WO2022170699A1 - 一种绑定引脚自动化转换方法及系统 - Google Patents

一种绑定引脚自动化转换方法及系统 Download PDF

Info

Publication number
WO2022170699A1
WO2022170699A1 PCT/CN2021/097473 CN2021097473W WO2022170699A1 WO 2022170699 A1 WO2022170699 A1 WO 2022170699A1 CN 2021097473 W CN2021097473 W CN 2021097473W WO 2022170699 A1 WO2022170699 A1 WO 2022170699A1
Authority
WO
WIPO (PCT)
Prior art keywords
binding
pin
pins
signal
chip
Prior art date
Application number
PCT/CN2021/097473
Other languages
English (en)
French (fr)
Inventor
刘司洋
王醉
Original Assignee
深圳市华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电半导体显示技术有限公司 filed Critical 深圳市华星光电半导体显示技术有限公司
Publication of WO2022170699A1 publication Critical patent/WO2022170699A1/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/394—Routing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/31—Design entry, e.g. editors specifically adapted for circuit design

Definitions

  • the present application relates to the field of display, in particular to a method and system for automatic conversion of binding pins.
  • the binding pins of the in-plane wiring need to match the connection pins of the out-of-plane circuit.
  • the feet are manually formulated and inspected.
  • the manual formulation and inspection method is inefficient, error-prone and expensive, which is not conducive to the development of panel design. Therefore, it is necessary to provide an automatic conversion method and system for binding pins to solve the above technical problems.
  • the embodiments of the present application provide an automatic conversion method and system for binding pins, which are used to solve the problem that in the existing panel design process, the binding pins for checking in-plane wiring and the binding pins for out-of-plane circuits need to be manually formulated.
  • the resulting problems are low efficiency, error-prone and high cost.
  • An embodiment of the present application provides an automatic conversion method for binding pins, including:
  • An automatic conversion method for binding pins including:
  • the signal identification of the binding pin of the display panel is automatically identified, and the signal identification of the binding pin of the circuit board is generated and output.
  • the signal identifiers of the bound pins of the display panel include pin serial numbers and pin signals.
  • the pin numbers of the binding pins of the display panel are Arabic numerals arranged in sequence
  • the pin signals of the binding pins of the display panel are the The electrical signal to which the binding pins of the display panel are connected.
  • the signal identifiers that define the binding pins of the display panel include:
  • the binding pins of the display panel are artificially defined, and the binding pins of the display panel are identified by the two levels of the pin number and the pin signal, wherein each of the pin numbers Corresponding to one of the pin signals respectively.
  • the electronic design automation program is used to automatically identify the signal identification of the binding pin of the display panel, and generate and output the signal identification of the binding pin of the circuit board, include:
  • the signal identification of the binding pin of the display panel the signal identification of the first binding pin of the chip-on-film is generated
  • the signal identifier of the binding pin of the circuit board is output.
  • the first binding pin of the chip-on-film is a pin that is bound with the binding pin of the display panel, and the chip-on-film The first binding pins are in one-to-one correspondence with the binding pins of the display panel.
  • generating the signal identification of the binding pin of the circuit board according to the signal identification of the first binding pin of the chip-on-film includes:
  • the signal identifiers of the first binding pins of the chip-on-chip films that are adjacent and have the same pin signal are automatically merged, and the merged signal identifiers are sequentially redefined to obtain the The signal identifier of the board's bound pins.
  • the binding pins of the circuit board are pins that are bound with the second binding pins of the chip on film, and the binding pins of the circuit board are The pins are in one-to-one correspondence with the second binding pins of the chip-on-film, and the second binding pins of the chip-on-film are inside the chip-on-film and the first binding pins of the chip-on-film.
  • the fixed pin realizes the electrical signal conduction pin.
  • generating the signal identification of the binding pin of the circuit board according to the signal identification of the first binding pin of the chip-on-film includes:
  • the signal identifiers of the first binding pins of the chip-on-chip films that are adjacent and have the same pin signal are automatically merged, and the merged signal identifiers are sequentially redefined to obtain the The signal identification of the second binding pin of the chip on film;
  • the signal identification of the binding pin of the circuit board is generated.
  • an automatic conversion system for binding pins including:
  • an identification module for automatically identifying the signal identification of the binding pin of the display panel
  • a conversion module for converting the signal identification of the binding pin of the display panel into the signal identification of the binding pin of the circuit board
  • the output module is used for outputting the signal identifier of the binding pin of the circuit board.
  • the embodiment of the present application adopts an automatic conversion method and system for binding pins, and the automatic conversion method for binding pins includes: defining a signal identifier of a binding pin of a display panel; Display the signal identification of the bound pins of the panel, and generate and output the signal identification of the bound pins of the circuit board.
  • the present application automatically converts the signal identification of the binding pin of the display panel into the signal identification of the binding pin of the circuit board through the electronic design automation program, instead of the binding pin for the in-plane and the out-of-plane circuit.
  • the operation of manually formulating inspections improves work efficiency, reduces the human error rate, and reduces labor costs.
  • Fig. 1 is the first flow chart of the binding pin automatic conversion method provided by the embodiment of the present application
  • Fig. 2 is the second flow chart of the binding pin automatic conversion method provided by the embodiment of the present application.
  • Fig. 3 is the first conversion schematic diagram of the binding pin automatic conversion method provided by the embodiment of the present application.
  • Fig. 4 is the second conversion schematic diagram of the binding pin automatic conversion method provided by the embodiment of the present application.
  • Fig. 5 is the third conversion schematic diagram of the binding pin automatic conversion method provided by the embodiment of the present application.
  • FIG. 6 is a first structural block diagram of a binding pin automatic conversion system provided by an embodiment of the present application.
  • Fig. 7 is the second structural block diagram of the binding pin automatic conversion system provided by the embodiment of the present application.
  • FIG. 8 is a third structural block diagram of the binding pin automatic conversion system provided by the embodiment of the present application.
  • Embodiments of the present application provide a method and system for automatic conversion of binding pins. Each of them will be described in detail below. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments.
  • FIG. 1 shows a first flow chart of the method for automatic conversion of binding pins provided by an embodiment of the present application.
  • the method for automatic conversion of binding pins provided by an embodiment of the present application includes:
  • each binding pin of the display panel is manually specified by the user, and each binding pin of the display panel is given a signal identifier, where the signal identifier includes a pin serial number and a pin signal.
  • the signal identifier includes a pin serial number and a pin signal.
  • Arabic numerals are used as the pin serial numbers, and the first-level identification is performed on the bound pins of the display panel with Arabic numerals arranged in sequence.
  • the electrical signal connected to the binding pin is used as the pin signal, since each binding pin of the display panel corresponds to at least one in-plane signal line connected to the display panel, that is, the signal line connected by the binding pin of the display panel
  • the electrical signals transmitted by the in-plane signal lines of the display panel perform second-level identification on the binding pins of the display panel.
  • FIG. 3 is a first conversion schematic diagram of an automatic conversion method for binding pins provided by an embodiment of the present application, and specifically shows a signal identifier of a binding pin of a display panel.
  • the display panel has 1098 binding pins, and the binding pins of the display panel use Arabic numerals 1, 2, 3... 1096, 1097 and 1098 sequentially from left to right Sorting of labels, the Arabic numerals corresponding to the binding pins are the pin serial numbers of the binding pins; at the same time, each binding pin uses the electrical signals TESTD, TESTC, VCOM1 connected to the binding pins. . ThousandsVCOM2, TESTB and TESTA are used for pin signal level identification.
  • the electrical signal connected to the bound pin with pin number 1 is TESTD
  • the pin signal of the bound pin is TESTD
  • the signal identification of the bound pin is pin number 1 and Pin signal TESTD
  • the electrical signal connected to the bound pin with pin number 6 is AVCOMR
  • the pin signal of the bound pin is AVCOMR
  • the signal identification of the bound pin is pin number 6 and Pin signal AVCOMR.
  • Each binding pin of the display panel has a pin number and a pin signal, and each pin number corresponds to a pin signal, and a pin signal can correspond to one or more pin numbers, When a pin signal corresponds to multiple pin numbers at the same time, these pin numbers may or may not be adjacent.
  • the signal identification of the binding pin of the display panel is automatically identified, and the signal identification of the binding pin of the circuit board is generated and output.
  • FIG. 2 shows a second flowchart of the method for automatic conversion of binding pins provided by an embodiment of the present application.
  • the signal identification of the bound pins of the display panel is automatically identified, and the signal identification of the bound pins of the circuit board is generated and output, including:
  • the electronic design automation program automatically identifies the signal identification of the binding pin of the display panel
  • the electronic design automation program can automatically identify the signal identification of the binding pin of the display panel, and read the signal of the binding pin of the display panel. Identification, including the pin number and pin signal of the bound pins of the display panel.
  • FIG. 4 shows a second conversion schematic diagram of the automatic conversion method for binding pins provided by the embodiment of the present application, and specifically shows that the signal identifiers of the binding pins of the display panel are converted into the binding pins of the circuit board.
  • Figure 4 corresponds to Figure 3.
  • the electronic design automation program automatically reads the signal identification of the binding pins of the display panel, the binding pins of the display panel (ACD Cell Pin) pin number and the signal identification table corresponding to the pin signal.
  • the first binding pin of the chip on film is the pin that is bound with the binding pin of the display panel, and the first binding pin of the chip on film is bound to the binding pin of the display panel.
  • the feet correspond one by one. Since the first binding pins of the chip on film are bound and connected in one-to-one correspondence with the binding pins of the display panel, the number of the first binding pins of the chip on film and the number of binding pins of the display panel The same, the pin number of the first binding pin of the chip-on-film is in one-to-one correspondence with the pin number of the binding pin of the display panel, and the pin signal of the first binding pin of the chip-on-film is the same as the display
  • the pin signals of the binding pins of the panel are in one-to-one correspondence and are the same, the pin numbers of the first binding pins of the chip-on-film and the pin signals are in one-to-one correspondence and match each other, and the matching result is bound to the display panel.
  • the pin number of the pin and the matching result is
  • the pin number of the first binding pin (COF Cell Pin) of the chip-on-chip film and the pin signal are obtained.
  • the chip-on-film also has 1098 first bonding pins, and the first bonding pins (COF Cell Pin) of the chip-on-chip film use Arabic numerals 1, 2, 3, ising 1096 from left to right , 1097 and 1098 are sequenced in sequence, and the Arabic numeral corresponding to the first binding pin is the pin number of the first binding pin.
  • the pin signal of the first binding pin (COF Cell Pin) with pin number 1 is the same as the pin signal of the binding pin (ACD Cell Pin) of the display panel with pin number 1, which is TESTD ;
  • the pin signal of the first binding pin (COF Cell Pin) with pin number 2 is the same as the pin signal of the binding pin (ACD Cell Pin) of the display panel with pin number 2, which is TESTC;
  • the pin signal of the first binding pin (COF Cell Pin) with pin number 3 is the same as the pin signal of the binding pin (ACD Cell Pin) of the display panel with pin number 3, which is VCOM1; And so on.
  • the electronic design automation program automatically merges the signal identifiers of the first binding pins of the adjacent chip-on-chip films with the same pin signal, and redefines the merged signal identifiers in sequence to obtain the chip-on-chip films.
  • the signal identification of the second binding pin of the chip-on-chip film includes a redefined pin serial number and a pin signal.
  • each second pin signal has a pin number and a pin signal, a pin number corresponds to a pin signal, and a pin signal can correspond to one or more pin numbers. When pin signals correspond to multiple pin numbers at the same time, these pin numbers are not adjacent.
  • the pin signal of the first bound pin with the pin number 1 is different from the pin signal of the first bound pin with the pin number 2, so the signal identification of the pin number 1 and the pin signal of TESTD can be Reserved, the pin number of the second binding pin is 1 and the pin signal is the signal identifier of TESTD; the pin signal of the first binding pin with the pin number 2 is the first binding pin with the pin number 3.
  • the pin signal of the fixed pin is different, so the pin number 2 pin signal is the signal identifier of TESTC, and the pin number 2 as the second binding pin is the signal identifier of TESTC;
  • the pin signals of the first bound pins with serial numbers 3, 4 and 5 are all VCOM1, and the signal identifiers of the first bound pins with the adjacent pin numbers of 3, 4 and 5 are merged and combined as
  • the pin number of the second binding pin is 3 and the pin signal is the signal identifier of VCOM1;
  • the pin signal of the first binding pin whose pin number is 6 is the same as the first binding pin whose pin number is 7
  • the pin signal is different, so it is redefined as the pin number of the second binding pin in turn, the pin number is 4, and the pin signal is the signal identifier of AVCOMR; and so on, the fifth and sixth lines in Figure 4 or As shown in the fifth and sixth rows in Figure 5, the second bonding pin of the chip on film (COF PCBA Pin) pin number and the signal identification table corresponding
  • the second binding pin of the chip-on-film is a pin that is bound to the binding pin of the circuit board, and the second binding pin of the chip-on-film is bound to the circuit board.
  • the binding pins correspond one-to-one.
  • the second binding pins of the flip-chip film are bound and connected one-to-one with the binding pins of the circuit board, so the number of the second binding pins of the flip-chip film is the same as the number of binding pins of the circuit board.
  • the pin number of the second binding pin of the chip-on-film is in one-to-one correspondence with the pin number of the binding pin of the circuit board, and the pin signal of the second binding pin of the chip-on-film is the same as that of the circuit board.
  • the pin signals of the binding pins of the circuit board correspond one-to-one and are the same, the pin numbers of the binding pins of the circuit board and the pin signals are in one-to-one correspondence and match each other, and the matching result is the same as the second binding lead of the flip chip film.
  • the pin number of the pin and the matching result of the pin signal are the same. That is, the signal identification of the binding pin of the circuit board is exactly the same as the signal identification of the second binding pin of the chip on film.
  • the signal identification of the pin after converting the signal identification of the first binding pin of the chip-on-film into the signal identification of the second binding pin of the chip-on-film, after the second binding pin of the chip-on-film
  • the signal identification of the pin generates the bonding pin of the circuit board (PCBA Pin) signal identification table, as shown in the seventh row and the eighth row in Figure 4.
  • the second binding of the chip on film is regarded as the second binding
  • the signal identification table of the pin is the obtained signal identification table of the binding pin of the circuit board. Compared with the previous embodiment, it is no longer necessary to generate the binding pin of the circuit board according to the signal identification of the second binding pin of the chip on film.
  • the signal identification table of the fixed pin is shown in Figure 5.
  • the adjacent tables belonging to the same pin signal in the signal identification table can be filled with the same color, and the adjacent tables belonging to different pin signals can be filled with different colors.
  • the automatic conversion method for binding pins provided by the embodiments of the present application automatically converts the signal identification of the binding pins of the display panel into the signal identification of the binding pins of the circuit board through the electronic design automation program, instead of manually formulating the inspection surface
  • the operations of the internal binding pins and the out-of-plane circuit binding pins improve work efficiency, reduce the human error rate, and reduce labor costs.
  • FIG. 6 shows a first structural block diagram of the binding pin automatic conversion system provided by the embodiment of the present application.
  • the binding pin automatic conversion system includes:
  • a definition module 61 is used to define the signal identification of the binding pin of the display panel
  • the user manually specifies the definition of each bound pin of the display panel through the definition module 61, and assigns a signal identifier to each bound pin of the display panel, where the signal identifier includes a pin serial number and a pin signal.
  • the signal identifier includes a pin serial number and a pin signal.
  • Arabic numerals are used as the pin serial numbers, and the first-level identification is performed on the bound pins of the display panel with Arabic numerals arranged in sequence.
  • the electrical signal connected to the binding pin is used as the pin signal, and the second-level identification is performed on the binding pin of the display panel by the electrical signal.
  • the identification module 62 is used to automatically identify the signal identification of the binding pin of the display panel
  • the identification module 62 automatically identifies the signal identifiers of the bound pins of the display panel in the definition module 61, and reads the signal identifiers of the bound pins of the display panel, including the pin numbers of the bound pins of the display panel and pin signal.
  • the conversion module 63 is used to convert the signal identification of the binding pin of the display panel into the signal identification of the binding pin of the circuit board;
  • the conversion module 63 obtains the pin number and pin signal of the binding pin of the display panel read by the identification module 62, and converts them into the pin number and pin signal of the binding pin of the circuit board. corresponding signal identifier.
  • the output module 64 is used for outputting the signal identifier of the binding pin of the circuit board.
  • FIG. 7 shows a second structural block diagram of the automatic conversion system for binding pins provided by the embodiment of the present application.
  • the conversion module 63 includes:
  • the first generating unit 631 is used for generating the signal identification of the first binding pin of the chip-on-chip film according to the signal identification of the binding pin of the display panel;
  • the first generating unit 631 acquires the pin serial number and pin signal of the binding pin of the display panel read by the identification module 62, and generates a signal identifier of the first binding pin of the chip on film.
  • the pin number of the first binding pin of the chip on film is in one-to-one correspondence with the pin number of the binding pin of the display panel, and the pin signal of the first binding pin of the chip on film is the same as that of the display panel.
  • the pin signals of the binding pins are in one-to-one correspondence and are the same, the pin numbers of the first binding pins of the chip-on-film and the pin signals are in one-to-one correspondence and match each other, and the matching result is the same as that of the binding pins of the display panel.
  • the matching result of the pin number and pin signal is the same.
  • the conversion unit 632 is used to convert the signal identification of the first binding pin of the chip-on-film into the signal identification of the second binding pin of the chip-on-film;
  • the converting unit 632 acquires the signal identifiers of the first binding pins of the chip on film in the first generating unit 631, and automatically merges the signal identifiers of the first binding pins of the chip on film that are adjacent and have the same pin signal. , and redefine the merged signal identifiers in sequence to obtain the signal identifier of the second binding pin of the chip-on-film, and the signal identifier of the second binding pin of the chip-on-film includes the redefined pin serial number and pin signal.
  • each second pin signal has a pin number and a pin signal, a pin number corresponds to a pin signal, and a pin signal can correspond to one or more pin numbers. When pin signals correspond to multiple pin numbers at the same time, these pin numbers are not adjacent.
  • the second generating unit 633 is configured to generate the signal identification of the binding pin of the circuit board according to the signal identification of the second signal binding pin of the chip-on-film;
  • the second binding pins of the chip on film are pins bound with the binding pins of the circuit board, and the second binding pins of the chip on film correspond to the binding pins of the circuit board one-to-one.
  • the second binding pins of the flip-chip film are bound and connected one-to-one with the binding pins of the circuit board, so the number of the second binding pins of the flip-chip film is the same as the number of binding pins of the circuit board.
  • the pin number of the second binding pin of the chip-on-film is in one-to-one correspondence with the pin number of the binding pin of the circuit board, and the pin signal of the second binding pin of the chip-on-film is the same as that of the circuit board.
  • the pin signals of the binding pins of the circuit board correspond one-to-one and are the same, the pin numbers of the binding pins of the circuit board and the pin signals are in one-to-one correspondence and match each other, and the matching result is the same as the second binding lead of the flip chip film.
  • the pin number of the pin and the matching result of the pin signal are the same.
  • FIG. 8 shows a third structural block diagram of the binding pin automatic conversion system provided by the embodiment of the present application.
  • the conversion module 63 includes:
  • the first generating unit 631 is used for generating the signal identification of the first binding pin of the chip on film according to the signal identification of the binding pin of the display panel;
  • the conversion unit 632 is used to convert the signal identification of the first binding pin of the chip-on-film into the signal identification of the binding pin of the circuit board;
  • the signal identification of the binding pin of the circuit board is exactly the same as the signal identification of the second binding pin of the chip-on-film
  • the signal identification of the first binding pin of the chip-on-film is converted into the signal identification of the first binding pin of the chip-on-film.
  • the signal identification of the second binding pin is regarded as converting the signal identification of the first binding pin of the chip-on-film into the signal identification of the binding pin of the circuit board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Liquid Crystal (AREA)

Abstract

一种绑定引脚自动化转换方法及系统，该绑定引脚自动化转换方法包括：定义显示面板的绑定引脚的信号标识（S1）；通过电子设计自动化程序，自动识别所述显示面板的绑定引脚的信号标识，生成并输出电路板的绑定引脚的信号标识（S2）。

Description

一种绑定引脚自动化转换方法及系统 技术领域
本申请涉及显示领域，具体涉及一种绑定引脚自动化转换方法及系统。
 背景技术
在显示面板的设计过程中，面内走线的绑定引脚需要与面外电路的连接引脚相匹配，现有技术是将面内走线的绑定引脚与面外电路的连接引脚进行人工制定与检查，然而，面内走线的绑定引脚往往有几百甚至几千个，人工制定和检查的方式效率低、容易出错且成本高，不利于面板设计的发展。因此，有必要提供一种绑定引脚自动化转换方法及系统，用以解决上述技术问题。
 技术问题
本申请实施例提供一种绑定引脚自动化转换方法及系统，用以解决现有面板设计过程中因需要人工制定检查面内走线的绑定引脚和面外电路的绑定引脚，而带来的效率低、易出错且成本高的问题。
 技术解决方案
本申请实施例提供一种绑定引脚自动化转换方法，包括：
一种绑定引脚自动化转换方法，包括：
定义显示面板的绑定引脚的信号标识；
通过电子设计自动化程序，自动识别所述显示面板的绑定引脚的信号标识，生成并输出电路板的绑定引脚的信号标识。
可选的，在本申请的一些实施例中，所述显示面板的绑定引脚的信号标识包括引脚序号和引脚信号。
可选的，在本申请的一些实施例中，所述显示面板的绑定引脚的引脚序号为顺次排列的阿拉伯数字，所述显示面板的绑定引脚的引脚信号为所述显示面板的绑定引脚所连接的电信号。
可选的，在本申请的一些实施例中，所述定义显示面板的绑定引脚的信号标识，包括：
人为定义所述显示面板的绑定引脚，分别用所述引脚序号和所述引脚信号两个层级对所述显示面板的绑定引脚进行标识，其中，每一所述引脚序号分别对应一个所述引脚信号。
可选的，在本申请的一些实施例中，所述通过电子设计自动化程序，自动识别所述显示面板的绑定引脚的信号标识，生成并输出电路板的绑定引脚的信号标识，包括：
通过所述电子设计自动化程序自动识别所述显示面板的绑定引脚的信号标识；
根据所述显示面板的绑定引脚的信号标识，生成覆晶薄膜的第一绑定引脚的信号标识；
根据所述覆晶薄膜的第一绑定引脚的信号标识，生成所述电路板的绑定引脚的信号标识；
输出所述电路板的绑定引脚的信号标识。
可选的，在本申请的一些实施例中，所述覆晶薄膜的第一绑定引脚为与所述显示面板的绑定引脚进行绑定的引脚，且所述覆晶薄膜的第一绑定引脚与所述显示面板的绑定引脚一一对应。
可选的，在本申请的一些实施例中，所述根据所述覆晶薄膜的第一绑定引脚的信号标识，生成所述电路板的绑定引脚的信号标识，包括：
通过所述电子设计自动化程序，自动合并相邻且引脚信号相同的所述覆晶薄膜的第一绑定引脚的信号标识，并顺次对合并后的信号标识进行重新定义，得到所述电路板的绑定引脚的信号标识。
可选的，在本申请的一些实施例中，所述电路板的绑定引脚为与所述覆晶薄膜的第二绑定引脚进行绑定的引脚，所述电路板的绑定引脚与所述覆晶薄膜的第二绑定引脚一一对应，所述覆晶薄膜的第二绑定引脚为在所述覆晶薄膜的内部与所述覆晶薄膜的第一绑定引脚实现电信号导通的引脚。
可选的，在本申请的一些实施例中，所述根据所述覆晶薄膜的第一绑定引脚的信号标识，生成所述电路板的绑定引脚的信号标识，包括：
通过所述电子设计自动化程序，自动合并相邻且引脚信号相同的所述覆晶薄膜的第一绑定引脚的信号标识，并顺次对合并后的信号标识进行重新定义，得到所述覆晶薄膜的第二绑定引脚的信号标识；
根据所述覆晶薄膜的第二绑定引脚的信号标识，生成所述电路板的绑定引脚的信号标识。
相应的，本申请实施例还提供一种绑定引脚自动化转换系统，包括：
定义模块，用于定义显示面板的绑定引脚的信号标识；
识别模块，用于自动识别所述显示面板的绑定引脚的信号标识；
转换模块，用于将所述显示面板的绑定引脚的信号标识转换为电路板的绑定引脚的信号标识；以及
输出模块，用于输出所述电路板的绑定引脚的信号标识。
 有益效果
本申请实施例采用一种绑定引脚自动化转换方法及系统，所述绑定引脚自动化转换方法包括：定义显示面板的绑定引脚的信号标识；通过电子设计自动化程序，自动识别所述显示面板的绑定引脚的信号标识，生成并输出电路板的绑定引脚的信号标识。本申请通过电子设计自动化程序，自动将显示面板的绑定引脚的信号标识转换为电路板的绑定引脚的信号标识，代替了针对面内绑定引脚和面外电路绑定引脚的人工制定检查的操作，提高了工作效率，降低了人为出错率，且降低了人力成本。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的绑定引脚自动化转换方法的第一种流程图；
图2是本申请实施例提供的绑定引脚自动化转换方法的第二种流程图；
图3是本申请实施例提供的绑定引脚自动化转换方法的第一种转换示意图；
图4是本申请实施例提供的绑定引脚自动化转换方法的第二种转换示意图；
图5是本申请实施例提供的绑定引脚自动化转换方法的第三种转换示意图；
图6是本申请实施例提供的绑定引脚自动化转换系统的第一种结构框图；
图7是本申请实施例提供的绑定引脚自动化转换系统的第二种结构框图；
图8是本申请实施例提供的绑定引脚自动化转换系统的第三种结构框图。
本申请的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。此外，应当理解的是，此处所描述的具体实施方式仅用于说明和解释本申请，并不用于限制本申请。在本申请中，在未作相反说明的情况下，使用的方位词如“上”和“下”通常是指装置实际使用或工作状态下的上和下，具体为附图中的图面方向；而“内”和“外”则是针对装置的轮廓而言的。
本申请实施例提供一种绑定引脚自动化转换方法及系统。以下分别进行详细说明。需说明的是，以下实施例的描述顺序不作为对实施例优选顺序的限定。
在一种实施例中，请参照图1，图1示出了本申请实施例提供的绑定引脚自动化转换方法的第一种流程图，本申请实施例提供的绑定引脚自动化转换方法，包括：
S1、定义显示面板的绑定引脚的信号标识；
具体的，由用户人为指定显示面板的每个绑定引脚的定义，赋予显示面板的每个绑定引脚信号标识，所述信号标识包括引脚序号和引脚信号。可选的，采用阿拉伯数字作为引脚序号，以顺次排列的阿拉伯数字对显示面板的绑定引脚进行第一层级的标识。同时，采用绑定引脚所连接的电信号作为引脚信号，由于显示面板的每一个绑定引脚对应连接显示面板的至少一条面内信号线，即由显示面板的绑定引脚连接的显示面板的面内信号线所传输的电信号对显示面板的绑定引脚进行第二层级的标识。
请参照图3，图3是本申请实施例提供的绑定引脚自动化转换方法的第一种转换示意图，具体示出了一种显示面板的绑定引脚的信号标识。如图3所示，该显示面板具有1098个绑定引脚，显示面板的绑定引脚从左到右采用阿拉伯数字1、2、3......1096、1097和1098顺次进行标号排序，所述绑定引脚对应的阿拉伯数字即为该绑定引脚的引脚序号；同时，每个绑定引脚采用该绑定引脚所连接的电信号TESTD、TESTC、VCOM1......VCOM2、TESTB和TESTA进行引脚信号层级的标识。如图所示，引脚序号为1的绑定引脚所连接的电信号为TESTD，该绑定引脚的引脚信号即为TESTD，该绑定引脚的信号标识为引脚序号1和引脚信号TESTD；引脚序号为6的绑定引脚所连接的电信号为AVCOMR，该绑定引脚的引脚信号即为AVCOMR，该绑定引脚的信号标识为引脚序号6和引脚信号AVCOMR。显示面板的每一个绑定引脚均具有一个引脚序号和一个引脚信号，且每一个引脚序号分别对应于一个引脚信号，一个引脚信号可以对应于一个或多个引脚序号，当一个引脚信号同时对应于多个引脚序号时，这些引脚序号可以相邻也可以不相邻。
S2、通过电子设计自动化程序，自动识别显示面板的绑定引脚的信号标识，生成并输出电路板的绑定引脚的信号标识。
在一种实施例中，请参照图2，图2示出了本申请实施例提供的绑定引脚自动化转换方法的第二种流程图。如图2所示，通过电子设计自动化程序，自动识别显示面板的绑定引脚的信号标识，生成并输出电路板的绑定引脚的信号标识，包括：
S21、电子设计自动化程序自动识别显示面板的绑定引脚的信号标识；
具体的，在显示面板的绑定引脚的信号标识定义完后，电子设计自动化程序（EDA）可自动识别显示面板的绑定引脚的信号标识，读取显示面板的绑定引脚的信号标识，包括显示面板的绑定引脚的引脚序号和引脚信号。
请参照图4，图4示出了本申请实施例提供的绑定引脚自动化转换方法的第二种转换示意图，具体示出了显示面板的绑定引脚的信号标识转换为电路板的绑定引脚的信号标识的表格示意图，图4与图3相对应。电子设计自动化程序自动读取显示面板的绑定引脚的信号标识后，得到如图4或图5中前两行所示，显示面板的绑定引脚（ACD Cell Pin）的引脚序号和引脚信号相对应的信号标识表。
S22、根据显示面板的绑定引脚的信号标识，生成覆晶薄膜的第一绑定引脚的信号标识；
在显示面板的设计中，覆晶薄膜的第一绑定引脚为与显示面板的绑定引脚进行绑定的引脚，覆晶薄膜的第一绑定引脚与显示面板的绑定引脚一一对应。由于覆晶薄膜的第一绑定引脚的与显示面板的绑定引脚一一对应绑定连接，因此覆晶薄膜的第一绑定引脚的数量与显示面板的绑定引脚的数量相同，覆晶薄膜的第一绑定引脚的引脚序号与显示面板的绑定引脚的引脚序号一一对应且相同，覆晶薄膜的第一绑定引脚的引脚信号与显示面板的绑定引脚的引脚信号一一对应且相同，覆晶薄膜的第一绑定引脚的引脚序号和引脚信号一一对应且相互匹配，并且匹配结果与显示面板的绑定引脚的引脚序号和引脚信号的匹配结果相同。
如图4中第三行和第四行或图5中第三行和第四行所示，得到覆晶薄膜的第一绑定引脚（COF Cell Pin）的引脚序号和引脚信号相对应的信号标识表。该覆晶薄膜同样具有1098个第一绑定引脚，覆晶薄膜的第一绑定引脚（COF Cell Pin）从左到右采用阿拉伯数字1、2、3、......1096、1097和1098顺次进行标号排序，第一绑定引脚对应的阿拉伯数字即为该第一绑定引脚的引脚序号。同时，引脚序号为1的第一绑定引脚（COF Cell Pin）的引脚信号与引脚序号为1的显示面板的绑定引脚（ACD Cell Pin）的引脚信号相同，为TESTD；引脚序号为2的第一绑定引脚（COF Cell Pin）的引脚信号与引脚序号为2的显示面板的绑定引脚（ACD Cell Pin）的引脚信号相同，为TESTC；引脚序号为3的第一绑定引脚（COF Cell Pin）的引脚信号与引脚序号为3的显示面板的绑定引脚（ACD Cell Pin）的引脚信号相同，为VCOM1；以此类推。
S23、根据覆晶薄膜的第一绑定引脚的信号标识，生成电路板的绑定引脚的信号标识；
具体的，电子设计自动化程序自动合并相邻且引脚信号相同的覆晶薄膜的第一绑定引脚的信号标识，并顺次对合并后的信号标识进行重新定义，得到所述覆晶薄膜的第二绑定引脚的信号标识，覆晶薄膜的第二绑定引脚的信号标识包括重新定义的引脚序号和引脚信号。同样的，每个第二引脚信号均具有一个引脚序号和一个引脚信号，一个引脚序号对应于一个引脚信号，一个引脚信号可以对应于一个或多个引脚序号，当一个引脚信号同时对应于多个引脚序号时，这些引脚序号不相邻。
引脚序号为1的第一绑定引脚的引脚信号与引脚序号为2的第一绑定引脚的引脚信号不同，因此引脚序号为1引脚信号为TESTD的信号标识得以保留，作为第二绑定引脚的引脚序号为1引脚信号为TESTD的信号标识；引脚序号为2的第一绑定引脚的引脚信号与引脚序号为3的第一绑定引脚的引脚信号不同，因此引脚序号为2引脚信号为TESTC的信号标识得以保留，作为第二绑定引脚的引脚序号为2引脚信号为TESTC的信号标识；引脚序号为3、4和5的第一绑定引脚的引脚信号均为VCOM1，将相邻的引脚序号为3、4和5的第一绑定引脚的信号标识合并，合并后作为第二绑定引脚的引脚序号为3引脚信号为VCOM1的信号标识；引脚序号为6的第一绑定引脚的引脚信号与引脚序号为7的第一绑定引脚的引脚信号不同，因此顺次将其重新定义为第二绑定引脚的引脚序号为4引脚信号为AVCOMR的信号标识；依次类推，得到如图4中第五行和第六行或图5中第五行和第六行所示，覆晶薄膜的第二绑定引脚（COF PCBA Pin）的引脚序号和引脚信号相对应的信号标识表。
又由于，在显示面板的设计中，覆晶薄膜的第二绑定引脚为与电路板的绑定引脚进行绑定的引脚，覆晶薄膜的第二绑定引脚与电路板的绑定引脚一一对应。覆晶薄膜的第二绑定引脚的与电路板的绑定引脚一一对应绑定连接，因此覆晶薄膜的第二绑定引脚的数量与电路板的绑定引脚的数量相同，覆晶薄膜的第二绑定引脚的引脚序号与电路板的绑定引脚的引脚序号一一对应且相同，覆晶薄膜的第二绑定引脚的引脚信号与电路板的绑定引脚的引脚信号一一对应且相同，电路板的绑定引脚的引脚序号和引脚信号一一对应且相互匹配，并且匹配结果与覆晶薄膜的第二绑定引脚的引脚序号和引脚信号的匹配结果相同。即，电路板的绑定引脚的信号标识与覆晶薄膜的第二绑定引脚的信号标识完全相同。在一种实施方案中，在将覆晶薄膜的第一绑定引脚的信号标识转换为覆晶薄膜的第二绑定引脚的信号标识后，在通过覆晶薄膜的第二绑定引脚的信号标识生成电路板的绑定引脚（PCBA Pin）的信号标识表，如图4中第七行和第八行所示。在两一种实施方案中，当将覆晶薄膜的第一绑定引脚的信号标识转换为覆晶薄膜的第二绑定引脚的信号标识后，即视覆晶薄膜的第二绑定引脚的信号标识表为得到的电路板的绑定引脚的信号标识表，相对于上一种实施方案，无需再根据覆晶薄膜的第二绑定引脚的信号标识生成电路板的绑定引脚的信号标识表，如图5所示。
为了便于识别，可将信号标识表中相邻且属于同一种引脚信号的表格用同一种颜色填充，相邻且属于不同种引脚信号的表格用不同的颜色填充。
S24、输出电路板的绑定引脚的信号标识。
本申请实施例提供的绑定引脚自动化转换方法，通过电子设计自动化程序自动将显示面板的绑定引脚的信号标识转换为电路板的绑定引脚的信号标识，代替了人工制定检查面内绑定引脚和面外电路绑定引脚的操作，提高了工作效率，降低了人为出错率，且降低了人工成本。
相应的，本申请实施例还提供一种绑定引脚自动化转换系统，用于实施本申请提供的绑定引脚自动化转换方法。请参照图6，图6示出了本申请实施例提供的绑定引脚自动化转换系统的第一种结构框图，如图6所示，该绑定引脚自动化转换系统包括：
定义模块61，用于定义显示面板的绑定引脚的信号标识；
具体的，用户通过定义模块61人为指定显示面板的每个绑定引脚的定义，赋予显示面板的每个绑定引脚信号标识，所述信号标识包括引脚序号和引脚信号。可选的，采用阿拉伯数字作为引脚序号，以顺次排列的阿拉伯数字对显示面板的绑定引脚进行第一层级的标识。同时，采用绑定引脚所连接的电信号作为引脚信号，以电信号对显示面板的绑定引脚进行第二层级的标识。
识别模块62，用于自动识别显示面板的绑定引脚的信号标识；
具体的，识别模块62自动识别定义模块61中显示面板的绑定引脚的信号标识，并读取显示面板的绑定引脚的信号标识，包括显示面板的绑定引脚的引脚序号和引脚信号。
转换模块63，用于将显示面板的绑定引脚的信号标识转换为电路板的绑定引脚的信号标识；
具体的，转换模块63获取识别模块62读取的显示面板的绑定引脚的引脚序号和引脚信号，并将其转换为电路板的绑定引脚的引脚序号和引脚信号相对应的信号标识。
输出模块64，用于输出电路板的绑定引脚的信号标识。
在一种实施例中，请参照图7，图7示出了本申请实施例提供的绑定引脚自动化转换系统的第二种结构框图，如图7所示，转换模块63包括：
第一生成单元631，用于根据显示面板的绑定引脚的信号标识，生成覆晶薄膜的第一绑定引脚的信号标识；
具体的，第一生成单元631获取识别模块62读取的显示面板的绑定引脚的引脚序号和引脚信号，并生成覆晶薄膜的第一绑定引脚的信号标识。覆晶薄膜的第一绑定引脚的引脚序号与显示面板的绑定引脚的引脚序号一一对应且相同，覆晶薄膜的第一绑定引脚的引脚信号与显示面板的绑定引脚的引脚信号一一对应且相同，覆晶薄膜的第一绑定引脚的引脚序号和引脚信号一一对应且相互匹配，并且匹配结果与显示面板的绑定引脚的引脚序号和引脚信号的匹配结果相同。
转换单元632，用于将覆晶薄膜的第一绑定引脚的信号标识转换为覆晶薄膜的第二绑定引脚的信号标识；
具体的，转换单元632获取第一生成单元631内覆晶薄膜的第一绑定引脚的信号标识，自动合并相邻且引脚信号相同的覆晶薄膜的第一绑定引脚的信号标识，并顺次对合并后的信号标识进行重新定义，得到所述覆晶薄膜的第二绑定引脚的信号标识，覆晶薄膜的第二绑定引脚的信号标识包括重新定义的引脚序号和引脚信号。同样的，每个第二引脚信号均具有一个引脚序号和一个引脚信号，一个引脚序号对应于一个引脚信号，一个引脚信号可以对应于一个或多个引脚序号，当一个引脚信号同时对应于多个引脚序号时，这些引脚序号不相邻。
第二生成单元633，用于根据覆晶薄膜的第二信号绑定引脚的信号标识生成电路板的绑定引脚的信号标识；
覆晶薄膜的第二绑定引脚为与电路板的绑定引脚进行绑定的引脚，覆晶薄膜的第二绑定引脚与电路板的绑定引脚一一对应。覆晶薄膜的第二绑定引脚的与电路板的绑定引脚一一对应绑定连接，因此覆晶薄膜的第二绑定引脚的数量与电路板的绑定引脚的数量相同，覆晶薄膜的第二绑定引脚的引脚序号与电路板的绑定引脚的引脚序号一一对应且相同，覆晶薄膜的第二绑定引脚的引脚信号与电路板的绑定引脚的引脚信号一一对应且相同，电路板的绑定引脚的引脚序号和引脚信号一一对应且相互匹配，并且匹配结果与覆晶薄膜的第二绑定引脚的引脚序号和引脚信号的匹配结果相同。
在另一种实施例中，请参照图8，图8示出了本申请实施例提供的绑定引脚自动化转换系统的第三种结构框图，如图8所示，转换模块63包括：
第一生成单元631，用于根据显示面板的绑定引脚的信号标识，生成覆晶薄膜的第一绑定引脚的信号标识；以及
转换单元632，用于将覆晶薄膜的第一绑定引脚的信号标识转换为电路板的绑定引脚的信号标识；
其中，由于电路板的绑定引脚的信号标识与覆晶薄膜的第二绑定引脚的信号标识完全相同，将覆晶薄膜的第一绑定引脚的信号标识转换为覆晶薄膜的第二绑定引脚的信号标识即视为将覆晶薄膜的第一绑定引脚的信号标识转换为电路板的绑定引脚的信号标识。
以上对本申请实施例所提供的一种绑定引脚自动化转换方法及系统进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方法及其核心思想；同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种绑定引脚自动化转换方法，其中，包括：
    定义显示面板的绑定引脚的信号标识；
    通过电子设计自动化程序，自动识别所述显示面板的绑定引脚的信号标识，生成并输出电路板的绑定引脚的信号标识；
    其中，所述信号标识包括第一信号标识和第二信号标识，一个所述第二信号标识对应多个第一信号标识。
  2. 如权利要求1所述的绑定引脚自动化转换方法，其中，所述显示面板的绑定引脚的信号标识包括引脚序号和引脚信号，所述第一信号标识为所述引脚序号，所述第二信号标识为所述引脚信号。
  3. 如权利要求2所述的绑定引脚自动化转换方法，其中，所述显示面板的绑定引脚的引脚序号为顺次排列的阿拉伯数字，所述显示面板的绑定引脚的引脚信号为所述显示面板的绑定引脚所连接的电信号。
  4. 如权利要求2所述的绑定引脚自动化转换方法，其中，所述定义显示面板的绑定引脚的信号标识，包括：
    人为定义所述显示面板的绑定引脚，分别用所述引脚序号和所述引脚信号两个层级对所述显示面板的绑定引脚进行标识，其中，每一所述引脚序号分别对应一个所述引脚信号。
  5. 如权利要求1所述的绑定引脚自动化转换方法，其中，所述通过电子设计自动化程序，自动识别所述显示面板的绑定引脚的信号标识，生成并输出电路板的绑定引脚的信号标识，包括：
    通过所诉电子设计自动化程序自动识别所述显示面板的绑定引脚的信号标识；
    根据所述显示面板的绑定引脚的信号标识，生成覆晶薄膜的第一绑定引脚的信号标识；
    根据所述覆晶薄膜的第一绑定引脚的信号标识，生成所述电路板的绑定引脚的信号标识；
    输出所述电路板的绑定引脚的信号标识。
  6. 如权利要求5所述的绑定引脚自动化转换方法，其中，所述覆晶薄膜的第一绑定引脚为与所述显示面板的绑定引脚进行绑定的引脚，且所述覆晶薄膜的第一绑定引脚与所述显示面板的绑定引脚一一对应。
  7. 如权利要求5所述的绑定引脚自动化转换方法，其中，所述根据所述覆晶薄膜的第一绑定引脚的信号标识，生成所述电路板的绑定引脚的信号标识，包括：
    通过所述电子设计自动化程序，自动合并相邻且引脚信号相同的所述覆晶薄膜的第一绑定引脚的信号标识，并顺次对合并后的信号标识进行重新定义，得到所述电路板的绑定引脚的信号标识。
  8. 如权利要求7所述的绑定引脚自动化转换方法，其中，所述电路板的绑定引脚为与所述覆晶薄膜的第二绑定引脚进行绑定的引脚，所述电路板的绑定引脚与所述覆晶薄膜的第二绑定引脚一一对应，所述覆晶薄膜的第二绑定引脚为在所述覆晶薄膜的内部与所述覆晶薄膜的第一绑定引脚实现电信号导通的引脚。
  9. 如权利要求5所述的绑定引脚自动化转换方法，其中，所述根据所述覆晶薄膜的第一绑定引脚的信号标识，生成所述电路板的绑定引脚的信号标识，包括：
    通过所述电子设计自动化程序，自动合并相邻且引脚信号相同的所述覆晶薄膜的第一绑定引脚的信号标识，并顺次对合并后的信号标识进行重新定义，得到所述覆晶薄膜的第二绑定引脚的信号标识；
    根据所述覆晶薄膜的第二绑定引脚的信号标识，生成所述电路板的绑定引脚的信号标识。
  10. 如权利要求2所述的绑定引脚自动转换方法，其中，与一个所述引脚信号对应的多个所述引脚序号不相邻。
  11. 一种绑定引脚自动化转换方法，其特征在于，包括：
    定义显示面板的绑定引脚的信号标识；
    通过电子设计自动化程序，自动识别所述显示面板的绑定引脚的信号标识，生成并输出电路板的绑定引脚的信号标识。
  12. 如权利要求11所述的绑定引脚自动化转换方法，其中，所述显示面板的绑定引脚的信号标识包括引脚序号和引脚信号。
  13. 如权利要求12所述的绑定引脚自动化转换方法，其中，所述显示面板的绑定引脚的引脚序号为顺次排列的阿拉伯数字，所述显示面板的绑定引脚的引脚信号为所述显示面板的绑定引脚所连接的电信号。
  14. 如权利要求12所述的绑定引脚自动化转换方法，其中，所述定义显示面板的绑定引脚的信号标识，包括：
    人为定义所述显示面板的绑定引脚，分别用所述引脚序号和所述引脚信号两个层级对所述显示面板的绑定引脚进行标识，其中，每一所述引脚序号分别对应一个所述引脚信号。
  15. 如权利要求11所述的绑定引脚自动化转换方法，其中，所述通过电子设计自动化程序，自动识别所述显示面板的绑定引脚的信号标识，生成并输出电路板的绑定引脚的信号标识，包括：
    通过所诉电子设计自动化程序自动识别所述显示面板的绑定引脚的信号标识；
    根据所述显示面板的绑定引脚的信号标识，生成覆晶薄膜的第一绑定引脚的信号标识；
    根据所述覆晶薄膜的第一绑定引脚的信号标识，生成所述电路板的绑定引脚的信号标识；
    输出所述电路板的绑定引脚的信号标识。
  16. 如权利要求15所述的绑定引脚自动化转换方法，其中，所述覆晶薄膜的第一绑定引脚为与所述显示面板的绑定引脚进行绑定的引脚，且所述覆晶薄膜的第一绑定引脚与所述显示面板的绑定引脚一一对应。
  17. 如权利要求15所述的绑定引脚自动化转换方法，其中，所述根据所述覆晶薄膜的第一绑定引脚的信号标识，生成所述电路板的绑定引脚的信号标识，包括：
    通过所述电子设计自动化程序，自动合并相邻且引脚信号相同的所述覆晶薄膜的第一绑定引脚的信号标识，并顺次对合并后的信号标识进行重新定义，得到所述电路板的绑定引脚的信号标识。
  18. 如权利要求17所述的绑定引脚自动化转换方法，其中，所述电路板的绑定引脚为与所述覆晶薄膜的第二绑定引脚进行绑定的引脚，所述电路板的绑定引脚与所述覆晶薄膜的第二绑定引脚一一对应，所述覆晶薄膜的第二绑定引脚为在所述覆晶薄膜的内部与所述覆晶薄膜的第一绑定引脚实现电信号导通的引脚。
  19. 如权利要求15所述的绑定引脚自动化转换方法，其中，所述根据所述覆晶薄膜的第一绑定引脚的信号标识，生成所述电路板的绑定引脚的信号标识，包括：
    通过所述电子设计自动化程序，自动合并相邻且引脚信号相同的所述覆晶薄膜的第一绑定引脚的信号标识，并顺次对合并后的信号标识进行重新定义，得到所述覆晶薄膜的第二绑定引脚的信号标识；
    根据所述覆晶薄膜的第二绑定引脚的信号标识，生成所述电路板的绑定引脚的信号标识。
  20. 一种绑定引脚自动化转换系统，其中，包括：
    定义模块，用于定义显示面板的绑定引脚的信号标识；
    识别模块，用于自动识别所述显示面板的绑定引脚的信号标识；
    转换模块，用于将所述显示面板的绑定引脚的信号标识转换为电路板的绑定引脚的信号标识；以及
    输出模块，用于输出所述电路板的绑定引脚的信号标识。
PCT/CN2021/097473 2021-02-10 2021-05-31 一种绑定引脚自动化转换方法及系统 WO2022170699A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110184817.9 2021-02-10
CN202110184817.9A CN112800713B (zh) 2021-02-10 2021-02-10 一种绑定引脚自动化转换方法及系统

Publications (1)

Publication Number Publication Date
WO2022170699A1 true WO2022170699A1 (zh) 2022-08-18

Family

ID=75815078

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/097473 WO2022170699A1 (zh) 2021-02-10 2021-05-31 一种绑定引脚自动化转换方法及系统

Country Status (2)

Country Link
CN (1) CN112800713B (zh)
WO (1) WO2022170699A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112800713B (zh) * 2021-02-10 2024-01-26 深圳市华星光电半导体显示技术有限公司 一种绑定引脚自动化转换方法及系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7331022B1 (en) * 2005-04-06 2008-02-12 Altera Corporation Method and apparatus for automating pin assignments
CN103793565A (zh) * 2014-01-26 2014-05-14 深圳市兴森快捷电路科技股份有限公司 一种快速生成网表的方法
CN110444135A (zh) * 2019-06-11 2019-11-12 重庆惠科金渝光电科技有限公司 一种显示装置及其检测方法和覆晶薄膜
CN110989230A (zh) * 2019-12-27 2020-04-10 深圳市华星光电半导体显示技术有限公司 显示装置及电子设备
CN112800713A (zh) * 2021-02-10 2021-05-14 深圳市华星光电半导体显示技术有限公司 一种绑定引脚自动化转换方法及系统

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106973485A (zh) * 2017-03-14 2017-07-21 惠科股份有限公司 显示设备及其柔性电路板
CN111081151A (zh) * 2020-01-08 2020-04-28 深圳市华星光电半导体显示技术有限公司 显示面板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7331022B1 (en) * 2005-04-06 2008-02-12 Altera Corporation Method and apparatus for automating pin assignments
CN103793565A (zh) * 2014-01-26 2014-05-14 深圳市兴森快捷电路科技股份有限公司 一种快速生成网表的方法
CN110444135A (zh) * 2019-06-11 2019-11-12 重庆惠科金渝光电科技有限公司 一种显示装置及其检测方法和覆晶薄膜
CN110989230A (zh) * 2019-12-27 2020-04-10 深圳市华星光电半导体显示技术有限公司 显示装置及电子设备
CN112800713A (zh) * 2021-02-10 2021-05-14 深圳市华星光电半导体显示技术有限公司 一种绑定引脚自动化转换方法及系统

Also Published As

Publication number Publication date
CN112800713B (zh) 2024-01-26
CN112800713A (zh) 2021-05-14

Similar Documents

Publication Publication Date Title
CN103439677A (zh) 一种数字表计检测方法及系统
WO2022170699A1 (zh) 一种绑定引脚自动化转换方法及系统
CN101713812A (zh) 一种ic设计电路板的测试系统、方法及一种测试接口板
CN102184132A (zh) 一种视频处理芯片测试方法与系统
CN103983921A (zh) 电源板检测方法及设备
CN111060807B (zh) 基于SoC的高速集成电路测试平台及其测试方法
CN206251273U (zh) 一种mhl到hdmi转接线检测仪
CN103926846B (zh) 航空弹药模拟与故障生成的系统
CN110275640A (zh) 红外触摸屏及其触摸框的脉冲计位器的清零方法和系统
CN104866640A (zh) 一种全fifo电路设计方法及其通用验证平台
CN207008599U (zh) 一种服务器主板测试板
CN107124241B (zh) 一种用于OTN中Ieee1588模块仿真的系统及方法
CN201965202U (zh) Esd测试设备
CN111538469B (zh) 一种基于多fpga并行输出超多路信号的模组信号发生器
CN205404705U (zh) 白电电控板自动测试装置
US20240202409A1 (en) Automatic conversion method and system of binding pins
CN212514957U (zh) 多线缆快速检测装置
CN107340287A (zh) 含有fpga器件的化学发光分析平台及其数据处理方法
CN103090996A (zh) 一种超声波热量表主板性能检测装置
CN206249291U (zh) 一种mhl数据线检测仪
CN207096110U (zh) 含有fpga器件的化学发光分析平台
CN206850886U (zh) 一种图像信号处理装置
CN218546888U (zh) 一种集成多接口的测试电路
CN204667732U (zh) 一种与非门电路演示实验装置
TWI833602B (zh) 測試裝置以及測試方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21925353

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21925353

Country of ref document: EP

Kind code of ref document: A1