WO2022138400A1 - 被覆工具および切削工具 - Google Patents
被覆工具および切削工具 Download PDFInfo
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- WO2022138400A1 WO2022138400A1 PCT/JP2021/046379 JP2021046379W WO2022138400A1 WO 2022138400 A1 WO2022138400 A1 WO 2022138400A1 JP 2021046379 W JP2021046379 W JP 2021046379W WO 2022138400 A1 WO2022138400 A1 WO 2022138400A1
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- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5463—Particle size distributions
- C04B2235/5472—Bimodal, multi-modal or multi-fraction
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
- C04B2235/604—Pressing at temperatures other than sintering temperatures
Definitions
- This disclosure relates to covering tools and cutting tools.
- a coated tool with improved wear resistance by coating the surface of a substrate such as cemented carbide, cermet, or ceramic with a coating film is known.
- a coating tool in which a part of the coating film is removed to expose a part of the substrate see Patent Document 2.
- the covering tool is a covering tool having a substrate and a coating film located on the substrate.
- the covering tool has a first surface having a rake face, a second surface having a flank surface, and a third surface located between the first surface and the second surface, which is a C surface or an R surface.
- the coating film has at least one of a first coating film located on the first surface and a second coating film located on the second surface, and a third coating film located on the third surface.
- the wave number of the maximum Raman peak of the first coating film is defined as the first wave number
- the wave number of the maximum Raman peak of the second coating film is defined as the second wave number
- the wave number of the maximum Raman peak of the third coating film is the third wave number.
- the third wavenumber is smaller than the first and second wavenumbers.
- the cutting tool according to one aspect of the present disclosure has a rod-shaped holder having a pocket at the end and the above-mentioned covering tool located in the pocket.
- FIG. 1 is a perspective view showing an example of a covering tool according to an embodiment.
- FIG. 2 is a side sectional view showing an example of a covering tool according to an embodiment.
- FIG. 3 is a schematic enlarged view of Part III shown in FIG.
- FIG. 4 is a schematic enlarged view of the IV part shown in FIG.
- FIG. 5 is a schematic enlarged view of the V portion shown in FIG.
- FIG. 6 is a front view showing an example of a cutting tool according to an embodiment.
- FIG. 7 is a graph showing the results of Raman spectroscopic analysis for the covering tool according to the embodiment.
- FIG. 8 is a graph showing the results of Raman spectroscopic analysis for the covering tool according to Comparative Example 1.
- a coating tool with improved wear resistance by coating the surface of a substrate such as cemented carbide, cermet, or ceramic with a coating film is known. There is room for further improvement in this type of covering tool in terms of improving durability.
- FIG. 1 is a perspective view showing an example of a covering tool according to an embodiment.
- the covering tool 1 according to the embodiment has a tip main body 2 and a cutting edge portion 3.
- the covering tool 1 according to the embodiment has, for example, a hexahedron shape in which the shapes of the upper surface and the lower surface (the surface intersecting the Z axis shown in FIG. 1) are parallelograms.
- the chip body 2 is formed of, for example, a cemented carbide.
- the cemented carbide contains W (tungsten), specifically WC (tungsten carbide). Further, the cemented carbide may contain at least one of Ni (nickel) and Co (cobalt).
- the chip body 2 may be formed of cermet.
- the cermet contains, for example, Ti (titanium), specifically TiC (titanium carbide) or TiN (titanium nitride). Further, the cermet may contain Ni or Co.
- a seat surface 4 for attaching the cutting edge portion 3 is located at the corner portion of the chip body 2. Further, a through hole 5 that vertically penetrates the chip body 2 is located at the center of the chip body 2. A screw 75 for attaching the covering tool 1 to the holder 70, which will be described later, is inserted into the through hole 5 (see FIG. 6).
- Cutting edge 3 is integrated with the chip main body 2 by being attached to the seat surface 4 of the chip main body 2.
- the cutting edge portion 3 has a first surface 6 (here, an upper surface) and a second surface 7 (here, a side surface) connected to the first surface 6.
- the first surface 6 functions as a "rake surface” for scooping chips generated by cutting
- the second surface 7 functions as a "floating surface”.
- the cutting edge 8 is located at least a part of the ridgeline where the first surface 6 and the second surface 7 intersect.
- the covering tool 1 cuts the work material by hitting the cutting edge 8 against the work material.
- FIG. 2 is a side sectional view showing an example of the covering tool 1 according to the embodiment.
- the cutting edge portion 3 has a substrate 10 and a coating film 20.
- the substrate 10 contains a plurality of boron nitride particles.
- the substrate 10 is a cubic boron nitride (cBN) material sintered body, and is composed of a boron nitride material sintered body containing a plurality of cubic boron nitride particles.
- the substrate 10 may have a bonded phase containing TiN, Al, Al2O3 , etc. between the plurality of boron nitride particles.
- the plurality of boron nitride particles are firmly bonded by such a bonded phase.
- the substrate 10 does not necessarily have to have a bound phase.
- the cutting edge 8 has a third surface 9 that is continuous with the first surface 6 and the second surface 7.
- the third surface 9 is, for example, a C surface (Chamfer surface) in which the corners of the first surface 6 and the second surface 7 are cut diagonally and linearly.
- the third surface 9 may be an R surface (round surface) in which the corners of the first surface 6 and the second surface 7 are rounded.
- the coating film 20 is coated on the substrate 10 for the purpose of improving the wear resistance, heat resistance, etc. of the cutting edge portion 3, for example.
- the coating film 20 is located on both the chip main body 2 and the cutting edge portion 3, but the coating film 20 may be located at least on the substrate 10.
- the coating film 20 is located on the side surface of the substrate 10 corresponding to the second surface 7 of the cutting edge portion 3, the wear resistance and heat resistance of the second surface 7 are high.
- the coating film 20 has a third coating film located on the third surface 9. Further, the coating film 20 has at least one of a first coating film located on the first surface 6 and a second coating film located on the second surface 7. The coating film 20 may have both a first coating film and a second coating film.
- FIG. 3 is a schematic enlarged view of Part III shown in FIG.
- the coating film 20 has a second coating film and a third coating film, and does not have a first coating film.
- the covering film 20 has a second covering film 202 located on the second surface 7 and a third covering film 203 located on the third surface 9.
- the boundary line between the second coating film 202 and the third coating film 203 is defined by, for example, a virtual line L extending in parallel with the first surface 6 from the boundary between the second surface 7 and the third surface 9. May be done.
- the wave number of the maximum Raman peak of the second coating film 202 is defined as the second wave number
- the wave number of the maximum Raman peak of the third coating film 203 is defined as the third wave number.
- the “maximum wave number of Raman peak” means that the scattering intensity is maximum in the Raman spectrum obtained by irradiating the surface of the coating film 20 (here, the second coating film 202 or the third coating film 203) with a laser beam. It is the wave number that becomes the value.
- the coating film on the third surface 9 located at the corner is thicker than that on the first surface 6 and the second surface 7.
- the wave number of the maximum Raman peak of the coating film located on the third surface 9 is larger than the wave number of the maximum Raman peak of the first surface 6 and the second surface 7. That is, the residual stress of the coating film on the third surface is larger than the residual stress of the coating film on the first surface 6 and the second surface 7. Therefore, the coating film on the third surface 9 is easily broken.
- the third wave number which is the wave number of the maximum Raman peak of the third covering film 203
- the second wave number which is the wave number of the maximum Raman peak of the second covering film 202.
- the third coating film 203 has a smaller residual stress than the second coating film 202, and is less likely to peel or crack. Therefore, the covering tool 1 having the third covering film 203 has high durability.
- the third wavenumber may be 1 cm -1 or more smaller than the second wavenumber. Further, the third wave number may be 3 cm -1 or more smaller than the second wave number. In this case, the durability of the covering tool 1 can be further improved.
- the thickness of the coating film on the third surface 9 may be thinner than the thickness of the coating film on the first surface 6 and the second surface 7.
- the substrate 10 may be exposed on the first surface 6.
- the coating film 20 does not have to be present on the first surface 6.
- the covering film 20 is located on the second surface 7 and the third surface 9.
- the inventor of the present application has not provided the coating film 20 on the first surface 6 as compared with the case where the coating film 20 is provided on the first surface 6 corresponding to the rake surface. It was clarified that the fracture resistance of the covering tool 1 was improved. The reason for this may be, for example, that when the coating film 20 is destroyed, the substrate 10 as a base material is damaged.
- the covering tool 1 according to the embodiment, the second surface 7 corresponding to the flank and the third surface 9 corresponding to the cutting edge 8 are covered with the coating film 20, and the first surface 6 corresponding to the rake surface is covered. I decided to expose it.
- the covering tool 1 having such a configuration has high fracture resistance.
- the covering tool 1 has a covering film 20 on the second surface 7 corresponding to the flank and the third surface 9 corresponding to the cutting edge 8.
- the covering tool 1 having such a configuration has high wear resistance and heat resistance.
- the covering tool 1 may have a covering film 20 on at least the second surface 7.
- the thickness of the coating film 20 (third coating film 203) on the third surface 9 may be thinner than the thickness of the coating film 20 (third coating film 203) on the second surface 7.
- the thickness of the coating film 20 on the second surface 7 may be 0.5 ⁇ m or more and 5.0 ⁇ m or less.
- the thickness of the coating film 20 on the third surface 9 may be 0.01 ⁇ m or more and less than 5.0 ⁇ m.
- the thickness of the coating film 20 on the second surface 7 is 0.5 ⁇ m or more and 5.0 ⁇ m or less (0.01 ⁇ m or more and less than 5.0 ⁇ m)" means that the thickness of the coating film 20 on the second surface 7 is It means that both the minimum value and the maximum value of are within the range of 0.5 ⁇ m or more and 5.0 ⁇ m or less (0.01 ⁇ m or more and less than 5.0 ⁇ m).
- the thickness of the coating film 20 on the third surface 9 may be thinner in the region close to the first surface 6 than in the region close to the second surface 7.
- the thickness of the coating film 20 located on the third surface 9 may be gradually increased from the first surface 6 to the second surface 7.
- the covering tool 1 having such a configuration has a good balance of chipping resistance, wear resistance, and heat resistance.
- the first surface 6 may be covered with the coating film 20.
- the coating film 20 may cover the first surface 6, the second surface 7, and the third surface 9.
- the third wave number is the first wave number. And it may be 1 cm -1 or more smaller than the second wave number. In this case, the durability of the covering tool 1 can be improved. Further, the third wave number may be 3 cm -1 or more smaller than the first wave number and the second wave number. In this case, the durability of the covering tool 1 can be further improved.
- the coating film 20 may cover the first surface 6 and the third surface 9. That is, the substrate 10 may be exposed on the second surface 7.
- the first surface 6 or the second surface 7 is masked or the like.
- the substrate 10 on the first surface 6 or the second surface 7 may be exposed. Further, after forming the coating film on the first surface 6, the second surface 7, and the third surface, the coating film coated on the first surface 6 or the second surface 7 may be removed.
- the coating film on the third surface 9 may be formed to be thinner than the other surfaces by using a shielding plate or the like. Further, the coating layer on the third surface 9 may be made thinner than the coating layer on the other surface by forming a coating film on the third surface 9 and then removing a part of the coating film.
- the thickness of the third coating film 203 is thinner than the thickness of the second coating film 202
- the thickness of the third coating film 203 is the thickness of the second coating film 202. It may be the same as the thickness.
- the difference in the coefficient of thermal expansion between the third coating film and the substrate 10 is increased. It may be smaller than the difference in the coefficient of thermal expansion between the first coating film 201 and the second coating film 202 and the substrate 10.
- FIG. 4 is a schematic enlarged view of the IV part shown in FIG.
- the coating film 20 has at least a hard layer 21.
- the hard layer 21 may have one or more metal nitride layers.
- the hard layer 21 is a layer having excellent wear resistance as compared with the metal layer 22.
- the hard layer 21 may be one layer.
- a plurality of metal nitride layers may be overlapped with each other.
- the hard layer 21 may have a laminated portion 23 in which a plurality of metal nitride layers are laminated, and a third metal nitride layer 24 located on the laminated portion 23. The configuration of the hard layer 21 will be described later.
- the coating film 20 may have a metal layer 22.
- the metal layer 22 is located between the substrate 10 and the hard layer 21. Specifically, the metal layer 22 is in contact with the upper surface of the substrate 10 on one surface (here, the lower surface) and is in contact with the lower surface of the hard layer 21 on the other surface (here, the upper surface).
- the metal layer 22 has higher adhesion to the substrate 10 than the hard layer 21.
- Examples of the metal element having such characteristics include Zr, V, Cr, W, Al, Si, and Y.
- the metal layer 22 contains at least one of the above metal elements.
- the simple substance of Ti, the simple substance of Zr, the simple substance of V, the simple substance of Cr, and the simple substance of Al are not used as the metal layer 22. This is because all of these have a low melting point and low oxidation resistance, and are therefore unsuitable for use in cutting tools. Further, the simple substance of Hf, the simple substance of Nb, the simple substance of Ta, and the simple substance of Mo have low adhesion to the substrate 10. However, this does not apply to alloys containing Ti, Zr, V, Cr, Ta, Nb, Hf, and Al.
- the metal layer 22 may be an Al—Cr alloy layer containing an Al—Cr alloy. Since the metal layer 22 has particularly high adhesion to the substrate 10, the effect of improving the adhesion between the substrate 10 and the coating film 20 is high.
- the Al content in the metal layer 22 may be higher than the Cr content in the metal layer 22.
- the composition ratio (atomic%) of Al and Cr in the metal layer 22 may be 70:30. With such a composition ratio, the adhesion between the substrate 10 and the metal layer 22 is higher.
- the metal layer 22 may contain components other than the above metal elements (Zr, V, Cr, W, Al, Si, Y). However, from the viewpoint of adhesion to the substrate 10, the metal layer 22 may contain at least 95 atomic% or more of the above metal elements in total. More preferably, the metal layer 22 may contain the above metal elements in a total amount of 98 atomic% or more. For example, when the metal layer 22 is an Al—Cr alloy layer, the metal layer 22 may contain at least 95 atomic% or more of Al and Cr in total. Further, the metal layer 22 may contain at least 98 atomic% or more in total of Al and Cr. The ratio of the metal component in the metal layer 22 can be specified by analysis using, for example, an EDS (energy dispersive X-ray spectroscope).
- EDS energy dispersive X-ray spectroscope
- the metal layer 22 does not contain Ti as much as possible from the viewpoint of improving the adhesion with the substrate 10.
- the Ti content in the metal layer 22 may be 15 atomic% or less.
- the metal layer 22 having a higher wettability with the base 10 than the hard layer 21 is provided between the base 10 and the hard layer 21 to cover the base 10 and the covering tool 1.
- the adhesion with the film 20 can be improved. Since the metal layer 22 has high adhesion to the hard layer 21, it is unlikely that the hard layer 21 will peel off from the metal layer 22.
- the cBN used as the substrate 10 is an insulator. There was room for improvement in the adhesion of cBN, which is an insulator, to the film formed by the PVD method (physical vapor deposition).
- the covering tool 1 according to the embodiment by providing the conductive metal layer 22 on the surface of the substrate 10, the adhesion between the hard layer 21 formed by PVD and the metal layer 22 is high.
- FIG. 5 is a schematic enlarged view of the V portion shown in FIG.
- the hard layer 21 has a laminated portion 23 located on the metal layer 22 and a third metal nitride layer 24 located on the laminated portion 23.
- the laminated portion 23 has a plurality of first metal nitride layers 23a and a plurality of second metal nitride layers 23b.
- the laminated portion 23 has a structure in which the first metal nitride layer 23a and the second metal nitride layer 23b are alternately laminated.
- the thickness of the first metal nitride layer 23a and the second metal nitride layer 23b may be 50 nm or less, respectively.
- the first metal nitride layer 23a is a layer in contact with the metal layer 22, and the second metal nitride layer 23b is formed on the first metal nitride layer 23a.
- the first metal nitride layer 23a and the second metal nitride layer 23b may contain the metal contained in the metal layer 22.
- the metal layer 22 contains two types of metals (here, "first metal” and "second metal”).
- the first metal nitride layer 23a contains a first metal and a third metal nitride.
- the third metal is a metal that is not contained in the metal layer 22.
- the second metal nitride layer 23b contains a first metal and a second metal nitride.
- the metal layer 22 may contain Al and Cr.
- the first metal nitride layer 23a may contain Al.
- the first metal nitride layer 23a may be an AlTiN layer containing AlTiN, which is a nitride of Al and Ti.
- the second metal nitride layer 23b may be an AlCrN layer containing AlCrN which is a nitride of Al and Cr.
- the adhesion between the metal layer 22 and the hard layer 21 is high. This makes it difficult for the hard layer 21 to peel off from the metal layer 22, so that the durability of the coating film 20 is high.
- the first metal nitride layer 23a that is, the AlTiN layer is excellent in, for example, wear resistance in addition to the adhesion with the metal layer 22 described above.
- the second metal nitride layer 23b that is, the AlCrN layer is excellent in heat resistance and oxidation resistance, for example.
- the coating film 20 contains the first metal nitride layer 23a and the second metal nitride layer 23b having different compositions from each other, thereby controlling the properties such as wear resistance and heat resistance of the hard layer 21. be able to. As a result, the tool life of the covering tool 1 can be extended.
- the hard layer 21 according to the embodiment it is possible to improve mechanical properties such as adhesion to the metal layer 22 and wear resistance while maintaining the excellent heat resistance of AlCrN.
- the laminated portion 23 may be formed into a film by, for example, an arc ion plating method (AIP method).
- AIP method uses an arc discharge in a vacuum atmosphere to evaporate the target metal (here, the AlTi target and the AlCr target) and combine it with the N2 gas to form a metal nitride (here, AlTiN and AlCrN). It is a method of filming.
- the metal layer 22 may also be formed by the AIP method.
- the third metal nitride layer 24 may be located on the laminated portion 23. Specifically, the third metal nitride layer 24 is in contact with the second metal nitride layer 23b of the laminated portion 23.
- the third metal nitride layer 24 is, for example, a metal nitride layer (AlTiN layer) containing Ti and Al, like the first metal nitride layer 23a.
- the thickness of the third metal nitride layer 24 may be thicker than the thickness of each of the first metal nitride layer 23a and the second metal nitride layer 23b. Specifically, when the thickness of the first metal nitride layer 23a and the second metal nitride layer 23b is 50 nm or less as described above, the thickness of the third metal nitride layer 24 may be 1 ⁇ m or more. For example, the thickness of the third metal nitride layer 24 may be 1.2 ⁇ m.
- the welding resistance of the covering tool 1 can be improved.
- the wear resistance of the covering tool 1 can be improved.
- the oxidation start temperature of the third metal nitride layer 24 is high, the oxidation resistance of the covering tool 1 can be improved.
- the thickness of the third metal nitride layer 24 may be thicker than the thickness of the laminated portion 23. Specifically, in the embodiment, when the thickness of the laminated portion 23 is 0.5 ⁇ m or less, the thickness of the third metal nitride layer 24 may be 1 ⁇ m or more. For example, when the thickness of the laminated portion 23 is 0.3 ⁇ m, the thickness of the third metal nitride layer 24 may be 1.2 ⁇ m. As described above, by making the third metal nitride layer 24 thicker than the laminated portion 23, the effect of improving the above-mentioned welding resistance, wear resistance, and the like is further higher.
- the thickness of the metal layer 22 may be, for example, 0.1 ⁇ m or more and less than 0.6 ⁇ m. That is, the metal layer 22 may be thicker than each of the first metal nitride layer 23a and the second metal nitride layer 23b, and may be thinner than the laminated portion 23.
- FIG. 6 is a front view showing an example of a cutting tool according to an embodiment.
- the cutting tool 100 has a covering tool 1 and a holder 70 for fixing the covering tool 1.
- the holder 70 is a rod-shaped member extending from the first end (upper end in FIG. 6) to the second end (lower end in FIG. 6).
- the holder 70 is made of, for example, steel or cast iron. In particular, it is preferable to use steel having high toughness among these members.
- the holder 70 has a pocket 73 at the end on the first end side.
- the pocket 73 is a portion on which the covering tool 1 is mounted, and has a seating surface that intersects the rotation direction of the work material and a restraining side surface that is inclined with respect to the seating surface.
- the seating surface is provided with a screw hole for screwing a screw 75, which will be described later.
- the covering tool 1 is located in the pocket 73 of the holder 70 and is attached to the holder 70 by the screw 75. That is, the screw 75 is inserted into the through hole 5 of the covering tool 1, and the tip of the screw 75 is inserted into the screw hole formed on the seating surface of the pocket 73 to screw the screw portions together. As a result, the covering tool 1 is attached to the holder 70 so that the cutting edge 8 (see FIG. 1) protrudes outward from the holder 70.
- a cutting tool used for so-called turning is exemplified.
- the turning process include inner diameter processing, outer diameter processing, and grooving processing.
- the cutting tool is not limited to the one used for turning.
- the covering tool 1 may be used as a cutting tool used for milling.
- the cutting process of the work material includes (1) a process of rotating the work material, (2) a process of bringing the cutting edge 8 of the covering tool 1 into contact with the rotating work material to cut the work material, and , (3) Includes a step of separating the covering tool 1 from the work material.
- Typical examples of the material of the work material include carbon steel, alloy steel, stainless steel, cast iron, and non-ferrous metal.
- the TiN raw material powder 72% by volume or more and 82% by volume or less of the TiN raw material powder, 13% by volume or more and 23% by volume or less of the Al raw material powder, and 1 % by volume or more and 11% by volume or less of the Al2O3 raw material powder are prepared.
- an organic solvent is added to each of the prepared raw material powders.
- alcohols such as acetone and isopropyl alcohol (IPA) can be used.
- IPA isopropyl alcohol
- it is pulverized and mixed for 20 hours or more and 24 hours or less. After grinding and mixing, the solvent is evaporated to give the first mixed powder.
- the cBN powder having an average particle size of 2.5 ⁇ m or more and 4.5 ⁇ m or less and the cBN powder having an average particle size of 0.5 ⁇ m 1.5 ⁇ m or less are mixed in a volume ratio of 8 or more and 9 or less: 1 or more and 2 or less. Mix in the ratio of. Further, an organic solvent is added. As the organic solvent, alcohols such as acetone and IPA can be used. Then, in a ball mill, it is pulverized and mixed for 20 hours or more and 24 hours or less. After grinding and mixing, the solvent is evaporated to give a second mixed powder.
- the obtained first mixed powder and the second mixed powder are mixed in a volume ratio of 68 or more and 78 or less: 22 or more and 32 or less.
- An organic solvent and an organic binder are added to the prepared powder.
- the organic solvent alcohols such as acetone and IPA can be used.
- the organic binder paraffin, acrylic resin or the like can be used.
- the third mixed powder is obtained by pulverizing and mixing in a ball mill for 20 hours or more and 24 hours or less, and then evaporating the organic solvent. In the process using a ball mill, a dispersant may be added as needed.
- a molded product can be obtained by molding this third mixed powder into a predetermined shape.
- Known methods such as uniaxial pressure press, cold isotropic press (CIP) and the like can be used for molding.
- This molded product is heated at a predetermined temperature within the range of 500 ° C. or higher and 1000 ° C. or lower to evaporate and remove the organic binder.
- the molded product is charged into an ultra-high pressure heating device and heated at 1200 ° C. or higher and 1500 ° C. or lower for 15 minutes or longer and 30 minutes or shorter under a pressure of 4 GPa or higher and 6 GPa or lower.
- the cubic boron nitride sintered body according to the embodiment can be obtained.
- the obtained cubic boron nitride sintered body is attached to the bearing surface of the chip body made of cemented carbide via a joining material. As a result, the chip according to the embodiment is obtained.
- the upper surface (rake surface) of the chip is covered with a jig.
- the rake face is in contact with the jig, and a film is not formed on the rake face.
- the jig is located on the upper part of the third surface 9 with a gap in between.
- the film thickness formed on the third surface 9 is thinner than the film thickness formed on the second surface 7.
- a coating film is formed on the surface of the chip by the physical vapor deposition (PVD) method.
- PVD physical vapor deposition
- the above-mentioned jig is located near the chamfer surface of the chip. Therefore, the vapor deposition on the chamfer surface is suppressed by the above-mentioned jig. As a result, the thickness of the coating film located on the chamfer surface is thinner than the thickness of the coating film located on the flank surface.
- Comparative Example 1 a sample in which a coating film was formed on the entire surface of the substrate was prepared without using the above-mentioned jig. Further, as Comparative Example 2, a sample from which the coating film was removed from the third surface 9 of the covering tool according to Comparative Example 1 described above was prepared.
- the intensity (scattering intensity) for each wave number can be obtained.
- the measurement using the above device was performed 5 times for each of the coating film located on the flank surface and the coating film located on the chamfer surface.
- Figures 7 and 8 show the results of these five measurements averaged for each wave number and graphed.
- FIG. 7 is a graph showing the results of Raman spectroscopic analysis for the covering tool according to the embodiment.
- FIG. 8 is a graph showing the results of Raman spectroscopic analysis for the covering tool according to Comparative Example 1.
- the Raman spectrum of the coating film located on the flank surface is shown by a broken line
- the Raman spectrum of the coating film located on the chamfer surface is shown by a solid line.
- the wave number of the maximum Raman peak of the coating film located on the chamfer surface is lower than the wave number of the maximum Raman peak of the coating film located on the flank surface. You can see that it is shifting to the side. Specifically, the wavenumber of the maximum Raman peak of the coating film located on the chamfer surface is shifted to the lower wavenumber side by about 5 cm -1 than the wavenumber of the maximum Raman peak of the coating film located on the flank surface. You can see that.
- the wave number of the maximum Raman peak of the coating film located on the chamfer surface is higher than the wave number of the maximum Raman peak of the coating film located on the flank surface. It can be seen that is also shifting to the high wavenumber side. It is considered that this is because the coating film on the third surface 9 is formed thicker than the coating film on the second surface, and the residual stress on the third surface 9 is large.
- the coating film located on the chamfer surface has a smaller residual stress than the coating film located on the flank surface, and it can be seen that peeling and cracking are less likely to occur.
- the cutting tool according to the example achieved the longest life. Further, the cutting tool according to Comparative Example 1 had the shortest life.
- the number of impacts until the cutting edge was broken in the coated tool according to the example was more than twice as many as the number of impacts until the cutting edge was broken in the coated tool according to Comparative Example 1. As is clear from this result, it can be seen that by exposing the rake face, the fracture resistance is improved and the tool life is extended.
- the coating tool 1 in which the substrate 10 made of boron nitride particles or the like is attached to the chip body 2 made of cemented carbide or the like and these are coated with the coating film 20 has been described.
- the covering tool according to the present disclosure for example, all of the hexahedron-shaped substrates having parallelograms on the upper and lower surfaces are cubic boron nitride boronic sintered bodies, and the substrates are covered on the substrates.
- a cover film may be formed.
- the shapes of the upper surface and the lower surface of the covering tool 1 are parallelograms, but the shapes of the upper surface and the lower surface of the covering tool 1 may be a rhombus, a square, or the like. Further, the shapes of the upper surface and the lower surface of the covering tool 1 may be a triangle, a pentagon, a hexagon, or the like.
- the shape of the covering tool 1 may be a positive type or a negative type.
- the positive type is a type in which the side surface is inclined with respect to the central axis passing through the center of the upper surface and the center of the lower surface of the covering tool 1
- the negative type is a type in which the side surface is parallel to the central axis.
- the substrate 10 contains particles of cubic boron nitride (cBN)
- the substrate disclosed in the present application may contain particles such as hexagonal boron nitride (hBN), rhombohedral boron nitride (rBN), and wurtzite boron nitride (wBN).
- the substrate 10 is not limited to boron nitride, and may be, for example, cemented carbide, cermet, or the like.
- the cemented carbide contains W (tungsten), specifically WC (tungsten carbide). Further, the cemented carbide may contain Ni (nickel) or Co (cobalt).
- the cermet also contains, for example, Ti (titanium), specifically TiC (titanium carbide) or TiN (titanium nitride). Further, the cermet may contain Ni or Co.
- the covering tool 1 has been described as being used for cutting, but the covering tool according to the present application can be applied to other than cutting tools such as excavation tools and blades.
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Abstract
Description
図1は、実施形態に係る被覆工具の一例を示す斜視図である。図1に示すように、実施形態に係る被覆工具1は、チップ本体2と、切刃部3とを有する。実施形態に係る被覆工具1は、たとえば、上面および下面(図1に示すZ軸と交わる面)の形状が平行四辺形である六面体形状を有する。
チップ本体2は、たとえば超硬合金で形成される。超硬合金は、W(タングステン)、具体的には、WC(炭化タングステン)を含有する。また、超硬合金は、Ni(ニッケル)およびCo(コバルト)の少なくとも一方を含有していてもよい。また、チップ本体2は、サーメットで形成されてもよい。サーメットは、たとえばTi(チタン)、具体的には、TiC(炭化チタン)またはTiN(窒化チタン)を含有する。また、サーメットは、NiやCoを含有していてもよい。
切刃部3は、チップ本体2の座面4に取り付けられることによってチップ本体2と一体化されている。
基体10は、複数の窒化硼素粒子を含有する。実施形態において、基体10は、立方晶窒化硼素(cBN)質焼結体であり、複数の立方晶型窒化硼素粒子を含有する窒化硼素質焼結体からなる。基体10は、複数の窒化硼素粒子の間に、TiN、Al、Al2O3等を含有する結合相を有していてもよい。複数の窒化硼素粒子は、かかる結合相によって強固に結合される。なお、基体10は、必ずしも結合相を有することを要しない。
被覆膜20は、例えば、切刃部3の耐摩耗性、耐熱性等を向上させることを目的として基体10に被覆される。図2の例では、被覆膜20がチップ本体2および切刃部3の両方に位置しているが、被覆膜20は、少なくとも基体10の上に位置していればよい。被覆膜20が切刃部3の第2面7に相当する基体10の側面に位置する場合、第2面7の耐摩耗性、耐熱性が高い。
次に、被覆膜20の具体的な構成について図4を参照して説明する。図4は、図3に示すIV部の模式的な拡大図である。
また、被覆膜20は、金属層22を有していてもよい。金属層22は、基体10と硬質層21との間に位置する。具体的には、金属層22は、一方の面(ここでは下面)において基体10の上面に接し、且つ、他方の面(ここでは上面)において硬質層21の下面に接する。
次に、硬質層21の構成について図5を参照して説明する。図5は、図4に示すV部の模式的な拡大図である。
次に、上述した被覆工具1を備えた切削工具の構成について図6を参照して説明する。図6は、実施形態に係る切削工具の一例を示す正面図である。
次に、実施例および比較例1に係る被覆工具の逃げ面に位置する被覆膜(第2被覆膜202)およびチャンファー面に位置する被覆膜(第3被覆膜203)について、以下の条件にてラマン分光分析を行った。
<測定条件>
測定装置 :(例)レーザーラマン分光装置HR800(堀場製作所製)
レーザー波長 :(例)514.79nm
グレーティング:600本
対物レンズ :×100
検出器 :CCD
検出波数 :100~800cm-1
次に、実施例および比較例1,2に係る被覆工具と、すくい面を含むすべての面が被覆膜で覆われた比較例に係る被覆工具とについて、以下の切削条件にて断続評価を行った。
<切削条件>
切削方法:旋削加工
被削材 :SCM415 8ヶ穴
切削速度:150m/分
送り :0.2mm/rev
切り込み:0.2mm
切削状態:湿式
評価方法:切刃が欠損するまでの衝撃回数
2 チップ本体
3 切刃部
4 座面
5 貫通孔
6 第1面
7 第2面
8 切刃
9 第3面
10 基体
20 被覆膜
21 硬質層
22 金属層
23 積層部
23a 第1金属窒化物層
23b 第2金属窒化物層
24 第3金属窒化物層
30 基板
40 接合材
70 ホルダ
73 ポケット
75 ネジ
100 切削工具
202 第2被覆膜
203 第3被覆膜
Claims (10)
- 基体と、
前記基体の上に位置する被覆膜と、を有する被覆工具であって、
前記被覆工具は、
すくい面を有する第1面と、
逃げ面を有する第2面と、
前記第1面および前記第2面との間に位置し、C面またはR面である第3面とを有し、
前記被覆膜は、
前記第1面に位置する第1被覆膜および前記第2面に位置する第2被覆膜のうち少なくとも一方と、
前記第3面に位置する第3被覆膜と、を有し、
前記第1被覆膜の最大ラマンピークの波数を第1波数とし、
前記第2被覆膜の最大ラマンピークの波数を第2波数とし、
前記第3被覆膜の最大ラマンピークの波数を第3波数とした場合、
前記第3波数は、前記第1波数および前記第2波数よりも小さい、被覆工具。 - 前記第3波数は、前記第1波数および前記第2波数よりも3cm-1以上小さい、請求項1に記載の被覆工具。
- 前記基体は、複数の立方晶型窒化硼素粒子を含有する窒化硼素質焼結体からなる、請求項1または2に記載の被覆工具。
- 前記基体は、前記第1面において露出している、請求項1~3のいずれか一つに記載の被覆工具。
- 前記第3被覆膜の厚みは、前記第2被覆膜の厚みよりも薄い、請求項1~4のいずれか一つに記載の被覆工具。
- 前記第3被覆膜の厚みは、前記第1面に近い領域において、前記第2面に近い領域よりも薄い、請求項1~5のいずれか一つに記載の被覆工具。
- 前記第3被覆膜の厚みは、0.01μm以上5.0μm以下である、請求項1~6のいずれか一つに記載の被覆工具。
- 前記被覆膜は、
硬質層と、
前記基体と前記硬質層との間に位置する、Ti、Zr、V、Cr、Ta、Nb、Hf、Alの単体以外の金属層と
を有する、請求項1に記載の被覆工具。 - 前記金属層は、Zr、Hf、V、Nb、Ta、Cr、Mo、W、Al、Si、Yのうち少なくとも一種以上の元素を含有する、請求項8に記載の被覆工具。
- 端部にポケットを有する棒状のホルダと、
前記ポケット内に位置する、請求項1~9のいずれか一つに記載の被覆工具と
を有する、切削工具。
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CN202180084770.7A CN116635179A (zh) | 2020-12-25 | 2021-12-15 | 涂层刀具以及切削刀具 |
JP2022572242A JPWO2022138400A1 (ja) | 2020-12-25 | 2021-12-15 | |
DE112021006657.9T DE112021006657T5 (de) | 2020-12-25 | 2021-12-15 | Beschichtetes werkzeug und schneidwerkzeug |
US18/258,810 US20240043351A1 (en) | 2020-12-25 | 2021-12-15 | Coated tool and cutting tool |
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JP (1) | JPWO2022138400A1 (ja) |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55137803A (en) * | 1979-04-09 | 1980-10-28 | Mitsubishi Metal Corp | Cutting tool covered with cemented carbide and manufacture thereof |
JPH0248103A (ja) * | 1989-06-20 | 1990-02-16 | Sumitomo Electric Ind Ltd | 被覆超硬合金工具及びその製造法 |
JPH1071507A (ja) * | 1996-06-12 | 1998-03-17 | Sumitomo Electric Ind Ltd | 被覆硬質合金工具 |
JP2004255488A (ja) * | 2003-02-25 | 2004-09-16 | Kyocera Corp | 表面被覆切削工具およびその製造方法 |
WO2015146507A1 (ja) * | 2014-03-25 | 2015-10-01 | 兼房株式会社 | 切削工具 |
Family Cites Families (2)
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JP3476749B2 (ja) | 2000-06-14 | 2003-12-10 | 東芝タンガロイ株式会社 | 硬質膜被覆超高温高圧焼結体 |
CA2559807C (en) | 2004-04-30 | 2009-02-10 | Sumitomo Electric Hardmetal Corp. | Surface-covered cubic boron nitride sintered body tool and method of manufacturing the same |
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2021
- 2021-12-15 JP JP2022572242A patent/JPWO2022138400A1/ja active Pending
- 2021-12-15 WO PCT/JP2021/046379 patent/WO2022138400A1/ja active Application Filing
- 2021-12-15 DE DE112021006657.9T patent/DE112021006657T5/de active Pending
- 2021-12-15 CN CN202180084770.7A patent/CN116635179A/zh active Pending
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55137803A (en) * | 1979-04-09 | 1980-10-28 | Mitsubishi Metal Corp | Cutting tool covered with cemented carbide and manufacture thereof |
JPH0248103A (ja) * | 1989-06-20 | 1990-02-16 | Sumitomo Electric Ind Ltd | 被覆超硬合金工具及びその製造法 |
JPH1071507A (ja) * | 1996-06-12 | 1998-03-17 | Sumitomo Electric Ind Ltd | 被覆硬質合金工具 |
JP2004255488A (ja) * | 2003-02-25 | 2004-09-16 | Kyocera Corp | 表面被覆切削工具およびその製造方法 |
WO2015146507A1 (ja) * | 2014-03-25 | 2015-10-01 | 兼房株式会社 | 切削工具 |
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JPWO2022138400A1 (ja) | 2022-06-30 |
CN116635179A (zh) | 2023-08-22 |
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