WO2022153877A1 - Feuille de manipulation de pièce, procédé de manipulation de petite pièce, procédé de fabrication de dispositif et utilisation d'une feuille de manipulation de pièce - Google Patents

Feuille de manipulation de pièce, procédé de manipulation de petite pièce, procédé de fabrication de dispositif et utilisation d'une feuille de manipulation de pièce Download PDF

Info

Publication number
WO2022153877A1
WO2022153877A1 PCT/JP2021/048936 JP2021048936W WO2022153877A1 WO 2022153877 A1 WO2022153877 A1 WO 2022153877A1 JP 2021048936 W JP2021048936 W JP 2021048936W WO 2022153877 A1 WO2022153877 A1 WO 2022153877A1
Authority
WO
WIPO (PCT)
Prior art keywords
work
interfacial
ablation
ablation layer
interface
Prior art date
Application number
PCT/JP2021/048936
Other languages
English (en)
Japanese (ja)
Inventor
喜章 古川
健太 古野
彰朗 福元
洋司 若山
征太郎 山口
Original Assignee
リンテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2021/045507 external-priority patent/WO2022153745A1/fr
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to JP2022575524A priority Critical patent/JPWO2022153877A1/ja
Priority to KR1020237005271A priority patent/KR20230132433A/ko
Priority to CN202180063657.0A priority patent/CN116234693A/zh
Publication of WO2022153877A1 publication Critical patent/WO2022153877A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

Definitions

  • the present invention relates to a work handling sheet that can be used for handling workpiece small pieces such as semiconductor parts and semiconductor devices, a method for handling small workpiece pieces and a device manufacturing method using the work handling sheet, and the use of the work handling sheet.
  • a work handling sheet that can be used to handle small pieces of work such as micro light emitting diodes, power devices, and MEMS (Micro Electro Mechanical Systems).
  • each pixel is composed of micro light emitting diodes, and the light emission of each micro light emitting diode is controlled independently.
  • a micro light emitting diode arranged on a supply substrate such as sapphire or glass on a wiring board provided with wiring.
  • the use of laser light irradiation is being considered.
  • the layer is irradiated with laser light to cause ablation of the layer at the irradiated position, thereby supporting the layer.
  • a method of mounting a micro light emitting diode separated from the body (laser lift-off) on a wiring substrate has been studied (Patent Document 1). Since the laser beam is excellent in directivity and convergence, it is easy to control the irradiation position, and selective placement can be performed satisfactorily.
  • the present invention has been made in view of such an actual situation, and an object of the present invention is to provide a work handling sheet capable of satisfactorily handling even fine work pieces.
  • the present invention comprises a base material and an interfacial ablation layer laminated on one side of the base material, capable of holding small workpieces, and interfacially ablated by irradiation with laser light.
  • a work handling sheet comprising the above, which is subjected to the first ultraviolet irradiation by irradiating ultraviolet rays having a wavelength of 365 nm with a light amount of 190 mJ / cm 2 , and further irradiating the work handling sheet with ultraviolet rays having a wavelength of 365 nm with a light amount of 950 mJ / cm 2 .
  • the conversion efficiency when the interfacial ablation layer converts the light energy of the ultraviolet rays in the second ultraviolet irradiation into heat energy is 60% or more. (Invention 1).
  • the interfacial ablation layer exhibits the above-mentioned conversion efficiency, so that the interfacial ablation is effectively performed when irradiated with laser light, whereby the work pieces are directed toward the object. It can be separated well.
  • the interface ablation layer is preferably a pressure-sensitive adhesive layer composed of an active energy ray-curable pressure-sensitive adhesive or a non-active energy ray-curable pressure-sensitive adhesive (Invention 2).
  • the interface ablation layer preferably contains at least one additive of an ultraviolet absorber and a photopolymerization initiator (Invention 3).
  • the laser light has a wavelength in the ultraviolet region (Invention 4).
  • the interfacial ablation layer is cured entirely or locally by irradiation with active energy rays, and interfacial ablation is locally generated in the interfacial ablation layer by irradiation with the laser beam.
  • the present invention comprises a preparatory step of preparing a laminate in which a plurality of work pieces are held on the surface of the work handling sheet (inventions 1 to 6) on the interface ablation layer side, and the work pieces.
  • the work piece existing at the position where the interfacial ablation occurs is made into the work.
  • a method for handling small work pieces which comprises a separation step of separating the small pieces of work from the handling sheet and placing the small pieces of work on the object (Invention 7).
  • the present invention comprises a preparatory step of preparing a laminate in which a plurality of work pieces are held on the surface of the work handling sheet (inventions 1 to 6) on the interface ablation layer side, and the work pieces.
  • the work piece existing at the position where the interfacial ablation occurs is made into the work.
  • the present invention provides a device manufacturing method comprising a separation step of separating from a handling sheet and placing the work piece on the object (Invention 8).
  • the present invention provides the use of the work handling sheet (Invention 1 to 6) for handling small pieces of work (Invention 9).
  • the work handling sheet according to the present invention can handle even fine work pieces satisfactorily.
  • FIG. 1 shows a cross-sectional view of a work handling sheet according to an embodiment.
  • the work handling sheet 1 shown in FIG. 1 includes a base material 12 and an interface ablation layer 11 laminated on one side of the base material 12.
  • the interface ablation layer 11 can hold a small piece of work. That is, the work handling sheet 1 according to the present embodiment can hold the work pieces laminated on the surface of the interface ablation layer 11 opposite to the base material 12 in that state.
  • the interface ablation layer 11 holds the work piece by exhibiting adhesiveness to the work piece.
  • the interface ablation layer 11 preferably contains a pressure-sensitive adhesive as one of the components constituting the interface ablation layer 11, that is, a pressure-sensitive adhesive layer.
  • the interfacial ablation layer 11 in the present embodiment is interfacial ablated by irradiation with laser light. That is, the interface ablation layer 11 locally ablates the interface in the region irradiated with the laser beam.
  • the laser light is not particularly limited as long as it can cause interfacial ablation, and may be a laser light having any wavelength in the ultraviolet region, the visible light region, and the infrared region, and among them, the ultraviolet region. A laser beam having a wavelength of is preferable.
  • the interfacial ablation means that a part of the components constituting the interfacial ablation layer 11 is evaporated or volatilized by the energy of the laser beam, and the gas generated thereby is the interface between the interfacial ablation layer 11 and the base material 12. It means that a gap (blister) is generated by accumulating in. In this case, the shape of the interface ablation layer 11 is changed by the blister, the work pieces are peeled off from the interface ablation layer 11, and the work pieces are separated.
  • the ultraviolet rays having a wavelength of 365 nm are further emitted to 950 mJ / cm / cm with respect to the work handling sheet 1 to which the first ultraviolet rays are irradiated to irradiate the ultraviolet rays having a wavelength of 365 nm at a light amount of 190 mJ / cm 2 .
  • the conversion efficiency when the interfacial ablation layer 11 converts the ultraviolet light energy in the second ultraviolet irradiation into heat energy is 60% or more. be.
  • the work handling sheet 1 by satisfying the above conversion efficiency, interfacial ablation is efficiently generated, and the held work pieces can be satisfactorily separated from the interfacial ablation layer 11.
  • the amount of laser light irradiation required to cause sufficient separation of the work pieces can be reduced, the operating cost of the laser light irradiation device can be reduced, and only the target work pieces can be easily separated satisfactorily.
  • the accuracy is improved, and it is possible to prevent damage to the device, work pieces, etc. due to excessive laser light irradiation.
  • Interface ablation layer The specific configuration and composition of the interface ablation layer 11 in the present embodiment are not particularly limited as long as they can hold small pieces of work and satisfy the above-mentioned conversion efficiency.
  • the interface ablation layer 11 is preferably an adhesive layer, and in particular, the interface ablation layer 11 is an adhesive having active energy ray curability (active energy ray curable adhesive) or active energy ray curable. It is preferable that the pressure-sensitive adhesive layer is composed of a pressure-sensitive adhesive (non-active energy ray-curable pressure-sensitive adhesive).
  • the interface ablation 11 preferably contains at least one additive of an ultraviolet absorber and a photopolymerization initiator from the viewpoint of easily satisfying the above-mentioned conversion efficiency.
  • the interface ablation layer 11 is an adhesive layer composed of an active energy ray curable adhesive
  • the work handling sheet 1 according to the present embodiment can be subjected to irradiation with active energy rays. Adhesion with small pieces of work can be reduced. Therefore, before the above-mentioned interface ablation is generated, or at the same time as the above-mentioned interface ablation, the adhesion is lowered by irradiation with active energy rays to separate the work pieces from the work handling sheet 1 according to the present embodiment. It will be possible to do it reliably. Further, it is possible to further reduce the irradiation amount of the laser beam required to cause sufficient separation of the work pieces.
  • the adhesion to the work pieces is lowered by the irradiation with the active energy rays, it is possible to set the adhesion before the irradiation with the active energy rays to be higher.
  • the work piece is transferred from another sheet or the like to the work handling sheet 1 according to the present embodiment, it is possible to prevent the work piece from remaining on the other sheet or the like and perform good transfer. It will be possible.
  • the active energy ray-curable adhesive may be any of acrylic adhesive, rubber adhesive, silicone adhesive, urethane adhesive, polyester adhesive, polyvinyl ether adhesive and the like. Although it is good, it is preferably an acrylic pressure-sensitive adhesive from the viewpoint that it easily exerts a desired adhesive strength.
  • the active energy ray-curable pressure-sensitive adhesive may be mainly composed of a polymer having active energy ray curability, or an active energy ray non-curable polymer (a polymer having no active energy ray curable property).
  • the main component may be a mixture of a monomer having at least one active energy ray-curable group and / or an oligomer. Further, it may be a mixture of an active energy ray-curable polymer and an active energy ray-non-curable polymer, or has an active energy ray-curable polymer and at least one active energy ray-curable group. It may be a mixture of a monomer and / or an oligomer, or a mixture of three of them.
  • the active energy ray-curable adhesive contains a polymer having active energy ray curability as a main component will be described below.
  • the polymer having active energy ray curability is a (meth) acrylic acid ester (co) polymer (A) in which a functional group having energy ray curability (active energy ray curable group) is introduced into a side chain (hereinafter, "" It may be referred to as “active energy ray-curable polymer (A)").
  • This active energy ray-curable polymer (A) is composed of an acrylic copolymer (a1) having a functional group-containing monomer unit and an unsaturated group-containing compound (a2) having a functional group bonded to the functional group. It is preferably obtained by reaction.
  • (meth) acrylic acid ester means both acrylic acid ester and methacrylic acid ester. The same applies to other similar terms.
  • the acrylic copolymer (a1) preferably contains a structural unit derived from a functional group-containing monomer and a structural unit derived from a (meth) acrylic acid ester monomer or a derivative thereof.
  • the functional group-containing monomer as a constituent unit of the acrylic copolymer (a1) has a polymerizable double bond and a functional group such as a hydroxy group, a carboxy group, an amino group, a substituted amino group, and an epoxy group in the molecule. It is preferable that the monomer is contained in.
  • hydroxy group-containing monomer examples include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, and 3-hydroxybutyl ( Examples thereof include meta) acrylate and 4-hydroxybutyl (meth) acrylate, which are used alone or in combination of two or more.
  • carboxy group-containing monomer examples include ethylenically unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, and citraconic acid. These may be used alone or in combination of two or more.
  • carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, and citraconic acid. These may be used alone or in combination of two or more.
  • amino group-containing monomer or the substituted amino group-containing monomer examples include aminoethyl (meth) acrylate and n-butylaminoethyl (meth) acrylate. These may be used alone or in combination of two or more.
  • the (meth) acrylic acid ester monomer constituting the acrylic copolymer (a1) includes an alkyl (meth) acrylate having an alkyl group having 1 to 20 carbon atoms, for example, an alicyclic structure in the molecule.
  • a monomer having an alicyclic structure (monomer containing an alicyclic structure) is preferably used.
  • an alkyl (meth) acrylate having an alkyl group having 1 to 18 carbon atoms for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl ( Meta) acrylate, 2-ethylhexyl (meth) acrylate and the like are preferably used. These may be used individually by 1 type, and may be used in combination of 2 or more type.
  • Examples of the alicyclic structure-containing monomer include cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, adamantyl (meth) acrylate, isobornyl (meth) acrylate, and dicyclopentenyl (meth) acrylate.
  • (Meta) dicyclopentenyloxyethyl acrylate and the like are preferably used. These may be used individually by 1 type, and may be used in combination of 2 or more type.
  • the acrylic copolymer (a1) contains the structural unit derived from the functional group-containing monomer in a proportion of preferably 1% by mass or more, particularly preferably 5% by mass or more, and further preferably 10% by mass or more. Further, the acrylic copolymer (a1) contains a structural unit derived from the functional group-containing monomer in a proportion of preferably 35% by mass or less, particularly preferably 30% by mass or less, still more preferably 25% by mass or less. do.
  • the acrylic copolymer (a1) contains a constituent unit derived from the (meth) acrylic acid ester monomer or a derivative thereof, preferably 50% by mass or more, particularly preferably 60% by mass or more, still more preferably 70% by mass. It is contained in the above ratio. Further, the acrylic copolymer (a1) contains a structural unit derived from the (meth) acrylic acid ester monomer or a derivative thereof, preferably 99% by mass or less, particularly preferably 95% by mass or less, and further preferably 90% by mass. It is contained in the following proportions.
  • the acrylic copolymer (a1) can be obtained by copolymerizing a functional group-containing monomer as described above with a (meth) acrylic acid ester monomer or a derivative thereof by a conventional method, but in addition to these monomers, Dimethylacrylamide, vinyl formate, vinyl acetate, styrene and the like may be copolymerized.
  • an active energy ray-curable polymer (a2) is obtained.
  • the functional group of the unsaturated group-containing compound (a2) can be appropriately selected depending on the type of functional group of the functional group-containing monomer unit of the acrylic copolymer (a1).
  • the functional group of the acrylic copolymer (a1) is a hydroxy group, an amino group or a substituted amino group
  • the functional group of the unsaturated group-containing compound (a2) is preferably an isocyanate group or an epoxy group, and acrylic.
  • the functional group of the system copolymer (a1) is an epoxy group
  • the functional group of the unsaturated group-containing compound (a2) is preferably an amino group, a carboxy group or an aziridinyl group.
  • the unsaturated group-containing compound (a2) contains at least one, preferably 1 to 6, and more preferably 1 to 4 energy ray-polymerizable carbon-carbon double bonds in one molecule. ing.
  • Specific examples of such an unsaturated group-containing compound (a2) include 2-methacryloyloxyethyl isocyanate, meta-isopropenyl- ⁇ , ⁇ -dimethylbenzyl isocyanate, methacryloyl isocyanate, allyl isocyanate, and 1,1-(.
  • Bisacryloyloxymethyl) ethyl isocyanate Acryloyl monoisocyanate compound obtained by reacting a diisocyanate compound or a polyisocyanate compound with a hydroxyethyl (meth) acrylate; a diisocyanate compound or a polyisocyanate compound, a polyol compound, and a hydroxyethyl (meth) Acryloyl monoisocyanate compound obtained by reaction with acrylate; glycidyl (meth) acrylate; (meth) acrylic acid, 2- (1-aziridinyl) ethyl (meth) acrylate, 2-vinyl-2-oxazoline, 2-isopropenyl- 2-Oxazoline and the like can be mentioned.
  • the unsaturated group-containing compound (a2) is preferably 50 mol% or more, particularly preferably 60 mol% or more, still more preferably 70 mol% or more, based on the number of moles of the functional group-containing monomer of the acrylic copolymer (a1). Used at a rate of% or more.
  • the unsaturated group-containing compound (a2) is preferably 95 mol% or less, particularly preferably 93 mol% or less, still more preferably 93 mol% or less, based on the number of moles of the functional group-containing monomer of the acrylic copolymer (a1). It is used in a proportion of 90 mol% or less.
  • the functional group of the acrylic copolymer (a1) and the functional group of the unsaturated group-containing compound (a2) are used.
  • the reaction temperature, pressure, solvent, time, presence / absence of catalyst, and type of catalyst can be appropriately selected.
  • the functional group present in the acrylic copolymer (a1) reacts with the functional group in the unsaturated group-containing compound (a2), and the unsaturated group is contained in the acrylic copolymer (a1). It is introduced into the side chain to obtain an active energy ray-curable polymer (A).
  • the weight average molecular weight (Mw) of the active energy ray-curable polymer (A) thus obtained is preferably 10,000 or more, particularly preferably 100,000 or more, and further preferably 150,000 or more. It is preferable to have it.
  • the weight average molecular weight (Mw) is preferably 1.5 million or less, particularly preferably 1.25 million or less, and further preferably 1 million or less.
  • the weight average molecular weight (Mw) in the present specification is a standard polystyrene-equivalent value measured by a gel permeation chromatography method (GPC method).
  • the active energy ray-curable pressure-sensitive adhesive contains a polymer having active energy ray-curable property such as the active energy ray-curable polymer (A) as a main component
  • the active energy ray-curable pressure-sensitive adhesive is an energy ray. It may further contain a curable monomer and / or oligomer (B).
  • active energy ray-curable monomer and / or oligomer (B) for example, an ester of a polyhydric alcohol and (meth) acrylic acid can be used.
  • Examples of the active energy ray-curable monomer and / or oligomer (B) include monofunctional acrylic acid esters such as cyclohexyl (meth) acrylate and isobornyl (meth) acrylate, trimethyl propantri (meth) acrylate, and the like.
  • the active energy ray-curable monomer and / or the oligomer (B) When the active energy ray-curable monomer and / or the oligomer (B) is blended with the active energy ray-curable polymer (A), the active energy ray-curable monomer and / or the active energy ray-curable monomer in the active energy ray-curable pressure-sensitive adhesive.
  • the content of the oligomer (B) is preferably more than 0 parts by mass, particularly preferably 60 parts by mass or more, with respect to 100 parts by mass of the active energy ray-curable polymer (A).
  • the content is preferably 250 parts by mass or less, and particularly preferably 200 parts by mass or less, with respect to 100 parts by mass of the active energy ray-curable polymer (A).
  • the active energy ray-curable pressure-sensitive adhesive contains a mixture of an active energy ray-curable polymer component and a monomer and / or an oligomer having at least one active energy ray-curable group as a main component. This will be described below.
  • the active energy ray non-curable polymer component for example, the same component as the acrylic copolymer (a1) described above can be used.
  • the same one as the above-mentioned component (B) can be selected.
  • the blending ratio of the active energy ray non-curable polymer component to the monomer and / or oligomer having at least one active energy ray curable group is at least 1 with respect to 100 parts by mass of the active energy ray non-curable polymer component. It is preferably 1 part by mass or more of the monomer and / or oligomer having two or more active energy ray-curable groups, and particularly preferably 60 parts by mass or more.
  • the compounding ratio is preferably 200 parts by mass or less of a monomer and / or an oligomer having at least one active energy ray-curable group with respect to 100 parts by mass of the active energy ray non-curable polymer component. In particular, it is preferably 160 parts by mass or less.
  • the pressure-sensitive adhesive is also an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, Any adhesive such as a silicone adhesive, a urethane adhesive, a polyester adhesive, or a polyvinyl ether adhesive may be used, but from the viewpoint of easily exhibiting the desired adhesive force, an acrylic adhesive. Is preferable.
  • an acrylic pressure-sensitive adhesive as a non-active energy ray-curable pressure-sensitive adhesive is a pressure-sensitive adhesive containing the above-mentioned active energy ray-non-curable polymer component.
  • the active energy ray non-curable polymer component the same component as the acrylic copolymer (a1) described above can be used.
  • the non-active energy ray-curable pressure-sensitive adhesive does not contain the above-mentioned polymer having active energy ray-curable property and the above-mentioned monomer and / or oligomer having at least one active energy ray-curable group. be.
  • the interface ablation 11 in the present embodiment preferably contains at least one additive of an ultraviolet absorber and a photopolymerization initiator from the viewpoint of easily satisfying the above-mentioned conversion efficiency. ..
  • UV absorber in the present embodiment is not particularly limited.
  • the ultraviolet absorber in the present embodiment may be an organic compound or an inorganic compound, but is preferably an organic compound from the viewpoint of easily causing good interfacial ablation.
  • UV absorber When the UV absorber is an organic compound, preferred examples of the UV absorber are hydroxyphenyltriazine-based UV absorbers, benzophenone-based UV absorbers, benzotriazole-based UV absorbers, benzoate-based UV absorbers, and benzooxadinone.
  • hydroxyphenyltriazine-based UV absorbers and benzophenone-based UV absorbers have good absorbency at the third harmonic of YAG (355 nm) and are likely to cause good interfacial ablation. It is preferable to use at least one of an ultraviolet absorber and a benzotriazole-based ultraviolet absorber, and it is particularly preferable to use a hydroxyphenyltriazine-based ultraviolet absorber.
  • hydroxyphenyltriazine-based ultraviolet absorber examples include 2- [4- (octyl-2-methylethanoate) oxy-2-hydroxyphenyl] -4,6- [bis (2,4-dimethylphenyl)] -1.
  • the ultraviolet absorber is an organic compound
  • the ultraviolet absorber is preferably a compound having one or more heterocycles as a characteristic of its chemical structure.
  • the number of heterocycles is preferably 4 or less, and particularly preferably 1.
  • the ultraviolet absorber in the present embodiment has at least one carbon ring and a heterocycle, and all the carbon rings and the heterocycle contained in the ultraviolet absorber are monocyclic rings, respectively. Is also preferable.
  • the ultraviolet absorber in the present embodiment is a compound having a plurality of aromatic rings.
  • the number of aromatic rings is preferably two or more.
  • the number of aromatic rings is preferably 6 or less, and particularly preferably 3 or less.
  • each heterocycle preferably has at least one selected from nitrogen, oxygen, phosphorus, sulfur, silicon and selenium as an element other than carbon constituting them, particularly. , Nitrogen, oxygen, phosphorus and sulfur, preferably having at least one selected from.
  • the number of atoms constituting the ring structure of the heterocycle is not particularly limited, and is, for example, 3 or more and 9 or less, and particularly preferably 5 or more and 6 or less.
  • Specific examples of the preferred heterocycle include triazine, benzotriazole, thiophene, pyrrole, imidazole, pyridine, pyrazine and the like.
  • aromatic ring examples include benzene, naphthalene, anthracene, biphenyl, triphenyl and the like.
  • UV absorbers having the above-mentioned chemical structural characteristics include tris [2,4,6- [2- ⁇ 4- (octyl-2-methylethanoate) oxy-2-hydroxyphenyl ⁇ ]] -1. , 3,5-Triazine).
  • the content of the ultraviolet absorber in the interface ablation layer 11 is preferably 1% by mass or more, and particularly preferably 3% by mass or more. It is preferable, and more preferably 5% by mass or more.
  • the content of the ultraviolet absorber is 1% by mass or more, the interfacial ablation layer 11 efficiently absorbs the laser beam, thereby facilitating good interfacial ablation.
  • the content of the ultraviolet absorber in the interface ablation layer 11 is preferably 75% by mass or less, particularly preferably 40% by mass or less, and further preferably 25% by mass or less. When the content of the ultraviolet absorber is 75% by mass or less, the viscosity of the material for forming the interface ablation layer 11 becomes appropriate, and it becomes easy to secure good film-forming property.
  • the ultraviolet absorber may be blended in this adhesive composition.
  • the blending amount of the ultraviolet absorber in the adhesive composition is preferably 1% by mass or more, particularly preferably 3% by mass or more, and further preferably 5% by mass or more. ..
  • the interfacial ablation layer 11 efficiently absorbs the laser light, thereby facilitating good interfacial ablation.
  • the blending amount of the ultraviolet absorber in the adhesive composition is preferably 75% by mass or less, particularly preferably 40% by mass or less, and further preferably 20% by mass or less. When the blending amount of the ultraviolet absorber is 75% by mass or less, the obtained adhesive can easily exhibit the desired adhesive force.
  • the photopolymerization initiator in the present embodiment is not particularly limited.
  • the interface ablation layer 11 is a pressure-sensitive adhesive layer composed of an active energy ray-curable pressure-sensitive adhesive
  • the interface ablation layer 11 preferably contains a photopolymerization initiator. In this case, efficient interfacial ablation is likely to occur, and the interfacial ablation layer 11 is efficiently cured.
  • photopolymerization initiator examples include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin-n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylaminoacetophenone, 2,2-dimethoxy-1, 2-Diphenylethane-1-one, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexylphenylketone, 2-methyl-1- [4- (Methylthio) Phenyl] -2-morpholino-propan-1-one, 4- (2-hydroxyethoxy) phenyl-2- (hydroxy-2-propyl) ketone, 2-dimethylamino-2- (4-) Methylbenzyl) -1- (4-morpholino-phenyl) butane-1-one, 1- [4- (2-hydroxyhydroxy)
  • the content of the photopolymerization initiator in the interface ablation layer 11 is preferably 1% by mass or more, particularly 3% by mass or more. It is preferable, and more preferably 5% by mass or more.
  • the content of the photopolymerization initiator is 1% by mass or more, the interfacial ablation layer 11 efficiently absorbs the laser light, thereby facilitating good interfacial ablation.
  • the content of the photopolymerization initiator in the interface ablation layer 11 is preferably 75% by mass or less, particularly preferably 40% by mass or less, and further preferably 25% by mass or less. When the content of the photopolymerization initiator is 75% by mass or less, the viscosity of the material for forming the interface ablation layer 11 becomes appropriate, and it becomes easy to secure good film-forming property.
  • the photopolymerization initiator may be blended in this adhesive composition.
  • the blending amount of the photopolymerization initiator in the adhesive composition is preferably 1% by mass or more, particularly preferably 3% by mass or more, and further preferably 5% by mass or more. preferable.
  • the blending amount of the photopolymerization initiator is 1% by mass or more, the interfacial ablation layer 11 efficiently absorbs the laser light, thereby facilitating good interfacial ablation.
  • the blending amount of the photopolymerization initiator in the adhesive composition is preferably 75% by mass or less, particularly preferably 40% by mass or less, and further preferably 25% by mass or less. .. When the blending amount of the photopolymerization initiator is 75% by mass or less, the obtained pressure-sensitive adhesive can easily exert a desired pressure-sensitive adhesive force.
  • Other components may be appropriately added to the pressure-sensitive adhesive constituting the interface ablation layer 11 according to the present embodiment.
  • examples of other components include a cross-linking agent, an active energy ray non-curable polymer component, an oligomer component, and the like.
  • a cross-linking agent is preferable from the viewpoint that the storage elastic modulus of the interface ablation layer 11 can be easily adjusted to a desired range.
  • a polyfunctional compound having reactivity with the functional group of the active energy ray-curable polymer (A) or the acrylic copolymer (a1) can be used.
  • examples of such polyfunctional compounds include isocyanate compounds, epoxy compounds, amine compounds, melamine compounds, aziridine compounds, hydrazine compounds, aldehyde compounds, oxazoline compounds, metal alkoxide compounds, metal chelate compounds, metal salts, ammonium salts, etc. Reactive phenolic resin and the like can be mentioned.
  • the blending amount of the cross-linking agent is preferably 0.001 part by mass or more, particularly preferably 0.1 part by mass or more, and further 0.2 part by mass or more with respect to 100 parts by mass of the main agent. Is preferable.
  • the amount of the cross-linking agent to be blended is preferably 20 parts by mass or less, particularly preferably 10 parts by mass or less, and further preferably 5 parts by mass or less with respect to 100 parts by mass of the main agent.
  • the "main agent” refers to the above-mentioned active energy ray-curable polymer (A) when the interface ablation layer 11 is composed of an active energy ray-curable pressure-sensitive adhesive, and the interface ablation layer 11 has non-active energy. When composed of a linear curable pressure-sensitive adhesive, it refers to the acrylic copolymer (a1) described above.
  • Examples of the above-mentioned active energy ray non-curable polymer component or oligomer component include polyacrylic acid esters, polyesters, polyurethanes, polycarbonates, polyolefins and the like, and polymers or oligomers having a weight average molecular weight (Mw) of 30 to 2.5 million. Is preferable. By blending the component, adhesiveness, peelability, adhesiveness with other layers, storage stability and the like can be improved.
  • the thickness of the interface ablation layer 11 in the present embodiment is preferably 3 ⁇ m or more, particularly preferably 20 ⁇ m or more, and further preferably 25 ⁇ m or more.
  • the thickness of the interface ablation layer 11 is preferably 100 ⁇ m or less, particularly preferably 50 ⁇ m or less, and further preferably 40 ⁇ m or less. When the thickness of the interface ablation layer 11 is within the above range, it becomes easy to achieve both the holding of the work pieces on the interface ablation layer 11 and the separation of the work pieces by the interface ablation.
  • Base material 12 in the present embodiment is not particularly limited in composition and physical properties. From the viewpoint that the work handling sheet 1 easily exerts a desired function, the base material 12 is preferably made of a resin.
  • the base material 12 is composed of a resin
  • examples of the resin include polyester resins such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; both polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, and ethylene-norbornene.
  • Polyethylene-based resins such as polymers and norbornene resins; ethylene-vinyl acetate copolymers; ethylene- (meth) acrylic acid copolymers, ethylene- (meth) methyl acrylate copolymers, and other ethylene- (meth) acrylics.
  • Ethylene copolymer resin such as acid ester copolymer; polyvinyl chloride resin such as polyvinyl chloride and vinyl chloride copolymer; (meth) acrylic acid ester copolymer; polyurethane; polyimide; polystyrene; polycarbonate; fluororesin And so on.
  • the resin constituting the base material 12 may be a crosslinked resin of the above-mentioned resin or a modified resin such as the ionomer of the above-mentioned resin.
  • the base material 12 may be a single-layer film made of the above-mentioned resin, or may be a laminated film in which a plurality of the films are laminated. In this laminated film, the materials constituting each layer may be the same type or different types.
  • the surface of the base material 12 in the present embodiment may be surface-treated by an oxidation method, an unevenness method, or a primer treatment for the purpose of improving the adhesion to the interface ablation layer 11.
  • an oxidation method include corona discharge treatment, plasma discharge treatment, chromium oxidation treatment (wet), flame treatment, hot air treatment, ozone, and ultraviolet irradiation treatment
  • examples of the unevenness method include sandblasting and sandblasting. Examples include a thermal spraying method.
  • the base material 12 in the present embodiment may contain various additives such as a colorant, a flame retardant, a plasticizer, an antistatic agent, a lubricant, and a filler. Further, when the interface ablation layer 11 contains a material that is cured by the active energy rays, it is preferable that the base material 12 has transparency to the active energy rays.
  • the method for producing the base material 12 in the present embodiment is not particularly limited as long as the base material 12 is produced from the resin.
  • it can be produced by molding a resin into a sheet by a melt extrusion method such as a T-die method or a round die method; a calendar method; a solution method such as a dry method or a wet method.
  • the thickness of the base material 12 in the present embodiment is preferably 10 ⁇ m or more, particularly preferably 30 ⁇ m or more, and further preferably 50 ⁇ m or more.
  • the thickness of the base material 12 is preferably 500 ⁇ m or less, more preferably 300 ⁇ m or less, particularly preferably 200 ⁇ m or less, further preferably 150 ⁇ m or less, and preferably 100 ⁇ m or less. Is most preferable.
  • the work handling sheet 1 has rigidity and flexibility in a predetermined balance, and it becomes easy to perform good handling of the work small pieces.
  • the configuration of the release sheet is arbitrary, and an example is one in which a plastic film is peeled off with a release agent or the like.
  • the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate and polyethylene naphthalate, and polyolefin films such as polypropylene and polyethylene.
  • the release agent a silicone type, a fluorine type, a long chain alkyl type or the like can be used, and among these, a silicone type which can obtain stable performance at a low cost is preferable.
  • the thickness of the release sheet is not particularly limited, and may be, for example, 20 ⁇ m or more and 250 ⁇ m or less.
  • the adhesive layer may be laminated on the surface of the interface ablation layer 11 opposite to the base material 12.
  • a work piece is attached to the surface of the adhesive layer opposite to the interface ablation layer 11, and the adhesive layer is diced together with the work piece to laminate a piece of work in which individualized adhesive layers are laminated. Can be obtained.
  • the chip is easily fixed to the object on which the work piece is mounted by the individualized adhesive layer.
  • a material containing a thermoplastic resin and a low molecular weight thermosetting adhesive component, a material containing a B stage (semi-curable) thermosetting adhesive component, and the like are used. It is preferable to use it.
  • the protective film forming layer may be laminated on the surface of the interface ablation layer 11 opposite to the base material 12.
  • a work is attached to the surface of the protective film forming layer opposite to the interface ablation layer 11, and the protective film forming layer is diced together with the work to obtain an individualized protective film forming layer. Stacked work pieces can be obtained.
  • a protective film forming layer is usually laminated on a surface opposite to the surface on which the circuit is formed.
  • the work handling sheet 1 is subjected to the first ultraviolet irradiation in which ultraviolet rays having a wavelength of 365 nm are irradiated with a light amount of 190 mJ / cm 2 .
  • the second ultraviolet irradiation is further performed by irradiating the ultraviolet rays having a wavelength of 365 nm with a light amount of 950 mJ / cm 2
  • the interfacial ablation layer 11 uses the optical energy of the ultraviolet rays in the second ultraviolet irradiation as thermal energy.
  • the conversion efficiency at the time of conversion (hereinafter, may be referred to as "conversion efficiency after ultraviolet irradiation") is 60% or more.
  • conversion efficiency after ultraviolet irradiation is 60% or more.
  • the conversion efficiency is preferably 65% or more, and particularly preferably 75% or more.
  • the upper limit of the conversion efficiency is not particularly limited, and may be, for example, 99% or less, particularly 97% or less, and further 95% or less.
  • the interface ablation layer 11 is exposed to the ultraviolet rays.
  • the conversion efficiency when converting the light energy of the above into heat energy (hereinafter, may be referred to as "conversion efficiency before ultraviolet irradiation") is preferably 70% or more, and particularly preferably 75% or more. Further, it is preferably 80% or more. This makes it easier to adjust the conversion efficiency after UV irradiation within the above-mentioned range.
  • the upper limit of the conversion efficiency before irradiation with ultraviolet rays is not particularly limited, and may be, for example, 100% or less, particularly 97% or less, and further 95% or less.
  • the work handling sheet 1 when the work handling sheet 1 is irradiated with ultraviolet rays having a wavelength of 365 nm (without performing the above-mentioned first ultraviolet irradiation) at a light amount of 950 mJ / cm 2 , the work handling sheet 1 is subjected to the above ultraviolet rays.
  • the conversion efficiency when converting the light energy of the above into thermal energy (hereinafter, may be referred to as "conversion efficiency of the work handling sheet 1”) is preferably 70% or more, and particularly 80% or more. It is preferable, and more preferably 85% or more. This makes it easier for the conversion efficiency after ultraviolet irradiation to satisfy the above-mentioned range.
  • the upper limit of the conversion efficiency of the work handling sheet 1 is not particularly limited, and may be, for example, 99% or less, particularly 97% or less, and further 95% or less.
  • ultraviolet rays having a wavelength of 365 nm are further applied to the work handling sheet 1 which has been subjected to the first ultraviolet irradiation in which ultraviolet rays having a wavelength of 365 nm are irradiated at a light intensity of 190 mJ / cm 2 .
  • the calorific value of the work handling sheet 1 is preferably 500 mJ / cm 2 or more, particularly 600 mJ / cm 2 or more when the second ultraviolet irradiation is performed with a light amount of 950 mJ / cm 2 . Is preferable, and more preferably 700 mJ / cm 2 or more.
  • the upper limit of the calorific value is not particularly limited, and may be, for example, 2000 mJ / cm 2 or less, particularly 1500 mJ / cm 2 or less, and further 1000 mJ / cm 2 or less.
  • it is preferably 600 mJ / cm 2 or more, particularly 700 mJ / cm 2 or more, and further preferably 800 mJ / cm 2 or more.
  • the upper limit of the calorific value is not particularly limited, and may be, for example, 2000 mJ / cm 2 or less, particularly 1500 mJ / cm 2 or less, and further 1000 mJ / cm 2 or less.
  • the base material 12 when the base material 12 alone is irradiated with ultraviolet rays having a wavelength of 365 nm (without performing the above-mentioned first ultraviolet irradiation) at a light intensity of 950 mJ / cm 2 .
  • the calorific value of the base material 12 is preferably 1 mJ / cm 2 or more, particularly preferably 5 mJ / cm 2 or more, and further preferably 10 mJ / cm 2 or more. It is also preferable that the base material 12 exhibits such a calorific value from the viewpoint of contributing to efficient interfacial ablation.
  • the upper limit of the calorific value is not particularly limited, and may be, for example, 100 mJ / cm 2 or less, particularly 90 mJ / cm 2 or less, and further 80 mJ / cm 2 or less.
  • the absorbance of light rays having a wavelength of 355 nm is preferably 0.5 or more, more preferably 2.0 or more, and particularly 2.5 or more. It is preferably present, and more preferably 3.0 or more.
  • the absorbance of light rays having a wavelength of 355 nm is 0.5 or more, it is possible to reduce the amount of ultraviolet rays reaching the work pieces when irradiated with laser light, effectively damaging the surface of the work pieces. It is possible to separate the work pieces while suppressing them.
  • the upper limit of the absorbance is not particularly limited, and may be, for example, 6.0 or less. The details of the method for measuring the absorbance are as described in Test Examples described later.
  • the manufacturing method of the work handling sheet 1 according to the present embodiment is not particularly limited.
  • the interface ablation layer 11 may be directly formed on the base material 12, or the interface ablation layer 11 may be transferred onto the base material 12 after the interface ablation layer 11 is formed on the process sheet. ..
  • the interface ablation layer 11 contains an adhesive as one of the constituents thereof
  • the interface ablation layer 11 can be formed by a known method. For example, a tacky composition for forming the interfacial ablation layer 11 and, if desired, a coating solution further containing a solvent or dispersion medium are prepared. Then, the coating liquid is applied to one side of the base material or the peelable surface of the release sheet (hereinafter, may be referred to as "peeling surface"). Subsequently, the interface ablation layer 11 can be formed by drying the obtained coating film.
  • the above-mentioned coating liquid can be applied by a known method, for example, a bar coating method, a knife coating method, a roll coating method, a blade coating method, a die coating method, a gravure coating method, or the like.
  • the properties of the coating liquid are not particularly limited as long as it can be coated, and the coating liquid may contain a component for forming the interface ablation layer 11 as a solute or a dispersoid. be.
  • the release sheet may be peeled off as a process material, or the interface ablation layer 11 may be protected until it is attached to the adherend. ..
  • the adhesive composition for forming the interface ablation layer 11 contains the above-mentioned cross-linking agent, by changing the above-mentioned drying conditions (temperature, time, etc.) or by separately providing a heat treatment. It is preferable to proceed the cross-linking reaction between the polymer component in the coating film and the cross-linking agent to form a cross-linked structure in the interface ablation layer 11 at a desired abundance density. Further, in order to allow the above-mentioned cross-linking reaction to proceed sufficiently, after the work handling sheet 1 is completed, it may be cured by allowing it to stand in an environment of, for example, 23 ° C. and a relative humidity of 50% for several days.
  • the work handling sheet 1 according to the present embodiment can be suitably used for handling small pieces of work. As described above, in the work handling sheet 1 according to the present embodiment, since the interfacial ablation layer 11 efficiently ablates the interface by irradiation with laser light, the small pieces of work held on the interfacial ablation layer 11 are high. It can be separated toward a predetermined position with accuracy.
  • the work handling sheet 1 is held on the surface of the interface ablation layer 11 opposite to the base material 12 by the interface ablation locally generated in the interface ablation layer 11.
  • a method of selectively separating any work piece from the plurality of work pieces from the interfacial ablation layer 11 can be mentioned.
  • the plurality of work pieces held on the interface ablation layer 11 are the work (material of the work pieces) held on the surface of the interface ablation layer 11 opposite to the base material 12. It may be obtained by individualizing on the surface. That is, the work piece may be obtained by dicing the work on the interface ablation layer 11. Alternatively, the work piece may be one formed independently of the work handling sheet 1 according to the present embodiment and placed on the interface ablation layer 11.
  • the work handling sheet 1 includes the above-mentioned adhesive layer and protective film forming layer, it is preferable to dice these layers and the work on the interface ablation layer 11. As a result, it is possible to obtain a work piece in which these layers are individualized and laminated.
  • the area of the work pieces in a plan view is preferably 10 ⁇ m 2 or more, and particularly preferably 100 ⁇ m 2 or more.
  • the work piece preferably has an area of 1 mm 2 or less when viewed in a plan view, and particularly preferably 0.25 mm 2 or less.
  • the minimum side of the work pieces is preferably 2 ⁇ m or more, particularly preferably 5 ⁇ m or more, and further preferably 10 ⁇ m or more. preferable. The minimum side is preferably 1 mm or less, and particularly preferably 0.5 mm or less.
  • the dimensions of the rectangular workpiece pieces include 2 ⁇ m ⁇ 5 ⁇ m, 10 ⁇ m ⁇ 10 ⁇ m, 0.5 mm ⁇ 0.5 mm, 1 mm ⁇ 1 mm, and the like.
  • the work handling sheet 1 according to the present embodiment can satisfactorily handle such fine work pieces, particularly even fine work pieces that are difficult to separate from the sheet by pushing up the needle.
  • the work handling sheet 1 according to the present embodiment is relatively large, such as one having an area of more than 1 mm 2 (for example, 1 mm 2 to 2000 mm 2 ) and one having a thickness of 1 to 10000 ⁇ m (for example, 10 to 1000 ⁇ m). It can handle small pieces of work of a size well.
  • small workpieces include semiconductor parts and semiconductor devices, and more specifically, micro light emitting diodes, power devices, MEMS (Micro Electro Mechanical Systems), and the like.
  • the work piece is preferably a light emitting diode, and particularly preferably a light emitting diode selected from a mini light emitting diode and a micro light emitting diode.
  • mini light emitting diodes and micro light emitting diodes are arranged at a high density has been studied, and in the manufacture of such a device, the present embodiment capable of handling these light emitting diodes with high accuracy.
  • the work handling sheet 1 according to the above is very suitable.
  • a preparation step (FIG. 2 (a)
  • a placement step (FIG. 2 (b)
  • a curing step (FIG. 2 (c)
  • a separation step (FIGS. 2 (d) and (e)). It includes at least four steps.
  • a laminated body in which a plurality of work pieces 2 are held on the surface of the work handling sheet 1 according to the present embodiment on the interface ablation layer 11 side is prepared. ..
  • the laminated body may be prepared by placing a separately prepared work piece 2 on the work handling sheet 1, or a work held on the surface on the interface ablation layer 11 side is individually formed on the surface. It may be prepared by ablation (ie, dicing). The dicing can be performed by a known method.
  • the shape and size of the work piece 2 are not particularly limited as described above, and the preferred size is also as described above.
  • semiconductor parts, semiconductor devices, and the like can be mentioned, and in particular, light emitting diodes such as mini light emitting diodes and micro light emitting diodes can be mentioned.
  • the laminate is arranged so that the surfaces of the laminate 2 on the work fragment 2 side face each other with respect to the object 3 that can accept the workpiece 2. ..
  • An example of the object 3 is appropriately determined according to the device to be manufactured, but when the work piece 2 is a light emitting diode, specific examples of the object 3 include a substrate, a sheet, a reel, and the like. In particular, a wiring board provided with wiring is preferably used.
  • the interface ablation layer 11 as a whole is cured by irradiating the entire interface ablation layer 11 in the laminated body with the active energy rays 4.
  • the interface ablation layer 11 becomes a cured interface ablation layer 11'.
  • FIG. 2C depicts a state in which the active energy ray 4 is irradiated to the entire interface ablation layer 11, the irradiation is performed by at least one work piece 2 in the interface ablation layer 11.
  • the interface ablation layer 11 may be locally cured by performing the treatment only on the position where the above is affixed.
  • the above-mentioned irradiation of the active energy ray 4 may be performed by using a known method.
  • an ultraviolet irradiation device provided with a high-pressure mercury lamp or an ultraviolet LED as a light source, or a laser light irradiation device used in a separation step described later may be used. You may use it.
  • the laser beam 5 is applied to the position of the interfacial ablation layer 11'after the curing of the laminated body to which at least one work piece 2 is attached. Irradiate.
  • the irradiation may be performed simultaneously on a plurality of positions to which the work pieces 2 are attached, or may be sequentially performed on those positions.
  • the irradiation conditions of the laser beam 5 are not limited as long as interfacial ablation can be generated.
  • the laser light irradiation device for irradiation a known one can be used.
  • the curing step and the separation step may be performed at the same time. That is, the irradiation of the laser beam 5 in the separation step may be performed as the irradiation of the active energy rays 4 in the curing step, and the local curing of the interface ablation layer 11 and the interface ablation may be performed at the same time.
  • the peak wavelength of the laser beam 5 to be irradiated is preferably 300 nm or more, particularly preferably 310 nm or more, and further preferably 350 nm or more.
  • the peak wavelength is preferably 400 nm or less, particularly preferably 390 nm or less, and further preferably 380 nm or less.
  • an ultraviolet irradiation device used in the curing step (particularly, a device provided with an ultraviolet LED as a light source and laser light irradiation).
  • the peak wavelength of the active energy ray 4 irradiated from the apparatus is preferably 300 nm or more, particularly preferably 310 nm or more, and further preferably 320 nm or more.
  • the peak wavelength is preferably 400 nm or less, particularly preferably 390 nm or less, and further preferably 380 nm or less.
  • the laser light 5 emitted from the laser light irradiating device used in the separation step preferably has a peak wavelength of 300 nm or more, particularly preferably 310 nm or more, and further preferably 320 nm or more. preferable.
  • the peak wavelength is preferably 400 nm or less, particularly preferably 390 nm or less, and further preferably 380 nm or less.
  • interfacial ablation can be generated at the irradiated position in the interfacial ablation layer 11'after curing.
  • the components constituting the region evaporate or volatilize to become the reaction region 13. ..
  • the gas generated by the evaporation or volatilization accumulates between the base material 12 and the reaction region 13, and the blister 6 is formed.
  • the hardened interface ablation layer 11' is locally deformed at the position of the work piece 2', and the work piece 2'is separated so as to be peeled off from the hardened interface ablation layer 11. As described above, the work piece 2'existing at the position where the interface ablation has occurred can be placed on the object 3.
  • FIG. 3 shows how the work pieces 2 are separated by sequentially irradiating the laser beam, and in particular, the state after separation (two on the left), the state during separation (center), and the separation. The previous state (two on the right) is shown.
  • the separated blister 6 is usually in a slightly deflated state as compared to the separated blister 6.
  • various devices can be manufactured by appropriately selecting the work piece 2 and the object 3 to be used.
  • a light emitting diode selected from a mini light emitting diode and a micro light emitting diode is used as the work piece 2
  • a light emitting device including a plurality of such light emitting diodes can be manufactured, and more specifically, a display.
  • another layer is laminated between the interface ablation layer 11 and the base material 12 in the work handling sheet 1 according to the present embodiment, or on the surface of the base material 12 opposite to the interface ablation layer 11. May be good.
  • Specific examples of the other layer include an adhesive layer.
  • the above-mentioned separation step or the like can be performed with the surface on the pressure-sensitive adhesive layer side attached to a support base (transparent substrate such as a glass plate).
  • Example 1 (1) Preparation of Adhesive Composition 80 parts by mass of 2-ethylhexyl acrylate and 20 parts by mass of 2-hydroxyethyl acrylate were polymerized by a solution polymerization method to obtain a (meth) acrylic acid ester polymer. .. The weight average molecular weight (Mw) of this acrylic polymer was measured by the above-mentioned method and found to be 600,000.
  • a release sheet manufactured by Lintec Corporation, product name "SP-PET38131" in which a silicone-based release agent layer is formed on one side of a 38 ⁇ m-thick polyethylene terephthalate film.
  • the coating liquid of the adhesive composition obtained in the above step (1) was applied to the peeled surface, and the obtained coating film was dried by heating.
  • a laminate obtained by laminating an interface ablation layer having a thickness of 5 ⁇ m and a release sheet formed by drying the coating film was obtained.
  • the above-mentioned weight average molecular weight (Mw) is a standard polystyrene-equivalent weight average molecular weight measured under the following conditions (GPC measurement) using gel permeation chromatography (GPC).
  • GPC measurement gel permeation chromatography
  • Examples 2 to 4 A work handling sheet was produced in the same manner as in Example 1 except that the type and content of the additive and the thickness of the interface ablation layer (adhesive layer) were changed as shown in Table 1.
  • Example 5 80 parts by mass of 2-ethylhexyl acrylate and 20 parts by mass of 2-hydroxyethyl acrylate were polymerized by a solution polymerization method to obtain a (meth) acrylate polymer. 80 mol% of methacryloyloxyethyl isocyanate (MOI) is reacted with this (meth) acrylic acid ester polymer with 2-hydroxyethyl acrylate to introduce an active energy ray-curable group into the side chain. Acrylic polymer (active energy ray-curable component) was obtained. The weight average molecular weight (Mw) of this acrylic polymer was measured by the above-mentioned method and found to be 1 million.
  • MOI methacryloyloxyethyl isocyanate
  • Mw weight average molecular weight
  • a work handling sheet was produced in the same manner as in Example 1 except that the above adhesive composition was used and the thickness of the interface ablation layer was changed as shown in Table 1.
  • Example 6 to 7 and Comparative Example 1 A work handling sheet was produced in the same manner as in Example 5, except that the content of the cross-linking agent and the type and content of the additive were changed as shown in Table 1.
  • Example 2 A work handling sheet was produced in the same manner as in Example 1 except that no additive was used and the thickness of the interface ablation layer was changed as shown in Table 1.
  • UV irradiation 230 mW / cm 2 , light intensity: 190 mJ / cm 2 )
  • first ultraviolet irradiation a work handling sheet “after UV irradiation” was obtained.
  • the interface ablation layer is a pressure-sensitive adhesive layer composed of an active energy ray-curable pressure-sensitive adhesive
  • the interface ablation layer is cured by the first ultraviolet irradiation. did.
  • Step 1 Hold at set atmosphere temperature 30 ° C for 1 minute
  • Step 2 Irradiate ultraviolet rays at set atmosphere temperature 30 ° C for 0.3 minutes at illuminance: 380 mW / cm 2 and light intensity: 950 mJ / cm 2 (hereinafter, this ultraviolet irradiation is performed.
  • Second UV irradiation Hold for 0.7 minutes at the set atmosphere temperature of 30 ° C.
  • the measurement was performed in the same manner as above in an empty state without installing a measurement sample in the measurement section.
  • the measurement data acquired from the reference is subtracted from the measurement data acquired from the measurement sample, and the calorie data of only the measurement sample (horizontal axis: time, vertical axis).
  • Axis DSC curve, which is the calorific value per unit time) was obtained.
  • the calorific value (mJ / cm 2 ) of the entire work handling sheet after UV irradiation was acquired as an integral value of the calorific value per unit time from the start of measurement to the end of measurement in the DSC curve. The results are shown in Table 2.
  • the work handling sheet after UV irradiation is replaced with the work handling sheet before UV irradiation (that is, the work handling sheet not subjected to the first ultraviolet irradiation), and the work handling before UV irradiation is performed in the same manner as described above.
  • the calorific value (mJ / cm 2 ) of the entire sheet was acquired. The results are also shown in Table 2.
  • the calorific value of the base material alone was reduced from the calorific value of the entire work handling sheet before UV irradiation, and the calorific value due to the interface ablation layer was calculated. Then, based on the calorific value caused by this interfacial ablation layer, the conversion efficiency (%) of the light energy by the second ultraviolet irradiation into heat energy was calculated in the same manner as described above. The results are shown in Table 2 as the conversion efficiency (%) of the interface ablation layer before UV irradiation.
  • the calorific value of the base material alone was reduced from the calorific value of the entire work handling sheet after UV irradiation, and the calorific value due to the interface ablation layer was calculated. Then, based on the calorific value caused by this interfacial ablation layer, the conversion efficiency (%) of the light energy by the second ultraviolet irradiation into heat energy was calculated in the same manner as described above. The results are shown in Table 2 as the conversion efficiency (%) of the interface ablation layer after UV irradiation.
  • a silicon wafer was diced into a chip having a size of 300 ⁇ m ⁇ 300 ⁇ m using a dicing apparatus (manufactured by Disco Corporation, product name “DFD6362”).
  • the dicing sheet is irradiated with ultraviolet rays (illuminance 230 mW / cm 2 , light intensity 190 mJ / cm 2 ) using an ultraviolet irradiation device (manufactured by Lintec Corporation, product name "RAD2000”) to form an adhesive layer of the dicing sheet. It was cured.
  • a laminated body in which a plurality of chips were provided on the dicing sheet was obtained.
  • the release sheet was peeled off from the work handling sheets produced in Examples and Comparative Examples, and the exposed exposed surface was bonded to the surface of the laminate obtained as described above in which a plurality of chips exist. ..
  • the dicing sheet was peeled off from the plurality of chips.
  • a plurality of chips were transferred from the dicing sheet to the work handling sheet, and a laminated body in which the plurality of chips were provided on the work handling sheet was obtained.
  • (2-1) Condition 1 A laser beam irradiator (YAG third harmonic (wavelength 355 nm), pulse width 20 ns, light intensity 700 mJ / cm 2 ) was used to irradiate the chip with laser light through the work handling sheet. The irradiation was performed on a region of 270 ⁇ m ⁇ 270 ⁇ m in the center of the chip. Other irradiation conditions were frequency: 30 kHz and irradiation amount: 50 ⁇ J / shot. In addition, irradiation was performed by selecting 100 chips (a group of 10 vertical ⁇ 10 horizontal chips) from a plurality of chips.
  • the chip was irradiated with laser light through the work handling sheet using a laser light irradiation device (manufactured by KEYENCE, product name "MD-U1000C").
  • the irradiation was performed by sequentially irradiating the center of the chip with laser light spots in a circular motion. At this time, the diameter of the laser beam spot was set to 25 ⁇ m, and the inner diameter of the ring generated as the irradiation locus was set to 65 ⁇ m.
  • Other irradiation conditions were frequency: 40 kHz, scan speed: 500 mm / s, and irradiation amount: 50 ⁇ J / shot. Further, the irradiation was performed by selecting 100 chips (a group of 10 vertical ⁇ 10 horizontal chips) from a plurality of chips and performing the irradiation on them.
  • condition 2 is a condition in which laser lift-off is more likely to occur than condition 1.
  • the work handling sheet manufactured in the examples was excellent in laser lift-off suitability.
  • the work handling according to Comparative Example 2 was inferior in the evaluation of the laser lift-off even under the condition 2 in which the laser lift-off was more likely to occur.
  • the work handling sheet of the present invention can be suitably used for manufacturing a display or the like provided with a micro light emitting diode as a pixel.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laser Beam Processing (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Adhesive Tapes (AREA)

Abstract

Le problème décrit par la présente invention est de fournir une feuille de manipulation de pièce grâce à laquelle il est possible de manipuler avantageusement une pièce, même très petite. La solution de l'invention porte sur une feuille de manipulation de pièce (1) qui est dotée d'un matériau de base (11) et d'une couche d'ablation d'interface (12) qui est stratifiée sur un côté surface du matériau de base (11), apte à maintenir une petite pièce, et subit une ablation d'interface par exposition à une lumière laser. Lorsque la feuille de manipulation de pièce (1), qui a été soumise à une première exposition aux ultraviolets pour effectuer une exposition à des rayons ultraviolets ayant une longueur d'onde de 365 nm pour une quantité de lumière de 190 mJ/cm2, est en outre soumise à une seconde exposition aux ultraviolets pour effectuer une exposition à des rayons ultraviolets ayant une longueur d'onde de 365 nm pour une quantité de lumière de 950 mJ/cm2, l'efficacité de conversion avec laquelle la couche d'ablation d'interface (12) convertit l'énergie lumineuse des rayons ultraviolets pendant la seconde exposition aux ultraviolets en énergie thermique est supérieure ou égale à 60 %.
PCT/JP2021/048936 2021-01-13 2021-12-28 Feuille de manipulation de pièce, procédé de manipulation de petite pièce, procédé de fabrication de dispositif et utilisation d'une feuille de manipulation de pièce WO2022153877A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022575524A JPWO2022153877A1 (fr) 2021-01-13 2021-12-28
KR1020237005271A KR20230132433A (ko) 2021-01-13 2021-12-28 워크 핸들링 시트, 워크 소편의 취급 방법, 디바이스 제조 방법, 및 워크 핸들링 시트의 사용
CN202180063657.0A CN116234693A (zh) 2021-01-13 2021-12-28 工件处理片、工件小片的处理方法、器件制造方法及工件处理片的应用

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP2021-003436 2021-01-13
JP2021003436 2021-01-13
JP2021-053427 2021-03-26
JP2021-053428 2021-03-26
JP2021053427 2021-03-26
JP2021053426 2021-03-26
JP2021-053426 2021-03-26
JP2021053428 2021-03-26
JPPCT/JP2021/045507 2021-12-10
PCT/JP2021/045507 WO2022153745A1 (fr) 2021-01-13 2021-12-10 Feuille de manipulation de pièce et procédé de fabrication de dispositif

Publications (1)

Publication Number Publication Date
WO2022153877A1 true WO2022153877A1 (fr) 2022-07-21

Family

ID=82447580

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2021/048937 WO2022153878A1 (fr) 2021-01-13 2021-12-28 Feuille de manipulation de pièce, procédé de fabrication de dispositif à semi-conducteur et utilisation de feuille de manipulation de pièce
PCT/JP2021/048936 WO2022153877A1 (fr) 2021-01-13 2021-12-28 Feuille de manipulation de pièce, procédé de manipulation de petite pièce, procédé de fabrication de dispositif et utilisation d'une feuille de manipulation de pièce

Family Applications Before (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/048937 WO2022153878A1 (fr) 2021-01-13 2021-12-28 Feuille de manipulation de pièce, procédé de fabrication de dispositif à semi-conducteur et utilisation de feuille de manipulation de pièce

Country Status (5)

Country Link
JP (2) JPWO2022153877A1 (fr)
KR (1) KR20230132433A (fr)
CN (1) CN116234693A (fr)
TW (2) TW202235577A (fr)
WO (2) WO2022153878A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251359A (ja) * 2009-04-10 2010-11-04 Sony Corp 素子の移載方法
JP2014515883A (ja) * 2011-04-11 2014-07-03 エヌディーエスユー リサーチ ファウンデーション レーザで促進される、分離した部品の選択的な転写
WO2019207920A1 (fr) * 2018-04-26 2019-10-31 Jsr株式会社 Procédé de montage et dispositif de montage pour éléments semi-conducteurs

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246278A (ja) 1988-08-06 1990-02-15 Marutaka Iryo Kk 陰イオン発生器付きパイプ
JP2007250598A (ja) * 2006-03-14 2007-09-27 Renesas Technology Corp 半導体装置の製造方法
JP7287797B2 (ja) * 2019-03-11 2023-06-06 日東電工株式会社 接着フィルム付きダイシングテープ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010251359A (ja) * 2009-04-10 2010-11-04 Sony Corp 素子の移載方法
JP2014515883A (ja) * 2011-04-11 2014-07-03 エヌディーエスユー リサーチ ファウンデーション レーザで促進される、分離した部品の選択的な転写
WO2019207920A1 (fr) * 2018-04-26 2019-10-31 Jsr株式会社 Procédé de montage et dispositif de montage pour éléments semi-conducteurs

Also Published As

Publication number Publication date
TW202244239A (zh) 2022-11-16
JPWO2022153878A1 (fr) 2022-07-21
KR20230132433A (ko) 2023-09-15
WO2022153878A1 (fr) 2022-07-21
JPWO2022153877A1 (fr) 2022-07-21
TW202235577A (zh) 2022-09-16
CN116234693A (zh) 2023-06-06

Similar Documents

Publication Publication Date Title
CN110211912B (zh) 切割片
JP7062654B2 (ja) ステルスダイシング用粘着シートおよび半導体装置の製造方法
CN111149191B (zh) 工件加工用片及已加工工件的制造方法
JP7325403B2 (ja) ワーク加工用シート
WO2020195744A1 (fr) Feuille de traitement de pièce à travailler
JP7382690B2 (ja) ワーク加工用シート
WO2022153877A1 (fr) Feuille de manipulation de pièce, procédé de manipulation de petite pièce, procédé de fabrication de dispositif et utilisation d'une feuille de manipulation de pièce
JP2021050251A (ja) ワーク加工用シートおよび半導体装置の製法方法
JP6818612B2 (ja) 半導体加工用シートおよび半導体装置の製造方法
JP7146145B1 (ja) ワークハンドリングシートおよびデバイス製造方法
JP7042271B2 (ja) ステルスダイシング用粘着シートおよび半導体装置の製造方法
JP7325634B2 (ja) ワークハンドリングシートおよびデバイス製造方法
WO2022201767A1 (fr) Feuille de manipulation de pièces et procédé de fabrication de dispositif
JP7062653B2 (ja) ステルスダイシング用粘着シートおよび半導体装置の製造方法
JP6980680B2 (ja) ステルスダイシング用粘着シート
WO2022153745A1 (fr) Feuille de manipulation de pièce et procédé de fabrication de dispositif
JP7062655B2 (ja) ステルスダイシング用粘着シートおよび半導体装置の製造方法
KR20230129372A (ko) 워크 핸들링 시트 및 디바이스 제조 방법
JP2023097043A (ja) ワークハンドリングシートおよびデバイス製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21919761

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022575524

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21919761

Country of ref document: EP

Kind code of ref document: A1