WO2022137653A1 - Electronic control device - Google Patents

Electronic control device Download PDF

Info

Publication number
WO2022137653A1
WO2022137653A1 PCT/JP2021/031897 JP2021031897W WO2022137653A1 WO 2022137653 A1 WO2022137653 A1 WO 2022137653A1 JP 2021031897 W JP2021031897 W JP 2021031897W WO 2022137653 A1 WO2022137653 A1 WO 2022137653A1
Authority
WO
WIPO (PCT)
Prior art keywords
control device
electronic control
protrusion
hole
circuit board
Prior art date
Application number
PCT/JP2021/031897
Other languages
French (fr)
Japanese (ja)
Inventor
直輝 星谷
俊明 高井
Original Assignee
日立Astemo株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立Astemo株式会社 filed Critical 日立Astemo株式会社
Priority to JP2022571044A priority Critical patent/JPWO2022137653A1/ja
Priority to CN202180081516.1A priority patent/CN116583944A/en
Publication of WO2022137653A1 publication Critical patent/WO2022137653A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon

Definitions

  • the present invention relates to an electronic control device.
  • the in-vehicle electronic control device is equipped with a microcomputer that supports high-speed calculation and high-speed processing in order to realize advanced automatic driving functions, and the computing power of the microcomputers is increasing year by year as the required automatic driving functions become more sophisticated. And the calorific value is increasing proportionally.
  • Patent Document 1 discloses "a heat dissipation structure in an electronic component accommodating case body". It is composed of a circuit board on which heat-generating electronic components are mounted and a case body that houses the circuit board, and the case body is formed by two case bodies so as to cover the front surface side and the back surface side of the circuit board. The body is integrally provided with a heat transfer protrusion that comes into contact with the heat-generating electronic component, heat can be dissipated to the case body via the heat transfer protrusion, and a circuit using the protrusion of the housing case is used. It is a heat dissipation structure that is also used as a alignment pin of a substrate, and provides a heat dissipation structure in an electronic component storage case body that allows easy assembly of components.
  • the heat dissipation structure of Patent Document 1 has a structure in which the heat transfer protrusion extending from the case body touches the surface of the circuit board or the heat-generating electronic component. Therefore, the distance between the heat transfer protrusion and the heat source is not equal on the front surface side and the back surface side, and the heat transfer amount is biased to either one, so that the heat dissipation efficiency cannot be maximized.
  • An object of the present invention is to provide an electronic control device capable of improving heat dissipation efficiency.
  • the electronic control device of the present invention includes a circuit board on which a heat generating component is mounted and having a through hole, and a first housing having a first protrusion protruding toward the through hole. Thermal paste that conducts heat from the inner wall of the circuit board forming the through hole and the second housing having the second protrusion facing the first protrusion to the first protrusion and the second protrusion. And.
  • FIG. It is sectional drawing (development view) of Embodiment 1.
  • FIG. It is sectional drawing (assembly drawing) of Embodiment 1.
  • FIG. It is sectional drawing (development view) of Embodiment 2.
  • FIG. It is a structural example 1 of a through hole portion. It is a structural example 2 of the through hole portion. It is a structural example 3 of the through hole portion.
  • FIG. 1 is an example of a configuration diagram of a heat dissipation structure according to the present embodiment.
  • the electronic control device 100 has a configuration in which a circuit board 5 is sandwiched between a base member 1 and a cover member 7, and the circuit board 5 is fixed to the base member 1 with fasteners such as screws 6.
  • the base member projecting portion 2 extends from the base member 1, and the cover member projecting portion 8 extends from the cover member 7 so as to face each other.
  • the circuit board 5 is provided with a through hole 9, and is arranged at a position where the base member projecting portion 2 and the cover member projecting portion 8 arranged to face each other are simultaneously inserted.
  • Thermal paste 3 is applied to the tip of the base member protrusion 2 or the cover member protrusion 8, and the electronic control device 100 is assembled with a fastening member such as a screw (not shown) to the wall of the through hole 9 and the base.
  • the member projecting portion 2 and the cover member projecting portion 8 are thermally connected via the thermal paste 3.
  • the thermal paste 3 uses various types of materials such as grease and gel. Generally used is a grease-like heat conductive material, such as a thermosetting resin having adhesiveness and a semi-curing resin having low elasticity. Further, the conductive and non-conductive thermal paste 3 is selected and used in consideration of the mounting situation and the like.
  • the thermal paste 3 is preferably a semi-cured resin using a silicon-based resin containing a ceramic filler, which has flexibility that can be deformed by heat deformation and vibration of the circuit board 5 and tolerance during manufacturing, for example. ..
  • the thermal paste 3 and the circuit board 5 are arranged on substantially the same plane.
  • the heat generating component 4 is electrically connected to the circuit board 5 with a joining material such as solder.
  • the heat generated from the heat generating component 4 is transferred to the circuit board 5 via a bonding material such as solder, and the heat accumulated on the circuit board is thermally connected from the through hole 9 via the thermal paste 3 to the protruding portion of the base member. It is transmitted to 2 and the protruding portion 8 of the cover member, and heat is dissipated to the base member 1 and the cover member 7.
  • the through hole 9 is covered with plating 10 and is electrically connected to the heat generating component 4 through a GND pattern or the like. The heat released from the heat generating component 4 is efficiently transferred to the plating 10 through the wiring pattern.
  • the base member protruding portion 2 When the plated portion connected to the GND pattern, the base member protruding portion 2, the cover member protruding portion 8 or both are connected, the equipotential properties of the circuit board 5, the base member 1, and the cover member 7 are improved.
  • the EMC resistance can be improved.
  • a pedestal 11 for keeping the thermal paste 3 on substantially the same plane of the circuit board 5 is provided between the base member 1 and the base member protruding portion 2.
  • the diameter of the pedestal 11 is larger than that of the through hole 9.
  • the shape of the through hole 9 shown in FIGS. 9, 10 and 11 has variations such as a circle and an elongated hole, and the larger the diameter of the through hole 9, the more the base member 1 and the cover member 7 come into contact with each other via the thermal paste 3.
  • heat can be dissipated from the circuit board 5 to the base member 1 and the cover member 7 more efficiently.
  • the four corners of the through hole 9 are shaped with R so that plating can be applied.
  • the through hole 9 may be arranged near the heat generating component 4, the edge of the board, or the like, and if it is arranged near the heat generating component 4, heat can be dissipated before it spreads over the entire circuit board, so that heat can be efficiently dissipated.
  • the through hole 9 is arranged at the end of the board, a space for mounting and wiring the component can be secured around the heat generating component 4, and the circuit board 5 is installed at the edge of the board when the circuit board 5 is fastened to the base member 1.
  • the base member 1 and the cover member 7 are each made of a metal material having excellent thermal conductivity, such as aluminum (for example, ADC12). Further, it can be formed of a sheet metal such as iron or a non-metal material such as a resin material to reduce the cost and weight. Similarly, the cover member 7 can be formed of a sheet metal such as iron or a non-metal material such as a resin material.
  • the electronic control device 100 includes at least a circuit board 5, a first housing (base member 1), a second housing (cover member 7), and thermal paste 3.
  • the circuit board 5 is mounted with a heat generating component 4 and has a through hole 9.
  • the first housing (base member 1) has a first protruding portion (pedestal 11) that protrudes toward the through hole 9.
  • the second housing (cover member 7) has a second protruding portion (cover member protruding portion 8) facing the first protruding portion (pedestal 11).
  • the thermal paste 3 conducts heat from the inner wall of the circuit board 5 forming the through hole 9 to the first protruding portion (pedestal 11) and the second protruding portion (cover member protruding portion 8).
  • the heat of the heat generating component 4 is transferred to the inner wall of the circuit board 5 forming the through hole 9, the thermal paste 3, the first protruding portion (pedestal 11), the second protruding portion (cover member protruding portion 8), and the first casing. Heat is dissipated into the atmosphere via the body (base member 1) and the second housing (cover member 7).
  • the base member 1 and the cover member 7 are referred to as a first housing and a second housing, respectively, but the opposite may be used.
  • the pedestal 11 is provided on the base member 1, it may be provided on the cover member 7.
  • the first protruding portion (pedestal 11) has a convex portion (base member protruding portion 2) facing the second protruding portion (cover member protruding portion 8).
  • the thermal paste 3 is filled between the inner wall of the circuit board 5 forming the through hole 9 and the convex portion (base member projecting portion 2) and the second projecting portion (cover member projecting portion 8).
  • the heat of the heat generating component 4 is transferred to the inner wall of the circuit board 5 forming the through hole 9, the thermal paste 3, the convex portion (base member projecting portion 2), the first projecting portion (pedestal 11), and the second projecting portion (the pedestal 11). Heat is dissipated into the atmosphere via the cover member projecting portion 8), the first housing (base member 1), and the second housing (cover member 7).
  • the tip of the convex portion (base member protruding portion 2) is located inside the through hole 9.
  • the first protrusion (pedestal 11) closes the through hole 9.
  • the thermal paste 3 does not leak to the surface side of the circuit board 5 on which the heat generating component 4 is mounted.
  • the base member 1 is on the lower side in the vertical direction at the time of assembly, and the circuit board 5 can be supported by the pedestal 11.
  • the convex portion (base member projecting portion 2) and the second projecting portion (cover member projecting portion 8) have a tapered shape. This facilitates, for example, positioning of the convex portion (base member protruding portion 2), the through hole 9 of the circuit board 5, and the second protruding portion (cover member protruding portion 8).
  • the circuit board 5 has a GND pattern 13 indicating a wiring pattern connected to the ground, and the through hole 9 has a plating 10 connected to the GND pattern 13.
  • the first protruding portion (pedestal 11) is in contact with the plating 10.
  • the GND pattern 13, the plating 10, the first protrusion (pedestal 11), and the first housing (base member 1) have the same potential.
  • the height of the plating 10 is lower than that of the resist 14. Therefore, the end portion 10E (FIG. 5) of the plating 10 is extended to the outside of the outer circumference of the pedestal 11 so that the pedestal 11 is surely in contact with the plating 10.
  • the through hole 9 is adjacent to the corner of the heat generating component 4 and is formed in a circular shape with respect to the surface of the circuit board 5 on which the heat generating component 4 is mounted. This facilitates the processing of the through hole 9, for example, while avoiding interference between the lead terminal of the heat generating component 4 and the through hole 9.
  • the through hole 9 is adjacent to the corner of the heat generating component 4 and is formed in an L shape with respect to the surface of the circuit board 5 on which the heat generating component 4 is mounted. Thereby, for example, the contact area between the circuit board 5 and the thermal paste 3 can be increased while avoiding the interference between the lead terminal of the heat generating component 4 and the through hole 9.
  • the through hole 9 is adjacent to the edge of the circuit board 5 and is formed linearly with respect to the surface of the circuit board 5 on which the heat generating component 4 is mounted. Thereby, for example, the contact area between the circuit board 5 and the thermal paste 3 can be further increased while avoiding the interference between the wiring pattern and the through hole 9.
  • the heat dissipation efficiency can be improved.
  • the groove portion 12 for applying the thermal paste 3 is provided on the base member protruding portion 2.
  • the thermal paste 3 stored in the groove 12 spreads inside the through hole 9 by being pressed by the cover member protrusion 8, and the base member protrusion 2 and the cover member protrusion 8 are thermally coupled via the thermal paste 3. Will be done.
  • the application position and pressing position of the thermal paste 3 are quantified, and the role of suppressing the variation in the thermal paste performance due to individual differences.
  • the convex portion (base member protruding portion 2) has a concave portion (groove portion 12) facing the second protruding portion (cover member protruding portion 8).
  • the thermal paste 3 is filled between the second protruding portion (cover member protruding portion 8) and the recess (groove portion 12). Thereby, for example, the contact area between the convex portion (base member protruding portion 2) and the thermal paste 3 can be increased.
  • the groove portion 12 can be formed in the pedestal 11 by eliminating the base member protruding portion 2.
  • the first protrusion (pedestal 11) has a recess (groove 12) facing the second protrusion (cover member protrusion 8). This makes it easier to apply the thermal paste 3 to the recess (groove 12) than in the example of FIG.
  • the thermal paste 3 is filled between the second protruding portion (cover member protruding portion 8) and the recess (groove portion 12).
  • the tip of the second protrusion (cover member protrusion 8) is located inside the recess (groove 12).
  • the first protrusion (pedestal 11) closes the through hole 9. As a result, for example, the thermal paste 3 does not easily leak to the surface side of the circuit board 5 on which the heat generating component 4 is mounted.
  • the groove portion 12 has a tapered shape so that the pressed thermal paste 3 can easily flow out of the groove portion 12.
  • the recess (groove 12) has a taper so that it narrows toward the bottom of the recess (groove 12).
  • the embodiment of the present invention may have the following aspects.
  • the first and second projecting portions are provided, respectively.
  • the circuit board 5 is provided with a through hole 9, and the first and second protrusions are arranged so as to face each other in the through hole 9.
  • Thermal paste 3 is applied between the first and second protrusions, and when the housing is assembled, the heat radiation grease is pressed into the through holes 9 by being pressed by the first and second protrusions.
  • An electronic control device characterized in that 3 is filled.
  • a convex portion or a concave portion is provided at the tip of the first protruding portion and the second protruding portion, and the thermal paste 3 is applied into the concave portion.
  • the thermal paste 3 is filled in the through hole 9 by being pressed by the convex portion and the concave portion, and the thermal paste 3 and the circuit board 5 are arranged on substantially the same plane.
  • a pedestal 11 is provided between the convex portion and the base member 1 or the cover member 7, or a pedestal 11 for preventing the thermal paste 3 from flowing out is provided in the convex portion of the pedestal 11.
  • the circuit board 5 can be sandwiched between the circuit board storage housings without using a board fastener such as a screw 6 (1). ).
  • the electronic control device By installing the through hole 9 at the end of the board (the end of the circuit board 5), the circuit board 5 can be sandwiched between the circuit board storage housings without using a board fastener such as a screw 6 (1). ).
  • the electronic control device By installing the through hole 9 at the end of the board (the end of the circuit board 5), the circuit board 5 can be sandwiched between the circuit board storage housings without using a board fastener such as a screw 6 (1). ).
  • the electronic control device By installing the through hole 9 at the end of the board (the end of the circuit board 5), the circuit board 5 can be sandwiched between the circuit board storage housings without using a board fastener such as a screw 6 (1). ).
  • the electronic control device By installing the through hole 9 at the end of the board (the end of the circuit board 5), the circuit board 5 can be sandwiched between

Abstract

An electronic control device (100) comprises: a circuit board (5); a first housing (base member (1)); a second housing (cover member (7)); and heat-dissipating grease (3). The circuit board (5) has a heat generating component (4) mounted thereon, and has a through hole (9) therein. The first housing (base member (1)) has a first protruding part (pedestal (11)) that protrudes towards the through hole (9). The second housing (cover member (7)) has a second protruding part (cover member protruding part (8)) that faces the first protruding part (pedestal (11)). The heat-dissipating grease (3) conducts heat from an inner wall of the circuit board (5) having the through hole (9) formed therein to the first protruding part (pedestal (11)) and the second protruding part (cover member protruding part (8)).

Description

電子制御装置Electronic control device
　本発明は、電子制御装置に関する。 The present invention relates to an electronic control device.
　車載用電子制御装置は、高度な自動運転機能の実現のため、高速演算および高速処理に対応したマイコンを搭載しており、求められる自動運転機能の高度化に伴い、マイコンの演算能力は年々増大しており、発熱量も比例し増大している。 The in-vehicle electronic control device is equipped with a microcomputer that supports high-speed calculation and high-speed processing in order to realize advanced automatic driving functions, and the computing power of the microcomputers is increasing year by year as the required automatic driving functions become more sophisticated. And the calorific value is increasing proportionally.
　一方で搭載する車載空間、筐体軽量化の観点から筐体のサイズアップを抑えつつ放熱性の向上を行う必要があるといった課題がある。 On the other hand, there is a problem that it is necessary to improve the heat dissipation while suppressing the size increase of the housing from the viewpoint of the in-vehicle space to be mounted and the weight reduction of the housing.
　本技術分野の背景として、特開２００９－１８２１８２（特許文献１）がある。この公報には、「電子部品収容ケース体における放熱構造」が開示されている。発熱電子部品を実装する回路基板と、回路基板を収容するケース体から構成されるとともに、そのケース体は前記回路基板の表面側、裏面側とを覆うように二つのケース体により形成され、ケース体には発熱電子部品に当接する熱伝達用突出部を一体的に設けており、熱伝達用突出部を介して熱をケース体に放熱することができ、また収容ケースの突出部を用い回路基板の位置合わせピンとしても使用する放熱構造体であり、簡単に部品の組み付けを行うことができる電子部品収納ケース体における放熱構造が提供される。 As a background of this technical field, there is Japanese Patent Application Laid-Open No. 2009-182182 (Patent Document 1). This publication discloses "a heat dissipation structure in an electronic component accommodating case body". It is composed of a circuit board on which heat-generating electronic components are mounted and a case body that houses the circuit board, and the case body is formed by two case bodies so as to cover the front surface side and the back surface side of the circuit board. The body is integrally provided with a heat transfer protrusion that comes into contact with the heat-generating electronic component, heat can be dissipated to the case body via the heat transfer protrusion, and a circuit using the protrusion of the housing case is used. It is a heat dissipation structure that is also used as a alignment pin of a substrate, and provides a heat dissipation structure in an electronic component storage case body that allows easy assembly of components.
特開２００９－１８２１８２号公報Japanese Unexamined Patent Publication No. 2009-182182
　しかしながら前記特許文献１の放熱構造は、回路基板もしくは発熱電子部品の表面に対しケース体から伸びる熱伝達用突出部が触れる構造になっている。そのことから熱伝達用突出部と熱源との距離は表面側、裏面側で等しくなく、どちらか一方に伝熱量が偏ってしまうことで放熱効率を最大化できないことが課題である。 However, the heat dissipation structure of Patent Document 1 has a structure in which the heat transfer protrusion extending from the case body touches the surface of the circuit board or the heat-generating electronic component. Therefore, the distance between the heat transfer protrusion and the heat source is not equal on the front surface side and the back surface side, and the heat transfer amount is biased to either one, so that the heat dissipation efficiency cannot be maximized.
　本発明の目的は、放熱効率を向上することができる電子制御装置を提供することにある。 An object of the present invention is to provide an electronic control device capable of improving heat dissipation efficiency.
　上記目的を達成するために、本発明の電子制御装置は、発熱部品が搭載され、貫通孔を有する回路基板と、前記貫通孔に向かって突出する第１突出部を有する第１筐体と、前記第１突出部と対向する第２突出部を有する第２筐体と、前記貫通孔を形成する前記回路基板の内壁から前記第１突出部及び前記第２突出部へ熱を伝導する放熱グリスと、を備える。 In order to achieve the above object, the electronic control device of the present invention includes a circuit board on which a heat generating component is mounted and having a through hole, and a first housing having a first protrusion protruding toward the through hole. Thermal paste that conducts heat from the inner wall of the circuit board forming the through hole and the second housing having the second protrusion facing the first protrusion to the first protrusion and the second protrusion. And.
　本発明によれば、放熱効率を向上することができる。上記した以外の課題、構成及び効果は、以下の実施形態の説明により明らかにされる。 According to the present invention, heat dissipation efficiency can be improved. Issues, configurations and effects other than those described above will be clarified by the following description of the embodiments.
実施形態１の断面図（展開図）である。It is sectional drawing (development view) of Embodiment 1. FIG. 実施形態１の断面図（組立図）である。It is sectional drawing (assembly drawing) of Embodiment 1. FIG. 実施形態２の断面図（展開図）である。It is sectional drawing (development view) of Embodiment 2. 実施形態２の断面図（組立図）である。It is sectional drawing (assembly drawing) of Embodiment 2. FIG. 貫通孔部の構造例１である。It is a structural example 1 of a through hole portion. 貫通孔部の構造例２である。It is a structural example 2 of the through hole portion. 貫通孔部の構造例３である。It is a structural example 3 of the through hole portion. 溝部の形状を示す断面図である。It is sectional drawing which shows the shape of the groove part. 貫通孔の配置・形状例１である。It is an arrangement / shape example 1 of a through hole. 貫通孔の配置・形状例２である。It is an arrangement / shape example 2 of a through hole. 貫通孔の配置・形状例３である。It is an arrangement / shape example 3 of a through hole.
　以下、図面を参照して本電子制御装置と放熱方法に係る実施の形態を説明する。ただし、以下に示す実施形態はあくまでも例示に過ぎず、実施形態で明示しない種々の変形例や技術の適用を排除する意図はない。すなわち、本実施形態を、その趣旨を逸脱しない範囲で種々変形して実施することができる。又、各図は、図中に示す構成要素のみを備えるという趣旨ではなく、他の機能等を含むことができる。 Hereinafter, embodiments relating to the electronic control device and the heat dissipation method will be described with reference to the drawings. However, the embodiments shown below are merely examples, and there is no intention of excluding the application of various modifications and techniques not specified in the embodiments. That is, the present embodiment can be variously modified and implemented within a range that does not deviate from the purpose. Further, each figure does not mean that it includes only the components shown in the figure, but may include other functions and the like.
　［実施形態１］
　図１は、本実施形態に係る放熱構造の構成図の例である。電子制御装置１００は、ベース部材１とカバー部材７との間に回路基板５を挟んだ構成になっており、回路基板５は、ネジ６などの締結具でベース部材１に固定されている。ベース部材１からはベース部材突出部２、カバー部材７からはカバー部材突出部８がそれぞれ向かい合うように延伸している。また回路基板５には貫通孔９が設けられており、対向して配置されているベース部材突出部２とカバー部材突出部８が同時に挿通される位置に配置されている。 [Embodiment 1]
FIG. 1 is an example of a configuration diagram of a heat dissipation structure according to the present embodiment. The electronic control device 100 has a configuration in which a circuit board 5 is sandwiched between a base member 1 and a cover member 7, and the circuit board 5 is fixed to the base member 1 with fasteners such as screws 6. The base member projecting portion 2 extends from the base member 1, and the cover member projecting portion 8 extends from the cover member 7 so as to face each other. Further, the circuit board 5 is provided with a through hole 9, and is arranged at a position where the base member projecting portion 2 and the cover member projecting portion 8 arranged to face each other are simultaneously inserted.
　ベース部材突出部２もしくはカバー部材突出部８の先端には放熱グリス３が塗布されており、電子制御装置１００は不図示のネジ等の締結部材にて組立てられる際に貫通孔９の壁とベース部材突出部２とカバー部材突出部８が放熱グリス３を介し熱的に接続される。 Thermal paste 3 is applied to the tip of the base member protrusion 2 or the cover member protrusion 8, and the electronic control device 100 is assembled with a fastening member such as a screw (not shown) to the wall of the through hole 9 and the base. The member projecting portion 2 and the cover member projecting portion 8 are thermally connected via the thermal paste 3.
　放熱グリス３にはグリース状、ジェル状などの種類の材料が用いられている。一般的に使用されているのはグリース状の熱伝導材であり、接着性を有する熱硬化樹脂や、低弾性を有する半硬化樹脂等がある。また実装状況などを鑑みて導電性、非導電性の放熱グリス３を選択し使用する。放熱グリス３は、回路基板５の熱による変形や振動、および製造時の公差に対して変形可能な柔軟性を有する、例えば、セラミックフィラーが含有されたシリコン系樹脂を用いた半硬化樹脂が好ましい。貫通孔９への充填については放熱グリス３と回路基板５は略同一平面上に配置される。 The thermal paste 3 uses various types of materials such as grease and gel. Generally used is a grease-like heat conductive material, such as a thermosetting resin having adhesiveness and a semi-curing resin having low elasticity. Further, the conductive and non-conductive thermal paste 3 is selected and used in consideration of the mounting situation and the like. The thermal paste 3 is preferably a semi-cured resin using a silicon-based resin containing a ceramic filler, which has flexibility that can be deformed by heat deformation and vibration of the circuit board 5 and tolerance during manufacturing, for example. .. For filling the through hole 9, the thermal paste 3 and the circuit board 5 are arranged on substantially the same plane.
　発熱部品４は、回路基板５に半田等の接合材で電気的に接続されている。発熱部品４から生じた熱は半田等の接合材を介し回路基板５へ伝わり、回路基板上で滞留している熱は貫通孔９から放熱グリス３を介し熱的に接続されたベース部材突出部２とカバー部材突出部８へと伝わり、ベース部材１とカバー部材７へと放熱される。また貫通孔９はメッキ１０で覆われており、ＧＮＤパターンなどを通じ電気的に発熱部品４と接続されている。発熱部品４から放出される熱は配線パターンを通じメッキ１０に効率よく伝熱される。 The heat generating component 4 is electrically connected to the circuit board 5 with a joining material such as solder. The heat generated from the heat generating component 4 is transferred to the circuit board 5 via a bonding material such as solder, and the heat accumulated on the circuit board is thermally connected from the through hole 9 via the thermal paste 3 to the protruding portion of the base member. It is transmitted to 2 and the protruding portion 8 of the cover member, and heat is dissipated to the base member 1 and the cover member 7. Further, the through hole 9 is covered with plating 10 and is electrically connected to the heat generating component 4 through a GND pattern or the like. The heat released from the heat generating component 4 is efficiently transferred to the plating 10 through the wiring pattern.
　ＧＮＤパターンと接続されたメッキ部とベース部材突出部２、カバー部材突出部８の両方もしくはいずれかが接続される場合、回路基板５とベース部材１、カバー部材７の同電位性が向上することで耐ＥＭＣ性能の向上を行える。 When the plated portion connected to the GND pattern, the base member protruding portion 2, the cover member protruding portion 8 or both are connected, the equipotential properties of the circuit board 5, the base member 1, and the cover member 7 are improved. The EMC resistance can be improved.
　ベース部材１とベース部材突出部２の間には放熱グリス３を回路基板５の略同一平面上に留めるための台座１１が設けられている。台座１１の径は貫通孔９よりも大きい。 A pedestal 11 for keeping the thermal paste 3 on substantially the same plane of the circuit board 5 is provided between the base member 1 and the base member protruding portion 2. The diameter of the pedestal 11 is larger than that of the through hole 9.
　図９、図１０、図１１に示した貫通孔９の形状は、丸、長穴などのバリエーションがあり貫通孔９の径を大きくするほど放熱グリス３を介しベース部材１とカバー部材７に接触する面積が大きくなることで、より効率よく回路基板５からベース部材１とカバー部材７への放熱を行うことができる。また長穴形状にする場合、貫通孔９の４隅はメッキを施せるようにＲを付けた形状になっている。 The shape of the through hole 9 shown in FIGS. 9, 10 and 11 has variations such as a circle and an elongated hole, and the larger the diameter of the through hole 9, the more the base member 1 and the cover member 7 come into contact with each other via the thermal paste 3. By increasing the area to be applied, heat can be dissipated from the circuit board 5 to the base member 1 and the cover member 7 more efficiently. Further, in the case of a long hole shape, the four corners of the through hole 9 are shaped with R so that plating can be applied.
　また貫通孔９の配置位置は、発熱部品４の近辺、基板端などでもよく発熱部品４の近辺に配置すると回路基板全体に広がる前に放熱を行えるため効率よく放熱を行うことができる。 Further, the through hole 9 may be arranged near the heat generating component 4, the edge of the board, or the like, and if it is arranged near the heat generating component 4, heat can be dissipated before it spreads over the entire circuit board, so that heat can be efficiently dissipated.
　一方で基板端に貫通孔９を配置すると発熱部品４の周辺に部品実装と配線を行うためのスペースを確保することができるほか、回路基板５をベース部材１に締結する際に基板端に設置した貫通孔９を用い回路基板５を挟持することでネジ６などの締結具を用いることなく回路基板収納筐体へ組付けを行うことができる。 On the other hand, if the through hole 9 is arranged at the end of the board, a space for mounting and wiring the component can be secured around the heat generating component 4, and the circuit board 5 is installed at the edge of the board when the circuit board 5 is fastened to the base member 1. By sandwiching the circuit board 5 using the through hole 9, it is possible to assemble the circuit board to the circuit board storage housing without using fasteners such as screws 6.
　ベース部材１とカバー部材７はそれぞれアルミニウム（例えば、ＡＤＣ１２）等の熱伝導性に優れた金属材料により形成されている。また、鉄などの板金、あるいは樹脂材料等の非金属材料により形成し、低コスト化および軽量化を図ることもできる。カバー部材７も同様に、鉄などの板金、あるいは樹脂材料等の非金属材料により形成することができる。 The base member 1 and the cover member 7 are each made of a metal material having excellent thermal conductivity, such as aluminum (for example, ADC12). Further, it can be formed of a sheet metal such as iron or a non-metal material such as a resin material to reduce the cost and weight. Similarly, the cover member 7 can be formed of a sheet metal such as iron or a non-metal material such as a resin material.
　本実施形態の特徴は、以下のようにまとめることもできる。 The features of this embodiment can also be summarized as follows.
　図２に示すように、電子制御装置１００は、少なくとも、回路基板５と、第１筐体（ベース部材１）と、第２筐体（カバー部材７）と、放熱グリス３と、を備える。回路基板５は、発熱部品４が搭載され、貫通孔９を有する。第１筐体（ベース部材１）は、貫通孔９に向かって突出する第１突出部（台座１１）を有する。第２筐体（カバー部材７）は、第１突出部（台座１１）と対向する第２突出部（カバー部材突出部８）を有する。放熱グリス３は、貫通孔９を形成する回路基板５の内壁から第１突出部（台座１１）及び第２突出部（カバー部材突出部８）へ熱を伝導する。 As shown in FIG. 2, the electronic control device 100 includes at least a circuit board 5, a first housing (base member 1), a second housing (cover member 7), and thermal paste 3. The circuit board 5 is mounted with a heat generating component 4 and has a through hole 9. The first housing (base member 1) has a first protruding portion (pedestal 11) that protrudes toward the through hole 9. The second housing (cover member 7) has a second protruding portion (cover member protruding portion 8) facing the first protruding portion (pedestal 11). The thermal paste 3 conducts heat from the inner wall of the circuit board 5 forming the through hole 9 to the first protruding portion (pedestal 11) and the second protruding portion (cover member protruding portion 8).
　これにより、発熱部品４の熱は、貫通孔９を形成する回路基板５の内壁、放熱グリス３、第１突出部（台座１１）、第２突出部（カバー部材突出部８）、第１筐体（ベース部材１）、第２筐体（カバー部材７）を介して大気中に放熱される。なお、本実施形態では、ベース部材１、カバー部材７を、それぞれ第１筐体、第２筐体と呼んでいるが、逆であってもよい。また、台座１１は、ベース部材１に設けられているが、カバー部材７に設けられてもよい。 As a result, the heat of the heat generating component 4 is transferred to the inner wall of the circuit board 5 forming the through hole 9, the thermal paste 3, the first protruding portion (pedestal 11), the second protruding portion (cover member protruding portion 8), and the first casing. Heat is dissipated into the atmosphere via the body (base member 1) and the second housing (cover member 7). In the present embodiment, the base member 1 and the cover member 7 are referred to as a first housing and a second housing, respectively, but the opposite may be used. Further, although the pedestal 11 is provided on the base member 1, it may be provided on the cover member 7.
　詳細には、第１突出部（台座１１）は、第２突出部（カバー部材突出部８）と対向する凸部（ベース部材突出部２）を有する。放熱グリス３は、貫通孔９を形成する回路基板５の内壁と、凸部（ベース部材突出部２）及び第２突出部（カバー部材突出部８）との間に充填される。これにより、発熱部品４の熱は、貫通孔９を形成する回路基板５の内壁、放熱グリス３、凸部（ベース部材突出部２）、第１突出部（台座１１）、第２突出部（カバー部材突出部８）、第１筐体（ベース部材１）、第２筐体（カバー部材７）を介して大気中に放熱される。 Specifically, the first protruding portion (pedestal 11) has a convex portion (base member protruding portion 2) facing the second protruding portion (cover member protruding portion 8). The thermal paste 3 is filled between the inner wall of the circuit board 5 forming the through hole 9 and the convex portion (base member projecting portion 2) and the second projecting portion (cover member projecting portion 8). As a result, the heat of the heat generating component 4 is transferred to the inner wall of the circuit board 5 forming the through hole 9, the thermal paste 3, the convex portion (base member projecting portion 2), the first projecting portion (pedestal 11), and the second projecting portion (the pedestal 11). Heat is dissipated into the atmosphere via the cover member projecting portion 8), the first housing (base member 1), and the second housing (cover member 7).
　図５に示すように、凸部（ベース部材突出部２）の先端は、貫通孔９の内部に位置する。第１突出部（台座１１）は、貫通孔９を塞ぐ。これにより、例えば、放熱グリス３は発熱部品４を搭載する回路基板５の面側にもれない。また、本実施形態では、組立時にベース部材１が鉛直方向下側になり、台座１１で回路基板５を支持することができる。 As shown in FIG. 5, the tip of the convex portion (base member protruding portion 2) is located inside the through hole 9. The first protrusion (pedestal 11) closes the through hole 9. As a result, for example, the thermal paste 3 does not leak to the surface side of the circuit board 5 on which the heat generating component 4 is mounted. Further, in the present embodiment, the base member 1 is on the lower side in the vertical direction at the time of assembly, and the circuit board 5 can be supported by the pedestal 11.
　本実施形態では、凸部（ベース部材突出部２）と第２突出部（カバー部材突出部８）は、先細り形状である。これにより、例えば、凸部（ベース部材突出部２）と回路基板５の貫通孔９と第２突出部（カバー部材突出部８）の位置決めが容易となる。 In the present embodiment, the convex portion (base member projecting portion 2) and the second projecting portion (cover member projecting portion 8) have a tapered shape. This facilitates, for example, positioning of the convex portion (base member protruding portion 2), the through hole 9 of the circuit board 5, and the second protruding portion (cover member protruding portion 8).
　回路基板５は、グランドに接続される配線パターンを示すＧＮＤパターン１３を有し、貫通孔９は、ＧＮＤパターン１３と接続されたメッキ１０を有する。第１突出部（台座１１）は、メッキ１０に接する。これにより、少なくともＧＮＤパターン１３、メッキ１０、第１突出部（台座１１）、第１筐体（ベース部材１）が同電位となる。 The circuit board 5 has a GND pattern 13 indicating a wiring pattern connected to the ground, and the through hole 9 has a plating 10 connected to the GND pattern 13. The first protruding portion (pedestal 11) is in contact with the plating 10. As a result, at least the GND pattern 13, the plating 10, the first protrusion (pedestal 11), and the first housing (base member 1) have the same potential.
　なお、図５等において、メッキ１０の高さは、レジスト１４より低い。そのため、台座１１がメッキ１０と確実に接触するように、メッキ１０の端部１０Ｅ（図５）を台座１１の外周よりも外側まで広げている。 In addition, in FIG. 5 and the like, the height of the plating 10 is lower than that of the resist 14. Therefore, the end portion 10E (FIG. 5) of the plating 10 is extended to the outside of the outer circumference of the pedestal 11 so that the pedestal 11 is surely in contact with the plating 10.
　図９に示す例では、貫通孔９は、発熱部品４の角に隣接し、発熱部品４を搭載する回路基板５の面に対し、円状に形成される。これにより、例えば、発熱部品４のリード端子と貫通孔９との干渉を避けつつ、貫通孔９の加工が容易となる。 In the example shown in FIG. 9, the through hole 9 is adjacent to the corner of the heat generating component 4 and is formed in a circular shape with respect to the surface of the circuit board 5 on which the heat generating component 4 is mounted. This facilitates the processing of the through hole 9, for example, while avoiding interference between the lead terminal of the heat generating component 4 and the through hole 9.
　図１０に示す例では、貫通孔９は、発熱部品４の角に隣接し、発熱部品４を搭載する回路基板５の面に対し、Ｌ字状に形成される。これにより、例えば、発熱部品４のリード端子と貫通孔９との干渉を避けつつ、回路基板５と放熱グリス３の接触面積を大きくすることができる。 In the example shown in FIG. 10, the through hole 9 is adjacent to the corner of the heat generating component 4 and is formed in an L shape with respect to the surface of the circuit board 5 on which the heat generating component 4 is mounted. Thereby, for example, the contact area between the circuit board 5 and the thermal paste 3 can be increased while avoiding the interference between the lead terminal of the heat generating component 4 and the through hole 9.
　図１１に示す例では、貫通孔９は、回路基板５の縁に隣接し、発熱部品４を搭載する回路基板５の面に対し、直線状に形成される。これにより、例えば、配線パターンと貫通孔９との干渉を避けつつ、回路基板５と放熱グリス３の接触面積をさらに大きくすることができる。 In the example shown in FIG. 11, the through hole 9 is adjacent to the edge of the circuit board 5 and is formed linearly with respect to the surface of the circuit board 5 on which the heat generating component 4 is mounted. Thereby, for example, the contact area between the circuit board 5 and the thermal paste 3 can be further increased while avoiding the interference between the wiring pattern and the through hole 9.
　以上説明したように、本実施形態によれば、放熱効率を向上することができる。 As described above, according to the present embodiment, the heat dissipation efficiency can be improved.
　［実施形態２］
　図３は、実施形態１の構成に加えて、ベース部材突出部２に放熱グリス３を塗布する為の溝部１２を設けている。溝部１２に溜められた放熱グリス３はカバー部材突出部８により押圧されることで貫通孔９の内側に広がり、ベース部材突出部２とカバー部材突出部８は放熱グリス３を介し熱的に結合される。 [Embodiment 2]
In FIG. 3, in addition to the configuration of the first embodiment, the groove portion 12 for applying the thermal paste 3 is provided on the base member protruding portion 2. The thermal paste 3 stored in the groove 12 spreads inside the through hole 9 by being pressed by the cover member protrusion 8, and the base member protrusion 2 and the cover member protrusion 8 are thermally coupled via the thermal paste 3. Will be done.
　溝部１２を作ることで放熱グリス３の塗布位置、押圧位置の定量化を行い、個体差による放熱性能のバラつきを抑える役割を果たす。 By creating the groove portion 12, the application position and pressing position of the thermal paste 3 are quantified, and the role of suppressing the variation in the thermal paste performance due to individual differences.
　本実施形態の特徴は、以下のようにまとめることもできる。 The features of this embodiment can also be summarized as follows.
　図６に示すように、凸部（ベース部材突出部２）は、第２突出部（カバー部材突出部８）と対向する凹部（溝部１２）を有する。放熱グリス３は、第２突出部（カバー部材突出部８）と凹部（溝部１２）との間に充填される。これにより、例えば、凸部（ベース部材突出部２）と放熱グリス３の接触面積を大きくすることができる。 As shown in FIG. 6, the convex portion (base member protruding portion 2) has a concave portion (groove portion 12) facing the second protruding portion (cover member protruding portion 8). The thermal paste 3 is filled between the second protruding portion (cover member protruding portion 8) and the recess (groove portion 12). Thereby, for example, the contact area between the convex portion (base member protruding portion 2) and the thermal paste 3 can be increased.
　［変形例］
　また図８のように、ベース部材突出部２を無くし台座１１に溝部１２を作ることもできる。換言すれば、図７に示すように、第１突出部（台座１１）は、第２突出部（カバー部材突出部８）と対向する凹部（溝部１２）を有する。これにより、放熱グリス３の凹部（溝部１２）への塗布が図６の例よりも容易となる。放熱グリス３は、第２突出部（カバー部材突出部８）と凹部（溝部１２）との間に充填される。第２突出部（カバー部材突出部８）の先端は、凹部（溝部１２）の内部に位置する。第１突出部（台座１１）は、貫通孔９を塞ぐ。これにより、例えば、放熱グリス３は発熱部品４を搭載する回路基板５の面側にもれ出しにくい。 [Modification example]
Further, as shown in FIG. 8, the groove portion 12 can be formed in the pedestal 11 by eliminating the base member protruding portion 2. In other words, as shown in FIG. 7, the first protrusion (pedestal 11) has a recess (groove 12) facing the second protrusion (cover member protrusion 8). This makes it easier to apply the thermal paste 3 to the recess (groove 12) than in the example of FIG. The thermal paste 3 is filled between the second protruding portion (cover member protruding portion 8) and the recess (groove portion 12). The tip of the second protrusion (cover member protrusion 8) is located inside the recess (groove 12). The first protrusion (pedestal 11) closes the through hole 9. As a result, for example, the thermal paste 3 does not easily leak to the surface side of the circuit board 5 on which the heat generating component 4 is mounted.
　第１突出部（台座１１）に凹部（溝部１２）を設ける場合、組立て時にカバー部材突出部８が放熱グリス３と接触するようにカバー部材突出部８の高さを延伸させる必要がある。 When the recess (groove 12) is provided in the first protrusion (pedestal 11), it is necessary to extend the height of the cover member protrusion 8 so that the cover member protrusion 8 comes into contact with the thermal paste 3 at the time of assembly.
　また、図６～図８に示すように、溝部１２の形状については押圧された放熱グリス３が溝部１２の外に流れ出やすくさせるために溝部１２はテーパー形状になっている。換言すれば、凹部（溝部１２）は、凹部（溝部１２）の底に向かうにつれて狭くなるようにテーパーを有する。 Further, as shown in FIGS. 6 to 8, the groove portion 12 has a tapered shape so that the pressed thermal paste 3 can easily flow out of the groove portion 12. In other words, the recess (groove 12) has a taper so that it narrows toward the bottom of the recess (groove 12).
　なお、ある実施形態の構成の一部を他の実施形態の構成に置き換えることが可能であり、また、ある実施形態の構成に他の実施形態の構成を加えることも可能である。また、各実施形態の構成の一部について、他の構成の追加・削除・置換をすることが可能である。 It is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. Further, it is possible to add / delete / replace a part of the configuration of each embodiment with another configuration.
　本発明の実施形態は、以下の態様であってもよい。 The embodiment of the present invention may have the following aspects.
　（１）．発熱部品４が搭載された回路基板５と、回路基板５を挟持するベース部材１とカバー部材７を備える回路基板収納筐体を有し、ベース部材１及びカバー部材７には回路基板５側に突出する第一、第二の突出部がそれぞれ設けられている。回路基板５には貫通孔９が設けられており、第一、第二の突出部は貫通孔９内で対向するように配置されている。第一、第二の突出部との間には放熱グリス３が塗布されており、筐体組立てを行う際に第一、第二の突出部に押圧されることにより貫通孔９内に放熱グリス３が充填されることを特徴とする電子制御装置。 (1). It has a circuit board 5 on which a heat generating component 4 is mounted, a circuit board storage housing including a base member 1 and a cover member 7 that sandwich the circuit board 5, and the base member 1 and the cover member 7 are on the circuit board 5 side. The first and second projecting portions are provided, respectively. The circuit board 5 is provided with a through hole 9, and the first and second protrusions are arranged so as to face each other in the through hole 9. Thermal paste 3 is applied between the first and second protrusions, and when the housing is assembled, the heat radiation grease is pressed into the through holes 9 by being pressed by the first and second protrusions. An electronic control device characterized in that 3 is filled.
　（２）．前記第一の突出部及び前記第二の突出部の先端には、凸部もしくは凹部のいずれかが設けられ前記放熱グリス３は前記凹部内に塗布される。前記放熱グリス３は前記凸部と前記凹部により押圧されることにより前記貫通孔９に充填され、前記放熱グリス３と前記回路基板５は略同一平面上に配置される。さらに前記凸部と前記ベース部材１もしくは前記カバー部材７の間には台座１１が設けられ、もしくは前記凸部には放熱グリス３が流れ出ることを防止するための台座１１が設けられ前記台座１１の断面積は、前記貫通孔９の断面積よりも大きいことを特徴とする（１）に記載の電子制御装置。 (2). Either a convex portion or a concave portion is provided at the tip of the first protruding portion and the second protruding portion, and the thermal paste 3 is applied into the concave portion. The thermal paste 3 is filled in the through hole 9 by being pressed by the convex portion and the concave portion, and the thermal paste 3 and the circuit board 5 are arranged on substantially the same plane. Further, a pedestal 11 is provided between the convex portion and the base member 1 or the cover member 7, or a pedestal 11 for preventing the thermal paste 3 from flowing out is provided in the convex portion of the pedestal 11. The electronic control device according to (1), wherein the cross-sectional area is larger than the cross-sectional area of the through hole 9.
　（３）．前記貫通孔９の断面積より大きい断面積を有する台座１１に放熱グリス３を塗布するための凹部を設置することで、より広い面積で貫通孔９に放熱グリス３を充填させることができることを特徴とする（２）に記載の電子制御装置。 (3). By providing a recess for applying the thermal paste 3 to the pedestal 11 having a cross section larger than the cross-sectional area of the through hole 9, the through hole 9 can be filled with the thermal paste 3 in a wider area. The electronic control device according to (2).
　（４）．前記貫通孔９を基板端（回路基板５の端）に設置することで、ネジ６などの基板締結具を用いることなく回路基板収納筐体へ回路基板５を挟持させることを特徴とする（１）に記載の電子制御装置。 (4). By installing the through hole 9 at the end of the board (the end of the circuit board 5), the circuit board 5 can be sandwiched between the circuit board storage housings without using a board fastener such as a screw 6 (1). ). The electronic control device.
　（１）～（４）によれば、発熱部品４から発せられ、回路基板５で滞留している熱を効率よく回路基板収納筐体へ放熱させる電子制御装置を提供することができる。 According to (1) to (4), it is possible to provide an electronic control device that efficiently dissipates the heat generated from the heat generating component 4 and accumulated in the circuit board 5 to the circuit board storage housing.
１００…電子制御装置
１…ベース部材
２…ベース部材突出部
３…放熱グリス
４…発熱部品
５…回路基板
６…ネジ
７…カバー部材
８…カバー部材突出部
９…貫通孔
１０…メッキ
１０Ｅ…メッキの端部
１１…台座
１２…溝部
１３…ＧＮＤパターン
１４…レジスト 100 ... Electronic control device 1 ... Base member 2 ... Base member projecting part 3 ... Thermal paste 4 ... Heat generating component 5 ... Circuit board 6 ... Screw 7 ... Cover member 8 ... Cover member projecting part 9 ... Through hole 10 ... Plating 10E ... Plating End 11 ... Pedestal 12 ... Groove 13 ... GND pattern 14 ... Resist

Claims (13)

  1. 　発熱部品が搭載され、貫通孔を有する回路基板と、
    　前記貫通孔に向かって突出する第１突出部を有する第１筐体と、
    　前記第１突出部と対向する第２突出部を有する第２筐体と、
    　前記貫通孔を形成する前記回路基板の内壁から前記第１突出部及び前記第２突出部へ熱を伝導する放熱グリスと、
    　を備えることを特徴とする電子制御装置。     A circuit board on which heat-generating components are mounted and has through holes,
    A first housing having a first protrusion protruding toward the through hole, and a first housing.
    A second housing having a second protrusion facing the first protrusion,
    Thermal paste that conducts heat from the inner wall of the circuit board that forms the through hole to the first protrusion and the second protrusion.
    An electronic control device characterized by comprising.
  2. 　請求項１に記載の電子制御装置であって、
    　前記第１突出部は、
    　前記第２突出部と対向する凸部を有し、
    　前記放熱グリスは、
    　前記貫通孔を形成する前記回路基板の内壁と、前記凸部及び前記第２突出部との間に充填される
    　ことを特徴とする電子制御装置。     The electronic control device according to claim 1.
    The first protrusion is
    It has a convex portion facing the second protruding portion and has a convex portion.
    The thermal paste is
    An electronic control device characterized in that the inner wall of the circuit board forming the through hole is filled between the convex portion and the second protruding portion.
  3. 　請求項２に記載の電子制御装置であって、
    　前記凸部は、
    　前記第２突出部と対向する凹部を有し、
    　前記放熱グリスは、
    　前記第２突出部と前記凹部との間に充填される
    　ことを特徴とする電子制御装置。     The electronic control device according to claim 2.
    The convex part is
    It has a recess facing the second protrusion and has a recess.
    The thermal paste is
    An electronic control device characterized in that it is filled between the second protrusion and the recess.
  4. 　請求項３に記載の電子制御装置であって、
    　前記凹部は、
    　底に向かうにつれて狭くなるようにテーパーを有する
    　ことを特徴とする電子制御装置。     The electronic control device according to claim 3.
    The recess is
    An electronic control device characterized by having a taper that narrows toward the bottom.
  5. 　請求項４に記載の電子制御装置であって、
    　前記凸部の先端は、
    　前記貫通孔の内部に位置し、
    　前記第１突出部は、
    　前記貫通孔を塞ぐ
    　ことを特徴とする電子制御装置。     The electronic control device according to claim 4.
    The tip of the convex portion
    Located inside the through hole
    The first protrusion is
    An electronic control device characterized by closing the through hole.
  6. 　請求項５に記載の電子制御装置であって、
    　前記凸部は、
    　先細り形状である
    　ことを特徴とする電子制御装置。     The electronic control device according to claim 5.
    The convex part is
    An electronic control device characterized by a tapered shape.
  7. 　請求項６に記載の電子制御装置であって、
    　前記第２突出部は、
    　先細り形状である
    　ことを特徴とする電子制御装置。     The electronic control device according to claim 6.
    The second protrusion is
    An electronic control device characterized by a tapered shape.
  8. 　請求項１に記載の電子制御装置であって、
    　前記第１突出部は、
    　前記第２突出部と対向する凹部を有し、
    　前記放熱グリスは、
    　前記第２突出部と前記凹部との間に充填される
    　ことを特徴とする電子制御装置。     The electronic control device according to claim 1.
    The first protrusion is
    It has a recess facing the second protrusion and has a recess.
    The thermal paste is
    An electronic control device characterized in that it is filled between the second protrusion and the recess.
  9. 　請求項８に記載の電子制御装置であって、
    　前記第２突出部の先端は、
    　前記凹部の内部に位置し、
    　前記第１突出部は、
    　前記貫通孔を塞ぐ
    　ことを特徴とする電子制御装置。     The electronic control device according to claim 8.
    The tip of the second protrusion is
    Located inside the recess,
    The first protrusion is
    An electronic control device characterized by closing the through hole.
  10. 　請求項１に記載の電子制御装置であって、
    　前記回路基板は、
    　ＧＮＤパターンを有し、
    　前記貫通孔は、
    　前記ＧＮＤパターンと接続されたメッキを有し、
    　前記第１突出部は、
    　前記メッキに接する
    　ことを特徴とする電子制御装置。     The electronic control device according to claim 1.
    The circuit board is
    Has a GND pattern and
    The through hole is
    It has a plating connected to the GND pattern and has
    The first protrusion is
    An electronic control device characterized by being in contact with the plating.
  11. 　請求項１に記載の電子制御装置であって、
    　前記貫通孔は、
    　前記発熱部品の角に隣接し、
    　前記発熱部品を搭載する回路基板の面に対し、円状に形成される
    　ことを特徴とする電子制御装置。     The electronic control device according to claim 1.
    The through hole is
    Adjacent to the corner of the heat generating component,
    An electronic control device characterized in that it is formed in a circular shape with respect to the surface of a circuit board on which the heat generating component is mounted.
  12. 　請求項１に記載の電子制御装置であって、
    　前記貫通孔は、
    　前記発熱部品の角に隣接し、
    　前記発熱部品を搭載する回路基板の面に対し、Ｌ字状に形成される
    　ことを特徴とする電子制御装置。     The electronic control device according to claim 1.
    The through hole is
    Adjacent to the corner of the heat generating component,
    An electronic control device characterized in that it is formed in an L shape with respect to the surface of a circuit board on which the heat generating component is mounted.
  13. 　請求項１に記載の電子制御装置であって、
    　前記貫通孔は、
    　前記回路基板の縁に隣接し、
    　前記発熱部品を搭載する回路基板の面に対し、直線状に形成される
    　ことを特徴とする電子制御装置。     The electronic control device according to claim 1.
    The through hole is
    Adjacent to the edge of the circuit board
    An electronic control device characterized in that it is formed linearly with respect to the surface of a circuit board on which the heat generating component is mounted.
PCT/JP2021/031897 2020-12-25 2021-08-31 Electronic control device WO2022137653A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022571044A JPWO2022137653A1 (en) 2020-12-25 2021-08-31
CN202180081516.1A CN116583944A (en) 2020-12-25 2021-08-31 Electronic control device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-216954 2020-12-25
JP2020216954 2020-12-25

Publications (1)

Publication Number Publication Date
WO2022137653A1 true WO2022137653A1 (en) 2022-06-30

Family

ID=82158934

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/031897 WO2022137653A1 (en) 2020-12-25 2021-08-31 Electronic control device

Country Status (3)

Country Link
JP (1) JPWO2022137653A1 (en)
CN (1) CN116583944A (en)
WO (1) WO2022137653A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009182182A (en) * 2008-01-31 2009-08-13 Nippon Seiki Co Ltd Heat dissipation structure of electronic component storage case body
JP2018006413A (en) * 2016-06-28 2018-01-11 株式会社デンソー Electronic device and manufacturing method for electronic device
JP2018064120A (en) * 2017-12-25 2018-04-19 日立オートモティブシステムズ株式会社 Electronic control device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009182182A (en) * 2008-01-31 2009-08-13 Nippon Seiki Co Ltd Heat dissipation structure of electronic component storage case body
JP2018006413A (en) * 2016-06-28 2018-01-11 株式会社デンソー Electronic device and manufacturing method for electronic device
JP2018064120A (en) * 2017-12-25 2018-04-19 日立オートモティブシステムズ株式会社 Electronic control device

Also Published As

Publication number Publication date
JPWO2022137653A1 (en) 2022-06-30
CN116583944A (en) 2023-08-11

Similar Documents

Publication Publication Date Title
EP1544915B1 (en) Electronic module heat sink mounting arrangement
US10194523B2 (en) Circuit assembly, electrical junction box, and manufacturing method for circuit assembly
JP4638923B2 (en) Control device
US6084776A (en) Control device, consisting of at least two housing parts
JP4892527B2 (en) Electronic control device
JP5071558B2 (en) Circuit module
US20080144290A1 (en) Electronic Unit and Method For Manufacturing an Electronic Unit
JP3281220B2 (en) Circuit module cooling system
JP7023298B2 (en) Power converter and manufacturing method of power converter
JP2011249520A (en) Electronic control device
WO2017161738A1 (en) Heat dissipation shield assembly
JP7016054B2 (en) Power supplies, headlights, and mobiles
WO2014132399A1 (en) Heat dissipating structure
JP2001332670A (en) Mounting structure of semiconductor device
JP2008041718A (en) Box for electronic device
JP2018182147A (en) Substrate with metal member, circuit configuration body, and electric connection box
WO2022137653A1 (en) Electronic control device
JPH09283886A (en) Substrate mounting method, mounting substrate structure and electronic apparatus using mounting substrate structure
JP2017162860A (en) Electronic control device
US7432591B1 (en) Thermal enhanced plastic ball grid array with heat sink attachment option
JPH11163564A (en) Electronic apparatus and its manufacture
CN211088249U (en) Heat dissipation structure for components and electronic device
CN112106454A (en) Circuit arrangement
JP7223639B2 (en) electronic controller
WO2022102149A1 (en) Electronic device and method for manufacturing electronic device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21909811

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022571044

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 202180081516.1

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21909811

Country of ref document: EP

Kind code of ref document: A1