CN112951748A - Wet etching clamp - Google Patents
Wet etching clamp Download PDFInfo
- Publication number
- CN112951748A CN112951748A CN202110405272.XA CN202110405272A CN112951748A CN 112951748 A CN112951748 A CN 112951748A CN 202110405272 A CN202110405272 A CN 202110405272A CN 112951748 A CN112951748 A CN 112951748A
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- Prior art keywords
- wafer
- base
- wet etching
- top cover
- corrosion
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
The invention belongs to the technical field of micro-nano processing, and particularly relates to a wet etching fixture which comprises a base, a top cover and a sealing mechanism, wherein the base is provided with a bearing part for bearing a wafer to be etched, the top cover is arranged above the base, the sealing mechanism is used for preventing an etching solution from contacting the front surface of the wafer facing the bearing part, a cavity for containing the etching solution is formed by the sealing mechanism, the top cover and the back surface of the wafer together, a spray head is arranged in the cavity, and a liquid outlet of the spray head is positioned above the bearing part and used for spraying the etching solution to etch the back surface. The wafer etching device has comprehensive functions and has the functions of performing comprehensive corrosion and local corrosion on the back of the wafer. General corrosion: loading a wafer to be corroded, filling sufficient corrosive liquid into the chamber, and carrying out overall corrosion on the back of the wafer; local corrosion: and loading the wafer to be corroded, spraying a corrosive liquid to a specific area on the back surface of the wafer through a spray head, and carrying out micro corrosion on the local part of the back surface of the wafer.
Description
Technical Field
The invention belongs to the technical field of micro-nano machining, and particularly relates to a wet etching clamp.
Background
Micro-nano processing is processing of micron-scale and nano-scale units, is often applied to the fields of material science, chip design and the like, and generally transfers a pattern onto a substrate through a photoetching technology, a LIGA technology, a bonding technology, a packaging technology and the like, wherein the substrate is generally a silicon wafer.
In order to functionalize a chip, a metal film, a semiconductor film, or the like is generally plated on the front surface of a wafer, and a portion of the wafer is selectively etched on the back surface of the wafer. In the wet etching process, the etching solution often reacts with the film material on the front surface of the wafer, thereby damaging the film structure on the front surface of the wafer. The common method for protecting the film structure on the front surface of the wafer is to spin the protective glue on the front surface of the wafer, but the method has high cost and poor effect, and the protective glue is not easy to remove.
The invention patent CN105405802A discloses a wet etching protection fixture, which can protect the front surface of a wafer from being etched without coating a protective glue, but has a single function, only has a function of etching the back surface of the wafer globally, and does not have a function of etching the back surface of the wafer locally.
Disclosure of Invention
In order to solve the above problems, the present invention provides a wet etching jig with a more comprehensive function, which has the functions of performing a general etching and a local etching on the back surface of a wafer.
Specifically, the technical scheme of the invention is as follows:
the utility model provides a wet process corrosion anchor clamps, includes base, top cap and sealing mechanism, is equipped with the portion of bearing on the base for bear the weight of the wafer of treating the corruption, the top cap is established in the base top, sealing mechanism is used for preventing that corrosive liquids from contacting towards the wafer of the portion of bearing openly, sealing mechanism, top cap and the wafer back form the cavity that is used for holding corrosive liquids jointly, are equipped with the shower nozzle in the cavity, the liquid outlet of shower nozzle is located the portion of bearing top for spout corrosive liquids is in order to corrode the wafer back.
Preferably, a stirrer is further arranged on the top cover, and a stirring head of the stirrer is positioned above the bearing part.
Preferably, the number of the spray heads is multiple, the stirring head of the stirrer is arranged in the center of the top cover, and the spray heads surround the stirring head and are arranged around the stirring head.
Preferably, the sealing mechanism comprises a locking mechanism and a sealing ring arranged above the bearing part, the wafer to be corroded is placed between the bearing part and the sealing ring, the inner diameter of the sealing ring is smaller than the size of the wafer to be corroded, and the top cover tightly presses the sealing ring under the locking of the locking mechanism.
Preferably, the base top surface is equipped with first recess, and first recess is cylindrical structure, and the sealing washer is ring annular structure, and the external diameter is less than the diameter of first recess, and the carrier portion is for establishing the carrier plate in first recess, and the carrier plate is circular structure.
Preferably, a buffer gasket is arranged below the bearing sheet, and the size of the buffer gasket is the same as that of the sealing ring.
Preferably, the top cap includes a cylinder, the top of the cylinder is provided with an extension portion extending outwards in the radial direction, the bottom surface of the cylinder is provided with a second groove recessed upwards, the diameter of the second groove is consistent with the inner diameter of the sealing ring, the nozzle is arranged in the second groove, and the locking mechanism includes a plurality of screws connecting the extension portion and the base.
Preferably, the top cover comprises an upper cover and a lower cover, the upper cover is of a disc structure and is arranged above the lower cover, and the spray head is fixed on the upper cover.
Preferably, the outer peripheral surface of extension and the outer peripheral surface parallel and level of base, surround first recess and be equipped with a plurality of first screw on the base, be equipped with the second screw on the extension, the first screw of screw spiro union and second screw are locked, and fix the top cap on the base.
Preferably, the bearing sheet is made of glass or steel resistant to alkali corrosion, and the base and the top cover are made of polytetrafluoroethylene materials.
The wet etching fixture provided by the invention has comprehensive functions and has the functions of performing comprehensive etching and local etching on the back surface of the wafer. General corrosion: loading a wafer to be corroded, filling sufficient corrosive liquid into the chamber, and carrying out overall corrosion on the back of the wafer; local corrosion: and loading the wafer to be corroded, spraying a corrosive liquid to a specific area on the back surface of the wafer through a spray head, and carrying out micro corrosion on the local part of the back surface of the wafer.
Drawings
FIG. 1 is a block diagram of a first embodiment of the present invention;
FIG. 2 is an exploded view of the first embodiment of the present invention;
FIG. 3 is an exploded view of another embodiment of the present invention;
FIG. 4 is a first cross-sectional view of a first embodiment of the present invention;
FIG. 5 is an enlarged view of portion A of FIG. 4;
FIG. 6 is a second cross-sectional view of the first embodiment of the present invention;
FIG. 7 is a cross-sectional view of a top cover, a mixing head, and a spray head in accordance with an embodiment of the present invention.
Detailed Description
The invention is described in further detail below with reference to the figures and the embodiments.
The first embodiment is as follows:
as shown in fig. 1 to 7, a wet etching fixture includes a base 1, a top cover and a sealing mechanism, wherein the base 1 is provided with a supporting portion for supporting a wafer 3 to be etched, and when the wafer 3 is loaded, the front surface of the wafer faces the supporting portion, and the back surface of the wafer faces the top cover. The top cap is established in base 1 top, and sealing mechanism is used for preventing that the corrosive liquid from contacting towards the wafer of bearing part openly, and sealing mechanism, top cap and wafer back form the cavity 9 that is used for holding the corrosive liquid jointly, are equipped with shower nozzle 4 in the cavity, and the liquid outlet of shower nozzle 4 is located the bearing part top for the spout corrosive liquid is in order to corrode the wafer back. As for how to supply the corrosion liquid to the spray head 4, the skilled person can choose arbitrarily, for example, a liquid storage cavity can be arranged in the upper cover 22, a liquid injection port communicated with the liquid storage cavity is arranged on the side surface of the upper cover 22, the spray head 4 is connected with the liquid storage cavity, when local corrosion is needed, the corrosion liquid needed for completing the primary corrosion is injected into the liquid storage cavity at one time from the liquid injection port by using a conduit, then the liquid injection port is sealed by using fluororubber, and the corrosion liquid in the liquid storage cavity is sprayed out from the liquid outlet of the spray head 4; for the spray head 4 which is not required to be used, the liquid outlet of the spray head 4 can be sealed by fluororubber. The method of supplying the etching solution to the spray head 4 is easily conceivable and implemented by those skilled in the art, and thus the relevant structure is not shown in detail in the drawings, but is simply described in the above text.
General corrosion: loading a wafer 3 to be corroded, filling sufficient corrosive liquid into the chamber, and carrying out overall corrosion on the back of the wafer; local corrosion: and loading the wafer 3 to be corroded, spraying a corrosive liquid to a specific area on the back surface of the wafer through the spray head 4, and carrying out micro corrosion on the local part of the back surface of the wafer.
Furthermore, still be equipped with agitator 5 on the top cap, the agitator head of agitator 5 is located the carrier portion top. When the back surface of the wafer is etched completely, the stirrer 5 can sufficiently stir the etching solution in the chamber 9, so that the back surface of the wafer is uniformly etched. In this embodiment, the driving device of the stirrer 5 is arranged outside the clamp, and the output end of the driving device penetrates through the top cover and is connected with the stirring head of the stirrer 5 so as to drive the stirring head to rotate. The stirrer adopted by the invention is an existing stirrer which can be purchased in the market, and the structure of the stirrer is not the improvement point of the invention, so that the stirrer is not completely shown in the drawing (the stirring shaft and the driving device are not shown), and only the installation position of the stirring head is shown.
Further, the number of the spray heads 4 is multiple, the stirring head of the stirrer 5 is arranged in the center of the top cover, and the plurality of spray heads 4 surround the stirring head and are arranged around the stirring head. The spray head 4 is used for locally corroding the wafer 3 slightly, preferably dispersedly, and the stirring head is used for uniformly stirring the corrosive liquid in the clamp, preferably arranged at the center of the clamp.
Further, the sealing mechanism comprises a locking mechanism and a sealing ring 61 arranged above the bearing part, the wafer 3 to be corroded is placed between the bearing part and the sealing ring 61, and the inner diameter of the sealing ring 61 is slightly smaller than the size of the wafer 3 to be corroded so as to ensure that the top cover does not directly contact with the wafer 3. Under the locking of the locking mechanism, the top cover presses the sealing ring 61. Specifically, the seal ring 61 may be made of fluororubber or fluororubber that is resistant to corrosion by alkali liquid. In the present embodiment, the outer diameter of the sealing ring 61 is slightly larger than the size of the wafer 3 to be corroded, so as to ensure that the sealing ring 61 can completely protect the edge of the wafer 3, and prevent the edge of the wafer 3 from directly contacting the top cover.
Adopt sealing washer 61 and locking mechanism to realize sealed, prevent that corrosive liquid from contacting the one side of wafer 3 towards the bearing part, simple structure, convenient operation. In other embodiments, the sealing mechanism with other structures can be adopted to realize sealing.
Furthermore, the top surface of the base 1 is recessed downwards to form a first groove 11, the first groove 11 is of a cylindrical structure, the sealing ring 61 is of a circular structure, the outer diameter of the sealing ring 61 is slightly smaller than the diameter of the first groove 11 so as to facilitate loading and taking out of the sealing ring 61, the bearing part is a bearing piece 12 arranged in the first groove 11, the bearing piece 12 is of a circular structure, and the outer diameter of the bearing piece is consistent with that of the wafer 3 to be corroded; if the size of the carrier 12 is too small, the wafer 3 is easily crushed when the wafer 3 is loaded, and if the size of the carrier 12 is too large, the carrier 12 is not easily taken out of the first recess 11. In this embodiment, the base 1 has a cylindrical structure, so that the clamp is compact.
Furthermore, the bearing sheet 12 is made of glass or steel which is resistant to alkali corrosion, and the base 1 and the top cover are made of polytetrafluoroethylene materials, so that the cost is low and the manufacture is easy.
Further, a buffer gasket 62 is arranged below the bearing sheet 12, the buffer gasket 62 can buffer the pressure of the top cover on the wafer 3, the bearing sheet 12 can protect the wafer 3 and prevent the wafer 3 from cracking, and the buffer gasket 62 and the sealing ring 61 have the same size, so that the positions of the buffer gasket 62 and the sealing ring 61 are as consistent as possible, and the pressure of the top cover on the wafer 3 is better buffered.
Further, as shown in fig. 7, the top cover includes a cylindrical body, and the top of the cylindrical body is provided with an extension extending radially outward. The bottom surface of the cylinder is recessed upwards to form a second groove 21, and the diameter of the second groove 21 is consistent with the inner diameter of the sealing ring 61; if the diameter of the second recess 21 is too large, corrosion of the wafer 3 is hindered. The spray head 4 is arranged in the second recess 21 and the locking mechanism comprises a plurality of screws 71 connecting the extension to the base. In this embodiment, the outer diameter of the cylinder coincides with the outer diameter of the seal ring 61 to ensure that the cylinder does not directly contact the wafer 3.
Further, the top cover comprises an upper cover 22 and a lower cover 23, the upper cover 22 is of a disc structure and is arranged above the lower cover 23, and the spray head 4 is fixed on the upper cover 22, so that corrosive liquid can be conveniently filled in and the spray head 4 can be conveniently disassembled, assembled and adjusted. In other embodiments, the top cover may be of unitary construction.
Further, the outer peripheral surface of the extension part is flush with the outer peripheral surface of the base 1, so that the clamp structure is compact. A plurality of first screw holes 13 are formed in the base 1 around the first groove 11, second screw holes 24 are formed in the extending portion, and screws 71 are in threaded connection with the first screw holes 13 and the second screw holes 24 and are locked, so that the top cover is fixed on the base 1, and the sealing ring 61 is pressed tightly by the top cover.
The using method comprises the following steps:
(1) general corrosion
The back surface to be corroded of the wafer 3 is placed upwards on the bearing sheet 12, the lower cover 23 is covered, sufficient corrosive liquid is filled, the upper cover 22 is covered, the screw 71 is locked, the stirrer 5 is started, and the back surface of the wafer is corroded comprehensively and uniformly.
(2) Local corrosion
The back surface to be corroded of the wafer 3 is placed upwards on the bearing sheet 12, the lower cover 23 and the upper cover 22 are covered, and the special area on the back surface of the wafer is sprayed with corrosive liquid through the spray head 4 to carry out micro corrosion on the local part of the back surface of the wafer.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention. It should be understood that any modification, equivalent replacement, improvement, etc. made by those skilled in the art after reading the specification, which are within the spirit and principle of the present invention, should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a wet process corrosion anchor clamps, its characterized in that, includes base, top cap and sealing mechanism, is equipped with the portion of bearing on the base for bear the weight of the wafer of treating the corruption, the top cap is established in the base top, sealing mechanism is used for preventing that corrosive liquids from contacting towards the wafer front of the portion of bearing, sealing mechanism, top cap and the wafer back form the cavity that is used for holding corrosive liquids jointly, are equipped with the shower nozzle in the cavity, the liquid outlet of shower nozzle is located the portion of bearing top, be used for the blowout corrosive liquids in order to corrode the wafer back.
2. The wet etching fixture of claim 1, wherein the top cover further comprises an agitator, and an agitator head of the agitator is located above the carrier.
3. The wet etching fixture of claim 2, wherein the number of the spray heads is plural, the stirring head of the stirrer is provided at the center of the top cover, and the plural spray heads surround the stirring head and are provided around the stirring head.
4. The wet etching fixture of claim 1, wherein the sealing mechanism comprises a locking mechanism and a sealing ring disposed above the carrier, the wafer to be etched is disposed between the carrier and the sealing ring, the sealing ring has an inner diameter smaller than a size of the wafer to be etched, and the top cover is pressed against the sealing ring under the locking of the locking mechanism.
5. The wet etching fixture of claim 4, wherein the base has a first groove on a top surface thereof, the first groove has a cylindrical structure, the sealing ring has a circular ring structure with an outer diameter smaller than a diameter of the first groove, and the bearing portion has a circular structure and is a bearing piece disposed in the first groove.
6. The wet etching fixture of claim 5, wherein a cushion washer is arranged below the carrier plate, and the cushion washer has the same size as the sealing ring.
7. The wet etching fixture of claim 5, wherein the top cap comprises a cylindrical body, the top of the cylindrical body is provided with an extension portion extending radially outward, the bottom of the cylindrical body is provided with a second recess recessed upward, the diameter of the second recess corresponds to the inner diameter of the seal ring, the spray head is disposed in the second recess, and the locking mechanism comprises a plurality of screws connecting the extension portion and the base.
8. The wet etching fixture of claim 7, wherein the top cover comprises an upper cover and a lower cover, the upper cover is a disk structure and is disposed above the lower cover, and the spray head is fixed on the upper cover.
9. The wet etching fixture of claim 7, wherein the outer peripheral surface of the extension portion is flush with the outer peripheral surface of the base, the base has a plurality of first screw holes around the first groove, the extension portion has a second screw hole, and the top cover is fixed to the base by screwing and locking the first screw holes and the second screw holes.
10. The wet etching fixture of claim 5, wherein the carrier plate is made of glass or steel resistant to alkali corrosion, and the base and the top cover are made of PTFE material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110405272.XA CN112951748A (en) | 2021-04-15 | 2021-04-15 | Wet etching clamp |
| PCT/CN2021/117389 WO2022217820A1 (en) | 2021-04-15 | 2021-09-09 | Wet etching fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110405272.XA CN112951748A (en) | 2021-04-15 | 2021-04-15 | Wet etching clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112951748A true CN112951748A (en) | 2021-06-11 |
Family
ID=76232704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110405272.XA Pending CN112951748A (en) | 2021-04-15 | 2021-04-15 | Wet etching clamp |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112951748A (en) |
| WO (1) | WO2022217820A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022217820A1 (en) * | 2021-04-15 | 2022-10-20 | 厦门大学 | Wet etching fixture |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100292075B1 (en) * | 1998-12-29 | 2001-07-12 | 윤종용 | Wafer processing device for semiconductor device manufacturing |
| CN101403118B (en) * | 2008-11-13 | 2010-06-16 | 中国电子科技集团公司第二十四研究所 | Silicon slice corrosion single-face protection clamper |
| CN105405802A (en) * | 2015-11-30 | 2016-03-16 | 浙江大学 | Wet etching protection clamp free of damage to wafer |
| CN109244031B (en) * | 2018-07-25 | 2024-06-25 | 北京大学 | Clamp for single-sided area corrosion and corrosion method |
| CN111370354A (en) * | 2020-04-27 | 2020-07-03 | 绍兴同芯成集成电路有限公司 | Etching device for wafer and annular glass carrier plate |
| CN112951748A (en) * | 2021-04-15 | 2021-06-11 | 厦门大学 | Wet etching clamp |
-
2021
- 2021-04-15 CN CN202110405272.XA patent/CN112951748A/en active Pending
- 2021-09-09 WO PCT/CN2021/117389 patent/WO2022217820A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022217820A1 (en) * | 2021-04-15 | 2022-10-20 | 厦门大学 | Wet etching fixture |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022217820A1 (en) | 2022-10-20 |
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