WO2021104004A1 - 屏蔽装置和电子设备 - Google Patents

屏蔽装置和电子设备 Download PDF

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Publication number
WO2021104004A1
WO2021104004A1 PCT/CN2020/127735 CN2020127735W WO2021104004A1 WO 2021104004 A1 WO2021104004 A1 WO 2021104004A1 CN 2020127735 W CN2020127735 W CN 2020127735W WO 2021104004 A1 WO2021104004 A1 WO 2021104004A1
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WO
WIPO (PCT)
Prior art keywords
lens barrel
conductive layer
conductive
substrate
shielding device
Prior art date
Application number
PCT/CN2020/127735
Other languages
English (en)
French (fr)
Inventor
孔博
刘辰钧
王天鹏
狄伟
周俭军
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP20892950.5A priority Critical patent/EP4044783A4/en
Publication of WO2021104004A1 publication Critical patent/WO2021104004A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0058—Casings specially adapted for optoelectronic applications

Definitions

  • This application relates to the field of electronic equipment, and more specifically, to a shielding device and electronic equipment.
  • the present application provides a shielding device and electronic equipment.
  • the shielding device covers the outer surface of the camera module with a conductive layer and fills the conductive structure in the support, and realizes the mirror through the connection between the conductive layer, the conductive structure and the substrate.
  • the electrical connection of the tube, the support and the substrate forms a relatively complete Faraday cage to achieve the shielding effect of shielding electromagnetic signals.
  • the size of the shielding device can be effectively reduced without affecting the appearance of the original structure.
  • the shielding device of the present application can be assembled in blocks. First, it can shorten the processing cycle due to the final step of forming the shielding cover. The second is to reduce the additional processing errors caused by the final process of forming the shielding cover, so as to increase the product qualification rate of the camera module.
  • a shielding device in a first aspect, includes a lens assembly, a support, and a substrate,
  • the lens assembly includes a lens barrel and a lens optical assembly.
  • the lens barrel has a cylindrical structure.
  • the lens barrel includes an optical channel penetrating the lens barrel and forms two ends with openings.
  • the lens barrel has an open end to allow light to enter the light channel through the lens optical assembly, the material of the lens barrel is a material that does not have conductive properties, and the outer surface of the lens barrel is covered with a first conductive layer;
  • the supporting member is arranged between the lens barrel and the substrate, and the material of the supporting member is a material that does not have conductive properties, and the supporting member is filled with at least one first conductive structure.
  • the first end of the structure is connected to the first conductive layer, and the second end of the first conductive structure is connected to the exposed metal of the substrate.
  • the outer surface of the lens barrel is covered with the first conductive layer and the support is filled with the first conductive structure, so that the lens barrel and the support themselves have a shielding function, and, through the first conductive
  • the structure realizes the connection between the lens barrel, the support and the substrate, so as to realize the electrical connection between the lens barrel, the support and the substrate through the electrical connection between the first conductive layer, the first conductive structure and the substrate, and realize the shielding device
  • the grounding of the camera module forms a complete Rafaday cage on the camera module, and the camera module is assembled into a new shielding device for shielding electromagnetic signals to achieve a better shielding effect.
  • the lens barrel of the shielding device of the present application is covered with the first conductive layer and the support is filled with the first conductive structure, and there is no need to provide a larger shielding cover that can accommodate the camera module outside the entire camera module. , Can effectively reduce the size of the shielding device without affecting the appearance of the original structure.
  • the shielding device of the present application can be assembled in blocks, and the outer surface of the lens barrel of the camera module is covered with a first conductive layer, Fill the support with the first conductive structure, and connect the first conductive structure and the first conductive layer to assemble and form a shielding device including a camera module and a complete shielding structure.
  • the increased processing cycle, second can reduce the additional processing errors caused by the final process of forming the shielding cover, so as to increase the product qualification rate of the camera module.
  • the supporting member is provided with at least one first through hole penetrating the supporting member, and the first through hole is filled with the first conductive structure.
  • the first through hole is an opening hole provided at the edge of the support member.
  • edge holes on the edge of the support By opening holes on the edge of the support, different sizes of edge holes can be opened according to requirements to fill the conductive structure; and when there are other interfering objects in the middle, it can be avoided; at the same time, without affecting the strength or rigidity of the support , Can increase the contact area between the conductive structure and the support; in addition, it can also reduce the construction difficulty of the conductive structure.
  • a first through hole penetrating the support member is provided inside the support member, and each end of the first conductive structure is formed by a plurality of convex structures.
  • each end of the first conductive structure is set as an end formed by a plurality of protruding structures, which can simplify the processing of the conductive structure and facilitate production.
  • the shielding device further includes a plastic package provided between the support and the substrate, and the first conductive structure penetrates the plastic package.
  • the first end of the first conductive structure is connected to the first conductive layer through conductive glue.
  • the second end of the first conductive structure is connected to a ground pad of the substrate.
  • the first conductive structure is: a structure formed of conductive glue, or a metal elastic sheet.
  • a shielding device in a second aspect, includes a lens assembly, a support, a plastic package, and a substrate,
  • the lens assembly includes a lens barrel and a lens optical assembly.
  • the lens barrel has a cylindrical structure.
  • the lens barrel includes an optical channel penetrating the lens barrel and forms two ends with openings.
  • the lens barrel has one end of an opening to allow light to enter the light channel through the lens optical assembly, the lens barrel is made of a material that does not have conductive properties, and the outer surface of the lens barrel is covered with a first conductive layer;
  • the support is arranged between the lens barrel and the plastic package, and the material of the support is a material that does not have conductive properties, and the outer surface of the support is covered with a third conductive layer.
  • a conductive layer is connected to the third conductive layer;
  • the plastic package is disposed between the support and the substrate, and at least one second conductive structure penetrating through the plastic package is plastic packaged in the plastic package.
  • the first end of the second conductive structure is connected to the substrate.
  • the third conductive layer is connected, and the second end of the second conductive structure is connected to the exposed metal of the substrate.
  • the outer surfaces of the lens barrel and the support are covered with conductive layers (the first conductive layer and the third conductive layer), and the plastic package is filled with the second conductive structure, so that the lens barrel and the support
  • the plastic package itself has a shielding function, and the connection between the lens barrel, the support, the plastic package and the substrate is realized through the second conductive structure, and the connection between the first conductive layer, the third conductive layer and the first conductive structure is realized.
  • the electrical connection between the lens barrel, the support, the plastic package and the substrate realizes the grounding of the shielding device, forming a complete Faraday cage on the camera module, and assembling the camera module into a new shielding device for shielding electromagnetic signals. Achieve better shielding effect.
  • the lens barrel of the shielding device of the present application is covered with the first conductive layer, the support is covered with the second conductive layer, and the plastic package is filled with the second conductive structure, and it is not necessary to provide a relatively large area outside the entire camera module.
  • the large shielding cover that can accommodate the camera module can effectively reduce the size of the shielding device without affecting the appearance of the original structure.
  • the shielding device of the present application can be assembled in blocks, and the first conductive layer is covered on the lens barrel of the camera module, and the supporting member Cover the second conductive layer, fill the second conductive structure in the plastic package, connect the second conductive structure, the first conductive layer and the second conductive layer to assemble a shielding device including a camera module and a complete shielding structure,
  • First it can shorten the processing cycle due to the process of finally forming the shielding cover.
  • Second, it can reduce the additional processing errors caused by the process of forming the shielding cover to increase the product qualification rate of the camera module.
  • the third is this application.
  • the shielding device has no effect on the assembly sequence of the modules, does not increase the size, and does not affect the appearance of the original structure.
  • the first end of the second conductive structure is connected to the third conductive layer through conductive glue.
  • the second end of the second conductive structure is connected to a ground pad of the substrate.
  • the second conductive structure is any one of the following: a structure formed of conductive glue, or, a metal elastic sheet, or, a grounding gold wire provided on a grounding pad of the substrate.
  • a shielding device in a third aspect, includes a lens assembly, a support, a plastic package, and a substrate,
  • the lens assembly includes a lens barrel and a lens optical assembly.
  • the lens barrel has a cylindrical structure.
  • the lens barrel includes an optical channel penetrating the lens barrel and forms two ends with openings.
  • the lens barrel has a first end that is open to allow light to enter the light channel through the lens optical assembly, and the peripheral edge of the second end of the lens barrel that has an opening forms a convex shape in a direction approaching the plastic package.
  • a convex edge to form a recessed area surrounded by the convex edge in the middle area of the second end of the lens barrel, the material of the lens barrel is a material with no conductive properties, and the outer surface of the lens barrel Covered with a first conductive layer;
  • the support member is accommodated in the recessed area to enclose the support member by the protruding edge;
  • the plastic package is arranged between the lens barrel and the substrate, and at least one second conductive structure penetrating through the plastic package is plastic packaged in the plastic package.
  • the first conductive layer is connected, and the second end of the second conductive structure is connected to the exposed metal of the substrate.
  • the lens barrel encloses and fixes the support, the lens barrel is covered with a first conductive layer and the plastic package is filled with a second conductive structure, so that the lens barrel and the plastic package themselves have a shielding function.
  • the connection between the lens barrel, the plastic package and the substrate is realized through the second conductive structure, and the electrical connection between the lens barrel, the support, the plastic package and the substrate is realized through the first conductive layer and the second conductive structure.
  • the grounding of the shielding device forms a complete Faraday cage on the camera module, and the camera module is assembled into a new shielding device for shielding electromagnetic signals to achieve a better shielding effect.
  • the lens barrel of the shielding device of the present application is covered with a first conductive layer and the plastic package is filled with a second conductive structure, which eliminates the need to provide a larger shielding cover that can accommodate the camera module outside the entire camera module. , Can effectively reduce the size of the shielding device without affecting the appearance of the original structure.
  • the shielding device of the present application can be assembled in blocks, and the outer surface of the lens barrel of the camera module is covered with the first conductive layer, The second conductive structure is filled in the plastic package, and the first conductive layer and the second conductive structure are connected to assemble a shielding device including a camera module and a complete shielding structure.
  • the process of forming the shielding cover can be shortened.
  • the increased processing cycle, second can reduce the additional processing errors caused by the final process of forming the shielding cover, so as to increase the product qualification rate of the camera module.
  • the first end of the second conductive structure is connected to the first conductive layer through conductive glue.
  • the second end of the second conductive structure is connected to a ground pad of the substrate.
  • the second conductive structure is any one of the following: a structure formed of conductive glue, or, a metal elastic sheet, or, a grounding gold wire provided on a grounding pad of the substrate.
  • a shielding device in a fourth aspect, includes a lens assembly, a support, and a substrate,
  • the lens assembly includes a lens barrel and a lens optical assembly.
  • the lens barrel has a cylindrical structure.
  • the lens barrel includes an optical channel penetrating the lens barrel and forms two ends with openings.
  • the lens barrel has an open end to allow light to enter the light channel through the lens optical assembly, and the material of the lens barrel is a composite material with conductive properties,
  • the supporting member is arranged between the lens barrel and the substrate, the material of the supporting member is a composite material with conductive properties, the supporting member is connected to the lens barrel, the supporting member and the substrate Exposed metal connection.
  • the lens barrel and the support can be made of conductive composite materials, and the lens barrel, the support and the substrate can be connected, and the electrical connection between the lens barrel, the support and the substrate can be realized.
  • the grounding of the shielding device forms a complete Faraday cage on the camera module, and the camera module is assembled into a new shielding device for shielding electromagnetic signals to achieve a better shielding effect.
  • the lens barrel and the supporting member of the shielding device of the present application are made of composite materials with conductive materials, and there is no need to provide a larger shielding cover that can accommodate the camera module outside the entire camera module, which can effectively reduce the shielding.
  • the size of the device does not affect the appearance of the original structure.
  • the shielding device of the present application can be assembled in blocks. First, it can shorten the processing cycle due to the final step of forming the shielding cover. The second is to reduce the additional processing errors caused by the final process of forming the shielding cover, so as to increase the product qualification rate of the camera module.
  • the shielding device further includes a plastic package provided between the support and the substrate, and at least one second conductive structure penetrating the plastic package is plastic packaged in the plastic package.
  • the first end of the conductive structure is connected to the support, and the second end of the second conductive structure is connected to the exposed metal of the substrate.
  • the first end of the second conductive structure is connected to the first conductive layer through conductive glue.
  • the second end of the second conductive structure is connected to a ground pad of the substrate.
  • the conductive material in the composite material may be any one of stainless steel fibers, nickel fibers, carbon fibers, and carbon nanotubes.
  • a shielding device in a fifth aspect, characterized in that the shielding device includes a lens assembly, a support, and a substrate,
  • the lens assembly includes a lens barrel and a lens optical assembly.
  • the lens barrel has a cylindrical structure.
  • the lens barrel includes an optical channel penetrating the lens barrel and forms two ends with openings.
  • the lens barrel has one end of an opening to allow light to enter the light channel through the lens optical assembly, the lens barrel is made of a material that does not have conductive properties, and the outer surface of the lens barrel is covered with a first conductive layer;
  • the supporting member is arranged between the lens barrel and the substrate, the material of the supporting member is a material that does not have conductive properties, and the outer surface of the supporting member is covered with a third conductive layer, and the third conductive layer is covered on the outer surface of the supporting member.
  • One end of the conductive layer is connected to the first conductive layer, and the other end of the third conductive layer is connected to the exposed metal of the substrate.
  • the outer surface of the lens barrel is covered with the first conductive layer
  • the outer surface of the support is covered with the third conductive layer
  • both ends of the third conductive layer are connected to the first conductive layer and the substrate respectively.
  • the exposed metal connection is used to realize the electrical connection between the lens barrel, the support and the substrate, to form a relatively complete Faraday cage on the camera module, and to assemble the camera module into a new shielding device for shielding electromagnetic signals.
  • the lens barrel of the shielding device of the present application is covered with a first conductive layer and the support member is covered with a third conductive layer, and there is no need to provide a larger shielding cover that can accommodate the camera module outside the entire camera module. , Can effectively reduce the size of the shielding device without affecting the appearance of the original structure.
  • the shielding device of the present application can be assembled in blocks, and the outer surface of the lens barrel of the camera module is covered with the first conductive layer, Cover the outer surface of the support with a third conductive layer, and connect the first conductive layer and the second conductive structure to assemble a shielding device including a camera module and a complete shielding structure.
  • the increase in the processing cycle of the process, the second is to reduce the additional processing error caused by the final process of forming the shielding cover, so as to increase the product pass rate of the camera module.
  • a shielding device in a sixth aspect, includes: a lens assembly and a substrate,
  • the lens assembly is disposed on one side of the substrate and includes a lens barrel and a lens optical assembly, the lens barrel is connected to the substrate, the lens barrel has a cylindrical structure, and the lens barrel includes a lens barrel penetrating through the lens barrel.
  • the lens optical assembly is arranged at the end of the lens barrel with the opening to allow light to enter the optical channel through the lens optical assembly, and the lens barrel is made of material without
  • the outer surface of the lens barrel is covered with a first conductive layer.
  • the outer surface of the lens barrel includes the side surface of the lens barrel in the circumferential direction and the top perpendicular to the first direction and away from the substrate. Surface, the circumferential direction of the lens barrel surrounds the first direction, and the first direction is perpendicular to the substrate;
  • the outer surface of the substrate is covered with a second conductive layer, the second conductive layer is connected to the first conductive layer, and the outer surface of the substrate includes lateral sides of the substrate in the circumferential direction and perpendicular to the first conductive layer.
  • One direction and away from the bottom surface of the lens barrel assembly, the bottom surface of the substrate is exposed with metal, and the circumferential direction of the substrate surrounds the first direction.
  • the camera module of the shielding device includes two connected parts, the first part includes the lens barrel, the second part includes at least the substrate, the outer surface of the first part is covered with the first conductive layer, and the second part The outer surface of the camera is covered with a second conductive layer, and the first conductive layer and the second conductive layer are connected to form a shielding structure wrapped around the camera module, which can make the shielding structure formed by the first conductive layer and the second conductive layer It is electrically connected with the substrate to realize the grounding of the shielding device, and a complete Faraday cage is formed outside the camera module to realize the shielding effect of shielding electromagnetic signals.
  • the first conductive layer is connected to the second conductive layer and connected to the metal of the substrate, and the second wire layer covers the outer surface of the substrate, which can expand the metal of the in-line structure of the substrate into a metal structure of a U-shaped structure. Enlarge the metal area of the substrate, increase the heat dissipation area, and improve the heat dissipation effect of the entire shielding device.
  • the conductive materials of the two can be directly combined without other conductive connection measures, the conductive performance is excellent, and the contact resistance is low.
  • the first end of the second conductive layer close to the first conductive layer is set in a stepped structure, and the first end of the first conductive layer close to the second conductive layer is set to In a structure matched with the stepped structure, the first end of the first conductive layer is connected to the first end of the second conductive layer.
  • This structure connecting the first conductive layer and the second conductive layer through a stepped structure can increase the contact area between the first conductive layer and the second conductive layer, improve the bonding force of the two, and make the connection more reliable.
  • the first end of the second conductive layer is configured as a stepped structure having an L-shaped cross-section, and the first end of the first conductive layer is connected to and accommodated in the second conductive layer The first end.
  • At least one groove is provided on the bottom surface of the substrate, and the second conductive layer extends to the groove to fill the groove.
  • the shielding device further includes a support provided between the substrate and the lens barrel, the second conductive layer also covers a side surface of the support in the circumferential direction, and the support The circumferential direction of the piece surrounds the first direction.
  • the shielding device further includes a plastic package provided between the substrate and the lens barrel, the second conductive layer also covers a side surface of the plastic package in the circumferential direction, and the plastic package The circumferential direction of the piece surrounds the first direction.
  • an electronic device in a seventh aspect, includes an antenna and a shielding device in any possible implementation manner of any one of the foregoing aspects.
  • Fig. 1 is a schematic structural diagram of an electronic device provided by the present application.
  • Fig. 2 is a schematic structural diagram of the shielding device provided by the present application.
  • Fig. 3 is a schematic principle diagram of the shielding device provided by the present application.
  • Fig. 4 is another schematic structural diagram of the shielding device provided by the present application.
  • Fig. 5 is another schematic structural diagram of the shielding device provided by the present application.
  • Fig. 6 is another schematic structural diagram of the shielding device provided by the present application.
  • Fig. 7 is another schematic structural diagram of the shielding device of the present application.
  • Fig. 8 is another schematic structural diagram of the shielding device of the present application.
  • Fig. 9 is another schematic structural diagram of the shielding device of the present application.
  • Fig. 10 is another schematic structural diagram of the shielding device of the present application.
  • Fig. 11 is another schematic structural diagram of the shielding device of the present application.
  • Fig. 12 is another schematic structural diagram of the shielding device of the present application.
  • Fig. 13 is another schematic structural diagram of the shielding device of the present application.
  • Fig. 14 is another schematic structural diagram of the shielding device of the present application.
  • Fig. 15 is another schematic structural diagram of the shielding device of the present application.
  • Fig. 16 is another schematic structural diagram of the shielding device of the present application.
  • Lens optical component 211 lens barrel 212, light channel 2121, support 220, filter 230, substrate 240, plastic package 250;
  • connection means connection
  • fixed connection means connection
  • contact means connection
  • connection it can be fixed connection, rotating connection, flexible connection, mobile connection, integral molding, electrical connection, etc.; it can be directly connected, or, can be indirectly connected through an intermediate medium, or , It can be the internal communication between two elements or the interaction between two elements.
  • connection generally refers to a mechanical connection, and if it is necessary to indicate an electrical connection, it will be specifically pointed out.
  • fixed connection one element can be directly or indirectly fixedly connected to another element; fixed connection can include mechanical connection, welding, and bonding, among which mechanical connection can include riveting, bolting, Thread connection, key-pin connection, snap connection, lock connection, plug-in connection, etc.
  • the bonding can include adhesive bonding and solvent bonding.
  • contact can mean that one element is in direct or indirect contact with another element.
  • contact between two elements described in the embodiments of this application can be understood as being within the allowable range of installation error In the internal contact, there may be a small gap due to installation errors.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
  • the features defined with “first” and “second” may explicitly or implicitly include one or more of these features.
  • the x, y, and z directions are perpendicular to each other.
  • the x direction can be understood as the length direction of the shielding device
  • the y direction can be understood as the width direction of the shielding device
  • the z direction can be understood as the height direction of the shielding device
  • the height direction of the shielding device is the shielding
  • the direction in which the various components in the device are stacked that is, the various components of the shielding device are stacked along the z-direction.
  • the shielding device of the present application can be a shielding device with a camera module.
  • the shielding device can be installed in various electronic devices, which can be mobile phones, smart phones, tablet computers, laptop computers, and laptop computers. (laptop computer), video camera, video recorder, camera, smart watch, smart wristband or other forms of equipment.
  • the embodiments of the present application do not impose special restrictions on the specific form of the above-mentioned electronic device. For the convenience of description and understanding, the following description takes the electronic device 100 as a mobile phone as an example.
  • FIG. 1 shows a schematic structural diagram of an electronic device.
  • the electronic device 100 may include a display panel (DP) 101, a housing 102, a shielding device 103, an antenna (not shown in the figure), and the like.
  • the housing 102 is formed with an accommodating space, and the display screen 101 and the shielding device 103 are disposed in the accommodating space of the housing 102.
  • the display screen 101 may be a liquid crystal display (LCD) screen, an organic light emitting diode (OLED) display screen, etc., where the OLED display screen may be a flexible display screen or a hard display screen.
  • LCD liquid crystal display
  • OLED organic light emitting diode
  • the shielding device 103 with a camera module can be only arranged on the front of the electronic device 100 for shooting scenes on the front side of the electronic device 100.
  • the camera module can be called a front camera; It is only set on the back of the electronic device 100 for shooting scenes on the back side of the electronic device 100.
  • the camera module can also be called a rear camera; it can also be set on the front and the back of the electronic device 100.
  • the front side of the electronic device 100 is provided with a shielding device 103, and the back side of the electronic device 100 is also provided with a shielding device 103, which can either capture the scene on the front side of the electronic device 100 or The scene on the back side of the electronic device 100 only needs to use the corresponding shielding device when shooting.
  • the installation position of the shielding device 103 is only illustrative, and the screen device 103 can be installed in any possible position of the electronic device 100, which is not limited in this application.
  • the embodiment of the present application does not limit the number of shielding devices 103, and it may be one, two, four, or even more. It should be noted that the front of the electronic device 100 described in the embodiments of the present application can be understood as when the user uses the electronic device 100, the side surface of the electronic device 100 facing the user, and the back of the electronic device 100 can be understood as when the user uses the electronic device 100. In the case of the electronic device 100, the side surface of the electronic device 100 facing away from the user.
  • the electronic device 100 shown in FIG. 1 is not limited to include the above devices, and may also include other devices, such as batteries, flashlights, fingerprint recognition modules, earpieces, buttons, sensors, etc.
  • the embodiments of the present application are only installed with The electronic equipment of the shielding device 103 is described as an example, but the components mounted on the electronic equipment 100 are not limited to this.
  • the present application provides a shielding device.
  • the shielding device includes a camera module.
  • the outer surface of the components of the camera module is covered with a conductive layer or the components are made of conductive materials.
  • the components are assembled separately, and the components are assembled through the conductive structure.
  • the components are connected to form a relatively complete Faraday cage to achieve the shielding effect of shielding electromagnetic signals.
  • the size of the shielding device can be effectively reduced without affecting the appearance of the original structure.
  • the above-mentioned structure is formed by block assembly method. First, it can shorten the processing cycle due to the final step of forming the shielding cover, and second, it can reduce the additional processing error caused by the final step of forming the shielding cover, so as to increase the camera.
  • the product qualification rate of the module is formed by block assembly method.
  • this application also provides another shielding device.
  • the camera module of the shielding device includes two connected parts. The outer surface of the first part is covered with a first conductive layer, and the outer surface of the second part is covered with a second conductive layer. The first conductive layer and the second conductive layer are connected to form a shielding structure wrapped outside the camera module to form a complete Faraday cage to achieve a shielding effect of shielding electromagnetic signals.
  • the wire layer and the part are basically closely attached with no gap.
  • spraying, sputtering, transfer or laser direct molding technology can be used ( Laser direct structuring (LDS) and other technologies form a conductive layer on the component.
  • LDS Laser direct structuring
  • the upper surface and lower surface of the component mentioned in this application means: taking the substrate as a reference, the upper surface and the lower surface are approximately parallel to the substrate, and the surface of the component close to the substrate can be understood as the lower surface.
  • the surface of the component away from the substrate can be understood as the upper surface.
  • the cylindrical structure mentioned in this application can be a structure with a regular shape, for example, the cylindrical structure is a cylinder or a circular cylinder, etc., and the cylindrical structure can also be a structure with an irregular shape, which is not done in the embodiment of this application. Any restrictions.
  • connection between the two mentioned in this application may be a direct connection, or may be an indirect connection through an intermediate medium.
  • the connection between the first conductive layer and the second conductive layer (or the first conductive structure) may be direct contact between the two to realize the connection, or between the first conductive layer and the second conductive layer (or, the first conductive layer).
  • the connection of the conductive structure can be connected through a conductive material or a conductive structure.
  • the shielding device 200 includes a camera module and a shielding structure formed of conductive materials on the camera module.
  • the camera module may include a lens assembly, a support 220, a support 220, and a lens assembly that are arranged in order from top to bottom along the z direction.
  • the shielding structure may include a first conductive layer 261, a third conductive layer 262, a conductive structure 266, and a conductive structure 267.
  • the lens assembly includes a lens optical assembly 211 and a lens barrel 212.
  • the lens barrel 212 has a cylindrical structure.
  • the lens barrel 212 includes an optical channel 2121 penetrating the lens barrel 212 and forms two ends with openings.
  • the lens optical assembly 211 is provided on the lens barrel 212. One end of the opening (denoted as the first end) allows light to enter the light channel 2121 through the lens optical assembly 211.
  • the support 220 and the filter 230 are arranged at the other end of the lens barrel 212 with an opening (denoted as the second end).
  • the support 220 has a cylindrical structure.
  • the support 220 encloses and connects the filter 230.
  • the filter 230 It is arranged opposite to the optical channel 2121 so that light enters the filter 230 through the optical channel 2121.
  • the substrate 240 is arranged at the end of the support 220 away from the lens assembly.
  • the substrate 240 is provided with a conductive structure such as a grounding pad.
  • the substrate 240 is connected with a printed circuit board (PCB) and a flexible printed circuit board (PCB).
  • circuit, FPC various passive devices (for example, capacitors, resistors, inductors, etc.), and various chips 201 (for example, sensor chips) and other components.
  • the material of the lens barrel 212 is a material that does not have conductive properties, and the outer surface of the lens barrel 212 is covered with a first conductive layer 261.
  • the non-conductive material may be polycarbonate (PC), polyamide (PA) and other plastics.
  • a conductive layer may be formed on the outer surface of the lens barrel 212 by any of the following methods: spraying, sputtering, transfer, or laser direct structuring (LDS).
  • the first conductive layer 261 may be a material with conductive properties, such as a metal, a metal compound, or a carbon-based compound.
  • the material of the support 220 is also a material that does not have conductive properties, and the outer surface of the support 220 is covered with a third conductive layer 262.
  • the material of the support 220 and the conductive layer 262 covering the outer surface of the support 220 can be It is similar to the related content of the lens barrel 212 and will not be repeated here.
  • the lens barrel 212 and the support 220 are connected by a conductive structure 266, and the support 220 and the substrate 240 are connected by a conductive structure 267 to realize electrical connection between the lens barrel, the support and the substrate.
  • the material of the conductive structure 266 or the conductive structure 267 can be conductive glue, metal, metallization, carbon-based compound and other materials with conductive properties, and various possible connections such as welding, bonding, and riveting can be used through the two conductive structures. Component connection.
  • the conductive structure 266 may be a structure formed of conductive glue, and the lower surface of the lens barrel 212 and the upper surface of the support 220 are attached to the conductive structure 266 respectively.
  • the conductive structure 267 may also be a structure formed of conductive glue, and the lower surface of the support 220 and the upper surface of the substrate 240 are attached to the conductive structure 267 respectively.
  • the first conductive layer 261 may extend from the outer surface of the lens barrel 212 toward the lower surface of the lens barrel 212 opposite to the support 220
  • the third conductive layer 262 may extend from the outer surface of the support 220 toward the support 220
  • a portion of the upper surface of 220 opposite to the lens barrel 212 extends, and the conductive structure 266 is respectively engaged with the portion of the first conductive layer 261 covering the lower surface of the lens barrel 212 and the portion of the third conductive layer 262 covering the upper surface of the support 220,
  • the connection between the lens barrel 212 and the support 220 is realized, and the electrical connection between the lens barrel 212 and the support 220 is realized.
  • the third conductive layer 262 may extend from the outer surface of the support 220 toward the lower surface of the support 220 opposite to the substrate 240 to cover the third conductive layer 262 on the lower surface of the support 220 and the conductive structure. 267 bonding, realizes the connection between the substrate 240 and the support 220, and realizes the electrical connection between the support 220 and the substrate 240. In this way, a complete Faraday cage can be formed after the shielding device is assembled in blocks to achieve a better shielding effect.
  • the outer surface of the lens barrel is covered with a first conductive layer
  • the outer surface of the support is covered with a third conductive layer
  • both ends of the third conductive layer are connected with the first conductive layer and the exposed metal of the substrate.
  • the shielding principle of the shielding device of the present application is briefly described in conjunction with FIG. 3.
  • the shielding principle of the shielding device corresponding to each figure is the same as the shielding principle shown in FIG. 3, and will not be repeated in the following.
  • the electromagnetic field when the antenna 300 generates an electromagnetic wave signal, the electromagnetic field induces charges on the outer surface of the shielding device.
  • the induced charges flow to the substrate ground through the conductive layer, the conductive structure and the substrate to avoid the shielding device
  • the chip 201 in 200 is disturbed; similarly, as shown by the dotted line, when the chip 201 in the shielding device 200 generates electromagnetic waves by itself, the electromagnetic waves generate induced charges inside the shielding device.
  • the electromagnetic waves change, the induced charges pass through the conductive layer, The conductive structure and the substrate flow to the substrate ground to prevent sensitive devices such as mobile phone receiving antennas from being disturbed.
  • the lens barrel of the shielding device of the present application is covered with a first conductive layer and the support member is covered with a third conductive layer, and there is no need to provide a larger shielding cover that can accommodate the camera module outside the entire camera module. , Can effectively reduce the size of the shielding device without affecting the appearance of the original structure.
  • the shielding device of the present application can be assembled in blocks, and the outer surface of the lens barrel of the camera module is covered with the first conductive layer, Cover the outer surface of the support with a third conductive layer, and connect the first conductive layer and the second conductive structure to assemble a shielding device including a camera module and a complete shielding structure.
  • the increase in the processing cycle of the process, the second is to reduce the additional processing error caused by the final process of forming the shielding cover, so as to increase the product pass rate of the camera module.
  • the structure in which the outer surfaces of the lens barrel 212 and the support 220 are covered with a conductive layer to achieve a shielding effect is only a schematic illustration, and should not be limited to the present application.
  • the material of the lens barrel 212 and the support member 220 can also be a composite material with conductive properties, and the plastic can be filled with conductive material to form a conductive plastic.
  • the lens barrel and the support member themselves can serve as For a part of the shielding structure, the connection between the support 220 and the lens barrel 212 is realized by the conductive structure 266, and the connection between the support 220 and the substrate 267 is realized by the conductive structure 267.
  • the conductive material filled in the lens barrel and the support may be any one of stainless steel fibers, nickel fibers, carbon fibers, and carbon nanotubes.
  • the structure shown in FIG. 2 is covered with a conductive layer on the outer surface of the lens barrel and the support, and the connection between the various components is realized through the conductive structure.
  • the shielding device for filling the conductive structure in the support is described.
  • the conductive structure filled in the support is denoted as the first conductive structure.
  • FIG. 4 shows another schematic structural diagram of the shielding device provided by this application.
  • Fig. 4(a) shows a cross-sectional view of the shielding device in the xz plane
  • Fig. 4(b) shows a schematic structural view of the support in the yz plane.
  • the shielding device 200 includes a camera module and a shielding structure.
  • the camera module includes a lens assembly, a support 220, a substrate 240, and a filter enclosed by the support 220 that are sequentially arranged from top to bottom along the z direction.
  • the shielding structure includes a first conductive layer 261 and at least one first conductive structure 264.
  • the lens assembly includes a lens optical assembly 211 and a lens barrel 212.
  • the lens barrel 212 has a cylindrical structure.
  • the lens barrel 212 includes a light channel 2121 penetrating the lens barrel 212 and forms two ends with openings.
  • the optical assembly 211 is disposed at the first end of the lens barrel 212 having an opening to allow light to enter the light channel 2121 through the lens optical assembly 211.
  • the support 220 and the filter 230 are arranged at the second end of the lens barrel 212 with an opening.
  • the support 220 has a cylindrical structure.
  • the support 220 encloses and connects the filter 230.
  • the filter 230 and the light channel 2121 are arranged opposite to each other. The light enters the filter 230 through the optical channel 2121.
  • the substrate 240 is arranged at the end of the support 220 away from the lens assembly, and the substrate 240 is connected with PCB, FPC, various passive devices (for example, capacitors, resistors and inductors, etc.) and various chips 201 (for example, sensor chips) and other components. .
  • the material of the lens barrel 212 may be a material that does not have conductive properties, and the outer surface of the lens barrel 212 is covered with a first conductive layer 261.
  • the material of the support 220 may also be a material that does not have conductive properties, and the edge of the support 220 is provided with at least one first through hole 221, the first through hole 221 is an opening hole, The first through hole 221 is filled with the first conductive structure 264.
  • the material of the first conductive structure 264 may be conductive glue, metal, metallization, carbon-based compound, and other materials with a conductive effect.
  • the first end of the first conductive structure 264 is connected to the first conductive layer 261, and the first conductive structure 264
  • the second end portion of the substrate 240 is connected to the exposed metal of the substrate 240, for example, the metal may be copper.
  • the electrical connection between the first conductive layer 261, the first conductive structure 264 and the substrate 240 can be realized to realize the grounding of the shielding device, and a complete Rafarday cage is formed on the camera module to realize the shielding effect.
  • the first conductive structure 264 can be connected to the first conductive layer 261 and the exposed metal of the substrate 240 by various possible connection methods such as welding, bonding, and riveting.
  • the second end of the first conductive structure 264 may extend to the ground pad of the substrate 240 and be connected to the ground pad by welding.
  • the first conductive layer 261 may extend from the outer surface of the lens barrel 212 toward the bottom surface of the lens barrel 212 opposite to the support 220, so as to connect the first end portion of the first conductive structure 264 with the first conductive layer 261.
  • the part covering the bottom surface of the lens barrel 212 is joined to realize the connection between the first conductive layer 261 and the first conductive structure 264.
  • the first end portion of the first conductive structure 264 and the first conductive layer 261 may be passed through a conductive glue (not shown in the figure). Out) connection.
  • the outer surface of the lens barrel is covered with a conductive layer and the support is filled with the first conductive structure, so that the lens barrel and the support themselves have a shielding function, and the two ends of the first conductive structure Respectively connected with the substrate and the first conductive layer, it can realize the electrical connection between the first conductive layer, the first conductive structure and the substrate, realize the grounding of the shielding device, and form a complete Rafarday cage on the camera module to realize shielding effect.
  • the material of the lens barrel can also be a composite material with conductive properties.
  • the plastic can be filled with conductive materials to form a conductive plastic.
  • the lens barrel and the first conductive structure are connected.
  • the lens barrel itself It can be used as a part of the shielding structure to realize the electrical connection between the lens barrel, the first conductive structure and the substrate, realize the grounding of the shielding device, and form a complete Rafarday cage on the camera module to realize the shielding effect.
  • the conductive material filled in the lens barrel may be any one of stainless steel fibers, nickel fibers, carbon fibers, and carbon nanotubes.
  • FIG. 5 shows another schematic structural diagram of the shielding device provided by this application.
  • Fig. 5(a) shows a cross-sectional view of the shielding device in the xz plane
  • Fig. 5(b) shows a schematic cross-sectional view of the support in the yz plane.
  • first through holes 221 may be provided inside the support member 220 and are complete holes, or a part of the first through holes 221 may be complete Holes, another part of the first through holes 221 may be provided on the edge of the support 220 to form an opening hole, and the shape of the first through holes 221 may be various shapes that are not limited to a circle.
  • the first conductive structure 264 is filled in the first through hole 221, and both ends of the first conductive structure 264 are respectively connected to the lens barrel 212 and the substrate 240. For a specific description of the connection method, refer to the relevant description of the embodiment corresponding to FIG. 4. No longer.
  • the material of the lens barrel can also be a composite material with conductive properties.
  • the plastic can be filled with conductive materials to form a conductive plastic.
  • the lens barrel and the first conductive structure are connected.
  • the lens barrel itself It can be used as a part of the shielding structure to realize the electrical connection between the lens barrel, the first conductive structure and the substrate, realize the grounding of the shielding device, and form a complete Rafarday cage on the camera module to realize the shielding effect.
  • the conductive material filled in the lens barrel may be any one of stainless steel fibers, nickel fibers, carbon fibers, and carbon nanotubes.
  • FIG. 6 shows another schematic structural diagram of the shielding device provided by this application.
  • Fig. 6(a) shows a cross-sectional view of the shielding device in the xz plane
  • Fig. 6(b) shows a schematic cross-sectional view of the support in the yz plane
  • Fig. 6(c) shows A schematic structural view of a partial area of the support in the yz plane.
  • the difference between the structure shown in FIG. 6 and the structure shown in FIG. 4 is that the support 220 is provided with a first through hole 221 that not only penetrates the support 220 along the z direction, but also the first through hole 221 is provided along the support
  • the member 220 has a circle in the circumferential direction, and the first through hole 221 is filled with the first conductive structure 264.
  • the first conductive structure 264 may be composed of a main body 2641 and two ends (denoted as the first end 2642 and the second end 2643).
  • the main body 2641, the first end 2642 and the second end 2643 It can be integrally formed or assembled in pieces, and this application does not make any limitation.
  • the main body 2641 is embedded in the first through hole 221, and the two ends are located on the upper surface and the lower surface of the supporting member 220, and are respectively connected to the exposed metal of the first conductive layer 261 and the substrate 240.
  • connection method refer to FIG. 4 The relevant description of the corresponding embodiment will not be repeated.
  • any one of the first end portion 2642 or the second end portion 2643 may be formed by a plurality of convex structures 264-A, and the shapes of the plurality of convex structures 264-A may be the same or different.
  • the first end 2642 or the second end 2643 may be a combination of various shapes of convex structures 264-A.
  • the convex structure 264-A can have any shape of, for example, a square, a rhombus, a circle, and a triangle, and the first end 2642 or the second end 2643 can have the above-mentioned shapes. Any combination of.
  • the material of the lens barrel can also be a composite material with conductive properties.
  • the plastic can be filled with conductive materials to form a conductive plastic.
  • the lens barrel and the first conductive structure are connected.
  • the lens barrel itself It can be used as a part of the shielding structure to realize the electrical connection between the lens barrel, the first conductive structure and the substrate, realize the grounding of the shielding device, and form a complete Rafarday cage on the camera module to realize the shielding effect.
  • the conductive material filled in the lens barrel may be any one of stainless steel fibers, nickel fibers, carbon fibers, and carbon nanotubes.
  • the outer surface of the lens barrel is covered with a first conductive layer and the support is filled with a first conductive structure, so that the lens barrel and the support themselves have a shielding function, and the first conductive structure realizes
  • the connection between the lens barrel, the supporting member and the substrate is to realize the electrical connection between the lens barrel, the supporting member and the substrate through the electrical connection between the first conductive layer, the first conductive structure and the substrate to realize the grounding of the shielding device,
  • a complete Rafaday cage is formed on the camera module, and the camera module is assembled into a new shielding device for shielding electromagnetic signals to achieve a better shielding effect.
  • the lens barrel of the shielding device of the present application is covered with the first conductive layer and the support is filled with the first conductive structure, and there is no need to provide a larger shielding cover that can accommodate the camera module outside the entire camera module. , Can effectively reduce the size of the shielding device without affecting the appearance of the original structure.
  • the shielding device of the present application can be assembled in blocks, and the outer surface of the lens barrel of the camera module is covered with a first conductive layer, Fill the support with the first conductive structure, and connect the first conductive structure and the first conductive layer to assemble and form a shielding device including a camera module and a complete shielding structure.
  • the increased processing cycle, second can reduce the additional processing errors caused by the final process of forming the shielding cover, so as to increase the product qualification rate of the camera module.
  • FIG. 7 shows another schematic structural diagram of the shielding device of this application.
  • the shielding device further includes a plastic package 250 arranged between the substrate 240 and the support 220, and the plastic package 250 is plastically packaged with a wire
  • the plastic package 250 is fixed on the substrate 240 by plastic packaging, and the plastic package 250 and the support 220 can be pasted by glue 268 to realize the connection.
  • the first conductive structure 264 is filled in the support 220 and the plastic package 250, or in other words, the first conductive structure 264 penetrates the support 220 and the plastic package 250, and the first end of the first conductive structure 264 is connected to the first conductive layer 261 , The second end of the first conductive structure 264 is connected to the exposed metal of the substrate 240.
  • connection method reference may be made to the related description of the embodiment corresponding to FIG. 4, and will not be repeated.
  • the support 220, the glue 268, and the plastic package 250 can be penetrated to the ground pad of the substrate 240 by laser drilling to form a through hole, and a conductive material is filled in the through hole to form a first conductive structure 264.
  • some through holes (as shown in (b) in FIG. 5) can be reserved when the support 240 is formed by injection molding, so as to reduce the number of layers penetrated by the laser.
  • the through holes can be complete holes or An opening hole is provided at the edge of the support 240.
  • the material of the lens barrel can also be a composite material with conductive properties.
  • the plastic can be filled with conductive materials to form a conductive plastic.
  • the lens barrel and the first conductive structure are connected.
  • the lens barrel itself It can be used as a part of the shielding structure to realize the electrical connection between the lens barrel, the first conductive structure and the substrate, realize the grounding of the shielding device, and form a complete Rafarday cage on the camera module to realize the shielding effect.
  • the conductive material filled in the lens barrel may be any one of stainless steel fibers, nickel fibers, carbon fibers, and carbon nanotubes.
  • the outer surface of the lens barrel is covered with a first conductive layer, and the supporting member and the plastic packaging member are filled with the first conductive structure, so that the lens barrel, the supporting member and the plastic packaging member themselves have a shielding function.
  • the first conductive structure realizes the connection between the lens barrel, the support, the plastic package and the substrate, so as to realize the electrical connection between the lens barrel, the support, the plastic package and the substrate through the first conductive layer and the first conductive structure.
  • the grounding of the shielding device forms a complete Rafaday cage on the camera module, and the camera module is assembled into a new shielding device for shielding electromagnetic signals to achieve a better shielding effect.
  • the shielding device of the present application can be assembled in blocks by covering the outer surface of the lens barrel of the camera module with a conductive layer. After a part of the shielding structure is assembled through the first conductive structure to form a shielding device including a camera module and a complete shielding structure, one can shorten the processing cycle due to the final step of forming the shield, and second, it can reduce the number of The additional processing error caused by the process of the shielding cover can increase the product qualification rate of the camera module.
  • the first conductive structure in the support it is necessary to fill the first conductive structure in the support. It can be filled with the first conductive structure only in the support, or it can be filled in the support and the plastic package.
  • the first conductive structure hereinafter, in conjunction with Figures 8 to 12, the shielding device in which the plastic package is filled with a conductive structure in the structure including the plastic package is described.
  • the conductive structure filled in the plastic package is marked as the first Two conductive structure.
  • FIG. 8 shows another schematic structural diagram of the shielding device provided by this application.
  • the shielding device includes a camera module and a shielding structure.
  • the camera module includes a lens assembly, a support 220, a plastic package 250, a substrate 240, and an enclosure enclosed by the support 220, which are sequentially arranged along the z direction from top to bottom.
  • the filter 230, the shielding structure includes a first conductive layer 261, a third conductive layer 262, and at least one second conductive structure 265.
  • the plastic package 250 includes components such as wire bonds and passive devices, and the plastic package 250 is fixed on the substrate 240 by a plastic package.
  • the material of the lens barrel 212 may be a material with no conductivity, and the outer surface of the lens barrel 212 is covered with the first conductive layer 261, the material of the support 220 may also be a material with no conductivity, and the support 220 The outer surface of is covered with a third conductive layer 262.
  • the lens barrel 212 and the supporting member 220 may be connected through the conductive structure 266, and the specific description of the connection method may refer to the related description of the embodiment corresponding to FIG. 2 and will not be repeated.
  • the second conductive structure 265 is filled in the plastic package 250.
  • the plastic package 250 has a second conductive structure 265 penetrating through the plastic package 250.
  • the first end of the second conductive structure 265 is connected to the third conductive layer 262.
  • the second end of the second conductive structure 265 is connected to the exposed metal of the substrate 240, and the lens barrel 212, the support 220, the plastic package 250 and the substrate are realized by the first conductive layer 261, the third conductive layer 262 and the second conductive structure 265.
  • the second conductive structure 265 can be connected to the support 220 and the substrate 240 by various possible connection methods such as welding, bonding, and riveting.
  • the second end of the second conductive structure 265 may extend to the ground pad of the substrate 240 and be connected to the ground pad by welding.
  • the third conductive layer 262 may extend from the outer surface of the supporting member 220 toward the bottom surface of the supporting member 220 opposite to the plastic package member 250, and cover the third conductive layer 262 on the bottom surface of the supporting member 220 and the second
  • the first end of the conductive structure 265 is joined to realize the connection between the third conductive layer 262 and the second conductive structure 265.
  • the first end of the second conductive structure 265 may be connected through the conductive structure 268 formed of conductive glue, that is, the conductive The structure 268 is pasted on the lower surface of the third conductive layer 262 and the support 220.
  • the material of the second conductive structure 265 may be conductive adhesives, metals, metal compounds, carbon-based compounds, and other materials with conductive properties, which are not limited in this application.
  • the second conductive structure 265 may be a metal shrapnel made of metal.
  • the second conductive structure 265 may also be a structure formed of conductive glue.
  • FIG. 9 shows another schematic structural diagram of the shielding device provided by this application.
  • the materials of the lens barrel 212 and the support 220 are composite materials with conductive properties, and conductive materials can be filled in the plastics to form conductive plastics, optionally
  • the conductive material filled in the lens barrel and the support can be any of stainless steel fibers, nickel fibers, carbon fibers, and carbon nanotubes.
  • the lens barrel 212 and the support 220 themselves can be used as part of the shielding structure, the support 220 and the lens barrel 212 can be connected by the conductive structure 266, and the support 220 and the second conductive structure 265 can be connected by the conductive structure 268 , In order to realize the electrical connection between the lens barrel, the support, the plastic package and the substrate.
  • the material of the conductive structure 266 or the conductive structure 268 may be conductive glue, metal, metallization, carbon-based compound and other materials with conductive properties, and various possible connection methods such as welding, bonding, and riveting may be adopted.
  • the conductive structure connects the two components.
  • FIG. 10 shows another schematic structural diagram of the shielding device provided by this application.
  • the shielding device 200 includes a camera module and a shielding structure.
  • the camera module includes a lens assembly, a support, a filter, a plastic package, a substrate, and at least one second conductive structure.
  • the shielding structure may include a first conductive structure. Layer 261 and second conductive structure 265. The difference between the structure shown in FIG. 10 and FIG. 11 and the structure shown in FIG. 8 and FIG. 9 is that the lens barrel 212 of the shielding device 200 encloses the support 220 and the filter 230.
  • the lens assembly includes a lens barrel 212 and a lens optical assembly 211.
  • the lens barrel 212 has a cylindrical structure.
  • the lens barrel 212 includes an optical channel 2121 penetrating through the lens barrel 212 and forms two ends with openings.
  • the lens optical assembly 211 is disposed on the lens barrel 212.
  • One end of the opening (denoted as the first end) allows light to enter the light channel 2121 through the lens optical assembly 211.
  • the peripheral edge of the second end of the lens barrel 212 with an opening forms a convex convex edge 2122 in the direction approaching the plastic package, so as to form a recessed area surrounded by the convex edge 2122 in the middle area of the second end of the lens barrel 212.
  • the support 220 and the filter 230 are accommodated in the recessed area to enclose the support 220 and the filter 230 through the raised edge 2122.
  • the support 220 has a cylindrical structure, and the support 220 encloses and fixes the filter 230.
  • the optical filter 230 and the optical channel 2121 are disposed opposite to each other so that light enters the optical filter 230 through the optical channel 2121.
  • the plastic package 250 is arranged between the lens barrel 212 and the substrate 240.
  • the plastic package 250 is plastic-encapsulated with components such as welding wires and passive devices.
  • the plastic package 250 is fixed on the substrate 240 by plastic packaging.
  • the substrate 240 is provided with grounding pads and other conductive components, and the substrate 240 is fixedly connected with PCB, FPC, various passive devices (for example, capacitors, resistors, and inductors, etc.) and various chips 201 (for example, sensor chips). ) And other components.
  • the material of the lens barrel 212 may be a material that does not have conductive properties, and the outer surface of the lens barrel 212 is covered with the first conductive layer 261. Since the support 220 is enclosed in the convex edge 2122 of the lens barrel 212, There is no need to do any treatment on the support 220, and the shielding effect can be achieved by the first conductive layer 261 on the lens barrel 212.
  • the second conductive structure 265 is filled in the plastic package 250. In other words, the plastic package 250 has a second conductive structure 265 penetrating the plastic package 250, and the first end of the second conductive structure 265 is connected to the first conductive layer 261.
  • the second end of the second conductive structure 265 is connected to the exposed metal of the substrate, and the electrical connection between the lens barrel 212, the plastic package 250 and the substrate 240 is realized through the first conductive layer 261 and the second conductive structure 265, so as to be in the camera mold.
  • a relatively complete Faraday cage is realized on the group to realize the shielding effect.
  • the second conductive structure 265 can be connected to the convex edge 2122 of the lens barrel 212 and the substrate 240 by various possible connection methods such as welding, bonding, and riveting.
  • one end of the second conductive structure 265 may extend to the ground pad of the substrate 240 and be connected to the ground pad by welding.
  • the first conductive layer 261 may extend from the outer surface of the lens barrel 212 toward the lower surface of the convex edge 2122 opposite to the plastic package 250, and cover the first conductive layer 261 on the lower surface of the convex edge 2122. Part of it is joined with the second conductive structure 265 to realize the joining connection of the first conductive layer 261 and the second conductive structure 265.
  • the first end of the second conductive structure 265 may be pasted on the first conductive structure 269 through a conductive structure 269 formed of conductive glue.
  • the layer 261 and the lower surface of the convex edge 2122 of the lens barrel 212 are on the lower surface.
  • the material of the second conductive structure 265 may be conductive adhesives, metals, metal compounds, carbon-based compounds, and other materials with conductive properties, which are not limited in this application.
  • the second conductive structure 265 may be a structure formed of conductive glue.
  • the difference between FIG. 11 and FIG. 10 is that in FIG. 11, the second conductive structure 265 may be a metal shrapnel made of metal.
  • the second conductive structure 265 may be a grounded gold wire made of metal.
  • a grounding gold wire is provided on the ground pad of the substrate 240 before the component is molded on the substrate 240, for example, refer to FIG.
  • the grounding gold wire can be welded on two adjacent grounding pads to form a grounding gold wire around the substrate 240, and after plastic packaging is formed into a plastic package, a laser or knife cutting method is used to remove one layer, and the The grounding gold wire leaks out, and one end of the grounding gold wire is connected to the first conductive layer 261.
  • the grounding gold wire can be pasted to the first conductive layer 261 through a conductive structure 269 formed of conductive glue.
  • the lens barrel encloses and fixes the support, the lens barrel is covered with a first conductive layer and the plastic package is filled with a second conductive structure, so that the lens barrel and the plastic package themselves have a shielding function.
  • the second conductive structure realizes the connection between the lens barrel, the plastic package and the substrate, so as to realize the electrical connection between the lens barrel, the support, the plastic package and the substrate through the first conductive layer and the second conductive structure, so as to realize the protection of the shielding device.
  • Grounding, a complete Faraday cage is formed on the camera module, and the camera module is assembled into a new shielding device for shielding electromagnetic signals to achieve a better shielding effect.
  • the lens barrel of the shielding device of the present application is covered with a first conductive layer and the plastic package is filled with a second conductive structure, which eliminates the need to provide a larger shielding cover that can accommodate the camera module outside the entire camera module. , Can effectively reduce the size of the shielding device without affecting the appearance of the original structure.
  • the shielding device of the present application can be assembled in blocks, and the outer surface of the lens barrel of the camera module is covered with the first conductive layer, The second conductive structure is filled in the plastic package, and the first conductive layer and the second conductive structure are connected to assemble a shielding device including a camera module and a complete shielding structure.
  • the process of forming the shielding cover can be shortened.
  • the increased processing cycle, second can reduce the additional processing errors caused by the final process of forming the shielding cover, so as to increase the product qualification rate of the camera module.
  • circumferential direction of the lens barrel, the circumferential direction of the plastic package 250, and the circumferential direction of the substrate 240 described below are all directions around the z direction, which is perpendicular to the surface of the substrate.
  • the camera module may include two connected parts, the first part includes the lens barrel, the second part includes at least the substrate, the outer surface of the first part is covered with the first conductive layer, and the outer surface of the second part The surface is covered with a second conductive layer, and the first conductive layer and the second conductive layer are connected to form a shielding structure wrapped around the camera module.
  • FIG. 13 shows another schematic structural diagram of the shielding device provided by this application.
  • Fig. 13(a) a cross-sectional view of the shielding device in the xz plane is shown
  • Fig. 13(b) is a schematic cross-sectional view of a partial area of the shielding device.
  • the shielding device 200 includes a camera module and a shielding structure.
  • the camera module includes a lens assembly, a plastic package 250 and a substrate 240 that are sequentially arranged along the z direction from top to bottom, and the shielding structure includes a first conductive layer 261 and a second conductive layer 263.
  • the lens assembly includes a lens optical assembly 211 and a lens barrel 212.
  • the lens barrel 212 has a cylindrical structure.
  • the lens barrel 212 includes an optical channel 2121 penetrating the lens barrel 212 and forms two ends with openings.
  • the lens optical assembly 211 is provided on the lens barrel 212. The first end of the opening allows light to enter the light channel 2121 through the lens optical assembly 211.
  • the substrate 240 is fixed with a plastic package 250 that is plastic-encapsulated on the substrate 240.
  • the plastic package 250 contains components such as wire bonds and passive components.
  • the plastic package 250 and the lens barrel 212 can be glued to realize the connection.
  • Various chips 201 (for example, sensor chips) can also be fixed on the substrate 240.
  • the lens barrel 212 serves as the first part
  • the plastic package 250 and the substrate 240 serve as the second part connected to the lens barrel 212
  • the first conductive layer 261 covers the outer surface of the lens barrel 212
  • the second conductive layer 263 covers the On the outer surface of the second part formed by the substrate 240 and the plastic package 250, the first conductive layer 261 and the second conductive layer 263 are connected to realize electrical connection between the two conductive layers.
  • the outer surface of the lens barrel 212 includes the side surface 212-A of the lens barrel in the circumferential direction and the top surface 212-C perpendicular to the z direction away from the substrate 240.
  • the outer surface of the plastic package 250 includes the outer surface of the plastic package in the circumferential direction.
  • the side surface 250-A, the outer surface of the substrate 240 includes the side surface 240-A of the substrate 240 in the circumferential direction and the bottom surface 240-B perpendicular to the z direction away from the lens barrel 212.
  • the bottom surface 240-B of the substrate 240 is exposed with copper, for example Metal
  • the second conductive layer 263 covers the bottom surface 240-B of the substrate 240 and is connected to the metal, so that the shielding structure formed by the first conductive layer 261 and the second conductive layer 263 can be electrically connected to the substrate 240 to realize the grounding of the shielding device , A complete Faraday cage is formed outside the camera module to achieve a shielding effect.
  • the second conductive layer 263 extends toward the first end portion 261-A of the first conductive layer 261 to form the first end portion 263-A of the second conductive layer 263, and the second conductive layer 263
  • the first end 263-A of the first conductive layer 261 is joined to the first end 261-A of the first conductive layer 261 to realize the connection between the two conductive layers, wherein the first end 261-A of the first conductive layer 261 is Close to the end of the second conductive layer 263, the first end 263 -A of the second conductive layer 263 is close to the end of the first conductive layer 261.
  • the first end 263-A of the second conductive layer 263 is configured as a stepped structure
  • the first end 261-A of the first conductive layer 261 is configured as a structure that cooperates with the stepped structure.
  • the ends of each conductive layer are joined for connection.
  • the first end 263-A of the step-like structure may be a structure having an L-shaped cross-section, and the first end 263-A of the step-like structure accommodates the first end 261- of the first conductive layer 261.
  • a and fixed connection may be connected by welding, riveting, conductive glue, or the like.
  • This structure connecting the first conductive layer and the second conductive layer through a stepped structure can increase the contact area between the first conductive layer and the second conductive layer, improve the bonding force of the two, and make the connection more reliable.
  • the first conductive layer 261 may be formed on the outer surface of the lens barrel 212 by any of the following methods: spraying, sputtering, transfer, or laser direct structuring (LDS).
  • the first conductive layer 261 may be a material with conductive properties, such as a metal, a metal compound, or a carbon-based compound.
  • the formation method and material of the second conductive layer 263 are similar to those of the first conductive layer 261, and will not be repeated here.
  • the lens barrel covered with the first conductive layer and the substrate fixed with the plastic package are assembled.
  • the outer surface of the parts (plastic package and substrate) other than the lens barrel is covered with a second conductive layer ,
  • the second conductive layer is connected with the first conductive layer to form a shielding structure that is basically close to the camera module outside the camera module, and the shielding effect is achieved through the shielding structure.
  • FIG. 14 shows another schematic structural diagram of the shielding device provided by this application.
  • the substrate 240 of FIG. 14 is provided with at least one groove 241, and metal such as copper is exposed in the groove 241, and the second conductive layer 263 extends to the groove 241 to fill the groove 241 to connect to the metal.
  • the surface of the groove 241 is used as a part of the bottom surface 240-B of the substrate 240, and the second conductive layer 263 covers the bottom surface 240-B of the surface of the substrate 240 including the groove 241, on the bottom surface 240 of the substrate 240.
  • a second conductive layer 263 with a protruding structure is formed on -B, so that the shielding structure formed by the first conductive layer 261 and the second conductive layer 263 is electrically connected to the substrate 240 to realize the grounding of the shielding device, A complete Faraday cage is formed on the outside of the camera module to achieve a shielding effect.
  • FIG. 15 shows another schematic structural diagram of the shielding device provided by this application.
  • the camera module of FIG. 14 also includes a support 220 and a filter 230 disposed between the plastic package 250 and the lens barrel 212.
  • the support has a cylindrical structure, and the support 220 is enclosed and connected. Filter 230.
  • the lens barrel 212 serves as the first part
  • the first conductive layer 261 covers the outer surface of the lens barrel 212
  • the support 220, the plastic package 250 and the substrate 240 serve as the second part connected to the lens barrel 212, and the support 220 2.
  • the first conductive layer 261 and the second conductive layer 263 are connected to realize electrical connection between the two conductive layers.
  • the outer surface of the support 220 includes the lateral side 220-A of the support 220 in the circumferential direction, the outer surface of the lens barrel 212, the outer surface of the plastic package 250, and the outer surface of the substrate 240.
  • the shielding structure formed by the first conductive layer 261 and the second conductive layer 263 is electrically connected to the substrate 240 to realize the grounding of the shielding device, and a complete Faraday cage is formed outside the camera module to achieve the shielding effect.
  • the camera module can also be divided into three parts, with the lens barrel as the first part and the substrate as the third part.
  • the support is the second part
  • the outer surface of the lens barrel is covered with a first conductive layer
  • the outer surface of the support is covered with a third conductive layer
  • the outer surface of the substrate is covered with a second conductive layer
  • the first conductive layer The layer and the third conductive layer may be connected by conductive glue or the like, and the connection between the second conductive layer and the third conductive layer may be the same as that shown in FIG. 13.
  • FIG. 16 shows another schematic structural diagram of the shielding device provided by this application.
  • the camera module of the shielding device includes a lens assembly and a substrate.
  • the lens assembly includes a lens optical assembly 211 and a lens barrel 212.
  • Various chips 201 for example, sensor chips
  • passive components can be fixed on the substrate 240.
  • the lens barrel 212 has The peripheral edge of the second end of the opening forms a convex convex edge 2122 toward the direction close to the substrate 240, so that a concave area surrounded by the convex edge 2122 is formed in the middle area of the second end of the lens barrel 212, and the convex edge 2122 is formed on the substrate 240.
  • each element can be accommodated in the recessed area, and the convex edge 2122 of the lens barrel 212 and the substrate 240 can be pasted by a viscous material such as glue.
  • the lens barrel 212 serves as the first part
  • the substrate 240 serves as the second part connected to the lens barrel
  • the first conductive layer 261 covers the outer surface of the lens barrel 212
  • the second conductive layer 263 covers the outer surface of the substrate 240.
  • the electrical connection between the two conductive layers can be achieved.
  • the specific description of the outer surface of the lens barrel 212 and the outer surface of the substrate 240 is the same as the related description of the embodiment corresponding to FIGS. 13 and 14, and will not be repeated.
  • the shielding structure formed by the first conductive layer 261 and the second conductive layer 263 is electrically connected to the substrate 240 to realize the grounding of the shielding device, and a complete Faraday cage is formed outside the camera module to achieve the shielding effect.
  • the camera module of the shielding device includes two connected parts, the first part includes a lens barrel, the second part includes at least a substrate, the outer surface of the first part is covered with a first conductive layer, and the outer surface of the second part Covered with a second conductive layer, the first conductive layer and the second conductive layer are connected to form a shielding structure wrapped around the camera module, so that the shielding structure formed by the first conductive layer and the second conductive layer can be realized with the substrate It is electrically connected to realize the grounding of the shielding device, and a complete Faraday cage is formed on the outside of the camera module to realize the shielding effect of shielding electromagnetic signals.
  • the first conductive layer is connected to the second conductive layer and connected to the metal of the substrate, and the second wire layer covers the outer surface of the substrate, which can expand the metal of the in-line structure of the substrate into a metal structure of a U-shaped structure. Enlarge the metal area of the substrate, increase the heat dissipation area, and improve the heat dissipation effect of the entire shielding device.
  • the conductive materials of the two can be directly combined without other conductive connection measures, the conductive performance is excellent, and the contact resistance is low.

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Abstract

本申请提供一种屏蔽装置和电子设备，该屏蔽装置通过在摄像头模组的部件的外表面覆盖导电层以及在支撑件中填充导电结构，通过导电层、导电结构和基板之间的连接实现镜筒、支撑件和基板的电连接，从而形成较为完备的法拉第笼，以实现屏蔽电磁信号的屏蔽效果。此外，由于不需要在整个摄像头模组外设置屏蔽罩，可以有效地减少屏蔽装置的尺寸，不影响原有结构外观。而且，相比于现有技术的在组装完摄像头模组后再形成屏蔽罩的方案，本申请的屏蔽装置可以分块组装，一是可以缩短由于最后形成屏蔽罩的工序所增加的加工周期，二是可以减少由于最后形成屏蔽罩的工序带来的额外的加工误差，以增加摄像头模组的产品合格率。

Description

屏蔽装置和电子设备
本申请要求于2019年11月29日提交中国专利局、申请号为201911203745.7、申请名称为“屏蔽装置和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备领域，更具体地，涉及一种屏蔽装置和电子设备。
背景技术
目前，越来越多的电子设备例如手机、平板电脑、笔记本电脑等都设置有摄像头组件。随着消费者对可视化需求的逐渐提升，摄像头模组传输的数据量也逐渐增加，摄像头模组日益提升的数据量给电子设备的通信质量带来干扰，同时，电子设备的大功率通信传输也会给摄像头模组的图像数据传输造成干扰，因此，需要对摄像头模组采用屏蔽技术，以解决摄像头模组工作过程中带来的电磁干扰(electromagnetic interference，EMI)问题。
发明内容
本申请提供一种屏蔽装置和电子设备，该屏蔽装置通过在摄像头模组的部件的外表面覆盖导电层以及在支撑件中填充导电结构，通过导电层、导电结构和基板之间的连接实现镜筒、支撑件和基板的电连接，从而形成较为完备的法拉第笼，以实现屏蔽电磁信号的屏蔽效果。
此外，由于不需要在整个摄像头模组外设置屏蔽罩，可以有效地减少屏蔽装置的尺寸，不影响原有结构外观。
而且，相比于现有技术的在组装完摄像头模组后再形成屏蔽罩的方案，本申请的屏蔽装置可以分块组装，一是可以缩短由于最后形成屏蔽罩的工序所增加的加工周期，二是可以减少由于最后形成屏蔽罩的工序带来的额外的加工误差，以增加摄像头模组的产品合格率。
第一方面，提供一种屏蔽装置，所述屏蔽装置包括镜头组件、支撑件和基板，
所述镜头组件包括镜筒和镜头光学组件，所述镜筒呈筒状结构，所述镜筒包括贯穿所述镜筒的光通道且形成具有开口的两端，所述镜头光学组件设置在所述镜筒具有开口的一端以使光通过所述镜头光学组件进入所述光通道，所述镜筒的材料是不具有导电性能的材料且所述镜筒的外表面覆盖有第一导电层；
所述支撑件设置在所述镜筒和所述基板之间，所述支撑件的材料是不具有导电性能的材料，所述支撑件中填充有至少一个第一导电结构，所述第一导电结构的第一端部与所述第一导电层连接，所述第一导电结构的第二端部与所述基板外露的金属连接。
因此，本申请提供的屏蔽装置，镜筒的外表面上覆盖有第一导电层以及支撑件中填充 有第一导电结构，使得镜筒和支撑件本身具有了屏蔽功能，而且，通过第一导电结构实现了镜筒、支撑件和基板之间的连接，以通过第一导电层、第一导电结构和基板之间的电连接实现镜筒、支撑件和基板之间的电连接，实现屏蔽装置的接地，在摄像头模组上形成完备的拉法第笼，将摄像头模组组装为一种新的屏蔽电磁信号的屏蔽装置，实现较好的屏蔽效果。
此外，本申请的屏蔽装置的镜筒上覆盖有第一导电层以及支撑件中填充有第一导电结构，可以不需要在整个摄像头模组外设置一个较大的可以容纳摄像头模组的屏蔽罩，可以有效地减少屏蔽装置的尺寸，不影响原有结构外观。
而且，相比于现有技术的在组装完摄像头模组后再形成屏蔽罩的方案，本申请的屏蔽装置可以分块组装，在摄像头模组的镜筒的外表面上覆盖第一导电层，在支撑件中填充第一导电结构，将第一导电结构和第一导电层连接，以组装形成包括摄像头模组和完整的屏蔽结构的屏蔽装置，一是可以缩短由于最后形成屏蔽罩的工序所增加的加工周期，二是可以减少由于最后形成屏蔽罩的工序带来的额外的加工误差，以增加摄像头模组的产品合格率。
可选地，所述支撑件上设置有贯穿所述支撑件的至少一个第一通孔，所述第一通孔填充有所述第一导电结构。
可选地，所述第一通孔为设置在所述支撑件的边缘的开口孔。
通过在支撑件的边缘开孔，可根据需求开大小不同的边缘孔，填充导电结构；并且，当中间存在其他干涉物体时，可以避让；同时，在不影响支撑件的强度或刚度的情况下，可增大导电结构与支撑件的接触面积；此外，还可以减小导电结构施工难度。
可选地，所述支撑件的内部设置有贯穿所述支撑件的一个第一通孔，所述第一导电结构的每个端部由多个外凸结构形成。
这种将第一导电结构的每个端部设置为由多个凸起结构形成的端部，可以简化导电结构的加工，便于生产。
可选地，所述屏蔽装置还包括设置在所述支撑件和所述基板之间的塑封件，所述第一导电结构贯穿所述塑封件。
可选地，所述第一导电结构的第一端部通过导电胶与所述第一导电层连接。
这样，通过采用导电胶将第一导电结构和第一导电层的第一端部连接，可以提高电连接的稳定性。
可选地，所述第一导电结构的第二端部与所述基板的接地焊盘连接。
可选地，所述第一导电结构为：由导电胶形成的结构，或，金属弹片。
第二方面，提供了一种屏蔽装置，所述屏蔽装置包括镜头组件、支撑件、塑封件和基板，
所述镜头组件包括镜筒和镜头光学组件，所述镜筒呈筒状结构，所述镜筒包括贯穿所述镜筒的光通道且形成具有开口的两端，所述镜头光学组件设置在所述镜筒具有开口的一端以使光通过所述镜头光学组件进入所述光通道，所述镜筒的材料为不具有导电性能的材料且所述镜筒的外表面覆盖有第一导电层；
所述支撑件设置在所述镜筒和所述塑封件之间，所述支撑件的材料为不具有导电性能的材料且所述支撑件的外表面上覆盖有第三导电层，所述第一导电层与所述第三导电层连 接；
所述塑封件设置在所述支撑件和所述基板之间，所述塑封件中塑封有贯穿所述塑封件的至少一个第二导电结构，所述第二导电结构的第一端部与所述第三导电层连接，所述第二导电结构的第二端部与所述基板外露的金属连接。
因此，本申请提供的屏蔽装置，镜筒和支撑件的外表面上覆盖有导电层(第一导电层和第三导电层)以及塑封件中填充有第二导电结构，使得镜筒、支撑件和塑封件本身具有了屏蔽功能，而且，通过第二导电结构实现了镜筒、支撑件、塑封件和基板之间的连接，以通过第一导电层、第三导电层和第一导电结构实现镜筒、支撑件、塑封件和基板之间的电连接，实现屏蔽装置的接地，在摄像头模组上形成完备的法拉第笼，将摄像头模组组装为一种新的屏蔽电磁信号的屏蔽装置，实现较好的屏蔽效果。
此外，本申请的屏蔽装置的镜筒上覆盖有第一导电层、支撑件上覆盖有第二导电层以及塑封件中填充有第二导电结构，可以不需要在整个摄像头模组外设置一个较大的可以容纳摄像头模组的屏蔽罩，可以有效地减少屏蔽装置的尺寸，不影响原有结构外观。
而且，相比于现有技术的在组装完摄像头模组后再形成屏蔽罩的方案，本申请的屏蔽装置可以分块组装，在摄像头模组的镜筒上覆盖第一导电层、在支撑件上覆盖第二导电层，在塑封件中填充第二导电结构，将第二导电结构、第一导电层和第二导电层连接，以组装形成包括摄像头模组和完整的屏蔽结构的屏蔽装置，一是可以缩短由于最后形成屏蔽罩的工序所增加的加工周期，二是可以减少由于最后形成屏蔽罩的工序带来的额外的加工误差，以增加摄像头模组的产品合格率，三是本申请的屏蔽装置对模组的装配次序无影响，不额外增加尺寸，不影响原有结构外观。
可选地，所述第二导电结构的第一端部通过导电胶与所述第三导电层连接。
这样，通过采用导电胶将第二导电结构的第一端部和第三导电层连接，可以提高电连接的稳定性。
可选地，所述第二导电结构的第二端部与所述基板的接地焊盘连接。
可选地，所述第二导电结构为以下任一项：由导电胶形成的结构，或，金属弹片，或，设置在所述基板的接地焊盘上的接地金线。
第三方面，提供了一种屏蔽装置，所述屏蔽装置包括镜头组件、支撑件、塑封件和基板，
所述镜头组件包括镜筒和镜头光学组件，所述镜筒呈筒状结构，所述镜筒包括贯穿所述镜筒的光通道且形成具有开口的两端，所述镜头光学组件设置在所述镜筒具有开口的第一端以使光通过所述镜头光学组件进入所述光通道，所述镜筒具有开口的第二端的周边边缘在朝着靠近所述塑封件的方向形成凸起的凸起边缘，以在所述镜筒的第二端的中间区域形成被所述凸起边缘包围的凹陷区域，所述镜筒的材料为不具有导电性能的材料且所述镜筒的外表面上覆盖有第一导电层；
所述支撑件容纳于所述凹陷区域以通过所述凸起边缘围合所述支撑件；
所述塑封件设置在所述镜筒和所述基板之间，所述塑封件中塑封有贯穿所述塑封件的至少一个第二导电结构，所述第二导电结构的第一端部与所述第一导电层连接，所述第二导电结构的第二端部与所述基板外露的金属连接。
因此，本申请提供的屏蔽装置，镜筒围合且固定支撑件，镜筒上覆盖有第一导电层以 及塑封件中填充有第二导电结构，使得镜筒、塑封件本身具有了屏蔽功能，而且，通过第二导电结构实现了镜筒、塑封件和基板之间的连接，以通过第一导电层和第二导电结构实现镜筒、支撑件、塑封件和基板之间的电连接，实现屏蔽装置的接地，在摄像头模组上形成完备的法拉第笼，将摄像头模组组装为一种新的屏蔽电磁信号的屏蔽装置，实现较好的屏蔽效果。
此外，本申请的屏蔽装置的镜筒上覆盖有第一导电层以及塑封件中填充有第二导电结构，可以不需要在整个摄像头模组外设置一个较大的可以容纳摄像头模组的屏蔽罩，可以有效地减少屏蔽装置的尺寸，不影响原有结构外观。
而且，相比于现有技术的在组装完摄像头模组后再形成屏蔽罩的方案，本申请的屏蔽装置可以分块组装，在摄像头模组的镜筒的外表面上覆盖第一导电层、在塑封件中填充第二导电结构，将第一导电层和第二导电结构连接，以组装形成包括摄像头模组和完整的屏蔽结构的屏蔽装置，一是可以缩短由于最后形成屏蔽罩的工序所增加的加工周期，二是可以减少由于最后形成屏蔽罩的工序带来的额外的加工误差，以增加摄像头模组的产品合格率。
可选地，所述第二导电结构的第一端部通过导电胶与所述第一导电层连接。
这样，通过采用导电胶将第二导电结构的第一端部和第一导电层连接，可以提高电连接的稳定性。
可选地，所述第二导电结构的第二端部与所述基板的接地焊盘连接。
可选地，所述第二导电结构为以下任一项：由导电胶形成的结构，或，金属弹片，或，设置在所述基板的接地焊盘上的接地金线。
第四方面，提供了一种屏蔽装置，所述屏蔽装置包括镜头组件、支撑件和基板，
所述镜头组件包括镜筒和镜头光学组件，所述镜筒呈筒状结构，所述镜筒包括贯穿所述镜筒的光通道且形成具有开口的两端，所述镜头光学组件设置在所述镜筒具有开口的一端以使光通过所述镜头光学组件进入所述光通道，所述镜筒的材料是具有导电性能的复合材料，
所述支撑件设置在所述镜筒和所述基板之间，所述支撑件的材料是具有导电性能的复合材料，所述支撑件和所述镜筒连接，所述支撑件和所述基板外露的金属连接。
因此，本申请提供的屏蔽装置，镜筒和支撑件可以采用具有导电性能的复合材料，镜筒、支撑件和基板之间连接，可以实现镜筒、支撑件和基板之间的电连接，实现屏蔽装置的接地，在摄像头模组上形成完备的法拉第笼，将摄像头模组组装为一种新的屏蔽电磁信号的屏蔽装置，实现较好的屏蔽效果。
此外，本申请的屏蔽装置的镜筒和支撑件本身采用具有导电材料的复合材料，可以不需要在整个摄像头模组外设置一个较大的可以容纳摄像头模组的屏蔽罩，可以有效地减少屏蔽装置的尺寸，不影响原有结构外观。
而且，相比于现有技术的在组装完摄像头模组后再形成屏蔽罩的方案，本申请的屏蔽装置可以分块组装，一是可以缩短由于最后形成屏蔽罩的工序所增加的加工周期，二是可以减少由于最后形成屏蔽罩的工序带来的额外的加工误差，以增加摄像头模组的产品合格率。
可选地，所述屏蔽装置还包括设置在所述支撑件和所述基板之间的塑封件，所述塑封 件中塑封有贯穿所述塑封件的至少一个第二导电结构，所述第二导电结构的第一端部与所述支撑件连接，所述第二导电结构的第二端部与所述基板外露的金属连接。
可选地，所述第二导电结构的第一端部通过导电胶与所述第一导电层连接。
可选地，所述第二导电结构的第二端部与所述基板的接地焊盘连接。
可选地，所述复合材料中中具有导电性能的材料可以是不锈钢纤维、镍纤维、碳纤维、碳纳米管中的任一种。
第五方面，提供了一种屏蔽装置，其特征在于，所述屏蔽装置包括镜头组件、支撑件和基板，
所述镜头组件包括镜筒和镜头光学组件，所述镜筒呈筒状结构，所述镜筒包括贯穿所述镜筒的光通道且形成具有开口的两端，所述镜头光学组件设置在所述镜筒具有开口的一端以使光通过所述镜头光学组件进入所述光通道，所述镜筒的材料为不具有导电性能的材料且所述镜筒的外表面覆盖有第一导电层；
所述支撑件设置在所述镜筒和所述基板之间，所述支撑件的材料为不具有导电性能的材料且所述支撑件的外表面上覆盖有第三导电层，所述第三导电层的一端与所述第一导电层连接，所述第三导电层的另一端与所述基板外露的金属连接。
因此，本申请提供的屏蔽装置，镜筒的外表面上覆盖有第一导电层，支撑件的外表面上覆盖有第三导电层，第三导电层的两端分别与第一导电层和基板外露的金属连接，以实现镜筒、支撑件和基板之间的电连接，以在摄像头模组上形成较为完备的法拉第笼，将摄像头模组组装为一种新的屏蔽电磁信号的屏蔽装置。
此外，本申请的屏蔽装置的镜筒上覆盖有第一导电层以及支撑件上覆盖有第三导电层，可以不需要在整个摄像头模组外设置一个较大的可以容纳摄像头模组的屏蔽罩，可以有效地减少屏蔽装置的尺寸，不影响原有结构外观。
而且，相比于现有技术的在组装完摄像头模组后再形成屏蔽罩的方案，本申请的屏蔽装置可以分块组装，在摄像头模组的镜筒的外表面上覆盖第一导电层、在支撑件的外表面上覆盖第三导电层，将第一导电层和第二导电结构连接，以组装形成包括摄像头模组和完整的屏蔽结构的屏蔽装置，一是可以缩短由于最后形成屏蔽罩的工序所增加的加工周期，二是可以减少由于最后形成屏蔽罩的工序带来的额外的加工误差，以增加摄像头模组的产品合格率。
第六方面，提供了一种屏蔽装置，所述屏蔽装置包括：镜头组件和基板，
所述镜头组件设置在所述基板的一侧，包括镜筒和镜头光学组件，所述镜筒与所述基板连接，所述镜筒呈筒状结构，所述镜筒包括贯穿所述镜筒的光通道且形成具有开口的两端，所述镜头光学组件设置在所述镜筒具有开口的一端以使光通过所述镜头光学组件进入所述光通道，所述镜筒的材料为不具有导电性能的材料且所述镜筒的外表面覆盖有第一导电层，所述镜筒的外表面包括所述镜筒的周向方向的侧面和垂直于第一方向且背离所述基板的顶面，所述镜筒的周向方向绕所述第一方向环绕，所述第一方向垂直于所述基板；
所述基板的外表面覆盖有第二导电层，所述第二导电层和所述第一导电层连接，所述基板的外表面包括所述基板的周向方向的侧面和垂直于所述第一方向且背离所述镜筒组件的底面，所述基板的底面外露有金属，所述基板的周向方向绕所述第一方向环绕。
因此，本申请提供的屏蔽装置，该屏蔽装置的摄像头模组包括连接的两部分，第一部 分包括镜筒，第二部分至少包括基板，第一部分的外表面覆盖有第一导电层，第二部分的外表面上覆盖有第二导电层，第一导电层和第二导电层连接，以形成包裹在摄像头模组外部的屏蔽结构，可以使得由第一导电层和第二导电层形成的屏蔽结构与基板实现电连接以实现屏蔽装置的接地，在摄像头模组的外部形成完备的法拉第笼，以实现屏蔽电磁信号的屏蔽效果。
此外，第一导电层与第二导电层连接并连接至基板的金属，第二导线层覆盖在基板的外表面，可以将基板的一字型结构的金属扩展为U型结构的金属结构，从而扩大基板的金属面积，增大散热面积，提高整个屏蔽装的散热效果。
并且，通过第二导电层与第一导电层之间的稳定连接，可以使得二者导电物质直接结合，无需其他导电连接措施，导电性能优异，接触电阻低。
可选地，所述第二导电层靠近所述第一导电层的第一端部被设置为台阶状结构，所述第一导电层靠近所述第二导电层的第一端部被设置为与所述台阶状结构配合的结构，所述第一导电层的第一端部与所述第二导电层的第一端部连接。
这种通过台阶状结构连接第一导电层和第二导电层的结构，可以增加第一导电层与第二导电层的接触面积，提升二者结合力，连接更可靠。
可选地，所述第二导电层的第一端部被设置为具有L字型的截面的台阶状结构，所述第一导电层的第一端部连接且容纳于所述第二导电层的第一端部。
可选地，所述基板的底面上设置有至少一个凹槽，所述第二导电层延伸至所述凹槽以填充所述凹槽。
可选地，所述屏蔽装置还包括设置在所述基板和所述镜筒之间的支撑件，所述第二导电层还覆盖在所述支撑件的周向方向的侧面上，所述支撑件的周向方向绕所述第一方向环绕。
可选地，所述屏蔽装置还包括设置在所述基板和所述镜筒之间的塑封件，所述第二导电层还覆盖在所述塑封件的周向方向的侧面上，所述塑封件的周向方向绕所述第一方向环绕。
第七方面，提供了一种电子设备，所述电子设备中包括天线和上述任一方面中任一种可能的实现方式中的屏蔽装置。
附图说明
图1是本申请提供的电子设备的示意性结构图。
图2是本申请提供的屏蔽装置的示意性结构图。
图3是本申请提供的屏蔽装置的示意性原理图。
图4是本申请提供的屏蔽装置的另一示意性结构图。
图5是本申请提供的屏蔽装置的另一示意性结构图。
图6是本申请提供的屏蔽装置的另一示意性结构图。
图7是本申请的屏蔽装置的另一示意性结构图。
图8是本申请的屏蔽装置的另一示意性结构图。
图9是本申请的屏蔽装置的另一示意性结构图。
图10是本申请的屏蔽装置的另一示意性结构图。
图11是本申请的屏蔽装置的另一示意性结构图。
图12是本申请的屏蔽装置的另一示意性结构图。
图13是本申请的屏蔽装置的另一示意性结构图。
图14是本申请的屏蔽装置的另一示意性结构图。
图15是本申请的屏蔽装置的另一示意性结构图。
图16是本申请的屏蔽装置的再一示意性结构图。
附图标记：
镜头光学组件211，镜筒212，光通道2121，支撑件220，滤光片230，基板240，塑封件250；
第一导电层261，第二导电层263，第三导电层262，第一导电结构264，第二导电结构265，镜筒和支撑件之间的导电结构266，支撑件和基板之间的导电结构267，支撑件和塑封件之间的导电结构268；
镜筒的侧面212-A，镜筒的顶面212-C，支撑件的侧面220-A，塑封件的侧面250-A，基板的底面240-B，基板的侧面241-A。
具体实施方式
下面将结合附图，对本申请中的技术方案进行描述。
在本申请中，除非另有明确的规定和限定，术语“连接”、“固定连接”以及“接触”等术语应做广义理解。对于本领域的普通技术人员而言，可以根据具体情况理解上述各种术语在本申请实施例中的具体含义。
示例性地，针对“连接”，可以是固定连接、转动连接、柔性连接、移动连接、一体成型、电连接等各种连接方式；可以是直接相连，或，可以是通过中间媒介间接相连，或，可以是两个元件内部的连通或两个元件的相互作用关系。
在本申请中，若无其他说明，连接一般表示的都是机械连接，若需要表示电连接，会特意指出。
示例性地，针对“固定连接”，可以是一个元件直接或间接固定连接在另一个元件上；固定连接可以包括机械连接、焊接以及粘接等方式，其中，机械连接可以包括铆接、螺栓连接、螺纹连接、键销连接、卡扣连接、锁扣连接、插接等方式，粘接可以包括粘合剂粘接以及溶剂粘接等方式。
示例性地，对于“接触”的解释，可以是一个元件与另一个元件直接接触或间接接触，此外，本申请实施例所描述的两个元件之间的接触，可以理解为在安装误差允许范围内的接触，可以存在由于安装误差原因造成的很小的间隙。
还应理解，本申请实施例描述的“平行”或“垂直”，可以理解为“近似平行”或“近似垂直”。
还应理解，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
需要说明的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。
还需说明的是，本申请实施例中以同一附图标记表示同一组成部分或同一零部件，对于本申请实施例中相同的零部件，图中可能仅以其中一个零件或部件为例标注了附图标记，应理解的是，对于其他相同的零件或部件，附图标记同样适用。
首先，对本申请实施例的附图的坐标系进行说明。x、y和z方向两两垂直，x方向可以理解为屏蔽装置的长度方向，y方向可以理解为屏蔽装置的宽度方向，z方向可以理解为屏蔽装置的高度方向，屏蔽装置的高度方向是屏蔽装置中各个部件堆叠的方向，即，屏蔽装置的各个部件沿着z方向堆叠。
本申请的屏蔽装置可以是具有摄像头模组的屏蔽装置，该屏蔽装置可以安装在各种电子设备中，电子设备可以是手机、智能手机(smart phone)、平板电脑、手提电脑、膝上型电脑(laptop computer)、摄像机、录像机、照相机、智能手表(smart watch)、智能手环(smart wristband)或其他形态的设备。本申请实施例对上述电子设备的具体形式不做特殊限制。以下为了方便说明和理解，以电子设备100为手机为例进行的说明。
图1示出了一种电子设备的示意结构图。如图1所示，电子设备100可以包括显示屏(display panel，DP)101、壳体102、屏蔽装置103以及天线(图中未示出)等。壳体102形成有容纳空间，显示屏101和屏蔽装置103设置于壳体102的容纳空间中。显示屏101可以为液晶显示(liquid crystal display，LCD)屏、有机发光二极管(organic light emitting diode，OLED)显示屏等，其中该OLED显示屏可以为柔性显示屏或硬质显示屏。
具有摄像头模组的屏蔽装置103可以只设置于电子设备100的正面，用于拍摄位于电子设备100正面一侧的景象，在一些实施例中可以将摄像头模组称之为前置摄像头；也可以只设置于电子设备100的背面，用于拍摄位于电子设备100背面一侧的景象，在一些实施例中也可以将摄像头模组称之为后置摄像头；还可以设置于电子设备100的正面和背面，如图1所示，电子设备100的正面设置有屏蔽装置103，电子设备100的背面也设置有屏蔽装置103，既可以拍摄到位于电子设备100正面一侧的景象，也可以拍摄到位于电子设备100背面一侧的景象，只要在拍摄时使用相应的屏蔽装置即可。
应理解，屏蔽装置103的安装位置仅仅是示意性的，屏幕装置103可以安装在电子设备100的任意可能的位置上，本申请不做任何限定。
本申请实施例对屏蔽装置103的设置个数不限定，可以是一个、两个、四个甚至更多。需要说明的是，本申请实施例中所述的电子设备100的正面可以理解为当用户使用电子设备100时，电子设备100面向用户的一侧表面，电子设备100的背面可以理解为当用户使用电子设备100时，电子设备100背向用户的一侧表面。
应理解，图1中示出的电子设备100并不限于包括以上器件，还可以包括其他器件，例如电池、闪光灯、指纹识别模组、听筒、按键、传感器等，本申请实施例仅以安装有屏蔽装置103的电子设备为例进行说明，但电子设备100上安装的元件并不限于此。
本申请提供了一种屏蔽装置，该屏蔽装置包括摄像头模组，通过在摄像头模组的部件的外表面覆盖导电层或采用具有导电性能的材料制作部件，分开组装各个部件，通过导电结构将各个部件连接，从而形成较为完备的法拉第笼，以实现屏蔽电磁信号的屏蔽效果。 此外，由于不需要在整个摄像头模组外设置屏蔽罩，可以有效地减少屏蔽装置的尺寸，不影响原有结构外观。并且，上述结构通过分块组装方式形成，一是可以缩短由于最后形成屏蔽罩的工序所增加的加工周期，二是可以减少由于最后形成屏蔽罩的工序带来的额外的加工误差，以增加摄像头模组的产品合格率。
此外，本申请还提供了另一种屏蔽装置，该屏蔽装置的摄像头模组包括连接的两部分，第一部分的外表面覆盖有第一导电层，第二部分的外表面上覆盖有第二导电层，第一导电层和第二导电层连接，以形成包裹在摄像头模组外部的屏蔽结构，形成完备的法拉第笼，以实现屏蔽电磁信号的屏蔽效果。
需要强调的是，本申请所说的部件上覆盖有导电层的结构中，导线层和部件之间基本紧密贴合，无间隙，可以采用例如喷涂、溅射、转印或激光直接成型技术(laser direct structuring，LDS)等技术在部件上形成导电层。
以下，结合图2至图16，对本申请的屏蔽装置做详细说明。
需要说明的是，本申请所说的部件的上表面和下表面表示的是：以基板作为参考物，上表面和下表面都近似平行于基板，部件中靠近基板的表面可以理解为下表面，部件中远离基板的表面可以理解为上表面。本申请所说的筒状结构可以是具有规则形状的结构，例如，筒状结构为圆柱体或圆环柱体等，筒状结构也可以是具有不规则形状的结构，本申请实施例不做任何限定。
还需要说明的是，本申请所说的两个之间的连接，可以是直接连接，或，可以是通过中间媒介间接相连。例如，第一导电层和第二导电层(或，第一导电结构)之间的连接可以是两者直接接触实现连接，或者，第一导电层和第二导电层之间(或，第一导电结构)的连接可以通过导电材料或导电结构连接。
图2所示为本申请提供的屏蔽装置的示意性结构图。参考图2，屏蔽装置200包括摄像头模组以及在摄像头模组上通过导电材料形成的屏蔽结构，其中，摄像头模组可以包括沿着z方向从上至下依次设置的镜头组件、支撑件220、基板240以及由支撑件220围合的滤光片230，屏蔽结构可以包括第一导电层261、第三导电层262、导电结构266和导电结构267。
镜头组件包括镜头光学组件211和镜筒212，镜筒212呈筒状结构，镜筒212包括贯穿镜筒212的光通道2121且形成具有开口的两端，镜头光学组件211设置在镜筒212具有开口的一端(记为第一端)以使光通过镜头光学组件211进入光通道2121。支撑件220和滤光片230设置在镜筒212具有开口的另一端(记为第二端)，支撑件220呈筒状结构，支撑件220围合且连接滤光片230，滤光片230和光通道2121相对设置以使光通过光通道2121进入滤光片230。基板240设置在支撑件220远离镜头组件的一端，基板240上设置有接地焊盘等具有导电性能的结构，基板240上连接有印刷电路板(printed circuit board，PCB)、柔性电路板(flexible printed circuit，FPC)、各种无源器件(例如，电容、电阻和电感等)及各种芯片201(例如，传感器芯片)等元件。
镜筒212的材料是不具有导电性能的材料，并且，镜筒212的外表面覆盖有第一导电层261。示例性地，该不具有导电性能的材料可以是聚碳酸酯(polycarbonate，PC)、聚酰胺(polyamide，PA)等塑料。示例性地，可以采用以下任一种方式在镜筒212的外表面形成一层导电层：喷涂、溅射、转印或激光直接成型技术(laser direct structuring，LDS)。 示例性地，第一导电层261可以是金属、金属化物、碳基化物等具有导电性能的材料。支撑件220的材料也是不具有导电性能的材料，并且，支撑件220的外表面覆盖有第三导电层262，关于该支撑件220的材料和覆盖在支撑件220的外表面的导电层262可以与镜筒212的相关内容类似，此处不再赘述。
镜筒212和支撑件220之间通过导电结构266连接，支撑件220和基板240之间通过导电结构267连接，以实现镜筒、支撑件和基板之间的电连接。导电结构266或导电结构267的材料可以是导电胶、金属、金属化物、碳基化物等具有导电性能的材料，可以采用焊接、粘接以及铆接等各种可能的连接的方式通过导电结构两个部件连接。
例如，导电结构266可以是由导电胶形成的结构，镜筒212的下表面和支撑件220的上表面分别与导电结构266粘贴。再例如，导电结构267也可以是由导电胶形成的结构，支撑件220的下表面和基板240的上表面分别与导电结构267粘贴。
可选地，第一导电层261可以从镜筒212的外表面朝着镜筒212与支撑件220相对的下表面延伸一部分，第三导电层262可以从支撑件220的外表面朝着支撑件220与镜筒212相对的上表面延伸一部分，导电结构266分别与第一导电层261覆盖在镜筒212的下表面的部分和第三导电层262覆盖在支撑件220的上表面的部分接合，实现镜筒212和支撑件220之间的连接，实现镜筒212和支撑件220之间的电连接。同理，第三导电层262可以从支撑件220的外表面朝着支撑件220与基板240相对的下表面延伸一部分，将第三导电层262覆盖在支撑件220的下表面的部分与导电结构267接合，实现基板240和支撑件220之间的连接，实现支撑件220和基板240之间的电连接。这样，在分块组装屏蔽装置后可以形成完备的法拉第笼，实现更好的屏蔽作用。
在上述屏蔽装置中，镜筒的外表面上覆盖有第一导电层，支撑件的外表面上覆盖有第三导电层，第三导电层的两端分别与第一导电层和基板外露的金属连接，以实现镜筒、支撑件和基板之间的电连接，以在摄像头模组上形成较为完备的法拉第笼，将摄像头模组组装为一种新的屏蔽电磁信号的屏蔽装置。
下面，结合图3，对本申请的屏蔽装置的屏蔽原理做简单说明，各个附图对应的屏蔽装置的屏蔽原理都与图3所示的屏蔽原理相同，后续不再赘述。参考图3，如实线所示，当天线300产生电磁波信号时，电磁场在屏蔽装置的外表面感应出电荷，电磁场变化时，感应电荷通过导电层、导电结构和基板流动至基板地，避免屏蔽装置200内的芯片201受到受扰；同理，如虚线所示，当屏蔽装置200内的芯片201自身产生电磁波时，电磁波在屏蔽装置内侧产生感应电荷，在电磁波变化时，感应电荷通过导电层、导电结构、基板流动至基板地，避免敏感设备如手机接收天线受扰。
此外，本申请的屏蔽装置的镜筒上覆盖有第一导电层以及支撑件上覆盖有第三导电层，可以不需要在整个摄像头模组外设置一个较大的可以容纳摄像头模组的屏蔽罩，可以有效地减少屏蔽装置的尺寸，不影响原有结构外观。而且，相比于现有技术的在组装完摄像头模组后再形成屏蔽罩的方案，本申请的屏蔽装置可以分块组装，在摄像头模组的镜筒的外表面上覆盖第一导电层、在支撑件的外表面上覆盖第三导电层，将第一导电层和第二导电结构连接，以组装形成包括摄像头模组和完整的屏蔽结构的屏蔽装置，一是可以缩短由于最后形成屏蔽罩的工序所增加的加工周期，二是可以减少由于最后形成屏蔽罩的工序带来的额外的加工误差，以增加摄像头模组的产品合格率。
应理解，上述镜筒212以及支撑件220的外表面覆盖有导电层以实现屏蔽作用的结构仅为示意性说明，不应对本申请构成限定。示例性地，镜筒212和支撑件220的材料也可以是具有导电性能的复合材料，可以在塑料中填充导电材料，以形成导电塑料，在该结构中，镜筒和支撑件本身就可以作为屏蔽结构的一部分，通过导电结构266实现支撑件220和镜筒212之间的连接，通过导电结构267实现支撑件220与基板267的连接。可选地，填充在镜筒和支撑件中的导电材料可以是不锈钢纤维、镍纤维、碳纤维、碳纳米管中的任一种。
图2所示的结构是在镜筒和支撑件的外表面覆盖有导电层，通过导电结构实现各部件之间的连接。在一些实施例中，可以不需要在支撑件的外表面上覆盖有导电层，可以在支撑件中填充导电结构，通过该导电结构分别与镜筒和基板连接，从而形成较为完整的法拉第笼，实现屏蔽装置的屏蔽作用。以下，结合图4至图7，对在支撑件中填充导电结构的屏蔽装置做说明，此外，将在支撑件中填充的导电结构记为第一导电结构。
图4所示为本申请提供的屏蔽装置的另一示意性结构图。图4中的(a)所示为屏蔽装置在xz平面的截面图，图4中的(b)所示为支撑件在yz平面的示意性结构图。
参考图4，屏蔽装置200包括摄像头模组和屏蔽结构，摄像头模组包括沿着z方向从上至下依次设置的镜头组件、支撑件220、基板240和由支撑件220围合的滤光片230，屏蔽结构包括第一导电层261和至少一个第一导电结构264。
参考图4中的(a)，镜头组件包括镜头光学组件211和镜筒212，镜筒212呈筒状结构，镜筒212包括贯穿镜筒212的光通道2121且形成具有开口的两端，镜头光学组件211设置在镜筒212具有开口的第一端以使光通过镜头光学组件211进入光通道2121。支撑件220和滤光片230设置在镜筒212具有开口的第二端，支撑件220呈筒状结构，支撑件220围合且连接滤光片230，滤光片230和光通道2121相对设置以使光通过光通道2121进入滤光片230。基板240设置在支撑件220远离镜头组件的一端，基板240上连接有PCB、FPC、各种无源器件(例如，电容、电阻和电感等)及各种芯片201(例如，传感器芯片)等元件。
参考图4中的(a)，镜筒212的材料可以是不具有导电性能的材料，并且，镜筒212的外表面覆盖有第一导电层261，关于到导电层的具体描述可以参考图2的相关描述，不再赘述。参考图4中的(b)，支撑件220的材料也可以是不具有导电性能的材料，并且，支撑件220的边缘设置有至少一个第一通孔221，第一通孔221是开口孔，第一通孔221上内填充有第一导电结构264。第一导电结构264的材料可以是导电胶、金属、金属化物、碳基化物等具有导电作用的材料，第一导电结构264的第一端部与第一导电层261连接，第一导电结构264的第二端部与基板240外露的金属连接，例如，金属可以是铜。这样，可以实现第一导电层261、第一导电结构264和基板240之间的电连接以实现屏蔽装置接地，在摄像头模组上形成完备的拉法第笼，实现屏蔽效果。
在本申请中，可以采用焊接、粘接以及铆接等各种可能的连接的方式将第一导电结构264分别与第一导电层261和基板240外露的金属连接。
示例性地，第一导电结构264的第二端部可以延伸至基板240的接地焊盘，与接地焊盘通过焊接方式连接起来。
示例性地，第一导电层261可以从镜筒212的外表面朝着镜筒212与支撑件220相对 的底面延伸一部分，以将第一导电结构264的第一端部与第一导电层261覆盖在镜筒212的底面的部分接合，以实现第一导电层261与第一导电结构264的连接。为了使得第一导电层261和第一导电结构264之间实现更好的连接，可选地，第一导电结构264的第一端部和第一导电层261可以通过导电胶(图中未示出)连接。
在上述屏蔽结构中，镜筒的外表面上覆盖有导电层以及支撑件中填充有第一导电结构，使得镜筒和支撑件本身具有了屏蔽功能，而且，第一导电结构的两个端部分别与基板和第一导电层连接，可以实现第一导电层、第一导电结构和基板之间的电连接，实现屏蔽装置的接地，在摄像头模组上形成完备的拉法第笼，实现屏蔽效果。
应理解，上述镜筒的外表面覆盖有导电层以实现屏蔽作用的结构仅为示意性说明，不应对本申请构成限定。示例性地，镜筒的材料也可以是具有导电性能的复合材料，可以在塑料中填充导电材料，以形成导电塑料，镜筒和第一导电结构之间连接，在该结构中，镜筒本身就可以作为屏蔽结构的一部分，可以实现镜筒、第一导电结构和基板之间的电连接，实现屏蔽装置接地，在摄像头模组上形成完备的拉法第笼，实现屏蔽效果。可选地，填充在镜筒的导电材料可以是不锈钢纤维、镍纤维、碳纤维、碳纳米管中的任一种。
图5所示为本申请提供的屏蔽装置的另一示意性结构图。图5中的(a)所示为屏蔽装置在xz平面的截面图，图5中的(b)所示为支撑件在yz平面的示意性截面图。
图5所示的结构与图4所示的结构的区别在于，多个第一通孔221可以设置在支撑件220的内部，是完整的孔洞，或者，一部分第一通孔221可以是完整的孔洞，另一部分第一通孔221可以设置在支撑件220的边缘，形成开口孔，第一通孔221的形状可以是不限于圆形的各种形状。第一导电结构264填充在该第一通孔221中，第一导电结构264的两端分别与镜筒212和基板240连接，连接方式的具体描述可以参考图4对应的实施例的相关描述，不再赘述。
应理解，上述镜筒的外表面覆盖有导电层以实现屏蔽作用的结构仅为示意性说明，不应对本申请构成限定。示例性地，镜筒的材料也可以是具有导电性能的复合材料，可以在塑料中填充导电材料，以形成导电塑料，镜筒和第一导电结构之间连接，在该结构中，镜筒本身就可以作为屏蔽结构的一部分，可以实现镜筒、第一导电结构和基板之间的电连接，实现屏蔽装置接地，在摄像头模组上形成完备的拉法第笼，实现屏蔽效果。可选地，填充在镜筒的导电材料可以是不锈钢纤维、镍纤维、碳纤维、碳纳米管中的任一种。
图6所示为本申请提供的屏蔽装置的另一示意性结构图。图6中的(a)所示为屏蔽装置在xz平面的截面图，图6中的(b)所示为支撑件在yz平面的示意性截面图，图6中的(c)所示为支撑件在yz平面的局部区域的示意性结构图。
图6所示的结构与图4所示的结构的区别在于，支撑件220中设置有一个不仅沿着z方向贯穿支撑件220的第一通孔221，而且，第一通孔221沿着支撑件220的周向方向环绕一周，第一通孔221中填充有第一导电结构264。第一导电结构264的可以由主体2641和两个端部(记为第一端部2642和第二端部2643)构成，可选地，主体2641、第一端部2642和第二端部2643可以一体成型，也可以是分块组装，本申请不做任何限定。主体2641内埋在第一通孔221，两个端部位于支撑件220的上表面和下表面，分别与第一导电层261和基板240外露的金属连接，连接方式的具体描述可以参考图4对应的实施例的相关描述，不再赘述。
可选地，第一端部2642或第二端部2643中的任一个端部可以由多个外凸结构264-A形成，多个外凸结构264-A的形状可以相同，也可以不同，第一端部2642或第二端部2643可以是各种形状的外凸结构264-A的组合。参考图6中的(c)，外凸结构264-A可以是例如方形、菱形、圆形、三角形中的任一种形状，第一端部2642或第二端部2643可以是上述几种形状的任意组合。
应理解，上述镜筒的外表面覆盖有导电层以实现屏蔽作用的结构仅为示意性说明，不应对本申请构成限定。示例性地，镜筒的材料也可以是具有导电性能的复合材料，可以在塑料中填充导电材料，以形成导电塑料，镜筒和第一导电结构之间连接，在该结构中，镜筒本身就可以作为屏蔽结构的一部分，实现镜筒、第一导电结构和基板之间的电连接，实现屏蔽装置接地，在摄像头模组上形成完备的拉法第笼，实现屏蔽效果。可选地，填充在镜筒的导电材料可以是不锈钢纤维、镍纤维、碳纤维、碳纳米管中的任一种。
在上述屏蔽装置中，镜筒的外表面上覆盖有第一导电层以及支撑件中填充有第一导电结构，使得镜筒和支撑件本身具有了屏蔽功能，而且，通过第一导电结构实现了镜筒、支撑件和基板之间的连接，以通过第一导电层、第一导电结构和基板之间的电连接实现镜筒、支撑件和基板之间的电连接，实现屏蔽装置的接地，在摄像头模组上形成完备的拉法第笼，将摄像头模组组装为一种新的屏蔽电磁信号的屏蔽装置，实现较好的屏蔽效果。
此外，本申请的屏蔽装置的镜筒上覆盖有第一导电层以及支撑件中填充有第一导电结构，可以不需要在整个摄像头模组外设置一个较大的可以容纳摄像头模组的屏蔽罩，可以有效地减少屏蔽装置的尺寸，不影响原有结构外观。
而且，相比于现有技术的在组装完摄像头模组后再形成屏蔽罩的方案，本申请的屏蔽装置可以分块组装，在摄像头模组的镜筒的外表面上覆盖第一导电层，在支撑件中填充第一导电结构，将第一导电结构和第一导电层连接，以组装形成包括摄像头模组和完整的屏蔽结构的屏蔽装置，一是可以缩短由于最后形成屏蔽罩的工序所增加的加工周期，二是可以减少由于最后形成屏蔽罩的工序带来的额外的加工误差，以增加摄像头模组的产品合格率。
图7所示为本申请的屏蔽装置的另一示意性结构图。图7所示的结构与图2至图6所示的结构的区别在于，该屏蔽装置还包括设置在基板240和支撑件220之间的塑封件250，塑封件250中塑封有焊线(wire bond)和无源器件等元件，塑封件250通过塑封方式固定在基板240上，塑封件250和支撑件220之间可以通过胶水268粘贴以实现连接。第一导电结构264填充在支撑件220和塑封件250中，或者说，第一导电结构264贯穿支撑件220和塑封件250，第一导电结构264的第一端部与第一导电层261连接，第一导电结构264的第二端部和基板240外露的金属连接，连接方式的具体描述可以参考图4对应的实施例的相关描述，不再赘述。
组装过程中，可以通过激光钻孔方式将支撑件220、胶水268以及塑封件250一起贯穿到基板240的接地焊盘以形成通孔，将导电材料填充在该通孔中以形成第一导电结构264。此外，在开模注塑形成支撑件240时可以预留一些通孔(如图5中的(b)所示)，从而减少激光穿透的层数，该通孔可以是完整孔，也可以是在支撑件240的边缘设置的开口孔。
应理解，上述镜筒的外表面覆盖有导电层以实现屏蔽作用的结构仅为示意性说明，不 应对本申请构成限定。示例性地，镜筒的材料也可以是具有导电性能的复合材料，可以在塑料中填充导电材料，以形成导电塑料，镜筒和第一导电结构之间连接，在该结构中，镜筒本身就可以作为屏蔽结构的一部分，实现镜筒、第一导电结构和基板之间的电连接，实现屏蔽装置接地，在摄像头模组上形成完备的拉法第笼，实现屏蔽效果。可选地，填充在镜筒的导电材料可以是不锈钢纤维、镍纤维、碳纤维、碳纳米管中的任一种。
在上述屏蔽装置中，镜筒的外表面上覆盖有第一导电层以及支撑件和塑封件中填充有第一导电结构，使得镜筒、支撑件和塑封件本身具有了屏蔽功能，而且，通过第一导电结构实现了镜筒、支撑件、塑封件和基板之间的连接，以通过第一导电层和第一导电结构实现镜筒、支撑件、塑封件和基板之间的电连接，实现屏蔽装置的接地，在摄像头模组上形成完备的拉法第笼，将摄像头模组组装为一种新的屏蔽电磁信号的屏蔽装置，实现较好的屏蔽效果。此外，由于不需要在整个摄像头模组外设置屏蔽罩，可以有效地减少屏蔽装置的尺寸，不影响原有结构外观。而且，相比于现有技术的在组装完摄像头模组后再形成屏蔽罩的方案，本申请的屏蔽装置可以分块组装，通过在摄像头模组的镜筒的外表面上覆盖有导电层形成一部分屏蔽结构后再通过第一导电结构进行组装形成包括摄像头模组和完整的屏蔽结构的屏蔽装置，一是可以缩短由于最后形成屏蔽罩的工序所增加的加工周期，二是可以减少由于最后形成屏蔽罩的工序带来的额外的加工误差，以增加摄像头模组的产品合格率。
以上，图4至图7所示的实施例中，都需要在支撑件中填充第一导电结构，可以是仅在支撑件中填充第一导电结构，也可以是在支撑件和塑封件中填充第一导电结构。以下，结合图8至图12，对屏蔽装置中包括塑封件的结构中在塑封件中填充导电结构的屏蔽装置做说明，此外，为了便于区别，将在塑封件中填充的导电结构记为第二导电结构。
图8所示为本申请提供的屏蔽装置的另一示意性结构图。参考图8，屏蔽装置包括摄像头模组和屏蔽结构，摄像头模组包括沿着z方向从上至下依次设置的镜头组件、支撑件220、塑封件250、基板240和由支撑件220围合的滤光片230，屏蔽结构包括第一导电层261、第三导电层262和至少一个第二导电结构265。
关于镜筒组件、支撑件220、滤光片230和基板240的具体描述可以参考图4对应的实施例的相关描述，不再赘述。塑封件250中塑封有焊线(wire bond)和无源器件等元件，塑封件250通过塑封方式固定在基板240上。
镜筒212的材料可以是不具有导电性能的材料，并且，镜筒212的外表面覆盖有第一导电层261，支撑件220的材料也可以是不具有导电性能的材料，并且，支撑件220的外表面覆盖有第三导电层262，关于第一导电层261和第三导电层262的具体描述可以参考图2对应的实施例的相关描述，不再赘述。镜筒212和支撑件220之间可以通过导电结构266连接，连接方式的具体描述可以参考图2对应的实施例的相关描述，不再赘述。第二导电结构265填充在塑封件250中，或者说，塑封件250中塑封有贯穿塑封件250的第二导电结构265，第二导电结构265的第一端部与第三导电层262连接，第二导电结构265的第二端部与基板240外露的金属连接，通过第一导电层261、第三导电层262和第二导电结构265实现镜筒212、支撑件220、塑封件250和基板240之间的电连接，以在摄像头模组上实现较为完备的法拉第笼，实现屏蔽效果。
在该实施例中，可以采用焊接、粘接以及铆接等各种可能的连接的方式将第二导电结 构265分别与支撑件220和基板240连接。
示例性地，第二导电结构265的第二端部可以延伸至基板240的接地焊盘，与接地焊盘通过焊接方式连接起来。
示例性地，第三导电层262可以从支撑件220的外表面朝着支撑件220与塑封件250相对的底面延伸一部分，将第三导电层262覆盖在支撑件220的底面的部分与第二导电结构265的第一端部接合，以实现第三导电层262和第二导电结构265的连接。为了使得第三导电层262和第二导电结构265之间实现较好的连接，可选地，第二导电结构265的第一端可以通过由导电胶形成的导电结构268连接，即，将导电结构268粘贴在第三导电层262和支撑件220的下表面上。
示例性地，第二导电结构265的材料可以是导电胶、金属、金属化物、碳基化物等具有导电性能的材料，本申请不作任何限定。例如，在图8中，第二导电结构265可以是由金属制成的金属弹片。再例如，第二导电结构265也可以是由导电胶形成的结构。
图9所示为本申请提供的屏蔽装置的另一示意性结构图。图9所示的结构与图8所示的结构的区别在于，镜筒212和支撑件220的材料是具有导电性能的复合材料，可以在塑料中填充导电材料，以形成导电塑料，可选地，填充在镜筒和支撑件中的导电材料可以是不锈钢纤维、镍纤维、碳纤维、碳纳米管中的任一种。在该结构中，镜筒212和支撑件220本身就可以作为屏蔽结构的一部分，支撑件220和镜筒212可以通过导电结构266连接，支撑件220和第二导电结构265可以通过导电结构268连接，以实现镜筒、支撑件、塑封件和基板之间的电连接。
示例性地，导电结构266或导电结构268的材料可以是导电胶、金属、金属化物、碳基化物等具有导电性能的材料，可以采用焊接、粘接以及铆接等各种可能的连接的方式通过导电结构将两个部件连接。
图10所示为本申请提供的屏蔽装置的另一示意性结构图。参考图10，屏蔽装置200包括摄像头模组和屏蔽结构，其中，摄像头模组包括镜头组件、支撑件、滤光片、塑封件、基板和至少一个第二导电结构，屏蔽结构可以包括第一导电层261和第二导电结构265。图10和图11所示的结构与图8和图9所示的结构的区别在于，该屏蔽装置200的镜筒212围合支撑件220和滤光片230。
镜头组件包括镜筒212和镜头光学组件211，镜筒212呈筒状结构，镜筒212包括贯穿镜筒212的光通道2121且形成具有开口的两端，镜头光学组件211设置在镜筒212具有开口的一端(记为第一端)以使光通过镜头光学组件211进入光通道2121。镜筒212具有开口的第二端的周边边缘在朝着靠近塑封件的方向形成凸起的凸起边缘2122，以在镜筒212的第二端的中间区域形成被凸起边缘2122包围的凹陷区域。支撑件220和滤光片230容纳于该凹陷区域以通过凸起边缘2122围合支撑件220和滤光片230，支撑件220呈筒状结构，支撑件220围合且固定滤光片230，滤光片230和光通道2121相对设置以使光通过光通道2121进入滤光片230。塑封件250设置在镜筒212和基板240之间，塑封件250中塑封有焊线和无源器件等元件，塑封件250通过塑封方式固定在基板240上。基板240上设置有接地焊盘等具有导电性能的部件，基板240上固定连接有PCB、FPC、各种无源器件(例如，电容、电阻和电感等)及各种芯片201(例如，传感器芯片)等元件。
镜筒212的材料可以是不具有导电性能的材料，并且，镜筒212的外表面覆盖有第一导电层261，由于支撑件220被围合在镜筒212的凸起边缘2122内，所以，不需要对支撑件220做任何处理，通过镜筒212上的第一导电层261就可以实现屏蔽效果。第二导电结构265填充在塑封件250中，或者说，塑封件250中塑封有贯穿塑封件250的第二导电结构265，第二导电结构265的第一端部与第一导电层261连接，第二导电结构265的第二端部与基板外露的金属连接，通过第一导电层261和第二导电结构265实现镜筒212、塑封件250和基板240之间的电连接，以在摄像头模组上实现较为完备的法拉第笼，实现屏蔽效果。
在该实施例中，可以采用焊接、粘接以及铆接等各种可能的连接的方式将第二导电结构265分别与镜筒212的凸起边缘2122和基板240连接。
示例性地，第二导电结构265的一端可以延伸至基板240的接地焊盘，与接地焊盘通过焊接方式连接起来。
示例性地，第一导电层261可以从镜筒212的外表面朝着凸起边缘2122与塑封件250相对的下表面延伸一部分，将第一导电层261覆盖在凸起边缘2122的下表面的部分与第二导电结构265接合，实现第一导电层261和第二导电结构265接合的连接。为了使得第一导电层261和第二导电结构265之间实现更好的连接，可选地，第二导电结构265的第一端部可以通过由导电胶形成的导电结构269粘贴在第一导电层261和镜筒212的凸起边缘2122的下表面上。
示例性地，第二导电结构265的材料可以是导电胶、金属、金属化物、碳基化物等具有导电性能的材料，本申请不作任何限定。例如，在图10中，第二导电结构265可以是由导电胶形成的结构。
参考图11，图11与图10的区别在于，在图11中，第二导电结构265可以是由金属制成的金属弹片。
参考图12，图12与图10的区别在于，在图12中，第二导电结构265可以是由金属制成的接地金线。示例性地，参考图12，在基板240上形成塑封件之前，为了避免激光烧孔，在基板240上塑封元件之前，在基板240的接地焊盘上设置接地金线，例如，参考图12中的(b)，可以将接地金线焊接在相邻两个接地焊盘上，形成在基板240上环绕一周的接地金线，塑封形成塑封件后再采用激光或者刀切方式去掉一层，将接地金线漏出来，将接地金线的一端与第一导电层261连接，可选地，可以通过由导电胶形成的导电结构269将接地金线与第一导电层261粘贴。
在上述屏蔽装置中，镜筒围合且固定支撑件，镜筒上覆盖有第一导电层以及塑封件中填充有第二导电结构，使得镜筒、塑封件本身具有了屏蔽功能，而且，通过第二导电结构实现了镜筒、塑封件和基板之间的连接，以通过第一导电层和第二导电结构实现镜筒、支撑件、塑封件和基板之间的电连接，实现屏蔽装置的接地，在摄像头模组上形成完备的法拉第笼，将摄像头模组组装为一种新的屏蔽电磁信号的屏蔽装置，实现较好的屏蔽效果。
此外，本申请的屏蔽装置的镜筒上覆盖有第一导电层以及塑封件中填充有第二导电结构，可以不需要在整个摄像头模组外设置一个较大的可以容纳摄像头模组的屏蔽罩，可以有效地减少屏蔽装置的尺寸，不影响原有结构外观。
而且，相比于现有技术的在组装完摄像头模组后再形成屏蔽罩的方案，本申请的屏蔽 装置可以分块组装，在摄像头模组的镜筒的外表面上覆盖第一导电层、在塑封件中填充第二导电结构，将第一导电层和第二导电结构连接，以组装形成包括摄像头模组和完整的屏蔽结构的屏蔽装置，一是可以缩短由于最后形成屏蔽罩的工序所增加的加工周期，二是可以减少由于最后形成屏蔽罩的工序带来的额外的加工误差，以增加摄像头模组的产品合格率。
以下，结合图13至图16，对本申请提供的另一屏蔽装置做说明。
应理解，下文描述的镜筒的周向方向、塑封件250的周向方向以及基板240的周向方向都是绕z方向环绕的方向，z方向垂直于基板的表面。
在图13至图16的结构中，摄像头模组可以包括连接的两部分，第一部分包括镜筒，第二部分至少包括基板，第一部分的外表面覆盖有第一导电层，第二部分的外表面上覆盖有第二导电层，第一导电层和第二导电层连接，形成包裹在摄像头模组外部的屏蔽结构。
图13所示为本申请提供的屏蔽装置的另一示意性结构图。参考图13中的(a)所示为屏蔽装置在xz平面的截面图，图13中的(b)所示为屏蔽装置的局部区域的示意性截面图。
参考图13，屏蔽装置200包括摄像头模组和屏蔽结构。摄像头模组包括沿着z方向从上至下依次设置的镜头组件、塑封件250和基板240，屏蔽结构包括第一导电层261和第二导电层263。
镜头组件包括镜头光学组件211和镜筒212，镜筒212呈筒状结构，镜筒212包括贯穿镜筒212的光通道2121且形成具有开口的两端，镜头光学组件211设置在镜筒212具有开口的第一端以使光通过镜头光学组件211进入光通道2121。基板240上固定有塑封在基板240上的塑封件250，塑封件250中塑封有焊线(wire bond)和无源器件等元件，塑封件250和镜筒212之间可以通过胶水粘贴以实现连接，基板240上还可以固定各种芯片201(例如，传感器芯片)。
在该结构中，镜筒212作为第一部分，塑封件250和基板240作为与镜筒212连接的第二部分，第一导电层261覆盖在镜筒212的外表面，第二导电层263覆盖在基板240和塑封件250形成的第二部分的外表面，第一导电层261和第二导电层263连接，可以实现两个导电层之间的电连接。其中，镜筒212的外表面包括镜筒的周向方向的侧面212-A和垂直于z方向的背离基板240的顶面212-C，塑封件250的外表面包括塑封件的周向方向的侧面250-A，基板240的外表面包括基板240的周向方向的侧面240-A和垂直于z方向的背离镜筒212的底面240-B，基板240的底面240-B外露有例如铜的金属，第二导电层263覆盖在基板240的底面240-B和金属连接，使得由第一导电层261和第二导电层263形成的屏蔽结构与基板240可以实现电连接以实现屏蔽装置的接地，在摄像头模组的外部形成完备法拉第笼，实现屏蔽效果。
参考图13中的(b)，第二导电层263朝第一导电层261的第一端部261-A延伸，形成第二导电层263的第一端部263-A，第二导电层263的第一端部263-A与第一导电层261的第一端部261-A接合以实现两个导电层之间的连接，其中，第一导电层261的第一端部261-A是靠近第二导电层263的端部，第二导电层263的第一端部263-A是靠近第一导电层261的端部。示例性地，第二导电层263的第一端部263-A被设置为台阶状结构，第一导电层261的第一端部261-A被设置为与该台阶状结构配合的结构，两个导电层的端部接 合以连接。例如，该台阶状结构的第一端部263-A可以是具有L字型的截面的结构，该台阶状结构的第一端部263-A容纳第一导电层261的第一端部261-A且固定连接。示例性地，第一导电层263的第一端部263-A与第二导电层261的第一端部261-A可以通过焊接、铆接或导电胶等连接。
这种通过台阶状结构连接第一导电层和第二导电层的结构，可以增加第一导电层与第二导电层的接触面积，提升二者结合力，连接更可靠。
示例性地，可以采用以下任一种方式在镜筒212的外表面形成第一导电层261：喷涂、溅射、转印或激光直接成型技术(laser direct structuring，LDS)。示例性地，第一导电层261可以是金属、金属化物、碳基化物等具有导电性能的材料。同理，第二导电层263的形成方式以及材料与第一导电层261类似，不再赘述。
组装过程中，将覆盖有第一导电层的镜筒和固定有塑封件的基板组装，在组装后的结构中除镜筒以外的部件(塑封件和基板)的外表面上覆盖第二导电层，将第二导电层与第一导电层连接，以在摄像头模组的外部形成一个基本紧贴摄像头模组的屏蔽结构，通过该屏蔽结构实现屏蔽效果。
图14所示为本申请提供的屏蔽装置的另一示意性结构图。与图13的区别在于，图14的基板240上设置有至少一个凹槽241，凹槽241中外露有例如铜的金属，第二导电层263延伸至凹槽241填充凹槽241以和金属连接，在该结构中，凹槽241的表面作为基板240的底面240-B的一部分，第二导电层263覆盖在基板240的包括凹槽241的表面的底面240-B，在基板240的底面240-B上形成覆盖在其上的具有凸起结构的第二导电层263，使得由第一导电层261和第二导电层263形成的屏蔽结构与基板240实现电连接以实现屏蔽装置的接地，在摄像头模组的外部形成完备法拉第笼，实现屏蔽效果。
图15所示为本申请提供的屏蔽装置的另一示意性结构图。与14的区别在于，图14的摄像头模组中还包括设置在塑封件250和镜筒212之间的支撑件220和滤光片230，支撑件呈筒状结构，支撑件220围合且连接滤光片230。在该结构中，镜筒212作为第一部分，第一导电层261覆盖在镜筒212的外表面，支撑件220、塑封件250和基板240作为与镜筒212连接的第二部分，支撑件220、塑封件250和基板240形成的第二部分的外表面，第一导电层261和第二导电层263连接，可以实现两个导电层之间的电连接。其中，支撑件220的外表面包括支撑件220的周向方向的侧面220-A，镜筒212的外表面、塑封件250的外表面和基板240的外表面的具体描述与对应图13和14的实施例的相关描述相同，不再赘述。这样，通过由第一导电层261和第二导电层263形成的屏蔽结构与基板240实现电连接以实现屏蔽装置的接地，在摄像头模组的外部形成完备法拉第笼，实现屏蔽效果。
关于第一导电层261和第二导电层263之间的连接、第一导电层261覆盖在镜筒261的外表面以及第二导电层263覆盖在第二部分的外表面上的具体描述可以参考图13和图14的相关描述，不再赘述。
应理解，上述结构仅为示意性说明，例如，在图14所示的结构包括支撑件的摄像头模组中，也可以将摄像头模组分为三部分，镜筒作为第一部分，基板作为第三部分，支撑件作为第二部分，镜筒的外表面上覆盖有第一导电层，支撑件的外表面上覆盖有第三导电层、基板的外表面上覆盖有第二导电层，第一导电层和第三导电层可以通过导电胶等连接， 第二导电层和第三导电层之间的连接可以和图13所示的连接的方式相同。
图16所示为本申请提供的屏蔽装置的另一示意性结构图。该屏蔽装置的摄像头模组包括镜头组件和基板，镜头组件包括镜头光学组件211和镜筒212，基板240上可以固定各种芯片201(例如，传感器芯片)和无源器件等，镜筒212具有开口的第二端的周边边缘在朝着靠近基板240的方向形成凸起的凸起边缘2122，以在镜筒212的第二端的中间区域形成被凸起边缘2122包围的凹陷区域，基板240上的各个元件可以容纳于该凹陷区域，镜筒212的凸起边缘2122与基板240之间可以通过胶水等粘性材料粘贴。在该结构中，镜筒212作为第一部分，基板240作为与镜筒连接第二部分，第一导电层261覆盖在镜筒212的外表面，第二导电层263覆盖在基板240的外表面，可以实现两个导电层之间的电连接。其中，镜筒212的外表面和基板240的外表面的具体描述与对应图13和14的实施例的相关描述相同，不再赘述。这样，通过由第一导电层261和第二导电层263形成的屏蔽结构与基板240实现电连接以实现屏蔽装置的接地，在摄像头模组的外部形成完备法拉第笼，实现屏蔽效果。
在上述屏蔽装置中，该屏蔽装置的摄像头模组包括连接的两部分，第一部分包括镜筒，第二部分至少包括基板，第一部分的外表面覆盖有第一导电层，第二部分的外表面上覆盖有第二导电层，第一导电层和第二导电层连接，以形成包裹在摄像头模组外部的屏蔽结构，可以使得由第一导电层和第二导电层形成的屏蔽结构与基板实现电连接以实现屏蔽装置的接地，在摄像头模组的外部形成完备的法拉第笼，以实现屏蔽电磁信号的屏蔽效果。
此外，第一导电层与第二导电层连接并连接至基板的金属，第二导线层覆盖在基板的外表面，可以将基板的一字型结构的金属扩展为U型结构的金属结构，从而扩大基板的金属面积，增大散热面积，提高整个屏蔽装的散热效果。
并且，通过第二导电层与第一导电层之间的稳定连接，可以使得二者导电物质直接结合，无需其他导电连接措施，导电性能优异，接触电阻低。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (26)

  1. 一种屏蔽装置，其特征在于，所述屏蔽装置包括镜头组件、支撑件和基板，
    所述镜头组件包括镜筒和镜头光学组件，所述镜筒呈筒状结构，所述镜筒包括贯穿所述镜筒的光通道且形成具有开口的两端，所述镜头光学组件设置在所述镜筒具有开口的一端以使光通过所述镜头光学组件进入所述光通道，所述镜筒的材料是不具有导电性能的材料且所述镜筒的外表面覆盖有第一导电层；
    所述支撑件设置在所述镜筒和所述基板之间，所述支撑件的材料是不具有导电性能的材料，所述支撑件中填充有至少一个第一导电结构，所述第一导电结构的第一端部与所述第一导电层连接，所述第一导电结构的第二端部与所述基板外露的金属连接。
  2. 根据权利要求1所述的屏蔽装置，其特征在于，所述支撑件上设置有贯穿所述支撑件的至少一个第一通孔，所述第一通孔填充有所述第一导电结构。
  3. 根据权利要求2所述的屏蔽装置，其特征在于，所述第一通孔为设置在所述支撑件的边缘的开口孔。
  4. 根据权利要求1至3中任一项所述屏蔽装置，其特征在于，所述支撑件的内部设置有贯穿所述支撑件的一个第一通孔，所述第一导电结构的每个端部由多个外凸结构形成。
  5. 根据权利要求1至4中任一项所述的屏蔽装置，其特征在于，所述屏蔽装置还包括设置在所述支撑件和所述基板之间的塑封件，所述第一导电结构贯穿所述塑封件。
  6. 根据权利要求1至5中任一项所述的屏蔽装置，其特征在于，所述第一导电结构的第一端部通过导电胶与所述第一导电层连接。
  7. 根据权利要求1至5中任一项所述的屏蔽装置，其特征在于，所述第一导电结构的第二端部与所述基板的接地焊盘连接。
  8. 根据权利要求1至7中任一项所述的屏蔽装置，其特征在于，所述第一导电结构为：由导电胶形成的结构，或，金属弹片。
  9. 一种屏蔽装置，其特征在于，所述屏蔽装置包括镜头组件、支撑件、塑封件和基板，
    所述镜头组件包括镜筒和镜头光学组件，所述镜筒呈筒状结构，所述镜筒包括贯穿所述镜筒的光通道且形成具有开口的两端，所述镜头光学组件设置在所述镜筒具有开口的一端以使光通过所述镜头光学组件进入所述光通道，所述镜筒的材料为不具有导电性能的材料且所述镜筒的外表面覆盖有第一导电层；
    所述支撑件设置在所述镜筒和所述塑封件之间，所述支撑件的材料为不具有导电性能的材料且所述支撑件的外表面上覆盖有第三导电层，所述第一导电层与所述第三导电层连接；
    所述塑封件设置在所述支撑件和所述基板之间，所述塑封件中塑封有贯穿所述塑封件的至少一个第二导电结构，所述第二导电结构的第一端部与所述第三导电层连接，所述第二导电结构的第二端部与所述基板外露的金属连接。
  10. 根据权利要求9所述的屏蔽装置，其特征在于，所述第二导电结构的第一端部通 过导电胶与所述第三导电层连接。
  11. 根据权利要求9或10所述的屏蔽装置，其特征在于，所述第二导电结构的第二端部与所述基板的接地焊盘连接。
  12. 根据权利要求9至11中任一项所述的屏蔽装置，其特征在于，所述第二导电结构为以下任一项：由导电胶形成的结构，或，金属弹片，或，设置在所述基板的接地焊盘上的接地金线。
  13. 一种屏蔽装置，其特征在于，所述屏蔽装置包括镜头组件、支撑件、塑封件和基板，
    所述镜头组件包括镜筒和镜头光学组件，所述镜筒呈筒状结构，所述镜筒包括贯穿所述镜筒的光通道且形成具有开口的两端，所述镜头光学组件设置在所述镜筒具有开口的第一端以使光通过所述镜头光学组件进入所述光通道，所述镜筒具有开口的第二端的周边边缘在朝着靠近所述塑封件的方向形成凸起的凸起边缘，以在所述镜筒的第二端的中间区域形成被所述凸起边缘包围的凹陷区域，所述镜筒的材料为不具有导电性能的材料且所述镜筒的外表面上覆盖有第一导电层；
    所述支撑件容纳于所述凹陷区域以通过所述凸起边缘围合所述支撑件；
    所述塑封件设置在所述镜筒和所述基板之间，所述塑封件中塑封有贯穿所述塑封件的至少一个第二导电结构，所述第二导电结构的第一端部与所述第一导电层连接，所述第二导电结构的第二端部与所述基板外露的金属连接。
  14. 根据权利要求13所述的屏蔽装置，其特征在于，所述第二导电结构的第一端部通过导电胶与所述第一导电层连接。
  15. 根据权利要求13或14所述的屏蔽装置，其特征在于，所述第二导电结构的第二端部与所述基板的接地焊盘连接。
  16. 根据权利要求13至15中任一项所述的屏蔽装置，其特征在于，所述第二导电结构为以下任一项：由导电胶形成的结构，或，金属弹片，或，设置在所述基板的接地焊盘上的接地金线。
  17. 一种屏蔽装置，其特征在于，所述屏蔽装置包括：镜头组件和基板，
    所述镜头组件设置在所述基板的一侧，包括镜筒和镜头光学组件，所述镜筒与所述基板连接，所述镜筒呈筒状结构，所述镜筒包括贯穿所述镜筒的光通道且形成具有开口的两端，所述镜头光学组件设置在所述镜筒具有开口的一端以使光通过所述镜头光学组件进入所述光通道，所述镜筒的材料为不具有导电性能的材料且所述镜筒的外表面覆盖有第一导电层，所述镜筒的外表面包括所述镜筒的周向方向的侧面和垂直于第一方向且背离所述基板的顶面，所述镜筒的周向方向绕所述第一方向环绕，所述第一方向垂直于所述基板；
    所述基板的外表面覆盖有第二导电层，所述第二导电层和所述第一导电层连接，所述基板的外表面包括所述基板的周向方向的侧面和垂直于所述第一方向且背离所述镜筒组件的底面，所述基板的底面外露有金属，所述基板的周向方向绕所述第一方向环绕。
  18. 根据权利要求17所述的屏蔽装置，其特征在于，所述第二导电层靠近所述第一导电层的第一端部被设置为台阶状结构，所述第一导电层靠近所述第二导电层的第一端部被设置为与所述台阶状结构配合的结构，所述第一导电层的第一端部与所述第二导电层的第一端部连接。
  19. 根据权利要求18所述的屏蔽装置，其特征在于，所述第二导电层的第一端部被设置为具有L字型的截面的台阶状结构，所述第一导电层的第一端部连接且容纳于所述第二导电层的第一端部。
  20. 根据权利要求17至19中任一项所述的屏蔽装置，其特征在于，所述基板的底面上设置有至少一个凹槽，所述第二导电层延伸至所述凹槽以填充所述凹槽。
  21. 根据权利要求17至20中任一项所述的屏蔽装置，其特征在于，所述屏蔽装置还包括设置在所述基板和所述镜筒之间的支撑件，所述第二导电层还覆盖在所述支撑件的周向方向的侧面上，所述支撑件的周向方向绕所述第一方向环绕。
  22. 根据权利要求17至21中任一项所述的屏蔽装置，其特征在于，所述屏蔽装置还包括设置在所述基板和所述镜筒之间的塑封件，所述第二导电层还覆盖在所述塑封件的周向方向的侧面上，所述塑封件的周向方向绕所述第一方向环绕。
  23. 一种电子设备，其特征在于，包括天线和如权利要求1至8中任一项所述的屏蔽装置。
  24. 一种电子设备，其特征在于，包括天线和如权利要求9至12中任一项所述的屏蔽装置。
  25. 一种电子设备，其特征在于，包括天线和如权利要求13至16中任一项所述的屏蔽装置。
  26. 一种电子设备，其特征在于，包括天线和如权利要求17至22中任一项所述的屏蔽装置。
PCT/CN2020/127735 2019-11-29 2020-11-10 屏蔽装置和电子设备 WO2021104004A1 (zh)

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