WO2022166946A1 - 天线封装模组及电子设备 - Google Patents

天线封装模组及电子设备 Download PDF

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Publication number
WO2022166946A1
WO2022166946A1 PCT/CN2022/075340 CN2022075340W WO2022166946A1 WO 2022166946 A1 WO2022166946 A1 WO 2022166946A1 CN 2022075340 W CN2022075340 W CN 2022075340W WO 2022166946 A1 WO2022166946 A1 WO 2022166946A1
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WIPO (PCT)
Prior art keywords
antenna
array
dielectric
bodies
layer
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PCT/CN2022/075340
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English (en)
French (fr)
Inventor
邾志民
简宪静
王义金
丁杰
刘洋
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维沃移动通信有限公司
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Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2022166946A1 publication Critical patent/WO2022166946A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them

Definitions

  • the present application belongs to the field of antenna technology, and in particular relates to an antenna packaging module and electronic equipment.
  • the mainstream millimeter-wave antenna design scheme mainly uses end-fire antennas (typically patch antennas) to be fabricated on the package of millimeter-wave chips to form an antenna package (Antenna in Package, AIP) module, that is, the A millimeter-wave array antenna, a radio frequency integrated circuit (RFIC) and a power management integrated circuit (PMIC) are integrated into one module.
  • AIP antenna package
  • RFIC radio frequency integrated circuit
  • PMIC power management integrated circuit
  • a millimeter-wave AIP module can only cover the direction perpendicular to the antenna, resulting in a smaller space coverage.
  • the millimeter-wave antenna AIP module of the prior art is generally placed on the frame of the mobile terminal or on the back cover side of the battery, and cannot effectively cover the top of the screen with millimeter-wave.
  • Embodiments of the present application provide an antenna packaging module and an electronic device, which can solve the problem that a millimeter-wave AIP module can only cover one direction perpendicular to the antenna in the form of an end-fire antenna, thus resulting in a small coverage space.
  • an antenna packaging module including:
  • the array antenna layer includes a first antenna array and a second antenna array, and the radiation directions of the first antenna array and the second antenna array are different;
  • the antenna radiation directions of the first antenna array and the second antenna array are both parallel to the plane where the array antenna layer is located.
  • an embodiment of the present application further provides an electronic device, including the antenna packaging module described in the first aspect.
  • the coverage of the antenna packaging module is increased. direction, which increases the spatial range covered by the antenna package module.
  • FIG. 1 is a schematic diagram of a composition structure of a millimeter-wave antenna packaging module according to an embodiment of the present application
  • FIG. 2 is a side sectional view of the millimeter-wave antenna package module of the first implementation
  • FIG. 3 is a schematic plan view of the horn antenna array of the first implementation
  • FIG. 4 is a plane layered view of the horn antenna unit of the first implementation
  • FIG. 5 is a schematic plan view of a horn antenna array of implementation mode 2;
  • Fig. 6 is the plane layered view of the horn antenna array of realization mode 3;
  • FIG. 7 is a schematic plan view of the horn antenna array of the third implementation.
  • Fig. 9 is the concrete structure schematic diagram of the first medium body and the second medium body
  • FIG. 10 is a schematic diagram of the arrangement position of the antenna packaging module in the electronic device according to the embodiment of the present application.
  • FIG. 11 is one of the schematic layout diagrams of the millimeter wave antenna packaging module according to the embodiment of the present application.
  • FIG. 12 is the second schematic diagram of the layout of the millimeter-wave antenna package module according to the embodiment of the present application.
  • first, second and the like in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the present application can be practiced in sequences other than those illustrated or described herein, and distinguish between “first”, “second”, etc.
  • the objects are usually of one type, and the number of objects is not limited.
  • the first object may be one or more than one.
  • “and/or” in the description and claims indicates at least one of the connected objects, and the character “/" generally indicates that the associated objects are in an "or” relationship.
  • an antenna packaging module including:
  • radio frequency integrated circuit 100
  • a power management integrated circuit 400 connected to the radio frequency integrated circuit 100;
  • the array antenna layer 200 includes a first antenna array 201 and a second antenna array 202, and the radiation directions of the first antenna array 201 and the second antenna array 202 are different;
  • the antenna radiation directions of the first antenna array 201 and the second antenna array 202 are both parallel to the plane where the array antenna layer 200 is located.
  • each component of the antenna packaging module in the embodiment of the present application is connected to a connector, and the connector is used to connect the antenna packaging module to the main board of the electronic device.
  • the antenna packaging module mentioned in the embodiments of the present application is a millimeter-wave antenna packaging module (millimeter-wave AIP module).
  • the antenna of the array antenna layer 200 in the millimeter-wave antenna packaging module is The radiation direction is set parallel to the plane where the array antenna layer 200 is located.
  • Such an antenna can be called an edge-emitting antenna (that is, the maximum radiation direction of the antenna is parallel to the plane where the antenna is located), and the array antenna layer 200 in the embodiment of the present application has multiple antennas Different array antennas have different radiation directions, which increases the coverage direction of the millimeter-wave antenna package module and increases the spatial range covered by the millimeter-wave antenna package module.
  • the array antenna layer 200 includes:
  • a dielectric substrate 230 connected to the first metal layer 210 and the second metal layer 220, and located between the first metal layer 210 and the second metal layer 220;
  • the dielectric substrate 230 includes at least two first dielectric bodies 2012 and at least two second dielectric bodies 2013 formed by connecting bodies, and the connecting bodies conduct the first metal layer and the second metal layer;
  • the first metal layer 210, the second metal layer 220 and at least two first dielectric bodies 2012 constitute the first antenna array 201;
  • the first metal layer 210 , the second metal layer 220 and at least two second dielectric bodies 2013 constitute the second antenna array 202 .
  • the connecting body encloses at least two medium regions 20 having an open end 21 and a closed end 22 , the first medium body 2012 and the second medium body 2013 are respectively connected with the at least two medium regions 20 .
  • Each medium area 20 is set in one-to-one correspondence;
  • the length of the open end 21 is greater than the length of the closed end 22 .
  • the dielectric substrate 230 includes a plurality of dielectric regions 20, and the plurality of dielectric regions 20 are divided into two groups.
  • Each of the dielectric regions 20 in one set of dielectric regions is provided with a first dielectric body 2012
  • the other set of dielectric regions is provided with a first dielectric body 2012.
  • a second medium body 2013 is provided in each medium region 20 in the region; for example, there are four medium regions 20 enclosed by the connecting body, and the four medium regions 20 are divided into two groups, each of which is in one group
  • a first medium body 2012 is correspondingly disposed on each of the medium regions 20
  • a second medium body 2013 is correspondingly disposed on each medium region 20 in the other group.
  • the shape of the dielectric region 20 enclosed by the connecting body can be regarded as a trumpet shape, and the first dielectric body 2012 and the second dielectric body 2013 are also trumpet shaped.
  • the connecting body may be composed of a plurality of metallized vias 20121 , and more specifically, each dielectric region 20 is composed of a plurality of metallized vias 20121 .
  • the connecting body can also be a solid metal column, a hollow metal column and other structural forms.
  • the first antenna array 201 and the second antenna array 202 in the embodiments of the present application can be regarded as being composed of a plurality of substrate integrated waveguide (SIW) horn antenna units respectively, that is, the first medium
  • SIW substrate integrated waveguide
  • the shapes of the body 2012 and the second dielectric body 2013 are both trumpet-shaped, and the first dielectric body 2012 and the second dielectric body 2013 can be referred to as SIW horn bodies (or horn bodies);
  • the first metal layer 210 and the second metal layer 2013 Layer 220 is the upper and lower layers of SIW metal grounds, and a SIW horn antenna unit is constructed by punching metallized vias in specific areas to connect the upper and lower metal grounds.
  • the horn body in the SIW horn antenna unit in the embodiment of the present application is divided into two parts: three sides of the head are surrounded by uniformly arranged metallized vias, and one side is not provided with metallized vias, the main purpose of which is to excite the required frequency
  • the size of the electromagnetic wave determines the resonant frequency of the SIW horn antenna unit; the tail is connected to one side of the head body without metallized vias, and the metallized vias are arranged at a predetermined angle on the outside of the tail, so as to realize
  • the electromagnetic waves excited by the head are radiated outward, and usually the size of the opening angle of the metallized vias on the outside of the tail determines the radiation performance of the SIW horn antenna unit.
  • the array antenna layer and the feeder layer in the embodiments of the present application are fed by means of vias, microstrips, or coplanar waveguides.
  • the hole 240 feeds the SIW horn antenna unit, and its main purpose is to facilitate integration with the feeder layer of the millimeter-wave AIP module. In practice, other feeding forms can be flexibly used as needed.
  • a via hole also referred to as a feeding via hole 240
  • the length of the feeding via hole 240 in this embodiment of the present application can be adjusted according to the requirements of impedance matching, It can be in direct contact with the upper metal ground of the SIW or buried in the dielectric substrate.
  • the diameter (d) of the metallized vias 20121 can be determined according to the requirements of the processing technology, and the distance between adjacent metallized vias 20121 is preferably set Between 1.5 times the diameter of the metallized via and 2 times the diameter of the metallized via to reduce unnecessary electromagnetic leakage.
  • the present application adopts the following implementation manners.
  • the first dielectric body 2012 and the second dielectric body 2013 are taken as the horn body as an example, and these implementation manners are respectively described below. It is explained as follows.
  • the at least two first dielectric bodies 2012 and the at least two second dielectric bodies 2013 are mirror images distributed along the first direction on the dielectric substrate, and two adjacent Between a medium body 2012 and two adjacent second medium bodies 2013 are respectively distributed along a first preset interval in the second direction;
  • the first direction is perpendicular to the second direction.
  • the first direction refers to the X-axis direction
  • the second direction refers to the Y-axis direction
  • the arrangement of the horn body in this implementation manner is as follows: the horn bodies belonging to the first dielectric body 2012 and the second dielectric body 2013 are respectively fabricated on the upper and lower ends of the millimeter-wave antenna package module (along the The horn bodies of the first dielectric body 2012 and the second dielectric body 2013 are arranged along the Y axis at a certain distance (preferably 0.5 air wavelength, or Change the spacing as needed) to form an array (preferably a 1 ⁇ 4 array, the number of arrays can also be changed as needed), and is controlled by the radio frequency integrated circuit 100 to realize beam scanning.
  • the first antenna array 201 and the second antenna array 202 in this application share the same radio frequency integrated circuit 100, and only one antenna array works at the same time.
  • the bidirectional radiation of the module is actually realized by switching the antenna array.
  • FIG. 2 which is a side view of a millimeter-wave antenna package module
  • the horn antenna unit in this implementation of the present application is fabricated on the array antenna layer 200 .
  • millimeter-wave signals are integrated through radio frequency.
  • the circuit enters the metal via hole in the feeder layer 300 and is connected with the feeder via via the microstrip line, thereby exciting the radiation of the SIW horn antenna.
  • the at least two first medium bodies 2012 are continuously distributed in the second direction
  • the at least two second medium bodies 2013 are continuously distributed in the second direction
  • the first The dielectric bodies 2012 and the second dielectric bodies 2013 are alternately distributed in the second direction.
  • the second direction is the Y-axis direction.
  • the staggered distribution method is:
  • a second medium body 2013 is disposed between adjacent first medium bodies 2012 , and a first medium body 2012 is disposed between adjacent second medium bodies 2013 .
  • the heads of the second dielectric bodies 2013 are located between the heads of two adjacent first dielectric bodies 2012 , and the heads of the first dielectric bodies 2012 are located in the adjacent two second dielectric bodies 2013 between the heads.
  • this implementation method is based on the first implementation method.
  • the width of the millimeter-wave antenna package module in the X-axis direction is reduced, thereby reducing the millimeter-wave antenna package module.
  • the size of the wave antenna package module further reduces the space occupied by the millimeter wave antenna package module on the electronic device.
  • the dielectric substrate 230 includes:
  • a third metal layer 233 disposed between the first substrate 231 and the second substrate 232 and connecting the first substrate 231 and the second substrate 232;
  • the at least two first dielectric bodies 2012 are disposed on the first substrate 231;
  • the at least two second dielectric bodies 2013 are disposed on the second substrate 232 .
  • this implementation is based on the second implementation, by making the horn bodies with different radiation directions on different antenna layers (respectively the upper antenna layer and the lower antenna layer) to further reduce the millimeter-wave antenna package mold.
  • the width of the group in the X-axis direction reduces the size of the millimeter-wave antenna package module, thereby further reducing the space occupied by the millimeter-wave antenna package module on the electronic device.
  • This application is different from the prior art, which usually uses an end-fire antenna to make AIP, but introduces an edge-fire antenna, such as the SIW horn antenna unit used in the embodiment, so as to realize the radiation direction of the antenna and the millimeter-wave AIP. module parallel;
  • the present application realizes the radiation of the millimeter-wave AIP module in two different directions by setting the openings of the horn antenna units of the two antenna arrays in different directions;
  • the present application realizes the coverage of the millimeter-wave AIP module in two different directions by switching different antenna arrays, which effectively improves the spatial coverage (theoretically increased by 3dB) compared with the millimeter-wave AIP module of the prior art. ;
  • the two antenna arrays of the millimeter-wave AIP module in this application share one millimeter-wave chip (that is, the two antenna arrays share the RFIC), that is to say, when the same space coverage is achieved, the existing The technology requires two millimeter-wave chips, while the present application only needs one millimeter-wave chip. Since the price of millimeter-wave chips is often high, the present application effectively reduces the number of required millimeter-wave chips, thereby greatly saving costs.
  • this application can be applied to Wireless Metropolitan Area Network (WMAN), Wireless Wide Area Networks (WWAN), Wireless Local Area Network (WLAN), Wireless Personal Area Network (WPAN), Multiple-Input Multiple-Output (MIMO), Radio Frequency Identification (RFID), and even Near Field Communication (NFC) , wireless charging (Wireless Power Consortium, WPC), or frequency modulation (Frequency Modulation, FM) and other wireless communication design and applications;
  • WMAN Wireless Metropolitan Area Network
  • WWAN Wireless Wide Area Networks
  • WLAN Wireless Local Area Network
  • WPAN Wireless Personal Area Network
  • MIMO Multiple-Input Multiple-Output
  • RFID Radio Frequency Identification
  • NFC Near Field Communication
  • WPC Wireless Power Consortium
  • FM Frequency Modulation
  • this application can also be applied to electromagnetic wave absorption ratio (Specific Absorption Rate, SAR) and hearing aid compatibility (Hearing Aid Compatibility, HAC) and other regulatory testing and practical design and application for human safety, health, and compatibility with worn electronic devices (such as hearing aids or heart rate regulator
  • Embodiments of the present application further provide an electronic device, including the above-mentioned antenna packaging module.
  • the antenna packaging module is located between the screen 91 and the battery cover 92 , and the array antenna layer of the antenna packaging module is facing the screen 91 without nano-indium tin metal oxide.
  • the position of the Indium Tin Oxides (ITO) layer due to the existence of the ITO layer in the screen, the millimeter wave signal cannot penetrate, so the antenna package module in this application needs to be placed at the black edge of the screen (there is no ITO at the black edge. layer) to achieve millimeter wave signal coverage above the screen.
  • ITO Indium Tin Oxides
  • the radiation direction of the antenna packaging module is above the screen of the electronic device or below the battery cover.
  • the current solution includes opening a window on the metal frame and shortening the metal frame; No matter which solution is adopted in the prior art, it is necessary to destroy the metal frame, thereby destroying the integrity of the appearance and bringing instability to the structural strength; and in the present application, because the end-fire antenna is used, the antenna radiation direction is realized. It is parallel to the antenna surface (in the X direction as shown in Figure 3), so there is no need to destroy the metal frame; at the same time, the antenna packaging module in this application realizes the millimeter above the display screen and below the battery back cover by switching different antenna arrays. Wave signal coverage, so as to achieve millimeter-wave signal coverage in a larger space.
  • the first antenna module 10 in FIG. 11 is the millimeter-wave antenna packaging module in the embodiment of the present application.
  • the second antenna module 20 and the third antenna module 30 are end-fire patch millimeter-wave antenna modules in the prior art.
  • the antenna packaging module of the present application is used to realize the millimeter wave coverage above the screen of the electronic device and below the battery cover, and at the same time, the second antenna module of the prior art end-fire patch millimeter wave is placed on the side of the electronic device.
  • the millimeter-wave AIP module can realize the radiation to the upper side of the screen of the electronic device.
  • the millimeter-wave AIP module of the present application can be combined with the millimeter-wave AIP of the prior art, so as to go further Improve the space coverage of mmWave.

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Abstract

本申请公开了一种天线封装模组及电子设备，属于天线技术领域。该天线封装模组，包括：射频集成电路；与所述射频集成电路连接的阵列天线层；与所述阵列天线层连接的馈线层；与所述射频集成电路连接的电源管理集成电路；其中，所述阵列天线层包括第一天线阵列和第二天线阵列，且所述第一天线阵列和所述第二天线阵列的辐射方向不相同；所述第一天线阵列和所述第二天线阵列的天线辐射方向均与所述阵列天线层所在面平行。

Description

天线封装模组及电子设备
相关申请的交叉引用
本申请主张在2021年02月08日在中国提交的中国专利申请No.202110170794.6的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于天线技术领域，特别涉及一种天线封装模组及电子设备。
背景技术
在全金属、高屏占比、超薄机身，与多天线通讯已成为终端的现今主流与未来趋势，且随着第五代移动通信(5 th Generation Mobile Communication Technolog，5G)的发展，毫米波天线的设计渐渐被引入到一些小的移动终端上，如手机、平板，甚至是笔记本电脑，故而在保持系统整体有竞争力的尺寸下，各天线所分得的有效辐射空间往往因而更加减少，进而使得天线性能下降，造成用户无线体验的劣化。或是为容纳多个分立的天线，而增加系统整体的体积尺寸，故而使产品整体竞争力下降。
目前主流毫米波的天线设计方案主要是采用端射天线(典型形式为贴片(patch)天线)制作在毫米波芯片的封装上，共同组成天线封装(Antenna in Package，AIP)模组，即把毫米波的阵列天线，射频集成电路(Radio Frquency Intergarted Circuit，RFIC)以及电源管理集成电路(Power Management Intergarted Circuit，PMIC)集成在一个模块内。
在实现本申请过程中，发明人发现现有技术中至少存在如下问题：
1、由于采用的天线形式为端射天线，因此一个毫米波AIP模组只能覆盖与天线垂直的方向，从而导致其覆盖的空间范围较小。
2、在实际应用中，为了获得更好的空间覆盖，往往需要采用多个毫米波AIP模组，这不仅会造成手机中整体成本的增加，还会占据了目前其他天线的空间，导致天线性能的下降，从而影响用户的无线体验。
3、现有的技术的毫米波天线AIP模组一般放置在移动终端的边框或者电池后盖侧，无法对屏幕上方进行有效的毫米波覆盖。
发明内容
本申请实施例提供一种天线封装模组及电子设备，能够解决端射天线形式使得一个毫米波AIP模组只能覆盖与天线垂直的一个方向，从而导致其覆盖的空间范围较小的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提供一种天线封装模组，包括：
射频集成电路；
与所述射频集成电路连接的阵列天线层；
与所述阵列天线层连接的馈线层；
与所述射频集成电路连接的电源管理集成电路；
其中，所述阵列天线层包括第一天线阵列和第二天线阵列，且所述第一天线阵列和所述第二天线阵列的辐射方向不相同；
所述第一天线阵列和所述第二天线阵列的天线辐射方向均与所述阵列天线层所在面平行。
第二方面，本申请实施例还提供一种电子设备，包括如第一方面所述的天线封装模组。
在本申请实施例中，通过在天线封装模组中设置具有多个辐射方向的天线阵列，且将天线阵列的天线辐射方向设置的与阵列天线层所在面平行，增加了天线封装模组的覆盖方向，增大了天线封装模组覆盖的空间范围。
附图说明
图1是本申请实施例的毫米波天线封装模组的组成结构示意图；
图2是实现方式一的毫米波天线封装模组的侧视剖面图；
图3是实现方式一的喇叭天线阵列平面示意图；
图4是实现方式一的喇叭天线单元平面分层图；
图5是是实现方式二的喇叭天线阵列平面示意图；
图6是实现方式三的喇叭天线阵列平面分层图；
图7是实现方式三的喇叭天线阵列平面示意图；
图8是实现方式三的毫米波天线封装模组的侧视剖面图；
图9是第一介质体和第二介质体的具体结构示意图；
图10是本申请实施例的天线封装模组在电子设备中的设置位置示意图；
图11是本申请实施例的毫米波天线封装模组的布局示意图之一；
图12是本申请实施例的毫米波天线封装模组的布局示意图之二。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的显示控制方法、装置及电子设备进行详细地说明。
如图1至图3所示，本申请实施例提供一种天线封装模组，包括：
射频集成电路100；
与所述射频集成电路100连接的阵列天线层200；
与所述阵列天线层200连接的馈线层300；
与所述射频集成电路100连接的电源管理集成电路400；
其中，所述阵列天线层200包括第一天线阵列201和第二天线阵列202，且所述第一天线阵列201和所述第二天线阵列202的辐射方向不相同；
所述第一天线阵列201和所述第二天线阵列202的天线辐射方向均与所述阵列天线层200所在面平行。
需要说明的是，本申请实施例的天线封装模组的各个部件均与连接器连接，该连接器用于将天线封装模组与电子设备的主板连接。
需要说明的是，本申请实施例所说的天线封装模组为毫米波天线封装模组(毫米波AIP模组)，本申请中通过将毫米波天线封装模组中的阵列天线层200的天线辐射方向设置的与阵列天线层200所在面平行，此种天线可以称为边射天线(即天线的最大辐射方向与天线所在面平行)，且本申请实施例的阵列天线层200具有多个天线阵列，不同阵列天线的辐射方向不同，以此增加了毫米波天线封装模组的覆盖方向，增大了毫米波天线封装模组覆盖的空间范围。
下面对本申请的阵列天线层200的具体设置进行详细说明如下。
具体地，如图2至图9所示，所述阵列天线层200，包括：
第一金属层210、第二金属层220；
分别与所述第一金属层210和所述第二金属层220连接，且位于所述第一金属层210和所述第二金属层220之间的介质基板230；
所述介质基板230包括由连接体构成的至少两个第一介质体2012和至少两个第二介质体2013，所述连接体将所述第一金属层和所述第二金属层导通；
所述第一金属层210和所述第二金属层220以及至少两个第一介质体2012构成所述第一天线阵列201；
所述第一金属层210和所述第二金属层220以及至少两个第二介质体2013构成所述第二天线阵列202。
进一步如图9所示，所述连接体围成具有开口端21和封闭端22的至少 两个介质区域20，所述第一介质体2012、所述第二介质体2013分别与所述至少两个介质区域20一一对应设置；
其中，所述开口端21的长度大于所述封闭端22的长度。
也就是说，介质基板230上包括多个介质区域20，多个介质区域20分为两组，一组介质区域中的每一个介质区域20中均设置一个第一介质体2012，另一组介质区域中的每一个介质区域20中均设置一个第二介质体2013；例如，连接体围成的介质区域20有4个，这四个介质区域20分为两组，其中一组中的每一个介质区域20上均对应设置一个第一介质体2012，另一组中的每一个介质区域20上均对应设置一个第二介质体2013。
需要说明的是，该连接体围成的介质区域20的形状可以看成为喇叭形，进而该第一介质体2012和第二介质体2013也为喇叭形。
还需要说明的是，该连接体可以由多个金属化过孔20121构成，更具体地说，每个介质区域20均由多个金属化过孔20121构成。连接体还可以是实心的金属柱，空心的金属柱等结构形式。
具体地，本申请实施例中的第一天线阵列201和第二天线阵列202可以看作分别由多个基片集成波导(Substrate Integrated Waveguide，SIW)喇叭天线单元构成，也就是说，第一介质体2012和第二介质体2013的形状均为喇叭形，可以将第一介质体2012和第二介质体2013称为SIW喇叭本体(或喇叭本体)；第一金属层210和所述第二金属层220为上下两层SIW金属地，通过在特定区域打金属化过孔连接上下层金属地从而构建一个SIW喇叭天线单元。本申请实施例中的SIW喇叭天线单元中的喇叭本体分为两个部分：头部的三面围绕均匀排列的金属化过孔，一面未设置金属化过孔，其主要目的是激励起所需频率的电磁波，其尺寸决定了SIW喇叭天线单元的谐振频率；尾部连接于未设置金属化过孔的头部体的一侧，金属化过孔在尾部的外侧按预定的张角排布，从而实现头部激励起的电磁波向外辐射，通常尾部外侧的金属化过孔的张角的大小决定了SIW喇叭天线单元的辐射性能。
需要说明的是，本申请实施例中的所述阵列天线层和所述馈线层通过： 过孔、微带或共面波导的方式进行馈电，优选地，本申请实施例中采用馈电过孔240对SIW喇叭天线单元进行馈电，其主要目的是便于跟毫米波AIP模组的馈线层进行集成，实际中可以根据需要灵活采用其他馈电形式。
进一步需要说明的是，当采用过孔(也可以称为馈电过孔240)的方式进行馈电时，本申请实施例中的馈电过孔240的长度可以根据阻抗匹配的需求进行调节，可以与SIW上层金属地直接接触也可以埋于介质基板中。
还需要说明的是，在所述连接体包括多个金属化过孔时，金属化过孔20121的直径(d)可根据加工工艺等要求决定，相邻金属化过孔20121间的距离优选设置在金属化过孔直径的1.5倍和金属化过孔直径的2倍之间，以减少不必要的电磁泄露。
为了保证本申请的天线封装模组的多个辐射方向，本申请采用如下几种实现方式，下面以第一介质体2012和第二介质体2013为喇叭本体为例，分别对这几种实现方式进行说明如下。
实现方式一、喇叭天线并列放置
具体地，如图3所示，所述至少两个第一介质体2012和所述至少两个第二介质体2013在所述介质基板上沿第一方向镜像分布，且相邻的两个第一介质体2012之间和相邻的两个所述第二介质体2013在第二方向均分别沿第一预设间隔分布；
其中，所述第一方向垂直于所述第二方向。
需要说明的是，此种实现方式下，所述第一方向指的是X轴方向，第二方向为Y轴方向。
需要说明的是，此种实现方式下的喇叭本体的设置情况为：将分别属于第一介质体2012和第二介质体2013的喇叭本体分别制作在毫米波天线封装模组的上下两端(沿着X轴镜像排布)实现对上下两侧的双向辐射；同时将第一介质体2012和第二介质体2013的喇叭本体沿着Y轴按照一定的间距(优选为0.5个空气波长，也可以根据需要改变间距)排列以组成阵列(优选为1×4阵列，也可以根据需要改变阵列数目)，并通过射频集成电路100进行控 制，从而实现波束扫描。需要注意的是，本申请中的第一天线阵列201和第二天线阵列202共用同一射频集成电路100，并且同一时刻只有一个天线阵列工作，模组的双向辐射其实是通过切换天线阵列实现的。
进一步如图2所示，为毫米波天线封装模组侧视图，本申请的此种实现方式中的喇叭天线单元制作在阵列天线层200上，以毫米波发射为例，毫米波信号经由射频集成电路(RFIC)进入到馈线层300中的金属过孔并经由微带线与馈线过孔相连接，从而激励起SIW喇叭天线的辐射。
实现方式二、喇叭天线交错放置
具体地，如图5所示，所述至少两个第一介质体2012在第二方向上连续分布，所述至少两个第二介质体2013在第二方向上连续分布，且所述第一介质体2012和所述第二介质体2013在第二方向上交错分布。
需要说明的是，此种实现方式下，第二方向为Y轴方向。
进一步地，在进行具体设置时，所述交错分布的方式为：
相邻的所述第一介质体2012之间设置一个第二介质体2013，相邻的所述第二介质体2013之间设置一个第一介质体2012。
由图5所示，第二介质体2013的头部位于相邻的两个第一介质体2012的头部之间，第一介质体2012的头部位于相邻的两个第二介质体2013的头部之间。
需要说明的是，此种实现方式是在实现方式一的基础上，通过将SIW喇叭本体在同一天线层上交错排布来缩小毫米波天线封装模组在X轴方向的宽度，进而缩小了毫米波天线封装模组的尺寸，从而进一步缩小了毫米波天线封装模组在电子设备上的空间占用。
实现方式三、喇叭天线在不同层放置
具体地，如图6至图8所示，所述介质基板230包括：
第一基板231、第二基板232；
设置在所述第一基板231和所述第二基板232之间、连接所述第一基板231和所述第二基板232的第三金属层233；
所述至少两个第一介质体2012设置在所述第一基板231上；
所述至少两个第二介质体2013设置在所述第二基板232上。
需要说明的是，此种实现方式是在实现方式二的基础上，通过将不同辐射方向的喇叭本体制作在不同天线层(分别为上层天线层和下层天线层)上来进一步缩小毫米波天线封装模组在X轴方向的宽度，进而缩小了毫米波天线封装模组的尺寸，从而进一步缩小了毫米波天线封装模组在电子设备上的空间占用。
需要说明的是，本申请可以达到如下有益效果：
1、本申请不同于现有技术通常采用端射天线制作AIP，而是引入一种边射天线，如实施例中所说的采用的SIW喇叭天线单元，从而实现天线的辐射方向与毫米波AIP模组平行；
2、本申请通过将两个天线阵列的喇叭天线单元的开口设置的方向不同，以此实现毫米波AIP模组的向两个不同方向的辐射；
3、本申请通过切换不同的天线阵列来实现毫米波AIP模组向两个不同方向的覆盖，相比于现有技术的毫米波AIP模组有效的提高了空间覆盖(理论上提高了3dB)；
4、相比于现有技术，本申请上的毫米波AIP模组的两个天线阵列共用一个毫米波芯片(即两个天线阵列共用RFIC)，也就是说在实现相同空间覆盖时，现有技术需要两个毫米波芯片，而本申请只需一个毫米波芯片，因毫米波芯片价格往往很高，本申请有效的降低所需的毫米波芯片的数量，从而大大节约了成本。
还需要说明的是，本申请可应用于无线城际网路(Wireless Metropolitan Area Network，WMAN)、无线广域网路(Wireless Wide Area Networks，WWAN)、无线区域网路(Wireless Local Area Network，WLAN)、无线个人网路(Wireless Personal Area Network，WPAN)、多输入多输出(Multiple-Input Multiple-Output，MIMO)、射频识别(Radio Frequency Identification，RFID)，甚至是近场通信(Near Field Communication，NFC)、无线充电(Wireless Power  Consortium，WPC)，或调频(Frequency Modulation，FM)等无线通信设计与应用上；本申请尚可应用于电磁波吸收比值(Specific Absorption Rate，SAR)与助听器兼容性(Hearing Aid Compatibility，HAC)等对人体安全、健康，与佩戴的电子器件(如助听器或心率调整器等)相容性的法规测试与实际设计及应用上。
本申请实施例还提供一种电子设备，包括上述的天线封装模组。
进一步地，如图10所示，所述天线封装模组位于屏幕91与电池盖92之间，且所述天线封装模组的阵列天线层正对所述屏幕91上未设置纳米铟锡金属氧化物(Indium Tin Oxides，ITO)层的位置；由于屏幕中ITO层的存在，毫米波信号无法穿透，因此需要将本申请中的天线封装模组放置在屏幕黑边处(黑边处没有ITO层)以实现对屏幕上方的毫米波信号覆盖。
还需要说明的是，所述天线封装模组的辐射方向为所述电子设备的屏幕的上方或电池盖的下方。
需要说明的是，现有技术中毫米波天线模组在移动终端中放置的方案，为了避免金属对毫米波天线性能的影响，目前的解决方案有在金属边框上开窗，以及缩短金属边框；现有技术中无论采用哪种方案，都需要破坏金属边框，从而破坏了外观的完整性以及给结构强度带来不稳定性；而本申请中由于采用了端射天线，从而实现了天线辐射方向与天线面平行(如图3中沿着X方向)，从而不需要破坏金属边框；同时本申请中的天线封装模组通过切换不同的天线阵列来实现对显示屏幕上方以及电池后盖下方的毫米波信号覆盖，从而实现更大空间的毫米波信号覆盖。
如图11和图12所示，为本申请的天线封装模组的两种可能的布局示意图，图11中的第一天线模组10为本申请实施例中的毫米波天线封装模组，第二天线模组20和第三天线模组30为现有技术的端射patch毫米波天线模组。图11中采用本申请的天线封装模组用来实现电子设备屏幕上方和电池盖下方的毫米波覆盖，同时在电子设备的侧边放置现有技术的端射patch毫米波的第二天线模组20和第三天线模组30用来实现横屏状态下的毫米波信号覆盖， 通过本申请与现有技术相结合的形式可以获得更好的空间覆盖；需要说明的是，本申请通过合理放置毫米波AIP模组，可以实现对电子设备屏幕上侧的辐射，同时在进行毫米波天线布局时，可以将本申请的毫米波AIP模组与现有技术的毫米波AIP相结合，从而更进一步提高毫米波的空间覆盖。图12中则是仅采用本申请的毫米波天线模组用来实现电子设备屏幕上方(上半球覆盖)和电池盖下方的毫米波覆盖(下半球覆盖)，该种布局仅需要1个毫米波天线模组(即1个毫米波RFIC)则可实现自由状态下近似全空间的覆盖，大大降低了毫米波天线模组对电子设备的空间占用，同时也有效的降低了电子设备的成本。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。此外，需要指出的是，本申请实施方式中的方法和装置的范围不限按示出或讨论的顺序来执行功能，还可包括根据所涉及的功能按基本同时的方式或按相反的顺序来执行功能，例如，可以按不同于所描述的次序来执行所描述的方法，并且还可以添加、省去、或组合各种步骤。另外，参照某些示例所描述的特征可在其他示例中被组合。
通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现，当然也可以通过硬件，但很多情况下前者是更佳的实施方式。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质(如计算机只读存储器(Read-Only Memory，ROM)、随机存取存储器(Random Access Memory，RAM)、磁碟、光盘)中，包括若干指令用以使得一台终端(可以是手机， 计算机，服务器，空调器，或者网络设备等)执行本申请各个实施例所述的方法。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (12)

  1. 一种天线封装模组，包括：
    射频集成电路；
    与所述射频集成电路连接的阵列天线层；
    与所述阵列天线层连接的馈线层；
    与所述射频集成电路连接的电源管理集成电路；
    其中，所述阵列天线层包括第一天线阵列和第二天线阵列，且所述第一天线阵列和所述第二天线阵列的辐射方向不相同；
    所述第一天线阵列和所述第二天线阵列的天线辐射方向均与所述阵列天线层所在面平行。
  2. 根据权利要求1所述的天线封装模组，其中，所述阵列天线层，包括：
    第一金属层、第二金属层；
    分别与所述第一金属层和所述第二金属层连接，且位于所述第一金属层和所述第二金属层之间的介质基板；
    所述介质基板包括由连接体构成的至少两个第一介质体和至少两个第二介质体，所述连接体将所述第一金属层和所述第二金属层导通；
    所述第一金属层和所述第二金属层以及至少两个第一介质体构成所述第一天线阵列；
    所述第一金属层和所述第二金属层以及至少两个第二介质体构成所述第二天线阵列。
  3. 根据权利要求2所述的天线封装模组，其中，所述连接体围成具有开口端和封闭端的至少两个介质区域，所述第一介质体、所述第二介质体分别与所述至少两个介质区域一一对应设置；
    其中，所述开口端的长度大于所述封闭端的长度。
  4. 根据权利要求2所述的天线封装模组，其中，所述至少两个第一介质体和所述至少两个第二介质体在所述介质基板上沿第一方向镜像分布，且相 邻的两个第一介质体之间和相邻的两个所述第二介质体在第二方向均分别沿第一预设间隔分布；
    其中，所述第一方向垂直于所述第二方向。
  5. 根据权利要求2所述的天线封装模组，其中，所述至少两个第一介质体在第二方向上连续分布，所述至少两个第二介质体在第二方向上连续分布，且所述第一介质体和所述第二介质体在第二方向上交错分布。
  6. 根据权利要求5所述的天线封装模组，其中，所述交错分布的方式为：
    相邻的所述第一介质体之间设置一个第二介质体，相邻的所述第二介质体之间设置一个第一介质体。
  7. 根据权利要求2所述的天线封装模组，其中，所述介质基板包括：
    第一基板、第二基板；
    设置在所述第一基板和所述第二基板之间、连接所述第一基板和所述第二基板的第三金属层；
    所述至少两个第一介质体设置在所述第一基板上；
    所述至少两个第二介质体设置在所述第二基板上。
  8. 根据权利要求2或7所述的天线封装模组，其中，所述连接体包括多个金属化过孔，且相邻的所述金属化过孔之间的间距位于金属化过孔直径的1.5倍和金属化过孔直径的2倍之间。
  9. 根据权利要求1所述的天线封装模组，其中，所述阵列天线层和所述馈线层通过：过孔、微带或共面波导的方式进行馈电。
  10. 一种电子设备，包括如权利要求1至9中任一项所述的天线封装模组。
  11. 根据权利要求10所述的电子设备，其中，所述天线封装模组位于屏幕与电池盖之间，且所述天线封装模组的阵列天线层正对所述屏幕上未设置纳米铟锡金属氧化物ITO层的位置。
  12. 根据权利要求10所述的电子设备，其中，所述天线封装模组的辐射方向为所述电子设备的屏幕的上方或电池盖的下方。
PCT/CN2022/075340 2021-02-08 2022-02-07 天线封装模组及电子设备 WO2022166946A1 (zh)

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