WO2022209830A1 - 粘着シート、補強フィルム、およびデバイスの製造方法 - Google Patents
粘着シート、補強フィルム、およびデバイスの製造方法 Download PDFInfo
- Publication number
- WO2022209830A1 WO2022209830A1 PCT/JP2022/011405 JP2022011405W WO2022209830A1 WO 2022209830 A1 WO2022209830 A1 WO 2022209830A1 JP 2022011405 W JP2022011405 W JP 2022011405W WO 2022209830 A1 WO2022209830 A1 WO 2022209830A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive sheet
- meth
- acrylate
- pressure
- sensitive adhesive
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 160
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 160
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 230000002787 reinforcement Effects 0.000 title description 11
- 238000000016 photochemical curing Methods 0.000 claims abstract description 90
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 87
- 229920005601 base polymer Polymers 0.000 claims abstract description 57
- 239000000203 mixture Substances 0.000 claims abstract description 56
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000000178 monomer Substances 0.000 claims abstract description 47
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 35
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 34
- 239000000470 constituent Substances 0.000 claims abstract description 17
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims abstract description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 72
- 230000003014 reinforcing effect Effects 0.000 claims description 63
- 239000000758 substrate Substances 0.000 claims description 45
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 239000003999 initiator Substances 0.000 claims description 7
- 125000000524 functional group Chemical group 0.000 abstract description 6
- -1 acryl Chemical group 0.000 description 28
- 239000003431 cross linking reagent Substances 0.000 description 26
- 230000003287 optical effect Effects 0.000 description 21
- 238000004132 cross linking Methods 0.000 description 14
- 238000007689 inspection Methods 0.000 description 14
- 239000010410 layer Substances 0.000 description 14
- 229920000058 polyacrylate Polymers 0.000 description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 11
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 238000001035 drying Methods 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000012948 isocyanate Substances 0.000 description 7
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000002313 adhesive film Substances 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 229920002457 flexible plastic Polymers 0.000 description 3
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 150000002902 organometallic compounds Chemical class 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- KANZWHBYRHQMKZ-UHFFFAOYSA-N 2-ethenylpyrazine Chemical compound C=CC1=CN=CC=N1 KANZWHBYRHQMKZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 229920003235 aromatic polyamide Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000006165 cyclic alkyl group Chemical group 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229940059574 pentaerithrityl Drugs 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- HASUCEDGKYJBDC-UHFFFAOYSA-N 1-[3-[[bis(oxiran-2-ylmethyl)amino]methyl]cyclohexyl]-n,n-bis(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC1CC(CN(CC2OC2)CC2OC2)CCC1)CC1CO1 HASUCEDGKYJBDC-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- DCRYNQTXGUTACA-UHFFFAOYSA-N 1-ethenylpiperazine Chemical compound C=CN1CCNCC1 DCRYNQTXGUTACA-UHFFFAOYSA-N 0.000 description 1
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- BFYSJBXFEVRVII-UHFFFAOYSA-N 1-prop-1-enylpyrrolidin-2-one Chemical compound CC=CN1CCCC1=O BFYSJBXFEVRVII-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- KQSMCAVKSJWMSI-UHFFFAOYSA-N 2,4-dimethyl-1-n,1-n,3-n,3-n-tetrakis(oxiran-2-ylmethyl)benzene-1,3-diamine Chemical compound CC1=C(N(CC2OC2)CC2OC2)C(C)=CC=C1N(CC1OC1)CC1CO1 KQSMCAVKSJWMSI-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- 125000000143 2-carboxyethyl group Chemical group [H]OC(=O)C([H])([H])C([H])([H])* 0.000 description 1
- PGMMQIGGQSIEGH-UHFFFAOYSA-N 2-ethenyl-1,3-oxazole Chemical compound C=CC1=NC=CO1 PGMMQIGGQSIEGH-UHFFFAOYSA-N 0.000 description 1
- MZNSQRLUUXWLSB-UHFFFAOYSA-N 2-ethenyl-1h-pyrrole Chemical compound C=CC1=CC=CN1 MZNSQRLUUXWLSB-UHFFFAOYSA-N 0.000 description 1
- ZDHWTWWXCXEGIC-UHFFFAOYSA-N 2-ethenylpyrimidine Chemical compound C=CC1=NC=CC=N1 ZDHWTWWXCXEGIC-UHFFFAOYSA-N 0.000 description 1
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- CFZDMXAOSDDDRT-UHFFFAOYSA-N 4-ethenylmorpholine Chemical compound C=CN1CCOCC1 CFZDMXAOSDDDRT-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- CUXGDKOCSSIRKK-UHFFFAOYSA-N 7-methyloctyl prop-2-enoate Chemical compound CC(C)CCCCCCOC(=O)C=C CUXGDKOCSSIRKK-UHFFFAOYSA-N 0.000 description 1
- JSCDRVVVGGYHSN-UHFFFAOYSA-N 8-hydroxyoctyl prop-2-enoate Chemical compound OCCCCCCCCOC(=O)C=C JSCDRVVVGGYHSN-UHFFFAOYSA-N 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- VTLYFUHAOXGGBS-UHFFFAOYSA-N Fe3+ Chemical compound [Fe+3] VTLYFUHAOXGGBS-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical class NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- KBWLNCUTNDKMPN-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) hexanedioate Chemical compound C1OC1COC(=O)CCCCC(=O)OCC1CO1 KBWLNCUTNDKMPN-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001718 carbodiimides Chemical class 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- KIQKWYUGPPFMBV-UHFFFAOYSA-N diisocyanatomethane Chemical compound O=C=NCN=C=O KIQKWYUGPPFMBV-UHFFFAOYSA-N 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- KHAYCTOSKLIHEP-UHFFFAOYSA-N docosyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)C=C KHAYCTOSKLIHEP-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- LZKLAOYSENRNKR-LNTINUHCSA-N iron;(z)-4-oxoniumylidenepent-2-en-2-olate Chemical compound [Fe].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O LZKLAOYSENRNKR-LNTINUHCSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- CWOBGOXHYZMVNY-UHFFFAOYSA-N methyl 2,3,5,6-tetrachloro-4-[methoxy(methyl)carbamoyl]benzoate Chemical compound CON(C)C(=O)C1=C(Cl)C(Cl)=C(C(=O)OC)C(Cl)=C1Cl CWOBGOXHYZMVNY-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- SJPFBRJHYRBAGV-UHFFFAOYSA-N n-[[3-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C=C(CN(CC2OC2)CC2OC2)C=CC=1)CC1CO1 SJPFBRJHYRBAGV-UHFFFAOYSA-N 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical class C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000001196 nonadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- MDYPDLBFDATSCF-UHFFFAOYSA-N nonyl prop-2-enoate Chemical compound CCCCCCCCCOC(=O)C=C MDYPDLBFDATSCF-UHFFFAOYSA-N 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XZHNPVKXBNDGJD-UHFFFAOYSA-N tetradecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCOC(=O)C=C XZHNPVKXBNDGJD-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 125000003866 trichloromethyl group Chemical group ClC(Cl)(Cl)* 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
- C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
Definitions
- the present invention relates to a pressure-sensitive adhesive sheet made of a photocurable pressure-sensitive adhesive composition and a reinforcing film comprising the pressure-sensitive adhesive sheet on a film substrate. Furthermore, the present invention relates to a method for manufacturing a device with a reinforcing film, in which the reinforcing film is adhered to the surface of an adherend.
- Adhesive films are sometimes attached to the surfaces of optical devices such as displays and electronic devices for the purpose of protecting the surfaces and imparting impact resistance.
- Such an adhesive film usually has an adhesive layer (adhesive sheet) fixedly laminated on the main surface of the film substrate, and is attached to the device surface via the adhesive sheet.
- Patent Literature 1 discloses a reinforcing film having a pressure-sensitive adhesive sheet made of a photocurable pressure-sensitive adhesive composition on a film substrate.
- This reinforcing film can be peeled off from the adherend because the adhesive has low adhesiveness immediately after being attached to the adherend. Therefore, reworking from the adherend is possible, and it is also possible to selectively remove the reinforcing film from a portion of the adherend that does not require reinforcement. Since the adhesive of the reinforcing film strongly adheres to the adherend by photocuring, the film base material is permanently adhered to the surface of the adherend, and can be used as a reinforcing material that protects the surface of the device. .
- an optical sensor such as a fingerprint sensor is placed in the display area of the display.
- an optical sensor such as a fingerprint sensor
- a configuration having the optical sensor within the display area can be realized.
- an object of the present invention is to provide a pressure-sensitive adhesive sheet that has a high haze in the final product incorporated into a device without reducing the inspection performance in the manufacturing process of the device.
- One aspect of the present invention is a pressure-sensitive adhesive sheet in which a photocurable pressure-sensitive adhesive composition is formed in layers.
- the adhesive composition contains an acrylic base polymer and a photocuring agent, and may contain a photopolymerization initiator.
- the acrylic base polymer contains 70% by weight or more of a (meth)acrylic acid alkyl ester in which the alkyl group is a chain alkyl having 6 or more carbon atoms, based on the total amount of the constituent monomer components.
- the photocuring agent contains polyfunctional (meth)acrylates having 4 or more (meth)acryloyl groups in one molecule.
- the content of the tetrafunctional or higher polyfunctional (meth)acrylate in the adhesive composition is preferably 7 parts by weight or more with respect to 100 parts by weight of the acrylic base polymer.
- the difference H 1 ⁇ H 0 between the haze H 1 of the adhesive sheet after photocuring and the haze H 0 before photocuring is preferably 1.0% or more.
- the haze H 0 of the adhesive sheet before photocuring is preferably less than 6%, and may be 5% or less.
- the haze H1 of the adhesive sheet after photocuring is preferably 3% or more, and may be 5% or more or 6% or more.
- a further aspect of the present invention is a reinforcing film in which the pressure-sensitive adhesive sheet described above is fixedly laminated on one main surface of a film substrate.
- a device with a reinforcing film can be formed by temporarily attaching the sheet of the reinforcing film to the surface of an adherend and then photocuring the pressure-sensitive adhesive sheet.
- the adherend may be an organic EL panel.
- the above adhesive sheet has a small haze before photocuring, it is possible to ensure the accuracy of optical inspection by visual inspection or imaging even when it is attached to the adherend.
- members such as an optical sensor arranged on the back side of the adhesive sheet are less likely to be visually recognized (recognized) from the outer surface of the device.
- FIG. 3 is a cross-sectional view showing a laminated structure of pressure-sensitive adhesive sheets having release films on both sides.
- FIG. 3 is a cross-sectional view showing a laminated structure of reinforcing films;
- FIG. 3 is a cross-sectional view showing an example of a laminated structure of a device to which a reinforcing film is attached;
- FIG. 1 is a cross-sectional view showing a release film-attached pressure-sensitive adhesive sheet in which release films 51 and 52 are temporarily attached to both sides of the pressure-sensitive adhesive sheet 2 .
- FIG. 2 is a cross-sectional view of a reinforcing film in which an adhesive sheet 2 is fixedly laminated on one main surface of a film substrate 1 and a release film 52 is temporarily attached on the adhesive sheet 2 .
- the adhesive sheet 2 is formed by layering a photocurable adhesive composition, and is cured by irradiation with actinic rays such as ultraviolet rays to increase the adhesive strength to the adherend.
- FIG. 3 is a cross-sectional view showing a state in which the reinforcing film 10 is attached to the surface of the device 20.
- FIG. The release film 51 is peeled off from the surface of the adhesive sheet 2 of the reinforcing film shown in FIG. be done.
- the adhesive sheet 2 has not yet been photocured, and the reinforcing film 10 (adhesive sheet 2 ) is temporarily attached to the device 20 .
- the adhesive force at the interface between the device 20 and the adhesive sheet 2 is increased, and the reinforcing film 10 is fixed to the surface of the device 20 .
- “Fixation” is a state in which two laminated layers are firmly adhered, and it is impossible or difficult to separate them at the interface. "Temporarily adhered” means a state in which the adhesive strength between two laminated layers is small and the layers can be easily separated at the interface between them.
- the release films 51 and 52 are temporarily attached to both sides of the adhesive sheet 2 , and the release films 51 and 52 can be easily peeled off from the surface of the adhesive sheet 2 .
- the film substrate 1 and the adhesive sheet 2 are fixed together, and the release film 51 is temporarily attached to the adhesive sheet 2 .
- peeling occurs at the interface between the adhesive sheet 2 and the release film 51 , and the state in which the adhesive sheet 2 adheres to the film substrate 1 is maintained. No adhesive remains on the release film 51 after peeling.
- the device 20 and the adhesive sheet 2 are temporarily attached before the adhesive sheet 2 is photocured.
- the adhesive sheet 2 is kept fixed on the film substrate 1 because the interface between the adhesive sheet 2 and the device 20 is peeled off.
- the adhesive force between the adhesive sheet 2 and the device 20 increases, and the device 20 is fixed. Cohesive failure of the sheet 2 may occur.
- the adhesive sheet 2 is made of a photocurable composition containing a base polymer and a photocurable agent. Since the pressure-sensitive adhesive sheet 2 has a low adhesive force to adherends such as devices and device parts before being photocured, it can be peeled off from the adherends. The pressure-sensitive adhesive sheet 2 has excellent adhesion reliability because its adhesive strength with an adherend is improved by photocuring.
- the light-curing adhesive hardly progresses in a general storage environment, and is cured by exposure to actinic rays such as ultraviolet rays. Therefore, the reinforcing film in which the adhesive sheet 2 is fixedly laminated on the film substrate 1 has the advantage that the timing of curing of the adhesive sheet 2 can be arbitrarily set, and the lead time of the process can be flexibly handled. .
- the thickness of the adhesive sheet 2 is, for example, about 1 to 300 ⁇ m. As the thickness of the pressure-sensitive adhesive sheet 2 increases, the adhesiveness to the adherend tends to improve. On the other hand, if the thickness of the adhesive sheet 2 is excessively large, it may have high fluidity before photocuring and may be difficult to handle. Therefore, the thickness of the adhesive sheet 2 is preferably 3-100 ⁇ m, more preferably 5-50 ⁇ m, even more preferably 6-40 ⁇ m, and particularly preferably 8-30 ⁇ m. From the viewpoint of thickness reduction, the thickness of the adhesive sheet 2 may be 25 ⁇ m or less, 20 ⁇ m or less, or 18 ⁇ m or less.
- the total light transmittance of the adhesive sheet used for optical devices such as displays is preferably 80% or higher, more preferably 85% or higher, and even more preferably 90% or higher.
- the haze of the adhesive sheet is preferably less than 6%, and may be 5% or less, 4% or less, or 3% or less.
- the final product such as a display
- the haze of the adhesive sheet is preferably 3% or more, more preferably 5% or more, still more preferably 6% or more, and may be 7% or more, 8% or more, 9% or more, or 10% or more.
- the pressure-sensitive adhesive sheet of the present invention has a low haze before photocuring, and the haze increases upon photocuring. Therefore, the accuracy of the optical inspection can be improved by performing the optical inspection before the adhesive sheet is photocured. In addition, in the final product obtained by photocuring the adhesive sheet, since the haze of the adhesive sheet is high, it is difficult for the user of the device to recognize the optical sensor or the like arranged on the back surface.
- the amount of increase in haze of the adhesive sheet due to photocuring is preferably 1.0% or more. 1.5% or more is more preferable, and it may be 2.0% or more, 2.5% or more, 3.0% or more, 4.0% or more, or 5.0% or more.
- the upper limit of haze increase is not particularly limited, but is generally 30% or less, and may be 20% or less or 15% or less.
- the adhesive composition that constitutes the adhesive sheet 2 contains a base polymer and a photo-curing agent and has photo-curing properties.
- the adhesive composition (photocurable composition) constituting the adhesive sheet 2 preferably contains a photopolymerization initiator.
- the base polymer is the main component of the pressure-sensitive adhesive composition, and the main factor that determines various properties of the pressure-sensitive adhesive sheet, such as adhesive strength.
- the pressure-sensitive adhesive composition preferably contains an acrylic polymer as a base polymer, and the acrylic polymer accounts for 50% by weight or more of the pressure-sensitive adhesive composition, since it is easy to control the adhesive strength and the like.
- the acrylic base polymer contains (meth)acrylic acid alkyl ester as the main monomer component.
- (meth)acryl means acryl and/or methacryl.
- the (meth)acrylic acid alkyl ester a (meth)acrylic acid C 1-22 alkyl ester in which the alkyl group has 1 to 22 carbon atoms is preferably used.
- the (meth)acrylic acid alkyl ester may have a branched alkyl group or a cyclic alkyl group.
- the acrylic base polymer preferably contains 70% by weight or more of a (meth)acrylic acid alkyl ester in which the alkyl group is a chain alkyl group having 6 or more carbon atoms, based on the total amount of the constituent monomer components.
- the haze of the pressure-sensitive adhesive sheet after photocuring tends to increase as the ratio of the (meth)acrylic acid alkyl ester having a chain alkyl of 6 or more carbon atoms (hereinafter referred to as "C6 or more alkyl (meth)acrylate") increases. be.
- the amount of C6 or higher alkyl (meth)acrylate is more preferably 75% by weight or more, more preferably 80% by weight or more, 85% by weight or more, 90% by weight or more, 93% by weight or more, or It may be 95% by weight or more.
- the upper limit of the amount of C6 or higher alkyl (meth)acrylate is not particularly limited. As will be described later, in order to introduce cross-linking points into the acrylic base polymer, it is preferable to use a hydroxy group-containing monomer or a carboxy group-containing monomer. It is preferably 99.5% by weight or less, more preferably 99% by weight or less, and may be 98% by weight or less, or 97% by weight or less, relative to the total amount of the constituent monomer components.
- the chain alkyl group of the C6 or higher alkyl (meth)acrylate may be linear or branched.
- Specific examples of C6 or higher alkyl (meth)acrylates include hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isooctyl (meth)acrylate, Nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, isotridecyl (meth) acrylate, ( meth)tetradecyl acrylate, isotetradecyl(meth)acrylate, pentadecyl(meth)acrylate, cetyl(meth
- the number of carbon atoms in the chain alkyl group in the C6 or higher alkyl (meth)acrylate is preferably 9 or less.
- Specific examples of low Tg C6 or higher alkyl (meth)acrylates include 2-ethylhexyl acrylate (Tg: -70°C), n-hexyl acrylate (Tg: -65°C), n-octyl acrylate (Tg: ⁇ 65° C.), isononyl acrylate (Tg: ⁇ 60° C.), n-nonyl acrylate (Tg: ⁇ 58° C.), isooctyl acrylate (Tg: ⁇ 58° C.), and the like.
- the chain alkyl group in the C6 or higher alkyl (meth)acrylate may have a branch. If the number of carbon atoms in the alkyl group is large or if the alkyl group has a branched structure, the molecular volume is large. Domains are likely to be formed, and the increase in haze is considered to be remarkable.
- the constituent monomer components of the acrylic base polymer may contain two or more C6 or higher alkyl (meth)acrylates, such as C 6-9 alkyl (meth)acrylate and C 10-22 alkyl (meth)acrylate. It may contain an ester.
- Constituent monomer components of the acrylic base polymer include, in addition to C6 or higher alkyl (meth)acrylates, alkyl (meth)acrylate esters having alkyl groups of 5 or less carbon atoms, and alkyl (meth)acrylates having cyclic alkyl groups. It may contain an ester.
- (meth)acrylic acid alkyl esters having an alkyl group having 5 or less carbon atoms include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, Examples include s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, isopentyl (meth)acrylate, and neopentyl (meth)acrylate.
- (meth)acrylic acid alkyl esters having an alicyclic alkyl group include cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, cycloheptyl (meth)acrylate, and cyclooctyl (meth)acrylate.
- (meth) acrylic acid cycloalkyl ester (meth) acrylic acid ester having a bicyclic aliphatic hydrocarbon ring such as isobornyl (meth) acrylate; dicyclopentanyl (meth) acrylate, dicyclopentanyloxy Tricyclics such as ethyl (meth)acrylate, tricyclopentanyl (meth)acrylate, 1-adamantyl (meth)acrylate, 2-methyl-2-adamantyl (meth)acrylate, 2-ethyl-2-adamantyl (meth)acrylate (Meth)acrylic acid esters having the above aliphatic hydrocarbon ring can be mentioned.
- the acrylic base polymer preferably contains a monomer component having a crosslinkable functional group as a copolymerization component in addition to the (meth)acrylic acid alkyl ester described above.
- Monomers having crosslinkable functional groups include hydroxy group-containing monomers and carboxy group-containing monomers.
- the acrylic base polymer may contain both a hydroxy group-containing monomer and a carboxy group-containing monomer as copolymerization components, or may contain only one of them.
- hydroxy group-containing monomers examples include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, and (meth)acrylate. 8-hydroxyoctyl acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, 4-(hydroxymethyl)cyclohexylmethyl (meth)acrylate and the like.
- Carboxy group-containing monomers include (meth)acrylic acid, 2-carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, crotonic acid and the like.
- the total amount of the hydroxyl group-containing monomer and the carboxy group-containing monomer relative to the total amount of the constituent monomer components is preferably 0.5 to 20% by weight, more preferably 1 to 15% by weight. It may be 1.5 to 10% by weight.
- the acrylic base polymer contains N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazine, vinylpyrazine, vinylpyrrole, vinylimidazole, vinyloxazole, vinylmorpholine, and N-acryloylmorpholine as monomer components. , N-vinylcarboxylic acid amides, and N-vinylcaprolactam.
- the acrylic base polymer may contain monomer components other than the above.
- the acrylic base polymer contains monomer components such as vinyl ester monomers, aromatic vinyl monomers, epoxy group-containing monomers, vinyl ether monomers, sulfo group-containing monomers, phosphoric acid group-containing monomers, and acid anhydride group-containing monomers. You can
- An acrylic polymer as a base polymer can be obtained by polymerizing the above monomer components by various known methods such as solution polymerization, emulsion polymerization, and bulk polymerization.
- a solution polymerization method is preferable from the viewpoint of the balance of properties such as the adhesive strength and holding power of the pressure-sensitive adhesive and the cost.
- Ethyl acetate, toluene, methyl ethyl ketone and the like are used as solvents for solution polymerization.
- the solution concentration is usually about 20 to 80% by weight.
- As the polymerization initiator various known ones such as azo type and peroxide type can be used.
- a chain transfer agent may be used to control molecular weight.
- the reaction temperature is generally about 50-80° C., and the reaction time is generally about 1-8 hours.
- the weight average molecular weight of the acrylic base polymer is preferably 100,000 to 2,000,000, more preferably 200,000 to 1,500,000, and even more preferably 300,000 to 1,000,000.
- the molecular weight of the base polymer refers to the molecular weight before the introduction of the crosslinked structure.
- crosslinking agent A cross-linked structure is introduced into the acrylic base polymer from the viewpoint of giving the pressure-sensitive adhesive an appropriate cohesive force to develop adhesive strength and ensuring the peelability of the pressure-sensitive adhesive sheet from the adherend before photocuring. is preferred.
- a cross-linked structure is introduced by adding a cross-linking agent to the solution after polymerization of the acrylic base polymer, and heating if necessary.
- cross-linking agents include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, carbodiimide-based cross-linking agents, and metal chelate-based cross-linking agents.
- cross-linking agents react with functional groups such as hydroxy groups and carboxy groups introduced into the acrylic base polymer to form a cross-linked structure.
- Isocyanate-based cross-linking agents and epoxy-based cross-linking agents are preferred because they are highly reactive with the hydroxy groups and carboxy groups of the acrylic base polymer and facilitate the introduction of a cross-linked structure.
- a polyisocyanate having two or more isocyanate groups in one molecule is used as the isocyanate-based cross-linking agent.
- polyisocyanate-based cross-linking agents include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; Aromatic isocyanates such as diisocyanate, 4,4′-diphenylmethane diisocyanate, and xylylene diisocyanate; trimethylolpropane/tolylene diisocyanate trimer adduct (for example, “Coronate L” manufactured by Tosoh), trimethylolpropane/hexane Methylene diisocyanate trimer adduct (e.g., Tosoh Corporation "Coronate HL”),
- a polyfunctional epoxy compound having two or more epoxy groups in one molecule is used as the epoxy-based cross-linking agent.
- the epoxy-based cross-linking agent may have 3 or more or 4 or more epoxy groups in one molecule.
- the epoxy group of the epoxy-based cross-linking agent may be a glycidyl group.
- epoxy-based cross-linking agents examples include N,N,N',N'-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, 1, 6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, penta erythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipate diglycidy
- the amount of cross-linking agent used may be adjusted as appropriate according to the composition, molecular weight, etc. of the acrylic base polymer.
- the amount of the cross-linking agent used is about 0.03 to 2 parts by weight, preferably 0.05 to 1 part by weight, more preferably 0.08 to 0.8 parts by weight, per 100 parts by weight of the acrylic base polymer. parts, and may be 0.1 to 0.5 parts by weight.
- a cross-linking catalyst may be used to promote the formation of a cross-linked structure.
- Cross-linking catalysts include organometallic compounds such as organometallic complexes (chelates), compounds of metals and alkoxy groups, and compounds of metals and acyloxy groups; and tertiary amines.
- organometallic compounds such as organometallic complexes (chelates), compounds of metals and alkoxy groups, and compounds of metals and acyloxy groups; and tertiary amines.
- an organometallic compound is preferable from the viewpoint of suppressing the progress of the crosslinking reaction in a solution state at room temperature and securing the pot life of the pressure-sensitive adhesive composition.
- Metals of the organometallic compounds include iron, tin, aluminum, zirconium, zinc, titanium, lead, cobalt, and the like.
- the amount of the cross-linking catalyst used is generally 0.5 parts by weight or less per 100 parts by weight of the acrylic base polymer.
- the adhesive composition that constitutes the adhesive sheet 2 contains a photo-curing agent in addition to the acrylic base polymer.
- the pressure-sensitive adhesive sheet 2 made of a photocurable pressure-sensitive adhesive composition has improved adhesive strength to an adherend when photocuring is performed after lamination with an adherend.
- a polyfunctional (meth)acrylate having 4 or more (meth)acryloyl groups in one molecule is used as the photocuring agent.
- Polyfunctional (meth)acrylates are typically esters of polyols and (meth)acrylic acid.
- the molecular weight of the photocuring agent is preferably 2000 or less, more preferably 1000 or less, and may be 800 or less or 600 or less.
- the functional group equivalent weight of the photocuring agent is preferably 60 to 200. , 70-150 is more preferred, and may be 75-130 or 80-120.
- tetrafunctional or higher polyfunctional (meth)acrylates include tetramethylolmethane tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, ditrimethylolpropane penta(meth)acrylate, ditrimethylolpropane hexa(meth) Acrylates, pentathritol tetra(meth)acrylate, ethoxylated pentathritol tetra(meth)acrylate, propoxylated pentathritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate etc.
- Polyfunctional (meth)acrylates may be used in combination of two or more.
- the polyfunctional (meth)acrylate exhibits moderate compatibility with the acrylic base polymer and has a small refractive index difference with the acrylic base polymer, so that the haze of the pressure-sensitive adhesive sheet before photocuring can be reduced.
- a tetrafunctional or higher polyfunctional (meth)acrylate as a photocuring agent, the haze of the pressure-sensitive adhesive sheet after photocuring tends to increase. There is a tendency that the amount of haze increase H 1 ⁇ H 0 of the pressure-sensitive adhesive sheet due to .
- the amount of the tetrafunctional or higher polyfunctional (meth)acrylate in the adhesive composition is preferably 7 parts by weight or more, more preferably 8 parts by weight or more, and 10 parts by weight or more with respect to 100 parts by weight of the acrylic base polymer. More preferably, it may be 13 parts by weight or more, or 15 parts by weight or more.
- the amount of the tetrafunctional or higher polyfunctional (meth)acrylate in the adhesive composition is not particularly limited, but if the amount of the photocuring agent is excessively large, the haze of the adhesive sheet before photocuring may increase. Moreover, when the amount of the photocuring agent is excessively large, the adhesive strength and flexibility of the adhesive sheet after photocuring may be insufficient.
- the amount of the tetrafunctional or higher polyfunctional (meth)acrylate in the adhesive composition is preferably 40 parts by weight or less, more preferably 35 parts by weight or less, more preferably 30 parts by weight with respect to 100 parts by weight of the acrylic base polymer.
- the following is more preferable, and may be 25 parts by weight or less.
- the adhesive composition may contain, as a photocuring agent, a trifunctional or less (meth)acrylate or other photocurable monomers or oligomers in addition to a tetrafunctional or more polyfunctional (meth)acrylate.
- a photocuring agent a trifunctional or less (meth)acrylate or other photocurable monomers or oligomers in addition to a tetrafunctional or more polyfunctional (meth)acrylate.
- the total amount of the photocuring agent total of the tetrafunctional or higher polyfunctional (meth)acrylate and other photocuring agents
- the content of the photocuring agent other than the tetrafunctional or higher polyfunctional (meth)acrylate is preferably 15 parts by weight or less, more preferably 10 parts by weight or less, more preferably 5 parts by weight or less, with respect to 100 parts by weight of the acrylic base polymer. It may be 3 parts by weight or less, or 1 part by weight or less.
- the adhesive composition preferably contains a photopolymerization initiator.
- the photopolymerization initiator generates active species upon exposure to actinic rays and accelerates the curing reaction of the photocuring agent.
- a polyfunctional (meth)acrylate is used as the photocuring agent, it is preferable to use a photoradical polymerization initiator.
- the photoradical polymerization initiator is preferably a photoradical generator that is cleaved by visible light or ultraviolet light having a wavelength shorter than 450 nm to generate radicals, such as hydroxyketones, benzyldimethylketals, aminoketones, and acylphosphine oxide. benzophenones, trichloromethyl group-containing triazine derivatives, and the like.
- a photoinitiator may be used individually and may be used in mixture of 2 or more types.
- the content of the photopolymerization initiator in the adhesive composition is about 0.001 to 5 parts by weight, 0.01 to 3 parts by weight, or 0.03 to 1 part by weight with respect to 100 parts by weight of the acrylic base polymer. may be a part.
- the adhesive composition may contain an oligomer in addition to the acrylic base polymer.
- the adhesive composition may contain an acrylic oligomer in addition to the acrylic base polymer.
- the oligomer those having a weight average molecular weight of about 1000 to 30000 are used.
- the acrylic oligomer contains a (meth)acrylic acid alkyl ester as a main constituent monomer component. From the viewpoint of increasing the adhesive strength of the adhesive sheet 2 after photocuring, the glass transition temperature of the acrylic oligomer is preferably 40°C or higher, more preferably 50°C or higher.
- the oligomer may contain crosslinkable functional groups similar to the acrylic base polymer.
- the content of the oligomer in the adhesive composition is not particularly limited.
- the amount of oligomer relative to 100 parts by weight of the acrylic base polymer is 0.1 to 20 parts by weight from the viewpoint of adjusting the adhesive force to an appropriate range. parts, more preferably 0.3 to 10 parts by weight, even more preferably 0.5 to 5 parts by weight.
- the pressure-sensitive adhesive composition includes a silane coupling agent, a tackifier, a plasticizer, a softening agent, an anti-degradation agent, a filler, a coloring agent, an ultraviolet absorber, an antioxidant, and a surfactant.
- Additives such as agents and antistatic agents may be contained within a range that does not impair the characteristics of the present invention.
- the above pressure-sensitive adhesive composition is coated by roll coating, kiss roll coating, gravure coating, reverse coating, roll brushing, spray coating, dip roll coating, bar coating, knife coating, air knife coating, curtain coating, lip coating, die coating, etc. , to form a pressure-sensitive adhesive sheet by coating on a substrate and removing the solvent by drying if necessary.
- a drying method an appropriate method can be adopted as appropriate.
- the heat drying temperature is preferably 40°C to 200°C, more preferably 50°C to 180°C, still more preferably 70°C to 170°C.
- the drying time is preferably 5 seconds to 20 minutes, more preferably 5 seconds to 15 minutes, even more preferably 10 seconds to 10 minutes.
- the pressure-sensitive adhesive composition contains a cross-linking agent
- the heating temperature and heating time are appropriately set according to the type of cross-linking agent used, and generally cross-linking is carried out by heating in the range of 20° C. to 160° C. for about 1 minute to 7 days.
- the heating for removing the solvent by drying may also serve as the heating for cross-linking.
- the gel fraction of the adhesive sheet 2 before photocuring (that is, the gel fraction of the photocurable composition constituting the adhesive sheet) is preferably 25% or more, more preferably 30% or more, 35% or more, and 40%. or more, or 45% or more.
- the gel fraction of the adhesive sheet 2 before photocuring is preferably 80% or less, and may be 75% or less or 70% or less.
- the gel fraction can be determined as an insoluble content in a solvent such as ethyl acetate. It is obtained as a fraction (unit: % by weight).
- the gel fraction of a polymer is equal to the degree of cross-linking; the more cross-linked moieties in the polymer, the higher the gel fraction.
- the base material used to form the adhesive sheet is not particularly limited. For example, after applying the adhesive composition on the release film 51, removing the solvent and performing crosslinking as necessary, by attaching the release film 52, as shown in FIG. A pressure-sensitive adhesive sheet to which the film is temporarily attached is obtained. Crosslinking may be performed after the release film 52 is attached on the adhesive sheet 2 .
- Plastic films such as polyethylene, polypropylene, polyethylene terephthalate, and polyester films are preferably used as the release films 51 and 52 .
- the thickness of the release film is usually 3 to 200 ⁇ m, preferably about 10 to 100 ⁇ m.
- the contact surfaces of the release films 51 and 52 with the adhesive sheet 2 are subjected to a release treatment using a release agent such as silicone, fluorine, long-chain alkyl, or fatty acid amide, or silica powder. preferably.
- the release films 51 and 52 may be subjected to antistatic treatment on either or both of the release-treated surface and the non-treated surface. By subjecting the release film to an antistatic treatment, it is possible to suppress charging when the release film is peeled off from the pressure-sensitive adhesive sheet.
- the pressure-sensitive adhesive sheet described above is used for bonding various members.
- the pressure-sensitive adhesive sheet 2 is used for laminating a flexible plastic film substrate to the surface of various devices or their constituent members. Appropriate rigidity is imparted by laminating a flexible plastic film on the surface of a device or its constituent members, so effects such as improved handleability and damage prevention are expected for members with a small thickness.
- the adhesive sheet 2 may be photocured.
- a flexible plastic film is used as the film substrate 1 of the reinforcing film 10 .
- the surface of the film substrate 1 on which the adhesive sheet 2 is attached is not subjected to release treatment.
- the thickness of the film substrate 1 is, for example, about 4 to 500 ⁇ m.
- the thickness of the film substrate 1 is preferably 12 ⁇ m or more, more preferably 20 ⁇ m or more, and may be 30 ⁇ m or more, 40 ⁇ m or more, or 45 ⁇ m or more, from the viewpoint of reinforcing the device by imparting rigidity, absorbing impact, or the like.
- the thickness of the film substrate 1 is preferably 300 ⁇ m or less, more preferably 200 ⁇ m or less, from the viewpoint of imparting flexibility to the reinforcing film and improving handling properties.
- Plastic materials constituting the film substrate 1 include polyester-based resins, polyolefin-based resins, cyclic polyolefin-based resins, polyamide-based resins, polyimide-based resins, polyetheretherketone, polyethersulfone, polyarylate-based resins, and aramid-based resins. etc.
- the film substrate 1 is preferably a transparent film.
- the adhesive sheet 2 is photocured by irradiating actinic rays from the film substrate 1 side, the film substrate 1 preferably has transparency to the actinic rays used for curing the adhesive.
- Polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, transparent polyimide, transparent aramid, and polyetheretherketone are preferably used because they have both mechanical strength and transparency.
- the adherend need only be transparent to the actinic ray, and the film substrate 1 need not be transparent to the actinic ray.
- the surface of the film substrate 1 may be provided with functional coatings such as an easy adhesion layer, an easy slip layer, a release layer, an antistatic layer, a hard coat layer, and an antireflection layer.
- functional coatings such as an easy adhesion layer, an easy slip layer, a release layer, an antistatic layer, a hard coat layer, and an antireflection layer.
- the surface of the film substrate 1 on which the adhesive sheet 2 is attached is not provided with a release layer.
- a reinforcing film is obtained by laminating a photocurable pressure-sensitive adhesive sheet 2 on a film substrate 1 .
- the adhesive sheet 2 may be directly formed on the film substrate 1 or may be transferred onto the film substrate 1 by transferring the adhesive sheet formed on the release film.
- an adhesive sheet 2 is fixedly laminated on a film substrate 1, and a reinforcing film is obtained in which a release film is temporarily attached on the adhesive sheet 2. As shown in FIG.
- the reinforcing film of the present invention described above is used by laminating it to a device or a device component.
- the adherend to which the reinforcing film is attached is not particularly limited, and includes various electronic devices, optical devices and their constituent parts.
- the adherend to which the reinforcing film is attached is an organic EL panel.
- the organic EL panel may be either top emission type or bottom emission type.
- a top-emission type organic EL panel has an anode (metal electrode), an organic light-emitting layer and a cathode (transparent electrode) arranged in this order on a substrate, and has a structure in which light is extracted from the cathode side.
- a bottom-emission type organic EL panel has a structure in which a cathode, an organic light-emitting layer and an anode are provided in this order on a transparent substrate, and light is extracted from the transparent substrate side. Thinning and flexibility can be achieved by using a flexible heat-resistant film such as a polyimide film as the substrate of the organic EL panel.
- the reinforcing film may be attached to the entire surface of the adherend, or may be selectively attached only to the portion requiring reinforcement (reinforcement target area). In addition, after the reinforcing film is attached to the entire area requiring reinforcement (reinforcement target area) and the area not requiring reinforcement (non-reinforcement target area), the reinforcing film attached to the non-reinforcement target area is cut. may be removed. If the adhesive is not photocured, the reinforcing film is temporarily attached to the surface of the adherend, so the reinforcing film can be peeled off from the surface of the adherend. A reinforcing film is attached to the area to be reinforced and the area not to be reinforced, and the area to be reinforced is selectively irradiated with light to cure the adhesive. It may be selectively peeled off.
- a reinforcing film is attached to the flexible substrate on the back side of the organic EL panel (the side opposite to the light extraction side).
- a reinforcing film may be attached to the light extraction surface of the organic EL panel.
- the reinforcing film may be attached to a substrate other than the substrate of the organic EL panel.
- the reinforcing film may be attached to a sealing material that seals the organic light-emitting layer and the electrodes.
- the reinforcing film may be attached to the large-sized in-process product before being cut into the product size.
- the reinforcing film may be roll-to-roll laminated to the mother roll of the device manufactured by the roll-to-roll process.
- the surface of the adherend may be subjected to activation treatment for the purpose of cleaning or the like. Examples of surface activation treatment include plasma treatment, corona treatment, glow discharge treatment, and the like.
- the adhesive force between the adhesive sheet 2 and the adherend before photocuring is about 0.005 to 1 N/25 mm. preferable.
- the adhesive strength is determined by a peel test using a polyimide film as an adherend at a tensile speed of 300 mm/min and a peel angle of 180°. Adhesion is measured at 25° C. unless otherwise specified.
- the haze of the adhesive sheet 2 before photocuring is preferably less than 6%, and may be 5% or less, 4% or less, or 3% or less. Since the haze of the adhesive sheet 2 before photocuring is small, optical inspection of an adherend such as an organic EL panel by visual observation or imaging from the film substrate 1 side even after bonding the reinforcing film to the adherend. inspection accuracy can be maintained.
- the adhesive sheet 2 is irradiated with actinic rays to remove the adhesive.
- Actinic rays include ultraviolet rays, visible light, infrared rays, X-rays, ⁇ -rays, ⁇ -rays, ⁇ -rays, and the like. Ultraviolet rays are preferable as actinic rays because they can suppress the curing of the adhesive in a storage state and are easy to cure.
- the irradiation intensity and irradiation time of actinic rays may be appropriately set according to the composition, thickness, etc. of the adhesive. Irradiation of the adhesive sheet 2 with actinic rays may be performed from either the film substrate 1 side or the adherend side, or may be performed from both sides.
- the adhesive strength of the pressure-sensitive adhesive sheet 2 to the adherend increases with the photocuring.
- the adhesive force between the adhesive sheet 2 and the adherend after photocuring is preferably 2 N/25 mm or more, more preferably 2.5 N/25 mm or more.
- the adhesive strength between the adhesive sheet 2 and the adherend after photocuring is preferably at least 5 times the adhesive strength between the adhesive sheet 2 and the adherend before photocuring.
- the haze of the adhesive sheet 2 increases due to photocuring.
- the haze of the adhesive sheet 2 after photocuring is preferably 3% or more, more preferably 5% or more, still more preferably 6% or more, and even if it is 7% or more, 8% or more, 9% or more, or 10% or more. good.
- the haze increase H 1 -H 0 of the adhesive sheet due to photocuring is preferably 1.0% or more, more preferably 1.5% or more, 2.0% or more, 2.5% or more, and 3.0%. Above, it may be 4.0% or more, or 5.0% or more, and may be 30% or less, 20% or less, or 15% or less.
- the adherend is provided with appropriate rigidity and the stress is relieved and dispersed. and improve yield.
- the reinforcing film can be peeled off from the adherend before the adhesive is photocured, reworking is possible in the event of lamination or bonding failure, and selective reinforcement is possible from areas other than the area to be reinforced. Processing such as removing the film is also possible.
- the adhesive sheet has a low haze before photocuring, it is possible to ensure the accuracy of inspection by visual observation or imaging even when the reinforcing film is attached.
- the reinforcing film When the device is used after completion, the reinforcing film is attached even if an external force is unexpectedly applied due to dropping the device, placing a heavy object on the device, or hitting the device with a flying object. Thus, damage to the device can be prevented.
- the reinforcing film after the photo-curing of the pressure-sensitive adhesive is firmly adhered to the device, the reinforcing film is difficult to peel off even in long-term use, and the reliability is excellent.
- the adhesive sheet since the adhesive sheet has a high haze due to photocuring, it is difficult to see the optical sensor, etc., placed on the back of the reinforcing film from the outer surface of the device. It can be used suitably also for a device.
- Example 1 ⁇ Preparation of adhesive composition> 96.2 parts by weight of 2-ethylhexyl acrylate (2EHA) and 3.8 parts by weight of 2-hydroxyethyl acrylate (2HEA) were added as monomers to a reaction vessel equipped with a thermometer, a stirrer, a reflux condenser and a nitrogen gas inlet tube. 0.2 parts by weight of azobisisobutyronitrile (AIBN) as a polymerization initiator and 156 parts by weight of ethyl acetate as a solvent were added, nitrogen gas was flowed, and nitrogen substitution was performed for about 1 hour while stirring. Thereafter, the mixture was heated to 60° C. and reacted for 7 hours to obtain a solution of an acrylic polymer having a weight average molecular weight (Mw) of 600,000.
- AIBN azobisisobutyronitrile
- Nasem ferric iron 0.02 parts by weight, dipentaerythritol polyacrylate as a photocuring agent (mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate; "NK Ester A-DPH” manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) 10 Parts by weight, and 0.1 parts by weight of 2,2-dimethoxy-1,2-diphenylethan-1-one ("Omnirad 651" manufactured by IGM Resins) as a photopolymerization initiator are added and uniformly mixed to form an adhesive composition. got stuff
- the pressure-sensitive adhesive composition was applied onto a polyethylene terephthalate film (heavy release film) having a thickness of 75 ⁇ m that had been subjected to a release treatment with silicone so that the thickness after drying would be 20 ⁇ m.
- the release-treated surface of a polyethylene terephthalate film (light release film) having a thickness of 50 ⁇ m and whose surface was subjected to silicone release treatment was attached to the adhesive-coated surface.
- an aging treatment was performed for 4 days in an atmosphere of 25° C. to promote cross-linking, and a pressure-sensitive adhesive sheet having release films temporarily adhered to both sides was obtained.
- Examples 2 to 7, Comparative Examples 1 to 7 A pressure-sensitive adhesive composition was prepared and a pressure-sensitive adhesive sheet was produced in the same manner as in Example 1, except that the composition of the acrylic polymer monomer and the type and amount of the photocuring agent were changed as shown in Table 1. .
- Example 8 Comparative Examples 8 and 9
- Table 1 the monomer composition of the acrylic polymer and the type and amount of the photocuring agent were changed.
- isocyanate-based cross-linking agent a tetrafunctional epoxy compound N,N,N',N'-tetraglycidyl-m-xylylenediamine (a tetrafunctional epoxy compound, Mitsubishi Gas Chemical ("Tetrad C") was added, and no cross-linking catalyst was added.
- a pressure-sensitive adhesive composition was prepared and a pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except for these changes.
- Table 1 shows the composition of the acrylic polymer, the type and amount of photocuring agent added, and the haze of the adhesive sheet before and after photocuring of the adhesive compositions of Examples and Comparative Examples.
- the polymer composition is the weight ratio of the constituent monomers
- the amount of the photocuring agent is the amount added to 100 parts by weight of the solid content of the acrylic polymer. Details of the monomers and photocuring agents are as follows.
- Example 8 From the comparison between Example 8 and Comparative Examples 8 and 9, it can be seen that even when acrylic acid, which is a carboxyl group-containing monomer, is used as the copolymerization monomer component of the acrylic polymer and an epoxy-based cross-linking agent is used, the main constituent of the base polymer is It can be seen that the use of a (meth)acrylic acid alkyl ester having an alkyl group with a large number of carbon atoms as a monomer component causes a large increase in haze due to photocuring.
- acrylic acid which is a carboxyl group-containing monomer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
粘着シート2は、ベースポリマーおよび光硬化剤を含む光硬化性組成物からなる。粘着シート2は、光硬化前はデバイスやデバイス部品等の被着体との接着力が小さいため、被着体から剥離可能である。粘着シート2は、光硬化により被着体との接着力が向上するため、接着信頼性に優れる。
粘着シート2を構成する粘着剤組成物は、ベースポリマーおよび光硬化剤を含み、光硬化性を有する。後述のように、粘着剤組成物が所定のベースポリマーと光硬化剤を含むことにより、光硬化によるヘイズ上昇が大きい粘着シートが得られる。光硬化の効率を高める観点から、粘着シート2を構成する粘着剤組成物(光硬化性組成物)は、光重合開始剤を含んでいることが好ましい。
ベースポリマーは粘着剤組成物の主構成成分であり、粘着シートの接着力等の諸特性を決定する主要素である。接着力等の制御が容易であることから、粘着剤組成物は、ベースポリマーとしてアクリル系ポリマーを含有するものが好ましく、粘着剤組成物の50重量%以上がアクリル系ポリマーであることが好ましい。
粘着剤に適度の凝集力を持たせ、接着力を発現させるとともに、光硬化前の粘着シートの被着体からの剥離性を確保する観点から、アクリル系ベースポリマーには架橋構造が導入されることが好ましい。例えば、アクリル系ベースポリマーを重合後の溶液に架橋剤を添加し、必要に応じて加熱を行うことにより、架橋構造が導入される。架橋剤としては、イソシアネート系架橋剤、エポキシ系架橋剤、オキサゾリン系架橋剤、アジリジン系架橋剤、カルボジイミド系架橋剤、金属キレート系架橋剤等が挙げられる。これらの架橋剤は、アクリル系ベースポリマー中に導入されたヒドロキシ基、カルボキシ基等の官能基と反応して架橋構造を形成する。アクリル系ベースポリマーのヒドロキシ基やカルボキシ基との反応性が高く、架橋構造の導入が容易であることから、イソシアネート系架橋剤およびエポキシ系架橋剤が好ましい。
粘着シート2を構成する粘着剤組成物は、アクリル系ベースポリマーに加えて光硬化剤を含有する。光硬化性の粘着剤組成物からなる粘着シート2は、被着体との貼り合わせ後に光硬化を行うと、被着体との接着力が向上する。
粘着剤組成物は、光重合開始剤を含むことが好ましい。光重合開始剤は、活性光線の照射により活性種を発生し、光硬化剤の硬化反応を促進する。光硬化剤として多官能(メタ)アクリレートが用いられる場合は、光ラジカル重合開始剤を用いることが好ましい。光ラジカル重合開始剤としては、波長450nmよりも短波長の可視光または紫外線により開裂してラジカルを発生する光ラジカル発生剤が好ましく、ヒドロキシケトン類、ベンジルジメチルケタール類、アミノケトン類、アシルフォスフィンオキサイド類、ベンゾフェノン類、トリクロロメチル基含有トリアジン誘導体等が挙げられる。光重合開始剤は、単独で使用してもよく、2種以上を混合して使用してもよい。
粘着剤組成物は、アクリル系ベースポリマーに加えてオリゴマーを含んでいてもよい。例えば、粘着剤組成物は、アクリル系ベースポリマーに加えてアクリル系オリゴマーを含んでいてもよい。オリゴマーとしては、重量平均分子量が1000~30000程度のものが用いられる。アクリル系オリゴマーは、主たる構成モノマー成分として(メタ)アクリル酸アルキルエステルを含有する。光硬化後の粘着シート2の接着力を高める観点から、アクリル系オリゴマーのガラス転移温度は、40℃以上が好ましく、50℃以上がより好ましい。オリゴマーは、アクリル系ベースポリマーと同様に架橋可能な官能基を含んでいてもよい。
上記例示の各成分の他、粘着剤組成物は、シランカップリング剤、粘着性付与剤、可塑剤、軟化剤、劣化防止剤、充填剤、着色剤、紫外線吸収剤、酸化防止剤、界面活性剤、帯電防止剤等の添加剤を、本発明の特性を損なわない範囲で含有していてもよい。
上記の粘着剤組成物を、ロールコート、キスロールコート、グラビアコート、リバースコート、ロールブラッシュ、スプレーコート、ディップロールコート、バーコート、ナイフコート、エアーナイフコート、カーテンコート、リップコート、ダイコート等により、基材上に塗布し、必要に応じて溶媒を乾燥除去することにより粘着シートが形成される。乾燥方法としては、適宜、適切な方法が採用され得る。加熱乾燥温度は、好ましくは40℃~200℃、より好ましくは50℃~180℃、さらに好ましくは70℃~170℃である。乾燥時間は、好ましくは5秒~20分、より好ましくは5秒~15分、さらに好ましくは10秒~10分である。
上記の粘着シートは、各種部材の貼り合わせに用いられる。一実施形態において、粘着シート2は、各種のデバイスまたはその構成部材の表面への可撓性プラスチックフィルム基材の貼り合わせに用いられる。デバイスまたはその構成部材の表面に可撓性プラスチックフィルムを貼り合わせることにより、適度な剛性が付与されるため、厚みが小さい部材に対して、ハンドリング性向上や破損防止等の効果が期待される。
補強フィルム10のフィルム基材1としては、可撓性のプラスチックフィルムが用いられる。フィルム基材1と粘着シート2とを固着するために、フィルム基材1の粘着シート2付設面は離型処理が施されていないことが好ましい。
フィルム基材1上に光硬化性の粘着シート2を積層することにより、補強フィルムが得られる。粘着シート2は、フィルム基材1上に直接形成してもよく、離型フィルム上に形成された粘着シートをフィルム基材1上に転写してもよい。例えば、図1に示す離型フィルム付き粘着シートから、粘着シート2の一方の面に仮着された離型フィルム52を剥離し、粘着シート2の露出面にフィルム基材1を貼り合わせることにより、図2に示すように、フィルム基材1上に粘着シート2が固着積層され、粘着シート2上に離型フィルムが仮着された補強フィルムが得られる。
上記の本発明の補強フィルムは、デバイスまたはデバイス構成部品に貼り合わせて用いられる。補強フィルムが貼り合わせられる被着体は特に限定されず、各種の電子デバイス、光学デバイスおよびその構成部品等が挙げられる。
<粘着剤組成物の調製>
温度計、攪拌機、還流冷却管および窒素ガス導入管を備えた反応容器に、モノマーとして、アクリル酸2-エチルヘキシル(2EHA)96.2重量部およびアクリル酸2-ヒドロキシエチル(2HEA)3.8重量部、重合開始剤としてアゾビスイソブチロニトリル(AIBN)0.2重量部、ならびに溶媒として酢酸エチル156重量部を投入し、窒素ガスを流し、攪拌しながら約1時間窒素置換を行った。その後、60℃に加熱し、7時間反応させて、重量平均分子量(Mw)60万のアクリル系ポリマーの溶液を得た。
シリコーン離型処理された厚み75μmのポリエチレンテレフタレートフィルム(重剥離フィルム)上に、上記の粘着剤組成物を、乾燥後の厚みが20μmとなるように塗布した。130℃で1分間乾燥して溶媒を除去後、粘着剤の塗布面に、表面がシリコーン離型処理された厚み50μmのポリエチレンテレフタレートフィルム(軽剥離フィルム)の離型処理面を貼り合わせた。その後、25℃の雰囲気で4日間のエージング処理を行い、架橋を進行させ、両面に離型フィルムが仮着された粘着シートを得た。
アクリル系ポリマーのモノマーの組成、光硬化剤の種類および添加量を表1に示す様に変更したこと以外は、実施例1と同様にして、粘着剤組成物を調製し、粘着シートを作製した。
アクリル系ポリマーのモノマーの組成、光硬化剤の種類および添加量を表1に示す様に変更した。また、イソシアネート系の架橋剤に代えて、架橋剤として、4官能のエポキシ化合物であるN,N,N’,N’-テトラグリシジル-m-キシリレンジアミン(4官能のエポキシ化合物、三菱ガス化学製「テトラッドC」)0.1重量部を添加し、架橋触媒を添加しなかった。これらの変更以外は、実施例1と同様にして、粘着剤組成物を調製し、粘着シートを作製した。
<光硬化前のヘイズ>
実施例および比較例の粘着シートの一方の面の離型フィルム(軽剥離フィルム)を剥離し、粘着シートをガラス板に貼り合わせた後、他方の離型フィルム(重剥離フィルム)を剥離して、ヘイズ測定用試料を準備した。ヘイズメーター(日本電色工業製「NDH-5000」)を用いて、粘着シート側の面から光を照射して、JIS K7136に準じて光硬化前の粘着シートのヘイズH0を測定した。
実施例および比較例の粘着シートから軽剥離フィルムを剥離し、粘着シートをガラス板に貼り合わせた後、重剥離フィルム側の面から、波長365nmのLED光源により、2000mJ/cm2の紫外線を照射して粘着剤組成物を光硬化した。その後、重剥離フィルムを剥離し、粘着シート側の面から光を照射して、光硬化前の粘着シートのヘイズH1を測定した。
2EHA 2-エチルヘキシルアクリレート
BA ブチルアクリレート
2HEA 2-ヒドロキシエチルアクリレート
4HBA 4-ヒドロキシブチルアクリレート
AA アクリル酸
<光硬化剤>
DPH ジペンタエリスリトールポリアクリレート(屈折率:1.489、粘度:7500mPa・s(25℃))
TMMT ペンタエリスリトールテトラアクリレート(屈折率:1.480、粘度:215mPa・s(40℃))
HDN 1,6-ヘキサンジオールジアクリレート(屈折率:1.456、粘度:6mPa・s(25℃))
DCP トリシクロデカンジメタノールジアクリレート(屈折率:1.503、粘度:135mPa・s(25℃))
TMPT トリメチロールプロパントリアクリレート(屈折率:1.474、粘度:105mPa・s(25℃))
2 粘着シート
51,52 離型フィルム
10 補強フィルム
20 被着体(有機ELパネル)
100 補強フィルム付きデバイス
Claims (8)
- アクリル系ベースポリマーおよび光硬化剤を含む光硬化性粘着剤組成物が層状に形成された粘着シートであって、
前記粘着剤組成物において、
前記アクリル系ベースポリマーは、構成モノマー成分全量に対する、アルキル基が炭素数6以上の鎖状アルキルである(メタ)アクリル酸アルキルエステルの量が70重量%以上であり、
前記光硬化剤は、1分子中に4個以上の(メタ)アクリロイル基を有する多官能(メタ)アクリレートを含み、
前記アクリル系ベースポリマー100重量部に対して、前記多官能(メタ)アクリレートを7重量部以上含有し、
光硬化後のヘイズH1と光硬化前のヘイズH0の差H1-H0が、1.0%以上である、粘着シート。 - 前記粘着剤組成物が、さらに光重合開始剤を含む、請求項1に記載の粘着シート。
- 前記アクリル系ベースポリマーが、構成モノマー成分として、ヒドロキシ基含有モノマーおよびカルボキシ基含有モノマーからなる群から選択される1以上を含有し、前記アクリル系ベースポリマーに架橋構造が導入されている、請求項1または2に記載の粘着シート。
- 光硬化前のヘイズH0が5%以下である、請求項1~3のいずれか1項に記載の粘着シート。
- 光硬化後のヘイズH1が6%以上である、請求項1~4のいずれか1項に記載の粘着シート。
- フィルム基材の一主面上に、請求項1~5のいずれか1項に記載の粘着シートが固着積層された、補強フィルム。
- 表面に補強フィルムが貼り合わせられたデバイスの製造方法であって、
請求項6に記載の補強フィルムの前記粘着シートを被着体の表面に仮着した後、
前記粘着シートを光硬化する、デバイスの製造方法。 - 前記被着体が、有機ELパネルである、請求項7に記載のデバイスの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202280024785.9A CN117083357A (zh) | 2021-04-02 | 2022-03-14 | 粘合片、加强薄膜、及器件的制造方法 |
KR1020237035715A KR20230163444A (ko) | 2021-04-02 | 2022-03-14 | 점착 시트, 보강 필름, 및 디바이스의 제조 방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021063680A JP2022158644A (ja) | 2021-04-02 | 2021-04-02 | 粘着シート、補強フィルム、およびデバイスの製造方法 |
JP2021-063680 | 2021-04-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022209830A1 true WO2022209830A1 (ja) | 2022-10-06 |
Family
ID=83458992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2022/011405 WO2022209830A1 (ja) | 2021-04-02 | 2022-03-14 | 粘着シート、補強フィルム、およびデバイスの製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2022158644A (ja) |
KR (1) | KR20230163444A (ja) |
CN (1) | CN117083357A (ja) |
TW (1) | TW202248381A (ja) |
WO (1) | WO2022209830A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015199164A1 (ja) * | 2014-06-27 | 2015-12-30 | 富士フイルム株式会社 | 有機電子装置用封止部材 |
JP2016069647A (ja) * | 2014-09-30 | 2016-05-09 | 日東電工株式会社 | 粘着シート |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019065375A1 (ja) | 2017-09-28 | 2019-04-04 | 日東電工株式会社 | 補強フィルム |
-
2021
- 2021-04-02 JP JP2021063680A patent/JP2022158644A/ja active Pending
-
2022
- 2022-03-14 WO PCT/JP2022/011405 patent/WO2022209830A1/ja active Application Filing
- 2022-03-14 CN CN202280024785.9A patent/CN117083357A/zh active Pending
- 2022-03-14 KR KR1020237035715A patent/KR20230163444A/ko unknown
- 2022-03-30 TW TW111112182A patent/TW202248381A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015199164A1 (ja) * | 2014-06-27 | 2015-12-30 | 富士フイルム株式会社 | 有機電子装置用封止部材 |
JP2016069647A (ja) * | 2014-09-30 | 2016-05-09 | 日東電工株式会社 | 粘着シート |
Also Published As
Publication number | Publication date |
---|---|
TW202248381A (zh) | 2022-12-16 |
KR20230163444A (ko) | 2023-11-30 |
JP2022158644A (ja) | 2022-10-17 |
CN117083357A (zh) | 2023-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7265350B2 (ja) | 補強フィルムおよび補強フィルム付きデバイスの製造方法 | |
JP7369583B2 (ja) | 補強フィルム、デバイスの製造方法および補強方法 | |
US20200291269A1 (en) | Reinforcing film | |
WO2022050009A1 (ja) | 補強フィルム、補強フィルム付きデバイスおよびその製造方法 | |
WO2022209830A1 (ja) | 粘着シート、補強フィルム、およびデバイスの製造方法 | |
CN111548752B (zh) | 增强薄膜及其制造方法、装置的制造方法、以及增强方法 | |
WO2023042726A1 (ja) | 補強フィルム、デバイスの製造方法および補強方法 | |
JP7257165B2 (ja) | 補強フィルムを備えるデバイスおよびその製造方法、ならびに補強方法 | |
WO2023095664A1 (ja) | 粘着剤組成物および粘着シート | |
CN111548751B (zh) | 增强薄膜、装置的制造方法以及增强方法 | |
JP2024003616A (ja) | 補強フィルム、デバイスの製造方法および補強方法 | |
TWI837300B (zh) | 補強膜 | |
JP2024003755A (ja) | 補強フィルム、デバイスの製造方法および補強方法 | |
TW202411069A (zh) | 補強膜、裝置之製造方法及補強方法 | |
JP2020132845A (ja) | 補強フィルムおよびその製造方法、デバイスの製造方法、ならびに補強方法 | |
CN117304832A (zh) | 加强薄膜、器件的制造方法及加强方法 | |
JP2020132846A (ja) | 補強フィルム、デバイスの製造方法および補強方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22780051 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202280024785.9 Country of ref document: CN |
|
ENP | Entry into the national phase |
Ref document number: 20237035715 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 22780051 Country of ref document: EP Kind code of ref document: A1 |