WO2022193678A1 - 一种飞秒激光增减材加工系统及加工方法 - Google Patents

一种飞秒激光增减材加工系统及加工方法 Download PDF

Info

Publication number
WO2022193678A1
WO2022193678A1 PCT/CN2021/128548 CN2021128548W WO2022193678A1 WO 2022193678 A1 WO2022193678 A1 WO 2022193678A1 CN 2021128548 W CN2021128548 W CN 2021128548W WO 2022193678 A1 WO2022193678 A1 WO 2022193678A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
workpiece
femtosecond laser
processing
mirror
Prior art date
Application number
PCT/CN2021/128548
Other languages
English (en)
French (fr)
Inventor
丁烨
杨立军
王联甫
Original Assignee
哈尔滨工业大学
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 哈尔滨工业大学 filed Critical 哈尔滨工业大学
Publication of WO2022193678A1 publication Critical patent/WO2022193678A1/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • B23K26/342—Build-up welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor

Definitions

  • the invention relates to the technical field of laser processing, in particular, to a femtosecond laser processing system and processing method for adding and subtracting materials.
  • electrochemical energy storage technology is widely used in high-end equipment in key national development fields such as aerospace, national defense and military, and instrumentation.
  • the energy conversion efficiency, specific capacity and rate performance of electrochemical energy storage devices are closely related to the material properties and macro-microstructure of the electrodes.
  • Existing relatively mature electrode construction technologies such as chemical synthesis assembly, wet spinning and inkjet printing, have problems such as large material limitations, complex processes, and poor repeatability.
  • femtosecond laser processing technology has been widely used in the field of micromachining because of its minimal impact on the surrounding material and can safely cut, punch, and engrave. Ablative debris is generated on the surface, which in turn affects the surface quality of the machined area of the workpiece.
  • the problem solved by the invention is that when the existing femtosecond laser processing technology is applied in an air environment, the interaction between the femtosecond laser and the solid material will produce ablation debris on the surface of the material, which in turn affects the surface quality of the workpiece processing area.
  • the present invention provides a femtosecond laser material addition and subtraction processing system, which includes a laser emission module and a laser working module, and the laser working module includes an optical path adjustment component, an optical path shaping component and a workpiece processing component.
  • the laser emitted by the module passes through the optical path shaping component and the optical path adjustment component in sequence and then reaches the workpiece processing component to perform laser processing on the workpiece to be processed in the workpiece processing component;
  • the workpiece processing assembly includes a workpiece processing pool, and the workpiece processing pool includes a tank body and a spacer arranged inside the tank body, and the spacer divides the tank body into a liquid storage tank and a space for placing the workpiece to be processed.
  • the processing tank is provided with a communication hole at the bottom of the spacer and the tank body, and the liquid storage tank is used to store chemical solution and transport the chemical solution into the processing tank through the communication hole, and
  • the side wall of the processing tank is provided with a drain hole suitable for liquid drainage, and the distance between the drain hole and the bottom of the tank body is greater than the distance between the workpiece to be processed and the bottom of the tank body.
  • the optical path shaping assembly includes a beam expander, a 1/4 glass lens group and a half glass lens group, and the 1/4 glass lens group and the half glass lens group are arranged on the expander lens. Downstream of the optical path of the beam mirror, the 1/4 glass mirror group is arranged close to the beam expander relative to the half glass mirror group, and the 1/4 glass mirror group is suitable for working and non-working switch between bits.
  • the 1/4 glass lens group includes a first reflecting mirror, a second reflecting mirror, and a quarter glass disposed between the first reflecting mirror and the second reflecting mirror, and the The first reflector and/or the second reflector are adapted to be switched between a reflecting station and a non-reflecting station.
  • the half-glass lens group includes a third reflecting mirror, a fourth reflecting mirror, and a half-glass disposed between the third reflecting mirror and the fourth reflecting mirror.
  • the optical path adjustment assembly includes a fifth reflector, a visible light transmission laser reflector, a non-polarized white light beam splitter, and an objective lens, and the laser light emitted by the laser emission module passes through the optical path shaping assembly and sequentially passes through the first lens.
  • the workpiece to be processed is processed after five reflecting mirrors, the non-polarized white light beam splitter, the visible light transmitting laser mirror and the objective lens.
  • the laser working module further includes a focusing observation assembly, the focusing observation assembly includes a white light source and an observation mirror group for receiving white light, and the white light emitted by the white light source and the laser emitted by the laser emission module are Coaxially incident on the surface of the workpiece to be machined.
  • the focusing observation assembly includes a white light source and an observation mirror group for receiving white light
  • the white light emitted by the white light source and the laser emitted by the laser emission module are Coaxially incident on the surface of the workpiece to be machined.
  • the observation lens group includes an attenuator, a filter, a CCD and an optical lens arranged in sequence according to the incident order of the white light, and the attenuator and the filter are used for the to-be-processed
  • the white light reflected by the workpiece is converted into a signal that can be processed by the CCD, and the optical lens is used to convert the signal processed by the CCD into a digital image signal to observe the relative position of the laser and the workpiece to be processed.
  • the femtosecond laser material addition and subtraction processing system further includes a power supply module, the power supply module is connected to the laser emission module and the laser working module, and the power supply module is used to supply the laser beam to the laser beam.
  • the transmitting module and the laser working module are powered.
  • the workpiece processing assembly further includes a worktable for placing the workpiece processing pool, the worktable is electrically connected to the power module, and the worktable is adapted to drive the workpiece processing pool to move.
  • the workpiece processing assembly further includes a base pad and a sample plate arranged in the processing tank, the base pad is arranged at the bottom of the tank body, and the sample plate is arranged above the base pad , the sample carrier is used for accommodating the workpiece to be processed, and a through hole suitable for the chemical solution to pass through is provided on the sample carrier.
  • the laser emission module includes a femtosecond laser and an optical shutter, the femtosecond laser, the optical shutter and the beam expander are coaxially installed in sequence, and the femtosecond laser is used to generate the femtosecond laser.
  • Laser, the optical shutter is used to pass or block laser pulses.
  • the femtosecond laser material addition and subtraction processing system of the present invention Compared with the prior art, the femtosecond laser material addition and subtraction processing system of the present invention:
  • the femtosecond laser can reduce the cations in the chemical solution while processing the microstructure, and deposit on the microstructure and its surroundings, and finally obtain a microstructure with a functional coating on the surface;
  • the chemical solution is supplemented by the communication hole between the liquid storage tank and the processing tank to make up for the loss of solution caused by thermal evaporation during the laser processing process, and maintain the liquid level in the processing tank together with the drain hole on the side wall of the processing tank. dynamic balance, so as to ensure the stability of the processing effect.
  • the present invention also provides a processing method for a femtosecond laser material addition and subtraction processing system. Based on the femtosecond laser material addition and subtraction processing system, the following steps are included:
  • Step S1 place the workpiece to be processed in the processing tank of the workpiece processing pool, and add a chemical solution to both the liquid storage tank and the processing tank, so that the height of the liquid level in the processing tank is the same as the discharge hole on the processing tank. flat;
  • Step S2 turn on the laser emission module, output low-power femtosecond laser, and adjust the position of the beam expander and the lenses of each mirror group in the laser working module, so that the femtosecond laser spot is in the position of the beam expander and the mirrors of each mirror group.
  • the femtosecond laser is vertically incident on the objective lens and focused on the surface of the workpiece to be processed;
  • Step S3 Turn off the laser emitting module, set the output parameters of the laser emitting module according to the processing requirements, and then reopen the laser emitting module, and select the 1/4 glass mirror in the optical path shaping assembly according to the processing requirements
  • a group or half-glass lens group is used to adjust the polarization state of the femtosecond laser to process the workpiece to be processed.
  • selecting a quarter glass lens group or a half glass lens group in the optical path shaping assembly to adjust the polarization state of the femtosecond laser includes:
  • step S2 the focusing and observation component in the laser working module is used to make the femtosecond laser vertically incident on the objective lens and focus on the surface of the workpiece to be processed.
  • the processing method of the femtosecond laser material addition/reduction processing system of the present invention has the same advantages as the femtosecond laser material addition/reduction processing system relative to the prior art, which will not be repeated here.
  • Fig. 1 is the structural block diagram of the femtosecond laser material addition and subtraction processing system in the embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a femtosecond laser material addition and subtraction processing system in an embodiment of the present invention
  • Fig. 3 is the structural representation of the workpiece processing pool in the embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a workpiece processing pool in an embodiment of the present invention.
  • 1-Power module 2-Femtosecond laser, 3-Optical shutter, 4-Beam expander, 5-1/4 glass lens group, 501-First reflector, 502-1/4 glass, 503-First Two mirrors, 6-half glass mirror group, 601-third mirror, 602-half glass, 603-fourth mirror, 7-fifth mirror, 801-visible light transmission laser mirror, 802-non- Polarized white beam splitter, 9-objective lens, 10-workpiece processing pool, 1001-tank, 1002-base pad, 1003-sample plate, 1004-workpiece to be processed, 1005-connection hole, 1006-vent hole, 1007- Chemical solution, 1008-reservoir, 1009-processing tank, 11-table, 12-white light source, 13-observation mirror group, 1301-attenuator, 1302-filter, 1303-CCD, 1304-optical lens.
  • first”, “second”, ..., “fifth” are used for descriptive purposes only, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as “first”, “second”, ..., “fifth” may expressly or implicitly include at least one of that feature.
  • an embodiment of the present invention provides a femtosecond laser material addition and subtraction processing system, which includes a laser emission module and a laser working module.
  • the laser working module includes an optical path adjustment component, an optical path shaping component and a workpiece processing component.
  • the laser emission module The emitted laser passes through the optical path shaping component and the optical path adjustment component in sequence and then reaches the workpiece processing component to perform laser processing on the workpiece 1004 to be processed in the workpiece processing component;
  • the workpiece processing assembly includes a workpiece processing pool 10.
  • the workpiece processing pool 10 includes a tank body 1001 and a spacer arranged inside the tank body 1001.
  • the spacer divides the tank body 1001 into a liquid storage tank 1008 and a processing tank for placing the workpiece 1004 to be processed. 1009, and a communication hole 1005 is provided at the bottom of the spacer and the tank body 1001, the liquid storage tank 1008 is used to store the chemical solution 1007 and transport the chemical solution 1007 into the processing tank 1009 through the communication hole 1005, and the side wall of the processing tank 1009 is set
  • the distance between the drain hole 1006 and the bottom of the tank body 1001 is greater than the distance between the workpiece 1004 to be processed and the bottom of the tank body 1001. It should be noted that in this embodiment, the drain hole 1006 and the bottom of the tank body 1001 are The distance from the bottom of the tank body 1001 refers to the distance between the lowest point of the drain hole 1006 and the bottom of the tank body 1001 . The distance from the bottom of the tank body 1001.
  • the femtosecond laser material addition and subtraction processing system of this embodiment uses the femtosecond laser to process the electrode material in the chemical solution 1007, which can construct the electrode microstructure and at the same time reduce the cations in the chemical solution, and build a functional unit on the surface of the microstructure.
  • Conductive coating, and there will be no obvious thermal effect during femtosecond laser processing, and the chips and slag generated by the processing are taken away by the chemical solution 1007 and will not accumulate around the microstructure, so the surface quality of the workpiece processing area is high.
  • the chemical solution 1007 is supplemented by the communication hole 1005 between the liquid storage tank 1008 and the processing tank 1009 to make up for the loss of the solution caused by thermal evaporation during the laser processing process, and the leakage hole on the side wall of the processing tank 1009 1006 jointly maintain the dynamic balance of the liquid level in the processing tank 1009, thereby ensuring the stability of the processing effect.
  • the shape of the spacer is not limited in this embodiment, and can be any geometric shape, as long as the liquid storage tank 1008 and the processing tank 1009 can be isolated.
  • the shape of the spacer is a rectangle, and the longer bottom side of the rectangle is connected with the bottom of the groove, and the two shorter sides of the rectangle are connected with the side walls of the tank body 1001, and the longer side is connected to the side wall of the tank body 1001.
  • the bottom edge of the tank is provided with a communication hole 1005, the structure is simple, and except for the communication hole 1005, all sides of the rectangle connected with the tank body 1001 are sealed with the tank body 1001, which effectively ensures the chemical solution 1007 in the liquid storage tank 1008.
  • the machining groove 1009 can only be entered through the communication hole 1005 .
  • the chemical solution 1007 in the liquid storage tank 1008 is much more than the chemical solution 1007 in the processing tank 1009.
  • the chemical solution in the liquid storage tank 1008 1007 will be replenished into the processing tank 1009 through the communication hole 1005, so that the liquid level of the chemical solution 1007 in the processing tank 1009 can be slightly higher than the workpiece 1004 to be processed, and when the liquid level of the chemical solution 1007 in the processing tank 1009 reaches When the height of the drain hole 1006 is high, that is, when the liquid level of the chemical solution 1007 in the processing tank 1009 is greater than the distance from the lowest point of the drain hole 1006 to the bottom wall of the tank body 1001, it will flow out from the drain hole 1006, by Therefore, the chemical solution 1007 is supplemented by the communication hole 1005 between the liquid storage tank 1008 and the processing tank 1009 to compensate for the loss of solution caused by thermal evaporation during the laser processing, and to maintain the processing together with
  • the shape of the communication hole 1005 is not limited in this embodiment, and can be any geometric figure. In some specific embodiments, the shape of the communication hole 1005 is circular, with simple structure and beautiful appearance.
  • the workpiece processing assembly further includes a base pad 1002 and a sample plate 1003 disposed in the processing groove 1009 , the base pad 1002 is disposed at the bottom of the groove body 1001 , and the sample plate 1003 is disposed above the base pad 1002 ,
  • the sample carrier 1003 is used for accommodating the workpiece 1004 to be processed, and a through hole suitable for the chemical solution 1007 to pass through is provided on the sample carrier 1003 .
  • the sample carrier 1003 is provided with a plurality of through holes, and the plurality of through holes are evenly arranged on the sample carrier 1003, so that the chemical solution 1007 can evenly pass through the through holes and contact the workpiece 1004 to be processed.
  • the shape of the through hole is not limited in this embodiment, and can be any geometric figure.
  • the shape of the communication hole 1005 is a circle, which has a simple structure and a beautiful appearance.
  • the materials of the sample carrier 1003 and the base pad 1002 are not limited in this embodiment, as long as they can be guaranteed not to be corroded by the chemical solution 1007.
  • the sample carrier 1003 and the base pad 1002 It is made of glass, with a wide range of raw materials and easy processing.
  • the shapes of the sample carrier 1003 and the base pad 1002 are not limited, and they can be any geometric figures. nice appearance.
  • the size of the sample carrier 1003 and the base pad 1002 is not limited.
  • the number of the sample carrier 1003 and the base pad 1002 is one, and each sample carrier 1003 can only accommodate one
  • the workpiece 1004 to be processed and the area of the base pad 1002 is larger than the area of the sample carrier 1003, and the areas of the base pad 1002 and the sample carrier 1003 are both larger than the area of the workpiece 1004 to be processed.
  • the number is two, the number of the sample carrier 1003 is one, and the two base pads 1002 are respectively arranged on both ends of the bottom of the sample carrier 1003, thereby making the workpiece 1004 to be processed more stable when placed on the sample carrier 1003, which is helpful for In the processing of the workpiece 1004 to be processed.
  • the laser emission module includes a femtosecond laser 2 and an optical shutter 3, the femtosecond laser 2 is used to generate femtosecond pulsed laser light, and the optical shutter 3 is arranged on the femtosecond laser After 2, and the optical shutter 3 is used to pass or block the laser pulse, and control the number of output pulses.
  • the optical path shaping component includes a beam expander 4, a quarter glass lens group 5 and a half glass lens group 6, and the femtosecond laser 2, the optical shutter 3 and the beam expander 4 are coaxial Installed in sequence, the beam expander 4 is used to expand the laser beam, which is convenient for subsequent optical path adjustment or focusing to obtain a smaller spot, and the 1/4 glass lens group 5 is used to adjust the polarization state of the laser from linear polarization to circular polarization. Or elliptically polarized, the half glass lens group 6 is used to adjust the linear polarization angle of the laser.
  • the quarter glass lens group 5 and the half glass lens group 6 are arranged behind the beam expander 4 , and the quarter glass lens group 5 is closer to the beam expander 4 than the half glass lens group 6 set, and the 1/4 glass lens group 5 is suitable for switching between the working position and the non-working position. Therefore, when the quarter glass lens group 5 is in the working position, since the quarter glass lens group 5 is arranged close to the beam expander 4 relative to the half glass lens group 6, the laser beam is expanded by the beam expander 4.
  • the 1/4 glass lens group 5 After the beam, directly enter the 1/4 glass lens group 5, adjust the polarization state of the laser from linear polarization to circular polarization or elliptical polarization, without entering the half glass lens group 6, when the 1/4 glass lens group 5 In the non-working position, after the laser beam is expanded by the beam expander 4, it will directly enter the half-glass lens group 6 to adjust the linear polarization angle of the laser, instead of entering the quarter-glass lens group 5.
  • the output power of the femtosecond laser 2 be controlled to be slightly higher than the ablation threshold of the workpiece material, but also a periodic structure can be induced around the constructed micro-holes or micro-grooves to further improve the electrode Electrochemical properties of materials.
  • the working position in this embodiment refers to the position where the 1/4 glass lens group 5 is in operation
  • the non-working position refers to the position where the 1/4 glass lens group 5 is not working.
  • the non-working position may be a certain position or any place, as long as it is ensured that the 1/4 glass lens group 5 is not in the working position.
  • the 1/4 glass lens group 5 includes a first reflecting mirror 501 , a second reflecting mirror 503 and a quarter glass disposed between the first reflecting mirror 501 and the second reflecting mirror 503 502, and the first mirror 501 and/or the second mirror 503 are adapted to be switched between the reflection station and the non-reflection station.
  • the reflection station in this embodiment refers to the position where the first reflection mirror 501 and/or the second reflection mirror 503 are in operation, and correspondingly, the non-reflection station is the first reflection mirror 501 and/or The position where the second reflecting mirror 503 is not working, and in this embodiment, the non-working position can be a certain position or any place, as long as it is ensured that the first reflecting mirror 501 and/or the second reflecting mirror 503 are not working.
  • the first reflecting mirror 501 and/or the second reflecting mirror 503 can be directly taken out from the working position and placed in a suitable position, as long as the first reflecting mirror 501 and ⁇ Or the second mirror 503 may not participate in the work.
  • the half glass mirror group 6 includes a third mirror 601 , a fourth mirror 603 , and a half glass 602 disposed between the third mirror 601 and the fourth mirror 603 .
  • the laser beam is expanded by the beam expander 4 and then enters the half glass mirror group 6 , the laser light is reflected by the third mirror 601 and passes through the half glass 602 , and is emitted by the fourth mirror 603 .
  • the optical path adjustment component includes a fifth reflector 7, a visible light transmission laser reflector 801, a non-polarized white light beam splitter 802 and an objective lens 9, the reflector reflects the femtosecond laser, adjusts the optical path direction, and the visible light transmits the laser
  • the mirror 801 is used to reflect the femtosecond laser and the white light of the transmission focusing observation component, and the non-polarized white light beam splitter 802 is used to separate the energy of the incident light to obtain the reflected light and refracted light of lower intensity; the objective lens 9 is used for focusing
  • the laser beam emitted by the laser emitting module passes through the optical path shaping component and sequentially passes through the fifth reflector 7, the non-polarized white beam splitter 802, the visible light transmission laser reflector 801 and the objective lens 9, and then the workpiece 1004 to be processed is processed.
  • the laser working module further includes a focusing observation assembly
  • the focusing observation assembly includes a white light source 12 and an observation mirror group 13 for receiving white light
  • the white light emitted by the white light source 12 is the same as the laser emitted by the laser emission module.
  • Coaxially incident on the surface to be processed specifically, the white light emitted by the white light source 12 is coaxially incident with the femtosecond laser through the non-polarized white light beam splitter 802 and the visible light transmission laser mirror 801 and illuminates the surface of the workpiece 1004 to be processed.
  • the white light will be reflected by the surface of the workpiece 1004 to be processed, and enter the observation mirror group 13 through the objective lens 9 , the visible light transmitting laser mirror 801 and the non-polarized white light beam splitter 802 .
  • the observation lens group 13 includes an attenuator 1301, a filter 1302, a CCD 1303 and an optical lens 1304 arranged in sequence according to the incident order of the white light.
  • the attenuator 1301 and the filter 1302 are used to
  • the white light reflected by the workpiece 1004 is converted into a signal that can be processed by the CCD 1303, and the optical lens 1304 is used to convert the signal processed by the CCD 1303 into a digital image signal to observe the relative position of the laser and the workpiece 1004 to be processed.
  • the femtosecond laser material addition and subtraction processing system further includes a power supply module 1, the power supply module 1 is connected to the laser emission module and the laser working module, and the power supply module 1 is used to supply the laser emission module and the laser working module. powered by.
  • the workpiece processing assembly further includes a worktable 11 for placing the workpiece processing pool 10, the worktable 11 is electrically connected to the power module 1, and the worktable 11 is adapted to drive the workpiece processing pool 10 to move to be processed
  • the workpiece 1004 is laser machined.
  • the shape of the workbench 11 is not limited in this embodiment. In some specific embodiments, the workbench 11 is rectangular in shape, with a simple structure and convenient processing.
  • the femtosecond laser material addition and subtraction processing system of this embodiment can, on the one hand, enable the femtosecond laser to reduce the cations in the chemical solution 1007 while processing the microstructure, and deposit them on the microstructure and its surroundings, and finally obtain a surface with The microstructure of the functional coating; on the other hand, there is no obvious thermal effect during the femtosecond laser processing, and the chips and slag generated by the processing are carried away by the chemical solution 1007 and will not accumulate around the microstructure, Therefore, the surface quality of the workpiece processing area can be guaranteed.
  • the chemical solution 1007 is supplemented by the communication hole 1005 between the liquid storage tank 1008 and the processing tank 1009 to make up for the solution loss caused by thermal evaporation during the laser processing, and maintain the processing together with the drain hole 1006 on the side wall of the processing tank 1009
  • the dynamic balance of the liquid level in the tank 1009 ensures the stability of the processing effect.
  • Another embodiment of the present invention provides a processing method for a femtosecond laser material addition and subtraction processing system, comprising the following steps:
  • step S1 the workpiece 1004 to be processed is placed in the processing tank 1009 of the workpiece processing pool 10, and the chemical solution 1007 is added to both the liquid storage tank 1008 and the processing tank 1009, so that the liquid level in the processing tank 1009 is the same as that of the processing tank 1009.
  • the drain hole 1006 is flat;
  • Step S2 turn on the laser emission module, output a low-power femtosecond laser, adjust the positions of the beam expander 4 and the lenses of each mirror group in the laser working module, so that the femtosecond laser spot is in the center of the beam expander 4 and the mirrors of each mirror group, At the same time, the femtosecond laser is vertically incident on the objective lens 9 and focused on the surface of the workpiece 1004 to be processed;
  • Step S3 Turn off the laser emission module, set the output parameters of the laser emission module according to the processing requirements, and then turn on the laser emission module again, and select the 1/4 glass lens group 5 or the half glass lens group in the optical path shaping assembly according to the processing requirements 6.
  • the workpiece 1004 to be processed is processed.
  • step S1 of this embodiment the height of the liquid level in the processing tank 1009 and the drain hole 1006 on the processing tank 1009 are the same as the height of the liquid level in the processing tank 1009 and the drain on the processing tank 1009.
  • the lowest part of hole 1006 is flat;
  • machining the workpiece 1004 to be machined includes:
  • Step S4 controlling the table 11 to move according to a given command to process the workpiece 1004 to be processed
  • Step S5 after the processing is completed, the workpiece 1004 to be processed is dried in the air to obtain a workpiece with a surface coating microstructure.
  • the control is convenient, the control is more intelligent, and the structure is simple and easy to process.
  • step S3 the quarter glass lens group 5 or the half glass lens group 6 in the optical path shaping assembly is selected according to processing requirements to adjust the polarization state of the femtosecond laser, including:
  • step S2 the femtosecond laser is vertically incident on the objective lens 9 and focused on the surface of the workpiece 1004 to be processed by using the focusing and observation component in the laser working module.
  • the processing method of the femtosecond laser material addition/reduction processing system of the present invention has the same advantages as the femtosecond laser material addition/reduction processing system relative to the prior art, which will not be repeated here.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

一种飞秒激光增减材加工系统及加工方法，飞秒激光增减材加工系统包括激光发射模块和激光工作模块，激光工作模块包括光路调整组件、光路整形组件和工件加工组件，激光发射模块发出的激光依次经过光路整形组件和光路调整组件后到达工件加工组件对工件加工组件内的待加工工件（1004）进行激光加工；工件加工组件包括槽体（1001）和设置于槽体（1001）内部的隔离件，隔离件将槽体（1001）分成储液槽（1008）和加工槽（1009），且隔离件与槽体（1001）的底部设置有连通孔（1005），且加工槽（1009）的侧壁设置有适于排液的泄流孔（1006），泄流孔（1006）与槽体（1001）的底部的距离大于待加工工件（1004）与槽体（1001）底部的距离。

Description

一种飞秒激光增减材加工系统及加工方法 技术领域
本发明涉及激光加工技术领域，具体而言，涉及一种飞秒激光增减材加工系统及加工方法。
背景技术
电化学储能技术因其环境友好性、安全性、高效率和长使用寿命等优点，在航空航天、国防军事、仪器仪表等国家重点发展领域的高端装备中都有着广泛的应用。
电化学储能器件的能量转换效率、比容量和倍率性能等指标与电极的材料性质和宏微观结构密切相关。现有的较为成熟的电极构筑技术，如化学合成组装、湿法纺丝和喷墨打印等，存在材料局限性大、工艺复杂、重复性差等问题。近年来，飞秒激光加工技术因其对材料周围影响极小，能安全地切割、打孔、雕刻，被广泛应用于微加工领域，但是空气环境下飞秒激光与固体材料相互作用会在材料表面产生烧蚀碎屑，继而影响了工件加工区域的表面质量。
发明内容
本发明解决的问题是现有飞秒激光加工技术在空气环境下应用时，飞秒激光与固体材料相互作用会在材料表面产生烧蚀碎屑，继而影响了工件加工区域的表面质量。
为解决上述问题，本发明提供一种飞秒激光增减材加工系统，包括激光发射模块和激光工作模块，所述激光工作模块包括光路调整组件、光路整形组件和工件加工组件，所述激光发射模块发出的激光依次经过所述光路整形组件和所述光路调整组件后到达所述工件加工组件对所述工件加工组件内的待加工工件进行激光加工；
所述工件加工组件包括工件加工池，所述工件加工池包括槽体和设置于所述槽体内部的隔离件，所述隔离件将所述槽体分成储液槽和用于放置待加工工件的加工槽，且所述隔离件与所述槽体的底部设置有连通孔，所述储液 槽用于存储化学溶液并通过所述连通孔向所述加工槽内输送所述化学溶液，且所述加工槽的侧壁设置有适于排液的泄流孔，所述泄流孔与所述槽体的底部的距离大于所述待加工工件与所述槽体底部的距离。
可选地，所述光路整形组件包括扩束镜、1/4玻片镜组和半玻片镜组，所述1/4玻片镜组和所述半玻片镜组设置于所述扩束镜的光路下游，所述1/4玻片镜组相对于所述半玻片镜组靠近所述扩束镜设置，且所述1/4玻片镜组适于在工作位与非工作位之间切换。
可选地，所述1/4玻片镜组包括第一反射镜、第二反射镜以及设置于所述第一反射镜与所述第二反射镜之间的1/4玻片，且所述第一反射镜和\或所述第二反射镜适于在反射工位与非反射工位之间切换。
可选地，所述半玻片镜组包括第三反射镜、第四反射镜以及设置于所述第三反射镜与所述第四反射镜之间的半玻片。
可选地，所述光路调整组件包括第五反射镜、可见光透射激光反射镜、非偏振白光分束镜和物镜，所述激光发射模块发出的激光经过所述光路整形组件后依次经过所述第五反射镜、所述非偏振白光分束镜、所述可见光透射激光反射镜和所述物镜后对所述待加工工件进行加工。
可选地，所述激光工作模块还包括聚焦观测组件，所述聚焦观测组件包括白光光源和用于接收白光的观测镜组，且所述白光光源发射的白光与所述激光发射模块发射的激光同轴入射到所述待加工工件的表面。
可选地，所述观测镜组包括按照所述白光的入射顺序依次排列的衰减片、滤光片、CCD和光学镜头，所述衰减片和所述滤光片用于将被所述待加工工件反射后的白光转变为所述CCD能够处理的信号，所述光学镜头用于根据所述CCD处理后的信号转换成数字图像信号以观测所述激光与所述待加工工件的相对位置。
可选地，所述的飞秒激光增减材加工系统，还包括电源模块，所述电源模块与所述激光发射模块和所述激光工作模块相连，且所述电源模块用于向所述激光发射模块和所述激光工作模块供电。
可选地，所述工件加工组件还包括用于放置所述工件加工池的工作台，所述工作台与所述电源模块电连接，且所述工作台适于带动所述工件加工池 移动。
可选地，所述工件加工组件还包括设置于所述加工槽内的基垫和载样板，所述基垫设置于所述槽体的底部，所述载样板设置于所述基垫的上方，所述载样板用于容纳所述待加工工件，且所述载样板上设置适于所述化学溶液透过的通孔。
可选地，所述激光发射模块包括飞秒激光器和光学快门，所述飞秒激光器、所述光学快门和所述扩束镜同轴线依次安装，且所述飞秒激光器用于产生飞秒激光，所述光学快门用于通过或阻断激光脉冲。
与现有技术比较，本发明所述飞秒激光增减材加工系统：
其一，能够使飞秒激光在加工微结构的同时还原化学溶液中的阳离子，并在微结构及其周围沉积，最终获得表面带有功能性涂层的微结构；
其二，飞秒激光加工过程中不会产生明显的热效应，且加工产生的碎屑和熔渣都被化学溶液带走，不会在微结构周围堆积，因此工件加工区域的表面质量能够得到保证；
其三，借助储液槽与加工槽之间的连通孔补充化学溶液，弥补激光加工过程中热蒸发所导致的溶液损耗，并与加工槽侧壁的泄流孔共同维持加工槽中液面高度的动态平衡，从而保证加工效果的稳定性。
为解决上述技术问题，本发明还提供了一种飞秒激光增减材加工系统的加工方法，基于所述飞秒激光增减材加工系统，包括如下步骤：
步骤S1、将待加工工件放置于工件加工池的加工槽中，在储液槽和加工槽中均加入化学溶液，使得所述加工槽中的液面高度与所述加工槽上的泄流孔持平；
步骤S2、打开激光发射模块，输出低功率飞秒激光，调整激光工作模块中扩束镜和各镜组镜片的位置，使得飞秒激光光斑处于所述扩束镜和所述各镜组镜片的中心，同时使得飞秒激光垂直入射到物镜并聚焦到所述待加工工件的表面；
步骤S3、关闭所述激光发射模块，按加工要求设定所述激光发射模块的输出参数后重新打开所述激光发射模块，并根据所述加工要求选择光路整形组件中的1/4玻片镜组或半玻片镜组以调整飞秒激光的偏振状态，对所述 待加工工件进行加工。
可选地，步骤S3中所述根据所述加工要求选择光路整形组件中的1/4玻片镜组或半玻片镜组以调整飞秒激光的偏振状态，包括：
若需使用椭圆偏振光，则移动所述1/4玻片镜组中的第一反射镜和第二反射镜进入反射工位，旋转所述1/4玻片镜组中的1/4玻片以调整飞秒激光的偏振状态；
若需使用线偏振光，则移动所述1/4玻片镜组中的第一反射镜和第二反射镜进入非反射工位，旋转所述半玻片镜组中的半玻片以调整飞秒激光的偏振状态。
可选地，步骤S2中利用所述激光工作模块中的聚焦观测组件使得飞秒激光垂直入射到物镜并聚焦到所述待加工工件的表面。
本发明所述的飞秒激光增减材加工系统的加工方法与所述飞秒激光增减材加工系统相对于现有技术的优势相同，在此不再赘述。
附图说明
图1为本发明实施例中飞秒激光增减材加工系统的结构框图；
图2为本发明实施例中飞秒激光增减材加工系统的结构示意图；
图3为本发明实施例中工件加工池的结构示意图；
图4为本发明实施例中工件加工池的剖视图。
附图标记说明：
1-电源模块，2-飞秒激光器，3-光学快门，4-扩束镜，5-1/4玻片镜组，501-第一反射镜，502-1/4玻片，503-第二反射镜，6-半玻片镜组，601-第三反射镜，602-半玻片，603-第四反射镜，7-第五反射镜，801-可见光透射激光反射镜，802-非偏振白光分束镜，9-物镜，10-工件加工池，1001-槽体，1002-基垫，1003-载样板，1004-待加工工件，1005-连通孔，1006-泄流孔，1007-化学溶液，1008-储液槽，1009-加工槽，11-工作台，12-白光光源，13-观测镜组，1301-衰减片，1302-滤光片，1303-CCD，1304-光学镜头。
具体实施方式
下面将结合附图对本申请实施例中的技术方案进行清楚、详尽地描述。在本发明的描述中，需要理解的是，附图中“X”的正向代表右方，“X”的反向代表左方，“Y”的正向代表上方，“Y”的反向代表下方，“Z”的正向代表前方，“Z”的反向代表后方，且术语“X”、“Y”和“Z”指示的方位或位置关系为基于说明书附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
术语“第一”、“第二”、……、“第五”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、……、“第五”的特征可以明示或者隐含地包括至少一个该特征。
术语“一些具体实施例”的描述意指结合该实施例或示例描述的具体特征、结构、材料或特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施或实例。而且，描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
如图2所示，本发明实施例提供一种飞秒激光增减材加工系统，包括激光发射模块和激光工作模块，激光工作模块包括光路调整组件、光路整形组件和工件加工组件，激光发射模块发出的激光依次经过光路整形组件和光路调整组件后到达工件加工组件对工件加工组件内的待加工工件1004进行激光加工；
工件加工组件包括工件加工池10，工件加工池10包括槽体1001和设置于槽体1001内部的隔离件，隔离件将槽体1001分成储液槽1008和用于放置待加工工件1004的加工槽1009，且隔离件与槽体1001的底部设置有连通孔1005，储液槽1008用于存储化学溶液1007并通过连通孔1005向加工槽1009内输送化学溶液1007，且加工槽1009的侧壁设置有适于排液的泄流孔1006，泄流孔1006与槽体1001的底部的距离大于待加工工件1004与槽体1001底部的距离，需要说明的是，本实施例中泄流孔1006与槽体1001的底部的距离是指泄流孔1006的最低处与槽体1001的底部的距离， 本实施例中待加工工件1004与槽体1001底部的距离是指待加工工件1004的最高处与槽体1001底部的距离。
因此，本实施例的飞秒激光增减材加工系统利用飞秒激光在化学溶液1007中加工电极材料，能够构筑电极微结构的同时，还原化学溶液中的阳离子，在微结构表面一体构筑功能性导电涂层，且飞秒激光加工过程中不会产生明显的热效应，且加工产生的碎屑和熔渣都被化学溶液1007带走，不会在微结构周围堆积，因此工件加工区域的表面质量能够得到保证，另外，借助储液槽1008与加工槽1009之间的连通孔1005补充化学溶液1007，弥补激光加工过程中热蒸发所导致的溶液损耗，并与加工槽1009侧壁的泄流孔1006共同维持加工槽1009中液面高度的动态平衡，从而保证加工效果的稳定性。
如图3和图4所示，需要说明的是，本实施例中对于隔离件的形状不做限制，可以为任意几何图形，只要能将储液槽1008与加工槽1009隔离开即可，在一些具体的实施例中，隔离件的形状为长方形，且长方形的较长的底边与槽底相连接，长方形的两个较短的侧边与槽体1001的侧壁相连接，且较长的底边设置有连通孔1005，结构简单，且除连通孔1005处外，长方形与槽体1001相连接的各边均与槽体1001密封连接，有效的保证储液槽1008中的化学溶液1007仅能通过连通孔1005进入加工槽1009。
需要说明的是，本实施例中储液槽1008中的化学溶液1007要远多于加工槽1009中化学溶液1007，当激光加工过程中热蒸发导致溶液损耗后，储液槽1008中的化学溶液1007会通过连通孔1005补充至加工槽1009中，使得加工槽1009中的化学溶液1007的液面高度能够略高于待加工工件1004，而当加工槽1009中的化学溶液1007的液面高度达到泄流孔1006高度时，即当加工槽1009中的化学溶液1007的液面高度大于泄流孔1006的最低处到达槽体1001的底壁的距离时，便会从泄流孔1006流出，由此，借助储液槽1008与加工槽1009之间的连通孔1005补充化学溶液1007，弥补激光加工过程中热蒸发所导致的溶液损耗，并与加工槽1009侧壁的泄流孔1006共同维持加工槽1009中液面高度的动态平衡，从而保证加工效果的稳定性。
需要说明的是，本实施例中对于连通孔1005的形状不做限制，可以为 任意几何图形，在一些具体的实施例中，连通孔1005的形状为圆形，结构简单，外形美观。
在一些优选的实施例中，工件加工组件还包括设置于加工槽1009内的基垫1002和载样板1003，基垫1002设置于槽体1001的底部，载样板1003设置于基垫1002的上方，载样板1003用于容纳待加工工件1004，且载样板1003上设置适于化学溶液1007透过的通孔。
在一些实施例中，载样板1003上设置多个通孔，且多个通孔均匀设置于载样板1003上，能够使化学溶液1007均匀透过通孔与待加工工件1004接触，需要说明的是，本实施例中对于通孔的形状不做限制，可以为任意几何图形，在一些具体的实施例中，连通孔1005的形状为圆形，结构简单，外形美观。
需要说明的是，本实施例中对于载样板1003和基垫1002的材质不做限制，只要能够保证不被化学溶液1007腐蚀即可，在一些优选的实施例中，载样板1003和基垫1002为玻璃材质，原料来源广泛，加工容易。另外，本实施例中对于载样板1003和基垫1002的形状也不做限制，可以为任意几何图形，在一些具体的实施例中，载样板1003和基垫1002的形状为长方形，结构简单，外形美观。
本实施例中，对于载样板1003和基垫1002的大小也不做限制，在一些优选的实施例中，载样板1003和基垫1002的数量均为一个，每一个载样板1003仅能容纳一个待加工工件1004，且基垫1002的面积大于载样板1003的面积，而基垫1002和载样板1003的面积均大于待加工工件1004的面积，在另一些优选的实施例中，基垫1002的数量为两个，载样板1003的数量为一个，且两个基垫1002分别设置于载样板1003底部的两端，由此，使得待加工工件1004在载样板1003上放置时更加稳定，有助于待加工工件1004的加工。
如图1和图2所示，在一些优选的实施例中，激光发射模块包括飞秒激光器2和光学快门3，飞秒激光器2用于产生飞秒脉冲激光，光学快门3设置于飞秒激光器2之后，且光学快门3用于通过或阻断激光脉冲，控制输出的脉冲个数。
在一些优选的实施例中，光路整形组件包括扩束镜4、1/4玻片镜组5和半玻片镜组6，且飞秒激光器2、光学快门3和扩束镜4同轴线依次安装，扩束镜4用于将激光光束扩束，便于后续光路调整或聚焦后获得更小的光斑，1/4玻片镜组5用于将激光的偏振态从线偏振调整为圆偏振或椭圆偏振，半玻片镜组6用于调整激光的线偏振角度。
本实施例中，1/4玻片镜组5和半玻片镜组6设置于扩束镜4的后方，1/4玻片镜组5相对于半玻片镜组6靠近扩束镜4设置，且1/4玻片镜组5适于在工作位与非工作位之间切换。由此，当1/4玻片镜组5处于工作位时，由于1/4玻片镜组5相对于半玻片镜组6靠近扩束镜4设置，因此，激光经过扩束镜4扩束后，直接进入1/4玻片镜组5，将激光的偏振态从线偏振调整为圆偏振或椭圆偏振，而不会进入半玻片镜组6，当1/4玻片镜组5处于非工作位时，激光经过扩束镜4扩束后，将直接进入半玻片镜组6，调整激光的线偏振角度，而不会进入1/4玻片镜组5。通过切换不同的玻片镜组，不但能够控制飞秒激光器2输出功率略高于工件材料的烧蚀阈值，同时还能够在构筑的微孔或微槽的周围诱导形成周期性结构，进一步提升电极材料的电化学性能。
需要说明的是，本实施例中工作位是指1/4玻片镜组5在工作时所在的位置，相应地，非工作位是指1/4玻片镜组5不工作时所在的位置，且本实施例中非工作位可以为一个确定的位置，也可以为任意处，只要保证1/4玻片镜组5不在工作位即可。
在一些优选的实施例中，1/4玻片镜组5包括第一反射镜501、第二反射镜503以及设置于第一反射镜501与第二反射镜503之间的1/4玻片502，且第一反射镜501和\或第二反射镜503适于在反射工位与非反射工位之间切换。
需要说明的是，本实施例中反射工位是指第一反射镜501和\或第二反射镜503在工作时所在的位置，相应地，非反射工位是第一反射镜501和\或第二反射镜503不工作时所在的位置，且本实施例中非工作位可以为一个确定的位置，也可以为任意处，只要保证第一反射镜501和\或第二反射镜503不在工作位即可，在一些具优选的实施例中，可以直接将第一反射镜501 和\或第二反射镜503从工作位中取出，放置在合适的位置，只要保证第一反射镜501和\或第二反射镜503不参与工作即可。
在一些优选的实施例中，半玻片镜组6包括第三反射镜601、第四反射镜603以及设置于第三反射镜601与第四反射镜603之间的半玻片602。当激光经过扩束镜4扩束后进入半玻片镜组6后，激光经第三反射镜601反射从半玻片602通过，并经第四反射镜603射出。
在一些优选的实施例中，光路调整组件包括第五反射镜7、可见光透射激光反射镜801、非偏振白光分束镜802和物镜9，反射镜反射飞秒激光，调整光路方向，可见光透射激光反射镜801用于反射飞秒激光和透射聚焦观测组件的白光，非偏振白光分束镜802用于将入射光的能量进行分离，获得更低强度的反射光和折射光；物镜9用于聚焦激光光束，且激光发射模块发出的激光经过光路整形组件后依次经过第五反射镜7、非偏振白光分束镜802、可见光透射激光反射镜801和物镜9后对待加工工件1004进行加工。
在一些优选的实施例中，激光工作模块还包括聚焦观测组件，聚焦观测组件包括白光光源12和用于接收白光的观测镜组13，且白光光源12发射的白光与激光发射模块发射的激光同轴入射到待加工表面，具体地，白光光源12发出的白光经由非偏振白光分束镜802和可见光透射激光反射镜801，与飞秒激光同轴入射并照亮待加工工件1004的表面，部分白光会被待加工工件1004表面反射，经由物镜9、可见光透射激光反射镜801和非偏振白光分束镜802进入观测镜组13。
在一些优选的实施例中，观测镜组13包括按照白光的入射顺序依次排列的衰减片1301、滤光片1302、CCD1303和光学镜头1304，衰减片1301和滤光片1302用于将被待加工工件1004反射后的白光转变为CCD1303能够处理的信号，光学镜头1304用于根据CCD1303处理后的信号转换成数字图像信号以观测激光与待加工工件1004的相对位置。
在一些优选的实施例中，飞秒激光增减材加工系统，还包括电源模块1，电源模块1与激光发射模块和激光工作模块相连，且电源模块1用于向激光发射模块和激光工作模块供电。
在一些优选的实施例中，工件加工组件还包括用于放置工件加工池10 的工作台11，工作台11与电源模块1电连接，且工作台11适于带动工件加工池10移动以对待加工工件1004进行激光加工。需要说明的是，本实施例中对于工作台11的形状不做限制，在一些具体的实施例中，工作台11的形状为长方形，结构简单，加工方便。
因此，本实施例的飞秒激光增减材加工系统，一方面能够使飞秒激光在加工微结构的同时还原化学溶液1007中的阳离子，并在微结构及其周围沉积，最终获得表面带有功能性涂层的微结构；另一方面，飞秒激光加工过程中不会产生明显的热效应，且加工产生的碎屑和熔渣都被化学溶液1007带走，不会在微结构周围堆积，因此工件加工区域的表面质量能够得到保证。
另外，借助储液槽1008与加工槽1009之间的连通孔1005补充化学溶液1007，弥补激光加工过程中热蒸发所导致的溶液损耗，并与加工槽1009侧壁的泄流孔1006共同维持加工槽1009中液面高度的动态平衡，从而保证加工效果的稳定性。
本发明的另一个实施例提供了一种飞秒激光增减材加工系统的加工方法，包括如下步骤：
步骤S1、将待加工工件1004放置于工件加工池10的加工槽1009中，在储液槽1008和加工槽1009中均加入化学溶液1007，使得加工槽1009中的液面高度与加工槽1009上的泄流孔1006持平；
步骤S2、打开激光发射模块，输出低功率飞秒激光，调整激光工作模块中扩束镜4和各镜组镜片的位置，使得飞秒激光光斑处于扩束镜4和各镜组镜片的中心，同时使得飞秒激光垂直入射到物镜9并聚焦到待加工工件1004的表面；
步骤S3、关闭激光发射模块，按加工要求设定激光发射模块的输出参数后重新打开激光发射模块，并根据加工要求选择光路整形组件中的1/4玻片镜组5或半玻片镜组6以调整飞秒激光的偏振状态，对待加工工件1004进行加工。
需要说明的是，本实施例步骤S1中，加工槽1009中的液面高度与加工槽1009上的泄流孔1006持平具体是指加工槽1009中的液面高度与加工槽1009 上的泄流孔1006的最低处持平；
在一些优选的实施例中，对待加工工件1004进行加工包括：
步骤S4、控制工作台11按给定指令移动以加工待加工工件1004；
步骤S5、加工结束后，将待加工工件1004置于空气中干燥，获得具有表面涂层微结构的工件。
由此，通过控制工作台11移动对待加工工件1004进行加工，控制方便，更加智能化，且结构简单，容易加工。
在一些优选的实施例中，步骤S3中根据加工要求选择光路整形组件中的1/4玻片镜组5或半玻片镜组6以调整飞秒激光的偏振状态，包括：
若需使用椭圆偏振光，则移动1/4玻片镜组5中的第一反射镜501和第二反射镜503进入反射工位，旋转1/4玻片镜组5中的1/4玻片502以调整飞秒激光的偏振状态；
若需使用线偏振光，则移动1/4玻片镜组5中的第一反射镜501和第二反射镜503进入非反射工位，旋转半玻片镜组6中的半玻片602以调整飞秒激光的偏振状态。
在一些优选的实施例中，步骤S2中利用激光工作模块中的聚焦观测组件使得飞秒激光垂直入射到物镜9并聚焦到待加工工件1004的表面。
本发明的飞秒激光增减材加工系统的加工方法与飞秒激光增减材加工系统相对于现有技术的优势相同，在此不再赘述。
虽然本公开披露如上，但本公开的保护范围并非仅限于此。本领域技术人员在不脱离本公开的精神和范围的前提下，可进行各种变更与修改，这些变更与修改均将落入本发明的保护范围。

Claims (14)

  1. 一种飞秒激光增减材加工系统，其中，包括激光发射模块和激光工作模块，所述激光工作模块包括光路调整组件、光路整形组件和工件加工组件，所述激光发射模块发出的激光依次经过所述光路整形组件和所述光路调整组件后到达所述工件加工组件对所述工件加工组件内的待加工工件(1004)进行激光加工；
    所述工件加工组件包括工件加工池(10)，所述工件加工池(10)包括槽体(1001)和设置于所述槽体(1001)内部的隔离件，所述隔离件将所述槽体(1001)分成储液槽(1008)和用于放置所述待加工工件(1004)的加工槽(1009)，且所述隔离件与所述槽体(1001)的底部设置有连通孔(1005)，所述储液槽(1008)用于存储化学溶液(1007)，并通过所述连通孔(1005)向所述加工槽(1009)内输送所述化学溶液(1007)，且所述加工槽(1009)的侧壁设置有适于排液的泄流孔(1006)，所述泄流孔(1006)与所述槽体(1001)的底部的距离大于所述待加工工件(1004)与所述槽体(1001)底部的距离。
  2. 根据权利要求1所述的飞秒激光增减材加工系统，其中，所述光路整形组件包括扩束镜(4)、1/4玻片镜组(5)和半玻片镜组(6)，所述1/4玻片镜组(5)和所述半玻片镜组(6)设置于所述扩束镜(4)的光路下游，所述1/4玻片镜组(5)相对于所述半玻片镜组(6)靠近所述扩束镜(4)设置，且所述1/4玻片镜组(5)适于在工作位与非工作位之间切换。
  3. 根据权利要求2所述的飞秒激光增减材加工系统，其中，所述1/4玻片镜组(5)包括第一反射镜(501)、第二反射镜(503)以及设置于所述第一反射镜(501)与所述第二反射镜(503)之间的1/4玻片(502)，且所述第一反射镜(501)和\或所述第二反射镜(503)适于在反射工位与非反射工位之间切换。
  4. 根据权利要求2所述的飞秒激光增减材加工系统，其中，所述半玻片镜组(6)包括第三反射镜(601)、第四反射镜(603)以及设置于所述第三反射镜(601)与所述第四反射镜(603)之间的半玻片(602)。
  5. 根据权利要求2所述的飞秒激光增减材加工系统，其中，所述光路调 整组件包括第五反射镜(7)、可见光透射激光反射镜(801)、非偏振白光分束镜(802)和物镜(9)，所述激光发射模块发出的激光经过所述光路整形组件后依次经过所述第五反射镜(7)、所述非偏振白光分束镜(802)、所述可见光透射激光反射镜(801)和所述物镜(9)后对所述待加工工件(1004)进行加工。
  6. 根据权利要求1所述的飞秒激光增减材加工系统，其中，所述激光工作模块还包括聚焦观测组件，所述聚焦观测组件包括白光光源(12)和用于接收白光的观测镜组(13)，且所述白光光源(12)发射的白光与所述激光发射模块发射的激光同轴入射到所述待加工工件(1004)的表面。
  7. 根据权利要求6所述的飞秒激光增减材加工系统，其中，所述观测镜组(13)包括按照所述白光的入射顺序依次排列的衰减片(1301)、滤光片(1302)、CCD(1303)和光学镜头(1304)，所述衰减片(1301)和所述滤光片(1302)用于将所述待加工工件(1004)反射后的白光转变为所述CCD(1303)能够处理的信号，所述光学镜头(1304)用于根据所述CCD(1303)处理后的信号转换成数字图像信号以观测所述激光与所述待加工工件(1004)的相对位置。
  8. 根据权利要求1所述的飞秒激光增减材加工系统，其中，还包括电源模块(1)，所述电源模块(1)与所述激光发射模块和所述激光工作模块相连，且所述电源模块(1)用于向所述激光发射模块和所述激光工作模块供电。
  9. 根据权利要求8所述的飞秒激光增减材加工系统，其中，所述工件加工组件还包括用于放置所述工件加工池(10)的工作台(11)，所述工作台(11)与所述电源模块(1)电连接，且所述工作台(11)适于带动所述工件加工池(10)移动。
  10. 根据权利要求1所述的飞秒激光增减材加工系统，其中，所述工件加工组件还包括设置于所述加工槽(1009)内的基垫(1002)和载样板(1003)，所述基垫(1002)设置于所述槽体(1001)的底部，所述载样板(1003)设置于所述基垫(1002)的上方，所述载样板(1003)用于容纳所述待加工工件(1004)，且所述载样板(1003)上设置适于所述化学溶液(1007)透过 的通孔。
  11. 根据权利要求2所述的飞秒激光增减材加工系统，其中，所述激光发射模块包括飞秒激光器(2)和光学快门(3)，所述飞秒激光器(2)、所述光学快门(3)和所述扩束镜(4)同轴线依次安装，且所述飞秒激光器(2)用于产生飞秒激光，所述光学快门(3)用于通过或阻断激光脉冲。
  12. 一种飞秒激光增减材加工系统的加工方法，基于如权利要求1-11任一项所述的飞秒激光增减材加工系统，其中，包括如下步骤：
    步骤S1、将待加工工件(1004)放置于工件加工池(10)的加工槽(1009)中，在储液槽(1008)和加工槽(1009)中均加入化学溶液(1007)，使得所述加工槽(1009)中的液面高度与所述加工槽(1009)上的泄流孔(1006)持平；
    步骤S2、打开激光发射模块，输出低功率飞秒激光，调整激光工作模块中扩束镜(4)和各镜组镜片的位置，使得飞秒激光光斑处于所述扩束镜(4)和所述各镜组镜片的中心，同时使得飞秒激光垂直入射到物镜(9)并聚焦到所述待加工工件(1004)的表面；
    步骤S3、关闭所述激光发射模块，按加工要求设定所述激光发射模块的输出参数后重新打开所述激光发射模块，并根据所述加工要求选择光路整形组件中的1/4玻片镜组(5)或半玻片镜组(6)以调整飞秒激光的偏振状态，对所述待加工工件(1004)进行加工。
  13. 根据权利要求12所述的飞秒激光增减材加工系统的加工方法，其中，步骤S3中所述根据所述加工要求选择光路整形组件中的1/4玻片镜组(5)或半玻片镜组(6)以调整飞秒激光的偏振状态，包括：
    若需使用椭圆偏振光，则移动所述1/4玻片镜组(5)中的第一反射镜(501)和第二反射镜(503)进入反射工位，旋转所述1/4玻片镜组(5)中的1/4玻片(502)以调整飞秒激光的偏振状态；
    若需使用线偏振光，则移动所述1/4玻片镜组(5)中的第一反射镜(501)和第二反射镜(503)进入非反射工位，旋转所述半玻片镜组(6)中的半玻片(602)以调整飞秒激光的偏振状态。
  14. 根据权利要求12所述的飞秒激光增减材加工系统的加工方法，其中， 步骤S2中，利用所述激光工作模块中的聚焦观测组件使得飞秒激光垂直入射到物镜(9)并聚焦到所述待加工工件(1004)的表面。
PCT/CN2021/128548 2021-03-19 2021-11-04 一种飞秒激光增减材加工系统及加工方法 WO2022193678A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110297092.4 2021-03-19
CN202110297092.4A CN113020798B (zh) 2021-03-19 2021-03-19 一种飞秒激光增减材加工系统及加工方法

Publications (1)

Publication Number Publication Date
WO2022193678A1 true WO2022193678A1 (zh) 2022-09-22

Family

ID=76471882

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/128548 WO2022193678A1 (zh) 2021-03-19 2021-11-04 一种飞秒激光增减材加工系统及加工方法

Country Status (2)

Country Link
CN (1) CN113020798B (zh)
WO (1) WO2022193678A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113020798B (zh) * 2021-03-19 2022-06-14 哈尔滨工业大学 一种飞秒激光增减材加工系统及加工方法
CN114054969B (zh) * 2021-11-30 2024-05-03 哈尔滨工业大学 一种柔性非对称电极的超快激光加工方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050105085A1 (en) * 2003-10-12 2005-05-19 Fuji Photo Film Co., Ltd. Microstructure for use in Raman spectrometry and production process for the microstructure
CN101474721A (zh) * 2009-01-16 2009-07-08 深圳市木森科技有限公司 激光加工方法及激光加工设备
CN206211260U (zh) * 2016-08-18 2017-05-31 中国科学院嘉兴微电子仪器与设备工程中心 一种激光偏振控制模块
CN107953027A (zh) * 2018-01-15 2018-04-24 哈尔滨工业大学 一种脉冲组合的飞秒-纳秒激光加工系统及加工方法
CN109913919A (zh) * 2019-02-18 2019-06-21 江苏大学 一种在工件表面制备微纳二维结构的加工方法及装置
CN111360392A (zh) * 2020-03-04 2020-07-03 北京航空航天大学合肥创新研究院 一种陶瓷植入物表面飞秒激光加工方法
CN113020798A (zh) * 2021-03-19 2021-06-25 哈尔滨工业大学 一种飞秒激光增减材加工系统及加工方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11192577A (ja) * 1998-01-05 1999-07-21 Mitsubishi Electric Corp ワークテーブル装置
JP5272186B2 (ja) * 2008-12-25 2013-08-28 コマツ産機株式会社 レーザ加工方法及びレーザ加工装置
JP5411299B2 (ja) * 2009-02-17 2014-02-12 マクアリスター テクノロジーズ エルエルシー 電解セルおよびその使用方法
CN102311095B (zh) * 2011-08-09 2013-11-06 吉林大学 一种在微流控芯片中制备多级金属微纳结构的方法
JP2014022337A (ja) * 2012-07-23 2014-02-03 Sharp Corp 非水系二次電池およびその注液方法
CN104411429B (zh) * 2012-09-12 2017-09-26 M技术株式会社 金属微粒的制造方法
CN203200060U (zh) * 2013-04-03 2013-09-18 李艳美 连续电解氧化还原生成器设备
CN104164683A (zh) * 2014-08-22 2014-11-26 温州市工业科学研究院 点阵阳极式电还原金属沉积零件3d打印装备
CN104576824B (zh) * 2014-10-23 2017-02-01 云南大学 一种新的晶硅太阳能电池前栅线电极开槽方法以及该太阳能电池的制造方法
CN104911953B (zh) * 2015-06-25 2016-08-24 武汉大学 基于飞秒激光技术的古字画防破损和修复系统及方法
US10259078B2 (en) * 2015-06-30 2019-04-16 Motorola Mobility Llc Antenna structure and methods for changing an intrinsic property of a substrate material of the antenna structure
US10139047B2 (en) * 2015-07-13 2018-11-27 Keystone Engineering Company Stress relieved welds in positive expulsion fuel tanks with elastomeric diaphragm
FR3045675A1 (fr) * 2015-12-17 2017-06-23 Univ Toulouse Iii - Paul Sabatier Procede de fabrication d'une piece ou d'une microstructure supportee par insolation laser a partir d'un oxalate de metal
EP3504748A1 (en) * 2016-08-25 2019-07-03 Alliance for Sustainable Energy, LLC Long-life rechargeable ion batteries
TWI617073B (zh) * 2016-11-25 2018-03-01 財團法人工業技術研究院 電池電極結構及其製作方法
CN106881507B (zh) * 2017-04-24 2019-10-11 广东工业大学 一种用于电解加工平面曲折群沟槽的装置及电解加工方法
CN107723761B (zh) * 2017-08-24 2019-04-02 江苏大学 一种激光冲击压电陶瓷定域微细电沉积的装置及方法
CN108220915B (zh) * 2017-12-30 2020-04-07 天津大学 一种面向图形化金刚石薄膜制备的微增减材复合制造方法
CN108563101A (zh) * 2018-05-24 2018-09-21 华中科技大学 一种光刻胶、微纳温湿敏感智能器件及其制备方法
CN109128531B (zh) * 2018-09-27 2020-05-22 广东工业大学 一种复合介质辅助的激光微孔加工方法
CN109686593A (zh) * 2019-01-17 2019-04-26 西安交通大学 一种基于二次激光辐照制备MnO2/石墨烯复合电极的方法
CN109676379B (zh) * 2019-01-24 2020-09-11 长春理工大学 激光刻蚀电化学微增材换热功能表面的制备装置及方法
CN109913930B (zh) * 2019-03-03 2020-10-20 吉林大学 阵列复合电场金属电化学微纳尺度增材制造装置及方法
CN109827947B (zh) * 2019-03-08 2021-06-11 北京理工大学 一种基于局域光场增强的飞秒激光光还原制造表面增强拉曼基底的方法
CN110408769B (zh) * 2019-07-02 2021-07-20 江苏大学 飞秒激光冲击提高镁合金耐腐蚀性的装置和方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050105085A1 (en) * 2003-10-12 2005-05-19 Fuji Photo Film Co., Ltd. Microstructure for use in Raman spectrometry and production process for the microstructure
CN101474721A (zh) * 2009-01-16 2009-07-08 深圳市木森科技有限公司 激光加工方法及激光加工设备
CN206211260U (zh) * 2016-08-18 2017-05-31 中国科学院嘉兴微电子仪器与设备工程中心 一种激光偏振控制模块
CN107953027A (zh) * 2018-01-15 2018-04-24 哈尔滨工业大学 一种脉冲组合的飞秒-纳秒激光加工系统及加工方法
CN109913919A (zh) * 2019-02-18 2019-06-21 江苏大学 一种在工件表面制备微纳二维结构的加工方法及装置
CN111360392A (zh) * 2020-03-04 2020-07-03 北京航空航天大学合肥创新研究院 一种陶瓷植入物表面飞秒激光加工方法
CN113020798A (zh) * 2021-03-19 2021-06-25 哈尔滨工业大学 一种飞秒激光增减材加工系统及加工方法

Also Published As

Publication number Publication date
CN113020798A (zh) 2021-06-25
CN113020798B (zh) 2022-06-14

Similar Documents

Publication Publication Date Title
WO2022193678A1 (zh) 一种飞秒激光增减材加工系统及加工方法
CN106994557B (zh) 一种激光焦点位置动态可控的激光加工系统及方法
CN103203541B (zh) 一种激光加工装置
US11471978B2 (en) Laser oscillator, laser machining device in which same is used, and laser oscillation method
CN102481665A (zh) 采用具有至少5mm 的边缘厚度的ZnS 透镜的激光聚焦头和激光切割装置以及使用这样的聚焦头的方法
CN212569305U (zh) 一种激光光束整形装置
CN107717215B (zh) 多功能超快激光微细加工系统及其方法
CN110449731A (zh) 一种激光变锥变径旋切孔加工光学系统
CN108098147A (zh) 一种用于pcb阵列微孔的双面激光加工方法
CN110076450A (zh) 双光束激光加工光学系统
CN210548825U (zh) 双光束激光加工光学系统
CN107824959A (zh) 一种激光打孔方法及系统
WO2019114466A1 (zh) 一种显示产品的制作方法及一种激光加工装置
CN114161005B (zh) 一种三维扫描式微小孔结构的加工方法及装置
CN113634769A (zh) 基于高斯光束、光束整形复合光束的金属slm打印系统
CN210548826U (zh) 激光微孔加工的光束扫描系统
CN1978120B (zh) 激光加工系统
CN212083832U (zh) 激光开槽的光学系统、激光器及带有激光器的设备
CN111871967A (zh) 一种激光清洗设备
KR101435404B1 (ko) 이중 파장 하이브리드 레이저 가공장치 및 가공방법
CN104716554B (zh) 光纤端面泵浦布儒斯特角腔内选频355nm紫外激光器
CN113909225A (zh) 一种激光清洗与激光抛光复合加工装置及方法
CN113319425B (zh) 一种多轴激光扫描光学系统
CN114054970B (zh) 一种柔性双面电极的超快激光加工方法
CN113067241A (zh) 一种多棒串接端面泵浦谐振腔

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21931253

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21931253

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 21931253

Country of ref document: EP

Kind code of ref document: A1