WO2022153627A1 - 光電変換基板 - Google Patents
光電変換基板 Download PDFInfo
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- WO2022153627A1 WO2022153627A1 PCT/JP2021/037559 JP2021037559W WO2022153627A1 WO 2022153627 A1 WO2022153627 A1 WO 2022153627A1 JP 2021037559 W JP2021037559 W JP 2021037559W WO 2022153627 A1 WO2022153627 A1 WO 2022153627A1
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- photoelectric conversion
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- ray
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Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T7/00—Details of radiation-measuring instruments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
Definitions
- An embodiment of the present invention relates to a photoelectric conversion substrate.
- an X-ray detector As a radiation detector, for example, an X-ray detector (X-ray plane detector) is known.
- the X-ray detection module of the X-ray detector includes an X-ray detection panel and an FPC (flexible printed circuit board).
- the X-ray detection panel includes a photoelectric conversion substrate using a glass substrate as a base material, and a scintillator layer formed on the photoelectric conversion substrate.
- the scintillator layer converts X-rays into fluorescence.
- the scintillator layer contains, for example, cesium iodide (CsI).
- the photoelectric conversion board converts fluorescence into an electric signal.
- the FPC is connected to a photoelectric conversion substrate by thermocompression bonding.
- This embodiment provides a photoelectric conversion substrate with high product reliability.
- the photoelectric conversion board is A flexible base material including a main body and a protrusion, a plurality of photoelectric conversion elements, and a plurality of wirings are provided.
- the main body is located in a detection region and a non-detection region surrounding the detection region, and the protrusion protrudes from the side of the main body and is physically continuously formed from the main body to form the non-detection region.
- the plurality of photoelectric conversion elements are located in the outer protruding region, the plurality of photoelectric conversion elements are provided above the main body portion and are located in the detection region, and the plurality of wirings are located above the main body portion and the protruding portion. It is electrically connected to a plurality of photoelectric conversion elements.
- FIG. 1 is a cross-sectional view showing an X-ray detector according to the first embodiment.
- FIG. 2 is a perspective view showing a support substrate, an X-ray detection panel, and a circuit board of the X-ray detector, and is also a diagram showing an image transmission unit.
- FIG. 3 is an enlarged cross-sectional view showing a detection area of the X-ray detection module of the X-ray detector.
- FIG. 4 is a plan view showing a part of the X-ray detector, and is a view showing an expanded protruding region of the photoelectric conversion substrate.
- FIG. 5 is a cross-sectional view showing a part of the X-ray detector shown in FIG. 4 along the line VV.
- FIG. 1 is a cross-sectional view showing an X-ray detector according to the first embodiment.
- FIG. 2 is a perspective view showing a support substrate, an X-ray detection panel, and a circuit board of the X-ray detector, and is also a diagram
- FIG. 6 is an enlarged cross-sectional view showing a detection region, a non-detection region, and a protruding region of the X-ray detection module, and is an expanded view of the protruding region.
- FIG. 7 is an enlarged plan view showing a non-detection region and a protruding region of the X-ray detection panel, is a view showing the protruding region expanded, and is a diagram showing a control circuit and a connector together.
- FIG. 8 is a plan view showing a part of the X-ray detector according to the first modification of the first embodiment, and is a view showing an expanded protruding region of the photoelectric conversion substrate.
- FIG. 9 is a plan view showing a part of the X-ray detector according to the second modification of the first embodiment, and is a view showing an expanded protruding region of the photoelectric conversion substrate.
- FIG. 10 is a plan view showing a part of the X-ray detector according to the third modification of the first embodiment, and is a view showing an expanded protruding region of the photoelectric conversion substrate.
- FIG. 11 is a cross-sectional view showing a part of the X-ray detector according to the second embodiment, and is a view showing an expanded protruding region of the photoelectric conversion substrate.
- FIG. 12 is an enlarged cross-sectional view showing a non-detection region of the X-ray detection module of the X-ray detector according to the comparative example and a region around the non-detection region.
- the X-ray detector as a radiation detector includes an X-ray detection panel.
- the base material of the photoelectric conversion substrate is made of glass.
- the material of the base material is, for example, resin.
- the resin base material is lighter in weight and bendable than the glass base material, so that it is strong against impact and hard to break.
- FPC Flexible Printed Circuit
- the photoelectric conversion board uses a glass base material
- the crimping is easy. This is because the FPC has a soft material, but the photoelectric conversion substrate uses a glass base material having a relatively high rigidity.
- the IC chip is mounted on the FPC by a mounting method called COF (ChipOnFilm or ChipOnFlexible), and the FPC on which the IC chip is mounted is crimped onto the photoelectric conversion substrate.
- COF ChipOnFilm or ChipOnFlexible
- FIG. 1 is a cross-sectional view showing an X-ray detector 1 according to the first embodiment.
- the X-ray detector 1 is an X-ray image detector, and is an X-ray plane detector that uses an X-ray detection panel.
- the X-ray detector 1 includes an X-ray detection module 10, a support substrate 12, a circuit board 11, spacers 9a, 9b, 9c, 9d, a housing 51, an incident window 52, and the like.
- the X-ray detection module 10 includes an X-ray detection panel PNL and a moisture-proof cover 7.
- the X-ray detection panel PNL is located between the support substrate 12 and the moisture-proof cover 7.
- the moisture-proof cover 7 faces the incident window 52.
- the incident window 52 is attached to the opening of the housing 51.
- the incident window 52 transmits X-rays. Therefore, X-rays pass through the incident window 52 and are incident on the X-ray detection module 10.
- the incident window 52 is formed in a plate shape and has a function of protecting the inside of the housing 51. It is desirable that the incident window 52 is thinly formed of a material having a low X-ray absorption rate.
- the incident window 52 is made of carbon fiber reinforced plastic (CFRP: Carbon-Fiber-Reinforced Plastic). As a result, it is possible to reduce the scattering of X-rays and the attenuation of the X-ray dose caused by the incident window 52. Then, a thin and light X-ray detector 1 can be realized.
- CFRP Carbon-Fiber-Reinforced Plastic
- the X-ray detection module 10, the support board 12, the circuit board 11, and the like are housed inside the space surrounded by the housing 51 and the incident window 52.
- the support substrate 12 has a first main surface SU1, a second main surface SU2 on the opposite side of the first main surface SU1, and a side surface SU3 between the first main surface SU1 and the second main surface SU2. ing.
- the X-ray detection module 10 Since the X-ray detection module 10 is configured by laminating thin members, it is light and has low mechanical strength. Therefore, the X-ray detection panel PNL (X-ray detection module 10) is fixed to the first main surface SU1 of the support substrate 12.
- the support substrate 12 is formed in a plate shape with, for example, lead, and has the strength (elastic modulus) required to stably hold the X-ray detection panel PNL. As a result, it is possible to suppress damage to the X-ray detection panel PNL when vibration or impact is applied to the X-ray detector 1 from the outside.
- the support substrate 12 may be made of a material having low moisture permeability and a high elastic modulus, and may be made of a material such as an aluminum alloy, stainless steel, glass, or CFRP.
- the circuit board 11 is fixed to the support board 12.
- the circuit board 11 is fixed to the second main surface SU2 of the support board 12 via spacers 9a and 9b.
- the electrical insulation distance from the support substrate 12 to the circuit board 11 can be maintained by using the spacers 9a and 9b.
- the circuit board 11 is fixed to the inner surface of the housing 51 via spacers 9c and 9d. By using the spacers 9c and 9d, it is possible to maintain the electrical insulation distance from the housing 51 mainly made of metal to the circuit board 11.
- the housing 51 supports the support board 12 and the like via the circuit board 11 and the spacers 9a, 9b, 9c, and 9d.
- the X-ray detection panel PNL is provided with a wiring board 2e1 on the peripheral edge.
- the wiring board 2e1 functions as an FPC.
- a control circuit 3a is provided on the wiring board 2e1.
- the control circuit 3a is, for example, an IC chip and is mounted on the wiring board 2e1.
- the wiring board 2e1 of the X-ray detection panel PNL is connected to the circuit board 11.
- the wiring board 2e1 can be bent by 180 ° and passes through a space facing the side surface SU3 of the support board 12.
- a connector corresponding to the wiring board 2e1 is mounted on the circuit board 11, and the wiring board 2e1 is electrically connected to the circuit board 11 via the connector.
- the circuit board 11 is electrically connected to the X-ray detection panel PNL via the connector.
- the circuit board 11 electrically drives the X-ray detection panel PNL together with the control circuit 3a and the like, and electrically processes the output signal from the X-ray detection panel PNL.
- FIG. 2 is a perspective view showing the support board 12, the X-ray detection panel PNL, and the circuit board 11 of the X-ray detector 1 of the present embodiment, and is also a view showing the image transmission unit 4. Note that FIG. 2 does not show all the members of the X-ray detector 1. Illustration of some members of the X-ray detector 1, such as a sealing portion described later, is omitted in FIG.
- the X-ray detection panel PNL includes a photoelectric conversion substrate 2, a scintillator layer 5, and the like.
- the photoelectric conversion board 2 has a base material 2a, a plurality of photoelectric conversion units 2b, a plurality of control lines (or gate lines) 2c1, a plurality of data lines (or signal lines) 2c2, a plurality of wiring boards 2e1, 2e2, and the like. ing.
- the number, arrangement, and the like of the photoelectric conversion unit 2b, the control line 2c1, the data line 2c2, and the wiring boards 2e1 and 2e2 are not limited to the example of FIG.
- the wiring board 2e1 is a region of the photoelectric conversion board 2 where a protrusion 2ab, which will be described later, a plurality of wirings WL1, WL2, etc. are located.
- the plurality of control lines 2c1 extend in the row direction X and are arranged in the column direction Y at predetermined intervals.
- the plurality of data lines 2c2 extend in the column direction Y, intersect the plurality of control lines 2c1, and are arranged in the row direction X at predetermined intervals.
- the plurality of photoelectric conversion units 2b are provided on one main surface (first main surface SU1) side of the base material 2a.
- the photoelectric conversion unit 2b is provided in a rectangular region partitioned by the control line 2c1 and the data line 2c2.
- One photoelectric conversion unit 2b corresponds to one pixel of the X-ray image.
- the plurality of photoelectric conversion units 2b are arranged in a matrix in the row direction X and the column direction Y. From the above, the photoelectric conversion unit 2b is an array substrate.
- Each photoelectric conversion unit 2b has a photoelectric conversion element 2b1 and a TFT (thin film transistor) 2b2 as a switching element.
- the TFT 2b2 is connected to a corresponding control line 2c1 and a corresponding data line 2c2.
- the photoelectric conversion element 2b1 is electrically connected to the TFT 2b2.
- the control line 2c1 is electrically connected to the circuit board 11 via the wiring board 2e1 and the like.
- the circuit board 11 gives a control signal S1 to a plurality of control lines 2c1 together with the control circuit 3a.
- the wiring board 2e2 of the X-ray detection panel PNL is connected to the circuit board 11 in the same manner as the wiring board 2e1.
- the wiring board 2e2 can be curved by 180 ° and passes through a space facing the side surface SU4 of the support board 12.
- the data line 2c2 is electrically connected to the circuit board 11 via the wiring board 2e2 and the like.
- the image data signal S2 charge accumulated in the photoelectric conversion unit 2b) converted by the photoelectric conversion element 2b1 is transmitted to the circuit board 11 via the TFT 2b2, the data line 2c2, the wiring board 2e2, the control circuit (3b) described later, and the like. Be transmitted.
- the X-ray detector 1 further includes an image transmission unit 4.
- the image transmission unit 4 is connected to the circuit board 11 via the wiring 4a.
- the image transmission unit 4 may be incorporated in the circuit board 11.
- the image transmission unit 4 generates an X-ray image based on the signal of the image data converted into a digital signal by a plurality of analog-digital converters (not shown).
- the generated X-ray image data is output from the image transmission unit 4 to an external device.
- FIG. 3 is an enlarged cross-sectional view showing the detection region DA of the X-ray detection module 10 of the X-ray detector 1 according to the present embodiment.
- the photoelectric conversion substrate 2 has a base material 2a, a plurality of photoelectric conversion units 2b, and insulating layers 21, 22, 23, 24, 25.
- the plurality of photoelectric conversion units 2b are located in the detection region DA.
- Each photoelectric conversion unit 2b includes a photoelectric conversion element 2b1 and a TFT 2b2.
- TFT2b2 has a gate electrode GE, a semiconductor layer SC, a source electrode SE, and a drain electrode DE.
- the photoelectric conversion element 2b1 is composed of a photodiode.
- the photoelectric conversion element 2b1 may be configured to convert light into electric charges.
- the base material 2a has a plate-like shape and is made of an insulating material.
- the base material 2a is flexible and bendable. Examples of the material of the base material 2a include polyimide (PI), which is a resin.
- the base material 2a is a flexible substrate (or a flexible layer), whereas the support substrate 12 is a rigid substrate.
- the support substrate 12 has a rigidity higher than that of the base material 2a.
- the elastic modulus of the support substrate 12 is higher than the elastic modulus of the base material 2a.
- the plurality of photoelectric conversion units 2b are located above the base material 2a.
- the insulating layer 21 is provided on the base material 2a.
- a gate electrode GE is formed on the insulating layer 21.
- the gate electrode GE is electrically connected to the control line 2c1.
- the insulating layer 22 is provided on the insulating layer 21 and the gate electrode GE.
- the semiconductor layer SC is provided on the insulating layer 22 and faces the gate electrode GE.
- the semiconductor layer SC is formed of a semiconductor material such as amorphous silicon as an amorphous semiconductor and polycrystalline silicon as a polycrystalline semiconductor.
- a source electrode SE and a drain electrode DE are provided on the insulating layer 22 and the semiconductor layer SC.
- the gate electrode GE, the source electrode SE, the drain electrode DE, the control line 2c1 and the data line 2c2 are formed by using a low resistance metal such as aluminum or chromium.
- the source electrode SE is electrically connected to the source region of the semiconductor layer SC. Further, the source electrode SE is electrically connected to the data line 2c2.
- the drain electrode DE is electrically connected to the drain region of the semiconductor layer SC.
- the insulating layer 23 is provided on the insulating layer 22, the semiconductor layer SC, the source electrode SE, and the drain electrode DE.
- the photoelectric conversion element 2b1 is electrically connected to the drain electrode DE.
- the insulating layer 24 is provided on the insulating layer 23 and the photoelectric conversion element 2b1.
- the bias line BL is provided on the insulating layer 24 and is connected to the photoelectric conversion element 2b1 through a contact hole formed in the insulating layer 24.
- the insulating layer 25 is provided on the insulating layer 24 and the bias wire BL.
- the insulating layers 21, 22, 23, 24, 25 are formed of an insulating material such as an inorganic insulating material or an organic insulating material.
- an insulating material such as an inorganic insulating material or an organic insulating material.
- the inorganic insulating material include an oxide insulating material, a nitride insulating material, and an oxynitride insulating material.
- the organic insulating material include resin.
- the scintillator layer 5 is provided on the photoelectric conversion substrate 2 (plurality of photoelectric conversion units 2b).
- the scintillator layer 5 faces a plurality of photoelectric conversion units 2b.
- the scintillator layer 5 is located at least in the detection region DA and covers the upper part of the plurality of photoelectric conversion units 2b.
- the scintillator layer 5 is configured to convert incident X-rays into light (fluorescence).
- the plurality of photoelectric conversion units 2b are located in the detection region DA. Therefore, when paying attention to the photoelectric conversion substrate 2, the detection region DA is a region in which light (visible light) can be detected.
- the photoelectric conversion element 2b1 converts the light incident from the scintillator layer 5 into electric charges. The converted charge is stored in the photoelectric conversion element 2b1.
- the TFT 2b2 can switch between storing electricity in the photoelectric conversion element 2b1 and discharging from the photoelectric conversion element 2b1. If the self-capacity of the photoelectric conversion element 2b1 is insufficient, the photoelectric conversion substrate 2 may further have a capacitor, and the charge converted by the photoelectric conversion element 2b1 may be accumulated in the capacitor.
- the scintillator layer 5 is formed of thallium-activated cesium iodide (CsI: Tl).
- CsI cesium iodide
- the scintillator layer 5 composed of an aggregate of a plurality of columnar crystals can be obtained.
- the thickness of the scintillator layer 5 is, for example, 600 ⁇ m.
- the thickness of the columnar crystals of the scintillator layer 5 is 8 to 12 ⁇ m.
- the material forming the scintillator layer 5 is not limited to CsI: Tl. Even if the scintillator layer 5 is formed of tarium-activated sodium iodide (NaI: Tl), sodium-activated cesium iodide (CsI: Na), europium-activated cesium iodide (CsBr: Eu), sodium iodide (NaI), etc. good.
- the scintillator layer 5 is formed by the vacuum vapor deposition method
- a mask having an opening is used.
- the scintillator layer 5 is formed in the region facing the opening on the photoelectric conversion substrate 2.
- the scintillator material produced by vapor deposition also deposits on the surface of the mask. Then, the scintillator material is also deposited in the vicinity of the opening of the mask, and crystals grow so as to gradually project inside the opening.
- the deposition of the scintillator material on the photoelectric conversion substrate 2 is suppressed in the vicinity of the opening. Therefore, as shown in FIG. 2, the thickness of the vicinity of the peripheral edge of the scintillator layer 5 gradually decreases toward the outside.
- the scintillator layers 5 may be arranged in a matrix and provided on the photoelectric conversion unit 2b on a one-to-one basis, and may have a plurality of scintillator units each having a square columnar shape.
- a scintillator material obtained by mixing gadolinium acid sulfide (Gd 2 O 2 S) phosphor particles with a binder material is applied onto the photoelectric conversion substrate 2, and the scintillator material is fired and cured. Let me. After that, a grid-like groove is formed in the scintillator material by dicing with a die.
- an inert gas such as air or nitrogen (N 2 ) for antioxidant is sealed between the plurality of scintillator portions.
- the space between the plurality of scintillator units may be set to a space decompressed from the atmospheric pressure.
- the X-ray detection panel PNL further includes a light reflecting layer 6.
- the light reflecting layer 6 is provided on the scintillator layer 5.
- the light reflecting layer 6 is provided on the incident side of the scintillator layer 5 with X-rays.
- the light reflecting layer 6 is located at least in the detection region DA and covers the upper surface of the scintillator layer 5.
- the light reflecting layer 6 is provided in order to improve the utilization efficiency of light (fluorescence) and improve the sensitivity characteristics. That is, the light reflecting layer 6 reflects the light generated in the scintillator layer 5 toward the side opposite to the side where the photoelectric conversion unit 2b is provided, and directs the light toward the photoelectric conversion unit 2b.
- the light reflecting layer 6 is not always necessary, and may be provided according to the sensitivity characteristics required for the X-ray detection module 10.
- a coating material obtained by mixing light-scattering particles made of titanium oxide (TiO 2 ), a resin, and a solvent is applied onto the scintillator layer 5, and then the coating material is dried to form the light-reflecting layer 6. Can be formed.
- the structure of the light reflecting layer 6 and the method of manufacturing the light reflecting layer 6 are not limited to the above examples, and can be variously modified.
- the light reflecting layer 6 may be formed by forming a layer made of a metal having a high light reflectance such as silver alloy or aluminum on the scintillator layer 5.
- the light reflecting layer 6 is formed by arranging a sheet containing a metal layer having a high light reflectance such as a silver alloy or aluminum on the surface, a resin sheet containing light scattering particles, or the like on the scintillator layer 5. May be good.
- the coating material shrinks as it dries, so that tensile stress is applied to the scintillator layer 5 and the scintillator layer 5 is photoelectric. It may peel off from the conversion board 2. Therefore, it is preferable to provide the sheet-shaped light reflecting layer 6 on the scintillator layer 5.
- the light reflecting layer 6 can be bonded onto the scintillator layer 5 by using, for example, double-sided tape, but it is preferable to place the light reflecting layer 6 on the scintillator layer 5. If the sheet-shaped light reflecting layer 6 is placed on the scintillator layer 5, peeling of the scintillator layer 5 from the photoelectric conversion substrate 2 due to expansion or contraction of the light reflecting layer 6 can be easily suppressed.
- the moisture-proof cover (moisture-proof portion) 7 is provided on the photoelectric conversion substrate 2, the scintillator layer 5, and the light reflection layer 6.
- the moisture-proof cover 7 covers the scintillator layer 5 and the light-reflecting layer 6.
- the moisture-proof cover 7 is provided to prevent deterioration of the characteristics of the light reflecting layer 6 and the characteristics of the scintillator layer 5 due to moisture contained in the air.
- the moisture-proof cover 7 completely covers the exposed portion of the scintillator layer 5. Although the moisture-proof cover 7 is in contact with the light-reflecting layer 6, a gap may be left between the moisture-proof cover 7 and the light-reflecting layer 6.
- the moisture-proof cover 7 is made of a sheet containing metal.
- the metal include a metal containing aluminum, a metal containing copper, a metal containing magnesium, a metal containing tungsten, stainless steel, Kovar and the like.
- the moisture-proof cover 7 can prevent or significantly suppress the permeation of moisture.
- the moisture-proof cover 7 may be formed of a laminated sheet in which a resin layer and a metal layer are laminated.
- the resin layer can be formed of a material such as a polyimide resin, an epoxy resin, a polyethylene terephthalate resin, Teflon (registered trademark), low density polyethylene, high density polyethylene, or elastic rubber.
- the metal layer may contain, for example, the metal described above.
- the metal layer can be formed by using a sputtering method, a laminating method, or the like.
- the metal layer on the scintillator layer 5 side rather than the resin layer. Since the metal layer can be covered with the resin layer, damage that can be received by the metal layer due to an external force or the like can be suppressed. Further, if the metal layer is provided on the scintillator layer 5 side of the resin layer, deterioration of the characteristics of the scintillator layer 5 due to moisture permeation through the resin layer can be suppressed.
- the moisture-proof cover 7 examples include a sheet containing a metal layer, a sheet containing an inorganic insulating layer, a laminated sheet in which a resin layer and a metal layer are laminated, and a laminated sheet in which a resin layer and an inorganic insulating layer are laminated.
- the inorganic layer of the moisture-proof cover 7 is not limited to the metal layer, but may be an inorganic insulating layer.
- the moisture-proof cover 7 may have both a metal layer and an inorganic insulating layer.
- the inorganic insulating layer can be formed of a layer containing silicon oxide, aluminum oxide, or the like.
- the inorganic insulating layer can be formed by using a sputtering method or the like.
- the thickness of the moisture-proof cover 7 can be determined in consideration of X-ray absorption, rigidity (elastic modulus), and the like. In this case, as the thickness of the moisture-proof cover 7 is increased, the amount of X-rays absorbed by the moisture-proof cover 7 increases. On the other hand, the smaller the thickness of the moisture-proof cover 7, the lower the rigidity of the moisture-proof cover 7, and the more easily the moisture-proof cover 7 is damaged.
- the thickness of the moisture-proof cover 7 is less than 10 ⁇ m, the rigidity of the moisture-proof cover 7 becomes too low, and pinholes may occur in the moisture-proof cover 7 due to damage due to external force or the like, which may cause a leak. If the thickness of the moisture-proof cover 7 exceeds 50 ⁇ m, the rigidity of the moisture-proof cover 7 becomes too high, and the ability to follow the unevenness of the upper end of the scintillator layer 5 deteriorates. Therefore, it may be difficult to confirm the above-mentioned gap and leak path. Further, it may be difficult to follow the deformation of the photoelectric conversion substrate 2.
- the thickness of the moisture-proof cover 7 is preferably 10 ⁇ m or more and 50 ⁇ m or less.
- the moisture-proof cover 7 can be formed of, for example, an aluminum foil having a thickness of 10 to 50 ⁇ m.
- the amount of X-ray transmittance can be increased by about 20 to 30% as compared with the aluminum foil having a thickness of 100 ⁇ m.
- the aluminum foil having a thickness of 10 to 50 ⁇ m is used, the occurrence of the above-mentioned leak can be suppressed, and the above-mentioned gap and leak path can be easily confirmed.
- the moisture-proof cover 7 can follow deformation such as warpage of the photoelectric conversion substrate 2.
- the thickness of the metal such as aluminum is 30 ⁇ m or less.
- the moisture-proof cover 7 contains an aluminum foil of 10 to 30 ⁇ m.
- the moisture-proof cover 7 is an aluminum laminated film containing an aluminum foil having a thickness of 10 to 30 ⁇ m and a resin layer.
- the moisture-proof cover 7 has flexibility and can cope with bending. In that case, the rigidity of the moisture-proof cover 7 is lower than the rigidity of the support substrate 12.
- the flexible moisture-proof cover 7 can contribute to the formation of the flexible X-ray detection module 10 together with the base material 2a.
- the amount of X-ray irradiation to the human body can be suppressed to the minimum necessary. Therefore, in the case of the X-ray detector 1 used in medical treatment, the intensity of the irradiated X-rays may be low, and the intensity of the X-rays transmitted through the moisture-proof cover 7 may be very low. Since the thickness of the aluminum foil of the moisture-proof cover 7 is 10 to 30 ⁇ m, it is possible to take an X-ray image even when the intensity of the irradiated X-ray is low.
- FIG. 4 is a plan view showing a part of the X-ray detector 1, and is a view showing the protruding region PA of the photoelectric conversion substrate 2 in an expanded manner.
- the scintillator layer 5 is provided with an upward-sloping diagonal line
- the sealing portion 8 is provided with a downward-sloping diagonal line.
- FIG. 5 is a cross-sectional view showing a part of the X-ray detector 1 shown in FIG. 4 along the line VV.
- the photoelectric conversion substrate 2 will be described in a state of being extended in the XY plane.
- the base material 2a of the photoelectric conversion substrate 2 includes a main body 2aa, a plurality of protrusions 2ab, and a plurality of protrusions 2ac, and has flexibility.
- the main body 2aa is located in the detection area DA and the non-detection area NDA surrounding the detection area DA.
- the detection region DA is, for example, a quadrangular region
- the non-detection region NDA is, for example, a square frame-shaped region.
- the planar shape of the main body 2aa (the planar shape of the photoelectric conversion substrate 2 located in the detection region DA and the non-detection region NDA) is, for example, a quadrangle.
- At least the detection region DA and the non-detection region NDA of the photoelectric conversion substrate 2 are fixed to the first main surface SU1 of the support substrate 12. Further, at least the main body portion 2aa of the base material 2a is fixed to the first main surface SU1 of the support substrate 12.
- Each protruding portion 2ab protrudes from the side SI1 of the main body portion 2aa, is physically continuously formed from the main body portion 2aa, and is located in the protruding region PAb outside the non-detection region NDA.
- Each protruding portion 2ac protrudes from the side SI2 of the main body portion 2aa, is physically continuously formed from the main body portion 2aa, and is located in the protruding region PAc outside the non-detection region NDA.
- the protruding region PAb of the photoelectric conversion board 2 corresponds to the wiring board 2e1 of the X-ray detection panel PNL
- the protruding region PAc of the photoelectric conversion board 2 corresponds to the wiring board 2e2 of the X-ray detection panel PNL.
- each of the protruding regions PAb and PAc is a quadrangular region, for example, a strip-shaped region.
- the scintillator layer 5 is located at least in the entire detection region DA.
- the light reflecting layer 6 is located at least in the detection region DA. In the present embodiment, the light reflecting layer 6 does not cover the side surface 5a of the scintillator layer 5 at all. However, the light reflecting layer 6 may cover a part of the side surface 5a of the scintillator layer 5, or may cover the entire side surface 5a of the scintillator layer 5.
- the X-ray detector 1 further includes a sealing portion 8.
- the sealing portion 8 is provided around the scintillator layer 5.
- the sealing portion 8 has a frame-like shape and continuously extends around the scintillator layer 5.
- the sealing portion 8 is located in the non-detection region NDA.
- the sealing portion 8 joins the photoelectric conversion substrate 2 (for example, the insulating layer 25) and the moisture-proof cover 7.
- the moisture-proof cover 7 is located in the detection region DA and the non-detection region NDA in the plan view shown in FIG.
- the moisture-proof cover 7 seals the scintillator layer 5 and the light-reflecting layer 6 together with the photoelectric conversion substrate 2.
- the moisture-proof cover 7 seals the scintillator layer 5 and the light reflection layer 6 together with the photoelectric conversion substrate 2 and the sealing portion 8. As shown in FIG. 5, a portion of the scintillator layer 5 that is not covered by the photoelectric conversion substrate 2 and the sealing portion 8 is completely covered with the moisture-proof cover 7.
- the moisture-proof cover 7 is joined to the outer surface 8a of the sealing portion 8.
- the moisture-proof cover 7 covers at least a part of the sealing portion 8. For example, if the moisture-proof cover 7 and the sealing portion 8 are joined in an environment where the pressure is lower than the atmospheric pressure, the moisture-proof cover 7 can be brought into contact with the light reflecting layer 6 or the like.
- the scintillator layer 5 has voids of about 10 to 40% of its volume. Therefore, if the voids contain gas, the gas may expand and the moisture-proof cover 7 may be damaged when the X-ray detector 1 is transported by an aircraft or the like. If the moisture-proof cover 7 and the sealing portion 8 are joined in an environment depressurized from the atmospheric pressure, the X-ray detector 1 may be transported by an aircraft or the like, or the X-ray detector 1 may be used in a high altitude. Even if there is, damage to the moisture-proof cover 7 can be suppressed. From the above, it is preferable that the pressure in the space defined by the sealing portion 8 and the moisture-proof cover 7 is lower than the atmospheric pressure.
- the sealing portion 8 is made of a material containing a thermoplastic resin.
- the sealing portion 8 is made of a material containing a thermoplastic resin as a main component.
- the sealing portion 8 may be made of 100% thermoplastic resin.
- the sealing portion 8 may be formed of a material in which additives are mixed with the thermoplastic resin. If the sealing portion 8 contains a thermoplastic resin as a main component, the sealing portion 8 can be joined to the photoelectric conversion substrate 2 and the moisture-proof cover 7 by heating.
- thermoplastic resin nylon, PET (Polyethyleneterephthalate), polyurethane, polyester, polyvinyl chloride, ABS (Acrylonitrile Butadiene Styrene), acrylic, polystyrene, polyethylene, polypropylene and the like can be used.
- the control circuit 3a is located in the protruding region PAb, and the control circuit 3b is located in the protruding region PAc.
- the control circuit 3a is mounted on the protruding region PAb (wiring board 2e1) of the photoelectric conversion board 2, and the control circuit 3b is mounted on the protruding region PAc (wiring board 2e2) of the photoelectric conversion board 2. Focusing on the control circuit 3a on behalf of the control circuit 3a and the control circuit 3b, in the present embodiment, the control circuit 3a is mounted on the lower surface of the wiring board 2e1 (the surface of the wiring board 2e1 on the support board 12 side). .. However, the control circuit 3a may be mounted on the upper surface of the wiring board 2e1 (the surface of the wiring board 2e1 on the scintillator layer 5 side).
- FIG. 6 is an enlarged cross-sectional view showing the detection region DA, the non-detection region NDA, and the protruding region PAb of the X-ray detection module 10, and is an expanded view showing the protruding region PAb.
- the plurality of photoelectric conversion elements 2b1 are provided above the main body 2aa.
- the photoelectric conversion substrate 2 is physically formed continuously over the detection region DA, the non-detection region NDA, and the protruding region PAb.
- the insulating layers 21 to 25 are physically continuously formed over the detection region DA, the non-detection region NDA, and the protruding region PAb. It is not necessary that all of the insulating layers 21 to 25 are formed in the protruding region PAb of the photoelectric conversion substrate 2.
- FIG. 7 is an enlarged plan view showing the non-detection region NDA and the protruding region PAb of the X-ray detection panel PNL, and is a view showing the protruding region PAb in an expanded manner.
- the control circuit 3a and the connector CN are also shown. Is.
- the X-ray detector 1 includes a connector CN.
- the connector CN is mounted on the wiring board 2e1.
- the photoelectric conversion board 2 includes a plurality of wirings such as a plurality of wirings WL1 and a plurality of wirings WL2, in addition to the plurality of control lines 2c1 and the plurality of data lines 2c2 shown in FIG.
- the wiring WL1 is located above the main body portion 2aa and the protruding portion 2ab of the base material 2a, and is physically continuously formed over the non-detection region NDA and the protruding region PAb.
- the wiring WL2 is located above the protrusion 2ab.
- the wiring WL1 and the wiring WL2 may be located between the insulating layer 21 and the insulating layer 22 shown in FIG. 3, or may be located between the insulating layer 22 and the insulating layer 23.
- Each wiring WL1 is electrically connected to the control line 2c1 on the one hand and electrically to the control circuit 3a on the other hand.
- the wiring WL1 may be formed physically continuously with the control line 2c1.
- Each wiring WL2 is electrically connected to the control circuit 3a on the one hand and electrically to the connector CN on the other hand.
- the wiring WL1, the wiring WL2, and the control line 2c1 may be formed of the same material at the same time.
- control circuit 3a the connector CN, the wiring board 2e1 and the like with reference to FIG. 7 can be applied to the configuration of the wiring board 2e2, the control circuit 3b, the connector mounted on the wiring board 2e2 and the like.
- the plurality of wirings WL1 and the plurality of wirings WL2 are electrically connected to the plurality of photoelectric conversion elements 2b1 via the plurality of TFTs 2b2 and the like.
- the control circuit 3a is a drive circuit, and gives a control signal S1 to the control line 2c1 together with the circuit board 11, drives the control lines 2c1 and the TFT 2b2, and controls the timing of extracting the image data signal S2 from the photoelectric conversion unit 2b.
- the control circuit 3b shown in FIG. 4 is a circuit that reads the image data signal S2, and reads the image data signal S2 from the data line 2c2 together with the circuit board 11.
- the X-ray detector 1 is configured as described above.
- the photoelectric conversion substrate 2 includes a main body portion 2aa and a protruding portion 2ab, 2ac, and is a flexible base material 2a. It has a plurality of photoelectric conversion elements 2b1 and a plurality of wirings WL1.
- the protruding portion 2ab protrudes from the side SI1 of the main body portion 2aa, is physically continuously formed from the main body portion 2aa, and is located in the protruding region PAb.
- a plurality of wiring boards 2e1 and 2e2 function as FPCs. Therefore, the manufacturing process itself for connecting the FPC to the photoelectric conversion substrate 2 (X-ray detection panel PNL) by the thermocompression bonding method can be eliminated. Therefore, it is possible to obtain an X-ray detector 1 capable of shortening the manufacturing time.
- the photoelectric conversion board 2 There is no concern about insufficient adhesive strength, electrical non-conduction, etc. between the photoelectric conversion board 2 and the FPC. Therefore, the photoelectric conversion board 2 with high product reliability can be obtained. Further, it is possible to obtain a photoelectric conversion substrate 2 having a high manufacturing yield.
- the manufacturing time is shortened, and the X-ray detector 1 does not require a separate FPC to connect the photoelectric conversion board 2 and the circuit board 11. Therefore, it is possible to obtain an X-ray detector 1 capable of suppressing the manufacturing cost.
- the X-ray detection panel PNL is a flexible panel.
- the X-ray detection panel PNL is a flexible panel, it is difficult to fix the X-ray detection panel PNL inside the housing 51. Therefore, the X-ray detection panel PNL is supported by the support substrate 12 which is a rigid substrate. As a result, the X-ray detection panel PNL can be easily fixed to the inside of the housing 51 together with the support substrate 12.
- the plurality of wiring boards 2e1 are provided at intervals in the row direction Y.
- the plurality of wiring boards 2e2 are provided at intervals in the row direction X. Since the wiring board 2e has flexibility, from the viewpoint of workability at the time of manufacturing the X-ray detector 1, it is better that the wiring board 2e is divided into a plurality of pieces at intervals as in the present embodiment. desirable. As a result, workability can be improved as compared with the case where a plurality of wiring boards 2e1 are physically connected without a gap or when a plurality of wiring boards 2e2 are physically connected without a gap. ..
- the number of wiring boards 2e1 and the number of wiring boards 2e2 may be 2 or more, respectively.
- FIG. 8 is a plan view showing a part of the X-ray detector 1 according to the present modification 1, and is a view showing the protruding region PA of the photoelectric conversion substrate 2 in an expanded manner.
- the X-ray detector 1 has the same configuration as that of the first embodiment, except for the configuration described in the first modification. As shown in FIG. 8, the plurality of projecting portions of the base material 2a may project from the four side SIs of the main body portion 2aa.
- the protruding portion 2ab protrudes from the side SI3 of the main body portion 2aa, is physically continuously formed from the main body portion 2aa, and is located in the protruding region PAb outside the non-detection region NDA.
- the X-ray detection panel PNL photoelectric conversion board 2 has a plurality of wiring boards 2e1 including protrusions 2ab on both sides of the main body 2aa in the row direction X.
- a control circuit 3a is mounted on each wiring board 2e1.
- the protruding portion 2ac protrudes from the side SI4 of the main body portion 2aa, is physically continuously formed from the main body portion 2aa, and is located in the protruding region PAc outside the non-detection region NDA.
- the X-ray detection panel PNL photoelectric conversion board 2
- the control circuit 3b is mounted on each wiring board 2e2. Also in the present modification 1, the same effect as that of the first embodiment can be obtained.
- the number of wiring boards 2e1 on the side SI1 side, the number of wiring boards 2e2 on the side SI2 side, the number of wiring boards 2e1 on the side SI3 side, and the number of wiring boards 2e2 on the side SI4 side are 2 or more, respectively. good.
- FIG. 9 is a plan view showing a part of the X-ray detector 1 according to the present modification 2, and is a view showing the protruding region PA of the photoelectric conversion substrate 2 in an expanded manner.
- the X-ray detector 1 has the same configuration as that of the first embodiment, except for the configuration described in the second modification. As shown in FIG. 9, the X-ray detector 1 may be configured without the plurality of wiring boards 2e1 and the plurality of control circuits 3a. Further, the control line 2c1 is electrically connected to the wiring board 2e2.
- the control circuit 3b also functions as a drive circuit for driving the control line 2c1.
- the plurality of projecting portions may only project from one side (side SI2) of the main body portion 2aa. Also in the second modification, the same effect as that of the first embodiment can be obtained.
- the number of wiring boards 2e2 may be 2 or more.
- FIG. 10 is a plan view showing a part of the X-ray detector 1 according to the third modification.
- the X-ray detector 1 has the same configuration as that of the first embodiment, except for the configuration described in the third modification.
- the photoelectric conversion board 2 has a single wiring board 2e1 on the side SI1 side of the main body 2aa.
- Three control circuits 3a are mounted on the wiring board 2e1.
- the number of control circuits 3a is not limited to three, and various modifications can be made.
- the photoelectric conversion board 2 On the side SI2 side of the main body 2aa, the photoelectric conversion board 2 has a single wiring board 2e2. Three control circuits 3b are mounted on the wiring board 2e2. However, the number of control circuits 3b is not limited to three, and various modifications can be made.
- the configuration of the wiring board 2e1 of the present modification 3 corresponds to a configuration in which a plurality of wiring boards 2e1 shown in FIG. 4 are physically connected without intervals. Further, the configuration of the wiring board 2e2 of the present modification 3 corresponds to a configuration in which a plurality of wiring boards 2e2 shown in FIG. 4 are physically connected without intervals.
- the X-ray detector 1 does not require an FPC for connecting the photoelectric conversion board 2 and the circuit board 11, the same effect as that of the first embodiment can be obtained.
- FIG. 11 is a cross-sectional view showing a part of the X-ray detector 1 according to the second embodiment, and is a view showing the protruding region PAb of the photoelectric conversion substrate 2 in an expanded manner.
- the X-ray detector 1 has the same configuration as the first embodiment except for the configuration described in the present embodiment.
- the scintillator layer 5 does not have to be directly formed on the photoelectric conversion substrate 2.
- the X-ray detector 1 includes a support substrate 12, a photoelectric conversion substrate 2, a control circuit 3a, a scintillator panel SP, and the like.
- the scintillator panel SP includes a substrate 15, a light reflecting layer 16, a scintillator layer 5, and a moisture-proof body 17.
- the substrate 15 is located in the detection region DA and the non-detection region NDA, and is formed of CFRP.
- CFRP is a material having high X-ray transmittance.
- the scintillator layer 5 is located between the substrate 15 and the photoelectric conversion substrate 2.
- the scintillator layer 5 faces the substrate 15 with a gap.
- the scintillator layer 5 is located at least in the detection region DA. In the present embodiment, the scintillator layer 5 is located in the detection region DA and the non-detection region NDA.
- the light reflecting layer 16 is provided between the substrate 15 and the scintillator layer 5.
- the light reflecting layer 16 is located in the detection region DA and the non-detection region NDA.
- the light reflecting layer 16 is provided to increase the utilization efficiency of fluorescence and improve the sensitivity characteristics. That is, the light reflecting layer 16 has a function of reflecting the fluorescence converted by the scintillator layer 5. Since the light reflecting layer 16 reflects the light directed to the side opposite to the photoelectric conversion substrate 2, the amount of the light directed to the photoelectric conversion unit 2b can be improved.
- the moisture-proof body 17 encloses the substrate 15, the light-reflecting layer 16, and the scintillator layer 5.
- the moisture-proof body 17 airtightly closes the scintillator layer 5 together with the light-reflecting layer 16.
- the moisture-proof body 17 is formed of, for example, an organic material such as a poly-para-xylylene resin by using a chemical vapor deposition (CVD) method.
- the moisture-proof body 17 formed of the polyparaxylylene resin can be referred to as an organic film.
- the X-ray detector 1 further includes an adhesive layer AL.
- the adhesive layer AL is located between the photoelectric conversion substrate 2 and the scintillator panel SP. Specifically, the adhesive layer AL is adhered to the insulating layer 25 of the photoelectric conversion substrate 2 and the moisture-proof body 17 of the scintillator panel SP, respectively. The photoelectric conversion substrate 2 and the scintillator panel SP are bonded by the adhesive layer AL.
- the photoelectric conversion board 2 is configured in the same manner as the photoelectric conversion board 2 of the first embodiment. Therefore, the same effect as that of the first embodiment can be obtained in the second embodiment.
- FIG. 12 is an enlarged cross-sectional view showing a non-detection region NDA of the X-ray detection module 10 of the X-ray detector 1 according to this comparative example and a region around the non-detection region NDA.
- the X-ray detector 1 has the same configuration as that of the first embodiment, except for the configuration described in this comparative example.
- the X-ray detection panel PNL (photoelectric conversion board 2) is formed without the wiring board 2e.
- the base material 2a is formed without protrusions 2ab and 2ac.
- the photoelectric conversion substrate 2 further has a pad 2d.
- Pad 2d is located in the non-detection region NDA.
- the pad 2d is formed on the insulating layer 23 and is not covered with the insulating layers 24 and 25.
- the pad 2d is electrically connected to, for example, the control line 2c1.
- the X-ray detector 1 further includes an FPC 20.
- the FPC 20 is fixed to the photoelectric conversion substrate 2 (X-ray detection panel PNL) by the connecting material AD by using a thermocompression bonding method, and is electrically connected to the pad 2d.
- the above-mentioned technique is not limited to the application to the photoelectric conversion substrate 2, but can be applied to other photoelectric conversion substrates. Further, the above-mentioned technique is not limited to the application to the above-mentioned X-ray detector 1, and can be applied to other X-ray detectors and various radiation detectors.
- the radiation detector may include a radiation detection panel for detecting radiation instead of the X-ray detection panel PNL.
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Abstract
Description
上記FPCは、熱圧着により光電変換基板に接続されている。
本体部及び突出部を含み可撓性を持つ基材と、複数の光電変換素子と、複数の配線と、を備え、
前記本体部は、検出領域及び前記検出領域を囲んだ非検出領域に位置し、前記突出部は、前記本体部の辺から突出し前記本体部から物理的に連続して形成され前記非検出領域の外側の突出領域に位置し、前記複数の光電変換素子は、前記本体部の上方に設けられ前記検出領域に位置し、前記複数の配線は、前記本体部及び前記突出部の上方に位置し前記複数の光電変換素子に電気的に接続されている。
放射線検出器としてのX線検出器は、X線検出パネルを備えている。X線検出パネルにおいて、光電変換基板の基材はガラスで形成されている。ところで、最近では、光電変換基板の基材に、可撓性を持ち湾曲可能である基材の適用を試みる技術開発が進められている。基材の材料としては、例えば樹脂である。樹脂製の基材は、ガラス製の基材に比べて、軽量であり、湾曲可能であるため、衝撃に強い、及び割れにくい、と言う特徴を有している。
まず、第1の実施形態について説明する。図1は、第1の実施形態に係るX線検出器1を示す断面図である。X線検出器1は、X線画像検出器であり、X線検出パネルを利用するX線平面検出器である。
筐体51の内面には、スペーサ9c,9dを介して回路基板11が固定されている。スペーサ9c,9dを使用することで、主に金属で構成される筐体51から回路基板11までの電気的絶縁距離を保持することができる。筐体51は、回路基板11及びスペーサ9a,9b,9c,9dを介して支持基板12等を支持している。
なお、配線基板2e1は、光電変換基板2のうち、後述する突出部2ab、複数の配線WL1,WL2等が位置する領域である。
図3に示すように、光電変換基板2は、基材2a、複数の光電変換部2b、絶縁層21,22,23,24,25を有している。複数の光電変換部2bは、検出領域DAに位置している。各々の光電変換部2bは、光電変換素子2b1と、TFT2b2と、を備えている。
基材2aはフレキシブル基板(又は、フレキシブル層)であるのに対し、支持基板12はリジッド基板である。支持基板12は、基材2aの剛性より高い剛性を持っている。本実施形態において、支持基板12の弾性率は、基材2aの弾性率より高い。
絶縁層21は、基材2aの上に設けられている。絶縁層21の上に、ゲート電極GEが形成されている。ゲート電極GEは、上記制御ライン2c1に電気的に接続されている。絶縁層22は、絶縁層21及びゲート電極GEの上に設けられている。半導体層SCは、絶縁層22の上に設けられ、ゲート電極GEに対向している。半導体層SCは、非晶質半導体としての非晶質シリコン、多結晶半導体としての多結晶シリコン等の半導体材料で形成されている。
なお、光電変換素子2b1は、シンチレータ層5から入射される光を電荷に変換する。変換された電荷は光電変換素子2b1に蓄積される。TFT2b2は、光電変換素子2b1への蓄電及び光電変換素子2b1からの放電を切替えることができる。なお、光電変換素子2b1の自己容量が不十分である場合、光電変換基板2はコンデンサ(キャパシタ)をさらに有し、光電変換素子2b1で変換された電荷をコンデンサに蓄積してもよい。
なお、光電変換基板2の突出領域PAbはX線検出パネルPNLの配線基板2e1に相当し、光電変換基板2の突出領域PAcはX線検出パネルPNLの配線基板2e2に相当している。また、本実施形態において、各々の突出領域PAb,PAcは、四角形の領域であり、例えば短冊形の領域である。
図6に示すように、複数の光電変換素子2b1は、本体部2aaの上方に設けられている。光電変換基板2は、検出領域DA、非検出領域NDA、及び突出領域PAbにわたって物理的に連続して形成されている。光電変換基板2において、基材2aだけではなく、絶縁層21乃至25に関しても検出領域DA、非検出領域NDA、及び突出領域PAbにわたって物理的に連続して形成されている。なお、光電変換基板2の突出領域PAbにおいて、絶縁層21乃至25の全てが形成されていなくともよい。
図7に示すように、X線検出器1は、コネクタCNを備えている。コネクタCNは、配線基板2e1に実装されている。光電変換基板2は、複数の配線WL1、複数の配線WL2等、図2に示した複数の制御ライン2c1及び複数のデータライン2c2以外にも複数の配線を備えている。
一方、図4に示した制御回路3bは、画像データ信号S2を読み取る回路であり、回路基板11とともにデータライン2c2から画像データ信号S2を読み取る。
X線検出器1は、上記のように構成されている。
なお、配線基板2e1の個数及び配線基板2e2の個数は、それぞれ2以上であればよい。
次に、上記第1の実施形態の変形例1について説明する。図8は、本変形例1に係るX線検出器1の一部を示す平面図であり、光電変換基板2の突出領域PAを展開して示した図である。X線検出器1は、本変形例1で説明する構成以外、上記第1の実施形態と同様に構成されている。
図8に示すように、基材2aの複数の突出部は、本体部2aaの4つの辺SIから突出してもよい。
本変形例1においても、上記第1の実施形態と同様の効果を得ることができる。
次に、上記第1の実施形態の変形例2について説明する。図9は、本変形例2に係るX線検出器1の一部を示す平面図であり、光電変換基板2の突出領域PAを展開して示した図である。X線検出器1は、本変形例2で説明する構成以外、上記第1の実施形態と同様に構成されている。
図9に示すように、X線検出器1は、複数の配線基板2e1及び複数の制御回路3a無しに構成されてもよい。配線基板2e2に、さらに、制御ライン2c1が電気的に接続されている。制御回路3bは、さらに、制御ライン2c1を駆動する駆動回路としても機能している。
なお、配線基板2e2の個数は、2以上であればよい。
次に、上記第1の実施形態の変形例3について説明する。図10は、本変形例3に係るX線検出器1の一部を示す平面図である。X線検出器1は、本変形例3で説明する構成以外、上記第1の実施形態と同様に構成されている。
図10に示すように、本体部2aaの辺SI1側において、光電変換基板2は、単個の配線基板2e1を有している。配線基板2e1に3個の制御回路3aが実装されている。但し、制御回路3aの個数は3個に限定されるものではなく、種々変形可能である。
次に、第2の実施形態について説明する。図11は、第2の実施形態に係るX線検出器1の一部を示す断面図であり、光電変換基板2の突出領域PAbを展開して示した図である。X線検出器1は、本実施形態で説明する構成以外、上記第1の実施形態と同様に構成されている。
シンチレータ層5は、基板15と光電変換基板2との間に位置している。シンチレータ層5は、基板15に隙間を設けて対向している。シンチレータ層5は、少なくとも検出領域DAに位置している。本実施形態において、シンチレータ層5は、検出領域DA及び非検出領域NDAに位置している。
次に、上記第1の実施形態の比較例について説明する。図12は、本比較例に係るX線検出器1のX線検出モジュール10の非検出領域NDAとその周辺の領域を示す拡大断面図である。X線検出器1は、本比較例で説明する構成以外、上記第1の実施形態と同様に構成されている。
光電変換基板2は、パッド2dをさらに有している。パッド2dは非検出領域NDAに位置している。パッド2dは、絶縁層23の上に形成され、絶縁層24,25で覆われていない。パッド2dは、例えば制御ライン2c1に電気的に接続されている。
Claims (3)
- 本体部及び突出部を含み可撓性を持つ基材と、
複数の光電変換素子と、
複数の配線と、を備え、
前記本体部は、検出領域及び前記検出領域を囲んだ非検出領域に位置し、
前記突出部は、前記本体部の辺から突出し前記本体部から物理的に連続して形成され前記非検出領域の外側の突出領域に位置し、
前記複数の光電変換素子は、前記本体部の上方に設けられ前記検出領域に位置し、
前記複数の配線は、前記本体部及び前記突出部の上方に位置し前記複数の光電変換素子に電気的に接続されている、
光電変換基板。 - 前記突出領域に位置し前記複数の配線に電気的に接続された制御回路をさらに備える、
請求項1に記載の光電変換基板。 - 前記突出部及び前記複数の配線が位置する前記突出領域は、180°湾曲可能である、
請求項1に記載の光電変換基板。
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JP2012118050A (ja) * | 2010-11-09 | 2012-06-21 | Fujifilm Corp | 放射線撮影装置 |
JP2013253887A (ja) * | 2012-06-07 | 2013-12-19 | Canon Inc | 放射線撮影装置、放射線撮影システム |
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