WO2022144668A1 - 表示装置 - Google Patents

表示装置 Download PDF

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Publication number
WO2022144668A1
WO2022144668A1 PCT/IB2021/061812 IB2021061812W WO2022144668A1 WO 2022144668 A1 WO2022144668 A1 WO 2022144668A1 IB 2021061812 W IB2021061812 W IB 2021061812W WO 2022144668 A1 WO2022144668 A1 WO 2022144668A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
insulating layer
light emitting
conductive layer
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2021/061812
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
柳澤悠一
笹川慎也
浜田崇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to US18/266,645 priority Critical patent/US20240057403A1/en
Priority to JP2022572813A priority patent/JPWO2022144668A1/ja
Publication of WO2022144668A1 publication Critical patent/WO2022144668A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/124—Insulating layers formed between TFT elements and OLED elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]

Definitions

  • the conductive layer 114R, the conductive layer 114G, and the conductive layer 114B may also be described as the conductive layer 114 in the same manner.
  • the conductive layer 114R is included in the light emitting element 120R.
  • the conductive layer 114G is included in the light emitting element 120G, and the conductive layer 114B is included in the light emitting element 120B.
  • the EL layer 115 and the conductive layer 116 are processed so as to be continuous without being divided between pixels exhibiting the same color.
  • the EL layer 115 and the conductive layer 116 can be processed into stripes.
  • a predetermined potential can be applied without the conductive layers 116 of all the light emitting elements being in a floating state.
  • both the conductive layer 111a and the conductive layer 111b may use materials and configurations selected from the materials and configurations that can be used for the conductive layer 111 listed above.
  • tandem structure a configuration in which a plurality of light emitting units (EL layers 115a and 115b) are connected in series via an intermediate layer (charge generation layer) 4440 is referred to as a tandem structure in the present specification.
  • the configuration as shown in FIG. 16C is referred to as a tandem structure, but the structure is not limited to this, and for example, the tandem structure may be referred to as a stack structure.
  • the tandem structure can be used as a light emitting element capable of high-luminance light emission.
  • the thin film constituting the display device when processing the thin film constituting the display device, it can be processed by using a photolithography method or the like.
  • the thin film may be processed by a nanoimprint method, a sandblast method, a lift-off method, or the like.
  • an island-shaped thin film may be directly formed by a film forming method using a shielding mask such as a metal mask.
  • a colored layer 165R that overlaps with the light emitting element 120R, a colored layer 165G that overlaps with the light emitting element 120G, and a colored layer 165B that overlaps with the light emitting element 120B are provided.
  • the colored layer 165R transmits red light
  • the colored layer 165G transmits green light
  • the colored layer 165B transmits blue light.
  • the color purity of the light from each light emitting element can be increased, and a display device having higher display quality can be realized.
  • the positioning of each light emitting unit and each colored layer is easier and extremely high as compared with the case where the colored layer is formed on the substrate 202 described later. A fine display device can be realized.
  • the colored layer 165R, the colored layer 165G, and the colored layer 165B may not be provided.
  • An insulating layer 261 is provided so as to cover the transistor 210, and a conductive layer 251 is provided on the insulating layer 261. Further, an insulating layer 262 is provided so as to cover the conductive layer 251, and a conductive layer 252 is provided on the insulating layer 262. The conductive layer 251 and the conductive layer 252 each function as wiring. Further, an insulating layer 263 and an insulating layer 232 are provided so as to cover the conductive layer 252, and a transistor 220 is provided on the insulating layer 232. Further, an insulating layer 265 is provided so as to cover the transistor 220, and a capacitive element 240 is provided on the insulating layer 265. The capacitive element 240 and the transistor 220 are electrically connected by a plug 274.
  • the nitrogen concentration obtained by the secondary ion mass spectrometry in the semiconductor layer is preferably 5 ⁇ 10 18 atoms / cm 3 or less.
  • hydrogen contained in an oxide semiconductor reacts with oxygen bonded to a metal atom to become water, which may form an oxygen deficiency.
  • oxygen deficiency When hydrogen enters the oxygen deficiency, electrons that are carriers may be generated.
  • a part of hydrogen may be combined with oxygen that is bonded to a metal atom to generate an electron as a carrier. Therefore, a transistor using an oxide semiconductor containing hydrogen tends to have a normally-on characteristic. Therefore, it is preferable that hydrogen in the channel forming region of the oxide semiconductor is reduced as much as possible.
  • the semiconductor layer is two or more of the CAAC-OS region, the polycrystalline oxide semiconductor region, the nc-OS region, the pseudo-amorphous oxide semiconductor region, and the amorphous oxide semiconductor region. It may be a mixed film having.
  • the mixed film may have, for example, a single-layer structure or a laminated structure including any two or more of the above-mentioned regions.
  • the pixel circuit unit 283 has a plurality of pixel circuits 283a arranged periodically.
  • the plurality of pixel circuits 283a may be arranged in a delta arrangement as shown in FIG. 11B. Since the delta array can arrange the pixel circuits at high density, it is possible to provide a high-definition display device.
  • the display device shown in FIG. 12A has a pixel unit 502, a drive circuit unit 504, a protection circuit 506, and a terminal unit 507.
  • the display device according to one aspect of the present invention may be configured not to be provided with the protection circuit 506.
  • the pixel circuit 400 can hold the potential of the node N1 by turning off the transistor M1. Further, by turning off the transistor M2, the potential of the node N2 can be maintained. Further, by writing a predetermined potential to the node N1 via the transistor M1 with the transistor M2 turned off, the potential of the node N2 is corresponding to the displacement of the potential of the node N1 by the capacitive coupling via the capacitance C1. Can be changed.
  • FIG. 13B is a timing chart relating to the operation of the pixel circuit 400.
  • the effects of various resistances such as wiring resistance, parasitic capacitance such as transistors or wiring, and threshold voltage of transistors are not considered here.
  • the housing 702 has a mechanism that can adjust the angle of the reflector 712. By changing the angle of the reflector 712, it is possible to change the position of the display area 706 in which the image is displayed. This makes it possible to arrange the display area 706 at an optimum position according to the position of the user's eyes.
  • FIG. 18B is a concentration profile of oxygen isotopes ( 18 O) in the depth direction of each sample.
  • the horizontal axis indicates the depth [nm] from the upper surface of the silicon nitride film 20, and the vertical axis indicates the concentration [atoms / cm 3 ] of the oxygen isotope ( 18 O) in the film.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
PCT/IB2021/061812 2020-12-29 2021-12-16 表示装置 Ceased WO2022144668A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US18/266,645 US20240057403A1 (en) 2020-12-29 2021-12-16 Display device
JP2022572813A JPWO2022144668A1 (https=) 2020-12-29 2021-12-16

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-219828 2020-12-29
JP2020219828 2020-12-29

Publications (1)

Publication Number Publication Date
WO2022144668A1 true WO2022144668A1 (ja) 2022-07-07

Family

ID=82260571

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PCT/IB2021/061812 Ceased WO2022144668A1 (ja) 2020-12-29 2021-12-16 表示装置

Country Status (3)

Country Link
US (1) US20240057403A1 (https=)
JP (1) JPWO2022144668A1 (https=)
WO (1) WO2022144668A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12262623B2 (en) 2021-06-30 2025-03-25 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of display device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012190682A (ja) * 2011-03-11 2012-10-04 Sony Corp 有機ｅｌ表示装置および電子機器
WO2014171056A1 (ja) * 2013-04-19 2014-10-23 パナソニック株式会社 薄膜半導体装置、有機ｅｌ表示装置、及びそれらの製造方法
WO2014192221A1 (ja) * 2013-05-29 2014-12-04 パナソニック株式会社 薄膜トランジスタ装置とその製造方法、および表示装置
KR20150101418A (ko) * 2014-02-24 2015-09-03 엘지디스플레이 주식회사 표시장치
JP2016004760A (ja) * 2014-06-19 2016-01-12 株式会社Ｊｏｌｅｄ 有機発光デバイスおよび有機表示装置
JP2018021993A (ja) * 2016-08-02 2018-02-08 株式会社ジャパンディスプレイ 半導体基板及びそれを用いた表示装置
JP2018087906A (ja) * 2016-11-29 2018-06-07 株式会社ジャパンディスプレイ 表示装置
JP2018116236A (ja) * 2017-01-20 2018-07-26 株式会社ジャパンディスプレイ 表示装置
WO2019215530A1 (ja) * 2018-05-11 2019-11-14 株式会社半導体エネルギー研究所 表示装置、及び表示装置の作製方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102582740B1 (ko) * 2014-05-30 2023-09-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 이의 제조 방법, 및 전자 장치
CN111192884A (zh) * 2020-02-21 2020-05-22 深圳市华星光电半导体显示技术有限公司 Oled显示装置及tft阵列基板的制备方法
KR102927098B1 (ko) * 2020-05-25 2026-02-12 삼성디스플레이 주식회사 폴더블 디스플레이 장치, 롤러블 디스플레이 장치, 및 디스플레이 장치
US12295220B2 (en) * 2020-09-09 2025-05-06 Samsung Display Co., Ltd. Display device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012190682A (ja) * 2011-03-11 2012-10-04 Sony Corp 有機ｅｌ表示装置および電子機器
WO2014171056A1 (ja) * 2013-04-19 2014-10-23 パナソニック株式会社 薄膜半導体装置、有機ｅｌ表示装置、及びそれらの製造方法
WO2014192221A1 (ja) * 2013-05-29 2014-12-04 パナソニック株式会社 薄膜トランジスタ装置とその製造方法、および表示装置
KR20150101418A (ko) * 2014-02-24 2015-09-03 엘지디스플레이 주식회사 표시장치
JP2016004760A (ja) * 2014-06-19 2016-01-12 株式会社Ｊｏｌｅｄ 有機発光デバイスおよび有機表示装置
JP2018021993A (ja) * 2016-08-02 2018-02-08 株式会社ジャパンディスプレイ 半導体基板及びそれを用いた表示装置
JP2018087906A (ja) * 2016-11-29 2018-06-07 株式会社ジャパンディスプレイ 表示装置
JP2018116236A (ja) * 2017-01-20 2018-07-26 株式会社ジャパンディスプレイ 表示装置
WO2019215530A1 (ja) * 2018-05-11 2019-11-14 株式会社半導体エネルギー研究所 表示装置、及び表示装置の作製方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12262623B2 (en) 2021-06-30 2025-03-25 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of display device

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Publication number Publication date
JPWO2022144668A1 (https=) 2022-07-07
US20240057403A1 (en) 2024-02-15

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