WO2022202661A1 - 積層構造体、その積層構造体における樹脂層の硬化物、電子部品、および硬化物の形成方法 - Google Patents
積層構造体、その積層構造体における樹脂層の硬化物、電子部品、および硬化物の形成方法 Download PDFInfo
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- WO2022202661A1 WO2022202661A1 PCT/JP2022/012599 JP2022012599W WO2022202661A1 WO 2022202661 A1 WO2022202661 A1 WO 2022202661A1 JP 2022012599 W JP2022012599 W JP 2022012599W WO 2022202661 A1 WO2022202661 A1 WO 2022202661A1
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- film
- resin layer
- resin
- laminated structure
- cured product
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- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- HZWAUDKTZOUQPD-UHFFFAOYSA-N diphenylphosphoryl-(2-methylphenyl)methanone Chemical compound CC1=CC=CC=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 HZWAUDKTZOUQPD-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- SSTAXLJQSRFHMB-UHFFFAOYSA-N ethyl 1,4-dimethylcyclohexa-2,4-diene-1-carboxylate Chemical compound CCOC(=O)C1(C)CC=C(C)C=C1 SSTAXLJQSRFHMB-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229940100630 metacresol Drugs 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- CCDXIADKBDSBJU-UHFFFAOYSA-N phenylmethanetriol Chemical compound OC(O)(O)C1=CC=CC=C1 CCDXIADKBDSBJU-UHFFFAOYSA-N 0.000 description 1
- SYJCUYXTMQSJLM-UHFFFAOYSA-N phenylphosphanyl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)PC1=CC=CC=C1 SYJCUYXTMQSJLM-UHFFFAOYSA-N 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000011973 solid acid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical compound CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 235000014692 zinc oxide Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Definitions
- the present invention relates to a laminated structure, a cured product of a resin layer in the laminated structure, an electronic component having the cured product, and a method for forming the cured product.
- the present invention provides a laminated structure in which both the peelability and bonding properties between the resin layer and the second film are good, a cured product of the resin layer in the laminated structure, and an electronic device having the cured product. It relates to a part and a method of forming a cured product thereof.
- An insulating film (solder resist) is formed on printed wiring boards used in various electronic devices.
- This insulating film is formed using, for example, a laminated structure including a first film, a resin layer, and a second film in this order.
- the method for forming an insulating film using this laminated structure includes a step of peeling off the second film from the laminated structure, and through this step, the insulating film is finally formed on the circuit-formed substrate. ing.
- Cited Document 1 the relationship between the peel strength of the protective film (second film) to the resin composition layer and the peel strength of the support (first film) to the resin composition layer is defined.
- a sheet is disclosed.
- the laminated structure considering the step of peeling the second film from the laminated structure, it is necessary to have good peelability between the resin layer and the second film. (For example, when the laminated structure is formed into a roll, their good lamination property) is also required. Thus, it is important to obtain a laminate structure that is good in both of these contradictory properties.
- the ambient temperature around the laminated structure may rise to about 40°C due to radiant heat. It is important to have a laminated structure that is both good.
- the object of the present invention which has been made in view of the above problems, is to provide a resin layer and a second film even under conditions where the environmental temperature around the laminated structure rises to a certain temperature (especially, about 40 ° C.).
- a certain temperature especially, about 40 ° C.
- the present inventors have found that in a laminated structure including a first film, a resin layer containing a specific component, and a second film, the second film and the resin layer are separated at an environmental temperature of 40 ° C.
- the inventors have found that the above object can be achieved by setting the strength to a specific range, and have completed the present invention.
- the object is a laminated structure comprising, in order, a first film according to the present invention, a resin layer and a second film,
- the resin layer contains (A) an alkali-soluble resin, (B) a polyfunctional photopolymerizable monomer, (C) a photopolymerization initiator, and (D) a thermosetting resin, It can be achieved by a laminate structure characterized in that the peel strength between the second film and the resin layer at an environmental temperature of 40° C. is 0.4 to 1.5 N/cm.
- the resin layer has a thickness of 5 to 100 ⁇ m.
- the surface of the second film facing the resin layer has an arithmetic mean surface roughness Ra of 0.1 ⁇ m or less.
- the melt viscosity of the (A) alkali-soluble resin at 90°C is in the range of 100 to 1,000 Pa ⁇ s.
- the (A) alkali-soluble resin having the melt viscosity is an alkali-soluble urethane resin having the melt viscosity, an acid-modified epoxy acrylate resin having the melt viscosity, or combinations thereof.
- the solid content of the alkali-soluble urethane resin having the melt viscosity, the solid content of the acid-modified epoxy acrylate resin having the melt viscosity, or The solid content of the combination is 5 to 50% by mass with respect to 100% by mass of the solid content of the resin layer.
- the present invention is a cured product obtained by curing the resin layer in the laminated structure.
- the present invention also relates to an electronic component characterized by having the cured product.
- the present invention a step of peeling off the second film in the laminated structure, attaching the resin layer to a circuit-formed substrate, and arranging the first film and the resin layer on the substrate; an exposure step of irradiating a predetermined portion of the resin layer with an active energy ray through the first film; A developing step of removing the first film and removing a region not irradiated with active energy rays in the resin layer after the exposure step, and a cured product forming step of heating the resin layer after the developing step It also relates to a method of forming a cured product characterized by comprising
- the peelability between the resin layer and the second film and the adhesion of these can be improved. It is an object of the present invention to provide a laminated structure having both good alignment properties, a cured product of a resin layer in the laminated structure, an electronic component having the cured product, and a method for forming the cured product.
- the laminated structure of the present invention is a laminated structure comprising a first film, a resin layer, and a second film in this order, wherein the resin layer comprises (A) an alkali-soluble resin, (B) a polyfunctional It contains a photopolymerizable monomer, (C) a photopolymerization initiator, and (D) a thermosetting resin, and the peel strength between the second film and the resin layer at an environmental temperature of 40 ° C. is 0.4 to 1.5 N. / cm.
- the peel strength is 0.4 to 1.5 N/cm, it is difficult for the roll-shaped laminated structure to sag, and the occurrence of wrinkles can also be prevented.
- One or more other resin layers can be further included between the first film and the resin layer.
- This further included resin layer may be the same as or different from the resin layer primarily disposed between the first film and the second film. That is, the resin composition for forming the other resin layer is the same as or different from the resin composition for forming the resin layer mainly arranged between the first film and the second film. may be
- the first film has a role of supporting the resin layer when the resin layer in the laminated structure is laminated on the circuit-formed substrate, and when the resin layer is formed, the resin layer is formed. It is coated with a resin composition for Examples of the first film include polyester films such as polyethylene terephthalate and polyethylene naphthalate, polyimide films, polyamideimide films, polyethylene films, polytetrafluoroethylene films, polypropylene films, polystyrene films, and other thermoplastic resins.
- a film can be used.
- a polyester film can be preferably used from the viewpoint of heat resistance, mechanical strength, handleability, and the like.
- the thickness of the first film is not particularly limited, but is preferably in the range of 10 to 150 ⁇ m, more preferably in the range of 15 to 100 ⁇ m, and still more preferably in the range of 20 to 75 ⁇ m. selected.
- a release treatment may be performed on the surface of the first film on which the resin layer is provided.
- the surface of the first film on which the resin layer is to be formed may be sputtered or formed with an ultra-thin copper foil. Examples of commercially available products include "E5041" (polyethylene terephthalate film; thickness: 25 ⁇ m) manufactured by Toyobo Co., Ltd.
- the peel strength between the first film and the resin layer at an environmental temperature of 40°C is preferably higher than the peel strength between the second film and the resin layer at an environmental temperature of 40°C, and is 0.5 to 2.5 N/cm. is more preferable.
- the peel strength between the first film and the resin layer is measured at an environmental temperature of 40° C. in a 90° peel test conforming to JIS K6854-1:1999. Autograph AG-X manufactured by Shimadzu Corporation can be used as a testing device for the 90° peel test.
- the peel strength can be measured at a peel speed of 50 mm/min and an average peel strength at a stroke of 35 mm.
- the laminate structure of the present invention was cut into a size of 15 mm in width and 95 mm in length, and then the second film was peeled off, leaving the exposed resin layer 15 mm in width, 95 mm in length and 1 mm in thickness.
- a vacuum laminator (Laminator CVP-300 manufactured by Nikko Materials Co., Ltd.) is used to adhere to a glass epoxy plate of 0.6 mm.
- the lamination temperature is 70° C.
- the vacuum retention time is 20 seconds
- the pressurization time is 90 seconds.
- a cut is made in the longitudinal direction so that the width of 15 mm of the first film is divided into a width of 10 mm and a width of 5 mm.
- a part of the first film was peeled off, gripped with a gripper, left in a constant temperature bath at 40° C. for 5 minutes, and then moved at a speed of 50 mm/min from one end in the longitudinal direction to a direction of 90 degrees with respect to the glass epoxy plate. Measure the load when the first film is peeled off by 30 mm, and determine the peel strength between the first film and the resin layer at an environmental temperature of 40°C.
- the constant temperature bath uses TCR2W-200T.
- the resin layer contains (A) an alkali-soluble resin, (B) a polyfunctional photopolymerizable monomer, (C) a photopolymerization initiator, and (D) a thermosetting resin.
- the thickness of this resin layer is preferably 5 to 100 ⁇ m, more preferably 10 to 90 ⁇ m, still more preferably 25 to 85 ⁇ m. By setting the thickness within this range, it is possible to meet the demand for thinner printed wiring boards.
- printed wiring boards have various circuit thicknesses according to their uses, the laminate structure of the present invention can be sufficiently applied to printed wiring boards having a large circuit thickness.
- the resin layer in the laminated structure of the present invention comprises a resin composition containing (A) an alkali-soluble resin, (B) a polyfunctional photopolymerizable monomer, (C) a photopolymerization initiator, and (D) a thermosetting resin. It is formed by coating on the first film and drying at 50 to 150° C. for 1 to 30 minutes.
- the constituent components of the resin composition for forming the resin layer are described below.
- the alkali-soluble resin has an alkali-soluble group that becomes soluble in an alkaline aqueous solution.
- the alkali-soluble group is, for example, any one of a phenolic hydroxyl group, a thiol group and a carboxyl group.
- alkali-soluble resins include compounds having two or more phenolic hydroxyl groups, carboxyl group-containing resins, compounds having phenolic hydroxyl groups and carboxyl groups, and compounds having two or more thiol groups.
- the alkali-soluble resin is a carboxyl group-containing resin or a phenolic resin
- the adhesion to the substrate is improved.
- the alkali-soluble resin is a carboxyl group-containing resin
- the developability is excellent.
- the carboxyl group-containing resin is preferably a carboxyl group-containing photosensitive resin having an ethylenically unsaturated group, but may be a carboxyl group-containing resin having no ethylenically unsaturated group.
- carboxyl group-containing resins include compounds (both oligomers and polymers) listed below.
- Carboxyl group-containing resins obtained by copolymerizing unsaturated carboxylic acids such as (meth)acrylic acid and unsaturated group-containing compounds such as styrene, ⁇ -methylstyrene, lower alkyl (meth)acrylates, and isobutylene.
- Diisocyanates such as aliphatic diisocyanates, branched aliphatic diisocyanates, alicyclic diisocyanates and aromatic diisocyanates, carboxyl group-containing dialcohol compounds such as dimethylolpropionic acid and dimethylolbutanoic acid, polycarbonate-based polyols, and polyether-based Carboxyl group-containing urethane resins obtained by polyaddition reaction of diol compounds such as polyols, polyester polyols, polyolefin polyols, acrylic polyols, bisphenol A alkylene oxide adduct diols, and compounds having phenolic hydroxyl groups and alcoholic hydroxyl groups.
- diol compounds such as polyols, polyester polyols, polyolefin polyols, acrylic polyols, bisphenol A alkylene oxide adduct diols, and compounds having phenolic hydroxyl groups and alcoholic hydroxyl groups.
- Diisocyanate compounds such as aliphatic diisocyanates, branched aliphatic diisocyanates, alicyclic diisocyanates, and aromatic diisocyanates, polycarbonate-based polyols, polyether-based polyols, polyester-based polyols, polyolefin-based polyols, acrylic polyols, and bisphenol A-based A terminal carboxyl group-containing urethane resin obtained by reacting an acid anhydride with the terminal of a urethane resin obtained by a polyaddition reaction of a diol compound such as an alkylene oxide adduct diol, a compound having a phenolic hydroxyl group and an alcoholic hydroxyl group.
- a diol compound such as an alkylene oxide adduct diol, a compound having a phenolic hydroxyl group and an alcoholic hydroxyl group.
- Diisocyanate and bifunctional epoxy resin such as bisphenol A type epoxy resin, hydrogenated bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bixylenol type epoxy resin, biphenol type epoxy resin ( A carboxyl group-containing urethane resin produced by a polyaddition reaction of a meth)acrylate or its partial acid anhydride modified product, a carboxyl group-containing dialcohol compound and a diol compound.
- a dibasic acid anhydride such as phthalic anhydride, tetrahydrophthalic anhydride, or hexahydrophthalic anhydride
- a carboxyl group-containing polyester resin obtained by reacting a polyfunctional oxetane resin with a dicarboxylic acid and adding a dibasic acid anhydride to the resulting primary hydroxyl group.
- reaction product obtained by reacting a compound having a plurality of phenolic hydroxyl groups in one molecule with an alkylene oxide such as ethylene oxide or propylene oxide and reacting an unsaturated group-containing monocarboxylic acid to obtain a reaction product
- alkylene oxide such as ethylene oxide or propylene oxide
- unsaturated group-containing monocarboxylic acid to obtain a reaction product
- a carboxyl group-containing resin obtained by reacting a polybasic acid anhydride with a substance.
- (11) Obtained by reacting a reaction product obtained by reacting a compound having a plurality of phenolic hydroxyl groups in one molecule with a cyclic carbonate compound such as ethylene carbonate or propylene carbonate with a monocarboxylic acid containing an unsaturated group.
- a carboxyl group-containing resin obtained by reacting a reaction product with a polybasic acid anhydride.
- an epoxy compound having a plurality of epoxy groups in one molecule a compound having at least one alcoholic hydroxyl group and one phenolic hydroxyl group in one molecule such as p-hydroxyphenethyl alcohol;
- Examples of compounds having a phenolic hydroxyl group include compounds having a biphenyl skeleton, a phenylene skeleton, or both skeletons, phenol, ortho-cresol, para-cresol, meta-cresol, 2,3-xylenol, 2,4-xylenol, 2 ,5-xylenol, 2,6-xylenol, 3,4-xylenol, 3,5-xylenol, catechol, resorcinol, hydroquinone, methylhydroquinone, 2,6-dimethylhydroquinone, trimethylhydroquinone, pyrogallol, phloroglucinol, etc. phenolic resins having various skeletons synthesized by
- Examples of compounds having a phenolic hydroxyl group include phenol novolac resins, alkylphenol borac resins, bisphenol A novolak resins, dicyclopentadiene type phenol resins, Xylok type phenol resins, terpene-modified phenol resins, polyvinylphenols, and bisphenol F. , bisphenol S-type phenolic resins, poly-p-hydroxystyrene, condensates of naphthol and aldehydes, and condensates of dihydroxynaphthalene and aldehydes.
- alkali-soluble resin one of the above compounds can be used alone or two or more of them can be used in combination.
- the melt viscosity of the alkali-soluble resin at 90°C is preferably in the range of 100 to 1,000 Pa ⁇ s, more preferably in the range of 120 to 700 Pa ⁇ s, still more preferably in the range of 150 to 500 Pa ⁇ s.
- the peel strength between the second film and the resin layer at an environmental temperature of 40 ° C. can be easily adjusted in the range of 0.4 to 1.5 N / cm, and the resin layer on the substrate on which the circuit is formed.
- air entrainment entrainment of air bubbles
- the above range of the melt viscosity of the alkali-soluble resin can be controlled, for example, by the melt viscosity and/or the amount of the main component that constitutes the alkali-soluble resin.
- the alkali-soluble resin was diluted with propylene glycol monomethyl ether acetate to form a resin solution, which was potted on a fluororesin (AGC Flex 50 HK NT) and heated in an oven at 100 ° C. for 10 hours to obtain a thickness. A dry resin plate about 1 mm thick and 25 mm in diameter is formed. Then, using Thermo Scientific RS-6000, the melt viscosity is measured under the following measurement conditions. (Conditions for measuring melt viscosity) Sensor: Parallel plate type of ⁇ 20mm Heating rate: 5°C/min Measurement frequency: 1Hz Measurement pressure: 3 Pa
- an alkali-soluble resin having a (meth)acryloyl group having the melt viscosity is preferable.
- an alkali-soluble urethane resin (urethane resin is more specifically are preferably the urethane resins of (2) to (6) above), and the acid-modified epoxy acrylate resin having the melt viscosity (more specifically, the acid-modified epoxy acrylate resins are the above (7) and (8) ), preferably alkali-soluble resins), or combinations thereof.
- the range of melt viscosity of the main component (for example, alkali-soluble urethane resin, acid-modified epoxy acrylate resin) constituting the alkali-soluble resin can be controlled according to the common technical knowledge of those skilled in the art.
- the solid content of the alkali-soluble urethane resin having the melt viscosity, the solid content of the acid-modified epoxy acrylate resin having the melt viscosity, or the solid content of the combination thereof is the solid content of the resin layer. It is preferably 5 to 50% by mass with respect to 100% by mass.
- the solid content of the alkali-soluble urethane resin having the melt viscosity and the melt viscosity is preferably 15-85:85-15, more preferably 40-60:60-40, most preferably 50:50.
- the acid value of the alkali-soluble resin is suitably in the range of 40-200 mgKOH/g, more preferably in the range of 45-120 mgKOH/g.
- the acid value of the alkali-soluble resin is 40 mgKOH/g or more, alkali development becomes easy.
- the weight average molecular weight of the alkali-soluble resin varies depending on the resin skeleton, but is preferably in the range of 1,500 to 150,000, more preferably 1,500 to 100,000.
- the weight-average molecular weight is 1,500 or more, the tack-free property is good, the moisture resistance of the coating film after exposure is good, the film reduction during development is suppressed, and the deterioration of resolution can be suppressed.
- the weight average molecular weight is 150,000 or less, the developability is good and the storage stability is also excellent.
- polyfunctional photopolymerizable monomer a compound having two or more ethylenically unsaturated groups in the molecule, and a photopolymerizable oligomer, a photopolymerizable vinyl monomer, etc., which are known and commonly used photocurable monomers, can be used. can be done.
- photopolymerizable oligomers examples include unsaturated polyester-based oligomers and (meth)acrylate-based oligomers.
- (Meth)acrylate oligomers include epoxy (meth)acrylates such as phenol novolac epoxy (meth)acrylate, cresol novolak epoxy (meth)acrylate, bisphenol type epoxy (meth)acrylate, urethane (meth)acrylate, epoxyurethane (meth)acrylate, ) acrylates, polyester (meth)acrylates, polyether (meth)acrylates, polybutadiene-modified (meth)acrylates, and the like.
- (meth)acrylate is a generic term for acrylate, methacrylate and mixtures thereof, and the same applies to other similar expressions.
- Photopolymerizable vinyl monomers include known and commonly used ones, for example, triallyl isocyanurate, diallyl phthalate, polyfunctional allyl compounds such as diallyl isophthalate; ethylene glycol di(meth)acrylate, butanediol di(meth)acrylates , neopentyl glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc.
- triallyl isocyanurate diallyl phthalate
- polyfunctional allyl compounds such as diallyl isophthalate
- ethylene glycol di(meth)acrylate butanediol di(meth)acrylates
- neopentyl glycol di(meth)acrylate 1,6-he
- Polyol poly(meth)acrylates polyoxyalkylene glycol poly(meth)acrylates such as diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, ethoxylated trimethylolpropane triacrylate, propoxylated trimethylolpropane tri(meth)acrylate; ) acrylates; poly(meth)acrylates such as hydroxypivalic acid neopentyl glycol ester di(meth)acrylate; isocyanurate type poly(meth)acrylates such as tris[(meth)acryloxyethyl]isocyanurate; be done. These can be used alone or in combination of two or more according to the required properties.
- Commercially available products include, for example, “Aronix M-350” (trimethylolpropane EO-modified triacrylate) manufactured by Toagosei Co., Ltd.
- the solid content of the polyfunctional photopolymerizable monomer is, for example, preferably 10 to 40% by mass with respect to 100% by mass of the solid content of the resin layer.
- photopolymerization initiator any photopolymerization initiator known as a photopolymerization initiator or a photoradical generator can be used.
- photopolymerization initiators include bis-(2,6-dichlorobenzoyl)phenylphosphine oxide, bis-(2,6-dichlorobenzoyl)-2,5-dimethylphenylphosphine oxide, bis-(2, 6-dichlorobenzoyl)-4-propylphenylphosphine oxide, bis-(2,6-dichlorobenzoyl)-1-naphthylphosphine oxide, bis-(2,6-dimethoxybenzoyl)phenylphosphine oxide, bis-( 2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, bis-(2,6-dimethoxybenzoyl)-2,5-dimethylphenylphosphine oxide, bis-(2,4,6- Bisacylphosphine oxides such as trimethylbenzoyl)-phenylphosphine oxide; 2,6-dimethoxybenzoyl
- acetophenones thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone; anthraquinone, chloroanthraquinone , 2-methylanthraquinone, 2-ethylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone, 2-amylanthraquinone, 2-aminoanthraquinone and other anthraquinones; acetophenone dimethylketal, benzyldimethylketal and other ketals; ethyl -benzoic acid esters such as 4-dimethylaminobenzoate, 2-(dimethylamino)eth
- a photoinitiator may be used individually by 1 type, and may be used in combination of 2 or more type.
- monoacylphosphine oxides and oxime esters are preferred, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, ethanone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3 -yl]-,1-(O-acetyloxime) is more preferred.
- the content of the photopolymerization initiator is preferably 0.1 to 40% by mass, more preferably 0.3 to 20% by mass, based on 100% by mass of the solid content of the resin layer.
- the resin layer preferably contains a thermosetting resin.
- a thermosetting resin any resin can be used as long as it is cured by heating and exhibits electrical insulation properties. Examples thereof include epoxy compounds, oxetane compounds, melamine resins, and silicone resins.
- an epoxy compound and an oxetane compound can be preferably used, and they may be used in combination.
- epoxy compound known and commonly used compounds having one or more epoxy groups can be used, and among them, compounds having two or more epoxy groups are preferable.
- epoxy resin for example, jER828, jER834, jER1001, jER1004 manufactured by Mitsubishi Chemical Corporation, EPICLON 840, 850, 850-S, 1050, 2055 manufactured by DIC Corporation, Epotote YD- manufactured by Nippon Steel Chemical & Materials Co., Ltd. 011, YD-013, YD-127, YD-128, D.D. E. R. 317, D. E. R. 331, D. E. R. 661, D. E. R. 664, Sumie-epoxy ESA-011, ESA-014, ELA-115, ELA-128, etc.
- Bisphenol F type epoxy resin (all trade names) Bisphenol F type epoxy resin; Epotote ST-2004, ST-2007, ST-3000 (trade name) manufactured by Nippon Steel Chemical & Materials Co., Ltd., hydrogenated bisphenol A type epoxy resin such as YX8034 manufactured by Mitsubishi Chemical Corporation; Mitsubishi Chemical Glycidylamine type epoxy resins such as jER604 manufactured by Nippon Steel Chemical & Materials Co., Ltd., Epotote YH-434 manufactured by Nippon Steel Chemical & Materials Co., Ltd., and Sumi-Epoxy ELM-120 manufactured by Sumitomo Chemical Co., Ltd.
- Bisphenol S type epoxy resins such as EBPS-200, EPX-30 manufactured by ADEKA, EXA-1514 (trade name) manufactured by DIC; Bisphenol A novolak type epoxy resins such as jER157S (trade name) manufactured by Mitsubishi Chemical; Tetraphenylolethane type epoxy resin such as jERYL-931 (both trade names) manufactured by Chemical Company; Heterocyclic epoxy resin such as TEPIC manufactured by Nissan Chemical Industries, Ltd.
- NOF Corporation Diglycidyl phthalate resin such as Blemmer DGT
- Tetraglycidyl xylenoyl ethane resin such as ZX-1063 manufactured by Nippon Steel Chemical &Material
- EXA-4750 naphthalene skeleton-containing epoxy resins such as EXA-4700; epoxy resins having a dicyclopentadiene skeleton such as DIC HP-7200 and HP-7200H; NOF Corporation CP-50S, CP-50M and other Glycidyl methacrylate copolymer epoxy resin; further copolymer epoxy resin of cyclohexyl maleimide and glycidyl methacrylate; CTBN-modified epoxy resin (for example, YR-102, YR-450, etc. manufactured by Nippon Steel Chemical & Materials Co., Ltd.), and the like. , but not limited to these. These epoxy resins may be used individually by 1 type, and may be used in combination of 2 or more type.
- R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms
- Specific examples of the oxetane compound containing an oxetane ring include 3-ethyl-3-hydroxymethyloxetane (Toa OXT-101 manufactured by Gosei Co., Ltd.), 3-ethyl-3-(phenoxymethyl) oxetane (OXT-211 manufactured by Toagosei Co., Ltd.), 3-ethyl-3-(2-ethylhexyloxymethyl) oxetane (OXT manufactured by Toagosei Co., Ltd.) -212), 1,4-bis ⁇ [(3-ethyl-3-oxetanyl) methoxy] methyl ⁇ benzene (OXT-121 manufactured by Toagosei Co., Ltd.), bis (3-
- the solid content of the thermosetting resin is determined by the functional groups of the alkali-soluble resin (alkali-soluble groups such as carboxyl groups) and the functional groups of the thermosetting resin that can react with these functional groups (thermosetting groups such as epoxy groups).
- group is preferably 1:0.1 to 1:10, more preferably 1:0.2 to 1:5, still more preferably 1:0.5 to 1:2.5. It is preferably a percentage. With such an equivalent ratio, it is possible to form a fine cured product pattern with good developability.
- the second film is provided on the opposite side of the resin layer to the first film for the purpose of preventing dust and the like from adhering to the surface of the resin layer of the laminated structure and improving handleability.
- a film made of the thermoplastic resin exemplified for the first film can be used.
- a polyester film, a polyethylene film, a polypropylene film, and a film obtained by releasing the surface of these films are preferable.
- the thickness of the second film is not particularly limited, but is preferably in the range of 10 to 150 ⁇ m, more preferably in the range of 12.5 to 100 ⁇ m, still more preferably in the range of 15 to 50 ⁇ m, depending on the application. selected as appropriate.
- a release treatment may be performed on the surface of the second film on which the resin layer is provided.
- the second film preferably has an arithmetic mean surface roughness Ra of 0.1 ⁇ m or less.
- Ra arithmetic mean surface roughness
- the arithmetic mean surface roughness Ra can be measured using a shape measuring laser microscope (for example, VK-X100 manufactured by Keyence Corporation). After activating the main body (control unit) of the shape measuring laser microscope (VK-X100) and the VK observation application (VK-H1VX manufactured by Keyence Corporation), the sample (second film) to be measured on the xy stage to be placed. Rotate the lens revolver of the microscope (VK-X110 manufactured by Keyence Corporation) to select the objective lens with a magnification of 10x, and roughly adjust the focus and brightness in the image observation mode of the VK observation application (same VK-H1VX). do.
- a shape measuring laser microscope for example, VK-X100 manufactured by Keyence Corporation.
- the part of the sample surface to be measured is adjusted so that it comes to the center of the screen.
- the 10x objective lens is replaced with a 50x magnification, and the autofocus function in the image observation mode of the VK observation application (same as VK-H1VX) is used to focus on the surface of the sample.
- VK-H1VX the simple mode on the shape measurement tab of the VK observation application
- pressing the measurement start button the surface shape of the sample can be measured and a surface image file can be obtained.
- a VK analysis application (VK-H1XA manufactured by KEYENCE CORPORATION) is started to display the obtained surface image file, and then tilt correction is performed.
- the horizontal observation and measurement range in the measurement of the surface shape of the sample is 270 ⁇ m.
- horizontal lines are displayed at four different locations in the surface image to obtain numerical values of the respective arithmetic mean surface roughness Ra. An average value of the obtained five numerical values is calculated and taken as the arithmetic mean surface roughness Ra of the surface of the sample.
- thermoplastic resin film When a thermoplastic resin film is used as the second film having the above arithmetic mean surface roughness Ra, a filler may be added to the resin during film formation, or the film surface may be blasted. Alternatively, the surface can be formed into a predetermined shape by hairline processing, matte coating, chemical etching, or the like, and a thermoplastic resin film having the arithmetic mean surface roughness Ra described above can be obtained.
- the arithmetic mean surface roughness Ra when a filler is added to the resin, the arithmetic mean surface roughness Ra can be controlled by adjusting the particle size and amount of filler added. In the case of blasting, the arithmetic mean surface roughness Ra can be controlled by adjusting the blasting material, blasting pressure, and other processing conditions.
- E-201F biaxially oriented polypropylene film
- TN100 and “TN200” manufactured by Toyobo Co., Ltd.
- TN200 release-treated polyethylene terephthalate film
- Toray Industries, Inc. "Therapeal PJ271” and “Therapeal PJ111” (release treated polyethylene terephthalate film).
- the peel strength between the second film and the resin layer at an environmental temperature of 40° C. is 0.4 to 1.5 N/cm. By combining this range of peel strength with a resin layer having a specific component, even under conditions where the environmental temperature around the laminated structure rises to a certain temperature (especially about 40 ° C.), Both the releasability and lamination property with the second film can be improved.
- the peel strength between the second film and the resin layer was measured at an ambient temperature of 40° C. in a 90° peel test conforming to JIS K6854-1:1999. Autograph AG-X manufactured by Shimadzu Corporation can be used as a testing device for the 90° peel test.
- the peel strength was measured at a peeling speed of 50 mm/min. , and the average peel strength at a stroke of 35 mm.
- a double-sided tape with a width of 15 mm (manufactured by Nichiban Co., Ltd. "Nice Tac NW-K15") is applied to the surface of the first film. 15mm wide, 95mm long and 15mm wide, 95mm long and 15mm long and 95mm thick.
- the double-faced tape attached to the surface of the first film is adhered to a glass epoxy plate having a thickness of 1.6 mm.
- a cut is made in the longitudinal direction so that the width of 15 mm of the second film is divided into a width of 10 mm and a width of 5 mm. Subsequently, a part of the second film was peeled off, gripped with a gripper, left in a constant temperature bath at 40° C. for 5 minutes, and then applied to the glass epoxy plate from one end in the longitudinal direction at a speed of 50 mm / min and a stroke of 35 mm. A load is measured when the film is peeled off by 30 mm in a direction of 90 degrees, and the peel strength between the second film and the resin layer at an environmental temperature of 40° C. is obtained.
- the constant temperature bath uses TCR2W-200T.
- the above-mentioned range (0.4 to 1.5 N/cm) of the peel strength between the second film and the resin layer is mainly determined by changing the melt viscosity of the alkali-soluble resin at 90° C. or by adjusting its blending amount.
- the thickness of the second film the arithmetic mean surface roughness Ra of the second film, and / or the compatibility between the alkali-soluble resin and the second film, can be controlled.
- the peel strength between the first film and the resin layer at an environmental temperature of 40°C is preferably 1.6 to 2.5 N/cm. Within such a range, it is possible to obtain the effect of preventing breakage of the resin layer when the second film is peeled off.
- the peel strength between the first film and the resin layer at an environmental temperature of 40° C. can be measured by the same method as above.
- the resin layer can also contain an inorganic filler.
- the inorganic filler preferably contains a surface-treated inorganic filler.
- the surface treatment of the inorganic filler means treatment for improving compatibility with the resin component.
- the surface treatment of the inorganic filler is preferably a surface treatment capable of introducing a curable reactive group to the surface of the inorganic filler.
- the inorganic filler is not particularly limited, and known and commonly used fillers such as silica, crystalline silica, Neuburg silica, aluminum hydroxide, glass powder, talc, clay, magnesium carbonate, calcium carbonate, natural mica, synthetic mica, Inorganic fillers such as aluminum hydroxide, barium sulfate, barium titanate, iron oxide, non-fibrous glass, hydrotalcite, mineral wool, aluminum silicate, calcium silicate, and zinc white can be used.
- silica is preferable, and spherical silica is more preferable because it has a small surface area and is less likely to cause cracks because the stress is dispersed over the entire surface.
- Commercially available products include, for example, “Aluminum Hydroxide” manufactured by Showa Denko K.K.
- the content of the inorganic filler is preferably 1 to 300% by mass, more preferably 5 to 150% by mass, based on 100% by mass of the solid content of the resin layer.
- the resin layer may contain other curing components and other additives known and commonly used in the field of electronic materials.
- Other curing components include cyanate ester resins, active ester resins, maleimide compounds, and alicyclic olefin polymers.
- Other additives include non-silicone release agents, photobase generators, thermosetting catalysts, colorants, organic solvents, thermal polymerization inhibitors, ultraviolet absorbers, silane coupling agents, plasticizers, flame retardants, and antistatic agents.
- agent antioxidant, antibacterial/antifungal agent, antifoaming agent, leveling agent, thickener, adhesion imparting agent, thixotropic agent, photoinitiation aid, sensitizer, thermoplastic resin, organic filler, release Type agents, surface treatment agents, dispersants, dispersing aids, surface modifiers, stabilizers, phosphors, and the like.
- a resin composition containing (A) an alkali-soluble resin, (B) a polyfunctional photopolymerizable monomer, (C) a photopolymerization initiator, and (D) a thermosetting resin is applied to a uniform thickness on the first film by a comma coater, blade coater, or the like. After that, the applied resin composition is usually dried at a temperature of 40 to 130° C. for 1 to 30 minutes to form a resin layer. After that, a second film is attached to the surface of the resin layer opposite to the first film to form a laminate structure.
- a resin layer may be formed by coating and drying a resin composition on the second film, and then the first film may be attached.
- the laminated structure when it is elongated, it may be wound into a roll to form a rolled laminated structure.
- the roll-shaped laminated structure may be cut into a predetermined width as needed.
- a method for forming a cured product of a resin layer on a circuit board includes the following steps: a step of peeling off the second film in the laminated structure, attaching the resin layer to a circuit-formed substrate, and arranging the first film and the resin layer on the substrate; an exposure step of irradiating a predetermined portion of the resin layer with an active energy ray through the first film; A developing step of removing the first film and removing a region not irradiated with active energy rays in the resin layer after the exposure step, and a cured product forming step of heating the resin layer after the developing step can be performed by a method comprising
- Step of attaching a resin layer to a circuit-formed substrate As the step of adhering the resin layer to the circuit-formed substrate, it is preferable to use a vacuum laminator or the like to separate the second film from the resin layer and bond them together under pressure and heat.
- a vacuum laminator By using such a vacuum laminator, the laminate structure is brought into close contact with the surface of the substrate on which the circuit is formed, so that air bubbles do not enter, and the recessed portions on the surface of the circuit substrate can be easily filled.
- the pressure condition is preferably about 0.1 to 2.0 MPa, and the heating condition is preferably 40 to 120°C.
- the resin layer containing the photopolymerization initiator can be photo-cured by irradiating the resin layer with light at an exposure amount of, for example, 50 mJ/cm 2 to 1000 mJ/cm 2 .
- Light irradiation is performed by irradiation with active energy rays such as ultraviolet rays, electron beams and actinic rays.
- active energy rays such as ultraviolet rays, electron beams and actinic rays.
- a direct drawing device for example, direct laser using CAD data from a computer
- a laser direct imaging device that draws an image may also be used.
- a developing method In the developing step, after the first film is peeled off, an unexposed portion is removed by alkali development to form a negative patterned cured film.
- a developing method a known method such as dipping can be used.
- sodium carbonate, potassium carbonate, potassium hydroxide, amines, imidazoles such as 2-methylimidazole, alkaline aqueous solutions such as tetramethylammonium hydroxide aqueous solution (TMAH), or mixtures thereof. can be used.
- the photocured resin layer is thermally cured by using a known heating means such as a hot air furnace, an electric furnace, an infrared induction heating furnace, or the like.
- a known heating means such as a hot air furnace, an electric furnace, an infrared induction heating furnace, or the like.
- the heating conditions it is preferable to heat at 150° C. to 170° C. for 5 minutes to 120 minutes.
- substrates on which circuits are formed include films made of glass polyimide, polyimide, polyethylene terephthalate, liquid crystal polymer, polycarbonate, etc., but not limited to these, known and commonly used circuit substrates can be used.
- the cured product of the resin layer on the circuit board (that is, the cured product obtained by curing the resin layer without the first film and the second film in the laminated structure) is also excellent in flexibility. In particular, it is also suitable as a coverlay or solder resist (insulating cured film) for flexible printed wiring boards.
- the present invention also provides an electronic component having a cured resin layer.
- the electronic component means a component used in an electronic circuit, including active components such as printed wiring boards, especially flexible printed wiring boards, transistors, light emitting diodes, laser diodes, resistors, capacitors, inductors, connectors and the like. Passive components are also included.
- the cured product of the resin layer of the present invention is suitable as these insulating cured films.
- an acid-modified epoxy acrylate resin (acid-modified epoxy acrylate resin A-3).
- the obtained acid-modified epoxy acrylate resin A-3 had a solid content concentration of 62 mass % and a solid content acid value (mgKOH/g) of 100.
- the acid-modified epoxy acrylate resin thus obtained had a solid content of 65%, a solid acid value of 100 mgKOH/g, and a weight average molecular weight Mw of about 3,500.
- Example 1-18 and Comparative Examples 1-7) A laminated structure was produced by the following method.
- the resin composition obtained above was applied on the film and dried at a temperature of 80° C. for 15 minutes to form a resin layer having a thickness of 25 ⁇ m.
- E-201F a biaxially oriented polypropylene film manufactured by Oji F-Tex Co., Ltd.
- a resin layer having an appropriate peel strength can provide a good laminated structure without lifting or peeling of the second film.
- E-201F Oji F-Tex Co., Ltd. biaxially oriented polypropylene film TN100: Toyobo Co., Ltd. release PET film MA-411: Oji F-Tex Co., Ltd. biaxially oriented polypropylene film MA-430: Oji F-Tex Co., Ltd. Biaxially oriented polypropylene film MAM-430 manufactured by Co., Ltd.: Biaxially oriented polypropylene film manufactured by Oji F-Tex Co., Ltd.
- the resin composition of Example 4 was evenly applied to the surface of the first film using a die coater and dried at 80° C. to 105° C. (average 90° C.) for 5 minutes to form a resin layer.
- a second film shown in Table 6 was laminated on the surface of the resin layer at 50° C. under normal pressure to prepare a laminate structure.
- the obtained laminated structure was wound into a roll (winding length: 50 m).
- the obtained roll-shaped body was slit to a width of 247 mm to obtain a roll-shaped laminate structure.
- E-201F Oji F-Tex Co., Ltd. biaxially oriented polypropylene film TN100: Toyobo Co., Ltd. release PET film MA-411: Oji F-Tex Co., Ltd. biaxially oriented polypropylene film
- the obtained roll-shaped laminate structure was set in a roll laminator ("VA-770A laminator” manufactured by Taisei Laminator Co., Ltd.).
- the lamination conditions were lamination roll temperature: 90°C, lamination pressure: 0.3 MPa, conveying speed: 0.5 m/min, unwinding tension for laminated structure: 20N, and tension for winding separator: 15N.
- the second film of the laminated structure of Example 1 was peeled off, and the exposed resin layer was 15 mm wide, 95 mm long, and It was attached to a glass epoxy plate having a thickness of 1.6 mm using a vacuum laminator (Laminator CVP-300 manufactured by Nikko Materials Co., Ltd.).
- the lamination temperature was 70° C.
- the vacuum retention time was 20 seconds
- the pressurization time was 90 seconds.
- the laminated structures of Examples 2 to 4 and Comparative Examples 1 and 2 were similarly measured. Table 8 shows the measurement results.
- the peel strength between the first film and the resin layer is the same value as in Example 4 (2.0 N/cm).
- the second film could not be peeled off well, and the peel strength between the first film and the resin layer at an ambient temperature of 40° C. could not be measured.
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Abstract
Description
第1のフィルムと、樹脂層と、第2のフィルムとを順に含む積層構造体であって、
前記樹脂層が、(A)アルカリ可溶性樹脂、(B)多官能光重合性モノマー、(C)光重合開始剤、および(D)熱硬化性樹脂を含み、
前記第2のフィルムと前記樹脂層との環境温度40℃における剥離強度が0.4~1.5N/cmであることを特徴とする積層構造体によって達成することができる。
前記積層構造体における前記第2のフィルムを剥離し、回路形成された基板に前記樹脂層を付着して、前記基板に対して前記第1のフィルムおよび前記樹脂層を配置する工程、
前記樹脂層の所定部分に前記第1のフィルムを介して活性エネルギー線を照射する露光工程、
前記第1のフィルムを剥離して、前記露光工程後の前記樹脂層において活性エネルギー線が照射されていない領域を除去する現像工程、および
前記現像工程後の前記樹脂層を加熱する硬化物形成工程
を含むことを特徴とする硬化物の形成方法にも関する。
第1のフィルムとは、回路形成された基板に積層構造体における樹脂層をラミネートする際、樹脂層を支持する役割を有するものであり、その樹脂層を形成する際に、その樹脂層を形成するための樹脂組成物が塗布されるものである。第1のフィルムとしては、例えば、ポリエチレンテレフタレートやポリエチレンナフタレート等のポリエステルフィルム、ポリイミドフィルム、ポリアミドイミドフィルム、ポリエチレンフィルム、ポリテトラフルオロエチレンフィルム、ポリプロピレンフィルム、ポリスチレンフィルム等の熱可塑性樹脂により形成されたフィルムを用いることができる。これらの中でも、耐熱性、機械的強度、取扱性等の観点から、ポリエステルフィルムを好適に使用することができる。第1のフィルムの厚さは、特に制限されるものではないが、好ましくは10~150μmの範囲、より好ましくは15~100μmの範囲、さらにより好ましくは20~75μmの範囲で用途に応じて適宜選択される。第1のフィルムの樹脂層を設ける面には、離型処理が施されていてもよい。また、第1のフィルムにおいて樹脂層を設ける面には、スパッタもしくは極薄銅箔が形成されていてもよい。市販品としては、例えば、東洋紡(株)製の「E5041」(ポリエチレンテレフタレートフィルム;厚さ25μm)が挙げられる。
第1のフィルムと樹脂層との環境温度40℃における剥離強度は、第2のフィルムと樹脂層との環境温度40℃における剥離強度よりも高いことが好ましく、0.5~2.5N/cmであることがより好ましい。
第1のフィルムと樹脂層との剥離強度の測定は、JIS K6854-1:1999に準拠した90°剥離試験において、環境温度40℃で行う。上記90°剥離試験に用いる試験装置としては、島津製作所製のオートグラフAG-Xを用いることができる。この剥離強度の測定は、引き剥がし速度50mm/min、ストローク35mmの平均剥離強度にて測定することができる。
具体的には、本発明の積層構造体を幅15mm、長さ95mmの大きさに切り出し、その後、第2のフィルムを剥がして、露出した樹脂層を幅15mm、長さ95mm、および厚さ1.6mmのガラスエポキシ板に真空ラミネーター(ニッコー・マテリアルズ株式会社製のラミネーターCVP-300)を用いて貼り付ける。ここで、ラミネート温度は70℃、真空保持時間は20秒、加圧時間は90秒である。
次いで、第1のフィルムの幅15mmが幅10mmと幅5mmとで分かれるように長手方向に切り込みを入れる。続いて、第1のフィルムの一部を剥がしてつかみ具で掴み、40℃の恒温槽に5分間放置した後、50mm/minの速度で長手方向の一端からガラスエポキシ板に対して90度方向に30mm引きはがした時の荷重を測定し、第1のフィルムと樹脂層との環境温度40℃における剥離強度を求める。恒温槽はTCR2W-200Tを使用する。
樹脂層は、(A)アルカリ可溶性樹脂、(B)多官能光重合性モノマー、(C)光重合開始剤、および(D)熱硬化性樹脂を含む。この樹脂層の厚さは、好ましくは5~100μm、より好ましくは10~90μmであり、さらにより好ましくは25~85μmである。この範囲にすることによって、プリント配線板の薄板化の要求に応えることができる。また、プリント配線板には用途に応じて様々な回路の厚みを有するものがあるが、本発明の積層構造体は、回路厚みの大きいプリント配線板に対しても充分に適用することができる。本発明の積層構造体における樹脂層は、(A)アルカリ可溶性樹脂、(B)多官能光重合性モノマー、(C)光重合開始剤、および(D)熱硬化性樹脂を含む樹脂組成物を第1のフィルム上に塗布および50~150℃で1~30分間乾燥して形成されるものである。以下、樹脂層を形成するための樹脂組成物についての構成成分を説明する。
アルカリ可溶性樹脂は、アルカリ水溶液に可溶となるアルカリ可溶性基を有する。アルカリ可溶性基とは、例えば、フェノール性水酸基、チオール基およびカルボキシル基のうちのいずれか1種である。アルカリ可溶性樹脂としては、例えば、フェノール性水酸基を2個以上有する化合物、カルボキシル基含有樹脂、フェノール性水酸基およびカルボキシル基を有する化合物、チオール基を2個以上有する化合物が挙げられる。
アルカリ可溶樹脂をプロピレングリコールモノメチルエーテルアセテートで希釈して樹脂溶液とし、これをフッ素樹脂(AGC製 アフレックス 50 HK NT)の上にポッティングし、100℃のオーブン中にて10時間加熱し、厚さ約1mm、直径25mmの乾燥した樹脂板を形成する。次いで、Thermo Scientific社製RS-6000を用いて、下記測定条件で溶融粘度を測定する。
(溶融粘度の測定条件)
センサー: Φ20mmの平行平板型
昇温速度: 5℃/min
測定周波数: 1Hz
測定圧力: 3Pa
一方、200mgKOH/g以下である正常な硬化物パターンの描画が容易となるので好ましい。
一方、重量平均分子量が150,000以下の場合、現像性が良好で、貯蔵安定性にも優れる。
多官能光重合性モノマーとしては、分子中に2個以上のエチレン性不飽和基を有する化合物であり、公知慣用の光硬化性モノマーである光重合性オリゴマー、光重合性ビニルモノマー等を用いることができる。
光重合開始剤としては、光重合開始剤や光ラジカル発生剤として公知の光重合開始剤であれば、いずれのものを用いることもできる。
前記樹脂層は熱硬化性樹脂を含むことが好ましい。熱硬化性樹脂としては、加熱により硬化して電気絶縁性を示す樹脂であればよく、例えば、エポキシ化合物、オキセタン化合物、メラミン樹脂、シリコーン樹脂などが挙げられる。特に、本発明においては、エポキシ化合物およびオキセタン化合物を好適に用いることができ、これらは併用してもよい。
これらのエポキシ樹脂は、1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。
第2のフィルムとは、積層構造体の樹脂層の表面に塵等が付着するのを防止するとともに取扱性を向上させる目的で、樹脂層における第1のフィルムとは反対側の面に設けられる。第2のフィルムとしては、例えば、前記第1のフィルムで例示した熱可塑性樹脂により形成されたフィルム等を用いることができる。これらの中でも、ポリエステルフィルム、ポリエチレンフィルム、ポリプロピレンフィルム、および、これらフィルムの表面が離形処理されたフィルムが好ましい。第2のフィルムの厚さは、特に制限されるものではないが、好ましくは10~150μmの範囲、より好ましくは12.5~100μmの範囲、さらにより好ましくは15~50μmの範囲で用途に応じて適宜選択される。第2のフィルムの樹脂層を設ける面には、離型処理が施されていてもよい。
第2のフィルムと樹脂層との環境温度40℃における剥離強度は、0.4~1.5N/cmである。この剥離強度の範囲と特定の成分を有する樹脂層との組み合わせによって、特に積層構造体の周辺の環境温度が或る温度(特には、40℃程度)まで上昇する条件下においても、樹脂層と第2のフィルムとの剥離性および貼り合わせ性の両方とも良好にすることができる。第2のフィルムと樹脂層との剥離強度の測定は、JIS K6854-1:1999に準拠した90°剥離試験において、環境温度40℃で行った。上記90°剥離試験に用いる試験装置としては、島津製作所製のオートグラフAG-Xを用いることができる。この剥離強度の測定は、引き剥がし速度50mm/min.、ストローク35mmの平均剥離強度にて測定することができる。
具体的には、本発明の積層構造体を幅15mm、長さ95mmにカットした後、第1のフィルム表面に幅15mmの両面テープ(ニチバン(株)製「ナイスタック NW-K15」)を長手方向に余分に貼り付けて、次に積層構造体の大きさ(幅15mm、長さ95mm)と同じになるように両面テープの余分な部分をカットして、幅15mm、長さ95mm、および厚さ1.6mmのガラスエポキシ板に対して第1のフィルム表面に貼り付けた両面テープを接着する。第2のフィルムの幅15mmが幅10mmと幅5mmとで分かれるように長手方向に切り込みを入れる。続いて、第2のフィルムの一部を剥がしてつかみ具で掴み、40℃の恒温槽に5分間放置した後、50mm/minの速度、ストローク35mmで長手方向の一端からガラスエポキシ板に対して90度方向に30mm引きはがした時の荷重を測定し、第2のフィルムと樹脂層との環境温度40℃における剥離強度を求める。恒温槽はTCR2W-200Tを使用する。
前記樹脂層は、無機フィラーを含有することもできる。無機フィラーとしては、表面処理された無機フィラーを含有することが好ましい。ここで、無機フィラーの表面処理とは、樹脂成分との相溶性を向上させるための処理のことを言う。無機フィラーの表面処理は、無機フィラーの表面に硬化性反応基を導入可能な表面処理が好ましい。
前記樹脂層には、電子材料の分野において公知慣用の他の硬化成分や他の添加剤を配合してもよい。他の硬化成分としては、シアネートエステル樹脂、活性エステル樹脂、マレイミド化合物、脂環式オレフィン重合体が挙げられる。他の添加剤としては、非シリコーン系剥離剤、光塩基発生剤、熱硬化触媒、着色剤、有機溶剤、熱重合禁止剤、紫外線吸収剤、シランカップリング剤、可塑剤、難燃剤、帯電防止剤、老化防止剤、抗菌・防黴剤、消泡剤、レベリング剤、増粘剤、密着性付与剤、チキソ性付与剤、光開始助剤、増感剤、熱可塑性樹脂、有機フィラー、離型剤、表面処理剤、分散剤、分散助剤、表面改質剤、安定剤、蛍光体等が挙げられる。
積層構造体を形成する際には、まず、(A)アルカリ可溶性樹脂と(B)多官能光重合性モノマーと(C)光重合開始剤と(D)熱硬化性樹脂とを含む樹脂組成物を、コンマコーター、ブレードコーター等により第1のフィルム上に均一な厚さに塗布する。その後、塗布された樹脂組成物を、通常、40~130℃の温度で1~30分間乾燥することで、樹脂層を形成することができる。その後、樹脂層における第1のフィルムとは反対側の表面に第2のフィルムを貼り合わせて、積層構造体を形成する。なお、第2のフィルム上に樹脂組成物を塗布および乾燥させることにより樹脂層を形成して、その後、第1のフィルムを貼り合わせてもよい。また、積層構造体が長尺状である場合には、ロール状に巻き取ってロール状積層構造体としてもよい。ロール状積層構造体は、必要に応じて所定の幅に切断してもよい。
回路基板への樹脂層の硬化物の形成方法(具体的には、上記積層構造体における樹脂層の硬化物の形成方法)は、以下の工程:
前記積層構造体における前記第2のフィルムを剥離し、回路形成された基板に前記樹脂層を付着して、前記基板に対して前記第1のフィルムおよび前記樹脂層を配置する工程、
前記樹脂層の所定部分に前記第1のフィルムを介して活性エネルギー線を照射する露光工程、
前記第1のフィルムを剥離して、前記露光工程後の前記樹脂層において活性エネルギー線が照射されていない領域を除去する現像工程、および
前記現像工程後の前記樹脂層を加熱する硬化物形成工程
を含む方法によって行うことができる。
回路形成された基板に樹脂層を付着する工程としては、真空ラミネーター等を用いて、第2のフィルムを樹脂層から剥離して加圧および加熱下で貼り合わせすることが好ましい。このような真空ラミネーターを使用することにより、回路形成された基板の表面に積層構造体が密着するため、気泡の混入がなく、また、回路基板表面の凹部の穴埋め性も向上する。加圧条件は、0.1~2.0MPa程度であることが好ましく、また、加熱条件は、40~120℃であることが好ましい。
露光工程では、光重合開始剤を含む樹脂層に例えば露光量が50mJ/cm2~1000mJ/cm2の条件にて光照射を行うことにより樹脂層を光硬化させることができる。光照射は、紫外線、電子線、化学線等の活性エネルギー線の照射により行われる。所定部分に活性エネルギー線を照射する方法としては、所定のパターンを形成したフォトマスクを通して選択的に活性エネルギー線を照射する方法でもよく、直接描画装置(例えば、コンピューターからのCADデータにより直接レーザーで画像を描くレーザーダイレクトイメージング装置)を用いてもよい。
現像工程では、第1のフィルムの剥離後にアルカリ現像により、未露光部を除去して、ネガ型のパターン状の硬化膜を形成する。現像方法としては、ディッピング等の公知の方法によることができる。また、現像液としては、炭酸ナトリウム、炭酸カリウム、水酸化カリウム、アミン類、2-メチルイミダゾール等のイミダゾール類、水酸化テトラメチルアンモニウム水溶液(TMAH)等のアルカリ水溶液、または、これらの混合液を用いることができる。
硬化物形成工程では、光硬化後の樹脂層が、公知の加熱手段、例えば、熱風炉、電気炉、赤外線誘導加熱炉等の加熱炉を用いることにより熱硬化される。加熱条件としては、150℃~170℃にて5分~120分加熱することが好ましい。
回路基板への樹脂層の硬化物(すなわち、積層構造体のうちの前記第1のフィルムおよび前記第2のフィルムを有しない状態の樹脂層を硬化した硬化物)は、柔軟性にも優れるため、特にフレキシブルプリント配線板に対するカバーレイやソルダーレジスト(絶縁性硬化膜)としても好適である。
本発明は、樹脂層の硬化物を有する電子部品も提供する。本発明において電子部品とは、電子回路に使用する部品を意味し、プリント配線板、特にフレキシブルプリント配線板、トランジスタ、発光ダイオード、レーザーダイオード等の能動部品の他抵抗、コンデンサ、インダクタ、コネクタ等の受動部品も含まれる。本発明の樹脂層の硬化物は、これらの絶縁性硬化膜として好適である。
攪拌装置、還流管をつけた2Lフラスコ中に、ビスフェノールA型エポキシ化合物(三菱ケミカル(株)製「828」;2官能ビスフェノールA型エポキシ樹脂、エポキシ当量: 189g/当量)378.0g、アクリル酸(分子量:72.06)142.7g、熱重合禁止剤としての2,6-ジ-tert-ブチル-p-クレゾール2.94gおよび反応触媒としてのトリフェニルフォスフィン1.53gを仕込み、98℃ の温度で反応液の酸価が0.5mgKOH/g以下になるまで反応させ、エポキシアクリレート化合物(a)(理論分子量:510.7)を得た。
次いでこの反応液に反応用溶媒としてのカルビトールアセテート594.0g、ジメチロールプロピオン酸(b)(分子量:134.16)105.5gを加え、45℃に昇温させた。この溶液にイソホロンジイソシアネート(c)(分子量:222.28)264.7gを反応温度が65℃を超えないように徐々に滴下した。滴下終了後、温度を80℃に上昇させ、赤外吸収スペクトル測定法により、2250cm-1付近のイソシアネート基の吸収がなくなるまで6時間反応させ、更に98℃の温度で2時間反応させた。このようにして、アルカリ可溶性ウレタン樹脂(A)を固形分濃度として60質量%含む樹脂溶液(アルカリ可溶性ウレタン樹脂A-1)を得た。酸価を測定したところ、28.9mgKOH/g(固形分酸価:48.2mgKOH/g)であった。
撹拌装置、温度計、コンデンサーを備えた反応容器に、2つ以上のアルコール性ヒドロキシル基を有する化合物としての1,5-ペンタンジオールと1,6-ヘキサンジオールとから誘導されるポリカーボネートジオール(旭化成ケミカルズ(株)製「TJ5650J」、数平均分子量800)3600g(4.5モル)、ジメチロールブタン酸814g(5.5モル)、および分子量調整剤(反応停止剤)としての2-ヒドロキシエチルアクリレート186g(1.6モル)を投入した。次に、芳香環を有しないイソシアネート化合物としてのトリメチルヘキサメチレンジイソシアネート2009g(10.8モル)を投入し、撹拌しながら60℃まで加熱して停止し、反応容器内の温度が低下し始めた時点で再度加熱して80℃で撹拌を続け、赤外線吸収スペクトルでイソシアネート基の吸収スペクトル(2280cm-1)が消失したことを確認して反応を終了した。次いで、固形分が60質量%となるようにカルビトールアセテートを添加し、希釈剤を含有する粘稠液体のカルボキシル基含有アルカリ可溶性ウレタン樹脂(アルカリ可溶性ウレタン樹脂A-2)を得た。得られたカルボキシル基含有アルカリ可溶性ウレタン樹脂A-2の固形分の酸価は49.8mgKOH/gであった。
平均の重合度nが6.2であるビスフェノールF型エポキシ樹脂(エポキシ当量950g/eq、軟化点85℃)380部とエピクロルヒドリン925部とをジメチルスルホキシド462.5部に溶解させた後、攪拌下70℃で98.5%NaOH60.9部を100分かけて添加した。添加後さらに70℃で3時間反応を行った。反応終了後、水250部を加え水洗を行った。油水分離後、油層よりジメチルスルホキシドの大半および過剰の未反応エピクロルヒドリンを減圧下に蒸留回収し、残留した副製塩とジメチルスルホキシドとを含む反応生成物をメチルイソブチルケトン750部に溶解させ、更に30%NaOH10部を加え、70℃で1時間反応させた。反応終了後、水200部で2回水洗を行った。油水分離後、油層よりメチルイソブチルケトンを蒸留回収して、エポキシ当量310g/eq、軟化点69℃のエポキシ樹脂(a)を得た。得られたエポキシ樹脂(a)は、エポキシ当量から計算すると、前記出発物質ビスフェノールF型エポキシ樹脂におけるアルコール性水酸基6.2個のうち約5個がエポキシ化されたものであった。このエポキシ樹脂(a)310部およびカルビトールアセテート282部をフラスコに仕込み、90℃に加熱・攪拌し、溶解した。得られた溶液を一旦60℃まで冷却し、アクリル酸72部(1モル)、メチルハイドロキノン0.5部、トリフェニルフォスフィン2部を加え、100℃に加熱し、約60時間反応させ、酸価が0.2mgKOH/gである反応物を得た。これにテトラヒドロ無水フタル酸140部(0.92モル)を加え、90℃に加熱し、反応を行い、酸変性エポキシアクリレート樹脂(酸変性エポキシアクリレート樹脂A-3)を得た。得られた酸変性エポキシアクリレート樹脂A-3の固形分濃度は62質量%、固形分酸価(mgKOH/g)は100であった。
クレゾールノボラック型エポキシ樹脂(DIC株式会社製「EPICLON N-695」;エポキシ当量:220)220部を撹拌機および還流冷却器の付いた四つ口フラスコに入れ、カルビトールアセテート214部を加え、加熱溶解した。次に、重合禁止剤としてのハイドロキノン0.1部と、反応触媒としてのジメチルベンジルアミン2.0部を加えた。この混合物を95~105℃に加熱し、アクリル酸72部を徐々に滴下し、16時間反応させた。この反応生成物を80~90℃まで冷却し、テトラヒドロフタル酸無水物106部を加え、8時間反応させ、冷却後、取り出した。
このようにして得られた酸変性エポキシアクリレート樹脂(酸変性エポキシアクリレート樹脂A-4)は、固形分65%、固形物の酸価100mgKOH/g、重量平均分子量Mw約3,500であった。
アルカリ可溶性ウレタン樹脂A-1、アルカリ可溶性ウレタン樹脂A-2、酸変性エポキシアクリレート樹脂A-3、および酸変性エポキシアクリレート樹脂A-4についての樹脂溶液をフッ素樹脂(AGC製 アフレックス 50 HK NT)の上にポッティングし、100℃のオーブン中にて10時間加熱し、厚さ約1mm、直径25mmの乾燥した樹脂板を形成した。Thermo Scientific社製RS-6000を用いて、下記測定条件で溶融粘度を測定した。この測定結果を下記の表1に示す。
(溶融粘度の測定条件)
センサー: Φ20mmの平行平板型
昇温速度: 5℃/min
測定周波数: 1Hz
測定圧力: 3Pa
下記の方法により積層構造体を作製した。
表2に記載の配合に従い、実施例および比較例に記載の成分をそれぞれ配合し、撹拌機にて予備混合した後、3本ロールミルにて混練し、積層構造体における樹脂層を形成するための樹脂組成物を調製した。表中の値は、特に断りが無い限り、質量%であり、固形分量である。
第1のフィルムとして厚さ25μmポリエチレンテレフタレートフィルム(東洋紡(株)製「E5041」)を用意した。上記で得られた樹脂組成物を該フィルム上に塗布し、80℃の温度にて15分乾燥し、厚み25μmの樹脂層を形成した。次いで、第2のフィルムとしてE-201F(王子エフテックス(株)製 二軸延伸ポリプロピレンフィルム)を貼り合わせることで、第1のフィルムと第2のフィルムとの間に樹脂層が配置されている実施例1~4および比較例1~2の積層構造体を得た。
※2 2,4,6-トリメチルベンゾイルジフェニルフォスフィンオキサイド
※3 ビフェニルアラルキル型エポキシ樹脂(日本化薬社製)
※4 水酸化アルミニウム(昭和電工社製)
ラミネートロール温度を50℃、加圧力を0.2MPaに設定したロールラミネーター(大成ラミネーター(株)社製 VA-770)を用いて上記積層構造体を作製する場合において、第2のフィルムを樹脂層に貼り合わせた際における第2のフィルムの貼り付き具合を評価した。この評価結果を下記の表3に示す。
○ :第2のフィルムの剥がれなし。
× :第2のフィルムの浮き、剥がれが発生。
実施例1~4および比較例1~2で作製した積層構造体を幅15mm、長さ95mmにカットした後、第1のフィルム表面に幅15mmの両面テープ(ニチバン(株)製「ナイスタック NW-K15」)を長手方向に余分に貼り付けて、次に積層構造体の大きさ(幅15mm、長さ95mm)と同じになるように両面テープの余分な部分をカットして、幅15mm、長さ95mm、および厚さ1.6mmのガラスエポキシ板に対して第1のフィルム表面に貼り付けた両面テープを接着した。第2のフィルムの幅15mmが幅10mmと幅5mmとで分かれるように長手方向に切り込みを入れた。続いて、第2のフィルムの一部を剥がしてつかみ具で掴み、40℃の恒温槽に5分間放置した後、50mm/minの速度で長手方向の一端からガラスエポキシ板に対して90度方向に30mm引きはがした時の荷重を測定し、第2のフィルムと樹脂層との環境温度40℃における剥離強度を求めた。測定には(株)島津製作所製AG-X、恒温槽はTCR2W-200Tを使用した。この測定結果下記の表3に示す。
実施例1~4および比較例1~2で作製した積層構造体を幅10cm、長さ30cmにカットした。次に、40℃に設定したホットプレートを準備し、このホットプレートに積層構造体の第2のフィルムが接するように10分間放置した。その後、第2のフィルムを一気に引きはがし、樹脂層の破壊の有無を観察した。この評価結果を下記の表3に示す。なお、樹脂層が破壊されずに第2のフィルムを剥離できれば、環境温度40℃における樹脂層と第2のフィルムとの剥離性が良好であると言える。
評価基準:
〇:樹脂層の破壊が認められない。
×:樹脂層の破壊が認められる。
E-201F:王子エフテックス(株)製 二軸延伸ポリプロピレンフィルム
TN100:東洋紡(株)製 離型PETフィルム
MA-411:王子エフテックス(株)製 二軸延伸ポリプロピレンフィルム
MA-430:王子エフテックス(株)製 二軸延伸ポリプロピレンフィルム
MAM-430:王子エフテックス(株)製 二軸延伸ポリプロピレンフィルム
一方、実施例5~12の積層構造体における第2のフィルムと樹脂層との環境温度40℃における剥離強度は1.5N/cm以下であり、第2のフィルムの取扱い性が良好であることが確認された。
第1のフィルムとして厚さ25μmポリエチレンテレフタレートフィルム(東洋紡(株)製「E5041」)を用意した。前記の実施例4の樹脂組成物を第1のフィルムの表面にダイコーターにて均一に塗布し、80℃~105℃(平均90℃)で、5分乾燥させて樹脂層を形成した。次いで、樹脂層の表面に表6に示す第2のフィルムを常圧下、50℃でラミネートし、積層構造体を作製した。得られた積層構造体をロール状に巻き取った(巻き取り長さ50m)。得られたロール状体を幅247mmにスリット加工して、ロール状積層構造体を得た。塗布時の膜厚を調節し、第2のフィルムの算術平均表面粗さRaを変更することによって実施例13~18のロール状積層構造体を作製した。また、第2のフィルムとしてMA-411を使用して、比較例7のロール状積層構造体を作製した。作製したロール状積層構造体の構成を表6に示す。
得られたロール状積層構造体をロールラミネーター(大成ラミネーター(株)製「VA-770A型ラミネーター」)にセットした。ラミネート条件は、ラミネートロール温度:90℃、ラミネート圧力:0.3MPa、搬送速度:0.5m/min、積層構造体巻き出しテンション:20N、セパレーター巻き取りテンション:15Nで行った。積層構造体を搬送しながら第2のフィルムを剥離し、樹脂層が露出した面を回路が形成された片面フレキシブルプリント配線板(回路厚=18、35、および70μmの3種類を用意、基材イミド厚=25μm)に接するようにしてラミネートを行った。この時の第2のフィルムの剥離状態を観察し、下記基準にて評価を行った。評価結果を表7に示す。
評価基準:
◎:下記〇の評価よりもなめらかに剥離できる。
〇:剥離できる。
×:剥離不可(ラミネートできない)。
一方、第2のフィルムの剥離力が1.5N/cmを超えた比較例7は剥離不能でありラミネートが出来なかった。
第1のフィルムと樹脂層との環境温度40℃における剥離強度の測定については、実施例1の積層構造体の第2のフィルムを剥がして、露出した樹脂層を幅15mm、長さ95mm、および厚さ1.6mmのガラスエポキシ板に真空ラミネーター(ニッコー・マテリアルズ株式会社製のラミネーターCVP-300)を用いて貼り付けた。ここで、ラミネート温度は70℃、真空保持時間は20秒、加圧時間は90秒とした。
次いで、第1のフィルムの幅15mmが幅10mmと幅5mmとで分かれるように長手方向に切り込みを入れた。続いて、第1のフィルムの一部を剥がしてつかみ具で掴み、40℃の恒温槽に5分間放置した後、50mm/minの速度で長手方向の一端からガラスエポキシ板に対して90度方向に30mm引きはがした時の荷重を測定し、第1のフィルムと樹脂層との環境温度40℃における剥離強度を求めた。測定には(株)島津製作所製AG-X、恒温槽はTCR2W-200Tを使用した。実施例2~4および比較例1、2の積層構造体についても同様に測定した。測定結果を表8に示す。
なお、実施例5~18の積層構造体は、実施例4の積積層構造体と第1のフィルムの種類および樹脂層の組成が同じであるため、第1のフィルムと樹脂層との剥離強度は実施例4と同一の値(2.0N/cm)である。比較例3~7の積層構造体については、第2のフィルムを良好に剥がすことができず、第1のフィルムと樹脂層との環境温度40℃における剥離強度を測定することができなかった。
Claims (9)
- 第1のフィルムと、樹脂層と、第2のフィルムとを順に含む積層構造体であって、
前記樹脂層が、(A)アルカリ可溶性樹脂、(B)多官能光重合性モノマー、(C)光重合開始剤、および(D)熱硬化性樹脂を含み、
前記第2のフィルムと前記樹脂層との環境温度40℃における剥離強度が0.4~1.5N/cmであることを特徴とする積層構造体。 - 前記樹脂層の厚さが5~100μmであることを特徴とする請求項1に記載の積層構造体。
- 前記第2のフィルムにおける前記樹脂層側の面についての算術平均表面粗さRaが0.1μm以下であることを特徴とする請求項1または2に記載の積層構造体。
- 前記(A)アルカリ可溶性樹脂の90℃における溶融粘度が100~1,000Pa・sの範囲であることを特徴とする請求項1~3のいずれか一項記載の積層構造体。
- 前記溶融粘度を有する(A)アルカリ可溶性樹脂が、前記溶融粘度を有するアルカリ可溶性ウレタン樹脂、前記溶融粘度を有する酸変性エポキシアクリレート樹脂、またはそれらの組み合わせを含むことを特徴とする請求項4に記載の積層構造体。
- 前記溶融粘度を有するアルカリ可溶性ウレタン樹脂の固形分含有量、前記溶融粘度を有する酸変性エポキシアクリレート樹脂の固形分含有量、またはそれらの組み合わせの固形分含有量が、それぞれ、前記樹脂層の固形分100質量%に対して、5~50質量%であることを特徴とする請求項5に記載の積層構造体。
- 請求項1~6のいずれか一項記載の積層構造体における前記樹脂層を硬化したことを特徴とする硬化物。
- 請求項7に記載の硬化物を有することを特徴とする電子部品。
- 前記請求項1~6のいずれか一項に記載の積層構造体における前記第2のフィルムを剥離し、回路形成された基板に前記樹脂層を付着して、前記基板に対して前記第1のフィルムおよび前記樹脂層を配置する工程、
前記樹脂層の所定部分に前記第1のフィルムを介して活性エネルギー線を照射する露光工程、
前記第1のフィルムを剥離して、前記露光工程後の前記樹脂層において活性エネルギー線が照射されていない領域を除去する現像工程、および
前記現像工程後の前記樹脂層を加熱する硬化物形成工程
を含むことを特徴とする硬化物の形成方法。
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WO2017122460A1 (ja) * | 2016-01-13 | 2017-07-20 | 太陽インキ製造株式会社 | ドライフィルムおよびプリント配線板 |
JP2017191335A (ja) * | 2014-06-30 | 2017-10-19 | 太陽インキ製造株式会社 | 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法 |
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JP2019144521A (ja) * | 2017-06-27 | 2019-08-29 | 太陽インキ製造株式会社 | 感光性フィルム積層体およびその硬化物 |
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JP2017191335A (ja) * | 2014-06-30 | 2017-10-19 | 太陽インキ製造株式会社 | 感光性ドライフィルムおよびそれを用いたプリント配線板の製造方法 |
WO2017122460A1 (ja) * | 2016-01-13 | 2017-07-20 | 太陽インキ製造株式会社 | ドライフィルムおよびプリント配線板 |
JP2017198747A (ja) * | 2016-04-25 | 2017-11-02 | 太陽インキ製造株式会社 | ドライフィルム、硬化物およびプリント配線板 |
JP2017198746A (ja) * | 2016-04-25 | 2017-11-02 | 太陽インキ製造株式会社 | ドライフィルム、硬化物およびプリント配線板 |
JP2019144521A (ja) * | 2017-06-27 | 2019-08-29 | 太陽インキ製造株式会社 | 感光性フィルム積層体およびその硬化物 |
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