WO2022176057A1 - 切削工具 - Google Patents

切削工具 Download PDF

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Publication number
WO2022176057A1
WO2022176057A1 PCT/JP2021/005902 JP2021005902W WO2022176057A1 WO 2022176057 A1 WO2022176057 A1 WO 2022176057A1 JP 2021005902 W JP2021005902 W JP 2021005902W WO 2022176057 A1 WO2022176057 A1 WO 2022176057A1
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WIPO (PCT)
Prior art keywords
layer
atomic ratio
unit layer
less
cutting tool
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2021/005902
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English (en)
French (fr)
Japanese (ja)
Inventor
優太 鈴木
恒佑 深江
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Sumitomo Electric Hardmetal Corp
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Sumitomo Electric Hardmetal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Sumitomo Electric Hardmetal Corp filed Critical Sumitomo Electric Hardmetal Corp
Priority to EP21926497.5A priority Critical patent/EP4215302B1/en
Priority to PCT/JP2021/005902 priority patent/WO2022176057A1/ja
Priority to JP2021541445A priority patent/JP7226688B2/ja
Priority to US18/033,564 priority patent/US12319996B2/en
Priority to CN202180071677.2A priority patent/CN116390824A/zh
Publication of WO2022176057A1 publication Critical patent/WO2022176057A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/5053—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials non-oxide ceramics
    • C04B41/5062—Borides, Nitrides or Silicides
    • C04B41/5063—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/5053—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials non-oxide ceramics
    • C04B41/5062—Borides, Nitrides or Silicides
    • C04B41/5068—Titanium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • C04B41/524—Multiple coatings, comprising a coating layer of the same material as a previous coating layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C23C14/0647—Boron nitride
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/044—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material coatings specially adapted for cutting tools or wear applications
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
    • C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2224/00—Materials of tools or workpieces composed of a compound including a metal
    • B23B2224/32—Titanium carbide nitride (TiCN)
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2228/00—Properties of materials of tools or workpieces, materials of tools or workpieces applied in a specific manner
    • B23B2228/10—Coatings
    • B23B2228/105—Coatings with specified thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B27/00—Tools for turning or boring machines; Tools of a similar kind in general; Accessories therefor
    • B23B27/14—Cutting tools of which the bits or tips or cutting inserts are of special material
    • B23B27/148—Composition of the cutting inserts

Definitions

  • the present disclosure relates to cutting tools.
  • Patent Document 1 discloses that an Al layer having a thickness of 0.8 to 5.0 ⁇ m is formed on the surface of a tool substrate made of a tungsten carbide-based cemented carbide or a titanium carbonitride-based cermet.
  • the thin layer A and the thin layer B each have a layer thickness of 0.05 to 2 ⁇ m, and the average crystal grain size of the granular crystals constituting the thin layer A is It discloses a surface-coated cutting tool characterized in that the grain size of the columnar crystals forming the thin layer B is 30 nm or less, and the average crystal grain size of the columnar crystals constituting the thin layer B is 50 to 500 nm.
  • the cutting tool according to the present disclosure is A cutting tool comprising a substrate and a hard layer provided on the substrate,
  • the hard layer includes a first unit layer and a second unit layer, In the hard layer, one or more layers of the first unit layer and the second unit layer are alternately laminated,
  • the first unit layer has a thickness of 2 nm or more and 100 nm or less
  • the second unit layer has a thickness of 2 nm or more and 100 nm or less
  • the first unit layer is made of a compound represented by TiaAlbBcN
  • the second unit layer is made of a compound represented by Ti d Ale B f N
  • the atomic ratio a of the titanium element in the TiaAlbBcN is 0.25 or more and less than 0.45
  • the atomic ratio b of the aluminum element in the TiaAlbBcN is 0.55 or more and less than 0.75
  • the atomic ratio c of the boron element in the TiaAlbBcN is more than 0 and 0.1 or less, the
  • FIG. 1 is a perspective view illustrating one mode of a cutting tool.
  • FIG. 2 is a schematic cross-sectional view of a cutting tool in one aspect of the present embodiment.
  • FIG. 3 is a schematic cross-sectional view of a cutting tool in another aspect of this embodiment.
  • FIG. 4 is a schematic cross-sectional view for explaining the crystal structure of the hard layer according to this embodiment.
  • FIG. 5 is an example of a spectral diagram obtained when the hard layer according to this embodiment is subjected to X-ray diffraction analysis.
  • FIG. 6 is a schematic cross-sectional view of a cutting tool in another aspect of this embodiment.
  • the surface-coated cutting tool described in Patent Literature 1 is expected to have a hard coating layer configured as described above, thereby improving wear resistance and thereby extending the life of the cutting tool.
  • the surface-coated cutting tool described in Patent Document 2 it is expected that delamination and crack propagation are suppressed by having the coating having the above structure, and thus the life of the cutting tool is extended.
  • the speed and efficiency of cutting have increased, and the load applied to the cutting tool has increased, resulting in a tendency to shorten the life of the cutting tool. For this reason, it is required to further improve the mechanical properties (for example, wear resistance, chipping resistance, heat resistance, etc.) of coatings of cutting tools.
  • the present disclosure has been made in view of the above circumstances, and aims to provide a cutting tool with excellent fracture resistance.
  • the cutting tool according to the present disclosure is A cutting tool comprising a substrate and a hard layer provided on the substrate,
  • the hard layer includes a first unit layer and a second unit layer, In the hard layer, one or more layers of the first unit layer and the second unit layer are alternately laminated,
  • the first unit layer has a thickness of 2 nm or more and 100 nm or less
  • the second unit layer has a thickness of 2 nm or more and 100 nm or less
  • the first unit layer is made of a compound represented by TiaAlbBcN
  • the second unit layer is made of a compound represented by Ti d Ale B f N
  • the atomic ratio a of the titanium element in the TiaAlbBcN is 0.25 or more and less than 0.45
  • the atomic ratio b of the aluminum element in the TiaAlbBcN is 0.55 or more and less than 0.75
  • the hard layer of the cutting tool becomes a cutting tool with excellent chipping resistance. That is, the cutting tool can have excellent chipping resistance by having the configuration as described above. Further, the hard layer provides a cutting tool with excellent heat resistance by setting the atomic ratio of the aluminum element in each of the first unit layer and the second unit layer within the ranges described above.
  • fracture resistance means resistance to chipping of a cutting tool during cutting.
  • Heat resistance means resistance to abrasion, deformation, etc. of a cutting tool in a high temperature environment.
  • the ratio I (200) /I (002) of the intensity I (200) of the X-ray diffraction peak of the (200) plane to the intensity I (002) of the X-ray diffraction peak of the (002) plane in the hard layer is greater than or equal to 2, and
  • the half width of the X-ray diffraction peak of the (002) plane is preferably 2 degrees or more.
  • the hardness H of the hard layer at room temperature is preferably 30 GPa or more.
  • the cutting tool can have excellent wear resistance in addition to excellent chipping resistance.
  • wear resistance means resistance to wear of a cutting tool during cutting.
  • the ratio H/E of the hardness H of the hard layer to the Young's modulus E of the hard layer at room temperature is preferably 0.07 or more.
  • the hard layer preferably has a thickness of 1 ⁇ m or more and 20 ⁇ m or less.
  • this embodiment An embodiment of the present disclosure (hereinafter referred to as "this embodiment") will be described below. However, this embodiment is not limited to this.
  • the notation of the form "A to Z” means the upper and lower limits of the range (that is, from A to Z), and if no unit is described at A and only a unit is described at Z, then A and the unit of Z are the same.
  • the chemical formula when a compound is represented by a chemical formula in which the composition ratio of constituent elements is not limited, such as "TiN”, the chemical formula can be any conventionally known composition ratio (element ratio) shall include At this time, the above chemical formula includes not only stoichiometric compositions but also non-stoichiometric compositions.
  • the chemical formula of “TiN” includes not only the stoichiometric composition “Ti 1 N 1 ” but also non-stoichiometric compositions such as “Ti 1 N 0.8 ”. This also applies to the description of compounds other than "TiN".
  • a cutting tool comprising a substrate and a hard layer provided on the substrate,
  • the hard layer includes a first unit layer and a second unit layer, In the hard layer, one or more layers of the first unit layer and the second unit layer are alternately laminated,
  • the first unit layer has a thickness of 2 nm or more and 100 nm or less
  • the second unit layer has a thickness of 2 nm or more and 100 nm or less
  • the first unit layer is made of a compound represented by TiaAlbBcN
  • the second unit layer is made of a compound represented by Ti d Ale B f N
  • the atomic ratio a of the titanium element in the TiaAlbBcN is 0.25 or more and less than 0.45
  • the atomic ratio b of the aluminum element in the TiaAlbBcN is 0.55 or more and less than 0.75
  • the atomic ratio c of the boron element in the TiaAlbBcN is more than 0 and 0.1 or less, the sum of the atomic ratio a,
  • cutting tools examples include drills, end mills, indexable cutting inserts for drills, indexable cutting inserts for end mills, indexable cutting inserts for milling, indexable cutting inserts for turning, and metal saws. , gear cutting tools, reamers, taps, and the like.
  • FIG. 1 is a perspective view illustrating one aspect of a cutting tool.
  • a cutting tool having such a shape is used, for example, as an indexable cutting tip.
  • the cutting tool 10 has a rake face 1, a flank face 2, and a cutting edge ridge 3 where the rake face 1 and the flank face 2 intersect. That is, the rake face 1 and the flank face 2 are surfaces connected with the cutting edge ridge 3 interposed therebetween.
  • the cutting edge ridge 3 constitutes the cutting edge of the cutting tool 10 .
  • Such a shape of the cutting tool 10 can also be grasped as the shape of the base material of the cutting tool. That is, the substrate has a rake face, a flank face, and a cutting edge ridge connecting the rake face and the flank face.
  • the base material is a cemented carbide (for example, a tungsten carbide (WC)-based cemented carbide, a cemented carbide containing Co in addition to WC, a carbonitride such as Cr, Ti, Ta, Nb in addition to WC).
  • a cemented carbide for example, a tungsten carbide (WC)-based cemented carbide, a cemented carbide containing Co in addition to WC, a carbonitride such as Cr, Ti, Ta, Nb in addition to WC.
  • cemented carbide, etc. cermet (mainly composed of TiC, TiN, TiCN, etc.), high-speed steel, ceramics (titanium carbide, silicon carbide, silicon nitride, aluminum nitride, aluminum oxide, etc.), cubic It is preferable to include one selected from the group consisting of type boron nitride sintered bodies (cBN sintered bodies) and diamond sintered bodies.
  • cemented carbide especially WC-based cemented carbide
  • cermet especially TiCN-based cermet
  • the effect of the present embodiment is exhibited even if such a cemented carbide contains free carbon or an abnormal phase called ⁇ phase in the structure.
  • the base material used in this embodiment may have a modified surface.
  • a ⁇ -free layer may be formed on the surface, or in the case of a cBN sintered body, a surface-hardened layer may be formed. Even if the surface is modified in this way, The effect of this embodiment is shown.
  • the substrate may or may not have a chip breaker. included.
  • the shape of the ridge line of the cutting edge is sharp edge (the ridge where the rake face and the flank face intersect), honing (sharp edge rounded shape), negative land (chamfered shape), and a combination of honing and negative land. any shape is included.
  • the coating according to this embodiment is provided on the substrate.
  • the “coating” has the effect of improving various properties such as heat resistance, chipping resistance, and wear resistance of the cutting tool by covering at least part of the base material (for example, part of the rake face). It is.
  • the coating preferably covers the entire surface of the substrate. However, it does not depart from the scope of the present embodiment even if a part of the substrate is not covered with the coating or the composition of the coating is partially different.
  • the coating includes a hard layer having a first unit layer and a second unit layer.
  • the thickness of the coating is preferably 1 ⁇ m or more and 20 ⁇ m or less, more preferably 1.5 ⁇ m or more and 12 ⁇ m or less, and even more preferably 2 ⁇ m or more and 8 ⁇ m or less.
  • the thickness of the coating means the total thickness of each layer constituting the coating. Examples of the "layers constituting the coating" include other layers such as the hard layer described above, a base layer described later, an intermediate layer and a surface layer.
  • the thickness of the coating is, for example, using a transmission electron microscope (TEM), measuring arbitrary 10 points in a cross-sectional sample parallel to the normal direction of the surface of the base material, the thickness of the measured 10 points can be obtained by taking the average value of The measurement magnification at this time is, for example, 10000 times.
  • TEM transmission electron microscope
  • the cross-sectional sample include a sample obtained by slicing the cross-section of the cutting tool with an ion slicer. The same is true when measuring the thickness of each of the hard layer, the base layer, the intermediate layer, the surface layer, and the like.
  • Examples of transmission electron microscopes include JEM-2100F (trade name) manufactured by JEOL Ltd.
  • the hard layer 20 includes a first unit layer 21 and a second unit layer 22 (FIG. 2).
  • the hard layer may start from the first unit layer 21 or may start from the second unit layer.
  • the hard layer 20 may be provided directly above the base material 11 (FIGS. 2 and 3), as long as the effect of the cutting tool according to the present embodiment is maintained. It may be provided on the substrate 11 via a layer (FIG. 6).
  • the hard layer 20 may be provided with another layer such as a surface layer 32 thereon as long as the effect of the cutting tool is maintained (FIG. 6). Further, the hard layer 20 may be provided on the surface of the coating 40 .
  • a plurality of hard layers may be provided as long as the effects of the cutting tool are maintained.
  • the coating when the coating includes a first hard layer and a second hard layer, the coating further includes an intermediate layer provided between the first hard layer and the second hard layer.
  • the hard layer preferably covers the flank face of the base material.
  • the hard layer preferably covers the rake face of the substrate. More preferably, the hard layer covers the entire surface of the substrate. However, even if a part of the substrate is not covered with the hard layer, it does not depart from the scope of the present embodiment.
  • the thickness of the hard layer is preferably 1 ⁇ m or more and 20 ⁇ m or less, more preferably 1.5 ⁇ m or more and 12 ⁇ m or less, and even more preferably 2 ⁇ m or more and 8 ⁇ m or less.
  • the thickness can be measured, for example, by observing the cross section of the cutting tool as described above at a magnification of 10,000 using a transmission electron microscope.
  • the ratio I (200) /I (002) of the intensity I (200) of the X-ray diffraction peak of the (200) plane to the intensity I (002) of the X-ray diffraction peak of the (002) plane in the hard layer is 2 or more. and The half width of the X-ray diffraction peak of the (002) plane is preferably 2 degrees or more.
  • the “intensity I (200) of the X-ray diffraction peak of the (200) plane” is the diffraction intensity (peak height) at the highest peak among the X-ray diffraction peaks derived from the (200) plane. means. The same applies to the "intensity I (002) of the X-ray diffraction peak of the (002) plane".
  • X-ray diffraction measurement by the ⁇ /2 ⁇ method is performed on each of three arbitrary points in the hard layer under the conditions described in the examples described later, and the X-ray of a predetermined crystal plane is measured.
  • the diffraction intensity is obtained, and the average value of the obtained three X-ray diffraction intensities is taken as the X-ray diffraction intensity of the predetermined crystal plane.
  • line diffraction intensity corresponds to line diffraction intensity (see, for example, FIG. 5).
  • the vertical axis indicates the X-ray diffraction intensity
  • the horizontal axis indicates the value of 2 ⁇ .
  • Examples of the apparatus used for the X-ray diffraction measurement include "SmartLab” (trade name) manufactured by Rigaku Corporation and "X'pert” (trade name) manufactured by PANalytical.
  • the X-ray diffraction intensity of the (200) plane is derived from the cubic crystals in the hard layer.
  • the intensity I (002) of the X-ray diffraction peak of the (002) plane originates from the hexagonal crystals in the hard layer. Therefore, it is possible to determine whether the hard layer has cubic crystals or hexagonal crystals based on the presence or absence of these peaks.
  • the fact that the ratio I (200) /I (002) is 2 or more means that a mixed crystal of the cubic columnar crystals 23 and the hexagonal columnar crystals 24 is formed in the hard layer. (Fig. 4). In each of the cubic columnar crystals 23 and the hexagonal columnar crystals 24, first unit layers and second unit layers are alternately laminated. We omit the structure of
  • the upper limit of the above ratio I (200) /I (002) may be, for example, 10 or less, less than 10, or 5 or less.
  • the upper limit of the half width of the X-ray diffraction peak of the (002) plane may be 4 degrees or less, or may be 3 degrees or less.
  • the hardness H of the hard layer at room temperature is preferably 30 GPa or more, more preferably 30 GPa or more and 50 GPa or less, and even more preferably 35 GPa or more and 45 GPa or less.
  • the Young's modulus E of the hard layer at room temperature is preferably 700 GPa or less, more preferably 400 GPa or more and 700 GPa or less, and even more preferably 400 GPa or more and 550 GPa or less.
  • the ratio H/E of the hardness H of the hard layer to the Young's modulus E of the hard layer at room temperature is preferably 0.07 or more, more preferably 0.07 or more and 0.12 or less, It is more preferably 0.08 or more and 0.11 or less.
  • the hardness H and the Young's modulus E can be obtained by a nanoindentation method according to the standard procedure stipulated in "ISO 14577-1: 2015 Metallic materials-Instrumented indentation test for hardness and materials parameters-". .
  • Room temperature as used in this embodiment means 25 degreeC.
  • the indentation depth of the indenter should not exceed 1/10 of the thickness of the hard layer in the indentation direction of the indenter.
  • the indentation load of the indenter is 1 g.
  • the above-described cross-sectional sample may be used as long as the cross-sectional area of the hard layer can be secured to be 10 times wider than the area of the indenter.
  • a sample having a cross section inclined with respect to the normal direction of the surface of the base material may be used so that the cross section of the hard layer is sufficiently wide with respect to the indenter.
  • Such measurements are performed for at least 10 cross-sectional samples, and the average values of the hardness and Young's modulus obtained for each sample are taken as the hardness H and Young's modulus E of the hard layer. Data that seem to be abnormal values at first glance shall be excluded.
  • An example of an apparatus for performing the nanoindentation method is ENT-1100a manufactured by Elionix.
  • the thickness of the first unit layer is 2 nm or more and 100 nm or less, preferably 2 nm or more and 50 nm or less, and more preferably 2 nm or more and 10 nm or less.
  • the thickness of the first unit layer and the thickness of the second unit layer described later are determined by analysis using electron energy loss spectroscopy (EELS). Specifically, first, in a scanning transmission electron microscope image (STEM image) of the cross-sectional sample described above, an intensity profile corresponding to Al is measured along a direction parallel to the stacking direction of the hard layers.
  • STEM image scanning transmission electron microscope image
  • the intensity profile is represented as a line graph in which the X axis (horizontal axis) is the distance from the measurement start point on the hard layer and the Y axis (vertical axis) is the intensity (brightness caused by atoms). be done.
  • the distance between the point showing the maximum value of the line graph corresponding to Al and the point showing the next maximum value is obtained.
  • the obtained distance means the total thickness of the thickness of the first unit layer and the thickness of the second unit layer. Calculate the total thickness obtained in this manner at at least four locations, obtain the average value, and divide the obtained average value by 2 to obtain the thickness of each of the first unit layer and the second unit layer. do.
  • the first unit layer is made of a compound represented by TiaAlbBcN .
  • Consisting of a compound represented by TiaAlbBcN refers to an embodiment composed only of a compound represented by TiaAlbBcN and an embodiment composed only of a compound represented by TiaAlbBcN . It is a concept that includes aspects consisting of compounds and unavoidable impurities. Examples of unavoidable impurities include carbon (C) and oxygen (O).
  • the composition of the first unit layer can be obtained by elemental analysis of the entire first unit layer by energy dispersive X-ray spectroscopy (TEM-EDX) attached to the above cross-sectional sample with a TEM. . The observation magnification at this time is, for example, 20000 times.
  • TEM-EDX energy dispersive X-ray spectroscopy
  • the atomic ratio a of the titanium element in the above TiaAlbBcN is 0.25 or more and less than 0.45, preferably 0.25 or more and 0.40 or less, and 0.25 or more and 0.35 or less. is more preferable.
  • the first unit layer has an appropriate hardness.
  • the atomic ratio b of the aluminum element in the above TiaAlbBcN is 0.55 or more and less than 0.75, preferably 0.60 or more and less than 0.75, and 0.65 or more and less than 0.75 is more preferable.
  • the first unit layer has excellent heat resistance.
  • the atomic ratio c of the boron element in the above TiaAlbBcN is more than 0 and 0.1 or less, preferably 0.01 or more and 0.09 or less, and 0.02 or more and 0.08 or less is more preferable.
  • the first unit layer can have an appropriate hardness.
  • the sum of the atomic ratio a, the atomic ratio b, and the atomic ratio c is one.
  • the thickness of the second unit layer is 2 nm or more and 100 nm or less, preferably 2 nm or more and 50 nm or less, and more preferably 2 nm or more and 10 nm or less.
  • the second unit layer is made of a compound represented by TidAleBfN .
  • Consisting of a compound represented by Ti d Ale BfN means an embodiment composed only of a compound represented by Ti d Ale BfN and a mode composed only of a compound represented by Ti d Ale BfN It is a concept that includes aspects consisting of compounds and unavoidable impurities. Examples of unavoidable impurities include carbon (C) and oxygen (O).
  • the composition of the second unit layer can be obtained by elemental analysis of the entire second unit layer by energy dispersive X-ray spectroscopy (TEM-EDX) attached to the above cross-sectional sample with a TEM. . The observation magnification at this time is, for example, 20000 times.
  • the atomic ratio d of the titanium element in the Ti d Ale B f N is 0.35 or more and less than 0.55, preferably 0.35 or more and 0.50 or less, and 0.35 or more and 0.45 or less. is more preferable.
  • the first unit layer has an appropriate hardness.
  • the atomic ratio e of the aluminum element in the Ti d Ale Bf N is 0.45 or more and less than 0.65, preferably 0.50 or more and less than 0.65, and 0.55 or more and less than 0.65. is more preferable.
  • the first unit layer can have an appropriate hardness.
  • the atomic ratio f of the boron element in the Ti d Ale B f N is more than 0 and 0.1 or less, preferably 0.01 or more and 0.09 or less, and 0.02 or more and 0.08 or less is more preferable.
  • the first unit layer has an appropriate hardness.
  • the sum of the atomic ratio d, the atomic ratio e, and the atomic ratio f is one.
  • the atomic ratio a and the atomic ratio d preferably satisfy 0.05 ⁇ da ⁇ 0.2 and 0.1 ⁇ da ⁇ 0.2. By setting da within the above range, a cutting tool having excellent chipping resistance can be obtained.
  • the atomic ratio b and the atomic ratio e preferably satisfy 0.05 ⁇ be ⁇ 0.2 and 0.1 ⁇ be ⁇ 0.2. By setting be within the above range, a cutting tool having excellent chipping resistance can be obtained.
  • the coating may further include other layers as long as the effects of the present embodiment are not impaired.
  • Examples of the other layer include a base layer provided between the substrate and the hard layer and a surface layer provided on the hard layer. Further, there is an intermediate layer provided between the first hard layer and the second hard layer in the case where the coating includes the first hard layer and the second hard layer.
  • the underlayer may be, for example, a layer made of a compound represented by AlCrN.
  • the surface layer may be, for example, a layer made of a compound represented by TiN.
  • the intermediate layer may be, for example, a layer made of a compound represented by TiAlN.
  • the composition of the other layer can be obtained by elemental analysis of the entire other layer by energy-dispersive X-ray spectroscopy (TEM-EDX) attached to the above cross-sectional sample with a TEM. The observation magnification at this time is, for example, 20000 times.
  • TEM-EDX energy-dispersive X-ray spectroscopy
  • the thickness of the other layer is not particularly limited as long as it does not impair the effects of the present embodiment.
  • the thickness can be measured, for example, by observing the cross section of the cutting tool as described above at a magnification of 10,000 using a transmission electron microscope.
  • the method for manufacturing a cutting tool includes: A step of preparing the base material (hereinafter sometimes referred to as "first step”); A step of alternately laminating one or more first unit layers and one or more second unit layers on the base material using a physical vapor deposition method to form the hard layer (hereinafter referred to as the "second step” There is a case.) and, including.
  • Physical vapor deposition is a vapor deposition method in which a raw material (also called “evaporation source” or “target”) is vaporized using physical action, and the vaporized raw material is deposited on a base material or the like.
  • a raw material also called “evaporation source” or “target”
  • Examples of physical vapor deposition include sputtering and arc ion plating.
  • the arc ion plating method is preferably used as the physical vapor deposition method used in this embodiment.
  • a base material is installed in the device and a target is installed as a cathode, and then a high current is applied to this target to generate an arc discharge.
  • the atoms forming the target are vaporized and ionized, and deposited on the substrate to which a negative bias voltage is applied to form a film.
  • a substrate is prepared in the first step.
  • a cemented carbide base material or a cubic boron nitride sintered body is prepared as the base material.
  • the cemented carbide base material and the cubic boron nitride sintered body may be commercially available base materials or may be produced by a general powder metallurgy method.
  • a cemented carbide is produced by a general powder metallurgy method, first, a mixed powder is obtained by mixing WC powder and Co powder with a ball mill or the like. After drying the mixed powder, it is molded into a predetermined shape to obtain a molded body.
  • a WC—Co-based cemented carbide sintered body
  • a predetermined cutting edge processing such as honing treatment to produce a base material made of a WC—Co based cemented carbide.
  • any substrate other than those described above can be prepared as long as it is conventionally known as this type of substrate.
  • the second step one or more first unit layers and one or more second unit layers are alternately laminated on the substrate by physical vapor deposition to form the hard layer.
  • various methods are used depending on the composition of the hard layer to be formed.
  • a method of using alloy targets with different grain sizes such as titanium (Ti), aluminum (Al), and boron (B)
  • a method of using a plurality of targets with different compositions include a method of using a pulse voltage as the bias voltage, a method of changing the gas flow rate during film formation, and a method of adjusting the rotation speed of a substrate holder that holds the substrate in the film forming apparatus.
  • the second step can be performed as follows. First, a chip having an arbitrary shape is mounted as a substrate in the chamber of the film forming apparatus. For example, the substrate is attached to the outer surface of a substrate holder on a rotary table that is rotatably mounted centrally within the chamber of the deposition apparatus. Next, the evaporation source for forming the first unit layer and the evaporation source for forming the second unit layer are arranged to face each other so as to sandwich the substrate holder. A bias power supply is attached to the substrate holder. An arc power source is attached to each of the evaporation source for forming the first unit layer and the evaporation source for forming the second unit layer.
  • Nitrogen gas or the like is introduced as a reaction gas while the substrate is rotated in the center of the chamber. Furthermore, the temperature of the substrate is maintained at 400 to 800° C., the reaction gas pressure is maintained at 1 to 10 Pa (partial pressure of nitrogen gas is 5 to 10 Pa), and the voltage of the bias power supply is gradually increased in the range of 30 to 200 V (DC power supply). , an arc current of 80 to 200 A is alternately supplied to the evaporation source for forming the first unit layer and the evaporation source for forming the second unit layer.
  • metal ions are generated from the evaporation source for forming the first unit layer and the evaporation source for forming the second unit layer, and when the substrate faces the evaporation source for forming the first unit layer, the second One unit layer is formed, and a second unit layer is formed when the substrate faces the evaporation source for forming the second unit layer.
  • the film while changing the voltage of the bias power supply as described above, it is possible to achieve both high hardness of the hard layer and cutting edge quality. After a predetermined time has passed, the supply of the arc current is stopped to form a hard layer (first unit layer and second unit layer) on the surface of the substrate.
  • the thickness of each of the first unit layer and the second unit layer is adjusted by adjusting the rotational speed of the substrate. Also, by adjusting the film formation time, the thickness of the hard layer is adjusted to fall within a predetermined range.
  • a hard layer may be formed on the surface of the base material other than the part involved in cutting. .
  • TiAlN layer a layer made of a compound represented by TiAlN (TiAlN layer) is predominantly cubic and has excellent hardness.
  • TiAlN layer a compound represented by TiAlN
  • boron is added as a raw material when forming the TiAlN layer, hexagonal crystals are likely to be formed and the hardness decreases. Therefore, there was no concept of using boron in addition to titanium and aluminum as raw materials when forming a TiAlN layer.
  • the present inventors added a trace amount of boron in addition to titanium and aluminum as raw materials, and further formed a hard layer so as to have a multilayer structure of the first unit layer and the second unit layer. As a result, it was found for the first time that a cutting tool having unexpectedly excellent heat resistance and excellent chipping resistance could be obtained.
  • the substrate is maintained at a temperature of 500-600° C.
  • the reaction gas pressure is maintained at 5-10 Pa (the partial pressure of nitrogen gas is 5-8 Pa)
  • the voltage of the bias power supply is 30-200 V (DC)
  • the raw material of the first unit layer contains titanium, aluminum, and boron, and examples thereof include titanium boride, aluminum metal, and titanium aluminum boride.
  • the blending composition of the raw materials of the first unit layer can be appropriately adjusted according to the desired composition of the first unit layer.
  • the raw material of the first unit layer may be in the form of a powder or a plate.
  • the raw material of the second unit layer contains titanium, aluminum, and boron. Examples thereof include metallic titanium, aluminum boride, and titanium aluminum boride.
  • the blending composition of the raw materials for the second unit layer can be appropriately adjusted according to the desired composition of the second unit layer. It is preferable that the mixing composition of the raw material of the second unit layer is different from the mixing composition of the raw material of the first unit layer.
  • the raw material for the second unit layer may be in the form of a powder or a plate.
  • the reaction gas described above is appropriately set according to the composition of the hard layer.
  • the reaction gas include a mixed gas of nitrogen gas and argon gas, nitrogen gas, and the like.
  • a step of ion bombardment treatment of the surface of the base material in addition to the above-described steps, between the first step and the second step, a step of ion bombardment treatment of the surface of the base material, A step of forming a base layer between them, a step of forming a surface layer on the hard layer, a step of forming an intermediate layer between the first hard layer and the second hard layer, a surface treatment step, etc. may be performed as appropriate.
  • the other layers may be formed by conventional methods.
  • indexable cutting insert P for milling (equivalent to JIS P30 cemented carbide, SEMT13T3AGSN) and indexable cutting insert K for milling (equivalent to JIS K30)
  • a cemented carbide, SEMT13T3AGSN) was prepared (first step).
  • ⁇ Ion bombardment treatment> Prior to the preparation of the coating described below, the surface of the base material was subjected to ion bombardment treatment according to the following procedure. First, the substrate was set in an arc ion plating apparatus. Next, ion bombardment treatment was performed under the following conditions. Gas composition: Ar (100%) Gas pressure: 0.5Pa Bias voltage: 600V (DC power supply) Processing time: 60 minutes
  • Coatings were produced by forming hard layers (multilayered structures or single layers) shown in Tables 2-1 to 2-3 on the surfaces of the substrates subjected to the ion bombardment treatment. A method for producing the hard layer will be described below.
  • the evaporation source for forming the first unit layer and the evaporation source for forming the second unit layer used raw material compositions shown in Tables 1-1 and 1-2, respectively.
  • the hard layer comprises the first unit layer and the second unit layer having the compositions shown in Tables 2-1 to 2-3, and the base material so as to have the thickness shown in Tables 2-1 to 2-3. It was produced by alternately laminating each layer one by one while adjusting the rotation speed of .
  • composition of the hard layer in Tables 2-1 to 2-3 is obtained by elemental analysis of the entire hard layer by energy dispersive X-ray spectroscopy (TEM-EDX) attached to the cross-sectional sample of the TEM as described above. sought by The observation magnification at this time was 20000 times.
  • TEM-EDX energy dispersive X-ray spectroscopy
  • samples 101 and 105 films were formed using only the evaporation source for forming the first unit layer (Tables 1-2 and 2-3). Therefore, the hard layer in samples 101 and 105 is a single layer rather than a multi-layer structure.
  • ⁇ Measurement of thickness of coating (thickness of hard layer)>
  • the thickness of the coating (that is, the thickness of the hard layer) is measured using a transmission electron microscope (TEM) (manufactured by JEOL Ltd., trade name: JEM-2100F), parallel to the normal direction of the surface of the substrate. It was obtained by measuring arbitrary 10 points in a cross-sectional sample and averaging the thickness of the measured 10 points. The results are shown in Tables 2-1 and 2-2.
  • the thickness of each of the first unit layer and the second unit layer was obtained by analysis using EELS. Specifically, in the STEM image obtained by the above measurement, the intensity profile corresponding to Al was measured along the direction parallel to the stacking direction of the hard layers.
  • the intensity profile is represented as a line graph in which the X-axis (horizontal axis) is the distance from the measurement start point on the hard layer and the Y-axis (vertical axis) is the intensity (brightness caused by atoms). In the obtained graph, the distance between the point showing the maximum value of the line graph corresponding to Al and the point showing the next maximum value was determined.
  • the obtained distance means the total thickness of the thickness of the first unit layer and the thickness of the second unit layer. Calculate the total thickness obtained in this manner at at least four locations, obtain the average value, and divide the obtained average value by 2 to obtain the thickness of each of the first unit layer and the second unit layer. did. The results are shown in Tables 2-1 and 2-2.
  • ⁇ X-ray diffraction analysis of hard layer The hard layer was analyzed by the X-ray diffraction analysis method (XDR analysis method) to obtain the X-ray diffraction intensities I (200) and I (002) of the (200) plane and (002) plane, respectively.
  • the conditions for X-ray diffraction analysis are shown below. Tables 3-1 and 3-2 show the obtained I (200) /I (002) and the peak half width of I (002) .
  • ENT-1100a (trade name) manufactured by Elionix Co., Ltd. was used as a measuring device. The above measurements were performed on 10 cross-sectional samples, and the average values of the hardness and Young's modulus obtained for each sample were taken as the hardness H and Young's modulus E of the hard layer. Data that appear to be outliers were excluded. A ratio H/E of the hardness H to the Young's modulus E was also obtained. The results are shown in Tables 3-1 and 3-2.

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US18/033,564 US12319996B2 (en) 2021-02-17 2021-02-17 Cutting tool
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12059731B1 (en) 2023-04-28 2024-08-13 Sumitomo Electric Hardmetal Corp. Cutting tool
WO2026018875A1 (ja) * 2024-07-18 2026-01-22 京セラ株式会社 被覆工具、切削工具、および切削加工物の製造方法
EP4703070A4 (en) * 2023-04-28 2026-04-08 Sumitomo Electric Hardmetal Corp CUTTING TOOL

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4578992A1 (en) * 2023-12-28 2025-07-02 Voestalpine Eifeler Vacotec Gmbh Workpiece having a hard material layer
US20250389013A1 (en) * 2024-06-20 2025-12-25 Sumitomo Electric Hardmetal Corp. Cutting tool

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007030130A (ja) * 2005-07-29 2007-02-08 Mitsubishi Materials Corp 合金鋼の高速歯切加工で硬質被覆層がすぐれた耐摩耗性を発揮する表面被覆超硬合金製歯切工具
JP2007038378A (ja) * 2005-08-05 2007-02-15 Mitsubishi Materials Corp 難削材の高速切削加工で硬質被覆層がすぐれた耐チッピング性を発揮する表面被覆超硬合金製切削工具
JP2011224717A (ja) * 2010-04-20 2011-11-10 Mitsubishi Materials Corp 表面被覆切削工具
JP2011224715A (ja) 2010-04-20 2011-11-10 Mitsubishi Materials Corp 硬質被覆層がすぐれた耐摩耗性を発揮する表面被覆切削工具
WO2017169498A1 (ja) * 2016-03-28 2017-10-05 住友電工ハードメタル株式会社 表面被覆切削工具、およびその製造方法
JP2017193004A (ja) 2016-04-19 2017-10-26 住友電工ハードメタル株式会社 表面被覆切削工具
JP2019005867A (ja) * 2017-06-26 2019-01-17 三菱マテリアル株式会社 硬質被覆層がすぐれた耐チッピング性を発揮する表面被覆切削工具
WO2019035220A1 (ja) * 2017-08-15 2019-02-21 三菱日立ツール株式会社 被覆切削工具

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2793696B2 (ja) * 1990-05-17 1998-09-03 神鋼コベルコツール株式会社 耐摩耗性皮膜
JP2006116831A (ja) * 2004-10-22 2006-05-11 Sony Corp プリンタ及びプリンタの制御方法
JP5234931B2 (ja) * 2008-06-23 2013-07-10 株式会社神戸製鋼所 硬質皮膜被覆部材および成形用冶工具
JP5730535B2 (ja) * 2010-10-29 2015-06-10 株式会社神戸製鋼所 硬質皮膜形成部材および硬質皮膜の形成方法
US8409702B2 (en) * 2011-02-07 2013-04-02 Kennametal Inc. Cubic aluminum titanium nitride coating and method of making same
WO2013002385A1 (ja) * 2011-06-30 2013-01-03 京セラ株式会社 表面被覆部材
KR101351845B1 (ko) * 2012-05-02 2014-01-16 한국야금 주식회사 절삭공구용 경질피막
JP6090063B2 (ja) * 2012-08-28 2017-03-08 三菱マテリアル株式会社 表面被覆切削工具
US9103036B2 (en) * 2013-03-15 2015-08-11 Kennametal Inc. Hard coatings comprising cubic phase forming compositions
JP2015066644A (ja) * 2013-09-30 2015-04-13 三菱マテリアル株式会社 高速切削加工で硬質被覆層がすぐれた耐摩耗性と耐チッピング性を発揮する表面被覆切削工具
JP6417959B2 (ja) * 2014-01-22 2018-11-07 三菱マテリアル株式会社 硬質被覆層がすぐれた耐チッピング性を発揮する表面被覆切削工具
US9849532B2 (en) * 2014-06-12 2017-12-26 Kennametal Inc. Composite wear pad and methods of making the same
JP6284034B2 (ja) * 2014-09-25 2018-02-28 三菱マテリアル株式会社 硬質被覆層がすぐれた耐チッピング性を発揮する表面被覆切削工具
KR20170138444A (ko) * 2015-04-20 2017-12-15 쎄코 툴스 에이비 코팅된 절삭 공구 및 절삭 공구를 코팅하는 방법
WO2016175166A1 (ja) * 2015-04-27 2016-11-03 株式会社タンガロイ 被覆切削工具
KR101753104B1 (ko) * 2015-09-18 2017-07-05 한국야금 주식회사 절삭공구용 경질피막
EP3360631B1 (en) * 2015-10-07 2022-11-16 Tungaloy Corporation Coated cutting tool
US10570501B2 (en) * 2017-05-31 2020-02-25 Kennametal Inc. Multilayer nitride hard coatings
EP3450591A1 (en) * 2017-08-30 2019-03-06 Seco Tools Ab A coated cutting tool and a method for coating the cutting tool
WO2019048507A1 (en) * 2017-09-05 2019-03-14 Oerlikon Surface Solutions Ag, Pfäffikon ALTIN FILMS RICH IN AL
KR102350224B1 (ko) * 2018-03-22 2022-01-14 스미또모 덴꼬오 하드메탈 가부시끼가이샤 표면 피복 절삭 공구 및 그 제조 방법
US20210046561A1 (en) 2019-04-19 2021-02-18 Sumitomo Electric Hardmetal Corp. Cutting tool
US12544837B2 (en) * 2019-06-19 2026-02-10 Ab Sandvik Coromant Coated cutting tool
WO2021085253A1 (ja) * 2019-10-29 2021-05-06 三菱マテリアル株式会社 表面被覆切削工具
CN111270202B (zh) * 2020-03-17 2022-03-25 株洲华锐精密工具股份有限公司 一种切削刀具用成分结构双梯度功能涂层及其制备方法
KR102172454B1 (ko) * 2020-08-24 2020-10-30 주식회사 와이지-원 다층 피복 절삭 소재, 그 제조 방법 및 이를 포함하는 기계가공용 절삭 공구 인서트

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007030130A (ja) * 2005-07-29 2007-02-08 Mitsubishi Materials Corp 合金鋼の高速歯切加工で硬質被覆層がすぐれた耐摩耗性を発揮する表面被覆超硬合金製歯切工具
JP2007038378A (ja) * 2005-08-05 2007-02-15 Mitsubishi Materials Corp 難削材の高速切削加工で硬質被覆層がすぐれた耐チッピング性を発揮する表面被覆超硬合金製切削工具
JP2011224717A (ja) * 2010-04-20 2011-11-10 Mitsubishi Materials Corp 表面被覆切削工具
JP2011224715A (ja) 2010-04-20 2011-11-10 Mitsubishi Materials Corp 硬質被覆層がすぐれた耐摩耗性を発揮する表面被覆切削工具
WO2017169498A1 (ja) * 2016-03-28 2017-10-05 住友電工ハードメタル株式会社 表面被覆切削工具、およびその製造方法
JP2017193004A (ja) 2016-04-19 2017-10-26 住友電工ハードメタル株式会社 表面被覆切削工具
JP2019005867A (ja) * 2017-06-26 2019-01-17 三菱マテリアル株式会社 硬質被覆層がすぐれた耐チッピング性を発揮する表面被覆切削工具
WO2019035220A1 (ja) * 2017-08-15 2019-02-21 三菱日立ツール株式会社 被覆切削工具

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Metallic materials - Instrumented indentation test for hardness and materials parameters", ISO 14577-1: 2015
See also references of EP4215302A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12059731B1 (en) 2023-04-28 2024-08-13 Sumitomo Electric Hardmetal Corp. Cutting tool
EP4494788A4 (en) * 2023-04-28 2025-07-23 Sumitomo Electric Hardmetal Corp CUTTING TOOL
EP4703070A4 (en) * 2023-04-28 2026-04-08 Sumitomo Electric Hardmetal Corp CUTTING TOOL
WO2026018875A1 (ja) * 2024-07-18 2026-01-22 京セラ株式会社 被覆工具、切削工具、および切削加工物の製造方法

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