WO2022111336A1 - 镜头模组及其装配方法 - Google Patents

镜头模组及其装配方法 Download PDF

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Publication number
WO2022111336A1
WO2022111336A1 PCT/CN2021/130945 CN2021130945W WO2022111336A1 WO 2022111336 A1 WO2022111336 A1 WO 2022111336A1 CN 2021130945 W CN2021130945 W CN 2021130945W WO 2022111336 A1 WO2022111336 A1 WO 2022111336A1
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WO
WIPO (PCT)
Prior art keywords
lens
adhesive layer
pcb board
base
lens module
Prior art date
Application number
PCT/CN2021/130945
Other languages
English (en)
French (fr)
Inventor
王卓
熊鑫煜
Original Assignee
江西联创电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 江西联创电子有限公司 filed Critical 江西联创电子有限公司
Priority to US18/252,946 priority Critical patent/US20230418021A1/en
Publication of WO2022111336A1 publication Critical patent/WO2022111336A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/028—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens

Definitions

  • the present invention generally relates to the field of optoelectronic technology, and in particular, to a lens module and an assembling method thereof.
  • AA glue is used between the lens and the lens holder or the base plate, which plays the role of fixing and AA focusing.
  • the thickness of the AA glue itself is at least 200 ⁇ m or more.
  • common UV+ heat-curing glues such as Delo's OB787 and 786, after UV pre-curing, it needs to be further baked and heat-cured, and the glue will shrink further after heat-curing. Fixed, there is a distribution.
  • the average shrinkage can be measured experimentally. It may be around 8 ⁇ m depending on the glue, but the variance itself may be 1 ⁇ m or more. Assuming the variance is 1 ⁇ m, then there is a 97% probability that the shrinkage range is 8 ⁇ m +/- 2 ⁇ m. And this +/-2 ⁇ m range makes the back focus change of the same batch of modules reach 4 ⁇ m or more.
  • the thickness of the glue will change due to the shrinkage or expansion of the glue itself.
  • the glue In a humid working environment, the glue itself will continuously absorb water vapor, and it will expand after absorbing water. In theory, it will gradually dehydrate and then shrink in a dry environment, but the shrinkage time may be very long and difficult to control, thus affecting the lens.
  • the thickness change after the reliability test is uncontrollable and difficult to predict, which will affect the resolution and image quality of the lens module.
  • Glue as an organic substance, will have a different thickness from the factory when exposed to various extreme test environments such as thermal shock, high temperature and high humidity. This thickness change, even one or two microns, will seriously affect the image quality of the camera, but the unpredictability of this effect makes early compensation impossible.
  • the present invention proposes a lens module, comprising: a base; a PCB board, wherein the PCB board is arranged on the base;
  • the lens includes one or more lenses and is arranged on the base; a first adhesive layer, the first adhesive layer is arranged between the base and the PCB board, and the the base and the PCB board are bonded together; and a second adhesive layer, the second adhesive layer is arranged between the base and the lens to bond the base and the lens stand up.
  • an image sensor is further included, the image sensor is disposed on the PCB board, wherein the thickness of the first adhesive layer and the second adhesive layer are substantially the same and the selected materials are the same, so that When the first adhesive layer and the second adhesive layer expand or contract, the distance between the image sensor and the optical center of the lens is kept substantially constant.
  • the base comprises a substrate
  • the first adhesive layer is disposed between the substrate and the PCB board
  • the second adhesive layer is disposed between the lens and the between the substrates.
  • the base includes a base plate and a lens holder
  • the lens base is fixed on the base plate and is used for mounting the lens
  • the first adhesive layer is disposed between the base plate and the lens holder.
  • the second adhesive layer is disposed between the lens and the lens holder, wherein the lens holder and the base plate are integrated.
  • the lens has a flange structure on an outer periphery thereof, and the second adhesive layer is provided between the flange structure and the lens holder.
  • the materials of the first adhesive layer and the second adhesive layer are selected from UV glue, thermosetting glue, epoxy glue, pressure sensitive glue, moisture curing glue and light curing glue composed group.
  • it further includes a heat dissipation thermal paste located between the base and the PCB board.
  • the present invention also relates to a lens module, comprising:
  • the mirror seat is fixed on the base plate;
  • PCB board the PCB board is arranged on the substrate;
  • a lens comprising one or more lenses
  • the first adhesive layer is disposed between the mirror base and the substrate or between the mirror base and the PCB board;
  • a second adhesive layer, the second adhesive layer is arranged between the lens and the lens holder.
  • the lens has a flange structure on an outer periphery thereof, and the second adhesive layer is provided between the flange structure and the lens holder.
  • an image sensor is further included, the image sensor is disposed on the PCB board, wherein the thickness of the first adhesive layer and the second adhesive layer are substantially the same and the selected materials are the same, so that When the first adhesive layer and the second adhesive layer expand or contract, the distance between the image sensor and the optical center of the lens is kept substantially constant.
  • the present invention also relates to a lens module, comprising:
  • PCB board the PCB board is arranged on the substrate;
  • a mirror holder which is fixed on the PCB board or the base plate;
  • a lens comprising one or more lenses
  • the lens is connected to the lens holder through the connecting piece;
  • a second adhesive layer, the second adhesive layer is disposed between the lens and the second end of the connecting piece.
  • an image sensor is further included, the image sensor is disposed on the PCB board, wherein the thickness of the first adhesive layer and the second adhesive layer are substantially the same and the selected materials are the same, so that When the first adhesive layer and the second adhesive layer expand or contract, the distance between the image sensor and the optical center of the lens is kept substantially constant.
  • the connecting member is a lens cap
  • the lens cap has a first annular portion constituting a first end, a second annular portion constituting a second end, and connecting the first annular portion and the The wall portion of the second annular portion, the first annular portion is located above the lens holder and is bonded to the lens holder through the first adhesive layer, the second annular portion is located above the lens and The lens is bonded with the lens through the second adhesive layer, wherein the lens holder and the base plate can be integrally processed.
  • the connecting member is a lens cap
  • the lens cap has a first annular portion constituting a first end, a second annular portion constituting a second end, and connecting the first annular portion and the The wall part of the second annular part
  • the lens has a flange structure on its outer circumference
  • the first annular part is located above the lens holder and is bonded with the lens holder through the first adhesive layer
  • the second annular portion is located above the flange structure and is bonded with the flange structure through the second adhesive layer, wherein the mirror base and the base plate can be integrally processed.
  • the connecting member is a ring member
  • the ring member is a flat member with a hollow center
  • the outer circumference of the upper surface or the lower surface of the ring member constitutes the first end
  • the inner circumference constitutes the second end
  • the lens has a flange structure on its outer periphery, the first adhesive layer bonds the first end of the ring with the lens holder, and the second adhesive layer bonds the method
  • a blue structure is bonded to the second end of the ring, wherein the mirror base and the base plate are integral.
  • the present invention also relates to a method for assembling a lens module, comprising:
  • the PCB board is fixed to the base through the first adhesive layer
  • the lens is fixed on the base through a second adhesive layer, wherein the thickness of the first adhesive layer and the second adhesive layer are the same and the selected materials are the same, so that when the first adhesive layer and the When the second adhesive layer expands or contracts, the distance between the image sensor and the optical center of the lens is kept substantially constant.
  • the present invention also relates to a method for assembling a lens module, comprising:
  • the lens holder is fixed to the PCB board or the substrate through a first adhesive layer, wherein the thickness of the first adhesive layer and the second adhesive layer are the same and the selected materials are the same, so that when all the When the first adhesive layer and the second adhesive layer expand or contract, the distance between the image sensor and the optical center of the lens is kept substantially constant.
  • the present invention also relates to a method for assembling a lens module, comprising:
  • the lens holder and the first end of the connecting piece are bonded together by a first adhesive layer, wherein the thickness of the first adhesive layer and the second adhesive layer are the same and the selected materials are the same, so that When the first adhesive layer and the second adhesive layer expand or contract, the distance between the image sensor and the optical center of the lens is kept substantially constant.
  • the embodiment of the present invention proposes a lens module and an assembling method thereof.
  • Adhesive layers with the same thickness and material are arranged at two corresponding positions inside the lens module.
  • the adhesive layers at the two positions are due to The offsets caused by synchronous aberrations cancel each other out, especially the reduction in image quality caused by the deviation of the ideal imaging plane and the plane where the image sensor is located due to changes in the adhesive layer itself, without affecting the lens
  • the imaging effect of the module improves the resolution and imaging quality of the lens module.
  • FIG. 1 shows a schematic diagram of a lens module according to an embodiment of the present invention
  • FIG. 2 shows a cross-sectional view of a lens module according to an embodiment of the present invention
  • FIG. 3 shows a schematic diagram of a lens module according to an embodiment of the present invention
  • FIG. 4 shows a schematic diagram of a lens module according to an embodiment of the present invention
  • FIG. 5 shows a cross-sectional view of a lens module according to an embodiment of the present invention
  • FIG. 6 shows a schematic diagram of a lens module according to an embodiment of the present invention
  • FIG. 7 shows a schematic diagram of a lens module according to an embodiment of the present invention.
  • FIG. 8 shows a schematic diagram of a lens module according to an embodiment of the present invention.
  • FIG. 9 shows a schematic diagram of a lens module according to an embodiment of the present invention.
  • FIG. 10 shows a schematic diagram of a lens module according to an embodiment of the present invention.
  • FIG. 11 shows a cross-sectional view of a lens module according to an embodiment of the present invention.
  • FIG. 12 shows a schematic diagram of a lens module according to an embodiment of the present invention.
  • FIG. 13 shows a schematic diagram of a lens module according to an embodiment of the present invention.
  • FIG. 14 shows a cross-sectional view of a lens module according to an embodiment of the present invention.
  • FIG. 15 shows a schematic diagram of a lens module according to an embodiment of the present invention.
  • FIG. 16 shows a schematic diagram of a lens module according to an embodiment of the present invention.
  • FIG. 17 shows a schematic diagram of a lens module according to an embodiment of the present invention.
  • FIG. 18 shows a schematic diagram of a lens module according to an embodiment of the present invention.
  • FIG. 19 shows a schematic diagram of a lens module according to another embodiment of the present invention.
  • FIG. 20 shows a flowchart of a method for assembling a lens module according to an embodiment of the present invention
  • FIG. 21 shows a flowchart of a method for assembling a lens module according to another embodiment of the present invention.
  • FIG. 22 shows a flowchart of a method for assembling a lens module according to still another embodiment of the present invention.
  • connection should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection: it can be a mechanical connection, an electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication between two elements or the interaction relationship between the two elements .
  • connection should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection: it can be a mechanical connection, an electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication between two elements or the interaction relationship between the two elements .
  • connection should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection: it can be a mechanical connection, an electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication between two elements or the interaction relationship between the two elements
  • a first feature "on” or “under” a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them.
  • the first feature being “above”, “over” and “above” the second feature includes that the first feature is directly above and diagonally above the second feature, or simply means that the first feature is level higher than the second feature.
  • the first feature “below”, “below” and “beneath” the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature has a lower level than the second feature.
  • the inventor of the present application has conceived that by disposing an adhesive layer at two designated positions in the lens module , Utilizing the characteristic that the adhesive layer has the same variation (simultaneous expansion or contraction) in the same environment, it solves the problem that the adhesive layer in the prior art affects the imaging effect of the module due to the variation, and improves the performance of the lens module. Resolution and image quality.
  • the thickness of the adhesive layer By setting the thickness of the adhesive layer, the redundancy of tolerances between components in the module can be better ensured.
  • FIG. 1 shows a schematic diagram of a lens module according to an embodiment of the present invention
  • FIG. 2 shows a cross-sectional view of a lens module according to an embodiment of the present invention
  • the lens module 100 includes: a base 10 , a PCB board 20 , a lens 30 , a first adhesive layer 40 and a second adhesive layer 50 .
  • the PCB board 20 is arranged on the base 10 , and various circuits and chips required for the operation of the lens module 30 can be arranged on the PCB board 20 .
  • the lens 30 is roughly cylindrical, has a ring-shaped housing, and includes one or more lenses inside, such as the lens 31, the lens 32 shown in FIG. 1, or the lenses 31, 32, 33, 34 shown in FIG.
  • the base 10 includes a base plate 11 and a lens holder 12 .
  • the first adhesive layer 40 is disposed between the base 10 and the PCB board 20 (specifically, between the base plate 11 and the PCB board 20 ), for example, distributed in a ring shape, connecting the base 10 and the PCB board 20 .
  • the PCB board 20 is bonded together, and the second bonding layer 50 is disposed between the base 10 and the lens 30 (specifically, between the end of the lens holder 12 and the end of the lens 30 , two The ends of the lenses are relatively close to each other), for example, distributed in a ring shape, and the base 10 and the lens 30 are bonded together.
  • the mirror base 12 and the base plate 11 may be integrally processed, and the two are integrated, and the base 10 including the base plate 11 and the mirror base 12 is obtained through integral processing.
  • the lens module 100 further includes an image sensor 60 , and the image sensor 60 is disposed on the PCB board 20 .
  • the image sensor 60 is located on the focal plane of the lens 30, so that the lens 30 can focus the light beam from the outside on the image sensor 60 for imaging.
  • the image sensor 60 is, for example, a CMOS image sensor or a CCD image sensor.
  • the first adhesive layer 40 and the second adhesive layer 50 are set to have substantially the same thickness (the difference in thickness within 20% can be considered to be substantially the same, or within 10%, or within 5% or less than 1%), and use the same material.
  • the first adhesive layer 40 and the second adhesive layer 50 expand or contract under the same environmental conditions, whether due to water absorption or loss, or due to high temperature or low temperature
  • the The first adhesive layer 40 and the second adhesive layer 50 can expand or contract synchronously, and the distance and direction of expansion or contraction are also the same, so as to maintain the distance between the image sensor 60 and the optical center of the lens 30 Basically unchanged, that is, the image sensor 60 is always kept on the focal plane of the lens 30 , so the expansion or contraction will not affect the imaging effect of the lens module 100 .
  • the first adhesive layer 40 may expand due to absorbing moisture, causing the image sensor 60 to move in an upward direction in the figure; at the same time, the second adhesive layer 50 will also absorb moisture
  • the expansion causes the lens 30 to move in the upward direction in the figure, and the optical center also moves upward. Since the two materials are the same and the thickness is the same, the upward movement distance is approximately equal, so the image sensor 60 and the lens can be maintained.
  • the distance between the optical centers of 30 is basically unchanged.
  • the variation range of the distance between the image sensor 60 and the optical center of the lens 30 is less than 10%, that is, it can be considered that the distance between the two is basically unchanged.
  • the fluctuation is less than 5%, or more preferably less than 1%, it can be considered that the distance between the two is basically unchanged.
  • the materials of the first adhesive layer 40 and the second adhesive layer 50 are selected from UV glue, thermosetting glue, epoxy resin glue, pressure sensitive glue, moisture curing glue and light-curing glue.
  • the PCB board 20 and the base 10 are connected by a first adhesive layer 40 composed of a glue material, because the Shore hardness of the glue material is lower than that of mechanical structural parts (such as screws) Therefore, it can play a certain buffering role, and the extrusion deformation of the first adhesive layer 40 to the PCB board 20 will be small during the use of the lens module, which protects the PCB board 20 to a certain extent.
  • the thermal stress applied to the PCB board 20 is reduced, and the possible deformation thereof is further reduced. In theory, this deformation will directly affect the sensor 60 and cause warpage of the imaging surface of the CMOS.
  • the lens 30 and the base 10 are connected by a second adhesive layer 50 composed of glue of the same material. Compared with the mechanical structural connector, the second adhesive layer 50 also plays a role in the lens 30 during use. Certain buffering and protective effects will not be repeated here.
  • the thickness of the adhesive layer can be adjusted according to the assembly needs of the lens module. For example, setting the thickness of the adhesive layer to be thicker can better ensure the tolerance of the components in the lens module. Redundancy, and the offsets of the image sensor 60 and the lens 30 in the direction of the optical axis of the lens cancel each other due to the synchronous mutation of the first adhesive layer 40 and the second adhesive layer 50, which can be eliminated or reduced. impact on imaging results.
  • FIG. 3 shows a schematic diagram of a lens module according to another embodiment of the present invention.
  • the base 10 includes the base plate 11, but does not include the lens holder 12 in the embodiment of FIGS. 1 and 2 .
  • the first adhesive layer 40 is disposed between the substrate 11 and the PCB board 20
  • the second adhesive layer 50 is disposed between the lens 30 and the substrate 11 . Therefore, the offset between the image sensor 60 and the lens 30 in the direction of the optical axis of the lens caused by the variation of the adhesive layer can be offset.
  • the working principle of the embodiment of FIG. 3 is basically the same as that of the embodiment of FIG. 1 and FIG. 2 , and details are not described herein again.
  • FIG. 4 shows a schematic diagram of a lens module according to an embodiment of the present invention
  • FIG. 5 shows a cross-sectional view of a lens module according to an embodiment of the present invention
  • the base 10 includes a base plate 11 and a lens mount 12
  • the lens mount 12 is fixed on the base plate 11 for mounting the lens 30
  • the mirror base 12 and the base plate 11 may be integrally processed, and the two are integrally processed to obtain the base 10 including the base plate 11 and the mirror base 12
  • the first adhesive layer 40 is disposed between the substrate 11 and the PCB board 20
  • the second adhesive layer 50 is disposed between the lens 30 and the lens holder 12 .
  • the lens 30 in the lens module 100 has a flange structure 70 located on the outer periphery of the lens module 100 , and the flange structure 70 is, for example, an annular plate It is formed integrally with the casing of the lens 30 or fixed on the casing of the lens 30 .
  • the flange structure is located above the upper end of the mirror base 12 , and the second adhesive layer 50 is disposed between the flange structure 70 and the upper end of the mirror base 12 .
  • the first adhesive layer 40 and the second adhesive layer 50 are configured to have substantially the same thickness and use the same material.
  • the first adhesive layer 40 and the second adhesive layer 50 expand or contract under the same environmental conditions, whether due to water absorption or loss, or due to high temperature or low temperature
  • the The first adhesive layer 40 and the second adhesive layer 50 can expand or contract synchronously, and the distance and direction of expansion or contraction are also the same, so as to maintain the distance between the image sensor 60 and the optical center of the lens 30 Basically unchanged, that is, the image sensor 60 is always kept on the focal plane of the lens 30 , so the expansion or contraction will not affect the imaging effect of the lens module 100 .
  • the lens module 100 further includes a heat dissipation thermal paste 80 located between the base 10 and the PCB board 20 .
  • the thermal paste 80 is used to dissipate heat from the PCB board 20 .
  • FIG. 6 shows a schematic diagram illustrating a lens module according to another embodiment of the present invention.
  • the lens module 100 includes a substrate 11 , a lens holder 12 , a PCB board 20 , a lens 30 , a first adhesive layer 40 and a second adhesive layer 50 .
  • the lens holder 12 is fixed on the PCB board 20 for mounting the lens 30
  • the PCB board 20 is arranged on the substrate 11 .
  • the lens 30 includes one or more lenses such as 31 and 32
  • the lens base 12 is a hollow cylinder with an "L"-shaped cross-section.
  • the lens holder 12 has a vertical annular wall (constituting the vertical portion of the L-shape), and an inwardly extending annular portion (constituting the horizontal portion of the L-shape) at the upper portion or top of the annular wall, the The annular portion is opposite to the end of the lens 30 away from the substrate 11 , and the annular portion is located outside the end of the lens 30 away from the substrate 11 .
  • the PCB board 20 is locked and fixed on the base plate 11 , and the lens holder 12 is used for installing the lens 30 .
  • FIG. 7 shows a schematic diagram of a lens module according to an embodiment of the present invention. As shown in FIG.
  • the lens module 100 includes a substrate 11 , a lens holder 12 , a PCB board 20 , a lens 30 , a first adhesive layer 40 and a second adhesive layer 50 .
  • the lens holder 12 is fixed on the base plate 11 for mounting the lens 30
  • the PCB board is arranged on the base plate 11 .
  • the lens 30 includes one or more lenses such as 31 and 32, and the lens base 12 is a hollow cylinder with an "L"-shaped cross-section.
  • the lens holder 12 has a vertical annular wall (constituting the vertical portion of the L-shape), and an inwardly extending annular portion (constituting the horizontal portion of the L-shape) at the upper portion or top of the annular wall, the The annular portion is opposite to the end of the lens 30 away from the substrate 11 , and the annular portion is located outside the end of the lens 30 away from the substrate 11 .
  • the first adhesive layer 40 is disposed between the bottom of the annular wall of the lens holder 12 and the substrate 11
  • the second adhesive layer 50 is disposed between the end of the lens 30 away from the substrate 11 and the substrate 11 . between the annular portions of the mirror base 12 .
  • FIG. 8 shows a schematic diagram of a lens module according to an embodiment of the present invention.
  • the lens module 100 includes a substrate 11 , a lens holder 12 , a PCB board 20 , a lens 30 , a first adhesive layer 40 and a second adhesive layer 50 .
  • the lens holder 12 is fixed on the base plate 11 for mounting the lens 30
  • the PCB board is arranged on the base plate 11 .
  • the lens 30 includes one or more lenses such as 31 and 32, and has a flange structure 70 located on the outer periphery thereof.
  • the flange structure 70 is, for example, a ring-shaped plate-shaped member, which is integrated with the housing of the lens 30. formed or fixed on the housing of the lens 30 .
  • the mirror base 12 is a hollow cylinder with an "L"-shaped cross section.
  • the lens holder 12 has a vertical annular wall (constituting the vertical portion of the L-shape), and an inwardly extending annular portion (constituting the horizontal portion of the L-shape) at the upper portion or top of the annular wall, the The annular portion is opposite to the flange structure 70 , and the annular portion is located above the flange structure 70 .
  • the first adhesive layer 40 is disposed between the bottom of the annular wall of the lens holder 12 and the base plate 11
  • the second adhesive layer 50 is disposed between the flange structure 70 and the lens holder 12 between the rings.
  • FIG. 9 shows a schematic diagram of a lens module according to another embodiment of the present invention.
  • the lens module 100 includes a substrate 11 , a lens holder 12 , a PCB board 20 , a lens 30 , a first adhesive layer 40 and a second adhesive layer 50 .
  • the lens holder 12 is fixed on the PCB board 20 for mounting the lens 30
  • the PCB board 20 is arranged on the substrate 11 .
  • the lens 30 includes one or more lenses such as 31 and 32, and the lens 30 also has a flange structure 70 on its outer periphery.
  • the housing of the lens 30 is integrally formed or fixed on the housing of the lens 30 .
  • the mirror base 12 is a hollow cylinder with an "L"-shaped cross section.
  • the lens holder 12 has a vertical annular wall (constituting the vertical portion of the L-shape), and an inwardly extending annular portion (constituting the horizontal portion of the L-shape) at the upper portion or top of the annular wall, the The annular portion is opposite to the flange structure 70 , and the annular portion is located above the flange structure 70 .
  • the PCB board 20 is locked and fixed on the base plate 11 , and the lens holder 12 is used for installing the lens 30 .
  • the substrate 11 itself does not directly contact the lens holder 12 .
  • the substrate 11 here does not necessarily exist, and in some designs, the substrate 11 may not be present.
  • the first adhesive layer 40 is disposed between the bottom of the annular wall of the lens holder 12 and the PCB board 20
  • the second adhesive layer 50 is disposed between the lens 30 and the lens holder 12 .
  • the second adhesive layer 50 is disposed between the flange structure 70 and the annular portion of the mirror base 12 .
  • FIG. 10 shows a schematic diagram of a lens module according to another embodiment of the present invention
  • FIG. 11 shows a cross-sectional view of a lens module according to an embodiment of the present invention
  • the lens module 100 includes a substrate 11 , a lens holder 12 , a PCB board 20 , a lens 30 , a connector 90 , a first adhesive layer 40 and a second adhesive layer 50 .
  • the base plate 11 and the lens holder 12 together constitute the base 10 .
  • the mirror holder 12 is directly fixed on the base plate 11
  • the PCB board 20 is disposed on the base plate 11 .
  • the mirror base 12 and the base plate 11 may be integrally processed, and the two are integrally processed to obtain the base 10 including the base plate 11 and the mirror base 12 .
  • the lens 30 includes one or more lenses, such as the lenses 31 and 32 shown in FIG. 10 , or the lenses 31 , 32 , 33 , and 34 shown in FIG. 11 .
  • the lens 30 is connected to the lens mount 12 through the connecting member 90 .
  • the first adhesive layer 40 is disposed between the lens holder 12 and the first end of the connecting member 90
  • the second adhesive layer 50 is disposed on the first end of the lens 30 and the connecting member 90 . between the two ends.
  • FIG. 12 shows a schematic diagram of a lens module according to another embodiment of the present invention.
  • the structure of the lens module in FIG. 12 is substantially the same as the structure of the lens module in FIG. 10 , the difference is that the lens holder 12 is directly fixed On the PCB board 20 , the PCB board 20 is arranged on the substrate 11 .
  • the lens module 100 further includes an image sensor 60 , and the image sensor 60 is disposed on the PCB board 20 , wherein the first adhesive The layer 40 and the second adhesive layer 50 are provided with substantially the same thickness and the same material is selected.
  • the first adhesive layer 40 and the second adhesive layer 50 expand or contract under the same environmental conditions, the first adhesive layer 40 and the second adhesive layer 50 can expand simultaneously
  • the expansion or contraction distance is also the same, so that the distance between the image sensor 60 and the optical center of the lens 30 can be kept basically unchanged, and the imaging effect of the lens module will not be affected.
  • the connecting member 90 is a lens cap
  • the lens cap has a first annular portion 91 constituting a first end and a second end
  • the first annular portion 91 is located above the lens holder 12 and is bonded to the lens holder 12 through the first adhesive layer 40
  • the second annular portion 92 is located above the lens 30 and passes through the lens holder 12 .
  • the second adhesive layer 50 is bonded with the lens 30 .
  • FIG. 13 shows a schematic diagram of a lens module according to an embodiment of the present invention
  • FIG. 14 shows a cross-sectional view of a lens module according to an embodiment of the present invention
  • the connecting member 90 is an annular member
  • the annular member is a flat member hollowed out in the middle.
  • the outer circumference of the lower surface of the annular member constitutes the first end, and the inner circumference constitutes the second end.
  • the annular member is a circular ring.
  • the lens 30 has a flange structure 70 on its outer periphery.
  • the connecting member 90 is located above the upper end of the mirror base 12 and the flange structure 70 .
  • the first adhesive layer 40 bonds the first end of the ring member to the lens holder 12 (upper end), and the second adhesive layer 50 bonds the flange structure 70 to the ring member.
  • the second end is glued together.
  • FIG. 15 shows a schematic diagram of a lens module according to another embodiment of the present invention.
  • the structure of the lens module in FIG. 15 is substantially the same as the structure of the lens module in FIG. 13 , the difference is that the lens holder 12 is directly fixed on the PCB board 20 , and the PCB board 20 is arranged on the substrate 11 superior.
  • FIG. 16 shows a schematic diagram of a lens module according to another embodiment of the present invention.
  • the connecting piece 90 is an annular piece
  • the annular piece is a flat piece hollowed out in the middle
  • the outer circumference of the upper surface of the annular piece constitutes the first end
  • the inner circumference constitutes the first end. second end.
  • the annular member is a circular ring.
  • the lens 30 has a flange structure 70 located on its outer periphery.
  • the flange structure 70 is, for example, an annular plate-shaped member, which is integrally formed with the housing of the lens 30 or fixed on the housing of the lens 30 .
  • the mirror base 12 is a hollow cylinder with an "L"-shaped cross section.
  • the lens holder 12 has a vertical annular wall (constituting the vertical portion of the L-shape), and an inwardly extending annular portion (constituting the horizontal portion of the L-shape) at the upper portion or top of the annular wall, the The annular portion is opposite to the flange structure 70 .
  • the connecting member 90 is located inside the mirror base 12 , specifically, below the annular portion of the mirror base 12 and the flange structure 70 .
  • the first adhesive layer 40 bonds the first end of the annular member (connecting member 90) to the annular portion of the lens holder 12, and the second adhesive layer 50 bonds the annular member (connecting member 90).
  • the second end of the connector 90) is bonded to the flange structure 70.
  • the bottom of the annular wall of the lens holder 12 is fixed on the base plate 11 .
  • FIG. 17 shows a schematic diagram of a lens module according to another embodiment of the present invention.
  • the structure of the lens module in FIG. 17 is substantially the same as the structure of the lens module in FIG. 16 , the difference is that the lens holder 12 is directly fixed on the PCB board 20 , and the PCB board 20 is arranged on the substrate 11 superior.
  • FIG. 18 shows a schematic diagram of a lens module according to another embodiment of the present invention.
  • the lens module 100 includes a substrate 11 , a lens holder 12 , a PCB board 20 , a lens 30 , a connector 90 , a first adhesive layer 40 and a second adhesive layer 50 .
  • the base plate 11 and the lens holder 12 together constitute the base 10 .
  • the mirror holder 12 is directly fixed on the base plate 11
  • the PCB board 20 is disposed on the base plate 11 .
  • the mirror base 12 and the base plate 11 may be integrally processed, and the two are integrally processed to obtain the base 10 including the base plate 11 and the mirror base 12 .
  • the lens 30 has a flange structure 70 located on its outer periphery.
  • the flange structure 70 is, for example, an annular plate-shaped member, which is integrally formed with the casing of the lens 30 or fixed to the casing of the lens 30 .
  • the connecting member 90 is a lens cap, and the lens cap has a first annular portion 91 constituting a first end, a second annular portion 92 constituting a second end, and a connection connecting the first annular portion 91 and the second annular portion 92 . wall portion 93 .
  • the first annular portion 91 is located above the mirror base 12 and is bonded to the mirror base 12 through the first adhesive layer 40
  • the second annular portion 92 is located above the flange structure 70 And it is bonded with the lens 30 through the second bonding layer 50 .
  • FIG. 19 shows a schematic diagram of a lens module according to another embodiment of the present invention.
  • the structure of the lens module in FIG. 19 is substantially the same as the structure of the lens module in FIG. 18 , the difference is that the lens holder 12 is directly fixed on the PCB board 20 , and the PCB board 20 is arranged on the substrate 11 superior.
  • the above-mentioned embodiment of the present invention proposes a lens module.
  • the adhesive layers can be uniformly mutated in the same environment (swelling or The characteristic of shrinkage) solves the problem that the adhesive layer in the prior art affects the imaging effect of the module due to abnormal changes, and improves the resolution and imaging quality of the lens module.
  • the adhesive layer can play a buffering role on the PCB board and the base plate, thereby improving the service life thereof, and by setting the thickness of the adhesive layer, the redundancy of tolerances between components in the module can be better ensured.
  • FIG. 20 shows a flowchart of a method for assembling a lens module according to an embodiment of the present invention.
  • the lens module 100 shown in FIG. 1 to FIG. 5 can be assembled by the assembly method 200 .
  • the assembling method 200 includes:
  • step S201 the image sensor is electrically connected to the PCB board.
  • step S202 the PCB board is fixed to the base through the first adhesive layer.
  • step S203 the lens is fixed on the base through a second adhesive layer, wherein the thickness of the first adhesive layer and the second adhesive layer are the same and the selected materials are the same, so that when the first adhesive layer and the second adhesive layer are the same thickness
  • the adhesive layer and the second adhesive layer expand or contract, the distance between the image sensor and the optical center of the lens is kept substantially constant.
  • the thickness of the lens holder is matched with the effective back focal length or flange distance of the lens, so that a second adhesive layer of the same material as the first adhesive layer is selected, and the second adhesive layer is made of the same material as the first adhesive layer.
  • the junction layer is fixed on the mirror base so that the thickness T2 of the second bond is approximately equal to T1.
  • the effective implementation of the assembly method requires very accurate control of the back focal length or flange distance (in the case of flange structure) of each lens, or accurate measurement results that can be adapted to the thickness of the lens mount.
  • the thickness of the lens holder is 0, that is, when there is no lens holder, a second adhesive layer of the same material as the first adhesive layer is selected, the second adhesive layer is arranged on the substrate, and the lens is aligned
  • the substrate is bonded to the lens through a second adhesive layer, and the thickness T2 of the second adhesive layer is approximately equal to T1. Therefore, when the first adhesive layer is changed, the second adhesive layer is also changed by the same amount.
  • the offset between the PCB board and the image sensor is the same as the offset of the lens. Consistent and ideally compensated perfectly.
  • the above method 200 can be applied to the case where the base includes a substrate and a mirror holder, and also applies to the case where the base does not include a mirror holder.
  • the base includes a substrate but does not include a mirror holder
  • the first adhesive layer is provided between the substrate and the PCB board
  • the second adhesive layer is provided on the between the lens and the substrate.
  • the method 200 further includes: fixing the lens mount on the base plate for mounting the lens.
  • the first adhesive layer is arranged between the substrate and the PCB board, and the second adhesive layer is arranged between the lens and the lens holder.
  • the lens has a flange structure on its outer periphery, and in step S203, the second adhesive layer is disposed on the flange structure and the lens holder between.
  • the materials of the first adhesive layer and the second adhesive layer are selected from UV glue, thermosetting glue, epoxy resin glue, pressure sensitive glue, moisture curing glue and light curing glue Group of glue.
  • FIG. 21 shows a flowchart of a method for assembling a lens module according to still another embodiment of the present invention.
  • the lens module 100 shown in FIG. 6 to FIG. 9 can be assembled through the assembly method 300 .
  • the assembling method 300 includes:
  • step S301 the image sensor is electrically connected to the PCB.
  • the PCB board is obtained by assembling the PCB and electronic components.
  • step S302 the PCB board is fixed to the substrate.
  • the PCB board is, for example, fixedly mounted in the middle of the substrate.
  • step S303 the lens is fixed to the lens holder through the second adhesive layer.
  • the mirror seat is a hollow cylinder with an "L"-shaped cross section.
  • the lens holder has a vertical annular wall (constituting the vertical portion of the L-shape), and an inwardly extending annular portion (constituting the horizontal portion of the L-shape) at the upper or top end of the annular wall, the annular portion It is opposite to the end of the lens away from the base plate or the flange structure of the lens.
  • the end of the lens away from the substrate or the flange structure of the lens is fixed to the annular portion of the lens holder through a second adhesive layer, and the thickness of the second adhesive layer is T2.
  • step S304 the lens holder is fixed to the PCB board or the substrate through a first adhesive layer.
  • the first adhesive layer is coated on the upper surface of the PCB board or the edge of the upper surface of the substrate, and the bottom of the annular wall of the mirror base is fixed to the PCB board or the substrate above, after the first adhesive layer is cured to obtain a thickness T1.
  • the second adhesive layer and the first adhesive layer are made of the same material, and the thickness T2 of the second adhesive layer is approximately equal to the thickness T1 of the first adhesive layer.
  • the two expand or contract by the same amount, so as to keep the distance between the image sensor and the optical center of the lens within The same shift occurs in the direction of the optical axis of the lens, which is perfectly compensated under ideal conditions.
  • FIG. 22 shows a flowchart of a method for assembling a lens module according to still another embodiment of the present invention.
  • the lens module 100 shown in FIG. 10 to FIG. 19 can be assembled through the assembly method 400 .
  • the assembling method 400 includes:
  • step S401 the image sensor is electrically connected to the PCB board.
  • the PCB board is obtained by assembling the PCB and electronic components.
  • step S402 the PCB board is fixed to the substrate.
  • the PCB board is, for example, fixedly mounted in the middle of the substrate.
  • step S403 the lens and the second end of the connecting member are bonded together by a second adhesive layer, and the thickness of the second adhesive layer is T2.
  • step S404 the lens holder is fixed on the substrate or the PCB.
  • the mirror holder is fixedly installed at the edge of the substrate to surround the PCB; or the area of the PCB is large, the mirror holder can be fixedly installed at the edge of the PCB.
  • the lens holder and the first end of the connector are bonded together by the first adhesive layer.
  • the thickness of the first adhesive layer is T1. wherein the first adhesive layer and the second adhesive layer have the same thickness and are selected from the same material so as to maintain the image when the first adhesive layer and the second adhesive layer expand or contract
  • the distance between the sensor and the optical center of the lens is substantially constant.
  • the connector is a lens cap
  • the first annular portion of the lens cap is bonded to the upper end of the lens holder through a first adhesive layer, wherein there is a loose fit between the lens cap and the lens
  • the second annular portion is bonded to the upper end of the lens through a second adhesive layer
  • the thickness T2 of the second adhesive layer is substantially the same as the thickness T1 of the first adhesive layer.
  • the second adhesive layer when the first adhesive layer changes, the second adhesive layer also changes by the same amount.
  • the offset between the PCB board and the image sensor is the same as the offset of the lens. Consistent and ideally compensated perfectly.
  • the assembly of the lens module can be made more flexible by controlling the deviation of the optical/mechanical axis and the change of the FEL.
  • the connecting member is a lens cap
  • the lens cap has a first annular portion forming a first end, a second annular portion forming a second end, and connecting the first annular portion and the second annular portion.
  • the wall part of two annular parts, the first annular part is located above the mirror base, and is bonded to the mirror base through the first adhesive layer in step S404, and the second annular part is located at the above the lens, and is bonded to the lens through the second adhesive layer in step S403.
  • the connecting piece is an annular piece
  • the annular piece is a flat piece with a hollowed-out center
  • the outer circumference of the lower surface of the annular piece constitutes the first end
  • the inner circumference constitutes the second end
  • the lens has a flange structure on its outer periphery.
  • the first adhesive layer bonds the first end of the ring member to the lens holder
  • the second adhesive layer bonds the flange structure to the lens holder.
  • the second ends of the ring members are bonded together.
  • the connecting piece is an annular piece
  • the annular piece is a flat piece with a hollowed-out center
  • the outer circumference of the upper surface of the annular piece constitutes the first end
  • the inner circumference of the annular piece constitutes the first end.
  • a second end is formed;
  • the lens has a flange structure on its outer circumference, and the lens holder has a vertical annular wall and an annular portion extending inward at the upper or top end of the annular wall.
  • the first adhesive layer bonds the first end of the annular member to the annular portion of the lens holder
  • the second adhesive layer bonds the flange The structure is bonded to the second end of the ring.
  • the materials of the first adhesive layer and the second adhesive layer are selected from UV glue, thermosetting glue, epoxy resin glue, pressure sensitive glue, moisture curing glue and light curing glue Group of glue.

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Abstract

本发明提供一种镜头模组及镜头模组的装配方法，镜头模组包括：基座；PCB板，所述PCB板设置在所述基座上；镜头，所述镜头包括一个或多个镜片，并设置在所述基座上；第一粘结层，所述第一粘结层设置在所述基座与所述PCB板之间，将所述基座与所述PCB板粘结起来；和第二粘结层，所述第二粘结层设置在所述基座与所述镜头之间，将所述基座与所述镜头粘结起来。通过本发明的实施例，不会影响镜头模组的成像效果，提高了镜头模组的解像力和成像质量，尤其是抵消了由于粘结层本身发生的变化而导致的理想成像面和图像传感器所在平面偏移而导致的成像质量下降。本发明提供的镜头模组中，整个摄像模组有两处粘结层，两处粘结层的厚度和材料一致，其变化相互抵消。

Description

镜头模组及其装配方法 技术领域
本发明大致涉及光电技术领域，尤其涉及一种镜头模组及其装配方法。
背景技术
在镜头技术领域中，当像素升级为8MP(百万像素)后，像素大小到了2.1μm甚至更小，使得整个系统的DOF(可聚焦范围，Depth of Focus)只有几个微米。在镜头模组系统中，AA胶水用于镜头与镜座或基板之间，起固定和AA调焦的作用。AA胶水本身的厚度至少有200μm甚至更大。对于常见的UV+热固化胶水，例如Delo的OB787和786等，在UV预固化后，需要进一步烘烤热固化，而热固化后胶水会进一步收缩，这个收缩量确实有均值可以参考，但是本身不是固定，有一个分布。举例而言，对于常见的450μm胶水厚度，这个收缩均值可以通过实验测出，根据胶水不同可能在8μm左右，但是本身的方差可能就有1μm甚至更大。假设方差是1μm，那么97％的概率收缩范围为8μm+/-2μm。而这个+/-2μm的范围使得同一批模组的后焦变化达到了4μm甚至更大。
另外一方面，在相机模组做了可靠性测试后，由于胶水自身收缩或者膨胀的缘故会出现胶水厚度变化。在潮湿的工作环境中，胶水本身会不断吸收水汽，吸水后会膨胀，理论上在干燥的环境里会逐渐脱水，然后收缩，但是收缩的时间可能会很长而且很难控制，因而影响了镜头模组的成像效果。这种可靠性测试后的厚度变化是不可控的，而且很难预测，会影响镜头模组的解像力和成像质量。
行业是通过可靠性测试的结果作为加速老化的参考，来预测相机在真实场景下使用比如5年后，大概的成像情况。胶水作为一种有机物，在各种极端的测试环境比如冷热冲击和高温高湿后，会出现和出厂时不一样的厚度。这个厚度变化，即使是一两个微米，也会严重影响到相机的成像质量，但这个影响的不可预测性，使得前期的补偿成为不可能。
背景技术部分的内容仅仅是发明人所知晓的技术，并不当然代表本领域的现有技术。
发明内容
有鉴于现有技术的至少一个缺陷，本发明提出一种镜头模组，包括：基座；PCB板，所述PCB板设置在所述基座上；
镜头，所述镜头包括一个或多个镜片，并设置在所述基座上；第一粘结层，所述第一粘结层设置在所述基座与所述PCB板之间，将所述基座与所述PCB板粘结起来；和第二粘结层，所述第二粘结层设置在所述基座与所述镜头之间，将所述基座与所述镜头粘结起来。
根据本发明的一个方面，还包括图像传感器，所述图像传感器设置在所述PCB板上，其中所述第一粘结层和所述第二粘结层的厚度基本相同且选用材料相同，从而当 所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。
根据本发明的一个方面，其中所述基座包括基板，所述第一粘结层设置在所述基板与所述PCB板之间，所述第二粘结层设置在所述镜头与所述基板之间。
根据本发明的一个方面，其中所述基座包括基板和镜座，所述镜座固定在所述基板上，用于安装所述镜头，所述第一粘结层设置在所述基板与所述PCB板之间，所述第二粘结层设置在所述镜头与所述镜座之间，其中所述镜座和所述基板成整体。
根据本发明的一个方面，其中所述镜头具有位于其外周缘上的法兰结构，所述第二粘结层设置在所述法兰结构与所述镜座之间。
根据本发明的一个方面，其中所述第一粘结层和所述第二粘结层的材料选自由UV胶、热固胶、环氧树脂胶、压敏胶、湿气固化胶和光固化胶构成的组。
根据本发明的一个方面，还包括位于所述基座与所述PCB板之间的散热热浆。
本发明还涉及一种镜头模组，包括：
基板；
镜座，所述镜座固定在所述基板上；
PCB板，所述PCB板设置在所述基板上；
镜头，所述镜头包括一个或多个镜片；
第一粘结层，所述第一粘结层设置在所述镜座与所述基板之间或所述镜座与所述PCB板之间；
第二粘结层，所述第二粘结层设置在所述镜头与所述镜座之间。
根据本发明的一个方面，其中所述镜头具有位于其外周缘上的法兰结构，所述第二粘结层设置在所述法兰结构与所述镜座之间。
根据本发明的一个方面，还包括图像传感器，所述图像传感器设置在所述PCB板上，其中所述第一粘结层和所述第二粘结层的厚度基本相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。
本发明还涉及一种镜头模组，包括：
基板；
PCB板，所述PCB板设置在所述基板上；
镜座，所述镜座固定在所述PCB板或所述基板上；
镜头，所述镜头包括一个或多个镜片；
连接件，所述镜头通过所述连接件连接到所述镜座；
第一粘结层，所述第一粘结层设置在所述镜座和所述连接件的第一端之间；和
第二粘结层，所述第二粘结层设置在所述镜头与所述连接件的第二端之间。
根据本发明的一个方面，还包括图像传感器，所述图像传感器设置在所述PCB板上，其中所述第一粘结层和所述第二粘结层的厚度基本相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。
根据本发明的一个方面，其中所述连接件为镜头帽，所述镜头帽具有构成第一端 的第一环形部、构成第二端的第二环形部和连接所述第一环形部和所述第二环形部的壁部，所述第一环形部位于所述镜座上方并通过所述第一粘结层与所述镜座粘结起来，所述第二环形部位于所述镜头上方并通过所述第二粘结层与所述镜头粘结起来，其中所述镜座和所述基板可以是一体加工。
根据本发明的一个方面，其中所述连接件为镜头帽，所述镜头帽具有构成第一端的第一环形部、构成第二端的第二环形部和连接所述第一环形部和所述第二环形部的壁部；所述镜头具有位于其外周上的法兰结构；所述第一环形部位于所述镜座上方并通过所述第一粘结层与所述镜座粘结起来，所述第二环形部位于所述法兰结构上方并通过所述第二粘结层与所述法兰结构粘结起来，其中所述镜座和所述基板可以是一体加工。
根据本发明的一个方面，其中所述连接件为环形件，所述环形件为中部镂空的扁平件，所述环形件的上表面或下表面的外周构成第一端，内周构成第二端；所述镜头具有位于其外周上的法兰结构，所述第一粘结层将所述环形件的第一端与所述镜座粘结起来，所述第二粘结层将所述法兰结构与所述环形件的第二端粘结起来，其中所述镜座和所述基板成整体。
本发明还涉及一种镜头模组的装配方法，包括：
将图像传感器电连接到PCB板上；
通过第一粘结层将所述PCB板固定到基座上；
通过第二粘结层将镜头固定到所述基座上，其中所述第一粘结层和所述第二粘结层的厚度相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。
本发明还涉及一种镜头模组的装配方法，包括：
将图像传感器电连接到PCB板上；
将所述PCB板固定到基板上；
通过第二粘结层将镜头固定到镜座上；
通过第一粘结层将所述镜座固定到所述PCB板或所述基板上，其中所述第一粘结层和所述第二粘结层的厚度相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。
本发明还涉及一种镜头模组的装配方法，包括：
将图像传感器电连接到PCB板上；
将所述PCB板固定到基板上；
通过第二粘结层将镜头与连接件的第二端粘接在一起；
将镜座固定在所述PCB板或所述基板上；
通过第一粘结层将所述镜座和所述连接件的第一端粘接在一起，其中所述第一粘结层和所述第二粘结层的厚度相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。
本发明的实施例通过提出一种镜头模组及其装配方法，在所述镜头模组内部的两个相应位置设置厚度、材料均相同的粘结层，所述两个位置的粘结层因发生同步异变而使造成的偏移量相互抵消，尤其是抵消了由于粘结层本身发生的变化而导致的理想 成像面和图像传感器所在平面偏移而导致的成像质量下降，不会影响镜头模组的成像效果，提高了镜头模组的解像力以及成像质量。
附图说明
附图用来提供对本发明的进一步理解，并且构成说明书的一部分，与本发明的实施例一起用于解释本发明，并不构成对本发明的限制。在附图中：
图1示出了根据本发明一个实施例的镜头模组的示意图；
图2示出了根据本发明一个实施例的镜头模组的剖面图；
图3示出了根据本发明一个实施例的镜头模组的示意图；
图4示出了根据本发明一个实施例的镜头模组的示意图；
图5示出了根据本发明一个实施例的镜头模组的剖面图；
图6示出了根据本发明一个实施例的镜头模组的示意图；
图7示出了根据本发明一个实施例的镜头模组的示意图；
图8示出了根据本发明一个实施例的镜头模组的示意图；
图9示出了根据本发明一个实施例的镜头模组的示意图；
图10示出了根据本发明一个实施例的镜头模组的示意图；
图11示出了根据本发明一个实施例的镜头模组的剖面图；
图12示出了根据本发明一个实施例的镜头模组的示意图；
图13示出了根据本发明一个实施例的镜头模组的示意图；
图14示出了根据本发明一个实施例的镜头模组的剖面图；
图15示出了根据本发明一个实施例的镜头模组的示意图；
图16示出了根据本发明一个实施例的镜头模组的示意图；
图17示出了根据本发明一个实施例的镜头模组的示意图；
图18示出了根据本发明一个实施例的镜头模组的示意图；
图19示出了根据本发明另一个实施例的镜头模组的示意图；
图20示出了根据本发明一个实施例的镜头模组装配方法的流程图；
图21示出了根据本发明另一个实施例的镜头模组装配方法的流程图；和
图22示出了根据本发明再一个实施例的镜头模组装配方法的流程图。
具体实施方式
在下文中，仅简单地描述了某些示例性实施例。正如本领域技术人员可认识到的那样，在不脱离本发明的精神或范围的情况下，可通过各种不同方式修改所描述的实施例。因此，附图和描述被认为本质上是示例性的而非限制性的。
在本发明的描述中，需要理解的是，术语"中心"、"纵向"、"横向"、"长度"、"宽度"、"厚度"、"上"、"下"、"前"、"后"、"左"、"右"、"竖直"、"水平"、"顶"、"底"、"内"、"外"、"顺时针"、"逆时针"等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语"第一"、"第二"仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有"第一"、"第二"的特征可以明示 或者隐含地包括一个或者更多个所述特征。在本发明的描述中，"多个"的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语"安装"、"相连"、"连接"应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接:可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之"上"或之"下"可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征"之上"、"上方"和"上面"包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征"之下"、"下方"和"下面"包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
以下结合附图对本发明的优选实施例进行说明，应当理解，此处所描述的优选实施例仅用于说明和解释本发明，并不用于限定本发明。
为了解决现有技术的镜头模组中胶水膨胀或收缩导致影响镜头模组的解像力和成像质量的问题，本申请的发明人构思出，通过在镜头模组中的两个指定位置设置粘结层，利用在同一环境中粘结层异变一致(同时膨胀或收缩)的特性，解决了现有技术中的粘结层因为异变而影响模组的成像效果的问题，提高了镜头模组的解像力和成像质量。另外通过设置粘结层的厚度能够更好的保证模组中各组件间公差的冗余。下面参考附图详细描述。
图1示出了根据本发明一个实施例的镜头模组的示意图，图2示出了根据本发明一个实施例的镜头模组的剖面图。如图1和图2所示，所述镜头模组100包括：基座10、PCB板20、镜头30、第一粘结层40和第二粘结层50。其中所述PCB板20设置在所述基座10上，所述PCB板20上可设置有镜头模组30工作所需要的各种电路和芯片。所述镜头30大致为圆柱状，具有环形外壳，内部包括一个或多个镜片，例如图1所示的镜片31、镜片32或如图2所示的镜片31、32、33、34，镜头30设置在所述基座10上。图1和图2的实施例中，基座10包括基板11和镜座12。所述第一粘结层40设置在所述基座10与所述PCB板20之间(具体是基板11与PCB板20之间)，例如成环形分布，将所述基座10与所述PCB板20粘结起来，所述第二粘结层50设置在所述基座10与所述镜头30之间(具体是镜座12的端部与所述镜头30的端部之间，二者的端部相对靠近)，例如成环形分布，将所述基座10与所述镜头30粘结起来。可选地，根据加工和成型的方式，所述镜座12和所述基板11可以是一体加工，二者成整体，经过 一体加工得到包括基板11和镜座12的基座10。
根据本发明的一个实施例，如图1所示，所述镜头模组100还包括图像传感器60，所述图像传感器60设置在所述PCB板20上。图像传感器60位于所述镜头30的焦平面上，从而镜头30可以将来自外部的光束汇聚到所述图像传感器60上进行成像。所述图像传感器60例如为CMOS图像传感器，或者CCD图像传感器。
根据本发明的一个优选实施例，所述第一粘结层40和所述第二粘结层50设置为厚度基本相同(厚度相差20％以内可认为基本相同，或者在10％以内，或者在5％或1％以内)、且选用相同的材料。因此当处在相同的环境条件下，无论是由于吸水或失水，或是由于高温或低温，所述第一粘结层40和所述第二粘结层50发生膨胀或收缩时，所述第一粘结层40和第二粘结层50能够同步膨胀或者收缩，并且膨胀或者收缩的距离和方向也相同，从而能保持所述图像传感器60与所述镜头30的光心之间的距离基本不变，即始终将图像传感器60保持在镜头30的焦平面上，因此所述膨胀或者收缩不会影响镜头模组100的成像效果。例如当处于潮湿的环境中时，第一粘结层40可能会由于吸收水分而膨胀，导致图像传感器60在图中沿着向上的方向移动；同时，第二粘结层50同样会由于吸收水分而膨胀，导致镜头30在图中沿着向上的方向移动，光心也向上移动，并且由于二者材料相同，厚度相同，因此向上移动的距离大致相等，因此能够保持所述图像传感器60与镜头30的光心之间的距离基本不变。本发明中，图像传感器60与镜头30的光心之间的距离变动幅度小于10％，即可认为二者之间的距离基本不变。优选的，变动浮动小于5％，或者更优选的小于1％，即可认为二者之间的距离基本不变。
根据本发明的一个实施例，其中所述第一粘结层40和所述第二粘结层50的材料选自由UV胶、热固胶、环氧树脂胶、压敏胶、湿气固化胶和光固化胶构成的组。如图1和图2所示，所述PCB板20和基座10通过由胶水材质组成的第一粘结层40连接，由于胶水材质的肖氏硬度相对于机械结构件(如螺钉)更低，因此可以起到一定的缓冲作用，在镜头模组的使用过程中所述第一粘结层40对PCB板20的挤压形变会较小，这在一定程度上保护了所述PCB板20，在出现基板11和PCB板20在温度发生变化后膨胀不一致的情况下，降低了施加到PCB板20的热应力，进一步降低了其可能的形变。这个形变理论上会直接影响到传感器60，引起CMOS的成像面的翘曲等。所述镜头30和基座10通过由同样材质的胶水组成的第二粘结层50连接，相比于机械结构连接件，在使用过程中第二粘结层50也对所述镜头30起到了一定的缓冲和保护作用，在此不再赘述。除此以外，所述粘结层的厚度可以根据镜头模组的组装需要进行调节，例如将所述粘结层的厚度设置的更厚，能够更好的保证镜头模组中各组件间公差的冗余，且第一粘结层40和第二粘结层50因为同步异变使所述图像传感器60和所述镜头30在镜头光轴方向上产生的偏移量互相抵消，能够消除或者减轻对成像效果造成的影响。
图3示出了根据本发明另一个实施例的镜头模组的示意图。如图所示，其中所述基座10包括基板11，而不包括图1和图2实施例中的镜座12。在图3的实施例中，所述第一粘结层40设置在所述基板11与所述PCB板20之间，所述第二粘结层50设置在所述镜头30与所述基板11之间，从而可以抵消所述图像传感器60和所述镜头30因粘结层发生异变而在镜头光轴方向上产生的偏移量。图3实施例的工作原理与图1 和图2实施例的工作原理基本相同，此处不再赘述。
图4示出了根据本发明一个实施例的镜头模组的示意图，图5示出了根据本发明一个实施例的镜头模组的剖面图。如图4和图5所示，其中所述基座10包括基板11和镜座12，所述镜座12固定在所述基板11上，用于安装所述镜头30。可选地，根据加工和成型的方式，所述镜座12和所述基板11可以是一体加工，二者成整体，经过一体加工得到包括基板11和镜座12的基座10。所述第一粘结层40设置在所述基板11与所述PCB板20之间，所述第二粘结层50设置在所述镜头30与所述镜座12之间。
与图1和图2的实施例不同，如图4所示，所述镜头模组100中的镜头30具有位于其外周缘上的法兰结构70，所述法兰结构70例如是环形的板状件，与镜头30的外壳一体形成，或者固定在镜头30的外壳上。所述法兰结构位于所述镜座12的上端部的上方，所述第二粘结层50设置在所述法兰结构70与所述镜座12的上端部之间。类似的，第一粘结层40和第二粘结层50设置为厚度基本相同、且选用相同的材料。因此当处在相同的环境条件下，无论是由于吸水或失水，或是由于高温或低温，所述第一粘结层40和所述第二粘结层50发生膨胀或收缩时，所述第一粘结层40和第二粘结层50能够同步膨胀或者收缩，并且膨胀或者收缩的距离和方向也相同，从而能保持所述图像传感器60与所述镜头30的光心之间的距离基本不变，即始终将图像传感器60保持在镜头30的焦平面上，因此所述膨胀或者收缩不会影响镜头模组100的成像效果。
根据本发明一个实施例，如图1、图3和图4所示，所述镜头模组100还包括位于所述基座10与所述PCB板20之间的散热热浆80，所述散热热浆80用于对所述PCB板20进行散热。
图6示出了示出了根据本发明另一个实施例的镜头模组的示意图。如6所示，所述镜头模组100包括基板11、镜座12、PCB板20、镜头30、第一粘结层40和第二粘结层50。其中所述镜座12固定在所述PCB板20上，用于安装所述镜头30，所述PCB板20设置在所述基板11上。所述镜头30包括一个或多个镜片如31、32，所述镜座12为横截面为“L”形的镂空圆柱。例如，所述镜座12具有竖直的环形壁(构成L形的竖直部分)，在该环形壁的上部或者顶端具有向内延伸的环状部(构成L形的水平部分)，所述环状部与所述镜头30远离基板11的一端相对，环状部位于所述镜头30远离基板11一端的外部。所述PCB板20锁付固定在所述基板11上，所述镜座12用于安装所述镜头30。值得注意的是，在这个结构里，基板11本身不与镜座12直接发生接触，换句话说，基板11并不是必须存在，在一些设计里，可以没有基板11。所述第一粘结层40设置在所述镜座12的环形壁的底部与所述PCB板20之间，所述第二粘结层50设置在所述镜头30远离基板11的一端与所述镜座12的环状部之间。图7示出了根据本发明一个实施例的镜头模组的示意图。如图7所示，所述镜头模组100包括基板11、镜座12、PCB板20、镜头30、第一粘结层40和第二粘结层50。其中所述镜座12固定在所述基板11上，用于安装所述镜头30，所述PCB板设置在所述基板11上。所述镜头30包括一个或多个镜片如31、32，所述镜座12为横截面为“L”形的镂空圆柱。例如，所述镜座12具有竖直的环形壁(构成L形的竖直部分)，在该环形壁的上部或者顶端具有向内延伸的环状部(构成L形的水平部分)，所述环状部与所述镜头30远离基板11的一端相对，环状部位于所述镜头30远离基板11一端的外部。所述第一 粘结层40设置在所述镜座12的环形壁的底部与所述基板11之间，所述第二粘结层50设置在所述镜头30远离基板11的一端与所述镜座12的环状部之间。
图8示出了根据本发明一个实施例的镜头模组的示意图。如图8所示，所述镜头模组100包括基板11、镜座12、PCB板20、镜头30、第一粘结层40和第二粘结层50。其中所述镜座12固定在所述基板11上，用于安装所述镜头30，所述PCB板设置在所述基板11上。所述镜头30包括一个或多个镜片如31、32，且具有位于其外周缘上的法兰结构70，所述法兰结构70例如是环形的板状件，与所述镜头30的外壳一体形成，或者固定在镜头30的外壳上。其中所述镜座12为横截面为“L”形的镂空圆柱。例如，所述镜座12具有竖直的环形壁(构成L形的竖直部分)，在该环形壁的上部或者顶端具有向内延伸的环状部(构成L形的水平部分)，所述环状部与所述法兰结构70相对，环状部位于法兰结构70上方。所述第一粘结层40设置在所述镜座12的环形壁的底部与所述基板11之间，所述第二粘结层50设置在所述法兰结构70与所述镜座12的环状部之间。
图9示出了根据本发明另一个实施例的镜头模组的示意图。如图9所示，所述镜头模组100包括基板11、镜座12、PCB板20、镜头30、第一粘结层40和第二粘结层50。其中所述镜座12固定在所述PCB板20上，用于安装所述镜头30，所述PCB板20设置在所述基板11上。所述镜头30包括一个或多个镜片如31、32，所述镜头30还具有位于其外周缘上的法兰结构70，所述法兰结构70例如是环形的板状件，与所述镜头30的外壳一体形成，或者固定在镜头30的外壳上。所述镜座12为横截面为“L”形的镂空圆柱。例如，所述镜座12具有竖直的环形壁(构成L形的竖直部分)，在该环形壁的上部或者顶端具有向内延伸的环状部(构成L形的水平部分)，所述环状部与所述法兰结构70相对，环状部位于法兰结构70上方。所述PCB板20锁付固定在所述基板11上，所述镜座12用于安装所述镜头30。值得注意的是，在这个结构里，基板11本身不与镜座12直接发生接触，换句话说，这里的基板11并不是必须存在，在一些设计里，可以没有基板11。所述第一粘结层40设置在所述镜座12的环形壁的底部与所述PCB板20之间，所述第二粘结层50设置在所述镜头30与所述镜座12的环状部之间，具体的，所述第二粘结层50设置在所述法兰结构70与所述镜座12的环状部之间。图6至图9实施例的工作原理与图1和图2实施例工作原理基本相同，此处不再赘述。
图10示出了根据本发明另一个实施例的镜头模组的示意图，图11示出了根据本发明一个实施例的镜头模组的剖面图。如图10和图11所示，所述镜头模组100包括基板11、镜座12、PCB板20、镜头30、连接件90、第一粘结层40和第二粘结层50。基板11和镜座12共同构成基座10。其中所述镜座12直接固定在所述基板11上，所述PCB板20设置在所述基板11上。可选地，根据加工和成型的方式，所述镜座12和所述基板11可以是一体加工，二者成整体，经过一体加工得到包括基板11和镜座12的基座10。所述镜头30包括一个或多个镜片,例如图10所示的镜片31、镜片32或者图11所示的镜片31、32、33、34。所述镜头30通过所述连接件90连接到所述镜座12。所述第一粘结层40设置在所述镜座12和所述连接件90的第一端之间，所述第二粘结层50设置在所述镜头30与所述连接件90的第二端之间。
图12示出了根据本发明另一个实施例的镜头模组的示意图，图12中镜头模组的 结构与图10中镜头模组结构大体相同，不同之处在于：所述镜座12直接固定在所述PCB板20上，所述PCB板20设置在所述基板11上。
根据本发明的一个实施例，如图6至图12所示，所述镜头模组100还包括图像传感器60，所述图像传感器60设置在所述PCB板20上，其中所述第一粘结层40和所述第二粘结层50设置为厚度基本相同、且选用相同的材料。当处在相同的环境条件下，所述第一粘结层40和所述第二粘结层50发生膨胀或收缩时，所述第一粘结层40和第二粘结层50能够同步膨胀或者收缩，理论情况下所述膨胀或者收缩的距离也相同，从而能保持所述图像传感器60与所述镜头30的光心之间的距离基本不变，不会影响镜头模组的成像效果。
根据本发明的一个实施例，如图10、图11和图12所示，其中所述连接件90为镜头帽，所述镜头帽具有构成第一端的第一环形部91、构成第二端的第二环形部92和连接所述第一环形部91和第二环形部92的壁部93。所述第一环形部91位于所述镜座12上方并通过所述第一粘结层40与所述镜座12粘结起来，所述第二环形部92位于所述镜头30上方并通过所述第二粘结层50与所述镜头30粘结起来。
图13示出了根据本发明一个实施例的镜头模组的示意图，图14示出了根据本发明一个实施例的镜头模组的剖面图。如图13和图14所示，其中所述连接件90为环形件，所述环形件为中部镂空的扁平件，所述环形件的下表面的外周构成第一端，内周构成第二端。可选地，所述环形件为圆环。所述镜头30具有位于其外周上的法兰结构70。所述连接件90位于所述镜座12的上端和法兰结构70的上方。所述第一粘结层40将所述环形件的第一端与所述镜座12(上端)粘结起来，所述第二粘结层50将所述法兰结构70与所述环形件的第二端粘结起来。
图15示出了根据本发明另一个实施例的镜头模组的示意图。图15中镜头模组的结构与图13中镜头模组结构大体相同，不同之处在于：所述镜座12直接固定在所述PCB板20上，所述PCB板20设置在所述基板11上。
图16示出了根据本发明另一个实施例的镜头模组的示意图。如图16所示，与图13类似地，其中所述连接件90为环形件，所述环形件为中部镂空的扁平件，所述环形件的上表面的外周构成第一端，内周构成第二端。可选地，所述环形件为圆环。所述镜头30具有位于其外周缘上的法兰结构70，所述法兰结构70例如是环形的板状件，与所述镜头30的外壳一体形成，或者固定在镜头30的外壳上。所述镜座12为横截面为“L”形的镂空圆柱。例如，所述镜座12具有竖直的环形壁(构成L形的竖直部分)，在该环形壁的上部或者顶端具有向内延伸的环状部(构成L形的水平部分)，所述环状部与所述法兰结构70相对。所述连接件90位于所述镜座12的内部，具体位于所述镜座12的环状部和法兰结构70的下方。所述第一粘结层40将所述环形件(连接件90)的第一端与所述镜座12的环状部粘结起来，所述第二粘结层50将所述环形件(连接件90)的第二端与所述法兰结构70粘结起来。所述镜座12的环形壁的底部固定在基板11上。
图17示出了根据本发明另一个实施例的镜头模组的示意图。图17中镜头模组的结构与图16中镜头模组结构大体相同，不同之处在于：所述镜座12直接固定在所述PCB板20上，所述PCB板20设置在所述基板11上。
图18示出了根据本发明另一个实施例的镜头模组的示意图。如图18所示，与图10类似地，所述镜头模组100包括基板11、镜座12、PCB板20、镜头30、连接件90、第一粘结层40和第二粘结层50。基板11和镜座12共同构成基座10。其中所述镜座12直接固定在所述基板11上，所述PCB板20设置在所述基板11上。可选地，根据加工和成型的方式，所述镜座12和所述基板11可以是一体加工，二者成整体，经过一体加工得到包括基板11和镜座12的基座10。具体地，所述镜头30具有位于其外周缘上的法兰结构70，所述法兰结构70例如是环形的板状件，与所述镜头30的外壳一体形成，或者固定在镜头30的外壳上。所述连接件90为镜头帽，所述镜头帽具有构成第一端的第一环形部91、构成第二端的第二环形部92和连接所述第一环形部91和第二环形部92的壁部93。所述第一环形部91位于所述镜座12上方并通过所述第一粘结层40与所述镜座12粘结起来，所述第二环形部92位于所述法兰结构70的上方并通过所述第二粘结层50与所述镜头30粘结起来。
图19示出了根据本发明另一个实施例的镜头模组的示意图。图19中镜头模组的结构与图18中镜头模组结构大体相同，不同之处在于：所述镜座12直接固定在所述PCB板20上，所述PCB板20设置在所述基板11上。
本发明的上述实施例提出一种镜头模组，通过在镜头模组中的两个指定位置设置材料和厚度均相同的粘结层，利用在同一环境中粘结层异变一致(同时膨胀或收缩)的特性，解决了现有技术中的粘结层因为异变而影响模组的成像效果的问题，提高了镜头模组的解像力和成像质量。同时，所述粘结层可以对PCB板、基板起到缓冲作用，提高了其使用寿命，且通过设置粘结层的厚度能够更好的保证模组中各组件间公差的冗余。
图20示出了根据本发明一个实施例的镜头模组装配方法的流程图。上述图1至图5中示出的镜头模组100可以通过所述装配方法200经装配得到。如图20所示，所述装配方法200包括：
在步骤S201：将图像传感器电连接到PCB板上。
在步骤S202：通过第一粘结层将所述PCB板固定到基座上。可选地，在所述PCB板的下表面涂上散热热浆，并在所述PCB板下表面的周围涂上所述第一粘结层，待所述第一粘结层固化得到其厚度为T1。
在步骤S203：通过第二粘结层将镜头固定到所述基座上，其中所述第一粘结层和所述第二粘结层的厚度相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。具体地，当有镜座时，匹配镜座的厚度与镜头的有效后焦距或者法兰距，使得选用与所述第一粘结层相同材料的第二粘结层，将所述第二粘结层固定在所述镜座上，使所述第二粘结的厚度T2大致等于T1。因此，所述装配方法的有效实施需要对每个镜头的后焦距或者法兰距(有法兰结构的情况)有非常准确的控制，或者有准确的测量结果可以对镜座的厚度适配。当镜座的厚度为0，即没有镜座时，选用与所述第一粘结层相同材料的第二粘结层，将第二粘结层设置在所述基板上，并将镜头对准基板，通过第二粘结层使基板和镜头粘结起来，且使所述第二粘结层的厚度T2大致与T1相等。从而当所述第一粘结层发生改变时，所述第二粘结层同时也改变相同的量，在镜头光轴方向， PCB板与图像传感器的偏移量和镜头的偏移量相同且一致，在理想情况下完美补偿。
上述方法200可适用于基座包括基板和镜座的情况，也适用于基座不包括镜座的情况。当所述基座包括基板但不包括镜座时，在所述步骤S202中，所述第一粘结层设置在所述基板与所述PCB板之间，所述第二粘结层设置在所述镜头与所述基板之间。
当所述基座包括基板和镜座时，所述方法200还包括：将所述镜座固定在所述基板上，用于安装所述镜头。其中所述第一粘结层设置在所述基板与所述PCB板之间，所述第二粘结层设置在所述镜头与所述镜座之间。
根据本发明的一个优选实施例，所述镜头具有位于其外周缘上的法兰结构，在所述步骤S203中，将所述第二粘结层设置在所述法兰结构与所述镜座之间。
根据本发明的一个优选实施例，所述第一粘结层和所述第二粘结层的材料选自由UV胶、热固胶、环氧树脂胶、压敏胶、湿气固化胶和光固化胶构成的组。
图21示出了根据本发明再一个实施例的镜头模组装配方法的流程图。上述图6至图9中示出的镜头模组100可以通过所述装配方法300经装配得到。如图21所示，所述装配方法300包括：
在步骤S301：将图像传感器电连接到PCB板上。可选地，其中所述PCB板通过PCB与电子元件组装获得。
在步骤S302：将所述PCB板固定到基板上。所述PCB板例如固定安装在所述基板的中间。
在步骤S303：通过第二粘结层将镜头固定到所述镜座上。所述镜座为横截面为“L”形的镂空圆柱。所述镜座具有竖直的环形壁(构成L形的竖直部分)，在该环形壁的上部或者顶端具有向内延伸的环状部(构成L形的水平部分)，所述环状部与所述镜头远离基板的一端或镜头的法兰结构相对。具体地，将镜头的远离基板的一端或镜头的法兰结构通过第二粘结层固定到所述镜座的环状部，所述第二粘结层的厚度为T2。
在步骤S304：通过第一粘结层将所述镜座固定到所述PCB板或所述基板上。可选地，在所述PCB板上表面或者所述基板上表面的边缘涂上所述第一粘结层，并将所述镜座的环形壁的底部固定到所述PCB板或所述基板上，待所述第一粘结层固化得到其厚度为T1。其中所述第二粘结层和所述第一粘结层选用相同的材料，且第二粘结层的厚度T2与第一粘结层的厚度T1大致相等。从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，二者发生膨胀或收缩的量相同，以保持所述图像传感器与所述镜头的光心之间的距离在镜头光轴方向发生相同的偏移，在理想情况下完美补偿。
图22示出了根据本发明再一个实施例的镜头模组装配方法的流程图。上述图10至图19中示出的镜头模组100可以通过所述装配方法400经装配得到。如图22所示，所述装配方法400包括：
在步骤S401：将图像传感器电连接到PCB板上。可选地，其中所述PCB板通过PCB与电子元件组装获得。
在步骤S402：将所述PCB板固定到基板上。所述PCB板例如固定安装在所述基板的中间。
在步骤S403：通过第二粘结层将所述镜头与所述连接件的第二端粘接在一起，所述第二粘结层的厚度为T2。
在步骤S404：将镜座固定在所述基板上或者所述PCB板上。所述镜座例如固定安装在所述基板的边缘位置，将所述PCB板包围起来；或者所述PCB板的面积较大，所述镜座可以固定安装在所述PCB板的边缘位置。
在步骤S405：通过第一粘结层将镜座和连接件的第一端粘接在一起。所述第一粘结层的厚度为T1。其中所述第一粘结层和所述第二粘结层的厚度相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。具体地，当所述连接件为镜头帽时，将所述镜头帽的第一环形部通过第一粘结层与所述镜座的上端粘结，其中镜头帽和镜头之间存在间隙松配，将第二环形部通过第二粘结层与所述镜头的上端粘结，并使所述第二粘结层的厚度T2与第一粘结层的厚度T1基本相同。当所述连接件为环形件时，将所述环形件的第一端通过第一粘结层与镜座粘结，第二端通过第二粘结层与镜头的法兰结构粘结，并使所述第二粘结层的厚度T2与第一粘结层的厚度T1基本相同。从而当所述第一粘结层发生改变时，所述第二粘结层同时也改变相同的量，在镜头光轴方向，PCB板与图像传感器的偏移量和镜头的偏移量相同且一致，在理想情况下完美补偿。另外，还可以通过控制光学/机械轴的偏差和FEL的变化使镜头模组的组装变得更灵活。
根据本发明的一个优选实施例，所述连接件为镜头帽，所述镜头帽具有构成第一端的第一环形部、构成第二端的第二环形部和连接所述第一环形部和第二环形部的壁部，所述第一环形部位于所述镜座上方，并在步骤S404中通过所述第一粘结层与所述镜座粘结起来，所述第二环形部位于所述镜头上方，并在步骤S403中通过所述第二粘结层与所述镜头粘结起来。
根据本发明的一个优选实施例，所述连接件为环形件，所述环形件为中部镂空的扁平件，所述环形件的下表面的外周构成第一端，内周构成第二端；所述镜头具有位于其外周上的法兰结构。在步骤S404中，所述第一粘结层将所述环形件的第一端与所述镜座粘结起来，在步骤S405中，所述第二粘结层将所述法兰结构与所述环形件的第二端粘结起来。
根据本发明的一个优选实施例，如图16所示，所述连接件为环形件，所述环形件为中部镂空的扁平件，所述环形件的上表面的外周构成第一端，内周构成第二端；所述镜头具有位于其外周上的法兰结构，所述镜座具有竖直的环形壁及在该环形壁的上部或者顶端向内延伸的环状部。在步骤S404中，所述第一粘结层将所述环形件的第一端与所述镜座的环形部粘结起来，在步骤S405中，所述第二粘结层将所述法兰结构与所述环形件的第二端粘结起来。
根据本发明的一个优选实施例，所述第一粘结层和所述第二粘结层的材料选自由UV胶、热固胶、环氧树脂胶、压敏胶、湿气固化胶和光固化胶构成的组。
最后应说明的是：以上所述仅为本发明的优选实施例而已，并不用于限制本发明，尽管参照前述实施例对本发明进行了详细的说明，对于本领域的技术人员来说，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (18)

  1. 一种镜头模组，包括：
    基座；
    PCB板，所述PCB板设置在所述基座上；
    镜头，所述镜头包括一个或多个镜片，并设置在所述基座上；
    第一粘结层，所述第一粘结层设置在所述基座与所述PCB板之间，将所述基座与所述PCB板粘结起来；和
    第二粘结层，所述第二粘结层设置在所述基座与所述镜头之间，将所述基座与所述镜头粘结起来。
  2. 根据权利要求1所述的镜头模组，还包括图像传感器，所述图像传感器设置在所述PCB板上，其中所述第一粘结层和所述第二粘结层的厚度基本相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。
  3. 根据权利要求1或2所述的镜头模组，其中所述基座包括基板，所述第一粘结层设置在所述基板与所述PCB板之间，所述第二粘结层设置在所述镜头与所述基板之间。
  4. 根据权利要求1或2所述的镜头模组，其中所述基座包括基板和镜座，所述镜座固定在所述基板上，用于安装所述镜头，所述第一粘结层设置在所述基板与所述PCB板之间，所述第二粘结层设置在所述镜头与所述镜座之间，其中所述镜座和所述基板成整体。
  5. 根据权利要求4所述的镜头模组，其中所述镜头具有位于其外周缘上的法兰结构，所述第二粘结层设置在所述法兰结构与所述镜座之间。
  6. 根据权利要求1或2所述的镜头模组，其中所述第一粘结层和所述第二粘结层的材料选自由UV胶、热固胶、环氧树脂胶、压敏胶、湿气固化胶和光固化胶构成的组。
  7. 根据权利要求1或2所述的镜头模组，还包括位于所述基座与所述PCB板之间的散热热浆。
  8. 一种镜头模组，包括：
    基板；
    镜座，所述镜座固定在所述基板上；
    PCB板，所述PCB板设置在所述基板上；
    镜头，所述镜头包括一个或多个镜片；
    第一粘结层，所述第一粘结层设置在所述镜座与所述基板之间或所述镜座与所述PCB板之间；
    第二粘结层，所述第二粘结层设置在所述镜头与所述镜座之间。
  9. 根据权利要求8所述的镜头模组，其中所述镜头具有位于其外周缘上的法兰结构，所述第二粘结层设置在所述法兰结构与所述镜座之间。
  10. 根据权利要求8或9所述的镜头模组，还包括图像传感器，所述图像传感器设置在所述PCB板上，其中所述第一粘结层和所述第二粘结层的厚度基本相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。
  11. 一种镜头模组，包括：
    基板；
    PCB板，所述PCB板设置在所述基板上；
    镜座，所述镜座固定在所述PCB板或所述基板上；
    镜头，所述镜头包括一个或多个镜片；
    连接件，所述镜头通过所述连接件连接到所述镜座；
    第一粘结层，所述第一粘结层设置在所述镜座与所述连接件的第一端之间；和
    第二粘结层，所述第二粘结层设置在所述镜头和所述连接件的第二端之间。
  12. 根据权利要求11所述的镜头模组，还包括图像传感器，所述图像传感器设置在所述PCB板上，其中所述第一粘结层和所述第二粘结层的厚度基本相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。
  13. 根据权利要求11或12所述的镜头模组，其中所述连接件为镜头帽，所述镜头帽具有构成第一端的第一环形部、构成第二端的第二环形部和连接所述第一环形部和所述第二环形部的壁部，所述第一环形部位于所述镜座上方并通过所述第一粘结层与所述镜座粘结起来，所述第二环形部位于所述镜头上方并通过所述第二粘结层与所述镜头粘结起来，其中所述镜座和所述基板可以是一体加工。
  14. 根据权利要求11或12所述的镜头模组，其中所述连接件为镜头帽，所述镜头帽具有构成第一端的第一环形部、构成第二端的第二环形部和连接所述第一环形部和所述第二环形部的壁部；所述镜头具有位于其外周上的法兰结构；所述第一环形部位于所述镜座上方并通过所述第一粘结层与所述镜座粘结起来，所述第二环形部位于所 述法兰结构上方并通过所述第二粘结层与所述法兰结构粘结起来，其中所述镜座和所述基板可以是一体加工。
  15. 根据权利要求11或12所述的镜头模组，其中所述连接件为环形件，所述环形件为中部镂空的扁平件，所述环形件的上表面或下表面的外周构成第一端、内周构成第二端；所述镜头具有位于其外周上的法兰结构，所述第一粘结层将所述环形件的第一端与所述镜座粘结起来，所述第二粘结层将所述法兰结构与所述环形件的第二端粘结起来，其中所述镜座和所述基板成整体。
  16. 一种镜头模组的装配方法，包括：
    将图像传感器电连接到PCB板上；
    通过第一粘结层将所述PCB板固定到基座上；
    通过第二粘结层将镜头固定到所述基座上，其中所述第一粘结层和所述第二粘结层的厚度相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。
  17. 一种镜头模组的装配方法，包括：
    将图像传感器电连接到PCB板上；
    将所述PCB板固定到基板上；
    通过第二粘结层将镜头固定到镜座上；
    通过第一粘结层将所述镜座固定到所述PCB板或所述基板上，其中所述第一粘结层和所述第二粘结层的厚度相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。
  18. 一种镜头模组的装配方法，包括：
    将图像传感器电连接到PCB板上；
    将所述PCB板固定到基板上；
    通过第二粘结层将镜头与连接件的第二端粘接在一起；
    将镜座固定在所述PCB板或所述基板上；
    通过第一粘结层将所述镜座和所述连接件的第一端粘接在一起，其中所述第一粘结层和所述第二粘结层的厚度相同且选用材料相同，从而当所述第一粘结层和所述第二粘结层膨胀或收缩时，保持所述图像传感器与所述镜头的光心之间的距离基本不变。
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