WO2022111509A1 - 电子设备及电子设备的支撑件的安装方法 - Google Patents
电子设备及电子设备的支撑件的安装方法 Download PDFInfo
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- WO2022111509A1 WO2022111509A1 PCT/CN2021/132701 CN2021132701W WO2022111509A1 WO 2022111509 A1 WO2022111509 A1 WO 2022111509A1 CN 2021132701 W CN2021132701 W CN 2021132701W WO 2022111509 A1 WO2022111509 A1 WO 2022111509A1
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- WIPO (PCT)
- Prior art keywords
- support
- camera
- electronic device
- bracket
- mainboard
- Prior art date
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- 238000009434 installation Methods 0.000 title claims description 7
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- 238000001816 cooling Methods 0.000 claims description 4
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Images
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
Definitions
- the present application relates to the technical field of communication devices, and in particular, to an electronic device and a method for installing a support for the electronic device.
- Some electronic devices on the market are very popular among consumers, and electronic devices generally have a front camera function.
- the front needs to be arranged with two front cameras (ie, the front main camera and the front wide-angle camera), resulting in a screen with a notch.
- two front cameras ie, the front main camera and the front wide-angle camera
- the roller-fixed-drop reliability test can easily cause the impact force to be transmitted to the front-facing cameras, resulting in failure of the two front-facing cameras and even damage to the electronic equipment.
- the present application discloses an electronic device and a method for installing a support of the electronic device, so as to solve the problem that the front camera cannot work normally because the front camera cannot be easily deformed because the supporting structure cannot be provided.
- an embodiment of the present application discloses an electronic device, including a mainboard bracket, a mainboard upper cover, a first camera, and a second camera;
- a cavity is formed between the mainboard bracket and the mainboard upper cover, the first camera and the second camera are both arranged in the cavity, and the first camera and the second camera are a gap is formed between;
- the mainboard upper cover has a first support portion, the first support portion is located between the first camera and the second camera and extends toward the gap;
- the electronic device further includes a support member, the support member is connected to the motherboard bracket, at least a part of the support member away from the motherboard bracket adopts a shape memory alloy, and at least a part of the support member away from the motherboard bracket Deformable between a first configuration in which at least a portion of the support member facing away from the motherboard bracket is located in the gap, and a second configuration in which the support member faces away from the mainboard bracket At least a part of the motherboard bracket forms a second support part, the second support part abuts against the first support part, and in the distribution direction of the first camera and the second camera, the first The size of the two support parts is larger than the size of the gap.
- an embodiment of the present application discloses a method for installing a support of an electronic device, including:
- the support member is heated to a second preset temperature, so that the support region of the support member is deformed to form the second support portion, and the second support portion is abutted against the first support portion.
- the support is connected to the mainboard bracket, and at least the part of the support away from the mainboard bracket is made of shape memory alloy, so that the support is partially pierced before the first form in which the support is not deformed.
- the formed second supporting part can abut on the first supporting part of the upper cover of the main board. In this way, in the first When the gap between the first camera and the second camera is as small as possible, it can meet the requirement that the support part penetrates into the gap, and at the same time, the support part can be deformed after penetrating the gap to increase the contact with the upper cover of the main board.
- the contact area between the first support parts can improve the support stability, and at the same time, it can also absorb the cumulative tolerance formed by the fixing between the support and the main board bracket and the assembly between the main board bracket and the main board upper cover.
- the good support effect of the front camera with a narrow spacing relieves the problem that the two front cameras are squeezed under the stress of the motherboard bracket, causing the cameras to not work properly.
- FIG. 1 is a partial schematic diagram of a front camera of an electronic device disclosed in the related art
- FIG. 2 is a partial schematic diagram of a front camera module of an electronic device disclosed in an embodiment of the present application
- FIG. 3 is a partial schematic diagram of a front camera module with a support in a first form in an electronic device disclosed in an embodiment of the present application;
- FIG. 4 is a partial schematic diagram of a front camera module where the support in the electronic device disclosed in the embodiment of the application is in the second form;
- FIG. 5 is a front perspective view of the assembly of the support member and the motherboard bracket in the electronic device disclosed in the embodiment of the application;
- FIG. 6 is a rear perspective view of the assembly of the support member and the motherboard bracket in the electronic device disclosed in the embodiment of the application;
- FIG. 7 is a schematic diagram of the support in the electronic device disclosed in the embodiment of the present application in a first state
- FIG. 8 is a schematic diagram of the support in the electronic device disclosed in the embodiment of the present application in a second state.
- 200-mainboard upper cover 210-first support part; 220-third support part; 230-fourth support part;
- 600-support 610-fixing plate; 611-positioning hole; 620-supporting plate; 630-second supporting part;
- FIG. 1 For an electronic device in the related art, such as a mobile phone, the overall layout of its two front cameras is shown in Figure 1, where 101 is the main front camera with high pixels and is mainly responsible for the front camera function; 102 is the front camera.
- the front wide-angle camera is mainly responsible for the super wide-angle camera function to meet more needs of users.
- the distance between the front main camera and the front wide-angle camera is relatively small.
- Small. 103 is a motherboard bracket, which is used to support and protect the two front cameras.
- the left side of the motherboard bracket 103 is supported on the motherboard, and the right side is supported on the motherboard upper cover 105.
- the spacing is too small to set up a support structure.
- 104 is the plate battery cover, which is relatively weak and easy to deform, and is pasted on the lower cover of the main board;
- 105 is the upper cover of the main board, which is used to fix the two front cameras, and is used to support the main board, the main board bracket and the main board lower cover.
- the plate battery cover 104 when the plate battery cover 104 is subjected to an external force, the plate battery cover 104 is greatly deformed due to its weak strength, so that the force is directly transmitted to the motherboard bracket 103 , since a support structure cannot be set between the two front cameras , so that the mainboard bracket 103 can only transmit the force to the two front cameras, thus, the two front cameras are deformed by force, resulting in a sharp increase in the risk of cracking of the photosensitive chip and the filter, which in turn leads to the two front cameras. unable to work properly.
- an embodiment of the present application discloses an electronic device.
- the disclosed electronic device includes a mainboard bracket 100 , a mainboard cover 200 , a first camera 400 , a second camera 500 and a support 600 .
- the mainboard bracket 100 is a basic component of an electronic device, and the mainboard bracket 100 can provide a mounting basis for some components in the electronic device.
- the first camera 400 and the second camera 500 are both disposed inside the mainboard bracket 100 , and the mainboard bracket 100 supports and protects the first camera 400 and the second camera 500 .
- the mainboard upper cover 200 is a fixing component of the electronic device, and the mainboard upper cover 200 can be used to fix and support some components.
- the mainboard upper cover 200 is used to fix the first camera 400 and the second camera 500, and is also used to support the mainboard 300, the mainboard bracket 100 and the mainboard lower cover.
- mainboard bracket 100 is supported on the mainboard 300 of the electronic device, the mainboard 300 is supported on the mainboard upper cover 200, and the other side of the mainboard bracket 100 is directly supported on the mainboard upper cover 200.
- a cavity is formed between 100 and the mainboard upper cover 200 , and the first camera 400 and the second camera 500 are arranged in parallel in the cavity, so as to realize the fixed installation of the two cameras through the mainboard bracket 100 and the mainboard upper cover 200 .
- the main board upper cover 200 has a first support portion 210, the first support portion 210 extends into the cavity and divides the cavity into two small cavities, and the first camera 400 is embedded in one of the small cavities , the second camera 500 is embedded in another small cavity, so as to fix and install two cameras respectively through the two small cavities.
- the first camera 400 is a front-facing main camera with high pixels, and is mainly responsible for the front-facing camera function; the second camera 500 is a front-facing wide-angle camera, responsible for the super wide-angle camera function, so as to meet the user's more photography needs.
- a gap M for installation is formed between the first camera 400 and the second camera 500 .
- a support member 600 is connected to the motherboard bracket 100, and at least the part of the support member 600 away from the motherboard bracket 100 is made of shape memory alloy material , and at least a portion of the support member 600 away from the mainboard bracket 100 is deformable between the first shape and the second shape.
- At least a portion of the support member 600 away from the mainboard bracket 100 can extend in the gap M
- at least a portion of the support member 600 away from the motherboard bracket 100 forms a second support portion 630
- the second support portion 630 abuts on the first support portion 210 of the motherboard bracket 100 , and is located between the first camera 400 and the mainboard bracket 100 .
- the size of the second support portion 630 in the distribution direction of the second camera 500 is larger than the size of the gap M. Therefore, the support member 600 realizes the support function between the mainboard bracket 100 and the mainboard upper cover 200 , which can effectively solve the problem of the mainboard bracket 100 .
- the problem that the camera module is damaged due to the force in the middle area.
- At least a portion of the support member 600 facing away from the main board bracket 100 adopts a shape memory alloy, wherein the memory alloy is a martensitic transformation alloy whose atoms are arranged regularly and whose volume becomes less than 0.5%.
- This alloy will deform under the action of external force. When the external force is removed, it can restore its original shape under certain temperature conditions. Because it has a recovery function of more than one million times, it is called “memory alloy” or “shape memory alloy”, that is, shape memory alloy.
- the shape memory alloy has the advantages of non-magnetic, wear-resistant, corrosion-resistant and non-toxic, and has been widely used.
- Shape Memory Alloys is an alloy material that can completely eliminate its deformation at a lower temperature after heating and restore its original shape before deformation, that is, an alloy with a "memory" effect.
- the huge antenna on artificial satellites can be made of shape memory alloys.
- the parabolic antenna is folded and put into the satellite body. After the rocket lifts off and the artificial satellite is put into the predetermined orbit, it only needs to be heated. .
- a curved shape memory alloy spoon straightens when placed in hot water, and bends again when placed in cold water.
- the support member 600 is in the first form.
- the support member 600 can penetrate into the gap M and face the first support portion. 210, so that the support 600 can smoothly penetrate into the gap M without colliding with the side wall of the first camera 400 or the second camera 500, and a good assembly effect is achieved; as shown in FIG.
- the supporting member 600 is partially deformed to assume the second shape, that is, a second supporting portion 630 is formed at the end of the supporting member 600 away from the motherboard bracket 100 , and the second supporting portion 630 is formed along the first camera 400 and the second camera 500 .
- the size of the second support portion 630 is larger than the size of the gap M between the first camera 400 and the second camera 500 .
- the contact area between the support member 600 and the first support portion 210 is increased, and the size of the support member 600 changes to a certain extent due to the local deformation, which can effectively absorb the gap between the support member 600 and the motherboard bracket 100 .
- the connection and the assembly tolerance between the main board bracket 100 and the main board upper cover 200, further, the supporting effect of the support member 600 is greatly improved.
- the gap M between the first camera 400 and the second camera 500 is relatively small.
- the support 600 is in the first form After the support member 600 penetrates into the gap M, it is partially deformed to form the second support portion 630 and assumes the second shape. At this time, the support member 600 passes through the second support portion 630 and the first support portion. 210 abutting each other, increasing the support area and achieving a good support effect.
- the gap M between the first camera 400 and the second camera 500 can only allow the support 600 in the first form to penetrate, but not the support 600 in the second form. That is, along the distribution direction of the first camera 400 and the second camera 500 , the size of the support 600 in the first form does not exceed the size of the gap M, and the size of the support 600 in the second form is larger than the size of the gap M.
- the support member 600 may use a shape memory alloy as a whole, or may use a shape memory alloy partially extending into the gap M, and of course, a shape memory alloy may also be used in the area for abutting with the first support portion 210;
- the deformation of the component 600 is determined according to several times of cold and hot cycle training. For the specific principle, reference may be made to the related art, which will not be described in detail here.
- the support member 600 adopts a sheet metal stamping part, and specifically includes a fixing plate 610 and a supporting plate 620.
- the fixing member 610 and the supporting plate 620 are integrally arranged or connected to each other, and The supporting plate 620 and the fixing plate 610 are arranged at an angle, the fixing plate 610 is fixedly connected to the mainboard bracket 100 , and the second supporting portion 630 is located at one end of the supporting plate 620 away from the fixing plate 610 .
- the fixing plate 610 can be directly welded on the mainboard bracket 100, for example, the fixing plate 610 and the mainboard bracket 100 are welded together by spot welding;
- a positioning protrusion 110 can also be provided on the side of the motherboard bracket 100 away from the motherboard upper cover 200, and the shape of the positioning protrusion 110 can be optional, such as cylindrical, prismatic, hemispherical, etc.
- Positioning holes 611 are provided on the 610, and the shape of the positioning holes 611 is adapted to the positioning protrusions 110. In this way, when the fixing plate 610 is installed, the positioning holes 611 on the fixing plate 610 are firstly sleeved on the positioning protrusions on the motherboard bracket 100. 110, and then, the fixed connection is realized by spot welding.
- the number of the positioning protrusions 110 may be arbitrary, as long as the actual requirements are met, which is not specifically limited here.
- the support plate 620 can be fixedly connected to the fixed plate 610 by spot welding, and the support plate 620 and the fixed plate 610 are arranged at an included angle. Since the longitudinal extension direction of the gap M is opposite to the mainboard bracket 100, or is substantially vertical, when the fixing plate 610 is welded and fixed on the mainboard bracket 100, in order to allow the supporting plate 620 to penetrate into the gap M, the supporting plate 620 and the fixing plate 610 are connected together. It is designed to be perpendicular to each other, so that not only the fixed connection between the fixing plate 610 and the motherboard bracket 100 is guaranteed, but also the supporting plate 620 can smoothly penetrate into the gap M without contacting the side walls of the two front cameras. bump. Further, the fixing plate 610 is an L-shaped plate, wherein the supporting plate 620 is fixedly connected at one of the outer edges of the L-shaped plate, and the supporting plate 620 and the fixing plate 610 are perpendicular to each other.
- the second supporting portion 630 is located at one end of the supporting plate 620 away from the fixing plate 610 .
- the supporting plate 620 is partially located in the gap M, and the supporting plate 620 faces away from the fixing plate 610
- One end of the main board is deformed to form a second support portion 630 , which is supported on the first support portion 210 of the mainboard upper cover 200 through the second support portion 630 , which increases the contact area and ensures good support for the central area of the mainboard bracket 100 Effect.
- the first category one-way memory effect: the shape memory alloy deforms at a lower temperature, and can restore the shape before deformation after heating. This shape memory phenomenon that only exists during the heating process is called the one-way memory effect;
- the second category two-way memory effect: the shape memory alloy restores the shape of the high temperature phase when heated, and can restore the shape of the low temperature phase when it is cooled, which is called the two-way memory effect;
- the third category whole-course memory effect: the shape of the high-temperature phase is restored when heated, and the shape of the low-temperature phase with the same shape and opposite orientation is changed when cooling, which is called the whole-course memory effect.
- the support member 600 adopts a shape memory alloy with two-way memory effect.
- This type of shape memory alloy can restore the shape of the high temperature phase when heated, and can restore the shape of the low temperature phase when cooled.
- the support plate 620 is in a low temperature state, according to the characteristics of the shape memory alloy itself, the support plate 620 is in a low temperature phase shape, and the support plate 620 is in a flat shape (ie, the above-mentioned first shape), as shown in FIG.
- the support plate 620 in the flattened state can smoothly penetrate the gap M between the first camera 400 and the second camera 500 , thereby effectively preventing the support plate 620 During the penetration process, it collides with the side wall of the first camera 400 or the second camera 500 , thereby achieving a good assembly effect.
- the support plate 620 is in a high temperature state, according to the characteristics of the shape memory alloy itself, the support plate 620 is deformed and bent to form a flange (ie, the second form described above), as shown in FIG. 8 .
- the contact area with the first support portion 210 can be greatly increased.
- the tolerance of the entire support member 600 connected to the motherboard bracket 100 is absorbed, thereby improving the support effect between the support member 600 and the first support portion 210 of the motherboard upper cover 200 and ensuring the stability of the support.
- the support plate 620 is bent into an L shape to increase the contact area with the first support portion 210 .
- the transformation temperature of shape memory alloys needs to be controlled between -30°C and 80°C.
- the temperature includes -30°C, -10°C, 0°C, 20°C, 40°C, 60°C, 80°C, etc. Of course, other degrees may also be included, which are not specifically limited here.
- nickel-titanium memory alloy can be selected for shape memory alloy.
- the low-temperature phase temperature of nickel-titanium memory alloy is about -15°C, and the high-temperature phase is 30°C to 55°C, which meets the actual requirements.
- it is not limited to nickel-titanium memory alloys, and other shape memory alloys that meet actual requirements can also be selected.
- the support plate 620 is in a flat state at a low temperature.
- the support plate 620 is a flat plate structure, and the support plate 620 deforms at a high temperature.
- a flange is formed at one end away from the fixing plate 610.
- the ratio of the size of the flange to the size of the flat structure is not less than 2.
- the size of the flange is the extended width of the flange, and the size of the flat structure is the thickness of the flat structure.
- the support plate 620 is in a flat shape.
- the support plate 620 can be regarded as a material thickness, and the gap M between the first camera 400 and the second camera 500 is slightly larger than a material thickness. Therefore, the length of the Liu Haiping screen can be minimized as much as possible, and the requirement of setting a support structure between the main board bracket 100 and the main board upper cover 200 is met.
- the size of the flange is not less than two material thicknesses, such as two material thicknesses, three material thicknesses, etc., so as to increase the contact area with the first support portion 210 and improve the support effect .
- the end of the support plate 620 away from the fixing plate 610 in a low temperature state There is a slight overlap area between the first support portion 210 and the first support portion, as shown in FIG. 3 .
- the support plate 620 is in a flat shape.
- the end of the support plate 620 away from the fixing plate 610 will contact Connected to the first support portion 210, so that the support member 600 is slightly elevated, that is, the support plate 620 has a certain amount of redundancy. Under the high temperature state, the bending deformation of the support plate 620 will cause the total length of the support plate 620. Since the support plate 620 in the flattened shape has a certain amount of redundancy relative to the first support portion 210, even if the support plate 620 is bent and deformed, the flange edge formed after bending can abut on the first support plate 620. On the support part 210, there will be no large gap and no support function.
- the main board bracket 100 is made of stainless steel.
- the main board bracket 100 is made of SUS304 3/4H material, which has good corrosion resistance, and has sufficient hardness and strength to achieve Support and protection of the first camera 400 and the second camera 500 .
- the main board bracket 100 is formed by in-mold injection molding of stainless steel, that is, it is formed by stamping stainless steel, and then injection molding with a plastic mold.
- the area on the mainboard bracket 100 for fixing and connecting the fixing plate 610 is made of stainless steel, so as to ensure the point between the fixing plate 610 and the mainboard bracket 100 Solder fixed connection.
- the fixing plate 610 of the support member 600 is fixedly connected to the side of the mainboard bracket 100 away from the mainboard upper cover 200 .
- a through hole 120 is opened, and the support plate 620 can pass through the through hole 120 and extend into the gap M, so that the end of the support plate 620 away from the fixing plate 610 can abut on the first support portion 210, as shown in FIG. 5 and shown in Figure 6.
- the support member 600 may also be fixedly connected to the side of the mainboard bracket 100 facing the mainboard upper cover 200 . At this time, the support member 600 is located at the mainboard bracket with the gap M relative to the mainboard bracket 100 . 100 on the same side, so that the actual assembly requirements can be met without opening the through holes 120 on the motherboard bracket 100 .
- the mainboard upper cover 200 further has a third supporting portion 220 and a fourth supporting portion 230 respectively disposed on the left and right sides of the mainboard upper cover 200 , wherein the third supporting portion 220 and the first supporting portion
- the 210 points are located on both sides of the first camera 400.
- the third support portion 220 and the first support portion 210 limit the positions of the two sides of the first camera 400.
- the first camera 400 is limited.
- the fourth support portion 230 and the first support portion 210 are located on both sides of the second camera 500, respectively, and the fourth support portion 230 and the first support portion 210 limit the two sides of the second camera 500.
- mainboard bracket 100 is supported on the mainboard 300
- mainboard 300 is supported on the third supporting portion 220
- the other side of the mainboard bracket 100 is supported on the fourth supporting portion 230
- the middle portion is supported on the third supporting portion 230 by the supporting member 600 .
- the mainboard bracket 100 is supported by the mainboard upper cover 200 , the mainboard 300 and the support member 600 , thereby effectively preventing the mainboard bracket 100 from pressing the front camera module after being stressed and causing its damage. , to ensure the normal use of the front camera module.
- a battery cover 700 is provided on the side of the mainboard bracket 100 away from the mainboard upper cover 200 .
- the battery cover 700 is a plate part with relatively weak strength, soft material and easy to deform.
- On the lower cover of the main board when the battery cover 700 is subjected to an external force, due to its weak strength, the deformation is relatively large, and the force is directly transmitted to the main board bracket 100, which is transmitted to the support member 600 through the main board bracket 100, and is transmitted to the main board bracket 600 through the support member 600.
- the upper cover 200 of the main board prevents the force from being transmitted to the first camera 400 or the second camera 500, thereby ensuring that the first camera 400 and the second camera 500 are not damaged.
- the embodiment of the present application discloses an installation method of the support member 600 in the above electronic device, and the installation method includes:
- the support member 600 is heated to the second preset temperature, so that the support region of the support member 600 is deformed to form the second support portion 630 , and the second support portion 630 is abutted against the first support portion 210 .
- the positioning holes 611 on the fixing plate 610 are sleeved on the positioning protrusions 110 on the mainboard bracket 100 , and then spot welding is performed to fix the support member 600 on the mainboard bracket 100 .
- the support member 600 can be placed in liquid nitrogen or transferred to a low temperature by contacting a cold source to reduce to the first preset temperature, so that the support member 600 is in the low temperature phase.
- the support area of the support member 600 is the first The pattern, that is, flattened, in preparation for subsequent assembly.
- the first preset temperature here can be determined according to the type of shape memory alloy selected. For example, when nickel-titanium alloy is selected, the first preset temperature is about -15°C to ensure that the support 600 is assembled before assembly. The support area of is flattened.
- the mainboard bracket 100 connected with the support member 600 is assembled to the main board upper cover 200.
- the support area of the support member 600 is it can smoothly penetrate into the narrow gap M formed between the first camera 400 and the second camera 500, effectively preventing the support 600 from colliding with the side wall of the first camera 400 or the second camera 500, and achieving good assembly Effect.
- the support member 600 When the support area of the support member 600 penetrates into the gap M between the first camera 400 and the second camera 500, the support member 600 is heated, and the support member 600 can be transferred to a high temperature by contacting the heat source to rise to the second preset temperature , the support member 600 is in the high temperature phase, at this time, the support area of the support member 600 is in the second shape, that is, a bending deformation occurs, forming a second support portion 630, and the support area of the support member 600 in the bent shape abuts On the first support portion 210 , the contact area between the support member 600 and the first support portion 210 is increased, and a good support effect is achieved.
- the second preset temperature here can be determined according to the type of shape memory alloy selected.
- the second preset temperature is 30°C to 55°C, so as to increase the support after assembly.
- the contact area between the component 600 and the first support portion 210 supporting the upper cover is improved, and the support stability is improved.
- At least part of the support member 600 is made of a shape memory alloy material, and the shape of the shape memory alloy can change at different temperatures to achieve different effects;
- the support area of the support member 600 is in the shape of the low temperature phase, and its thickness is relatively small, so that a good assembly effect can be achieved in the case of a narrow distance between the first camera 400 and the second camera 500;
- the support area of the support member 600 connected to the motherboard bracket 100 is in the shape of the high temperature phase, so that its thickness is relatively large, which increases the contact area with the first support portion 210 supporting the upper cover, and also absorbs the support member. 600 to the accumulated tolerance of fixing and assembly, so that a good supporting effect can be achieved in the case of a narrow distance between the first camera 400 and the second camera 500 .
- the electronic devices in the embodiments of the present application include mobile phones, tablet computers, etc., and the specific types are not limited.
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Abstract
Description
Claims (13)
- 一种电子设备,其中,包括:主板支架(100)、主板上盖(200)、第一摄像头(400)和第二摄像头(500);所述主板支架(100)与所述主板上盖(200)之间围设成一腔体,所述第一摄像头(400)和所述第二摄像头(500)均设置于所述腔体,且所述第一摄像头(400)与所述第二摄像头(500)之间形成有间隙(M);所述主板上盖(200)具有第一支撑部(210),所述第一支撑部(210)位于所述第一摄像头(400)与所述第二摄像头(500)之间,并朝向所述间隙(M)延伸;所述电子设备还包括支撑件(600),所述支撑件(600)连接于所述主板支架(100),所述支撑件(600)背离所述主板支架(100)的至少部分采用形状记忆合金,且所述支撑件(600)背离所述主板支架(100)的至少部分在第一形态和第二形态之间可形变,在所述第一形态下,所述支撑件(600)背离所述主板支架(100)的至少部分位于所述间隙(M)中,在所述第二形态下,所述支撑件(600)背离所述主板支架(100)的至少部分形成第二支撑部(630),所述第二支撑部(630)与所述第一支撑部(210)相抵接,且在所述第一摄像头(400)和所述第二摄像头(500)的分布方向上,所述第二支撑部(630)的尺寸大于所述间隙(M)的尺寸。
- 根据权利要求1所述的电子设备,其中,所述支撑件(600)包括固定板(610)和支撑板(620),所述固定板(610)和所述支撑板(620)一体设置或相互连接,所述固定板(610)与所述支撑板(620)呈夹角设置;所述固定板(610)固定连接于所述主板支架(100),所述支撑板(620)延伸于所述间隙(M)中,所述第二支撑部(630)位于所述支撑板(620)的背离所述固定板(610)的一端部。
- 根据权利要求2所述的电子设备,其中,所述支撑板(620)采用形状记忆合金;所述支撑板(620)背离所述固定板(610)的一端部在所述第一形态下呈平板结构,在所述第二形态下形变形成法兰边,以使所述支撑板(620)呈L形。
- 根据权利要求3所述的电子设备,其中,在所述第一摄像头(400)和所述第二摄像头(500)的分布方向上,所述法兰边的尺寸与所述平板结构的尺寸之比不小于2。
- 根据权利要求3所述的电子设备,其中,在所述第一形态下,所述支撑板(620)的背离所述固定板(610)的一端与所述第一支撑部(210)之间部分重叠。
- 根据权利要求2所述的电子设备,其中,所述主板支架(100)的背离所述主板上盖(200)的一侧面设有定位凸起(110),所述固定板(610)上开设有定位孔(611),所述定位孔(611)适于套设所述定位凸起(110);和/或,所述固定板(610)焊接于所述主板支架(100)。
- 根据权利要求6所述的电子设备,其中,所述主板支架(100)采用SUS304 3/4H材质;和/或,所述主板支架(100)采用不锈钢模内注塑成型;和/或,所述主板支架(100)的用于固定所述固定板(610)的区域采用不锈钢材质。
- 根据权利要求6所述的电子设备,其中,所述主板支架(100)上开设有通孔(120),所述支撑板(620)适于穿过所述通孔(120),并延伸入所述间隙(M)。
- 根据权利要求1-8中任意一项所述的电子设备,其中,所述支撑件(600)至少部分采用双程记忆效应的形状记忆合金。
- 根据权利要求9所述的电子设备,其中,所述形状记忆合金的变相温度范围为-30℃至80℃。
- 根据权利要求10所述的电子设备,其中,所述形状记忆合金为镍钛记忆合金。
- 根据权利要求1-8中任意一项所述的电子设备,其中,所述主板上盖(200)还具有设于所述第一摄像头(400)的背离所述第一支撑部(210)一侧的第三支撑部(220),以及设于所述第二摄像头(500)的背离所述第一支撑部(210)一侧的第四支撑部(230);所述电子设备还包括主板(300),所述主板(300)被支撑于所述第三支撑部(220)上,所述主板支架(100)的一侧被支撑于所述主板(300)上,另一侧被支撑于所述第四支撑部(230)上。
- 一种电子设备的支撑件的安装方法,其中,所述电子设备为权利要求1-12中任意一项所述的电子设备,所述安装方法包括:将所述支撑件(600)固定于所述主板支架(100);将所述支撑件(600)降温至第一预设温度,以使所述支撑件(600)的支撑区域呈展平形态;将所述主板支架(100)装配至所述主板上盖(200),并使所述支撑件(600)的支撑区域延伸于所述间隙(M)中;将所述支撑件(600)升温至第二预设温度,以使所述支撑件(600)的支撑区域发生形变形成所述第二支撑部(630),并使所述第二支撑部(630)抵接于所述第一支撑部(210)。
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EP21897010.1A EP4254915A4 (en) | 2020-11-30 | 2021-11-24 | ELECTRONIC DEVICE AND INSTALLATION METHOD FOR A SUPPORT PART OF AN ELECTRONIC DEVICE |
KR1020237021170A KR20230107362A (ko) | 2020-11-30 | 2021-11-24 | 전자 기기 및 전자 기기의 지지부재의 장착 방법 |
JP2023528493A JP2023550723A (ja) | 2020-11-30 | 2021-11-24 | 電子機器及び電子機器の支持部材の取り付け方法 |
US18/321,972 US20230300229A1 (en) | 2020-11-30 | 2023-05-23 | Electronic device and method for mounting support member of electronic device |
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CN113114825B (zh) * | 2021-05-14 | 2023-05-02 | 维沃移动通信有限公司 | 电子设备 |
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