WO2022209903A1 - Ledチャック - Google Patents
Ledチャック Download PDFInfo
- Publication number
- WO2022209903A1 WO2022209903A1 PCT/JP2022/011973 JP2022011973W WO2022209903A1 WO 2022209903 A1 WO2022209903 A1 WO 2022209903A1 JP 2022011973 W JP2022011973 W JP 2022011973W WO 2022209903 A1 WO2022209903 A1 WO 2022209903A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- led
- control board
- led control
- cooling plate
- chuck
- Prior art date
Links
- 238000001816 cooling Methods 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000000696 magnetic material Substances 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims abstract description 3
- 239000011247 coating layer Substances 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000000523 sample Substances 0.000 description 14
- 238000007689 inspection Methods 0.000 description 12
- 239000011521 glass Substances 0.000 description 10
- 238000012360 testing method Methods 0.000 description 7
- 239000002826 coolant Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
Definitions
- the present disclosure relates to LED chucks.
- an electronic device inspection apparatus for inspecting electronic devices
- an electronic device inspection apparatus for example, Patent Document 1 that irradiates light from an LED to heat the electronic device is known.
- This disclosure provides a technique for suppressing the emission of noise to the outside that occurs when illuminating an LED.
- a top plate on which an object to be inspected is placed, and a plurality of LEDs arranged to face the object to be inspected and heating the object to be inspected placed on the top plate a cooling plate arranged on the rear surface side of the LED array substrate; an LED control substrate arranged on the rear surface side of the cooling plate and controlling the plurality of LEDs; and the LED control substrate and a base plate arranged to surround the LED chuck, wherein the surface of the cooling plate facing the LED control board and the surface of the base plate facing the LED control board are made of a magnetic material.
- This disclosure provides a technique for suppressing the emission of noise to the outside that occurs when illuminating an LED.
- FIG. 1 is a perspective view of an electronic device inspection apparatus according to this embodiment.
- FIG. 2 is a front view of the electronic device inspection apparatus according to this embodiment.
- FIG. 3 is a cross-sectional view of an LED chuck according to this embodiment.
- FIG. 4 is a cross-sectional view of the cooling plate of the LED chuck according to this embodiment.
- FIG. 5 is a cross-sectional view of the base plate of the LED chuck according to this embodiment.
- FIG. 6 is a cross-sectional view of an LED chuck according to this embodiment.
- FIG. 1 is a perspective view of an electronic device inspection apparatus 10, which is an example of an electronic device inspection apparatus according to this embodiment.
- FIG. 2 is a front view of an electronic device inspection apparatus 10, which is an example of an electronic device inspection apparatus according to this embodiment. Note that FIG. 2 schematically shows components incorporated in the electronic device inspection apparatus 10 as a partial cross-sectional view.
- the electronic device inspection apparatus 10 inspects electrical characteristics of a plurality of electronic devices formed on the wafer W.
- the electronic device testing apparatus 10 includes a storage chamber 12, a loader 13, and a tester 14.
- the housing chamber 12 has a hollow housing shape.
- the accommodation chamber 12 accommodates the stage 11 therein.
- the storage chamber 12 also includes a probe card 15 inside.
- the probe card 15 includes a plurality of needle-like probes 16 arranged corresponding to electrode pads or solder bumps provided corresponding to the electrodes of the electronic devices on the wafer W. As shown in FIG.
- the wafer W is fixed to the stage 11 so that its position relative to the stage 11 does not shift.
- the stage 11 has an LED chuck 30 .
- the wafer W is fixed to the stage 11 by the LED chuck 30 .
- the stage 11 moves horizontally and vertically.
- the stage 11 adjusts the relative position between the probe card 15 and the wafer W.
- Electrode pads and solder bumps provided corresponding to the electrodes of the electronic devices on the wafer W are brought into contact with the probes 16 of the probe card 15 .
- the loader 13 takes out the wafer W on which the electronic devices are arranged from a FOUP (Front Opening Unify Pod), which is a transfer container, and places it on the stage 11 inside the storage chamber 12 . Also, the loader 13 removes the wafer W that has been inspected from the stage 11 and accommodates it in the FOUP.
- FOUP Front Opening Unify Pod
- the probe card 15 is connected to the tester 14. When each probe 16 contacts the electrode pads or solder bumps provided corresponding to the electrodes of each electronic device on the wafer W, each probe 16 supplies power from the tester 14 to each electronic device. Each probe 16 also transmits signals from the electronic device to the tester 14 .
- the tester 14 has a test board (not shown) that reproduces part of the circuit configuration of the motherboard on which the electronic device is mounted. Also, the test board of the tester 14 is connected to a tester computer 18 which judges the quality of the electronic device based on signals from the electronic device. By replacing the test board in the tester 14, circuit configurations of multiple types of motherboards can be reproduced.
- the loader 13 includes a base unit 19 as a controller that controls a power source, etc., and a potential difference generation circuit (not shown) in each electronic device, such as a potential difference measurement unit 20 that measures the potential difference in a diode, transistor, or resistor.
- the potential difference measurement unit 20 is connected to the probe card 15 via wiring 21 .
- the potential difference measurement unit 20 acquires the potential difference between the two probes 16 contacting the two electrode pads corresponding to each electrode of the potential difference generation circuit, and transfers the acquired potential difference to the base unit 19 .
- the base unit 19 is connected to the stage 11 via wiring 22 . It also controls the operation of the LED chuck 30, which will be described later.
- the base unit 19 and the potential difference measurement unit 20 may be provided in the housing chamber 12 , and the potential difference measurement unit 20 may be provided in the probe card 15 .
- the electronic device inspection apparatus 10 also includes a user interface section 23 .
- the user interface unit 23 includes a display panel such as a touch panel and a keyboard. The user inputs various information and instructions through the user interface section 23 .
- the tester computer 18 when inspecting the electrical characteristics of the electronic device, transmits data to the test board connected to the electronic device via each probe 16. Also, the tester computer 18 determines whether or not the transmitted data was correctly processed by the test board based on the electrical signals from the test board.
- FIG. 3 is a cross-sectional view of the LED chuck 30 according to this embodiment.
- the LED chuck 30 has a temperature raising function to control the temperature of the electronic device to be tested.
- the LED chuck 30 heats the electronic device with an LED 35a, which will be described later.
- the LED chuck 30 includes a top plate 31 , a glass plate 32 , an insulating ring 33 , a base plate 34 , an LED array substrate 35 , a cooling plate 36 and an LED control substrate 37 .
- a wafer W which is an object to be inspected, is placed on the top plate 31 .
- the top plate 31 is made of silicon carbide, for example.
- the top plate 31 has a mechanism for attracting the wafer W, which is an object to be inspected.
- the top plate 31 is placed on the glass plate 32 . That is, the glass plate 32 is provided on the back side of the top plate 31 when viewed from above.
- the glass plate 32 is made of heat-resistant glass, for example.
- the glass plate 32 transmits light from the LEDs 35 a mounted on the LED array substrate 35 . The light transmitted through the LEDs 35 a heats the top plate 31 and the wafer W placed on the top plate 31 .
- the insulating ring 33 is a member that connects the glass plate 32 and the base plate 34 .
- the insulating ring 33 has a hollow cylindrical shape.
- a cooling plate 36 and an LED control board 37 are provided in the internal space formed by the insulating ring 33 , the glass plate 32 and the base plate 34 .
- the insulating ring 33 is made of, for example, a low thermal expansion material.
- the base plate 34 holds the cooling plate 36.
- the base plate 34 is made of ceramic, for example.
- the cooling plate 36 is fixed to the base plate 34 with screws 39 .
- the LED array substrate 35 is a substrate on which the LEDs 35a are mounted.
- the LED array substrate 35 holds the LEDs 35 a and conducts heat generated from the LEDs 35 a to the cooling plate 36 .
- the LED array substrate 35 is made of aluminum, for example.
- the cooling plate 36 cools the LED array substrate 35.
- the cooling plate 36 is made of copper, for example.
- the cooling plate 36 has a coolant inlet 36a on its side surface.
- the cooling plate 36 has a channel 36b inside.
- the coolant introduced from the coolant inlet port 36a passes through the flow path 36b and is discharged from the coolant outlet port.
- the cooling plate 36 is cooled by the coolant passing through the flow path 36b.
- the cooling plate 36 carries the LED array substrate 35 thereon. That is, the cooling plate 36 is provided on the back side of the LED array substrate 35 when viewed from above.
- the LED control board 37 is a board provided with a circuit for controlling light emission of the LEDs 35a of the LED array board 35.
- the LED control board 37 is made of, for example, a glass epoxy board.
- the LED control board 37 is fixed to the cooling plate 36 by a power supply member 38 .
- the LED control board 37 is provided on the back side of the cooling plate 36 when viewed from above.
- the power supply member 38 also supplies power from the LED control board 37 to the LEDs 35 a of the LED array board 35 .
- the LED control board 37 is arranged so as to be surrounded by the base plate 34 .
- the LED control board 37 generates noise because it has a circuit that drives the LED 35a to switch between ON and OFF at high speed.
- the LED chuck 30 includes the LED control board 37 A coating layer made of a magnetic material is provided on the surface corresponding to the .
- a coating layer made of a magnetic material will be explained.
- FIG. 4 is a cross-sectional view of the cooling plate 36 of the LED chuck 30 according to this embodiment.
- the cooling plate 36 includes a top surface 36S1 on which the LED array substrate 35 is placed, a bottom surface 36S2 facing the LED control substrate 37, and a side surface 36S3 connecting the top surface 36S1 and the bottom surface 36S2, and a coating layer 36c made of a magnetic material.
- the covering layer 36c is an example of a first covering layer.
- FIG. 5 is a cross-sectional view of the base plate 34 of the LED chuck 30 according to this embodiment.
- the base plate 34 includes a coating layer 34c made of a magnetic material on the upper surface 34S1 facing the LED control board 37. As shown in FIG. A coating layer made of a magnetic material is not formed on the lower surface 34S2. Note that the coating layer 34c is an example of a second coating layer.
- the magnetic material forming the coating layers 36c and 34c is, for example, nickel.
- the coating layer 36c and the coating layer 34c are formed of magnetic plated layers. That is, the coating layer 36c and the coating layer 34c are magnetic plating layers.
- the base plate 34 may be made of a magnetic metal.
- the base plate 34 may be made of magnetic stainless steel.
- the shielding effect can be enhanced by forming the base plate 34 itself from a magnetic metal.
- the coating layer 36c and the coating layer 34c may be composed of ferrite plated layers. That is, the coating layer 36c and the coating layer 34c may be ferrite plated layers. High frequency noise can be suppressed by using ferrite.
- the covering layer 36c and the covering layer 34c may be configured by attaching a magnetic shield sheet. It can be easily mounted by attaching a sheet. Also, the material of the magnetic shield sheet may be appropriately selected according to the noise frequency.
- FIG. 6 is a cross-sectional view of the LED chuck 30 according to the present embodiment, particularly an enlarged cross-sectional view of the connecting portion between the LED array substrate 35 and the LED control substrate 37. As shown in FIG. The LED array board 35 and the LED control board 37 are electrically connected by a power supply member 38 .
- the power supply member 38 includes a screw 381 , a screw 382 , and a connecting member 383 that connects the screw 381 and the screw 382 .
- the screw 381, screw 382 and connecting member 383 are made of a conductive material.
- screw 381, screw 382 and connecting member 383 are made of metal.
- a resin sleeve 384 is provided around the screw 381 to insulate it from the cooling plate 36 .
- a sleeve 385 for insulating the cooling plate 36 is provided around the connection member 383 .
- the LED control board 37 includes electronic components 371 for controlling the LEDs 35a.
- the electronic component 371 is a component that generates heat. In order to cool the electronic component 371 , the electronic component 371 is thermally connected with the cooling plate 36 via the thermally conductive sheet 372 .
- connection cable 37 a is connected to the LED control board 37 .
- a shield 40 is provided around the connection cable 37a. By providing the shield 40, the noise radiated from the connection cable 37a can be reduced to less than half.
- the shield 40 is made of stainless steel, for example.
- the connection cable 37a may be covered with a magnetic shield sheet.
- LED chuck 31 top plate 32 glass plate 33 insulation ring 34 base plate 34c coating layer 34S1 upper surface 34S2 lower surface 35 LED array substrate 36 cooling plate 36c coating layer 36S1 upper surface 36S2 lower surface 36S3 side surface 37 LED control substrate 37a connection cable 38 power supply member 40 shield 371 Electronic component 372 Thermally conductive sheet W Wafer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Environmental & Geological Engineering (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Led Device Packages (AREA)
Abstract
Description
本実施形態のLEDチャック30について説明する。図3は、本実施形態に係るLEDチャック30の断面図である。
31 トッププレート
32 ガラスプレート
33 絶縁リング
34 ベースプレート
34c 被覆層
34S1 上面
34S2 下面
35 LEDアレイ基板
36 クーリングプレート
36c 被覆層
36S1 上面
36S2 下面
36S3 側面
37 LED制御基板
37a 接続ケーブル
38 給電部材
40 シールド
371 電子部品
372 熱伝導性シート
W ウエハ
Claims (9)
- 被検査体が載置されるトッププレートと、
前記被検査体に対向して配置され、前記トッププレートに載置される被検査体を加熱する複数のLEDが設けられたLEDアレイ基板と、
前記LEDアレイ基板の裏面側に配置されるクーリングプレートと、
前記クーリングプレートの裏面側に配置されて前記複数のLEDを制御するLED制御基板と、
前記LED制御基板を囲むように配置されるベースプレートと、
を備え、
前記クーリングプレートの前記LED制御基板に対向する面及び前記ベースプレートの前記LED制御基板に対向する面は、磁性体材料からなる、
LEDチャック。 - 前記クーリングプレートの前記LED制御基板に対向する面は、前記磁性体材料からなる第1被覆層を有する、
請求項1に記載のLEDチャック。 - 前記第1被覆層は、磁性体めっき層である、
請求項2に記載のLEDチャック。 - 前記ベースプレートの前記LED制御基板に対向する面は、前記磁性体材料からなる第2被覆層を有する、
請求項1から請求項3のいずれか一項に記載のLEDチャック。 - 前記第2被覆層は、磁性体めっき層である、
請求項4に記載のLEDチャック。 - 前記磁性体材料は、ニッケルである、
請求項1から請求項5のいずれか一項に記載のLEDチャック。 - 前記ベースプレートは、セラミックにより形成される、
請求項1から請求項6のいずれか一項に記載のLEDチャック。 - 前記LED制御基板に接続される接続ケーブルを備え、
前記接続ケーブルは、シールドにより覆われる、
請求項1から請求項7のいずれか一項に記載のLEDチャック。 - 前記LED制御基板に搭載の電子部品は、熱伝導性シートを介して前記クーリングプレートに固定される、
請求項1から請求項8のいずれか一項に記載のLEDチャック。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020237036294A KR20230160884A (ko) | 2021-03-30 | 2022-03-16 | Led 척 |
DE112022001827.5T DE112022001827T5 (de) | 2021-03-30 | 2022-03-16 | LED-Futter |
US18/282,744 US20240159825A1 (en) | 2021-03-30 | 2022-03-16 | Led chuck |
CN202280023471.7A CN117043611A (zh) | 2021-03-30 | 2022-03-16 | Led卡盘 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021057160A JP2022154237A (ja) | 2021-03-30 | 2021-03-30 | Ledチャック |
JP2021-057160 | 2021-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022209903A1 true WO2022209903A1 (ja) | 2022-10-06 |
Family
ID=83459025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2022/011973 WO2022209903A1 (ja) | 2021-03-30 | 2022-03-16 | Ledチャック |
Country Status (6)
Country | Link |
---|---|
US (1) | US20240159825A1 (ja) |
JP (1) | JP2022154237A (ja) |
KR (1) | KR20230160884A (ja) |
CN (1) | CN117043611A (ja) |
DE (1) | DE112022001827T5 (ja) |
WO (1) | WO2022209903A1 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001068515A (ja) * | 1999-06-30 | 2001-03-16 | Cascade Microtech Inc | 容量性電流を遮蔽するプローブステーション熱チャック |
JP2003077964A (ja) * | 2001-08-31 | 2003-03-14 | Ibiden Co Ltd | ウエハプローバ用チャックトップ |
JP2011030122A (ja) * | 2009-07-29 | 2011-02-10 | Tamura Seisakusho Co Ltd | 可視光通信用led照明装置 |
JP2011520269A (ja) * | 2008-05-02 | 2011-07-14 | アプライド マテリアルズ インコーポレイテッド | 回転基板のための非半径方向温度制御のためのシステム |
JP2017195239A (ja) * | 2016-04-19 | 2017-10-26 | 三菱電機株式会社 | プローブ位置検査装置および半導体評価装置ならびにプローブ位置検査方法 |
WO2018100881A1 (ja) * | 2016-11-29 | 2018-06-07 | 東京エレクトロン株式会社 | 載置台及び電子デバイス検査装置 |
WO2019116911A1 (ja) * | 2017-12-13 | 2019-06-20 | 東京エレクトロン株式会社 | 検査装置 |
WO2020230674A1 (ja) * | 2019-05-10 | 2020-11-19 | 東京エレクトロン株式会社 | 載置台及び載置台の作製方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6994313B2 (ja) | 2016-11-29 | 2022-01-14 | 東京エレクトロン株式会社 | 載置台及び電子デバイス検査装置 |
JP2021057160A (ja) | 2019-09-27 | 2021-04-08 | 東芝ライテック株式会社 | 照明制御システム |
-
2021
- 2021-03-30 JP JP2021057160A patent/JP2022154237A/ja active Pending
-
2022
- 2022-03-16 US US18/282,744 patent/US20240159825A1/en active Pending
- 2022-03-16 KR KR1020237036294A patent/KR20230160884A/ko unknown
- 2022-03-16 WO PCT/JP2022/011973 patent/WO2022209903A1/ja active Application Filing
- 2022-03-16 DE DE112022001827.5T patent/DE112022001827T5/de active Pending
- 2022-03-16 CN CN202280023471.7A patent/CN117043611A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001068515A (ja) * | 1999-06-30 | 2001-03-16 | Cascade Microtech Inc | 容量性電流を遮蔽するプローブステーション熱チャック |
JP2003077964A (ja) * | 2001-08-31 | 2003-03-14 | Ibiden Co Ltd | ウエハプローバ用チャックトップ |
JP2011520269A (ja) * | 2008-05-02 | 2011-07-14 | アプライド マテリアルズ インコーポレイテッド | 回転基板のための非半径方向温度制御のためのシステム |
JP2011030122A (ja) * | 2009-07-29 | 2011-02-10 | Tamura Seisakusho Co Ltd | 可視光通信用led照明装置 |
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WO2019116911A1 (ja) * | 2017-12-13 | 2019-06-20 | 東京エレクトロン株式会社 | 検査装置 |
WO2020230674A1 (ja) * | 2019-05-10 | 2020-11-19 | 東京エレクトロン株式会社 | 載置台及び載置台の作製方法 |
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JP2022154237A (ja) | 2022-10-13 |
US20240159825A1 (en) | 2024-05-16 |
KR20230160884A (ko) | 2023-11-24 |
CN117043611A (zh) | 2023-11-10 |
DE112022001827T5 (de) | 2024-01-11 |
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