WO2022188449A1 - 一种线缆组件和线缆组件的制备方法 - Google Patents

一种线缆组件和线缆组件的制备方法 Download PDF

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Publication number
WO2022188449A1
WO2022188449A1 PCT/CN2021/129457 CN2021129457W WO2022188449A1 WO 2022188449 A1 WO2022188449 A1 WO 2022188449A1 CN 2021129457 W CN2021129457 W CN 2021129457W WO 2022188449 A1 WO2022188449 A1 WO 2022188449A1
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Prior art keywords
shielding layer
cable
free end
cable core
layer
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PCT/CN2021/129457
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English (en)
French (fr)
Inventor
王超
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长春捷翼汽车零部件有限公司
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Filing date
Publication date
Application filed by 长春捷翼汽车零部件有限公司 filed Critical 长春捷翼汽车零部件有限公司
Priority to US18/281,420 priority Critical patent/US20240170940A1/en
Priority to JP2023554865A priority patent/JP2024509248A/ja
Priority to EP21929912.0A priority patent/EP4307320A1/en
Priority to MX2023010753A priority patent/MX2023010753A/es
Publication of WO2022188449A1 publication Critical patent/WO2022188449A1/zh

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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00Cable fittings
    • H02G15/08Cable junctions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02Soldered or welded connections
    • H01R4/021Soldered or welded connections between two or more cables or wires
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/17Protection against damage caused by external factors, e.g. sheaths or armouring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/28Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • H01R9/0503Connection between two cable ends
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G1/00Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
    • H02G1/14Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for joining or terminating cables
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02GINSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G15/00Cable fittings
    • H02G15/08Cable junctions
    • H02G15/10Cable junctions protected by boxes, e.g. by distribution, connection or junction boxes

Definitions

  • the present invention relates to the technical field of cables, and in particular, to a cable assembly and a preparation method of the cable assembly.
  • the cable used to connect the battery and the electrical device is not a complete cable, but is formed by connecting multiple cables in sequence.
  • the cable generally includes a cable core and a shielding net wrapped on the outside of the cable core; the main function of the cable core is to realize the transmission of power; the main function of the shielding net is to provide a good shielding effect for the cable to prevent The current in the cable core produces electromagnetic interference to the external electrical components.
  • the invention provides a cable assembly and a preparation method of the cable assembly which can effectively improve the electromagnetic shielding effect between cables.
  • the present invention provides a cable assembly including: a first cable and a second cable.
  • the first cable includes a first cable core and a first shielding layer, the periphery of the first cable core is covered with a first protective layer, and the first shielding layer is arranged outside the first protective layer.
  • the second cable includes a second cable core and a second shielding layer, the periphery of the second cable core is covered with a second protective layer, and the second shielding layer is arranged outside the second protective layer.
  • the free end of the first cable core is connected with the free end of the second cable core to realize the electrical connection between the first cable core and the second cable core.
  • the free end of the first shielding layer is connected to the free end of the second shielding layer, thereby realizing the electrical connection between the shielding layers of the first cable and the second cable, ensuring the continuity of the electromagnetic shielding structure of the cable assembly, and effectively Improve the electromagnetic shielding effect of the cable assembly.
  • connection positions of the first shielding layer and the second shielding layer are symmetrically connected.
  • connection position of the first shielding layer and the second shielding layer is a single point connection, a large current will flow at the connection position, thereby generating a magnetic field, which will be coupled with the magnetic field generated by the cable core to connect the entire cable. A large amount of radiation occurs at the place, which seriously affects the working status of other electrical appliances.
  • connection positions of the first shielding layer and the second shielding layer are symmetrically connected, the magnetic fields generated at the connection positions are in opposite directions, which will cancel each other out and reduce the combined field, thereby reducing the radiation at the cable connection, and can effectively reduce the The magnetic field generated by the cable core reduces the impact on other electrical appliances.
  • connection position of the first shielding layer and the second shielding layer is a 360° connection setting.
  • connection position Relative to the connection position of the first shielding layer and the second shielding layer, the connection position is symmetrical, and the connection position of the first shielding layer and the second shielding layer is a 360° connection setting.
  • the radiation generated by the cable core and the shielding layer itself The radiation generated has a great shielding and offsetting effect, so that the shielding effect of the cable connection is optimal.
  • connection when the free end of the first shielding layer and the free end of the second shielding layer are connected, the connection may be made by butt or overlapping, so as to improve the convenience of connection.
  • the fixed connection between the first shielding layer and the second shielding layer may also be realized by welding.
  • the cable assembly further includes a conductive device, the conductive device is arranged on a part of the periphery of the first cable core and the second cable core, the first end of the conductive device is connected to the free end of the first shielding layer, and the second end of the conductive device is connected to the first cable core.
  • the free ends of the two shielding layers are connected.
  • connection position of the first end of the conductive device and the free end of the first shielding layer is a symmetrical connection configuration
  • the connection position of the second end of the conductive device and the free end of the second shielding layer is a symmetrical connection configuration
  • connection position between the conductive device and the shielding layer is a single-point connection
  • a large current will flow at the connection position, thereby generating a magnetic field, which will be coupled with the magnetic field generated by the cable core, causing a large amount of damage to the entire cable connection.
  • the radiation will seriously affect the working state of other electrical appliances.
  • connection position between the conductive device and the shielding layer is symmetrically connected, the magnetic fields generated at the connection position are in opposite directions, which will cancel each other out and reduce the resultant field, thereby reducing the radiation at the cable connection and effectively reducing the magnetic field generated by the cable core. Magnetic field, reducing the impact on other electrical appliances.
  • connection position of the first end of the conductive device and the free end of the first shielding layer is a 360° connection configuration
  • the connection position of the second end of the conductive device and the free end of the second shielding layer is a 360° connection configuration
  • connection position Relative to the connection position between the conductive device and the shielding layer, the connection position is symmetrical, and the connection position between the conductive device and the shielding layer is 360° connection. Cancellation effect, so as to optimize the shielding effect at the cable connection.
  • the conductive device and the first shielding layer can be connected by butt or overlap.
  • the connection between the conductive device and the second shielding layer may be performed in a butt or overlapping manner, so as to improve the connection effect between the first shielding layer and the second shielding layer and the conductive device.
  • the fixed connection between the conductive device and the first shielding layer may also be realized by welding.
  • the fixed connection between the conductive device and the second shielding layer can also be realized by welding.
  • an insulating protective layer may be provided on the periphery of the first shielding layer, the second shielding layer and the conductive device to improve the insulation reliability of the cable assembly and prevent the first shielding layer, the second shielding layer and the conductive device from conducting electricity with the outside world Conductive contact is created between the bodies.
  • the first cable core has a protrusion extending beyond the first protective layer
  • the second cable core has a protrusion extending beyond the second protective layer. It is convenient to electrically connect the first cable core and the second cable core.
  • an isolation sleeve is further provided on the outer side of the connection between the first cable core and the second cable core.
  • a spacer sleeve may be provided on the periphery of the extended section of the first cable core and the extended section of the second cable core.
  • the thickness of the spacer sleeve is at least greater than one of the thickness of the first protective layer or the thickness of the second protective layer.
  • one end of the isolation sleeve can be butted with the first protective layer, and the other end can be butted with the second protective layer, so as to form a hermetic protection effect on the first cable core and the second cable core.
  • the free end of the first cable core and the free end of the second cable core may be connected in a butt or overlapping manner.
  • the end face of the free end of the first cable core is butted with the end face of the free end of the second cable core.
  • the end face of the free end of the first cable core and the end face of the free end of the second cable core can adopt laser welding, ultrasonic welding, resistance welding , pressure diffusion welding or brazing for welding.
  • the specific welding process is not limited in this application.
  • the free end of the first cable core and the free end of the second cable core may also have an overlapping area to form an overlap.
  • the free end of the first cable core and the free end of the second cable core ie the overlapping area
  • the minimum cross-sectional area of the overlapping or butt joint location of the first and second cable cores may be greater than or equal to the minimum cross-sectional area in either the first or second cable cores. Avoid excessive cable resistance due to the overlapping or small cross-sectional area of the first cable core and the second cable core, and the temperature rise value exceeds the standard requirement when the current is passed.
  • the thickness of the first and second shielding layers and the conductive means may be between 0.003 mm and 27 mm.
  • the minimum cross-sectional area where the free end of the first shielding layer is overlapped or butted with the free end of the second shielding layer is 60%-260% of the smallest cross-sectional area of the first shielding layer and the second shielding layer. Therefore, the connection effect between the free end of the first shielding layer and the free end of the second shielding layer can be guaranteed.
  • the minimum cross-sectional area where the conductive device overlaps or abuts with the first shielding layer or the second shielding layer is 60%-260% of the minimum cross-sectional area of the first shielding layer and the second shielding layer. Therefore, the connection effect between the conductive device and the first shielding layer or the second shielding layer can be ensured.
  • the impedance of the connection location of the first shielding layer and the second shielding layer is less than 13.7 m ⁇ .
  • the impedance of the connection position of the first shielding layer and the second shielding layer is less than 12.5 m ⁇ .
  • the impedance of the connection position of the first end of the conductive device and the free end of the first shielding layer is less than 13.7m ⁇
  • the impedance of the connection position of the second end of the conductive device and the free end of the second shielding layer is less than 13.7m ⁇
  • the impedance of the connection position between the first end of the conductive device and the free end of the first shielding layer is less than 12.5m ⁇ , and the impedance of the connection position between the second end of the conductive device and the free end of the second shielding layer is less than 12.5m ⁇ .
  • the impedance of the connection position between the first shield layer and the second shield layer, and the impedance of the connection position between the conductive device and the shield layer should be as small as possible, so that the current generated by the shield layer will flow back to the energy source or ground position unimpeded.
  • the impedance at the connection position between a shielding layer and the second shielding layer, and the impedance at the connection position between the conductive device and the shielding layer are relatively large, and the impedance at the connection position between the first shielding layer and the second shielding layer, and the connection position between the conductive device and the shielding layer will be generated. Larger current, resulting in larger radiation at the cable connection.
  • the first cable further includes a third protection layer
  • the second cable further includes a fourth protection layer
  • the third protection layer is disposed outside the first shielding layer
  • the fourth protection layer is disposed outside the second shielding layer .
  • the present invention also provides a method for preparing a cable assembly, comprising:
  • a first cable is provided, the first cable includes a first cable core, a first protective layer and a first shielding layer, the first protective layer is arranged on the outside of the first cable core, and the first shielding layer is arranged on the outer side of the first protective layer. outside;
  • a second cable is provided, the second cable includes a second cable core, a second protective layer and a second shielding layer, the second protective layer is arranged on the outer side of the second cable core, and the second shielding layer is arranged on the second protective layer. outside;
  • connecting the free end of the first cable core with the free end of the second cable core specifically includes:
  • the free end of the first cable core is connected to the free end of the second cable core by a welding or crimping process.
  • the electrical connection between the free end of the first shielding layer and the free end of the second shielding layer specifically includes:
  • the free end of the first shielding layer and the free end of the second shielding layer are connected by a welding process.
  • connecting the free end of the first shielding layer with the free end of the second shielding layer specifically includes:
  • a conductive device is provided, and the conductive device is arranged on a part of the periphery of the first cable core and the second cable core; the first end of the conductive device is connected with the free end of the first shielding layer by a welding process, and the conductive device is connected. The second end of the shielding layer is connected to the free end of the second shielding layer.
  • the method before disposing the first end of the conductive device on the periphery of the first cable core and disposing the second end of the conductive device on the periphery of the second cable core, the method further includes:
  • An isolation sleeve is provided at the periphery of the connection of the first cable core and the second cable core.
  • the first shielding layer and the second shielding layer can be connected by means of direct connection or by means of a conductive device, thereby having high flexibility and convenience.
  • the electromagnetic shielding continuity between the first shielding layer and the second shielding layer can also be effectively ensured.
  • FIG. 1 is a schematic cross-sectional structural diagram of a cable assembly according to an embodiment of the present invention
  • FIG. 2 is a schematic cross-sectional structural diagram of another cable assembly according to an embodiment of the present invention.
  • FIG. 3 is a schematic cross-sectional structural diagram of another cable assembly according to an embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional structural diagram of another cable assembly provided by an embodiment of the present invention.
  • FIG. 5 is a schematic cross-sectional structural diagram of another cable assembly according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a plane structure of a shielding layer symmetrical connection arrangement according to an embodiment of the present invention.
  • FIG. 7 is a schematic three-dimensional structural diagram of a symmetrical connection arrangement of shielding layers according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram of a plane structure of a shielding layer asymmetric connection arrangement according to an embodiment of the present invention.
  • FIG. 9 is a schematic three-dimensional structural diagram of a shielding layer asymmetric connection arrangement provided by an embodiment of the present invention.
  • FIG. 10 is a flowchart of a method for preparing a cable assembly according to an embodiment of the present invention.
  • FIG. 11 is a flowchart of another method for preparing a cable assembly according to an embodiment of the present invention.
  • This embodiment provides a solution in which cable shielding nets are directly connected.
  • an embodiment of the present invention provides a cable assembly, including: a first cable 10 and a second cable 20 .
  • the electromagnetic shielding structures in the first cable 10 and the second cable 20 are electrically connected, so as to realize the continuity of the electromagnetic shielding structure between the first cable 10 and the second cable 20, so as to effectively improve the electromagnetic shielding of the cable assembly Effect.
  • the first cable 10 includes a first cable core 11 and a first shielding layer 13 , the periphery of the first cable core 11 is covered with a first protective layer 12 , and the first shielding layer 12 The layer 13 is provided outside the first protective layer 12 .
  • the main function of the first cable core 11 is to realize the transmission of electric energy.
  • the first cable core 11 may be made of materials with good electrical conductivity such as copper and aluminum.
  • the first protective layer 12 is wrapped around the outside of the first cable core 11 , so as to provide good protection for the first cable core 11 .
  • the first protective layer 12 can be made of one of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, polyethylene, or It is made of a variety of combined insulating materials, so as to provide good electrical insulation for the first cable core 11 .
  • the first shielding layer 13 is arranged on the outer side of the first protective layer 12 to provide electromagnetic shielding for the first cable core 11. When a current flows through the first cable core 11, an electromagnetic signal will be generated.
  • the first shielding layer 13 The electromagnetic signal can be shielded to prevent the electromagnetic signal from being transmitted to the external environment.
  • the first shielding layer 13 can be braided by metal wires, so as to have good flexibility.
  • the second cable 20 includes a second cable core 21 and a second shielding layer 23 .
  • the periphery of the second cable core 21 is covered with a second protective layer 22 , and the second shielding layer 23 is disposed outside the second protective layer 22 .
  • the main function of the second cable core 21 is to realize the transmission of electric energy; in the specific configuration, the second cable core 21 can be made of materials with good electrical conductivity such as copper and aluminum.
  • the second protective layer 22 is wrapped around the outside of the second cable core 21 , so as to provide good protection for the second cable core 21 .
  • the second protective layer 22 can be made of one of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, polyethylene, or It is made of various combined insulating materials, so as to provide good electrical insulation for the second cable core 21 .
  • the second shielding layer 23 is disposed on the outside of the second protective layer 22 to provide electromagnetic shielding for the second cable core 21 .
  • an electromagnetic signal When a current flows through the second cable core 21 , an electromagnetic signal will be generated.
  • the electromagnetic signal can be shielded to prevent the electromagnetic signal from being transmitted to the external environment.
  • the second shielding layer 23 can be braided by metal wires, so as to have good flexibility.
  • the free end of the first cable core 11 is connected with the free end of the second cable core 21 to realize the electrical connection between the first cable core 11 and the second cable core 21 .
  • the free end of the first shielding layer 13 is connected to the free end of the second shielding layer 23, thereby realizing the electrical connection between the shielding layers of the first cable 10 and the second cable 20, and ensuring the continuity of the electromagnetic shielding structure of the cable assembly to effectively improve the electromagnetic shielding effect of the cable assembly.
  • connection positions of the first shielding layer 13 and the second shielding layer 23 are symmetrically connected.
  • connection position of the first shielding layer 13 and the second shielding layer 23 is a single-point connection, a large current will flow at the connection position, thereby generating a magnetic field, which will be coupled with the magnetic field generated by the cable core, so that the entire wire A large amount of radiation occurs at the cable connection, which seriously affects the working status of other electrical appliances.
  • connection positions of the first shielding layer 13 and the second shielding layer 23 are symmetrically connected, the magnetic fields generated at the connection positions are in opposite directions, which will cancel each other out and reduce the resultant field, thereby reducing the radiation at the cable connection, and can effectively It reduces the magnetic field generated by the cable core and reduces the impact on other electrical appliances.
  • connection position of the first shielding layer 13 and the second shielding layer 23 is a 360° connection setting.
  • connection positions of the first shielding layer 13 and the second shielding layer 23 are symmetrical, and the connection positions of the first shielding layer 13 and the second shielding layer 23 are 360° connected, which is reflected in the radial direction of the first shielding layer 13.
  • the first cable core 11 is completely wrapped in the direction, and the second shielding layer 23 completely wraps the second cable core 21 in the radial direction.
  • the radiation generated by the shielding layer itself, as well as the radiation generated by the shielding layer itself, have a great shielding and offsetting effect, so that the shielding effect of the cable connection is optimal.
  • Table 1 The influence of the connection position of the first shielding layer and the second shielding layer on the shielding performance.
  • the standard requires that the shielding performance value of the connection position of the first shielding layer and the second shielding layer is greater than 60dB.
  • the shielding performance value of the connection position of the first shielding layer 13 and the second shielding layer 23 is less than 60dB, which does not meet the standard requirements.
  • the shielding performance value of the connection position of the first shielding layer 13 and the second shielding layer 23 still meets the standard requirements.
  • the connection position of the first shielding layer 13 and the second shielding layer 23 is a 360° connection setting, the shielding performance of the cable connection point is better.
  • the free end of the first shielding layer 13 is overlapped or butted with the free end of the second shielding layer 23 .
  • the free end of the first shielding layer 13 and the free end of the second shielding layer 23 are connected in a butt-joint manner.
  • the free end (the right end in the figure) of the first shielding layer 13 has an everted portion
  • the free end (the left end in the drawing) of the second shielding layer 23 also has an everted portion.
  • the connection between the first shielding layer 13 and the second shielding layer 23 can be realized by butting the everted portion of the first shielding layer 13 with the everted portion of the second shielding layer 23 .
  • the everted portion of the first shielding layer 13 and the everted portion of the second shielding layer 23 may be fixedly connected by welding.
  • the welding can be performed by means of laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing.
  • the specific welding process is not limited in this application.
  • connection between the first shielding layer 13 and the second shielding layer 23 may also be performed by means of overlapping.
  • the free end of the first shielding layer 13 may be disposed on the periphery of the free end of the second shielding layer 23 , so as to realize the overlap between the first shielding layer 13 and the second shielding layer 23 .
  • the overlapping portion of the first shielding layer 13 and the second shielding layer 23 may be fixedly connected by welding.
  • the welding can be performed by means of laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing.
  • the specific welding process is not limited in this application.
  • an insulating protective layer 32 can be provided on the periphery of the first shielding layer 13 and the second shielding layer 23 to improve the insulation reliability of the cable assembly and prevent the first shielding layer 13 and the second shielding layer 23 from being connected to external conductors. make conductive contact.
  • the insulating protective layer 32 may be a heat shrinkable tube or other structural member with good insulating properties, and the specific material and type of the insulating sleeve may be adaptively selected according to actual needs, which is not specifically limited in this application.
  • the first cable core 11 has a protruding section extending from the first protective layer 12
  • the second cable core 21 has a protruding section protruding from the second protective layer 22 . It is convenient to electrically connect the first cable core 11 and the second cable core 21 .
  • the outer side of the connection between the first cable core 11 and the second cable core 21 is also provided with a The isolation sleeve 30 may be provided on the periphery of the protruding section of the first cable core 11 and the protruding section of the second cable core 21 .
  • the thickness of the isolation sleeve 30 is at least greater than one of the thickness of the first protective layer 12 or the thickness of the second protective layer 22 .
  • the isolation sleeve 30 can be a heat shrinkable tube, or can be a polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastic that is injection-molded on the outside of the butt joint.
  • the left end of the isolation sleeve 30 can be butted with the first protective layer 12 of the first cable 10, and the right end of the isolation sleeve 30 can be butted with the second protective layer 22 of the second cable 20, so that the The cable core 11 and the second cable core 21 play a good protective role.
  • the free end of the first cable core 11 and the free end of the second cable core 21 may be connected in a butt or overlapping manner.
  • the end face of the free end of the first cable core 11 is butted against the end face of the free end of the second cable core 21 .
  • the end face of the free end of the first cable core 11 and the end face of the free end of the second cable core 21 can use laser welding, ultrasonic wave Connections are made by welding, resistance welding, pressure diffusion welding, brazing or crimping. The specific welding or crimping process is not limited in this application.
  • the free end of the first cable core 11 and the free end of the second cable core 21 can also be overlapped. That is, the right end of the first cable core 11 and the left end of the second cable core 21 have an overlapping area.
  • the free end of the first cable core 11 and the free end of the second cable core 21 ie the first cable core 11 and the second cable core 21
  • the overlapping area of the second cable core 21 can be welded by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, brazing or crimping. The specific welding or crimping process is not limited in this application.
  • the minimum cross-sectional area of the overlapped or butted position of the first cable core 11 and the second cable core 21 may be greater than or equal to the minimum cross-sectional area of the first cable core 11 or the second cable core 21, so as to avoid the damage caused by the first cable core and the second cable core 21.
  • the small cross-sectional area of the second cable core overlapping or docking position leads to excessive cable resistance, and the temperature rise value exceeds the standard requirement when the current is passed.
  • the thickness of the first shielding layer 13 and the second shielding layer 23 may be between 0.003 mm and 27 mm.
  • Table 2 The effect of shielding layer and conductive device thickness on shielding performance and the number of increase in bending radius.
  • the shielding performance value of the connection position between the conductive device 31 and the shielding layer is greater than 60 dB.
  • the thickness of the first shielding layer 13 and the second shielding layer 23 is between 0.003mm and 27mm, the shielding performance of the first cable 10 and the second cable 20 will be reduced. It increases with the thickness, but when the thickness of the first shielding layer 13 and the second shielding layer 23 exceeds 27 mm, the shielding performance of the first cable 10 and the second cable 20 changes little and does not improve significantly;
  • the thickness of the shielding layer 13 and the second shielding layer 23 is between 0.003mm and 27mm, the increase in the turning radius of the first cable 10 and the second cable 20 will increase with the thickness, but when the first shielding layer 13
  • the thickness of the second shielding layer 23 exceeds 27 mm, the turning radius of the first cable 10 and the second cable 20 increases by more than 200 mm, which is not conducive to actual processing. Therefore, the first shielding layer 13 and the second shielding layer 23 are preferred.
  • the thickness is 0.003mm-27mm.
  • the minimum cross-sectional area where the free end of the first shielding layer 13 and the free end of the second shielding layer 23 overlap or butt is 60%-260% of the minimum cross-sectional area of the first shielding layer 13 and the second shielding layer 23 %. Therefore, the connection effect between the free end of the first shielding layer 13 and the free end of the second shielding layer 23 can be guaranteed.
  • the main function of the first shielding layer 13 and the second shielding layer 23 is to ground the eddy current generated by the conduction current of the cable core, so as to avoid the generation of electromagnetic interference.
  • Table 3 The influence of the ratio of the minimum cross-sectional area of the connection position of the first shielding layer and the second shielding layer to the minimum cross-sectional area of the first shielding layer and the second shielding layer on the temperature rise value between the shielding layers.
  • the temperature rise value between the first shielding layer 13 and the second shielding layer 23 is less than 50°C.
  • the first shielding layer The cross-sectional area of 13 and the second shielding layer 23 is already much larger than the minimum conduction area of the eddy current, so the temperature rise value between the first shielding layer 13 and the second shielding layer 23 is basically the same as when the ratio is 260%, but The cost and processing cycle are higher.
  • the minimum cross-sectional area of the overlapped or butted position of the free end of the first shielding layer 13 and the free end of the second shielding layer 23 is 60% of the minimum cross-sectional area of the first shielding layer 13 and the second shielding layer 23 - 260%.
  • the impedance of the connection position between the first shielding layer 13 and the second shielding layer 23 is less than 13.7 m ⁇ .
  • the impedance of the connection position between the first shielding layer 13 and the second shielding layer 23 is less than 12.5 m ⁇ .
  • the impedance of the connection position of the first shielding layer 13 and the second shielding layer 23 should be as small as possible, so that the current generated by the shielding layer will flow back to the energy source or the grounding position unimpeded. If the first shielding layer 13 and the second shielding layer If the impedance of the connection position of the layer 23 is relatively large, a relatively large current will be generated at the connection position of the first shielding layer 13 and the second shielding layer 23 , so that relatively large radiation will be generated at the connection position of the cable.
  • Table 4 The influence of the impedance of the connection position of the first shielding layer and the second shielding layer on the shielding performance.
  • the shielding performance value of the connection position of the first shielding layer 13 and the second shielding layer 23 is less than 6dB, and the shielding performance value of the connection position of the first shielding layer 13 and the second shielding layer 23 is less than 4dB.
  • the shielding performance value of the connection position of the first shielding layer 13 and the second shielding layer 23 is greater than 6dB.
  • the anti-radio frequency interference of the connection position of the two shielding layers 23 is greater than 4dB, which does not meet the standard requirements.
  • the impedance of the connection position of the first shield layer 13 and the second shield layer 23 is less than 12.5 m ⁇ , the shielding performance of the connection position of the first shield layer 13 and the second shield layer 23 and the first shield layer 13 and the second shield layer 23 The shielding performance of the connection position of the shielding layer 23 does not change much. Therefore, the impedance of the connection position of the first shielding layer 13 and the second shielding layer 23 is set to be less than 13.7 m ⁇ .
  • the impedance of the connection position between the first shielding layer 13 and the second shielding layer 23 is less than 12.5 m ⁇ .
  • the first cable 10 may generally further include a third protective layer 14 (which may also be understood as a sheath); the second cable 20 may also generally include a fourth protection layer 24 (which may also be understood as a sheath).
  • the third protective layer 14 is arranged on the outside of the first shielding layer 13 to prevent the first shielding layer 13 from making conductive contact with other components, so that the safety of the first cable 10 can be improved. In addition, Also, the overall waterproof and dustproof performance of the first cable 10 can be improved.
  • the third protective layer 14 can be made of one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, polyethylene Made of a variety of combined insulating materials.
  • the fourth protective layer 24 is arranged on the outer side of the second shielding layer 23 to prevent the second shielding layer 23 from making conductive contact with other components, so that the second cable 20 can be lifted.
  • the overall waterproof and dustproof performance of the second cable 20 can be improved.
  • the fourth protective layer 24 can be made of one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, polyethylene Made of a variety of combined insulating materials.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • This embodiment provides a solution in which cable shielding nets are connected through a conductive device.
  • connection between the first shielding layer 13 and the second shielding layer 23 may also be performed by an additional conductive device 31 .
  • the cable assembly further includes a conductive device 31, the conductive device 31 is arranged on a part of the periphery of the first cable core 11 and the second cable core 21, and one end of the conductive device 31 is connected to the free end of the first shielding layer 13, the conductive device The second end of 31 is connected to the free end of the second shielding layer 23 .
  • the conductive device 31 can be used for transitional connection, and at the same time, the shielding effect of the connection position can be ensured.
  • connection positions of one end of the conductive device 31 and the free end of the first shielding layer 13 are symmetrically connected, and the connection positions of the second end of the conductive device 31 and the free end of the second shielding layer 23 are symmetrically connected.
  • connection position between the conductive device 31 and the shielding layer is a single-point connection
  • a large current will flow at the connection position, thereby generating a magnetic field
  • this magnetic field will be coupled with the magnetic field generated by the cable core, causing the entire cable connection to generate a large amount of current.
  • Large radiation seriously affecting the working state of other electrical appliances.
  • the connection positions of the conductive device 31 and the shielding layer are symmetrically connected, the magnetic fields generated at the connection positions are in opposite directions, which will cancel each other out and reduce the resultant field, thereby reducing the radiation at the cable connection and effectively reducing the generation of the cable core.
  • the magnetic field reduces the impact on other electrical appliances.
  • connection position of the first end of the conductive device 31 and the free end of the first shielding layer 13 is a 360° connection setting. That is, the first end of the conductive device 31 is completely butted with the free end of the first shielding layer 13 .
  • the connection position of the second end of the conductive device 31 and the free end of the second shielding layer 23 is a 360° connection setting, that is, the second end of the conductive device 31 and the free end of the second shielding layer 23 are completely butted.
  • the connecting position between the conductive device 31 and the shielding layer is 360° connected, and the radiation generated by the cable core and the radiation generated by the shielding layer itself has a large Shielding and offsetting effect, so as to optimize the shielding effect at the cable connection.
  • Table 5 The influence of the connection position of the conductive device and the shielding layer on the shielding performance.
  • the standard requires that the shielding performance value of the connection position between the conductive device and the shielding layer is greater than 60dB.
  • the shielding performance value of the connection position between the conductive device 31 and the shielding layer is less than 60 dB, which does not meet the standard requirements.
  • the shielding performance value of the connection position between the conductive device 31 and the shielding layer still meets the standard requirements.
  • the connection position of the conductive device 31 and the shielding layer is a 360° connection setting, the shielding performance of the cable connection point is better.
  • the conductive device 31 and the first shielding layer 13 may be connected by butt or overlap.
  • the connection between the conductive device 31 and the second shielding layer 23 may be performed in a butt or overlapping manner. In order to improve the connection effect between the first shielding layer 13 and the second shielding layer 23 .
  • the first end of the conductive device 31 is connected to the free end of the first shielding layer 13, or the second end of the conductive device 31 is connected to the free end of the second shielding layer 23, refer to the first shielding layer 13 and the second shielding layer above.
  • the layer 23 is connected by laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing.
  • an insulating protective layer 32 may also be provided at the position where the first shielding layer 13 , the conductive device 31 and the second shielding layer 23 are connected, and on the periphery of the conductive device 31 .
  • the left end of the insulating protective layer 32 can be butted or socketed with the third protective layer 14 of the first cable 10 .
  • the right end of the insulating protective layer 32 can be butted or socketed with the fourth protective layer 24 of the second cable 20 to improve the reliability of the cable assembly.
  • the first shielding layer 13 , the conductive device 31 and the second shielding layer 23 are Conductive contact is created between external conductors.
  • the insulating protective layer 32 may be a heat shrinkable tube or other structural member with good insulating properties, and the specific material and type of the insulating protective layer 32 can be adaptively selected according to actual needs, which is not specifically limited in this application.
  • the first shielding layer 13 and the second shielding layer 23 are connected through a conductive device 31 .
  • the first shielding layer 13 and the conductive device 31 can be connected by butt joint; the second shielding layer 23 and the conductive device 31 can also be connected by butt joint.
  • the free end of the first shielding layer 13 has an everted portion
  • the first end (the left end in the figure) of the conductive device 31 also has an everted portion.
  • the connection between the first shielding layer 13 and the conductive device 31 can be realized by butting the everted portion of the first shielding layer 13 with the everted portion of the left end of the conductive device 31 .
  • the free end of the second shielding layer 23 has an everted portion
  • the second end (the right end in the figure) of the conductive device 31 also has an everted portion.
  • the connection between the second shielding layer 23 and the conductive device 31 can be realized by butting the everted portion of the second shielding layer 23 with the everted portion of the right end of the conductive device 31 .
  • the everted portion of the first shielding layer 13 and the everted portion of the conductive device 31 may be fixedly connected by welding.
  • the welding can be performed by means of laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing.
  • the specific welding process is not limited in this application.
  • the welding can be performed by means of laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing.
  • the specific welding process is not limited in this application.
  • the first shielding layer 13 and the conductive device 31 can be connected by a lap joint; the second shield layer 23 and the conductive device 31 can also be connected by a lap joint.
  • the free end of the first shielding layer 13 may be disposed on the periphery of the left end of the conductive device 31 , so as to realize the overlap between the first shielding layer 13 and the conductive device 31 .
  • the free end of the second shielding layer 23 may be disposed on the periphery of the right end of the conductive device 31 , so as to realize the overlap between the second shielding layer 23 and the conductive device 31 .
  • the overlapping portion of the first shielding layer 13 and the conductive device 31 can be fixedly connected by welding.
  • the welding can be performed by means of laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing.
  • the specific welding process is not limited in this application.
  • welding can be carried out by means of laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing. The specific welding process is not limited in this application.
  • the thicknesses of the first shielding layer 13, the second shielding layer 23 and the conductive device 31 may be between 0.003 mm and 27 mm.
  • the thickness of the first shielding layer 13, the second shielding layer 23 and the conductive device 31 is preferably 0.003mm-27mm.
  • the minimum cross-sectional area where the conductive device 31 overlaps or butts with the first shielding layer 13 or the second shielding layer 23 is 60%-260% of the minimum cross-sectional area of the first shielding layer 13 and the second shielding layer 23 . Therefore, the connection effect between the conductive device 31 and the first shielding layer 13 or the second shielding layer 23 can be ensured.
  • the main function of the first shielding layer 13 and the second shielding layer 23 is to ground the eddy current generated by the conduction current of the cable core, so as to avoid the generation of electromagnetic interference.
  • Table 6 The ratio of the minimum cross-sectional area of the connection position between the conductive device and the first shielding layer or the second shielding layer to the smallest cross-sectional area in the first shielding layer or the second shielding layer vs. the conductive device and the first shielding layer or the second shielding The effect of the temperature rise value between layers.
  • the temperature rise value between the conductive device and the first shielding layer 13 and the second shielding layer 23 is less than 50°C.
  • the ratio of the minimum cross-sectional area of the connection position between the conductive device 31 and the first shielding layer 13 or the second shielding layer 23 to the minimum cross-sectional area of the first shielding layer 13 and the second shielding layer 23 is less than At 60%, the temperature increase between the conductive device 31 and the first shielding layer 13 or the second shielding layer 23 does not meet the standard requirements.
  • the ratio of the minimum cross-sectional area of the connection position between the conductive device 31 and the first shielding layer 13 or the second shielding layer 23 to the minimum cross-sectional area of the first shielding layer 13 and the second shielding layer 23 is greater than 260%, at this time due to The cross-sectional area of the first shielding layer 13 and the second shielding layer 23 is already much larger than the minimum conduction area of the eddy current, so the temperature rise value and proportion between the conductive device 31 and the first shielding layer 13 or the second shielding layer 23 At 260%, it is basically the same, but the cost and processing cycle are higher.
  • the minimum cross-sectional area of the overlapped or butted position of the conductive device 31 and the first shielding layer 13 or the second shielding layer 23 is 60%-260% of the minimum cross-sectional area of the first shielding layer 13 and the second shielding layer 23 .
  • the impedance of the connection position between one end of the conductive device and the free end of the first shielding layer is less than 13.7m ⁇
  • the impedance of the connection position between the second end of the conductive device and the free end of the second shielding layer is less than 13.7m ⁇
  • the impedance of the connection position between one end of the conductive device and the free end of the first shielding layer is less than 12.5m ⁇
  • the impedance of the connection position between the second end of the conductive device and the free end of the second shielding layer is less than 12.5m ⁇ .
  • the impedance of the connection position between the conductive device and the shielding layer should be as small as possible, so that the current generated by the shielding layer will flow back to the energy source or the grounding position unimpeded. A larger current is generated at the connection between the device and the shielding layer, resulting in larger radiation at the cable connection.
  • Table 7 The effect of the impedance of the connection position of the conductive device and the shielding layer on the shielding performance.
  • the standard requires that the shielding performance value of the connection position between the conductive device and the shielding layer is greater than 60dB.
  • the impedance between the conductive device and the shielding layer is greater than 13.7m ⁇
  • the impedance between the conductive device and the shielding layer is greater than 13.7m ⁇ .
  • the shielding performance value of the connection position is less than 60dB, which does not meet the standard requirements.
  • the conductive device and the shielding layer have an impedance of less than 12.5m ⁇ .
  • the shielding performance values at the connection locations of the layers do not vary much. Therefore, the inventors set the impedance of the connection position between one end of the conductive device and the free end of the first shielding layer to be less than 13.7m ⁇ , and the impedance of the connection position of the second end of the conductive device and the free end of the second shielding layer to be less than 13.7m ⁇ .
  • the impedance of the connection position between one end of the conductive device and the free end of the first shielding layer is less than 12.5m ⁇
  • the impedance of the connection position between the second end of the conductive device and the free end of the second shielding layer is less than 12.5m ⁇ .
  • the first cable 10 may generally further include a third protective layer 14 (which may also be understood as a sheath); the second cable 20 may also generally include a fourth protection layer 24 (which may also be understood as a sheath).
  • the third protective layer 14 is arranged on the outside of the first shielding layer 13 to prevent the first shielding layer 13 from making conductive contact with other components, so that the safety of the first cable 10 can be improved. In addition, Also, the overall waterproof and dustproof performance of the first cable 10 can be improved.
  • the third protective layer 14 can be made of one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, polyethylene Made of a variety of combined insulating materials.
  • the fourth protective layer 24 is arranged on the outer side of the second shielding layer 23 to prevent the second shielding layer 23 from making conductive contact with other components, so that the second cable 20 can be lifted.
  • the overall waterproof and dustproof performance of the second cable 20 can be improved.
  • the fourth protective layer 24 can be made of one or more of polyvinyl chloride, polyurethane, nylon, polypropylene, silicone rubber, cross-linked polyolefin, synthetic rubber, polyurethane elastomer, cross-linked polyethylene, polyethylene
  • the conductive device 31 may be a cylindrical structure made of conductive materials such as copper, aluminum, and graphene; or, the conductive device 31 may also be a cylindrical structure woven from metal wires, so that it has A certain flexibility, which can improve the application range and seismic performance.
  • the material and manufacturing method of the conductive device 31 are not limited in the present invention.
  • This embodiment provides a method for preparing a cable assembly.
  • the method may include:
  • the first cable 10 includes a first cable core 11 , a first protective layer 12 and a first shielding layer 13 , the first protective layer 12 is arranged outside the first cable core 11 , and the first shielding layer 13 is arranged on the first cable core 11 . the outer side of the protective layer 12 .
  • the second cable 20 includes a second cable core 21 , a second protective layer 22 and a second shielding layer 23 , the second protective layer 22 is arranged outside the second cable core 21 , and the second shielding layer 23 is arranged on the second the outer side of the protective layer 22 .
  • first cable core 11 and the second cable core 21 may be connected by means of laser welding, ultrasonic welding, resistance welding, pressure diffusion welding, brazing or crimping. In order to improve the connection strength between the first cable core 11 and the second cable core 21 .
  • first shielding layer 13 and the second shielding layer 23 may be connected by means of laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing. In order to improve the connection strength between the first shielding layer 13 and the second shielding layer 23 .
  • first cable core 11 and the second cable core 21 can also be connected in other ways, so as to realize the conductive connection between the first cable core 11 and the second cable core 21 and Mechanical connection.
  • other ways may also be used to connect the first shielding layer 13 and the second shielding layer 23 to realize the conductive connection and the mechanical connection between the first shielding layer 13 and the second shielding layer 23 .
  • the method may further include: disposing an isolation sleeve 30 on the periphery of the connection between the first cable core 11 and the second cable core 21 . In order to prevent bad situations such as conductive contact between the connection and the conductive device 31 .
  • the isolation sleeve 30 may be a heat shrinkable tube, or may be another insulating layer directly injection-molded on the outside of the connection.
  • step S11 when the outer side of the first cable 10 has the third protective layer 14 , when step S11 is performed, the step further includes peeling off the third protective layer 14 of the first cable 10 .
  • step S21 when the outer side of the second cable 20 has the fourth protective layer 24 , when step S21 is performed, the step further includes peeling off the fourth protective layer 24 of the second cable 20 .
  • an embodiment of the present invention further provides another method for preparing a cable assembly.
  • steps S30 and S31 are added.
  • the method further includes:
  • the conductive device 31 is provided, and is disposed on a part of the periphery of the first cable core 11 and the second cable core 21 .
  • the conductive device 31 and the first shielding layer 13 may be welded by means of laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing. In order to improve the connection strength between the conductive device 31 and the first shielding layer 13 .
  • the conductive device 31 and the second shielding layer 23 may also be welded by means of laser welding, ultrasonic welding, resistance welding, pressure diffusion welding or brazing. In order to improve the connection strength between the conductive device 31 and the second shielding layer 23 .
  • the method may further include: disposing an isolation sleeve 30 on the periphery of the connection between the first cable core 11 and the second cable core 21 . In order to prevent bad situations such as conductive contact between the connection and the conductive device 31 .
  • the isolation sleeve 30 may be a heat shrinkable tube, or may be another insulating layer directly injection-molded on the outside of the connection.
  • step S11 when the outer side of the first cable 10 has the third protective layer 14 , when step S11 is performed, the step further includes peeling off the third protective layer 14 of the first cable 10 .
  • step S21 when the outer side of the second cable 20 has the fourth protective layer 24 , when step S21 is performed, the step further includes peeling off the fourth protective layer 24 of the second cable 20 .
  • the manufacturing sequence may be adaptively adjusted according to the actual situation, and in addition, some steps may be added or omitted, which is not specifically limited in this application.

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Abstract

本发明提供了一种线缆组件和线缆组件的制备方法,涉及线缆技术领域,以解决线缆连接结构不成熟的问题;本发明提供的线缆组件包括:第一线缆和第二线缆;其中,第一线缆包括第一缆芯和第一屏蔽层,第一缆芯的外围包覆有第一保护层,第一屏蔽层设置在第一保护层的外侧;第二线缆包括第二缆芯和第二屏蔽层,第二缆芯的外围包覆有第二保护层,第二屏蔽层设置在第二保护层的外侧;第一屏蔽层和第二屏蔽层电连接,从而实现第一线缆和第二线缆之间电磁屏蔽结构的连续性,以有效提升线缆组件的电磁屏蔽效果。

Description

一种线缆组件和线缆组件的制备方法 技术领域
本发明涉及线缆技术领域,尤其涉及一种线缆组件和线缆组件的制备方法。
背景技术
随着新能源技术的不断发展和普遍应用,越来越多的车辆开始使用电池作为动力来源。在配备有电池的车辆中,电机、车载电脑等用电器件需要通过线缆与电池进行连接,电池中的电能可以通过线缆传输至用电器件,从而使用电器件发挥各自的功能。在实际应用中,用于连接电池和用电器件的线缆并不是一条完整的线缆,而是由多条线缆依次连接而成的。
具体来说,在线缆中一般包括缆芯和包裹在缆芯外侧的屏蔽网;缆芯的主要功能是实现电力的传输;屏蔽网的主要功能是为线缆提供良好的屏蔽作用,以防止缆芯中的电流对外界的用电元件产生电磁干扰。
目前,将两条线缆进行对接时,由于采用的连接结构不成熟,导致在线缆的对接处,两条线缆的屏蔽网之间不能形成稳定、有效的连接,从而不利于保证线缆的电磁屏蔽效果。
发明内容
本发明提供了一种能有效提升线缆之间电磁屏蔽效果的线缆组件和线缆组件的制备方法。
一方面,本发明提供了一种线缆组件,包括:第一线缆和第二线缆。其中,第一线缆包括第一缆芯和第一屏蔽层,第一缆芯的外围包覆有第一保护层,第一屏蔽层设置在第一保护层的外侧。第二线缆包括第二缆芯和第二屏蔽层,第二缆芯的外围包覆有第二保护层,第二屏蔽层设置在第二保护层的外侧。第一缆芯的自由端与第二缆芯的自由端连接,实现第一缆芯与第二缆芯的电连接。第一屏蔽层的自由端和第二屏蔽层的自由端连接,从而实现第一线缆和第二线缆的屏蔽层之间的电连接,保证线缆组件电磁屏蔽结构的连续性,以有效提升线缆组件的电磁屏蔽效果。
其中,第一屏蔽层和第二屏蔽层的连接位置为对称连接设置。
第一屏蔽层和第二屏蔽层的连接位置如果是单点连接,则在连接位置会流过较大电流,从而产生磁场,这个磁场又会跟缆芯产生的磁场耦合,使整个线缆连接处发生很大的辐射,严重影响其他电器的工作状态。当第一屏蔽层和第二屏蔽层的连接位置是对称连接时,在连接位置产生的磁场方向相反,会相互抵消并减小合成场,从而降低线缆连接处的辐射,并且可以有效的降低缆芯产生的磁场,减小了对其他电器的影响。
其中,第一屏蔽层和第二屏蔽层的连接位置为360°连接设置。
相对于第一屏蔽层和第二屏蔽层的连接位置为对称设置,第一屏蔽层和第二屏蔽层的连接位置为360°连接设置,对线缆的缆芯产生的辐射,以及屏蔽层本身产生的辐射,有很大的屏蔽及抵消作用,从而使线缆连接处的防屏蔽效果达到最优。
其中,当第一屏蔽层的自由端和第二屏蔽层的自由端连接时,可以采用对接或搭接的方式进行连接,以提升连接时的便利性。
另外,为了提升第一屏蔽层和第二屏蔽层之间的连接强度,也可以采用焊接的方式实现第一屏蔽层和第二屏蔽层之间的固定连接。
线缆组件还包括导电装置,导电装置设置在第一缆芯和第二缆芯的部分外围,且导电装置的第一端与第一屏蔽层的自由端连接,导电装置的第二端与第二屏蔽层的自由端连接。当第一屏蔽层和第二屏蔽层的连接长度不足时,可以使用导电装置进行过渡连接,同时也能保证连接位置的屏蔽效果。
作为示例,导电装置的第一端和第一屏蔽层的自由端的连接位置为对称连接设置,导电装置的第二端和第二屏蔽层的自由端的连接位置为对称连接设置。
导电装置与屏蔽层的连接位置如果是单点连接,则在连接位置会流过较大电流,从而产生磁场,这个磁场又会跟缆芯产生的磁场耦合,使整个线缆连接处发生很大的辐射,严重影响其他电器的工作状态。当导电装置与屏蔽层的连接位置是对称连接时,在连接位置产生的磁场方向相反,会相互抵消并减小合成场,从而降低线缆连接处的辐射,并且可以有效的降低缆芯产生的磁场,减小了对其他电器的影响。
作为示例,导电装置的第一端和第一屏蔽层的自由端的连接位置为360°连接设置,导电装置的第二端和第二屏蔽层的自由端的连接位置为360°连接设置。
相对于导电装置与屏蔽层连接位置为对称设置,导电装置与屏蔽层连接位置为360°连接设置,对线缆的缆芯产生的辐射,以及屏蔽层本身产生的辐射,有很大的屏蔽及抵消作用,从而使线缆连接处的防屏蔽效果达到最优。
当第一屏蔽层的自由端和第二屏蔽层的自由端通过导电装置进行连接时,导电装置与第一屏蔽层之间可以采用对接或搭接的方式进行连接。相应的,导电装置与第二屏蔽层之间可以采用对接或搭接的方式进行连接,以提升第一屏蔽层和第二屏蔽层与导电装置之间的连接效果。
另外,为了提升导电装置和第一屏蔽层之间的连接强度,也可以采用焊接的方式实现导电装置和第一屏蔽层之间的固定连接。相应的,为了提升导电装置和第二屏蔽层之间的连接强度,也可以采用焊接的方式实现导电装置和第二屏蔽层之间的固定连接。
作为示例,第一屏蔽层、第二屏蔽层和导电装置的外围可以设置绝缘保护层,以提升线缆组件的绝缘可靠性,防止第一屏蔽层、第二屏蔽层和导电装置与外界的导电体之间产生导电接触。
作为示例,第一缆芯具有伸出于第一保护层的伸出段,第二缆芯具有伸出于第二保护层的伸出段。方便对第一缆芯和第二缆芯进行电连接。
作为示例,为了对第一缆芯和第二缆芯连接处形成良好的绝缘保护作用,第一缆芯和第二缆芯的连接处的外侧还设置有隔离套筒。隔离套筒可以设置在第一缆芯的伸出段和第二缆芯的伸出段的外围。
作为示例,隔离套筒的厚度至少大于第一保护层的厚度或第二保护层的厚度中的一个。
作为示例,隔离套筒的一端可以与第一保护层对接,另一端可以与第二保护层对接,从而对第一缆芯和第二缆芯形成密闭的保护作用。
作为示例,第一缆芯的自由端与第二缆芯的自由端可以采用对接或搭接的方式进行连接。
例如,第一缆芯的自由端的端面与第二缆芯的自由端的端面进行对接。在具体实施时,为了保证第一缆芯和第二缆芯之间的连接稳定性,第一缆芯的自由端的端面与第二缆芯的自由端的端面可以采用激光焊、超声波焊接、电阻焊、压力扩散焊或钎焊的方式进行焊接。其中,具体的焊接工艺本申请不作限制。
另外,第一缆芯的自由端与第二缆芯的自由端还可以具有一段重叠区域,以形成搭接。在具体实施时,为了保证第一缆芯和第二缆芯之间的连接稳定性,第一缆芯的自由端与第二缆芯的自由端(即第一缆芯和第二缆芯的重叠区域)可以采用激光焊、超声波焊接、电阻焊、压力扩散焊或钎焊的方式进行焊接。其中,具体的焊接工艺本申请不作限制。
作为示例,第一缆芯和第二缆芯搭接或对接位置的最小截面面积可以大于或等于第一缆芯或第二缆芯中的最小截面面积。避免因第一缆芯和第二缆芯搭接或对接位置截面面积小导致线缆电阻过大,通电流时温度升高值超过标准要求。
作为示例,第一屏蔽层和第二屏蔽层及导电装置的厚度可以介于0.003mm至27mm之间。
作为示例,第一屏蔽层的自由端与第二屏蔽层的自由端搭接或对接位置的最小截面面积为第一屏蔽层和第二屏蔽层中的最小截面面积的60%-260%。从而可以保证第一屏蔽层的自由端与第二屏蔽层的自由端之间的连接效果。
作为示例,导电装置与第一屏蔽层或第二屏蔽层搭接或对接位置的最小截面面积为第一屏蔽层和第二屏蔽层中的最小截面面积的60%-260%。从而可以保证导电装置与第一屏蔽层或第二屏蔽层之间的连接效果。
作为示例,第一屏蔽层和第二屏蔽层的连接位置的阻抗小于13.7mΩ。
作为优选的示例,第一屏蔽层和第二屏蔽层的连接位置的阻抗小于12.5mΩ。
作为示例,导电装置的第一端和第一屏蔽层的自由端的连接位置的阻抗小于13.7mΩ,导电装置的第二端和第二屏蔽层的自由端的连接位置的阻抗小于13.7mΩ。
作为优选的示例,导电装置的第一端和第一屏蔽层的自由端的连接位置的阻抗小于12.5mΩ,导电装置的第二端和第二屏蔽层的自由端的连接位置的阻抗小于12.5mΩ。
第一屏蔽层和第二屏蔽层连接位置的阻抗,以及导电装置与屏蔽层连接位置的阻抗要尽可能小,这样屏蔽层产生的电流才会无阻碍的流回能量源或接地位置,如果第一屏蔽层和第二屏蔽层连接位置的阻抗,以及导电装置与屏蔽层连接位置的阻抗较大,则会在第一屏蔽层和第二屏蔽层连接位置,以及导电装置与屏蔽层连接位置产生较大的电流,从而使线缆连接处产生较大的辐射。
作为示例,第一线缆还包括第三保护层,第二线缆还包括第四保护层,第三保护层设置在第一屏蔽层的外侧,第四保护层设置在第二屏蔽层的外侧。通过第三保护层能够有效提升第一线缆的使用安全性和结构强度;相应的,通过第四保护层能够有效提升第二线缆的使用安全性和结构强度。
另一方面,本发明还提供了一种线缆组件的制备方法,包括:
提供第一线缆,第一线缆包括第一缆芯、第一保护层和第一屏蔽层,第一保护层设置在第一缆芯的外侧,第一屏蔽层设置在第一保护层的外侧;
对第一线缆的第一端的第一屏蔽层和第一保护层进行剥离,以裸露出第一缆芯;
提供第二线缆,第二线缆包括第二缆芯、第二保护层和第二屏蔽层,第二保护层设置在第二缆芯的外侧,第二屏蔽层设置在第二保护层的外侧;
对第二线缆的第一端的第二屏蔽层和第二保护层进行剥离,以裸露出第二缆芯;
将第一缆芯的自由端与第二缆芯的自由端进行连接;
将第一屏蔽层的自由端与第二屏蔽层的自由端进行连接。
作为示例,将第一缆芯的自由端与第二缆芯的自由端进行连接具体包括:
采用焊接或压接工艺将第一缆芯的自由端与第二缆芯的自由端进行连接。
作为示例,将第一屏蔽层的自由端与第二屏蔽层的自由端进行电连接具体包括:
采用焊接工艺将第一屏蔽层的自由端与第二屏蔽层的自由端进行连接。
作为示例,将第一屏蔽层的自由端与第二屏蔽层的自由端进行连接具体包括:
提供导电装置,将导电装置设置在所述第一缆芯和所述第二缆芯的部分外围;采用焊接工艺将导电装置的第一端与第一屏蔽层的自由端进行连接、将导电装置的第二端与第二屏蔽层的自由端进行连接。
作为示例,在将导电装置的第一端设置在第一缆芯的外围,将导电装置的第二端设置在第二缆芯的外围之前,方法还包括:
在第一缆芯与第二缆芯的连接处的外围设置隔离套筒。本发明实施例的有益效果在于:
在本发明提供的线缆组件中,第一屏蔽层和第二屏蔽层可以通过直接连接的方式进行连接,也可以通过导电装置的方式进行连接,从而具有较高的灵活性和便利性。另外,也能够有效保证第一屏蔽层和第二屏蔽层之间的电磁屏蔽连续性。
附图说明
图1为本发明实施例提供的一种线缆组件的剖面结构示意图;
图2为本发明实施例提供的另一种线缆组件的剖面结构示意图;
图3为本发明实施例提供的又一种线缆组件的剖面结构示意图;
图4为本发明实施例提供的又一种线缆组件的剖面结构示意图;
图5为本发明实施例提供的又一种线缆组件的剖面结构示意图;
图6为本发明实施例提供的一种屏蔽层对称连接设置的平面结构示意图;
图7为本发明实施例提供的一种屏蔽层对称连接设置的立体结构示意图;
图8为本发明实施例提供的一种屏蔽层不对称连接设置的平面结构示意图;
图9为本发明实施例提供的一种屏蔽层不对称连接设置的立体结构示意图;
图10为本发明实施例提供的一种线缆组件的制备方法的流程图;
图11为本发明实施例提供的另一种线缆组件的制备方法的流程图。
附图标记:
10-第一线缆;11-第一缆芯;12-第一保护层;13-第一屏蔽层;14-第三保护层;20-第二线缆;21-第二缆芯;22-第二保护层;23-第二屏蔽层;24-第四保护层;30-隔离套筒;31-导电装置;32-绝缘保护层。
具体实施方式
为了使本领域技术人员更好的理解本发明的技术方案,下面结合说明书附图对本发明实施例进行详细的描述。
实施例一:
本实施例提供一种线缆屏蔽网直接相连接的方案。
如图1所示,本发明实施例提供了一种线缆组件,包括:第一线缆10和第二线缆20。第一线缆10和第二线缆20中的电磁屏蔽结构电连接,从而实现第一线缆10和第二线缆20之间电磁屏蔽结构的连续性,以有效提升线缆组件的电磁屏蔽效果。
具体来说,在本发明提供的实施例中,第一线缆10包括第一缆芯11和第一屏蔽层13,第一缆芯11的外围包覆有第一保护层12,第一屏蔽层13设置在第一保护层12的外侧。
其中,第一缆芯11的主要作用是实现电能的传输。在具体配置时,第一缆芯11可以由铜、铝等导电性能良好的材料制作而成。
第一保护层12包裹在第一缆芯11的外侧,从而可以为第一缆芯11提供良好的保护作用。在具体配置时,第一保护层12可以由聚氯乙烯、聚氨酯、尼龙、聚丙烯、硅橡胶、交联聚烯烃、合成橡胶、聚氨酯弹性体、交联聚乙烯、聚乙烯中的一种或多种的组合绝缘材料所制成,从而可以为第一缆芯11提供良好电气绝缘性。
第一屏蔽层13设置在第一保护层12的外侧,用于为第一缆芯11提供电磁屏蔽作用,当第一缆芯11中通有电流时,会产生电磁信号,第一屏蔽层13可以对该电磁信号起到屏蔽效果,以对防止该电磁信号传输至外界环境中。在具体配置时,第一屏蔽层13可以由金属丝编织而成,从而具有良好的柔性。
第二线缆20包括第二缆芯21和第二屏蔽层23,第二缆芯21的外围包覆有第二保护层22,第二屏蔽层23设置在第二保护层22的外侧。
其中,第二缆芯21的主要作用是实现电能的传输;在具体配置时,第二缆芯21可以由铜、铝等导电性能良好的材料制作而成。
第二保护层22包裹在第二缆芯21的外侧,从而可以为第二缆芯21提供良好的保护作用。在具体配置时,第二保护层22可以由聚氯乙烯、聚氨酯、尼龙、聚丙烯、硅橡胶、交联聚烯烃、合成橡胶、聚氨酯弹性体、交联聚乙烯、聚乙烯中的一种或多种的组合绝缘材料所制成,从而可以为第二缆芯21提供良好电气绝缘性。
第二屏蔽层23设置在第二保护层22的外侧,用于为第二缆芯21提供电磁屏蔽作用,当第二缆芯21中通有电流时,会产生电磁信号,第二屏蔽层23可以对该电磁信号起到屏蔽效果,以对防止该电磁信号传输至外界环境中。在具体配置时,第二屏蔽层23可以由金属丝编织而成,从而具有良好的柔性。
其中,第一缆芯11的自由端与第二缆芯21的自由端连接,实现第一缆芯11与第二缆芯21的电连接。第一屏蔽层13的自由端和第二屏蔽层23的自由端连接,从而实现第一线缆10和第二线缆20的屏蔽层之间的电连接,保证线缆组件电磁屏蔽结构的连续性,以有效提升线缆组件的电磁屏蔽效果。
请结合参阅图1、图6和图7。其中,第一屏蔽层13和第二屏蔽层23的连接位置为对称连接设置。
请结合参阅图8和图9。第一屏蔽层13和第二屏蔽层23的连接位置如果是单点连接,则在连接位置会流过较大电流,从而产生磁场,这个磁场又会跟缆芯产生的磁场耦合,使整个线缆连接处发生很大的辐射,严重影响其他电器的工作状态。当第一屏蔽层13和第二屏蔽层23的连接位置是对称连接时,在连接位置产生的磁场方向相反,会相互抵消并减小合成场,从而降低线缆连接处的辐射,并且可以有效的降低缆芯产生的磁场,减小了对其他电器的影响。
其中,第一屏蔽层13和第二屏蔽层23的连接位置为360°连接设置。
相对于第一屏蔽层13和第二屏蔽层23的连接位置为对称设置,第一屏蔽层13和第二屏蔽层23的连接位置为360°连接设置,体现为第一屏蔽层13在径向方向上完全包裹第一缆芯11,第二屏蔽层23在径向方向上完全包裹第二缆芯21,此时缆芯的径向外周全部被屏蔽层所包裹,对线缆的缆芯产生的辐射,以及屏蔽层本身产生的辐射,有很大的屏蔽及抵消作用,从而使线缆连接处的防屏蔽效果达到最优。
试验方法为:测试仪器对第一线缆10或第二线缆20输出一个信号值(此数值为测试值2),在线缆组件外侧设置探测装置,此探测装置探测到一个信号值(此数值为测试值1)。屏蔽性能值=测试值2-测试值1。
表1第一屏蔽层和第二屏蔽层的连接位置方式对屏蔽性能的影响。
Figure PCTCN2021129457-appb-000001
表1
如上表所示,选取某个线径的线缆进行试验的数据。其中,标准要求为第一屏蔽层和第二屏蔽层的连接位置的屏蔽性能值大于60dB。
在第一屏蔽层13和第二屏蔽层23的连接位置尺寸相同时,不对称设置时,第一屏蔽层13和第二屏蔽层23的连接位置的屏蔽性能值小于60dB,不符合标准要求。当对称设置时,即使是不完全连接,因为电磁辐射被抵消,第一屏蔽层13和第二屏蔽层23的连接位置的屏蔽性能值仍然是符合标准要求的。优选的,当第一屏蔽层13和第二屏蔽层23的连接位置为360°连接设置,线缆连接点的屏蔽性能更佳。
在具体实施时,第一屏蔽层13的自由端与第二屏蔽层23的自由端搭接或对接。
请继续参阅图1。在本发明提供的一个实施中,第一屏蔽层13的自由端与第二屏蔽层23的自由端采用对接的方式进行连接。
具体来说,第一屏蔽层13的自由端(图中的右端)具有外翻的部分,第二屏蔽层23的自由端(图中的左端)也具有外翻的部分。将第一屏蔽层13的外翻部分与第二屏蔽层23的外翻部分进行对接,便可实现第一屏蔽层13和第二屏蔽层23之间的连接。
其中,为了保证第一屏蔽层13和第二屏蔽层23之间的连接稳定性。第一屏蔽层13的外翻部分和第二屏蔽层23的外翻部分可以采用焊接的方式进行固定连接。例如,可以采用激光焊、超声波焊接、电阻焊、压力扩散焊或钎焊的方式进行焊接。其中,具体的焊接工艺本申请不作限制。
或者,如图2所示,第一屏蔽层13和第二屏蔽层23之间也可以采用搭接的方式进行连接。
具体来说,第一屏蔽层13的自由端可以设置在第二屏蔽层23的自由端的外围,从而实现第一屏蔽层13和第二屏蔽层23之间的搭接。
其中,为了保证第一屏蔽层13和第二屏蔽层23之间的连接稳定性。第一屏蔽层13和第二屏蔽层23的搭接部分可以采用焊接的方式进行固定连接。例如,可以采用激光焊、超声波焊接、电阻焊、压力扩散焊或钎焊的方式进行焊接。其中,具体的焊接工艺本申请不作限制。
另外,第一屏蔽层13和第二屏蔽层23的外围可以设置绝缘保护层32,以提升线缆组件的绝缘可靠性,防止第一屏蔽层13和第二屏蔽层23与外界的导电体之间产生导电接触。在具体配置时,绝缘保护层32可以是热缩管等具备良好绝缘性的结构件,可根据实际需求对绝缘套的具体材质和种类进行适应性选择,本申请对此不作具体限定。
在具体配置时,第一缆芯11具有伸出于第一保护层12的伸出段,第二缆芯21具有伸出于第二保护层22的伸出段。方便对第一缆芯11和第二缆芯21进行电连接。
另外,为了对第一缆芯11和第二缆芯21连接处形成良好的保护作用,在本发明提供的实施例中,第一缆芯11和第二缆芯21连接处的外侧还设置有隔离套筒30,隔离套筒30可以设置在第一缆芯11的伸出段和第二缆芯21的伸出段的外围。
在具体配置时,隔离套筒30的厚度至少大于第一保护层12的厚度或第二保护层22的厚度中的一个。
在具体配置时,隔离套筒30可以是热缩管,也可以是注塑成型在该对接处外侧的聚氯乙烯、聚氨酯、尼龙、聚丙烯、硅橡胶、交联聚烯烃、合成橡胶、聚氨酯弹性体、交联聚乙烯、聚乙烯中的一种或多种的组合绝缘材料。
其中,隔离套筒30的左端可以与第一线缆10的第一保护层12进行对接,隔离套筒30的右端可以与第二线缆20的第二保护层22进行对接,以对第一缆芯11和第二缆芯21起到良好的保护作用。
在具体配置时,第一缆芯11的自由端与第二缆芯21的自由端可以采用对接或搭接的方式进行连接。
例如,如图1和图2所示,第一缆芯11的自由端的端面与第二缆芯21的自由端的端面进行对接。在具体实施时,为了保证第一缆芯11和第二缆芯21之间的连接稳定性,第一缆芯11的自由端的端面与第二缆芯21的自由端的端面可以采用激光焊、超声波焊接、电阻焊、压力扩散焊、钎焊或压接的方式进行连接。其中,具体的焊接或压接工艺本申请不作限制。
如图3所示,第一缆芯11的自由端与第二缆芯21的自由端也可以进行搭接。即第一缆芯11的右端与第二缆芯21的左端具有一段重叠区域。在具体实施时,为了保证第 一缆芯11和第二缆芯21之间的连接稳定性,第一缆芯11的自由端与第二缆芯21的自由端(即第一缆芯11和第二缆芯21的重叠区域)可以采用激光焊、超声波焊接、电阻焊、压力扩散焊、钎焊或压接的方式进行焊接。其中,具体的焊接或压接工艺本申请不作限制。
其中,第一缆芯11和第二缆芯21搭接或对接位置的最小截面面积可以大于或等于第一缆芯11或第二缆芯21中的最小截面面积,避免因第一缆芯和第二缆芯搭接或对接位置截面面积小导致线缆电阻过大,通电流时温度升高值超过标准要求。
其中,第一屏蔽层13和第二屏蔽层23的厚度可以介于0.003mm至27mm之间。
试验方法为:测试仪器对第一线缆10或第二线缆20输出一个信号值(此数值为测试值2),在线缆组件外侧设置探测装置,此探测装置探测到一个信号值(此数值为测试值1)。屏蔽性能值=测试值2-测试值1。
表2屏蔽层及导电装置厚度对屏蔽性能和折弯半径增加数的影响。
Figure PCTCN2021129457-appb-000002
Figure PCTCN2021129457-appb-000003
表2
如上表所示,选取某个线径的线缆进行试验的数据。其中,标准要求为导电装置31与屏蔽层的连接位置的屏蔽性能值大于60dB。
根据表中所示的测试结果可以得知:当第一屏蔽层13和第二屏蔽层23的厚度在0.003mm-27mm之间时,第一线缆10、第二线缆20的屏蔽性能会随厚度增加而增加,但当第一屏蔽层13和第二屏蔽层23的厚度超过27mm时,第一线缆10、第二线缆20 的屏蔽性能变化较小,无明显提升;当第一屏蔽层13和第二屏蔽层23的厚度在0.003mm-27mm之间时,第一线缆10、第二线缆20的转弯半径增加数量会随厚度增加而增加,但当第一屏蔽层13和第二屏蔽层23的厚度超过27mm时,第一线缆10、第二线缆20的转弯半径增加数超过200mm,不利于实际加工,因此,优选第一屏蔽层13和第二屏蔽层23的厚度为0.003mm-27mm。
另外,第一屏蔽层13的自由端与第二屏蔽层23的自由端搭接或对接位置的最小截面面积为第一屏蔽层13和第二屏蔽层23中的最小截面面积的60%-260%。从而可以保证第一屏蔽层13的自由端与第二屏蔽层23的自由端之间的连接效果。
第一屏蔽层13和第二屏蔽层23的主要作用是将缆芯导通电流产生的涡流电流接地,避免电磁干扰的产生,缆芯截面面积越大,能够导通的电流越大,从而在屏蔽层内产生的涡流电流越大。当第一屏蔽层13和第二屏蔽层23连接位置的最小截面面积小于标准要求时,就会产生连接位置局部生热,严重时会烧断第一屏蔽层13和第二屏蔽层23的连接位置,导致线缆屏蔽性能下降甚至失效。
表3第一屏蔽层和第二屏蔽层连接位置的最小截面面积与第一屏蔽层和第二屏蔽层中的最小截面面积的占比对屏蔽层之间的温度升高值的影响。
Figure PCTCN2021129457-appb-000004
表3
如上表所示,选取某个线径的线缆进行试验的数据。其中,标准要求为第一屏蔽层13和第二屏蔽层23之间的温度升高值小于50℃。
从上表中可以看出,当第一屏蔽层13和第二屏蔽层23连接位置的最小截面面积与第一屏蔽层13和第二屏蔽层23中的最小截面面积的占比小于60%时,屏蔽层之间的温度升高不满足标准要求。
当第一屏蔽层13和第二屏蔽层23连接位置的最小截面面积与第一屏蔽层13和第二屏蔽层23中的最小截面面积的占比大于260%时,此时由于第一屏蔽层13和第二屏蔽层23的截面面积已经远大于涡流电流最小导通面积,因此第一屏蔽层13和第二屏蔽层23之间的温度升高值与占比为260%时基本相同,但所花费的成本和加工周期更高。
因此,优选第一屏蔽层13的自由端与第二屏蔽层23的自由端搭接或对接位置的最小截面面积为第一屏蔽层13和第二屏蔽层23中的最小截面面积的60%-260%。
在具体配置时,第一屏蔽层13和第二屏蔽层23的连接位置的阻抗小于13.7mΩ。
作为优选的方式,第一屏蔽层13和第二屏蔽层23的连接位置的阻抗小于12.5mΩ。
第一屏蔽层13和第二屏蔽层23的连接位置的阻抗要尽可能小,这样屏蔽层产生的电流才会无阻碍的流回能量源或接地位置,如果第一屏蔽层13和第二屏蔽层23的连接位置的阻抗较大,则会在第一屏蔽层13和第二屏蔽层23的连接位置产生较大的电流,从而使线缆连接处产生较大的辐射。
表4第一屏蔽层和第二屏蔽层的连接位置的阻抗对屏蔽性能的影响。
Figure PCTCN2021129457-appb-000005
表4
如上表所示,选取某个线径的线缆进行试验的数据。其中,标准要求为第一屏蔽层13和第二屏蔽层23的连接位置的屏蔽性能值小于6dB,第一屏蔽层13和第二屏蔽层23的连接位置的屏蔽性能值小于4dB。
当第一屏蔽层13和第二屏蔽层23的连接位置的阻抗大于13.7mΩ时,第一屏蔽层13和第二屏蔽层23的连接位置的屏蔽性能值大于6dB,第一屏蔽层13和第二屏蔽层23的连接位置的抗射频干扰大于4dB,不符合标准要求。而且,当第一屏蔽层13和第二屏蔽层23的连接位置的阻抗小于12.5mΩ时,第一屏蔽层13和第二屏蔽层23的连接位置的屏蔽性能和第一屏蔽层13和第二屏蔽层23的连接位置的屏蔽性能变化不大。因此,设定第一屏蔽层13和第二屏蔽层23的连接位置的阻抗小于13.7mΩ。
作为优选的方式,第一屏蔽层13和第二屏蔽层23的连接位置的阻抗小于12.5mΩ。
在实际应用时,第一线缆10通常还可以包括第三保护层14(也可以理解为外皮);第二线缆20通常还包括第四保护层24(也可以理解为外皮)。
具体来说,第三保护层14设置在第一屏蔽层13的外侧,用于防止第一屏蔽层13与其他的部件产生导电接触,从而可以提升第一线缆10的使用安全性,另外,还能提升第一线缆10整体的防水、防尘等性能。
在具体实施时,第三保护层14可以由聚氯乙烯、聚氨酯、尼龙、聚丙烯、硅橡胶、交联聚烯烃、合成橡胶、聚氨酯弹性体、交联聚乙烯、聚乙烯中的一种或多种的组合绝缘材料所制成。
相应的,在第二线缆20中,第四保护层24设置在第二屏蔽层23的外侧,用于防止第二屏蔽层23与其他的部件产生导电接触,从而可以提升第二线缆20的使用安全性,另外,还能提升第二线缆20整体的防水、防尘等性能。
在具体实施时,第四保护层24可以由聚氯乙烯、聚氨酯、尼龙、聚丙烯、硅橡胶、交联聚烯烃、合成橡胶、聚氨酯弹性体、交联聚乙烯、聚乙烯中的一种或多种的组合绝缘材料所制成。
实施例二:
本实施例提供一种线缆屏蔽网通过导电装置相连接的方案。
在本实施例中,第一屏蔽层13和第二屏蔽层23之间也可以通过额外的导电装置31进行连接。
其中,线缆组件还包括导电装置31,导电装置31设置在第一缆芯11和第二缆芯21的部分外围,且导电装置31的一端与第一屏蔽层13的自由端连接,导电装置31的第二端与第二屏蔽层23的自由端连接。当第一屏蔽层13和第二屏蔽层23的连接长度不足时,可以使用导电装置31进行过渡连接,同时也能保证连接位置的屏蔽效果。
其中,导电装置31的一端和第一屏蔽层13的自由端的连接位置为对称连接设置,导电装置31的第二端和第二屏蔽层23的自由端的连接位置为对称连接设置。
导电装置31与屏蔽层的连接位置如果是单点连接,则在连接位置会流过较大电流,从而产生磁场,这个磁场又会跟缆芯产生的磁场耦合,使整个线缆连接处发生很大的辐射,严重影响其他电器的工作状态。当导电装置31与屏蔽层的连接位置是对称连接时,在连接位置产生的磁场方向相反,会相互抵消并减小合成场,从而降低线缆连接处的辐射,并且可以有效的降低缆芯产生的磁场,减小了对其他电器的影响。
其中,导电装置31的第一端和第一屏蔽层13的自由端的连接位置为360°连接设置。即导电装置31的第一端和第一屏蔽层13的自由端完全对接。导电装置31的第二端和第二屏蔽层23的自由端的连接位置为360°连接设置,即导电装置31的第二端和第二屏蔽层23的自由端完全对接。
相对于导电装置31与屏蔽层连接位置为对称设置,导电装置31与屏蔽层连接位置为360°连接设置,对线缆的缆芯产生的辐射,以及屏蔽层本身产生的辐射,有很大的屏蔽及抵消作用,从而使线缆连接处的防屏蔽效果达到最优。
试验方法为:测试仪器对第一线缆10或第二线缆20输出一个信号值(此数值为测试值2),在线缆组件外侧设置探测装置,此探测装置探测到一个信号值(此数值为测试值1)。屏蔽性能值=测试值2-测试值1。
表5导电装置和屏蔽层的连接位置方式对屏蔽性能的影响。
Figure PCTCN2021129457-appb-000006
表5
如上表所示,选取某个线径的线缆进行试验的数据。其中,标准要求为导电装置与屏蔽层的连接位置的屏蔽性能值大于60dB。
在导电装置31与屏蔽层的连接位置尺寸相同时,不对称设置时,导电装置31与屏蔽层的连接位置的屏蔽性能值小于60dB,不符合标准要求。当对称设置时,即使是不完全连接,因为电磁辐射被抵消,导电装置31与屏蔽层的连接位置的屏蔽性能值仍然是符合标准要求的。优选的,当导电装置31与屏蔽层的连接位置为360°连接设置,线缆连接点的屏蔽性能更佳。
当第一屏蔽层13的自由端和第二屏蔽层23的自由端通过导电装置31进行连接时。导电装置31与第一屏蔽层13之间可以采用对接或搭接的方式进行连接。相应的,导电装置31与第二屏蔽层23之间可以采用对接或搭接的方式进行连接。以提升第一屏蔽层13和第二屏蔽层23之间的连接效果。
导电装置31的第一端与第一屏蔽层13的自由端连接,或者导电装置31的第二端与第二屏蔽层23的自由端连接,都可以参考上述第一屏蔽层13和第二屏蔽层23连接的方式,采用激光焊、超声波焊接、电阻焊、压力扩散焊或钎焊的方式进行焊接。
另外,在具体实施时,也可以在第一屏蔽层13、导电装置31和第二屏蔽层23相连接的位置以及导电装置31的外围设置绝缘保护层32。绝缘保护层32的左端可以与第一线缆10的第三保护层14进行对接或套接。绝缘保护层32的右端可以与第二线缆20的第四保护层24进行对接或套接,以提升线缆组件的可靠性,第一屏蔽层13、导电装置 31和第二屏蔽层23与外界的导电体之间产生导电接触。在具体配置时,绝缘保护层32可以是热缩管等具备良好绝缘性的结构件,可根据实际需求对绝缘保护层32的具体材质和种类进行适应性选择,本申请对此不作具体限定。
例如,如图4所示,在本发明提供的另一个实施例中,第一屏蔽层13和第二屏蔽层23之间通过导电装置31进行连接。
在进行连接时,第一屏蔽层13和导电装置31之间可以采用对接的方式进行连接;第二屏蔽层23和导电装置31之间也可以采用对接的方式进行连接。
具体来说,第一屏蔽层13的自由端具有外翻的部分,导电装置31的第一端(图中的左端)也具有外翻部分。将第一屏蔽层13的外翻部分与导电装置31左端的外翻部分进行对接,便可实现第一屏蔽层13和导电装置31之间的连接。第二屏蔽层23的自由端具有外翻的部分,导电装置31的第二端(图中的右端)也具有外翻部分。将第二屏蔽层23的外翻部分与导电装置31右端的外翻部分进行对接,便可实现第二屏蔽层23和导电装置31之间的连接。
其中,为了保证第一屏蔽层13和导电装置31之间的连接稳定性。第一屏蔽层13的外翻部分和导电装置31的外翻部分可以采用焊接的方式进行固定连接。例如,可以采用激光焊、超声波焊接、电阻焊、压力扩散焊或钎焊的方式进行焊接。其中,具体的焊接工艺本申请不作限制。另外,为了保证第二屏蔽层23和导电装置31之间的连接稳定性。第二屏蔽层23的外翻部分和导电装置31的外翻部分可以采用焊接的方式进行固定连接。例如,可以采用激光焊、超声波焊接、电阻焊、压力扩散焊或钎焊的方式进行焊接。其中,具体的焊接工艺本申请不作限制。
或者,如图5所示,第一屏蔽层13和导电装置31之间可以采用搭接的方式进行连接;第二屏蔽层23和导电装置31之间也可以采用搭接的方式进行连接。
具体来说,第一屏蔽层13的自由端可以设置在导电装置31的左端的外围,从而实现第一屏蔽层13和导电装置31之间的搭接。第二屏蔽层23的自由端可以设置在导电装置31的右端的外围,从而实现第二屏蔽层23和导电装置31之间的搭接。
其中,为了保证第一屏蔽层13和导电装置31之间的连接稳定性。第一屏蔽层13和导电装置31的搭接部分可以采用焊接的方式进行固定连接。例如,可以采用激光焊、超声波焊接、电阻焊、压力扩散焊或钎焊的方式进行焊接。其中,具体的焊接工艺本申请不作限制。另外,为了保证第二屏蔽层23和导电装置31之间的连接稳定性。第二屏蔽层23和导电装置31的搭接部分可以采用焊接的方式进行固定连接。例如,可以采用激 光焊、超声波焊接、电阻焊、压力扩散焊或钎焊的方式进行焊接。其中,具体的焊接工艺本申请不作限制。
其中,第一屏蔽层13和第二屏蔽层23及导电装置31的厚度可以介于0.003mm至27mm之间。
如表1所示。根据表中所示的测试结果可以得知:当第一屏蔽层13和第二屏蔽层23及导电装置31的厚度在0.003mm-27mm之间时,第一线缆10、第二线缆20的屏蔽效果即屏蔽性能会随厚度增加而增加,但当第一屏蔽层13和第二屏蔽层23及导电装置31的厚度超过27mm时,第一线缆10、第二线缆20的屏蔽能力变化较小,无明显提升;当第一屏蔽层13和第二屏蔽层23及导电装置31的厚度在0.003mm-27mm之间时,第一线缆10、第二线缆20的转弯半径增加数量会随厚度增加而增加,但当第一屏蔽层13和第二屏蔽层23及导电装置31的厚度超过27mm时,第一线缆10、第二线缆20的转弯半径增加数超过200mm,不利于实际加工,因此,优选第一屏蔽层13和第二屏蔽层23及导电装置31的厚度为0.003mm-27mm。
另外,导电装置31与第一屏蔽层13或第二屏蔽层23搭接或对接位置的最小截面面积为第一屏蔽层13和第二屏蔽层23中的最小截面面积的60%-260%。从而可以保证导电装置31与第一屏蔽层13或第二屏蔽层23之间的连接效果。
第一屏蔽层13和第二屏蔽层23的主要作用是将缆芯导通电流产生的涡流电流接地,避免电磁干扰的产生,缆芯截面面积越大,能够导通的电流越大,从而在屏蔽层内产生的涡流电流越大。当导电装置31和第一屏蔽层13或第二屏蔽层23连接位置的最小截面面积小于标准要求时,就会产生线缆连接位置局部生热,严重时会烧断导电装置31与第一屏蔽层13或第二屏蔽层23的连接位置,导致屏蔽性能下降甚至失效。
表6导电装置和第一屏蔽层或第二屏蔽层连接位置的最小截面面积与第一屏蔽层或第二屏蔽层中的最小截面面积的占比对导电装置与第一屏蔽层或第二屏蔽层之间的温度升高值的影响。
Figure PCTCN2021129457-appb-000007
表6
如上表所示,选取某个线径的线缆进行试验的数据。其中,标准要求为导电装置与第一屏蔽层13及第二屏蔽层23之间的温度升高值小于50℃。
从上表中可以看出,导电装置31和第一屏蔽层13或第二屏蔽层23连接位置的最小截面面积与第一屏蔽层13和第二屏蔽层23中的最小截面面积的占比小于60%时,导电装置31与第一屏蔽层13或第二屏蔽层23之间的温度升高不满足标准要求。
当导电装置31和第一屏蔽层13或第二屏蔽层23连接位置的最小截面面积与第一屏蔽层13和第二屏蔽层23中的最小截面面积的占比大于260%时,此时由于第一屏蔽层13及第二屏蔽层23的截面面积已经远大于涡流电流最小导通面积,因此导电装置31与第一屏蔽层13或第二屏蔽层23之间的温度升高值与占比为260%时基本相同,但所花费的成本和加工周期更高。
因此,优选导电装置31与第一屏蔽层13或第二屏蔽层23搭接或对接位置的最小截面面积与第一屏蔽层13和第二屏蔽层23中的最小截面面积的60%-260%。
在具体配置时,导电装置的一端和第一屏蔽层的自由端的连接位置的阻抗小于13.7mΩ,导电装置的第二端和第二屏蔽层的自由端的连接位置的阻抗小于13.7mΩ。
作为优选的方式,导电装置的一端和第一屏蔽层的自由端的连接位置的阻抗小于12.5mΩ,导电装置的第二端和第二屏蔽层的自由端的连接位置的阻抗小于12.5mΩ。
导电装置与屏蔽层连接位置的阻抗要尽可能小,这样屏蔽层产生的电流才会无阻碍的流回能量源或接地位置,如果导电装置与屏蔽层连接位置的阻抗较大,则会在导电装置与屏蔽层连接位置产生较大的电流,从而使线缆连接处产生较大的辐射。
试验方法为:测试仪器对第一线缆或第二线缆输出一个信号值(此数值为测试值2),在线缆组件外侧设置探测装置,此探测装置探测到一个信号值(此数值为测试值1)。屏蔽性能值=测试值2-测试值1。
表7导电装置和屏蔽层的连接位置的阻抗对屏蔽性能的影响。
Figure PCTCN2021129457-appb-000008
表7
如上表所示,选取某个线径的线缆进行试验的数据。其中,标准要求为导电装置与屏蔽层的连接位置的屏蔽性能值大于60dB。
当导电装置的一端和第一屏蔽层的自由端的连接位置的阻抗大于13.7mΩ,导电装置的第二端和第二屏蔽层的自由端的连接位置的阻抗大于13.7mΩ时,导电装置与屏蔽层的连接位置的屏蔽性能值小于60dB,不符合标准要求。而且,当导电装置的一端和第一屏蔽层的自由端的连接位置的阻抗小于12.5mΩ,导电装置的第二端和第二屏蔽层的自由端的连接位置的阻抗小于12.5mΩ时,导电装置与屏蔽层的连接位置的屏蔽性能值变化不大。因此,发明人设定导电装置的一端和第一屏蔽层的自由端的连接位置的阻抗小于13.7mΩ,导电装置的第二端和第二屏蔽层的自由端的连接位置的阻抗小于13.7mΩ。
作为优选的方式,导电装置的一端和第一屏蔽层的自由端的连接位置的阻抗小于12.5mΩ,导电装置的第二端和第二屏蔽层的自由端的连接位置的阻抗小于12.5mΩ。
在实际应用时,第一线缆10通常还可以包括第三保护层14(也可以理解为外皮);第二线缆20通常还包括第四保护层24(也可以理解为外皮)。
具体来说,第三保护层14设置在第一屏蔽层13的外侧,用于防止第一屏蔽层13与其他的部件产生导电接触,从而可以提升第一线缆10的使用安全性,另外,还能提升第一线缆10整体的防水、防尘等性能。
在具体实施时,第三保护层14可以由聚氯乙烯、聚氨酯、尼龙、聚丙烯、硅橡胶、交联聚烯烃、合成橡胶、聚氨酯弹性体、交联聚乙烯、聚乙烯中的一种或多种的组合绝缘材料所制成。
相应的,在第二线缆20中,第四保护层24设置在第二屏蔽层23的外侧,用于防止第二屏蔽层23与其他的部件产生导电接触,从而可以提升第二线缆20的使用安全性,另外,还能提升第二线缆20整体的防水、防尘等性能。
在具体实施时,第四保护层24可以由聚氯乙烯、聚氨酯、尼龙、聚丙烯、硅橡胶、交联聚烯烃、合成橡胶、聚氨酯弹性体、交联聚乙烯、聚乙烯中的一种或
在进行制作时,导电装置31可以是由铜、铝、石墨烯等导电材料制成的筒状结构;或者,导电装置31也可以是由金属丝编织而成的筒状结构,以使其具备一定的柔性,从而可以提升应用范围和抗震等性能。其中,导电装置31的材质和制作方式本发明不作限定。
实施例三:
本实施例提供一种线缆组件的制备方法。
在对线缆组件进行制备时,可以采用以下步骤:
请结合图1、图2和图10,该方法可以包括:
S10、提供第一线缆10。其中,第一线缆10包括第一缆芯11、第一保护层12和第一屏蔽层13,第一保护层12设置在第一缆芯11的外侧,第一屏蔽层13设置在第一保护层12的外侧。
S11、对第一线缆10的自由端(图1中第一线缆10的右端)的第一屏蔽层13和第一保护层12进行剥离,以裸露出第一缆芯11。
S20、提供第二线缆20。其中,第二线缆20包括第二缆芯21、第二保护层22和第二屏蔽层23,第二保护层22设置在第二缆芯21的外侧,第二屏蔽层23设置在第二保护层22的外侧。
S21、对第二线缆20的自由端(图1中第二线缆20的左端)的第二屏蔽层23和第二保护层22进行剥离,以裸露出第二缆芯21。
S22、将第一缆芯11的自由端与第二缆芯21的自由端进行连接,以实现第一缆芯11和第二缆芯21之间的电连接。
S23、将第一屏蔽层13的自由端和第二屏蔽层23的自由端进行连接。
其中,第一缆芯11和第二缆芯21之间可以采用激光焊、超声波焊接、电阻焊、压力扩散焊、钎焊或压接等方式进行连接。以提升第一缆芯11和第二缆芯21之间的连接强度。
另外,第一屏蔽层13和第二屏蔽层23之间可以采用激光焊、超声波焊接、电阻焊、压力扩散焊或钎焊等方式进行连接。以提升第一屏蔽层13和第二屏蔽层23之间的连接强度。
可以理解的是,在具体实施时,也可以采用其他的方式将第一缆芯11和第二缆芯21进行连接,以实现第一缆芯11和第二缆芯21之间的导电连接和机械连接。另外,也可以采用其他的方式将第一屏蔽层13和第二屏蔽层23进行连接,以实现第一屏蔽层13和第二屏蔽层23之间的导电连接和机械连接。
另外,在步骤S23之前该方法还可以包括:在第一缆芯11与第二缆芯21的连接处的外围设置隔离套筒30。以防止该连接处与导电装置31之间产生导电接触等不良情况。
其中,该隔离套筒30可以是热缩管,也可以是其他直接注塑成型在该连接处外侧的绝缘层。
另外,在一些实施方式中,当第一线缆10的外侧具有第三保护层14时,在进行步骤S11时,该步骤还包括对第一线缆10的第三保护层14进行剥离。相应的,当第二线缆20的外侧具有第四保护层24时,在进行步骤S21时,该步骤还包括对第二线缆20的第四保护层24进行剥离。
另外,如图11所示,本发明实施例还提供了另一种线缆组件的制备方法。该制备方法中,增加了步骤S30和步骤S31。
请结合参阅图4、图5和图11,具体来说,该方法还包括:
S30、提供导电装置31,并设置在第一缆芯11和第二缆芯21的部分外围。
S31、将导电装置31的一端(图5中的左端)和第一屏蔽层13的自由端(图中的右端)进行连接、将导电装置31的另一端(图5中的右端)和第二屏蔽层23的自由端(图中的左端)进行连接。
其中,导电装置31和第一屏蔽层13之间可以采用激光焊、超声波焊接、电阻焊、压力扩散焊或钎焊等方式进行焊接。以提升导电装置31和第一屏蔽层13之间的连接强度。相应的,导电装置31和第二屏蔽层23之间也可以采用激光焊、超声波焊接、电阻焊、压力扩散焊或钎焊等方式进行焊接。以提升导电装置31和第二屏蔽层23之间的连接强度。
可以理解的是,在具体实施时,也可以采用其他的方式将导电装置31和第一屏蔽层13进行连接、将导电装置31和第二屏蔽层23进行连接。
另外,在步骤S31之前该方法还可以包括:在第一缆芯11与第二缆芯21的连接处的外围设置隔离套筒30。以防止该连接处与导电装置31之间产生导电接触等不良情况。
其中,该隔离套筒30可以是热缩管,也可以是其他直接注塑成型在该连接处外侧的绝缘层。
另外,在一些实施方式中,当第一线缆10的外侧具有第三保护层14时,在进行步骤S11时,该步骤还包括对第一线缆10的第三保护层14进行剥离。相应的,当第二线缆20的外侧具有第四保护层24时,在进行步骤S21时,该步骤还包括对第二线缆20的第四保护层24进行剥离。
可以理解的是,在对线缆组件进行制备时,其制作顺序可以根据实际情况进行适应性调整,另外,也可以增加或省略部分步骤,本申请对此不作具体限定。
显然,本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样,倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内,则本发明也意图包含这些改动和变型在内。

Claims (29)

  1. 一种线缆组件,其特征在于,包括:
    第一线缆,包括第一缆芯和第一屏蔽层,所述第一缆芯的外围包覆有第一保护层,所述第一屏蔽层设置在所述第一保护层的外侧;
    第二线缆,包括第二缆芯和第二屏蔽层,所述第二缆芯的外围包覆有第二保护层,所述第二屏蔽层设置在所述第二保护层的外侧;
    所述第一缆芯的自由端与所述第二缆芯的自由端连接,所述第一屏蔽层的自由端与所述第二屏蔽层的自由端连接。
  2. 根据权利要求1所述的线缆组件,其特征在于,所述第一屏蔽层和所述第二屏蔽层的连接位置为对称连接设置。
  3. 根据权利要求1所述的线缆组件,其特征在于,所述第一屏蔽层和所述第二屏蔽层的连接位置为360°连接设置。
  4. 根据权利要求1所述的线缆组件,其特征在于,所述第一屏蔽层的自由端与所述第二屏蔽层的自由端搭接或对接。
  5. 根据权利要求1所述的线缆组件,其特征在于,所述线缆组件还包括导电装置,所述导电装置设置在所述第一缆芯和所述第二缆芯的部分外围,且所述导电装置的第一端与所述第一屏蔽层的自由端连接,所述导电装置的第二端与所述第二屏蔽层的自由端连接。
  6. 根据权利要求5所述的线缆组件,其特征在于,所述导电装置的一端和所述第一屏蔽层的自由端的连接位置为对称连接设置,所述导电装置的第二端和所述第二屏蔽层的自由端的连接位置为对称连接设置。
  7. 根据权利要求5所述的线缆组件,其特征在于,所述导电装置的一端和所述第一屏蔽层的自由端的连接位置为360°连接设置,所述导电装置的第二端和所述第二屏蔽层的自由端的连接位置为360°连接设置。
  8. 根据权利要求5所述的线缆组件,其特征在于,所述导电装置与所述第一屏蔽层搭接或对接。
  9. 根据权利要求5所述的线缆组件,其特征在于,所述导电装置与所述第二屏蔽层搭接或对接。
  10. 根据权利要求5所述的线缆组件,其特征在于,所述第一屏蔽层、所述第二屏蔽层和所述导电装置的外围设有绝缘保护层。
  11. 根据权利要求1所述的线缆组件,其特征在于,所述第一缆芯具有伸出于所述第一保护层的伸出段,所述第二缆芯具有伸出于所述第二保护层的伸出段。
  12. 根据权利要求11所述的线缆组件,其特征在于,所述线缆组件还包括隔离套筒,所述隔离套筒设置在所述第一缆芯的伸出段和所述第二缆芯的伸出段的外围。
  13. 根据权利要求12所述的线缆组件,其特征在于,所述隔离套筒的厚度至少大于所述第一保护层的厚度或所述第二保护层的厚度中的一个。
  14. 根据权利要求12所述的线缆组件,其特征在于,所述隔离套筒的一端与所述第一保护层对接,所述隔离套筒的另一端与所述第二保护层对接。
  15. 根据权利要求1所述的线缆组件,其特征在于,所述第一缆芯的自由端与所述第二缆芯的自由端搭接或对接。
  16. 根据权利要求15所述的线缆组件,其特征在于,所述搭接或对接位置的最小截面面积大于或等于所述第一缆芯和所述第二缆芯中的最小截面面积。
  17. 根据权利要求5所述的线缆组件,其特征在于,所述第一屏蔽层或所述第二屏蔽层或所述导电装置的厚度介于0.003mm至27mm之间。
  18. 根据权利要求1-17中任一所述的线缆组件,其特征在于,所述第一屏蔽层的自由端与所述第二屏蔽层的自由端搭接或对接位置的最小截面面积为所述第一屏蔽层和所述第二屏蔽层中的最小截面面积的60%-260%。
  19. 根据权利要求5-10或17中任一所述的线缆组件,其特征在于,所述导电装置与所述第一屏蔽层或所述第二屏蔽层搭接或对接位置的最小截面面积为所述第一屏蔽层和所述第二屏蔽层中的最小截面面积的60%-260%。
  20. 根据权利要求1所述的线缆组件,其特征在于,所述第一屏蔽层和所述第二屏蔽层的连接位置的阻抗小于13.7mΩ。
  21. 根据权利要求1所述的线缆组件,其特征在于,所述第一屏蔽层和所述第二屏蔽层的连接位置的阻抗小于12.5mΩ。
  22. 根据权利要求5所述的线缆组件,其特征在于,所述导电装置的第一端和所述第一屏蔽层的自由端的连接位置的阻抗小于13.7mΩ,所述导电装置的第二端和所述第二屏蔽层的自由端的连接位置的阻抗小于13.7mΩ。
  23. 根据权利要求5所述的线缆组件,其特征在于,所述导电装置的第一端和所述第一屏蔽层的自由端的连接位置的阻抗小于12.5mΩ,所述导电装置的第二端和所述第二屏蔽层的自由端的连接位置的阻抗小于12.5mΩ。
  24. 根据权利要求1所述的线缆组件,其特征在于,所述第一线缆还包括第三保护层,所述第二线缆还包括第四保护层;
    所述第三保护层设置在所述第一屏蔽层的外侧,所述第四保护层设置在所述第二屏蔽层的外侧。
  25. 一种线缆组件的制备方法,其特征在于,包括:
    提供第一线缆,所述第一线缆包括第一缆芯、第一保护层和第一屏蔽层,所述第一保护层设置在所述第一缆芯的外侧,所述第一屏蔽层设置在所述第一保护层的外侧;
    对所述第一线缆的第一端的第一屏蔽层和第一保护层进行剥离,以裸露出所述第一缆芯;
    提供第二线缆,所述第二线缆包括第二缆芯、第二保护层和第二屏蔽层,所述第二保护层设置在所述第二缆芯的外侧,所述第二屏蔽层设置在所述第二保护层的外侧;
    对所述第二线缆的第一端的第二屏蔽层和第二保护层进行剥离,以裸露出所述第二缆芯;
    将所述第一缆芯的自由端与所述第二缆芯的自由端进行连接;
    将所述第一屏蔽层的自由端与所述第二屏蔽层的自由端进行连接。
  26. 根据权利要求25所述的制备方法,其特征在于,将所述第一缆芯的自由端与所述第二缆芯的自由端进行连接具体包括:
    采用焊接或压接工艺将所述第一缆芯的自由端与所述第二缆芯的自由端进行连接。
  27. 根据权利要求25所述的制备方法,其特征在于,将所述第一屏蔽层的自由端与所述第二屏蔽层的自由端进行连接具体包括:
    采用焊接工艺将所述第一屏蔽层的自由端与所述第二屏蔽层的自由端进行连接。
  28. 根据权利要求25所述的制备方法,其特征在于,将所述第一屏蔽层的自由端与所述第二屏蔽层的自由端进行连接具体包括:
    提供导电装置,并设置在所述第一缆芯和所述第二缆芯的部分外围,采用焊接工艺将所述导电装置的第一端与所述第一屏蔽层的自由端进行连接、将所述导电装置的第二端与所述第二屏蔽层的自由端进行连接。
  29. 根据权利要求28所述的制备方法,其特征在于,在将所述导电装置的第一端与所述第一屏蔽层的自由端进行连接、将所述导电装置的第二端与所述第二屏蔽层的自由端进行连接之前,所述方法还包括:
    在所述第一缆芯与所述第二缆芯的连接处的外围设置隔离套筒。
PCT/CN2021/129457 2021-03-12 2021-11-09 一种线缆组件和线缆组件的制备方法 WO2022188449A1 (zh)

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