JP2007159204A - Inverter device - Google Patents

Inverter device Download PDF

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JP2007159204A
JP2007159204A JP2005348207A JP2005348207A JP2007159204A JP 2007159204 A JP2007159204 A JP 2007159204A JP 2005348207 A JP2005348207 A JP 2005348207A JP 2005348207 A JP2005348207 A JP 2005348207A JP 2007159204 A JP2007159204 A JP 2007159204A
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circuit element
switching circuit
main switching
control board
heat transfer
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JP4816036B2 (en
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Yuji Sasaki
裕司 佐々木
Sukeaki Aida
祐明 会田
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IHI Corp
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IHI Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an inverter device wherein a switching circuit element and a control board are cooled and insulated. <P>SOLUTION: The inverter device is so constructed that a main switching circuit element 10 is provided on a cooling plate 11, and the control board 14 for controlling driving of the main switching circuit element 10 is disposed above the main switching circuit element 10. A metal support 15 that is positioned on one side of the main switching circuit element 10 and has a supporting piece 18, is erected on the cooling plate 11. A heat transmission sheet 20 is stuck to the bottom face of the control board 14, and the control board 14 is disposed on the upper face of the supporting piece 18 of the metal support 15 so that the heat transmission sheet 20 is partly in contact therewith. A board fixing plate 21 is disposed on the lower face of the supporting piece 18, and they are fixed together by a bolt and a nut 22 or the like. An insulating sheet 23 is stuck to the heat transmission sheet 20 extended from the supporting piece 18 toward the main switching circuit element 10. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、モータを駆動するＩＧＢＴ等の素子を備えた主スイッチング回路素子とそのスイッチング回路素子を駆動する制御基板からなる小型大容量のインバータ装置に関するものである。   The present invention relates to a small-sized and large-capacity inverter device comprising a main switching circuit element having an element such as an IGBT for driving a motor and a control board for driving the switching circuit element.

パッケージ内にＩＧＢＴ（Ｉｎｓｕｌａｔｅｄ Ｇａｔｅ Ｂｉｐｏｌａｒ Ｔｒａｎｓｉｓｔｏｒ）などのスイッチング素子を備えた主スイッチング回路素子と、その主スイッチング回路素子を駆動する制御基板とを備えたＩＰＭ（インテリジェントパワーモジュール）からなるインバータ装置は、小型大容量のモータを駆動するのに広く使用されている。   An inverter device composed of an IPM (intelligent power module) having a main switching circuit element including a switching element such as an IGBT (Insulated Gate Bipolar Transistor) in a package and a control board for driving the main switching circuit element is small. Widely used to drive large capacity motors.

このインバータ装置は、主スイッチング回路素子が、６個のＩＧＢＴとそのＩＧＢＴをそれぞれ独立してスイッチングする制御ＩＣを備え、制御基板が、制御ＩＣに指令周波数を出力するためのフォトカプラを備えており、主スイッチング回路素子側に制御端子が設けられ、制御基板側にコネクタが設けられて両者が接続されるようになっている。   In this inverter device, the main switching circuit element includes six IGBTs and a control IC that switches the IGBTs independently, and the control board includes a photocoupler for outputting a command frequency to the control IC. A control terminal is provided on the main switching circuit element side, and a connector is provided on the control board side so that both are connected.

主スイッチング回路素子と制御基板とを接続するには、フォトカプラの１・２次間の浮遊容量を増加させないために、制御端子はできるだけ短くされ、このため、主スイッチング回路素子上に制御端子が突出するように設けられ、制御基板が、その制御端子と接続するために主スイッチング回路素子の直上に設置される構造となっている（特許文献１）。   In order to connect the main switching circuit element and the control board, the control terminal is made as short as possible in order not to increase the stray capacitance between the primary and secondary sides of the photocoupler. For this reason, the control terminal is provided on the main switching circuit element. A control board is provided so as to protrude, and has a structure in which the control board is installed immediately above the main switching circuit element in order to connect to the control terminal (Patent Document 1).

従来、モータドライブ用インバータのパワー半導体素子の冷却方法として、特許文献２、３があり、水冷式モータのケースにインバータ装置を取り付けて、パワー半導体素子を冷却している。   Conventionally, as a method for cooling a power semiconductor element of an inverter for a motor drive, there are Patent Documents 2 and 3, and an inverter device is attached to a case of a water-cooled motor to cool the power semiconductor element.

特開２００３−１９７８６０号公報JP 2003-197860 A 特開平６−１９７４９４号公報JP-A-6-197494 特開２００１−３４６３６０号公報JP 2001-346360 A 特開２００４−３９７４９号公報JP 2004-39749 A

しかしながら、上述したＩＰＭからなるインバータ装置は、主スイッチング回路素子上に制御基板が設けられ、主スイッチング回路素子の冷却は行えても、制御基板が、主スイッチング回路素子からの熱的影響を受けてしまうため、別途冷却が必要となる問題がある。   However, in the inverter device composed of the IPM described above, a control board is provided on the main switching circuit element, and even though the main switching circuit element can be cooled, the control board is affected by thermal influence from the main switching circuit element. Therefore, there is a problem that cooling is required separately.

特許文献４では、この制御基板の冷却手段として、モータの筐体に、スイッチング回路素子を直接固定し、かつその上部の制御基板を固定する台座を形成し、これらを冷却するようにしているが、筐体に、台座を加工するためのスペースが必要となる問題がある。また、主スイッチング回路素子と制御基板は、電位レベルが異なるため、これらを絶縁する必要があるが、特許文献４では、これらの絶縁については、考慮されていない。   In Patent Document 4, as a cooling means for the control board, a switching circuit element is directly fixed to the motor casing and a base for fixing the control board on the upper part is formed, and these are cooled. There is a problem that a space for processing the pedestal is required in the housing. In addition, since the main switching circuit element and the control board have different potential levels, it is necessary to insulate them. However, Patent Document 4 does not consider these insulations.

そこで、本発明の目的は、上記課題を解決し、スイッチング回路素子と制御基板を冷却できると共に絶縁できるインバータ装置を提供することにある。   SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above problems and provide an inverter device that can cool and insulate a switching circuit element and a control board.

上記目的を達成するために請求項１の発明は、冷却プレート上に主スイッチング回路素子を設け、その主スイッチング回路素子の上方に、その主スイッチング回路素子を駆動制御する制御基板を配置したインバータ装置において、上記冷却プレート上に、主スイッチング回路素子の一側に位置して金属製サポートを立設すると共にその金属製サポートの上部に主スイッチング回路素子側に延びる支持片を形成し、他方上記制御基板の底面に熱伝導性と電気絶縁性を備えた伝熱シートを貼り付け、金属製サポートの支持片の上面に、伝熱シートの一部が接するように制御基板を配すると共に支持片の下面に基板固定板を配してこれらをボルト・ナット等で固定し、さらに支持片から主スイッチング回路素子側に延びる伝熱シートに、絶縁シートを貼り付けたインバータ装置である。   In order to achieve the above object, an invention according to claim 1 is an inverter device in which a main switching circuit element is provided on a cooling plate, and a control board for driving and controlling the main switching circuit element is disposed above the main switching circuit element. The metal support is erected on one side of the main switching circuit element on the cooling plate, and a support piece extending toward the main switching circuit element is formed on the metal support. A heat transfer sheet having thermal conductivity and electrical insulation is affixed to the bottom surface of the board, and a control board is arranged so that a part of the heat transfer sheet is in contact with the upper surface of the support piece of the metal support. A board fixing plate is arranged on the lower surface, these are fixed with bolts and nuts, etc., and further to the heat transfer sheet extending from the support piece to the main switching circuit element side, an insulating sheet It is a pasted inverter device.

請求項２の発明は、金属製サポートは、冷却プレートと接する設置片と、設置片から垂直に延びる垂直片と、垂直片の上部から水平に延びる支持片とで、コ字状に形成され、設置片の先端が主スイッチング回路素子側に位置するように冷却プレート上に立設され、制御基板や主スイッチング回路素子からの熱を、伝熱シートを介して冷却プレートに逃がして制御基板を冷却する請求項１記載のインバータ装置である。   In the invention of claim 2, the metal support is formed in a U shape with an installation piece in contact with the cooling plate, a vertical piece extending vertically from the installation piece, and a support piece extending horizontally from the upper part of the vertical piece, Standing on the cooling plate so that the tip of the installation piece is located on the main switching circuit element side, the heat from the control board and the main switching circuit element is released to the cooling plate via the heat transfer sheet to cool the control board The inverter device according to claim 1.

請求項３の発明は、伝熱シートは、シリコンゴム、窒化アルミやアルミナなどのセラミックスからなり、制御基板の全底面に貼り付けられ、制御基板と共に主スイッチング回路素子の一側から他側に亘って延在するように配置される請求項１又は２記載のインバータ装置である。   According to a third aspect of the present invention, the heat transfer sheet is made of ceramics such as silicon rubber, aluminum nitride, and alumina, and is attached to the entire bottom surface of the control board, and extends from one side of the main switching circuit element to the other side together with the control board. It is an inverter apparatus of Claim 1 or 2 arrange | positioned so that it may extend.

請求項４の発明は、絶縁シートは、ガラスエポキシ板からなり、設置片と同じ厚さに形成されて、伝熱シートと共に主スイッチング回路素子上に延在するよう伝熱シートに貼り付けられる請求項２又は３記載のインバータ装置である。   According to a fourth aspect of the present invention, the insulating sheet is made of a glass epoxy plate, is formed to have the same thickness as the installation piece, and is attached to the heat transfer sheet so as to extend on the main switching circuit element together with the heat transfer sheet. Item 4. The inverter device according to Item 2 or 3.

請求項５の発明は、金属製サポートは、銅やアルミニウムなどからなる請求項１記載のインバータ装置である。   The invention according to claim 5 is the inverter device according to claim 1, wherein the metal support is made of copper, aluminum or the like.

本発明によれば、冷却プレート上に金属製サポートを立設し、制御基板からの熱を、その制御基板に貼り付けた伝熱シートから金属製サポートを介して冷却プレートに逃がすことで、制御基板の冷却が行え、またその伝熱シートに絶縁シートを貼り付けることで、主スイッチング回路素子と制御基板の間を絶縁することができる。   According to the present invention, the metal support is erected on the cooling plate, and the heat from the control board is released from the heat transfer sheet affixed to the control board to the cooling plate via the metal support. The board can be cooled, and the main switching circuit element and the control board can be insulated by attaching an insulating sheet to the heat transfer sheet.

以下、本発明の好適な一実施の形態を添付図面に基づいて詳述する。   A preferred embodiment of the present invention will be described below in detail with reference to the accompanying drawings.

図１は、本発明のインバータ装置の要部拡大正面図で、図２は、インバータ装置の全体正面図を示したものである。   FIG. 1 is an enlarged front view of a main part of an inverter device according to the present invention, and FIG. 2 is an overall front view of the inverter device.

図において、１０は主スイッチング回路素子を示し、詳細は図示していないが、６個のＩＧＢＴとそのＩＧＢＴをそれぞれ独立してスイッチングする制御ＩＣがパッケージに収容されて形成され、その下面の放熱面が冷却プレート１１に接するように固定される。   In the figure, reference numeral 10 denotes a main switching circuit element, details of which are not shown, but six IGBTs and a control IC for independently switching the IGBTs are housed in a package, and a heat dissipation surface on the lower surface thereof Is fixed in contact with the cooling plate 11.

主スイッチング回路素子１０の上面には、電源やモータ（図示せず）の巻き線と接続するための高電圧端子１２が複数設けられ、また上記制御ＩＣを駆動するための制御端子１３が設けられる。   On the upper surface of the main switching circuit element 10, there are provided a plurality of high voltage terminals 12 for connection with windings of a power source and a motor (not shown), and a control terminal 13 for driving the control IC. .

冷却プレート１１内には、図示していないが冷却水通路が形成され、その冷却通路に冷却水が供給されて、主スイッチング回路素子１０を冷却するようになっている。この冷却プレート１１は、水冷式のモータケースであってもよい。   Although not shown, a cooling water passage is formed in the cooling plate 11, and cooling water is supplied to the cooling passage to cool the main switching circuit element 10. The cooling plate 11 may be a water-cooled motor case.

主スイッチング回路素子１０の上方には、制御基板１４が配置される。この制御基板１４は、図示していないが、主スイッチング回路素子１０の制御ＩＣに指令周波数を出力するためのフォトカプラを備えており、そのフォトカプラの２次側が、主スイッチング回路素子１０に突出して設けられた制御端子１３にコネクタ（図示せず）で接続されるようになっている。   A control board 14 is disposed above the main switching circuit element 10. Although not shown, the control board 14 includes a photocoupler for outputting a command frequency to the control IC of the main switching circuit element 10, and the secondary side of the photocoupler projects to the main switching circuit element 10. Are connected to a control terminal 13 provided by a connector (not shown).

冷却プレート１１上には、主スイッチング回路素子１０の一側に位置して銅やアルミニウムなどの金属製サポート１５が立設される。この金属製サポート１５は、冷却プレート１１と接する設置片１６と、設置片１６から垂直に延びる垂直片１７と、垂直片１７の上部から水平に延びる支持片１８とで、全体にコ字状に形成され、設置片１６の先端側が主スイッチング回路素子１０側に位置するように冷却プレート１１上に立設される。   On the cooling plate 11, a metal support 15 such as copper or aluminum is erected on one side of the main switching circuit element 10. The metal support 15 has an installation piece 16 in contact with the cooling plate 11, a vertical piece 17 that extends vertically from the installation piece 16, and a support piece 18 that extends horizontally from the upper part of the vertical piece 17, and is generally U-shaped. It is formed and erected on the cooling plate 11 so that the front end side of the installation piece 16 is located on the main switching circuit element 10 side.

金属製サポート１５の支持片１８の上面には、制御基板１４が主スイッチング回路素子１０上で水平に延びるように取り付けられる。制御基板１４の取り付けは、制御基板１４の底面に、シリコンゴム、窒化アルミやアルミナなどのセラミックス等からなる熱伝導性と電気絶縁性を備えた伝熱シート２０を貼り付け、その伝熱シート２０を介して支持片１８に制御基板１４を配置すると共に、支持片１８の下面に基板固定板２１を配し、その状態でボルト・ナット２２等で固定する。すなわち、基板固定板２１には、ボルト穴２２ａが設けられ、支持片１８、伝熱シート２０及び制御基板１４には、ボルト挿入穴２２ｃが形成され、制御基板１４側からボルト挿入穴２２ｃにボルト２２ｂを挿入してボルト穴２２ａにねじ込むことで、制御基板１４を支持片１８に取り付ける。   The control board 14 is attached to the upper surface of the support piece 18 of the metal support 15 so as to extend horizontally on the main switching circuit element 10. The control board 14 is attached to the bottom surface of the control board 14 by sticking a heat transfer sheet 20 having thermal conductivity and electrical insulation made of ceramics such as silicon rubber, aluminum nitride, and alumina, and the heat transfer sheet 20. The control board 14 is arranged on the support piece 18 via the board 18, and the board fixing plate 21 is arranged on the lower surface of the support piece 18, and is fixed with bolts / nuts 22 and the like in this state. That is, the board fixing plate 21 is provided with a bolt hole 22a, the support piece 18, the heat transfer sheet 20, and the control board 14 are formed with bolt insertion holes 22c, and the bolts are inserted into the bolt insertion holes 22c from the control board 14 side. The control board 14 is attached to the support piece 18 by inserting 22b and screwing it into the bolt hole 22a.

また、伝熱シート２０の下面には、主スイッチング回路素子１０と制御基板１４間を絶縁するための絶縁シート２３が貼り付けられる。この絶縁シート２３は、ガラスエポキシ基板から形成されると共に、金属製サポート１５の支持片１８と同じ厚さに形成され、伝熱シート２０を支持片１８上に配置したとき、伝熱シート２０の下面を覆うように延びて、スイッチング回路素子１０と制御基板１４間を絶縁するようになっている。   An insulating sheet 23 for insulating the main switching circuit element 10 and the control board 14 is attached to the lower surface of the heat transfer sheet 20. The insulating sheet 23 is formed from a glass epoxy substrate and is formed to have the same thickness as the support piece 18 of the metal support 15. When the heat transfer sheet 20 is disposed on the support piece 18, It extends so as to cover the lower surface and insulates the switching circuit element 10 from the control board 14.

また、この絶縁シート２３は、伝熱シート２０に貼り付けられると共にその一側が、制御基板１４を基板固定板２１で取り付ける際に、制御基板１４と固定基板２１とで挟まれるように取り付けられる。さらに、絶縁シート２３と伝熱シート２０には、主スイッチング回路素子１０の制御端子１３を挿通する穴が形成されており、制御基板１４を支持片１８上に配置する際に、その穴を通して制御基板１４に設けたコネクタ（図示せず）に制御端子１３が接続された後、ボルト・ナット２２で制御基板１４が支持片１８に固定されるようにする。   The insulating sheet 23 is attached to the heat transfer sheet 20 and one side thereof is attached so as to be sandwiched between the control board 14 and the fixed board 21 when the control board 14 is attached by the board fixing plate 21. Further, the insulating sheet 23 and the heat transfer sheet 20 are formed with holes through which the control terminals 13 of the main switching circuit element 10 are inserted, and control is performed through the holes when the control board 14 is disposed on the support piece 18. After the control terminal 13 is connected to a connector (not shown) provided on the board 14, the control board 14 is fixed to the support piece 18 with bolts and nuts 22.

以上において、主スイッチング回路素子１０の高電圧端子１２が電源とモータ巻き線に接続されてモータを回転数可変に駆動する際、主スイッチング素子１０が発熱するが冷却プレート１１により冷却される。また主スイッチング回路素子１０の熱は、その上方の制御基板１４にも放射熱として伝熱し、同時に制御基板１４自体も発熱するが、これら熱は、伝熱シート２０から金属製サポート１５を介して冷却プレート１１側に放熱される。   In the above, when the high voltage terminal 12 of the main switching circuit element 10 is connected to the power source and the motor winding to drive the motor with the variable number of rotations, the main switching element 10 generates heat but is cooled by the cooling plate 11. The heat of the main switching circuit element 10 is also transferred as radiant heat to the control board 14 thereabove, and at the same time, the control board 14 itself generates heat. However, the heat is transferred from the heat transfer sheet 20 through the metal support 15. Heat is radiated to the cooling plate 11 side.

すなわち、コ字状の金属製サポート１５と伝熱シート２０を熱経路とすることで狭いスペースながら効果的に制御基板１４を冷却することができる。   That is, by using the U-shaped metal support 15 and the heat transfer sheet 20 as a heat path, the control board 14 can be effectively cooled in a narrow space.

また主スイッチング回路素子１０内のＩＧＢＴによるスイッチングによる切り替えにより巻き線からのサージ電圧が発生し、これが、グランド電位に保たれた制御基板１４側に伝搬するが、絶縁シート２３により主スイッチング回路素子１０と制御基板１４とは絶縁されているため、絶縁基板１４にその影響が及ぶことがない。したがって、制御基板１４のサイズや形状による主スイッチング回路素子１０の高電圧端子１２との干渉を気にする必要がなくなり、複雑な形状のインバータ装置設計に対応できる。   In addition, a surge voltage from the winding is generated by switching by switching by the IGBT in the main switching circuit element 10, and this is propagated to the control substrate 14 side maintained at the ground potential, but the main switching circuit element 10 is transmitted by the insulating sheet 23. Since the control board 14 and the control board 14 are insulated, the insulating board 14 is not affected. Therefore, it is not necessary to worry about interference with the high voltage terminal 12 of the main switching circuit element 10 due to the size and shape of the control board 14, and it is possible to cope with the design of an inverter device having a complicated shape.

本発明の一実施の形態を示す要部拡大正面図である。It is a principal part enlarged front view which shows one embodiment of this invention. 本発明の一実施の形態を示す全体正面図である。1 is an overall front view showing an embodiment of the present invention.

符号の説明Explanation of symbols

１０ 主スイッチング回路素子
１１ 冷却プレート
１４ 制御基板
１５ 金属製サポート
１８ 支持片
２０ 伝熱シート
２３ 絶縁シート DESCRIPTION OF SYMBOLS 10 Main switching circuit element 11 Cooling plate 14 Control board 15 Metal support 18 Support piece 20 Heat transfer sheet 23 Insulation sheet

Claims (5)

冷却プレート上に主スイッチング回路素子を設け、その主スイッチング回路素子の上方に、その主スイッチング回路素子を駆動制御する制御基板を配置したインバータ装置において、上記冷却プレート上に、主スイッチング回路素子の一側に位置して金属製サポートを立設すると共にその金属製サポートの上部に主スイッチング回路素子側に延びる支持片を形成し、他方上記制御基板の底面に熱伝導性と電気絶縁性を備えた伝熱シートを貼り付け、金属製サポートの支持片の上面に、伝熱シートの一部が接するように制御基板を配すると共に支持片の下面に基板固定板を配してこれらをボルト・ナット等で固定し、さらに支持片から主スイッチング回路素子側に延びる伝熱シートに、絶縁シートを貼り付けたことを特徴とするインバータ装置。   In an inverter device in which a main switching circuit element is provided on a cooling plate, and a control board for driving and controlling the main switching circuit element is disposed above the main switching circuit element, the main switching circuit element is provided on the cooling plate. The metal support is erected on the side and a support piece extending to the main switching circuit element side is formed on the metal support. On the other hand, the bottom surface of the control board is provided with thermal conductivity and electrical insulation. A heat transfer sheet is affixed, and a control board is arranged so that a part of the heat transfer sheet is in contact with the upper surface of the support piece of the metal support, and a board fixing plate is arranged on the lower surface of the support piece and these are bolts and nuts Inverter device, characterized in that an insulating sheet is attached to a heat transfer sheet that is fixed to the main switching circuit element side from the support piece. 金属製サポートは、冷却プレートと接する設置片と、設置片から垂直に延びる垂直片と、垂直片の上部から水平に延びる支持片とで、コ字状に形成され、設置片の先端が主スイッチング回路素子側に位置するように冷却プレート上に立設され、制御基板や主スイッチング回路素子からの熱を、伝熱シートを介して冷却プレートに逃がして制御基板を冷却する請求項１記載のインバータ装置。   The metal support is formed in a U shape with an installation piece that contacts the cooling plate, a vertical piece that extends vertically from the installation piece, and a support piece that extends horizontally from the top of the vertical piece, and the tip of the installation piece is the main switching 2. The inverter according to claim 1, wherein the inverter is erected on the cooling plate so as to be positioned on the circuit element side, and heat from the control board and the main switching circuit element is released to the cooling plate via the heat transfer sheet to cool the control board. apparatus. 伝熱シートは、シリコンゴム、窒化アルミやアルミナなどのセラミックスからなり、制御基板の全底面に貼り付けられ、制御基板と共に主スイッチング回路素子の一側から他側に亘って延在するように配置される請求項１又は２記載のインバータ装置。   The heat transfer sheet is made of ceramics such as silicon rubber, aluminum nitride, and alumina, and is attached to the entire bottom surface of the control board and arranged to extend from one side of the main switching circuit element to the other side together with the control board. The inverter device according to claim 1 or 2. 絶縁シートは、ガラスエポキシ板からなり、設置片と同じ厚さに形成されて、伝熱シートと共に主スイッチング回路素子上に延在するよう伝熱シートに貼り付けられる請求項２又は３記載のインバータ装置。   4. The inverter according to claim 2, wherein the insulating sheet is made of a glass epoxy plate, is formed to have the same thickness as the installation piece, and is attached to the heat transfer sheet so as to extend on the main switching circuit element together with the heat transfer sheet. apparatus. 金属製サポートは、銅やアルミニウムなどからなる請求項１記載のインバータ装置。   The inverter device according to claim 1, wherein the metal support is made of copper, aluminum, or the like.
JP2005348207A 2005-12-01 2005-12-01 Inverter device Expired - Fee Related JP4816036B2 (en)

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