JP2004040127A - Heat conduction spacer and heat sink - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat conduction sheet (spacer) as a heat conduction means that can contain a heat conduction means for conducting heat from a heat evolving electronic component to a heat sink in a circuit device having a electronic circuit including the electronic component, thereby remarkably reducing a period of time and accordingly reducing a cost to manufacture the circuit deice as a whole. <P>SOLUTION: In a heat conduction spacer (1) placed between one or a plurality of heat evolving electronic components and a heat sink mounted on a substrate, a plurality of heat conduction sheets (3a, 3b, 3c, and 3d) each having a specified shape and thickness and to be contacted closely with the heat evolving electronic component are integrally mounted on the predetermined position of an electrically insulated sheet (2). <P>COPYRIGHT: (C)2004,JPO

Description

The present invention relates to a heat conducting member for promoting heat radiation of heat-generating electronic components in a circuit device.

2. Description of the Related Art Conventionally, in order to promote heat radiation of one or more heat-generating electronic components such as a plurality of semiconductor integrated circuit devices (ICs) installed on a substrate such as a printed wiring board, respective heat-generating electronic components are respectively provided. The other side of each heat conductive sheet made of heat conductive silicon rubber or the like is brought into close contact with each other, and the other side of each heat conductive sheet is made of one metal plate as a common heat sink, for example, Close contact with metal chassis for circuit devices, including was performed.
JP-A-7-111378

When assembling the circuit device in a line, one or a plurality of heat conducting sheets having shapes (sizes) and thicknesses which are not the same in advance in a case of a predetermined heat generation on a substrate (for example, a printed wiring board). Check the position of the conductive electronic component and paste it accurately on the upper surface, and then attach the above-mentioned substrate on which the electronic component to which the heat conductive sheet has been attached is attached to a predetermined position on the chassis where the heat sink is to be formed. Was like that. Therefore, it takes a great deal of time to find a position of a predetermined heat-generating electronic component on a substrate and to accurately attach a heat-conducting sheet thereon.

An object of the present invention is to provide a heat conducting sheet (spacer) that can significantly reduce the time and effort required for the entire circuit as compared with the related art, and thus can significantly reduce the manufacturing cost, thereby enabling the manufacture of the circuit device. is there.

According to a first aspect of the present invention, there is provided a heat conductive spacer interposed between a substrate on which one or a plurality of heat-generating electronic components are installed and a heat sink. That is, at least one heat conduction sheet having a predetermined shape and thickness to be in close contact with the substrate surface near the heat-generating electronic component is integrally attached at a predetermined position of the support plate. Features.

The heat conductive spacer according to the first aspect of the present invention includes a heat conductive sheet in advance so that a predetermined heat conductive sheet can abut against a substrate surface near one or a plurality of heat-generating electronic components on the substrate. Since the support plate is provided on one support plate having a predetermined shape, it can be efficiently manufactured on another line using an automatic machine. Further, as described above, since the heat conduction sheet takes an aspect in which the heat conduction sheet is in contact with the substrate surface, the thickness of the heat conduction sheet is approximately equal to the distance between the substrate and the support plate. It can be manufactured without being affected by the shape of the heat-generating electronic component.

The heat-conducting spacer according to claim 2 is a heat-conducting spacer interposed between one or more heat-generating electronic components provided on a substrate and a heat sink, wherein the heat-generating electronic component is provided. A plurality of heat conducting sheets each having a predetermined shape and thickness are integrally attached to a predetermined position of the support plate so as to be in close contact with the support plate.

The heat conductive spacer according to the second aspect of the present invention has a heat conductive sheet so that a predetermined heat conductive sheet (spacer) can correspond to one or a plurality of heat-generating electronic components on a substrate. Are arranged on one support plate having a predetermined shape, so that it can be efficiently manufactured on another line by using an automatic machine. The conductive spacer can be easily arranged in a predetermined positional relationship with the heat-generating electronic component with the substrate and the heat sink, and it is only necessary to fix them.

The heat conductive spacer according to a third aspect of the present invention is the heat conductive spacer according to the first or second aspect, wherein the support plate is an electrically insulating sheet. In the heat conductive spacer according to the third aspect of the present invention, the supporting plate is made of an electrically insulating sheet, that is, electrically insulating, so that an electronic circuit on the substrate is electrically connected to a heat sink which is usually made of metal. This is to ensure safety in an insulating environment.

According to a fourth aspect of the present invention, in the heat conductive spacer according to the third aspect, the electric insulating sheet is made of a synthetic resin.
In the heat conductive spacer according to the fourth aspect of the present invention, since the electric insulating sheet is made of a synthetic resin, it is inexpensive and easy to manufacture, and a lightweight and electrically insulating sheet can be obtained. As the synthetic resin, for example, polyethylene terephthalate, polyethylene, polyimide and the like can be preferably used.

A heat conductive spacer according to a fifth aspect of the present invention is the heat conductive spacer according to the third or fourth aspect, wherein the electric insulating sheet is made of a synthetic resin mixed with a heat conductive filler. .

In the heat conductive spacer according to the fifth aspect of the present invention, since the above-described heat conductive filler is mixed into the synthetic resin, the heat conductivity is the same as that of the heat conductive sheet without impairing electrical insulation. Can be raised to a degree.

According to a sixth aspect of the present invention, there is provided the heat conductive spacer according to any one of the third to fifth aspects, wherein the electric insulating sheet includes a metal surface layer on a surface in contact with the heat sink. Wherein the metal surface layer is used by forming the heat sink or a part thereof.

7. The heat conductive spacer according to claim 6, wherein the metal surface layer provided in close contact with the electric insulating sheet forms at least a part of a heat sink. The heat distribution in a portion close to the above is advantageously performed. Therefore, when a heat sink is separately used, the heat conductive spacer can further radiate heat to the heat sink even under a relatively low contact pressure with the heat sink. The metal surface layer can be provided by metal coating, vacuum deposition, bonding of metal foil, or the like.

According to a seventh aspect of the present invention, there is provided a heat conductive spacer according to the first or second aspect, wherein the support plate is made of a conductive material. According to the heat conductive spacer of the present invention described in claim 7, the EMC effect (electromagnetic compatibility) can be obtained in addition to the heat conductivity by forming the support plate with a sheet of a conductive material. In this case, the conductive material may be a metal material, or a material mixed with carbon, carbon fiber, metal particles, or the like as a material for enhancing the EMC effect.

An eighth aspect of the present invention is the heat conductive spacer according to any one of the first to seventh aspects, wherein the heat conductive sheet is made of a synthetic resin mixed with a heat conductive filler. It is characterized by.

The heat conductive spacer according to the invention according to claim 8 is characterized in that the heat conductive sheet is formed of an elastic material containing rubber, such as raw rubber, natural rubber, or synthetic rubber (including vulcanized rubber and thermoplastic elastomer), in the form of powdery heat. Use a conductive filler mixed therein. For this reason, compared with the case where a synthetic resin is used, it is rich in elasticity and easily adheres to the heat-generating electronic component. Specifically, for example, a synthetic rubber such as silicone rubber, urethane rubber, and styrene rubber can be preferably used. Since the thermal conductivity is provided by mixing the thermal conductive filler, the thermal conductivity can be easily and inexpensively adjusted. When using ceramics such as alumina, beryllia, magnesium, silica fiber, zinc oxide, aluminum nitride, cordierite, aluminum titanate, and transition metal oxide-based ceramics as the thermally conductive filler, the electrical insulation is also high. Being advantageous. On the other hand, non-electrically insulating materials such as silver, copper, carbon black, graphite, and carbon fiber can also be used. Also, by performing preliminary processing of rough surface processing such as so-called wrinkle processing and sand blast processing on a surface portion of the heat conductive sheet which is in contact with an electric insulating sheet made of synthetic resin or a metal heat sink, for example. Since the thermal conductivity is improved by increasing the area in which the contact surfaces are brought into close contact with each other when pressed, and the property that both contact surfaces are bonded to each other when the contact surfaces are pressed is used for electric insulation of the heat conductive sheet. It can be advantageously used for bonding to a sheet or a heat sink.

According to a ninth aspect of the present invention, there is provided the heat conductive spacer according to any one of the first to eighth aspects, wherein the heat conductive sheet is provided in a hole provided in the support plate on one side of the support plate. By providing from the side, at least a part of the surface of the heat conduction sheet is exposed to the other surface side of the support plate, whereby the heat conduction sheet is used in direct contact with the heat sink. Features.

According to the ninth aspect of the present invention, since the heat conductive sheet can be directly brought into close contact with the heat sink, the heat transfer to the heat sink can be more effectively performed. According to a tenth aspect of the present invention, there is provided the heat conductive spacer according to any one of the first to ninth aspects, wherein a hole is provided in a portion of the support plate where the heat conductive sheet is not attached. The hole is used as a vent.

In the heat conductive spacer according to the tenth aspect of the present invention, a hole is formed in the support plate and a hole is formed in a corresponding position of the heat sink to form a ventilation hole, so that heat convection divergence can be further promoted. .

An eleventh aspect of the present invention provides the heat conductive spacer according to any one of the first to tenth aspects, wherein the portion of the support plate is bent toward the side on which the heat sink is provided. Such a tongue-shaped protruding piece is provided, and is used in elastic contact with the heat sink through the tongue-shaped protruding piece.

In the heat conductive spacer according to the eleventh aspect of the present invention, since the support plate is further strengthened to the heat sink at the tongue-shaped protruding portion, and thus is further in close contact with the heat sink, heat conduction is more effectively performed.

According to a twelfth aspect of the present invention, there is provided the heat conductive spacer according to any one of the first to eleventh aspects, wherein the heat conductive sheet is in contact with the support plate or the heat of the support plate. The heat conductive sheet and the electric insulating sheet are bonded to each other through an adhesive layer provided in advance on one of the surfaces in contact with the conductive sheet.

In the heat conductive spacer according to the twelfth aspect of the present invention, in the manufacturing process of the heat conductive spacer, the heat conductive sheet and the support plate are fixed in a predetermined positional relationship, and one of the adhesive layers is previously provided. By applying the adhesive layer to the contacting portions of the sheets, the sheet provided with the adhesive layer and the other sheet can be attached only by pressing the sheet in contact with each other. Become.

According to a thirteenth aspect of the present invention, there is provided a heat conductive spacer according to any one of the first to twelfth aspects, wherein the heat conductive spacer comprises the heat generating electronic component and the heat generating electronic component. The present invention is characterized in that a pressurized interposed member is used between a metal plate serving as a heat sink provided integrally with a chassis to which the provided substrate is attached.

According to a thirteenth aspect of the present invention, the heat conductive spacer is provided integrally with the heat generating electronic component and a chassis on which the substrate on which the heat generating electronic component is provided is mounted. Since it is used by being pressurized and interposed between the heat-generating electronic component and the metal plate forming the heat sink, when the substrate provided with the heat-generating electronic component is used by using a chassis, the heat-conductive spacer with respect to the heat-generating electronic component and the heat sink is used. Adhesion, and thus heat transfer, can be obtained more fully and easily.

The heat sink according to claim 14, wherein the heat sink has a predetermined shape and a predetermined thickness so as to be in close contact with a substrate surface near one or more heat-generating electronic components mounted on the substrate. The seat is integrally attached to a predetermined position.

According to a fourteenth aspect of the present invention, there is provided a heat sink in which the heat conducting sheet is directly disposed on the heat sink itself. For example, the heat conduction sheet may be directly attached to a position facing the heat-generating electronic component on the printed circuit board on the inner surface of the heat sink, or a position facing the printed circuit board surface near the heat-generating electronic component. In this case, heat generated from the heat-generating electronic component is directly transmitted to the heat sink via the heat-conducting sheet. For this reason, a more excellent heat dissipation effect can be obtained.

In the heat sink according to the present invention, a plurality of heat conductive sheets each having a predetermined shape and a predetermined thickness are provided in advance so as to be in close contact with one or more heat-generating electronic components provided on the substrate. It is characterized in that it is integrally attached to a fixed position.

The heat conductive spacer according to the present invention is provided with a heat conductive sheet in advance so that a predetermined heat conductive sheet can correspond to one or a plurality of heat-generating electronic components on a substrate. Therefore, it is possible to efficiently manufacture this on another line using an automatic machine, while on the assembly line of the circuit device, the heat-generating electronic components with a substrate are placed in a predetermined positional relationship with respect to the heat sink. All you have to do is fix them easily.

According to a sixteenth aspect of the present invention, in the heat sink according to the fourteenth or fifteenth aspect, the heat conductive sheet is made of an elastic material mixed with a heat conductive filler.

The heat sink of the present invention according to claim 16 is characterized in that an elastic material containing rubber such as raw rubber, natural rubber, and synthetic rubber (including vulcanized rubber and thermoplastic elastomer) is used as a heat conductive sheet, and a powdery heat conductive material is used. Use a mixture of fillers. For this reason, compared with the case where a synthetic resin is used, it is rich in elasticity and easily adheres to the heat-generating electronic component. Specifically, for example, a synthetic rubber such as silicone rubber, urethane rubber, and styrene rubber can be preferably used. Since the thermal conductivity is provided by mixing the thermal conductive filler, the thermal conductivity can be easily and inexpensively adjusted. When using ceramics such as alumina, beryllia, magnesium, silica fiber, zinc oxide, aluminum nitride, cordierite, aluminum titanate, and transition metal oxide-based ceramics as the thermally conductive filler, the electrical insulation is also high. Being advantageous. On the other hand, non-electrically insulating materials such as silver, copper, carbon black, graphite, and carbon fiber can also be used. Also, by performing preliminary processing of rough surface processing such as so-called wrinkle processing and sand blast processing on a surface portion of the heat conductive sheet that is in contact with the surface of the heat sink, an area where the contact surfaces are brought into close contact when pressed against each other is reduced. By increasing, the heat conductivity is improved, and the contact surfaces are bonded to each other when pressed. Therefore, the heat conductive sheet can be advantageously used for bonding to the heat sink.

The heat sink according to claim 17 of the present invention is the heat sink according to any one of claims 14 to 16, wherein a surface of the heat conduction sheet that contacts the heat sink or a surface of the heat sink that contacts the heat conduction sheet. Wherein the heat conductive sheet and the heat sink are bonded to each other via an adhesive layer provided in advance.

The heat sink of the present invention according to claim 17, wherein the heat conductive sheet and the heat sink body are fixed in a predetermined positional relationship in a heat sink manufacturing process, and the adhesive layer is brought into contact with one of the adhesive layers in advance. By applying the pressure-sensitive adhesive layer to both sides, the two sides can be attached only by pressing the one side provided with the adhesive layer and the other side, and the heat sink can be easily manufactured.

熱 The heat conductive spacer according to the first embodiment of the present invention is shown in FIGS. FIG. 1 is a perspective view of a heat conductive spacer according to a first embodiment of the present invention, and FIG. 2 is a diagram showing a case where the heat conductive spacer is formed of a metal heat sink together with a heat-generating electronic component provided on a printed wiring board. It is a figure showing the partial section in the state where it was installed in the chassis.

The heat conductive spacer 1 of this embodiment is formed by punching a synthetic resin sheet, and a plurality of heat conductive spacers each having a predetermined thickness and cross-sectional shape are formed on one surface of the sheet 2 for electrical insulation. Sheets 3a, 3b, 3c, and 3d in a predetermined arrangement. More specifically, for example, first, a pressure-sensitive adhesive layer having a predetermined thin thickness is formed at one time on predetermined plural portions on the electric insulating sheet 2 by a method such as transfer or screen printing. Thereafter, a predetermined heat conducting sheet 3a, 3b, 3c or 3d is arranged at each of the adhesive layer forming sites using a jig, and then pressed and adhered. For example, the heat conductive spacer is temporarily fixed to one side of the metal plate portion 42 of the metal chassis 4 which is to serve as a heat sink, while maintaining a predetermined positional relationship, and then the heat-generating electronic components 7b and 7d such as IC chips. .. Are attached to the other metal plate portion 41 of the metal chassis 4 while maintaining a predetermined positional relationship in the surface direction. From the bottom side of the other metal plate portion 41, the locking card spacers 51, 52... Provided with widening pins at both ends are placed at predetermined positions of the other metal plate portion 41 and the printed wiring board 6, respectively. By inserting the locking card spacers 51, 52,... Into the mounting holes provided, and pressing the snaps at the other ends of the locking card spacers 51, 52,. The printed circuit board 6 is fixed in a predetermined plane direction position and a predetermined height with respect to the metal plate portion 41. At this time, the heat conductive spacer 1 is interposed correctly and under a predetermined pressure between the metal plate portion 42 of the chassis 4 forming the heat sink and the heat-generating electronic components 7b, 7d. The surfaces of the heat conducting sheets 3b, 3d,... Are in close contact with the heat-generating electronic components 7b, 7d, and the surface of the electric insulating sheet 2 is in close contact with the heat sink 42. Thus, the heat from the heat-generating electronic components 7b, 7d,... Is sufficiently sufficiently transmitted to the heat sink 42 side.

Next, FIG. 3 shows a heat conductive spacer according to a second embodiment of the present invention. FIG. 3 is a partial cross-sectional view illustrating a state in which the heat conductive spacer according to the second embodiment of the present invention is interposed between a heat-generating electronic component provided on a substrate and a heat sink. Parts denoted by the same reference numerals as those used in FIG. 1 and FIG. 2 are the same functional parts, and therefore will not be described.

The heat conductive spacer 10 of the second embodiment is different from the heat conductive spacer 1 of the first embodiment in the manner of attaching the heat conductive sheets 30a to the electric insulating sheet 20. That is, a step portion 31a having a step substantially equal to the thickness of the electric insulating sheet 20 is formed at the peripheral portion on one surface side of the heat conducting sheet 30a. The attachment is performed by firmly fitting into the hole 21 provided in the seat 20. When the heat conductive spacer 10 is interposed between the heat-generating electronic components 7a and the heat sink 43, the heat conductive sheets 30a are used so as to be directly provided on the heat sink 43. .

FIG. 4 shows another first modification of the electrically insulating sheet of the heat conductive spacer according to the above embodiment. FIG. 4 is a diagram showing a partial cross section of the other first modification.
Another first modified example 201 of the electric insulating sheet is an electric insulating sheet portion forming the main body, here, a synthetic resin portion 202 is in close contact with the surface of the synthetic resin portion 202 on the side in contact with the heat sink. It is provided with a coating layer 203 of the formed metal thin film technology. The metal coating layer 203 is used, for example, so as to be in contact with a separately provided heat sink so as to form a part of the heat sink, and to more efficiently conduct heat from the heat conducting sheet to the heat sink.

FIG. 5 shows another second modification of the electrically insulating sheet of the heat conductive spacer according to the above embodiment. FIG. 5 is a view showing a partial cross section of the other second modified example.
Another second modification 204 of the electric insulating sheet is provided with ventilation holes 205, 205,... At a portion where the heat conducting sheet is not attached, and at a corresponding portion on the heat sink side. A vent hole is formed in cooperation with the hole to promote heat dissipation by convection. Note that the electric insulating sheet 204 shows a case where a heat sink or a metal surface layer 206 which is to be a part of the heat sink is provided on the surface of the sheet to be in contact with the heat sink.

FIG. 6 shows another third modification of the electric insulating sheet of the heat conductive spacer according to the above embodiment. FIG. 6 is a view showing a partial cross section of the third modification.
The other third modified example 207 of the electric insulating sheet has tongue-shaped protrusions 208, 208,... Formed by bending the tongue-shaped portion toward the side where the heat sink is provided. And the elastic member is used in elastic contact with the heat sink through the tongue-shaped projection piece. Since the tongue-like projections 208, 208,..., The electrically insulating sheet is further strengthened against the heat sink, and thus comes into further contact with the heat sink, the heat dissipation is more advantageously performed. Note that the electric insulating sheet 207 shows a case in which a metal surface layer 209 which forms a part of the heat sink is provided on a surface of the sheet to be in contact with the heat sink.

Next, FIG. 7 shows a heat conductive spacer according to a third embodiment of the present invention. FIG. 7 is a partial cross-sectional view showing a state in which the heat conductive spacer of the present invention is interposed between a substrate and a heat sink. Note that the main configuration of the third embodiment is the same as that of the first embodiment, and the portions denoted by the same reference numerals as those used in FIGS. 2 and 7 are the same functional portions, and therefore will not be particularly described.

熱 The heat conductive spacer 11 of the third embodiment differs from the heat conductive spacer 1 of the first embodiment in the manner in which the heat conductive sheets 13b, 13d,. That is, the heat conduction sheets 13b, 13d... Are pressed against the substrate 6 on the substrate surface facing the heat-generating electronic components 17b, 17d. That is, the heat-conducting spacer 11 is correctly interposed on the metal plate portion 42 of the chassis 4 serving as a heat sink and the substrate surface of the substrate 6 under a predetermined pressure. The surfaces of the heat conductive sheets 13b, 13d,... Of the heat conductive spacer 11 are in close contact with the surface of the substrate 6 opposite to the surface on which the heat-generating electronic components 17b, 17d are provided. The surface opposite to the surface on which the heat conducting sheets 13b and 13d are provided in 2 is in close contact with the heat sink 42. As a result, the heat generated from the heat-generating electronic components 17b, 17d,... Is sufficiently transmitted to the heat sink 42 via the substrate 6.

The third embodiment is particularly advantageous when the heat-generating electronic components 17b, 17d,... Are insertion-mount components. In other words, when the lead wire extending from the component protrudes from the surface of the substrate 6 on the side opposite to the heat-generating electronic components, and is a component that is soldered, the above-described heat conduction is applied to the solder or the like. What is necessary is just to make it the structure which adhere | attaches the sheet | seat for taking heat. In this case, since the thickness of each of the heat conducting sheets 13b, 13d,... May be substantially equal to the distance between the metal plate portion 42 and the back surface of the substrate 6, the heat-generating electronic component 17b , 17d... Need not be considered. In addition, the thickness of the heat conduction sheets 13b, 13d,... Can be reduced, which leads to cost reduction of the heat conduction sheets. Further, it is not necessary to provide the heat conducting sheets 13b, 13d,... For each of the heat-generating electronic components 17b, 17d,.

In the present embodiment, it is described that the present invention is suitable for the insertion mounting type heat-generating electronic component. However, it is needless to say that the present invention may be used for the surface mount type and other types of heat-generating electronic components. However, in this case, since the heat generated from the heat-generating electronic component is transmitted through the substrate, it is necessary to arrange the heat conducting sheet near the heat-generating electronic component. 7 shows a configuration in which the heat conducting sheets 13b, 13d,... Are arranged just behind the heat-generating electronic components 17b, 17d,. I don't care. Also, the heat-generating electronic components 17b and 17d are provided on the opposite side of the substrate 6 from the heat-conducting sheets 13a... (The lower surface of the substrate 6 in FIG. 7), but on the same side (FIG. May be provided on the upper surface of the substrate 6).

As described above, the embodiments of the present invention have been described. However, the embodiments of the present invention are not limited to the above-described embodiments, and can be implemented in various modes as long as they belong to the technical scope of the present invention. Needless to say.

In the above embodiment, the electric insulating sheet 2 is used as the support plate of the heat conductive spacer 11, but a support plate made of a conductive material may be used instead of the electric insulating sheet. Specifically, the electric insulating sheet 2 in FIG. 2 or the electric insulating sheet 20 in FIG. 3 may be formed of a conductive material sheet. In this way, an EMC effect can be obtained in addition to the thermal conductivity. In this case, the conductive material may be a metal material, or a material mixed with carbon, carbon fiber, metal particles, or the like as a material for enhancing the EMC effect.

The heat conducting sheet of the present invention may be attached to the support plate and used as a part of the spacer as described above, or may be used by directly arranging it on the heat sink itself. That is, the heat-conducting sheet may be directly attached to a position facing the heat-generating electronic component on the printed circuit board on the inner surface of the heat sink or a position facing the printed-circuit board surface near the heat-generating electronic component. In this case, the heat generated from the heat-generating electronic component is directly transmitted to the heat sink via the heat-conducting sheet.

It is a perspective view of a heat conduction spacer of a 1st embodiment of the present invention. FIG. 4 is a partial cross-sectional view showing a state in which the heat conductive spacer is installed in a metal chassis serving as a heat sink together with heat-generating electronic components provided on a printed wiring board. It is a figure showing the partial section in the state where the heat conduction spacer of a 2nd embodiment of the present invention was interposed between the heat generating electronic component and the heat sink which were installed on the substrate. FIG. 9 is a view showing a partial cross section of another first modification of the electric insulating sheet of the heat conductive spacer according to the present invention. FIG. 10 is a view showing a partial cross section of another second modification of the electric insulating sheet of the heat conductive spacer according to the present invention. FIG. 11 is a view showing a partial cross section of another third modification of the electric insulating sheet of the heat conductive spacer according to the present invention. It is a figure showing the partial section in the state where the heat conduction spacer of a 3rd embodiment of the present invention was installed in the metal chassis which constitutes the heat sink with the exothermic electronic component provided on the printed circuit board.

Explanation of reference numerals

1, 10: thermal conductive spacers 2, 20, 201, 204, 207: electric insulating sheet 3a, 3b, 3c, 3d, 13b, 13d: thermal conductive sheet 42, 43: heat sink 6: substrate, 7a, 7b, 7d, 17b, 17d ... heat-generating electronic components

Claims (17)

A heat conductive spacer interposed between a substrate on which one or more heat-generating electronic components are installed and a heat sink, the heat-conductive spacer having a predetermined shape so as to be in close contact with a substrate surface near the heat-generating electronic components. A heat conductive spacer, wherein at least one heat conductive sheet having a thickness is integrally attached to a predetermined position of a support plate. A heat conductive spacer interposed between one or more heat-generating electronic components installed on a substrate and a heat sink, each having a predetermined shape, thickness, and thickness to be in close contact with the heat-generating electronic components. A heat conductive spacer, wherein a plurality of heat conductive sheets having the following are integrally attached to a predetermined position of a support plate. The heat conductive spacer according to claim 1, wherein the support plate is an electrically insulating sheet. The heat conductive spacer according to claim 3, wherein the electric insulating sheet is made of a synthetic resin. The heat conductive spacer according to claim 3, wherein the electric insulating sheet is made of a synthetic resin mixed with a heat conductive filler. The heat conductive spacer according to any one of claims 3 to 5, wherein the electrically insulating sheet includes a metal surface layer on a surface in contact with the heat sink, and the metal surface layer is formed of the heat sink or one thereof. A heat conductive spacer, which is used by forming a part. 3. The heat conductive spacer according to claim 1, wherein the support plate is made of a conductive material. The heat conductive spacer according to any one of claims 1 to 7, wherein the heat conductive sheet is made of an elastic material mixed with a heat conductive filler. 9. The heat conductive sheet according to claim 1, wherein the heat conductive sheet is provided in a hole provided in the support plate from one surface side of the support plate. A heat conductive spacer, wherein at least a part of the surface of the heat conductive sheet is exposed to the other surface of the support plate, whereby the heat conductive sheet is used in direct contact with a heat sink. The heat conductive spacer according to any one of claims 1 to 9, wherein a hole is provided in a portion of the support plate where the heat conductive sheet is not attached, and the hole is used as a ventilation hole. . The heat conductive spacer according to any one of claims 1 to 10, further comprising: a tongue-like projection formed by bending a portion of the support plate toward a side on which the heat sink is provided. A heat conductive spacer used in elastic contact with the heat sink via The heat conductive spacer according to any one of claims 1 to 11, wherein an adhesive layer is provided in advance on one of a surface of the heat conductive sheet contacting the support plate and a surface of the support plate contacting the heat conductive sheet. A heat conductive spacer comprising the heat conductive sheet and the support plate bonded to each other via a material layer. The heat conductive spacer according to any one of claims 1 to 12, wherein the heat conductive spacer is integrally formed on a chassis on which the heat-generating electronic component and a substrate provided with the heat-generating electronic component are mounted. A heat conductive spacer, which is used by being interposed between a metal plate forming a heat sink and a pressure plate. A plurality of heat conducting sheets having a predetermined shape and thickness to be in close contact with the substrate surface near one or more heat-generating electronic components installed on the substrate are integrally placed at predetermined positions. A heat sink characterized by being attached. A plurality of heat conducting sheets each having a predetermined shape and thickness are integrally attached at a predetermined position so as to be in close contact with one or a plurality of heat-generating electronic components provided on the substrate. Features heat sink. 16. The heat sink according to claim 14, wherein the heat conductive sheet is made of an elastic material mixed with a heat conductive filler. The heat sink according to any one of claims 14 to 16, further comprising an adhesive material layer provided in advance on one of a surface of the heat conductive sheet that contacts the heat sink and a surface of the heat sink that contacts the heat conductive sheet. Wherein the heat conducting sheet and the heat sink are bonded to each other.

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