WO2022188474A1 - 一种显示装置 - Google Patents

一种显示装置 Download PDF

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Publication number
WO2022188474A1
WO2022188474A1 PCT/CN2021/134361 CN2021134361W WO2022188474A1 WO 2022188474 A1 WO2022188474 A1 WO 2022188474A1 CN 2021134361 W CN2021134361 W CN 2021134361W WO 2022188474 A1 WO2022188474 A1 WO 2022188474A1
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WIPO (PCT)
Prior art keywords
light
layer
emitting diode
reflective
reflection
Prior art date
Application number
PCT/CN2021/134361
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English (en)
French (fr)
Inventor
丛晓东
张志睿
韩宇
金海洋
张钦泉
张超
李广卿
Original Assignee
海信视像科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from CN202110265542.1A external-priority patent/CN115079465A/zh
Priority claimed from CN202110382807.6A external-priority patent/CN115202095A/zh
Priority claimed from CN202120728841.XU external-priority patent/CN214704248U/zh
Priority claimed from CN202110591605.2A external-priority patent/CN115407549A/zh
Application filed by 海信视像科技股份有限公司 filed Critical 海信视像科技股份有限公司
Publication of WO2022188474A1 publication Critical patent/WO2022188474A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes

Definitions

  • the present application relates to the field of display technology, and in particular, to a display device.
  • liquid crystal display liquid crystal display, LCD for short
  • liquid crystal displays are widely used in notebook computers, digital cameras, digital video recorders , mobile phones, computer screens and LCD TVs and other electronic products.
  • the liquid crystal display panel in the liquid crystal display is a non-self-luminous display panel, the display function can only be generated by the light source provided by the backlight module.
  • backlight modules include edge-lit backlight modules and direct-lit backlight modules.
  • a certain light mixing distance is usually set between the light source and the diffusion plate.
  • the direct type backlight module is applied, a series of optical problems will also be encountered.
  • the display device includes: a display panel and a backlight module;
  • the backlight module includes: a backplane, a circuit board, and a light-emitting device;
  • the light-emitting device includes: a light-emitting diode chip, a first reflection layer, and a second reflection layer, The first reflective layer and the second reflective layer have the property of reflecting light.
  • the light emitted from the LED chip is continuously reflected between the first reflective layer and the second reflective layer, and finally exits from the side of the LED chip, thereby expanding the The exit angle of the light improves the light mixing effect of two adjacent light-emitting devices, so uniform light can be obtained without a large mixing distance, avoiding the obvious lamp shadow phenomenon caused by the reduction of the mixing distance, improving the the display effect of the display device.
  • the first reflective layer and the second reflective layer are Bragg reflectors; both the first reflective layer and the second reflective layer include multiple alternately stacked first and second dielectric layers.
  • the optical thicknesses of the first dielectric layer and the second dielectric layer are 1/4 of the central reflection wavelength, so they are a quarter-wavelength multilayer system, which is equivalent to a simple set of photonic crystals. Since electromagnetic waves with frequencies falling within the energy gap range cannot penetrate, the reflectivity of the first reflection layer and the second reflection layer are both greater than or equal to 99%.
  • the material used for the first dielectric layer is silicon dioxide, and the first dielectric layer made of silicon dioxide is not easy to decompose and absorb, and has better scattering properties.
  • the material used for the second medium layer is titanium dioxide, and the second medium layer made of titanium dioxide has higher hardness and can improve the comprehensive performance of the light-emitting device.
  • the film thickness is not too thick, and the first reflective layer and the second reflective layer
  • the reflectivity can reach 99.6%, which can meet the needs of use.
  • the optical composite layer when the light emitting diode chip is a blue light emitting diode chip, the optical composite layer includes: a first diffusion layer, a quantum dot layer, a second diffusion layer, a prism layer and a light enhancement layer.
  • the first diffusion layer and the second diffusion layer play a role of diffusing light.
  • the first diffusion layer and the second diffusion layer are made of high-temperature-resistant materials, which can ensure that the optical composite layer maintains the stiffness of the plate itself in a heated state under high-power backlight operation, and is not easy to generate high temperature. deformation.
  • the main materials of the quantum dot layer are red quantum dots and green quantum dots that are wrapped and synthesized by a thin film.
  • the red quantum dots and green quantum dots that are synthesized by re-wrapping can effectively isolate water and oxygen, and ensure the stability of the quantum dots.
  • the blue light emitted by the blue light-emitting diode chip forms a relatively uniform blue light surface through the light diffusion of the first diffusion layer.
  • the red quantum dot material in the quantum dot layer emits red light under the excitation of blue light, and the green quantum dot material emits red light under the blue light. Green light is emitted under excitation, and the excited red light, green light and transmitted blue light are mixed into white light and emitted; the second diffusion layer plays the role of diffusing the light.
  • the prism layer concentrates the scattered light in a certain range and emits it to improve the brightness of the light within the range, thereby improving the brightness of the light on the front of the display panel;
  • the light-enhancing layer can improve the brightness of the backlight module and increase the brightness of the light utilization efficiency.
  • the material used for the first dielectric layer is silicon dioxide
  • the material used for the second dielectric layer is titanium dioxide
  • the refractive index of the silicon dioxide layer is 1.47
  • the thickness of the first dielectric layer is 63.02 nm-73.02 nm
  • the thickness of the second dielectric layer is 34.68 nm-44.68 nm.
  • the optical composite layer includes: a diffusion layer, a prism layer, and a light enhancement layer.
  • the diffusion layer plays the role of diffusing the light, and the diffusion layer is made of high-temperature resistant materials. Under the working state of high-power backlight, it can ensure that the optical composite layer maintains the stiffness of the plate itself in the heated state, and is not easy to generate high temperature. deformation; the prism layer concentrates the scattered light in a certain range and emits it, and improves the brightness of the light within the range, thereby improving the brightness of the light on the front of the display panel; the brightening layer can improve the brightness of the backlight module and improve the utilization efficiency of light.
  • the backlight module further includes a diffuse reflection layer, which is located on the side of the circuit board close to the light emitting device, and the diffuse reflection layer includes a plurality of openings for exposing the light emitting devices, which can expose the light emitting devices to ensure that the light emitting devices can be The light is emitted smoothly.
  • the diffuse reflection layer can reflect the light emitted by the light-emitting device to the side of the circuit board, or the light reflected back to the circuit board by other devices, and re-reflected to the light-emitting side, and the reflection path of the reflected light is random. Multiple reflections play a role in homogenizing the light, thereby improving the utilization efficiency of the light source.
  • the diffuse reflection layer is formed by coating a circuit board with a colloid mixed with reflective particles, and the reflectivity of the diffuse reflection layer is greater than or equal to 97%.
  • the display device includes: a display panel and a backlight module;
  • the backlight module includes: a light source and a diffuser plate, the diffuser plate is located on the light-emitting side of the light source, and the side of the diffuser plate facing the light source is provided with reflective dots, reflecting The dots have the property of reflecting light.
  • the light emitted by the light source is incident on the reflective dots, most of the light is reflected by the reflective dots back to the first reflective sheet and the second reflective sheet in the backlight module, and the light is reflected again.
  • the light is continuously reflected between the reflective dots and the first reflective sheet and the second reflective sheet in the backlight module, and finally exits at the interval between the reflective dots, and the light passes through the diffuser plate and the first reflective sheet and the After the homogenization between the second reflective sheets, the brightness of the light-emitting surface is uniform, which avoids the phenomenon of darkening of the surrounding area of the backlight module, and improves the display effect of the display device.
  • the distribution density of the reflective dots set in the edge region of the diffuser plate is smaller than the distribution density of the reflective dots set in the middle region of the diffuser plate. There is less distribution, resulting in the problem of darkness around the diffuser.
  • the reflector and the second reflector are constantly reflected and oscillated, so that a part of the light can be reflected and oscillated into the edge area of the diffuser, while the density of the reflection dots set in the edge area of the diffuser is small, and relatively more light can pass through the reflection dots
  • the interval is incident into the diffuser plate, so that more light emerges from the edge area than from the middle area. Therefore, after the light is homogenized between the diffuser plate and the first reflection sheet and the second reflection sheet for many times, the brightness of the light-emitting surface is uniform, thereby balancing the brightness difference between the edge area and the center area of the diffuser plate. , which avoids the phenomenon that the area around the backlight module becomes dark, and improves the display effect of the display device.
  • the backlight module further includes: a backplane, a light-emitting diode lamp board, a first reflection sheet and a second reflection sheet, the first reflection sheet is located on the side of the light-emitting diode lamp board away from the backplane, and the second reflection sheet The sheet is located on the side of the inclined portion of the backplane facing the light-emitting diode lamp board, and the first reflection sheet and the second reflection sheet are diffuse reflection layers.
  • the first reflective sheet can reflect the light emitted from the light-emitting device to the side of the LED lamp panel, or the light reflected back to the LED lamp panel by the diffuser plate and the optical film, and then reflect it to the light-emitting side again.
  • the reflection paths of the reflected light are random, so the multiple reflections of the light by the first reflection sheet play a role in homogenizing the light, thereby improving the utilization efficiency of the light source.
  • the second reflective sheet can re-reflect the large-angle light emitted from the light-emitting device at the edge position back to the backlight module for reuse, or the light reflected back to the inclined portion by the diffuser plate and the optical film can be
  • the second reflective sheet re-reflects toward the light-emitting side, and the reflection path of the reflected light is random. Therefore, the multiple reflections of the light by the second reflective sheet play a role in homogenizing the light, thereby improving the utilization efficiency of the light source.
  • the orthographic projection of the diffuser plate on the back plate covers the orthographic projection of the first reflection sheet and the second reflection sheet on the back plate.
  • the distribution density of the first reflective dots of the diffuser in the region corresponding to the first reflective sheet is greater than the distribution density of the second reflective dots of the diffuser in the region corresponding to the second reflective sheet. In this way, the gap between the first reflective dots can be made smaller than the gap between the second reflective dots.
  • the reflective sheet On one side of the reflective sheet, only a small part of the light can be emitted into the diffuser, so that most of the light can be continuously reflected and oscillated between the first reflective dot, the first reflective sheet, and the second reflective sheet, so that a part of the light can be reflected and oscillated
  • the density of the second reflective dots set in the diffuser area corresponding to the second reflective sheet is small, and relatively more light can be incident on the diffuser through the gap between the second reflective dots Inside, there will still be a part of the light incident on the second reflective mesh point, which will be reflected back to the side of the first reflective sheet and the second reflective sheet by the second reflective mesh point.
  • the brightness of the light-emitting surface is uniform, thereby balancing the diffusion plate area corresponding to the first reflection sheet and the second reflection sheet
  • the brightness of the outgoing picture in the diffuser plate corresponding to the film is poor, which avoids the phenomenon that the area around the backlight module is darkened, and improves the display effect of the display device.
  • the size of the first reflective dots of the diffuser in the region corresponding to the first reflective sheet is larger than the size of the second reflective dots of the diffuser in the region corresponding to the second reflective sheet, so that the first The gap between the reflective dots is smaller, so that the gap between the second reflective dots is larger, so that the transmittance of the light incident on the area corresponding to the second reflective sheet is greater than the light incident on the area corresponding to the first reflective sheet.
  • the transmittance of the backlight module is improved, and combined with the reflection homogenization effect of the reflection dots and the first reflection sheet and the second reflection sheet, the phenomenon of darkening around the backlight module can be avoided, and the display effect of the display device can be improved.
  • the size of each reflective dot in the area corresponding to the first reflective sheet may be the same, which can reduce the difficulty of manufacturing the reflective dots, thereby simplifying the manufacturing process of the display device.
  • more reflective dots are arranged at the positions corresponding to the luminous center of the light-emitting device corresponding to the diffuser plate, and fewer reflective dots are arranged in the area corresponding to the large-angle light emitted by the light-emitting device, so that the light-emitting device can emit light.
  • the small-angle light from the light emitting device is more reflected back to the side of the first reflective sheet, and the large-angle light emitted by the light-emitting device is more transmitted into the diffuser plate, which plays a role in balancing the light transmittance.
  • the light reflected by the reflective dots will be diffusely reflected by the first reflective sheet again, and after multiple reflection oscillations between the reflective dots and the first reflective sheet, the final emitted light is more uniform, which balances the light emission of the light-emitting device.
  • the difference between light and dark at the center and edge positions improves the display effect of the display device.
  • the outgoing light of a light-emitting device is within the irradiation range of the diffuser, and the size of the reflective dots close to the center is larger than the size of the reflective dots far from the center, so that the reflective dots close to the center can be separated from each other.
  • the gap between them is smaller, and the gap between the reflection dots far away from the middle position is larger, so that the transmittance of the large-angle light emitted by the light-emitting device is relatively large.
  • the problem that the middle position of the light-emitting device is bright and the edge is dark can be avoided, and the display effect of the display device is improved.
  • the material used for the reflective dots is white ink.
  • the size of the reflective dots ranges from 0.4 mm to 1.5 mm.
  • the display device includes a backplane and a circuit board located on the backplane; the circuit board includes an opening, and the edge of the opening is provided with a plurality of pads on the side away from the backplane; the sink board connector Disposed in the opening, the sink board connector includes a plurality of first pins that are lapped with each pad in a one-to-one correspondence, and a second pin that is electrically connected to each of the first pins in a one-to-one correspondence. It is arranged in the socket on the side away from the backplane, and inserting the FFC into the socket can realize the circuit connection between the FFC and the circuit board through the sink board connector.
  • the backplane is provided with an opening at a position corresponding to the opening of the circuit board, and the size of the opening of the backplane is generally larger than the size of the opening of the circuit board.
  • the sink board connector passes through the opening of the circuit board and the opening of the backplane.
  • the surface of the sink board connector on the side away from the backplane slightly protrudes from the surface of the circuit board, so that the first pins of the sink board connector can be overlapped with the pads on the edge of the opening.
  • the surface of the sink board connector on the side away from the circuit board protrudes from the surface of the backplane, thereby exposing the socket for connecting the FFC.
  • a plurality of first pins are arranged side by side, and a certain gap exists between adjacent first pins.
  • the width of the first pins along the arrangement direction is 0.25mm-0.6mm, and the spacing between adjacent first pins is 0.5mm-1.0mm, so that different voltage and current specifications can be adapted.
  • the sink board connector is provided with fixed pins on both sides of the first pin, and correspondingly, the circuit board is provided with fixed pins corresponding to the fixed pins on both sides of the opening pads.
  • the fixed pin and the fixed pad can also be connected together, so that the connection between the fixed pin and the fixed pad can be used to strengthen the sink board connector and the circuit
  • the connection relationship between the boards can avoid the disconnection of the first pin and the pad under the action of external force, thereby affecting the circuit connection relationship.
  • the first pin includes an arc-shaped part and a flat-shaped part that are connected to each other; wherein, one end of the arc-shaped part is connected to the sinking board connector, and the other end is connected to the flat part; the flat part is parallel to the surface of the circuit board, and the flat surface
  • the parts overlap with the corresponding pads on the surface of the circuit board.
  • the end of the first pin close to the sink board connector is set as an arc surface, so that a certain gap can be formed between the arc part and the circuit board. If the solder paste is excessive, the melted solder paste can flow to the gap position , and will not be squeezed out to the edge of the board where the opening is located, thus avoiding the problem of short circuit of the circuit board caused by the overflow of solder paste.
  • the arc-shaped portion is bent in the direction of the side wall of the sinker connector, so that the arc-shaped portion and the flat portion can be smoothly connected, and no sharp connection points are generated, so as to avoid breaking under the action of external force. open.
  • the vertical distance between one end of the arc-shaped part connecting the sinker connector and one end of the connecting plane part is set to be less than or equal to 1.5 mm, so that the bending of the first pins can be avoided.
  • the first pin is too high to avoid the influence on the light emitted by the light source.
  • the edge of the opening of the circuit board exceeds the boundary line between the flat part and the arc surface, so that the side wall of the opening of the circuit board can be farther away from the flat part, even if there is solder paste overflow Stored in the gap between the arc and the circuit board without running on the sides of the circuit board.
  • the vertical distance between the edge of the opening and the end of the arc-shaped portion connecting the plane portion is set to be greater than or equal to 0.6 mm, which can reserve a space for storing overflowing solder paste and avoid the circuit board caused by overflowing solder paste. short circuit problem.
  • the side wall of the sink plate connector is set as an inclined plane at the position where the socket is connected.
  • the inclined plane is a guide groove to facilitate the insertion of the FFC.
  • the FFC can be inserted into the guide groove as a reference to avoid blindness in the vertical direction. Insertion can not be inserted at one time, causing the FFC to break, and it can also improve the efficiency of plugging.
  • the angle between the inclined plane s and the side wall where the socket is located is 45°.
  • the backlight module further includes a reflective layer on the side of the circuit board close to the light-emitting diode chip, and the reflective layer covers the sink board connectors, so that the surface of the circuit board can be positioned at the position where the sink board connectors are arranged and not.
  • the reflectivity of the position where the sink board connector is set is kept consistent, so as to avoid the dark shadow caused by the sink board connector being unable to reflect light.
  • FIG. 1 is a schematic cross-sectional structure diagram of a display device provided by some embodiments of the present application.
  • FIG. 2 is a schematic cross-sectional structure diagram of a backlight module provided by some embodiments of the present application.
  • FIG. 3 is a schematic diagram of a display effect of a display device in the related art
  • FIG. 4 is a schematic cross-sectional structure diagram of a light-emitting device provided by some embodiments of the present application.
  • FIG. 5 is a schematic cross-sectional structure diagram of a Bragg reflector provided by some embodiments of the present application.
  • FIG. 6 is a schematic diagram of optical simulation of the reflectivity of a Bragg reflector comprising a first dielectric layer and a second dielectric layer with different layers under the same conditions provided by some embodiments of the present application;
  • 7a is one of the schematic cross-sectional structures of the optical composite layer provided by some embodiments of the present application.
  • 7b is the second schematic diagram of the cross-sectional structure of the optical composite layer provided by some embodiments of the present application.
  • FIG. 8 is a schematic diagram of a display effect of a display device provided by some embodiments of the present application.
  • FIG. 9 is a schematic cross-sectional structure diagram of a backlight module provided by some embodiments of the present application.
  • FIG. 10 is a schematic diagram of a partial light path of a backlight module provided by some embodiments of the present application.
  • FIG. 11 is a schematic diagram of the arrangement effect of reflection dots provided by some embodiments of the present application.
  • 12a is a top view of a display effect of a display device in the related art
  • 12b is a schematic diagram of a partial light path of a backlight module in the related art
  • FIG. 13 is a schematic partial cross-sectional structure diagram of a backlight module provided by some embodiments of the present application.
  • FIG. 14 is a schematic plan view of a backlight module provided by some embodiments of the present application.
  • FIG. 16 is an oblique view of the sink-plate connector provided by some embodiments of the present application.
  • FIG. 17 is a schematic top-view structure diagram of a sink plate connector provided by some embodiments of the present application.
  • FIG. 18 is a perspective view of a backlight module provided at a sink board connector according to some embodiments of the present application.
  • FIG. 19 is a schematic bottom view of the sink plate connector provided by some embodiments of the present application.
  • 20 is a schematic side view of the structure of the sink plate connector provided by some embodiments of the present application.
  • FIG. 21 is the second schematic diagram of the cross-sectional structure of the backlight module provided by some embodiments of the present application.
  • the liquid crystal display is mainly composed of a backlight module and a liquid crystal display panel.
  • the liquid crystal display panel itself does not emit light, and needs to rely on the light source provided by the backlight module to achieve brightness display.
  • the imaging principle of the liquid crystal display is to place the liquid crystal between two pieces of conductive glass, driven by the electric field between the two electrodes, to cause the electric field effect of the liquid crystal molecules to twist, so as to control the transmission or shielding function of the backlight source, so as to display the image. . If a color filter is added, color images can be displayed.
  • FIG. 1 is a schematic cross-sectional structure diagram of a display device provided by an embodiment of the present application.
  • the display device includes: a backlight module 100 and a display panel 200 .
  • the display panel 200 is located on the light-emitting side of the backlight module 100, and the shape and size of the display panel are usually matched with the backlight module.
  • the display panel 200 can be set to a rectangle, including the sky side, the ground side, the left side and the right side,
  • the sky side is opposite to the ground side
  • the left side is opposite to the right side
  • the sky side is connected to one end of the left side and one side of the right side respectively
  • the ground side is connected to the other end of the left side and the other end of the right side respectively.
  • the display panel 200 is a transmissive display panel, which can modulate the transmittance of light, but does not emit light itself.
  • the display panel 200 has a plurality of pixel units arranged in an array, and each pixel unit can independently control the light transmittance and color of the backlight module 100 incident on the pixel unit, so that the light transmitted by all the pixel units is composed of displayed image.
  • the backlight module 100 is usually located at the bottom of the display device, and its shape and size are adapted to the shape and size of the display device. When applied to fields such as televisions or mobile terminals, the backlight module usually adopts a rectangular shape.
  • the backlight module in the embodiment of the present application adopts a direct-type backlight module, which is used for uniformly emitting light in the entire light-emitting surface to provide the display panel with light with sufficient brightness and uniform distribution, so that the display panel can display images normally.
  • FIG. 2 is a schematic cross-sectional structure diagram of a backlight module provided by an embodiment of the present application.
  • the backlight module includes: a backplane 11 , a circuit board 12 , a light emitting device 13 , a diffuse reflection layer 14 and an optical composite layer 15 .
  • the back plate 11 is located at the bottom of the backlight module and has the function of supporting and bearing.
  • the backplane 11 is usually a rectangular structure, and when applied to a special-shaped display device, its shape is adapted to the shape of the display device.
  • the back panel 11 includes a sky side, a ground side, a left side and a right side.
  • the sky side is opposite to the ground side
  • the left side is opposite to the right side
  • the sky side is connected to one end of the left side and one side of the right side respectively
  • the ground side is connected to the other end of the left side and the other end of the right side respectively.
  • the material of the back plate 11 is aluminum, iron, aluminum alloy or iron alloy.
  • the backplane 11 is used for fixing the circuit board 12 and supporting and fixing the edge positions of components such as the optical composite layer 15 , and the backplane 11 also plays a role in dissipating heat to the circuit board 12 .
  • the circuit board 12 is located on the backplane 11 , and the shape of the circuit board 12 can be plate-like or strip-like. It is plate-shaped, and the whole is rectangular or square.
  • the circuit board 12 may be a printed circuit board (Printed Circuit Board, PCB for short), and the PCB includes a base material, an electronic circuit and an insulating layer.
  • PCB printed Circuit Board
  • the substrate can be made of materials such as FR4 or glass.
  • the substrate can also be made of a flexible material to form a flexible circuit board.
  • the material of the electronic circuit is usually copper, and the pattern of the electronic circuit for driving the light-emitting device 13 is formed by an etching process.
  • the insulating layer has the function of protecting the electronic circuit, and the insulating layer exposes the bonding pad of the electronic circuit where the light emitting device 13 is soldered and covers the rest.
  • the circuit board 12 can also be an array substrate formed by fabricating a thin film transistor driving circuit on a base substrate.
  • the surface of the array substrate has connection electrodes connected to the thin film transistor driving circuit for soldering the light emitting device 13 .
  • the light emitting device 13 is located on the circuit board 12 , and the circuit board 12 is used for providing driving signals for the light emitting device 13 .
  • the light emitting devices 13 are arranged in an array to provide backlight for the display panel.
  • the diffuse reflection layer 14 is located on the surface of the circuit board 12 on the side close to the light emitting device 13, and its shape is the same as that of the circuit board 12.
  • the diffuse reflection layer 14 includes a plurality of openings for exposing the light emitting devices 13, and each light emitting device 13 can be exposed. It is ensured that the light emitting device 13 can emit light smoothly.
  • the diffuse reflection layer 14 can reflect the light emitted from the light-emitting device 13 to the side of the circuit board 12, or the light reflected back to the circuit board 12 by other devices, and re-reflect it to the light-emitting side, and the reflection path of the reflected light is random, so it undergoes diffuse reflection.
  • the multiple reflections of the light by the layer 14 play a role in homogenizing the light, thereby improving the utilization efficiency of the light source.
  • the diffuse reflection layer 14 is formed by coating on the circuit board 12 with a colloid mixed with reflective particles.
  • the reflectivity of the diffuse reflection layer 14 is greater than or equal to 97%.
  • a certain light mixing distance is usually set between the light source and the diffuser.
  • the light mixing distance needs to be reduced, and the light mixing distance The reduction of the distance will cause the obvious lamp shadow phenomenon as shown in Figure 3, which will affect the display effect.
  • the 13 light emitters are set as follows, which can not only realize the thinning of the display device, realize more refined dynamic control, but also solve the problem of reducing light mixing in order to realize ultra-thin design Lighting and shadowing problems due to distance.
  • FIG. 4 is a schematic cross-sectional structure diagram of a light emitting device provided by an embodiment of the present application.
  • the light emitting device 13 includes: a light emitting diode chip 131 , a first reflection layer 132 and a second reflection layer 133 .
  • the light-emitting diode chip 131 includes: a substrate 1311 , a first semiconductor layer 1312 , a second semiconductor layer 1313 , a first electrode P, a second electrode and an N electrode.
  • a first semiconductor layer 1312 and a second semiconductor layer 1313 are sequentially formed on the substrate 1311.
  • the first electrode P is located on the second semiconductor layer 1313 and is electrically connected to the second semiconductor layer 1313.
  • the second electrode N is located on the first semiconductor layer 1312 and is electrically connected to the first semiconductor layer 1312 .
  • the substrate 1311 can be made of sapphire, the material used for the first semiconductor layer 1312 is N-type gallium nitride, the material used for the second semiconductor layer 1313 is P-type gallium nitride, and the material used for the first semiconductor layer 1312 and the first semiconductor layer 1312 is N-type gallium nitride.
  • the two semiconductor layers 1313 form a P-N junction. After a voltage is applied to the P-N junction, the P-N junction emits light to provide a backlight for the display device.
  • the first reflective layer 132 is located on the side of the substrate 1311 away from the first semiconductor layer 1312 , and the size and shape of the first reflective layer 132 is the same as that of the substrate 1311 .
  • the second reflective layer 133 is located on the side of the second semiconductor layer 1313 and the first semiconductor layer 1312 away from the substrate 1311 . Orthographic coincidence.
  • the first reflection layer 132 and the second reflection layer 133 have the property of reflecting light, the light emitted from the P-N junction is continuously reflected between the first reflection layer 132 and the second reflection layer 133, and finally The light is emitted from the side of the light emitting diode chip 131, thereby expanding the light exit angle and improving the light mixing effect of the two adjacent light emitting devices 13. Therefore, uniform light can be obtained without a large mixing distance, avoiding the need for mixed light.
  • the obvious lamp shadow phenomenon occurs when the light distance is reduced, which improves the display effect of the display device.
  • the upper and lower sides of the traditional light-emitting diode chip are not provided with reflective layers, and the exit angle of light is about 120°.
  • first reflective layers are provided on the upper and lower sides of the light-emitting diode chip 131 respectively.
  • the outgoing angle of the light from the light-emitting diode chip 131 can be increased to 165°, which expands the outgoing angle of the light, thereby improving the light mixing effect of the two adjacent light-emitting devices 13, so it does not need to be too much.
  • a large light mixing distance uniform light can be obtained, the obvious lamp shadow phenomenon caused by the reduction of the light mixing distance is avoided, and the display effect of the display device is improved.
  • the first reflection layer 132 and the second reflection layer 133 are Bragg reflection sheets.
  • FIG. 5 is a schematic cross-sectional structure diagram of a Bragg reflector provided in an embodiment of the present application.
  • the first reflective layer 132 and the second reflective layer 133 are both formed by alternately stacking the first dielectric layer 1301 and the second dielectric layer 1302 with two different refractive indices.
  • the optical thickness is 1/4 of the wavelength of the central reflection, so it is a quarter-wave multilayer system, equivalent to a simple set of photonic crystals. Since electromagnetic waves with frequencies falling within the energy gap range cannot penetrate, the reflectances of the first reflection layer 132 and the second reflection layer 133 are both greater than or equal to 99%.
  • the specific values of the refractive indices R of the first reflective layer 132 and the second reflective layer 133 can be calculated by the following formula:
  • nL represents the refractive index of the first dielectric layer 1301
  • nH represents the refractive index of the second dielectric layer 1302
  • ns represents the refractive index of the substrate in contact with the first reflective layer 132 or the second reflective layer 133.
  • ns represents the refractive index of the substrate 1311 .
  • the thickness d r of the first dielectric layer 1301 or the second dielectric layer 1302 can be calculated by the following formula:
  • dr represents the thickness of the first dielectric layer 1301 or the second dielectric layer 1302
  • ⁇ d represents the wavelength of light emitted from the LED chip
  • n r represents the refractive index of the first dielectric layer 1301 or the second dielectric layer 1302 .
  • the material used for the first dielectric layer 1301 is silicon dioxide, and the first dielectric layer 1301 made of silicon dioxide is not easy to decompose and absorb, and has good scattering properties.
  • the material used for the second dielectric layer 1302 is titanium dioxide, and the second dielectric layer 1302 made of titanium dioxide has higher hardness, which can improve the overall performance of the light-emitting device.
  • the reflected reflectance is also different.
  • FIG. 6 is a schematic diagram of optical simulation of the reflectivity of a Bragg reflector including a first dielectric layer and a second dielectric layer with different numbers of layers under the same conditions, according to an embodiment of the present application.
  • the abscissa is the wavelength of the light emitted by the light-emitting diode chip, and the ordinate is the reflectivity of the Bragg reflector.
  • the embodiment of the present application has three first dielectric layers 1301 and The Bragg reflector with 3 layers of the second dielectric layer 1302 (corresponding to the dashed line 1 in FIG. 6 ), and the Bragg reflector including 5 layers of the first dielectric layer 1301 and 5 layers of the second dielectric layer 1302 (corresponding to the dashed line in FIG. 6 ) 2)
  • Optical simulation is performed with the Bragg reflector (corresponding to solid line 3 in FIG.
  • the Bragg reflector contains 7 layers of the first dielectric layer 1301
  • the reflectivity of the Bragg reflector can reach 99.6%, which meets the usage requirements.
  • the first reflective layer 132 and the second reflective layer 133 include 7 layers of the first dielectric layer 1301 and 7 layers of the second dielectric layer 1302, the film thickness will not be too thick, and the first reflective layer 132 and the second reflective layer 132 The reflectivity of the layer 133 can reach 99.6%, which meets the usage requirements.
  • the first reflective layer 132 provided in this embodiment of the present application may include seven first dielectric layers 1301 and seven second dielectric layers 1302 .
  • the light emitting diode chip 131 is used as a backlight source, which is different from a common light emitting diode chip.
  • the size of the chip used in the light-emitting diode chip 131 is in the micrometer level. Since the size of the light-emitting diode chip 131 is very small, it is beneficial to perform finer control of the display device and improve the contrast of the picture.
  • the size of the light emitting diode chip 131 is below 500 ⁇ m.
  • the light-emitting diode chip is a miniLED (Mini Light Emitting Diode) chip.
  • the size of the chip used in the light-emitting diode chip 131 is in the micrometer level, and the light-emitting diode chip is a miniature light-emitting diode chip.
  • the light emitting diode chip 131 may be fabricated with corresponding dimensions according to practical applications, which is not limited herein.
  • the optical composite layer 15 is located on the side of the light-emitting device 13 away from the circuit board 12, and is used to improve the display effect of the display device.
  • FIG. 7 a is one of the schematic cross-sectional structural diagrams of the optical composite layer provided by the embodiment of the present application.
  • the optical composite layer 15 includes: a first diffusion layer 151, a quantum dot layer 152, a second diffusion layer 153, a prism layer 154 and a light enhancement layer 155.
  • the first diffusion layer 151 is located on the side of the light-emitting device 13 away from the circuit board 12.
  • the size and shape of the first diffusion layer 151 are adapted to the size and shape of the circuit board 12 in the display device.
  • the first diffusion layer 151 functions to diffuse light. effect.
  • the material used for the first diffusion layer 151 is polycarbonate (PC).
  • the quantum dot layer 152 is located on the side of the first diffusion layer 151 away from the light emitting device 13 , and the size and shape of the quantum dot layer 152 are consistent with the first diffusion layer 151 .
  • the main materials of the quantum dot layer 152 are red quantum dots and green quantum dots that are wrapped and synthesized by a thin film. The red quantum dots and green quantum dots that are synthesized by re-wrapping can effectively isolate water and oxygen, and ensure the stability of the quantum dots.
  • the blue light emitted by the blue light emitting diode chip forms a relatively uniform blue light surface through the light diffusion effect of the first diffusion layer 151, the red quantum dot material in the quantum dot layer 152 emits red light under the excitation of blue light, and the green quantum dot material is in the Under the excitation of blue light, green light is emitted, and the excited red light, green light and transmitted blue light are mixed into white light and emitted.
  • the second diffusion layer 153 is located on the side of the quantum dot layer 152 away from the first diffusion layer 151 ; its shape and size are consistent with the quantum dot layer 152 .
  • the second diffusion layer 153 plays the role of diffusing the light, and the first diffusion layer 151 and the second diffusion layer 153 are made of high temperature resistant materials, which can ensure that the optical composite layer 15 is heated under the high-power backlight working state. The state maintains the stiffness of the sheet itself, and is not easy to deform at high temperature.
  • the material used for the first diffusion layer 151 is polycarbonate (PC).
  • the prism layer 154 is located on the side of the second diffusion layer 153 away from the quantum dot layer 152 , and has the same shape and size as the second diffusion layer 153 .
  • the function of the prism layer 154 is to concentrate the scattered light in a certain range and emit it, so as to improve the brightness of the light in the range, thereby improving the brightness of the light on the front of the display panel.
  • the material used for the prism layer 154 is polyethylene terephthalate (PET).
  • the light enhancement layer 155 is located on the side of the prism layer 154 away from the second diffusion layer 153 , and its shape and size are consistent with the prism layer 154 .
  • the brightness enhancement layer 155 can improve the brightness of the backlight module and improve the utilization efficiency of light.
  • the material used for the light-enhancing layer 155 is polyethylene terephthalate (PET).
  • the material used for the first dielectric layer 134 is silicon dioxide
  • the material used for the second dielectric layer 135 is titanium dioxide
  • the refractive index of the silicon dioxide layer is When the refractive index of the titanium dioxide layer is 1.47 and the refractive index of the titanium dioxide layer is 2.52, the blue light wavelength is brought in.
  • the thickness of the first dielectric layer 1301 is 63.02nm-73.02nm
  • the thickness of the second dielectric layer 1302 is 34.68nm-44.68nm.
  • FIG. 7b is the second schematic diagram of the cross-sectional structure of the optical composite layer provided by the embodiment of the present application.
  • the optical composite layer 15 includes: a diffusion layer 150, a prism layer 154 and a light enhancement layer 155.
  • the diffusion layer 150 is located on the side of the light-emitting device 13 away from the circuit board 12.
  • the size and shape of the diffusion layer 150 are adapted to the size and shape of the circuit board 12 in the display device.
  • the diffusion layer 150 plays a role in diffusing light, and the diffusion layer
  • the 150 is made of high temperature resistant materials. Under the working state of high power backlight, it can ensure that the optical composite layer 15 maintains the stiffness of the plate itself in a heated state, and is not easily deformed by high temperature.
  • the prism layer 154 is located on the side of the diffusion layer 150 away from the light emitting device 13 , and its shape and size are consistent with the diffusion layer 150 .
  • the function of the diffusion layer 150 is to concentrate the scattered light in a certain range to emit light, to improve the brightness of the light in the range, and thus to improve the brightness of the light on the front of the display panel.
  • the material used for the prism layer 154 is polyethylene terephthalate (PET).
  • the light enhancement layer 155 is located on the side of the prism layer 154 away from the diffusion layer 150 , and its shape and size are consistent with the prism layer 154 .
  • the brightness enhancement layer 155 can improve the brightness of the backlight module and improve the utilization efficiency of light.
  • the material used for the light-enhancing layer 155 is polyethylene terephthalate (PET).
  • the problem of lamp shadow can be significantly improved. As shown in FIG. 8 , the brightness of the light-emitting surface of the backlight module is uniform, and no lamp shadow problem occurs.
  • Mini LED In the current direct-lit backlight modules, miniature light-emitting diodes have become the current hot spot in liquid crystal display technology as a backlight source. Mini LED for short), using Mini LED as the backlight source can control the dynamic lighting of the backlight module to a smaller partition, which is beneficial to improve the contrast of the picture.
  • Mini LEDs In order to reduce costs, it is necessary to reduce the number of Mini LEDs used and increase the spacing between Mini LEDs. In the direct-lit backlight module, in the currently applied backplane design products with an inclination angle, the Mini LEDs cannot be set around the backplane. LED, which makes the surrounding area of the backlight module obviously dark, and the backlight effect is not good.
  • FIG. 9 is a schematic cross-sectional structure diagram of a backlight module provided by an embodiment of the present application.
  • the backlight module includes: a backplane 11-1, a light source, a first reflection sheet 131-1, a second reflection sheet 132-1, a diffusion plate 14-1 and an optical film 15-1.
  • the light source is provided in the form of a light-emitting diode lamp panel 12-1.
  • the back plate 11-1 is located at the bottom of the backlight module and has the function of supporting and bearing.
  • the back plate 11-1 includes a flat portion 111-1 and an inclined portion 112-1.
  • the plane portion 111-1 of the back plate 11-1 is located at the bottom, and is usually a square or rectangular structure. When applied to a special-shaped display device, the shape of the plane portion 111-1 is adapted to the shape of the display device.
  • the flat part 111-1 is used to carry the LED lamp board 12-1 and the upper diaphragm, the inclined part 112-1 is located around the flat part 111-1, and the inclined part 112-1 is along the edge of the flat part 111-1 Bending to one side of the back plate, the angle between the inclined portion 112-1 and the flat portion 111-1 is 30-60°, so that the outgoing light can be limited to this angle. Within this angle range, the display device has For the user's favorite appearance, in general, the angle between the inclined portion 112-1 and the flat portion 111-1 can be set to 45°, which is not limited herein.
  • the flat portion 111-1 and the inclined portion 112-1 are integral structures.
  • the material of the back plate 11-1 can generally be made of materials such as electro-galvanized steel sheet (SECC) or hot-dip galvanized steel sheet (SGCC), with a thickness of 0.8-1.0 cm.
  • SECC electro-galvanized steel sheet
  • SGCC hot-dip galvanized steel sheet
  • the back plate has the function of carrying and supporting the edge position of the optical film and other components, and the back plate 11-1 also plays the role of dissipating heat to the light emitting diode lamp board 12-1.
  • the backlight module is a direct type backlight module
  • the LED lamp board 12-1 is used as the backlight source
  • the LED lamp board 12-1 is located on the flat portion 111-1 of the backplane 11-1.
  • the LED light panel 12-1 can be square or rectangular as a whole, and when applied to a special-shaped display device, its shape and size are adapted to the shape and size of the display device.
  • a plurality of light-emitting diode lamp panels 12-1 can be provided, and the light-emitting diode lamp panels 12-1 are jointly provided with backlight by splicing.
  • the seams between the adjacent LED lamp panels 12-1 should be as small as possible, and even seamless splicing can be achieved.
  • the light-emitting diode light board 12-1 is specifically a Mini LED light board.
  • the light-emitting diode lamp board 12-1 specifically includes: a substrate 121-1, a circuit layer 122-1, a light-emitting diode chip 123-1, and a package bracket 124-1.
  • the light-emitting diode chip 123-1 and the packaging bracket 124-1 constitute a light-emitting device.
  • the substrate 121-1 is located on the plane portion 111-1, and the shape of the substrate 121-1 is the same as the overall shape of the light-emitting diode lamp board 12-1. Under normal circumstances, the substrate 121-1 is plate-shaped, and the whole is rectangular or square.
  • the material used for the substrate 121-1 may be glass with high thermal conductivity, and using glass with high thermal conductivity to make the substrate 121-1 can make the display device emit heat quickly during display.
  • the surface of the glass substrate is smooth and flat, which is beneficial to the later processing and production.
  • the material used for the substrate 121-1 may be made of materials such as FR4 or PET, which is not limited herein.
  • the circuit layer 122-1 provided in the embodiment of the present application is deposited on the substrate 121-1 by electroplating a conductive material, and is formed by etching the circuit as required.
  • the conductive material may be copper, which is not limited herein.
  • the conductive material will etch a fracture, and the two sides of the fracture are respectively connected to the positive electrode and the negative electrode of the light-emitting diode chip 123-1.
  • the above-mentioned substrate 121-1 and circuit layer 122-1 can be made of different materials and manufactured through different manufacturing processes.
  • the substrate 121-1 and the circuit layer 122-1 may constitute a printed circuit board (Printed Circuit Board, PCB for short), and may also be an array substrate, which is not limited herein.
  • the light emitting diode chip 123-1 is located on the circuit layer 122-1. After the circuit layer 122-1 is fabricated, a pad for soldering the light-emitting diode chip 123-1 will be formed on its surface, and the light-emitting diode chip 123-1 will be soldered on the pad, so as to control the driving signal of the circuit layer 122-1. The light-emitting diode chip 123-1 is driven to emit light.
  • the size of the chip used by the light emitting diode chip 123-1 is in the micrometer level
  • the light emitting diode chip 123-1 is a micro light emitting diode chip 123-1
  • the light board 12-1 is a micro light emitting diode light board 12-1.
  • the light emitting diode chip 123-1 is a miniLED (Mini Light Emitting Diode) chip
  • the light board 12-1 is specifically a miniLED light board, but not limited thereto.
  • the size of the light-emitting diode chip 123-1 is small, it is beneficial to control the dynamic light emission of the backlight module to a smaller partition, which is beneficial to improve the contrast of the picture.
  • the light emitting diode chip 123-1 may have various sizes, for example, the size of the light emitting diode chip 123-1 is less than 500 ⁇ m.
  • the light-emitting diode chip 123-1 can be fabricated with corresponding dimensions according to practical applications, which is not limited herein.
  • the light-emitting diode light board 12-1 may include only one color of light-emitting diode chips 123-1, or may include light-emitting diode chips 123-1 of multiple colors, which is not limited herein.
  • the light-emitting diode chip 123-1 can be packaged in two ways: POB and COB.
  • a package bracket 124-1 will be provided outside the light-emitting diode chip.
  • the package bracket 124-1 is used for packaging. The package protects the light-emitting diode chip 123-1, and blocks foreign matter from entering the interior of the light-emitting diode chip 123-1.
  • the light-emitting diode chip when the light-emitting diode chip is packaged by the POB packaging method, a patch electrode will be formed on its lower surface at the same time, and the patch electrode is electrically connected to the electrode of the light-emitting diode chip.
  • the light-emitting diode chip 123-1 is mounted on the corresponding position of the circuit layer 122-1.
  • the POB packaging method has mature technology and good adaptability.
  • the single light emitting diode chip 123-1 and the package holder 124-1 constitute one light emitting device.
  • COB packaging is used to package the LED chips, then the LED chips 123-1 are first welded to the pads corresponding to the circuit layer 122-1, and then the LED chips 123-1 are The LED chip 123-1 is encapsulated on the surface by means of dispensing, and the encapsulant on the surface of the LED chip 123-1 can be made of a transparent colloidal material, such as silica gel, modified silica gel or epoxy resin with better permeability. COB packaging has higher efficiency and lower cost. A single light-emitting diode chip 123-1 and its corresponding encapsulant constitute a light-emitting device.
  • the first reflection sheet 131-1 is located on the surface of the LED lamp board 12-1 away from the back plate 11-1, and is specifically arranged at a position corresponding to the plane portion 111-1.
  • the shape and size of the first reflection sheet 131-1 is the same as the plane.
  • the shapes and sizes of the parts 111-1 are the same, and the first reflection sheet 131-1 includes a plurality of openings for exposing the light emitting diode chips 123-1.
  • the first reflection sheet 131-1 is a diffuse reflection layer, and the first reflection sheet 131-1 can reflect the light emitted from the LED chip 123-1 to the side of the LED lamp board 12-1, or be reflected by the light emitted from the LED chip 123-1.
  • the diffuser plate 14-1 and the optical film 15-1 reflect the light from the light-emitting diode panel 12-1 back to the light-emitting side, and the reflection path of the reflected light is random.
  • the multiple reflections play a role in homogenizing the light, thereby improving the utilization efficiency of the light source.
  • the first reflective sheet 131-1 is coated on the surface of the substrate with colloid mixed with reflective particles, and the reflectivity of the first reflective sheet 131-1 is greater than or equal to 97%.
  • the second reflection sheet 132-1 is located on the side of the inclined portion 112-1 of the back plate 11-1 that faces the light-emitting diode lamp board 12-1, and its shape and size are adapted to the shape and size of the inclined portion 112-1, and are implemented in this application.
  • the second reflective sheet 132-1 is coated on the surface of the substrate with colloid mixed with reflective particles, and is disposed on the inclined portion 112-1.
  • the second reflection sheet 132-1 is a diffuse reflection layer and has the property of reflecting light, so that the large-angle light emitted by the LED chip 123-1 located at the edge can be reflected back to the backlight module by the second reflection sheet 132-1
  • the light used in the group or reflected back to the inclined part 112-1 by the diffuser plate 14-1 and the optical film 15-1 can be re-reflected by the second reflecting sheet 132-1 to the light-emitting side, and the reflection of the reflected light
  • the paths are random, so the multiple reflections of the light by the second reflection sheet 132-1 play a role in homogenizing the light, thereby improving the utilization efficiency of the light source.
  • the diffuser plate 14-1 is located on the light-emitting side of the light-emitting diode lamp board 12-1. There is a certain light mixing distance between the diffuser plate 14-1 and the light-emitting diode lamp board 12-1.
  • the diffuser plate 14-1 is located on the back plate 11-1.
  • the orthographic projection of the first reflective sheet 131-1 and the second reflective sheet 132-1 on the backplane 11-1 is covered, that is, the diffuser 14-1 is located directly above the entire backplane 11-1.
  • the diffuser plate 14-1 can be set in a rectangular or square shape.
  • the function of the diffusing plate 14-1 is to scatter the incident light, so that the light passing through the diffusing plate 14-1 is more uniform.
  • the diffuser plate 14-1 is provided with a scattering particle material, and the light incident on the scattering particle material will be continuously refracted and reflected, so as to achieve the effect of scattering the light and realize the effect of uniform light.
  • the diffuser plate 14-1 has higher haze and better uniformity. It can usually be processed by extrusion process.
  • the material used for the diffuser plate 14-1 is generally selected from polymethyl methacrylate PMMA, polycarbonate PC, polystyrene At least one of the materials PS and polypropylene PP.
  • Quantum dot materials can also be arranged in the diffusion plate 14-1 to form a quantum dot diffusion plate.
  • the quantum dot materials include red quantum dot materials and green quantum dot materials, and red quantum dot materials are included in the quantum dot materials.
  • the quantum dot material emits red light under the excitation of blue light
  • the green quantum dot material emits green light under the excitation of blue light
  • the excited red light, green light and transmitted blue light are mixed into white light and output.
  • the quantum dot film is no longer provided in the subsequent process of manufacturing the backlight module, which not only reduces the cost, but also makes the display device lighter and thinner.
  • the optical film 15-1 is located on the side of the diffusion plate 14-1 away from the first reflection sheet 131-1 and the second reflection sheet 132-1.
  • the optical film 15-1 is arranged in a whole layer, and its shape is the same as that of the diffusion plate 14-1. is the same shape, usually it can be set to rectangle or square.
  • the arrangement of the optical film 15-1 can make the backlight module adapt to various practical applications.
  • the light-emitting diode chip 123-1 may be a blue light-emitting diode chip, and the optical film 15-1 includes a color conversion layer such as a quantum dot layer or a fluorescent layer.
  • the quantum dot layer includes a red quantum dot material and a green quantum dot material, the red quantum dot material emits red light under the excitation of blue light, the green quantum dot material emits green light under the excitation of blue light, and the stimulated emission of red light, The green light and the transmitted blue light are mixed into white light and emitted.
  • the fluorescent layer includes fluorescent materials that stimulate emission of red light and stimulated emission of green light, and the stimulated emission of red light, green light and transmitted blue light is mixed into white light for output.
  • the optical film 15-1 may also include a prism sheet, and the prism sheet can change the exit angle of light, thereby changing the viewing angle of the display device.
  • the optical film 15-1 may also include a reflective polarizer.
  • the reflective polarizer as a kind of brightening film, can improve the brightness of the backlight module, improve the utilization efficiency of light, and at the same time make the outgoing light have the property of polarization, omitting the liquid crystal display The use of polarizers under the panel.
  • the optical film 15-1 can not only achieve corresponding functions, but also have fogging and covering effects.
  • the light-emitting diodes are usually equipped with refractive lenses.
  • the light intensity distribution is close to the Gaussian distribution curve, the subjective visual effect is better.
  • the light-emitting device of the present application due to the small size of the light-emitting diode chip 123-1, no lens is provided during packaging, so the light emitted by the light-emitting device cannot rely on the refraction lens to expand the light-emitting angle of the light, resulting in the light of the light-emitting device. If the exit angle is small, the light-emitting device located at the edge cannot inject light to the edge of the backplane, resulting in the problem of darkening around the backlight module.
  • the diffuser plate 14-1 is provided with reflective dots M on the surface facing the side of the light-emitting diode lamp board 12-1, and the reflective dots M have The property of reflecting light, in the embodiments of the present application, the reflection dots M have the functions of reflection, diffuse reflection and/or scattering.
  • the light-emitting surface is uniform, which avoids the phenomenon that the area around the backlight module is darkened, and improves the display effect of the display device.
  • the material used for the reflective dots M may be white ink, which is printed on the surface of the diffuser plate 14-1 by screen printing.
  • the reflective dots M have the property of reflecting the incident light and not transmitting light. Therefore, the larger the size of the reflective dots M, the better the reflection effect and the less light passing through the reflective dots M. Therefore, the reflection can be adjusted according to the brightness of the light-emitting surface.
  • the size of the dots M makes the light-emitting surface more uniform and improves the display effect of the display device.
  • the size of the reflection dots M ranges from 0.4 mm to 1.5 mm.
  • the backplane of the backlight module provided by the embodiment of the present application has an inclined portion 112-1, and a set angle is formed between the inclined portion 112-1 and the flat portion 111-1.
  • the light emitting device cannot be installed in the position, and the exit angle of the light emitting device is limited, so that less light is emitted to the peripheral edge of the backlight module, resulting in the problem of dark surrounding.
  • the distribution density of the reflection dots M set in the edge region of the diffuser plate 14-1 provided in the embodiment of the present application is smaller than the distribution density of the reflection dots M set in the middle region of the diffuser plate 14-1.
  • When the light enters the middle area of the diffuser most of the light is reflected back to the first reflector and the second reflector. Only a small part of the light can be emitted into the diffuser through the gaps of the reflective dots, so that most of the light can be continuously reflected and oscillated between the reflective dots in the midline area and the first and second reflective sheets, so that part of the light can be reflected and oscillated.
  • the edge area of the diffuser It can be reflected and oscillated into the edge area of the diffuser, and the density of the reflection dots set in the edge area of the diffuser is small, and relatively more light can be incident into the diffuser through the interval of the reflection dots, so that the outgoing light in the edge area is relatively small. There is more outgoing light in the middle area. Therefore, after the light is homogenized between the diffuser plate and the first reflection sheet and the second reflection sheet for many times, the brightness of the light-emitting surface is uniform, thereby balancing the brightness difference between the edge area and the center area of the diffuser plate. , which avoids the phenomenon that the area around the backlight module becomes dark, and improves the display effect of the display device.
  • the distribution density of the first reflection dots M1 of the diffuser plate 14-1 in the region E corresponding to the first reflection sheet 131-1 provided by the embodiment of the present application is greater than that of the diffuser plate 14-1 in the second reflection sheet 132.
  • the region where the first reflection sheet 131-1 is located corresponds to the flat portion 111-1 of the backplane, and the region where the second reflection sheet 132-1 is located corresponds to the inclined portion 112-1 of the backplane.
  • the reflection dots M1 provided in the area E of the diffuser plate 14-1 corresponding to the first reflection sheet 131-1 are the first reflection dots M1, and the diffusion plate 14-1 corresponding to the reflection dots arranged in the area F of the second reflection sheet 132-1
  • the mesh point is the second reflection mesh point M2.
  • FIG. 10 is a schematic diagram of a partial light path of a backlight module provided in real time by the application
  • the light emitted by the light-emitting device when the light emitted by the light-emitting device is incident on the reflection dots M, most of the light is reflected, and the light can be incident on the diffuser 14-1 only when it enters the gap between the reflection dots, and the reflected dots
  • the reflected light returns to the side of the first reflection sheet 131-1 and the second reflection sheet 132-1, and passes through the diffuse reflection of the first reflection sheet 131-1 and the second reflection sheet 132-1, so that the reflection angle of the diffusely reflected light is Randomly changed, and then exits to the diffuser plate 14-1 again; the light incident on the diffuser plate 14-1 will repeat the above-mentioned process of entering the reflection dots and the gaps between the reflection dots.
  • the first reflection sheet 131-1 and the second reflection sheet 132-1 continuously reflect the light, the light finally emitted by the diffusion plate 14-1 is relatively uniform.
  • the distribution density of the first reflective dots M1 in the area E of the diffuser is set to be greater than the distribution density of the second reflective dots M2 in the area F, so that the area E can be
  • the gap between the first reflective dots M1 in the region F is smaller than the gap between the second reflective dots M2 in the region F.
  • the brightness of the light exit surface is uniform after the light is homogenized between the diffuser plate 14-1 and the first reflection sheet 131-1 and the second reflection sheet 132-1 for many times, thereby balancing the area E and the area F
  • the brightness of the inner output picture is poor, which avoids the phenomenon that the area around the backlight module (area F) is dark, and improves the display effect of the display device.
  • the size of the first reflection dots M1 of the diffuser plate 14-1 in the region E corresponding to the first reflection sheet 131-1 provided by the embodiment of the present application is larger than that of the diffuser plate 14-1 corresponding to the second reflection sheet 132-1
  • the size of the second reflective dots M2 in the area F can make the gap between the first reflective dots M1 smaller and the gap between the second reflective dots M2 larger, so that the light incident on the area F can be
  • the transmittance of the light source is greater than the transmittance of the light incident on the area E, and combined with the reflection and homogenization of the reflection dots and the first reflection sheet 131-1 and the second reflection sheet 132-1, the phenomenon of darkening around the backlight module can be avoided. , which improves the display effect of the display device.
  • the size of each reflection dot M1 of the diffuser plate 14-1 in the region E corresponding to the first reflection sheet 131-1 may be the same, which can reduce the difficulty of manufacturing the reflection dot M1, thereby simplifying the display device. production process.
  • FIG 11 is a partial effect diagram of a quarter of the diffuser plate in practical application.
  • the density of the screen-printed reflective dots in the central area (ie, the region E) is greater than the density of the screen-printed reflective dots in the edge region (ie, the region F) of the diffuser.
  • the size of the reflective dots is generally set at 0.4mm-1.5mm, wherein the size of the first reflective dots M1 can be 0.9mm, and the size of the second reflective dots M2 can be 0.4 mm mm.
  • the distribution density of the reflection dots M at a position close to the center is greater than the reflection at a position far from the center.
  • the distribution density of dots M is greater than the reflection at a position far from the center.
  • the light emitted by the light-emitting device is mainly concentrated in a small angle.
  • the large-angle light emitted by the light-emitting device corresponds to There are fewer reflective dots in the area, so that the small-angle light emitted by the light-emitting device can be more reflected back to the side of the first reflection sheet 131-1, and the large-angle light emitted by the light-emitting device can be more transmitted to the diffuser plate 14-1, plays a role in balancing the light transmittance.
  • the light reflected by the reflective dots will be diffusely reflected by the first reflective sheet 131-1 again, and after multiple reflection oscillations between the reflective dots and the first reflective sheet 131-1, the final emitted light will be more uniform.
  • the difference between light and dark at the light-emitting center and edge positions of the light-emitting device is balanced, and the display effect of the display device is improved.
  • the outgoing light of one light-emitting device is within the irradiation range of the diffuser plate 14-1, and the size of the reflective dots M near the center is larger than the size of the reflective dots M far away from the center.
  • the gap between the reflective dots near the center is smaller, and the gap between the reflective dots far away from the middle is larger, so that the transmittance of the large-angle light emitted by the light-emitting device is relatively large, and the reflective dots are combined with the first.
  • the reflection homogenization effect of the reflection sheet 131-1 can avoid the problem that the middle position of the light emitting device is bright and the edge is dark, and the display effect of the display device is improved.
  • Mini LED backlight is becoming more and more attractive.
  • Mini LED is the miniaturization of LED, which can be used in a unit area. Set a larger number of Mini LEDs. As the number of Mini LEDs used increases, the cost of Mini LED light panels increases.
  • PCB Printed Circuit Board
  • FFC flexible flat cable
  • the backlight module is provided with a light plate, which is used as a backlight light source to provide backlight for the display panel.
  • the light board is usually composed of a circuit board and a light source located on the circuit board, and the cost of the circuit board in the light board is relatively large.
  • circuit boards can be divided into single-sided and double-sided, wherein single-sided refers to the formation of circuits on only one side of the substrate, and double-sided refers to the formation of circuits on both sides of the substrate.
  • the double-sided board is beneficial to directly set the pins on the back of the circuit board to connect with the power supply board, so that the punching of the circuit board can be avoided.
  • the cost of the double-sided board is twice as high as that of the single-sided board.
  • connection pins on the side of the circuit board In order to reduce the cost, if the single-sided board is used, it is necessary to set connection pins on the side of the circuit board, and then use the FFC to connect the power board.
  • the power board is usually set in the backlight module. Near the center, when the FFC is bound to the side of the circuit board, the length of the FFC will undoubtedly increase, the wiring will be more complicated, and it is not conducive to reducing costs.
  • the embodiments of the present application provide a display device, which can effectively reduce the cost of the circuit board and improve the processing efficiency of the backlight module.
  • FIG. 14 is a schematic plan view of a backlight module provided by an embodiment of the present application.
  • the backlight module provided by the embodiment of the present application includes: a backplane 11-2 and a light board 12-2 located on the backplane.
  • the back plate 11-2 located at the bottom of the backlight module, has the function of supporting and bearing.
  • the back plate 11-2 is usually a rectangular structure, and when applied to a special-shaped display device, its shape is adapted to the shape of the display device.
  • the back panel 11-2 includes a sky side, a ground side, a left side and a right side.
  • the sky side is opposite to the ground side
  • the left side is opposite to the right side
  • the sky side is connected to one end of the left side and one side of the right side respectively
  • the ground side is connected to the other end of the left side and the other end of the right side respectively.
  • the material of the back plate 11-2 is aluminum, iron, aluminum alloy or iron alloy.
  • the back plate 11-2 is used for supporting the light plate 12-2 and supporting and fixing the edge positions of components such as the diffuser plate and the optical film.
  • the back plate 11-2 also plays a role of heat dissipation for the light plate 12-2.
  • the overall shape of the light plate 12-2 can be the same as that of the back plate 11-2, and the overall size of the light plate 12-2 can be slightly smaller than that of the back plate 11-2. Rectangular, with a length of 200mm-800mm and a width of 100mm-500mm.
  • a plurality of light panels 12-2 can be provided, and the light panels 12-2 are jointly provided with backlight by splicing.
  • the seams between the adjacent lamp panels 12-2 should be as small as possible, and even seamless splicing can be achieved.
  • the backlight module provided by the embodiment of the present application is a direct type backlight module, and the lamp panel 12 - 2 includes a plurality of light sources arranged in an array to form a uniform surface light source and provide backlight for the display panel 200 .
  • the light board 12-2 may include a circuit board 121-2 and a light emitting diode chip 122-2 located on the circuit board 121-2.
  • the circuit board 121-2 is located on the backplane 11-2, and the shape of the circuit board 121-2 is the same as the overall shape of the light board 12-2. Under normal circumstances, the circuit board 121-2 is in the shape of a plate, and the whole is rectangular or square.
  • the length of the circuit board 121-2 is 200mm-800mm, and the width is 100mm-500mm.
  • the circuit board 121-2 may be a printed circuit board (Printed Circuit Board, PCB for short), and the PCB includes an electronic circuit and an insulating layer, and the insulating layer is used to solder the pads of the light-emitting diode chip 122-2 in the electronic circuit. Leave it bare and cover the rest.
  • PCB printed Circuit Board
  • the circuit board 121-2 may also be an array substrate formed by fabricating a thin film transistor driving circuit on a base substrate, and the surface of the array substrate has connection electrodes connected to the thin film transistor driving circuit for soldering the light emitting diode chip 122-2.
  • the substrate or the base substrate of the above circuit board 121-2 can be made of flexible materials to form a flexible display device.
  • the circuit board 121-2 is a single panel, and the circuit is only provided on the side of the substrate away from the backplane 11-2.
  • the circuit board 121-2 is used to provide driving electrical signals for the light emitting diode chip 122-2.
  • the LED chip 122-2 and the circuit board 121-2 are separately fabricated.
  • the surface of the circuit board 121-2 includes a plurality of pads for soldering the LED chip 122-2.
  • the LED chip 122-2 is transferred after the fabrication is completed. Above the pads, the LED chip 122-2 is soldered on the circuit board 121-2 by a process such as reflow soldering, so that the LED chip 122-2 can be driven to emit light through the input signal of the control circuit board 121-2.
  • the light emitting diode chip 122-2 is located on the circuit board 121-2.
  • the electrodes of the light-emitting diode chip 122-2 are soldered on the exposed pads of the circuit board 121-2 to realize electrical connection therebetween.
  • the light-emitting diode chip 122-2 is used as a backlight source, which is different from a common light-emitting diode chip.
  • the size of the chip used by the light-emitting diode chip 122-2 is in the micrometer level. Since the size of the light-emitting diode chip 122-2 is small, it is beneficial to perform finer control of the display device and improve the contrast of the picture.
  • the size of the light emitting diode chip 122-2 is below 500 ⁇ m.
  • the light-emitting diode chip is a miniLED (Mini Light Emitting Diode) chip.
  • the size of the light-emitting diode chip 122 - 1 is in the micrometer level, and the light-emitting diode chip is a micro light-emitting diode chip.
  • the light-emitting diode chip 122-2 can be fabricated with corresponding dimensions according to practical applications, which is not limited herein.
  • the light board 12-2 may only include light-emitting diode chips 122-2 of one color, or may include light-emitting diode chips 122-2 of multiple colors, which is not limited herein.
  • the circuit board 121-2 is provided with an opening k1 at a position close to the center, and the position of the opening k1 is used for setting the sink plate connector.
  • FIG. 15 is one of the schematic cross-sectional structural diagrams of the backlight module provided by the embodiment of the present application.
  • the circuit board 121-2 is provided with a plurality of pads e at the edge of the opening k1 on the side away from the back plate 11-2.
  • a plurality of pads e may be formed simultaneously with the wiring of the circuit board 121-2.
  • the opening k1 of the circuit board 121-2 can be set as a rectangle, and a plurality of pads e can be set on one side of the rectangular opening.
  • the plurality of pads e have a set spacing, so as to avoid short circuit between the pads e.
  • the sink board connector 13-2 is disposed in the opening k1 of the circuit board 121-2.
  • the backplane 11-2 is provided with an opening k2 at a position corresponding to the opening k1 of the circuit board, and the size of the opening k2 on the backplane is generally larger than the size of the opening k1 of the circuit board 121-2.
  • the sink board connector 13-2 penetrates through the opening k1 of the circuit board and the opening k2 of the backplane.
  • the surface of the sink board connector 13-2 on the side facing away from the backplane 11-2 slightly exceeds the surface of the circuit board 121-2, and the surface on the side facing away from the circuit board 121-2 protrudes beyond the surface of the backplane 11-2. surface.
  • FIG. 16 is an oblique view of the sink plate connector provided by the embodiment of the present application.
  • the sink board connector includes: a socket c, a plurality of first pins p1 , a plurality of second pins p2 and two fixed pins p3 .
  • a plurality of first pins p1 are located on the side of the sink plate connector 13-2 on the side of the opening k1 away from the back plate 11-2.
  • the first pin p1 is located on the side of the circuit board 121-2 away from the backplane 11-2, and the first pin p1 is in one-to-one correspondence with the pads at the opening k1 of the circuit board 121-2.
  • the first pins p1 are overlapped with the pads e in one-to-one correspondence, so that the electrical connection between the circuit board 121-2 and the sink board connector 13-2 can be realized.
  • FIG. 17 is a schematic top view of the structure of the sink plate connector provided by the embodiment of the present application.
  • a plurality of first pins p1 are arranged side by side, and there is a certain gap between adjacent first pins p1.
  • the width of the first pins p1 along the arrangement direction is 0.25mm-0.6mm, and the spacing between adjacent first pins p1 is 0.5mm-1.0mm, so that different Voltage, different current specifications requirements.
  • the spacing between the first pins p1 also needs to be increased.
  • the width of the first pins p1 can be reduced, and accordingly, the distance between the first pins p1 can be reduced, thereby reducing the sink board connection size of the device 13-2.
  • the width of the first pins p1 may be set to 0.25mm, 0.45mm or 0.6mm; correspondingly, the spacing between the first pins p1 may be set to 0.5mm, 0.7mm or 1.0mm.
  • FIG. 18 is a perspective view of the backlight module provided at the sink board connector according to the embodiment of the present application.
  • the socket c is located on the side of the sink board connector 13-2 facing the backplane 11-2 in the opening k1, and the socket c protrudes from the backplane 11-2 away from the circuit board 121-2 side surface, so that the socket c can be exposed on the back of the backplane 11-2, which is beneficial to insert the FFC into the socket c along the direction of the arrow in FIG. 18 .
  • a plurality of second pins p2 are arranged in the socket c, and each second pin p2 corresponds to each first pin p1 one-to-one, and the sink board connector 13-2 is in a one-to-one correspondence.
  • Corresponding lines are provided to electrically connect the second pin p2 with the corresponding first pin p1. Then when the FFC is inserted into the plug-in port c, the line of the FFC is electrically connected to the second pin p2, and the second pin p2 is electrically connected to the first pin p1. If the FFC is connected to the power driver board, you can The circuit connection between the power drive board and the circuit board 121-2 is realized.
  • FIG. 19 is a schematic view of the bottom structure of the sink plate connector provided by the embodiment of the present application.
  • the two fixed pins p3 are respectively located on both sides of the first pin p1; correspondingly, the circuit board 121-2 is provided with the fixed pins p3 on both sides of the pad e of the opening k1.
  • the fixed pin p3 and the fixed pad can also be connected together. The connection strengthens the connection between the sink board connector 13-2 and the circuit board 121-2, so as to prevent the first pin p1 from being disconnected from the pad e under the action of an external force, thereby affecting the circuit connection relationship.
  • connection between the first pin p1 and the pad and between the fixed pin p2 and the fixed pad may be connected by welding.
  • solder paste can be applied to the pads of the circuit board 121-2, and then the sinking board connector 13-2 is placed in the opening k1, so that the first pin p1 of the sinking board connector 13-2 is connected to the circuit
  • the pads e of the board 121-2 correspond to each other, so that the fixed pins of the sink board connector 13-2 and the fixed pads of the circuit board 121-2 correspond to each other.
  • the solder paste is melted, and after cooling, the corresponding pins of the sink board connector 13-2 can be soldered to the circuit board 121-2.
  • circuit board 121-2 exposes lines on the sidewall of the opening k1, if the applied solder paste is excessive, the solder paste between the first pin p1 and the pad e overflows to the circuit board 121- 2. There is an electrical connection between the edge of the board at the opening and the circuit on the side wall of the circuit board 121-2, which may cause problems such as a short circuit of the circuit board 121-2.
  • the embodiment of the present application improves the structure of the first pin p1, so as to avoid the problem of short circuit of the circuit board caused by the overflow of solder paste.
  • FIG. 20 is a schematic side view of the structure of the sink plate connector provided by the embodiment of the present application.
  • the first pin p1 includes an arc-shaped portion b and a portion a that are connected to each other; wherein, one end of the arc-shaped portion b is connected to the sinker connector 13-2, and the other end is connected to the flat portion a, and the arc-shaped portion b is directed toward The side connecting the sink plate connector 13-2 is bent.
  • the flat portion a is parallel to the surface of the circuit board 121-2, and the flat portion a overlaps with the corresponding pad on the surface of the circuit board.
  • the end of the first pin p1 close to the sink board connector is set as an arc surface, so that a certain gap can be formed between the arc part b and the circuit board 121-2. If the solder paste is excessive, it will melt. The solder paste can flow to the gap position without being squeezed out and overflowing to the edge of the board where the opening is located, thus avoiding the problem of short circuit of the circuit board caused by the overflow of the solder paste.
  • the arc-shaped part b is bent in the direction of the side wall of the sink plate connector, so that the arc-shaped part b and the flat part a can be connected smoothly, and no sharp connection points are generated, so as to avoid external force Disconnect under action.
  • the vertical distance w1 between one end of the arc-shaped part b connected to the sinker connector 13-2 and one end of the connection plane part a is set to be less than or equal to 1.5 mm, so as to avoid setting due to bending As a result, the first pin p1 is too high.
  • the edge of the opening k1 of the circuit board 121-2 is beyond the boundary line between the flat part a and the arc surface b, so that the side wall of the opening k1 of the circuit board 121-2 can be separated from the flat part If a is farther away, even if the solder paste overflows, it will be stored in the gap between the arc part b and the circuit board 121-2, and will not flow to the side of the circuit board.
  • the vertical distance w2 between the edge of the opening k1 and the end of the arc-shaped part b connected to the plane part a can be set to be greater than or equal to 0.6 mm, so that the storage overflow solder paste can be reserved. space to avoid the problem of short circuit on the circuit board caused by solder paste overflow.
  • the side wall of the sink plate connector 13-2 is set as a slope x at the position of the connection socket, and the slope x is a guide groove for the insertion of the FFC.
  • the flow trough is used as a reference for homeopathic insertion, which avoids the problem of FFC fracture caused by blind insertion in the vertical direction and cannot be inserted at one time, and can also improve the efficiency of wire insertion.
  • the angle between the inclined plane s and the side wall where the socket is located may be 45°, which is not limited here.
  • FIG. 21 is the second schematic diagram of the cross-sectional structure of the backlight module provided by the embodiment of the present application.
  • the backlight module further includes: a reflective layer 14-2, a diffusion layer 15-2 and an optical film layer 16-2.
  • the reflective layer 14-2 is located on the side of the circuit board 121-2 close to the light-emitting diode chip 122-2, the reflective layer 14-2 includes a plurality of openings for exposing the light-emitting diode chip 122-2, and the reflective layer 122 covers the sink board connection 13-2 settings.
  • the reflective layer 14-2 can be configured as a reflective sheet, which is usually made by coating a reflective particle material with a transparent substrate.
  • the reflective layer 14-2 has the property of reflecting light, so when the light emitted by the LED chip 122-2 is reflected back to the back side by the components in the backlight module, it can be redirected to the light-emitting side by the reflective layer 14-2 reflection, thereby improving the utilization efficiency of the light source.
  • the reflective layer 14-2 covers the setting of the sink board connector 13-2, which can keep the reflectivity of the surface of the circuit board at the position where the sink board connector is provided and the position where the sink board connector is not set, so as to avoid the sink board connector. Unable to reflect light and form dark shadows.
  • the diffusion layer 15-2 is located on the light-emitting side of the lamp panel 12-2.
  • the entire diffusion layer 15-2 is disposed on the light emitting side of the lamp panel 12-2, and the shape of the diffusion layer 15-2 is the same as that of the lamp panel 12-2.
  • the diffusion layer 15-2 can be arranged in a rectangular or square shape.
  • the function of the diffusion layer 15-2 is to scatter the incident light, so that the light passing through the diffusion layer 15-2 is more uniform.
  • the diffusion layer 15-2 is provided with scattering particle materials, and the light incident on the scattering particle materials will continuously refract and reflect, so as to achieve the effect of scattering the light and realize the effect of uniform light.
  • the diffusion layer 15-2 can take the form of a diffusion plate or a diffusion sheet. If it is applied to large-scale display devices such as TVs, a diffuser plate can be used; when applied to small display devices such as mobile phones and smart bracelets, a diffuser sheet can be used.
  • the thickness of the diffuser plate is larger than that of the diffuser sheet, and the thickness of the diffuser plate is 1.5mm-3mm.
  • the haze of the diffuser plate is larger, and the uniformity effect is better. It can usually be processed by extrusion process.
  • the material used for the diffuser plate is generally selected from polymethyl methacrylate PMMA, polycarbonate PC, polystyrene material PS, polypropylene PP at least one of them.
  • the thickness of the diffusion sheet is less than 0.3mm, which is relatively thin, and is more suitable for small and light display devices.
  • the diffusion sheet is usually coated with diffusion particles on the base material.
  • the base material can be polyethylene terephthalate, PET, glass, etc., and the scattering particles can be made of titanium dioxide, zinc oxide, calcium oxide, and the like.
  • the optical film layer 16-2 is located on the side of the diffuser plate 15-2 away from the light plate 12-2.
  • the optical film layer 16-2 is arranged in the whole layer, and its shape is the same as the overall shape of the diffuser layer 15-2. Usually, it can be set be rectangular or square.
  • the arrangement of the optical film layer 16-2 can make the backlight module adapt to various practical applications.
  • the light emitting diode chip 122-2 may use a blue light device, and the optical film layer 16-2 specifically includes a quantum dot layer or a fluorescent layer.
  • the quantum dot layer includes a red quantum dot material and a green quantum dot material, the red quantum dot material emits red light under the excitation of blue light, the green quantum dot material emits green light under the excitation of blue light, and the stimulated emission of red light, The green light and the transmitted blue light are mixed into white light and emitted.
  • the fluorescent layer includes fluorescent materials that stimulate emission of red light and stimulated emission of green light, and the stimulated emission of red light, green light and transmitted blue light is mixed into white light for output.
  • the optical film layer 16-2 may also include a prism sheet, and the prism sheet can change the exit angle of light, thereby changing the viewing angle of the display device.
  • the optical film layer 16-2 may also include a reflective polarizer.
  • the reflective polarizer can improve the brightness of the backlight module, improve the utilization efficiency of light, and at the same time make the outgoing light have the property of polarization, omitting the liquid crystal display.
  • the optical film layer 16-2 can be provided as an integrated optical film, thereby simplifying the installation of the backlight module.
  • the first reflective layer and the second reflective layer have the property of reflecting light, and the light emitted from the P-N junction is continuously reflected between the first reflective layer and the second reflective layer, and is finally reflected by the light-emitting diode chip.
  • Side exit thereby expanding the exit angle of light and improving the light mixing effect of two adjacent light-emitting devices, so uniform light can be obtained without a large mixing distance, avoiding the occurrence of light caused by the reduction of the mixing distance.
  • the obvious lamp shadow phenomenon improves the display effect of the display device.
  • the exit angle of light from the light-emitting diode chip can be increased to 165°, which expands the exit angle of the light. Therefore, the light mixing effect of two adjacent light-emitting devices is improved, so that uniform light can be obtained without a large light mixing distance, and the obvious lamp shadow phenomenon caused by the reduction of the light mixing distance is avoided, and the display device is improved. display effect.
  • both the first reflective layer and the second reflective layer are formed by alternately stacking two first and second dielectric layers with different refractive indices, the optical thicknesses of the first and second dielectric layers being the center Reflects 1/4 of the wavelength and is therefore a quarter-wave multilayer system, equivalent to a simple set of photonic crystals. Since electromagnetic waves with frequencies falling within the energy gap range cannot penetrate, the reflectivity of the first reflection layer and the second reflection layer are both greater than or equal to 99%.
  • the material used for the first dielectric layer is silicon dioxide, and the first dielectric layer made of silicon dioxide is not easy to decompose and absorb, and has better scattering properties.
  • the material used for the second medium layer is titanium dioxide, and the second medium layer made of titanium dioxide has higher hardness and can improve the comprehensive performance of the light-emitting device.
  • the film thickness will not be too thick, and the thickness of the first reflective layer and the second reflective layer
  • the reflectivity can reach 99.6%, which can meet the needs of use.
  • the optical composite layer includes: a first diffusion layer, a quantum dot layer, a second diffusion layer, a prism layer and a light enhancement layer.
  • the first diffusion layer plays the role of diffusing light; the main materials of the quantum dot layer are red quantum dots and green quantum dots synthesized by wrapping the film.
  • the red quantum dots and green quantum dots synthesized by re-wrapping can effectively isolate water and oxygen Guarantee the stability of quantum dots.
  • the blue light emitted by the blue light-emitting diode chip forms a relatively uniform blue light surface through the light diffusion of the first diffusion layer.
  • the red quantum dot material in the quantum dot layer emits red light under the excitation of blue light
  • the green quantum dot material emits red light under the blue light.
  • the green light is emitted under the excitation of the excitation light, and the excited red light, green light and transmitted blue light are mixed into white light and emitted;
  • the second diffusion layer plays the role of diffusing the light, and the first diffusion layer and the second diffusion layer adopt Made of high-temperature-resistant materials, in the working state of high-power backlight, it can ensure that the optical composite layer maintains the stiffness of the plate itself in the heated state, and is not easy to deform at high temperature.
  • the prism layer concentrates the scattered light in a certain range and emits it, and improves the brightness of the light in the range, thereby improving the brightness of the light on the front of the display panel; the light-enhancing layer can improve the brightness of the backlight module and improve the utilization efficiency of light.
  • the material used for the first dielectric layer is silicon dioxide
  • the material used for the second dielectric layer is titanium dioxide
  • the refractive index of the silicon dioxide layer is 1.47
  • the titanium dioxide When the refractive index of the layer is 2.52, the blue light wavelength is brought in.
  • the thickness of the first dielectric layer is 63.02nm-73.02nm
  • the thickness of the second dielectric layer The thickness of the dielectric layer is 34.68nm-44.68nm.
  • the optical composite layer includes: a diffusion layer, a prism layer and a light enhancement layer, and the diffusion layer plays the role of radiating light. It has the effect of diffusion, and the diffusion layer is made of high-temperature resistant materials.
  • the optical composite layer maintains the stiffness of the plate itself in the heated state, and is not easy to be deformed at high temperature; the prism layer will disperse the light The light is concentrated in a certain range and the brightness of the light in this range is improved, thereby improving the brightness of the light on the front of the display panel; the light-enhancing layer can improve the brightness of the backlight module and improve the utilization efficiency of light.

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Abstract

一种显示装置，包括：显示面板（200）和背光模组（100）；背光模组（100）包括：背板（11）、电路板（12）和发光器件（13）；发光器件（13）包括：发光二极管芯片（131）、第一反射层（132）和第二反射层（133），第一反射层（132）和第二反射层（133）具有对光进行反射的性质，发光二极管芯片（131）出射的光线在第一反射层（132）和第二反射层（133）之间不断反射，最终由发光二极管芯片（131）的侧面出射，从而扩大了光线的出射角度，提升相邻两个发光器件（13）的混光效果，因此不需要太大的混光距离就可以得到均匀的光线，避免了由于混光距离的减小出现的明显的灯影现象，提高了显示装置的显示效果。

Description

一种显示装置
相关申请交叉引用
本申请要求于2021年03月11日提交中国专利局、申请号为202110265542.1、申请名称为“一种显示装置”、2021年04月09日提交中国专利局、申请号为202110382807.6、申请名称为“一种显示装置”、2021年04月09日提交中国专利局、申请号为202120728841.X、申请名称为“一种显示装置”以及2021年05月28日提交中国专利局、申请号为202110591605.2、申请名称为“一种显示装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及显示技术领域，尤其涉及一种显示装置。
背景技术
随着液晶显示器(liquid crystal display，简称LCD)制作技术快速的进步，以及其具备有轻薄、省电及无辐射线等优点，使得液晶显示器大量地被应用于笔记本电脑、数字相机、数字摄录像机、移动电话、计算机屏幕及液晶电视等各式电子产品中。但由于液晶显示器中的液晶显示面板为非自发光性的显示面板，需要借助背光模组所提供的光源才能产生显示的功能。
目前常用的背光模组包括侧入式背光模组和直下式背光模组。直下式背光模组中为提高显示装置的显示效果，光源和扩散板之间通常会设置一定的混光距离，直下式背光模组在应用时，也会遇到一系列的光学问题。
发明内容
本申请一些实施例中，显示装置包括：显示面板和背光模组；背光模组包括：背板、电路板和发光器件；发光器件包括：发光二极管芯片、第一反射层和第二反射层，第一反射层和第二反射层具有对光进行反射的性质，发光二极管芯片出射的光线在第一反射层和第二反射层之间不断反射，最终由发光二极管芯片的侧面出射，从而扩大了光线的出射角度，提升相邻两个发光器件的混光效果，因此不需要太大的混光距离就可以得到均匀的光线，避免了由于混光距离的减小出现的明显的灯影现象，提高了显示装置的显示效果。
本申请一些实施例中，第一反射层和第二反射层为布拉格反射片；第一反射层和第二 反射层均包括多层交替堆叠的第一介质层和第二介质层。
本申请一些实施例中，第一介质层和第二介质层的光学厚度为中心反射波长的1/4，因此是一种四分之一波长多层系统，相当于简单的一组光子晶体。由于频率落在能隙范围内的电磁波无法穿透，第一反射层和第二反射层的反射率均大于或等于99％。
本申请一些实施例中，第一介质层采用的材料为二氧化硅，采用二氧化硅制作的第一介质层不容易分解和吸收，散射性较好。第二介质层采用的材料为二氧化钛，采用二氧化钛制作的第二介质层硬度较高，可以提高发光器件的综合性能。
本申请一些实施例中，第一反射层和第二反射层包括7层第一介质层和7层第二介质层时，膜层厚度不会太厚，并且第一反射层和第二反射层的反射率可以达到99.6％，满足使用需求。
本申请一些实施例中，当发光二极管芯片为蓝光发光二极管芯片时，光学复合层包括：第一扩散层、量子点层、第二扩散层、棱镜层和增光层。
本申请一些实施例中，第一扩散层和第二扩散层起到对光线进行扩散的作用。
本申请一些实施例中，第一扩散层和第二扩散层采用耐高温的材料进行制作，在高功率背光工作状态下，可以保证光学复合层在受热状态保持板材自身的挺度，不易高温产生形变。
本申请一些实施例中，量子点层主要材料为被薄膜包裹合成的红色量子点和绿色量子点，重新包裹合成的红色量子点和绿色量子点可以有效隔绝水和氧气，保证量子点的稳定性。蓝光发光二极管芯片发出的蓝光在通过第一扩散层的光扩散作用形成较为均匀的蓝光面，量子点层中的红色量子点材料在蓝色光的激发下出射红色光，绿色量子点材料在蓝色光的激发下出射绿色光，受激发射的红色光、绿色光以及透射的蓝色光混合成白光出射；第二扩散层起到对光线进行扩散的作用。
本申请一些实施例中，棱镜层将分散的光线集中在一定范围内射出，提高该范围内光线的亮度，从而提高显示面板正面的光线辉度；增光层可以提高背光模组的亮度，提高光线的利用效率。
本申请一些实施例中，当发光二极管芯片为蓝光发光二极管芯片，第一介质层采用的材料为二氧化硅，第二介质层采用的材料为二氧化钛，并且二氧化硅层的折射率为1.47，二氧化钛层的折射率为2.52时，第一介质层的厚度为63.02nm-73.02nm，第二介质层的厚度为34.68nm-44.68nm。
本申请一些实施例中，当发光二极管芯片包括红光色发光二极管芯片、绿光发光二极管芯片和蓝光发光二极管芯片时，光学复合层包括：扩散层、棱镜层和增光层。
其中，扩散层起到对光线进行扩散的作用，并且扩散层采用耐高温的材料进行制作，在高功率背光工作状态下，可以保证光学复合层在受热状态保持板材自身的挺度，不易高温产生形变；棱镜层将分散的光线集中在一定范围内射出，提高该范围内光线的亮度，从而提高显示面板正面的光线辉度；增光层可以提高背光模组的亮度，提高光线的利用效率。
本申请一些实施例中，背光模组还包括漫反射层，位于电路板靠近发光器件的一侧，漫反射层包括多个暴露发光器件的开口，可以将各发光器件暴露出来，保证发光器件可以顺利地出射光线。漫反射层可以将发光器件向电路板一侧出射的光线，或者被其它器件反射回电路板的光线，重新向出光一侧反射，并且反射光线的反射路径随机，因此经过漫反射层对光线的多次反射，对光线起到了匀化的作用，进而提高光源的利用效率。
本申请一些实施例中，漫反射层是采用混有反射粒子的胶体涂覆在电路板上形成，漫反射层的反射率大于或等于97％。
本申请一些实施例中，显示装置包括：显示面板和背光模组；背光模组包括：光源和扩散板，扩散板位于光源的出光侧，在扩散板面向光源的一侧设置有反光网点，反射网点具有对光进行反射的性质，当光源出射的光线入射到反光网点上时，绝大数光线被反光网点反射回背光模组中的第一反射片和第二反射片上，光线再次被反射，由此，光线在反射网点与背光模组中的第一反射片和第二反射片之间不断反射，最终在反光网点之间的间隔位置出射，光线经过多次扩散板与第一反射片和第二反射片之间的匀化作用之后，出光面亮度均匀，避免了背光模组四周区域发暗的现象，提高了显示装置的显示效果。
本申请一些实施例中，扩散板在边缘区域内设置的反射网点的分布密度小于扩散板在中间区域内设置的反射网点的分布密度，由于显示装置在边缘位置无法设置光源，因此在边缘位置光线分布较少，产生四周发暗的问题，通过在扩散板边缘区域内设置较少的反射网点，在扩散板的中间区域内设置较多反射网点，当光线入射到扩散板中间区域时，大部分的光线被反射回第一反射片、第二反射片一侧，只有少部分光可以通过反射网点的间隙出射到扩散板中，从而使得大部分光线可以在中线区域内的反射网点与第一反射片、第二反射片之间不断反射振荡，使得一部分光线能够被反射振荡到扩散板的边缘区域内，而扩散板的边缘区域设置的反射网点密度较小，相对较多的光线可以通过反射网点的间隔入射到扩散板内，从而使得边缘区域出射光相对于中间区域的出射光更多。由此，光线经过多次在扩散板与第一反射片、第二反射片之间的匀化作用之后，出光面亮度均匀，由此平衡了扩散板的边缘区域与中心区域出射画面的明亮差，避免了背光模组四周区域发暗的现象，提高了显示装置的显示效果。
本申请一些实施例中，背光模组还包括：背板、发光二极管灯板、第一反射片和第二 反射片，第一反射片位于发光二极管灯板背离背板的一侧，第二反射片位于背板的倾斜部面向发光二极管灯板的一侧，并且，第一反射片和第二反射片为漫反射层。
本申请一些实施例中，第一反射片可以将发光器件向发光二极管灯板一侧出射的光线，或者被扩散板和光学膜片反射回发光二极管灯板的光线，重新向出光一侧反射，并且反射光线的反射路径随机，因此经过第一反射片对光线的多次反射，对光线起到了匀化的作用，进而提高光源的利用效率。
本申请一些实施例中，第二反射片可以将边缘位置的发光器件出射的大角度光线重新反射回背光模组中再次利用，或者被扩散板和光学膜片反射回倾斜部的光线，可以被第二反射片重新向出光一侧反射，并且反射光线的反射路径随机，因此经过第二反射片对光线的多次反射，对光线起到了匀化的作用，进而提高光源的利用效率。
本申请一些实施例中，扩散板在背板的正投影覆盖第一反射片和第二反射片在背板的正投影。
本申请一些实施例中，扩散板在第一反射片对应的区域内的第一反射网点的分布密度大于扩散板在第二反射片对应的区域内的第二反射网点的分布密度。这样可以使得第一反射网点之间的间隙小于第二反射网点之间的间隙。当光线入射到第一反射片对应的扩散板区域内时，由于第一反射片对应的扩散板区域设置的第一反射网点密度较大，大部分的光线被反射回第一反射片、第二反射片一侧，只有少部分光可以出射到扩散板中，从而使得大部分光线可以在第一反射网点与第一反射片、第二反射片之间不断反射振荡，使得一部分光线能够被反射振荡到第二反射片对应的扩散板区域内，而第二反射片对应的扩散板区域内设置的第二反射网点密度较小，相对较多的光线可以经过第二反射网点的间隙入射到扩散板内，仍然会有一部分光线入射到第二反射网点上，被第二反射网点反射回第一反射片和第二反射片一侧。由此，光线经过多次在扩散板与第一反射片、第二反射片之间的匀化作用之后，出光面亮度均匀，由此平衡了第一反射片对应的扩散板区域和第二反射片对应的扩散板内出射画面的明亮差，避免了背光模组四周区域发暗的现象，提高了显示装置的显示效果。
本申请一些实施例中，扩散板在第一反射片对应的区域内的第一反射网点的尺寸大于扩散板在第二反射片对应的区域内的第二反射网点的尺寸，这样可以使第一反射网点之间的间隙更小，使第二反射网点之间的间隙更大，从而可以使入射到第二反射片对应的区域的光线的透射率大于入射到第一反射片对应的区域的光线的透射率，再配合反射网点与第一反射片和第二反射片的反射匀化作用，可以避免背光模组四周发暗的现象，提高了显示装置的显示效果。
本申请一些实施例中，扩散板在第一反射片对应的区域内的各反射网点的尺寸可以相同，这样可以降低反射网点的制作难度，从而简化了显示装置的制作工艺。
本申请一些实施例中，在扩散板对应的发光器件发光中心对应的位置设置更多的反射网点，在发光器件出射的大角度光线对应的区域设置较少的反射网点，从而可以使发光器件出射的小角度光线更多地被反射回第一反射片一侧，而使发光器件出射的大角度光线更多地透射到扩散板中，起到平衡光线透射率的作用。与此同时，被反射网点反射的光线会再次被第一反射片漫反射，经过反射网点和第一反射片之间的多次反射振荡，使得最终出射的光线更加均匀，平衡了发光器件的发光中心和边缘位置处的明暗差异，提高了显示装置的显示效果。
本申请一些实施例中，一个发光器件的出射光在扩散板的照射范围内，靠近中心位置的反射网点的尺寸大于远离中心位置的反射网点的尺寸，由此可以使靠近中心位置的反射网点之间的间隙更小，远离中间位置的反射网点之间的间隙更大，从而可以发光器件出射的大角度光线的透射率相对较大，再配合反射网点与第一反射片的反射匀化作用，可以避免发光器件的出光中间位置较亮，边缘较暗的问题，提高了显示装置的显示效果。
本申请一些实施例中，反射网点采用的材料为白色油墨。
本申请一些实施例中，反射网点的尺寸范围为0.4mm-1.5mm。
本申请一些实施例中，显示装置包括背板和位于背板之上的电路板；电路板包括开孔，开孔的边缘在背离背板的一侧设置有多个焊盘；沉板连接器设置于开孔内，沉板连接器包括多个与各焊盘一一对应搭接的第一引脚，以及与各第一引脚一一对应电连接的第二引脚，第二引脚设置于背离背板一侧的插线口内，将FFC插入到插线口内可以实现FFC通过沉板连接器与电路板之间的电路连接。
本申请一些实施例中，背板在对应电路板的开孔位置处设置有开口，背板的开口的尺寸通常大于电路板的开孔的尺寸。沉板连接器贯穿电路板的开孔和背板的开口。
本申请一些实施例中，沉板连接器在背离背板的一侧表面略超出于电路板的表面，从而可以将沉板连接器的第一引脚与开孔边缘的焊盘进行搭接。沉板连接器在背离电路板一侧的表面凸出于背板的表面，从而露出插线口，用于连接FFC。
本申请一些实施例中，多个第一引脚并排排列，且相邻的第一引脚之间存在一定的间隙。第一引脚沿着排列方向的宽度为0.25mm-0.6mm，相邻的第一引脚之间的间距为0.5mm-1.0mm，由此可以适配不同电压、不同电流规格需求。
本申请一些实施例中，沉板连接器在第一引脚的两侧设置有固定引脚，相应地，电路板在开孔的焊盘的两侧设置与固定引脚一一对应的固定焊盘，在连接第一引脚与焊盘时， 还可以一并将固定引脚与固定焊盘连接，由此，可以利用固定引脚和固定焊盘之间的连接加强沉板连接器与电路板之间的连接关系，避免在外力作用下第一引脚与焊盘断开从而影响电路连接关系。
本申请一些实施例中，第一引脚包括相互连接的弧形部和平面部；其中，弧形部的一端连接沉板连接器，另一端连接平面部；平面部与电路板的表面平行，平面部与电路板表面的对应的焊盘搭接。将第一引脚靠近沉板连接器的一端设置为弧面，由此可以使弧形部与电路板之间形成一定的间隙，如果锡膏过量，那么融化的锡膏可以流动到该间隙位置，而不会被挤出溢到开孔位于的板边处，由此可以避免锡膏溢出造成的电路板短路的问题。
本申请一些实施例中，弧形部向沉板连接器的侧壁的方向弯曲，这样可以使弧形部与平面部之间平滑连接，不产生尖锐的连接点，从而避在外力作用下断开。
本申请一些实施例中，将弧形部连接沉板连接器的一端与连接平面部的一端之间的垂直距离设置为小于或等于1.5mm，由此可以避免由于第一引脚弯曲设置而导致第一引脚过高，从而避免对光源出射光的影响。
本申请一些实施例中，电路板的开孔的边缘超出平面部与弧面部的交界线，由此可以使电路板的开孔的侧壁距离平面部较远，那么即使有锡膏溢出也会存储在弧形部与电路板之间的间隙位置，而不会流到电路板的侧边上。
本申请一些实施例中，将开孔的边缘与平面部连接弧形部一端的垂直距离设置为大于或等于0.6mm，可以预留出存储溢出锡膏的空间，避免锡膏溢出造成的电路板短路的问题。
本申请一些实施例中，沉板连接器的侧壁在连接插线口的位置设置为斜面，该斜面为方便FFC插入的导流槽，FFC可以导流槽为基准顺势插入，避免垂直方向盲插入无法一次性插入造成FFC折伤的问题，还可以提升插线效率。
本申请一些实施例中，斜面s与插线口所在侧壁的夹角为45°。
本申请一些实施例中，背光模组还包括位于电路板靠近发光二极管芯片一侧的反射层，反射层覆盖沉板连接器设置，可以使电路板的表面在设置沉板连接器的位置和未设置沉板连接器的位置的反射率保持一致，从而避免沉板连接器无法反光而形成暗影。
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为了更清楚地说明本申请实施例的技术方案，下面将对本申请实施例中所需要使用的附图作简单地介绍，显而易见地，下面所介绍的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请某些实施例提供的显示装置的截面结构示意图；
图2为本申请某些实施例提供的背光模组的截面结构示意图；
图3为相关技术中显示装置的显示效果的示意图；
图4为本申请某些实施例提供的发光器件的截面结构示意图；
图5为本申请某些实施例提供的布拉格反射片的截面结构示意图；
图6为本申请某些实施例提供的对相同条件下包含不同层数的第一介质层和第二介质层的布拉格反射片的反射率的光学模拟示意图；
图7a为本申请某些实施例提供的光学复合层的截面结构示意图之一；
图7b为本申请某些实施例提供的光学复合层的截面结构示意图之二；
图8为本申请某些实施例提供的显示装置的显示效果的示意图；
图9为本申请某些实施例提供的背光模组的截面结构示意图；
图10为本申请某些实施例提供的背光模组的局部光线路程示意图；
图11为本申请某些实施例提供的反射网点的排布效果示意图；
图12a为相关技术中显示装置的显示效果俯视图；
图12b为相关技术中背光模组的局部光线路程示意图；
图13为本申请某些实施例提供的背光模组的局部截面结构示意图；
图14为本申请某些实施例提供的背光模组的平面结构示意图；
图15为本申请某些实施例提供的背光模组的截面结构示意图之一；
图16为本申请某些实施例提供的沉板连接器的斜视图；
图17为本申请某些实施例提供的沉板连接器的俯视结构示意图；
图18为本申请某些实施例提供的背光模组在沉板连接器处的立体图；
图19为本申请某些实施例提供的沉板连接器的仰视结构示意图；
图20为本申请某些实施例提供的沉板连接器的侧视结构示意图；
图21为本申请某些实施例提供的背光模组的截面结构示意图之二。
其中，100-背光模组，200-显示面板，11-背板，12-电路板，13-发光器件，14-漫反射层，15-光学复合层，131-发光二极管芯片，132-第一反射层，133-第二反射层，1301-第一介质层，1302-第二介质层，1311-衬底，1312-第一半导体层，1313-第二半导体层，150-扩散层，151-第一扩散层，152-量子点层，153-第二扩散层，154-棱镜层，155-增光层。
具体实施方式
为使本申请的上述目的、特征和优点能够更为明显易懂，下面将结合附图和实施例对 本申请做进一步说明。然而，示例实施方式能够以多种形式实施，且不应被理解为限于在此阐述的实施方式；相反，提供这些实施方式使得本申请更全面和完整，并将示例实施方式的构思全面地传达给本领域的技术人员。在图中相同的附图标记表示相同或类似的结构，因而将省略对它们的重复描述。本申请中所描述的表达位置与方向的词，均是以附图为例进行的说明，但根据需要也可以做出改变，所做改变均包含在本申请保护范围内。本申请的附图仅用于示意相对位置关系不代表真实比例。
液晶显示器主要由背光模组和液晶显示面板构成。液晶显示面板本身不发光，需要依靠背光模组提供的光源实现亮度显示。
液晶显示器的显像原理，是将液晶置于两片导电玻璃之间，靠两个电极间电场的驱动，引起液晶分子扭曲的电场效应，以控制背光源透射或遮蔽功能，从而将影像显示出来。若加上彩色滤光片，则可显示彩色影像。
图1为本申请实施例提供的显示装置的截面结构示意图。
参照图1，显示装置包括：背光模组100和显示面板200。
显示面板200位于背光模组100的出光侧，显示面板的形状与尺寸通常与背光模组相匹配，通常情况下显示面板200可以设置为矩形，包括天侧、地侧、左侧和右侧，其中天侧和地侧相对，左侧和右侧相对，天侧分别与左侧的一端和右侧的一侧相连，地侧分别与左侧的另一端和右侧的另一端相连。
显示面板200为透射型显示面板，能够对光的透射率进行调制，但本身并不发光。显示面板200具有多个呈阵列排布的像素单元，每个像素单元都可以独立的控制背光模组100入射到该像素单元的光线透过率和色彩，以使全部像素单元透过的光线构成显示的图像。
背光模组100通常位于显示装置的底部，其形状与尺寸与显示装置的形状与尺寸相适应。当应用于电视或移动终端等领域时，背光模组通常采用矩形的形状。
本申请实施例中的背光模组采用直下式背光模组，用于在整个出光面内均匀的发出光线，为显示面板提供亮度充足且分布均匀的光线，以使显示面板可以正常显示影像。
图2为本申请实施例提供的背光模组的截面结构示意图。
参照图2，背光模组包括：背板11、电路板12、发光器件13、漫反射层14和光学复合层15。
背板11位于背光模组的底部，具有支撑和承载作用。背板11通常情况下为一矩形结构，当应用于异形显示装置时，其形状适应于显示装置的形状。背板11包括天侧、地侧、左侧和右侧。其中天侧和地侧相对，左侧和右侧相对，天侧分别与左侧的一端和右侧的一侧相连，地侧分别与左侧的另一端和右侧的另一端相连。
背板11的材质采用铝、铁、铝合金或铁合金等。背板11用于固定电路板12以及支撑固定光学复合层15等部件的边缘位置，背板11还对电路板12起到散热的作用。
电路板12位于背板11之上，电路板12的形状可以采用板状或条状，电路板12采用板状时，其形状可以与背板11的形状相同，在通常情况下，电路板12为板状，整体呈长方形或正方形。
电路板12可以是印刷电路板(Printed Circuit Board，简称PCB)，PCB包括基材、电子线路和绝缘层。
基材可以采用FR4或玻璃等材料进行制作。或者，基板也可以采用柔性材料来制作以形成柔性电路板。
电子线路的材料通常采用铜，采用刻蚀工艺形成用于驱动发光器件13的电子线路的图形。
绝缘层具有保护电子线路的作用，绝缘层将电子线路中焊接发光器件13的焊盘裸露在外而将其余部分覆盖。
或者，电路板12也可以是在衬底基板上制作薄膜晶体管驱动电路形成的阵列基板，阵列基板的表面具有连接至薄膜晶体管驱动电路的连接电极，用于焊接发光器件13。
发光器件13位于电路板12之上，电路板12用于为发光器件13提供驱动信号。在直下式背光模组中，发光器件13呈阵列排布，为显示面板提供背光。
漫反射层14位于电路板12靠近发光器件13一侧的表面，其形状与电路板12的形状相同，漫反射层14包括多个暴露发光器件13的开口，可以将各发光器件13暴露出来，保证发光器件13可以顺利地出射光线。漫反射层14可以将发光器件13向电路板12一侧出射的光线，或者被其它器件反射回电路板12的光线，重新向出光一侧反射，并且反射光线的反射路径随机，因此经过漫反射层14对光线的多次反射，对光线起到了匀化的作用，进而提高光源的利用效率。
漫反射层14采用混有反射粒子的胶体涂覆在电路板12上形成，在本申请实施例中，漫反射层14的反射率大于或等于97％。
目前在直下式背光模组中为提高显示装置的显示效果，光源和扩散板之间通常会设置一定的混光距离，为实现显示装置超薄化设计，需要减小混光距离，而混光距离的减小会出现如图3所示的明显的灯影现象，影响显示效果。
有鉴于此，在本申请实施例中，对发光器13件进行如下设置，既可以实现显示装置的薄型化，实现更为精细化的动态控制，又解决了为实现超薄设计减小混光距离而出现的灯影问题。
图4为本申请实施例提供的发光器件的截面结构示意图。
参照图4，发光器件13包括：发光二极管芯片131、第一反射层132和第二反射层133。
发光二极管芯片131包括：衬底1311、第一半导体层1312、第二半导体层1313、第一电极P第二电极N电极。制作发光二极管芯片131时，在衬底1311上依次形成第一半导体层1312和第二半导体层1313，第一电极P位于第二半导体层1313上，与第二半导体层1313电连接，第二电极N位于第一半导体层1312上，与第一半导体层1312电连接。
在本申请实施中，衬底1311可以采用蓝宝石，第一半导体层1312采用的材料为N型氮化镓，第二半导体层1313采用的材料为P型氮化镓，第一半导体层1312和第二半导体层1313构成P-N结，对P-N结施加电压后，P-N结出射光线，为显示装置提供背光。
第一反射层132位于衬底1311背离第一半导体层1312的一侧，第一反射层132的大小形状与衬底1311的大小形状相同。
第二反射层133位于第二半导体层1313和第一半导体层1312背离衬底1311的一侧，第二反射层133在衬底1311上的正投影与第二半导体层1313在衬底1311上的正投影重合。
如图4所示，由于第一反射层132和第二反射层133具有对光进行反射的性质，P-N结出射的光线在第一反射层132和第二反射层133之间不断反射，最终由发光二极管芯片131的侧面出射，从而扩大了光线的出射角度，提升相邻两个发光器件13的混光效果，因此不需要太大的混光距离就可以得到均匀的光线，避免了由于混光距离的减小出现的明显的灯影现象，提高了显示装置的显示效果。
具体地，传统发光二极管芯片的上下两侧未设置反射层，光线的出射角度在120°左右，而在本申请实施例中，在发光二极管芯片131的上侧和下侧分设置第一反射层132和第二反射层133后，发光二极管芯片131的光线的出射角度可提高到165°，扩大了光线的出射角度，从而提升了相邻两个发光器件13的混光效果，因此不需要太大的混光距离就可以得到均匀的光线，避免了由于混光距离的减小出现的明显的灯影现象，提高了显示装置的显示效果。
在本申请实施例中，第一反射层132和第二反射层133为布拉格反射片。图5为本申请实施例提供的布拉格反射片的截面结构示意图。
参照图5，第一反射层132和第二反射层133均由两种不同折射率的第一介质层1301和第二介质层1302交替堆叠形成，第一介质层1301和第二介质层1302的光学厚度为中心反射波长的1/4，因此是一种四分之一波长多层系统，相当于简单的一组光子晶体。由于频率落在能隙范围内的电磁波无法穿透，第一反射层132和第二反射层133的反射率均大于或等于99％。
具体地，第一反射层132和第二反射层133的折射率R的具体数值可由以下公式计算得出：
R＝[1-(nH/nL) 2×nH 2/ns] 2×[1+(nH/nL) 2×nH 2/ns] 2
其中，nL表示第一介质层1301的折射率，nH表示第二介质层1302的折射率，ns表示与第一反射层132或第二反射层133接触的衬底的折射率，例如当求第一反射层132的折射率R时，ns表示衬底1311的折射率。
第一介质层1301或第二介质层1302的厚度d r可由以下公式计算得出：
d r＝λ d/(4×n r)
其中，d r表示第一介质层1301或第二介质层1302的厚度，λ d表示发光二极管芯片出射的光线的波长，n r表示第一介质层1301或第二介质层1302的折射率。
在本申请实施例中，第一介质层1301采用的材料为二氧化硅，采用二氧化硅制作的第一介质层1301不容易分解和吸收，散射性较好。
第二介质层1302采用的材料为二氧化钛，采用二氧化钛制作的第二介质层1302硬度较高，可以提高发光器件的综合性能。
当第一介质层1301和第二介质层1302采用的层数不同时，表现出的反射率也不尽相同。
图6为本申请实施例提供的对相同条件下包含不同层数的第一介质层和第二介质层的布拉格反射片的反射率的光学模拟示意图。
参照图6，横坐标为发光二极管芯片出射的光线的波长，纵坐标为布拉格反射片的反射率，在温度为300℃的情况下，本申请实施例分别对包含3层第一介质层1301和3层第二介质层1302的布拉格反射片(对应附图6中的虚线1)、包含5层第一介质层1301和5层第二介质层1302的布拉格反射片(对应附图6中的虚线2)和包含7层第一介质层1301和7层第二介质层1302的布拉格反射片(对应附图6中的实线3)进行光学模拟，当布拉格反射片包含7层第一介质层1301和7层第二介质层1302时，布拉格反射片的反射率可以达到99.6％，满足使用要求。
因此，当第一反射层132和第二反射层133包括7层第一介质层1301和7层第二介质层1302时，膜层厚度不会太厚，并且第一反射层132和第二反射层133的反射率可以达到99.6％，满足使用需求。本申请实施例提供的第一反射层132可以包括7层第一介质层1301和7层第二介质层1302。
在本申请某些实施例中，发光二极管芯片131作为背光源，不同于普通的发光二极管芯片。发光二极管芯片131采用的芯片的尺寸在微米级别，由于发光二极管芯片131的尺 寸很小，有利于对显示装置进行更精细的控制，提高画面的对比度。
在本申请一些实施例中，发光二极管芯片131的尺寸在500μm以下。
在某些实施例中，发光二极管芯片为miniLED(Mini Light Emitting Diode)芯片。
在本申请某些实施例中，发光二极管芯片131采用的芯片的尺寸在微米级别，发光二极管芯片为微型发光二极管芯片。
在本申请实施例中，发光二极管芯片131可以根据实际应用进行相应尺寸的制作，在此不做限定。
光学复合层15位于发光器件13背离电路板12的一侧，用于提高显示装置的显示效果。图7a为本申请实施例提供的光学复合层的截面结构示意图之一。
参照图2和7a，当发光二极管芯片为蓝光发光二极管芯片时，光学复合层15包括：第一扩散层151、量子点层152、第二扩散层153、棱镜层154和增光层155。
第一扩散层151位于发光器件13背离电路板12的一侧，第一扩散层151的大小形状与显示装置中的电路板12的大小形状相适应，第一扩散层151起到对光线进行扩散的作用。
在本申请实施例中，第一扩散层151采用的材料为聚碳酸酯(PC)。
量子点层152位于第一扩散层151背离发光器件13的一侧，量子点层152的大小形状与第一扩散层151一致。量子点层152主要材料为被薄膜包裹合成的红色量子点和绿色量子点，重新包裹合成的红色量子点和绿色量子点可以有效隔绝水和氧气，保证量子点的稳定性。蓝光发光二极管芯片发出的蓝光在通过第一扩散层151的光扩散作用形成较为均匀的蓝光面，量子点层152中的红色量子点材料在蓝色光的激发下出射红色光，绿色量子点材料在蓝色光的激发下出射绿色光，受激发射的红色光、绿色光以及透射的蓝色光混合成白光出射。
第二扩散层153位于量子点层152背离第一扩散层151的一侧；其形状大小与量子点层152一致。第二扩散层153起到对光线进行扩散的作用，并且第一扩散层151和第二扩散层153采用耐高温的材料进行制作，在高功率背光工作状态下，可以保证光学复合层15在受热状态保持板材自身的挺度，不易高温产生形变。
在本申请实施例中，第一扩散层151采用的材料为聚碳酸酯(PC)。
棱镜层154位于第二扩散层153背离量子点层152的一侧，其形状大小与第二扩散层153一致。棱镜层154的作用是将分散的光线集中在一定范围内射出，提高该范围内光线的亮度，从而提高显示面板正面的光线辉度。
在本申请实施例中，棱镜层154采用的材料为聚对苯二甲酸乙二醇酯(PET)。
增光层155位于棱镜层154背离第二扩散层153的一侧，其形状大小与棱镜层154一致。增光层155可以提高背光模组的亮度，提高光线的利用效率。
在本申请实施例中，增光层155采用的材料为聚对苯二甲酸乙二醇酯(PET)。
在本申请提供的实施例中，当发光二极管芯片为蓝光发光二极管芯片，第一介质层134采用的材料为二氧化硅，第二介质层135采用的材料为二氧化钛，并且二氧化硅层的折射率为1.47，二氧化钛层的折射率为2.52时，将蓝光波长带入，根据上述第一介质层1301或第二介质层1302的厚度d r的计算公式可以得出：第一介质层1301的厚度为63.02nm-73.02nm，第二介质层1302的厚度为34.68nm-44.68nm。
图7b为本申请实施例提供的光学复合层截面结构示意图之二。
参照图2和7b，当发光二极管芯片包括红光发光二极管芯片、绿光发光二极管芯片和蓝光发光二极管芯片时，光学复合层15包括：扩散层150、棱镜层154和增光层155。
扩散层150位于发光器件13背离电路板12的一侧，扩散层150的大小形状与显示装置中的电路板12的大小形状相适应，扩散层150起到对光线进行扩散的作用，并且扩散层150采用耐高温的材料进行制作，在高功率背光工作状态下，可以保证光学复合层15在受热状态保持板材自身的挺度，不易高温产生形变。
棱镜层154位于扩散层150背离发光器件13的一侧，其形状大小与扩散层150一致。扩散层150的作用是将分散的光线集中在一定范围内射出，提高该范围内光线的亮度，从而提高显示面板正面的光线辉度。
在本申请实施例中，棱镜层154采用的材料为聚对苯二甲酸乙二醇酯(PET)。
增光层155位于棱镜层154背离扩散层150的一侧，其形状大小与棱镜层154一致。增光层155可以提高背光模组的亮度，提高光线的利用效率。
在本申请实施例中，增光层155采用的材料为聚对苯二甲酸乙二醇酯(PET)。
在采用本申请实施例提供的背光模组结构之后，可以明显改善灯影问题，如图8所示，背光模组的出光面亮度均一，无灯影问题产生。
目前的直下式背光模组中，微型发光二极管作为背光源在液晶显示技术中已经成为了当前的热点，微型发光二极管采用的芯片的尺寸在微米级别，常见的为Mini LED(Mini Light Emitting Diode，简称Mini LED)，采用Mini LED作为背光源可以将背光模组的动态发光控制到更小的分区，有利于提高画面的对比度。
为了降低成本，需要减少Mini LED的使用数量，增大Mini LED之间的间距，在直下式背光模组中，在目前应用的具有倾角的背板设计产品中，由于背板的四周无法设置Mini LED，这就使得背光模组的四周区域明显发暗，背光效果不佳。
图9为本申请实施例提供的背光模组的截面结构示意图。
参照图9，背光模组包括：背板11-1、光源、第一反射片131-1、第二反射片132-1、扩散板14-1和光学膜片15-1。
在本申请某些实施例中，光源以发光二极管灯板12-1的形式提供。
背板11-1位于背光模组的底部，具有支撑和承载作用。在本申请实施例中，背板11-1包括平面部111-1和倾斜部112-1。
其中，背板11-1的平面部111-1位于底部，通常情况下为一方形或矩形结构，当应用于异形显示装置时，平面部111-1形状适应于显示装置的形状。
平面部111-1用于承载发光二极管灯板12-1及上方膜片的作用，倾斜部112-1位于平面部111-1的四周，倾斜部112-1沿着平面部111-1的边缘向背板的一侧进行弯折，倾斜部112-1与平面部111-1的夹角为30-60°，这样可以使出射光线限定到该角度内出射，在此角度范围内，显示装置具有用户喜爱的外观形态，通常情况下倾斜部112-1与平面部111-1的夹角可以设置为45°，在此不做限定。在本申请实施例中，平面部111-1和倾斜部112-1为一体结构。
背板11-1的材料通常可以采用电镀锌钢板(SECC)或热浸锌钢板(SGCC)等材料进行制作，厚度为0.8-1.0cm。
背板具有承载和支撑光学膜片等部件的边缘位置的作用，背板11-1还对发光二极管灯板12-1起到散热的作用。
在本申请实施例中，背光模组为直下式背光模组，采用发光二极管灯板12-1作为背光源，发光二极管灯板12-1位于背板11-1的平面部111-1之上。通常情况下，发光二极管灯板12-1整体可呈方形或矩形，当应用于异形显示装置时，其形状与尺寸大小适应于显示装置的形状和尺寸大小。
根据显示装置的尺寸可以设置多个发光二极管灯板12-1，发光二极管灯板12-1之间通过拼接方式共同提供背光。为了避免发光二极管灯板12-1拼接带来的光学问题，相邻发光二极管灯板12-1之间的拼缝尽量做到较小，甚至实现无缝拼接。
在本申请某些实施例中，发光二极管灯板12-1具体为Mini LED灯板。
发光二极管灯板12-1具体包括：基板121-1、线路层122-1、发光二极管芯片123-1、和封装支架124-1。其中发光二极管芯片123-1和封装支架124-1构成一发光器件。
基板121-1位于平面部111-1之上，基板121-1的形状与发光二极管灯板12-1的整体形状相同。在通常情况下，基板121-1为板状，整体呈长方形或正方形。
在本申请实施例中，基板121-1采用的材料可以为热导系数较高的玻璃，采用热导系 数较高的玻璃制作基板121-1，可以使显示装置在显示时发出的热量很快地散发出去，避免了温度过高引起的降低发光效率的问题，另外，玻璃基板表面光滑平整，有利于后期的加工制作。或者，基板121-1采用的材料可以为FR4或PET等材料进行制作，在此不做限定。
本申请实施例提供的线路层122-1经导电材料电镀沉积在基板121-1上，根据需要刻蚀线路形成，导电材料可以采用铜，在此不做限定。导电材料会刻蚀出断口，断口的两侧分别连接发光二极管芯片123-1的正极和负极。
上述的基板121-1和线路层122-1可以采用不同的材料，并且通过不同的制作工艺进行制作。基板121-1和线路层122-1可以构成印刷电路板(Printed Circuit Board，简称PCB)，也可以是阵列基板，在此不做限定。
发光二极管芯片123-1位于线路层122-1之上。线路层122-1制作完成后会在其表面形成用于焊接发光二极管芯片123-1的焊盘，发光二极管芯片123-1焊接于该焊盘上，从而通过控制线路层122-1的驱动信号驱动发光二极管芯片123-1发光。
在本申请某些实施例中，发光二极管芯片123-1采用的芯片的尺寸在微米级别，发光二极管芯片123-1为微型发光二极管芯片123-1，灯板12-1为微型发光二极管灯板12-1。
在某些实施例中，发光二极管芯片123-1为miniLED(Mini Light Emitting Diode)芯片，灯板12-1具体为miniLED灯板，但不限于此。
由于发光二极管芯片123-1的尺寸很小，因此有利于将背光模组的动态发光控制到更小的分区，有利于提高画面的对比度。在本申请实施例中，发光二极管芯片123-1的可以采用多种尺寸，例如发光二极管芯片123-1尺寸小于500μm。发光二极管芯片123-1可以根据实际应用进行相应尺寸的制作，在此不做限定。
发光二极管灯板12-1可以只包括一种颜色的发光二极管芯片123-1，也可以包括多种颜色的发光二极管芯片123-1，在此不做限定。
发光二极管芯片123-1可以采用POB和COB两种方式进行封装，采用POB封装方式对发光二极管芯片进行封装时，会在发光二极管芯片的外侧设置封装支架124-1，封装支架124-1用于封装保护发光二极管芯片123-1，阻隔异物进入到发光二极管芯片123-1内部。
在本申请实施例中，采用POB封装方式对发光二极管芯片进行封装时，其下表面会同时形成贴片电极，该贴片电极与发光二极管芯片的电极对应电连接，待封装后再将封装好的发光二极管芯片123-1贴片到线路层122-1的对应位置上。POB封装方式工艺成熟，适应性好。单个发光二极管芯片123-1和封装支架124-1构成一个发光器件。
在本申请某些实施例中，采用COB封装方式对发光二极管芯片进行封装，则先将发 光二极管芯片123-1焊接到线路层122-1对应的焊盘上，再在发光二极管芯片123-1表面采用点胶的方式对发光二极管芯片123-1进行封装，发光二极管芯片123-1表面的封装胶可以采用透明胶体材料，如透过性较佳的硅胶、改性硅胶或环氧树脂等。COB封装具有较高的效率且成本较低。单个发光二极管芯片123-1和其对应的封装胶构成一发光器件。
第一反射片131-1位于发光二极管灯板12-1背离背板11-1一侧的表面，具体设置在平面部111-1对应的位置，第一反射片131-1的形状大小与平面部111-1的形状大小一致，第一反射片131-1包括多个用于暴露发光二极管芯片123-1的开口。
在本申请实施例中，第一反射片131-1为漫反射层，第一反射片131-1可以将发光二极管芯片123-1向发光二极管灯板12-1一侧出射的光线，或者被扩散板14-1和光学膜片15-1反射回发光二极管灯板12-1的光线，重新向出光一侧反射，并且反射光线的反射路径随机，因此经过第一反射片131-1对光线的多次反射，对光线起到了匀化的作用，进而提高光源的利用效率。
第一反射片131-1采用混有反射粒子的胶体涂覆在基材的表面，第一反射片131-1的反射率大于或等于97％。
第二反射片132-1位于背板11-1的倾斜部112-1面向发光二极管灯板12-1的一侧，其形状大小与倾斜部112-1的形状大小相适应，在本申请实施例中，第二反射片132-1采用混有反射粒子的胶体涂覆在基材表面，在设置于倾斜部112-1上。
第二反射片132-1为漫反射层，具有对光进行反射的性质，由此位于边缘位置的发光二极管芯片123-1出射的大角度光线可以被第二反射片132-1反射回背光模组中被利用，或者被扩散板14-1和光学膜片15-1反射回倾斜部112-1的光线，可以被第二反射片132-1重新向出光一侧反射，并且反射光线的反射路径随机，因此经过第二反射片132-1对光线的多次反射，对光线起到了匀化的作用，进而提高光源的利用效率。
扩散板14-1位于发光二极管灯板12-1的出光侧，扩散板14-1与发光二极管灯板12-1之间存在一定的混光距离，扩散板14-1在背板11-1的正投影覆盖第一反射片131-1和第二反射片132-1在背板11-1上的正投影，即扩散板14-1位于整个背板11-1的正上方。通常情况下扩散板14-1可以设置为矩形或方形。
扩散板14-1的作用是对入射光线进行散射，使经过扩散板14-1的光线更加均匀。扩散板14-1中设置有散射粒子材料，光线入射到散射粒子材料会不断发生折射与反射，从而达到将光线打散的效果，实现匀光的作用。
扩散板14-1具有较高的雾度，均匀效果更加，通常可以采用挤出工艺加工，扩散板14-1所用材质一般选自聚甲基丙烯酸甲酯PMMA、聚碳酸酯PC、聚苯乙烯系材料PS、聚 丙烯PP中的至少一种。
扩散板14-1中还可以设置量子点材料，形成量子点扩散板，当发光二极管芯片123-1为蓝色发光二极管芯片时，量子点材料中包括红色量子点材料和绿色量子点材料，红色量子点材料在蓝色光的激发下出射红色光，绿色量子点材料在蓝色光的激发下出射绿色光，受激发射的红色光、绿色光以及透射的蓝色光混合成白光出射。
当采用量子点扩散板时，在制作背光模组的后续过程中，不再设置量子点膜，既降低了成本，又使显示装置更轻薄。
光学膜片15-1位于扩散板14-1背离第一反射片131-1和第二反射片132-1的一侧，光学膜片15-1整层设置，其形状与扩散板14-1的形状相同，通常情况下可以设置为矩形或方形。
光学膜片15-1的设置可以使背光模组适应多种多样的实际应用。
在本申请实施例中，发光二极管芯片123-1可以采用蓝光发光二极管芯片，光学膜片15-1包括量子点层或荧光层等色彩转换层。
量子点层中包括红色量子点材料和绿色量子点材料，红色量子点材料在蓝色光的激发下出射红色光，绿色量子点材料在蓝色光的激发下出射绿色光，受激发射的红色光、绿色光以及透射的蓝色光混合成白光出射。
荧光层中包括受激发射红色光和受激发射绿色光的荧光材料，受激发射的红色光、绿色光以及透射的蓝色光混合成白光出射。
除此之外，光学膜片15-1还可以包括棱镜片，棱镜片可以改变光线的出射角度，从而改变显示装置的可观看角度。
光学膜片15-1还可以包括反射式偏光片，反射式偏光片作为一种增亮片，可以提高背光模组的亮度，提高光线的利用效率，同时使出射光线具有偏振的性质，省略液晶显示面板下偏光片的使用。
光学膜片15-1不仅可以达到相应的功能，还具有雾化和遮盖效果。
相关技术中通常采用普通发光二极管作为光源时，发光二极管通常搭配折射透镜，当其光强分布接近于高斯分布曲线时，其主观视觉效果较佳。而采用本申请的发光器件作为光源时，由于发光二极管芯片123-1尺寸较小，封装时不会设置透镜，因此发光器件出射的光线无法依靠折射透镜扩大光线的出光角度，导致发光器件的光线出射角度较小，那么位于边缘的发光器件无法将光线入射到背板的边缘位置，导致背光模组四周发暗的问题。
有鉴于此，如图9所示，在本申请实施例提供的显示装置中，扩散板14-1在面向发光二极管灯板12-1一侧的表面上设置有反射网点M，反射网点M具有对光进行反射的性质， 在本申请实施例中，反射网点M具有反射、漫反射和/或散射的作用，当发光器件出射的光线入射到反光网点M上时，绝大数光线被反光网点M反射回第一反射片131-1或第二反射片132-1一侧，且反射角度随机变化，光线再次被第一反射片131-1或第二反射片132-1的漫反射，由此，光线在反射网点M与第一反射片131-1、第二反射片132-1之间不断反射，最终在反光网点M之间的间隔位置出射，光线经过多次扩散板14-1与第一反射片131-1、第二反射片132-1之间的匀化作用之后出光面亮度均匀，避免了背光模组四周区域发暗的现象，提高了显示装置的显示效果。
在具体实施时，反光网点M采用的材料可以为白色油墨，通过丝印的方式印刷于扩散板14-1的表面。反光网点M具有对入射光进行反射，且不透光的性质，因此反光网点M尺寸越大，反射效果越好，透过反光网点M的光线越少，因此可以根据发光面亮暗程度调整反光网点M的尺寸大小，使发光面更均匀，提高显示装置的显示效果。
在本申请实施例中，反射网点M的尺寸大小范围为0.4mm-1.5mm。
本申请实施例提供的背光模组的背板具有倾斜部112-1，且倾斜部112-1与平面部111-1之间具有设定夹角，因背光模组在倾斜部112-1的位置无法设置发光器件，而发光器件的出射角度有限，使得光线出射到背光模组四周边缘位置的光线较少，导致四周发暗的问题。
有鉴于此，本申请实施例提供的扩散板14-1在边缘区域内设置的反射网点M的分布密度小于扩散板14-1在中间区域内设置的反射网点M的分布密度，通过在扩散板边缘区域内设置较少的反射网点，在扩散板的中间区域内设置较多反射网点，当光线入射到扩散板中间区域时，大部分的光线被反射回第一反射片、第二反射片一侧，只有少部分光可以通过反射网点的间隙出射到扩散板中，从而使得大部分光线可以在中线区域内的反射网点与第一反射片、第二反射片之间不断反射振荡，使得一部分光线能够被反射振荡到扩散板的边缘区域内，而扩散板的边缘区域设置的反射网点密度较小，相对较多的光线可以通过反射网点的间隔入射到扩散板内，从而使得边缘区域出射光相对于中间区域的出射光更多。由此，光线经过多次在扩散板与第一反射片、第二反射片之间的匀化作用之后，出光面亮度均匀，由此平衡了扩散板的边缘区域与中心区域出射画面的明亮差，避免了背光模组四周区域发暗的现象，提高了显示装置的显示效果。
在具体实施时，本申请实施例提供的扩散板14-1在第一反射片131-1对应的区域E内的第一反射网点M1的分布密度大于扩散板14-1在第二反射片132-1对应的区域F内的第二反射网点M2的分布密度。其中，第一反射片131-1所在区域对应于背板的平面部111-1，第二反射片132-1所在区域对应背板的倾斜部112-1。扩散板14-1对应于第一反射片131-1的区域E内设置的反射网点为第一反射网点M1，扩散板14-1对应于第二反射片132-1的 区域F内设置的反射网点为第二反射网点M2。
图10为本申请实时提供的背光模组的局部光线路程示意图；
参照图10，发光器件出射的光线在入射到反射网点M时，绝大多数的光线被反射，光线只有入射到反射网点之间的间隙时才可以入射到扩散板14-1内，被反射网点反射的光线返回第一反射片131-1和第二反射片132-1一侧，经过第一反射片131-1和第二反射片132-1的漫反射作用，使得漫反射光的反射角度随机变化，再次向扩散板14-1出射；入射到扩散板14-1的光线又会重复上述入射到反射网点和反射网点的间隙的过程。经过扩散板14-1和第一反射片131-1和第二反射片132-1对光线不断反射的作用之后，最终由扩散板14-1出射的光线相对均匀。
在本申请实施例中，为了达到上述效果，将扩散板在区域E内的第一反射网点M1的分布密度设置得大于在区域F内的第二反射网点M2的分布密度，这样可以使得区域E中第一反射网点M1之间的间隙小于区域F中第二反射网点M2之间的间隙。当光线入射到扩散板的区域E内时，由于扩散板14-1上设置的第一反射网点M1密度较大，大部分的光线被反射回第一反射片131-1、第二反射片132-1一侧，只有少部分光可以出射到扩散板14-1中，从而使得大部分光线可以在第一反射网点M1与第一反射片131-1、第二反射片132-1之间不断反射振荡，使得一部分光线能够被反射振荡到区域F内，而区域F内的扩散板14-1上设置的第二反射网点M2密度较小，相对较多的光线可以经过第二反射网点M2的间隙入射到扩散板14-1内，仍然会有一部分光线入射到第二反射网点M2上，被第二反射网点M2反射回第一反射片131-1和第二反射片132-1一侧。由此，光线经过多次在扩散板14-1与第一反射片131-1、第二反射片132-1之间的匀化作用之后出光面亮度均匀，由此平衡了区域E和区域F内出射画面的明亮差，避免了背光模组四周区域(区域F)发暗的现象，提高了显示装置的显示效果。
具体地，本申请实施例提供的扩散板14-1在第一反射片131-1对应的区域E内的第一反射网点M1的尺寸大于扩散板14-1在第二反射片132-1对应的区域F内的第二反射网点M2的尺寸，这样可以使第一反射网点M1之间的间隙更小，使第二反射网点M2之间的间隙更大，从而可以使入射到区域F的光线的透射率大于入射到区域E的光线的透射率，再配合反射网点与第一反射片131-1和第二反射片132-1的反射匀化作用，可以避免背光模组四周发暗的现象，提高了显示装置的显示效果。
在本申请实施例中，扩散板14-1在第一反射片131-1对应的区域E内的各反射网点M1的尺寸可以相同，这样可以降低反射网点M1的制作难度，从而简化了显示装置的制作工艺。
在实际应用过程中，可以采用丝印的方式在扩散板14-1的表面形成反射网点，图11为实际应用中四分之一的扩散板的局部效果图，如图11所示，扩散板在中心区域(即区域E)内丝印的反射网点的密度大于扩散板在边缘区域(即区域F)内丝印的反射网点的密度。
考虑到目前的工艺难度以及最终的匀化效果，反射网点的尺寸一般设置在0.4mm-1.5mm，其中，第一反射网点M1的尺寸可以为0.9mm，第二反射网点M2的尺寸可以为0.4mm。
目前为了降低成本，还需要减少Mini LED的使用数量，使得Mini LED之间的间距增大，而发光器件的光线出射角度较小，在增大Mini LED的间距之后出光面会呈现如图12a和图12b所示的现象，即在发光器件正上方出光位置较亮，而在相邻的发光器件的交界位置较暗，Mini LED中间的交界位置P-1明显发暗，导致亮度不均的问题。
有鉴于此，如图13所示，本申请实施例在一个发光器件的出射光在扩散板14-1的照射范围内，靠近中心位置处的反射网点M的分布密度大于远离中心位置处的反射网点M的分布密度。
发光器件出射光线主要集中在较小的角度内，本申请实施例通过在扩散板14-1对应的发光器件发光中心对应的位置设置更多的反射网点，在发光器件出射的大角度光线对应的区域设置较少的反射网点，从而可以使发光器件出射的小角度光线更多地被反射回第一反射片131-1一侧，而使发光器件出射的大角度光线更多地透射到扩散板14-1中，起到平衡光线透射率的作用。与此同时，被反射网点反射的光线会再次被第一反射片131-1漫反射，经过反射网点和第一反射片131-1之间的多次反射振荡，使得最终出射的光线更加均匀，平衡了发光器件的发光中心和边缘位置处的明暗差异，提高了显示装置的显示效果。
具体地，在本申请实施例中，一个发光器件的出射光在扩散板14-1的照射范围内，靠近中心位置的反射网点M的尺寸大于远离中心位置的反射网点M的尺寸，由此可以使靠近中心位置的反射网点之间的间隙更小，远离中间位置的反射网点之间的间隙更大，从而可以发光器件出射的大角度光线的透射率相对较大，再配合反射网点与第一反射片131-1的反射匀化作用，可以避免发光器件的出光中间位置较亮，边缘较暗的问题，提高了显示装置的显示效果。
随着LED背光技术的不断发展成熟以及市场的迅速扩大，越来越多的产品形态层出不穷，其中Mini LED背光越来越引人注目，Mini LED是将LED微缩化，对而可以在单位面积内设置更多数量的Mini LED，随着Mini LED使用数量的提升，Mini LED灯板的成本升高。
其中，印刷电路板(Printed Circuit Board，简称PCB)作为Mini LED灯板的驱动板， 在整个灯板中的成本占比较大，虽然使用单面板相比于双面板成本有所下降，但是单面板只能在边缘位置绑定电源插线，从而使得连接电源的柔性扁平电缆(Flexible Flat Cable，简称FFC)的长度增大，布线更加复杂，也不利于降低成本。
背光模组中设置有灯板，作为背光光源为显示面板提供背光。灯板通常由电路板和位于电路板之上的光源构成，电路板在灯板中的成本占比较大。电路板目前可以分为单面板和双面板，其中，单面板是指只在基板的一侧形成电路，而双面板是指在基板的两侧均形成电路。双面板有利于在电路板的背面直接设置引脚与电源板进行连接，从而可以避免对电路板进行打孔。但是双面板的成本要比单面板高出一倍，为了降低成本如果采用单面板则需要在电路板的侧面设置连接引脚，再采用FFC连接电源板，然而电源板通常会设置于背光模组靠近中心的位置，当在电路板的侧面绑定FFC，无疑会使FFC的长度增大，布线更加复杂，也不利于降低成本。
有鉴于此，本申请实施例提供一种显示装置，可以有效降低电路板的成本，同时提高背光模组的可加工效率。
图14为本申请实施例提供的背光模组的平面结构示意图。
参照图14，本申请实施例提供的背光模组包括：背板11-2和位于背板之上的灯板12-2。
背板11-2，位于背光模组的底部，具有支撑和承载作用。背板11-2通常情况下为一矩形结构，当应用于异形显示装置时，其形状适应于显示装置的形状。背板11-2包括天侧、地侧、左侧和右侧。其中天侧和地侧相对，左侧和右侧相对，天侧分别与左侧的一端和右侧的一侧相连，地侧分别与左侧的另一端和右侧的另一端相连。
背板11-2的材质采用铝、铁、铝合金或铁合金等。背板11-2用于支撑灯板12-2，以及支撑固定扩散板、光学膜片等部件的边缘位置，背板11-2还对灯板12-2起到散热的作用。
灯板12-2，位于背板11-2之上，作为背光源。灯板12-2整体形状可以与背板11-2的形状相同，且灯板12-2的整体尺寸可以稍小于背板11-2的尺寸，灯板12-2通常下可以设置为方形或矩形，长度在200mm-800mm，宽度在100mm-500mm。
根据显示装置的尺寸可以设置多个灯板12-2，灯板12-2之间通过拼接方式共同提供背光。为了避免灯板12-2拼接带来的光学问题，相邻的灯板12-2之间的拼缝尽量做到较小，甚至实现无缝拼接。
本申请实施例提供的背光模组为直下式背光模组，灯板12-2上包括多个呈阵列排布的光源，用于形成均匀的面光源，为显示面板200提供背光。
如图14所示，灯板12-2可以包括电路板121-2和位于电路板121-2之上的发光二极 管芯片122-2。
电路板121-2位于背板11-2之上，电路板121-2的形状与灯板12-2的整体形状相同。在通常情况下，电路板121-2为板状，整体呈长方形或正方形。电路板121-2的长度在200mm-800mm，宽度在100mm-500mm。
在本申请实施例中，电路板121-2可以是印刷电路板(Printed Circuit Board，简称PCB)，PCB包括电子线路和绝缘层，绝缘层将电子线路中焊接发光二极管芯片122-2的焊盘裸露在外而将其余部分覆盖。
或者，电路板121-2也可以是在衬底基板上制作薄膜晶体管驱动电路形成的阵列基板，阵列基板的表面具有连接至薄膜晶体管驱动电路的连接电极，用于焊接发光二极管芯片122-2。
以上电路板121-2的衬底或衬底基板可以采用柔性材料来制作以形成柔性显示装置。
本申请实施例中，电路板121-2为单面板，仅在基板背离背板11-2的一侧设置电路。
电路板121-2用于为发光二极管芯片122-2提供驱动电信号。发光二极管芯片122-2与电路板121-2分别单独制作，电路板121-2的表面包括多个用于焊接发光二极管芯片122-2的焊盘，发光二极管芯片122-2在制作完成后转移至焊盘上方，通过回流焊等工艺将发光二极管芯片122-2焊接在电路板121-2上，从而可以通过控制电路板121-2的输入信号，驱动发光二极管芯片122-2发光。
发光二极管芯片122-2位于电路板121-2上。发光二极管芯片122-2的电极焊接在电路板121-2所暴露的焊盘上，实现两者之间的电连接。
在本申请某些实施例中，发光二极管芯片122-2作为背光源，不同于普通的发光二极管芯片。发光二极管芯片122-2采用的芯片的尺寸在微米级别，由于发光二极管芯片122-2的尺寸很小，有利于对显示装置进行更精细的控制，提高画面的对比度。
在本申请一些实施例中，发光二极管芯片122-2的尺寸在500μm以下。
在某些实施例中，发光二极管芯片为miniLED(Mini Light Emitting Diode)芯片。
在本申请某些实施例中，发光二极管芯片122-1采用的芯片的尺寸在微米级别，发光二极管芯片为微型发光二极管芯片。
在本申请实施例中，发光二极管芯片122-2可以根据实际应用进行相应尺寸的制作，在此不做限定。
灯板12-2可以只包括一种颜色的发光二极管芯片122-2，也可以包括多种颜色的发光二极管芯片122-2，在此不做限定。
如图14所示，在本申请实施例提供的背光模组中，电路板121-2在靠近中心的位置设 置有一个开孔k1，该开孔k1的位置用于设置沉板连接器。
图15为本申请实施例提供的背光模组的截面结构示意图之一。
参照图15，电路板121-2在开孔k1的边缘在背离背板11-2的一侧设置有多个焊盘e。多个焊盘e可以与电路板121-2的线路同时形成。
通常情况下，电路板121-2的开孔k1可以设置为矩形，多个焊盘e可以设置在矩形开孔的一个侧边。且多个焊盘e之间具有设定间距，以避免焊盘e之间相互短路。
沉板连接器13-2，设置于电路板121-2的开孔k1内。如图15所示，背板11-2在对应电路板的开孔k1位置处设置有开口k2，背板上的开口k2的尺寸通常大于电路板121-2的开孔k1的尺寸。沉板连接器13-2贯穿电路板的开孔k1和背板的开口k2。且沉板连接器13-2在背离背板11-2的一侧表面略超出于电路板121-2的表面，在背离电路板121-2一侧的表面凸出于背板11-2的表面。
图16为本申请实施例提供的沉板连接器的斜视图。
参照图15和图16，沉板连接器包括：插线口c、多个第一引脚p1、多个第二引脚p2和两个固定引脚p3。
如图15所示，多个第一引脚p1，位于沉板连接器13-2在开孔k1背离背板11-2的一侧。第一引脚p1位于电路板121-2背离背板11-2的一侧，且第一引脚p1与电路板121-2的开孔k1处的焊盘一一对应。第一引脚p1与焊盘e一一对应搭接，由此可以实现电路板121-2与沉板连接器13-2之间的电连接。
图17为本申请实施例提供的沉板连接器的俯视结构示意图。
参照图17，多个第一引脚p1并排排列，且相邻的第一引脚p1之间存在一定的间隙。在本申请实施例中，第一引脚p1沿着排列方向的宽度为0.25mm-0.6mm，相邻的第一引脚p1之间的间距为0.5mm-1.0mm，由此可以适配不同电压、不同电流规格需求。当电路板121-2需要的电压越大和/或电流越大时，则需要更大宽度的第一引脚p1，相应地，第一引脚p1之间的间距也需要增大。当电路板121-2需要的电压越小和/或电流越小时，则可以缩小第一引脚p1的宽度，相应地，可以缩小第一引脚p1之间的距离，从而可以缩小沉板连接器13-2的尺寸。例如，根据不同的规格，第一引脚p1的宽度可以设置为0.25mm、0.45mm或0.6mm；相应地，第一引脚p1之间的间距可以设置为0.5mm、0.7mm或1.0mm。
图18为本申请实施例提供的背光模组在沉板连接器处的立体图。
参照图15和图18，插线口c，位于沉板连接器13-2在开孔k1面向背板11-2的一侧，且插线口c凸出于背板11-2背离电路板121-2一侧的表面，由此可以在背板11-2的背面将插线口c露出，有利于将FFC沿着图18中箭头的方向插入到插线口c中。
如图15和图18所示，插线口c内设置有多个第二引脚p2，各第二引脚p2与各第一引脚p1一一对应，且沉板连接器13-2中设置有相应的线路将第二引脚p2与对应的第一引脚p1对应电连接。那么当插线口c处插入FFC之后，FFC的线路与第二引脚p2电连接，而第二引脚p2又与第一引脚p1电连接，如果将FFC与电源驱动板连接，则可以实现电源驱动板与电路板121-2之间的电路连接。
图19为本申请实施例提供的沉板连接器的仰视结构示意图。
参照图17-图19，两个固定引脚p3分别位于第一引脚p1的两侧；相应地，电路板121-2在开孔k1的焊盘e的两侧设置与固定引脚p3一一对应的固定焊盘，在连接第一引脚p1与焊盘时，还可以一并将固定引脚p3与固定焊盘连接，由此，可以利用固定引脚p3和固定焊盘之间的连接加强沉板连接器13-2与电路板121-2之间的连接关系，避免在外力作用下第一引脚p1与焊盘e断开从而影响电路连接关系。
在具体实施时，第一引脚p1与焊盘之间，以及固定引脚p2与固定焊盘之间均可以采用焊接的方式进行连接。
具体地，可以在电路板121-2的焊盘上涂锡膏，再将沉板连接器13-2放置于开孔k1内，使沉板连接器13-2的第一引脚p1与电路板121-2的焊盘e相互对应，使沉板连接器13-2的固定引脚之与电路板121-2的固定焊盘相互对应，再采用回流焊工艺使涂覆在焊盘表面的锡膏融化，待冷却之后可以将沉板连接器13-2相应的引脚与电路板121-2进行焊盘。
由于电路板121-2在开孔k1的侧壁上暴露出线路，如果涂覆的锡膏过量，在进行焊接时第一引脚p1与焊盘e之间的锡膏溢出到电路板121-2开孔处的板边，与电路板121-2侧壁上的线路之间存在电连接，很有可能会造成电路板121-2短路等问题。
有鉴于此，本申请实施例对第一引脚p1的结构进行改进，从而避免锡膏溢出造成的电路板短路的问题。
图20为本申请实施例提供的沉板连接器的侧视结构示意图。
参照图20，第一引脚p1包括相互连接的弧形部b和平面部a；其中，弧形部b的一端连接沉板连接器13-2，另一端连接平面部a，弧形部b向连接沉板连接器13-2的一侧弯曲。平面部a与电路板121-2的表面平行，平面部a与电路板表面的对应的焊盘搭接。
本申请实施例将第一引脚p1靠近沉板连接器的一端设置为弧面，由此可以使弧形部b与电路板121-2之间形成一定的间隙，如果锡膏过量，那么融化的锡膏可以流动到该间隙位置，而不会被挤出溢到开孔位于的板边处，由此可以避免锡膏溢出造成的电路板短路的问题。
在本申请实施例中，弧形部b向沉板连接器的侧壁的方向弯曲，这样可以使弧形部b 与平面部a之间平滑连接，不产生尖锐的连接点，从而避在外力作用下断开。
考虑到弧形部b越陡峭会使得沉板连接器13-2凸出于电路板121-2的表面越高，为了避免沉板连接器13-2设置得过高而影响发光二极管芯片光线的正常出射，本申请实施例将弧形部b连接沉板连接器13-2的一端与连接平面部a的一端之间的垂直距离w1设置为小于或等于1.5mm，由此可以避免由于弯曲设置而导致第一引脚p1过高。
另外，如图20所示，电路板121-2的开孔k1的边缘超出平面部a与弧面部b的交界线，由此可以使电路板121-2的开孔k1的侧壁距离平面部a较远，那么即使有锡膏溢出也会存储在弧形部b与电路板121-2之间的间隙位置，而不会流到电路板的侧边上。
在本申请实施例中，考虑到实际应用可以将开孔k1的边缘与平面部a连接弧形部b一端的垂直距离w2设置为大于或等于0.6mm，由此可以预留出存储溢出锡膏的空间，避免锡膏溢出造成的电路板短路的问题。
本申请一些实施例中，如图20所示，沉板连接器13-2的侧壁在连接插线口的位置设置为斜面x，该斜面x为方便FFC插入的导流槽，FFC可以导流槽为基准顺势插入，避免垂直方向盲插入无法一次性插入造成FFC折伤的问题，还可以提升插线效率。
在具体实施时，可以使斜面s与插线口所在侧壁的夹角为45°，在此不做限定。
图21为本申请实施例提供的背光模组的截面结构示意图之二。
参照图21，背光模组还包括：反射层14-2、扩散层15-2和光学膜层16-2。
反射层14-2，位于电路板121-2靠近发光二极管芯片122-2的一侧，反射层14-2包括多个用于暴露发光二极管芯片122-2的开口，反射层122覆盖沉板连接器13-2设置。
反射层14-2可以设置为反射片，通常可以采用透明基板涂覆反射粒子材料制作。
反射层14-2具有对光进行反射的性质，因此发光二极管芯片122-2出射的光线被背光模组中的元件反射回背板一侧时，可以被反射层14-2重新向出光一侧反射，由此提高光源的利用效率。
反射层14-2覆盖沉板连接器13-2设置，可以使电路板的表面在设置沉板连接器的位置和未设置沉板连接器的位置的反射率保持一致，从而避免沉板连接器无法反光而形成暗影。
扩散层15-2位于灯板12-2的出光侧。扩散层15-2整层设置于灯板12-2的出光侧，且扩散层15-2的形状与灯板12-2的形状相同。通常情况下扩散层15-2可以设置为矩形或方形。
扩散层15-2的作用是对入射光线进行散射，使经过扩散层15-2的光线更加均匀。扩散层15-2中设置有散射粒子材料，光线入射到散射粒子材料会不断发生折射与反射，从而 达到将光线打散的效果，实现匀光的作用。
扩散层15-2可以采用扩散板或扩散片两种形式。如果应用于电视等大型显示装置中，可以采用扩散板；而应用于手机、智能手环等小型显示装置时，可以采用扩散片。
扩散板的厚度相对于扩散片来说更大，扩散板的厚度为1.5mm-3mm。扩散板的雾度更大，均匀效果更加，通常可以采用挤出工艺加工，扩散板所用材质一般选自聚甲基丙烯酸甲酯PMMA、聚碳酸酯PC、聚苯乙烯系材料PS、聚丙烯PP中的至少一种。
扩散片的厚度为0.3mm以下，相对较薄，更加适用于小型和轻型显示装置中。扩散片通常在基材上涂布扩散粒子，基材可以采用聚对苯二甲酸乙二醇酯PET或玻璃等，散射粒子可以采用二氧化钛、氧化锌、氧化钙等。
光学膜层16-2位于扩散板15-2背离灯板12-2的一侧，光学膜层16-2整层设置，其形状与扩散层15-2的整体形状相同，通常情况下可以设置为矩形或方形。
光学膜层16-2的设置可以使背光模组适应多种多样的实际应用。
在本申请实施例中，发光二极管芯片122-2可以采用蓝光器件，光学膜层16-2具体包括量子点层或荧光层。
量子点层中包括红色量子点材料和绿色量子点材料，红色量子点材料在蓝色光的激发下出射红色光，绿色量子点材料在蓝色光的激发下出射绿色光，受激发射的红色光、绿色光以及透射的蓝色光混合成白光出射。
荧光层中包括受激发射红色光和受激发射绿色光的荧光材料，受激发射的红色光、绿色光以及透射的蓝色光混合成白光出射。
除此之外，光学膜层16-2还可以包括棱镜片，棱镜片可以改变光线的出射角度，从而改变显示装置的可观看角度。
光学膜层16-2还可以包括反射式偏光片，反射式偏光片作为一种增亮片，可以提高背光模组的亮度，提高光线的利用效率，同时使出射光线具有偏振的性质，省略液晶显示面板下偏光片的使用。
光学膜层16-2可以设置为集成的光学膜片，由此简化背光模组的安装。
根据第一发明构思，第一反射层和第二反射层具有对光进行反射的性质，P-N结出射的光线在第一反射层和第二反射层之间不断反射，最终由发光二极管芯片的侧面出射，从而扩大了光线的出射角度，提升相邻两个发光器件的混光效果，因此不需要太大的混光距离就可以得到均匀的光线，避免了由于混光距离的减小出现的明显的灯影现象，提高了显示装置的显示效果。
根据第二发明构思，在发光二极管芯片的上侧和下侧分设置第一反射层和第二反射层 后，发光二极管芯片的光线的出射角度可提高到165°，扩大了光线的出射角度，从而提升了相邻两个发光器件的混光效果，因此不需要太大的混光距离就可以得到均匀的光线，避免了由于混光距离的减小出现的明显的灯影现象，提高了显示装置的显示效果。
根据第三发明构思，第一反射层和第二反射层均由两种不同折射率的第一介质层和第二介质层交替堆叠形成，第一介质层和第二介质层的光学厚度为中心反射波长的1/4，因此是一种四分之一波长多层系统，相当于简单的一组光子晶体。由于频率落在能隙范围内的电磁波无法穿透，第一反射层和第二反射层的反射率均大于或等于99％。
根据第四发明构思，第一介质层采用的材料为二氧化硅，采用二氧化硅制作的第一介质层不容易分解和吸收，散射性较好。第二介质层采用的材料为二氧化钛，采用二氧化钛制作的第二介质层硬度较高，可以提高发光器件的综合性能。
根据第五发明构思，第一反射层和第二反射层包括7层第一介质层和7层第二介质层时，膜层厚度不会太厚，并且第一反射层和第二反射层的反射率可以达到99.6％，满足使用需求。
根据第六发明构思，当发光二极管芯片为蓝光发光二极管芯片时，光学复合层包括：第一扩散层、量子点层、第二扩散层、棱镜层和增光层。第一扩散层起到对光线进行扩散的作用；量子点层主要材料为被薄膜包裹合成的红色量子点和绿色量子点，重新包裹合成的红色量子点和绿色量子点可以有效隔绝水和氧气，保证量子点的稳定性。蓝光发光二极管芯片发出的蓝光在通过第一扩散层的光扩散作用形成较为均匀的蓝光面，量子点层中的红色量子点材料在蓝色光的激发下出射红色光，绿色量子点材料在蓝色光的激发下出射绿色光，受激发射的红色光、绿色光以及透射的蓝色光混合成白光出射；第二扩散层起到对光线进行扩散的作用，并且第一扩散层和第二扩散层采用耐高温的材料进行制作，在高功率背光工作状态下，可以保证光学复合层在受热状态保持板材自身的挺度，不易高温产生形变。棱镜层将分散的光线集中在一定范围内射出，提高该范围内光线的亮度，从而提高显示面板正面的光线辉度；增光层可以提高背光模组的亮度，提高光线的利用效率。
根据第七发明构思，当发光二极管芯片为蓝光发光二极管芯片，第一介质层采用的材料为二氧化硅，第二介质层采用的材料为二氧化钛，并且二氧化硅层的折射率为1.47，二氧化钛层的折射率为2.52时，将蓝光波长带入，根据上述第一介质层或第二介质层的厚度dr的计算公式可以得出：第一介质层的厚度为63.02nm-73.02nm，第二介质层的厚度为34.68nm-44.68nm。
根据第八发明构思，当发光二极管芯片包括红光色发光二极管芯片、绿光发光二极管芯片和蓝光发光二极管芯片时，光学复合层包括：扩散层、棱镜层和增光层，扩散层起到 对光线进行扩散的作用，并且扩散层采用耐高温的材料进行制作，在高功率背光工作状态下，可以保证光学复合层在受热状态保持板材自身的挺度，不易高温产生形变；棱镜层将分散的光线集中在一定范围内射出，提高该范围内光线的亮度，从而提高显示面板正面的光线辉度；增光层可以提高背光模组的亮度，提高光线的利用效率。
尽管已描述了本申请的优选实施例，但本领域内的技术人员一旦得知了基本创造性概念，则可对这些实施例作出另外的变更和修改。所以，所附权利要求意欲解释为包括优选实施例以及落入本申请范围的所有变更和修改。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (12)

  1. 一种显示装置，其特征在于，包括：
    显示面板，用于图像显示；
    背光模组，位于所述显示面板的入光侧，用于提供背光；
    所述背光模组包括：
    背板，具有支撑和承载作用；
    电路板，位于所述背板的一侧，用于提供驱动信号；
    发光器件，位于所述电路板的一侧，
    所述发光器件包括：
    发光二极管芯片，作为背光源；
    第一反射层，位于所述发光二极管芯片靠近所述电路板一侧的表面；
    第二反射层，位于所述发光二极管芯片背离所述电路板一侧的表面；
    所述发光二极管芯片出射的光线在所述第一反射层与所述第二反射层之间反射，由所述发光二极管芯片的侧面出射。
  2. 如权利要求1所述的显示装置，其特征在于，所述第一反射层和所述第二反射层为布拉格反射片；
    所述第一反射层和所述第二反射层均包括多层交替堆叠的第一介质层和第二介质层。
  3. 如权利要求2所述的显示装置，其特征在于，所述第一反射层和所述第二反射层的反射率大于或等于99％。
  4. 如权利要求2所述的显示装置，其特征在于，所述第一介质层采用的材料为二氧化硅，所述第二介质层采用的材料为二氧化钛。
  5. 如权利要求4所述的显示装置，其特征在于，所述第一反射层包括7层所述第一介质层和7层所述第二介质层；
    所述第二反射层包括7层所述第一介质层和7层所述第二介质层。
  6. 如权利要求1-5任一项所述的显示装置，其特征在于，所述发光二极管芯片为蓝光发光二极管芯片；
    所述背光模组还包括光学复合层，所述光学复合层包括：
    第一扩散层，位于所述发光器件背离所述电路板的一侧；
    量子点层，位于所述第一扩散层背离所述发光器件的一侧；
    第二扩散层，位于所述量子点层背离所述第一扩散层的一侧；
    棱镜层，位于所述第二扩散层背离所述量子点层的一侧；
    增光层，位于所述棱镜层背离所述第二扩散层的一侧。
  7. 如权利要求6所述的显示装置，其特征在于，所述第一介质层的厚度为63.02nm-73.02nm；所述第二介质层的厚度为34.68nm-44.68nm。
  8. 如权利要求1-5任一项所述的显示装置，其特征在于，所述发光二极管芯片包括：红光发光二极管芯片、绿光发光二极管芯片和蓝光发光二极管芯片；
    所述背光模组还包括光学复合层，所述光学复合层包括：
    扩散层，位于所述发光器件背离所述电路板的一侧；
    棱镜层，位于所述扩散层背离所述发光器件的一侧；
    增光层，位于所述棱镜层背离所述第一扩散层的一侧。
  9. 一种显示装置，其特征在于，包括：
    显示面板，用于图像显示；
    背光模组，位于所述显示面板的入光侧，用于提供背光；
    所述背光模组包括：
    光源，作为背光源；
    扩散板，位于所述光源的出光侧；所述扩散板面向所述光源的一侧设置有反射网点。
  10. 如权利要求9所述的显示装置，其特征在于，所述扩散板的边缘区域内的反射网点的分布密度小于中间区域内的反射网点的分布密度，和/或所述扩散板的边缘区域内的反射网点的尺寸小于中间区域内的反射网点的尺寸。
  11. 如权利要求9所述的显示装置，其特征在于，所述背光模组还包括：
    背板，具有支撑和承载作用；所述背板包括平面部和倾斜部，所述倾斜部向着所述平面部的一侧倾斜设定角度；
    发光二极管灯板，位于所述背板的所述平面部之上；所述发光二极管灯板包括多个发光器件；
    第一反射片，位于所述发光二极管灯板背离所述背板的一侧；所述第一反射片包括多个用于暴露所述发光器件的开口；
    第二反射片，位于所述背板的倾斜部面向所述发光二极管灯板的一侧。
  12. 如权利要求11所述的显示装置，其特征在于，所述扩散板在所述第一反射片对应的区域内的所述反射网点的分布密度大于所述扩散板在所述第二反射片对应的区域内的所述反射网点的分布密度或所述扩散板在所述第一反射片对应的区域内的所述反射网点的尺寸大于所述扩散板在所述第二反射片对应的区域内的所述反射网点的尺寸。
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