WO2022158687A1 - Masque métallique fin pour affichage de grande surface et son procédé de fabrication - Google Patents

Masque métallique fin pour affichage de grande surface et son procédé de fabrication Download PDF

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Publication number
WO2022158687A1
WO2022158687A1 PCT/KR2021/016072 KR2021016072W WO2022158687A1 WO 2022158687 A1 WO2022158687 A1 WO 2022158687A1 KR 2021016072 W KR2021016072 W KR 2021016072W WO 2022158687 A1 WO2022158687 A1 WO 2022158687A1
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WO
WIPO (PCT)
Prior art keywords
photomask
alignment
fine metal
metal mask
manufacturing
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PCT/KR2021/016072
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English (en)
Korean (ko)
Inventor
유명훈
김재범
한덕기
Original Assignee
풍원정밀(주)
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Priority to CN202180089361.6A priority Critical patent/CN116724683A/zh
Publication of WO2022158687A1 publication Critical patent/WO2022158687A1/fr

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12Organic material
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/16Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present invention relates to a method of manufacturing a fine metal mask for a large area display, and more particularly, to easily manufacture a fine metal mask for manufacturing an 8th generation large area display, a plurality of photomask raw materials or a plurality of materials An extended effective part is manufactured by connecting and using a photomask of Accordingly, it is possible to increase production efficiency in manufacturing a fine metal mask having an effective portion extended in length compared to a fine metal mask for manufacturing a 6.5 generation display, and to utilize the existing exposure equipment for manufacturing a fine metal mask for the 6.5 generation as it is. can
  • a key component for depositing OLED devices on a display panel is a fine metal mask, and it is difficult to keep up with the trend of large-area display panels with the existing 6.5G OLED pixel deposition fine metal mask. is laid Therefore, there is a need to develop a fine metal mask for deposition of 8th generation OLED pixels (hereinafter abbreviated as “8th generation mask”).
  • the fine metal mask is composed of an effective portion, which is an area in which a pattern is formed so that pixels are deposited, and grip portions formed at both ends of the effective portion to perform a mask fixing role in order to seat the fine metal mask on the panel in the process of depositing the pixels.
  • the length of the effective part of the 6.5th generation mask is 1100mm, whereas the length of the effective part of the 8th generation mask is 2200mm.
  • the length of the grip part it is 2600mm, which is a conventional exposure machine that can expose up to a length of 2400mm. There is a problem in that it is difficult to produce a generation mask.
  • the photomask used to manufacture the 8th generation mask is a type of laminating two or more numbers, so the continuity or consistency of alignment between the two photomasks in the process of laminating two pre-processed photomasks, respectively. There is a high possibility that this cannot be ensured, and when continuity or consistency of alignment is not ensured in this way, pixel defects may occur in the process of forming pixels, and the resolution of the display may deteriorate due to the defective pixels. Therefore, the development of a new process technology for manufacturing the 8th generation mask is desired.
  • the present invention has been devised to solve the problems of the prior art, and the present invention aims to manufacture a fine metal mask for manufacturing an 8th generation large-area display having a high degree of alignment by aligning a plurality of photo masks with high accuracy. do it with
  • the present invention employs most of the existing fine metal mask manufacturing methods, thereby increasing the utility of the existing process, performing a connection exposure or introducing a connection cutting process, so that production efficiency and production speed can be improved. to serve a different purpose.
  • the present invention utilizes a conventional exposure machine to perform a continuous exposure process for the effective part and the grip part, or by separately performing the effective part exposure and the grip part cutting process, when manufacturing a fine metal mask for manufacturing an 8th generation large-area display. Another purpose is to solve the need for the development of a new exposure machine and to maximize the utilization of the conventional exposure machine.
  • Another object of the present invention is to configure a simple alignment inspection apparatus to precisely align photo masks on an existing exposure machine in aligning a plurality of photo masks.
  • Another object of the present invention is to manufacture a separate aligner for aligning a plurality of photomasks and to precisely align the plurality of photomasks in a simple manner.
  • the present invention provides a fine metal including an effective portion having a through-hole pattern for depositing an optical element and a grip portion formed at both ends of the effective portion to serve as a support in the deposition process of the optical element.
  • a method of manufacturing a mask comprising: applying a photoresist to a region of a metal panel for manufacturing a fine metal mask; laminating a photomask having a pattern formed thereon on the photoresist-coated metal panel; exposing a central region of the photoresist region on which the photomask is stacked; and shaping a region extending from the central region to both ends by laser processing, wherein the central region is an effective part of the fine metal mask, and the both ends extending region shaped by laser processing is a grip of the fine metal mask It provides a method of manufacturing a fine metal mask for a large area display, characterized in that the denial.
  • the present invention relates to a method of manufacturing a fine metal mask comprising an effective portion having a through-hole pattern for depositing an optical element and a grip portion formed at both ends of the effective portion to serve as a support in the deposition process of the optical element.
  • applying a photoresist to one area of the metal panel for manufacturing a fine metal mask laminating a photomask having a pattern formed thereon on the photoresist-coated metal panel; a first exposure step of exposing a central region or one end region of the photoresist region on which the photomask is stacked; and a second exposure step of exposing a region other than the exposed region after the first exposure step; wherein the central region is an effective part of the fine metal mask, and the one end region is the grip of the fine metal mask It provides a method of manufacturing a fine metal mask for a large area display, characterized in that the denial.
  • the effective portions are formed by continuous exposure in half and connected.
  • the manufacturing of the photomask may include laminating a plurality of photomask raw materials in a longitudinal direction; and floating a pattern on a plurality of laminated photomask raw materials.
  • the manufacturing of the photomask may include: a first step of generating at least one alignment mark on the photomask; a second step of first aligning and mounting the at least two photomasks on which the alignment marks are generated on a photomask mounting frame of an exposure machine; a third step of confirming the positions of the alignment marks between the mounted photomasks; and a fourth step of determining whether the alignment state is complete according to the confirmed position of the alignment mark; and, if the alignment state is not completed, it is preferable to perform the second step after aligning the photomasks again from the third step do.
  • the third step is performed by a photomask alignment system, comprising: an alignment reference unit having at least two alignment reference points formed thereon, the alignment reference points being positioned to overlap the alignment marks; and a photographing device mounted at a position capable of photographing the overlapping state of the alignment reference unit and the alignment mark, wherein at least one of the alignment reference points overlaps the alignment mark formed on the first photomask among the plurality of photomasks, The remainder preferably overlaps the alignment marks formed on the second photomask aligned adjacent to the first photomask.
  • the alignment system may be positioned above or below the photomask and may be configured to be movable.
  • the photographing device is provided as many as the number of the alignment reference points.
  • the manufacturing of the photomask may include: a first step of generating at least one alignment mark on the photomask; a second step of first aligning and mounting the at least two photomasks on which the alignment marks are generated on a photomask mounting frame of a photomask alignment apparatus; a third step of confirming the positions of the alignment marks between the mounted photomasks; and a fourth step of determining whether the alignment state is complete according to the confirmed position of the alignment mark; and, if the alignment state is not completed, it is preferable to perform the second step after aligning the photomasks again from the third step do.
  • the photomask alignment apparatus may include a photomask mounting frame; a photomask adsorption unit formed on an edge of the photomask mounting frame; At least two alignment reference points are formed, the alignment reference point is an alignment reference portion positioned to overlap the alignment mark; and a photographing device mounted at a position capable of photographing the overlapping state of the alignment reference unit and the alignment mark, wherein at least one of the alignment reference points overlaps the alignment mark formed on the first photomask among the plurality of photomasks, The remainder preferably overlaps the alignment marks formed on the second photomask aligned adjacent to the first photomask.
  • the photomask alignment device may include: a photomask lifting bar provided to be liftable under the photomask mounting frame; It is preferable to include a; support glass for supporting the photomasks at the interface when the plurality of photomasks are laminated.
  • the photographing device is provided as many as the number of the alignment reference points.
  • the present invention provides a fine metal mask for a large area display, which is manufactured by the above-described method, and characterized in that the effective part and the grip part are processed continuously or separately to form a single object.
  • the present invention employs most of the existing fine metal mask manufacturing method, thereby increasing the utilization of the existing process, performing connection exposure or introducing a connection cutting process, thereby promoting efficiency in production and improvement of production speed. is expected
  • the present invention utilizes a conventional exposure machine to perform a continuous exposure process for the effective part and the grip part, or by separately performing the effective part exposure and the grip part cutting process, when manufacturing a fine metal mask for manufacturing an 8th generation large-area display. , it is expected to solve the need for the development of a new exposure machine and to maximize the utilization of the conventional exposure machine.
  • the present invention configures a simple alignment inspection apparatus in aligning a plurality of photomasks and utilizes it on an existing exposure machine, so that the effect of allowing the photomasks to be precisely aligned by a convenient and simple method is expected. do.
  • the present invention is expected to have the effect of precisely aligning the plurality of photomasks in a simple way before performing the exposure process.
  • FIG. 1 is a flowchart for explaining a process of continuous exposure of an effective part and a grip part in a manufacturing process of a fine metal mask according to an embodiment of the present invention.
  • FIG. 2 is a flowchart for explaining a process of continuous exposure of an effective part and a grip part in a manufacturing process of a fine metal mask according to another embodiment of the present invention.
  • FIG. 3 is a flowchart illustrating a grip part cutting process after exposure of an effective part in a manufacturing process of a fine metal mask according to an embodiment of the present invention.
  • FIG. 4 is a manufacturing flowchart of a photomask manufactured to have a high degree of alignment by laminating raw materials for a photomask according to an embodiment of the present invention, and performing a floating process.
  • FIG. 5 is a flowchart illustrating a process of laminating two individual photomasks and securing alignment according to an embodiment of the present invention, and shows a case in which an existing exposure machine is used.
  • FIG. 6 is a flowchart illustrating a process of exposing the surface of a fine metal mask by using the port mask lamination and alignment diagram according to FIG. 5 .
  • FIG. 7 is a flowchart illustrating a process of laminating two individual photomasks and securing an alignment degree according to another embodiment of the present invention, and shows a case in which a separate alignment device is used.
  • FIG. 8 shows the alignment device of FIG. 7 from the side, and at the same time shows a process for laminating a photomask and confirming an alignment state.
  • ... unit and “... group” described in the specification mean a unit for processing at least one function or operation.
  • the present invention is to fabricate an 8th generation fine metal mask, and the 8th generation fine metal mask is characterized in that the effective portion is twice as long as that of the existing 6.5 generation fine metal mask.
  • the overall length of the 8th generation fine metal mask is 2600 mm, which is 1100 mm longer than the total length of the 6.5 generation fine metal mask of 1500 mm.
  • the exposure machine for performing the exposure process which is a process for manufacturing a fine metal mask, can expose a target object with a length of up to 2500 mm, one full exposure of the 6.5 generation fine metal mask is possible, but the 8th generation fine metal mask One full exposure of the mask is not possible.
  • FIG. 1 is a flowchart for explaining a process of continuous exposure of an effective part and a grip part in a manufacturing process of a fine metal mask according to an embodiment of the present invention
  • FIG. 2 is a manufacturing process of a fine metal mask according to another embodiment of the present invention It is a flowchart for explaining the continuous exposure process of the effective part and the grip part
  • FIG. 3 is a flowchart for explaining the grip part cutting process after exposure of the effective part in the manufacturing process of the fine metal mask according to an embodiment of the present invention
  • FIG. 4 is a manufacturing flowchart of a photomask manufactured to have a high degree of alignment through laminating photomask raw materials and a floating process according to an embodiment of the present invention
  • FIG. 5 is two individual photos according to an embodiment of the present invention.
  • FIG. 6 is the port mask lamination and alignment according to FIG. It is a flowchart showing a process of exposing
  • FIG. 7 is a flowchart showing a process of laminating two individual photomasks and securing alignment according to another embodiment of the present invention, showing a case in which a separate alignment device is used
  • FIG. 8 shows the alignment device of FIG. 7 from the side, and at the same time shows a process for laminating a photomask and confirming an alignment state.
  • the metal plate 190 eg, Invar
  • the metal plate 190 is exposed while moving in the same direction as the length direction of the mask. showed the process.
  • the fine metal mask 100 is composed of an effective portion 120 and a grip portion 110 integrally formed on both sides of the effective portion 120 , and a processing hole for OLED pixel deposition for the display is formed in the effective portion 120 . do.
  • photoresist is first applied on the metal plate 190, and the applied photoresist is selectively exposed and developed. For this, a photomask is laminated on the photoresist and then exposed.
  • the length of the 8th generation fine metal mask 100 is longer than that of the mounting frame and the usable exposure area of the exposure machine, it is impossible to simultaneously expose the effective portion 120 and the grip portion 110 . Accordingly, in the present invention, continuous exposure or sequential exposure is performed using the effective portion 120 and the grip portion 110 as basic units, thereby overcoming this impossibility.
  • two fine metal masks 100 to be processed are extracted and displayed.
  • the processed fine metal mask 100 may be further displayed on the left side of the left fine metal mask 100 among the two fine metal masks 100 , but for the purpose of excerpt, the display thereof is omitted.
  • the metal plate 190 of the corresponding part was exposed. However, it is more efficient in the production process to simultaneously expose the adjacent grip part 110 on the left side of the grip part 110 .
  • the adjacent grip part 110 is not shown here, it is assumed that exposure for forming the leftmost grip part 110 is performed first for the purpose of description. Thereafter, the adjacent effective portion 120 is exposed, and then the right grip portion 110 is sequentially exposed, or the right grip portion 110 and the left grip portion 110 of the fine metal mask 100 to be processed adjacent to the right grip portion 110 are simultaneously exposed. can do. Thereafter, the effective portion 120 and the right grip portion 110 were sequentially exposed again.
  • Figure 2 is the same as Figure 1 in that it is a process of performing continuous exposure, but the movement path of the photomask is different. It is different in that it performs
  • the exposure area corresponds to the length of the effective part 120 of the fine metal mask 100 to be processed on the left side, when exposing the grip part 110 of the fine metal mask 100 to be processed on the right side, the effective area adjacent thereto
  • the area of the sub 120 is preferably shielded from light.
  • the metal plate 190 material
  • the photomask is moved.
  • the effective part 120 after exposure to the effective part 120 of 1100 mm that matches the effective part 120 of the 6.5 generation fine metal mask 100, the remaining effective part of 1100 mm through a continuous exposure process By performing connection exposure to 120, the effective portion 120 (2200 mm) of the 8th generation fine metal mask 100 can be formed, otherwise, the effective portion 120 of the 8th generation fine metal mask 100 ( 2200 mm) may be formed by exposure at once.
  • FIG. 3 shows a method of performing the exposure process only on the effective portion 120 of the fine metal mask 100 . Since exposing only the effective part 120 is possible with the current exposure machine, the effective part 120 exposure is performed first, and the grip part 110 at both ends is cut using a cutting means such as a laser.
  • a cutting means such as a laser.
  • the cutting means is indicated by the laser generating unit 130, the cutting means is not particularly limited. That is, cutting using a blade, cutting using a water jet, etc. may be mentioned as examples.
  • the cutting means may be determined in consideration of process continuity with the exposure process, equipment owned by the subject performing the process, and the like.
  • FIG. 4 illustrates a manufacturing process of a photomask used for exposing the fine metal mask 100 .
  • the two photomask raw materials 141 are mounted on the mounting plate 140 and lamination is performed at the same time. Accordingly, an interface is formed between the two photomask raw materials 141 .
  • the mounting plate 140 mainly adopts a glass plate. This is because the glass plate is suitable for performing the exposure process because it has heat resistance and is transparent. However, an appropriate material other than the glass plate may be adopted as an alternative material.
  • the floating is for patterning the fine metal mask 100 , and a photomask having a desired shape is manufactured through floating using the floating means 160 . can do.
  • a photomask having an extended length suitable for manufacturing the 8th generation fine metal mask 100 is manufactured.
  • the most preferred method for floating is a laser floating method, but floating by other means is also possible, and as a method other than floating, if a method for forming a pattern is derived, it is also possible to use it.
  • the boundary surface is difficult to secure continuity when floating, and if the boundary surface is also floated, the pattern formed by the corresponding portion may be inconsistent or an error may occur in the shape surface. .
  • the pattern region of the photomask has a length of 2200 mm, and the length coincides with the effective portion 120 of the 8th generation fine metal mask 100 . Accordingly, it is possible to perform an exposure process for manufacturing the 8th generation fine metal mask 100 .
  • the illustrated photomask mounting frame 170 is a region on which a photomask is mounted (mounted), a central portion surrounded by the frame is penetrated, and a transparent mounting plate 172 on which the photomask is mounted is positioned.
  • a slit to which a negative pressure is applied is provided at the edge of the frame, the photomask can be seated on the frame by the negative pressure when the photomask is mounted, thus stably fixing the photomask.
  • the upper slit may be replaced by a single hole, and the interstitial space that can use the sound pressure may have any shape.
  • the photomask mounting frame 170 has a size on which two manufactured unit photomasks can be mounted.
  • the number of photomasks that can be mounted is not limited to two, and more photomasks may be mounted according to the size of the frame or the length of the mask.
  • the photomask mounting frame 170 is a component of a conventional exposure machine, and is used in a process of fixing a single photomask and exposing the metal plate 190 using the fixed photomask. However, a function for laminating and mounting a plurality of photomasks and checking the alignment state between them is not mounted. As described above, when a plurality of photomasks are laminated, the pattern must be closely aligned, so the plurality of photomasks must be precisely aligned, and a means for checking the alignment state must be separately devised.
  • a movable type photomask alignment system 180 is added to the exposure machine, whereby the alignment state of the laminated photomasks can be precisely checked, and the laminated photomask having an alignment state suitable for performing the exposure process. implementation became possible. That is, by further increasing the utilization of the existing exposure machine, the existing exposure machine can be used for manufacturing the 8th generation fine metal mask 100 .
  • the process of manufacturing the photomask may include: a first step of generating at least one alignment mark 145 on the photomask; a second step of first aligning and mounting at least two photomasks on which the alignment marks 145 are generated on a photomask mounting frame 170 of an exposure machine; a third step of confirming the positions of the alignment marks 145 between the mounted photomasks; and a fourth step of determining whether the alignment state is complete according to the confirmed position of the alignment mark 145; if the alignment state is not completed, the photomasks are secondarily aligned and then performed again from the third step will do
  • the alignment marks 145 generated on the photomask are preferably marked outside the region where the pattern is formed. Therefore, it is preferable that the photomask be installed in the area near the vertex of the rectangular photomask as the most comfortable position.
  • the alignment marks 145 may be formed at all four vertices, or at least at both ends of the long side. That is, it is most preferable that the alignment mark 145 is marked at an appropriate position so that the alignment state of the unit photomask and the adjacent unit photomask can be checked.
  • the alignment marks 145 are formed at the same coordinates of an alignment target photomask having the same standard, so that the alignment state can be checked regularly. When the check of the alignment state between the photomasks is completed, the alignment state is confirmed as it is so that it can be connected to the exposure process, which is the next process. Checking the alignment status may be continuously performed until the alignment status is confirmed.
  • the photomask alignment system 180 configured separately from the exposure machine.
  • the alignment reference points 182 are formed, and the alignment reference points 182 include an alignment reference unit 181 positioned to overlap the alignment mark 145; and a photographing device 183 mounted at a position capable of photographing the overlapping state of the alignment reference unit 181 and the alignment mark 145 .
  • at least one of the alignment reference points 182 overlaps the alignment mark 145 formed on the first photomask among the plurality of photomasks, and the rest are aligned on the second photomask aligned adjacent to the first photomask. superimposed on mark 145 .
  • the illustrated shape shows a shape in which one alignment mark 145 is formed in the vertex regions adjacent to each other of the first photomask and the second photomask.
  • the number of alignment marks 145 is not particularly limited as long as the alignment check can be precisely performed as described above.
  • the alignment reference unit 181 may be formed of a transparent material. For example, by making the transparent reference unit semi-transparent, the effect of light reflection during photographing can be reduced. Accordingly, the overlapping state of the alignment reference point 182 and the alignment mark 145 can be confirmed with the naked eye.
  • the alignment mark 145 is formed on the upper surface or the lower surface of the photomask, and the formation surface of the alignment mark 145 is not limited to any one surface.
  • the photomask alignment system 180 may be located above or below the photomask. That is, since the mounting portion on which the photomask is mounted is made of transparent glass, it is possible to check the alignment state even under the photomask.
  • the photomask is preferably mounted at a reference position on the frame, and the alignment system also moves to the reference position on the frame to check the alignment state of the photomask.
  • the alignment state of the photomask can be easily and precisely confirmed and confirmed in a short time.
  • Confirmation of the alignment state is performed by the photographing device, and the alignment state photographed by the photographing apparatus is transmitted to a control unit (not shown) by wired/wireless communication means to determine whether the alignment state is confirmed or not after the control unit confirms the alignment state do. As a result of checking the alignment status, if there is a need for realignment, it is sent back to the alignment system to perform the corresponding process.
  • the photomask alignment system 180 may be configured to be movable without limitation in direction or by limiting direction.
  • the photographing device 183 is preferably provided as many as the number of the alignment reference points 182 , but of course, one movable photographing device 183 may be configured to check the alignment state while moving.
  • FIG. 6 illustrates a process of exposing the metal plate 190 using the photomask after the alignment state of the laminated photomasks is confirmed.
  • the photomask alignment system 180 moves, and a pair of photomasks symmetrical on both sides of the metal plate 190 are moved to come into contact with the metal plate 190 , and then Exposure is performed with respect to both surfaces. Since processes such as exposure and development are known processes, a detailed description thereof will be omitted.
  • FIGS. 7 and 8 show a photomask alignment device 200 in which a photomask mounting frame 170 is configured separately from an exposure machine, and an elevating bar 173, support glass, etc. are provided here, unlike FIGS. 5 and 6 . will be.
  • a method of manufacturing a photomask using the above photomask aligning apparatus 200 is mostly the same as that of FIG. 5 , except that a separate photomask aligning apparatus 200 is used.
  • the photomask alignment apparatus 200 is composed of an alignment reference unit 181 and a photographing device, and is different from the movable photomask alignment system 180 of FIG. 5 . It has an otherwise fixed photomask alignment system 180 and has an independent frame structure including a photomask mounting frame 170 capable of mounting a photomask.
  • the photomask alignment apparatus 200 includes a photomask mounting frame 170 ; a photomask adsorption unit 171 formed on an edge of the photomask mounting frame 170;
  • the alignment reference point 182 is formed at least two, the alignment reference point 182 is an alignment reference portion 181 positioned to overlap the alignment mark 145; and a photographing device 183 mounted at a position capable of photographing the overlapping state of the alignment reference unit 181 and the alignment mark 145, wherein at least one of the alignment reference points 182 is one of a plurality of photomasks. It overlaps the alignment marks 145 formed on the first photomask, and the remainder overlaps the alignment marks 145 formed on the second photomask aligned adjacent to the first photomask.
  • FIG. 5 descriptions related to the photomask mounting frame 170 , the photomask adsorption unit 171 , the alignment reference unit 181 , the photographing device, the alignment reference point 182 , the alignment mark 145 and the like are shown in FIG. 5 in terms of structure and function. Since it is the same as described in the related description, it will be omitted here.
  • the photomask mounting frame 170 and the photomask adsorption unit 171 of the present embodiment are 1) configured independently from those configured in the exposure machine, and 2) including the alignment reference unit 181 and the photographing device 183 .
  • the photomask alignment system 180 is fixed to the frame, 3) a leg portion is formed on the lower portion of the frame, and 4) a photomask lifting bar 173 provided to be lifted at the lower portion of the photomask mounting frame 170 . ; is provided and ascends and descends to the central portion surrounded by the frame, and serves to support the photomask to be seated on the frame.
  • the supporter 220 supports the photomasks on the boundary surface of the photomask, and serves to maintain the alignment state when the photomask is moved; further includes.
  • the material of the support 220 is not limited, but it is preferable to use a glass material.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

La présente invention concerne un masque métallique fin pour un affichage de grande surface et son procédé de fabrication et, plus particulièrement, un procédé de fabrication d'un masque métallique fin qui comprend : une partie efficace dans laquelle un motif de trou traversant pour déposer un élément optique est formé ; et des parties de préhension formées au niveau des deux extrémités de la partie efficace pour servir de support dans le processus de dépôt de l'élément optique. Le procédé de fabrication d'un masque métallique fin pour un affichage de grande surface comprend les étapes consistant à : appliquer une résine photosensible sur une région d'un panneau métallique pour fabriquer un masque métallique fin ; empiler un photomasque ayant un motif, sur le panneau métallique sur lequel la résine photosensible est appliquée ; exposer une région centrale de la région de résine photosensible sur laquelle le photomasque est empilé ; et des régions de mise en forme s'étendant de la région centrale aux deux extrémités par traitement laser, la région centrale étant la partie efficace du masque métallique fin, et les régions s'étendant vers les deux extrémités, formées par traitement laser, étant les parties de préhension du masque métallique fin.
PCT/KR2021/016072 2021-01-21 2021-11-05 Masque métallique fin pour affichage de grande surface et son procédé de fabrication WO2022158687A1 (fr)

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CN202180089361.6A CN116724683A (zh) 2021-01-21 2021-11-05 大面积显示器用精细金属掩模及其制造方法

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KR1020210008807A KR102289722B1 (ko) 2021-01-21 2021-01-21 대면적 디스플레이용 미세 금속 마스크 및 그의 제조방법
KR10-2021-0008807 2021-01-21

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KR102289722B1 (ko) * 2021-01-21 2021-08-17 풍원정밀(주) 대면적 디스플레이용 미세 금속 마스크 및 그의 제조방법

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KR20180032718A (ko) * 2016-09-22 2018-04-02 삼성디스플레이 주식회사 분할 마스크의 제조 방법
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KR20110068174A (ko) * 2009-12-15 2011-06-22 삼성모바일디스플레이주식회사 박막 증착용 마스크 프레임 조립체 및 유기 발광 디스플레이 장치
JP2012030238A (ja) * 2010-07-29 2012-02-16 Fuji Electric Co Ltd レーザ加工方法及びレーザ加工装置
KR20130124861A (ko) * 2012-05-07 2013-11-15 삼성전자주식회사 패턴 형성 방법
KR20150120543A (ko) * 2014-04-17 2015-10-28 주식회사 웨이브일렉트로닉스 미세 패턴을 포함하는 포토마스크를 이용한 유기발광디스플레이용 새도우 마스크의 제조 방법,그 새도우 마스크 및 이를 이용한 유기발광디스플레이의 제조 방법
KR20180032718A (ko) * 2016-09-22 2018-04-02 삼성디스플레이 주식회사 분할 마스크의 제조 방법
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