WO2022161333A1 - Équipement électronique et dispositif d'affichage - Google Patents
Équipement électronique et dispositif d'affichage Download PDFInfo
- Publication number
- WO2022161333A1 WO2022161333A1 PCT/CN2022/073628 CN2022073628W WO2022161333A1 WO 2022161333 A1 WO2022161333 A1 WO 2022161333A1 CN 2022073628 W CN2022073628 W CN 2022073628W WO 2022161333 A1 WO2022161333 A1 WO 2022161333A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- nfc
- display device
- light
- coil
- Prior art date
Links
- 238000009792 diffusion process Methods 0.000 claims abstract description 38
- 229910000859 α-Fe Inorganic materials 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 claims description 137
- 239000011241 protective layer Substances 0.000 claims description 15
- 239000000084 colloidal system Substances 0.000 claims description 2
- 239000000306 component Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W4/00—Services specially adapted for wireless communication networks; Facilities therefor
- H04W4/80—Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Definitions
- the present application relates to the field of electronic equipment, and in particular, to electronic equipment and display devices.
- an electronic device is configured with a Near Field Communication (Near Field Communication, NFC) module.
- NFC Near Field Communication
- the NFC module enables the electronic device to have a short-range wireless communication function.
- electronic devices can be used for payment, motion monitoring, access control, etc. Obviously, this can further expand the application scenarios of electronic devices.
- the electronic device is equipped with a display module, and the NFC module is attached to the back of the display module (ie, the surface opposite to the display surface of the display module), thereby realizing the stacked installation of the NFC module and the display module.
- the NFC module is attached to the back of the display module (ie, the surface opposite to the display surface of the display module), thereby realizing the stacked installation of the NFC module and the display module.
- such an assembly structure will lead to a larger thickness of the electronic device, and thus cannot meet the requirement of developing the electronic device in a thinner direction.
- the present invention proposes a display device to solve the problem of increased thickness caused by the NFC module occupying the stacking space of the display device.
- the present application discloses a display device including an NFC module and a backlight module, wherein: the NFC module includes an NFC coil and an NFC ferrite; the backlight module includes a diffusion layer and a first an insulating layer, the NFC coil is disposed on the diffusion layer and within the first insulating layer, and the NFC ferrite is disposed on the side of the diffusion layer facing away from the NFC coil.
- the present application discloses an electronic device including the display device.
- the NFC coil is arranged on the diffusion layer and located in the first insulating layer, so as to realize the embedding of the NFC module in the display device, thereby avoiding the occupation of the stacking space of the display device by the NFC module.
- reducing the thickness of the display device is conducive to the development of the display device to be lighter and thinner, and ultimately is conducive to the design of the electronic device in a thinner direction.
- FIG. 1 is a layout diagram of an NFC module in a display device disclosed in an embodiment of the present invention
- Fig. 2 is an enlarged view at I of Fig. 1 disclosed in an embodiment of the present invention
- FIG. 3 is a cross-sectional view taken along the M-M direction of FIG. 1 disclosed in an embodiment of the present invention
- FIG. 4 is a structural diagram of a light source component layer disclosed in an embodiment of the present invention.
- 110-NFC coil 110-NFC coil, 111-first coil end, 112-second coil end,
- 200-backlight module 200a-display area, 200b-non-display area,
- the display device disclosed in the present application includes an NFC module 100 and a backlight module 200 .
- the NFC module 100 includes the NFC coil 110 and the NFC ferrite 120 .
- the backlight module 200 includes a diffusion layer 230 and a first insulating layer 240 that are stacked in sequence.
- the NFC coil 110 is disposed on the diffusion layer 230
- the NFC coil 110 is located in the first insulating layer 240
- the NFC ferrite 120 is disposed on the side of the diffusion layer 230 facing away from the NFC coil 110 .
- the display device disclosed in the embodiment of the present application includes a display screen, and the display screen is stacked on the backlight module 200 , and performs a display function under the backlight provided by the backlight module 200 .
- the diffusion layer 230 performs diffusion treatment on the backlight emitted by the backlight module 200 to make it diffuse evenly and then emits it, so as to achieve a better light-emitting effect.
- the first insulating layer 240 provides insulating protection for the NFC module 100 to prevent short circuit.
- the function of the NFC module 100 is to play the NFC function.
- the NFC ferrite 120 gathers magnetic flux to effectively increase the sensing distance by increasing the magnetic field strength, while the NFC coil 110 is used to generate an NFC signal.
- the NFC coil 110 is disposed on the diffusion layer 230 and embedded in the first insulating layer 240, so that the NFC coil 110 does not need to occupy the stacking space separately, thereby avoiding the NFC module 100 occupying the stacking space of the backlight module 200.
- the thickness of the display device of the present application can be effectively reduced. According to the statistics of the test data, the thickness of the display device is reduced by about 300 ⁇ m by adopting the design method of the adaptation of the NFC module 100 and the backlight module 200 of the present application. It is conducive to the design of electronic equipment towards thinner direction.
- the NFC coil 110 may be deposited on the diffusion layer 230 by vapor deposition first, and then the first insulating layer 240 may be stacked on the diffusion layer 230 by vapor deposition, and the NFC coil 110 It is in the first insulating layer 240 to realize the assembly of the display device of the present application.
- the specific materials of the NFC coil 110 can be transparent ITO, nano-silver, TiAlTi, etc.
- ITO and TiAlTi can be arranged on the diffusion layer 230 by magnetron sputtering, and the nano-silver can be coated with liquid. method is provided on the diffusion layer 230 .
- the NFC coil 110 can be set as a transparent wire to further improve the screen ratio.
- the NFC coil 110 can flexibly adjust the proportion of transparent metal components by using an evaporation process to adapt to different working scenarios.
- the NFC coil 110 extends along the edge of the backlight module 200 and is arranged in multiple circles.
- the backlight module 200 includes a display area 200a and a non-display area 200b.
- the non-display area 200b is disposed around the display area 200a, a part of the NFC coil 110 is located in the display area 200a, and another part of the NFC coil 110 is located in the non-display area 200b.
- Such a layout method can effectively prevent the NFC coil 110 from entering the center of the display area 200a to reduce the screen ratio, and the regular wiring method is also beneficial to avoid the problem of screen flashing during card reading.
- the NFC coil 110 includes a first coil end 111 adjacent to the center of the backlight module 200 and a second coil end 112 adjacent to the edge of the backlight module 200 .
- the display device further Including a first flexible circuit board 300, the first end of the first flexible circuit board 300 is connected to the edge of the backlight module 200, and is electrically connected to the second coil end 112, and the first coil end 111 is connected to the first coil end 111 through the bridge wiring 400.
- the flexible circuit board 300 is electrically connected.
- the design of the first flexible circuit board 300 can transmit the NFC signal generated by the NFC module 100 to the external chip to complete the signal transmission.
- the first flexible circuit board 300 is disposed on the edge of the backlight module 200, and the layout of connecting the first coil end 111 and the second coil end 112 with the bridge wiring 400 can ensure that the first flexible circuit board 300 can effectively transmit NFC At the same time, the signal is far away from the center of the backlight module 200 to avoid interfering with the work of the backlight module 200 .
- the backlight module 200 further includes a first protective layer 250 , and the diffusion layer 230 , the first insulating layer 240 and the first protective layer 250 are stacked in sequence.
- the first part of the bridging trace 400 is disposed in the first insulating layer 240
- the second part of the bridging trace 400 is disposed in the first protective layer 250 .
- the first protective layer 250 can be selected in different materials according to different working scenarios, for example, an organic photoresist layer that prevents water and oxygen corrosion is used to prevent water and oxygen corrosion, or the first protective layer 250 is selected from the first insulating layer. 240 of the same material to provide insulation protection.
- the way that the bridging trace 400 is partially located in the first insulating layer 240 can realize the connection between the first coil end 111 and other parts of the NFC coil 110 at the same time, so that the first insulating layer 240 can prevent the bridging trace 400 from being connected to the NFC coil. 110; the first part of the bridging trace 400 is disposed in the first insulating layer 240, and the second part of the bridging trace 400 is disposed in the first protective layer 250, so that the bridging trace 400 can be embedded in the first protective layer 250. Between the insulating layer 240 and the first protective layer 250 , the bridging traces 400 can prevent the stacking space of the backlight module 200 from occupying, thereby further reducing the thickness of the display device.
- the backlight module 200 further includes a light source component layer 220 .
- the light source component layer 220 is stacked on the side of the diffusion layer 230 facing away from the first insulating layer 240 , and is located between the NFC ferrite 120 and the diffusion layer 230 .
- the light source assembly layer 220 is used to emit light, and is the core component of the backlight module 200 , and the backlight module 200 achieves the purpose of emitting light through the light source assembly layer 220 .
- the light source component layer 220 may be configured to include a light guide layer 221 and a light source 222 .
- the light source 222 is arranged on one side of the light guide layer 221 , the light source component layer 220 is stacked on the diffusion layer 230 through the light guide layer 221 , the light emitted by the light source 222 will enter the light guide layer 221 , and will be emitted backward through the light guide layer 221 .
- the first part of the light emitted by the NFC ferrite 120 is the first part of the light emitted by the NFC ferrite 120 .
- the light source component layer 220 will eventually emit light in the form of a surface light source, so that the light will be emitted more uniformly through the light guide layer 221, and the luminous effect will be better.
- the light source component layer 220 may further include a reflector 223 .
- the reflector 223 covers the light source 222 and is disposed opposite to the light guide layer 221 .
- the reflector 223 is provided with a reflector on the side facing the light guide layer 221 . The light emitted by the light source 222 will enter the light guide layer 221 through the reflection port after being reflected by the reflection cover 223 .
- the light emitted by the light source 222 will also enter the light guide layer 221 through the reflection port after being reflected by the reflector 223, so that the incident light can be injected into the light guide layer 221.
- the light of the layer 221 is increased, thereby enhancing the brightness of the light emitted by the light guide layer 221, and at the same time, the utilization rate of light can be improved.
- the backlight module 200 may further include a reflective layer 210 , and the reflective layer 210 is stacked between the NFC ferrite 120 and the light source assembly layer 220 .
- the light emitted by the light source 222 will enter the light guide layer 221 and emit a second part of the light toward the reflection layer 210 through the light guide layer 221 . After the second part of the light is reflected by the reflective layer 210, it will be emitted in the direction of the first part of the light.
- the second part of the light can be reflected to the light exit direction of the backlight module 200, that is, the first part of the light and the second part of the light are combined and emitted in the same direction, and the brightness of the light emitted by the backlight module 200 can be enhanced. , thereby improving the utilization of light.
- the diffusion layer 230 includes end outer edges 231 .
- the first insulating layer 240 forms a first projection on the diffusion layer 230, and the outer edge 231 of the end portion forms a second projection on the diffusion layer 230.
- the first projection and the second projection are coplanar and located on one side of the second projection.
- a first electrode sheet 232 and a second electrode sheet 233 are fixed on the surface of the outer edge 231 of the end portion facing the display direction of the backlight module 200 , and the first end of the first flexible circuit board 300 is used for connecting with the first electrode sheet 232 and the second electrode sheet.
- the sheet 233 is electrically connected, the first coil end 111 is electrically connected to the first electrode sheet 232 through the bridge wiring 400 , and the second coil end 112 is electrically connected to the second electrode sheet 233 .
- the second end of the first flexible circuit board 300 is used for electrical connection with the main board of the electronic device.
- the first electrode sheet 232 and the second electrode sheet 233 can be fully exposed through the arrangement of the outer edge 231 of the end portion, which facilitates the connection between the NFC coil 110 and the first flexible circuit board 300 .
- the second electrode sheet 233 is used as an intermediate transmission medium, which is more conducive to the transmission of the signal generated by the NFC coil 110 to the first flexible circuit board 300 .
- both the first electrode sheet 232 and the second electrode sheet 233 can be made of ITO, nano-silver, TiAlTi, etc. In terms of specific technological means, they can also be deposited on the diffusion layer 230 by vapor deposition. s surface.
- the backlight module 200 further includes a light-enhancing layer 260 , and the light-enhancing layer 260 is stacked on the side of the first protective layer 250 facing away from the first insulating layer 240 .
- the light-enhancing layer 260 has the function of concentrating light. After the light emitted by the light source component layer 220 is evenly diffused by the diffusing layer 230 , the brightness is increased by the light-enhancing layer 260 to further enhance the luminous effect of the light source component layer 220 .
- the first end of the first flexible circuit board 300 is overlapped and fixed on the first electrode sheet 232 and the second electrode sheet 233 , and the end faces of the first electrode sheet 232 and the second electrode sheet 233
- a glue 500 is arranged between the first flexible circuit board 300 to ensure a more stable connection, and at the same time, the glue 500 can prevent the first end of the first flexible circuit board 300 from being bent at a large angle, thereby protecting the first The role of the flexible circuit board 300 .
- the colloid 500 can choose vertical glue as the adhesive.
- the NFC coil 110 , the first electrode sheet 232 and the second electrode sheet 233 are arranged in the same layer. For example, they are all disposed on the surface of the diffusion layer 230 and inside the first insulating layer 240 to improve space utilization and further avoid occupying the stacking space of the backlight module 200 .
- the surface of the NFC ferrite 120 facing the reflective layer 210 is a first end surface, and the first end surface is provided with a convex ring 121 .
- the projection of the NFC coil 110 on the first end face is located in the projection of the convex ring 121 on the first end face.
- the surface of the NFC ferrite 120 surrounded by the convex ring 121 can be used as a receiving surface for sending signals to the NFC coil 110, and adding the convex ring 121 on the surface of the NFC ferrite 120 can further focus the magnetic flux, improve the strength of the NFC signal and stability.
- the backlight module 200 may further include a support frame, the support frame is usually an iron frame, and the support frame can support other structures of the backlight module 200 .
- the support frame is the NFC ferrite 120.
- the support frame and the NFC ferrite 120 are multiplexed, so that the support frame of the backlight module 200 can play a dual-purpose effect. The problem of increased thickness caused by stacking more structures of the backlight module 200 is avoided, which further facilitates the design of the display device in a thinner direction.
- the specific process means for realizing the stacking of the reflective layer 210 , the light source component layer 220 , the diffusion layer 230 , the first insulating layer 240 , the first protective layer 250 and the light enhancement layer 260 in sequence can be achieved by vapor deposition. accomplish.
- the electronic devices disclosed in the embodiments of the present application may be mobile phones, tablet computers, e-book readers, wearable devices (eg, smart watches, smart glasses), etc.
- the embodiments of the present application do not limit the specific types of electronic devices.
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- Computer Networks & Wireless Communication (AREA)
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- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN202110120602.0A CN112927614B (zh) | 2021-01-28 | 2021-01-28 | 电子设备及显示装置 |
CN202110120602.0 | 2021-01-28 |
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WO2022161333A1 true WO2022161333A1 (fr) | 2022-08-04 |
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PCT/CN2022/073628 WO2022161333A1 (fr) | 2021-01-28 | 2022-01-25 | Équipement électronique et dispositif d'affichage |
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CN (1) | CN112927614B (fr) |
WO (1) | WO2022161333A1 (fr) |
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CN112927616B (zh) * | 2021-01-28 | 2023-03-14 | 维沃移动通信有限公司 | 电子设备及显示装置 |
CN112927614B (zh) * | 2021-01-28 | 2023-06-16 | 维沃移动通信有限公司 | 电子设备及显示装置 |
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CN112927614B (zh) | 2023-06-16 |
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