WO2022095397A1 - 相变液冷散热装置 - Google Patents

相变液冷散热装置 Download PDF

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Publication number
WO2022095397A1
WO2022095397A1 PCT/CN2021/093025 CN2021093025W WO2022095397A1 WO 2022095397 A1 WO2022095397 A1 WO 2022095397A1 CN 2021093025 W CN2021093025 W CN 2021093025W WO 2022095397 A1 WO2022095397 A1 WO 2022095397A1
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WIPO (PCT)
Prior art keywords
heat
cavity
heat dissipation
phase
water
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PCT/CN2021/093025
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English (en)
French (fr)
Inventor
聂鑫
杨若菡
王永恒
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深圳市森若新材科技有限公司
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Application filed by 深圳市森若新材科技有限公司 filed Critical 深圳市森若新材科技有限公司
Priority to EP21888100.1A priority Critical patent/EP4239671A4/en
Publication of WO2022095397A1 publication Critical patent/WO2022095397A1/zh
Priority to US18/251,587 priority patent/US20240258199A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Definitions

  • the present application relates to the technical field of electronic temperature control, in particular to a heat dissipation device in a computer, and in particular to a phase-change liquid-cooled heat dissipation device used for heat dissipation in a CPU overload state.
  • the central processing unit (CPU for short) is one of the core electronic components of the computer.
  • CPU central processing unit
  • the computing load of the CPU is increasing.
  • the CPU power consumption of the computer has reached about 80W.
  • High-power and high-frequency computers will cause the CPU temperature to rise, shorten the service life of the CPU, and reduce the performance of the CPU.
  • the normal operating temperature of the CPU is generally maintained between 45°C and 55°C.
  • the heat dissipation equipment in the existing computer is mainly composed of heat dissipation aluminum and a fan. During use, the fan is driven by a power supply to achieve the purpose of rapid heat dissipation. This method consumes high power and high power. The most important point is that when the CPU exceeds the cooling capacity of the cooling device, that is, when the cooling device cannot satisfy the overheating of the CPU, that is, the CPU will sometimes continue to work in an overloaded state, resulting in the heat generated by the CPU.
  • the invention solves the technical problem that the CPU in the computer cannot be quickly dissipated due to the CPU in the overloaded state, and the CPU performance and the service life of the CPU are reduced, thereby causing the computer to be unable to be used normally. For the above problems, no effective solution has been proposed yet.
  • the main purpose of the present application is to provide a phase-change liquid cooling device to solve the problem that the CPU in the computer cannot quickly dissipate heat due to the CPU being overloaded.
  • Technical problems that cannot be used normally The invention can effectively solve the technical problem that the CPU cannot quickly dissipate heat in an overloaded working state, and can effectively prevent damage to the CPU itself due to the inability to dissipate heat in time in an overheated state.
  • a phase-change liquid-cooled heat-dissipating device includes, from top to bottom, a phase-change energy storage module, a water-cooling module, and a heat-conducting cavity,
  • the upper and lower parts of the heat-absorbing mechanism of the water-cooling module are respectively fixedly installed with the phase-change energy storage module and the heat-conducting cavity, and the heat-conducting cavity is installed on the CPU; the heat-conducting cavity is filled with water, and the amount of water added is equal to the volume in the heat-conducting cavity.
  • the ratio is 0.2 ⁇ 0.9, the heat conduction cavity is made of red copper material; the phase change energy storage module is filled with phase change material.
  • the heat-conducting cavity mainly transfers heat to the water-cooling module through the liquid water in the heat-conducting cavity and the wall of the heat-conducting cavity.
  • the cooling mechanism dissipates heat.
  • the phase change energy storage module begins to function.
  • the phase change material in the phase change energy storage module can absorb heat.
  • the phase change material releases the heat into the water cooling module. , restore the normal state, and play the role of buffer protection at the peak time of CPU overload.
  • the heat-conducting cavity is filled with water and the ratio of the added amount of water to the volume of the heat-conducting cavity is 0.2 ⁇ 0.9, that is, there are liquid water and air layers in the heat-conducting cavity. higher.
  • the heat-conducting cavity is made of red copper material.
  • the copper material has very good thermal conductivity, is not easy to rust, has a long use time and has good durability.
  • the upper and lower parts of the heat-absorbing mechanism of the water-cooling module, the phase-change energy storage module and the heat-conducting cavity can be attached and fixed with strong glue, of course, other fixing methods are not limited. Water-cooled modules can also be referred to as liquid-cooled modules.
  • the phase change energy storage module includes a closed energy storage cavity and a first heat sink, the first heat sink is arranged in the energy storage cavity, and the phase change material is filled in the energy storage cavity.
  • the first heat sink and the energy storage cavity are integrally formed.
  • the phase change material in the phase change energy storage module is a phase change material with a phase change point of 56-75°C, and further preferably, a phase change material with a phase change point of 56-65°C is selected.
  • the selection is made according to the normal temperature of the CPU and the extreme temperature of the CPU. Generally speaking, it can be 5 ⁇ 10°C higher than the normal working temperature of the CPU.
  • the normal working temperature of the general CPU is 45 ⁇ 55°C, so the phase change material with the phase change point of 56 ⁇ 65°C can be selected.
  • the water cooling module includes: a heat absorption mechanism, a cooling liquid pump and a heat dissipation mechanism, the heat absorption mechanism is used to absorb the heat transferred by the heat conduction cavity, and the heat absorption mechanism, the cooling liquid pump and the heat dissipation mechanism are connected by a hose, The coolant pump drives the water in the heat absorption mechanism and the water in the heat dissipation mechanism to realize circulation.
  • the heat absorption mechanism includes: a heat transfer cavity and a second heat sink, the second heat sink is fixed inside the heat transfer cavity, the liquid water is filled in the heat transfer cavity, and the heat transfer cavity is made of red copper.
  • the heat absorption mechanism is mainly used to absorb the heat transferred from the heat conduction cavity.
  • a temperature sensor is installed in the heat transfer cavity of the heat absorption mechanism.
  • the temperature sensor can measure the heat in the heat-absorbing mechanism, so as to adjust the gear size of the fan in the heat-dissipating mechanism.
  • the heat dissipation mechanism includes: a third heat dissipation fin, a metal pipe and a fan, the metal pipe is filled with liquid water, and the fan releases the heat of the third heat dissipation fin and the metal pipe into the air.
  • the third heat sink is a "W-shaped" heat sink.
  • the W-type heat sink dissipates heat more quickly.
  • the ratio of the added amount of water in the heat-conducting cavity to the volume in the heat-conducting cavity is 0.4-0.6, and the air pressure in the heat-conducting cavity is less than 1.01 ⁇ 10 5 Pa. That is, the air in the heat conduction cavity is pumped to a low pressure, which is lower than the standard atmospheric pressure, which reduces the temperature of the vaporization of liquid water.
  • the water in the heat-conducting cavity continuously undergoes vaporization and liquefaction reactions, continuously absorbing and releasing heat, which improves the overall heat dissipation and heat conduction efficiency.
  • the basic working process of the phase change liquid cooling device is as follows: when the temperature of the CPU rises, the heat is transferred to the water cooling module through the liquid water and water vapor in the heat conduction cavity, and the heat is dissipated through the water cooling module.
  • the temperature exceeds the heat dissipation of the water cooling module
  • the phase change energy storage module starts to work, and the phase change material liquefies, Absorbs a lot of heat quickly, preventing the water-cooled module from heating up.
  • the water cooling module will also return to the normal temperature zone below the phase transition point.
  • the liquefied phase change material releases heat to re-solidify, returns the heat absorbed during the peak to the water-cooled module, and dissipates into the air through the cooling mechanism of the water-cooled module.
  • the phase change material absorbs or releases part of the heat through the phase change to prevent the CPU temperature from rising and protect the stable operation of the system.
  • phase-change energy storage module a three-layer structure of a phase-change energy storage module, a water-cooling module, and a heat-conducting cavity is adopted, and the effect of the phase-change energy storage module is used to reduce the temperature of the CPU when the CPU is overloaded. It enables the CPU to work normally under normal temperature, and solves the technical problem that the CPU in the computer cannot be rapidly dissipated due to the overloaded state of the CPU, resulting in the decline of CPU performance and CPU service life, which leads to the technical problem that the computer cannot be used normally. .
  • FIG. 1 is a schematic structural diagram of a phase change liquid cooling device according to the present application.
  • FIG. 2 is a structural diagram of the interior of a heat absorption mechanism of a phase-change liquid-cooled heat sink according to an embodiment of the present application.
  • phase change energy storage module of a phase change liquid cooling device is an internal structural diagram of a phase change energy storage module of a phase change liquid cooling device according to an embodiment of the present application.
  • orientation or positional relationship indicated by the terms “upper” and “lower” is based on the orientation or positional relationship shown in the drawings. These terms are primarily used to better describe the present application and its embodiments, and are not intended to limit the specific orientation of the indicated device or component.
  • the terms “installed”, “set up”, “provided with”, “connected”, “connected”, “socketed” should be construed broadly. For example, it may be a fixed connection, a detachable connection, or an integral structure; it may be a direct connection, or an indirect connection through an intermediate medium, or an internal communication between two devices, elements or components.
  • installed may be a fixed connection, a detachable connection, or an integral structure; it may be a direct connection, or an indirect connection through an intermediate medium, or an internal communication between two devices, elements or components.
  • the present application relates to a phase-change liquid-cooled heat dissipation device
  • the phase-change liquid-cooled heat dissipation device includes, from top to bottom, a phase-change energy storage module 1 , a water-cooled module 2 and a heat conduction cavity 3
  • the heat-absorbing mechanism 7 of the water-cooled module is fixedly installed with the phase-change energy storage module and the heat-conducting cavity at the top and bottom respectively, and the heat-conducting cavity is installed on the CPU 4; ⁇ 0.9, the heat conduction cavity is made of red copper material; the phase change energy storage module is filled with phase change material.
  • the heat-conducting cavity mainly transfers heat to the water-cooling module through the liquid water in the heat-conducting cavity and the wall of the heat-conducting cavity.
  • the cooling mechanism dissipates heat.
  • the phase change energy storage module begins to function.
  • the phase change material in the phase change energy storage module can absorb heat.
  • the phase change material releases the heat into the water cooling module. , restore the normal state, and play the role of buffer protection at the peak time of CPU overload.
  • the heat-conducting cavity is filled with water and the ratio of the added amount of water to the volume of the heat-conducting cavity is 0.5, that is, there are liquid water and air layers in the heat-conducting cavity.
  • the heat-conducting cavity is made of red copper material.
  • the copper material has very good thermal conductivity, is not easy to rust, has a long use time and has good durability.
  • the CPU is mounted on the motherboard 16 .
  • the phase change energy storage module includes a closed energy storage cavity 5 and a first heat sink 6, the first heat sink is arranged in the energy storage cavity, and the phase change material is filled in the energy storage cavity.
  • the first heat sink is integrally formed with the energy storage cavity.
  • the phase change point of the phase change material in the phase change energy storage module is 59°C.
  • the phase change material with a phase change point of 59°C can ensure the normal and efficient operation of the CPU.
  • the normal operating temperature range of the CPU is 45°C-55°C. When the temperature exceeds 59°C, the phase change energy storage module will play a role.
  • the water cooling module includes: a heat absorption mechanism 7, a cooling liquid pump 8 and a heat dissipation mechanism 9.
  • the heat absorption mechanism is used to absorb the heat transmitted by the heat conduction cavity. They are connected through a hose 10, and the cooling liquid pump drives the water in the heat absorption mechanism and the water in the heat dissipation mechanism to achieve circulation.
  • the coolant pump 8 is electrically connected to the power supply 18, and the power supply 18 is electrically connected to the control panel 19.
  • the control panel is used to control the gear position of the fan and the switch of the coolant pump.
  • the temperature sensor 17 is electrically connected to the control panel, and the control panel is electrically connected to the power supply.
  • the heat absorption mechanism includes: a heat transfer cavity 11 and a second heat sink 12, the second heat sink is fixed inside the heat transfer cavity, liquid water is filled in the heat transfer cavity, and the heat transfer cavity is Made of copper material.
  • the heat absorption mechanism is mainly used to absorb the heat transferred from the heat conduction cavity.
  • there are also two guide isolation plates 20 the length of the guide isolation plates is less than the length of the second heat sink, and the guide isolation plates mainly play the role of backflow of liquid water.
  • a temperature sensor may also be installed in the heat transfer cavity of the heat absorption mechanism.
  • the temperature sensor can measure the heat in the heat absorption mechanism, and it is convenient to adjust the gear size of the fan in the heat dissipation mechanism through the control panel.
  • the temperature sensor is electrically connected with the control panel. When the temperature sensor exceeds the normal temperature, the fan gear is adjusted to speed up the fan operation and increase the heat dissipation capacity.
  • the heat dissipation mechanism includes: a third heat sink 13, a metal pipe 14, a fan 15 and a control panel.
  • the control panel is a small controller, and the metal pipe is filled with liquid water. And the heat from the metal pipes is dissipated into the air.
  • the third heat sink is a "W-shaped" heat sink. The W-type heat sink dissipates heat more quickly.
  • the air pressure in the heat conduction cavity is less than 0.8 ⁇ 10 5 Pa. That is, the air in the heat conduction cavity is pumped to a low pressure, which is lower than the standard atmospheric pressure, which reduces the temperature of the vaporization of liquid water.
  • the water in the heat-conducting cavity continuously undergoes vaporization and liquefaction reactions, continuously absorbing and releasing heat, which improves the overall heat dissipation and heat conduction efficiency.
  • the basic working process of the phase change liquid cooling device is as follows: when the temperature of the CPU rises, the heat is transferred to the water cooling module through the liquid water and water vapor in the heat conduction cavity, and the heat is dissipated through the water cooling module.
  • the temperature exceeds the heat dissipation of the water cooling module
  • the phase change energy storage module starts to work, and the phase change material liquefies, Absorbs a lot of heat quickly, preventing the water-cooled module from heating up.
  • the water cooling module will also return to the normal temperature zone below the phase transition point.
  • the liquefied phase change material releases heat to re-solidify, returns the heat absorbed during the peak to the water-cooled module, and dissipates into the air through the cooling mechanism of the water-cooled module.
  • the phase change material absorbs or releases part of the heat through the phase change to prevent the CPU temperature from rising and protect the stable operation of the system.
  • a three-layer structure of a phase-change energy storage module, a water-cooling module, and a heat-conducting cavity is adopted, and the effect of the phase-change energy storage module reduces the temperature of the CPU when the CPU is overloaded. , so that the CPU can work normally under normal temperature, which solves the problem of the CPU in the computer, because the CPU is in an overloaded state, the CPU performance and CPU service life are reduced due to the inability to quickly dissipate heat, and the computer cannot be used normally. question.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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  • Chemical & Material Sciences (AREA)
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种相变液冷散热装置。该相变液冷散热装置从上到下依次包括：相变储能模块（1）、水冷模块（2）和导热腔体（3），水冷模块（2）的吸热机构（7）上、下分别与相变储能模块（1）、导热腔体（3）固定安装，导热腔体（3）安装于CPU（4）上；所述导热腔体（3）内填充水且水的添加量与导热腔体（3）内的体积之比为0.2～0.9，导热腔体（3）由紫铜材质制成；相变储能模块（1）内填充相变材料。解决了在电脑中的CPU，由于CPU在超负荷状态下，无法快速散热而导致的CPU性能下降、CPU使用寿命下降，进而导致电脑无法正常使用的技术问题。

Description

相变液冷散热装置 技术领域
本申请涉及电子控温技术领域，特别是电脑中的散热装置，具体而言，涉及一种用于CPU超负荷状态下散热的相变液冷散热装置。
 背景技术
中央处理器（简称CPU）是电脑的核心电子元件之一，随着人们对计算机能力需求的增加，以及现在各种大型软件以及游戏的大力发展，导致CPU计算负荷越来越大。目前计算机的CPU功耗已经达到80W左右了，高功率、高频率的计算机会导致CPU温度升高，缩短CPU的使用寿命，降低CPU的性能。
CPU的正常工作温度一般维持在45℃-55℃之间。目前，现有的计算机中的散热设备主要有散热铝、风扇构成，在使用过程中，使用电源驱动风扇，以到达快速散热的目的，这种方式消耗电能高、功率高。最重要的一点就是，当CPU超过散热装置所能散热的状态的时候，即：散热装置无法满足CPU过热的时候，也就是CPU有时候会在超负荷状态下，持续工作，导致CPU所产生的热量超过预定的温度，散热风扇无法快速将热量带走，导致的CPU在较高温度下工作，从而导致CPU性能降低、使用寿命降低的技术问题。本发明将解决在电脑中的CPU，由于CPU在超负荷状态下，无法快速散热而导致的CPU性能、CPU使用寿命均下降，进而导致电脑无法正常使用的技术问题。针对上述问题，目前尚未提出有效的解决方案。
 技术问题
本申请的主要目的在于提供一种相变液冷散热装置，以解决在电脑中的CPU，由于CPU在超负荷状态下，无法快速散热而导致的CPU性能下降、CPU使用寿命下降，进而导致电脑无法正常使用的技术问题。本发明将能够有效解决CPU在超负荷工作状态下，无法快速散热的技术问题，能够有效预防过热状态下，无法及时散热对CPU本身的损害。
 技术解决方案
为了实现上述目的，根据本申请的一个方面，提供了一种相变液冷散热装置，该相变液冷散热装置从上到下依次包括：相变储能模块、水冷模块和导热腔体，水冷模块的吸热机构上、下分别与相变储能模块、导热腔体固定安装，导热腔体安装于CPU上；所述导热腔体内填充水且水的添加量与导热腔体内的体积之比为0.2~0.9，导热腔体由紫铜材质制成；相变储能模块内填充相变材料。导热腔体主要通过导热腔体内的液态水和导热腔体壁将热量传递给水冷模块，相变储能模块与导热腔体之间主要为水冷模块的吸热机构，吸热后将通过水冷模块的散热机构进行散热。当出现CPU超负荷状态的时候，相变储能模块开始发挥作用，相变储能模块内的相变材料能够吸收热量，当CPU恢复正常状态的时候，相变材料将热量释放到水冷模块中，恢复正常状态，起到了CPU超负荷尖峰时刻缓冲保护的作用。所述导热腔体内填充水且水的添加量与导热腔体内体积比为0.2~0.9，即导热腔体内有液态的水和空气层，采用液态水蒸发后，通过水蒸气传递给水冷模块，效率更高。导热腔体由紫铜材质制成，紫铜材质导热性非常好，且不易生锈，使用时间长，耐久性好。水冷模块的吸热机构上、下分别与相变储能模块、导热腔体可用强力胶水贴附式固定安装，当然不限定其他固定方式进行固定。水冷模块也可称为液冷模块。
优选地，所述相变储能模块包括密闭的储能腔体和第一散热片，第一散热片设于储能腔体内，相变材料填充于储能腔体内。
优选地，所述第一散热片与储能腔体一体成型。
优选地，所述相变储能模块内相变材料选用相变点为56~75℃的相变材料，进一步优选的，选用相变点为56~65℃的相变材料。当然本发明中，选用相变材料的时候，根据CPU正常温度和CPU极限温度进行选择，一般来说，比CPU正常工作温度高出5~10℃即可。一般的CPU正常工作温度为45~55℃，因此选用相变点为56~65℃的相变材料即可。
优选地，所述水冷模块包括：吸热机构、冷却液泵和散热机构，吸热机构用于吸收导热腔体传递的热量，吸热机构、冷却液泵、散热机构之间通过软管相连，冷却液泵驱动吸热机构中的水与散热机构中的水实现循环。
优选地，吸热机构包括：传热腔体和第二散热片，第二散热片固定于传热腔体内部，液态水灌装于传热腔体内，传热腔体为紫铜材质制成。吸热机构主要用于吸收导热腔体传递过来的热量。
优选地，吸热机构的传热腔体内安装温度传感器。温度传感器能够测量出吸热机构中的热量，便于调整散热机构中的风扇的挡位大小。
优选地，所述散热机构包括：第三散热片、金属管道和风扇，液态水填充于金属管道中，风扇将第三散热片和金属管道的热量释放到空气中。
优选地，第三散热片为“W型”的散热片。W型的散热片散热更加迅速。
优选地，导热腔体内水的添加量与导热腔体内的体积比为0.4~0.6，导热腔体内空气压强为小于1.01×10 5Pa。即导热腔体内的空气抽成低气压，小于标准大气压，降低液态水汽化的温度。热量传递过程中，导热腔体内的水不断发生汽化、液化的反应，不断吸收和释放热量，提升了整体的散热和热传导的效率。
该相变液冷散热装置的基本工作过程为：CPU温度升高的时候，将热量通过导热腔体内的液态水和水蒸气传递给水冷模块，并通过水冷模块进行散热。当温度超过水冷模块所能散热的时候，CPU处于超负荷状态的时候，并且温度超过相变储能模块内相变材料相变点的时候，相变储能模块开始工作，相变材料液化，快速吸收大量热量，阻止水冷模块升温。当CPU恢复正常负荷时，水冷模块也会回到相变点以下的正常温区。随着温度降低，液化的相变材料释放热量重新固化，将尖峰时吸收的热量返回给水冷模块，通过水冷模块的散热机构散失在空气中。在这个过程中，相变材料通过相态变化吸收或释放部分热量，来阻止CPU温度的升高，保护了系统的稳定运行。
 有益效果
在本申请中，采用相变储能模块、水冷模块、导热腔体三层的结构的方式，通过相变储能模块所产生的作用，达到了CPU在超负荷状态下，降低CPU的温度，使CPU能够在正常温度下正常工作，解决了在电脑中的CPU，由于CPU在超负荷状态下，无法快速散热而导致的CPU性能、CPU使用寿命均下降，进而导致电脑无法正常使用的技术问题。
 附图说明
构成本申请的一部分的附图用来提供对本申请的进一步理解，使得本申请的其它特征、目的和优点变得更明显。本申请的示意性实施例附图及其说明用于解释本申请，并不构成对本申请的不当限定。
在附图中：图1是根据本申请一种相变液冷散热装置的结构示意图。
图2是根据本申请实施例一种相变液冷散热装置的吸热机构内部的结构图。
图3是根据本申请实施例一种相变液冷散热装置的相变储能模块内部结构图。
其中，图中标号表示：1、相变储能模块；2、水冷模块；3、导热腔体；4、CPU；5、储能腔体；6、第一散热片；7、吸热机构；8、冷却液泵；9、散热机构；10、软管；11、传热腔体；12、第二散热片；13、第三散热片；14、金属管道；15、风扇；16、主板；17、温度传感器；18、电源；19、控制面板；20、导向隔离板。
 本发明的实施方式
为了使本技术领域的人员更好地理解本申请方案，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分的实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本申请保护的范围。
需要说明的是，本申请的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的本申请的实施例。此外，术语“包括”意图在于覆盖不排他的包含。
在本申请中，术语“上”、“下”指示的方位或位置关系为基于附图所示的方位或位置关系。这些术语主要是为了更好地描述本申请及其实施例，并非用于限定所指示的装置或组成部分必须具有特定方位。
并且，上述部分术语除了可以用于表示方位或位置关系以外，还可能用于表示其他含义，例如术语“上”在某些情况下也可能用于表示某种依附关系或连接关系。对于本领域普通技术人员而言，可以根据具体情况理解这些术语在本申请中的具体含义。
此外，术语“安装”、“设置”、“设有”、“连接”、“相连”、“套接”应做广义理解。例如，可以是固定连接，可拆卸连接，或整体式构造；可以是直接相连，或者是通过中间媒介间接相连，又或者是两个装置、元件或组成部分之间内部的连通。对于本领域普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本申请。
如图1-3所示，本申请涉及一种相变液冷散热装置，该相变液冷散热装置从上到下依次包括：相变储能模块1、水冷模块2和导热腔体3，水冷模块的吸热机构7上、下分别与相变储能模块、导热腔体固定安装，导热腔体安装于CPU4上；导热腔体内填充水且水的添加量与导热腔体内体积比为0.2~0.9，导热腔体由紫铜材质制成；相变储能模块内填充相变材料。导热腔体主要通过导热腔体内的液态水和导热腔体壁将热量传递给水冷模块，相变储能模块与导热腔体之间主要为水冷模块的吸热机构，吸热后将通过水冷模块的散热机构进行散热。当出现CPU超负荷状态的时候，相变储能模块开始发挥作用，相变储能模块内的相变材料能够吸收热量，当CPU恢复正常状态的时候，相变材料将热量释放到水冷模块中，恢复正常状态，起到了CPU超负荷尖峰时刻缓冲保护的作用。导热腔体内填充水且水的添加量与导热腔体内体积比为0.5，即导热腔体内有液态的水和空气层，采用液态水蒸发后，通过水蒸气传递给水冷模块，效率更高。导热腔体由紫铜材质制成，紫铜材质导热性非常好，且不易生锈，使用时间长，耐久性好。CPU安装于主板16上。
如图1-3所示，相变储能模块包括密闭的储能腔体5和第一散热片6，第一散热片设于储能腔体内，相变材料填充于储能腔体内。第一散热片与储能腔体一体成型。
相变储能模块内相变材料的相变点为59℃。相变点为59℃的相变材料能够保证CPU正常高效的工作，CPU正常工作温度区间为45℃-55℃，当超过59℃的时候，相变储能模块发挥作用。
如图1-3所示，水冷模块包括：吸热机构7、冷却液泵8和散热机构9，吸热机构用于吸收导热腔体传递的热量，吸热机构、冷却液泵、散热机构之间通过软管10相连，冷却液泵驱动吸热机构中的水与散热机构中的水实现循环。冷却液泵8与电源18电连接，电源18与控制面板19电连接，控制面板用于控制风扇的挡位和冷却液泵开关，温度传感器17与控制面板电连接，控制面板与电源电连接。
如图2所示，吸热机构包括：传热腔体11和第二散热片12，第二散热片固定于传热腔体内部，液态水灌装于传热腔体内，传热腔体为紫铜材质制成。吸热机构主要用于吸收导热腔体传递过来的热量。图2中还设有2个导向隔离板20，导向隔离板长度小于第二散热片的长度，导向隔离板主要起到液态水倒流的作用。
吸热机构的传热腔体内还可以安装温度传感器。温度传感器能够测量出吸热机构中的热量，通过控制面板便于调整散热机构中的风扇的挡位大小。温度传感器与控制面板电连接，当温度传感器超过正常温度的时候，调整风扇挡位，加快风扇运转，增大散热能力。
如图1-3所示，散热机构包括：第三散热片13、金属管道14、风扇15以及控制面板，控制面板即为小型控制器，液态水填充于金属管道中，风扇将第三散热片和金属管道的热量散失到空气中。第三散热片为“W型”的散热片。W型的散热片散热更加迅速。
如图1所示，导热腔体内空气压强为小于0.8×10 5Pa。即导热腔体内的空气抽成低气压，小于标准大气压，降低液态水汽化的温度。热量传递过程中，导热腔体内的水不断发生汽化、液化的反应，不断吸收和释放热量，提升了整体的散热和热传导的效率。
该相变液冷散热装置的基本工作过程为：CPU温度升高的时候，将热量通过导热腔体内的液态水和水蒸气传递给水冷模块，并通过水冷模块进行散热。当温度超过水冷模块所能散热的时候，CPU处于超负荷状态的时候，并且温度超过相变储能模块内相变材料相变点的时候，相变储能模块开始工作，相变材料液化，快速吸收大量热量，阻止水冷模块升温。当CPU恢复正常负荷时，水冷模块也会回到相变点以下的正常温区。随着温度降低，液化的相变材料释放热量重新固化，将尖峰时吸收的热量返回给水冷模块，通过水冷模块的散热机构散失在空气中。在这个过程中，相变材料通过相态变化吸收或释放部分热量，来阻止CPU温度的升高，保护了系统的稳定运行。
在本实施例中，采用相变储能模块、水冷模块、导热腔体三层的结构的方式，通过相变储能模块所产生的作用，达到了CPU在超负荷状态下，降低CPU的温度，使CPU能够在正常温度下正常工作，解决了在电脑中的CPU，由于CPU在超负荷状态下，无法快速散热而导致的CPU性能、CPU使用寿命均下降，进而导致电脑无法正常使用的技术问题。
以上仅为本申请的优选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (9)

  1. 一种相变液冷散热装置，其特征在于，包括：相变储能模块（1）、水冷模块（2）和导热腔体（3），水冷模块的吸热机构（7）上、下分别与相变储能模块、导热腔体固定安装，导热腔体贴附于CPU（4）上；所述导热腔体内填充水且水的添加量与导热腔体内的体积之比为0.2~0.9，导热腔体由紫铜材质制成；相变储能模块（1）内填充相变材料。
  2. 根据权利要求1所述的相变液冷散热装置，其特征在于，所述相变储能模块（1）包括密闭的储能腔体（5）和第一散热片（6），第一散热片设于储能腔体内，相变材料填充于储能腔体内。
  3. 根据权利要求2所述的相变液冷散热装置，其特征在于，所述第一散热片（6）与储能腔体一体成型。
  4. 根据权利要求1所述的相变液冷散热装置，其特征在于，所述水冷模块包括：吸热机构（7）、冷却液泵（8）和散热机构（9），吸热机构用于吸收导热腔体传递的热量，吸热机构、冷却液泵、散热机构之间通过软管（10）相连，冷却液泵驱动吸热机构中的水与散热机构中的水实现循环。
  5. 根据权利要求4所述的相变液冷散热装置，其特征在于，吸热结构包括：传热腔体（11）和第二散热片（12），第二散热片固定于传热腔体内部，液态水灌装于传热腔体内，传热腔体（11）为紫铜材质制成。
  6. 根据权利要求5所述的相变液冷散热装置，其特征在于，吸热机构的传热腔体内安装温度传感器（17）。
  7. 根据权利要求4所述的相变液冷散热装置，其特征在于，所述散热机构包括：第三散热片（13）、金属管道（14）和风扇（15），液态水填充于金属管道中，风扇将第三散热片和金属管道的热量释放到空气中。
  8. 根据权利要求7所述的相变液冷散热装置，其特征在于，第三散热片为“W型”的散热片。
  9. 根据权利要求1所述的相变液冷散热装置，其特征在于，导热腔体（3）内水的添加量与导热腔体内的体积比为0.4~0.6，导热腔体内空气压强为小于1.01×10 5Pa。
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