WO2021083391A1 - 母头连接器及连接器组合 - Google Patents

母头连接器及连接器组合 Download PDF

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Publication number
WO2021083391A1
WO2021083391A1 PCT/CN2020/134257 CN2020134257W WO2021083391A1 WO 2021083391 A1 WO2021083391 A1 WO 2021083391A1 CN 2020134257 W CN2020134257 W CN 2020134257W WO 2021083391 A1 WO2021083391 A1 WO 2021083391A1
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WO
WIPO (PCT)
Prior art keywords
connector
absorbing material
pcb board
female
signal layer
Prior art date
Application number
PCT/CN2020/134257
Other languages
English (en)
French (fr)
Inventor
许一凡
唐济海
赵敬棋
Original Assignee
天津莱尔德电子材料有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 天津莱尔德电子材料有限公司 filed Critical 天津莱尔德电子材料有限公司
Priority to US17/772,824 priority Critical patent/US20230027686A1/en
Publication of WO2021083391A1 publication Critical patent/WO2021083391A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins

Definitions

  • This application relates to the technical field of connectors, in particular to a female connector and a connector assembly formed by mating the female connector with a male connector or a gold finger circuit board.
  • Connectors are widely used in the electronic field. With the rapid development of big data, 5G technology and artificial intelligence applications, connectors must meet the requirements of high-speed and high-density applications. This brings challenges to the signal integrity design of the connector, especially how to solve the crosstalk problem of differential signals under high frequency/high density.
  • the connector can also be coated with a wave-absorbing material, or a conductor/conductor pair can be covered with a wave-absorbing material.
  • the absorption of electromagnetic waves by the absorbing material is used to eliminate the problem of differential signal crosstalk.
  • the traditional coating method using absorbing materials that is, the absorption of electromagnetic waves by the absorbing materials is non-selective, and the whole absorbing material covers the connector while absorbing the crosstalk electromagnetic waves of the differential signal, and it will also absorb the crosstalk electromagnetic waves of the differential signal.
  • the normal transmission of electrical signals is more likely to destroy the signal integrity of the connector.
  • the embodiment of the present application provides a female connector and a connector combination formed by mating the female connector with a male connector or a gold finger circuit board.
  • Absorbing materials are set in areas where high frequency radiation is likely to be generated, so as to achieve the selectivity and pertinence of electromagnetic wave absorption by the absorbing materials, which not only absorbs the crosstalk signal of the differential signal, but also retains the normal transmission of the electrical signal, ensuring the integrity of the connector signal , And the overall weight of the connector is lighter.
  • a female connector for connecting with a PCB board The PCB board is provided with a signal layer and a drill hole penetrating the signal layer; the female connector includes: a female terminal with two ends, one of which is used for The connection end that is mated with the male connector or the gold finger circuit board, and the other end forms a crimping pin for inserting in the drill hole and connecting with the signal layer; the crimping pin is connected to the drill
  • the vicinity of the connection of the hole forms a high-frequency radiation area when the connection end is mated with the male connector or the gold finger circuit board; the wave-absorbing material is arranged in the space covered by the high-frequency radiation area.
  • a connector combination includes: a male connector and a female connector; the male connector includes a male terminal; the female connector is used to connect to a PCB board, and the PCB board is provided with a signal layer and a through hole The signal layer is drilled; the female connector includes: a female terminal with two ends, one of which is a connecting end for mating with the male terminal, and the other end is formed for inserting in the drill A crimping pin in the hole and connected to the signal layer; the vicinity of the connection between the crimping pin and the drilled hole forms a high-frequency radiation area when the connecting end is mated with the male terminal; The material is arranged in the space covered by the high-frequency radiation area.
  • a connector assembly comprising: a gold finger circuit board and a female connector; the gold finger circuit board has a gold finger insertion end; the female connector is used to connect with a PCB board, and the PCB board is provided with a signal layer And a drill hole penetrating the signal layer; the female connector includes: a PCB board with a signal layer and a drill hole penetrating the signal layer;
  • the golden finger is inserted into the connecting end of the end, and the other end forms a crimping needle for inserting in the borehole and connecting with the signal layer; the connection point of the crimping needle and the borehole
  • a high-frequency radiation area is formed nearby when the connecting end is mated with the golden finger insertion end; the absorbing material is arranged in the space range covered by the high-frequency radiation area.
  • the connector is prone to generate high-frequency radiation near the area near the connection between the crimping pin and the drilled hole due to the antenna effect during use.
  • the radiating area needs only to be equipped with absorbing materials, and the other areas that do not produce high-frequency radiation do not need to be equipped with absorbing materials.
  • the signal absorbed by the absorbing material also has a certain selectivity. That is, only the crosstalk signal is absorbed without affecting the normal signal, so that the integrity of the differential signal can be better guaranteed.
  • the method of selectively or targeted placement of absorbing materials in the area of high-frequency radiation is used to replace the method of integrally covering the absorbing materials (plastic bracket and housing) in the prior art to achieve the goal of overcoming signal crosstalk.
  • No additional shielding material is needed, not only the amount of absorbing materials is greatly reduced, the overall weight of the connector, consumables and the implementation cost of the process are greatly lower, but it is also conducive to increasing the density of differential pairs to meet the high-speed and high-density applications of the current technological development of the connector demand.
  • FIG. 1 is a schematic structural diagram of a connector combination in which a female connector and a male connector of the present application are mated to form a non-limiting embodiment
  • FIG. 2 is a schematic structural diagram of a connector assembly in which a female connector and a gold finger circuit board are mated to form a non-limiting embodiment of the present application;
  • 3A is a schematic diagram of the assembly structure of the first embodiment between the wave absorbing material and the crimping needle or the drill hole;
  • 3B is a schematic diagram of the second embodiment of the assembly structure between the wave absorbing material and the crimping needle or the drill hole;
  • 3C is a schematic diagram of the assembly structure of the third embodiment between the wave absorbing material and the crimping needle or the drill hole;
  • 3D is a schematic diagram of the assembly structure of the fourth embodiment between the wave absorbing material and the crimping needle or the drill hole;
  • 3E is a schematic diagram of the assembly structure of the fifth embodiment between the wave absorbing material and the crimping needle or the drill hole;
  • 3F is a schematic diagram of the assembly structure of the sixth embodiment between the wave absorbing material and the crimping needle or the drill hole;
  • 3G and 3H are top views of FIG. 3F.
  • an embodiment of the present application provides a female connector 100, and a connector assembly formed by mating the female connector 100 with a male connector 200 or a gold finger circuit board 300 .
  • the female connector 100 includes a female terminal 101 for mating with a male connector 200 or a gold finger circuit board 300.
  • the female terminal 101 has opposite ends, which are used to connect with the male connector 200 or
  • the connecting terminal 101a (the upper end shown in FIG. 1 and the right end shown in FIG. 2) to which the golden finger circuit board 300 is mated, and the crimping pin 101b (such as the upper end shown in FIG. Figure 1 and Figure 2 show the lower end).
  • one end is used to connect to the male connector 200 or the golden finger circuit board 300, and the other end is used to connect to the PCB board 400.
  • the connecting end 101a of the female terminal 101 can be expanded radially outward to form a horn-shaped guide head 103.
  • the male connector 200 or the golden finger circuit board 300 and the female connector 100 to achieve blind mating. In this way, the operator holds the male connector 200 or the golden finger circuit board 300, and can successfully complete the mating operation with the female connector 100 under the guidance of the horn-shaped guide 103.
  • the female terminal 101 includes a cantilever section 104 with elasticity.
  • the cantilever section 104 is at least One position is bent to form an elastic pressing portion 105 for contact with the male connector 200 or the gold finger circuit board 300 by interference fit.
  • one of the elastic pressing portions 105 is disposed close to the horn-shaped guide head 103.
  • the cantilever section 104 has a preset length, so that it has an elastic force F for unidirectional compression/bidirectional clamping of the male connector 200 or bidirectional clamping of the golden finger circuit board 300.
  • FIG. 1 it is a schematic diagram of the elastic pressing portion 105 formed on the cantilever segment 104 clamping the golden finger circuit board 300 bidirectionally. Since the golden finger circuit board 300 is clamped in both directions by the elastic pressing part 105, the golden finger circuit board 300 and the single female terminal 101 are in contact with each other at a single point, and the golden finger circuit board 300 and the female terminal 101 can be better matched. .
  • the mating of the golden finger circuit board 300 and the female connector 100 is a straight male-angled female situation.
  • the gold finger circuit board 300 in this embodiment can use the prior art of straight male.
  • the bendable or flexible golden finger circuit board 300 is gradually used. Then it is feasible for the golden finger circuit board 300 to be prepared in a curved or flexed shape. Therefore, this embodiment does not exclude the case where the golden finger circuit board 300 and the female connector 100 are mated as a male-bend female.
  • the female terminal 101 unidirectionally clamps the male terminal 202 of the male connector 200.
  • the female terminal 101 and the male terminal 202 of the male connector 200 may be single-point contact mating. At this time, the mating of the male connector 200 and the female connector 100 is a straight male-elbow female situation.
  • the female terminal 101 and the male terminal 202 of the male connector 200 can also be two-point or multi-point contact mating, that is, two or more elastic pressing forces are formed on the cantilever section 104 of the female terminal 101 at this time.
  • Portion 105, and the male terminal 202 is also formed with two or more elastic mating portions. Two or more elastic mating parts are in contact with the elastic pressing part 105 to achieve two or more points of contact between the male terminal 202 and the female terminal 101.
  • the mating of the male connector 200 and the female connector 100 is a male-elbow female situation.
  • the PCB board 400 is provided with a signal layer (not shown) and a bore 401 penetrating the signal layer.
  • the signal layer is horizontally arranged in the PCB board 400
  • the drill hole 401 is vertically arranged in the PCB board 400.
  • the PCB board 400 may include multiple different functional layers, such as a signal layer, an intermediate board layer, an internal electrical layer, a silk screen layer, a solder paste layer, a mechanical layer, a shielding layer, a solder resist layer, a solder flux layer, etc.
  • the crimping pin 101b can be inserted in the bore 401 and connected to the signal layer.
  • the crimping needle 101b has a crimping ring 102, and the crimping ring 102 is provided with a fisheye hole.
  • the crimping ring 102 can undergo radial elastic contraction and deformation and press against the inner wall of the bore 401 to achieve an interference fit.
  • the crimp ring 102 is in contact with the signal layer, thereby realizing the signal connection between the female terminal 101 and the PCB board 400.
  • the female terminal 101 forms a limiting portion 101c on the outer wall close to the crimping pin 101b, and the limiting portion 101c is used to abut the surface of the PCB board 400 when the crimping pin 101b is inserted into the bore 401 (specifically as shown in the figure) 1 and the upper surface shown in Fig. 2) to limit the female terminal 101.
  • the limiting portion 101c can function as a stop and limit.
  • the female terminal 101 has a flat shape
  • the limiting portion 101c may be a plurality of protrusions formed by extending the outer wall of the female terminal 101 radially outward, and the plurality of protrusions are arranged at intervals in the circumferential direction, thereby the limiting portion 101c is not continuous in the circumferential direction.
  • the limiting portion 101c can also be a circumferential flange formed by extending the outer wall of the female terminal 101 radially outward, which is an integral structure and continuous in the circumferential direction.
  • the differential signal is transmitted from one end to the other end (connecting end 101a ⁇ crimping pin 101b, or crimping pin 101b ⁇ connecting end 101a).
  • the transmission of the differential signal depends on the contact part of the crimping pin 101b and the borehole 401, specifically the surface of the part where the differential signal contacts the borehole 401 via the crimping pin 101b Passed, and finally transmitted to the signal layer.
  • a high-frequency radiation area A is easily formed at the connection between the crimping pin 101b and the bore 401. Specifically, the area outside the signal layer at the connection between the crimping pin 101b and the bore 401 is in an exposed and suspended state. Therefore, due to the antenna effect, the surface of the crimping pin 101b and the borehole 401 located in the vicinity of the area will accumulate charges, and then a high-frequency radiation area A is formed in the vicinity of the connection between the crimping pin 101b and the borehole 401.
  • the absorbing material can be used to absorb the crosstalk signal, and the specific method is to use the absorbing material to fully wrap the connector.
  • adopting the method of fully enveloping the absorbing material will result in indiscriminate absorption of the signal, which is even more detrimental to the integrity of the differential signal.
  • the full package of the absorbing material will increase the overall weight of the connector, and will consume a large amount of absorbing material, and the cost of consumables and process implementation is relatively high.
  • the inventor of the present application has discovered after long-term field practice that the absorbing material B is specifically set in the area A where high frequency radiation is likely to occur due to the antenna effect, while other areas where high frequency radiation is not generated Without the absorbing material B, the above problems can be better solved.
  • the absorbing material B is arranged in the space covered by the high-frequency radiation area A.
  • the absorbing material B Since the absorbing material B is selectively or targetedly arranged in the space covered by the high-frequency radiation area A, it can absorb crosstalk signals on the one hand, and not transmit through the connection between the crimping needle 101b and the borehole 401.
  • the normal differential signal affects the normal differential signal, thereby ensuring the integrity of the differential signal.
  • the absorbing material B is only arranged in the space covered by the high-frequency radiation area A, and the amount is less.
  • this embodiment The female connector 100 is lighter in weight and lower in cost.
  • the spatial range covered by the high-frequency radiation area A is a virtual space, which can be centered on the connection between the crimping needle 101b and the borehole 401, and roughly expand outward in a three-dimensional space radially or Spherical.
  • this embodiment does not limit this.
  • the location of the absorbing material B only needs to be within the space covered by the high-frequency radiation area A, and its specific location, setting method, and material form can be relatively free and flexible.
  • the absorbing material B can support a wide frequency range from 1GHZ to 100GHZ, and the material form can be solid (for example, including but not limited to layer, sheet, film, block, plate, strip , Cylindrical), liquid, powder and plastic particles, etc.
  • the setting method can be adopted according to different material forms. It can be adapted to different occasions including but not limited to laminating, hot melting, electroplating, brushing, spraying, filling and injection molding, etc. . Therefore, the absorbing material B can be customized according to the signal frequency, resonant frequency, etc., to improve the scope of application of the technical solution of this embodiment.
  • the absorbing material B can be directly disposed on the crimping needle 101b.
  • the location of the absorbing material B may be the outer surface of the crimping needle 101b, and the material form may be a coating, a paste, or a film.
  • the material form of the absorbing material B as a coating or film layer can be realized by spraying or electroplating, and the material form of the layer can be the absorbing material B, which is prepared into a layer or sheet, and then pasted by glue. , Hot-melt fixing and other ways to achieve.
  • the size and thickness of the coating, paste or film layer can be set according to actual conditions, which is not limited in this embodiment.
  • the absorbing material B can also be directly disposed in the bore 401.
  • the location of the absorbing material B may be the inner wall surface of the drilled hole 401, and the material form is a coating, a laminate, or a film.
  • the absorbing material B when it is set in the borehole 401, it can not only be disposed on the inner wall surface of the borehole 401, but also can be disposed in the borehole 401.
  • the drill hole 401 may be a blind hole that only penetrates the upper surface of the PCB board 400 but does not penetrate the lower surface of the PCB board 400, and the absorbing material B is accommodated In the blind hole.
  • the shape of the absorbing material B can be in the form of liquid, powder or granules, and can also be in the form of blocks, strips, and the like.
  • the drill hole 401 is not limited to the above-mentioned blind hole structure.
  • the drill hole 401 may also be a through hole penetrating the upper surface and the lower surface of the PCB board 400.
  • the absorbing material B may be provided on the lower surface of the PCB board 400 in a solid form and block the bottom of the through hole.
  • the absorbing material B has an integral solid structure, such as a layered, sheet, plate, or block structure, and is arranged on the lower surface of the PCB board 400 by any suitable method, such as bonding and sealing. Plug the bottom of the through hole.
  • the crimping needle may not be provided on 101b, or the absorbing material B may be provided, which is not limited in the embodiment of the present application.
  • the absorbing material B can also be arranged on a plastic bracket (not shown) that wraps and fixes the female terminal 101. It is specifically arranged to be close to the crimping needle 101b and the bore 401 to be as close as possible to the high-frequency radiation source.
  • the material form can be a coating, a paste or a film, or it can be a solid form. As described above, when the material form is a coating, a paste or a film, the absorbing material B can be arranged on the surface of the plastic bracket.
  • the material form is a solid form, such as a tangible physical shape such as a block shape, a plate shape, a sheet shape, etc.
  • the absorbing material B can be fixed on the plastic bracket by any suitable method.
  • snap-fit connection including but not limited to snap-fit connection, mechanical fastener connection such as bolts, other fastening structures, welding, heat melting, snap-fitting, snap-fit connection, hook connection, etc., such as ultrasonic, solvent, laser, etc. Integrate fastening features and other methods.
  • the plastic bracket can be housed in the housing 500.
  • the absorbing material B may be provided on the housing 500. Specifically, it is set close to the crimping needle 101b and the drill hole 401, and the material form can be a coating, a paste or a film, or a solid form. For details, please refer to the above description, which will not be repeated here.
  • the embodiment shown in FIG. 3E is more effective when the drill hole 401 is a blind hole.
  • the reason is that since the borehole 401 is a blind hole and its lower end is blocked, the crosstalk signal generated at the connection between the crimping needle 101b and the borehole 401 cannot or is difficult to propagate downward in the blind hole. Propagate to the upper open end of the blind hole.
  • the absorbing material B can be disposed on the housing 500 close to the open end facing the blind hole. That is, in the embodiment shown in FIG. 3E, the absorbing material B may be provided on the lower surface of the housing 500 and face the upper open end of the borehole 401.
  • the projection (downward projection) of the absorbing material B toward the direction of the PCB board 400 preferably completely covers the upper open end of the borehole 401.
  • the crosstalk signal that escapes through the gap between the crimping needle 101b and the borehole 401 and the upper opening end of the borehole 401 can be absorbed by the absorbing material B, so that the crosstalk signal can be absorbed more specifically.
  • the absorption effect is better.
  • the installation position, installation method, and material form of the absorbing material B include but are not limited to the above-mentioned embodiments.
  • the absorbing material B when it is prepared in the form of liquid, powder, plastic particles, etc., it can also be configured by adopting a suitable implementation process according to actual needs, which is not limited in this embodiment.
  • plastic bracket, housing 500, etc. included in the female connector 100 of the embodiment of the present application can be any suitable existing structure.
  • the above-mentioned parts will not be repeated here, and the accompanying drawings in the specification have also been simplified accordingly.
  • the spatial scope of the embodiments of the present application is not limited by this.
  • the absorbing material can also be arranged in the PCB board 400 and close to the crimping pin 101b and the drilled hole. 401.
  • the PCB board 400 may be provided with a plurality of filling holes 402 located around the bore 401, and the wave absorbing material may be provided in the filling holes 402.
  • the filling hole 402 may be a blind hole or a through hole.
  • the absorbing material can be coated on the inner wall surface of the filling hole 402 in the form of a coating, a paste or a film, or it can be arranged in a solid state in the filling hole 402, or in a liquid, powder or granular form.
  • the filling hole 402 is filled in the form of a shape, which is not limited in this embodiment.
  • the number of filling holes 402 can be set according to actual requirements, and a plurality of filling holes 402 are preferably arranged in a circular array around the borehole 401, so that crosstalk signals can be uniformly absorbed.
  • the plurality of absorbing materials B are roughly enclosed to form a hollow cylindrical shape. That is, the absorbing material B distributed around the crimping needle 101b and the bore 401 is discontinuous in the circumferential direction.
  • the absorbing material B can be continuously arranged around the crimping needle 101b and the bore 401 in the circumferential direction.
  • the PCB board 400 may be provided with a filling ring groove 403 located around the bore 401, and the wave absorbing material is arranged in the filling ring groove 403.
  • the filling ring groove 403 may only penetrate the upper surface of the PCB board 400, or may penetrate the upper surface and the lower surface of the PCB board 400.
  • the absorbing material can be coated on the inner groove surface of the filling ring groove 403 in the form of coating, pasting or film layer, or it can be set in the filling ring groove 403 in a solid state, or in the form of liquid or powder. Or the granular form is filled in the filling ring groove 403, which is not limited in this embodiment.
  • the embodiment of the present application also provides a connector combination formed by mating the female connector 100 and the male connector 200 or the golden finger circuit board 300 described in the above embodiment. Since the principle of solving the problem and the technical effects that can be obtained by the connector combination are similar to those of the female connector 100, the implementation of the connector combination can refer to the implementation of the above-mentioned female connector 100, and the repetition will not be repeated.
  • FIG. 1 it is a schematic structural diagram of a connector assembly formed by mating a male connector 200 and a female connector 100 described in the foregoing embodiment.
  • the male connector 200 includes a male terminal 202 for mating with the female terminal 101, and the male terminal 202 has a male insertion end 203 that is inserted into the female terminal 101.
  • the female connector 100 is used to connect with a PCB board 400, and the PCB board 400 is provided with a signal layer and a bore 401 penetrating the signal layer.
  • a high-frequency radiation area A is formed near the connection between the crimping pin 101b and the borehole 401, and the space covered by the high-frequency radiation area A is provided with Absorbing material B.
  • FIG. 2 it is a schematic structural diagram of a connector assembly formed by mating the golden finger circuit board 300 and the female connector 100 described in the foregoing embodiment.
  • the golden finger circuit board 300 has a golden finger insertion end 301 inserted into the female terminal 101.
  • the female connector 100 is used to connect with the PCB 400 board, and the PCB board 400 is provided with a signal layer and a bore 401 penetrating the signal layer.
  • a high-frequency radiation area A is formed near the connection between the crimping pin 101b and the borehole 401, which is within the spatial range covered by the high-frequency radiation area A
  • a absorbing material B is provided.
  • the absorbing material B can be set in the area where high frequency radiation is generated, and the absorbing material B does not need to be set in the other areas where high frequency radiation is not generated.
  • the signal absorbed by the absorbing material B also has a certain selectivity. That is, only the crosstalk signal is absorbed without affecting the normal signal, so that the integrity of the differential signal can be better guaranteed.
  • the method of selectively or specifically setting the absorbing material B in the area of high-frequency radiation is used to replace the method of integrally covering the absorbing material B (plastic bracket and housing 500) in the prior art to overcome the signal.
  • Crosstalk target no additional shielding material is needed, not only the amount of absorbing material B is greatly reduced, the overall weight of the connector, consumables, and the cost of process implementation are greatly lower, but it is also conducive to increasing the density of differential pairs and meeting the high speed of the current technology development. And high-density application requirements.
  • the installation position, installation method, and material form of the absorbing material B include but are not limited to the above-mentioned embodiments.
  • the absorbing material B when it is prepared in the form of liquid, powder, plastic particles, etc., it can also be configured by adopting a suitable implementation process according to actual needs, which is not limited in this embodiment.

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Abstract

一种母头连接器（100）及连接器组合，母头连接器（100）用于与PCB板（400）连接，PCB板（400）内设有信号层以及贯穿信号层的钻孔（401）；所述母头连接器（100）包括：母头端子（101），具有两端，其中一端为用于与公头连接器（200）或金手指电路板（300）配接的连接端（101a），另一端形成用于插设在钻孔（401）中并与信号层连接的压接针（101b）；压接针（101b）与钻孔（401）的连接处附近在连接端（101a）与公头连接器（200）或金手指电路板（300）配接时形成高频辐射区（A），高频辐射区（A）所涵盖的空间范围内设有吸波材料（B）。通过选择性在连接器使用过程中易产生高频辐射的区域（A）设置吸波材料（B），在吸收串扰信号的同时，又保留了正常传输的电信号，并且连接器的整体重量较轻。

Description

母头连接器及连接器组合
交叉参考相关引用
本申请要求2019年10月28日递交的申请号为201921830714.X、发明名称为“母头连接器及连接器组合”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及一种连接器技术领域，尤其涉及一种母头连接器以及由该母头连接器与公头连接器或金手指电路板相配接形成的连接器组合。
背景技术
连接器被广泛应用于电子领域，随着大数据、5G技术以及人工智能应用的高速发展，连接器必须满足高速及高密的应用要求。这给连接器的信号完整性设计，尤其是如何解决高频/高密下的差分信号的串扰问题带来了挑战。
传统的解决方法通常包含两种：一是通过利用金属材料及塑胶材料电镀后对连接器的某一对差分信号或者某一列上的差分信号进行包裹屏蔽；二是通过利用改善接地的方法，例如通过导电塑胶或者金属将每对差分信号的地针连接。传统的设计方法由于使用过多的屏蔽材料和接地材料，使得连接器重量加大以及插拔力大等负面影响，同时传统方法对于进一步实现更高的差分密度非常困难。
除采用上述两种方法外，解决高频/高密下的差分信号串扰问题还可以采用吸波材料进行连接器包覆，或者吸波材料对导体/导体对进行包覆。利用吸波材料对电磁波的吸收作用，实现消除差分信号串扰的问题。但是传统的采用吸波材料包覆方式存在一个问题，即：吸波材料对电磁波的吸收是无选择性的，吸波材料整体包覆连接器在吸收差分信号的串扰电磁波的同时，也会吸收正常传输的电信号，从而更容易破坏连接器的信号完整性。
申请内容
本申请实施例提供了一种母头连接器以及由该母头连接器与公头连接器或金手指电路板相配接形成的连接器组合，本申请所提供的实施例通过在连接器使用过程中易产生 高频辐射的区域设置吸波材料，从而实现吸波材料吸收电磁波的选择性和针对性，既吸收差分信号的串扰信号，又保留正常传输的电信号，保证连接器信号的完整性，并且连接器的整体重量较轻。
为了实现上述目的，本申请提供了如下的技术方案。
一种母头连接器，用于与PCB板连接，PCB板内设有信号层以及贯穿信号层的钻孔；所述母头连接器包括：母头端子，具有两端，其中一端为用于与公头连接器或金手指电路板配接的连接端，另一端形成用于插设在所述钻孔中并与所述信号层连接的压接针；所述压接针与所述钻孔的连接处附近在所述连接端与公头连接器或金手指电路板配接时形成高频辐射区；吸波材料，设置在所述高频辐射区所涵盖的空间范围内。
一种连接器组合，包括：公头连接器和母头连接器；所述公头连接器包括公头端子；所述母头连接器用于与PCB板连接，PCB板内设有信号层以及贯穿信号层的钻孔；所述母头连接器包括：母头端子，具有两端，其中一端为用于与所述公头端子配接的连接端，另一端形成用于插设在所述钻孔中并与所述信号层连接的压接针；所述压接针与所述钻孔的连接处附近在所述连接端与所述公头端子配接时形成高频辐射区；吸波材料，设置在所述高频辐射区所涵盖的空间范围内。
一种连接器组合，包括：金手指电路板和母头连接器；所述金手指电路板具有金手指插入端头；所述母头连接器用于与PCB板连接，PCB板内设有信号层以及贯穿信号层的钻孔；所述母头连接器包括：PCB板，其内设有信号层以及贯穿所述信号层的钻孔；母头端子，具有两端，其中一端为用于与所述金手指插入端头配接的连接端，另一端形成用于插设在所述钻孔中并与所述信号层连接的压接针；所述压接针与所述钻孔的连接处附近在所述连接端与所述金手指插入端头配接时形成高频辐射区；吸波材料，设置在所述高频辐射区所涵盖的空间范围内。
本申请实施例创造性的发现并找到连接器在使用过程中容易因天线效应而在压接针与钻孔的连接处附近区域附近产生高频辐射，并经过实践后发现，仅在易产生高频辐射的区域设置吸波材料即可，其他没有产生高频辐射的区域不必设置吸波材料。通过选择性或针对性的设置吸波材料，则吸波材料所吸收的信号也具有一定的选择性。即仅吸收串扰信号，而不对正常信号产生影响，从而可较佳的保证差分信号的完整性。
并且，采用在高频辐射的区域内选择性或针对性的设置吸波材料的方式来替代现有技术中吸波材料整体包覆(塑胶支架和壳体)的方式来达成克服信号串扰目标，无需额外屏蔽材料，不仅吸波材料的用量大幅减少，连接器整体重量、耗材及工艺实施成本极 大的较低，而且利于提高差分对密度，满足当前技术发展对连接器的高速及高密的应用需求。
附图说明
图1为本申请的母头连接器与公头连接器配接形成非限制性实施例的连接器组合的结构示意图；
图2为本申请的母头连接器与金手指电路板配接形成非限制性实施例的连接器组合的结构示意图；
图3A为吸波材料与压接针或钻孔之间的第一实施例的装配结构示意图；
图3B为吸波材料与压接针或钻孔之间的第二实施例的装配结构示意图；
图3C为吸波材料与压接针或钻孔之间的第三实施例的装配结构示意图；
图3D为吸波材料与压接针或钻孔之间的第四实施例的装配结构示意图；
图3E为吸波材料与压接针或钻孔之间的第五实施例的装配结构示意图；
图3F为吸波材料与压接针或钻孔之间的第六实施例的装配结构示意图；
图3G和图3H为图3F的俯视图。
具体实施方式
为了使本技术领域的人员更好地理解本申请中的技术方案，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都应当属于本申请保护的范围。
需要说明的是，当元件被称为“设置于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的，并不表示是唯一的实施例。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。本文所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。此外，在本申请的描述中，除非另有说明， “多个”的含义是两个或两个以上。
如图1和图2所示，本申请实施例提供了一种母头连接器100，以及由该母头连接器100与公头连接器200或金手指电路板300相配接形成的连接器组合。
母头连接器100包括用于与供公头连接器200或金手指电路板300配接的母头端子101，母头端子101具有相对的两端，分别为用于与公头连接器200或金手指电路板300配接的连接端101a(如图1所示意的上端和图2所示意的右端)，以及与连接端101a背对用于与PCB板400电连接的压接针101b(如图1和图2所示意的下端)。
也就是说，母头连接器100的母头端子101具有的两端中，其中一端用于公头连接器200或金手指电路板300连接，另一端用于与PCB板400连接。
为使公头连接器200或金手指电路板300能顺利的实现与母头连接器100的配接，母头端子101的连接端101a可径向外扩形成呈喇叭状的引导头103，用以供公头连接器200或金手指电路板300与母头连接器100实现盲配。如此，操作人员手持公头连接器200或金手指电路板300，在喇叭状引导头103的导向作用下即可顺利完成与母头连接器100的配接操作。
此外，为保证公头连接器200或金手指电路板300与母头连接器100在完成配接后保持良好的电连接关系，母头端子101包括具有弹性的悬臂段104，悬臂段104在至少一个位置处弯折形成用于与公头连接器200或金手指电路板300过盈配合接触的弹性抵压部105。在本实施例中，其中一个弹性抵压部105靠近喇叭状引导头103设置。
悬臂段104具有预设长度，以使其具有单向压紧/双向夹紧公头连接器200或者双向夹紧金手指电路板300的弹力F。如图1所示，为形成在悬臂段104上的弹性抵压部105双向夹紧金手指电路板300的示意图。由于金手指电路板300被弹性抵压部105双向夹紧，因此金手指电路板300与单个母头端子101单点接触，即可实现金手指电路板300与母头端子101较佳的配接。
在该实施例中，悬臂段104上形成的弹性抵压部105可以仅为一个。则此时，金手指电路板300与母头连接器100的配接为直公-弯母的情形。
由于传统的金手指电路板300的弯曲性能不佳，因为本实施例中金手指电路板300可沿用直公的现有技术。但是，随着技术的发展，可弯曲或挠曲的金手指电路板300逐渐被使用。则金手指电路板300被制备呈弯曲或挠曲的形状是可行的。因此，本实施例并不排除金手指电路板300与母头连接器100的配接为弯公-弯母的情形。
在如图2所示意的实施例中，为母头端子101单向夹紧公头连接器200的公头端子 202的情形。其中，在能够保证母头端子101与公头连接器200的公头端子202接触良好的情况下，母头端子101与公头连接器200的公头端子202可以为单点接触配接。则此时，公头连接器200与母头连接器100的配接为直公-弯母的情形。
当然，母头端子101与公头连接器200的公头端子202也可以为两点或多点接触配接，即此时母头端子101的悬臂段104上形成两个或多个弹性抵压部105，而公头端子202上也形成有两个或多个弹性配合部。两个或多个弹性配合部和弹性抵压部105接触，实现公头端子202与母头端子101的两点或多点接触。则此时，公头连接器200与母头连接器100的配接为弯公-弯母的情形。
进一步地，PCB板400的内部设有信号层(未示出)以及贯穿信号层的钻孔401。其中，信号层水平设置在PCB板400中，钻孔401竖直设置在PCB板400中。实际上，PCB板400可包含有多个不同的功能层，例如信号层、中间板层、内电层、丝印层、锡膏层、机械层、遮蔽层、阻焊层、助焊层等。为清楚简要地说明本实施例的技术方案，在此将不再对上述部分进行赘述，说明书附图也进行了相应简化。但是应该理解，本申请实施方式在范围上并不因此而受到限制。
在本实施例中，压接针101b可插设在钻孔401中并与信号层连接。具体的，如图1至图3H所示，压接针101b具有压接环102，压接环102中设置有鱼眼孔。压接环102能发生径向弹性收缩变形并顶触钻孔401的内壁，实现过盈配合。具体为压接环102与信号层接触，进而实现母头端子101与PCB板400的信号连接。
进一步地，母头端子101在靠近压接针101b的外壁形成有限位部101c，限位部101c用于在压接针101b插入钻孔401中时顶抵PCB板400的表面(具体为如图1和图2所示意的上表面)，以对母头端子101进行限位。在本实施例中，限位部101c可以起到止挡和限位的作用。当母头端子101的压接针101b在插入钻孔401的过程中，当限位部101c顶触到PCB板400的上表面，则说明压接针101b插接到位。如此，可简单识别压接针101b与钻孔401是否已完成装配，并可保证压接针101b与钻孔401能较为准确地实现装配到位。
通常，母头端子101呈扁平状，限位部101c可以为母头端子101的外壁沿径向向外延伸形成的多个凸起，多个凸起沿周向间隔排布，从而限位部101c沿周向不连续。当然，限位部101c也可以为母头端子101的外壁沿径向向外延伸形成的周向凸缘，其为一个整体结构，并沿周向连续。
母头连接器100与公头连接器200或金手指电路板300配接后，差分信号由一端传 输到另一端(连接端101a→压接针101b，或者压接针101b→连接端101a)。在压接针101b与钻孔401的连接处的连接处，差分信号的传输依赖压接针101b与钻孔401接触的部分，具体为差分信号经由压接针101b与钻孔401接触部分的表面通过，并再最终传输至信号层。然而，本申请发明人经长期的研究发现，在高频操作状况下，压接针101b与钻孔401的连接处容易形成高频辐射区A。具体为，在压接针101b与钻孔401的连接处位于信号层外侧的区域处于暴露悬置状态。从而由于天线效应，位于该区域内附近的压接针101b与钻孔401的表面会聚集电荷，进而在压接针101b与钻孔401的连接处的附近区域形成高频辐射区A。
诚如上文所述，为解决差分信号的串扰问题，可采用吸波材料来对串扰信号进行吸收，具体方式为采用吸波材料对连接器进行全包裹。然而，采用吸波材料全包裹的方式，将导致对信号的无差别吸收，反而更不利于差分信号的完整性。并且，吸波材料全包裹会增大连接器的整体重量，并将消耗大量的吸波材料，耗材及工艺实施成本较高。
有鉴于此，本申请发明人在经过长期的现场实践后发现，针对性的在容易因天线效应而导致出现高频辐射的区域A内设置吸波材料B，而其他没有产生高频辐射的区域不设置吸波材料B，可较佳的解决上述问题。具体到本实施例中，高频辐射区A所涵盖的空间范围内设置有吸波材料B。
由于吸波材料B被选择性或针对性的设置在高频辐射区A所涵盖的空间范围内，因此其一方面可吸收串扰信号，而不对传输经过压接针101b与钻孔401的连接处的正常差分信号产生影响，从而保证差分信号的完整性。另一方面，吸波材料B仅被设置在高频辐射区A所涵盖的空间范围内，用量较少，从而相较于现有技术被吸波材料全包裹的连接器而言，本实施例的母头连接器100的重量较轻，成本较低。
在本实施例中，高频辐射区A所涵盖的空间范围为一个虚拟的空间，其可以以压接针101b与钻孔401的连接处为中心，大致向外扩展在三维空间内呈放射状或球状。实际中，高频辐射区A所涵盖的空间范围的大小或尺寸与诸多因素例如信号强度、母头端子101的材质、压接针101b与钻孔401的连接平滑性、信号频率、谐振频率等有关，本实施例对此不作限定。
因此，吸波材料B的设置位置只要满足位于高频辐射区A所涵盖的空间范围内即可，其具体设置位置、设置方式以及材料形态可相对自由和灵活。总体而言，吸波材料B可支持从1GHZ至100GHZ的宽频工作范围，材料形态可以为固态状(例如，包括但不限于层状、片材、膜状、块体状、板状、条状、筒状)、液态状、粉末及塑胶颗粒等类别， 设置方式可根据材料形式的不同而采用适应不同场合下包含但不限于贴合、热熔、电镀、刷涂、喷涂、填充及注塑等。因此，吸波材料B可根据信号频率、谐振频率等客制化，提高本实施例技术方案的适用范围。
例如，在一种可行的实施例中，吸波材料B可以直接设置在压接针101b上。具体的，如图3A所示，吸波材料B的设置位置可以为压接针101b的外表面，材料形态可以为涂层、贴层或膜层。其中，吸波材料B为涂层或膜层的材料形态可通过喷涂或电镀等工艺实现，为贴层的材料形态可以为吸波材料B被制备成层状或薄片状，再通过粘胶粘贴、热熔固定等方式来实现。涂层、贴层或膜层的尺寸和厚度可根据实际情况进行设定，本实施例对此不作限定。
或者，在母头连接器100与公头连接器200或金手指电路板300配接形成连接器组合的实施例中，吸波材料B也可以直接设置在钻孔401中。具体的，如图3B所示，在一种可行的实施例中，吸波材料B的设置位置可以为钻孔401的内壁面，材料形态为涂层、贴层或膜层。具体设置方式可参照上文描述，在此不作赘述。
当然，当吸波材料B以钻孔401为设置位置时，其不仅可以设置在钻孔401的内壁面上，还可以设置在钻孔401中。具体的，如图3C所示，在另一种可行的实施例中，钻孔401可以为仅贯穿PCB板400的上表面而未贯穿PCB板400下表面的盲孔，吸波材料B容置在盲孔中。在该实施例中，吸波材料B的形态可以以液态、粉末或颗粒状，也可以为块体状、条状等。
当然，钻孔401并不限于上述的盲孔结构。如图3D所示，在另一个实施例中，钻孔401还可以为贯穿PCB板400的上表面和下表面的通孔。则在该实施例中，吸波材料B可以以固态形式设置在PCB板400的下表面并封堵通孔的底部。具体的，吸波材料B呈一个整体式的固体结构，例如呈层状、片状、板状或块体状结构，并通过任何合适的方式例如粘接设置在PCB板400的下表面并封堵通孔的底部。
需要说明的是，在母头连接器100与公头连接器200或金手指电路板300配接形成连接器组合的实施例中，当钻孔401中设置有吸波材料B时，压接针101b上可以不设置吸波材料B，也可以设置有吸波材料B，本申请实施例对此不作限定。
此外，上文所述“上表面”和“下表面”为根据附图而进行的示意性说明，母头连接器100在实际使用过程中，“上表面”并不表示其一定位于“下表面”的上方。这里采用“上表面”和“下表面”的描述仅是为了说明方便，而不意图限定方位。实际上，可以将PCB板400靠近母头端子101的表面定义为“上表面”，将PCB板400背对母 头端子101的表面定义为“下表面”。
在另一种可行的实施例中，吸波材料B还可以设置在包裹固定母头端子101的塑胶支架(未示出)上。具体设置为靠近压接针101b和钻孔401，以尽可能靠近高频辐射源。材料形态可以为涂层、贴层或膜层，也可以为固体形态。同上文描述，当材料形态为涂层、贴层或膜层，吸波材料B可设置在塑胶支架的表面。而当材料形态为固体形态时，例如块体状、板状、片状等有形的物理形状，吸波材料B可通过任意合适的方式固定在塑胶支架上。例如，包括但不限于搭扣配合连接、诸如螺栓、其他紧固构造等的机械紧固件连接、诸如超声、溶剂、激光等方式的焊接、热熔、卡擎、卡扣连接、钩连接、集成紧固特征等方式设置。
进一步地，塑胶支架可被收纳在壳体500中。如图3E所示，则在再一种可行的实施例中，吸波材料B可设置在壳体500上。具体设置为靠近压接针101b和钻孔401，材料形态可以为涂层、贴层或膜层，也可以为固体形态。具体可参照上述描述，在此不作赘述。
实践证明，如图3E所示意的实施例应用在钻孔401为盲孔的情形中效果更佳。原因在于，由于钻孔401为盲孔，其下端封堵，则在压接针101b与钻孔401的连接处产生的串扰信号，在盲孔中无法或难以向下传播，而只能或优选向盲孔的上部开口端传播。有鉴于此，可以将吸波材料B设置在壳体500上并靠近面对盲孔的开口端。即在图3E所示意的实施例中，吸波材料B可以设置在壳体500的下表面，并正对钻孔401的上部开口端。并且，吸波材料B朝向PCB板400方向的投影(向下投影)优选将钻孔401的上部开口端完全覆盖住。这样，经压接针101b与钻孔401之间的缝隙及钻孔401的上部开口端逃逸出来的串扰信号，可恰好被吸波材料B所吸收，从而可吸收串扰信号的针对性更好，吸收效果更佳。
当然，上述实施例仅是几种可行的示意性方案，而并非是限制性的方案。也即是说，吸波材料B的设置位置、设置方式以及材料形态等包括但不限于上述实施例。在其他可行的实施例中，例如吸波材料B被制备成液态状、粉末及塑胶颗粒等形态时，亦可根据实际需求采用适合的实施工艺来实现其设置，本实施例对此不作限定。
需要说明的是，本申请实施例的母头连接器100所包含的塑胶支架、壳体500等可以选用任意合适的现有构造。为清楚简要地说明本实施例所提供的技术方案，在此将不再对上述部分进行赘述，说明书附图也进行了相应简化。但是应该理解，本申请实施方式在空间范围上并不因此而受到限制。
而在母头连接器100与公头连接器200或金手指电路板300配接形成连接器组合的实施例中，吸波材料还可以设置在PCB板400中并靠近压接针101b和钻孔401。具体的，如图3F和图3G所示，在一个实施例中，PCB板400上可设有位于在钻孔401周围的多个填充孔402，吸波材料可以设置在填充孔402中。在本实施例中，填充孔402可以为盲孔，也可以为通孔。同上文描述，吸波材料可以以涂层、贴层或膜层的形式涂覆在填充孔402的内壁面上，也可以为固态状设置在填充孔402中，还可以以液态、粉末或颗粒状的形式填充在填充孔402中，本实施例对此不作限定。此外，填充孔402的数量可以根据实际需求进行设定，多个填充孔402优选以环形阵列的形式排布在钻孔401的周围，从而可以均匀地吸收串扰信号。
上述多个吸波材料B沿周向均匀间隔排布在压接针101b和钻孔401周围的实施例，多个吸波材料B大致围合形成一个呈镂空的筒状。即分布在压接针101b和钻孔401周围的吸波材料B沿周向不连续。当然，吸波材料B可以呈周向连续的设置在压接针101b和钻孔401周围。具体的，如图3H所示，在另一个实施例中，PCB板400上可设有位于在钻孔401周围的填充环槽403，吸波材料设置在填充环槽403中。在本实施例中，该填充环槽403可以仅贯穿PCB板400的上表面，也可以贯穿PCB板400的上表面和下表面。同样的，吸波材料可以以涂层、贴层或膜层的形式涂覆在填充环槽403的内槽面上，也可以为固态状设置在填充环槽403中，还可以以液态、粉末或颗粒状的形式填充在填充环槽403中，本实施例对此不作限定。
基于同一构思，本申请实施例还提供了一种运用上述实施例所述的母头连接器100与公头连接器200或金手指电路板300配接形成的连接器组合。由于该连接器组合解决问题的原理，以及能够取得的技术效果与母头连接器100相似，因此该连接器组合的实施可以参见上述母头连接器100的实施，重复之处不再赘述。
需要明确的是，本申请实施例中所提供的连接器组合作为独立的实施例可以与上述母头连接器100的实施例相互参考引用，但不应当以上述母头连接器100所产生的效果为限制。
如图1所示，为由公头连接器200与上述实施例所述的母头连接器100相配接形成连接器组合的结构示意图。其中，公头连接器200包括用于与母头端子101相配接的公头端子202，公头端子202具有插入母头端子101的公头插入端头203。母头连接器100用于与PCB板400连接，PCB板400内设有信号层以及贯穿信号层的钻孔401。当母头端子101的连接端101a与公头端子202配接时，压接针101b与钻孔401的连接处附近 形成高频辐射区A，高频辐射区A所涵盖的空间范围内设置有吸波材料B。
如图2所示，为由金手指电路板300与上述实施例所述的母头连接器100相配接形成的连接器组合的结构示意图。其中，金手指电路板300具有插入母头端子101的金手指插入端头301。母头连接器100用于与PCB400板连接，PCB板400内设有信号层以及贯穿信号层的钻孔401。当母头端子101的连接端101a与金手指插入端头301配接时，压接针101b与钻孔401的连接处附近形成高频辐射区A，高频辐射区A所涵盖的空间范围内设置有吸波材料B。
本申请实施例创造性的发现并找到连接器在使用过程中容易因天线效应而在压接针101b与钻孔401的连接处附近区域附近产生高频辐射，并经过实践后发现，仅在该易产生高频辐射的区域设置吸波材料B即可，其他没有产生高频辐射的区域不必设置吸波材料B。通过选择性或针对性的设置吸波材料B，则吸波材料B所吸收的信号也具有一定的选择性。即仅吸收串扰信号，而不对正常信号产生影响，从而可较佳的保证差分信号的完整性。
并且，采用在高频辐射的区域内选择性或针对性的设置吸波材料B的方式来替代现有技术中吸波材料B整体包覆(塑胶支架和壳体500)的方式来达成克服信号串扰目标，无需额外屏蔽材料，不仅吸波材料B的用量大幅减少，连接器整体重量、耗材及工艺实施成本极大的较低，而且利于提高差分对密度，满足当前技术发展对连接器的高速及高密的应用需求。
当然，上述实施例仅是几种可行的示意性方案，而并非是限制性的方案。也即是说，吸波材料B的设置位置、设置方式以及材料形态等包括但不限于上述实施例。在其他可行的实施例中，例如吸波材料B被制备成液态状、粉末及塑胶颗粒等形态时，亦可根据实际需求采用适合的实施工艺来实现其设置，本实施例对此不作限定。
以上所述仅为本申请的几个实施例，本领域的技术人员依据申请文件公开的内容，可以对本申请实施例进行各种改动或变型而不脱离本申请的精神和范围。

Claims (13)

  1. 一种母头连接器，用于与PCB板连接，所述PCB板内设有信号层以及贯穿所述信号层的钻孔；其特征在于，所述母头连接器包括：
    母头端子，具有两端，其中一端为用于与公头连接器或金手指电路板配接的连接端，另一端形成用于插设在钻孔中并与所述信号层连接的压接针；所述压接针与钻孔的连接处附近在所述连接端与公头连接器或金手指电路板配接时形成高频辐射区；
    吸波材料，设置在所述高频辐射区所涵盖的空间范围内。
  2. 如权利要求1所述的母头连接器，其特征在于，所述吸波材料设置在所述压接针的外表面。
  3. 如权利要求1所述的母头连接器，其特征在于，所述母头端子在靠近所述压接针的外壁形成有限位部，所述限位部用于在所述压接针插入所述钻孔中时顶抵所述PCB板的表面以对所述母头端子进行限位。
  4. 如权利要求1所述的母头连接器，其特征在于，所述母头端子被塑胶支架部分包裹固定，所述塑胶支架收纳在壳体中；所述吸波材料设置在所述塑胶支架上和/或所述壳体上并靠近所述压接针。
  5. 一种连接器组合，其特征在于，包括：公头连接器和母头连接器；
    所述公头连接器包括公头端子；
    所述母头连接器用于与PCB板连接，所述PCB板内设有信号层以及贯穿所述信号层的钻孔；所述母头连接器包括：
    母头端子，具有两端，其中一端为用于与所述公头端子配接的连接端，另一端形成用于插设在所述钻孔中并与所述信号层连接的压接针；所述压接针与所述钻孔的连接处附近在所述连接端与所述公头端子配接时形成高频辐射区；
    吸波材料，设置在所述高频辐射区所涵盖的空间范围内。
  6. 一种连接器组合，其特征在于，包括：金手指电路板和母头连接器；
    所述金手指电路板具有金手指插入端头；
    所述母头连接器用于与PCB板连接，所述PCB板内设有信号层以及贯穿所述信号层的钻孔；所述母头连接器包括：
    PCB板，其内设有信号层以及贯穿所述信号层的钻孔；
    母头端子，具有两端，其中一端为用于与所述金手指插入端头配接的连接端，另一 端形成用于插设在所述钻孔中并与所述信号层连接的压接针；所述压接针与所述钻孔的连接处附近在所述连接端与所述金手指插入端头配接时形成高频辐射区；
    吸波材料，设置在所述高频辐射区所涵盖的空间范围内。
  7. 如权利要求5或6所述的连接器组合，其特征在于，所述吸波材料设置在所述钻孔中。
  8. 如权利要求7所述的连接器组合，其特征在于，所述吸波材料设置在所述钻孔的内壁面上。
  9. 如权利要求7所述的连接器组合，其特征在于，所述钻孔为仅贯穿所述PCB板的上表面而未贯穿所述PCB板下表面的盲孔；所述吸波材料容置在所述盲孔中。
  10. 如权利要求7所述的连接器组合，其特征在于，所述钻孔为仅贯穿所述PCB板的上表面而未贯穿所述PCB板下表面的盲孔；所述母头端子固定在一壳体上，所述吸波材料设置在所述壳体上并靠近面对所述盲孔的开口端。
  11. 如权利要求5或6所述的连接器组合，其特征在于，所述钻孔为贯穿所述PCB板的上表面和下表面的通孔；所述吸波材料设置在所述PCB板的下表面并封堵所述通孔的底部。
  12. 如权利要求5或6所述的连接器组合，其特征在于，所述PCB板上设有位于在所述钻孔周围的多个填充孔，所述吸波材料设置在所述填充孔中。
  13. 如权利要求5或6所述的连接器组合，其特征在于，所述PCB板上设有位于在所述钻孔周围的填充环槽，所述吸波材料设置在所述填充环槽中。
PCT/CN2020/134257 2019-10-28 2020-12-07 母头连接器及连接器组合 WO2021083391A1 (zh)

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Families Citing this family (2)

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Publication number Priority date Publication date Assignee Title
CN210692927U (zh) * 2019-10-28 2020-06-05 天津莱尔德电子材料有限公司 母头连接器及连接器组合
CN116709638A (zh) * 2023-08-03 2023-09-05 合肥国家实验室 用于超导量子计算机系统的排线

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008545250A (ja) * 2005-06-30 2008-12-11 アムフェノール・コーポレーション 相互接続組立体用の電気コネクタ
CN103579830A (zh) * 2012-07-18 2014-02-12 联发科技股份有限公司 接口模块及其降低噪声的方法
CN105392271A (zh) * 2014-08-20 2016-03-09 英特尔公司 在互连件中的吸收终止
CN107017526A (zh) * 2016-01-12 2017-08-04 泰连公司 具有谐振控制的电连接器
CN107069264A (zh) * 2016-01-15 2017-08-18 泰连公司 具有有着谐振控制的电路板的互连系统
CN208862209U (zh) * 2018-09-26 2019-05-14 安费诺东亚电子科技(深圳)有限公司 一种连接器及其应用的pcb板
CN210535884U (zh) * 2019-10-28 2020-05-15 天津莱尔德电子材料有限公司 母头连接器及连接器组合
CN210692927U (zh) * 2019-10-28 2020-06-05 天津莱尔德电子材料有限公司 母头连接器及连接器组合

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008545250A (ja) * 2005-06-30 2008-12-11 アムフェノール・コーポレーション 相互接続組立体用の電気コネクタ
CN103579830A (zh) * 2012-07-18 2014-02-12 联发科技股份有限公司 接口模块及其降低噪声的方法
CN105392271A (zh) * 2014-08-20 2016-03-09 英特尔公司 在互连件中的吸收终止
CN107017526A (zh) * 2016-01-12 2017-08-04 泰连公司 具有谐振控制的电连接器
CN107069264A (zh) * 2016-01-15 2017-08-18 泰连公司 具有有着谐振控制的电路板的互连系统
CN208862209U (zh) * 2018-09-26 2019-05-14 安费诺东亚电子科技(深圳)有限公司 一种连接器及其应用的pcb板
CN210535884U (zh) * 2019-10-28 2020-05-15 天津莱尔德电子材料有限公司 母头连接器及连接器组合
CN210692927U (zh) * 2019-10-28 2020-06-05 天津莱尔德电子材料有限公司 母头连接器及连接器组合

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