CN116583944A - Electronic control device - Google Patents
Electronic control device Download PDFInfo
- Publication number
- CN116583944A CN116583944A CN202180081516.1A CN202180081516A CN116583944A CN 116583944 A CN116583944 A CN 116583944A CN 202180081516 A CN202180081516 A CN 202180081516A CN 116583944 A CN116583944 A CN 116583944A
- Authority
- CN
- China
- Prior art keywords
- protruding portion
- hole
- electronic control
- circuit board
- control device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
Abstract
The electronic control device (100) is provided with a circuit board (5), a first housing (base member (1)), a second housing (cover member (7)), and a heat dissipation grease (3). The circuit board (5) is provided with a heat generating component (4) and has a through hole (9). The first housing (base member (1)) has a first protruding portion (pedestal 11) protruding toward the through hole (9). The second frame (cover member (7)) has a second protruding portion (cover member protruding portion (8)) that faces the first protruding portion (pedestal (11)). The heat dissipation grease (3) conducts heat from the inner wall of the circuit board (5) in which the through holes (9) are formed to the first protruding portion (pedestal (11)) and the second protruding portion (cover member protruding portion (8)).
Description
Technical Field
The present invention relates to an electronic control device.
Background
In order to realize the high-speed automatic operation function, the in-vehicle electronic control device is equipped with a microcomputer corresponding to the high-speed operation and the high-speed processing, and the operation capability of the microcomputer increases year by year and the heat generation amount increases proportionally with the increase in the required height of the automatic operation function.
On the other hand, from the viewpoints of a mounted vehicle space and a lightweight housing, there is a problem that it is necessary to suppress an increase in the size of the housing and to improve heat dissipation.
As background of the art, there is japanese patent laid-open No. 2009-182182 (patent document 1). In this publication, "heat dissipation structure in electronic component housing case" is disclosed. Provided is a heat radiation structure of an electronic component housing case, wherein: the heat dissipation structure is composed of a circuit board for mounting the heat-generating electronic component and a housing for accommodating the circuit board, wherein the housing is formed by two housings so as to cover the front side and the back side of the circuit board, heat transfer protruding parts which are in contact with the heat-generating electronic component are integrally arranged on the housing, heat can be dissipated to the housing through the heat transfer protruding parts, and the heat dissipation structure is also used as a positioning pin of the circuit board by using the protruding parts for accommodating the housing, so that the assembly of the components can be easily performed.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2009-182182
Disclosure of Invention
Problems to be solved by the invention
However, the heat dissipation structure of patent document 1 is a structure in which a heat transfer protrusion extending from a case contacts a surface of a circuit board or a heat generating electronic component. Therefore, the distance between the heat transfer protrusion and the heat source is not equal on the front surface side and the rear surface side, and the heat transfer amount is biased to one side, so that the heat radiation efficiency cannot be maximized.
The invention aims to provide an electronic control device capable of improving heat dissipation efficiency.
Technical means for solving the problems
In order to achieve the above object, an electronic control device of the present invention includes: a circuit board having a heat generating component mounted thereon and having a through hole; a first frame body having a first protruding portion protruding toward the through hole; a second frame body having a second protruding portion opposite to the first protruding portion; and a heat dissipation grease that conducts heat from the inner wall of the circuit board, in which the through hole is formed, to the first protruding portion and the second protruding portion.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the invention, the heat dissipation efficiency can be improved. The problems, configurations, and effects other than those described above will be apparent from the following description of the embodiments.
Drawings
Fig. 1 is a cross-sectional view (developed view) of embodiment 1.
Fig. 2 is a cross-sectional view (assembled view) of embodiment 1.
Fig. 3 is a cross-sectional view (developed view) of embodiment 2.
Fig. 4 is a cross-sectional view (assembled view) of embodiment 2.
Fig. 5 is a configuration example 1 of the through hole portion.
Fig. 6 is a configuration example 2 of the through hole portion.
Fig. 7 is a configuration example 3 of the through hole portion.
Fig. 8 is a cross-sectional view showing the shape of the groove.
Fig. 9 shows the arrangement and shape of the through holes in example 1.
Fig. 10 shows the arrangement and shape of the through holes in example 2.
Fig. 11 shows the arrangement and shape of the through holes in example 3.
Detailed Description
Embodiments of the present electronic control device and heat dissipation method are described below with reference to the drawings. However, the embodiments described below are merely examples, and are not intended to exclude various modifications and applications of techniques not explicitly described in the embodiments. That is, the present embodiment can be variously modified and implemented within a range not departing from the gist thereof. Each of the drawings does not include only the constituent elements shown in the drawings, and may include other functions and the like.
Embodiment 1
Fig. 1 is an example of a configuration diagram of a heat dissipation structure of the present embodiment. The electronic control device 100 is configured such that a circuit board 5 is sandwiched between a base member 1 and a cover member 7, and the circuit board 5 is fixed to the base member 1 by fasteners such as screws 6. A base member projection 2 extends from the base member 1, and a cover member projection 8 extends from the cover member 7, opposite to each other. The circuit board 5 is provided with a through hole 9, and is disposed at a position where the base member protruding portion 2 and the cover member protruding portion 8, which are disposed to face each other, are inserted at the same time.
The heat dissipation grease 3 is applied to the tip of the base member protruding portion 2 or the cover member protruding portion 8, and when the electronic control device 100 is assembled by a fastening member such as a screw, not shown, the wall of the through hole 9 and the base member protruding portion 2 and the cover member protruding portion 8 are thermally connected via the heat dissipation grease 3.
The heat dissipation grease 3 is made of a grease paste, gel, or other material. A heat conductive material in the form of a grease is generally used, and there are thermosetting resins having adhesion, semi-curing resins having low elasticity, and the like. In addition, in view of the installation condition, etc., the conductive and nonconductive heat dissipation grease 3 is selected and used. The heat dissipation grease 3 preferably uses a semi-cured resin having flexibility capable of deforming against deformation or vibration due to heat of the circuit board 5 and tolerance in manufacturing, for example, a silicone resin containing a ceramic filler. The heat dissipation grease 3 and the circuit board 5 are disposed on the same plane for filling the through hole 9.
The heat generating component 4 is electrically connected to the circuit board 5 via a bonding material such as solder. The heat generated from the heat generating component 4 is transferred to the circuit board 5 via a bonding material such as solder, and the heat retained on the circuit board is transferred from the through hole 9 to the thermally connected base member protruding portion 2 and cover member protruding portion 8 via the heat dissipation grease 3, and is dissipated to the base member 1 and cover member 7. The through hole 9 is covered with a plating layer 10, and is electrically connected to the heat generating component 4 by a GND pattern or the like. The heat emitted from the heat generating component 4 is efficiently transferred to the plating layer 10 through the wiring pattern.
When the plating portion connected to the GND pattern is connected to either or both of the base member protruding portion 2 and the cover member protruding portion 8, the EMC resistance can be improved by improving the potentioability of the circuit board 5 to the base member 1 and the cover member 7.
A pedestal 11 for leaving the heat dissipation grease 3 on substantially the same plane as the circuit board 5 is provided between the base member 1 and the base member protruding portion 2. The diameter of the pedestal 11 is larger than the diameter of the through hole 9.
The shape of the through hole 9 shown in fig. 9, 10, 11 is changed by a circle, a long hole, or the like, and the larger the diameter of the through hole 9 is, the larger the area of contact with the base member 1 and the cover member 7 via the heat dissipation grease 3 is, so that heat dissipation from the circuit board 5 to the base member 1 and the cover member 7 can be performed more effectively. In addition, in the case of forming in a long hole shape, four corners of the through hole 9 are formed in a shape with R so as to perform plating.
The through holes 9 may be disposed in the vicinity of the heat generating component 4, at the substrate end, or the like, and if disposed in the vicinity of the heat generating component 4, heat can be dissipated before being spread over the entire circuit board, and therefore heat can be dissipated with high efficiency.
On the other hand, if the through-holes 9 are provided at the substrate end, in addition to the space for mounting and wiring components being secured around the heat generating component 4, when the circuit board 5 is fastened to the base member 1, the circuit board 5 is held by the through-holes 9 provided at the substrate end, and thus the circuit board housing case can be assembled without using a fastener such as the screw 6.
The base member 1 and the cover member 7 are each formed of a metal material having excellent heat conductivity such as aluminum (for example, ADC 12). Further, the metal plate may be made of a nonmetallic material such as iron or a resin material, and the cost and weight may be reduced. The cover member 7 may be formed of a nonmetallic material such as sheet metal of iron or a resin material.
The features of the present embodiment can be summarized as follows.
As shown in fig. 2, the electronic control device 100 includes at least a circuit board 5, a first housing (base member 1), a second housing (cover member 7), and a heat dissipation grease 3. The circuit board 5 is mounted with a heat generating component 4 and has a through hole 9. The first housing (base member 1) has a first protruding portion (pedestal 11) protruding toward the through hole 9. The second frame (cover member 7) has a second protruding portion (cover member protruding portion 8) opposite to the first protruding portion (pedestal 11). The heat dissipation grease 3 transfers heat from the inner wall of the circuit board 5, in which the through hole 9 is formed, to the first protruding portion (the pedestal 11) and the second protruding portion (the cover member protruding portion 8).
Thereby, the heat of the heat generating component 4 is radiated to the atmosphere through the inner wall of the circuit board 5, which forms the through hole 9, the heat radiation grease 3, the first protruding portion (pedestal 11), the second protruding portion (cover member protruding portion 8), the first housing (base member 1), and the second housing (cover member 7). In the present embodiment, the base member 1 and the cover member 7 are referred to as a first housing and a second housing, respectively, but the opposite may be adopted. The pedestal 11 is provided on the base member 1, but may be provided on the cover member 7.
Specifically, the first protruding portion (the pedestal 11) has a convex portion (the base member protruding portion 2) opposing the second protruding portion (the cover member protruding portion 8). The heat dissipation grease 3 fills between the inner wall of the circuit board 5 where the through hole 9 is formed and the convex portion (the base member protruding portion 2) and the 2 nd protruding portion (the cover member protruding portion 8). Thereby, heat of the heat generating component 4 is radiated to the atmosphere through the inner wall of the circuit board 5, which forms the through hole 9, the heat radiation grease 3, the convex portion (base member protruding portion 2), the first protruding portion (pedestal 11), the second protruding portion (cover member protruding portion 8), the first frame (base member 1), and the second frame (cover member 7).
As shown in fig. 5, the tip of the convex portion (base member protruding portion 2) is located inside the through hole 9. The first protruding portion (pedestal 11) blocks the through hole 9. Thus, for example, the heat dissipation grease 3 does not leak to the surface side of the circuit board 5 on which the heat generating component 4 is mounted. In the present embodiment, the base member 1 is positioned at the lower side in the vertical direction when assembled, and the circuit board 5 can be supported by the pedestal 11.
In the present embodiment, the convex portion (base member protruding portion 2) and the second protruding portion (cover member protruding portion 8) are tapered in shape. This facilitates positioning of, for example, the convex portion (base member protruding portion 2) and the through hole 9 and the second protruding portion (cover member protruding portion 8) of the circuit board 5.
The circuit board 5 has a GND pattern 13 indicating a wiring pattern of a ground connection, and the through hole 9 has a plating layer 10 connected to the GND pattern 13. The first protruding portion (the pedestal 11) is in contact with the plating layer 10. Thus, at least GND pattern 13, plating layer 10, first protruding portion (pedestal 11), and first frame (base member 1) are at the same potential.
In fig. 5 and the like, the height of the plating layer 10 is lower than that of the resist 14. Therefore, in order to reliably bring the base 11 into contact with the plating layer 10, the end portion 10E (fig. 5) of the plating layer 10 is expanded to the outside of the outer periphery of the base 11.
In the example shown in fig. 9, the through holes 9 are adjacent to each other at the corners of the heat generating component 4, and are formed in a circular shape with respect to the surface of the circuit board 5 on which the heat generating component 4 is mounted. This can avoid interference between the lead terminal of the heat generating component 4 and the through hole 9, and facilitate processing of the through hole 9.
In the example shown in fig. 10, the through holes 9 are adjacent to each other at the corners of the heat generating component 4, and are formed in an L-shape with respect to the surface of the circuit board 5 on which the heat generating component 4 is mounted. This can prevent interference between the lead terminals of the heat generating component 4 and the through holes 9, and increase the contact area between the circuit board 5 and the heat dissipation grease 3.
In the example shown in fig. 11, the through holes 9 are adjacent to each other at the edge of the circuit board 5, and are formed in a straight line with respect to the surface of the circuit board 5 on which the heat generating component 4 is mounted. This can prevent interference between the wiring pattern and the through hole 9, and can further increase the contact area between the circuit board 5 and the heat dissipation grease 3.
As described above, according to the present embodiment, the heat radiation efficiency can be improved.
Embodiment 2
Fig. 3 is a configuration of embodiment 1, and a groove 12 for applying the heat dissipation grease 3 is provided in the base member protruding portion 2. The heat dissipation grease 3 stored in the groove 12 is pressed by the cover member protruding portion 8 and spreads toward the inside of the through hole 9, and the base member protruding portion 2 and the cover member protruding portion 8 are thermally coupled via the heat dissipation grease 3.
The groove 12 is formed to quantify the application position and the pressing position of the heat dissipation grease 3, thereby suppressing variation in heat dissipation performance due to individual differences.
The features of the present embodiment can be summarized as follows.
As shown in fig. 6, the convex portion (base member protruding portion 2) has a concave portion (groove portion 12) opposed to the second protruding portion (cover member protruding portion 8). The heat dissipation grease 3 is filled between the second protruding portion (cover member protruding portion 8) and the recessed portion (groove portion 12). This increases the contact area between the convex portion (base member protruding portion 2) and the heat dissipation grease 3, for example.
Modification example
As shown in fig. 8, the base member protruding portion 2 may be removed to form the groove portion 12 in the pedestal 11. In other words, as shown in fig. 7, the first protruding portion (the pedestal 11) has a concave portion (the groove portion 12) opposing the second protruding portion (the cover member protruding portion 8). This makes it easier to apply the heat dissipation grease 3 to the concave portion (groove portion 12) than in the example of fig. 6. The heat dissipation grease 3 is filled between the second protruding portion (cover member protruding portion 8) and the recessed portion (groove portion 12). The tip of the second protruding portion (cover member protruding portion 8) is located inside the recess (groove portion 12). The first protruding portion (pedestal 11) blocks the through hole 9. Thus, for example, the heat dissipation grease 3 is less likely to leak to the surface side of the circuit board 5 on which the heat generating component 4 is mounted.
In the case where the recess (groove 12) is provided in the first protruding portion (pedestal 11), it is necessary to extend the height of the cover member protruding portion 8 at the time of assembly so that the cover member protruding portion 8 comes into contact with the heat dissipation grease 3.
As shown in fig. 6 to 8, the groove 12 is tapered so that the pressed heat dissipation grease 3 easily flows out of the groove 12. In other words, the concave portion (groove portion 12) has a tapered shape that narrows toward the bottom of the concave portion (groove portion 12).
In addition, a part of the constitution of one embodiment may be replaced with the constitution of another embodiment, and the constitution of another embodiment may be added to the constitution of one embodiment. In addition, some of the configurations of the embodiments may be added, deleted, or replaced with other configurations.
Embodiments of the present invention may be as follows.
(1) An electronic control device, comprising: a circuit board 5 on which the heat generating component 4 is mounted; the circuit board housing frame has a base member 1 and a cover member 7 for sandwiching the circuit board 5, and first and second protruding portions protruding toward the circuit board 5 are provided on the base member 1 and the cover member 7, respectively. The circuit board 5 is provided with a through hole 9, and the first and second protruding portions are disposed in the through hole 9. The heat dissipation grease 3 is applied between the first and second protruding portions, and the heat dissipation grease 3 is filled into the through hole 9 by being pressed by the first and second protruding portions when the housing is assembled.
(2) The electronic control device according to (1), wherein the tip of the first protrusion and the tip of the second protrusion are provided with either a convex portion or a concave portion, and the heat dissipation grease 3 is applied to the concave portion. The heat dissipation grease 3 is filled in the through hole 9 by being pressed by the convex portion and the concave portion, and the heat dissipation grease 3 and the circuit board 5 are disposed on the substantially same plane. Further, a pedestal 11 is provided between the convex portion and the base member 1 or the cover member 7, or a pedestal 11 for preventing the heat dissipation grease 3 from flowing out is provided on the convex portion, and a cross-sectional area of the pedestal 11 is larger than a cross-sectional area of the through hole 9.
(3) The electronic control device according to (2), wherein the recess for applying the heat dissipation grease 3 is provided in the pedestal 11 having a cross-sectional area larger than that of the through hole 9, so that the heat dissipation grease 3 can be filled into the through hole 9 with a larger area.
(4) The electronic control device according to (1), wherein the through-hole 9 is provided at a board end (an end of the circuit board 5), and the circuit board 5 is held in the circuit board housing frame without using a board fastener such as a screw 6.
According to (1) to (4), an electronic control device that efficiently radiates heat generated from the heat generating component 4 and retained on the circuit board 5 to the circuit board housing case can be provided.
Symbol description
100 … electronic control device
1 … base Member
2 … base Member protrusion
3 … heat dissipation grease
4 … heating element
5 … circuit substrate
6 … screw
7 … cover member
8 … cover member projection
9 … through hole
10 … coating
10E … end of coating
11 … pedestal
12 … groove part
13 … GND pattern
14 … resist.
Claims (13)
1. An electronic control device is characterized by comprising:
a circuit board having a heat generating component mounted thereon and having a through hole;
a first frame body having a first protruding portion protruding toward the through hole;
a second frame body having a second protruding portion opposite to the first protruding portion; and
and a heat dissipation grease that conducts heat from the inner wall of the circuit board, on which the through hole is formed, to the first protruding portion and the second protruding portion.
2. The electronic control device according to claim 1, wherein,
the first protruding portion has a convex portion opposite to the second protruding portion,
the heat dissipation grease is filled between the inner wall of the circuit board, which forms the through hole, and the convex portion and the second protruding portion.
3. The electronic control device according to claim 2, wherein,
the convex portion has a concave portion opposite to the second protruding portion,
the heat dissipation grease is filled between the second protruding portion and the recessed portion.
4. The electronic control apparatus according to claim 3, wherein,
the recess has a taper that narrows toward the bottom.
5. The electronic control apparatus according to claim 4, wherein,
the top end of the convex part is positioned in the through hole,
the first protrusion blocks the through hole.
6. The electronic control apparatus according to claim 5, wherein,
the convex part is in a conical shape.
7. The electronic control apparatus according to claim 6, wherein,
the second protrusion is tapered.
8. The electronic control device according to claim 1, wherein,
the first projection has a recess opposite the second projection,
the heat dissipation grease is filled between the second protruding portion and the recessed portion.
9. The electronic control device according to claim 8, wherein,
the tip of the second protrusion is located inside the recess,
the first protrusion blocks the through hole.
10. The electronic control device according to claim 1, wherein,
the circuit substrate has a GND pattern,
the through hole has a plating layer connected to the GND pattern,
the first protrusion is in contact with the plating layer.
11. The electronic control device according to claim 1, wherein,
the through hole is adjacent to a corner of the heat generating component,
the through hole is formed in a circular shape with respect to a surface of the circuit board on which the heat generating component is mounted.
12. The electronic control device according to claim 1, wherein,
the through hole is adjacent to a corner of the heat generating component,
the through hole is formed in an L-shape with respect to a surface of the circuit board on which the heat generating component is mounted.
13. The electronic control device according to claim 1, wherein,
the through hole is adjacent to the edge of the circuit substrate,
the through hole is formed in a straight line shape with respect to a surface of the circuit board on which the heat generating component is mounted.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-216954 | 2020-12-25 | ||
| JP2020216954 | 2020-12-25 | ||
| PCT/JP2021/031897 WO2022137653A1 (en) | 2020-12-25 | 2021-08-31 | Electronic control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116583944A true CN116583944A (en) | 2023-08-11 |
Family
ID=82158934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180081516.1A Pending CN116583944A (en) | 2020-12-25 | 2021-08-31 | Electronic control device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2022137653A1 (en) |
| CN (1) | CN116583944A (en) |
| WO (1) | WO2022137653A1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5093481B2 (en) * | 2008-01-31 | 2012-12-12 | 日本精機株式会社 | Heat dissipation structure in electronic component housing case |
| JP6668973B2 (en) * | 2016-06-28 | 2020-03-18 | 株式会社デンソー | Electronic device and method of manufacturing electronic device |
| JP2018064120A (en) * | 2017-12-25 | 2018-04-19 | 日立オートモティブシステムズ株式会社 | Electronic control device |
-
2021
- 2021-08-31 JP JP2022571044A patent/JPWO2022137653A1/ja active Pending
- 2021-08-31 CN CN202180081516.1A patent/CN116583944A/en active Pending
- 2021-08-31 WO PCT/JP2021/031897 patent/WO2022137653A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022137653A1 (en) | 2022-06-30 |
| JPWO2022137653A1 (en) | 2022-06-30 |
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