WO2022161306A1 - Dispositif électronique et appareil d'affichage - Google Patents

Dispositif électronique et appareil d'affichage Download PDF

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Publication number
WO2022161306A1
WO2022161306A1 PCT/CN2022/073451 CN2022073451W WO2022161306A1 WO 2022161306 A1 WO2022161306 A1 WO 2022161306A1 CN 2022073451 W CN2022073451 W CN 2022073451W WO 2022161306 A1 WO2022161306 A1 WO 2022161306A1
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WO
WIPO (PCT)
Prior art keywords
nfc
coil
layer
electrode sheet
screen
Prior art date
Application number
PCT/CN2022/073451
Other languages
English (en)
Chinese (zh)
Inventor
段进才
赵宇晓
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2022161306A1 publication Critical patent/WO2022161306A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display

Definitions

  • the present application relates to the field of electronic equipment, and in particular, to electronic equipment and display devices.
  • an electronic device is configured with a Near Field Communication (Near Field Communication, NFC) module.
  • NFC Near Field Communication
  • the NFC module enables the electronic device to have a short-range wireless communication function.
  • electronic devices can be used for payment, motion monitoring, access control, etc. Obviously, this can further expand the application scenarios of electronic devices.
  • the electronic device is equipped with a display module, and the NFC module is attached to the back of the display module (ie, the surface opposite to the display surface of the display module), thereby realizing the stacked installation of the NFC module and the display module.
  • the NFC module is attached to the back of the display module (ie, the surface opposite to the display surface of the display module), thereby realizing the stacked installation of the NFC module and the display module.
  • such an assembly structure will lead to a larger thickness of the electronic device, and thus cannot meet the requirement of developing the electronic device in a thinner direction.
  • An embodiment of the present application proposes a display device to solve the problem of increased thickness caused by the NFC module occupying the stacking space of the display device.
  • the present application discloses a display device including an NFC module and a display screen, wherein: the NFC module includes an NFC coil and an NFC ferrite; the display screen includes a circuit substrate layer and a screen encapsulation layer stacked in sequence and a first insulating layer, the NFC coil is arranged on the screen encapsulation layer and inside the first insulating layer, and the NFC ferrite is arranged on the circuit substrate layer facing away from the NFC coil. side.
  • the present application discloses an electronic device including the display device.
  • the NFC coil is arranged in the first insulating layer, and the NFC module is embedded in the display screen, thereby avoiding the occupation of the stacking space of the display device by the NFC module, and reducing the thickness of the display device. It is beneficial to the development of the display device towards lightness and thinness.
  • FIG. 1 is a layout diagram of an NFC module in a display device disclosed in an embodiment of the present application.
  • Fig. 2 is an enlarged view of part I of Fig. 1 disclosed in the embodiment of the present application;
  • FIG. 3 is a cross-sectional view taken along the line M-M of FIG. 1 disclosed in the embodiment of the present application.
  • 110-NFC coil 110-NFC coil, 111-first coil end, 112-second coil end,
  • 300-first flexible circuit board 400-bridge wiring, 500-colloid, 600-elastic buffer layer.
  • the display device disclosed in the present application includes an NFC module 100 and a display screen 200 , wherein: the NFC module 100 includes an NFC coil 110 and an NFC ferrite 120 .
  • the display screen 200 includes a circuit substrate layer 210 , a screen encapsulation layer 220 and a first insulating layer 230 which are stacked in sequence.
  • the NFC coil 110 is disposed on the screen encapsulation layer 220 within the first insulating layer 230
  • the NFC ferrite 120 is disposed on the side of the circuit substrate layer 210 facing away from the NFC coil 110 .
  • the circuit substrate layer 210 is the layer where the wiring of the display screen 200 is located, and is the main part of the display screen.
  • the specific material of the circuit substrate layer 210 may be a low temperature polysilicon (Low Temperature Poly-Silicon, LTPS) layer, which It has the advantages of ultra-thin, light weight and low power consumption, and is suitable for the light and thin requirements of the display device of the present application.
  • the screen encapsulation layer 220 may be the encapsulation glass layer of the hard screen or the thin film encapsulation layer of the flexible screen, so as to encapsulate and protect the circuit substrate layer 210 to prevent the wiring and various deposited film layers on the circuit substrate layer 210 from being affected by water. Oxygen corrosion, the two are the core components for the display screen 200 to realize the display function.
  • the function of the NFC module 100 is to exert the NFC function, specifically, the NFC ferrite 120 condenses the magnetic flux to effectively increase the sensing distance by increasing the magnetic field strength, and the NFC coil 110 is used to generate the NFC signal.
  • the NFC coil 110 does not need to occupy the stacking space alone, thereby avoiding the NFC module 100 occupying the stacking space of the display screen 200, and can effectively reduce the thickness of the display device of the present application , according to the statistics of the test data, the thickness of the display device is reduced by about 150 ⁇ m by adopting the design method that the NFC module 100 and the display screen 200 of the present application are adapted, which is beneficial to the development of the display device to be light and thin.
  • the screen encapsulation layer 220 can be stacked on the circuit substrate layer 210 by vapor deposition first, and then the NFC coil 110 can be attached to the screen encapsulation layer 220 by vapor deposition, and then The first insulating layer 230 is stacked on the screen encapsulation layer 220 by vapor deposition, and the NFC coil 110 is placed in the first insulating layer 230, so as to realize the assembly of the display device of the present application.
  • the specific material of the NFC coil 110 can be transparent indium tin oxide (Indium Tin Oxide, ITO), nano-silver, TiAlTi, etc.
  • ITO and TiAlTi can be arranged on the screen encapsulation layer by means of magnetron sputtering. 220, and the nano-silver can be disposed on the screen encapsulation layer 220 by a liquid coating method.
  • the NFC coil 110 extends along the edge of the display screen 200 and is arranged in multiple circles.
  • the display screen 200 includes a display area 200a and a non-display area 200b, which The area 200b is arranged around the display area 200a, a part of the NFC coil 110 is located in the display area 200a, and the other part of the NFC coil 110 is located in the non-display area 200b.
  • Such a layout can effectively prevent the NFC coil 110 from entering the center of the display area 200a and reduce the screen ratio , and the way of regular wiring is also beneficial to avoid the problem of flashing screen when reading the card.
  • the NFC coil 110 is a transparent wire to further increase the screen ratio, and the NFC coil 110 can flexibly adjust the proportion of transparent metal components by using an evaporation process to adapt to different working scenarios.
  • the NFC coil 110 includes a first coil end 111 adjacent the center of the display screen 200 and a second coil end 112 adjacent the edge of the display screen 200 .
  • the display device further includes a first flexible circuit board 300 .
  • the first end of the first flexible circuit board 300 is connected to the edge of the display screen 200, while the first flexible circuit board 300 is electrically connected to the second coil end 112, and the first coil end 111 is connected to the first flexible circuit board through the bridge wire 400 300 electrical connections.
  • the design of the first flexible circuit board 300 can transmit the NFC signal generated by the NFC module 100 to the external chip to complete the signal transmission.
  • the first flexible circuit board 300 is disposed on the edge of the display screen 200, and the layout of connecting the first coil end 111 and the second coil end 112 with the bridge wiring 400 can ensure that the first flexible circuit board 300 can effectively transmit NFC signals At the same time, it is far away from the center of the display screen 200 to avoid interfering with the work of the display screen 200 .
  • the display screen 200 further includes a first protective layer 240 , and the first protective layer 240 is stacked on the first insulating layer 230 , specifically, stacked in the first insulating layer 230 and facing away from the screen on one side of the encapsulation layer 220 .
  • the first part of the bridging trace 400 is disposed in the first insulating layer 230
  • the second part of the bridging trace 400 is disposed in the first protective layer 240 .
  • the first protective layer 240 can be selected in different materials according to different working scenarios. For example, when the touch control mode of the display screen 200 is incell type, the touch traces of the display screen 200 are integrated in the circuit substrate layer 210 and the screen package. Between the layers 220, the first protective layer 240 can be set as an organic photoresist layer to prevent water and oxygen corrosion. In a specific process embodiment, the first protective layer 240 can be stacked on the first insulating layer by spin coating layer 230. When the touch mode of the display screen 200 is oncell hard-screen external in-cell touch, the touch traces of the display screen 200 are located above the first insulating layer 230, and the first protective layer 240 can be made of the first insulating layer. 230 is made of the same material to provide insulating protection against short circuits.
  • the way that the bridging trace 400 is partially located in the first insulating layer 230 can realize the connection between the first coil end 111 and other parts of the NFC coil 110 while maintaining a distance, so that the first insulating layer 230 can prevent the bridging trace 400 from being connected to the NFC coil. 110; the first part of the bridging trace 400 is disposed in the first insulating layer 230, and the second part of the bridging trace 400 is disposed in the first protective layer 240, which can be embedded in the first insulating layer 230 and between the first protective layers 240 to prevent the bridging traces 400 from occupying the stacking space of the display screen 200 and further reduce the thickness of the display device.
  • the NFC coil 110 may be a spiral line disposed on the edge of the display screen 200 , and is attached to the screen encapsulation layer 220 in a mouth-shaped or back-shaped layout as a whole, and circles from the display area 200a to the non-display area 200b.
  • the first coil end 111 and the second coil end 112 are both disposed on the screen encapsulation layer 220 , that is, on the same thickness of the display screen 200 in the stacking direction, so as to reduce the NFC coil 110 on the display screen 200 as much as possible.
  • the thickness in the stacking direction and the connection method of the bridging traces 400 can improve the thinning effect of the display device.
  • the bridge wiring 400 may be disposed on the display screen 200 by means of magnetron sputtering, which is also beneficial to reduce the occupation of the stacking space by the bridge wiring 400 .
  • the screen encapsulation layer 220 includes an end outer edge 221 .
  • the first insulating layer 230 forms a first projection on the screen encapsulation layer 220, and the outer edge 221 of the end portion forms a second projection on the screen encapsulation layer 220.
  • the first projection and the second projection are coplanar and located on one side of the second projection .
  • a first electrode sheet 222 and a second electrode sheet 223 are fixed on the surface of the outer edge 221 of the end portion facing the display direction of the display screen 200 , and the first end of the first flexible circuit board 300 is connected with the first electrode sheet 222 and the second electrode sheet 223
  • the first coil end 111 is electrically connected to the first electrode sheet 222 through the bridge wiring 400
  • the second coil end 112 is electrically connected to the second electrode sheet 223 .
  • the second end of the first flexible circuit board 300 is used for electrical connection with the main board of the electronic device.
  • the first electrode sheet 222 and the second electrode sheet 223 can be fully exposed through the arrangement of the outer edge 221 of the end portion, which facilitates the connection between the NFC coil 110 and the first flexible circuit board 300, and the first electrode sheet 222 and the second electrode sheet 223 as an intermediate transmission medium, which is more conducive to the transmission of the signal generated by the NFC coil 110 to the first flexible circuit board 300 .
  • both the first electrode sheet 222 and the second electrode sheet 223 can be made of ITO, nano-silver, TiAlTi, etc.
  • vapor deposition can also be used to apply them to the screen encapsulation layer. 220 surface.
  • the first end of the first flexible circuit board 300 is overlapped and fixed on the first electrode sheet 222 and the second electrode sheet 223 , and the end faces of the first electrode sheet 222 and the second electrode sheet 223
  • a glue 500 is arranged between the first flexible circuit board 300 to ensure a more stable connection, and at the same time, the glue 500 can prevent the first end of the first flexible circuit board 300 from being bent at a large angle, thereby protecting the first The role of the flexible circuit board 300 .
  • the colloid 500 can choose vertical glue as the adhesive.
  • the NFC coil 110 , the first electrode sheet 222 and the second electrode sheet 223 are arranged in the same layer, for example, they are all arranged on the surface of the screen encapsulation layer 220 and inside the first insulating layer 230 to improve space utilization, and further to avoid occupying the overlapping space of the display screen 200 .
  • an elastic buffer layer 600 is stacked on the side of the circuit substrate layer 210 facing away from the NFC coil 110 , and the NFC ferrite 120 is stacked on the elastic buffer layer 600 and located in the elastic buffer layer.
  • the layer 600 faces away from the side of the NFC coil 110 .
  • the design of the elastic buffer layer 600 can play a buffer role to prevent the circuit substrate layer 210 from being damaged by bumps, and at the same time, the design of the elastic buffer layer 600 can also increase the magnetic induction distance between the NFC coil 110 and the NFC ferrite 120 , to enhance the transmission signal.
  • the specific process means for realizing the successive stacking of the circuit substrate layer 210, the screen encapsulation layer 220, the first insulating layer 230 and the first protective layer 240 can be realized by vapor deposition.
  • the embodiment of the present application discloses an electronic device, and the disclosed electronic device includes the display device described in the above embodiment.
  • the electronic devices disclosed in the embodiments of the present application may be wearable devices such as smart phones and smart watches, and of course other types of devices.
  • the embodiments of the present application do not limit the specific types of electronic devices.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne un appareil d'affichage, comprenant un module NFC et un écran d'affichage. Le module NFC comprend une bobine NFC et une ferrite NFC ; et l'écran d'affichage comprend une couche de substrat de circuit, une couche d'encapsulation d'écran et une première couche isolante, qui sont empilées de manière séquentielle, la bobine NFC étant disposée sur la couche d'encapsulation d'écran et étant située dans la première couche isolante, et la ferrite NFC étant disposée sur le côté d'un substrat de circuit qui est opposé à la bobine NFC. L'invention concerne en outre un dispositif électronique.
PCT/CN2022/073451 2021-01-28 2022-01-24 Dispositif électronique et appareil d'affichage WO2022161306A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110121001.1 2021-01-28
CN202110121001.1A CN112783372B (zh) 2021-01-28 2021-01-28 电子设备及显示装置

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WO2022161306A1 true WO2022161306A1 (fr) 2022-08-04

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WO (1) WO2022161306A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112927613B (zh) * 2021-01-28 2023-07-07 维沃移动通信有限公司 电子设备及显示模组
CN112783372B (zh) * 2021-01-28 2023-04-18 维沃移动通信有限公司 电子设备及显示装置
CN114464084A (zh) * 2021-06-21 2022-05-10 电子科技大学 一种智能化穿戴设备及其制备工艺
CN114464092B (zh) * 2022-02-14 2023-12-05 京东方科技集团股份有限公司 一种显示模组及其制备方法、显示装置

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CN111399286A (zh) * 2020-04-30 2020-07-10 厦门天马微电子有限公司 显示装置及电子设备
US20200266542A1 (en) * 2016-03-10 2020-08-20 Kunshan Visionox Technology Co., Ltd. Display device having nfc communication function
CN112783372A (zh) * 2021-01-28 2021-05-11 维沃移动通信有限公司 电子设备及显示装置

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CN111413815B (zh) * 2020-04-08 2022-06-17 厦门天马微电子有限公司 显示面板和显示装置
CN111508340B (zh) * 2020-04-26 2022-04-05 厦门天马微电子有限公司 一种显示模组、制备方法以及显示装置

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Publication number Priority date Publication date Assignee Title
US20200266542A1 (en) * 2016-03-10 2020-08-20 Kunshan Visionox Technology Co., Ltd. Display device having nfc communication function
CN110941113A (zh) * 2019-11-27 2020-03-31 上海天马微电子有限公司 显示装置及其制作方法
CN111399286A (zh) * 2020-04-30 2020-07-10 厦门天马微电子有限公司 显示装置及电子设备
CN112783372A (zh) * 2021-01-28 2021-05-11 维沃移动通信有限公司 电子设备及显示装置

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