WO2022201394A1 - 光源パラメータ情報管理方法、光源パラメータ情報管理装置及びコンピュータ可読媒体 - Google Patents
光源パラメータ情報管理方法、光源パラメータ情報管理装置及びコンピュータ可読媒体 Download PDFInfo
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/50—Circuit arrangements for operating light-emitting diodes [LED] responsive to malfunctions or undesirable behaviour of LEDs; responsive to LED life; Protective circuits
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- H—ELECTRICITY
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
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- H05B47/105—Controlling the light source in response to determined parameters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
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- H—ELECTRICITY
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- H05B47/19—Controlling the light source by remote control via wireless transmission
Definitions
- the present disclosure relates to a light source parameter information management method, a light source parameter information management device, and a computer-readable medium.
- a KrF excimer laser device that outputs laser light with a wavelength of about 248 nm and an ArF excimer laser device that outputs laser light with a wavelength of about 193 nm are used.
- the spectral line width of the spontaneous oscillation light of the KrF excimer laser device and the ArF excimer laser device is as wide as 350-400 pm. Therefore, if the projection lens is made of a material that transmits ultraviolet light, such as KrF and ArF laser light, chromatic aberration may occur. As a result, resolution can be reduced. Therefore, it is necessary to narrow the spectral line width of the laser light output from the gas laser device to such an extent that the chromatic aberration can be ignored. Therefore, in the laser resonator of the gas laser device, a line narrow module (LNM) including a band narrowing element (etalon, grating, etc.) is provided in order to narrow the spectral line width.
- LNM line narrow module
- a gas laser device whose spectral line width is narrowed will be referred to as a band-narrowed gas laser device.
- a light source parameter information management method is a light source parameter information management method for managing parameter information of a light source used in an exposure apparatus, and is a variable that is a priority target parameter prioritized in operation of the light source. obtaining priority target parameter information including target values for items and variables; estimating maintenance information including a value representing a service life of a consumable in a light source based on the priority target parameter information; and outputting information.
- a light source parameter information management device includes a processor and a memory in which a program executed by the processor is stored. Obtain priority target parameter information including variable items and variable target values that are priority target parameters that are prioritized in the operation of the light source, and based on the priority target parameter information, a value that represents the life of the consumables in the light source until maintenance , and output the maintenance information.
- a computer-readable medium is a non-transitory computer-readable medium recording a program that causes a computer to implement a function of managing parameter information of a light source used in an exposure apparatus,
- a computer is provided with a function of acquiring priority target parameter information including items of variables that are priority target parameters prioritized in the operation of the light source and target values of the variables;
- It is a computer-readable medium on which a program for realizing a function of estimating maintenance information including a value representing a life until maintenance, a function of outputting maintenance information, and a program for realizing the function are recorded.
- FIG. 1 schematically illustrates the configuration of a semiconductor manufacturing system within an exemplary semiconductor factory.
- FIG. 2 schematically shows the configuration of the lithography system.
- FIG. 3 shows an example of an output pattern of the light emission trigger signal output from the exposure control section to the laser control section.
- FIG. 4 shows an example of an exposure pattern for step-and-scan exposure on a wafer.
- FIG. 5 shows the relationship between one scan field on the wafer and the static exposure area.
- FIG. 6 shows an example of a static exposure area.
- FIG. 7 schematically shows the configuration of a light source for an exemplary exposure apparatus.
- FIG. 8 shows the configuration of the semiconductor manufacturing system according to the first embodiment.
- FIG. 1 schematically illustrates the configuration of a semiconductor manufacturing system within an exemplary semiconductor factory.
- FIG. 2 schematically shows the configuration of the lithography system.
- FIG. 3 shows an example of an output pattern of the light emission trigger signal output from the exposure control section to the laser control section.
- FIG. 4 shows an example of an
- FIG. 9 is a block diagram showing the overall flow of processing in the semiconductor manufacturing system according to the first embodiment.
- FIG. 10 is a flowchart showing an example of processing contents in the data analysis server.
- FIG. 11 is a graph showing a method of obtaining the target values of the light source parameters and their ranges from the regression curve.
- FIG. 12 is a flowchart showing an example of processing contents in the light source parameter management server.
- FIG. 13 is a flow chart showing an example of processing contents in the light source parameter management server.
- FIG. 14 is a flow chart showing an example of a subroutine applied to step S22 of FIG.
- FIG. 15 is a flow chart showing an example of a subroutine applied to step S29 of FIG. 13 and step S44 of FIG.
- FIG. 10 is a flowchart showing an example of processing contents in the data analysis server.
- FIG. 11 is a graph showing a method of obtaining the target values of the light source parameters and their ranges from the regression curve.
- FIG. 12 is
- FIG. 16 is a block diagram showing the overall flow of processing in the semiconductor manufacturing system according to the second embodiment.
- FIG. 17 is a flowchart showing an example of a confirmation flow of recommended target parameter information in the data analysis server according to the second embodiment.
- FIG. 18 is a graph showing an analysis example of the relationship between recommended target parameters and exposure performance parameters.
- FIG. 19 is a flow chart showing an example of processing contents in the light source parameter management server according to the second embodiment.
- FIG. 20 is a flowchart illustrating an example of processing contents in the light source parameter management server according to the second embodiment.
- FIG. 21 is a flow chart showing an example of a subroutine applied to step S72 of FIG.
- FIG. 22 is a flow chart showing an example of a subroutine applied to step S79 of FIG.
- FIG. 23 is a flow chart showing an example of a subroutine applied to step S106 of FIG.
- FIG. 24 is a flow chart showing an example of processing contents in the light source parameter management server according to the third embodiment.
- FIG. 25 is a flow chart showing an example of a subroutine applied to step S71 of FIG.
- FIG. 26 is an example of a graph showing the relationship between priority target parameters and operation control parameters.
- FIG. 27 is a flow chart showing an example of processing contents in the data analysis server according to the fourth embodiment.
- FIG. 28 is a graph showing an example of a method of obtaining a target spectral linewidth and its range using a regression curve.
- FIG. 29 is a flow chart showing an example of a subroutine applied to step S71 of FIG.
- FIG. 30 is an example of a graph showing the relationship between the spectral linewidth and the lens interval of the wavefront modulator.
- FIG. 31 is a flowchart showing an example of processing contents in the light source parameter management server when the priority target parameter value is a high pulse energy value and the recommended target parameter value is a wide spectral line width value.
- FIG. 32 is an example of a graph showing the relationship between the pulse energy and the lens spacing of the wavefront modulator.
- FIG. 33 is an example of a graph showing the relationship between pulse energy and spectral linewidth.
- FIG. 34 is a flowchart showing an example of processing contents in the light source parameter management server when the priority target parameter value is a high pulse energy value and the range of the pulse energy stability parameter can be relaxed.
- FIG. 35 is an example of a graph showing the relationship between halogen gas partial pressure and pulse energy and the relationship between halogen gas partial pressure and pulse energy stability.
- FIG. 36 is a graph showing a setting example of the halogen gas partial pressure when giving priority to the stability of the pulse energy in the optical performance priority mode.
- FIG. 37 is an example of a graph showing the relationship between duty ratio and pulse energy.
- FIG. 38 is a flowchart showing an example of processing contents in the light source parameter management server when the priority target parameter is the duty ratio and the range of the pulse energy stability parameter can be relaxed.
- FIG. 35 is an example of a graph showing the relationship between halogen gas partial pressure and pulse energy and the relationship between halogen gas partial pressure and pulse energy stability.
- FIG. 36 is a graph showing a setting example of the halogen
- FIG. 39 is a flow chart showing an example of the processing contents applied in the consumables life extension mode operation.
- FIG. 40 is an example of a graph showing the relationship between gas consumption per unit pulse and pulse energy.
- FIG. 41 is an example of a processing flow applied in the case of gas consumption reduction mode operation.
- FIG. 42 is an example of a processing flow applied in power saving mode operation.
- FIG. 43 is a block diagram showing a modification of the fourth embodiment;
- FIG. 44 is a table showing a specific example of parameter information regarding a light source.
- FIG. 45 is a chart showing a specific example of priority target parameter information.
- FIG. 46 is a chart showing a specific example of recommended target parameter information.
- FIG. 47 is a chart showing a specific example of maintenance information.
- FIG. 48 is a chart showing a specific example of operation control target parameter information.
- Embodiment 4 9.1 Configuration 9.2 Performance Priority Mode Operation 9.2.1 Example of Spectral Linewidth ⁇ as Priority Target Parameter 9.2.1.1 Operation 9.2.1.2 Effect 9.2.1. 3 Others 9.2.2 When pulse energy is the priority target parameter 9.2.2.1 Example of when obtaining high pulse energy is given priority and exposure can be performed by widening spectral line width ⁇ 9.2 .2.1.1 Operation 9.2.2.1.2 Effects 9.2.2.1.3 Others 9.2.2.2 Obtaining high pulse energy is a priority and pulse energy stability is specified 9.2.2.2.1 Operation 9.2.2.2.2 Effects 9.2.2.2.3 Others 9.2.2.3 High duty ratio Example of a case where priority is given to operation at 9.2.2.3.1 Operation 9.2.2.3.2 Effect 9.2.2.
- parameter information 11 Computer-readable medium on which the program is recorded. Others
- embodiments of the present disclosure will be described in detail with reference to the drawings.
- the embodiments described below show some examples of the present disclosure and do not limit the content of the present disclosure.
- not all the configurations and operations described in each embodiment are essential as the configurations and operations of the present disclosure.
- the same reference numerals are given to the same components, and redundant explanations are omitted.
- Consables refer to parts or modules that deteriorate due to pulse output of a light source used in an exposure apparatus and need to be replaced.
- a light source chamber there may be a light source chamber, a narrowband module (LNM), an out-coupling mirror (OC), a monitor module, and the like.
- LNM narrowband module
- OC out-coupling mirror
- monitor module a monitor module
- replacement includes replacing consumables with new ones, as well as maintaining and/or restoring the functions of parts by cleaning consumables, and relocating the same consumables.
- CD Crritical Dimension
- “Overlay” refers to the superposition of fine patterns formed on wafers such as semiconductors.
- Exposure conditions refer to the conditions under which the resist of wafers such as semiconductors is exposed. Specific examples include illumination conditions, projection conditions, exposure dose, spectral characteristics of light sources, output characteristics of light sources, and the like.
- a "parameter” is an item that represents a variable.
- Parameter value is the value of the above variable. That is, it is a specific numerical value of the above parameter.
- Parameter information is a collection of data that includes multiple variables and the values of the multiple variables.
- the spectral linewidth parameter information is a collection of data including a variable (item) called spectral linewidth and its value, and a variable (item) called spectral linewidth stability (operating range) and its value.
- Values indicative of spectral linewidth stability include, for example, the lower and upper limits of the operating range.
- the spectral linewidth parameter information may also include a variable of a period during which operation is performed while satisfying the spectral linewidth value and stability, and data of the value.
- target such as “target parameter” and “target parameter information” means that it is a parameter or parameter information that is set as a control target.
- the target parameter information may include a target value, which is the control target of the parameter, and information indicating its allowable range.
- the allowable range referred to here may be read as the operating range of the parameter, the operating specification, the variation range, the stability range, or the like.
- Priority target parameter information is a collection of data of items of variables that are target parameters prioritized in the operation of the light source and target values of the variables. A specific example of the priority target parameter information will be described later (Fig. 45).
- the priority target parameter information also includes the following two cases.
- the light source's light performance priority mode operation refers to operating the light source so as to prioritize the light performance of the light source.
- Consumables life extension mode operation refers to operating the light source so as to extend the life of the consumables of the light source.
- Consumption reduction mode operation refers to operating the light source so as to reduce the power consumption and gas consumption of the light source. Power and laser gas are each elements consumed by the operation of the light source.
- Recommended target parameter information refers to parameters that are different from the priority target parameters estimated when the light source is operated with target parameter information that is prioritized in light source operation, and that are parameters that require specification relaxation. It is a collection of target value data. A specific example of the recommended target parameter information will be described later (FIG. 46).
- Maintenance information is a collection of data on the number of remaining pulses or the remaining time until maintenance of each consumable that requires periodic replacement of parts of the light source after the operation of the light source is stopped. A specific example of maintenance information will be described later (FIG. 47).
- the remaining number of pulses or remaining time until maintenance for each consumable is a value that indicates the life of each consumable (remaining life until maintenance). If the number of pulses per unit time, such as the average number of pulses per day, is known, the remaining number of pulses until maintenance of consumables can be converted into the remaining time. As a parameter indicating the service life of consumables, the number of remaining pulses until maintenance may be used, the remaining time may be used, or both of them may be used.
- the maintenance information may also include date and time information indicating when the consumables should be replaced.
- “Operating control target parameters” are light source control target parameters necessary for the light source to achieve the priority target parameter information.
- "Operating control target parameter information” is an aggregate of an operating control target parameter and a target value, and a plurality of operating control target parameters may be set in order to satisfy a plurality of required specifications. A specific example of the operation control target parameter information will be described later (Fig. 48).
- External device is a device that receives at least one of priority target parameter information, recommended target parameter information, and maintenance information.
- a semiconductor factory management system a display device (a display device for informing the operator of priority control parameter information, recommended target parameter information, maintenance information, etc.), an exposure device, an exposure device management system, etc. are external devices. can be.
- FIG. 1 schematically shows the configuration of a semiconductor manufacturing system 200 in an exemplary semiconductor factory.
- Semiconductor manufacturing system 200 includes a plurality of lithography systems 10 , wafer inspection equipment management system 202 , exposure equipment management system 204 , light source management system 206 , and semiconductor factory management system 208 .
- the semiconductor factory management system 208 is connected to the wafer inspection device management system 202 , the exposure device management system 204 and the light source management system 206 via the network 210 .
- the network 210 is a communication line capable of transmitting information by wire, wireless, or a combination thereof.
- Network 210 may be a wide area network or a local area network.
- lithography system identification codes #1, #2, . . . #k, . w is the number of lithography systems included in semiconductor manufacturing system 200 .
- w is an integer of 1 or more.
- k is an integer ranging from 1 to w.
- Each lithography system #k includes a wafer inspection device 12, an exposure device 14, and a light source 16.
- the wafer inspection apparatus 12, the exposure apparatus 14, and the light source 16 included in the lithography system #k are hereinafter referred to as wafer inspection apparatus #k, exposure apparatus #k, and light source #k, respectively.
- each lithography system #k is shown to include one each of wafer inspection apparatus #k, exposure apparatus #k, and light source #k.
- Some or all of the plurality of lithography systems #1 to #w may have different configurations.
- the number and arrangement of wafer inspection apparatus #k, exposure apparatus #k, and light source #k included in lithography system #k can be appropriately designed.
- Each lithography system #k includes one or more wafer inspection devices #k, one or more exposure devices #k, and one or more light sources #k.
- the wafer inspection equipment management system 202 is connected to each of the wafer inspection equipments #1 to #w via the first local area network 211 .
- the exposure apparatus management system 204 is connected to each exposure apparatus #1 to #w via a second local area network 212 .
- a light source management system 206 is connected to each of the light sources # 1 to #w via a third local area network 213 .
- the first local area network 211 is indicated as “LAN1", the second local area network 212 as “LAN2”, and the third local area network 213 as "LAN3".
- the wafer inspection apparatuses #1 to #w measure the physical characteristic values of the surface of each wafer on which the respective resist patterns are formed.
- Physical characteristic values are, for example, CD values, overlays, magnification values, and surface heights.
- the wafer inspection apparatus management system 202 acquires the physical property values measured for each wafer from the wafer inspection apparatuses #1 to #w, and stores the measured physical property values for each wafer in each lithography system #k. and store each characteristic value data. Furthermore, the wafer inspection apparatus management system 202 organizes and stores the physical characteristic value data for each scan field of each wafer.
- the wafer inspection apparatus management system 202 outputs part or all of these measurement data to the semiconductor factory management system 208 and a data analysis server (not shown) as necessary.
- the exposure apparatus management system 204 acquires data including exposure conditions and measurement values for each wafer and each scan field from the exposure apparatuses #1 to #w.
- Exposure conditions are, for example, projection conditions, illumination conditions, and the like.
- the "measured value” is, for example, the amount of exposure, the focus position, and the like.
- the exposure apparatus management system 204 stores data of exposure conditions and measurement values for each lithography system #k, each wafer, and each scan field.
- the exposure apparatus management system 204 outputs part or all of these measurement data to the semiconductor factory management system 208 and the data analysis server as required.
- the light source management system 206 acquires operation data from each of the light sources #1 to #w, and stores the operation data of the light source #k for each lithography system #k.
- the operating data includes, for example, spectral characteristic value data, pulse energy characteristic value data, laser light output characteristic value data, and the like.
- Spectral characteristic values are, for example, wavelength and spectral line width.
- the output characteristic values of the laser light include, for example, the pulse energy value, ⁇ (standard deviation value) indicating variations in pulse energy, dose stability, the number of pulses per unit time, and the duty ratio.
- the operating data includes measurement data measured using a sensor or the like during operation of the light source #k.
- the light source management system 206 organizes and stores these data for each lithography system, each wafer, and each scan field, and if necessary, the semiconductor factory management system 208 and data analysis server. , some or all of these measurement data are output.
- the semiconductor factory management system 208 manages the entire semiconductor factory.
- the semiconductor factory management system 208 receives information obtained by, for example, the wafer inspection device management system 202 , the exposure device management system 204 , and the light source management system 206 .
- FIG. 2 schematically shows a configuration example of the lithography system #k.
- Lithography system #k includes wafer inspection apparatus 12 , exposure apparatus 14 , and light source 16 .
- the wafer inspection device 12 can perform the following measurements by irradiating the wafer with laser light and measuring the reflected light or diffracted light. That is, the wafer inspection apparatus 12 is capable of measurements including CD, wafer height, and overlay. Also, the wafer inspection device 12 may be a high-resolution scanning electron microscope (SEM).
- the wafer inspection device 12 includes a wafer inspection controller 220 , a wafer holder 225 and a wafer stage 226 .
- the exposure apparatus 14 includes an exposure control unit 50, a beam delivery unit (BDU) 15, a high reflection mirror 51, an illumination optical system 66, a reticle 74 and a reticle stage 76, a projection optical system 78, a wafer holder 80 and a wafer.
- a stage 81 and a focus sensor 84 are included.
- the exposure apparatus #k includes an exposure sensor (not shown) for measuring the exposure on the wafer WF held by the wafer holder 80 .
- the illumination optical system 66 is configured to shape the incident laser beam into a rectangular static exposure area SEA (see FIG. 5) with a substantially uniform light intensity distribution.
- the illumination optical system 66 is configured to generate an illumination pattern (not shown) so that the illumination conditions for the reticle 74 can be changed.
- the illumination pattern may be, for example, polarized illumination, annular illumination, dipole illumination, and the like.
- the projection optical system 78 is arranged to form an image of the reticle pattern on the wafer WF. NA) can be adjusted.
- the focus sensor 84 is arranged so that the distance between the wafer WF surface and the projection optical system 78 can be measured.
- the light source 16 is, for example, an excimer laser device capable of narrowband oscillation with variable wavelength and spectral linewidth, and includes a laser control unit 90, a monitor module (not shown in FIG. 1), a chamber, and a narrowband module. , out-coupling mirrors, and other devices.
- a laser control unit 90 for example, an excimer laser device capable of narrowband oscillation with variable wavelength and spectral linewidth
- monitor module not shown in FIG. 1
- a chamber for example, a laser control unit 90, a monitor module (not shown in FIG. 1), a chamber, and a narrowband module. , out-coupling mirrors, and other devices.
- out-coupling mirrors and other devices.
- a control device functioning as each control unit such as the exposure control unit 50 and the laser control unit 90 can be realized by a combination of hardware and software of one or more computers.
- Software is synonymous with program.
- a programmable controller is included in the concept of a computer.
- a computer includes a CPU (Central Processing Unit) and a memory.
- a programmable controller is included in the concept of a computer. Also, part or all of the processing functions of the control device may be realized using an integrated circuit represented by FPGA (Field Programmable Gate Array) or ASIC (Application Specific Integrated Circuit).
- controllers may be connected to each other via a communication network such as a local area network or the Internet.
- program units may be stored in both local and remote memory storage devices.
- the exposure controller 50 outputs various target parameter values to the light source 16 .
- the target parameter values provided from exposure controller 50 to light source 16 include target wavelength ⁇ t, target spectral linewidth ⁇ t, target pulse energy Et, and other target parameter values.
- the laser control unit 90 adjusts the selected wavelength and wavelength bandwidth of the narrow-band module of the laser resonator, which will be described later, so that the output wavelength and spectral linewidth of the light source 16 become the target wavelength ⁇ t and the target spectral linewidth ⁇ t. , to control. Then, the laser control unit 90 outputs pulsed laser light in synchronization with the light emission trigger signal Tr, and outputs data measured by a monitor module, which will be described later, to the exposure control unit 50 and the light source management system 206 . Data measured by the monitor module include wavelength ⁇ , spectral linewidth ⁇ , pulse energy E, and the like.
- the exposure control unit 50 controls the reticle stage 76 and the wafer stage 81 while outputting the light emission trigger signal Tr by a step-and-scan method, which will be described later, on the resist-coated wafer WF, thereby displaying the image of the reticle 74 on the wafer WF.
- the resist is scanned and exposed.
- the exposure control unit 50 then outputs the exposure condition data to the exposure apparatus management system 204 .
- the exposure condition data includes, for example, the conditions (illumination pattern) of the illumination optical system 66, the dose (exposure amount), the focus (the distance between the projection optical system 78 and the wafer surface), and the conditions of the projection optical system 78 (for example, , NA) and
- the wafer inspection apparatus 12 develops the exposed wafer WF in a developing apparatus (not shown), and then detects physical characteristic values (e.g., CD value, overlay, magnification, surface height, etc.).
- the wafer inspection control unit 220 then outputs these measurement data to the wafer inspection apparatus management system 202 .
- FIG. 3 shows an example of an output pattern of the light emission trigger signal Tr output from the exposure controller 50 to the laser controller 90 .
- an actual exposure pattern is entered after adjustment exposure for each wafer WF.
- the light source 16 stops oscillating during the step period in the step-and-scan exposure, and outputs pulsed laser light according to the interval of the light emission trigger signal Tr during the scanning period.
- Such a laser oscillation pattern is called a burst operation pattern.
- FIG. 4 shows an example of an exposure pattern of step-and-scan exposure on the wafer WF.
- Each of the numerous rectangular areas shown within the wafer WF in FIG. 4 is a scan field SF.
- the scan field SF is an exposure area for one scan exposure and is also called a scan area.
- the wafer WF is divided into a plurality of exposure areas (scan fields SF) of a predetermined size, and the period between the start (Wafer START) and the end (Wafer END) of wafer exposure is Secondly, each exposure area is scanned and exposed.
- the first predetermined exposure area of the wafer WF is exposed by the first scan exposure (Scan#1), and then the second predetermined exposure area is exposed by the second scan exposure (Scan#2). ) is repeated.
- a plurality of pulsed laser beams can be continuously output from the laser device during one scanning exposure. This scan exposure is sequentially repeated, and after completing the scan exposure of the entire exposure area of the first wafer WF, the adjustment exposure is performed again, and then the wafer exposure of the second wafer WF is performed.
- Step-and-scan exposure is performed in the order of the dashed arrows shown in FIG. 4 from Wafer START ⁇ Scan #1 ⁇ Scan #2 ⁇ .
- the wafer WF is an example of a semiconductor substrate (photosensitive substrate) coated with a resist.
- FIG. 5 shows the relationship between one scan field SF on the wafer WF and the static exposure area SEA.
- the reticle 74 is irradiated with a rectangular laser beam having a substantially uniform light intensity distribution, and the reticle 74 and the wafer WF are aligned with the reduction magnification of the projection optical system 78 in the minor axis direction (Y-axis direction).
- the reticle pattern is exposed onto the scan field SF on the wafer WF by exposing while moving in different directions in the Y-axis direction accordingly.
- This example shows a case where the wafer stage 81 moves in the negative direction of the Y-axis and the scanning direction moves in the positive direction of the Y-axis during scanning exposure.
- the movement time of the next step may be shortened by combining the case where the wafer stage 81 moves in the positive direction of the Y axis and the scanning direction moves in the negative direction.
- N slit the number of pulses Ns of the pulsed laser light irradiated to the resist while performing scanning exposure.
- N slit the number of pulses Ns of the pulsed laser light irradiated to the resist while performing scanning exposure.
- FIG. 7 schematically shows the configuration of an exemplary light source 16 .
- the light source 16 is, for example, a KrF excimer laser device and includes a chamber 100, a band narrowing module (LNM) 102, an inverter 104, an output coupling mirror (OC) 106, a wavefront tuner 107, and a monitor module 108. , a charger 110 , a pulse power module (PPM) 112 , a gas supply device 114 , a gas exhaust device 116 and an exit shutter 118 .
- LNM band narrowing module
- OC output coupling mirror
- PPM pulse power module
- the chamber 100 includes a first window 121, a second window 122, a cross flow fan (CFF) 123, a motor 124 that rotates the CFF 123, a pair of electrodes 125 and 126, an electrical insulator 127, and a pressure sensor. 128 and a heat exchanger (not shown).
- CFF cross flow fan
- the inverter 104 is a power supply device for the motor 124 .
- Inverter 104 receives a command signal from laser controller 90 specifying the frequency of the power to be supplied to motor 124 .
- the frequency of the inverter 104 By controlling the frequency of the inverter 104, the rotational speed of the CFF 123 can be controlled.
- PPM 112 is connected to electrode 125 via a feedthrough in electrical insulator 127 of chamber 100 .
- PPM 112 includes a semiconductor switch 129, a charging capacitor, a pulse transformer, and a pulse compression circuit, all not shown.
- the LNM 102 includes a beam expander using a first prism 131 and a second prism 132, a rotating stage 134, and a grating 136.
- the first prism 131 and the second prism 132 are arranged to expand the light beam emitted from the second window 122 of the chamber 100 in the Y-axis direction and enter the grating 136 .
- the grating 136 is Littrow arranged so that the incident angle and the diffraction angle of the laser light match.
- the second prism 132 is arranged on the rotary stage 134 so that the angle of incidence of the laser light on the grating 136 and the angle of diffraction thereof change when the rotary stage 134 rotates.
- the OC 106 is a partially reflective mirror, arranged to form an optical resonator together with the LMN 102 .
- a chamber 100 is placed on the optical path of this optical resonator.
- a wavefront modulator 107 is arranged between the OC 106 and the chamber 100 .
- the wavefront modulator 107 includes a cylindrical concave lens 171 , a cylindrical convex lens 172 and a linear stage 174 .
- the radius of curvature of the wavefront viewed from the Z axis can be changed.
- the monitor module 108 includes a first beam splitter 141 and a second beam splitter 142, a pulse energy detector 144, and a spectrum detector 146.
- the first beam splitter 141 is arranged on the optical path of the laser light output from the OC 106 so that part of the laser light is reflected and enters the second beam splitter 142 .
- the pulse energy detector 144 is arranged so that the laser light that has passed through the second beam splitter 142 is incident thereon. Pulse energy detector 144 may be, for example, a photodiode that measures ultraviolet light intensity. A second beam splitter 142 is positioned such that a portion of the laser light is reflected onto a spectral detector 146 .
- the spectrum detector 146 may be, for example, an etalon spectroscope including an etalon and an image sensor.
- the monitor etalon spectroscope has a configuration capable of measuring interference fringes generated by the etalon with an image sensor. Then, based on the generated interference fringes, the center wavelength and spectral line width of the output pulsed laser beam are measured.
- the gas supply device 114 includes an inert gas supply source 152 that is an inert laser gas supply source and a halogen gas supply source 154 that is a halogen-containing laser gas supply source. Connected via piping.
- An inert laser gas is a mixed gas of Kr gas and Ne gas.
- the laser gas containing halogen is a mixed gas of F2 gas, Kr gas and Ne gas.
- the gas supply device 114 is connected to the chamber 100 via piping.
- the gas supply device 114 includes an automatic valve and a mass flow controller (not shown) for supplying a predetermined amount of inert laser gas or halogen-containing laser gas to the chamber 100 .
- the gas exhaust device 116 is connected to the chamber 100 via piping.
- the gas exhaust device 116 includes a halogen filter and an exhaust pump (not shown) for removing halogen, and is configured to exhaust the halogen-removed laser gas to the outside.
- the exit shutter 118 is arranged on the optical path of the laser light output from the light source 16 to the outside, and has a configuration capable of outputting the laser light to the outside and blocking the light.
- the light source 16 is arranged so that the laser light output from the light source 16 through the exit shutter 118 enters the exposure device 14 .
- the laser control unit 90 After exhausting the gas present in the chamber 100 through the gas exhaust device 116, the laser control unit 90 causes the mixed gas of Kr and Ne and the mixed gas of F2, Kr, and Ne to be mixed through the gas supply device 114. Gases are charged into the chamber 100 to the desired gas composition and total gas pressure.
- the laser control unit 90 rotates the motor 124 at a predetermined number of revolutions via the inverter 104 to rotate the CFF 123 . As a result, the laser gas flows between the electrodes 125,126.
- the laser control unit 90 receives the target pulse energy Et from the exposure control unit 50 of the exposure device 14, and outputs data of the charging voltage V to the charger 110 so that the pulse energy becomes Et.
- the charger 110 charges the charging capacitor of the PPM 112 to the charging voltage V.
- the trigger signal Tr2 is input to the semiconductor switch 129 of the PPM 112 from the laser controller 90 in synchronization with the light emission trigger signal Tr1.
- the semiconductor switch 129 operates, the current pulse is compressed by the magnetic compression circuit of the PPM 112 and a high voltage is applied between the electrodes 125 and 126 according to the charging voltage V. FIG. As a result, a discharge is generated between the electrodes 125 and 126 to excite the laser gas in the discharge space.
- excimer light which is ultraviolet light
- This excimer light oscillates by going back and forth between the OC 106 and the LMN 102 and being amplified.
- narrow-band pulsed laser light is output from the OC 106 .
- a pulsed laser beam output from the OC 104 enters the monitor module 108 .
- a part of the laser light is sampled by the first beam splitter 141 in the monitor module 108 and enters the second beam splitter 142 .
- the second beam splitter 142 transmits part of the incident laser beam to enter the pulse energy detector 144 and reflects another part of the laser beam to enter the spectrum detector 146 .
- the pulse energy E of the pulse laser light output from the light source 16 is measured by the pulse energy detector 144 , and data of the measured pulse energy E is output from the pulse energy detector 144 to the laser controller 90 .
- the spectrum detector 146 measures the center wavelength ⁇ and the spectral line width ⁇ , and outputs data of the measured center wavelength ⁇ and the spectral line width ⁇ from the spectrum detector 146 to the laser controller 90 .
- the laser control unit 90 receives the target pulse energy Et, target wavelength ⁇ t, and target spectral linewidth ⁇ t from the exposure device 14 .
- the laser controller 90 controls the pulse energy based on the pulse energy E measured by the pulse energy detector 144 and the target pulse energy Et.
- the laser control unit 90 performs wavelength control and spectral line width control based on the center wavelength ⁇ and the target wavelength ⁇ t measured by the spectrum detector 146 .
- the laser control unit 90 receives the target pulse energy Et, the target wavelength ⁇ t, and the target spectral line width ⁇ t from the exposure device 14, and every time the light emission trigger signal Tr1 is input, A pulsed laser beam is output from the light source 16 in synchronization.
- the laser control unit 90 performs the following gas control ([1] to [4]) in order to suppress these adverse effects.
- Halogen injection control refers to reducing the amount of halogen gas consumed mainly by discharge in the chamber 100 during laser oscillation to a gas containing a halogen gas at a higher concentration than the halogen gas in the chamber 100. is a gas control that replenishes the halogen gas by injecting .
- the laser control unit 90 controls the halogen partial pressure in the chamber 100 to be the target halogen partial pressure Hgct.
- the target halogen partial pressure Hgct is one of the operational control target parameters of the light source 16 .
- Partial Gas exchange control refers to a gas that partially exchanges the laser gas in the chamber 100 with new laser gas so as to suppress an increase in the impurity gas concentration in the chamber 100 during laser oscillation. Control.
- Gas pressure control is defined as a laser gas that is injected into the chamber 100 when it is difficult to control the pulse energy of the pulsed laser light output from the light source 16 within the control range of the charging voltage V. is a gas control that controls the pulse energy by varying the total gas pressure P of .
- the upper limit value (HVULt) and lower limit value (HVLLt) of the control range of charging voltage V are one of the operation control target parameters of light source 16 .
- gas consumption Gw is defined.
- the gas consumption Gw is defined as the laser gas consumption per unit pulse number.
- the target gas consumption Gwt is one of the operation control target parameters of the light source 16, and the light source 16 is controlled so that the gas consumption per unit pulse number is Gwt.
- the laser controller 90 controls the gas exhaust device .
- Halogen gas is removed from the laser gas exhausted from the chamber 100 by a halogen filter (not shown), and the laser gas is exhausted to the outside of the light source 16 .
- the laser control unit 90 receives data of these parameter values including the number of oscillation pulses, the charging voltage V, the gas pressure P in the chamber 100, the pulse energy E of the laser light, the wavelength ⁇ , and the spectral line width ⁇ . are output to the exposure apparatus 14 and the light source management system 206 .
- FIG. 7 shows an example of a narrow band KrF excimer laser device as the light source 16, but the light source 16 is not limited to this example and may be a narrow band ArF excimer laser device.
- the present invention is not limited to this example. and an amplifier for performing the laser device.
- the master oscillator In a laser device including a master oscillator and an amplifier, the master oscillator outputs narrow-band laser light in the amplifiable wavelength range of an ArF laser or KrF laser, which is a combination of a solid-state laser and a nonlinear crystal. It may be a solid-state laser device.
- the light source is designed to guarantee operation within the range of specifications determined as a product.
- FIG. 8 shows the configuration of a semiconductor manufacturing system 300 according to the first embodiment. The points of the configuration of FIG. 8 that are different from those of FIG. 1 will be described.
- a semiconductor manufacturing system 300 shown in FIG. 8 has a configuration in which a data analysis server 310 and a light source parameter management server 320 are added to the configuration of the semiconductor manufacturing system 200 shown in FIG.
- the data analysis server 310 and the light source parameter management server 320 are connected to the network 210 .
- Each of the data analysis server 310 and the light source parameter management server 320 includes a processor (not shown) and a storage device storing programs.
- a storage device is a tangible non-transitory computer-readable medium, and includes, for example, a memory as a main storage device and a storage as an auxiliary storage device.
- the computer-readable medium may be, for example, a semiconductor memory, a Hard Disk Drive (HDD) device, or a Solid State Drive (SSD) device, or a combination thereof.
- the processor includes a CPU and executes various processes by executing program instructions.
- a processor may be a combination of a CPU and a GPU (Graphics Processing Unit), and may include an integrated circuit such as a Programmable Logic Device (PLD).
- PLD Programmable Logic Device
- FIG. 9 is a block diagram showing the overall processing flow of the semiconductor manufacturing system 300. As shown in FIG. The data analysis server 310 executes the following steps (A-1 to A-5).
- Step A-1 The data analysis server 310 stores the data of the wafer inspection apparatus management system 202, the data of the exposure apparatus management system 204, the data of the light source management system 206, the factory tracking data 207, are linked to each lithography system, each wafer, and each scan, and the respective data are organized and saved.
- Tracking data 207 includes, for example, data tracking the yield of chips within a wafer.
- Step A-2 The data analysis server 310 analyzes the parameter information of the lithography system #k organized and saved in step A-1.
- the analysis method in the data analysis server 310 for example, the method described in Patent Document 4 may be applied.
- Step A-3 The data analysis server 310 extracts the parameters of the light source #k that greatly affect the exposure performance parameters from the analysis results of step A-2.
- Step A-4 The data analysis server 310 obtains priority target parameter information for the light source #k based on the relationship between the parameters of the light source #k and the exposure performance parameters extracted in step A-3.
- Step A-5 The data analysis server 310 outputs the priority target parameter information of the light source #k obtained in step A-4 to the semiconductor factory management system 208.
- the semiconductor factory management system 208 executes the following steps (B-1, B-2).
- Step B-1 The semiconductor factory management system 208 receives priority target parameter information for light source #k and management information 209 for other semiconductor factories.
- Other semiconductor factory management information 209 is, for example, data including semiconductor factory processes, semiconductor yields, factory line schedules, and semiconductor manufacturing costs.
- Step B-2 The semiconductor factory management system 208 outputs the priority target parameter information of the light source #k to the light source parameter management server 320 based on the acquired priority target parameter information and other semiconductor factory management information. do.
- the light source parameter management server 320 executes the following steps (C-1 to C-3).
- Step C-1 The light source parameter management server 320 receives priority target parameter information from the semiconductor factory management system 208 .
- Step C-2 The light source parameter management server 320 estimates the light source maintenance information when the priority target parameter information is set.
- Step C-3 The light source parameter management server 320 outputs maintenance information to the semiconductor factory management system 208 .
- the semiconductor factory management system 208 further executes the following steps (B-4, B-5).
- Step B-4 The semiconductor factory management system 208 receives maintenance information for light source #k.
- Step B-5 The semiconductor factory management system 208 determines whether or not to permit operation of the light source #k (OK/NOK) based on the other semiconductor factory management information 209 and the maintenance information of the light source #k. The result is output to the light source parameter management server 320 .
- the semiconductor factory management system 208 outputs an OK signal when permitting the operation of the light source #k (when judging OK), and outputs a NOK signal when not permitting the operation of the light source #k (when judging NOK). .
- the light source parameter management server 320 further executes the following steps (C-4 to C-6).
- Step C-4 When an OK determination permitting operation of light source #k is obtained, light source parameter management server 320 outputs priority target parameter information to light source #k via light source management system 206 . As a result, the priority target parameter information is set for the light source #k, and the operation of the light source #k is controlled based on the priority target parameter information.
- Step C-5 Further, when an OK determination is obtained, the light source parameter management server 320 estimates, from the operation data of the light source #k, maintenance information when operating while satisfying the priority target parameter information, and estimates it. It outputs maintenance information to the semiconductor factory management system 208 .
- Step C-6 On the other hand, when a NOK determination is obtained that the operation of the light source #k is not permitted, the light source parameter management server 320 instructs the light source #k to stop operation via the light source management system 206. Outputs a signal (operation stop signal). As a result, light source #k stops operating.
- FIG. 10 is a flow chart showing an example of processing contents in the data analysis server 310 .
- the processing of the steps shown in FIG. 10 is implemented by the processor included in the data analysis server 310 executing program instructions.
- step S11 the data analysis server 310 acquires various data from the wafer inspection apparatus management system 202, the exposure apparatus management system 204, the light source management system 206, etc.
- the wafer inspection data, the light source data, and the exposure apparatus data are arranged and stored for each scan of each wafer in k.
- step S12 the data analysis server 310 analyzes the correlation between each parameter of the light source #k and each parameter of the exposure performance of the exposure apparatus #k.
- step S13 the data analysis server 310 selects light source parameters that are highly correlated with exposure performance parameters.
- step S14 the data analysis server 310 calculates a regression curve of the parameters of the light source #k selected to have a high correlation with the exposure performance parameters of the exposure apparatus #k.
- step S15 the data analysis server 310 calculates, from the calculated regression curve, the target value and the range of the parameters of the light source #k where the parameter values of the exposure performance are within the allowable range (see FIG. 11).
- step S16 the data analysis server 310 outputs the target parameter value of the light source and its range as priority target parameter information for the light source #k.
- the data analysis server 310 terminates the flowchart of FIG. 10 after step S16.
- FIG. 11 is a graph showing a method of obtaining the target value and range of the light source parameter from the regression curve.
- the horizontal axis of FIG. 11 represents the exposure performance parameter value R, and the vertical axis represents the light source parameter value L.
- a regression curve RC is a regression curve of the light source parameters of the light source #k selected to have a high correlation with the exposure performance parameters of the exposure apparatus #k.
- the target value Lt of the light source parameter and its allowable range are indicated from the regression curve RC. Allowable lower limit value Lmin and allowable upper limit value Lmax can be obtained.
- a set of data including the light source parameter target value Lt, the allowable lower limit value Lmin, and the allowable upper limit value Lmax thus obtained can be the priority target parameter information of the light source.
- FIGS. 12 and 13 are flowcharts showing an example of processing contents in the light source parameter management server 320.
- the processing of the steps shown in FIGS. 12 and 13 is implemented by the processor included in the light source parameter management server 320 executing program instructions.
- the light source parameter management server 320 acquires the priority target parameter information of light source #k in step S20.
- the priority target parameter information of the light source #k acquired by the light source parameter management server 320 is not limited to one item of target parameters. may
- step S22 the light source parameter management server 320 estimates the maintenance information of the light source #k when the light source #k is set as the priority target parameter information.
- the subroutine of step S22 will be described later (FIG. 14).
- step S ⁇ b>23 the light source parameter management server 320 outputs the estimated maintenance information for the light source #k to the semiconductor factory management system 208 .
- step S24 the light source parameter management server 320 determines which of the operation OK or operation NOK signal has been received from the semiconductor factory management system 208.
- the light source parameter management server 320 proceeds to step S25.
- step S25 the light source parameter management server 320 outputs an operation stop signal for light source #k.
- maintenance of the light source #k is performed based on the maintenance information output in step S23.
- the light source parameter management server 320 terminates the flowchart of FIG. 12 after step S25.
- step S24 if the light source parameter management server 320 receives the operation OK signal from the semiconductor factory management system 208 in the determination of step S24, the light source parameter management server 320 proceeds to step S26.
- step S26 the light source parameter management server 320 outputs priority target parameter information to light source #k.
- step S26 the light source parameter management server 320 proceeds to step S27 in FIG.
- step S27 the light source parameter management server 320 outputs an operation signal for light source #k.
- step S28 the light source parameter management server 320 acquires the operation data of light source #k.
- step S29 the light source parameter management server 320 estimates maintenance information when setting priority target parameter information from the operation data of light source #k.
- the subroutine of step S29 will be described later (FIG. 15).
- step S ⁇ b>30 the light source parameter management server 320 outputs the maintenance information estimated for the light source #k to the semiconductor factory management system 208 .
- step S ⁇ b>31 the light source parameter management server 320 determines whether or not a light source operation stop signal has been received from the semiconductor factory management system 208 . If the determination result in step S31 is No, the light source parameter management server 320 returns to step S28.
- step S31 the determination result in step S31 is Yes, the light source parameter management server 320 proceeds to step S32.
- step S32 the light source parameter management server 320 outputs an operation stop signal for the light source #k. In the semiconductor factory, maintenance of the light source #k is carried out based on the maintenance information. The light source parameter management server 320 terminates the flowchart of FIG. 12 after step S32.
- FIG. 14 is a flow chart showing an example of a subroutine applied to step S22 of FIG. 14 starts, the light source parameter management server 320 outputs priority target parameter information to the light source #k in step S41.
- step S42 the light source parameter management server 320 outputs an adjustment operation signal for light source #k.
- the light source #k starts adjusted operation and outputs various data (adjusted operation data) obtained by performing the adjusted operation to the light source parameter management server 320 .
- step S43 the light source parameter management server 320 acquires the adjusted operation data of light source #k.
- step S44 the light source parameter management server 320 performs a process of estimating maintenance information when setting priority target parameter information from the operation data of light source #k.
- the "operating data of light source #k” in this case is the "adjusted operating data of light source #k" acquired in step S43.
- the subroutine of the process applied to step S44 may be common to the subroutine applied to step S29 of FIG.
- step S44 the light source parameter management server 320 returns to the flowchart of FIG.
- FIG. 15 is a flow chart showing an example of a subroutine applied to step S29 of FIG. 13 and step S44 of FIG.
- the light source parameter management server 320 acquires the operation data of light source #k in step S51.
- the light source parameter management server 320 calls a learning model used in the process of estimating the degree of deterioration of consumables.
- This learning model is a pre-trained machine consisting of a neural network created by performing machine learning using supervised learning data so that the operation data of the light source is input and the degree of deterioration of consumables is output. It may be a learning model (inference model).
- Patent Document 1 discloses a method of creating a learning model for estimating the degree of deterioration of consumables from operating data of the light source and a method of calculating the number of pulses from the degree of deterioration output as the inference result of the learning model to maintenance. You can adopt the technology that is used.
- Patent Document 1 describes the following method. That is, a machine learning method for creating a learning model for predicting the life of consumables of a laser device, which corresponds to different oscillation pulse numbers during the period from the start of use of the consumables to the replacement of the consumables. obtaining first life-related information including data of life-related parameters of the consumables recorded by means of the first life-related information; by creating training data that associates the first life-related information with a level representing the degree of deterioration, and performing machine learning using the training data, so that the life-related parameter data is used to determine the number of consumables A machine learning method including creating a learning model for predicting the degree of deterioration and storing the created learning model.
- Patent Document 1 describes a learning model storage unit that stores a learning model created by implementing the above-described machine learning method, and a request signal for life prediction processing for a consumable to be replaced in a laser device. and an information acquisition unit that acquires current second life-related information about the consumable to be replaced, and based on the learning model of the consumable to be replaced and the second life-related information,
- a laser device including a life prediction unit that calculates the life and remaining life of consumables, and an information output unit that notifies an external device of information on the calculated life and remaining life of consumables to be replaced.
- a consumables management device is described.
- the light source parameter management server 320 may have the same functions as the consumables management device described in Patent Document 1.
- step S53 the light source parameter management server 320 inputs the operating data of the light source #k into the learning model to estimate the degree of deterioration.
- step S54 the light source parameter management server 320 calculates the remaining number of pulses from the estimated degree of deterioration to maintenance of each consumable.
- step S55 the light source parameter management server 320 outputs the remaining number of pulses until maintenance as maintenance information. After step S55, the light source parameter management server 320 returns to the flow charts shown in FIGS.
- the learning model used in the flowchart of FIG. 15 is created based on supervised learning data for each mode when the maintenance life of consumables differs depending on the priority target parameter information described later. be. Then, the light source parameter management server 320 may call a learning model corresponding to each priority target parameter.
- the light source parameter management server 320 is an example of a "light source parameter information management device" in the present disclosure.
- a method including steps executed by the light source parameter management server 320 is an example of a “light source parameter information management method” in the present disclosure.
- the data analysis server 310 is used to derive optimal priority target parameter information for the exposure process of the lithography system #k, and this priority target parameter information is sent to the light source #k.
- this priority target parameter information is sent to the light source #k.
- Embodiment 1 it is possible for individual users or semiconductor processes to operate the light source so as to maintain specific target parameter information that is of particular importance.
- the yield of semiconductor manufacturing can be improved, and costs can be improved. Also, optimum exposure for the semiconductor process becomes possible.
- the data analysis server 310 and the light source parameter management server 320 are described for each function. These two functions may be implemented. Also, the functions of both servers may be shared by the light source management system 206 or the exposure apparatus management system 204 . Also, the function of the data analysis server 310 may be provided to the exposure apparatus management system 204 , the light source parameter management server 320 , or the light source management system 206 .
- the output result of the data analysis server 310 or the light source parameter management server 320 may be output to a display device or the like (not shown) and displayed so that the operator can understand it.
- the priority target parameter information may be output to the exposure apparatus #k via the exposure apparatus management system 204 . Then, the priority target parameter information may be transmitted from the exposure apparatus #k to the light source #k to control the light source #k.
- FIG. 16 is a block diagram showing the overall processing flow of the semiconductor manufacturing system according to the second embodiment.
- the system configuration of the second embodiment may be the same as the configuration of the first embodiment (FIG. 8).
- FIG. 16 shows an example of outputting recommended target parameter information necessary for setting priority target parameter information in addition to the flow of FIG.
- the light source parameter management server 320 estimates and outputs maintenance information and recommended target parameter information to an external device when setting priority target parameter information for light source #k.
- the recommended target parameter information includes, for example, at least one of target spectral characteristic parameter information, target output characteristic parameter information, and target consumption parameter information.
- the recommended target parameter information for light source #k is output to data analysis server 310 via semiconductor factory management system 208 .
- the data analysis server 310 analyzes the correlation between the recommended target parameter and the exposure performance parameter, determines whether the operation is OK/NOK when the recommended target parameter information is set to the light source #k, and outputs the determination result. Output to the semiconductor factory management system 208 .
- the semiconductor factory management system 208 determines OK/NOK of the operation of the light source #k based on the maintenance information, the recommended target parameter information, and other semiconductor factory management information 209 .
- priority target parameter information and recommended target parameter information are set for light source #k via light source management system 206, and light source #k is set so as to satisfy these target parameter information. is controlled.
- FIG. 17 is a flowchart showing a confirmation flow of recommended target parameter information in the data analysis server 310 of the second embodiment.
- the semiconductor factory management system 208 sends the recommended target parameter information to the data analysis server 310 in determining whether or not to adopt the received recommended target parameter information, and causes the data analysis server 310 to confirm the propriety of the recommended target parameter information. receive results.
- the data analysis server 310 receives the recommended target parameter information of the light source #k in step S60.
- step S62 the data analysis server 310 analyzes the relationship between the value range of each parameter in the recommended target parameter information of the light source #k and the value range of the exposure performance parameter.
- step S63 the data analysis server 310 determines whether the parameter value of the exposure performance is within the allowable range in the range of each parameter value of the recommended target parameter information (see FIG. 18).
- step S63 the data analysis server 310 proceeds to step S64.
- step S64 the data analysis server 310 outputs an OK signal indicating that the recommended target parameter information is appropriate (OK).
- step S63 determines whether the recommendation result of step S63 is Yes. If the determination result of step S63 is No, the data analysis server 310 proceeds to step S65. In step S65, the data analysis server 310 outputs an NG signal indicating that the recommended target parameter information is inappropriate (NG).
- step S64 or step S65 the data analysis server 310 ends the flowchart of FIG.
- FIG. 18 is a graph showing an analysis example of the relationship between recommended target parameters and exposure performance parameters.
- the horizontal axis of FIG. 18 represents recommended target parameters, and the vertical axis represents exposure performance parameters.
- the relationship between exposure performance parameter values and recommended target parameter values is obtained.
- the lower limit value and the upper limit value indicating the allowable range of the exposure performance parameter value are specified, it is possible to determine whether the corresponding exposure performance parameter value is within the allowable range within the recommended target parameter value range. .
- FIGS. 19 and 20 are flowcharts showing an example of processing contents in the light source parameter management server 320 of the second embodiment. 19 and 20 are obtained by changing steps S22, S23, S26, S29 and S30 in the flowcharts of FIGS. 12 and 13 to steps S72, S73, S76, S79 and S80, respectively. Steps S70, S74, S75, S77, S78, S81 and S82 in FIG. 13 are the same as steps S20, S24, S25, S27, S28, S31 and S32 in the flow charts in FIGS. omit the description.
- step S72 the light source parameter management server 320 estimates the maintenance information and the recommended target parameter information of the light source #k when the light source #k is set as the priority target parameter information.
- the subroutine of step S72 will be described later (FIG. 21).
- step S ⁇ b>73 the light source parameter management server 320 outputs the estimated maintenance information of the light source #k and the recommended target parameter information to the semiconductor factory management system 208 .
- step S74 if the light source parameter management server 320 receives an OK signal permitting operation from the semiconductor factory management system 208, the light source parameter management server 320 proceeds to step S76.
- step S76 the light source parameter management server 320 outputs priority target parameter information and recommended target parameter information to light source #k. After step S76, the light source parameter management server 320 proceeds to step S77 in FIG.
- the light source parameter management server 320 After acquiring the operation data of the light source #k in step S78, the light source parameter management server 320 acquires the maintenance information and the recommended target parameter information in the case of setting the priority target parameter information from the operation data of the light source #k in step S79. and estimate The subroutine of step S79 will be described later (FIG. 22).
- step S80 the light source parameter management server 320 outputs the maintenance information estimated for the light source #k and the recommended target parameter information to the semiconductor factory management system 208.
- steps S81 and S82 are the same as steps S31 and S32.
- FIG. 21 is a flow chart showing an example of a subroutine applied to step S72 of FIG. Steps S91, S92, and S93 in the flowchart of FIG. 21 are the same as steps S41, S42, and S43 in the flowchart of FIG. 14, respectively, so overlapping descriptions are omitted.
- step S44 of FIG. 14 is changed to step S94.
- step S94 the light source parameter management server 320 performs a process of estimating maintenance information and recommended target parameter information when setting priority target parameter information from the operation data of light source #k.
- the "operating data of light source #k” in this case is the "adjusted operating data of light source #k” obtained in step S93.
- the subroutine of the processing applied to step S94 may be common to the subroutine applied to step S79 of FIG.
- FIG. 22 is a flow chart showing an example of a subroutine applied to step S79 of FIG. 20 and step S94 of FIG. Steps S101, S102, S103, S104 and S105 in the flowchart of FIG. 22 are the same as steps S51, S52, S53, S54 and S55 in the flowchart of FIG.
- the flowchart of FIG. 22 has steps S106 and S107 added after step S55 of FIG.
- step S106 the light source parameter management server 320 obtains the performance parameter value range of each light source from the operating data of the light source #k, and estimates recommended target parameter information.
- the subroutine of step S106 will be described later (FIG. 23).
- step S107 the light source parameter management server 320 outputs recommended target parameter information estimated for light source #k.
- step S107 the light source parameter management server 320 returns to the flow charts shown in FIGS.
- FIG. 23 is a flow chart showing an example of a subroutine applied to step S106 of FIG.
- the light source parameter management server 320 acquires the operating data of the light source #k.
- the light source parameter management server 320 calculates the average value Pav of each performance parameter value and its standard deviation value P ⁇ from the operating data of the light source #k.
- Each performance parameter value is the value of each parameter that expresses the performance of the pulsed laser beam. For example, there are pulse energy E and its stability E ⁇ , spectral line width ⁇ and its stability ⁇ , and the like.
- step S123 the light source parameter management server 320 multiplies the standard deviation value P ⁇ of each performance parameter by the safety factor K.
- the safety factor K may be a value in the range of 3-5, for example. When the safety factor K is 3, the range of values is ⁇ 3 ⁇ with respect to the average value.
- step S124 the light source parameter management server 320 outputs the average value Pav of each performance parameter value and its range K ⁇ P ⁇ as recommended target parameter information.
- step S124 the light source parameter management server 320 ends the flowchart in FIG. 23 and returns to the flowchart in FIG.
- ⁇ K ⁇ P ⁇ is used as an example of the expression of the performance parameter value range, but this is not restrictive, and ⁇ K ⁇ (P ⁇ /Pav) ⁇ 100(%) may also be used. .
- the semiconductor factory management system 208 can comprehensively consider these pieces of information and determine whether the operation of the light source #k is OK or NOK.
- the second embodiment it is possible to present recommended target parameter information requiring specification relaxation, confirm OK/NOK of the operation, and perform exposure, thereby suppressing a decrease in the yield of the exposure process.
- the light source #k can be operated by setting it to the recommended target parameter information that can be relaxed. An increase in gas consumption can be suppressed.
- the semiconductor factory management system 208 determines OK/NOK based on the management information 209 of other semiconductor factories. , the recommended target parameter information is output, and the exposure apparatus management system 204 determines OK/NOK of exposure execution as the exposure apparatus #k, and the semiconductor factory management system 208 receives the determination result. Factory management system 208 may make an overall OK/NOK decision.
- Embodiment 3 8.1 Configuration
- the system configuration and overall flow of the third embodiment may be the same as those of the second embodiment.
- the third embodiment differs from the second embodiment in that the light source parameter management server 320 changes (resets) the operation control target parameter value of the light source #k based on the priority target parameter information of the light source #k.
- a default operation control parameter value is set for the light source #k, and when the priority target parameter information is specified, the parameter value related to this is reset.
- FIG. 24 is a flow chart showing an example of processing contents in the light source parameter management server 320 of the third embodiment.
- steps common to those in FIG. 19 are denoted by the same step numbers, and overlapping descriptions are omitted.
- the flowchart shown in FIG. 24 includes step S71 between steps S70 and S72 in FIG.
- step S71 the light source parameter management server 320 resets the operation control target parameter value of the light source #k based on the priority target parameter information of the light source #k.
- Other steps may be the same as in FIG.
- the flowchart after step S76 may be the same as that of FIG.
- FIG. 25 is a flow chart showing an example of a subroutine applied to step S71 of FIG.
- the light source parameter management server 320 selects the operation control target parameters for the light source #k based on the priority target parameter information.
- step S132 the light source parameter management server 320 retrieves data on the relationship between the priority target parameter and the operation control target parameter of light source #k.
- the light source parameter management server 320 stores data such as table data or approximate curves indicating the relationship between the priority target parameter and the operation control target parameter of the light source #k, and calls this relationship data.
- step S133 the light source parameter management server 320 obtains the operation control target parameter value Po for approaching the priority target parameter value Pt from the called data (see FIG. 26).
- step S134 the light source parameter management server 320 outputs the operation control target parameter value Po to the light source #k. After step S134, the light source parameter management server 320 returns to the flow chart of FIG.
- FIG. 26 is an example of a graph showing the relationship between priority target parameters and operation control parameters.
- the light source parameter management server 320 calls the data indicating the relationship as shown in FIG. 26 in step S132 of FIG. Then, in step S133, as shown in FIG. 26, an operation control target parameter value Po corresponding to the priority target parameter value Pt is obtained.
- Embodiment 4 9.1 Configuration The fourth embodiment is a more specific example of the third embodiment.
- the system configuration and overall flow of the fourth embodiment may be the same as those of the first embodiment.
- Embodiment 4 exemplifies the case of operating in each of the optical performance priority mode, consumables life extension mode, and consumption reduction mode.
- optical performance priority mode operation for example, when giving priority to spectral linewidth performance, when giving priority to pulse energy (output) performance, or when giving priority to energy stability performance
- optical performance priority mode operation for example, when giving priority to spectral linewidth performance, when giving priority to pulse energy (output) performance, or when giving priority to energy stability performance
- performance to be emphasized A specific example of the operation when operation in such a mode giving priority to specific optical performance is requested is shown below.
- FIG. 27 is a flow chart showing an example of processing contents in the data analysis server 310 of the fourth embodiment.
- Step S141 is the same as step S11 in FIG.
- step S142 the data analysis server 310 analyzes the correlation between the spectral linewidth ⁇ of the light source #k and the CD-related parameters of the resist pattern formed by the exposure apparatus #k.
- step S144 the data analysis server 310 calculates a regression curve between the spectral line width ⁇ of the light source #k and the CD of the resist pattern formed by the exposure apparatus #k.
- step S145 the data analysis server 310 calculates, from the calculated regression curve, the target value and range of the spectral line width ⁇ of the light source #k in which the parameter CD value is within the allowable range.
- step S146 the data analysis server 310 outputs the calculated target spectral linewidth ⁇ tp of the light source #k and its range ( ⁇ tp ⁇ tp) as priority target parameter information of the light source #k.
- the target spectral linewidth ⁇ tp and its range ( ⁇ tp ⁇ tp) are examples of “spectral linewidth parameter information” in the present disclosure.
- step S146 the flowchart of FIG. 27 ends.
- FIG. 28 is a graph showing an example of a method of obtaining the target spectral linewidth ⁇ t and its range using a regression curve.
- the horizontal axis of FIG. 28 represents the CD, and the vertical axis represents the spectral linewidth ⁇ of the light source.
- a regression curve RC2 is a curve showing the correlation between the CD and the spectral line width ⁇ .
- the target spectral line width ⁇ t which is the target value of the spectral line width ⁇ of the light source, and its allowable range are obtained from the regression curve RC.
- An allowable lower limit value ⁇ t ⁇ t and an allowable upper limit value ⁇ t+ ⁇ t indicating the range can be obtained.
- a set of data including the target spectral linewidth ⁇ t and its range ( ⁇ t ⁇ t) thus obtained can be the target spectral linewidth ⁇ tp and its range ( ⁇ tp ⁇ tp) as priority target parameter information of the light source.
- FIG. 29 is a flowchart showing an example in which the flowchart of FIG. 25 is applied when the spectral line width ⁇ is the priority target parameter.
- the flowchart of FIG. 29 is applied as the subroutine of step S71 of FIG.
- step S ⁇ b>151 the light source parameter management server 320 retrieves data on the relationship between the spectral line width ⁇ and the lens spacing LD of the wavefront modulator 107 .
- a lens distance LD is the distance between the concave lens 171 and the convex lens 172 that constitute the wavefront modulator 107 .
- step S154 the light source parameter management server 320 outputs the spectral linewidth ⁇ tp to light source #k as priority target parameter information.
- the light source parameter management server 320 may also output the spectral linewidth ⁇ tp as the priority target parameter information to the exposure apparatus #k.
- the light source parameter management server 320 returns to the flow chart of FIG.
- FIG. 30 is an example of a graph showing the relationship between the spectral linewidth ⁇ and the lens spacing LD of the wavefront tuner 107.
- FIG. The horizontal axis of FIG. 30 represents the spectral line width ⁇ , and the vertical axis represents the lens spacing LD.
- the lens spacing Ct corresponding to the target spectral linewidth ⁇ t can be obtained.
- the spectral line width matched to the exposure process is narrow, and it is possible to operate the light source with a limited range, thereby improving the yield due to the exposure process of the critical layer.
- the maintenance information for consumables may be estimated based on operation data obtained by performing adjusted oscillation with priority target parameter information set to light source #k.
- step S154 outputs data to light source #k
- data may be output to exposure device #k.
- these data may be output from exposure apparatus #k to light source #k as priority target parameter values.
- pulse energy is a priority target parameter 9.2.2.1 Example where obtaining high pulse energy is given priority and exposure can be performed by widening spectral line width ⁇ Light source #k If the step of the exposure process is a rough layer or if a resist pattern is formed on a stepped substrate that requires a deep depth of focus, exposure must be performed under the following conditions (Condition A and Condition B). be.
- Exposure is performed with a wide spectral line width ⁇ in order to deepen the depth of focus.
- Condition B Furthermore, when exposing a resist with low resist sensitivity or a thick film resist, the pulse energy of the light source #k is set high in order to maintain the throughput.
- the priority target parameter is pulse energy
- the target value Etp is set to a high pulse energy value
- the recommended target parameter is spectral line width
- the target value ⁇ tr An example of the processing flow in the light source parameter management server 320 when operating the light source #k by setting a wide spectral linewidth value to is shown.
- FIG. 31 is a flowchart showing an example in which the flowchart of FIG. 25 is applied to a mode in which high pulse energy is prioritized.
- the flowchart of FIG. 31 is applied as the subroutine of step S71 of FIG.
- step S161 the light source parameter management server 320 sets the pulse energy target value Etp of the priority target parameter.
- step S ⁇ b>162 the light source parameter management server 320 calls the relationship data between the pulse energy E and the lens spacing LD of the wavefront modulator 107 .
- step S165 the light source parameter management server 320 calls the relationship data between the pulse energy E and the spectral line width ⁇ .
- step S166 the light source parameter management server 320 uses the retrieved relational data to obtain the spectral line width ⁇ tr at which the pulse energy E, which is the priority target parameter, becomes the target value Etp (see FIG. 33).
- ⁇ tr is the target value of the recommended target spectral linewidth.
- step S167 the light source parameter management server 320 registers the spectral linewidth ⁇ as recommended target parameter information.
- step S168 the light source parameter management server 320 outputs the target spectral linewidth ⁇ tr as the operation control target parameter value to the light source #k.
- step S169 the light source parameter management server 320 outputs the target pulse energy Etp as the priority target parameter value to the light source #k.
- the light source parameter management server 320 may also output at least one of the target spectral linewidth ⁇ tr and the target pulse energy Etp to the exposure apparatus #k.
- step S169 the light source parameter management server 320 returns to the flowchart of FIG.
- FIG. 32 is an example of a graph showing the relationship between the pulse energy E and the lens spacing LD of the wavefront modulator 107.
- FIG. The horizontal axis of FIG. 32 represents the pulse energy E, and the vertical axis represents the lens interval LD.
- the lens spacing Ct corresponding to the target pulse energy value Etp can be obtained.
- FIG. 33 is an example of a graph showing the relationship between pulse energy E and spectral line width ⁇ .
- the horizontal axis of FIG. 33 represents the pulse energy E, and the vertical axis represents the spectral line width ⁇ .
- a target spectral linewidth ⁇ tr corresponding to the target pulse energy value Etp can be obtained using the relational data shown in FIG.
- the spectral line width ⁇ is widened. becomes possible.
- the spectral linewidth is widened as a means of increasing the target pulse energy, so it is possible to suppress the decrease in the number of remaining pulses until maintenance of consumables and the increase in gas consumption.
- step S168 and S168 output the operation control target parameter value and the priority target parameter value to light source #k, but exposure These pieces of information may be output to device #k. During actual exposure, these target parameter values may be output from exposure apparatus #k to light source #k.
- This example shows an example of changing the lens spacing LD of the wavefront modulator 107 to change the spectral linewidth ⁇ .
- the spectral linewidth ⁇ may be widened to give some margin to the pulse energy.
- FIG. is the pulse energy, a high pulse energy value is set as the target value Etp, and the range of the pulse energy stability parameter can be relaxed. If the pulse energy E is a priority target parameter and exposure can be performed with relaxed specifications for pulse energy stability, the flowchart in FIG. 34 can be applied instead of the flowchart in FIG.
- step S171 the light source parameter management server 320 sets the pulse energy target value Etp of the priority target parameter.
- step S172 the light source parameter management server 320 retrieves data on the relationship between the halogen gas partial pressure Hgc and the pulse energy E and the relationship between the halogen gas partial pressure Hgc and the pulse energy stability E ⁇ .
- step S173 the light source parameter management server 320 uses the retrieved relational data to obtain the target value Hgct of the halogen gas partial pressure that maximizes the pulse energy E (see FIG. 35).
- step S174 the light source parameter management server 320 outputs the target value Hgct of the halogen gas partial pressure as the operation control target parameter to the light source #k.
- step S177 the light source parameter management server 320 registers the pulse energy stability E ⁇ as recommended target parameter information.
- step S179 the light source parameter management server 320 outputs the target pulse energy Etp as the priority target parameter value to the light source #k.
- the light source parameter management server 320 may also output the target pulse energy Etp to the exposure apparatus #k.
- step S179 the light source parameter management server 320 returns to the flow chart of FIG.
- FIG. 35 is an example of a graph showing the relationship between the halogen gas partial pressure Hgc and the pulse energy E, and the relationship between the halogen gas partial pressure Hgc and the pulse energy stability E ⁇ .
- the horizontal axis of FIG. 35 represents the halogen gas partial pressure Hgc in the chamber 100, the left vertical axis represents the pulse energy E, and the right vertical axis represents the pulse energy stability E ⁇ .
- the mountain-shaped curve shown by a thick line is a graph showing the relationship between the halogen gas partial pressure Hgc and the pulse energy E
- the valley-shaped curve shown by a thin line shows the relationship between the halogen gas partial pressure Hgc and the pulse energy stability E ⁇ . It is a graph showing.
- the halogen gas partial pressure Hgc in the chamber 100 is controlled so that the halogen gas partial pressure Hgct becomes the maximum value Emax of the pulse energy E. , the pulse energy E can be increased. Therefore, exposure throughput is improved.
- the target halogen gas partial pressure Hgct which is an operation control parameter, is determined so that the pulse energy E of the halogen gas partial pressure Hgc is maximized.
- the stability E ⁇ may degrade to the E ⁇ r values shown in FIG.
- the pulse energy stability E ⁇ may be registered as recommended target parameter information, and the recommended target parameter information may be estimated from the operation data during adjustment oscillation and output to the external device.
- the gas consumption per pulse Gwt which is the operation control target parameter for light source #k
- Gwt the gas consumption per pulse
- the optical performance priority mode there may be a mode that prioritizes the stability of pulse energy.
- the target halogen gas partial pressure Hgct is set as the operation control target parameter so that the value of the pulse energy stability E ⁇ is minimized (stability is maximized).
- light source #k can be operated by allowing a decrease in the number of remaining pulses until maintenance of consumables or by increasing the target gas consumption per pulse Gwt. becomes.
- the duty ratio in this case is expressed by the following formula.
- FIG. 37 is a graph showing the relationship between duty ratio and pulse energy. As shown in FIG. 37, generally, under the same conditions (when the same gas pressure and the same charging voltage are applied), the pulse energy of the light output from the light source tends to decrease as the duty ratio increases. There is Therefore, when operating the light source with a high duty ratio, it is necessary to operate under conditions where the pulse energy of the light source is high.
- the relationship as shown in FIG. 37 shows a similar tendency even if the number of pulses per unit time is plotted on the horizontal axis and the pulse energy is plotted on the vertical axis.
- the pulse energy decreases. Therefore, when the light source is operated by increasing the number of pulses per unit time, the measures for compensating for the pulse energy are the same as in the case of a high duty ratio. be.
- FIG. 38 shows an example of a flowchart when the duty ratio is the priority target parameter and the range of the pulse energy stability parameter can be relaxed.
- the flowchart of FIG. 38 can be applied instead of the flowchart of FIG.
- step S181 the light source parameter management server 320 sets Drtp, which is a priority target parameter.
- the burst pattern duty ratio Drtp which is a priority parameter, is a duty ratio calculated from the operation pattern for the next exposure.
- Steps S182, S183, S184 and S187 may be the same as steps S172, S173, S174 and S177 of FIG.
- step S189 the light source parameter management server 320 outputs the target duty ratio Drtp as priority target parameter information to light source #k.
- the light source parameter management server 320 may also output the target duty ratio to the exposure apparatus #k.
- the exposure device outputs a trigger pattern to the light source #k so as to perform exposure with a burst exposure pattern close to this target duty ratio Drtp.
- the pulse energy stability may deteriorate. Therefore, the pulse energy stability may be registered as recommended target parameter information, and the recommended target parameter information may be estimated from operation data during adjustment oscillation and output to an external device.
- the gas consumption per pulse Gwt which is the operation control target parameter for light source #k
- the gas consumption per pulse Gwt may be increased and reset. This makes it possible to maintain the number of remaining pulses for maintenance of consumables.
- the priority target parameter is the duty ratio, but the invention is not limited to this example, and for example, the output per unit time may be set as the priority target parameter.
- a process flow such as that shown in FIG. 31 or FIG. 38 is executed to, for example, broaden the spectral linewidth, or relax the range of the pulse energy stability parameter, or reduce the gas consumption per pulse.
- the operation control target parameter is set under the condition that the pulse energy can be maintained. Then, a value with a high duty ratio or a large number of pulses per unit time may be set as the target priority parameter information to operate the light source #k.
- FIG. 39 is an example of a processing flow applied in the case of consumables life extension mode operation. 39 is applied to step S71 of FIG. 24 in the case of consumables life extension mode operation.
- step S191 the light source parameter management server 320 selects operating parameters that can extend the life of consumables.
- Halogen gas partial pressure is one of the operational parameters that lead to higher pulse energies for the same gas pressure and charging voltage (see FIG. 35).
- the light source parameter management server 320 selects the halogen gas partial pressure.
- Steps S192, S193, S194 and S197 may be the same as steps S182, S183, S184 and S187 of FIG. 38, respectively.
- step S197 the light source parameter management server 320 returns to the flowchart of FIG.
- the pulse energy and the pulse energy stability may be obtained based on the data during the adjustment operation and output to the external device.
- the spectral linewidth and the spectral linewidth stability may be obtained based on the data during the adjustment operation and output to the external device.
- the operation control target of light source #k It may be reset by increasing the gas consumption Gwt for each pulse, which is a parameter. This also makes it possible to extend the remaining number of pulses until maintenance of consumables.
- the set gas consumption Gwt for each pulse may be output to the external device as the recommended target parameter information.
- the maintenance information may be output to an external device based on the data during adjustment operation when the gas consumption Gwt for each pulse is increased and set.
- Consumable life extension mode operation can extend the number of pulses remaining until consumable maintenance. By extending the number of pulses remaining until the maintenance of the consumables, for example, it becomes possible to match the maintenance timing of the other consumables of the lithography system #k with the maintenance timing of the light source #k, thereby reducing downtime of the production line. You can improve your time. Further, according to the consumables life extension mode operation, it is possible to match the maintenance timing of the consumables for the light source #k with the maintenance timing of the consumables for the light source #j (j ⁇ k).
- FIG. 40 is a graph showing the relationship between gas consumption per unit pulse and pulse energy. As shown in FIG. 40, generally, the light source tends to increase the pulse energy of the light output from the light source as the gas consumption per unit pulse increases.
- gas consumption per unit pulse makes it possible to keep the pulse energy of the light source high. Conversely, gas consumption can be reduced if the pulse energy can be kept high by other parameters.
- FIG. 41 is an example of a processing flow applied in the case of gas consumption reduction mode operation. In the case of gas consumption reduction mode operation, the flow chart of FIG. 41 is applied to step S71 of FIG.
- step S201 the light source parameter management server 320 sets the gas consumption Gwtp as a priority target parameter.
- Steps S202, S203, S204 and step S207 may be the same as steps S182, S183, S184 and step S187 of FIG. 38, respectively.
- step S208 the light source parameter management server 320 outputs the target gas consumption Gwtp, which is priority target parameter information, to light source #k.
- step S208 the light source parameter management server 320 returns to the flowchart of FIG.
- the light source parameter management server 320 obtains the pulse energy stability as the recommended target parameter information based on the data during the adjustment operation. The light source parameter management server 320 then outputs the estimated recommended target parameter information and maintenance information to an external device.
- the recommended target parameter information obtains the spectrum line width ⁇ and the stability range of the spectrum line width based on the operation data during the adjustment operation. Then, the recommended target parameter information and the maintenance information are output to an external device.
- the gas consumption per unit pulse can be reduced.
- the gas consumption reduction mode operation has a large cost reduction effect when the cost of the excimer laser gas rises.
- the gas consumption reduction mode operation is an effective means.
- the above example shows three examples of resetting the target halogen partial pressure, widening the target spectral linewidth, and shortening the number of remaining pulses until maintenance. However, without being limited to these examples, these three examples may be combined as appropriate. By doing so, it is also possible to reduce the range of relaxed specifications of the recommended target parameters.
- FIG. 42 is an example of a processing flow applied in the case of power saving mode operation. In the case of power saving mode operation, the flowchart of FIG. 42 is applied to step S71 of FIG.
- the light source parameter management server 320 selects an operation control target parameter capable of reducing power consumption (power consumption) as a priority target parameter.
- the light source parameter management server 320 selects the charging voltage of the charger 110 as one of the operation control target parameters capable of reducing power consumption.
- step S212 the light source parameter management server 320 resets the operation range HVLLt to HVULt of the charging voltage of the charger 110 as the operation control target parameter for the light source #k. Since the power consumption depends on the charging voltage of the laser device that is the light source, the power consumption can be suppressed by setting the lower limit HVLLt and the upper limit HVULt of the target charging voltage as low as possible within the operable range.
- step S213 the light source parameter management server 320 outputs the operation range HVLLt to HVULt of the charging voltage as operation control parameter information to the light source #k.
- step S213 the light source parameter management server 320 returns to the flowchart of FIG.
- the power consumption can be suppressed by setting the lower limit value HVLLt and the upper limit value HVULt, which are the range of the charging voltage target value, low within the operable range. That is, the lower limit value HVLLt and the upper limit value HVULt of the target charging voltage of charger 110 as the operation control target parameter for light source #k may be reset to lower values than in the normal case.
- the light source parameter management server 320 obtains, as the recommended target parameter information, parameter information regarding the stability of the pulse energy and the gas consumption based on the operation data during the adjustment operation. and maintenance information to an external device.
- the pulse energy can be increased under the conditions of the same gas pressure and the same charging voltage. This margin of pulse energy can be distributed to the operating range of the charging voltage.
- the light source parameter management server 320 obtains the stability range of the pulse energy as the recommended target parameter information based on the operation data during the adjustment operation, and outputs this recommended target parameter information to the external device.
- the light source parameter management server 320 obtains the spectral line width and the stability range of the spectral line width as the recommended target parameter information based on the operation data during the adjustment operation, and sends this recommended target parameter information to an external device. Output to device.
- the power consumption of the motor 124 that drives the CFF 123 can be cited as an item with a high percentage of the power consumption of the laser device. In this case, power consumption can be reduced by reducing the rotation speed of the CFF 123 .
- the stability of pulse energy may deteriorate and the lifetime of the chamber may be shortened.
- the recommended target parameter information may be output to an external device to determine whether the operation is OK/NOK.
- FIG. 43 is a block diagram showing a modification of the fourth embodiment.
- the semiconductor manufacturing system may be configured with an input/display device 330 connected to a light source parameter management server 320 .
- the input/display device 330 includes an input device for receiving input of information from the operator and a display device for displaying various information.
- the input device may be, for example, a keyboard, mouse, multi-touch panel, voice input device, or any suitable combination thereof.
- the input/display device 330 may be an information processing terminal device such as a personal computer or a tablet terminal that can access the light source parameter management server 320 via a communication line.
- a plurality of input/display devices 330 may be present.
- An operator in the factory may select the light source #k from the input/display device 330 and input priority target parameter information, thereby displaying maintenance information and recommended target parameter information on the input/display device 330 . After confirming the maintenance information and the recommended target parameter information, the operator may determine whether the operation is OK/NOK and input the result of the determination from the input/display device 330 .
- the method of inputting priority target parameter information from the input/display device 330 is not limited to directly inputting information on parameters and their numerical values.
- mode information such as extended mode operation or consumption reduction mode operation from the input/display device 330
- priority target parameter information defined for each mode is automatically set, and similar operations are performed. You may take action.
- the input/display device 330 is presented with a mode selection menu containing selection candidates for a plurality of modes.
- the light source parameter management server 320 takes in the priority target parameter information including target values with narrowed spectral line widths defined in the spectral line width priority mode. Conversion from mode information to corresponding parameter information may be performed in the input/display device 330 or in the light source parameter management server 320 .
- FIG. 44 shows a specific example of parameter information regarding the light source.
- spectral linewidth parameter information is a collection of data including spectral linewidth and its value, and spectral linewidth stability and its value.
- FIG. 45 shows a specific example of priority target parameter information.
- the spectral linewidth priority target parameter information includes the priority target spectral linewidth as a variable, the target value ⁇ tp of the priority spectral linewidth, the stability of the priority target spectral linewidth as another variable, and a target value ⁇ tp of the variation width of the preferential spectral linewidth ⁇ .
- the spectral line width here is an example of the "first variable” in the present disclosure
- the target value ⁇ tp is an example of the "first target value” in the present disclosure.
- the fluctuation width of the spectral linewidth ⁇ corresponds to the allowable numerical range of the spectral linewidth ⁇ .
- the fluctuation range of the spectral linewidth ⁇ is an example of the “second variable” in the present disclosure
- the target value ⁇ tp is an example of the “second target value” in the present disclosure.
- FIG. 46 shows a specific example of recommended target parameter information. 46, the phrase "priority target parameter" shown in FIG. 45 is changed to "recommended target parameter", and the preferential target value shown in FIG. 45 is changed to a recommended target value. It differs from FIG. 45 in that
- the consumables include the chamber 100, the LNM band narrowing module, and the output coupling mirror (OC).
- Other optical modules such as an optical pulse stretcher not shown are also included.
- FIG. 48 shows a specific example of operation control target parameter information.
- the operation control parameters the voltage commanded to the charger (charging voltage), the halogen gas partial pressure, and the lens interval of the wavefront modulator were given, but the operation control parameters are limited to this example. Also included are control gains for feedback control of, for example, spectral linewidth, wavelength, and pulse energy.
- Computer-readable medium recording the program
- a program containing instructions for causing a computer to function can be stored in an optical disk, magnetic disk, or other computer-readable medium. (a tangible non-transitory information storage medium), and the program can be provided through this information storage medium.
- the excimer laser device is exemplified as the light source used in the exposure device, but the present invention is not limited to this, and may be a solid-state laser device or extreme ultraviolet (EUV) light with a wavelength of about 13 nm. It may be an EUV light generator or the like.
- the EUV light generation device may be, for example, an LPP (Laser Produced Plasma) type device that uses plasma generated by irradiating a target material with laser light.
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Abstract
Description
1.用語の説明
2.半導体製造システムの説明
2.1 構成
2.2 動作
3.リソグラフィーシステムの説明
3.1 構成
3.2 動作
4.ウエハ上への露光パターンの例
5.光源の例
5.1 構成
5.2 動作
5.3 その他
5.4 課題
6.実施形態1
6.1 構成
6.2 動作
6.2.1 データ解析用サーバの処理例
6.2.2 光源パラメータ管理用サーバの処理例
6.3 効果
6.4 その他
7.実施形態2
7.1 構成
7.2 動作
7.2.1 データ解析用サーバの処理例
7.2.2 光源パラメータ管理サーバの処理例
7.3 効果
7.4 その他
8.実施形態3
8.1 構成
8.2 動作
8.3 効果
9.実施形態4
9.1 構成
9.2 性能優先モード運転
9.2.1 スペクトル線幅Δλが優先目標パラメータの場合の例
9.2.1.1 動作
9.2.1.2 効果
9.2.1.3 その他
9.2.2 パルスエネルギが優先目標パラメータの場合
9.2.2.1 高パルスエネルギを得ることが優先され、スペクトル線幅Δλを広くして露光が可能な場合の例
9.2.2.1.1 動作
9.2.2.1.2 効果
9.2.2.1.3 その他
9.2.2.2 高パルスエネルギを得ることが優先され、パルスエネルギ安定性を仕様緩和して露光が可能な場合の例
9.2.2.2.1 動作
9.2.2.2.2 効果
9.2.2.2.3 その他
9.2.2.3 高デューティ比で運転することが優先され、パルスエネルギ安定性を仕様緩和して露光が可能な場合の例
9.2.2.3.1 動作
9.2.2.3.2 効果
9.2.2.3.3 その他
9.3 消耗品寿命延長モード運転
9.3.1 目標ハロゲンガス分圧を再設定する例
9.3.1.1 動作
9.3.1.2 効果
9.3.2 目標スペクトル線幅を再設定する例
9.3.3 ガス消費量を再設定する例
9.3.4 効果
9.3.5 その他
9.4 消費量低減モード運転
9.4.1 ガス消費量低減モード運転
9.4.1.1 目標ハロゲン分圧を再設定する例
9.4.1.2 目標スペクトル線幅を広げる例
9.4.1.3 メインテナンスまでの残りパルス数を減少させる例
9.4.1.4 効果
9.4.1.5 その他
9.4.2 省電力モード運転
9.4.2.1 充電電圧の目標値を再設定する例
9.4.2.2 ハロゲンガス分圧の目標値を再設定する例
9.4.2.3 目標スペクトル線幅を広げる例
9.4.3 効果
9.4.4 その他
9.5 変形例
10.パラメータ情報の具体例
11.プログラムを記録したコンピュータ可読媒体について
12.その他
以下、本開示の実施形態について、図面を参照しながら詳しく説明する。以下に説明される実施形態は、本開示のいくつかの例を示すものであって、本開示の内容を限定するものではない。また、各実施形態で説明される構成及び動作の全てが本開示の構成及び動作として必須であるとは限らない。なお、同一の構成要素には同一の参照符号を付して、重複する説明を省略する。
「消耗品」とは、露光装置に用いられる光源がパルス出力することによって、劣化して、交換する部品又はモジュールをいう。例えば、光源のチャンバ、狭帯域化モジュール(LNM)、出力結合ミラー(OC)、モニタモジュール等があり得る。「交換」の概念には、消耗品を新しいものに置き換えることの他、消耗品を洗浄するなどして部品の機能の維持及び/又は回復を図り、同じ消耗品を再配置することも含まれる。
2.1 構成
図1に、例示的な半導体工場内の半導体製造システム200の構成を概略的に示す。半導体製造システム200は、複数のリソグラフィーシステム10と、ウエハ検査装置用管理システム202と、露光装置用管理システム204と、光源用管理システム206と、半導体工場管理システム208と、を含む。
ウエハ検査装置#1~#wは、ウエハ毎に、それぞれのレジストパターンが形成されたウエハの表面の物理的な特性値を計測する。「物理的な特性値」は、例えばCD値、オーバーレイ、倍率値、及び表面の高さなどである。ウエハ検査装置用管理システム202は、ウエハ検査装置#1~#wからウエハ毎に計測された物理的な物性値を取得し、それぞれのリソグラフィーシステム#kのそれぞれのウエハ毎に、計測された物理的な特性値のデータをそれぞれ保存する。さらに、ウエハ検査装置用管理システム202は、それぞれのウエハのスキャンフィールド毎に、物理的な特性値のデータを整理して保存する。そして、ウエハ検査装置用管理システム202は、必要に応じて半導体工場管理システム208と図示しないデータ解析用サーバとなどに、これらの計測データの一部又は全部を出力する。
3.1 構成
図2に、リソグラフィーシステム#kの構成例を概略的に示す。リソグラフィーシステム#kは、ウエハ検査装置12と、露光装置14と、光源16と、を含む。
露光制御部50は、各種目標パラメータ値を光源16に出力する。露光制御部50から光源16に提供される目標パラメータ値は、目標波長λtと、目標スペクトル線幅Δλtと、目標パルスエネルギEtと、その他目標パラメータ値と、を含む。
図3に、露光制御部50からレーザ制御部90に出力される発光トリガ信号Trの出力パターンの例を示す。この例では、ウエハWF毎に、調整露光の後、実露光パターンに入る。光源16は、ステップアンドスキャン露光におけるステップ期間中は、発振休止し、スキャン期間中は、発光トリガ信号Trの間隔に応じてパルスレーザ光を出力する。このようなレーザ発振のパターンをバースト運転パターンという。
式中のVwはウエハWFのスキャン速度であり、fは光源の繰り返し周波数である。
5.1 構成
図7に、例示的な光源16の構成を概略的に示す。光源16は、例えば、KrFエキシマレーザ装置であって、チャンバ100と、狭帯域化モジュール(LNM)102と、インバータ104と、出力結合ミラー(OC)106と、波面調節器107と、モニタモジュール108と、充電器110と、パルスパワーモジュール(PPM)112と、ガス供給装置114と、ガス排気装置116と、出射口シャッタ118と、を含む。
光源16の動作について説明する。レーザ制御部90は、チャンバ100内に存在するガスを、ガス排気装置116を介して排気した後、ガス供給装置114を介してKr及びNeの混合ガスと、F2とKrとNeとの混合ガスと、を所望のガス組成及び全ガス圧となるようにチャンバ100内に充填する。
ハロゲン注入制御とは、レーザ発振中に、チャンバ100内で主に放電によって消費された分のハロゲンガスを、チャンバ100内のハロゲンガスよりも高い濃度にハロゲンガスを含むガスを注入することによって、ハロゲンガスを補充するガス制御である。この制御では、レーザ制御部90は、チャンバ100内での目標ハロゲン分圧Hgctとなるように制御する。ここで、目標ハロゲン分圧Hgctは、光源16の運転制御目標パラメータの1つである。
部分ガス交換制御とは、レーザ発振中に、チャンバ100内の不純物ガスの濃度の増加を抑制するように、チャンバ100内のレーザガスの一部を新しいレーザガスに交換するガス制御である。
ガス圧制御とは、光源16から出力されるパルスレーザ光のパルスエネルギの制御が、充電電圧Vの制御範囲では困難な場合に、チャンバ100内にレーザガスを注入してレーザガスの全ガス圧Pを変化させることによって、パルスエネルギを制御するガス制御である。ここで、充電電圧Vの制御範囲の上限値(HVULt)と下限値(HVLLt)とは、光源16の運転制御目標パラメータの1つである。
上記の[1]、[2]及び[3]の制御では、レーザ性能(パルスエネルギ)を維持できない場合には、レーザ発振を停止し、チャンバ100中のレーザガスを排気して、新しくレーザガスを充填した後、再び、レーザを発振させて運転する。このような制御を全ガス交換制御という。
図7では、光源16として狭帯域化KrFエキシマレーザ装置の例を示したが、この例に限定されることなく、狭帯域化ArFエキシマレーザ装置であってもよい。
顧客や顧客のプロセスデザインや製作している製品によって、どの目標パラメータ情報が、どのように影響するかは異なる。また、光源は設計上、製品として決められた仕様の範囲で動作することを保証している。
6.1 構成
図8は、実施形態1に係る半導体製造システム300の構成を示す。図8の構成について図1と異なる点を説明する。図8に示す半導体製造システム300は、図1の半導体製造システム200の構成に、データ解析用サーバ310と、光源パラメータ管理用サーバ320とが追加された構成となっている。データ解析用サーバ310及び光源パラメータ管理用サーバ320はネットワーク210に接続される。
図9は、半導体製造システム300の全体的な処理フローを示すブロック図である。データ解析用サーバ310は、以下のステップ(A-1~A-5)を実行する。
図10は、データ解析用サーバ310における処理内容の例を示すフローチャートである。図10に示すステップの処理は、データ解析用サーバ310に含まれるプロセッサがプログラムの命令を実行することによって実現される。
図12及び図13は、光源パラメータ管理用サーバ320における処理内容の例を示すフローチャートである。図12及び図13に示すステップの処理は、光源パラメータ管理用サーバ320に含まれるプロセッサがプログラムの命令を実行することによって実現される。
実施形態1によれば、データ解析用サーバ310を用いて、リソグラフィーシステム#kの露光プロセスに対して、最適な優先目標パラメータ情報を導き出し、この優先目標パラメータ情報を光源#kに設定して、光源#kを運転させた場合に推定されるメインテナンス情報を半導体工場管理システム208に出力することによって、リソグラフィーシステム#kの運転又は停止を効率よく管理できる。
実施形態1の例では、データ解析用サーバ310と、光源パラメータ管理用サーバ320とをそれぞれの機能毎に記載したが、必ずしも、これらサーバの機能を分ける必要がなく、同じサーバでこれら2つの機能を実現してもよい。また、両サーバの機能は、光源用管理システム206又は露光装置用管理システム204に機能を兼用してもよい。また、データ解析用サーバ310の機能は、露光装置用管理システム204、光源パラメータ管理用サーバ320又は光源用管理システム206に持たせてもよい。
7.1 構成
図16は、実施形態2に係る半導体製造システムの全体的な処理フローを示すブロック図である。実施形態2のシステム構成は実施形態1の構成(図8)と同様であってよい。実施形態2では、実施形態1で説明した構成及びその機能に加えて、優先目標パラメータとは異なるパラメータに関する推奨目標パラメータ情報を推定して、半導体工場管理システム208などの外部装置に提供する仕組みが追加される。
図16について、図9と異なる点を説明する。図16では、図9のフローに追加して、優先目標パラメータ情報を設定する場合に必要な推奨目標パラメータ情報を出力する場合の例を示す。
図17は、実施形態2のデータ解析用サーバ310における推奨目標パラメータ情報の確認フローを示すフローチャートである。半導体工場管理システム208は、受信した推奨目標パラメータ情報の採否を判定するにあたり、データ解析用サーバ310に推奨目標パラメータ情報を送り、データ解析用サーバ310に推奨目標パラメータ情報の適否を確認させ、その結果を受け取る。
図19及び図20は、実施形態2の光源パラメータ管理用サーバ320における処理内容の例を示すフローチャートである。図19及び図20のフローチャートは、図12及び図13のフローチャートにおけるステップS22、S23、S26、S29及びS30を、ステップS72、S73、S76、S79及びS80にそれぞれ変更したものとなっている。図13のステップS70、S74、S75、S77、S78、S81及びS82は、図13及び図14のフローチャートにおけるステップS20、S24、S25、S27、S28、S31及びS32のそれぞれと同様であるため、重複する説明を省略する。
実施形態2によれば、優先目標パラメータ情報に基づいて、メインテナンス情報だけでなく、推奨目標パラメータ情報を推定して、これらの情報が半導体工場管理システム208に出力される。これにより、半導体工場管理システム208において、これらの情報を総合的に勘案して、光源#kの運転のOK/NOKの判定が可能となる。
実施形態2の例では、半導体工場管理システム208が、その他の半導体工場の管理情報209に基づいてOK/NOKを判定しているが、これに限らず、露光装置用管理システム204に、推奨目標パラメータ情報を出力し、露光装置用管理システム204にて露光装置#kとして、露光実施のOK/NOKを判定させ、その判定結果を半導体工場管理システム208が受信することにより、半導体工場管理システム208がOK/NOKを総合的に判定してもよい。
8.1 構成
実施形態3のシステム構成及び全体フローは、実施形態2と同様であってよい。実施形態3は、光源パラメータ管理用サーバ320が光源#kの優先目標パラメータ情報に基づいて、光源#kの運転制御目標パラメータ値を変更(再設定)する点で実施形態2と異なる。
図24は、実施形態3の光源パラメータ管理用サーバ320における処理内容の例を示すフローチャートである。図24において、図19と共通するステップには同一のステップ番号を付し、重複する説明は省略する。図24に示すフローチャートは、図19のステップS70とステップS72との間にステップS71を含む。
実施形態3によれば、光源#kについての優先目標パラメータ情報が設定されると、その設定に関連する他の運転制御目標パラメータ値が再設定される。これにより、優先目標パラメータ情報を満たす運転が実現される。
9.1 構成
実施形態4は、実施形態3のさらなる具体的な形態の例である。実施形態4のシステム構成及び全体フローは、実施形態1と同様であってよい。実施形態4は、光性能優先モード、消耗品寿命延長モード及び消費量低減モードの各モードで運転する場合について例示する。
光性能優先モード運転には、例えば、スペクトル線幅の性能を優先させる場合、パルスエネルギ(出力)の性能を優先させる場合、あるいは、エネルギ安定性の性能を優先させる場合など、優先する性能(重視する性能)の観点が異なる複数態様があり得る。このような特定の光性能を優先するモードでの運転が要求された場合の動作の具体例を以下に示す。
9.2.1.1 動作
ここでは、リソグラフィーシステム#kが、クリティカルレーヤのプロセスの露光を行っている場合に関して説明する。クリティカルレーヤのプロセスでは露光装置#kの解像力を高く維持する必要があるので、目標スペクトル特性を示す目標パラメータ(例えばスペクトル線幅Δλ)を優先的に管理する必要があると推定される。この場合、データ解析用サーバ310では、図27に示すフローチャートの各ステップが実行される。
この例では、波面調節器107のレンズ間隔を初期値Ctとして設定することによって、短時間で、優先される目標スペクトル線幅Δλtpに設定する光源の運転が可能となる。
この例では、優先目標パラメータである目標スペクトル線幅のみを狭くしている。この場合、パルスエネルギの余裕が少なくなるため、消耗品のメインテナンスまでの残りパルス数が減少する。この点、実施形態2で説明したように、他の仕様緩和可能なパラメータについて推奨目標パラメータ情報を推定してもよい。
9.2.2.1 高パルスエネルギを得ることが優先され、スペクトル線幅Δλを広くして露光が可能な場合の例
光源#kの露光プロセスの工程が、ラフレーヤの場合又は焦点深度の深さが要求される段差のある基板上にレジストパターンを形成する場合には、以下の条件(条件A及び条件B)で露光を行う必要がある。
図31は、優先目標パラメータをパルスエネルギとし、その目標値Etpに高パルスエネルギの値を設定し、さらに推奨目標パラメータをスペクトル線幅とし、その目標値Δλtrに広いスペクトル線幅の値を設定して、光源#kを運転する場合の光源パラメータ管理用サーバ320における処理フローの例を示す。
図31~図33を用いて説明した方式によって、優先目標パラメータの目標値である高パルスエネルギでの運転が可能となる。
図31の最後の2つのステップ(ステップS168,S168)は、光源#kに運転制御目標パラメータ値と、優先目標パラメータ値とを出力しているが、露光装置#kにこれら情報を出力してもよい。実際の露光時には露光装置#kから、光源#kに、これらの目標パラメータ値を出力してもよい。
9.2.2.2.1 動作
図34は、優先目標パラメータをパルスエネルギとして高パルスエネルギの値を目標値Etpに設定し、パルスエネルギ安定性のパラメータの範囲が仕様緩和可能な場合のフローチャートの例を示す。パルスエネルギEが優先目標パラメータとなり、パルスエネルギ安定性についての仕様を緩和して露光可能な場合、図31のフローチャートに代えて、図34のフローチャートを適用し得る。
図34のフローチャートによれば、パルスエネルギEが最大値Emaxとなるハロゲンガス分圧Hgctとなるように、チャンバ100内のハロゲンガス分圧Hgcを制御することによって、パルスエネルギEを高くすることができる。そのため、露光のスループットが改善する。
図34の例では、ハロゲンガス分圧HgcをパルスエネルギEが最大となるように、運転制御パラメータである目標のハロゲンガス分圧Hgctを定めたため、パルスエネルギ安定性Eσが図35に示すEσrの値に悪化する可能性がある。
9.2.2.3.1 動作
露光装置の光源は、一般的に、図2のように、ウエハを露光するために発振(所定の繰り返し周波数で発振)と休止を繰り返すバースト運転パターンを行う。
図37は、デューティ比とパルスエネルギとの関係を示すグラフである。図37に示すように、一般的に、光源は、同じ条件(同じガス圧及び同じ充電電圧を印加した時)ではデューティ比が高くなるにつれて、光源から出力される光のパルスエネルギが低くなる傾向がある。したがって、高デューティ比で光源を運転する場合は、光源のパルスエネルギが高くなる条件で運転する必要がある。
パルスエネルギが最大となるハロゲンガス分圧となるように、チャンバ100内のハロゲンガス分圧を制御することによって、高デューティ比の運転が可能となる。そのため、露光のスループットが改善する。
この例では、ハロゲンガス分圧をパルスエネルギが最大となるように目標のハロゲンガス分圧Hgctを定めたため、パルスエネルギ安定性が悪化する可能性がある。したがって、パルスエネルギ安定性を推奨目標パラメータ情報として登録しておき、調整発振時の運転データから推奨目標パラメータ情報を推定し、外部装置に出力してもよい。
半導体工場によっては、生産計画やメインテナンス計画等の事情により、消耗品のメインテナンスまでの期間を長くすることを希望する場合がある。消耗品の寿命を延長するには、同じガス圧及び同じ充電電圧の場合のパルスエネルギが高くなるように光源#kの運転制御目標パラメータを設定すればよい。
9.3.1.1 動作
図39は、消耗品寿命延長モード運転の場合に適用される処理フローの例である。消耗品寿命延長モード運転の場合、図24のステップS71に、図39のフローチャートが適用される。
図39のように、光源#kの運転制御目標パラメータとして、目標ハロゲンガス分圧をパルスエネルギが最大エネルギとなるように再設定することによって、同じガス圧及び同じ充電電圧を設定した場合に、パルスエネルギを高くすることが可能となる。このパルスエネルギの余裕度を消耗品のメインテナンスまでの残りパルス数の延長に振り分けることが可能である。
図33で説明したように、光源#kの運転制御目標パラメータとして、目標スペクトル線幅を広げることによって、同じガス圧及び同じ充電電圧を印加した時のパルスエネルギを高くすることが可能となる。このパルスエネルギの余裕度を消耗品のメインテナンスまでの残りパルス数の延長に振り分けることが可能である。
推奨目標パラメータ情報として、パルスエネルギ安定性又はスペクトル線幅等の目標パラメータを仕様緩和することができない場合は、例えば、光源#kの運転制御目標パラメータであるパルス毎のガス消費量Gwtを増加させて再設定してもよい。これにより、消耗品のメインテナンスまでの残りパルス数を延長することも可能となる。ただし、この場合は、推奨目標パラメータ情報として、設定したパルス毎のガス消費量Gwtを外部装置に出力してもよい。メインテナンス情報は、パルス毎のガス消費量Gwtを増加させて設定する場合の調整運転時のデータに基づいて、外部装置に出力してもよい。
消耗品寿命延長モード運転によれば、消耗品のメインテナンスまでの残りのパルス数を延長できる。消耗品のメインテナンスまでの残りのパルス数を延長することによって、例えば、リソグラフィーシステム#kのその他の消耗品のメインテナンス時期と、光源#kのメインテナンス時期とを合わせることが可能となり、製造ラインのダウンタイムを改善することができる。また、消耗品寿命延長モード運転によれば、光源#kの消耗品のメインテナンス時期と光源#j(j≠k)の消耗品のメインテナンス時期とを合わせることも可能である。
この例では目標ハロゲン分圧を再設定する例と、目標スペクトル線幅を再設定する例と、目標ガス消費量を再設定する例と、の3つの例を示したが、これらの例に限定されることなく、これら3つの例を適宜組み合わせてもよい。このようにすることによって、推奨目標パラメータ情報の仕様緩和の範囲を小さくすることも可能となる。
9.4.1 ガス消費量低減モード運転
何らかの事情により、通常の仕様よりもガス消費量を低減したいという要望も想定される。ガス消費量を低減するには、同じガス圧及び同じ充電電圧を印加した時のパルスエネルギが高くなるように光源の運転制御目標パラメータを設定すればよい。
図41は、ガス消費量低減モード運転の場合に適用される処理フローの例である。ガス消費量低減モード運転の場合、図24のステップS71に、図41のフローチャートが適用される。
図33の例のように、目標スペクトル線幅Δλtを広げることによって、同じガス圧及び同じ充電電圧を印加した時のパルスエネルギを高くすることが可能となる。このパルスエネルギの余裕度をガス消費量低減に振り分けることが可能である。この場合、図24のフローチャートにおける光源#kの運転制御目標パラメータとして、以下のパラメータを再設定する。
また、推奨目標パラメータ情報としてエネルギ安定性又はスペクトル線幅の目標パラメータを仕様緩和することができない場合は、消耗品のメインテナンスまでの残りパルス数を短くすることで、ガス消費量を抑制できる。ただし、この場合は、メインテナンス情報としてメインテナンスまでの残りパルス数が短くなることを外部装置に出力することになる。
上記に例示したガス消費量低減モード運転によれば、単位パルス当たりのガス消費量を低減できる。ガス消費量低減モード運転は、エキシマレーザガスのコストが高騰した場合に、コスト低減効果が大きくなる。
上記の例では目標ハロゲン分圧を再設定する例と、目標スペクトル線幅を広げる例と、メインテナンスまでの残りパルス数を短くする例と、の3つの例を示したが、これらの例に限定されることなく、これら3つの例を適宜組み合わせてもよい。このようにすることによって、推奨目標パラメータの仕様緩和の範囲を小さくすることも可能となる。
消費電力を低減するには、電源の充電電圧の範囲を低く設定することで可能となる。
図42は、省電力モード運転の場合に適用される処理フローの例である。省電力モード運転の場合、図24のステップS71に、図42のフローチャートが適用される。
図35の例のように、運転制御目標パラメータであるハロゲンガス分圧を最大のパルスエネルギが得られる目標値Hgctに設定することで、同じガス圧及び同じ充電電圧の条件でのパルスエネルギを高くすることができる。このパルスエネルギの余裕度を充電電圧の運転範囲に振り分けることが可能となる。この場合、光源パラメータ管理用サーバ320は、推奨目標パラメータ情報として、調整運転時の運転データに基づいて、パルスエネルギの安定性の範囲を求め、この推奨目標パラメータ情報を外部装置に出力する。
図33の例のように、運転制御目標パラメータである目標スペクトル線幅Δλtを広げることによって、同じガス圧及び同じ充電電圧を印加した時のパルスエネルギを高くすることが可能となる。このパルスエネルギの余裕度を充電電圧の運転範囲に振り分けることが可能である。この場合、光源パラメータ管理用サーバ320は、推奨目標パラメータ情報として、調整運転時の運転データに基づいて、スペクトル線幅とスペクトル線幅の安定性の範囲とを求め、この推奨目標パラメータ情報を外部装置に出力する。
省電力モード運転を実施することにより、電力消費量を低減できる。また、半導体工場内の電力事情がひっ迫した場合でも、電力消費量を抑えつつ、光源の運転を継続することができる。
上記の例では、充電電圧目標値を再設定する例と、ハロゲンガス分圧を再設定する例と、スペクトル線幅を広げる例と、の3つの例を示したが、これらの例に限定されることなく、これら3つの例を適宜組み合わせてもよい。このようにすることによって、推奨目標パラメータの仕様緩和の範囲を小さくすることも可能となる。
図43は、実施形態4の変形例を示すブロック図である。図43に示すように、半導体製造システムは、光源パラメータ管理用サーバ320と接続される入力/表示装置330を備える構成であってもよい。入力/表示装置330は、オペレータからの情報の入力を受け付ける入力装置と、各種の情報を表示させる表示装置とを含む。入力装置は、例えば、キーボード、マウス、マルチタッチパネル、もしくは音声入力装置又はこれらの適宜の組み合わせであってよい。入力/表示装置330は、通信回線を介して光源パラメータ管理用サーバ320にアクセス可能なパーソナルコンピュータやタブレット端末などの情報処理端末装置であってよい。入力/表示装置330は、複数存在していてもよい。
図44に、光源に関するパラメータ情報の具体例を示す。例えば、スペクトル線幅のパラメータ情報は、スペクトル線幅及びその値と、スペクトル線幅安定性及びその値と、を含むデータの集合体である。
上述の各実施形態で説明したデータ解析用サーバ310や光源パラメータ管理用サーバ320として、コンピュータを機能させるための命令を含むプログラムを光ディスクや磁気ディスクその他のコンピュータ可読媒体(有体物たる非一過性の情報記憶媒体)に記録し、この情報記憶媒体を通じてプログラムを提供することが可能である。このプログラムをコンピュータに組み込み、プロセッサがプログラムの命令を実行することにより、コンピュータに、これらのサーバの機能を実現させることができる。
上述の各実施形態では、露光装置に用いられる光源として、エキシマレーザ装置を例示したが、これに限らず、固体レーザ装置であってもよいし、波長約13nmの極端紫外(EUV)光を生成するEUV光生成装置などであってもよい。EUV光生成装置は、例えば、ターゲット物質にレーザ光を照射することによって生成されるプラズマが用いられるLPP(Laser Produced Plasma)方式の装置であってよい。
Claims (20)
- 露光装置に用いられる光源のパラメータ情報を管理する光源パラメータ情報管理方法であって、
前記光源の運転で優先される優先目標パラメータである変数の項目と前記変数の目標値とを含む優先目標パラメータ情報を取得することと、
前記優先目標パラメータ情報に基づいて、前記光源における消耗品のメインテナンスまでの寿命を表す値を含むメインテナンス情報を推定することと、
前記メインテナンス情報を出力することと、
を含む光源パラメータ情報管理方法。 - 請求項1に記載の光源パラメータ情報管理方法であって、
外部装置から前記優先目標パラメータ情報の入力を受け付け、
前記メインテナンス情報を前記外部装置に出力する、
光源パラメータ情報管理方法。 - 請求項2に記載の光源パラメータ情報管理方法であって、さらに、
前記外部装置から前記光源の運転の許否を表すOK信号又はNOK信号を取得すること、を含む、
光源パラメータ情報管理方法。 - 請求項3に記載の光源パラメータ情報管理方法であって、さらに、
前記外部装置から前記光源の運転を許可する前記OK信号を得た場合に、前記優先目標パラメータ情報を前記光源に設定して、前記光源を制御すること、を含む、
光源パラメータ情報管理方法。 - 請求項4に記載の光源パラメータ情報管理方法であって、さらに、
前記光源の運転中のデータから、前記優先目標パラメータ情報を設定したときの前記光源の前記メインテナンス情報を推定すること、を含む、
光源パラメータ情報管理方法。 - 請求項5に記載の光源パラメータ情報管理方法であって、さらに、
前記運転中のデータから推定される前記メインテナンス情報を、前記外部装置に出力すること、を含む、
光源パラメータ情報管理方法。 - 請求項3に記載の光源パラメータ情報管理方法であって、さらに、
前記外部装置から前記光源の運転を不許可とするNOK信号を得た場合に、前記光源の運転を停止すること、を含む、
光源パラメータ情報管理方法。 - 請求項1に記載の光源パラメータ情報管理方法であって、
前記優先目標パラメータ情報は、前記優先目標パラメータである第1変数の第1目標値と、前記第1変数の数値範囲を示す第2変数の第2目標値とを含む、
光源パラメータ情報管理方法。 - 請求項1に記載のパラメータ情報管理方法であって、
前記優先目標パラメータ情報は、
目標スペクトル特性パラメータ情報と、目標出力特性パラメータ情報と、目標消費量情報と、のうち少なくとも1つを含む、
光源パラメータ情報管理方法。 - 請求項1に記載の光源パラメータ情報管理方法であって、
前記メインテナンス情報は、前記消耗品の前記寿命を表す値として、前記消耗品のメインテナンスまでの残りパルス数及び残り時間のうち少なくとも一方の値を含む、
光源パラメータ情報管理方法。 - 請求項1に記載の光源パラメータ情報管理方法であって、
前記メインテナンス情報の推定は、
前記優先目標パラメータ情報を前記光源に設定して前記光源を調整運転させることによって得られる運転データを、学習済みの機械学習モデルに入力し、前記機械学習モデルから前記消耗品の劣化度を出力させ、
前記劣化度を基に前記消耗品の寿命を表す値を求めること、を含む、
光源パラメータ情報管理方法。 - 請求項1に記載の光源パラメータ情報管理方法であって、さらに、
前記取得された前記優先目標パラメータ情報とは異なるパラメータ情報を含む推奨目標パラメータ情報を推定することと、
前記推奨目標パラメータ情報を出力することと、を含む、
光源パラメータ情報管理方法。 - 請求項12に記載の光源パラメータ情報管理方法であって、
前記推奨目標パラメータ情報は、目標スペクトル特性パラメータ情報と、目標出力特性パラメータ情報と、目標消費量パラメータ情報と、のうち少なくとも1つを含み、
光源パラメータ情報管理方法。 - 請求項1に記載の光源パラメータ情報管理方法であって、
前記優先目標パラメータ情報は、前記光源の光性能を優先する光性能優先モードと、前記光源の前記消耗品の寿命の延長を優先する消耗品寿命延長モードと、前記光源の運転で消費される要素の消費量を低減する消費量低減モードと、のうち少なくとも1つのモードを指定するモード情報を含む、
光源パラメータ情報管理方法。 - 請求項14に記載の光源パラメータ情報管理方法であって、
前記光性能優先モードは、スペクトル線幅パラメータ情報と、出力特性パラメータ情報とのいずれかを優先して前記光源を運転するモードである、
光源パラメータ情報管理方法。 - 請求項14に記載の光源パラメータ情報管理方法であって、
前記消耗品寿命延長モードは、前記光源の消耗品のメインテナンスまでの残りパルス数の延長を優先して前記光源を運転するモードである、
光源パラメータ情報管理方法。 - 請求項14に記載の光源パラメータ情報管理方法であって、
前記消費量低減モードは、レーザガスの消費量の低減と、消費電力の低減とのいずれかを優先して前記光源を運転するモードである、
光源パラメータ情報管理方法。 - 請求項1に記載の光源パラメータ情報管理方法であって、
前記優先目標パラメータは、ウエハ検査データと、前記露光装置から得られるデータと、前記光源から得られるデータと、追跡データと、に基づいて選定される、
光源パラメータ情報管理方法。 - 露光装置に用いられる光源のパラメータ情報を管理する光源パラメータ情報管理装置であって、
プロセッサと、
前記プロセッサが実行するプログラムが記憶されるメモリと、を含み、
前記プロセッサが前記プログラムの命令を実行することにより、前記プロセッサが、
前記光源を運転する際に優先される優先目標パラメータである変数の項目と前記変数の目標値とを含む優先目標パラメータ情報を取得し、
前記優先目標パラメータ情報に基づいて、前記光源における消耗品のメインテナンスまでの寿命を表す値を含むメインテナンス情報を推定し、
前記メインテナンス情報を出力する、
光源パラメータ情報管理装置。 - 露光装置に用いられる光源のパラメータ情報を管理する機能をコンピュータに実現させるプログラムが記録された非一過性のコンピュータ可読媒体であって、
前記コンピュータに、
前記光源を運転する際に優先される優先目標パラメータである変数の項目と前記変数の目標値とを含む優先目標パラメータ情報を取得する機能と、
前記優先目標パラメータ情報に基づいて、前記光源における消耗品のメインテナンスまでの寿命を表す値を含むメインテナンス情報を推定する機能と、
前記メインテナンス情報を出力する機能と、
を実現させる前記プログラムが記録されたコンピュータ可読媒体。
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JPH10275951A (ja) * | 1997-03-28 | 1998-10-13 | Nikon Corp | レーザ光源の寿命判定方法 |
JP2000306813A (ja) * | 1999-04-22 | 2000-11-02 | Nikon Corp | 露光方法及び露光装置 |
KR20030001712A (ko) * | 2001-06-27 | 2003-01-08 | 삼성전자 주식회사 | 노광 램프의 시간 관리기 |
JP2010067794A (ja) * | 2008-09-11 | 2010-03-25 | Canon Inc | 露光装置及びデバイス製造方法 |
WO2020031301A1 (ja) * | 2018-08-08 | 2020-02-13 | ギガフォトン株式会社 | リソグラフィシステムのメインテナンス管理方法、メインテナンス管理装置、及びコンピュータ可読媒体 |
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JPH10275951A (ja) * | 1997-03-28 | 1998-10-13 | Nikon Corp | レーザ光源の寿命判定方法 |
JP2000306813A (ja) * | 1999-04-22 | 2000-11-02 | Nikon Corp | 露光方法及び露光装置 |
KR20030001712A (ko) * | 2001-06-27 | 2003-01-08 | 삼성전자 주식회사 | 노광 램프의 시간 관리기 |
JP2010067794A (ja) * | 2008-09-11 | 2010-03-25 | Canon Inc | 露光装置及びデバイス製造方法 |
WO2020031301A1 (ja) * | 2018-08-08 | 2020-02-13 | ギガフォトン株式会社 | リソグラフィシステムのメインテナンス管理方法、メインテナンス管理装置、及びコンピュータ可読媒体 |
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