WO2022168972A1 - Procédé de fabrication de connecteur et connecteur - Google Patents

Procédé de fabrication de connecteur et connecteur Download PDF

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Publication number
WO2022168972A1
WO2022168972A1 PCT/JP2022/004667 JP2022004667W WO2022168972A1 WO 2022168972 A1 WO2022168972 A1 WO 2022168972A1 JP 2022004667 W JP2022004667 W JP 2022004667W WO 2022168972 A1 WO2022168972 A1 WO 2022168972A1
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WIPO (PCT)
Prior art keywords
electronic component
anisotropic conductive
conductive film
region
width
Prior art date
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PCT/JP2022/004667
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English (en)
Japanese (ja)
Inventor
紀之 渡邉
遥哲 芝
怜司 塚尾
裕樹 大関
宏一 佐藤
康二 江島
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デクセリアルズ株式会社
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Publication of WO2022168972A1 publication Critical patent/WO2022168972A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • the present invention relates to a method for manufacturing a connection using an anisotropic conductive film and the connection.
  • display panels of small electronic devices such as smartphones and tablet computers and large image display devices such as large organic EL televisions have a display part, a mounting area arranged on the periphery thereof, and a wiring area arranged at least in part thereof. It consists of In the wiring area, terminals of various electronic components such as FPC (flexible printed circuit) boards are anisotropically conductively connected through an anisotropic conductive film. At the time of this anisotropic conductive connection, an anisotropic conductive film having a width equal to or less than the width of the wiring region is temporarily attached to the wiring region of the display panel, and the temporarily attached anisotropic conductive film is attached. After aligning the terminal portions of various electronic components such as FPC substrates with the film, anisotropic conductive connection processing is performed.
  • FPC flexible printed circuit
  • any one of the predetermined evaluation items of the body may cause a problem that the evaluation result is lowered to a level that cannot be applied in practice. If such a problem occurs, for example, when performing anisotropic conductive connection using an anisotropic conductive film, connection failures such as short circuits and a decrease in the number of conductive particles captured may occur. There is concern that it will be lost.
  • the terminal portion of the first electronic component such as an FPC board is further mounted within a mounting area of a very narrow width (for example, a width of 0.6 mm or less) of a second electronic component such as a narrowed display panel.
  • a very narrow width for example, a width of 0.6 mm or less
  • a second electronic component such as a narrowed display panel.
  • the inventor of the present invention states that "the problem of the prior art is that the narrowed wiring area of the second electronic component such as the display panel of the small electronic device is anisotropic due to the narrowing of the frame of the second electronic component such as the display panel.”
  • the anisotropic conductive film is temporarily pasted, and the width of the anisotropic conductive film for the temporary pasting is slit to the narrow width of the wiring area or less. It is due to the fact that there is Under this hypothesis, if an anisotropic conductive film with a width equal to or greater than the width of the wiring area in the mounting area of the second electronic component such as a display panel can be used, the possibility of achieving the object of the present invention increases. I found out.
  • the terminal of the first electronic component such as an FPC board is used. part, and then the terminal part of the first electronic component such as the FPC board, the wiring area in the mounting area of the second electronic component such as the display panel, and the anisotropic conductive connection between them.
  • the inventors have found that it is sufficient to adjust the relative positional relationship with the anisotropic conductive film to achieve a predetermined relationship, and have completed the present invention.
  • the present invention provides a method for manufacturing a connecting body for anisotropically conductively connecting a terminal portion of a first electronic component to a wiring region within a mounting region of a second electronic component via an anisotropic conductive film, A temporary attachment step of temporarily attaching an anisotropic conductive film to the first electronic component; A placing step of placing the anisotropic conductive film temporarily attached to the first electronic component on the wiring region of the second electronic component; a thermocompression bonding step of thermocompression bonding with a thermocompression bonding tool from the first electronic component side;
  • the anisotropic conductive film includes a first region sandwiched between facing surfaces of the second electronic component and the first electronic component, and an anisotropic conductive film adjacent to the first region and facing the first electronic component but not the second electronic component. and a second region not facing the electronic component.
  • the terminal portion of the first electronic component and the wiring region of the second electronic component are different from each other through an anisotropic conductive film having a conductive particle-containing layer in which conductive particles are contained in a binder resin layer.
  • a connecting body that is tropically conductively connected The anisotropic conductive film is adjacent to the first region sandwiched between the facing surfaces of the second electronic component and the first electronic component, and faces the first electronic component. and a second region that does not face the second electronic component.
  • the anisotropic conductive film is temporarily attached to the terminal portion of the first electronic component such as the FPC board. This eliminates the need to make the width of the anisotropic conductive film to be used equal to or less than the width of the wiring area of the second electronic component such as the display panel. Therefore, as the anisotropic conductive film, it is possible to use an anisotropic conductive film whose width is larger than the width of the wiring region of the second electronic component and which has stable anisotropic conductive properties. Therefore, temporary attachment of an anisotropic conductive film can be realized by a conventional mounting apparatus, and temporary attachment with a particularly high placement accuracy is not required. As a result, the evaluation results for all of the predetermined evaluation items (conduction resistance, insulation resistance, conductive particle trapping property, and adhesive strength) of the manufactured connection are lowered to a level that cannot be applied in practice. can be avoided.
  • the predetermined evaluation items conduction resistance, insulation resistance, conductive particle trapping property, and adhesive strength
  • FIG. 1 is an explanatory view of the temporary bonding process of the manufacturing method of the connected body of the present invention.
  • FIG. 2 is an explanatory view of the placing process of the manufacturing method of the connected body of the present invention.
  • FIG. 3 is an explanatory view of the thermocompression bonding process of the manufacturing method of the connected body of the present invention.
  • FIG. 4 is a schematic cross-sectional view of the connection body of the present invention.
  • FIG. 5 is a schematic cross-sectional view of an anisotropic conductive film applied to the method for manufacturing a connected body of the present invention.
  • the present invention is a method for manufacturing a connecting body in which a terminal portion of a first electronic component is anisotropically conductively connected to a wiring region of a second electronic component via an anisotropic conductive film. It has a “placement step” and a “thermocompression bonding step”.
  • placement step and a “thermocompression bonding step”.
  • an anisotropic conductive film 20 is temporarily attached to the first electronic component 10 .
  • the position where the anisotropic conductive film 20 is temporarily attached is usually a position covering the terminal portion 11 provided at the end of the first electronic component 10 , which is different from the first electronic component 10 .
  • the anisotropic conductive film 20 is flush at the end to facilitate alignment in the subsequent mounting process and to minimize the width of the anisotropic conductive film 20 itself. preferable.
  • the operation itself of temporary sticking can be performed according to the temporary sticking operation of an anisotropic conductive film.
  • First electronic component 10 As the first electronic component 10, an FPC board such as a known COF (chip-on-film) board or the like can be preferably applied. A hard glass substrate, a glass epoxy substrate, or the like can also be used as long as the effects of the present invention are not impaired.
  • the terminal portion 11 is made of a terminal material such as a metal such as Au, Ag, Cu, Ni, Ti, Al, Sn, Mo, a metal alloy combining these metals, or a metal oxide such as ITO. can be applied.
  • the anisotropic conductive film 20 has a structure in which conductive particles 22 are arranged two-dimensionally or three-dimensionally in a random or regular manner (for example, in a lattice such as a hexagonal lattice or a square lattice) in a binder resin layer 21. of conductive particle-containing layer 23 .
  • conductive particles 22 are arranged two-dimensionally or three-dimensionally in a random or regular manner (for example, in a lattice such as a hexagonal lattice or a square lattice) in a binder resin layer 21. of conductive particle-containing layer 23 .
  • the manufacturing operation of the anisotropic conductive film 20 can be simplified (for example, by kneading and dispersing the conductive particles in a binder resin to form a dispersion film). should be fine).
  • the conductive particles are regularly arranged, the amount of conductive particles used can be reduced, the production cost of the anisotropic conductive film can be
  • the binder resin layer 21 and the conductive particles 22 can have the same configurations as the binder resin layer and the conductive particles, respectively, which constitute the conductive particle-containing layer of a known anisotropic conductive film.
  • the binder resin layer include an acrylic resin composition layer and an epoxy resin composition layer.
  • the layer thickness of the binder resin layer 21 is preferably 1 ⁇ m or more and 10 ⁇ m or less.
  • conductive particles include metal or alloy particles such as nickel particles and solder particles, and metal-coated resin particles obtained by coating known resin particles with a metal such as nickel.
  • the average particle size of the conductive particles is preferably 1 ⁇ m or more and 10 ⁇ m or less.
  • Such conductive particles 22 may have their surfaces subjected to insulation treatment.
  • the number density of the conductive particles 22 in the binder resin layer 21 is preferably 1000 to 500000/mm 2 .
  • the number density of the conductive particles 22 in the binder resin layer 21 is preferably 1000 to 500000/mm 2 .
  • the anisotropic conductive film 20 may be composed only of the conductive particle-containing layer 23, but as shown in FIG. 5, it is preferable to use a film having a structure in which an insulating resin layer 24 is further laminated. .
  • this insulating resin layer 24 is a layer containing no conductive particles.
  • the conductive particle-containing layer 23 preferably exhibits a higher melt viscosity than the insulating resin layer 24 from the viewpoint of suppressing unnecessary resin flow of the conductive particles during anisotropic conductive connection.
  • the conductive particles 22 are preferably unevenly distributed on one side of the binder resin layer 21. If the conductive particles are unevenly distributed on one side, the conductive particles are likely to come into contact with the wiring area of the second electronic component, which will be described later, and it becomes easy to improve the conduction reliability during the anisotropic conductive connection.
  • the degree of uneven distribution when the distance from the one side of the binder resin layer 21 of the anisotropic conductive film 20 to the conductive particles 22 is D, and the layer thickness of the binder resin layer 21 is La, the layer thickness La at the distance D.
  • the ratio (%) [(D/La) ⁇ 100] is preferably ⁇ 5% or more and 40% or less, more preferably ⁇ 5% or more and 15% or less, and particularly preferably ⁇ 5% or more and 5% or less. If the ratio exceeds 40%, the position of the conductive particles 22 tends to shift during the anisotropic conductive connection, and between the terminal portion of the first electronic component and the wiring area of the second electronic component described later during the anisotropic conductive connection. reduces the number of conductive particles trapped in When the ratio is less than -5% (when the degree of exposure of the conductive particles from the binder resin layer increases), the insulating resin layer 24 cannot cover the conductive particles 22, and the anisotropic conductive film 20 is affected by deterioration in adhesion ability, etc. There is concern that the characteristics of A particularly preferable degree of uneven distribution is that the conductive particles 22 are flush with the binder resin layer 21 .
  • this temporary attachment step when temporarily attaching the anisotropic conductive film to the first electronic component, it is preferable to perform the temporary attachment from the side where the conductive particles are not unevenly distributed. As a result, it becomes easier to bring the conductive particles into contact with the wiring region of the second electronic component, which will be described later, and it becomes easier to improve the conduction reliability during the anisotropic conductive connection.
  • the anisotropic conductive film 20 has an insulating resin layer 24 as shown in FIG. It is preferable that the layer 24 side is positioned on the first electronic component 10 side. Since the conductive particle-containing layer 23 is pressed after the insulating resin layer 24 during anisotropic conductive connection, this suppresses unnecessary movement of the conductive particles 22, resulting in a short circuit and the number of trapped particles. This is for avoiding a decrease.
  • Aligning the anisotropic conductive film 20 in this way makes the width of the anisotropic conductive film 20 larger than the width of the wiring region 31 even if the wiring region 31 of the second electronic component 30 is very narrow. can do. Alignment can be performed using a known alignment device or alignment mechanism. Note that the first region 20X and the second region 20Y being “adjacent” means that the second region 20Y extends continuously from the first region 20X without a break.
  • the mounting area 30a is an area formed in at least a part of the peripheral edge (frame) of the second electronic component 30, and is an area where an anisotropic conductive connection with the first electronic component 10 is performed.
  • a wiring region 31 is formed from a terminal material such as metals such as Au, Ag, Cu, Ni, Ti, Al, Sn, Mo, metal alloys combining these metals, or metal oxides such as ITO. formed.
  • thermocompression bonding process corresponds to the main curing process.
  • the first electronic component 10 is heated by a thermocompression bonding tool 40 while being thermocompressed in the direction of the arrow, thereby forming the first region 20X of the anisotropic conductive film 20 into the second electronic component. It is thermocompression bonded to the wiring area 31 of the component 30 .
  • a known cushioning material for example, a 50 ⁇ m thick Teflon (registered trademark) sheet
  • Teflon registered trademark
  • the connector 100 of FIG. 4 which is a part of the present invention, is obtained.
  • This connecting body 100 has an anisotropic conductive particle-containing layer 23 in which the terminal portion 11 of the first electronic component 10 and the wiring region 31 of the second electronic component 30 are formed by containing the conductive particles 22 in the binder resin layer 21 . It has a structure of anisotropically conductive connection via the conductive film 20 .
  • connection body 100 is adjacent to the first region 20X where the anisotropic conductive film 20 is sandwiched between the facing surfaces of the second electronic component 30 and the first electronic component 10, and the first region 20X.
  • a second region 20 ⁇ /b>Y faces the first electronic component 10 but does not face the second electronic component 30 .
  • thermocompression bonding process the relationship between the first electronic component 10, the second electronic component 30, and the anisotropic conductive film (ACF) 20 is shown in FIG. (width).
  • (b) Mounting area width The width of the frame of the second electronic component such as a display panel, which is not particularly limited, is preferably 1 mm or less in response to the narrowing of the frame of the second electronic component such as a display panel, and may be 0.2 mm or less. is assumed.
  • First area width of ACF It is the width (overlap width) of the region sandwiched between the facing surfaces of the first electronic component and the second electronic component and thermally compressed by the thermal compression bonding tool, and the first region width is less than the mounting region width, 25% or more of the ACF width is preferred.
  • Thermo-compression bonding tool position It is the distance from the inner edge of the mounting area (display edge) to the thermo-compression tool. A negative number indicates that the thermo-compression tool extends to the display. It is 0% or more and less than 100% of the width of the mounting area, preferably 5% or more and 70% or less.
  • Thermo-compression bonding tool width is preferably 0.8 to 3 times the mounting area width. This is for promoting the curing reaction of the first region of the anisotropic conductive film while preventing uneven contact of the tool. On the other hand, it is preferable to make it larger than the anisotropic conductive film width. This is for promoting the curing reaction of the anisotropic conductive film in the second region.
  • Second region width of ACF The width of the area of the ACF that faces the first electronic component but not the second electronic component, preferably less than or equal to the thermocompression tool width. This is for increasing the curing reaction rate of the ACF in the second region.
  • the width of the second region is preferably 75% or less of the width of the anisotropic conductive film in order to obtain sufficient connection strength. Furthermore, it is required to increase the curing reaction rate of the film to a certain level or higher, and in practice it is preferably 60% or more, more preferably 80% or more.
  • the curing reaction rate is calculated by the general IR method based on each peak intensity of the completely cured product and the uncured product, and the second area where the ACF is not thermocompressed in each evaluation connector is calculated as the measurement site. can be done. In the second area of the ACF, which is the curing reaction rate measurement site, it is preferable to measure near the center of gravity as a representative value.
  • connection body obtained in this way has a very narrow mounting area (e.g., 0.6 mm or less) for the second electronic component such as a display panel with a narrowed frame for the terminal portion of the first electronic component such as an FPC board.
  • a very narrow mounting area e.g., 0.6 mm or less
  • the second electronic component such as a display panel with a narrowed frame for the terminal portion of the first electronic component such as an FPC board.
  • Examples 1-10, Comparative Examples 1-6 (1) Preparation of anisotropic conductive film (a) Preparation of binder resin layer Phenoxy resin (YP-50, Nippon Steel Chemical & Materials Co., Ltd.) 40 parts by mass, silica filler (Aerosil R805, Nippon Aerosil Co., Ltd.) 25 parts by mass, liquid epoxy resin (jER828, Mitsubishi Chemical Co., Ltd.) 30 parts by mass, silane coupling agent (KBM-403, Shin-Etsu Chemical Co., Ltd.) 2 parts by mass, and thermal cationic polymerization initiator (SI-60L , Sanshin Kagaku Kogyo Co., Ltd.) 3 parts by mass of a binder resin layer-forming composition is applied on a PET film having a film thickness of 50 ⁇ m with a bar coater, dried in an oven at 80 ° C. for 5 minutes, and PET A binder resin layer having a thickness of 5 ⁇ m was formed on the film.
  • a binder resin layer
  • This conductive particle-containing layer was capable of functioning as a single-layer anisotropic conductive film.
  • the degree of embedding of the conductive particles was 0% in Examples 1 to 7 and Comparative Examples 1 to 5. (In other words, the conductive particles are unevenly distributed on one side of the binder resin layer).
  • the CV value of the metal-coated resin particles used was measured using FPIA-3000 (Malvern Panalytical) with 1000 or more particles, and was found to be 20% or less.
  • the outer shape of this glass substrate is 30 mm ⁇ 50 mm, the thickness is 0.5 mm, the width of the mounting area corresponding to the frame portion to which the FPC substrate is to be anisotropically conductively connected is 0.5 mm, and the width of the mounting area is 0.5 mm.
  • the temporarily attached anisotropic conductive film is placed in alignment on the mounting area of the glass substrate, and heated and pressurized with a thermocompression bonding tool (180 ° C., 3.5 MPa, 6 seconds, A connected body was obtained by lowering the thermocompression tool at a speed of 10 mm/sec and a stage temperature of 40°C.
  • thermocompression bonding when performing thermocompression bonding, as shown in FIG. ) mounting area width, (b) wiring area width, (c) ACF first area width, (d) thermocompression tool position, (e) thermocompression tool width, and (f) ACF second area width Performed as specified in Table 1.
  • (a) Curing reaction rate of second region of ACF The curing reaction rate of the second region of ACF (that is, the region not thermocompression-bonded) in the connecting body for evaluation was evaluated. Specifically, the curing reaction rate of the second region of ACF in each connection for evaluation is calculated based on the peak intensity of each of the completely cured product and the uncured product by the IR method. The curing reaction rate was evaluated according to the following criteria.
  • Conduction resistance of each connection body for evaluation was evaluated. Specifically, a digital multimeter (product number: Digital Multimeter 7555, manufactured by Yokogawa Electric Corporation) was used to measure the resistance value when a current of 1 mA was applied by the four-terminal method. The conduction resistance was evaluated according to the following criteria.
  • (c) Insulation resistance The insulation resistance of each evaluation connector was evaluated. Specifically, a high resistance meter (product number: high resistance meter 4339B, manufactured by Agilent Technologies) was used to measure the resistance between adjacent lines when an applied voltage of 25 V was applied by the two-terminal method. The insulation resistance was evaluated according to the following criteria.
  • Particle capture (minimum connection area) Particle trapping was evaluated by estimating the minimum connection area (the area of the terminal where 5 or more conductive particles are trapped). Specifically, a TEG with lines formed in the X direction was used. The indentations were counted with an optical microscope, and estimated by creating a calibration curve in which the horizontal axis is the connection area and the vertical axis is the captured number.
  • A particle trapping evaluation criteria: 200 ⁇ m 2 or more and less than 1000 ⁇ m 2
  • B no problem: 1000 ⁇ m 2 or more and 2000 ⁇ m 2 or less
  • C impossible: 2000 ⁇ m 2 or more
  • Adhesive strength The adhesive strength of each connector for evaluation was evaluated. Specifically, it was measured using a tensile tester (RTC1225A, A&D Co., Ltd.). The FPC substrate for evaluation was pulled up from the glass substrate for evaluation in the direction of 90 degrees at a speed of 50 mm/sec, and the force required for peeling off was measured as adhesive strength (N). The adhesive strength was evaluated according to the following criteria.
  • Adhesion strength evaluation criteria A (preferred): greater than 8N B (no problem): 5N or more and 8N or less C (impossible): less than 5N
  • connection body of Comparative Example 1 was evaluated as "C" in conduction resistance.
  • a comparison with Example 4 suggests that the ratio of the first area width of the ACF is small and the ratio of the second area width of the ACF is large.
  • the ratio of the first region width of the anisotropic conductive film to the total width of the anisotropic conductive film was 25% or more (the ratio of the second region width of the anisotropic conductive film is 75% or less) is preferable.
  • thermocompression tool position is preferably 70% or less.
  • thermocompression bonding tool is approximately four times the width of the mounting area, the bottom surface of the thermocompression bonding tool does not come into surface contact with the FPC board and causes uneven contact.
  • the width of the thermocompression bonding tool is preferably three times or less than the width of the mounting area.
  • connection body manufactured under the conditions of Comparative Example 4 had a problem with the evaluation item of adhesive strength.
  • the reason for this is thought to be that the mounting area width was 0.1 mm and the bonding width between the glass substrate and the anisotropic conductive film was reduced, resulting in a decrease in connection strength.
  • the width of the mounting area is 0.2 mm or more, no problem occurs in adhesive strength.
  • thermocompression bonding tool is a negative value of -10%, and the thermocompression bonding tool is in contact with the display section, and the bottom surface does not come into surface contact with the FPC board, causing uneven contact.
  • connection body manufactured under the conditions of Comparative Example 6 had a problem with the evaluation item of insulation resistance.
  • the number density of the conductive particles was 20,000/mm 2 and the conductive particles were too dense.
  • the anisotropic conductive film is temporarily attached to the terminal portion of the first electronic component such as the FPC board. This eliminates the need to make the width of the anisotropic conductive film to be used equal to or less than the width of the wiring area of the second electronic component such as the display panel. Therefore, as the anisotropic conductive film, it is possible to use an anisotropic conductive film whose width is larger than the width of the wiring region of the second electronic component and which has stable anisotropic conductive properties. Therefore, temporary attachment of an anisotropic conductive film can be realized by a conventional mounting apparatus, and temporary attachment with a particularly high placement accuracy is not required.
  • connection body of the present invention is used when anisotropically conductively connecting the terminal portion of the first electronic component such as the FPC board to the narrow mounting area of the second electronic component such as the display panel. Useful.
  • First electronic component 11 Terminal portion 20 Anisotropic conductive film 20X First region 20Y Second region 21 Binder resin layer 22 Conductive particles 23 Conductive particle-containing layer 24 Insulating resin layer 30 Second electronic component (for example, display panel) 30a Mounting area 31 Wiring area 40 Thermocompression bonding tool 100 Connection body D Distance La from one side of binder resin layer of anisotropic conductive film to conductive particles La Layer thickness of binder resin layer (a) Mounting area width (b) Wiring area width (C) Width of first region of anisotropic conductive film (D) Position of thermocompression bonding tool (E) Width of thermocompression bonding tool (F) Width of second region of anisotropic conductive film

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Combinations Of Printed Boards (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

Procédé de fabrication d'un connecteur permettant la connexion conductrice anisotrope d'une partie terminale d'un premier composant électronique à une région de câblage dans une région de montage d'un second composant électronique, un film conducteur anisotrope étant disposé entre ces dernières. Le procédé comprend une étape de fixation provisoire permettant de fixer provisoirement le film conducteur anisotrope au premier composant électronique, une étape de montage permettant le montage, sur la région de câblage du second composant électronique, du film conducteur anisotrope fixé de manière provisoire au premier composant électronique, et une étape de liaison par compression thermique permettant de réaliser une liaison par compression thermique à l'aide d'un outil de liaison par compression thermique à partir du côté premier composant électronique. La liaison par compression thermique est réalisée de telle sorte que le film conducteur anisotrope ait une première région dans laquelle le film conducteur anisotrope est pris en sandwich entre des surfaces opposées du second composant électronique et du premier composant électronique, et une seconde région adjacente à la première région dans laquelle le film conducteur anisotrope est opposé au premier composant électronique mais ne s'oppose pas au second composant électronique.
PCT/JP2022/004667 2021-02-08 2022-02-07 Procédé de fabrication de connecteur et connecteur WO2022168972A1 (fr)

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JP2021-018340 2021-02-08
JP2021018340A JP2022121154A (ja) 2021-02-08 2021-02-08 接続体の製造方法，接続体

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009004902A1 (fr) * 2007-07-03 2009-01-08 Sony Chemical & Information Device Corporation Film conducteur anisotrope et son procédé de fabrication, et corps lié
CN103513452A (zh) * 2012-06-29 2014-01-15 北京京东方光电科技有限公司 显示装置的组装方法
WO2014021424A1 (fr) * 2012-08-01 2014-02-06 デクセリアルズ株式会社 Procédé de fabrication d'un film conducteur anisotrope, film conducteur anisotrope et structure de connexion

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009004902A1 (fr) * 2007-07-03 2009-01-08 Sony Chemical & Information Device Corporation Film conducteur anisotrope et son procédé de fabrication, et corps lié
CN103513452A (zh) * 2012-06-29 2014-01-15 北京京东方光电科技有限公司 显示装置的组装方法
WO2014021424A1 (fr) * 2012-08-01 2014-02-06 デクセリアルズ株式会社 Procédé de fabrication d'un film conducteur anisotrope, film conducteur anisotrope et structure de connexion

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