WO2022107692A1 - 有機el表示素子用封止材、その硬化物および有機el表示装置 - Google Patents
有機el表示素子用封止材、その硬化物および有機el表示装置 Download PDFInfo
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- WO2022107692A1 WO2022107692A1 PCT/JP2021/041696 JP2021041696W WO2022107692A1 WO 2022107692 A1 WO2022107692 A1 WO 2022107692A1 JP 2021041696 W JP2021041696 W JP 2021041696W WO 2022107692 A1 WO2022107692 A1 WO 2022107692A1
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- Prior art keywords
- organic
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- encapsulant
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- meth
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- 239000003566 sealing material Substances 0.000 title claims abstract description 22
- 150000001875 compounds Chemical class 0.000 claims abstract description 69
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- 125000004149 thio group Chemical group *S* 0.000 claims abstract description 8
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 4
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- 238000007789 sealing Methods 0.000 claims description 41
- 229910010272 inorganic material Inorganic materials 0.000 claims description 34
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- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- IYPNRTQAOXLCQW-UHFFFAOYSA-N [4-(sulfanylmethyl)phenyl]methanethiol Chemical compound SCC1=CC=C(CS)C=C1 IYPNRTQAOXLCQW-UHFFFAOYSA-N 0.000 description 1
- VGNFJJWLWFCHMR-UHFFFAOYSA-N [4-(sulfanylmethylsulfanyl)phenyl]sulfanylmethanethiol Chemical compound SCSC1=CC=C(SCS)C=C1 VGNFJJWLWFCHMR-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- ZQDJUKZNWBUSNT-UHFFFAOYSA-N benzene-1,2,3,4-tetrathiol Chemical compound SC1=CC=C(S)C(S)=C1S ZQDJUKZNWBUSNT-UHFFFAOYSA-N 0.000 description 1
- KHJIHSHHUDGOPQ-UHFFFAOYSA-N benzene-1,2,3,5-tetrathiol Chemical compound SC1=CC(S)=C(S)C(S)=C1 KHJIHSHHUDGOPQ-UHFFFAOYSA-N 0.000 description 1
- PPQNMKIMOCEJIR-UHFFFAOYSA-N benzene-1,2,3-trithiol Chemical compound SC1=CC=CC(S)=C1S PPQNMKIMOCEJIR-UHFFFAOYSA-N 0.000 description 1
- KVPDTCNNKWOGMZ-UHFFFAOYSA-N benzene-1,2,4,5-tetrathiol Chemical compound SC1=CC(S)=C(S)C=C1S KVPDTCNNKWOGMZ-UHFFFAOYSA-N 0.000 description 1
- UKLXGHUHPLLTKD-UHFFFAOYSA-N benzene-1,2,4-trithiol Chemical compound SC1=CC=C(S)C(S)=C1 UKLXGHUHPLLTKD-UHFFFAOYSA-N 0.000 description 1
- KXCKKUIJCYNZAE-UHFFFAOYSA-N benzene-1,3,5-trithiol Chemical compound SC1=CC(S)=CC(S)=C1 KXCKKUIJCYNZAE-UHFFFAOYSA-N 0.000 description 1
- ZWOASCVFHSYHOB-UHFFFAOYSA-N benzene-1,3-dithiol Chemical compound SC1=CC=CC(S)=C1 ZWOASCVFHSYHOB-UHFFFAOYSA-N 0.000 description 1
- WYLQRHZSKIDFEP-UHFFFAOYSA-N benzene-1,4-dithiol Chemical compound SC1=CC=C(S)C=C1 WYLQRHZSKIDFEP-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- VRPKUXAKHIINGG-UHFFFAOYSA-N biphenyl-4,4'-dithiol Chemical group C1=CC(S)=CC=C1C1=CC=C(S)C=C1 VRPKUXAKHIINGG-UHFFFAOYSA-N 0.000 description 1
- RYBPXNXMLJTRJB-UHFFFAOYSA-N bis(4-chlorophenyl)methanethiol Chemical compound C=1C=C(Cl)C=CC=1C(S)C1=CC=C(Cl)C=C1 RYBPXNXMLJTRJB-UHFFFAOYSA-N 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- FOIUCLZOGHHKRB-UHFFFAOYSA-N bromo(phenyl)methanethiol Chemical compound SC(Br)C1=CC=CC=C1 FOIUCLZOGHHKRB-UHFFFAOYSA-N 0.000 description 1
- MMALMXBEMBYJSC-UHFFFAOYSA-N but-3-ene-1-thiol Chemical compound SCCC=C MMALMXBEMBYJSC-UHFFFAOYSA-N 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- VFOUNXVDAWREBP-UHFFFAOYSA-N chloro(phenyl)methanethiol Chemical compound SC(Cl)C1=CC=CC=C1 VFOUNXVDAWREBP-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- JRVFLEPKNRTFHN-UHFFFAOYSA-N cycloheptanethiol Chemical compound SC1CCCCCC1 JRVFLEPKNRTFHN-UHFFFAOYSA-N 0.000 description 1
- OTMRJSRKUQXLBW-UHFFFAOYSA-N cyclohex-2-ene-1-thiol Chemical compound SC1CCCC=C1 OTMRJSRKUQXLBW-UHFFFAOYSA-N 0.000 description 1
- VSARMWHOISBCGR-UHFFFAOYSA-N cyclohexane-1,1-dithiol Chemical compound SC1(S)CCCCC1 VSARMWHOISBCGR-UHFFFAOYSA-N 0.000 description 1
- YKRCKUBKOIVILO-UHFFFAOYSA-N cyclohexane-1,2-dithiol Chemical compound SC1CCCCC1S YKRCKUBKOIVILO-UHFFFAOYSA-N 0.000 description 1
- CMKBCTPCXZNQKX-UHFFFAOYSA-N cyclohexanethiol Chemical compound SC1CCCCC1 CMKBCTPCXZNQKX-UHFFFAOYSA-N 0.000 description 1
- HBLUJTHFXFVJRN-UHFFFAOYSA-N cyclopentylmethanethiol Chemical compound SCC1CCCC1 HBLUJTHFXFVJRN-UHFFFAOYSA-N 0.000 description 1
- VTXVGVNLYGSIAR-UHFFFAOYSA-N decane-1-thiol Chemical compound CCCCCCCCCCS VTXVGVNLYGSIAR-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000005695 dehalogenation reaction Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- AVZNJQIAFXEAPG-UHFFFAOYSA-N dichloro(phenyl)methanethiol Chemical compound SC(Cl)(Cl)C1=CC=CC=C1 AVZNJQIAFXEAPG-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- KGGOIDKBHYYNIC-UHFFFAOYSA-N ditert-butyl 4-[3,4-bis(tert-butylperoxycarbonyl)benzoyl]benzene-1,2-dicarboperoxoate Chemical compound C1=C(C(=O)OOC(C)(C)C)C(C(=O)OOC(C)(C)C)=CC=C1C(=O)C1=CC=C(C(=O)OOC(C)(C)C)C(C(=O)OOC(C)(C)C)=C1 KGGOIDKBHYYNIC-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- LJUJMKJGPIXNAK-UHFFFAOYSA-N ethyl 4-[2-(2-chlorophenyl)-1-[2-(2-chlorophenyl)-4,5-bis(4-ethoxycarbonylphenyl)imidazol-2-yl]-5-(4-ethoxycarbonylphenyl)imidazol-4-yl]benzoate Chemical compound C1=CC(C(=O)OCC)=CC=C1C1=NC(N2C(=C(N=C2C=2C(=CC=CC=2)Cl)C=2C=CC(=CC=2)C(=O)OCC)C=2C=CC(=CC=2)C(=O)OCC)(C=2C(=CC=CC=2)Cl)N=C1C1=CC=C(C(=O)OCC)C=C1 LJUJMKJGPIXNAK-UHFFFAOYSA-N 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000003983 fluorenyl group Chemical class C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- ORTRWBYBJVGVQC-UHFFFAOYSA-N hexadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCS ORTRWBYBJVGVQC-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- PJUIMOJAAPLTRJ-UHFFFAOYSA-N monothioglycerol Chemical compound OCC(O)CS PJUIMOJAAPLTRJ-UHFFFAOYSA-N 0.000 description 1
- HYRAFPWOUAMMQN-UHFFFAOYSA-N naphthalene-1,4-dithiol Chemical compound C1=CC=C2C(S)=CC=C(S)C2=C1 HYRAFPWOUAMMQN-UHFFFAOYSA-N 0.000 description 1
- AAPAGLBSROJFGM-UHFFFAOYSA-N naphthalene-1,5-dithiol Chemical compound C1=CC=C2C(S)=CC=CC2=C1S AAPAGLBSROJFGM-UHFFFAOYSA-N 0.000 description 1
- XMHBJPKFTZSWRJ-UHFFFAOYSA-N naphthalene-2,6-dithiol Chemical compound C1=C(S)C=CC2=CC(S)=CC=C21 XMHBJPKFTZSWRJ-UHFFFAOYSA-N 0.000 description 1
- INUVVGTZMFIDJF-UHFFFAOYSA-N naphthalene-2,7-dithiol Chemical compound C1=CC(S)=CC2=CC(S)=CC=C21 INUVVGTZMFIDJF-UHFFFAOYSA-N 0.000 description 1
- ZVEZMVFBMOOHAT-UHFFFAOYSA-N nonane-1-thiol Chemical compound CCCCCCCCCS ZVEZMVFBMOOHAT-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- QJAOYSPHSNGHNC-UHFFFAOYSA-N octadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCCCS QJAOYSPHSNGHNC-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 125000001037 p-tolyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C([H])([H])[H] 0.000 description 1
- WHSJGOHDJIXULF-UHFFFAOYSA-N pent-1-ene-1-thiol Chemical compound CCCC=CS WHSJGOHDJIXULF-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- SQHKKVDREPFJLB-UHFFFAOYSA-N phenyl-(2-propan-2-ylphenyl)methanone Chemical compound CC(C)C1=CC=CC=C1C(=O)C1=CC=CC=C1 SQHKKVDREPFJLB-UHFFFAOYSA-N 0.000 description 1
- 229940049953 phenylacetate Drugs 0.000 description 1
- 150000008301 phosphite esters Chemical class 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- NCNISYUOWMIOPI-UHFFFAOYSA-N propane-1,1-dithiol Chemical compound CCC(S)S NCNISYUOWMIOPI-UHFFFAOYSA-N 0.000 description 1
- UWHMFGKZAYHMDJ-UHFFFAOYSA-N propane-1,2,3-trithiol Chemical compound SCC(S)CS UWHMFGKZAYHMDJ-UHFFFAOYSA-N 0.000 description 1
- ZJLMKPKYJBQJNH-UHFFFAOYSA-N propane-1,3-dithiol Chemical compound SCCCS ZJLMKPKYJBQJNH-UHFFFAOYSA-N 0.000 description 1
- HMPSOEYFMTWOFC-UHFFFAOYSA-N propane-2,2-dithiol Chemical compound CC(C)(S)S HMPSOEYFMTWOFC-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ACTRVOBWPAIOHC-UHFFFAOYSA-N succimer Chemical compound OC(=O)C(S)C(S)C(O)=O ACTRVOBWPAIOHC-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical class OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- WTSBJMAOQNCZBF-UHFFFAOYSA-N sulfanylmethylsulfanylmethanethiol Chemical compound SCSCS WTSBJMAOQNCZBF-UHFFFAOYSA-N 0.000 description 1
- QNITWMBGUWZSSI-UHFFFAOYSA-N sulfanylmethylsulfanylmethylsulfanylmethanethiol Chemical compound SCSCSCS QNITWMBGUWZSSI-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- GEKDEMKPCKTKEC-UHFFFAOYSA-N tetradecane-1-thiol Chemical compound CCCCCCCCCCCCCCS GEKDEMKPCKTKEC-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229940071127 thioglycolate Drugs 0.000 description 1
- TWXMZYPORGXIFB-UHFFFAOYSA-N thiophene-3,4-dithiol Chemical compound SC1=CSC=C1S TWXMZYPORGXIFB-UHFFFAOYSA-N 0.000 description 1
- VSGXHZUTTFLSBC-UHFFFAOYSA-N thiophene-3-thiol Chemical compound SC=1C=CSC=1 VSGXHZUTTFLSBC-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- IPBROXKVGHZHJV-UHFFFAOYSA-N tridecane-1-thiol Chemical compound CCCCCCCCCCCCCS IPBROXKVGHZHJV-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- JQZIKLPHXXBMCA-UHFFFAOYSA-N triphenylmethanethiol Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(S)C1=CC=CC=C1 JQZIKLPHXXBMCA-UHFFFAOYSA-N 0.000 description 1
- CCIDWXHLGNEQSL-UHFFFAOYSA-N undecane-1-thiol Chemical compound CCCCCCCCCCCS CCIDWXHLGNEQSL-UHFFFAOYSA-N 0.000 description 1
- 229940042596 viscoat Drugs 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Definitions
- the present invention relates to a sealing material for an organic EL display element, a cured product thereof, and an organic EL display device.
- Organic EL display elements are being used in displays, lighting devices, etc. because of their low power consumption. Since organic EL display elements are easily deteriorated by moisture and oxygen in the atmosphere, they are used by being sealed with various sealing members. For practical use, the durability of moisture and oxygen of various sealing members is improved. Is desired.
- Examples of the sealing method of the organic EL display element include a method of alternately laminating and sealing an inorganic material and an organic material.
- a method is used in which a sealing layer is formed on an element coated with a first layer of an inorganic material film, and a second layer of the inorganic material film is further coated. Since these inorganic material films have a high refractive index, the sealing layer in contact with the inorganic material film is required to have a high refractive index in order to suppress the reflection of light generated at the interface with the inorganic material film.
- a method of coating the sealing layer with an inorganic material film for example, a method of forming an inorganic material film made of silicon nitride or silicon oxide by vapor deposition can be mentioned.
- the vapor deposition method include a sputtering method and an electron cyclotron resonance plasma CVD method. Since the surface of the sealing layer is exposed to plasma during vapor deposition, the sealing layer is also required to have plasma resistance, that is, to be resistant to deterioration due to plasma treatment or the like.
- Patent Document 1 describes a composition for encapsulating an organic light emitting element, which contains a sulfur-based photocurable monomer, a non-sulfur-based photocurable monomer, and a polymerization initiator.
- Patent Document 2 describes a resin composition containing a cyclic (meth) acrylate compound and a polymerization initiator.
- Patent Document 3 describes a curable composition containing a thioepoxy group-containing fluorene derivative and a thioepoxy resin obtained by polymerizing a dithiol compound.
- the cured products of the resin compositions described in Patent Documents 1 and 2 all have a low refractive index of less than 1.60, and there is room for improvement.
- the resin composition described in Patent Document 2 may have low plasma resistance depending on the type of the (meth) acrylate compound.
- the resin composition described in Patent Document 3 has a high viscosity, there is room for improvement in applicability by screen printing or inkjet.
- the present invention has been made in view of the description of these patent documents, and provides a sealing material for an organic EL display element having an excellent balance of viscosity, plasma resistance and refractive index when made into a cured product.
- R 1 represents a hydrogen atom or a methyl group, and * represents a bond position.
- R 2 represents a hydrogen atom or a methyl group, and * represents a bond position.
- [6] The encapsulant for an organic EL display element according to any one of the above [1] to [5], which is used for coating by an inkjet method.
- [7] Used for forming the sealing layer in an organic EL display device having a structure in which an organic EL display element, a first inorganic material film, a sealing layer, and a second inorganic material film are laminated in this order.
- [8] The sealing material for an organic EL display element according to any one of the above [1] to [7], which is used as the filling material in a sealing structure using a dam material and a filling material.
- a sealing material for an organic EL display element having an excellent balance of viscosity, plasma resistance and refractive index when made into a cured product.
- the encapsulant for an organic EL display element (hereinafter, also simply referred to as “encapsulating material”) is a compound (A) having a (meth) acrylic thio group represented by the following general formula (1). contains.
- the encapsulant of the present embodiment has an excellent balance of viscosity, plasma resistance and refractive index when made into a cured product.
- R 1 represents a hydrogen atom or a methyl group
- * represents a bond position.
- the compound (A) is preferably a compound having two or more (meth) acrylic thio groups.
- Examples of the compound (A) include compounds represented by the following general formula (2).
- R 1 has the same meaning as the definition of the general formula (1)
- R 2 is an aliphatic group which may be substituted, an alicyclic group group which may be substituted, or an alicyclic group group which may be substituted. Representing a good aromatic group or a optionally substituted heterocyclic group, the aliphatic group and the alicyclic group may have an oxygen atom or a sulfur atom, where n represents an integer of 1 or more.
- n represents an integer of 1 or more.
- R2 preferably has 1 to 20 carbon atoms, more preferably 1 to 12 carbon atoms, and even more preferably 1 to 10 carbon atoms.
- n is preferably 2 or more from the viewpoint of adjusting the polymerization rate of the encapsulant and increasing the refractive index of the cured product of the encapsulant. Further, the upper limit of n is not limited, but may be, for example, 12 or less, 6 or less, or 3 or less.
- R 2 is an aliphatic group that may be substituted from the viewpoint of increasing the refractive index of the cured product of the encapsulant and improving the plasma resistance of the cured product of the encapsulant. It is preferable that the substance is present and has a sulfur atom.
- the encapsulant for an organic EL display element of the present embodiment may contain only one kind of compound (A) or may contain a plurality of kinds of compounds (A). From the viewpoint of increasing the refractive index of the cured product of the encapsulant and improving the plasma resistance of the cured product of the encapsulant, the encapsulant for an organic EL display element of the present embodiment has the general formula (2). It is preferable to contain a plurality of kinds of compounds (A) having different values of n in.
- the compound of the general formula (2) is produced, for example, from a thiol compound represented by the general formula (3) and a (meth) acrylic acid halide by dehalogenation and dehydrogenation.
- R 2 and n are the same as the definitions of R 2 and n in the general formula (2), respectively.
- the thiol compound represented by the general formula (3) may have, for example, a hydroxy group in addition to the mercapto group.
- examples of the monothiol compound having one thiol group include methyl mercaptan, ethyl mercaptan, propyl mercaptan, butyl mercaptan, amyl mercaptan, hexyl mercaptan, and heptyl mercaptan.
- thiol compounds represented by the general formula (3) as a polythiol compound having two or more thiol groups, specifically, Methanedithiol, 1,2-ketandithiol, 1,1-propanedithiol, 1,2-propanedithiol, 1,3-propanedithiol, 2,2-propanedithiol, 1,6-hexanedithiol, 1,2,3 -Propanetrithiol, 1,1-cyclohexanedithiol, 1,2-cyclohexanedithiol, 2,2-dimethylpropane-1,3-dithiol, 3,4-dimethoxybutane-1,2-dithiol, 2-methylcyclohexane- 2,3-Dithiol, Bicyclo [2,2,1] Hepta-Exo-cis-2,3-Dithiol, 1,1-bis (mercaptomethyl) cyclohexane, thioapple acid bis (2-
- Tribe polythiol 1,2-Dimercaptobenzene, 1,3-dimercaptobenzene, 1,4-dimercaptobenzene, 1,2-bis (mercaptomethyl) benzene, 1,3-bis (mercaptomethyl) benzene, 1,4- Bis (mercaptomethyl) benzene, 1,2-bis (mercaptoethyl) benzene, 1,3-bis (mercaptoethyl) benzene, 1,4-bis (mercaptoethyl) benzene, 1,2-bis (mercaptomethyleneoxy) Benzene, 1,3-bis (mercaptoethyleneoxy) benzene, 1,4-bis (mercaptoethyleneoxy) benzene, 1,2-bis (mercaptoethyleneoxy) benzene, 1,3-bis (mercaptoethyleneoxy) benzene, 1,4-bis (mercaptoethyleneoxy) benzene, 1,2,bis (mercaptoethyleneoxy) benzene, 1,3-bis (mer
- the encapsulant for an organic EL display element of the present embodiment may further contain compound (B).
- the compound (B) is a (meth) acrylic group-containing compound (however, the above compound (A) is excluded).
- the (meth) acryloyl group means at least one of an acryloyl group and a methacryloyl group.
- (meth) acrylic means at least one of acrylic and methacrylic.
- the (meth) acrylate means at least one of acrylate and methacrylate.
- (meth) acrylic compound having a (meth) acryloyl group examples include monofunctional mono (meth) acrylic compounds, bifunctional di (meth) acrylic compounds, and trifunctional or higher functional (meth) acrylic compounds. Be done.
- the mono (meth) acrylic compound examples include isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, 3,3,5-trimethylcyclohexyl (meth) acrylate, and 4-tershalbutylcyclohexyl (meth) acrylate.
- Specific product names and sources of mono (meth) acrylic compounds include ethoxylated orthophenylphenol acrylate (NK ester A-LEN-10, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and m-phenoxybenzyl acrylate (light).
- Acrylate POB-A manufactured by Kyoeisha Chemical Co., Ltd.
- di (meth) acrylic compound examples include di (meth) acrylate of diol and di (meth) acrylate of (poly) alkylene glycol.
- Specific product names and sources of the di (meth) acrylic compound include 1,6-hexanediol diacrylate (NK ester A-HD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd .; light acrylate 1,6HX-.
- Specific product names and sources of polyfunctional (meth) acrylic compounds include Trimethylol Propanetriacrylate (NK Ester A-TMPT, manufactured by Shin-Nakamura Chemical Industry Co., Ltd .; Light Acrylate TMP-A, manufactured by Kyoeisha Chemical Co., Ltd.), Trimethylol Propanetriacrylate (NK Ester A-TMPT-EO, manufactured by Shin-Nakamura Chemical Co., Ltd.) (Manufactured by Kogyo Co., Ltd.), ethoxylated glycerin triacrylate (NK ester A-GLY-6E, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), propoxylated glycerin triacrylate (NK ester A-GLY-3P, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), etc.
- NK Ester A-TMPT manufactured by Shin-Nakamura Chemical Industry Co., Ltd .
- Light Acrylate TMP-A manufactured by Kyoeisha Chemical Co
- Trifunctional (meth) acrylic compound Trifunctional (meth) acrylic compound
- Pentaerythritol tetraacrylate NK ester A-TMMT, manufactured by Shin Nakamura Chemical Industry Co., Ltd.
- ethoxylated pentaerythritol tetraacrylate NK ester ATM-4E, manufactured by Shin Nakamura Chemical Industry Co., Ltd.
- ditrimethylolpropane tetraacrylate NK ester AD-) TMP-L, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.
- a pentafunctional (meth) acrylic compound such as dipentaerythritol pentaacrylate (M-402, manufactured by Toagosei Co., Ltd.
- a pentafunctional (meth) acrylic compound such as dipentaerythritol hexaacrylate (GM66G0H, manufactured by Kokusei Kagaku Co., Ltd.); And so on.
- the compound (B) is preferably a compound having an aromatic group which may be substituted.
- the aromatic group which may be substituted in the compound (B) among the groups derived from the compound exemplified as the thiol compound represented by the general formula (3) above, the aromatic group which may be substituted may be substituted. Can be applied.
- the total amount of the compound (A) and the compound (B) is preferably 70% by mass or more with respect to the total composition of the encapsulant of the present embodiment. It is more preferably 90% by mass or more, further preferably 95% by mass or more, and even more preferably 99% by mass or more.
- the compound (A) is preferably 50 parts by mass or more and 100 parts by mass or less, and more preferably 60 parts by mass or more and 100 parts by mass or less, based on 100 parts by mass of the total of the compound (A) and the compound (B). Further, the compound (A) may be, for example, 70 parts by mass or more and 100 parts by mass or less, and 80 parts by mass or more and 100 parts by mass or less with respect to a total of 100 parts by mass of the compound (A) and the compound (B).
- the compound (B) is preferably 0 parts by mass or more and 50 parts by mass or less, and more preferably 0 parts by mass or more and 40 parts by mass or less with respect to 100 parts by mass in total of the compound (A) and the compound (B). Further, the compound (B) may be, for example, 0 parts by mass or more and 30 parts by mass or less, for example, 0 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass in total of the compound (A) and the compound (B).
- the encapsulant of the present embodiment may further contain a polymerization initiator.
- the polymerization initiator is preferably a photopolymerization initiator which is a compound that generates radicals or acids by irradiation with ultraviolet rays or visible light.
- the photopolymerization initiator include an acylphosphine oxide-based initiator, an oxyphenylacetic acid ester-based initiator, a benzoylformic acid-based initiator, a hydroxyphenylketone-based initiator, and the like.
- photopolymerization initiator examples include benzophenone, Michler's ketone, 4,4'-bis (diethylamino) benzophenone, xanthone, thioxanthone, isopropylxanthone, 2,4-diethylthioxanthone, 2-ethylanthraquinone, acetophenone, 2-hydroxy-.
- the photopolymerization initiators are 1-hydroxycyclohexylphenylketone, 2-hydroxy-2-methyl-1-phenyl-1-propanol, 1- [4- (2-hydroxy). Ethoxy) -Phenyl] -2-Hydroxy-2-methyl-1-propanol, 2-hydroxy-1- ⁇ 4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl ⁇ -2-methyl -1-Propanone, 2,2-Dimethoxy-2-phenylacetophenone, oxy-phenyl-acetic acid 2- [2-oxo-2-phenyl-acetoxy-ethoxy] -ethyl ester, oxy-phenyl-acetic acid 2- [2- [2- Hydroxy-ethoxy] -ethyl ester, methyl benzoylate, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, 2,4,6-
- Specific product names and sources of photopolymerization initiators include Irgacure184, Irgacure651, Irgacure127, Irgacure1173, Irgacure500, Irgacure2959, Irgacure754, IrgacureMBF, IrgacureMBF, IrgacureTPO, and more. And so on.
- the content of the polymerization initiator is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, based on the total composition of the encapsulant. It is more preferably 1% by mass or more, and even more preferably 2% by mass or more.
- the content of the polymerization initiator is preferably 10% by mass or less, more preferably 8% by mass or less, still more preferably 8% by mass, based on the total composition of the encapsulant. It is 6% by mass or less, and more preferably 5% by mass or less.
- the encapsulant of the present embodiment has components other than the above (other components) such as a tackifier, a filler, a curing accelerator, a plasticizer, a surfactant, a heat stabilizer, an antioxidant, a flame retardant, and an antistatic agent. It may contain one or more components selected from the group consisting of inhibitors, defoamers, leveling agents and UV absorbers.
- the content of the other components is preferably 5% by mass or less, more preferably 1% by mass or less, based on the total composition of the encapsulant.
- the encapsulant preferably contains a thermal stabilizer.
- a hindered phenol compound can be used as the heat stabilizer.
- the hindered phenol compound include dibutylhydroxytoluene (also known as 2,6-bis (1,1-dimethylethyl) -4-methylphenol) (product name BHT, manufactured by Wako Pure Chemical Industries, Ltd.), 3,5-di-.
- tert-Butyl-4-hydroxytoluene pentaerythritol-tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] (product name IRGANOX1010, manufactured by BASF; product name Adecastab AO-60, ADEKA), octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate (product name IRGANOX1076, manufactured by BASF) and the like.
- the encapsulant is dibutylhydroxytoluene and pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] as thermal stabilizers. It is preferable to contain at least one of.
- a phosphorus-based antioxidant can be used as the antioxidant.
- the phosphorus-based antioxidant include phosphite ester, for example, 2,2-methylenebis (4,6-dit-butylphenyl) octylphosphite (product name: ADEKA STAB HP-10, manufactured by ADEKA).
- examples thereof include tris (2,4-dit-butylphenyl) phosphite (product name IRGAFOS168, manufactured by BASF).
- the properties of the encapsulant of the present embodiment are not limited, but are preferably liquid from the viewpoint of being suitable for coating by an inkjet method or the like.
- the sealing material is preferably a sealing material used for coating, and more preferably a sealing material used for coating by an inkjet method. ..
- the viscosity of the encapsulant measured at 25 ° C. and 20 rpm using an E-type viscometer is preferably 5 mPa ⁇ s or more, more preferably 8 mPa ⁇ s or more, still more preferably, from the viewpoint of improving the inkjet ejection property. Is 10 mPa ⁇ s or more. Further, from the viewpoint of improving the inkjet ejection property, the viscosity of the sealing material is preferably 50 mPa ⁇ s or less, more preferably 40 mPa ⁇ s or less, and further preferably 30 mPa ⁇ s or less.
- the method for producing the encapsulant is not limited, and includes, for example, mixing the compound (A) and the compound (B) as appropriate, and other components, for example, various additives to be added as needed.
- various known kneaders such as a planetary stirrer, a homodisper, a universal mixer, a Banbury mixer, a kneader, two rolls, three rolls, and an extruder are used alone or in combination. Examples thereof include a method of uniformly kneading under conditions such as normal pressure, reduced pressure, pressure, or an inert gas stream under normal temperature or heating.
- the cured product of the encapsulant of the present embodiment is obtained by curing the encapsulant of the present embodiment.
- the cured product of the encapsulant of the present embodiment is obtained by applying the encapsulant of the present embodiment on a substrate and curing it.
- a known method such as an inkjet method, screen printing, or dispenser coating can be used.
- the shape of the cured product obtained by curing the encapsulant is not limited, and may be, for example, a film or a layer.
- photo-cure the encapsulant applied on the substrate examples include low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, excima lasers, chemical lamps, black light lamps, microwave-excited mercury lamps, metal halide lamps, sodium lamps, and halogen lamps.
- a method of curing by irradiating light using a light source such as a xenon lamp, an LED lamp such as a UV-LED, a fluorescent lamp, sunlight, or an electron beam irradiating device.
- the refractive index (nd) of the cured product of the present embodiment at room temperature (25 ° C.) at d-line (wavelength 587.6 nm) is preferably 1.60 or more, more preferably 1.61 or more. , More preferably 1.62 or more, still more preferably 1.63 or more, still more preferably 1.64 or more, still more preferably 1.65 or more.
- the upper limit of the refractive index is not limited, but may be, for example, 2.00 or less, 1.90 or less, or 1.80 or less.
- the refractive index of the encapsulant after curing can be measured by an Abbe refractometer.
- the cured product of the encapsulant can be used as the encapsulant for encapsulating the organic EL display element. According to the cured product of the encapsulant of the present embodiment, it is preferable as the encapsulant because it has a high refractive index and excellent plasma resistance.
- the organic EL display device of the present embodiment has an organic EL display element and a sealing layer containing a cured product of the sealing material of the present embodiment.
- the sealing layer By having the sealing layer, the organic EL display element arranged on the substrate is sealed by the sealing layer, and the infiltration of moisture into the organic EL display element is sufficiently prevented, and the organic EL display is performed. The performance and durability of the element can be maintained high.
- the sealing layer may be covered with an inorganic material film. Further, the organic EL display element arranged on the substrate may be previously coated with an inorganic material film before being sealed with the sealing layer.
- the sealing material of the present embodiment is used to form the sealing layer.
- FIG. 1 is a cross-sectional view showing a configuration example of an organic EL display device according to the present embodiment.
- the organic EL display element 10 is arranged on the base material 50, and the surface of the organic EL display element 10 is covered with the first inorganic material film 21.
- the organic EL display element 10 coated with the first inorganic material film 21 is sealed by the first sealing layer 22.
- the surface of the first sealing layer 22 is further covered with the second inorganic material film 23.
- the first sealing layer 22 coated with the second inorganic material film 23 is further sealed by the second sealing layer 24.
- a surface protective layer 25 is provided on the surface of the second sealing layer 24.
- the organic EL display device 100 may have a top emission structure or a bottom emission structure.
- the material of the base material 50 is not limited, and various materials such as a glass substrate, a silicon substrate, and a plastic substrate can be used.
- a TFT substrate having a plurality of TFTs (thin film transistors) and a flattening layer on the substrate can also be used.
- Examples of the inorganic material constituting the first inorganic material film 21 and the second inorganic material film 23 include silicon nitride (SiN x ), silicon oxide (SiO x ), aluminum oxide (Al 2 O 3 ), and the like. Be done.
- the inorganic material film may be a single layer or a laminated body of a plurality of types of layers.
- Examples of the coating method by the first inorganic material film 21 and the second inorganic material film 23 include a sputtering method and an electronic cyclotron resonance plasma CVD method when the inorganic material film is made of silicon nitride or silicon oxide. Be done.
- the sputtering method can be performed under the conditions of room temperature, electric power of 50 to 1000 W, and pressure of 0.001 to 0.1 Torr, for example, using a single or mixed gas such as argon or nitrogen as the carrier gas.
- a mixed gas of SiH 4 and O 2 or a mixed gas of SiH 4 and N 2 is used, the temperature is 30 ° C to 100 ° C, the pressure is 10 mTorr to 1 Torr, and the frequency is 2.45 GHz. It can be performed under the condition of electric power of 10 to 1000 W.
- the sealing layer of the present embodiment has excellent plasma resistance, even if an inorganic material film is formed on the surface of the sealing layer by plasma treatment such as an electron cyclotron resonance plasma CVD method, the resin layer does not easily deteriorate, and the organic EL light emitting element. Damage to is suppressed.
- the thickness of the first inorganic material film 21 and the second inorganic material film 23 is not limited, but is, for example, 0.01 to 10 ⁇ m, preferably 0.1 to 5 ⁇ m from the viewpoint of improving the barrier performance.
- Examples of the method for obtaining the sealing layer include a method in which a sealing material is applied and cured.
- a coating method an inkjet method can be used.
- the encapsulant can be applied in a planar manner by methods such as screen printing, dispenser coating, inkjet printing, slit coating, and spray coating.
- the thickness of the sealing layer is not limited, but is, for example, 0.1 to 50 ⁇ m, preferably 1 to 20 ⁇ m from the viewpoint of improving the sealing performance and the flexible performance.
- a dam is formed around the organic EL display element with a high-viscosity curable resin (dam material), and a low-viscosity curable resin (fill material) is placed therein.
- dam material high-viscosity curable resin
- fill material low-viscosity curable resin
- the sealing material of the present embodiment can be used as the filling material. Since the sealing material of the present embodiment has a reduced viscosity and excellent fluidity, it can be suitably used as a filling material.
- Thio Compound A1 The compound of the following formula prepared according to the description of Example 2 of JP-A-7-91262.
- Thio compound A2 A compound of the following formula prepared according to the description of Example 3 of Japanese Patent No. 2708607.
- Thio compound A3 A compound of the following formula prepared according to the description of Synthesis Example 6 of JP-A-9-324023.
- Thio compound A4 Except for replacing 25.0 parts (0.10 mol) of 4,4'-thiobis-benzenethiol in Example 1 of Japanese Patent No. 2708607 with 24.8 parts (0.20 mol) of benzyl mercaptan. A compound of the following formula prepared by performing the same operation as in Example 1 of Japanese Patent No. 2708607.
- Thio compound A5 A compound of the following formula prepared in accordance with the description of Example 1 of Japanese Patent No. 2708607.
- (meth) acrylic compounds B1 to B4 were used.
- acrylic compound B3 benzyl acrylate, product name Viscoat # 160, Kyoeisha Chemical Co., Ltd.
- Each component was blended so as to have the blending composition shown in Table 1 to obtain a liquid encapsulant.
- the unit of the compounding composition of the compound (A) and the compound (B) in Table 1 is the mass part of the compound (A) or the compound (B) with respect to a total of 100 parts by mass of the compound (A) and the compound (B).
- the unit of the compounding composition of the heat stabilizer and the photoradical initiator in Table 1 is mass% with respect to the total composition of the encapsulant.
- viscosity The viscosity of the obtained encapsulant was measured at 25 ° C. and 20 rpm using an E-type viscometer (LV DV-II + Pro, manufactured by BROOKFIELD). The evaluation was performed according to the following criteria. The results are shown in Table 1. ⁇ : 5 to 50 mPa ⁇ s ⁇ : Less than 5 mPa ⁇ s or larger than 50 mPa ⁇ s
- the refractive index of the cured film obtained by curing the obtained sealing material was evaluated by the following method. Using a 100 ⁇ m thick Teflon (registered trademark) sheet as a mold, the mold is placed on a transparent polyethylene terephthalate (PET) film, and the encapsulant obtained by the above method is poured therein, and further transparent. By placing a PET film, a sealing material is sandwiched between two transparent PET films and cured by curing under the conditions of an illuminance of 1000 mW / cm 2 and an integrated light amount of 1500 mJ / cm 2 with a UV-LED having a wavelength of 395 nm. I got a film.
- PET polyethylene terephthalate
- the refractive index (nd) of the cured film at d-line (wavelength 587.6 nm) at room temperature (25 ° C.) was measured by an Abbe refractometer (DR-M4, manufactured by Atago Co., Ltd.). The evaluation was performed according to the following criteria. The results are shown in Table 1. ⁇ : 1.60 or more ⁇ : less than 1.60
- the element damage in the plasma processing process using the parallel plate type electron cyclotron resonance plasma CVD apparatus was evaluated by the following method.
- the encapsulant obtained by the above method was introduced into an inkjet cartridge DMC-11610 (manufactured by FUJIFILM Dimension).
- the inkjet cartridge is set in an inkjet device DMP-2831 (manufactured by Fujifilm Dimatic), and after adjusting the ejection state, it is placed on a glass substrate in a size of 15 mm x 15 mm so that the cured thickness is 10 ⁇ m. Applied.
- the obtained coating film was placed in a box in which nitrogen was flowed and adjusted to room temperature (25 ° C.), allowed to stand for 5 minutes, and then using a UV-LED having a wavelength of 395 nm, an illuminance of 1000 mW / cm 2 , and an integrated light intensity of 1500 mJ /. Irradiation was performed under the condition of cm 2 to form a cured film.
- An inorganic material film (SiN x film) having a film thickness of 1 ⁇ m was deposited on the surface of the cured film using a parallel plate type electron cyclotron resonance plasma CVD device under the conditions of an output of 100 W and a cured film surface temperature of 100 ° C.
- the obtained sample was put into a constant temperature and humidity chamber at 85 ° C. and 85%, and the appearance after 240 hours was observed. The evaluation was performed according to the following criteria. The results are shown in Table 1. ⁇ : Not bleached ⁇ : Whitened
- the encapsulant and the cured product obtained in each example are excellent in the effect of suppressing element damage to plasma irradiation, have a high refractive index, and have a low viscosity suitable for coating. Met.
- Organic EL display element 21 First inorganic material film 22 First sealing layer 23 Second inorganic material film 24 Second sealing layer 25 Surface protective layer 50 Base material 100 Organic EL display device
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Abstract
Description
これらの無機材料膜は屈折率が高いため、無機材料膜に接する封止層には、無機材料膜との界面で生じる光の反射を抑えるため、高い屈折率が求められる。
蒸着に際して、封止層の表面がプラズマにさらされるので、封止層には、耐プラズマ性、即ちプラズマ処理等で劣化しにくいことも求められている。
特許文献2には、環状(メタ)アクリレート化合物及び重合開始剤を含有する樹脂組成物が記載されている。
特許文献3には、チオエポキシ基含有フルオレン誘導体、及びジチオール化合物を重合して得られるチオエポキシ樹脂を含む硬化性組成物が記載されている。
また、特許文献2にされた樹脂組成物は、(メタ)アクリレート化合物の種類によっては、耐プラズマ性が低い場合があった。
さらに、特許文献3に記載された樹脂組成物は、粘度が高いため、スクリーン印刷やインクジェットでの塗布性に改善の余地があった。
[1] 下記一般式(1)で表される(メタ)アクリルチオ基を有する化合物(A)を含有する、有機EL表示素子用封止材。
[2] 上記化合物(A)が上記(メタ)アクリルチオ基を2個以上有する化合物である、[1]に記載の有機EL表示素子用封止材。
[3] (メタ)アクリル基を有する化合物(B)(但し上記化合物(A)を除く。)をさらに含有する、上記[1]又は[2]に記載の有機EL表示素子用封止材。
[4] 上記化合物(B)が、置換されてもよい芳香族基をさらに有する化合物である、上記[3]に記載の有機EL表示素子用封止材。
[5] E型粘度計で測定される25℃、20rpmにおける粘度が、5mPa・s以上50mPa・s以下である、上記[1]~[4]のいずれか1つに記載の有機EL表示素子用封止材。
[6] インクジェット法による塗布に用いられる、上記[1]~[5]のいずれか1つに記載の有機EL表示素子用封止材。
[7] 有機EL表示素子、第1の無機材料膜、封止層、第2の無機材料膜がこの順序で積層された構造を有する有機EL表示装置において、上記封止層の形成に用いられる、上記[1]~[6]のいずれか1つに記載の有機EL表示素子用封止材。
[8] ダム材とフィル材を用いた封止構造において、上記フィル材として用いられる、上記[1]~[7]のいずれか1つに記載の有機EL表示素子用封止材。
[9] 上記[1]~[8]のいずれか1つに記載の有機EL表示素子用封止材を硬化してなる硬化物。
[10] 有機EL表示素子と、
上記有機EL表示素子を被覆する封止層と、
を含み、上記封止層が、上記[9]に記載の硬化物を含有する、有機EL表示装置。
(化合物(A))
本実施形態において、有機EL表示素子用封止材(以下、適宜単に「封止材」とも呼ぶ。)は、下記一般式(1)で示す(メタ)アクリルチオ基を有する化合物(A)を含有する。本実施形態の封止材は、粘度、プラズマ耐性および硬化物にした際の屈折率のバランスに優れる。
封止材の硬化物の屈折率を大きくさせる観点、また封止材の硬化物の耐プラズマ性を改善させる観点から、本実施形態の有機EL表示素子用封止材は、一般式(2)におけるnの値が異なる複数種類の化合物(A)を含有するのが好ましい。
メタンジチオール、1,2-ケタンジチオール、1,1-プロパンジチオール、1,2-プロパンジチオール、1,3-プロパンジチオール、2,2-プロパンジチオール、1,6-ヘキサンジチオール、1,2,3-プロパントリチオール、1,1-シクロヘキサンジチオール、1,2-シクロヘキサンジチオール、2,2-ジメチルプロパン-1,3-ジチオール、3,4-ジメトキシブタン-1,2-ジチオール、2-メチルシクロヘキサン-2,3-ジチオール、ビシクロ[2,2,1]ヘプタ-エクソ-シス-2,3-ジチオール、1,1-ビス(メルカプトメチル)シクロヘキサン、チオリンゴ酸ビス(2-メルカプトエチルエステル)、2,3-ジメルカプトコハク酸(2-メルカプトエチルエステル)、2,3-ジメルカプト-1-プロパノール(2-メルカプトアセテート)、2,3-ジメルカプト-1-プロパノール(3-メルカプトアセテート)、ジエチレングリコールビス(2-メルカプトアセテート)、ジエチレングリコールビス(3-メルカプトプロピオネート)、1,2-ジメルカプトプロピルメチルエーテル、2,3-ジメルカプトプロピルメチルエーテル、2,2-ビス(メルカプトメチル)-1,3-プロパンジチオール、ビス(2-メルカプトエチル)エーテル、エチレングリコールビス(2-メルカプトアセテート)、エチレングリコールビス(3-メルカプトプロピオネート)、トリメチロールプロパンビス(2-メルカプトアセテート)、トリメチロールプロパンビス(3-メルカプトプロピオネート)、ペンタエリスリトールテトラキス(2-メルカプトアセテート)、ペンタエリスリトールテトラキス(3-メルカプトプロピオネート)等の脂肪族ポリチオール、並びにそれらの塩素置換体及び臭素置換体等のハロゲン置換脂肪族ポリチオール;
1,2-ジメルカプトベンゼン、1,3-ジメルカプトベンゼン、1,4-ジメルカプトベンゼン、1,2-ビス(メルカプトメチル)ベンゼン、1,3-ビス(メルカプトメチル)ベンゼン、1,4-ビス(メルカプトメチル)ベンゼン、1,2-ビス(メルカプトエチル)ベンゼン、1,3-ビス(メルカプトエチル)ベンゼン、1,4-ビス(メルカプトエチル)ベンゼン、1,2-ビス(メルカプトメチレンオキシ)ベンゼン、1,3-ビス(メルカプトメチレンオキシ)ベンゼン、1,4-ビス(メルカプトメチレンオキシ)ベンゼン、1,2-ビス(メルカプトエチレンオキシ)ベンゼン、1,3-ビス(メルカプトエチレンオキシ)ベンゼン、1,4-ビス(メルカプトエチレンオキシ)ベンゼン、1,2,3-トリメルカプトベンゼン、1,2,4-トリメルカプトベンゼン、1,3,5-トリメルカプトベンゼン、1,2,3-トリス(メルカプトメチル)ベンゼン、1,2,4-トリス(メルカプトメチル)ベンゼン、1,3,5-トリス(メルカプトメチル)ベンゼン、1,2,3-トリス(メルカプトエチル)ベンゼン、1,2,4-トリス(メルカプトエチル)ベンゼン、1,3,5-トリス(メルカプトエチル)ベンゼン、1,2,3-トリス(メルカプトメチレンオキシ)ベンゼン、1,2,4-トリス(メルカプトメチレンオキシ)ベンゼン、1,3,5-トリス(メルカプトメチレンオキシ)ベンゼン、1,2,3-トリス(メルカプトエチレンオキシ)ベンゼン、1,2,4-トリス(メルカプトエチレンオキシ)ベンゼン、1,3,5-トリス(メルカプトエチレンオキシ)ベンゼン、1,2,3,4-テトラメルカプトベンゼン、1,2,3,5-テトラメルカプトベンゼン、1,2,4,5-テトラメルカプトベンゼン、1,2,3,4-テトラキス(メルカプトメチル)ベンゼン、1,2,3,5-テトラキス(メルカプトメチル)ベンゼン、1,2,4,5-テトラキス(メルカプトメチル)ベンゼン、1,2,3,4-テトラキス(メルカプトエチル)ベンゼン、1,2,3,5-テトラキス(メルカプトエチル)ベンゼン、1,2,4,5-テトラキス(メルカプトエチル)ベンゼン、1,2,3,4-テトラキス(メルカプトメチレンオキシ)ベンゼン、1,2,3,5-テトラキス(メルカプトメチレンオキシ)ベンゼン、1,2,4,5-テトラキス(メルカプトメチレンオキシ)ベンゼン、1,2,3,4-テトラキス(メルカプトエチレンオキシ)ベンゼン、1,2,3,5-テトラキス(メルカプトエチレンオキシ)ベンゼン、1,2,4,5-テトラキス(メルカプトエチレンオキシ)ベンゼン、2,2′-ジメルカプトビフェニル、4,4′-チオビス-ベンゼンチオール、4,4′-ジメルカプトビフェニル、4,4′-ジメルカプトビベンジル、2,5-トルエンジチオール、3,4-トルエンジチオール、1,4-ナフタレンジチオール、1,5-ナフタレンジチオール、2,6-ナフタレンジチオール、2,7-ナフタレンジチオール、2,4-ジメチルベンゼン-1,3-ジチオール、4,5-ジメチルベンゼン-1,3-ジチオール、9,10-アントラセンジメタンチオール、1,3-ジ(p-メトキシフェニル)プロパン-2,2-ジチオール、1,3-ジフェニルプロパン-2,2-ジチオール、フェニルメタン-1,1-ジチオール、2,4-ジ(p-メルカプトフェニル)ペンタン、ビス(4-メルカプトフェニル)スルフィド等の芳香族ポリチオール;
2,5-ジクロロベンゼン-1,3-ジチオール、1,3-ジ(p-クロロフェニル)プロパン-2,2-ジチオール、3,4,5-トリブロム-1,2-ジメルカプトベンゼン、2,3,4,6-テトラクロル-1,5-ビス(メルカプトメチル)ベンゼン等芳香族ポリチオールの塩素置換体及び芳香族ポリチオールの臭素置換体等のハロゲン置換芳香族ポリチオール;
2-メチルアミノ-4,6-ジチオール-sym-トリアジン、2-エチルアミノ-4,6-ジチオール-sym-トリアジン、2-アミノ-4,6-ジチオール-sym-トリアジン、2-モルホリノ-4,6-ジチオール-sym-トリアジン、2-シクロヘキシルアミノ-4,6-ジチオール-sym-トリアジン、2-メトキシ-4,6-ジチオール-sym-トリアジン、2-フェノキシ-4,6-ジチオール-sym-トリアジン、2-チオベンゼンオキシ-4,6-ジチオール-sym-トリアジン、2-チオブチルオキシ-4,6-ジチオール-sym-トリアジン、3,4-チオフェンジチオール、ビスムチオール等の複素環を含有したポリチオール;
1,2-ビス(メルカプトメチルチオ)ベンゼン、1,3-ビス(メルカプトメチルチオ)ベンゼン、1,4-ビス(メルカプトメチルチオ)ベンゼン、1,2-ビス(メルカプトエチルチオ)ベンゼン、1,3-ビス(メルカプトエチルチオ)ベンゼン、1,4-ビス(メルカプトエチルチオ)ベンゼン、1,2,3-トリス(メルカプトメチルチオ)ベンゼン、1,2,4-トリス(メルカプトメチルチオ)ベンゼン、1,3,5-トリス(メルカプトメチルチオ)ベンゼン、1,2,3-トリス(メルカプトエチルチオ)ベンゼン、1,2,4-トリス(メルカプトエチルチオ)ベンゼン、1,3,5-トリス(メルカプトエチルチオ)ベンゼン、1,2,3,4-テトラキス(メルカプトメチルチオ)ベンゼン、1,2,3,5-テトラキス(メルカプトメチルチオ)ベンゼン、1,2,4,5-テトラキス(メルカプトメチルチオ)ベンゼン、1,2,3,4-テトラキス(メルカプトエチルチオ)ベンゼン、1,2,3,5-テトラキス(メルカプトエチルチオ)ベンゼン、1,2,4,5-テトラキス(メルカプトエチルチオ)ベンゼン等の芳香族化合物の核アルキル化物由来のポリチオール;
ビス(メルカプトメチル)スルフィド、ビス(メルカプトエチル)スルフィド、ビス(メルカプトプロピル)スルフィド、ビス(メルカプトメチルチオ)メタン、ビス(2-メルカプトエチルチオ)メタン、ビス(3-メルカプトプロピルチオ)メタン、1,2-ビス(メルカプトメチルチオ)エタン、1,2-ビス(2-メルカプトエチルチオ)エタン、1,2-ビス(3-メルカプトプロピル)エタン、1,3-ビス(メルカプトメチルチオ)プロパン、1,3-ビス(2-メルカプトエチルチオ)プロパン、1,3-ビス(3-メルカプトプロピルチオ)プロパン、1,2,3-トリス(メルカプトメチルチオ)プロパン、1,2,3-トリス(2-メルカプトエチルチオ)プロパン、1,2,3-トリス(3-メルカプトプロピルチオ)プロパン、テトラキス(メルカプトメチルチオメチル)メタン、テトラキス(2-メルカプトエチルチオメチル)メタン、テトラキス(3-メルカプトプロピルチオメチル)メタン、ビス(2,3-ジメルカプトプロピル)スルフィド、2,5-ジメルカプト-1,4-ジチアン、ビス(メルカプトメチル)ジスルフィド、ビス(メルカプトエチル)ジスルフィド、ビス(メルカプトプロピル)ジスルフィド等の脂肪族ポリチオール、並びにそれらのチオグリコール酸エステル及びメルカプトプロピオン酸エステル;
ヒドロキシメチルスルフィドビス(2-メルカプトアセテート)、ヒドロキシメチルスルフィドビス(3-メルカプトプロピオネート)、ヒドロキシエチルスルフィドビス(2-メルカプトアセテート)、ヒドロキシエチルスルフィドビス(3-メルカプトプロピオネート)、ヒドロキシプロピルスルフィドビス(2-メルカプトアセテート)、ヒドロキシプロピルスルフィドビス(3-メルカプトプロピオネート)、ヒドロキシメチルジスルフィドビス(2-メルカプトアセテート)、ヒドロキシメチルジスルフィドビス(3-メルカプトプロピオネート)、ヒドロキシエチルジスルフィドビス(2-メルカプトアセテート)、ヒドロキシエチルジスルフィドビス(3-メルカプトプロピオネート)、ヒドロキシプロピルジスルフィドビス(2-メルカプトアセテート)、ヒドロキシプロピルジスルフィドビス(3-メルカプトプロピオネート)、2-メルカプトエチルエーテルビス(2-メルカプトアセテート)、2-メルカプトエチルエーテルビス(3-メルカプトプロピオネート)、1,4-ジチアン-2,5-ジオールビス(2-メルカプトアセテート)、1,4-ジチアン-2,5-ジオールビス(3-メルカプトプロピオネート)、チオジグリコール酸ビス(2-メルカプトエチルエステル)、チオジプロピオン酸ビス(2-メルカプトエチルエステル)、4,4-チオジブチル酸ビス(2-メルカプトエチルエステル)、ジチオグリコール酸ビス(2-メルカプトエチルエステル)、ジチオジプロピオン酸ビス(2-メルカプトエチルエステル)、4,4-ジチオジブチル酸ビス(2-メルカプトエチルエステル)、チオジグリコール酸ビス(2,3-ジメルカプトプロピルエステル)、チオジプロピオン酸ビス(2,3-ジメルカプトプロピルエステル)、ジチオグリコール酸ビス(2,3-ジメルカプトプロピルエステル)、ジチオジプロピオン酸ビス(2,3-ジメルカプトプロピルエステル)等の脂肪族ポリチオールのエステル;
2-メルカプトエタノール、3-メルカプト-1,2-プロパンジオール、グルセリンジ(メルカプトアセテート)、1-ヒドロキシ-4-メルカプトシクロヘキサン、2,4-ジメルカプトフェノール、2-メルカプトハイドロキノン、4-メルカプトフェノール、3,4-ジメルカプト-2-プロパノール、1,3-ジメルカプト-2-プロパノール、2,3-ジメルカプト-1-プロパノール、1,2-ジメルカプト-1,3-ブタンジオール、ペンタエリスリトールトリス(3-メルカプトプロピオネート)、ペンタエリスリトールモノ(3-メルカプトプロピオネート)、ペンタエリスリトールビス(3-メルカプトプロピオネート)、ペンタエリスリトールトリス(チオグリコレート)、ペンタエリスリトールペンタキス(3-メルカプトプロピオネート)、ヒドロキシメチル-トリス(メルカプトエチルチオメチル)メタン、1-ヒドロキシエチルチオ-3-メルカプトエチルチオベンゼン、4-ヒドロキシ-4′-メルカプトジフェニルスルホン、2-(2-メルカプトエチルチオ)エタノール、ジヒドロキシエチルスルフィドモノ(3-メルカプトプロピオネート)、ジメルカプトエタンモノ(サルチレート)、ヒドロキシエチルチオメチル-トリス(メルカプトエチルチオメチル)メタン、2,2'-((3-メルカプトプロパン-1,2-ジイル)ビス(スルファンジイル))ビス(エタン-1-チオール)、3,3'-チオビス(2-((2-メルカプトエチル)チオ)プロパン-1-チオール)等のポリチオール;
が挙げられる。
さらには、これらの塩素置換体、臭素置換体等のハロゲン置換体が挙げられる。
本実施形態の有機EL表示素子用封止材は、化合物(B)をさらに含んでもよい。化合物(B)は(メタ)アクリル基含有化合物(但し上記化合物(A)を除く。)である。
ここで、本明細書において、(メタ)アクリロイル基とは、アクリロイル基とメタクリロイル基のうちの少なくとも一方を意味する。また、(メタ)アクリルとは、アクリルまたはメタクリルのうちの少なくとも一方を意味する。また、(メタ)アクリレートとは、アクリレートとメタクリレートのうちの少なくとも一方を意味する。
また、モノ(メタ)アクリル化合物の具体的な製品名および入手先としては、エトキシ化オルトフェニルフェノールアクリレート(NKエステルA-LEN-10、新中村化学工業社製)、m-フェノキシベンジルアクリレート(ライトアクリレートPOB-A、共栄社化学社製)等が挙げられる。
また、ジ(メタ)アクリル化合物の具体的な製品名および入手先としては、1,6-ヘキサンジオールジアクリレート(NKエステルA-HD-N、新中村化学工業社製;ライトアクリレート1,6HX-A、共栄社化学社製)、1,9-ノナンジオールジアクリレート(NKエステルA-NOD-N、新中村化学工業社製;ライトアクリレート1,9ND-A、共栄社化学社製)、1,10-デカンジオールジアクリレート(NKエステルA-DOD-N、新中村化学工業社製)、ネオペンチルグリコールジアクリレート(NKエステルA-NPG、新中村化学工業社製;ライトアクリレートNP-A、共栄社化学社製)、エチレングリコールジアクリレート(SR206NS、アルケマ社製)、ポリエチレングリコールジアクリレート(NKエステルA-400、新中村化学工業社製)、ポリプロピレングリコールジアクリレート(NKエステルAPG-400、新中村化学工業社製)、トリシクロデカンジメタノールジアクリレート(別名:ジメチロール-トリシクロデカンジアクリレート)(NKエステルA-DCP、新中村化学工業社製;ライトアクリレートDCP-A、共栄社化学社製)、1,3-ブタンジオールジメタクリレート(NKエステルBG、新中村化学工業社製)、1,4-ブタンジオールジメタクリレート(NKエステルBD、新中村化学工業社製)、1,6-ヘキサンジオールジメタクリレート(NKエステルHD-N、新中村化学工業社製)、1,9-ノナンジオールジメタクリレート(NKエステルNOD-N、新中村化学工業社製)、1,10-デカンジオールジメタクリレート(NKエステルDOD-N、新中村化学工業社製)、1,12-ドデカンジオールジアクリレート(SR262、サートマー社製)ネオペンチルグリコールジメタクリレート(NKエステルNPG、新中村化学工業社製)等が挙げられる。
トリメチロールプロパントリアクリレート(NKエステルA-TMPT、新中村化学工業社製;ライトアクリレートTMP-A、共栄社化学社製)、エトキシ化トリメチロールプロパントリアクリレート(NKエステルA-TMPT-EO、新中村化学工業社製)、エトキシ化グリセリントリアクリレート(NKエステルA-GLY-6E、新中村化学工業社製)、プロポキシ化グリセリントリアクリレート(NKエステルA-GLY-3P、新中村化学工業社製)等の3官能(メタ)アクリル化合物;
ペンタエリスリトールテトラアクリレート(NKエステルA-TMMT、新中村化学工業社製)、エトキシ化ペンタエリスリトールテトラアクリレート(NKエステルATM-4E、新中村化学工業社製)、ジトリメチロールプロパンテトラアクリレート(NKエステルAD-TMP-L、新中村化学工業社製)等の4官能(メタ)アクリル化合物;
ジペンタエリスリトールペンタアクリレート(M-402、東亞合成社製)等の5官能(メタ)アクリル化合物;
ジペンタエリスリトールヘキサアクリレート(GM66G0H、國精化學社製)等の5官能(メタ)アクリル化合物;
等が挙げられる。
また、化合物(A)と化合物(B)の合計100質量部に対し、化合物(A)を、例えば70質量部以上100質量部以下、80質量部以上100質量部以下とすることもできる。
また、化合物(A)と化合物(B)の合計100質量部に対し、化合物(B)を、例えば0質量部以上30質量部以下、例えば0質量部以上20質量部以下とすることもできる。
本実施形態の封止材は重合開始剤をさらに含んでもよい。低温で安定的に硬化物を形成する観点から、重合開始剤は、好ましくは、紫外線または可視光線の照射によりラジカルまたは酸を発生する化合物である光重合開始剤である。
光重合開始剤としては、アシルフォスフィンオキサイド系開始剤、オキシフェニル酢酸エステル系開始剤、ベンゾイルギ酸系開始剤およびヒドロキシフェニルケトン系開始剤等が挙げられる。
本実施形態の封止材は、上記以外の成分(その他の成分)として、粘着付与剤、充填剤、硬化促進剤、可塑剤、界面活性剤、熱安定剤、酸化防止剤、難燃剤、帯電防止剤、消泡剤、レベリング剤および紫外線吸収剤からなる群から選択される1または2以上の成分を含んでいてもよい。
その他の成分の含有量は、封止材の全組成に対し、好ましくは5質量%以下であり、より好ましくは1質量%以下である。
熱安定剤としてはヒンダードフェノール化合物を用いることができる。
ヒンダードフェノール化合物としては、ジブチルヒドロキシトルエン(別名:2,6-ビス(1,1-ジメチルエチル)-4-メチルフェノール)(製品名BHT、和光純薬社製)、3,5-ジ-tert-ブチル-4-ヒドロキシトルエン、ペンタエリトリトール-テトラキス[3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオネート](製品名IRGANOX1010、BASF社製;製品名アデカスタブAO-60、ADEKA社製)、オクタデシル-3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオネート(製品名IRGANOX1076、BASF社製)などが挙げられる。
封止材の熱安定性をより向上させる観点から、封止材は熱安定剤としてジブチルヒドロキシトルエンおよびペンタエリトリトールテトラキス[3-(3,5-ジ-tert-ブチル-4-ヒドロキシフェニル)プロピオネート]の少なくとも1つを含有することが好ましい。
リン系酸化防止剤としては、亜リン酸エステルが挙げられ、例えば、2,2-メチレンビス(4,6-ジt-ブチルフェニル)オクチルホスファイト(製品名アデカスタブHP-10、ADEKA社製)、トリス(2,4-ジt-ブチルフェニル)ホスファイト(製品名IRGAFOS168、BASF社製)などが挙げられる。
本実施形態の封止材の性状は限定されないが、インクジェット法等の塗布に好適であるという観点から、好ましくは液状である。
また、インクジェット吐出性向上の観点から、上記封止材の粘度は、好ましくは50mPa・s以下であり、より好ましくは40mPa・s以下、さらに好ましくは30mPa・s以下である。
封止材の製造方法を説明する。封止材の製造方法は限定されず、たとえば、化合物(A)、および、適宜化合物(B)、その他の成分、たとえば必要に応じて添加する各種添加剤を混合することを含む。
各成分を混合する方法として、たとえば、遊星式撹拌装置、ホモディスパー、万能ミキサー、バンバリーミキサー、ニーダー、2本ロール、3本ロール、押出機等の公知の各種混練機を単独または併用して、常温下または加熱下で、常圧下、減圧下、加圧下または不活性ガス気流下等の条件下で均一に混練する方法が挙げられる。
本実施形態の封止材の硬化物は、本実施形態の封止材を硬化してなるものである。
例えば、本実施形態の封止材の硬化物は、本実施形態の封止材を基材上に塗布し、硬化することで得られる。塗布には、インクジェット法、スクリーン印刷、ディスペンサー塗布等の公知の手法を用いることができる。
本実施形態の有機EL表示装置は、有機EL表示素子と、本実施形態の封止材の硬化物を含有する封止層とを有する。封止層を有することで、基板上に配置された有機EL表示素子が封止層により封止されることになり、有機EL表示素子内への水分の浸入が充分に防止され、有機EL表示素子の性能および耐久性を高く維持することができる。
図1に示した有機EL表示装置100では、基材50上に有機EL表示素子10が配置され、有機EL表示素子10の表面は、第1の無機材料膜21で被覆されている。
第1の無機材料膜21で被覆された有機EL表示素子10は、第1の封止層22により封止されている。
第1の封止層22の表面は、第2の無機材料膜23でさらに被覆されている。
第2の無機材料膜23で被覆された第1の封止層22は、第2の封止層24によりにさらに封止されている。
第2の封止層24の表面には表面保護層25が設けられている。
はじめに、以下の例において用いた材料を示す。
チオ化合物A1:特公平7-91262号公報の実施例2の記載にしたがい調製された下記式の化合物
(メタ)アクリル化合物B1:エトキシ化オルトフェニルフェノールアクリレート、製品名NKエステルA-LEN-10、新中村化学工業社製
(メタ)アクリル化合物B2:m-フェノキシベンジルアクリレート、製品名ライトアクリレートPOB-A、共栄社化学社製
(メタ)アクリル化合物B3:ベンジルアクリレート、製品名ビスコート♯160、共栄社化学社製
(メタ)アクリル化合物B4:1,9-ノナンジオールジアクリレート、製品名ライトアクリレート1,9-ND-A、共栄社化学社製
表1における化合物(A)および化合物(B)の配合組成の単位は、化合物(A)と化合物(B)の合計100質量部に対する化合物(A)または化合物(B)の質量部である。また、表1における熱安定剤および光ラジカル開始剤の配合組成の単位は封止材の全組成に対する質量%である。
得られた封止材について、E型粘度計(LV DV-II+ Pro、BROOKFIELD社製)を用いて25℃、20rpmの条件で粘度を測定した。評価は下記の基準で行った。結果を表1に示す。
〇:5~50mPa・s
×:5mPa・s未満または50mPa・sより大きい
得られた封止材を硬化させてなる硬化フィルムの屈折率を以下の方法で評価した。
100μm厚のテフロン(登録商標)シートを型枠として、透明ポリエチレンテレフタレート(PET)フィルムの上に当該型枠を置き、そこに上記の方法で得られた封止材を流し込み、その上にさらに透明PETフィルムを載せることで、2枚の透明PETフィルムの間に封止材を挟みこみ、波長395nmのUV-LEDで照度1000mW/cm2、積算光量1500mJ/cm2の条件で硬化させることで硬化フィルムを得た。
得られた硬化フィルムについて、室温(25℃)でのd線(波長587.6nm)における硬化後のフィルムの屈折率(nd)をアッベ屈折計(アタゴ社製、DR-M4)により測定した。評価は下記の基準で行った。結果を表1に示す。
〇:1.60以上
×:1.60未満
耐プラズマ性として、平行平板型の電子サイクロトロン共鳴プラズマCVD装置を用いたプラズマ処理工程における素子ダメージを以下の方法で評価した。
上記の方法により得られた封止材を、インクジェットカートリッジDMC-11610(富士フイルムDimatix社製)に導入した。そのインクジェットカートリッジをインクジェット装置DMP-2831(富士フイルムDimatix社製)にセットし、吐出状態の調整を行った後、ガラス基板に、硬化後の厚みが10μmとなるように、15mm×15mmのサイズで塗布した。
得られた塗膜を、窒素がフローされ且つ室温(25℃)に調整されたボックスに入れ、5分間静置し、次いで波長395nmのUV-LEDを用い照度1000mW/cm2、積算光量1500mJ/cm2の条件で照射をし、硬化膜を形成した。
硬化膜の表面に、平行平板型の電子サイクロトロン共鳴プラズマCVD装置を用いて、出力100W、硬化膜表面温度100℃の条件で、膜厚1μmの無機材料膜(SiNx膜)を蒸着した。
得られたサンプルを85℃85%の恒温恒湿槽に投入して240時間後の外観を観察した。評価は下記の基準で行った。結果を表1に示す。
〇:白化しなかった
×:白化した
21 第1の無機材料膜
22 第1の封止層
23 第2の無機材料膜
24 第2の封止層
25 表面保護層
50 基材
100 有機EL表示装置
Claims (10)
- 前記化合物(A)が前記(メタ)アクリルチオ基を2個以上有する化合物である、請求項1に記載の有機EL表示素子用封止材。
- (メタ)アクリル基を有する化合物(B)(但し前記化合物(A)を除く。)をさらに含有する、請求項1又は2に記載の有機EL表示素子用封止材。
- 前記化合物(B)が、置換されてもよい芳香族基をさらに有する化合物である、請求項3に記載の有機EL表示素子用封止材。
- E型粘度計で測定される25℃、20rpmにおける粘度が、5mPa・s以上50mPa・s以下である、請求項1~4のいずれか1項に記載の有機EL表示素子用封止材。
- インクジェット法による塗布に用いられる、請求項1~5のいずれか1項に記載の有機EL表示素子用封止材。
- 有機EL表示素子、第1の無機材料膜、封止層、第2の無機材料膜がこの順序で積層された構造を有する有機EL表示装置において、前記封止層の形成に用いられる、請求項1~6のいずれか1項に記載の有機EL表示素子用封止材。
- ダム材とフィル材を用いた封止構造において、前記フィル材として用いられる、請求項1~7のいずれか1項に記載の有機EL表示素子用封止材。
- 請求項1~8のいずれか1項に記載の有機EL表示素子用封止材を硬化してなる硬化物。
- 有機EL表示素子と、
前記有機EL表示素子を被覆する封止層と、
を含み、前記封止層が、請求項9に記載の硬化物を含有する、有機EL表示装置。
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