WO2022215906A1

WO2022215906A1 - Electrically conductive contact pin, inspection device comprising same, and method for manufacturing electrically conductive contact pin

Info

Publication number: WO2022215906A1
Application number: PCT/KR2022/004039
Authority: WO
Inventors: 안범모; 박승호; 변성현
Original assignee: (주)포인트엔지니어링
Priority date: 2021-04-06
Filing date: 2022-03-23
Publication date: 2022-10-13
Also published as: TW202240175A; KR102549551B1; KR20220138731A; TWI818486B

Abstract

The present invention provides an electrically conductive contact pin, an inspection device comprising same, and a method for manufacturing an electrically conductive contact pin, wherein the electrically conductive contact pin is formed by stacking a plurality of metal layers and has improved wear resistance on side surfaces thereof.

Description

Electrically conductive contact pin, inspection device having same, and manufacturing method of electrically conductive contact pin

The present invention relates to an electrically conductive contact pin, an inspection device having the same, and a method for manufacturing the electrically conductive contact pin.

The electrically conductive contact pin is a contact pin that can be used in a probe card or a test socket that is in contact with an object to inspect the object. Hereinafter, the contact pins of the probe card will be described as an example.

The electrical property test of a semiconductor device is performed by approaching a semiconductor wafer to a probe card having a plurality of electrically conductive contact pins and bringing the electrically conductive contact pins into contact with corresponding electrode pads on the semiconductor wafer. When the electrically conductive contact pin and the electrode pad on the semiconductor wafer are brought into contact, after reaching a state in which both start to contact, a process for further accessing the semiconductor wafer to the probe card is performed. This process is called overdrive. Overdrive is a process of elastically deforming the electrically conductive contact pins, and by performing overdrive, all electrically conductive contact pins can be reliably brought into contact with the electrode pads even if there is a deviation in the height of the electrode pad or the height of the electrically conductive contact pin. In addition, the electrically conductive contact pin elastically deforms during overdrive, and the tip moves on the electrode pad, thereby performing scrubbing. By this scrubbing, the oxide film on the surface of the electrode pad can be removed and the contact resistance can be reduced.

Such electrically conductive contact pins may be manufactured using a MEMS process. Looking at the process of manufacturing an electrically conductive contact pin using the MEMS process, first, a photoresist is applied to the surface of a conductive substrate, and then the photoresist is patterned. Thereafter, a metal material is deposited in the opening by an electroplating method using a photoresist as a mold, and an electrically conductive contact pin is obtained by removing the photoresist sheet and the conductive substrate. Here, the electrically conductive contact pins are formed by stacking a plurality of metal materials on top and bottom. In the case of a metal material having relatively high wear resistance, since electrical conductivity is relatively low, when an electrically conductive contact pin is manufactured by stacking a plurality of metal materials, there is a trade-off relationship between wear resistance and electrical conductivity.

These electrically conductive contact pins are inserted into the guide holes of the guide plate to constitute the probe head of the probe card. During inspection, the electrically conductive contact pins are in continuous sliding contact with the inner wall of the guide hole of the guide plate. Due to this, the side of the electrically conductive contact pin in contact with the inner wall of the guide hole is worn out, which reduces durability and causes a problem that a part of the side is slightly dented when used for a long time.

[Prior art literature]

[Patent Literature]

(Patent Document 1) Republic of Korea Registration No. 10-0449308 Patent Publication

The present invention has been devised to solve the problems of the prior art, and the present invention is an electrically conductive contact pin with improved wear resistance on the side of the electrically conductive contact pin in an electrically conductive contact pin formed by laminating a plurality of metal layers. An object of the present invention is to provide an inspection device having the same, and a method for manufacturing an electrically conductive contact pin.

In order to achieve the above object, the electrically conductive contact pin according to the present invention is an electrically conductive contact pin including a stacking part formed by stacking a plurality of metal layers, which is provided on a side surface of the electrically conductive contact pin. Includes reinforcement.

In addition, the stacked portion includes a first metal and a second metal, wherein the first metal is a metal having relatively high wear resistance compared to the second metal, and the second metal has relatively high electrical conductivity compared to the first metal. a metal, and the reinforcing part is formed of the first metal.

In addition, the first metal is rhodium (Rd), platinum (platinum, Pt), iridium (iridium, Ir), palladium (palladium) or alloys thereof, or palladium-cobalt (palladium-cobalt, PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphor (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten ( It is formed of a metal selected from a nickel-tungsten, NiW alloy, and the second metal is formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof.

In addition, the electrically conductive contact pin includes a first region and a second region formed separately in a longitudinal direction, wherein the first region includes the lamination portion, and the second region includes the lamination portion and the reinforcement portion. do.

In addition, at least two second regions are formed in the longitudinal direction of the electrically conductive contact pins.

In addition, the first area is provided between the second area.

In addition, the reinforcement part is formed of the same material as at least one of the metal layers constituting the stacking part.

In addition, the reinforcement portion is formed of a material different from the metal layer constituting the stacking portion.

In addition, the reinforcement portion is continuously formed on the side surface of the electrically conductive contact pin from the lower surface portion to the upper surface portion in the thickness direction of the electrically conductive contact pin.

On the other hand, the electrically conductive contact pin according to the present invention, in the electrically conductive contact pin, includes a first region and a second region formed separately in the longitudinal direction of the electrically conductive contact pin, wherein the first region includes a plurality of It includes a lamination part provided with a stacked metal layer, and the second region includes the lamination part and a reinforcement part, wherein the reinforcement part is provided on at least one side of the laminate part while having a higher wear resistance than the average wear resistance of the laminate part.

On the other hand, the inspection apparatus according to the present invention is an inspection apparatus comprising a guide plate into which a plurality of electrically conductive contact pins are inserted, wherein the electrically conductive contact pins include a stacking part formed by stacking a plurality of metal layers, and the electrical A reinforcing part provided on a side surface of the conductive contact pin, wherein the stacking part includes a first metal and a second metal, wherein the first metal is a metal having relatively high wear resistance compared to the second metal, and the second metal is the A metal having relatively high electrical conductivity compared to the first metal, the reinforcing portion is formed of the first metal, and the reinforcing portion is provided at a position corresponding to the position of the guide hole of the guide plate.

On the other hand, the manufacturing method of the electrically conductive contact pin according to the present invention, a first plating step of forming a laminate in which a plurality of metal layers are laminated; and a second plating step of forming a reinforcement part on at least one side of the laminated part with a metal having a higher wear resistance than the average wear resistance of the laminated part by a plating process separate from the first plating step.

In addition, the first plating step is a step of forming the lamination part in a first internal space of the mold, and the second plating step is a step of forming a reinforcement part in the second internal space formed in the mold in a lateral direction of the lamination part. .

In addition, the mold is made of an anodized film material.

The present invention provides an electrically conductive contact pin having improved abrasion resistance on the side of the electrically conductive contact pin in an electrically conductive contact pin formed by laminating a plurality of metal layers, an inspection device having the same, and a method for manufacturing the electrically conductive contact pin .

1 is a view showing a state in which an electrically conductive contact pin is inserted into a guide plate according to a first preferred embodiment of the present invention.

2 to 6 are views showing a method of manufacturing an electrically conductive contact pin according to a first preferred embodiment of the present invention.

7 (a) is a front view of a state in which an electrically conductive contact pin is inserted into a guide hole of a guide plate according to a first preferred embodiment of the present invention, and FIG. 7 (b) is a side view of the electrically conductive contact pin.

8 is a view showing a state in which an electrically conductive contact pin is inserted into a guide plate according to a second preferred embodiment of the present invention;

9 to 13 are views showing a method of manufacturing an electrically conductive contact pin according to a second preferred embodiment of the present invention.

14 (a) is a front view of a state in which an electrically conductive contact pin is inserted into a guide hole of a guide plate according to a second preferred embodiment of the present invention, and FIG. 14 (b) is a side view of the electrically conductive contact pin.

The following is merely illustrative of the principles of the invention. Therefore, those skilled in the art will be able to devise various devices that, although not explicitly described or shown herein, embody the principles of the invention and are included in the spirit and scope of the invention. In addition, it should be understood that all conditional terms and examples listed herein are, in principle, expressly intended only for the purpose of understanding the inventive concept and are not limited to the specifically enumerated embodiments and states as such. .

The above-described objects, features, and advantages will become more apparent through the following detailed description in relation to the accompanying drawings, and accordingly, those of ordinary skill in the art to which the invention pertains will be able to easily practice the technical idea of the invention. .

Embodiments described herein will be described with reference to cross-sectional and/or perspective views, which are ideal illustrative drawings of the present invention. The thicknesses of films and regions shown in these drawings are exaggerated for effective description of technical content. The shape of the illustrative drawing may be modified due to manufacturing technology and/or tolerance. In addition, the number of electrically conductive contact pins shown in the drawings is only partially shown in the drawings by way of example. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include changes in the form generated according to the manufacturing process. The technical terms used herein are used only to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present specification, terms such as "comprises" or "comprises" are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described herein exist, and include one or more other It should be understood that it does not preclude the possibility of addition or presence of features or numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of various embodiments, components performing the same function will be given the same names and same reference numbers for convenience even if the embodiments are different. In addition, configurations and operations already described in other embodiments will be omitted for convenience.

The electrically conductive contact pin 100 according to a preferred embodiment of the present invention is provided in the inspection device and is used to electrically and physically contact the inspection object to transmit an electrical signal. The inspection apparatus may be an inspection apparatus used in a semiconductor manufacturing process, and for example, may be a probe card or a test socket. However, the inspection device according to the preferred embodiment of the present invention is not limited thereto, and any device for checking whether the inspection object is defective by applying electricity is included. However, in the following description, a probe card will be exemplified as an example of the inspection device.

In the electrical property test of the semiconductor device, the semiconductor wafer (W) is approached to the probe card on which a plurality of electrically conductive contact pins (100) are formed, and each electrically conductive contact pin (100) is applied to the corresponding electrode pad (W) on the semiconductor wafer (W). WP). After reaching a position where the electrically conductive contact pin 100 contacts the electrode pad WP, the wafer W may be further raised to a predetermined height toward the probe card. The electrically conductive contact pins 100 are inserted into the guide holes 11 of the guide plate 10 to elastically deform, and the electrically conductive contact pins 100 are adopted to form a vertical probe card. As a preferred embodiment of the present invention, the electrically conductive contact pin 100 has a pre-deformed structure, that is, a structure in which the straight pin is deformed by moving the upper, lower, or additional guide plate or having the shape of a cobra pin. do.

In the case of a vertical probe card, at least two guide plates 10 are provided vertically spaced apart from each other. In addition, each guide plate may be a laminated guide plate in which a plurality of thin plates are closely stacked.

The electrically conductive contact pin 100 is provided by being inserted into the guide hole 11 of the guide plate 10 , and during inspection, the electrically conductive contact pin 100 is in sliding contact with the inner wall of the guide hole 11 . In particular, during the inspection, the electrically conductive contact pin 100 is bent in the direction of the side surface 103 and gives a large force to the inner wall of the guide hole 11, so that the friction force is increased. In this situation, the electrically conductive contact pin 100 according to the preferred embodiment of the present invention is provided with the reinforcing part 120 with high wear resistance on the side surface 103, so that wear due to friction is minimized. As a result, the durability of the electrically conductive contact pin 100 is improved. In addition, it is possible to minimize the generation of foreign substances due to friction.

In the method for manufacturing the electrically conductive contact pin 100 according to a preferred embodiment of the present invention, a first plating step of forming the stacked portion 111 provided by stacking a plurality of metal layers and a plating separate from the first plating step The process includes a second plating step of forming the reinforcing part 120 on at least one side of the laminated part 111 with a metal having a higher wear resistance than the average wear resistance of the laminated part 111 .

Hereinafter, an electrically conductive contact pin 100 according to a first preferred embodiment of the present invention will be described with reference to FIGS. 1 to 7 . 1 is a view showing a state in which an electrically conductive contact pin 100 according to a first preferred embodiment of the present invention is inserted into the guide plate 10, and FIGS. 2 to 6 are a first preferred embodiment of the present invention. It is a view showing a manufacturing method of the electrically conductive contact pin 100 according to, Figure 7 (a) is an electrically conductive contact pin 100 according to the first preferred embodiment of the present invention is a guide hole of the guide plate (10) (11) is a front view of the inserted state, Figure 7 (b) is a side view of the electrically conductive contact pin (100).

Referring to FIGS. 1 and 7 , the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention includes an upper surface 101 , and the opposite surface of the upper surface 101 is a lower surface and a side surface 103 . The electrically conductive contact pin 100 includes a stacking part 110 formed by stacking a plurality of metal layers. In addition, the electrically conductive contact pin 100 includes a reinforcing part 120 provided on the side surface 103 of the electrically conductive contact pin 100 . The reinforcement portion 120 is continuously formed on the side surface 103 of the electrically conductive contact pin 100 from the lower surface to the upper surface in the thickness direction of the electrically conductive contact pin 100 .

Although the guide hole 11 is in the form of a hole into which the electrically conductive contact pin 100 is inserted, only a part of the guide plate 10 is shown in FIG. 1 for convenience of explanation.

The stacked part 110 includes a first metal 111 and a second metal 112 . The first metal 111 is a metal having relatively high wear resistance compared to the second metal 112 , and the second metal 112 is a metal having relatively high electrical conductivity compared to the first metal 111 .

The first metal 111 is rhodium (Rd), platinum (platinum, Pt), iridium (iridium, Ir), palladium (palladium) or alloys thereof, or palladium-cobalt (palladium-cobalt, PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphor (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten ( It is formed of a metal selected from nickel-tungsten, NiW alloy, and the second metal 112 is formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof.

The reinforcing part 120 is formed of the first metal 111 . The reinforcement unit 120 may be formed of the same material as at least one of the metal layers constituting the lamination unit 110 , or may be formed of a material different from the metal layer constituting the lamination unit 110 .

For example, the stacking unit 110 may be formed by alternately stacking a first metal 111 made of a palladium-cobalt (PdCo) alloy and a second metal 112 made of a copper (Cu) material. have. In this case, the reinforcing part 120 may be a first metal 111 made of a palladium-cobalt (PdCo) alloy or a first metal 111 made of a rhodium (Rd) material.

The electrically conductive contact pin 100 includes a first region 210 and a second region 220 that are formed separately in the longitudinal direction of the electrically conductive contact pin 100 . The first region 210 includes the stacking part 110 , and the second region 220 includes the stacking part 110 and the reinforcement part 120 . The reinforcing part 120 is provided on at least one side of the stacking part 110 while having a higher wear resistance than the average wear resistance of the stacking part 110 . The reinforcing part 120 is a portion in sliding contact with the inner wall of the guide hole 11 of the guide plate 10 . The durability of the electrically conductive contact pin 100 can be improved by allowing the reinforcing part 120 , which is a portion with high wear resistance of the electrically conductive contact pin 100 , to contact the inner wall of the guide hole 11 .

Referring to FIG. 1 , two second regions 220 are formed in the longitudinal direction of the electrically conductive contact pins 100 . This is considering that the number of guide plates 10 is two, and when the number of guide plates is two or more, two or more second regions 220 are formed in the longitudinal direction of the electrically conductive contact pins 100 .

A first area 210 is provided between the two second areas 220 . Since the first region 210 is a region containing a metal having high electrical conductivity, the content of the metal having high electrical conductivity is increased in an area where there is little risk of sliding contact with the inner wall of the guide hole 11, so that the electrically conductive contact pin 100 ) can improve the overall current carrying capacity.

Hereinafter, a method of manufacturing the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention will be described with reference to FIGS. 2 to 6 .

The method of manufacturing the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention is separate from the first plating step and the first plating step of forming the stacked portion 111 provided by stacking a plurality of metal layers. a second plating step of forming the reinforcement part 120 with a metal having a higher wear resistance than the average wear resistance of the laminated part 111 on a part of the side 103 of the laminated part 111 by the plating process of the laminated part 111 . It will be described in detail below.

First, referring to FIG. 2, FIG. 2 (a) is a plan view of the mold 20 provided with the first internal space 21, and FIG. 2 (b) is a cross-sectional view taken along line A-A' of FIG. 2 (a). , FIG. 2(c) is a sectional view taken along line B-B' of FIG. 2(a), FIG. 2(d) is a cross-sectional view of FIG. D-D' is a cross-sectional view.

Referring to FIG. 2 , a first internal space 21 is formed in the mold 20 , and a seed layer 30 is provided under the mold 20 .

The mold 20 may be made of an anodized film, photoresist, silicon wafer, or a similar material. However, preferably, the mold 20 may be made of an anodized film material. The anodization film refers to a film formed by anodizing a metal as a base material, and the pores refer to a hole formed in the process of forming an anodization film by anodizing the metal. For example, when the base metal is aluminum (Al) or an aluminum alloy, when the base material is anodized, an anodization film made of aluminum oxide (Al ₂ 0 ₃ ) material is formed on the surface of the base material. However, the base metal is not limited thereto, and includes Ta, Nb, Ti, Zr, Hf, Zn, W, Sb, or alloys thereof. The anodized film formed as described above is vertically divided into a barrier layer in which pores are not formed and a porous layer in which pores are formed. When the base material is removed from the base material on which the anodized film having a barrier layer and a porous layer is formed on the surface, only the anodized film made of aluminum oxide (Al ₂ O ₃ ) material remains. The anodization film may be formed in a structure in which the barrier layer formed during anodization is removed to penetrate the top and bottom of the pores, or the barrier layer formed during anodization remains as it is and seals one end of the top and bottom of the pores.

The anodized film has a coefficient of thermal expansion of 2-3 ppm/°C. For this reason, when exposed to a high temperature environment, thermal deformation due to temperature is small. Therefore, even if the manufacturing environment of the electrically conductive contact pin 100 is a high temperature environment, it is possible to manufacture the precise electrically conductive contact pin 100 without thermal deformation.

The electrically conductive contact pin 100 according to a preferred embodiment of the present invention is manufactured using a mold 20 made of an anodized film material instead of a photoresist mold, so the precision of the shape was limited in realization with the photoresist mold; It becomes possible to exhibit the effect of realization of a micro-shape. In addition, in the case of a conventional photoresist mold, an electrically conductive contact pin having a thickness of 40 μm can be manufactured, but when using a mold made of an anodized film material, an electrically conductive contact pin 100 having a thickness of 100 μm or more and 200 μm or less is used. can be crafted.

A seed layer 30 is provided on a lower surface of the mold 20 . The seed layer 30 may be provided on the lower surface of the mold 20 before the first internal space 21 is formed in the mold 20 . Meanwhile, a support substrate (not shown) is formed under the mold 20 to improve handling of the mold 20 . In addition, in this case, the seed layer 30 is formed on the upper surface of the support substrate (not shown), and the mold 20 in which the first internal space 21 is formed may be used by coupling the mold 20 to the support substrate (not shown). The seed layer 30 may be formed of a copper (Cu) material, and may be formed by a deposition method. The seed layer 30 is used to improve the plating quality of the lamination part 110 and the reinforcement part 120 when forming the laminated part 110 and the reinforcement part 120 using the electroplating method.

The first inner space 21 may be formed by wet etching the mold 20 made of an anodized film material. To this end, a photoresist is provided on the upper surface of the mold 20 and patterned, and then the anodized film in the patterned and open area reacts with the etching solution to form the first internal space 21 . Specifically, the photosensitive material may be provided on the upper surface of the mold 20 before the first internal space 21 is formed, and then exposure and development processes may be performed. At least a portion of the photosensitive material may be patterned and removed while forming an open area by an exposure and development process. The mold 20 made of the anodized film material is etched through the open region from which the photosensitive material has been removed by the patterning process, and the anodized film at the position corresponding to the first internal space 21 is removed by the etching solution to form the first mold 20 . 1 The inner space 21 is formed.

Next, referring to FIG. 3 , FIG. 3 ( a ) is a plan view of the mold 20 in which the stacking part 110 is formed in the first internal space 21 , and FIG. 3 ( b ) is a diagram of FIG. 3 ( a ). A-A' cross-sectional view, Fig. 3(c) is a B-B' cross-sectional view of Fig. 3(a)), Fig. 3(d) is a C-C' cross-sectional view of Fig. 3(a), and Fig. 3(e) ) is a D-D' cross-sectional view of FIG. 3(a).

An electroplating process is performed in the first inner space 21 of the mold 20 to form the stacked part 110 . A plurality of metal layers are stacked and formed in the thickness direction of the electrically conductive contact pin 100 by performing a plurality of electroplating processes. The stacked part 110 is rhodium (Rd), platinum (platinum, Pt), iridium (iridium, Ir), palladium (palladium) or an alloy thereof, or palladium-cobalt (palladium-cobalt, PdCo) alloy, palladium -Nickel (palladium-nickel, PdNi) alloy or nickel-phosphor (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (nickel) A first metal 111 selected from -tungsten, NiW alloy and a second metal 112 selected from copper (Cu), silver (Ag), and gold (Au) are provided. For example, the first metal 210 made of a palladium-cobalt (PdCo) alloy and the second metal 230 made of copper (Cu) may be alternately stacked and formed. Here, the first metal 210 allows the electrically conductive contact pin 100 to be elastically deformed, and the second metal 230 allows the current carrying capacity (CCC) of the electrically conductive contact pin 100 to be improved.

When the plating process is completed, a planarization process may be performed. The metal protruding from the upper surface of the mold 20 is removed and planarized through a chemical mechanical polishing (CMP) process.

Next, referring to FIG. 4, FIG. 4 (a) is a plan view of the mold 20 forming the second inner space 22, and FIG. 4 (b) is a cross-sectional view taken along line A-A' of FIG. 4 (a). , FIG. 4(c) is a sectional view taken along line B-B' of FIG. 4(a), FIG. 4(d) is a cross-sectional view taken from FIG. D-D' is a cross-sectional view.

A process of removing a portion of the mold 20 is performed. A portion of the mold 20 is removed to form the second inner space 22 in the mold 20 . Specifically, after the photosensitive material is provided on the upper surface of the mold 20 , an exposure and development process may be performed. At least a portion of the photosensitive material may be patterned and removed while forming an open area by an exposure and development process. An etching process is performed through the open region from which the photosensitive material has been removed by the patterning process, and a portion of the mold 20 is removed by the etching solution to form the second internal space 22 .

At least four second internal spaces 22 are formed adjacent to the side surface of the stacking part 110 to correspond to the position of the reinforcing part 120 . A plurality of stacked parts 111 are exposed on three side surfaces of each of the second internal spaces 22 , and the mold 20 is exposed on one side surface.

Next, referring to FIG. 5, FIG. 5(a) is a plan view of the mold 20 in which the reinforcement part 120 is formed in the second inner space 22, and FIG. 5(b) is a view of FIG. 5(a). A-A' cross-sectional view, Fig. 5(c) is a B-B' cross-sectional view of Fig. 5(a), Fig. 5(d) is a C-C' cross-sectional view of Fig. 5(a), Fig. 5(e) is a D-D' cross-sectional view of FIG. 5(a).

A step of forming the reinforcement part 120 is performed. The reinforcement part 120 is formed in the second internal space 22 formed in the previous step by using an electroplating process.

The reinforcement part 120 is integrated with the stacking part 110 manufactured in the previous step. As described above, the stacked part 110 is exposed on three side surfaces of the second internal space 22 . In this side, the reinforcement part 120 is integrated with the stacked part 110 .

Reinforcing unit 120 is rhodium (rhodium, Rd), platinum (platinum, Pt), iridium (iridium, Ir), palladium (palladium) or alloys thereof, or palladium-cobalt (palladium-cobalt, PdCo) alloy, palladium -Nickel (palladium-nickel, PdNi) alloy or nickel-phosphor (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (nickel) -tungsten, NiW) may be a metal selected from an alloy, and preferably, the reinforcing part 120 may be formed of the same material as the first metal 210 constituting the stacking part 110 . For example, when the stacked part 110 is formed of a palladium-cobalt (PdCo) alloy material among the first metal 111 , the reinforced part 120 is also palladium-cobalt (PdCo). It may be an alloy material. Alternatively, the reinforcing part 120 may be formed of a material different from that of the first metal 210 constituting the stacking part 110 . For example, when the stacked part 110 is formed of a palladium-cobalt (PdCo) alloy material among the first metal 111, the reinforced part 120 may be made of a rhodium (Rd) material. .

Next, referring to FIG. 6, FIG. 6(a) is a plan view of the electrically conductive contact pin 100, FIG. 6(b) is a cross-sectional view taken along line A-A' of FIG. 6(a), and FIG. 6(c) is 6(a) is a cross-sectional view B-B', FIG. 6(d) is a C-C' cross-sectional view of FIG. 6(a), and FIG. 6(e) is a sectional view D-D' of FIG. 6(a). .

After the previous step, a process of removing the mold 20 and the seed layer 30 is performed. When the mold 20 is made of an anodized film material, the mold 20 is removed using a solution that selectively reacts to the anodized film material. Also, when the seed layer 30 is made of copper (Cu), the seed layer 30 is removed using a solution that selectively reacts with copper (Cu).

In the previous description, the step of forming the laminated part 110 by plating the first internal space 21 using the mold 20 in which the first internal space 21 is formed is first performed, and then the mold 20 is formed. Although it has been described that the steps of forming the second inner space 22 by removing a part and forming the reinforcing part 120 by plating the second inner space 22 are performed, according to the first preferred embodiment of the present invention In the method of manufacturing the electrically conductive contact pin, a step of forming the second inner space 22 by removing a part of the mold 20 and plating the second inner space 22 to form the reinforcement part 120 is performed first. and then plating the first internal space 21 using the mold 20 in which the first internal space 21 is formed to form a plurality of stacked parts 110 .

7 (a) is a view from the front in a state in which the electrically conductive contact pin 100 is inserted into the guide hole 11 of the guide plate 10 as a part of the inspection device according to the first preferred embodiment of the present invention. , Figure 7 (b) is a side view of the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention.

The inspection apparatus according to the first preferred embodiment of the present invention includes a guide plate 10 into which a plurality of electrically conductive contact pins 100 are inserted. In addition, the electrically conductive contact pin 100 provided in the inspection device includes a stacking part 110 formed by stacking a plurality of metal layers, and a strengthening part 120 provided on the side surface 103 of the electrically conductive contact pin 100 . ) is included. In addition, the stacking part 110 includes a first metal 111 and a second metal 112, but the first metal 111 is a metal having relatively high wear resistance compared to the second metal 112, and the second metal ( 112 is a metal having relatively high electrical conductivity compared to the first metal 111 , the reinforcing part 120 is formed of the first metal 111 , and the reinforcing part 120 is a guide hole of the guide plate 10 . It is provided at a position corresponding to the position of (11).

The electrically conductive contact pin 100 according to a preferred embodiment of the present invention is provided with a reinforcing portion 120 corresponding to the positions of the guide holes 11 of the two guide plates 10 . Accordingly, the side 103 of the electrically conductive contact pin 100 is provided with two reinforcement portions 120 . A stacking part 110 is provided between the two reinforcement parts 120 . Except for only the region where the reinforcement part 120 is provided, the stacked part 110 is entirely formed on the electrically conductive contact pin 100 . The stacking part 110 is a configuration formed by stacking a plurality of metal layers, and the metal layer includes a metal having higher electrical conductivity than the metal constituting the reinforcement part 120 . Through the configuration of the stacking part 110 provided between the two reinforcing parts 120 , it is possible to prevent a decrease in the current carrying capacity of the electrically conductive contact pin 100 .

The electrically conductive contact pin 100 according to the first preferred embodiment of the present invention includes a first metal 111 made of palladium-cobalt (PdCo) and a second metal 112 made of copper (Cu). It may be configured by being alternately stacked. For example, in the thickness direction of the electrically conductive contact pin 100, the first metal 111 made of palladium-cobalt (PdCo), the second metal 112 made of copper (Cu), palladium-cobalt ( First metal 111 made of palladium-cobalt, PdCo, second metal 112 made of copper (Cu), first metal 111 made of palladium-cobalt (PdCo), 5 in order The layers may be alternately stacked. Of course, the same number of layers may be stacked in the same alternating stacking pattern. However, in this case, the first metal 111 made of palladium-cobalt (PdCo) material may be positioned on the lowermost layer and the uppermost layer of the electrically conductive contact pin 100 . In this case, the reinforcing unit 120 may be formed of the first metal 111 made of palladium-cobalt (PdCo). In the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention, the first metal 111 made of palladium-cobalt (PdCo) is continuously continuous through a plating process to form an integral type. Since it is formed, it is possible to improve durability by minimizing delamination between layers during elastic deformation behavior of the electrically conductive contact pin 100 .

In addition, the content of the second metal 112 selected from among copper (Cu), silver (Ag), and gold (Au) having relatively high electrical conductivity can be increased through the configuration of the stacking unit 110 in which a plurality of metal layers are stacked. Therefore, it is possible to prevent a decrease in the current carrying capacity (Current Carrying Capacity) of the electrically conductive contact pin (100).

In addition, since the metal constituting the reinforcing part 120 has a higher hardness than the second metal 112 selected from copper (Cu), silver (Ag), and gold (Au) constituting the stacking part 110 , the guide hole When in contact with the inner wall of (11), the side 103 of the electrically conductive contact pin 100 is plastically deformed to prevent a dent. Through this, the behavior pattern of the electrically conductive contact pin 100 can be constantly maintained.

Hereinafter, an electrically conductive contact pin 100 according to a second preferred embodiment of the present invention will be described with reference to FIGS. 8 to 14 . 8 is a view showing a state in which an electrically conductive contact pin 100 according to a second preferred embodiment of the present invention is inserted into the guide plate 10, and FIGS. 9 to 13 are a second preferred embodiment of the present invention. It is a view showing a manufacturing method of the electrically conductive contact pin 100 according to, Figure 14 (a) is an electrically conductive contact pin 100 according to a second preferred embodiment of the present invention is a guide hole of the guide plate (10) (11) is a front view of the inserted state, Figure 14 (b) is a side view of the electrically conductive contact pin (100).

Referring to FIG. 8 , the electrically conductive contact pin 100 according to the second preferred embodiment of the present invention includes an upper surface 101 , and the opposite surface of the upper surface 101 is a lower surface and a side surface 103 . The electrically conductive contact pin 100 includes a stacking part 110 formed by stacking a plurality of metal layers. In addition, the electrically conductive contact pin 100 includes a reinforcing part 120 provided on the side surface 103 of the electrically conductive contact pin 100 . The reinforcement portion 120 is continuously formed on the side surface 103 of the electrically conductive contact pin 100 from the lower surface to the upper surface in the thickness direction of the electrically conductive contact pin 100 . Although the guide hole 11 is in the form of a hole into which the electrically conductive contact pin 100 is inserted, only a part of the guide plate 10 is illustrated in FIG. 8 for convenience of explanation.

In the electrically conductive contact pin 100 according to the second preferred embodiment of the present invention, unlike the configuration of the electrically conductive contact pin 100 according to the first embodiment, the reinforcing part 120 is the electrically conductive contact pin 100 . There is a difference in configuration in that it is provided on the entire side 103 .

Hereinafter, a method of manufacturing the electrically conductive contact pin 100 according to a second preferred embodiment of the present invention will be described with reference to FIGS. 9 to 13 .

The manufacturing method of the electrically conductive contact pin 100 according to the second preferred embodiment of the present invention is separate from the first plating step and the first plating step of forming the stacked portion 111 provided by stacking a plurality of metal layers. a second plating step of forming the reinforced part 120 with a metal having a higher wear resistance than the average wear resistance of the laminated part 111 on the entire side surface of the laminated part 111 by the plating process of the laminated part 111 . It will be described in detail below.

First, referring to FIG. 9, FIG. 9 (a) is a plan view of the mold 20 provided with the first internal space 21, and FIG. 9 (b) is a cross-sectional view taken along line A-A' of FIG. , FIG. 9(c) is a cross-sectional view taken along line B-B' of FIG. 9(a), and FIG. 9(d) is a cross-sectional view taken along line C-C' of FIG.

Referring to FIG. 9 , a first internal space 21 is formed in the mold 20 , and a seed layer 30 is provided under the mold 20 .

The mold 20 may be made of an anodized film, photoresist, silicon wafer, or a similar material. However, preferably, the mold 20 may be made of an anodized film material.

The electrically conductive contact pin 100 according to a preferred embodiment of the present invention is manufactured using a mold 20 made of an anodized film material instead of a photoresist mold, so the precision of the shape was limited in realization with the photoresist mold; It becomes possible to exhibit the effect of realization of a micro-shape.

Next, referring to FIG. 10 , FIG. 10 ( a ) is a plan view of the mold 20 in which the stacking part 110 is formed in the first internal space 21 , and FIG. 10 ( b ) is a view of FIG. 10 ( a ). A-A' cross-sectional view, FIG. 10(c) is a B-B' cross-sectional view of FIG. 10(a), and FIG. 10(d) is a C-C' cross-sectional view of FIG. 10(a).

Next, referring to FIG. 11, FIG. 11 ^(a) is a plan view of the mold 20 forming the second inner space 22, and FIG. ^11(b) is A-A of FIG. ^11(a) 'It is a cross-sectional view, and FIG. 11 ⁽ ^c) ^is ^a sectional view taken along line B-B' of FIG.

Two second internal spaces 22 are formed along the side surface of the stacking part 110 to correspond to the position of the reinforcing part 120 . A plurality of stacked parts 111 are exposed on one side surface of each of the second internal spaces 22 , and the mold 20 is exposed on three side surfaces.

Next, referring to FIG. 12 , FIG. 12 ( a ) is a plan view of the mold 20 in which the reinforcement part 120 is formed in the second inner space 22 , and FIG. 12 ( b ) is a view of FIG. 12 ( a ). A-A' cross-sectional view, FIG. 12(c) is a B-B' cross-sectional view of FIG. 12(a), and FIG. 12(d) is a C-C' cross-sectional view of FIG. 12(a).

The reinforcement part 120 is integrated with the stacking part 110 manufactured in the previous step. As described above, the stacked part 110 is exposed on one side of the second internal space 22 , and the reinforcement part 120 is integrated with the stacked part 110 on this side.

Next, referring to FIG. 13, FIG. 13(a) is a plan view of the electrically conductive contact pin 100, FIG. 13(b) is a cross-sectional view taken along line A-A' of FIG. 13(a), and FIG. 13(c) is 13(a) is a sectional view taken along line B-B', and FIG. 13(d) is a cross-sectional view taken along line C-C' of FIG. 13(a).

In the previous description, the step of forming the laminated part 110 by plating the first internal space 21 using the mold 20 in which the first internal space 21 is formed is first performed, and then the mold 20 is formed. Although it has been described that the step of forming the second inner space 22 is formed by removing a part and the step of forming the reinforcing part 120 is performed by plating the second inner space 22, according to the second preferred embodiment of the present invention In the method of manufacturing the electrically conductive contact pin, a step of forming the second inner space 22 by removing a part of the mold 20 and plating the second inner space 22 to form the reinforcement part 120 is performed first. and then plating the first internal space 21 using the mold 20 in which the first internal space 21 is formed to form a plurality of stacked parts 110 .

14 (a) is a view from the front of a state in which the electrically conductive contact pin 100 is inserted into the guide hole 11 of the guide plate 10 as a part of the inspection device according to the second preferred embodiment of the present invention. , Figure 14 (b) is a side view of the electrically conductive contact pin 100 according to the first preferred embodiment of the present invention.

The inspection apparatus according to the second preferred embodiment of the present invention includes a guide plate 10 into which a plurality of electrically conductive contact pins 100 are inserted. In addition, the electrically conductive contact pin 100 provided in the inspection device includes a stacking part 110 formed by stacking a plurality of metal layers, and a strengthening part 120 provided on the side surface 103 of the electrically conductive contact pin 100 . ) is included. In addition, the stacking part 110 includes a first metal 111 and a second metal 112, but the first metal 111 is a metal having relatively high wear resistance compared to the second metal 112, and the second metal ( 112 is a metal having relatively high electrical conductivity compared to the first metal 111 , the reinforcing part 120 is formed of the first metal 111 , and the reinforcing part 120 is a guide hole of the guide plate 10 . It is provided at a position corresponding to the position of (11).

More specifically, the reinforcing part 120 according to the second preferred embodiment of the present invention is provided on the entire side surface 103 of the electrically conductive contact pin 100 .

The electrically conductive contact pin 100 is provided by being inserted into the guide hole 11 of the guide plate 10 , and during inspection, the electrically conductive contact pin 100 is in sliding contact with the inner wall of the guide hole 11 . In particular, during the inspection, since the electrically conductive contact pin 100 is bent in the lateral direction to apply a large force to the inner wall of the guide hole 11, the frictional force is increased. In this situation, the electrically conductive contact pin 100 according to the second preferred embodiment of the present invention is provided with the reinforcing portion 120 having high wear resistance on the entire side surface 103, thereby minimizing wear due to friction. As a result, the durability of the electrically conductive contact pin 100 is improved. In addition, it is possible to minimize the generation of foreign substances due to friction.

The electrically conductive contact pin 100 according to the second preferred embodiment of the present invention includes a first metal 111 made of palladium-cobalt (PdCo) and a second metal 112 made of copper (Cu). It may be configured by being alternately stacked. For example, in the thickness direction of the electrically conductive contact pin 100, the first metal 111 made of palladium-cobalt (PdCo), the second metal 112 made of copper (Cu), palladium-cobalt ( First metal 111 made of palladium-cobalt, PdCo, second metal 112 made of copper (Cu), first metal 111 made of palladium-cobalt (PdCo), 5 in order The layers may be alternately stacked. Of course, the same number of layers may be stacked in the same alternating stacking pattern. However, in this case, the first metal 111 made of palladium-cobalt (PdCo) material may be positioned on the lowermost layer and the uppermost layer of the electrically conductive contact pin 100 . In this case, the reinforcing unit 120 may be formed of the first metal 111 made of palladium-cobalt (PdCo). In the electrically conductive contact pin 100 according to the second preferred embodiment of the present invention, the first metal 111 made of palladium-cobalt (PdCo) is continuously continuous through a plating process to form an integral type. Since it is formed, it is possible to improve durability by minimizing delamination between layers during elastic deformation behavior of the electrically conductive contact pin 100 .

A plating film made of a gold (Au) material may be additionally formed on the surface of the electrically conductive contact pin 100 according to the first and second embodiments described above in order to further improve the current carrying capacity. In this case, it may be somewhat disadvantageous in terms of the abrasion resistance of the reinforcement part 120, but the effect of preventing the dent due to plastic deformation of the side surface of the electrically conductive contact pin 100 through the configuration of the reinforcement part 120 can be exhibited as it is. be able to

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify the present invention within the scope without departing from the spirit and scope of the present invention described in the claims below. Or it can be carried out by modification.

[Explanation of code]

100: electrically conductive contact pin

110: stacked part

120: reinforcement

210: first area

220: second area

Claims

An electrically conductive contact pin comprising a lamination part formed by laminating a plurality of metal layers,

An electrically conductive contact pin comprising a reinforcement provided on a side surface of the electrically conductive contact pin.
According to claim 1,

The lamination part includes a first metal and a second metal, wherein the first metal is a metal having relatively high wear resistance compared to the second metal, and the second metal is a metal having relatively high electrical conductivity compared to the first metal. ,

The reinforcing portion is formed of the first metal, an electrically conductive contact pin.
3. The method of claim 2,

The first metal is rhodium (Rd), platinum (platinum, Pt), iridium (iridium, Ir), palladium (palladium) or an alloy thereof, or palladium-cobalt (palladium-cobalt, PdCo) alloy, palladium- palladium-nickel (PdNi) alloy or nickel-phosphor (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (nickel- tungsten, NiW) is formed of a metal selected from alloys,

The second metal is an electrically conductive contact pin formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof.
According to claim 1,

Including a first region and a second region formed separately in the longitudinal direction of the electrically conductive contact pin,

The first region includes the stacking part,

and the second region includes the stacked portion and the reinforced portion.
5. The method of claim 4,

At least two of the second regions are formed in the longitudinal direction of the electrically conductive contact pin.
6. The method of claim 5,

An electrically conductive contact pin, wherein the first region is provided between the second region.
According to claim 1,

The reinforcing portion is formed of the same material as at least one of the metal layers constituting the stacked portion, an electrically conductive contact pin.
According to claim 1,

The reinforcing portion is formed of a material different from the metal layer constituting the stacked portion, an electrically conductive contact pin.
According to claim 1,

The reinforcing portion is continuously formed on the side surface of the electrically conductive contact pin from the lower surface portion to the upper surface portion in the thickness direction of the electrically conductive contact pin.
An electrically conductive contact pin comprising:

Including a first region and a second region formed separately in the longitudinal direction of the electrically conductive contact pin,

The first region includes a stacking portion provided with a plurality of metal layers stacked,

The second region includes the lamination portion and the reinforcing portion, wherein the reinforcing portion is provided on at least one side of the lamination portion while having a higher wear resistance than the average wear resistance of the lamination portion.
11. The method of claim 10,

The lamination part includes a first metal and a second metal, wherein the first metal is a metal having relatively high wear resistance compared to the second metal, and the second metal is a metal having relatively high electrical conductivity compared to the first metal. ,

The reinforcing portion is formed of the first metal, an electrically conductive contact pin.
12. The method of claim 11,

The first metal is rhodium (Rd), platinum (platinum, Pt), iridium (iridium, Ir), palladium (palladium) or an alloy thereof, or palladium-cobalt (palladium-cobalt, PdCo) alloy, palladium- palladium-nickel (PdNi) alloy or nickel-phosphor (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (nickel- tungsten, NiW) is formed of a metal selected from alloys,

The second metal is an electrically conductive contact pin formed of a metal selected from copper (Cu), silver (Ag), gold (Au), or an alloy thereof.
In the inspection device comprising a guide plate into which a plurality of electrically conductive contact pins are inserted,

The electrically conductive contact pin includes a stacking part formed by stacking a plurality of metal layers,

Including a reinforcement provided on the side of the electrically conductive contact pin,

The lamination part includes a first metal and a second metal, wherein the first metal is a metal having relatively high wear resistance compared to the second metal, and the second metal is a metal having relatively high electrical conductivity compared to the first metal. ,

The reinforcing part is formed of the first metal,

The reinforcing part is provided at a position corresponding to the position of the guide hole of the guide plate, inspection apparatus.
14. The method of claim 13,

Including a first region and a second region formed separately in the longitudinal direction of the electrically conductive contact pin,

The first region includes the stacking part,

and the second region includes the stacking part and the reinforcement part.
A first plating step of forming a stacked portion provided with a plurality of metal layers stacked; and

Manufacturing an electrically conductive contact pin comprising a second plating step of forming a reinforcing portion with a metal having a higher wear resistance than the average wear resistance of the stacked portion on at least one side of the stacked portion by a plating process separate from the first plating step Way.
16. The method of claim 15,

The first plating step is a step of forming the lamination part in the first inner space of the mold,

The second plating step is a step of forming a reinforcing portion in the second inner space formed in the mold in a lateral direction of the stacking portion.
17. The method of claim 16,

The mold is made of an anodized film material, the method of manufacturing an electrically conductive contact pin.