WO2022126781A1 - Caisson de haut-parleur - Google Patents

Caisson de haut-parleur Download PDF

Info

Publication number
WO2022126781A1
WO2022126781A1 PCT/CN2020/141838 CN2020141838W WO2022126781A1 WO 2022126781 A1 WO2022126781 A1 WO 2022126781A1 CN 2020141838 W CN2020141838 W CN 2020141838W WO 2022126781 A1 WO2022126781 A1 WO 2022126781A1
Authority
WO
WIPO (PCT)
Prior art keywords
soldering
pad
conductive
fixed
terminal
Prior art date
Application number
PCT/CN2020/141838
Other languages
English (en)
Chinese (zh)
Inventor
任璋
钟志威
赵彬
周孙铜
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声光电科技(常州)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声光电科技(常州)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2022126781A1 publication Critical patent/WO2022126781A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts

Definitions

  • the invention relates to the field of electro-acoustic conversion, in particular to a speaker box for portable electronic products.
  • the speaker box of the related art includes a housing with a housing space, a sound-generating unit accommodated in the housing, the sound-generating unit is provided with a single pad for electrical connection, and is assembled in the housing. And a conductive terminal connected to the outside world and a flexible circuit board connecting the conductive terminal and the single pad.
  • the flexible circuit board is fixed to the housing by welding, and the assembly process includes processes such as mating, soldering, and slotting glue.
  • the assembly process is complicated and requires processes such as ironing and pressure maintenance; due to the small size of the flexible circuit board, The assembly accuracy is poor, and it is necessary to apply slot glue to the outlet groove after assembly. If the slot glue is not applied in place, the outlet slot will have the risk of air leakage; at the same time, the price of the flexible circuit board is relatively expensive.
  • the invention provides a speaker box with high assembly efficiency, low cost and good reliability.
  • the present invention provides a loudspeaker box, which includes a housing with a receiving space and a sound-generating unit with a diaphragm, the sound-generating unit is accommodated in the housing, and the sound-generating unit is provided with an external circuit for electrical connection
  • the pad wherein the pad has a conductive part, the surface of the pad is provided with a through hole, and the through hole penetrates the conductive part;
  • the speaker box further includes a soldering piece, and the soldering piece includes a The main body part of the casing and the conductive terminals and fixed terminals respectively extending from opposite ends of the main body part, the conductive terminals extend to the outside of the receiving space and form an electrical connection with an external circuit, and the fixed terminals are located in the In the accommodating space, the conductive portion is stacked on the fixed terminal along the vibration direction of the diaphragm, and the fixed terminal and the conductive portion are fixed by soldering with tin in the through hole.
  • a soldering station for accommodating the soldering pad is provided at the position of the fixed terminal corresponding to the soldering pad, the fastening terminal further includes a connection surface close to the soldering pad, and the soldering table is close to the soldering surface from the connection surface.
  • the vibrating film is formed in a concave direction.
  • a side of the pad away from the vibrating membrane is provided with a notch formed by an inward depression.
  • the housing is respectively provided with a first groove and a second groove corresponding to the positions of the fixed terminal and the conductive terminal, and the fixed terminal and the conductive terminal are respectively exposed in the first groove In the groove and the second groove, the fixed terminal is electrically connected with the pad, and the conductive terminal is electrically connected with the external circuit.
  • the shape of the soldering station matches the shape of the pad, and the number of the soldering station and the pad is in one-to-one correspondence.
  • the shape of the first groove matches the shape of the fixed terminals, and the number of the first grooves and the fixed terminals is in one-to-one correspondence.
  • the soldering piece includes a first soldering piece and a second soldering piece, and the first soldering piece and the second soldering piece extend from opposite ends of one side of the sounding unit and are arranged at intervals from each other.
  • the speaker box provided by the present invention has the following advantages:
  • solder tabs to replace the flexible circuit board reduces the cost; the wire outlet of the flexible circuit board is eliminated, and the air leakage problem of the wire outlet is completely avoided;
  • the solder pads are accommodated in the soldering station, which can improve assembly efficiency and assembly accuracy.
  • FIG. 1 is a schematic structural diagram of a speaker box provided by the present invention.
  • FIG. 2 is a schematic diagram of the exploded structure of the speaker box provided by the present invention.
  • FIG. 3 is an enlarged schematic view of the structure at A in FIG. 1 .
  • FIG. 4 is a schematic cross-sectional structural diagram of FIG. 1 along the line D-D.
  • FIG. 5 is an enlarged schematic view of the structure at E in FIG. 4 .
  • FIG. 6 is a schematic diagram of the assembly structure of the sounding unit and the soldering piece.
  • FIG. 7 is an enlarged schematic view of the structure at F in FIG. 6 .
  • FIG. 8 is a schematic view of the structure of the casing.
  • FIG. 9 is a schematic diagram of the structure of the solder tab.
  • FIG. 1 is a schematic structural diagram of a speaker box provided by the present invention
  • FIG. 2 is a schematic diagram of an exploded structure of a speaker box provided by the present invention
  • FIG. 3 is an enlarged schematic view of the structure at A in FIG. 4 is a schematic cross-sectional structure diagram of FIG. 1 along the D-D line
  • FIG. 5 is an enlarged schematic view of the structure at the E place in FIG. 4; Enlarge the schematic diagram of the structure.
  • the present invention provides a speaker box 100 provided by the present invention, comprising a housing 1 having a housing space 1B, a sounding unit 2 housed in the housing 1, and a soldering piece 3 fixed to the housing 1, the The sounding unit 2 is electrically connected to the external circuit through the solder pads 3 .
  • the sound-generating unit 2 has a diaphragm 21 and a magnetic yoke 22 that are opposite and spaced apart.
  • the housing 1 also has a bottom wall 11 that is opposite to the diaphragm 31 and spaced apart.
  • the membrane 31 encloses the front cavity 1C.
  • the sound-generating unit 2 includes two pads 23 spaced along the width direction of the sound-generating unit 2 , and the sound-generating unit 2 is electrically connected to an external circuit through the pads 23 .
  • Each of the pads 23 has a conductive portion 234; in addition, a through hole 231 is formed on the surface of each of the pads 23, and the through hole 231 penetrates the conductive portion 234; the pad 23 is far away from the diaphragm
  • One side of 21 is also provided with a notch 232 which is recessed inwardly.
  • the number of the through holes 231 on each of the bonding pads 23 is two, and the two through holes 231 are arranged at intervals along the width direction of the sounding unit 2 .
  • the through holes 231 and the gaps 232 are used to increase the bonding force of the solder pads 23 and the solder pads 3 by tin spraying.
  • the positions and numbers of the through holes 231 and the gaps 232 And the shape can be adjusted according to the actual situation, and such adjustment should belong to the protection scope of the present invention.
  • FIG. 8 is a schematic view of the structure of the housing
  • FIG. 9 is a schematic view of the structure of the solder tab.
  • the soldering piece 3 is fixed to the housing 1 by injection molding, which saves the steps of welding, pressure maintaining, and grooving glue.
  • the outlet slot of the flexible circuit board is eliminated, the air leakage problem of the outlet slot is completely avoided, and at the same time, the cost of the speaker box 100 is lower because the solder tab 3 is used instead of the higher-priced flexible circuit board.
  • the number of the soldering pieces 3 is two, and each of the soldering pieces 3 includes a main body portion fixed to the housing 1 , a fixed terminal extending from opposite ends of the main body portion, and a Conductive terminals, the fixed terminals are located in the receiving space 1B and are electrically connected to the pads 23 , the conductive terminals extend outside the receiving space 1B and form electrical connections with external circuits; the fixed terminals correspond to the The position of the pad 23 is provided with a soldering station for accommodating the pad 23.
  • the fixed terminal further includes a connection surface close to the pad, and the soldering station is recessed from the connection surface to the direction of the diaphragm 21. form.
  • the conductive portion 234 of the pad 23 is stacked on the fixed terminal along the vibration direction of the diaphragm 21 , and the fixed terminal and the conductive portion 234 pass through the through hole 231 Soldering and tinning is performed to realize the electrical connection and fixed connection between the conductive portion 234 and the fixed terminal, and finally realize the electrical connection between the sounding unit 2 and the external circuit through the soldering piece 3 .
  • each of the conductive parts 234 is correspondingly stacked on a fixed terminal, and then soldering is performed at the positions of the through holes 231 and the gaps 232 , so that not only the pads 23 and the solder pads 3 are formed
  • the formation of the electrical connection can also enhance the bonding force of the soldering pads 23 and the solder pads 3 by tin spraying, thereby improving the reliability of the product.
  • the soldering piece 3 includes a first soldering piece 31 and a second soldering piece 32 , and the first soldering piece 31 and the second soldering piece 32 extend from opposite ends of one side of the sounding unit 2 . and spaced from each other.
  • the first solder tab 31 includes a first main body portion 311 that is injection-molded and fixed to the housing, and first fixed terminals 312 and first conductive terminals 313 disposed at opposite ends of the first main body portion 311 .
  • the fixed terminal 312 is located in the accommodating space 1B and is electrically connected to one of the bonding pads 23 .
  • the first conductive terminal 313 extends out of the accommodating space 1B and forms an electrical signal connection with the outside.
  • the first fixing terminal 312 is provided with a first soldering pad 3121 that accommodates the bonding pad 23 at the position corresponding to the bonding pad 23 , and the first fixing terminal 312 further includes a first connection surface close to the bonding pad 23 .
  • the first soldering station 3121 is formed concavely from the first connecting surface 3122 toward the direction close to the diaphragm 21 .
  • the shape of the first soldering station 3121 matches the shape of the bonding pad 23 .
  • one of the pads 23 is electrically connected to the first fixed terminal 312 , so that one of the pads 23 is electrically connected to the first fixed terminal 312 .
  • the bonding pads 23 are electrically connected to the first solder pads 31 , and at the same time, the bonding force of the solder pads 23 and the first solder pads 31 by tin spray welding is enhanced.
  • the second solder tab 32 includes a second main body portion 321 that is injection-molded and fixed to the housing, and second fixed terminals 322 and second conductive terminals 323 disposed at opposite ends of the second main body portion 321 .
  • the fixed terminal 322 is located in the accommodating space 1B and is electrically connected to another of the bonding pads 23 , and the second conductive terminal 323 extends to the outside of the accommodating space 1B and forms an electrical signal connection with the outside.
  • the second fixing terminal 322 is provided with a second soldering pad 3221 which accommodates the bonding pad 23 at a position corresponding to the bonding pad 23 , and the second fixing terminal 322 further includes a second connecting surface close to the bonding pad 23 .
  • the second soldering station 3221 is formed concavely from the second connection surface 3222 toward the direction close to the diaphragm 21 .
  • the shape of the second soldering station 3221 matches the shape of the pad 23 .
  • the housing 1 is provided with two first grooves 12 corresponding to the first fixed terminal 312 and the second fixed terminal 322 respectively, and the first fixed terminal 312 and the second fixed terminal 322 are exposed respectively. They are arranged in the two first grooves 12 to realize the electrical connection between the first fixed terminal 312 and the second fixed terminal 322 and the pad 23 respectively.
  • the shapes of the two first grooves 12 match the shapes of the first fixing terminal 312 and the second fixing terminal 322 respectively.
  • the first conductive terminal 313 and the second conductive terminal 323 are rectangular plates, the housing 1 is provided with two second grooves 13 , the first conductive terminal 313 and the second conductive terminal 323 are both It is exposed on the bottom of the second groove 13 , so that the first conductive terminal 313 and the second conductive terminal 323 are electrically connected to the outside world.
  • the speaker box provided by the present invention has the following advantages:
  • solder tab 3 to replace the flexible circuit board reduces the cost; the wire outlet of the flexible circuit board is cancelled, and the air leakage problem of the wire outlet is completely avoided; by setting the first soldering station 3121 and the second The soldering station 3221 and the two bonding pads 23 are respectively accommodated in the first soldering station 3121 and the second soldering station 3221, which can improve assembly efficiency and assembly accuracy.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

La présente invention concerne un caisson de haut-parleur, comprenant un boîtier ayant un espace de logement et une unité d'émission de son ayant une membrane, dans laquelle l'unité d'émission de son est munie de plots connectés électriquement à un circuit externe ; chaque plot est muni d'une partie conductrice ; un trou traversant est agencé sur la surface du plot ; le trou traversant pénètre à travers la partie conductrice, et comprenant en outre des feuilles de soudure, chaque feuille de soudure comprenant une partie de corps principal fixée au boîtier, et une borne conductrice et une borne fixe qui s'étendent respectivement depuis les deux extrémités opposées de la partie de corps principal. La borne conductrice s'étend hors de l'espace de logement et forme une connexion électrique avec le circuit externe. La borne fixe est située dans l'espace de réception. Les parties conductrices sont empilées sur les bornes fixes le long de la direction de vibration de la membrane, et les bornes fixes sont fixées aux parties conductrices par soudure à l'étain dans les trous traversants. Le caisson de haut-parleur fourni par la présente invention présente les avantages d'une grande efficacité d'assemblage, d'un faible coût et d'une bonne fiabilité.
PCT/CN2020/141838 2020-12-18 2020-12-30 Caisson de haut-parleur WO2022126781A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011511826.6A CN112468912A (zh) 2020-12-18 2020-12-18 扬声器箱
CN202011511826.6 2020-12-18

Publications (1)

Publication Number Publication Date
WO2022126781A1 true WO2022126781A1 (fr) 2022-06-23

Family

ID=74803132

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/141838 WO2022126781A1 (fr) 2020-12-18 2020-12-30 Caisson de haut-parleur

Country Status (2)

Country Link
CN (1) CN112468912A (fr)
WO (1) WO2022126781A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080050093A (ko) * 2006-12-01 2008-06-05 주식회사 이엠텍 음향변환장치
CN102130311A (zh) * 2010-01-13 2011-07-20 鸿富锦精密工业（深圳）有限公司 电池座
CN108307277A (zh) * 2018-01-05 2018-07-20 瑞声科技(新加坡)有限公司 扬声器箱
CN208285537U (zh) * 2018-05-10 2018-12-25 歌尔科技有限公司 发声装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101439912B1 (ko) * 2013-05-28 2014-09-12 주식회사 이엠텍 납땜 구조를 개선한 마이크로스피커
CN110475427A (zh) * 2019-09-20 2019-11-19 昆山国显光电有限公司 一种焊盘、终端设备及焊接方法
CN111244618A (zh) * 2020-03-31 2020-06-05 江苏雳通通讯科技有限公司 一种天线与滤波器的联接结构及联接方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080050093A (ko) * 2006-12-01 2008-06-05 주식회사 이엠텍 음향변환장치
CN102130311A (zh) * 2010-01-13 2011-07-20 鸿富锦精密工业（深圳）有限公司 电池座
CN108307277A (zh) * 2018-01-05 2018-07-20 瑞声科技(新加坡)有限公司 扬声器箱
CN208285537U (zh) * 2018-05-10 2018-12-25 歌尔科技有限公司 发声装置

Also Published As

Publication number Publication date
CN112468912A (zh) 2021-03-09

Similar Documents

Publication Publication Date Title
CN108307277B (zh) 扬声器箱
CN111970618B (zh) 发声装置和可穿戴设备
WO2016169256A1 (fr) Dispositif haut-parleur
WO2021000085A1 (fr) Haut-parleur
US20130148837A1 (en) Multi-functional microphone assembly and method of manufacturing the same
CN109672948A (zh) 发声器件
JP2011114506A (ja) マイクロホンユニット
US11265631B2 (en) Speaker box
WO2020029639A1 (fr) Haut-parleur
WO2022126782A1 (fr) Boîtier de haut-parleur et son procédé d'assemblage
CN111970620B (zh) 发声装置和可穿戴设备
WO2022126781A1 (fr) Caisson de haut-parleur
US20230283965A1 (en) MEMS speaker
WO2022126766A1 (fr) Boîtier de haut-parleur
CN109982217A (zh) 一种微型扬声器
JP2011124748A (ja) マイクロホンユニット
CN209201323U (zh) 发声器件
CN108337614B (zh) 电声转换器
WO2020220710A1 (fr) Module de haut-parleur
WO2010048833A1 (fr) Microphone à condensateur au silicium
WO2021237800A1 (fr) Microphone mems
WO2022126779A1 (fr) Enceinte de haut-parleur
CN205081969U (zh) 一种指向性mems传声器及收音装置
WO2022126785A1 (fr) Enceinte de haut-parleur
CN112019983B (zh) 发声装置和可穿戴设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20965793

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20965793

Country of ref document: EP

Kind code of ref document: A1