WO2022172898A1 - 基材接着方法、基材接着システムおよびマイクロ流体デバイス - Google Patents

基材接着方法、基材接着システムおよびマイクロ流体デバイス Download PDF

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Publication number
WO2022172898A1
WO2022172898A1 PCT/JP2022/004729 JP2022004729W WO2022172898A1 WO 2022172898 A1 WO2022172898 A1 WO 2022172898A1 JP 2022004729 W JP2022004729 W JP 2022004729W WO 2022172898 A1 WO2022172898 A1 WO 2022172898A1
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Prior art keywords
substrate
glass transition
transition temperature
base material
temperature
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English (en)
French (fr)
Japanese (ja)
Inventor
教幸 小粥
公昭 岩堀
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Asti Corp
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Asti Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices

Definitions

  • the present invention relates to a substrate bonding method, a substrate bonding system, and a microfluidic device for bonding two substrates together.
  • microfluidic devices such as cartridges and lab-on-chips have been widely used in the bio, medical, and analytical fields.
  • Such a microfluidic device is produced by adhering another resin base material to a resin base material in which channels composed of grooves and recesses are formed.
  • a base material with an adhesive or adhesive is used, or the surface of the base material is exposed to a solvent to melt the surface for bonding.
  • adhesives and solvents may remain on the channel surface of the microfluidic device, and the adhesives and solvents may affect test results and measurement results.
  • Cited Document 1 discloses bonding two base materials made of plastic resin by thermocompression bonding without using an adhesive or a solvent. However, in Cited Document 1, it is necessary to perform pressure bonding at a temperature exceeding the glass transition temperature of the substrate, which may clog or deform the fine channels of the microfluidic device or warp the substrate itself containing the microfluidic device. There is
  • Cited Documents 2 and 3 disclose a method in which the substrates to be bonded are surface-modified in advance by plasma treatment, corona discharge treatment, or the like, and then press-bonded at a low temperature.
  • JP 2013-10076 A "Bonding Cycloolefin Polymers by Photosurface Activation: Evaluation of Bonding Strength and Application to Microchannels" Surface Technology Vol.65, No. 5, 2014 "Dissimilar Material Bonding of COP and Glass Substrate by Water Vapor Plasma” IEEJ Transactions Sensors and Micromachines Vol.138 No.8 pp.358-364, 2018
  • the adhesive state of the base material cannot be maintained for a long time.
  • the microfluidic device is used for liquid transfer or is placed under high temperature in a reagent-sealed state, the microfluidic device may be damaged due to its low water resistance.
  • surface modification may also affect the surface of the substrate opposite to the surface to be adhered.
  • the base material may be adhered to the mold during crimping with a press.
  • the surface is modified in advance and then the substrate is adhered, there is also a problem that the formed product becomes expensive.
  • a first substrate made of a first resin having a first glass transition temperature and a second resin made of a second resin having a second glass transition temperature lower than the first glass transition temperature a preparatory step of preparing two base materials; and a temporary bonding step of superimposing the second base material on the first base material and pressing them against each other at a predetermined temperature and with a predetermined pressure, wherein the predetermined temperature is the first base material. a temperature between one glass transition temperature and the second glass transition temperature;
  • a method of bonding substrates is provided that includes this bonding step of heating for a period of time.
  • a first substrate made of a first resin having a first glass transition temperature is combined with a second substrate made of a second resin having a second glass transition temperature lower than the first glass transition temperature. are superimposed and pressed against each other at a predetermined temperature and at a predetermined pressure, wherein the predetermined temperature is a temperature between the first glass transition temperature and the second glass transition temperature;
  • a substrate bonding system is provided comprising a bonding unit that heats the first substrate and the second substrate pressed together to a temperature approximately equal to the second glass transition temperature for a predetermined time.
  • the temperature is approximately equal to the second glass transition temperature. to heat these base materials (main bonding step). It suffices that the temperature applied to the two substrates is always lower than the first glass transition temperature. For this reason, two substrates can be inexpensively and firmly bonded without using adhesives or solvents, without warping or deforming the substrates, and without surface modification. can. Furthermore, the reliability of microfluidic devices produced by such bonding methods can be enhanced.
  • FIG. 1 is a schematic illustration of a substrate bonding system according to the present disclosure
  • FIG. 4 is a top view of the first substrate
  • Fig. 10 is a top view of another first base material
  • FIG. 10 is a side view of a first base material in another embodiment
  • FIG. 10 is a side view of a first base material and a second base material in another embodiment
  • FIG. 4 is a partial side view of the first base material and the second base material in the example
  • FIG. 5 is a diagram showing the relationship between the time of the main bonding step and the amount of recession of the second base material
  • FIG. 1 is a schematic diagram showing a substrate bonding system according to the present disclosure.
  • the substrate bonding system 10 shown in FIG. 1 is used to bond a first substrate 21 and a second substrate 22 together in at least partial surface contact.
  • the "base material" in this specification is a concept including both a plate and a film.
  • the first base material 21 is formed from a first resin having a first glass transition temperature Tg1.
  • the second base material 22 is made of a second resin having a second glass transition temperature Tg2 lower than the first glass transition temperature Tg1.
  • the first resin is a cycloolefin polymer and the second resin is a cycloolefin copolymer.
  • FIG. 2A is a top view of the first substrate.
  • the first substrate 21 preferably has at least one of grooves A and recesses B formed on its surface. Grooves A and recesses B form the channels of the microfluidic device.
  • a through-hole may be formed instead of or in addition to the recess B, and the second substrate 22 is preferably flat.
  • the surface of the first base material 21 may be flat, and the flat first base material 21 and the second base material 22 may simply be adhered.
  • another member may be enclosed between the first base material 21 and the second base material 22 .
  • the base material bonding system 10 includes a temporary bonding unit 11 that superimposes a second base material 22 on a first base material 21 and presses them together at a predetermined temperature and a predetermined pressure, and a second base material that is pressure bonded to each other. and a main bonding unit 12 for heating the first base material 21 and the second base material 22 for a predetermined period of time.
  • the temporary adhesion unit 11 is preferably a press, for example, and the main adhesion unit 12 is preferably a constant temperature bath, for example.
  • other devices having functions equivalent to those described later may be used as the temporary adhesion unit 11 and the permanent adhesion unit 12 .
  • the thickness of the first base material 21 is preferably 5 mm or less, more preferably 2 mm or less, and the thickness of the second base material 22 is preferably about 10 ⁇ m to 1 mm, more preferably 30 ⁇ m to 200 ⁇ m.
  • the first base material 21 when the first base material 21 is thicker than the second base material 22, the first base material 21 functions as a base, and the second base material 22 serves as a cover covering the surface of the first base material 21. function as Therefore, it is advantageous when a channel structure including grooves A and recesses B is formed on the surface of the first base material 21 .
  • the thicknesses of the first base material 21 and the second base material 22 are not limited to the above, and may be the same thickness.
  • the first base material 21 is formed by injection molding and the second base material 22 is formed by extrusion molding.
  • the areas of the first base material 21 and the second base material 22 are preferably approximately equal to each other. Alternatively, if the second substrate 22 has a sufficient area to cover the channel structure or specific portions of the first substrate 21, the area of the second substrate 22 is larger than the area of the first substrate 21. Small is fine.
  • the first base material 21 and the second base material 22 are supplied to the temporary adhesion unit 11.
  • the temporary adhesion unit 11 for example, a press
  • the second base material 22 is superimposed on the first base material 21 .
  • the superimposed first base material 21 and second base material 22 are arranged between the upper mold 15 and the lower mold 16 .
  • the first substrate 21 may be overlaid on the second substrate 22 .
  • the first substrate 21 may be sandwiched between two second substrates 22 and placed between the upper mold 15 and the lower mold 16 .
  • the temperature T1 of the upper mold 15 and the lower mold 16 of the temporary adhesion unit 11 is a value between the first glass transition temperature Tg1 of the first base material 21 and the second glass transition temperature Tg2 of the second base material 22.
  • the temperature T1 may be approximately equal to Tg2, which has a lower glass transition temperature.
  • the upper mold 15 and the lower mold 16 may be set to a temperature other than the temperature T1.
  • the mold 16 may be below temperature T1.
  • the first base material 21 will not be deformed or warped by the heat of the temporary adhesion unit 11. Therefore, it is particularly advantageous when the channel structure is formed in the first base material 21 .
  • the second substrate 22 softens at the temperature T1, and as a result, exhibits stickiness and adheres to the first substrate 21 .
  • the pressure for pressing the first base material 21 and the second base material 22 is a value sufficient to obtain adhesive strength, for example, 1 MPa or more, more preferably 3 MPa or more.
  • the pressing time for pressing the first base material 21 and the second base material 22 is also a value sufficient to obtain adhesive strength, for example, 30 seconds or longer, preferably 60 seconds or longer, and more preferably 120 seconds or longer. be.
  • the pressure and pressing time of the temporary bonding unit 11 also change depending on the materials and shapes of the first base material 21 and the second base material 22 .
  • the second glass transition temperature Tg2 of the second substrate 22 is lower than the first glass transition temperature Tg1 of the first substrate 21.
  • the difference between the temperature T1 and the first glass transition temperature Tg1 is 5 to 40°C, preferably 5 to 20°C
  • the difference between the temperature T1 and the second glass transition temperature Tg2 is 0 to 40°C, preferably 0 to 20°C. °C is preferred.
  • the difference between the first glass transition temperature Tg1 and the second glass transition temperature Tg2 is preferably 5°C to 40°C, preferably 10°C to 30°C. In other words, it is required to prepare the first base material 21 and the second base material 22 having such glass transition temperatures Tg1 and Tg2.
  • first base material 21 and the second base material 22 are temporarily bonded in the temporary bonding unit 11.
  • the temporarily bonded first base material 21 and second base material 22 are supplied to the final bonding unit 12 .
  • the temporarily bonded first base material 21 and second base material 22 are placed in an environment of temperature T2 for a predetermined period of time.
  • the predetermined time in the main bonding unit 12 is preferably relatively long.
  • the predetermined time is 30 minutes or longer, preferably 60 minutes or longer, and more preferably 120 minutes or longer.
  • the temperature T2 is a value approximately equal to the second glass transition temperature Tg2 of the second substrate 22.
  • the temperature T2 may be slightly below or slightly above the second glass transition temperature Tg2.
  • the temperature T2 in some embodiments is the second glass transition temperature Tg2 ⁇ 20°C. More preferably, the temperature T2 is the second glass transition temperature Tg2 ⁇ 10°C.
  • a large constant temperature bath is used as the main bonding unit 12
  • a plurality of temporarily bonded substrates can be treated at once.
  • a reflow oven is used as the main bonding unit 12
  • FIG. 4A which will be described later, is a partial side view of the first base material 21 and the second base material 22 after the temporary bonding process and before the permanent bonding process in one embodiment.
  • a second substrate 22 having a smaller thickness than the first substrate 21 is used.
  • the temperature T1 in the temporary bonding process is higher than the second glass transition temperature Tg2, so when the temporary bonding process is completed, the loosened second base material 22 may drop into the concave portion B of the first base material 21. be.
  • the amount of depression of the second base member 22 into the concave portion B increases as the dimension of the concave portion B increases.
  • the temperature T2 of the main bonding unit 12 is approximately equal to the second glass transition temperature Tg2, the second base material 22 shrinks, and as a result, the second base material 22 is prevented from falling into the concave portion B. Therefore, when the first substrate 21 has the grooves A and the recesses B, it is possible to avoid changes in the dimensions of their internal spaces, and to form a microfluidic device having channels of the required dimensions.
  • the entire first base material 21 is not warped or deformed, and the grooves Neither does the shape of the channel structure such as A and/or recess B change. Therefore, the two base materials 21 and 22 can be firmly adhered at low cost without warping of the base materials. Furthermore, it is possible to provide a highly reliable bond consisting of the first base material 21 and the second base material 22 .
  • the first substrate 21 having the grooves A and/or the recesses B formed on both the front surface and the back surface as described above is sandwiched between the two second substrates 22, the first substrate
  • the grooves A and/or the recesses B formed on the front and back sides of 21 can be closed simultaneously with two second substrates 22 .
  • the present disclosure there is no need to use an adhesive, a cover material with an adhesive, or the like, and they do not remain. Furthermore, in the present disclosure, it is not necessary to previously perform surface modification of the first base material 21 and the second base material 22 by vacuum ultraviolet treatment, plasma treatment, or corona discharge treatment. In addition, autofluorescence that may occur during vacuum ultraviolet treatment does not remain on the first base material 21 and the second base material 22 . Furthermore, unlike plasma treatment and corona discharge treatment, the wettability of the surfaces of the first base material 21 and the second base material 22 does not change, so the liquid flowability is not affected. Furthermore, since no surface modification is performed, the substrates 21 and 22 are not adhered to the mold of the pressing machine.
  • the two substrates 21, 22 can be bonded at low cost. Furthermore, when it is desired to modify the surface of the channel such as the groove A and/or the recess B to make it hydrophilic, the two base materials 21 and 22 are bonded as described above after the surface modification. Also good. This enables a strong seal with high water resistance.
  • the first resin of the first substrate 21 is a cycloolefin polymer and the second resin of the second substrate 22 is a cycloolefin copolymer.
  • such olefin-based resins have low water absorption and low adsorption of proteins and the like. Substrates made of such olefinic resins can be adhered without surface modification. Thus, it is also possible to provide an olefinic bond consisting of the first substrate 21 and the second substrate 22 .
  • a press machine is used as the main adhesion unit 12, and a predetermined pressure is applied to the first base material 21 and the second base material 22 in the main adhesion process, for example, as compared with the case of the temporary adhesion process. A lower pressure may be applied.
  • FIG. 3A is a side view of a first base material in another embodiment.
  • a first base material 21 shown in FIG. 3A has a plurality of fine uneven portions 21a formed on its surface. Such an uneven portion 21a is assumed to be much smaller than the grooves A and recesses B described above.
  • the concave-convex portion 21a may be formed at the time of manufacturing the first base material 21, for example, at the time of injection molding, or may be formed after the first base material 21 is manufactured.
  • a first base material 21 and a second base material 22 shown in Table 1 were prepared.
  • the first base material 21 is made of cycloolefin polymer (COP), and has a first glass transition temperature Tg1 of 100° C. and a thickness of 1.2 mm.
  • the second base material 22 is made of cycloolefin copolymer (COC), has a second glass transition temperature Tg2 of 78° C., and a thickness of 0.1 mm.
  • the recess B of the first base material 21 was previously filled with the reagent. The same is true for Comparative Examples 1 and 2.
  • the temperature T1 was set to 90°C, the pressure was set to 4.4 MPa, and the time was set to 120 seconds. Time was set to 2 hours. Furthermore, in the temporary bonding process of Comparative Examples 1 and 2, the temperature T1 was set to 90° C., the pressure was set to 8 MPa, and the time was set to 120 seconds, and the main bonding process was not performed. Further, in Comparative Example 2, surface modification treatment is performed with vacuum ultraviolet light before the temporary bonding step. A press machine was used as the temporary adhesion unit 11 and a constant temperature bath was used as the main adhesion unit 12 .
  • Example 1 The adhesives of Example 1 and Comparative Examples 1 and 2 thus prepared were separately heated at 42° C. from the viewpoint of accelerated testing.
  • the reagent filled in the recesses B did not leak even after 48 hours or more.
  • the reagent filled in the recesses B leaked after 1 to 10 hours (variations among multiple samples or variations due to recess positions within the same sample).
  • Comparative Example 2 the reagent filled in the recesses B leaked after 1 to 6 hours. Therefore, the present disclosure can provide an olefin adhesive with high water resistance.
  • Example 2 Example 2
  • FIG. 4A is a partial side view of the first base material and the second base material in Example 2.
  • FIG. The first substrate 21 and the second substrate 22 are the same as in Example 1 in Table 1. Further, the depth of the concave portion B formed in the first base material 21 is 0.7 mm.
  • the second base material 22 partially falls into the recess B of the first base material 21 as shown in FIG. 4A.
  • Z be the amount of depression of the upper surface of the second base material 22 at the position corresponding to the concave portion B. As shown in FIG.
  • the susceptibility to depression varies depending on adhesion conditions and material characteristics.
  • FIG. 4B is a diagram showing the relationship between the time of the main bonding process and the amount of recession of the second base material.
  • the depression amount Z is about 0.11 mm immediately after the temporary bonding process (the time of the main bonding process is zero). Then, the main bonding step is performed under the conditions of Example 1 shown in Table 1. After performing the main bonding process for at least 2 hours, the depression amount Z was 0.02 mm, which indicates that the depression is almost eliminated.
  • the time for the main bonding step in Example 2 is preferably a time that substantially eliminates the sagging amount Z and satisfies the water resistance (see Table 2).
  • the first resin of the first base material 21 and the second resin of the second base material 22 are olefinic polymers.
  • the first resin is a cycloolefin polymer (COP) and the second resin is a cycloolefin copolymer (COC).
  • COP cycloolefin polymer
  • COC cycloolefin copolymer
  • first resin and the second resin can also be employed as the first resin and the second resin.
  • first resin and the second resin can also be employed as the first resin and the second resin.
  • the same type of resin such as a cycloolefin polymer, with different specifications, eg, molecular weights, may be used as the first and second resins, provided that the glass transition temperatures are different from each other.
  • a cycloolefin copolymer (COC) is selected as the first resin
  • the second resin is A cycloolefin polymer (COP) may be selected.
  • microfluidic devices that include a first substrate and a second substrate bonded by the substrate bonding method and/or substrate bonding system of the present disclosure.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Micromachines (AREA)
PCT/JP2022/004729 2021-02-10 2022-02-07 基材接着方法、基材接着システムおよびマイクロ流体デバイス Ceased WO2022172898A1 (ja)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003211545A (ja) * 2002-01-29 2003-07-29 Mitsui Chemicals Inc フレキシブル両面金属積層板の製造方法
JP2013010076A (ja) * 2011-06-29 2013-01-17 Sumitomo Bakelite Co Ltd マイクロ流路デバイスの製造方法及びマイクロ流路チップ
JP2020011403A (ja) * 2018-07-13 2020-01-23 サムコ株式会社 シクロオレフィンポリマーの接合方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5576040B2 (ja) * 2007-12-27 2014-08-20 アルプス電気株式会社 樹脂物品の剥離方法およびマイクロチップの剥離方法
JP6394651B2 (ja) * 2016-07-15 2018-09-26 ウシオ電機株式会社 基板の貼り合わせ方法およびマイクロチップの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003211545A (ja) * 2002-01-29 2003-07-29 Mitsui Chemicals Inc フレキシブル両面金属積層板の製造方法
JP2013010076A (ja) * 2011-06-29 2013-01-17 Sumitomo Bakelite Co Ltd マイクロ流路デバイスの製造方法及びマイクロ流路チップ
JP2020011403A (ja) * 2018-07-13 2020-01-23 サムコ株式会社 シクロオレフィンポリマーの接合方法

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