WO2022179193A1 - 显示面板、显示装置及制备方法 - Google Patents

显示面板、显示装置及制备方法 Download PDF

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Publication number
WO2022179193A1
WO2022179193A1 PCT/CN2021/130560 CN2021130560W WO2022179193A1 WO 2022179193 A1 WO2022179193 A1 WO 2022179193A1 CN 2021130560 W CN2021130560 W CN 2021130560W WO 2022179193 A1 WO2022179193 A1 WO 2022179193A1
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WIPO (PCT)
Prior art keywords
display area
layer
emitting device
light
area
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PCT/CN2021/130560
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English (en)
French (fr)
Inventor
王倩
邓伟
魏悦
杨玉清
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京东方科技集团股份有限公司
成都京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US17/797,837 priority Critical patent/US20240206270A1/en
Publication of WO2022179193A1 publication Critical patent/WO2022179193A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present disclosure relates to the field of display technology, and in particular, to a display panel, a display device and a manufacturing method.
  • the area of the display panel corresponding to the camera is required to be set as a display area that can transmit light.
  • the entire display panel includes a camera area, a normal display area surrounding the camera area, and a transition area between the normal display area and the camera area.
  • the The light emitting device unit is connected to the driving unit located in the transition area through the indium tin oxide ITO lead, and the driving unit located in the transition area is driven to emit light.
  • the ITO lead is fabricated on the organic substrate which is a flat layer, but the bonding force between the ITO lead film formed on the organic substrate and the organic substrate is poor, and the ITO lead film is prone to fall off, and the organic substrate is in the Outgassing and other phenomena are easy to occur in a vacuum environment, which affects the deposition of thin films and makes the resistivity of ITO leads prepared on organic substrates too large.
  • the polymer chains in the organic substrate are bombarded by particles to crack out carbon, which produces compounds with the film layer, resulting in blackening of the substrate, which seriously affects the service life and luminous efficiency of under-screen camera products.
  • the purpose of the technical solution of the present disclosure is to provide a display panel, a display device and a manufacturing method, which are used to solve the problem that the ITO lead film layer is easy to fall off, the resistivity is too high, and the substrate is prone to blackening in the display panel using the under-screen camera in the prior art.
  • the problem is to provide a display panel, a display device and a manufacturing method, which are used to solve the problem that the ITO lead film layer is easy to fall off, the resistivity is too high, and the substrate is prone to blackening in the display panel using the under-screen camera in the prior art. The problem.
  • An embodiment of the present disclosure provides a display panel, including a transparent substrate, a first display area and a second display area located on the transparent substrate, and a plurality of first display areas arranged in an array are provided on the first display area.
  • a light-emitting device unit wherein a plurality of first driving units arranged in an array are arranged on the second display area, wherein:
  • Each of the first driving units is respectively connected to one of the first light-emitting device units through connecting wires, and the corresponding first light-emitting device units are driven to emit light by the first driving unit; wherein, the connecting wires are made of inorganic on the protective layer.
  • a flat layer is formed on a side of the connecting lead away from the transparent substrate, the flat layer is connected to the connecting lead and covers the entire first display area and the second display area.
  • the first light-emitting device unit includes a first anode, a first cathode, and a first anode and a first anode disposed on a side of the flat layer away from the transparent substrate. a first light-emitting layer between the first cathodes; the first driving unit includes a first active layer, a first gate and a first source disposed between the transparent substrate and the inorganic protective layer /drain layer;
  • connection lead is connected to the source or drain of the first source/drain layer through a first via penetrating the inorganic protective layer, and the first anode is connected to the source or drain of the first source/drain layer through a The second via hole is connected with the connecting lead.
  • the display panel wherein the display panel further includes a third display area, the third display area is arranged around the first display area, and the second display area is arranged on the first display area between the display area and the third display area;
  • the third display area is provided with a plurality of pixel structures arranged in an array, and each pixel structure includes a second light-emitting device unit and a second driving unit respectively;
  • the distribution density of the plurality of pixel structures on the third display area is greater than the distribution density of the plurality of the first light emitting device units on the first display area.
  • the second driving unit includes a second active layer, a second gate and a second active layer, a second gate, and a second light emitting device, which are arranged in sequence between the transparent substrate and the second light-emitting device unit.
  • a source/drain layer wherein the inorganic protective layer extends to the third display region and covers the third source/drain layer.
  • a flat layer is provided on a side away from the inorganic protective layer, and the second light emitting device unit includes a flat layer located far away from the flat layer.
  • a second anode, a second light-emitting layer, and a second cathode are arranged on one side of the transparent substrate in sequence, wherein the second anode is connected to the second anode through a third via penetrating the flat layer and the inorganic protective layer. The source or drain connection of the second source/drain layer.
  • the second display area is further provided with a plurality of pixel structures arranged in an array, and the distribution density of the plurality of pixel structures on the second display area is smaller than that of the first display area.
  • the inorganic protective layer is a silicon oxide layer.
  • An embodiment of the present disclosure further provides a display device, including the display panel described in any one of the above.
  • An embodiment of the present disclosure also provides a preparation method, wherein, applied to the display panel according to any one of the above, the method includes:
  • connection leads are fabricated on the inorganic protective layer, and the first end of each of the connection leads is connected to one of the first driving units through a via hole penetrating the inorganic protective layer;
  • a plurality of first light emitting device units arranged in an array are fabricated, and each of the first light emitting device units is connected to a second end of one of the connecting wires.
  • the method after fabricating a plurality of connecting leads on the inorganic protective layer, the method further includes:
  • a flat layer is made on the connection lead; the flat layer covers the entire first area and the second area;
  • a plurality of the first light emitting device units are fabricated on the flat layer, and are respectively connected to the second end of one of the connecting wires through via holes penetrating the first light emitting device units.
  • the preparation method wherein the method further comprises:
  • the formed inorganic protective layer also extends to cover a plurality of the second driving units;
  • the preparation method wherein, fabricating a plurality of connection leads on the inorganic protective layer, comprising:
  • a plurality of connecting leads are fabricated by ITO sputtering film formation, and oxygen UV irradiation and oxygen plasma processes are performed during the sputtering process.
  • FIG. 1 is a schematic plan view of a display panel according to an embodiment of the disclosure
  • FIG. 2 is a schematic diagram illustrating the distribution structure of each device unit on different display areas on the display panel according to the embodiment of the present disclosure
  • FIG. 3 is a schematic cross-sectional structure diagram illustrating a display panel according to an embodiment of the present disclosure
  • FIG. 4 is a schematic flowchart illustrating a method for fabricating a display panel according to an embodiment of the present disclosure.
  • the embodiment of the present disclosure provides a display panel, which is connected to the light-transmitting area of the camera.
  • the connecting leads connected to the light-emitting device units are fabricated on the inorganic protective layer, so as to increase the bonding force with the connecting leads, reduce the resistivity, and avoid the problem of blackening of the substrate.
  • the display panel includes a first display area 11 , a second display area 12 and a third display area 13 .
  • the first display area 11 and the second display area 12 are formed as light-transmitting display areas, wherein when the display panel is installed on the electronic device, inside the electronic device, the position corresponding to the first display area 11 can be installed.
  • the photosensitive element is a camera, which is used to collect images through the first display area 11, forming a display structure of a camera under the screen.
  • the third display area 13 is arranged around the first display area 11, the second display area 12 is located between the first display area 11 and the third display area 13, and the second display area 12 is respectively connected to the first display area 11 and the third display area 13.
  • the third display area 13 is connected to form a transition area between the first display area 11 and the third display area 13 .
  • the first display area 11 , the second display area 12 and the third display area 13 are combined to form the entire display area of the display panel.
  • the entire display area of the display panel may be a light-transmitting display area, or only the first display area 11 and the second display area 12 are combined to form a light-transmitting display area of the display panel, which is used to realize the under-screen camera.
  • Image Acquisition In one embodiment, the display panel is an OLED display panel.
  • the first display area 11 , the second display area 12 and the third display area 13 are fabricated on a transparent substrate.
  • the first display area 11 is provided with a plurality of first light emitting device units 100 arranged in an array
  • the second display area 12 is provided with a plurality of arrays Arranged first drive units 200 .
  • a plurality of first light-emitting device units 100 are made of light-transmitting materials to form a light-transmitting effect in the first display area 11;
  • the first light emitting device unit 100 is not limited to be made of light-transmitting materials, and the light-transmitting effect of the first display area 11 can also be formed by utilizing the light-transmitting function of the gaps between the plurality of first light-emitting device units 100 distributed at intervals.
  • a plurality of first driving units 200 are made of light-transmitting materials to form a light-transmitting effect of the second display area 12; of course, optionally, the first driving units 200 are not limited to only The light-transmitting material can be used, and the light-transmitting effect of the second display area 12 can also be formed by using the light-transmitting function of the intervals between the plurality of first driving units 200 distributed at intervals.
  • each of the first driving units 200 in the second display area 12 is connected to one of the first light-emitting device units 100 through the connecting wires 300 respectively, and the corresponding first light-emitting device unit can be driven by the first driving unit 200 100 glows,
  • the display panel is an OLED display panel
  • the first light-emitting device unit 100 is an OLED light-emitting unit in an OLED pixel unit
  • the first driving unit 200 is an OLED pixel unit for driving the OLED light-emitting unit to emit light drive unit.
  • the first light emitting device unit 100 and the first driving unit 200 for driving the first light emitting device unit 100 to emit light are distributed in different areas to meet the requirements of the first display area 11 and the second display area 12
  • the plurality of first light emitting device units 100 and the plurality of first driving units 200 are connected in a one-to-one correspondence to realize the light emission of the first light emitting device units 100 in the first display area 11 for use in Image display of the first display area 11 .
  • the second display area 12 and the third display area 13 are respectively provided with a plurality of pixel structures 400 arranged in an array, that is, pixel units.
  • the second display area 12 and the third display area 13 can realize image display through the set pixel structure 400 respectively.
  • the distribution density of the plurality of pixel structures 400 provided on the second display area 12 is smaller than the distribution density of the plurality of pixel structures 400 provided on the third display area 13 .
  • the third display area 13 is formed as a normal display area of the display panel, and the second display area 12 utilizes the space between the plurality of pixel structures 400 provided, or the pixel structures 400 and the first driving unit 200 on the second display area 12 It is made of light-transmitting material and can be formed into a light-transmitting display area to meet the requirements of displaying images and transmitting light.
  • the distribution density of the plurality of first light emitting device units 100 arranged on the first display area 11 is smaller than the distribution density of the plurality of pixel structures 400 arranged on the third display area 13 , and the first display area 11 utilizes the plurality of arranged pixel structures 400 .
  • the interval between the first light emitting device units 100, or the plurality of first light emitting device units 100 on the first display area 11 are made of light-transmitting material, and can be formed as a light-transmitting display area to meet the requirements of displaying images and transmitting light.
  • FIG. 3 is a schematic cross-sectional structure diagram of a display panel according to an embodiment of the present disclosure. As shown in FIG. 3 , on the first display area 11 and the second display area 12 , the connecting leads 300 and the first light-emitting device in the first display area 11 are connected The unit 100 and the first driving unit 200 of the second display area 12 are respectively connected.
  • the connecting leads 300 are fabricated on the inorganic protective layer 500 , that is, when the display panel is fabricated, the connecting leads 300 are fabricated using the inorganic protective layer 500 as a substrate.
  • the connection lead 300 is made of transparent ITO material.
  • the ITO lead film layer is made on the organic material substrate, and the bonding force between the ITO lead film layer made on the organic material substrate and the substrate is poor, and the ITO lead film layer is prone to occur. It falls off, and there is a problem that the resistivity of the ITO lead is too large, and there is also a problem that the polymer chain in the organic material substrate is bombarded by particles to decompose carbon, which produces compounds with the film layer, resulting in the blackening of the substrate.
  • the connecting leads are fabricated on the inorganic protective layer 500 , and the inorganic protective layer 500 with better compactness is used as the base to fabricate the connecting leads 300 , so that the connecting leads 300 and the inorganic protective layer 500 are formed between the connecting leads 300 and the inorganic protective layer 500 .
  • the bonding force is better, so as to greatly reduce the falling off of the connection lead 300, and to avoid problems such as outgassing, black spots and increase in resistivity of the organic polymer material during the preparation of the connection lead 300.
  • the inorganic protective layer is a silicon oxide (SiOx) layer.
  • each display area on the display panel according to the embodiment of the present disclosure will be described in detail below with reference to FIG. 3 .
  • the first display area 11 , the second display area 12 and the third display area 13 are all fabricated on the transparent substrate 1 and distributed in different areas on the transparent substrate 1 .
  • the second driving unit is connected with the second light-emitting device unit to form a pixel structure, and the second driving unit is used for driving the second light-emitting device unit to emit light.
  • the second driving unit includes a second active layer 131, a gate insulating layer 132, a second gate electrode 133, an interlayer insulating layer 134, a second Source/drain layer 135 .
  • the inorganic protective layer 500 is disposed on the second source/drain layer 135 , and the planarization layer 600 is formed on the inorganic protective layer 500 .
  • the second light emitting device unit includes a second anode 136 , a second light emitting layer 137 , and a second cathode 138 disposed in sequence on the flat layer 600 , and the second light emitting layer 137 is disposed in the pixel defining layer 139 .
  • the second anode 136 is connected to the source or drain of the second source/drain layer 135 through a third via penetrating the planarization layer 600 and the inorganic protective layer 500, so that the second driving unit can drive the second The light emitting device unit emits light.
  • the first driving unit 200 includes a first active layer 201 , a gate insulating layer 132 , a first gate electrode 202 , an interlayer insulating layer 134 , and a first source disposed in sequence from the transparent substrate 1 to the direction away from the transparent substrate 1 . /Drain layer 203.
  • an inorganic protective layer 500 is formed on the first source/drain layer 203 , and a connecting lead 300 is formed on the side of the inorganic protective layer 500 away from the first source/drain layer 203 , and the connecting lead 300 is far from the inorganic protective layer.
  • a flat layer 600 is formed on one side of the layer 500 .
  • the gate insulating layer 132 of the third display area 13 extends to the second display area 12, and is formed as the gate insulating layer 132 of the second display area 12; the interlayer insulating layer 134 of the third display area 13 extends to the second display area 12.
  • the display area 12 is formed as the interlayer insulating layer 134 of the second display area 12 .
  • the inorganic protective layer 500 and the flat layer 600 entirely cover the first display area 11 , the second display area 12 and the third display area 13 .
  • the first active layer 201 and the second active layer 131, the first gate 202 and the second gate 133, the first source/drain layer 203 and the The second source/drain layers 135 are respectively the same layer, and can optionally be formed by the same patterning process.
  • the buffer layer 2 , the gate insulating layer 132 , and the interlayer insulating layer extending from the second display area 12 to the first display area 11 are sequentially formed from the transparent substrate 1 to the direction away from the transparent substrate 1 .
  • the first light emitting device unit 100 is fabricated on the side of the flat layer 600 away from the transparent substrate 1 .
  • the first light emitting device unit 100 includes a first anode 101 , a first light emitting layer 102 and a first cathode 103 arranged in sequence on the side of the flat layer 600 away from the transparent substrate 1 , and the second light emitting layer 102 is arranged on the pixel defining layer 139.
  • the second cathode 138 may extend to the first display area 11 to form the first cathode 103; of course, the first cathode 103 and the second cathode 108 may also be different patterns of the same layer.
  • the connecting lead 300 is connected to the source or drain of the first source/drain layer 203 through the first via penetrating the inorganic protective layer 500, and the first anode 101 is connected to the connection lead 300 through a second via hole penetrating the planarization layer 600 .
  • the first anode 101 , the first light-emitting layer 102 and the first cathode 103 of the first display area 12 are respectively connected with the second anode 136 , the second light-emitting layer 137 and The second cathodes 138 are disposed in the same layer and are respectively formed by the same patterning process.
  • FIG. 3 is a schematic diagram illustrating the structure of the connection lead 300 connecting the first light emitting device unit 100 of the first display area 12 and the second driving unit 200 of the second display area 12 .
  • a plurality of pixel structures arranged in an array may also be arranged, and the pixel structures arranged are the same as those arranged in the third display area 13
  • the structure of the pixel structure is the same, and each layer is formed by the same patterning process, which will not be described in detail here.
  • capacitor structures 700 are respectively provided, which are used to provide the voltage in the light-emitting stage of the pixel structure.
  • the capacitor structure 700 includes a first electrode layer 701 , a second electrode layer 702 and a signal transmission layer 703 connected to the first electrode layer 701 , which are oppositely disposed.
  • the first electrode layer 701 and the first gate electrode 202 and the second gate electrode 133 are arranged in the same layer, and can be formed by the same patterning process, and the gate insulating layer 132 can be arranged in two layers, wherein the first electrode layer 701
  • the gate insulating layer 132 may be disposed on the first gate insulating layer close to the transparent substrate 1
  • the second electrode layer 702 may be disposed on the second gate insulating layer far away from the transparent substrate 1 to form an opposite structure.
  • the signal transmission layer 703 is the same layer as the first source/drain layer 203 and the second source/drain layer 135, and is formed by the same patterning process.
  • the signal transmission layer 703 penetrates through the interlayer insulating layer 134 and the second gate
  • the via hole of the insulating layer is connected to the first electrode layer 701 .
  • the inorganic protective layer 500 covers the entire display area of the display panel and is fabricated on the source/drain layers of the driving unit.
  • the connection leads 300 are fabricated with the inorganic protective layer 500 as the base.
  • a film may be formed by ITO sputtering, and during the sputtering process, oxygen UV irradiation and oxygen plasma processes are performed to reduce the production of ITO.
  • the resistivity of the connection lead 300 is greatly increased, and the bonding with the inorganic protective layer 500 is greatly increased.
  • the display panel according to the embodiment of the present disclosure can significantly reduce water and oxygen corrosion by using an inorganic protective layer as a substrate for the connection lead 300 .
  • the resistivity of the connecting lead 300 made of ITO is related to the ITO square resistance, the thickness of the ITO connecting lead, and the line width of the ITO connecting lead. can be between 150 angstroms and 200 angstroms in thickness.
  • the use of the display panel according to the embodiment of the present disclosure can reduce the resistivity of the ITO connection lead compared to the organic layer, and further reduce the thickness of the ITO connection lead under the same resistivity condition.
  • the display device includes the display panel of the above-mentioned implementation structure.
  • Another aspect of the embodiments of the present disclosure further provides a preparation method, and the preparation method is applied to the display panel described in any one of the above, as shown in FIG. 4 , the method includes:
  • connection leads on the inorganic protective layer, and a first end of each of the connection leads is connected to one of the first driving units through a via hole penetrating the inorganic protective layer;
  • the preparation method also includes:
  • the formed inorganic protective layer also extends to cover a plurality of the second driving units;
  • the first area, the second area, and the third area on the transparent substrate are respectively formed as the first display area 11 , the second display area 12 and the third area, respectively.
  • Display area 13 the first area, the second area, and the third area on the transparent substrate are respectively formed as the first display area 11 , the second display area 12 and the third area, respectively.
  • multiple third drive units arranged in arrays are also fabricated on the second area;
  • the synchronization process of fabricating multiple arrays of first light-emitting device units on the first area, and also fabricating multiple arrays of third light-emitting device units, multiple third driving units and multiple third light-emitting devices on the second area The units are connected in one-to-one correspondence to form a plurality of pixel structures disposed on the second area.
  • the method further includes:
  • a flat layer is made on the connection lead; the flat layer covers the entire first area and the second area;
  • a plurality of the first light emitting device units are fabricated on the flat layer, and are respectively connected to the second end of one of the connecting wires through via holes penetrating the first light emitting device units.
  • the flat layer also covers the third region.
  • the insulating layer when the first driving unit is fabricated includes a buffer layer, a gate insulating layer, an interlayer insulating layer, a pixel defining layer, and the like.
  • the specific structures of the first display area, the second display area, and the third display area may be shown in combination with FIG. 3 , wherein the fabrication of each film layer may be fabricated by a process such as exposure or evaporation, which is not described here.
  • a process such as exposure or evaporation
  • a film can be formed by ITO sputtering, and during the sputtering process, oxygen UV irradiation and oxygen plasma processes are performed to reduce the connecting lead made of ITO. resistivity and greatly increase the bond with the inorganic protective layer.

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Abstract

本公开提供一种显示面板、显示装置及制备方法。该显示面板包括透明衬底和位于所述透明衬底上的第一显示区域、第二显示区域，所述第一显示区域上设置有多个阵列排布的第一发光器件单元，所述第二显示区域上设置有多个阵列排布的第一驱动单元，每一所述第一驱动单元分别通过连接引线连接至其中一第一发光器件单元，通过所述第一驱动单元驱动相应的所述第一发光器件单元发光；其中，所述连接引线制作于无机保护层上。

Description

显示面板、显示装置及制备方法
本申请要求在先申请日为2021年2月26日，申请号为202110220398.X专利申请的优先权。
技术领域
本公开涉及显示技术领域，尤其是指一种显示面板、显示装置及制备方法。
背景技术
目前，随着全屏幕显示的市场发展需求，将摄像头集成设置于显示面板的下方，成为当前显示装置结构设计的主要方向。
对于集成于显示面板下方的摄像头，为实现拍摄功能，要求显示面板对应摄像头的区域设置为能够透光的显示区域。基于该结构要求，通常整个显示面板包括摄像头区域、围绕摄像头区域的正常显示区域和位于正常显示区域与摄像头区域之间的过渡区域，为同时保证摄像头区域的正常显示和透光功能，摄像头区域的发光器件单元通过铟锡氧化物ITO引线连接至位于过渡区域的驱动单元，通过该位于过渡区域的驱动单元驱动发光。
通常技术中，ITO引线制作于为平坦层的有机基底上，但制作于有机基底上的ITO引线膜层与有机基底之间的结合力差，容易出现ITO引线膜层的脱落，且有机基底在真空环境中容易出现放气等现象，影响薄膜的沉积，使有机基底上制备的ITO引线电阻率偏大。同时有机基底中的高分子链受粒子轰击裂解出碳，与膜层产生化合物，导致基底发黑，严重影响屏下摄像头产品的使用寿命和发光效率。
发明内容
本公开技术方案的目的是提供一种显示面板、显示装置及制备方法，用于解决现有技术采用屏下摄像头的显示面板中，ITO引线膜层容易脱落、电阻率偏大和容易产生基底发黑的问题。
本公开实施例提供一种显示面板，包括透明衬底和位于所述透明衬底上的 第一显示区域、第二显示区域，所述第一显示区域上设置有多个阵列排布的第一发光器件单元，所述第二显示区域上设置有多个阵列排布的第一驱动单元，其中：
每一所述第一驱动单元分别通过连接引线连接至其中一第一发光器件单元，通过所述第一驱动单元驱动相应的所述第一发光器件单元发光；其中，所述连接引线制作于无机保护层上。
可选地，所述的显示面板，其中，所述连接引线远离所述透明衬底的一侧制作有平坦层，所述平坦层与所述连接引线连接，且覆盖整个所述第一显示区域和所述第二显示区域。
可选地，所述的显示面板，其中所述第一发光器件单元包括在所述平坦层远离所述透明衬底的一侧设置的第一阳极、第一阴极及位于所述第一阳极与所述第一阴极之间的第一发光层；所述第一驱动单元包括设置于所述透明衬底与所述无机保护层之间的第一有源层、第一栅极和第一源/漏极层；
其中，所述连接引线通过穿透所述无机保护层的第一过孔与所述第一源/漏极层的源极或漏极连接，所述第一阳极通过穿透所述平坦层的第二过孔与所述连接引线连接。
可选地，所述的显示面板，其中所述显示面板还包括第三显示区域，所述第三显示区域围绕所述第一显示区域设置，且所述第二显示区域设置于所述第一显示区域与所述第三显示区域之间；
其中，所述第三显示区域上设置有多个阵列排布的像素结构，每一像素结构分别包括第二发光器件单元和第二驱动单元；
所述第三显示区域上多个像素结构的分布密度大于所述第一显示区域上多个所述第一发光器件单元的分布密度。
可选地，所述的显示面板，其中所述第二驱动单元包括在所述透明衬底与所述第二发光器件单元之间依次设置的第二有源层、第二栅极和第二源/漏极层，其中所述无机保护层延伸至所述第三显示区域，覆盖所述第三源/漏极层。
可选地，所述的显示面板，其中，在所述第三显示区域，远离所述无机保护层的一侧设置有平坦层，所述第二发光器件单元包括位于所述平坦层远离所述透明衬底一侧、且依次设置的第二阳极、第二发光层和第二阴极，其中所述第二阳极通过穿透所述平坦层和所述无机保护层的第三过孔与所述第二源/漏 极层的源极或漏极连接。
可选地，所述的显示面板，其中，所述第二显示区域上还设置有多个阵列排布的像素结构，且所述第二显示区域上多个像素结构的分布密度小于所述第三显示区域上多个像素结构的分布密度。
可选地，所述的显示面板，其中，所述无机保护层为氧化硅层。
本公开实施例还提供一种显示装置，其中，包括如上任一项所述的显示面板。
本公开实施例还提供一种制备方法，其中，应用于如上任一项所述的显示面板，所述方法包括：
在透明衬底的第二区域上制作多个阵列排布的第一驱动单元，其中制作所述第一驱动单元时的绝缘层延伸至所述透明衬底的第一区域；
在所述第一驱动单元上制作无机保护层，且所述无机保护层覆盖整个所述第一区域和所述第二区域；
在所述无机保护层上制作多个连接引线，每一所述连接引线的第一端通过穿透所述无机保护层的过孔与其中一个第一驱动单元连接；
在所述第一区域，制作多个阵列排布的第一发光器件单元，且每一所述第一发光器件单元与一个所述连接引线的第二端连接。
可选地，所述的制备方法，其中，在所述无机保护层上制作多个连接引线之后，所述方法还包括：
在所述连接引线上制作平坦层；所述平坦层覆盖整个所述第一区域和所述第二区域；
其中多个所述第一发光器件单元制作于所述平坦层上，且分别通过穿透所述第一发光器件单元的过孔与一个所述连接引线的第二端连接。
可选地，所述的制备方法，其中，所述方法还包括：
在透明衬底的第二区域上制作多个阵列的第一驱动单元的同步过程，在透明衬底的第三区域上制作形成多个阵列的第二驱动单元；
在所述第一驱动单元上制作无机保护层时，所制作的无机保护层还延伸覆盖多个所述第二驱动单元；
在透明衬底的第一区域上制作多个阵列的第一发光器件单元的同步过程，在所述第三区域上制作形成多个阵列的第二发光器件单元。
可选地，所述的制备方法，其中，在所述无机保护层上制作多个连接引线，包括：
通过ITO溅射成膜制作多个连接引线，且溅射过程中进行氧气UV照射及氧气等离子体工艺。
附图说明
为了更清楚地说明本公开文本实施例或相关技术中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开文本的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本公开实施例所述显示面板的平面结构示意图；
图2为说明本公开实施例所述显示面板上不同显示区域上各器件单元的分布结构示意图；
图3为说明本公开实施例所述显示面板的剖面结构示意图；
图4为说明本公开实施例所述显示面板的制备方法的流程示意图。
具体实施方式
为使本公开要解决的技术问题、技术方案和优点更加清楚，下面将结合附图及具体实施例进行详细描述。
为解决现有技术采用屏下摄像头的显示面板中，ITO引线膜层容易脱落、电阻率偏大和容易产生基底发黑的问题，本公开实施例提供一种显示面板，使与摄像头透光区域上所设置发光器件单元连接的连接引线制作于无机保护层上，以增加与连接引线的结合力，并达到降低电阻率，并避免基底发黑的问题。
为清楚说明本公开实施例所述显示面板的结构，以下先结合图1和图2说明本公开实施例所述显示面板的区域分布情况。
如图1和图2所示，本公开实施例所述显示面板包括第一显示区域11、第二显示区域12和第三显示区域13。
可选地，第一显示区域11和第二显示区域12形成为透光显示区，其中在显示面板安装于电子设备上时，在电子设备的内部，对应第一显示区域11的位置，可以安装感光元件如为摄像头，用于透过第一显示区域11采集图像， 形成为屏下摄像头显示结构。
可选地，第三显示区域13围绕第一显示区域11设置，第二显示区域12位于第一显示区域11与第三显示区域13之间，第二显示区域12分别与第一显示区域11和第三显示区域13连接，形成为第一显示区域11与第三显示区域13之间的过渡区域。第一显示区域11、第二显示区域12与第三显示区域13相组合形成为显示面板的整个显示区域。
可选地，显示面板的整个显示区域可以均为透光显示区，或者仅第一显示区域11与第二显示区域12相组合形成为显示面板的透光显示区域，用于实现屏下摄像头的图像采集。其中一实施方式，显示面板为OLED显示面板。
本公开实施例中，可选地，第一显示区域11、第二显示区域12和第三显示区域13制作于透明衬底上。
另外，结合图2所示，本公开实施例所述显示面板上，第一显示区域11上设置有多个阵列排布的第一发光器件单元100，第二显示区域12上设置有多个阵列排布的第一驱动单元200。
可选地，为了形成屏下摄像头显示结构，在第一显示区域11中，多个第一发光器件单元100采用透光材料制作，以形成第一显示区域11的透光效果；可选地，第一发光器件单元100不限于仅能够采用透光材料制作，也可以利用间隔分布的多个第一发光器件单元100之间间隙的透光功能，形成第一显示区域11的透光效果。
可选地，第二显示区域12中，多个第一驱动单元200采用透光材料制成，形成第二显示区域12的透光效果；当然，可选地，第一驱动单元200不限于仅能够采用透光材料制作，也可以利用间隔分布的多个第一驱动单元200之间间隔的透光功能，形成第二显示区域12的透光效果。
本公开实施例中，第二显示区域12的每一第一驱动单元200分别通过连接引线300连接至其中一第一发光器件单元100，通过第一驱动单元200能够驱动相应的第一发光器件单元100发光，
可选地，本公开实施例中，显示面板为OLED显示面板，第一发光器件单元100为OLED像素单元中的OLED发光单元，第一驱动单元200为OLED像素单元中用于驱动OLED发光单元发光的驱动单元。
采用该实施例所述显示面板，第一发光器件单元100和用于驱动第一发光 器件单元100发光的第一驱动单元200分布于不同区域，以满足第一显示区域11和第二显示区域12的透光功能要求；另外，通过多个第一发光器件单元100和多个第一驱动单元200分别一一对应连接，实现第一显示区域11的第一发光器件单元100的发光，以用于第一显示区域11的图像显示。可选地，第二显示区域12和第三显示区域13上还分别设置有多个阵列排布的像素结构400，也即像素单元。其中，第二显示区域12和第三显示区域13分别通过所设置的像素结构400，能够实现图像显示。
其中一实施方式，可选地，第二显示区域12上所设置的多个像素结构400的分布密度小于第三显示区域13上所设置的多个像素结构400的分布密度。第三显示区域13形成为显示面板的正常显示区域，第二显示区域12利用所设置的多个像素结构400之间的间隔，或者第二显示区域12上的像素结构400和第一驱动单元200采用透光材料制成，可以形成为透光显示区域，满足显示图像并透光的要求。
进一步地，第一显示区域11上所设置的多个第一发光器件单元100的分布密度小于第三显示区域13上多个像素结构400的分布密度，第一显示区域11利用所设置的多个第一发光器件单元100之间的间隔，或者第一显示区域11上的多个第一发光器件单元100采用透光材料制作，可以形成为透光显示区域，满足显示图像并透光的要求。
图3为本公开实施例所述显示面板的剖面结构示意图，如图3所示，在第一显示区域11和第二显示区域12上，连接引线300与第一显示区域11的第一发光器件单元100和第二显示区域12的第一驱动单元200分别连接。
本公开实施例所述显示面板中，连接引线300制作于无机保护层500上，也即在显示面板制备时，连接引线300制作时，以无机保护层500为基底制作。可选地，连接引线300为采用透明的ITO材料制成。
需要说明的是，通常技术的显示面板中，ITO引线膜层制作于有机材料基底上，制作于有机材料基底上的ITO引线膜层与基底之间的结合力差，容易出现ITO引线膜层的脱落，且存在ITO引线电阻率偏大的问题，而且还存在有机材料基底中的高分子链受粒子轰击裂解出碳，与膜层产生化合物，导致基底发黑的问题。本公开实施例所述显示面板，通过将连接引线制作于无机保护层500上，利用致密性较好的无机保护层500作为基底，制作连接引线300，使连接 引线300与无机保护层500之间的结合力较好，以大大降低连接引线300脱落的情况，且能够避免有机高分子材料在连接引线300制备过程中出现的放气、黑点和电阻率变大等的问题。
本公开实施例中，可选地，所述无机保护层为氧化硅(SiOx)层。
以下结合图3，对本公开实施例所述显示面板上，各显示区域的结构进行详细说明。
第一显示区域11、第二显示区域12和第三显示区域13均制作于透明衬底1上，且分布于透明衬底1上的不同区域。
其中，如图3所示，以顶发射型发光器件为例，在第三显示区域13，从透明衬底1到远离透明衬底1的方向依次制作有缓冲层2、第二驱动单元和第二发光器件单元，第二驱动单元与第二发光器件单元连接，形成为一个像素结构，第二驱动单元用于驱动第二发光器件单元发光。
具体地，第二驱动单元包括从透明衬底1到远离透明衬底1的方向依次设置的第二有源层131、栅绝缘层132、第二栅极133、层间绝缘层134、第二源/漏极层135。
本公开实施例中，无机保护层500设置于第二源/漏极层135上，且无机保护层500上制作有平坦层600。
第二发光器件单元包括在平坦层600上依次设置的第二阳极136、第二发光层137和第二阴极138，且第二发光层137设置于像素限定层139中。
其中，第二阳极136通过穿透平坦层600和无机保护层500的第三过孔与第二源/漏极层135的源极或漏极连接，以能够使第二驱动单元能够驱动第二发光器件单元发光。
在第二显示区域12，从透明衬底1到远离透明衬底1的方向依次制作有缓冲层2和第一驱动单元200。该第一驱动单元200包括从透明衬底1到远离透明衬底1的方向依次设置的第一有源层201、栅绝缘层132、第一栅极202、层间绝缘层134、第一源/漏极层203。本公开实施例中，第一源/漏极层203上制作有无机保护层500，无机保护层500远离第一源/漏极层203的一侧制作有连接引线300，连接引线300远离无机保护层500的一侧制作有平坦层600。
可选地，第三显示区域13的栅绝缘层132延伸至第二显示区域12，形成为第二显示区域12的栅绝缘层132；第三显示区域13的层间绝缘层134延伸 至第二显示区域12，形成为第二显示区域12的层间绝缘层134。无机保护层500、平坦层600整个地覆盖第一显示区域11、第二显示区域12和第三显示区域13。
另外，第二显示区域12与第三显示区域13中，第一有源层201与第二有源层131、第一栅极202与第二栅极133、第一源/漏极层203与第二源/漏极层135分别为同层，且可选地可以分别通过同一构图工艺制成。
在第一显示区域11中，从透明衬底1到远离透明衬底1的方向依次制作有从第二显示区域12延伸至第一显示区域11的缓冲层2、栅绝缘层132、层间绝缘层134、无机保护层500、连接引线300和平坦层600。其中，在平坦层600远离透明衬底1的一侧制作有第一发光器件单元100。该第一发光器件单元100包括在平坦层600远离透明衬底1的一侧依次设置的第一阳极101、第一发光层102和第一阴极103，且第二发光层102设置于像素限定层139中。其中，可选地，第二阴极138可以延伸至第一显示区域11形成为第一阴极103；当然，第一阴极103与第二阴极108也可以为同一图层的不同图形。
其中，参阅图3所示，在第二显示区域12，连接引线300通过穿透无机保护层500的第一过孔与第一源/漏极层203的源极或漏极连接，第一阳极101通过穿透平坦层600的第二过孔与连接引线300连接。
本公开实施例中，可选地，第一显示区域12的第一阳极101、第一发光层102和第一阴极103分别与第三显示区域13的第二阳极136、第二发光层137和第二阴极138为同层设置，且分别采用同一构图工艺制成。
本公开实施例中，图3用于说明连接引线300连接第一显示区域12的第一发光器件单元100与第二显示区域12的第二驱动单元200的结构示意图。根据图2，第二显示区域12上，除设置多个阵列排布的第二驱动单元200外，还可以设置多个阵列排布的像素结构，所设置像素结构与第三显示区域13所设置像素结构的结构相同，且各层分别采用同一构图工艺制成，在此不再详细说明。
需要说明的是，在第二显示区域12和第三显示区域13，还分别设置有电容结构700，用于提供像素结构发光阶段电压。该电容结构700包括相对设置的第一电极层701、第二电极层702和连接第一电极层701的信号传输层703。可选地，第一电极层701与第一栅极202与第二栅极133同层设置，且可以采 用同一构图工艺制成，栅绝缘层132可以设置为两层，其中第一电极层701可以设置于栅绝缘层132靠近透明衬底1的第一栅绝缘层上，第二电极层702设置于远离透明衬底1的第二栅绝缘层上，形成为相对设置的结构。信号传输层703与第一源/漏极层203、第二源/漏极层135为同层，且采用同一构图工艺制成，信号传输层703通过穿透层间绝缘层134和第二栅绝缘层的过孔与第一电极层701连接。
采用该实施例所述显示面板，如图3所示，无机保护层500在整个显示面板的显示区域覆盖，且制作于驱动单元的源/漏极层之上，在此基础上，在第二显示区域12和第三显示区域13，以无机保护层500为基底，制作连接引线300。通过使连接引线300制作于无机保护层500之上，能够大大降低连接引线300脱落的情况，且避免有机高分子材料在连接引线300制备过程中出现的放气、黑点和电阻率变大等的问题。
本公开实施例所述显示面板中，可选地，在连接引线300制作过程中，可以通过ITO溅射成膜，且溅射过程中进行氧气UV照射及氧气等离子体工艺，用于降低ITO制作的连接引线300的电阻率，并大大增加与无机保护层500之间的结合。
本公开实施例所述显示面板，根据实验证明，利用无机保护层作为连接引线300制作的基底，还能够明显降低水氧侵蚀。
另外，ITO制作的连接引线300，电阻率与ITO方阻、ITO连接引线厚度、ITO连接引线的线宽等有关，举例说明，在线宽2.4的条件下，方阻Spec＜2135时，ITO连接引线的厚度可以位于150埃至200埃之间。采用本公开实施例所述显示面板，相较于通常制作于有机层，能够使ITO连接引线的电阻率降低，在相同电阻率条件下，进一步使得ITO连接引线厚度减小成为可能。
本公开实施例另一方面还提供一种显示装置，该显示装置包括上述实施结构的显示面板，结合图1至图3并参阅以上的详细描述，本领域技术人员应该能够了解采用本公开实施例所述显示面板的显示装置的具体实施结构，在此不再详细说明。
本公开实施例另一方面还提供一种制备方法，该制备方法应用于如上任一项所述的显示面板，如图4所示，所述方法包括：
S410，在透明衬底的第二区域上制作多个阵列排布的第一驱动单元，其中 制作所述第一驱动单元时的绝缘层延伸至所述透明衬底的第一区域；
S420，在所述第一驱动单元上制作无机保护层，且所述无机保护层覆盖整个所述第一区域和所述第二区域；
S430，在所述无机保护层上制作多个连接引线，每一所述连接引线的第一端通过穿透所述无机保护层的过孔与其中一个第一驱动单元连接；
S440，在所述第一区域，制作多个阵列排布的第一发光器件单元，且每一所述第一发光器件单元与一个所述连接引线的第二端连接。
可选地，所述制备方法，还包括：
在透明衬底的第二区域上制作多个阵列的第一驱动单元的同步过程，还在透明衬底的第三区域上制作形成多个阵列的第二驱动单元；
在所述第一驱动单元上制作无机保护层时，所制作的无机保护层还延伸覆盖多个所述第二驱动单元；
在透明衬底的第一区域上制作多个阵列的第一发光器件单元的同步过程，还在所述第三区域上制作形成多个阵列的第二发光器件单元。
结合图3所示，本公开实施例所述制备方法中，透明衬底上的第一区域、第二区域、第三区域分别对应形成为第一显示区域11、第二显示区域12和第三显示区域13。
可选地，在透明衬底的第二区域上制作多个阵列的第一驱动单元的同步过程时，还在第二区域上制作多个阵列排布的第三驱动单元；在透明衬底的第一区域上制作多个阵列的第一发光器件单元的同步过程，还在第二区域上制作多个阵列排布的第三发光器件单元，多个第三驱动单元与多个第三发光器件单元一一对应连接，形成为设置于第二区域上的多个像素结构。
本公开实施例中，可选地，所述的制备方法，其中，在所述无机保护层上制作多个连接引线之后，所述方法还包括：
在所述连接引线上制作平坦层；所述平坦层覆盖整个所述第一区域和所述第二区域；
其中多个所述第一发光器件单元制作于所述平坦层上，且分别通过穿透所述第一发光器件单元的过孔与一个所述连接引线的第二端连接。
可选地，平坦层还覆盖第三区域。
另外，需要说明的是，在步骤S410，结合图3所示，制作第一驱动单元时 的绝缘层包括缓冲层、栅绝缘层、层间绝缘层和像素限定层等。
本公开实施例中，第一显示区域、第二显示区域和第三显示区域的具体结构可以结合图3所示，其中各膜层的制作可以采用曝光或蒸镀等工艺过程制作，在此不再详细说明。
本公开实施例所述制备方法，可选地，在连接引线制作时，可以通过ITO溅射成膜，且溅射过程中进行氧气UV照射及氧气等离子体工艺，用于降低ITO制作的连接引线的电阻率，并大大增加与无机保护层之间的结合。
以上所述的是本公开的优选实施方式，应当指出对于本技术领域的普通人员来说，在不脱离本公开所述原理前提下，还可以作出若干改进和润饰，这些改进和润饰也应视为本公开的保护范围。

Claims (13)

  1. 一种显示面板，包括透明衬底和位于所述透明衬底上的第一显示区域、第二显示区域，所述第一显示区域上设置有多个阵列排布的第一发光器件单元，所述第二显示区域上设置有多个阵列排布的第一驱动单元，其中：
    每一所述第一驱动单元分别通过连接引线连接至其中一第一发光器件单元，通过所述第一驱动单元驱动相应的所述第一发光器件单元发光；其中，所述连接引线制作于无机保护层上。
  2. 根据权利要求1所述的显示面板，其中，所述连接引线远离所述透明衬底的一侧制作有平坦层，所述平坦层与所述连接引线连接，且覆盖整个所述第一显示区域和所述第二显示区域。
  3. 根据权利要求2所述的显示面板，其中，所述第一发光器件单元包括在所述平坦层远离所述透明衬底的一侧设置的第一阳极、第一阴极及位于所述第一阳极与所述第一阴极之间的第一发光层；所述第一驱动单元包括设置于所述透明衬底与所述无机保护层之间的第一有源层、第一栅极和第一源/漏极层；
    其中，所述连接引线通过穿透所述无机保护层的第一过孔与所述第一源/漏极层的源极或漏极连接，所述第一阳极通过穿透所述平坦层的第二过孔与所述连接引线连接。
  4. 根据权利要求1所述的显示面板，其中，所述显示面板还包括第三显示区域，所述第三显示区域围绕所述第一显示区域设置，且所述第二显示区域设置于所述第一显示区域与所述第三显示区域之间；
    其中，所述第三显示区域上设置有多个阵列排布的像素结构，每一像素结构分别包括第二发光器件单元和第二驱动单元；
    所述第三显示区域上多个像素结构的分布密度大于所述第一显示区域上多个所述第一发光器件单元的分布密度。
  5. 根据权利要求4所述的显示面板，其中，所述第二驱动单元包括在所述透明衬底与所述第二发光器件单元之间依次设置的第二有源层、第二栅极和第二源/漏极层，其中所述无机保护层延伸至所述第三显示区域，覆盖所述第三源/漏极层。
  6. 根据权利要求5所述的显示面板，其中，在所述第三显示区域，远离所 述无机保护层的一侧设置有平坦层，所述第二发光器件单元包括位于所述平坦层远离所述透明衬底一侧、且依次设置的第二阳极、第二发光层和第二阴极，其中所述第二阳极通过穿透所述平坦层和所述无机保护层的第三过孔与所述第二源/漏极层的源极或漏极连接。
  7. 根据权利要求4所述的显示面板，其中，所述第二显示区域上还设置有多个阵列排布的像素结构，且所述第二显示区域上多个像素结构的分布密度小于所述第三显示区域上多个像素结构的分布密度。
  8. 根据权利要求1所述的显示面板，其中，所述无机保护层为氧化硅层。
  9. 一种显示装置，其中，包括权利要求1至8任一项所述的显示面板。
  10. 一种制备方法，其中，应用于权利要求1至8任一项所述的显示面板，所述方法包括：
    在透明衬底的第二区域上制作多个阵列排布的第一驱动单元，其中制作所述第一驱动单元时的绝缘层延伸至所述透明衬底的第一区域；
    在所述第一驱动单元上制作无机保护层，且所述无机保护层覆盖整个所述第一区域和所述第二区域；
    在所述无机保护层上制作多个连接引线，每一所述连接引线的第一端通过穿透所述无机保护层的过孔与其中一个第一驱动单元连接；
    在所述第一区域，制作多个阵列排布的第一发光器件单元，且每一所述第一发光器件单元与一个所述连接引线的第二端连接。
  11. 根据权利要求10所述的制备方法，其中，在所述无机保护层上制作多个连接引线之后，所述方法还包括：
    在所述连接引线上制作平坦层；所述平坦层覆盖整个所述第一区域和所述第二区域；
    其中多个所述第一发光器件单元制作于所述平坦层上，且分别通过穿透所述第一发光器件单元的过孔与一个所述连接引线的第二端连接。
  12. 根据权利要求10所述的制备方法，其中，所述方法还包括：
    在透明衬底的第二区域上制作多个阵列的第一驱动单元的同步过程，在透明衬底的第三区域上制作形成多个阵列的第二驱动单元；
    在所述第一驱动单元上制作无机保护层时，所制作的无机保护层还延伸覆盖多个所述第二驱动单元；
    在透明衬底的第一区域上制作多个阵列的第一发光器件单元的同步过程，在所述第三区域上制作形成多个阵列的第二发光器件单元。
  13. 根据权利要求10所述的制备方法，其中，在所述无机保护层上制作多个连接引线，包括：
    通过ITO溅射成膜制作多个连接引线，且溅射过程中进行氧气UV照射及氧气等离子体工艺。
PCT/CN2021/130560 2021-02-26 2021-11-15 显示面板、显示装置及制备方法 WO2022179193A1 (zh)

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