WO2022191192A1 - 圧電素子、圧電装置、および圧電素子の製造方法 - Google Patents
圧電素子、圧電装置、および圧電素子の製造方法 Download PDFInfo
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/02—Microphones
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/304—Beam type
- H10N30/306—Cantilevers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L23/00—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid
- G01L23/08—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid operated electrically
- G01L23/10—Devices or apparatus for measuring or indicating or recording rapid changes, such as oscillations, in the pressure of steam, gas, or liquid; Indicators for determining work or energy of steam, internal-combustion, or other fluid-pressure engines from the condition of the working fluid operated electrically by pressure-sensitive members of the piezoelectric type
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R29/00—Monitoring arrangements; Testing arrangements
- H04R29/004—Monitoring arrangements; Testing arrangements for microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R3/00—Circuits for transducers, loudspeakers or microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/24—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges
Definitions
- the present disclosure relates to a piezoelectric element having a vibration region, a piezoelectric device, and a method of manufacturing the piezoelectric element.
- the piezoelectric element has a configuration in which a piezoelectric film and an electrode film electrically connected to the piezoelectric film are laminated on a support.
- a recess is formed in the support, and a part of the piezoelectric film and the electrode film is a floating region floating from the support.
- the floating region is divided into a plurality of regions by forming slits in the floating region, thereby forming vibration regions.
- each vibration region is in a state of being cantilevered by the support.
- Each vibration region has a substantially triangular planar shape, and the mass of one end on the support side is made heavier than the mass of the other end on the opposite side.
- An object of the present disclosure is to provide a piezoelectric element, a piezoelectric device, and a method for manufacturing the piezoelectric element that can improve detection accuracy.
- a piezoelectric element has a support and an electrode film disposed on the support and electrically connected to the piezoelectric film and the piezoelectric film, and is supported by the support.
- a vibrating portion having a support region; and a plurality of vibration regions, one end of which is supported by the support region and the other end of which is opposite to the one end suspended from the support, wherein a plurality of vibrations
- the region consists of a vibrating region in which the mass on the one end side is heavier than the mass on the other end side, and which serves as a pressure detection portion that outputs a first detection signal based on the charge of the piezoelectric film, and a vibration region on the other end side where the mass on the other end side and a vibrating region that is made heavier than the mass of the part and serves as an acceleration detection part that outputs a second detection signal based on the charge of the piezoelectric film.
- the mass of the acceleration detection unit on the other end side is made heavier than the mass on the one end side. Therefore, the acceleration detector has a lower roll-off frequency than the pressure detector. Therefore, when the frequency of the pressure to be detected is less than a predetermined threshold, the pressure is detected using the second detection signal from the acceleration detection section, thereby improving detection accuracy on the low frequency side. can.
- a piezoelectric device includes the above-described piezoelectric element and a control unit that performs predetermined processing, the control unit being applied based on the first detection signal and the second detection signal.
- the pressure frequency is derived, the derived frequency is compared with a predetermined threshold, and if it is determined that the derived frequency is less than the predetermined threshold, the pressure is detected based on the second detection signal, and the derived frequency is the predetermined is equal to or greater than the threshold, the pressure is detected based on the first detection signal.
- control unit detects the pressure based on the second detection signal when determining that the frequency of the derived pressure is less than the predetermined threshold. Therefore, it is possible to improve the detection accuracy on the low frequency side.
- a piezoelectric device includes a support and an electrode film disposed on the support and electrically connected to the piezoelectric film and the piezoelectric film, supported by the support.
- a piezoelectric element having a support region; a vibration region having one end supported by the support region and a vibration region having the other end opposite to the one end suspended from the support; a control unit for performing processing, wherein a plurality of piezoelectric elements are provided, the mass on one end side is made heavier than the mass on the other end side, and the pressure detection unit outputs a first detection signal based on the charge of the piezoelectric film.
- control unit derives the frequency of the applied pressure based on the first detection signal and the second detection signal, compares the derived frequency with a predetermined threshold value, and determines that the derived frequency is a predetermined value. If it is determined that the frequency is less than the threshold, the pressure is detected based on the second detection signal, and if it is determined that the derived frequency is equal to or greater than the predetermined threshold, the pressure is detected based on the first detection signal.
- the mass of the acceleration detection unit on the other end side is made heavier than the mass on the one end side. Therefore, the acceleration detector has a lower roll-off frequency than the pressure detector. Then, when the controller determines that the frequency of the derived pressure is less than the predetermined threshold value, the controller detects the pressure based on the second detection signal. Therefore, it is possible to improve the detection accuracy on the low frequency side.
- the above-described method for manufacturing a piezoelectric element includes preparing a support, forming a piezoelectric film and an electrode film on the support, and supporting the piezoelectric film through the piezoelectric film.
- a vibrating region is formed by forming a vibration region forming part by forming a slit reaching the body, and by forming a concave portion from the opposite side of the support to the piezoelectric film side to float the vibrating region forming part.
- the pressure detection section and the acceleration detection section are formed in the same process by adjusting the shape of the slit. Therefore, the manufacturing process can be simplified.
- FIG. 1 is a cross-sectional view of a piezoelectric device according to a first embodiment
- FIG. FIG. 2 is a plan view of the piezoelectric element shown in FIG. 1
- 3 is a cross-sectional view taken along line III-III in FIG. 2
- FIG. FIG. 4 is a diagram showing the relationship between frequency and output frequency characteristics
- 4A to 4C are cross-sectional views showing a method for manufacturing the piezoelectric element according to the first embodiment
- 5B is a cross-sectional view showing the method of manufacturing the piezoelectric element continued from FIG. 5A
- FIG. FIG. 5C is a cross-sectional view showing the method for manufacturing the piezoelectric element continued from FIG. 5B
- FIG. 4 is a diagram showing the relationship between frequency and frequency characteristics of noise;
- FIG. 8 is a plan view of a piezoelectric element in a second embodiment;
- FIG. 11 is a plan view of a piezoelectric element in a third embodiment;
- FIG. 11 is a plan view of a piezoelectric element in a fourth embodiment;
- FIG. 11 is a cross-sectional view of a piezoelectric device according to a fifth embodiment;
- FIG. 11 is a cross-sectional view of a piezoelectric device according to a sixth embodiment;
- FIG. 10 is a cross-sectional view of a piezoelectric device according to another embodiment;
- the piezoelectric device S10 of the first embodiment is preferably used for detecting pressure such as sound pressure of 1 to 20000 Hz, which is an audible range. preferred.
- the piezoelectric device S10 of the present embodiment is preferably installed in an electronic device or the like that exhibits a wake-up function that can obtain an output according to displacement without a power supply, and is used to detect the displacement. be.
- the piezoelectric device S10 of this embodiment includes a circuit board 2 having a piezoelectric element 1 and a control section 200.
- the piezoelectric element 1 and the circuit board 2 are accommodated in a casing 100.
- the configuration of the piezoelectric element 1 of this embodiment will be described.
- the piezoelectric element 1 includes a support 10 and a vibrating portion 20, and has a rectangular planar shape.
- the support 10 has a support substrate 11 having one surface 11 a and the other surface 11 b and an insulating film 12 formed on the one surface 11 a of the support substrate 11 .
- the support substrate 11 is made of, for example, a silicon substrate or the like, and the insulating film 12 is made of an oxide film or the like.
- the vibrating portion 20 is arranged on the support 10 and has a piezoelectric film 30 and an electrode film 40 electrically connected to the piezoelectric film 30 .
- the piezoelectric film 30 is made of, for example, lead-free piezoelectric ceramics such as scandium aluminum nitride (ScAlN) or aluminum nitride (AlN).
- the electrode film 40 is made of molybdenum, copper, platinum, platinum, titanium, or the like.
- the piezoelectric film 30 has a lower piezoelectric film 31 and an upper piezoelectric film 32 laminated on the lower piezoelectric film 31 .
- the electrode film 40 includes a lower electrode film 41 arranged below the lower piezoelectric film 31, an intermediate electrode film 42 arranged between the lower piezoelectric film 31 and the upper piezoelectric film 32, and an upper piezoelectric film 32. It has an upper electrode film 43 disposed thereon. That is, the vibrating portion 20 has a bimorph structure in which the lower piezoelectric film 31 is sandwiched between the lower electrode film 41 and the intermediate electrode film 42, and the upper piezoelectric film 32 is sandwiched between the intermediate electrode film 42 and the upper electrode film 43. It is The vibrating section 20 then outputs a detection signal corresponding to the capacitance between the lower electrode film 41 and the intermediate electrode film 42 and the capacitance between the intermediate electrode film 42 and the upper electrode film 43 .
- Each electrode film 40 is formed in each vibration region 22 of the vibration section 20, which will be described later.
- Each electrode film 40 is appropriately connected to a wiring (not shown) formed in a support region 21a, which will be described later, of the vibrating portion 20, and is connected to the circuit board 2 via an electrode portion (not shown) formed in the support region 21a. be done.
- the vibrating portion 20 of this embodiment has a base film 50 on which the lower piezoelectric film 31 and the lower electrode film 41 are arranged. That is, the piezoelectric film 30 and the electrode film 40 are arranged on the support 10 with the base film 50 interposed therebetween.
- the base film 50 is not necessarily required, but is provided to facilitate crystal growth when forming the lower layer piezoelectric film 31 and the like.
- the base film 50 of the present embodiment is made of aluminum nitride or the like.
- the piezoelectric film 30 has a thickness of about 1 ⁇ m, and the base film 50 has a thickness of about several tens of nanometers. That is, the base film 50 is made extremely thin with respect to the piezoelectric film 30 .
- the support 10 is formed with a recess 10a for floating the inner edge side of the vibrating portion 20. Therefore, the vibrating portion 20 has a support region 21a arranged on the support 10 and a floating region 21b that is connected to the support region 21a and floats above the recess 10a.
- the concave portion 10a of the present embodiment has a planar rectangular shape at the opening end on the vibrating portion 20 side. Therefore, the shape of the inner edge of the support region 21a is a rectangle having first to fourth sides 211 to 214. As shown in FIG.
- a slit 60 penetrating through the floating region 21b in the thickness direction is formed in the floating region 21b.
- the slit 60 divides the floating area 21b into six areas, and each divided area is cantilevered by the support area 21a.
- Each of the six divided regions functions as the vibration region 22 .
- Each vibration area 22 is composed of the same constituent elements, and functions are divided according to the planar shape, although the details will be described later.
- Each vibrating region 22 vibrates to change the electric charge of the piezoelectric film 30 , so that the electrode film 40 outputs a detection signal corresponding to the electric charge.
- each vibration region 22 of this embodiment will be described below.
- the end of each vibration region 22 that is a fixed end on the side of the support region 21a is referred to as one end 221
- the end of each vibration region 22 that is a free end on the side opposite to the support region 21a is referred to as the other end 222.
- the surface of the vibration region 22 opposite to the support 10 is referred to as one surface 22a of the vibration region 22
- the surface of the vibration region 22 facing the support 10 is referred to as the other surface 22b of the vibration region 22.
- each of the six vibration regions 22 has a substantially triangular planar shape.
- Two of the six vibration regions 22 are formed such that the mass on the one end 221 side is heavier than the mass on the other end 222 side.
- the two vibrating regions 22 have a substantially triangular planar shape as described above. It is formed so that the sides consist of one apex angle.
- the width of the two vibration regions 22 on the one end 221 side is greater than that on the other end 222 side in the direction normal to the one surface 22a and the other surface 22b of the vibration regions 22 (hereinafter also simply referred to as the normal direction). Wider than wide. Note that the width in the present embodiment is the length along the surface direction of the vibration region 22 in the direction intersecting with the extending direction of the vibration region 22 from the support region 21a side.
- Such a vibrating region 22 vibrates according to the pressure directly applied to the vibrating region 22 and outputs a detection signal based on the vibration.
- the vibration area 22 has a larger mass on the one end 221 side than on the other end 222 side, and outputs a detection signal corresponding to a state in which a uniformly distributed load is applied.
- a vibration region 22 will be referred to as a pressure detection section 220a
- a detection signal output from the pressure detection section 220a will be referred to as a first detection signal.
- the pressure detection unit 220a has a smaller mass on the other end 222 side than the mass on the one end side compared to the acceleration detection unit 220b, which will be described later.
- the four vibration regions 22 out of the six vibration regions 22 are formed so that the mass on the other end 222 side is heavier than the mass on the one end 221 side.
- the four vibration regions 22 have a substantially triangular planar shape (in other words, a substantially trapezoidal planar shape) as described above, and the one end 221 side is configured with one vertex side.
- the other end 222 is formed by the remaining two apex sides.
- the width of the four vibration regions 22 on the side of the other end 222 is wider than the width on the side of the one end 221 in the normal direction.
- Such a vibration region 22 has a heavier mass on the other end 222 side than the pressure detection part 220a, so that it is difficult to vibrate due to the pressure directly applied to the vibration region 22.
- Such vibration region 22 outputs a detection signal corresponding to the acceleration based on the pressure applied to the entire piezoelectric element 1 .
- the vibration area 22 has a mass on the other end 222 side larger than that on the one end side, and outputs a detection signal corresponding to a state in which a tip load is applied.
- the vibration region 22 will be referred to as the acceleration detection section 220b, and the detection signal output from the acceleration detection section 220b will be referred to as the second detection signal.
- the detection signal corresponding to the acceleration based on the pressure applied to the entire piezoelectric element 1 includes the vibration caused by the pressure applied to the entire piezoelectric element 1, the air vibration, and the weight of the other end 222 side. It is a signal based on vibration etc. caused by its own weight due to being held. In addition, since the mass of the other end portion 222 side of the vibration region 22 is made heavier than the mass of the one end portion 221 side, the vibration region 22 is caused to vibrate by the pressure that escapes through the slit 60 between the adjacent vibration regions 22 . 22 is difficult to vibrate.
- the piezoelectric element 1 of the present embodiment is configured to have two pressure detection units 220a and four acceleration detection units 220b.
- the piezoelectric element 1 of this embodiment is a so-called composite sensor.
- the pressure detection section 220a outputs a first detection signal based on the pressure directly applied to the vibration region 22, and the acceleration detection section 220b applies the pressure to the entire piezoelectric element 1.
- a second detection signal based on the pressure or the like is output.
- the four pressure detection units 220a are connected in series and output one first detection signal.
- the two acceleration detectors 220b are connected in series and output one second detection signal.
- the mass of the one end portion 221 side of the pressure detection portion 220a is larger than the mass of the other end portion 222 side of the pressure detection portion 220a. weighted. Therefore, as shown in FIG. 4, the pressure detection unit 220a and the acceleration detection unit 220b have different low-frequency roll-off frequencies fr1 and fr2 and resonance frequencies f1 and f2.
- the low roll-off frequency fr2 of the second detection signal output from the acceleration detection section 220b is lower than the low roll-off frequency fr1 of the first detection signal output from the pressure detection section 220a.
- the low-frequency roll-off frequency fr2 of the second detection signal is approximately 1 Hz
- the low-frequency roll-off frequency fr1 of the first detection signal is approximately 100 Hz.
- the resonance frequency f2 of the acceleration detection section 220b is lower than the resonance frequency f1 of the pressure detection section 220a.
- the resonance frequency f2 of the acceleration detection section 220b is approximately 4.5 kHz
- the resonance frequency f1 of the pressure detection section 220a is approximately 13 kHz.
- FIG. 4 uses the output of the first detection signal output from the pressure detection section 220a when the frequency is 1 kHz as the reference (that is, 0 dB). Further, detailed numerical values of the low-frequency roll-off frequencies fr1 and fr2 and the resonance frequencies f1 and f2 can be appropriately changed by adjusting the width of the other end portion 222 side of the vibration region 22 and the like. However, when the pressure detection unit 220a and the acceleration detection unit 220b are configured with the magnitude relationship between the masses of the one end 221 and the other end 222 defined as described above, the low-frequency roll-off frequency of the second detection signal fr2 is lower than the low frequency roll-off frequency fr1 of the first detection signal.
- the pressure detection section 220a and the acceleration detection section 220b of the present embodiment are provided with one end 221 side supported by the opposing first side 211 and third side 213 in the support area 21a.
- the first side 211 is provided with one pressure detection section 220a and two acceleration detection sections 220b.
- one pressure detection unit 220 a is provided at a position including the center of the first side 211 .
- the two acceleration detection units 220b are provided on the first side 211 so as to sandwich the pressure detection unit 220a.
- the third side 213 is provided with one pressure detector 220a and two acceleration detectors 220b.
- one pressure detection unit 220 a is provided at a position including the center of the third side 213 .
- the two acceleration detection units 220b are provided on the third side 213 so as to sandwich the pressure detection unit 220a.
- the circuit board 2 performs predetermined processing, and has a control section 200 in this embodiment.
- the control unit 200 is composed of a CPU, a microcomputer having storage units such as a ROM, a RAM, and a nonvolatile RAM, and is connected to the piezoelectric element 1 .
- the control unit 200 implements various control operations by having the CPU read and execute programs from the ROM or the nonvolatile RAM.
- Various data for example, initial values, lookup tables, maps, etc.
- a storage medium such as a ROM is a non-transitional substantive storage medium.
- CPU is an abbreviation for Central Processing Unit
- ROM is an abbreviation for Read Only Memory
- RAM is an abbreviation for Random Access Memory.
- the control unit 200 of this embodiment derives the frequency of the applied pressure based on the first detection signal output from the pressure detection unit 220a and the second detection signal output from the acceleration detection unit 220b. For example, the control unit 200 derives the frequency of the applied pressure by performing Fourier analysis based on the first detection signal and the second detection signal.
- the control unit 200 determines that the derived frequency is equal to or higher than the predetermined threshold value, the control unit 200 detects the applied pressure using the first detection signal. Further, when the control unit 200 determines that the derived frequency is less than the predetermined threshold value, the control unit 200 detects the applied pressure using the second detection signal.
- the predetermined threshold value is set based on the low-frequency roll-off frequency fr1 of the pressure detection section 220a, and is set to 100 Hz in this embodiment, for example.
- the casing 100 includes a printed circuit board 101 on which the piezoelectric element 1 and the circuit board 2 are mounted, and a lid portion 102 fixed to the printed circuit board 101 so as to accommodate the piezoelectric element 1 and the circuit board 2. and
- the printed circuit board 101 corresponds to a mounted member.
- the printed circuit board 101 has wiring portions, through-hole electrodes, and the like formed as appropriate, and electronic components such as capacitors (not shown) are mounted as necessary.
- the other surface 11b of the support substrate 11 of the piezoelectric element 1 is mounted on one surface 101a of the printed circuit board 101 via a bonding member 3 such as an adhesive.
- the circuit board 2 is mounted on one surface 101a of the printed circuit board 101 via a joint member 4 made of a conductive member.
- the piezoelectric element 1 and the circuit board 2 are electrically connected via bonding wires 110 .
- the lid portion 102 is made of metal, plastic, resin, or the like, and is fixed to the printed circuit board 101 via a bonding member such as an adhesive (not shown) so as to accommodate the piezoelectric element 1 and the circuit board 2 . ing.
- a through hole 101b is formed in a portion of the printed circuit board 101 that faces the vibration region 22 to allow communication between the inside and the outside of the casing 100 .
- the through-hole 101b has a substantially cylindrical shape, and is formed such that its central axis coincides with the central portion of the vibrating portion 20 in the normal direction.
- the pressure detection section 220a and the acceleration detection section 220b output first and second detection signals to the circuit board 2 according to the change in charge. Specifically, the pressure detection unit 220a outputs a first detection signal based on the pressure introduced into the recess 10a from the through hole 101b.
- the acceleration detection unit 220b outputs a second detection signal based on the pressure or the like applied to the entire piezoelectric device S10 (that is, the entire piezoelectric element 1).
- the control unit 200 performs the above operations. Specifically, the control unit 200 derives the frequency of the applied pressure based on the first detection signal and the second detection signal. Then, when the derived frequency is less than a predetermined threshold, the pressure is detected using the second detection signal, and when the derived frequency is greater than or equal to the predetermined threshold, the pressure is detected using the first detection signal. to detect
- FIGS. 5A to 5C are sectional views of a portion corresponding to FIG. 3.
- FIG. 5A to 5C are sectional views of a portion corresponding to FIG. 3.
- a base film 50, a piezoelectric film 30, an electrode film 40, etc. are formed on a support 10 having a support substrate 11 and an insulating film 12 is prepared. That is, the piezoelectric element 1 shown in FIG. 3 in which the concave portion 10a and the slit 60 are not formed is prepared. Note that the piezoelectric film 30 and the electrode film 40 formed in the process of FIG. 5A constitute the vibrating portion 20 . Therefore, in FIG. 5A, the same reference numerals as those of the one surface 22a and the other surface 22b of the vibration region 22 are attached.
- a vibration region forming portion 230 that becomes the vibration region 22 is formed by forming a recess 10a, which will be described later.
- the pressure detecting portion 220a in which the mass on the one end portion 221 side is heavier than the mass on the other end portion 222 side, and Acceleration detecting section 220b, which is heavier than mass is configured. That is, in the present embodiment, the pressure detection section 220a and the acceleration detection section 220b are separated only by the shape of the slit 60, and have the same configuration other than the planar shape.
- the vibration region forming portion 230 is a portion that becomes the vibration region 22 by forming the concave portion 10a.
- the one surface and the other surface of the vibration region forming part 230 are given the same reference numerals as the one surface 22a and the other surface 22b of the vibration region 22. As shown in FIG.
- etching is performed from the other surface 11b of the support substrate 11 so as to penetrate the insulating film 12 and reach the base film 50, thereby forming the recesses 10a.
- the insulating film 12 is removed by isotropic wet etching to form the concave portion 10a.
- the vibration region forming portion 230 is suspended from the support 10 to form the vibration region 22, and the piezoelectric element 1 shown in FIG. 1 is manufactured.
- the configured vibration region 22 has a configuration including the pressure detection section 220a and the acceleration detection section 220b.
- a protective resist or the like covering the upper piezoelectric film 32 and the upper electrode film 43 may be placed to form the concave portion 10a. According to this, when forming the recessed part 10a, it can suppress that the vibration area
- the piezoelectric device S10 has the pressure detection section 220a and the acceleration detection section 220b. Therefore, detection accuracy can be improved. That is, when the piezoelectric element 1 includes only the pressure detection portion 220a in which the mass on the one end portion 221 side is larger than the mass on the other end portion 222 side, the detection signal output from the pressure detection portion 220a is shown in FIG. be able to Note that FIG. 6 is based on the output when the frequency is 1 kHz (that is, 0 dB).
- the detection signal is a constant signal containing white noise at frequencies higher than 1 kHz, but at frequencies lower than 1 kHz, the lower the frequency, the larger the 1/f noise becomes. . That is, the detection accuracy of the detection signal from the pressure detection section 220a decreases as the frequency decreases. This is because when the pressure has a low frequency, the mass on the one end 221 side of the pressure detection part 220a is made heavier than the mass on the other end 222 side, so that the pressure coming out of the slit 60 has a greater influence. .
- the acceleration detection section 220b in addition to the pressure detection section 220a, the acceleration detection section 220b is provided. Further, the acceleration detection section 220b makes the mass of the other end portion 222 side heavier than the mass of the one end portion 221 side so that the low-frequency roll-off frequency fr2 of the second detection signal is equal to the low-frequency roll-off frequency of the first detection signal. It is made lower than fr1. Then, the piezoelectric device S10 detects the pressure based on the second detection signal when the pressure is less than the predetermined threshold. Therefore, in the piezoelectric device S10 of the present embodiment, the low-frequency pressure that lowers the detection accuracy of the pressure detection unit 220a is detected based on the second detection signal from the acceleration detection unit 220b. can be improved. Further, by improving detection accuracy on the low frequency side, AOP (abbreviation of Acoustic Over Point) can be improved.
- AOP abbreviation of Acoustic Over Point
- the pressure detection section 220a and the acceleration detection section 220b are supported by the common support area 21a. That is, the pressure detection section 220a and the acceleration detection section 220b are arranged on the common support 10 . Therefore, the number of parts can be reduced as compared with the case where the pressure detection section 220a and the acceleration detection section 220b are formed in separate piezoelectric elements 1 to configure the piezoelectric device S10.
- the pressure detection section 220a and the acceleration detection section 220b have different functions depending on the planar shape, and the basic components are the same. Therefore, simplification of the configuration can be achieved. Further, when manufacturing such a piezoelectric element 1, the pressure detection section 220a and the acceleration detection section 220b are formed in the same process by adjusting the shape of the slit 60. As shown in FIG. Therefore, the manufacturing process can be simplified.
- the support region 21a of the piezoelectric element 1 is provided with a temperature detection section 70.
- the temperature detection unit 70 is composed of a temperature sensitive resistor or the like whose resistance value changes according to the temperature.
- the control unit 200 of this embodiment is connected to the temperature detection unit 70 and performs predetermined temperature correction based on the temperature detection signal from the temperature detection unit 70 .
- the vibration region 22 is configured by laminating the piezoelectric film 30 and the electrode film 40 as described above. Therefore, the vibration region 22 may warp when the ambient temperature changes due to the use environment or the like because the piezoelectric film 30 and the electrode film 40 have different coefficients of linear expansion. Therefore, the control unit 200 derives the warp of the vibration region 22 from the temperature detection signal, performs temperature correction based on the derived warp, and detects the pressure.
- the relationship between the temperature and the warp of the vibration region 22 is derived in advance by experiments or the like, and auxiliary data regarding the temperature and the warp of the vibration region 22 is stored in the control unit 200 . Then, the control unit 200 derives the warp of the vibration region 22 based on the temperature detection signal and the auxiliary data, and performs temperature correction for deriving a correction signal that reduces the influence of the warp from the first detection signal and the second detection signal. and detect the pressure using the correction signal.
- the direction and magnitude of the warp of the vibration region 22 change depending on the temperature, the material and thickness of the piezoelectric film 30 and the electrode film 40, and the like. Therefore, it is preferable that the auxiliary data be created in consideration of the actual material, thickness, etc. of the piezoelectric film 30 and the electrode film 40 .
- the piezoelectric element 1 is provided with the pressure detection section 220a and the acceleration detection section 220b, and the control section 200 detects the pressure based on a predetermined threshold value. can be suppressed.
- the support region 21a of the piezoelectric element 1 is provided with the temperature detection section 70. Then, the control unit 200 performs temperature correction based on the temperature detection signal. Therefore, according to the piezoelectric device S10 of the present embodiment, detection accuracy can be further improved.
- a third embodiment will be described.
- the present embodiment differs from the first embodiment in the configurations of the pressure detection section 220a and the acceleration detection section 220b. Others are the same as those of the first embodiment, so description thereof is omitted here.
- the first side 211 is provided with one acceleration detection section 220b on the fourth side 214 side and one pressure detection section 220a on the second side 212 side.
- a portion including the boundary between the first side 211 and the second side 212 is provided with one pressure detection section 220a.
- the third side 213 is provided with one acceleration detection section 220b on the second side 212 side and one pressure detection section 220a on the fourth side 214 side.
- a portion including the boundary between the third side 213 and the fourth side 214 is provided with one pressure detection section 220a.
- the piezoelectric element 1 is provided with the pressure detection section 220a and the acceleration detection section 220b, and the control section 200 detects the pressure based on a predetermined threshold value. can be suppressed.
- the number of pressure detection units 220a and acceleration detection units 220b can be changed as appropriate.
- the piezoelectric element 1 of the present embodiment has four pressure detecting portions in one region from the virtual line K with respect to the virtual line K connecting two predetermined locations on the inner edge side of the support region 21a. 220a are collectively arranged. Also, in the piezoelectric element 1, two acceleration detectors 220b are collectively arranged in the other area from the virtual line K. As shown in FIG. 9, the piezoelectric element 1 of the present embodiment has four pressure detecting portions in one region from the virtual line K with respect to the virtual line K connecting two predetermined locations on the inner edge side of the support region 21a. 220a are collectively arranged. Also, in the piezoelectric element 1, two acceleration detectors 220b are collectively arranged in the other area from the virtual line K. As shown in FIG.
- the virtual line K in this embodiment is a polygonal line that connects the central portion C of the floating region 21b and the inner edge portion of the support region 21a.
- the imaginary line K may be a straight line, or may be a line that does not pass through the central portion C.
- the piezoelectric element 1 is provided with the pressure detection section 220a and the acceleration detection section 220b, and the control section 200 detects the pressure based on a predetermined threshold value. can be suppressed.
- the pressure detection section 220a and the acceleration detection section 220b are collectively arranged. Therefore, it is possible to facilitate routing of the wirings formed in the support region 21a and connected to the electrode film 40, thereby simplifying the configuration.
- the through hole 101b is formed in a portion facing the pressure detection section 220a, and is not formed in a portion facing the acceleration detection section 220b. . That is, in the through holes 101b of this embodiment, the distance between the opposing side surfaces is narrower than in the first embodiment.
- a partition wall 120 is arranged around the through hole 101b of the printed circuit board 101 .
- the printed circuit board 101 is divided into a first space S1 surrounded by the pressure detection unit 220a and the printed circuit board 101 and a second space S2 surrounded by the acceleration detection unit 220b and the printed circuit board 101.
- a wall 120 is arranged.
- the printed circuit board 101 is provided with a partition wall 120 that separates a portion facing the pressure detection section 220a from a portion facing the acceleration detection section 220b.
- the partition wall 120 is configured by, for example, placing a potting material made of a resin material at a predetermined location on the printed circuit board 101 .
- the division here includes the case where the first space S1 and the second space S2 are communicated with each other through a gap or the like.
- the piezoelectric element 1 is provided with the pressure detection section 220a and the acceleration detection section 220b, and the control section 200 detects the pressure based on a predetermined threshold value. can be suppressed.
- the first space S1 and the second space S2 are separated. Therefore, the pressure introduced into the concave portion 10a through the through hole 101b is less likely to be directly applied to the acceleration detection section 220b, and the acceleration detection section 220b is less likely to vibrate due to the pressure. Then, the second detection signal is less likely to be affected by vibration caused by the pressure introduced into the recess 10a from the through hole 101b. Therefore, it is possible to further improve the detection accuracy.
- the recess 10a is formed so as to form a partition wall 13 that separates the first space S1 and the second space S2.
- the concave portion 10a forms a partition wall 13 that separates a first space S1 surrounded by the pressure detecting portion 220a and the support 10 and a second space S2 surrounded by the acceleration detecting portion 220b and the support 10.
- the partition wall 13 is arranged in the space within the recess 10a so as to separate the first space S1 on the side of the pressure detection unit 220a from the second space S2 on the side of the acceleration detection unit 220b.
- the partition wall 120 in the said 5th Embodiment is not formed in this embodiment.
- the partition wall 13 of this embodiment is composed of the support substrate 11 and the insulating film 12 .
- the piezoelectric element 1 is provided with the pressure detection section 220a and the acceleration detection section 220b, and the control section 200 detects the pressure based on a predetermined threshold value. can be suppressed. Moreover, even if the partition wall 13 is provided in the piezoelectric element 1, the same effects as those of the fifth embodiment can be obtained.
- the pressure detection unit 220a and the acceleration detection unit 220b may be arranged on different supports 10. That is, in the first embodiment, two piezoelectric elements 1 may be provided, one piezoelectric element 1 may be provided with the pressure detection section 220a, and the other piezoelectric element 1 may be provided with the acceleration detection section 220b. .
- the through hole 101b may be formed so as to communicate with the recessed portion 10a of the piezoelectric element 1 in which the pressure detecting portion 220a is formed.
- control unit 200 may not be provided on the circuit board 2 .
- control unit 200 may be provided in another circuit unit arranged outside casing 100 .
- the number of pressure detection units 220a and acceleration detection units 220b can be changed as appropriate.
- one pressure detection unit 220a and one acceleration detection unit 220b may be formed.
- the vibrating portion 20 may be configured to have at least one layer of the piezoelectric film 30 and one layer of the electrode film 40 .
- the piezoelectric element 1 may have a polygonal shape such as a pentagonal shape or a hexagonal shape instead of a rectangular shape in plan view.
- the planar shape of the floating region 21b may be a polygonal shape such as a substantially pentagonal shape or a substantially hexagonal shape instead of the substantially rectangular shape.
- a through hole 102a may be formed in the lid portion 102.
- the cover part 102 should just be equipped with a partition wall.
- the second embodiment may be combined with the third to sixth embodiments, and the temperature detection unit 70 may be provided.
- the third embodiment may be combined with the fifth and sixth embodiments to change the numbers of the pressure detection units 220a and the acceleration detection units 220b.
- the fourth embodiment may be combined with the fifth and sixth embodiments to collectively arrange the pressure detection units 220a and collectively arrange the acceleration detection units 220b.
- the partition wall 120 may be arranged on the printed circuit board 101 and the partition wall 13 may be arranged on the piezoelectric element 1 .
- the controller and techniques described in this disclosure may be implemented by a dedicated computer provided by configuring a processor and memory programmed to perform one or more functions embodied by the computer program.
- the controls and techniques described in this disclosure may be implemented by a dedicated computer provided by configuring the processor with one or more dedicated hardware logic circuits.
- the control units and techniques described in this disclosure can be implemented by a combination of a processor and memory programmed to perform one or more functions and a processor configured by one or more hardware logic circuits. It may also be implemented by one or more dedicated computers configured.
- the computer program may also be stored as computer-executable instructions on a computer-readable non-transitional tangible recording medium.
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Abstract
Description
本開示は、検出精度の向上を図ることができる圧電素子、圧電装置、および圧電素子の製造方法を提供することを目的とする。
第1実施形態の圧電装置S10の構成について、図1~図3を参照しつつ説明する。なお、本実施形態の圧電装置S10は、例えば、可聴域である1~20000Hzの音圧等の圧力を検出するのに用いられると好適であり、スマートフォンやAIスピーカ等に搭載されて用いられると好適である。また、本実施形態の圧電装置S10は、例えば、電源無しで変位に応じた出力を得られるウェイクアップ機能を発揮する電子機器等に搭載され、当該変位を検出するのに利用されると好適である。
第2実施形態について説明する。本実施形態は、第1実施形態に対し、圧電素子1に温度検出部を備えたものである。その他に関しては、第1実施形態と同様であるため、ここでは説明を省略する。
第3実施形態について説明する。本実施形態は、第1実施形態に対し、圧力検出部220aおよび加速度検出部220bの構成を変更したものである。その他に関しては、第1実施形態と同様であるため、ここでは説明を省略する。
第4実施形態について説明する。本実施形態は、第3実施形態に対し、圧力検出部220aおよび加速度検出部220bの配置を変更したものである。その他に関しては、第3実施形態と同様であるため、ここでは説明を省略する。
第5実施形態について説明する。本実施形態は、第1実施形態に対し、圧電装置S10の構成を変更したものである。その他に関しては、第1実施形態と同様であるため、ここでは説明を省略する。
第6実施形態について説明する。本実施形態は、第5実施形態に対し、圧電装置S10の構成を変更したものである。その他に関しては、第5実施形態と同様であるため、ここでは説明を省略する。
本開示は、実施形態に準拠して記述されたが、本開示は当該実施形態や構造に限定されるものではないと理解される。本開示は、様々な変形例や均等範囲内の変形をも包含する。加えて、様々な組み合わせや形態、さらには、それらに一要素のみ、それ以上、あるいはそれ以下、を含む他の組み合わせや形態をも、本開示の範疇や思想範囲に入るものである。
Claims (8)
- 圧力を検出する圧電素子であって、
支持体(10)と、
前記支持体上に配置され、圧電膜(30)と前記圧電膜と電気的に接続される電極膜(40)とを有し、前記支持体に支持される支持領域(21a)と、一端部(221)側が前記支持領域に支持されていると共に前記一端部と反対側の他端部(222)側が前記支持体から浮遊している複数の振動領域(22)と、を有する振動部(20)と、を備え、
前記複数の振動領域は、
前記一端部側の質量が前記他端部側の質量より重くされ、前記圧電膜の電荷に基づく第1検出信号を出力する圧力検出部(220a)とされる振動領域と、
前記他端部側の質量が前記一端部側の質量より重くされ、前記圧電膜の電荷に基づく第2検出信号を出力する加速度検出部(220b)とされる振動領域と、を有する圧電素子。 - 前記支持領域には、温度に応じた温度検出信号を出力する温度検出部(70)が配置されている請求項1に記載の圧電素子。
- 前記圧力検出部および前記加速度検出部は、前記振動領域の面方向に沿った方向に延び、前記支持領域における所定の2箇所を通る仮想線(K)に対し、前記仮想線より一方の側に前記圧力検出部が纏めて配置され、前記仮想線より他方の側に前記加速度検出部が纏めて配置されている請求項1または2に記載の圧電素子。
- 前記支持体には、当該支持体から前記振動領域を浮遊させる凹部(10a)が形成されており、
前記凹部は、前記圧力検出部と前記支持体とで囲まれる第1空間(S1)と、前記加速度検出部と前記支持体とで囲まれる第2空間(S2)とを区画する仕切壁(13)が構成される状態で形成されている請求項1ないし3のいずれか1つに記載の圧電素子。 - 圧力を検出する圧電装置であって、
請求項1ないし4のいずれか1つに記載の圧電素子と、
所定の処理を行う制御部(200)と、を備え、
前記制御部は、前記第1検出信号および前記第2検出信号に基づいて印加される前記圧力の周波数を導出すると共に導出した周波数と所定の閾値とを比較し、導出した周波数が前記所定の閾値未満であると判定すると前記第2検出信号に基づいて前記圧力を検出し、導出した周波数が前記所定の閾値以上であると判定すると前記第1検出信号に基づいて前記圧力を検出する圧電装置。 - 前記圧電素子を収容するケーシング(100)を備え、
前記ケーシングには、前記圧力検出部と対向する部分に貫通孔(101b)が形成されていると共に、前記圧力検出部と対向する部分と前記加速度検出部と対向する部分とを区画する仕切壁(120)が配置されている請求項5に記載の圧電装置。 - 圧力を検出する圧電装置であって、
支持体(10)と、前記支持体上に配置され、圧電膜(30)と前記圧電膜と電気的に接続される電極膜(40)とを有し、前記支持体に支持される支持領域(21a)と、一端部(221)側が前記支持領域に支持されていると共に前記一端部と反対側の他端部(222)側が前記支持体から浮遊している振動領域(22)と、を有する振動部(20)と、を備える圧電素子(1)と、
所定の処理を行う制御部(200)と、を備え、
前記圧電素子は、
複数備えられ、
前記一端部側の質量が前記他端部側の質量より重くされ、前記圧電膜の電荷に基づく第1検出信号を出力する圧力検出部(220a)とされる振動領域を有する圧電素子と、
前記他端部側の質量が前記一端部側の質量より重くされ、前記圧電膜の電荷に基づく第2検出信号を出力する加速度検出部(220b)とされる振動領域を有する圧電素子と、を含み、
前記制御部は、前記第1検出信号および前記第2検出信号に基づいて印加される前記圧力の周波数を導出すると共に導出した周波数と所定の閾値とを比較し、導出した周波数が前記所定の閾値未満であると判定すると前記第2検出信号に基づいて前記圧力を検出し、導出した周波数が前記所定の閾値以上であると判定すると前記第1検出信号に基づいて前記圧力を検出する圧電装置。 - 支持体(10)と、
前記支持体上に配置され、圧電膜(30)と前記圧電膜と電気的に接続される電極膜(40)とを有し、前記支持体に支持される支持領域(21a)と、一端部(221)側が前記支持領域に支持されていると共に前記一端部と反対側の他端部(222)側が前記支持体から浮遊している複数の振動領域(22)と、を有する振動部(20)と、を備え、
前記複数の振動領域は、
前記一端部側の質量が前記他端部側の質量より重くされ、前記圧電膜の電荷に基づく第1検出信号を出力する圧力検出部(220a)とされる振動領域と、
前記他端部側の質量が前記一端部側の質量より重くされ、前記圧電膜の電荷に基づく第2検出信号を出力する加速度検出部(220b)とされる振動領域と、を有する圧電素子の製造方法であって、
前記支持体を用意することと、
前記支持体上に、前記圧電膜および前記電極膜を形成することと、
前記圧電膜を貫通して前記支持体に達するスリット(60)を形成することで振動領域構成部分(230)を形成することと、
前記支持体のうちの前記圧電膜側と反対側から凹部(10a)を形成して前記振動領域構成部分を浮遊させることにより、前記振動領域を有する前記振動部を構成することと、を行い、
前記スリットを形成することでは、前記振動部を構成することの際、前記一端部側の質量が前記他端部側の質量より重くされた前記圧力検出部とされる振動領域と、前記他端部側の質量が前記一端部側の質量より重くされた前記加速度検出部とされる振動領域とが構成されるように、前記スリットを形成する圧電素子の製造方法。
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JP2014515214A (ja) * | 2011-03-31 | 2014-06-26 | バクル−コーリング,インコーポレイテッド | ギャップ制御構造を有する音響トランスデューサおよび音響トランスデューサの製造方法 |
JP5936154B2 (ja) | 2011-03-31 | 2016-06-15 | ベスパー テクノロジーズ インコーポレイテッドVesper Technologies Inc. | ギャップ制御構造を有する音響トランスデューサおよび音響トランスデューサの製造方法 |
JP2020522178A (ja) * | 2017-05-26 | 2020-07-27 | フラウンホッファー−ゲゼルシャフト ツァ フェルダールング デァ アンゲヴァンテン フォアシュンク エー.ファオ | マイクロメカニカル音響変換器 |
US20210051414A1 (en) * | 2019-08-16 | 2021-02-18 | Aac Acoustic Technologies (Shenzhen) Co., Ltd. | Piezoelectric MEMS microphone |
CN112423210A (zh) * | 2019-08-21 | 2021-02-26 | 新科实业有限公司 | Mems换能器、mems麦克风以及制造mems换能器的方法 |
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US20230345183A1 (en) | 2023-10-26 |
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