WO2022090823A1 - Ensemble et procédé de manipulation de tranches - Google Patents

Ensemble et procédé de manipulation de tranches Download PDF

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Publication number
WO2022090823A1
WO2022090823A1 PCT/IB2021/058715 IB2021058715W WO2022090823A1 WO 2022090823 A1 WO2022090823 A1 WO 2022090823A1 IB 2021058715 W IB2021058715 W IB 2021058715W WO 2022090823 A1 WO2022090823 A1 WO 2022090823A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
wafer holder
station
carrier
loading station
Prior art date
Application number
PCT/IB2021/058715
Other languages
English (en)
Inventor
Massimo SCARPELLA
Pascal Dromard
Damien Coste
Marco Oberli
Original Assignee
Ismeca Semi Conductor Holding Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ismeca Semi Conductor Holding Sa filed Critical Ismeca Semi Conductor Holding Sa
Priority to CN202180073432.3A priority Critical patent/CN116547793A/zh
Priority to KR1020237014217A priority patent/KR20230093267A/ko
Publication of WO2022090823A1 publication Critical patent/WO2022090823A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Definitions

  • the present invention concerns an assembly and method of handling semiconductor wafers; and in particular to an assembly and method in which a wafer comprising components to be picked is loaded onto a second wafer holder at a loading station, while components are picked from a wafer on a first wafer holder located at a picking station.
  • Existing assemblies and method for handling semiconductor wafers typically comprise a carrier which receive a wafer at a loading station and transport that wafer to a picking station; at the picking station semiconductor components on the wafer are picked and moved onto a rotatable turret which transports each of the respective picked components to a series of processing/testing stations located at the periphery of the turret.
  • an assembly for handling semiconductor wafers having the features recited in independent claim 1; and a method of handling semiconductor wafers which involves carrying out the steps recited in claim 13.
  • Figures 1 and 2 provide a perspective view of an assembly 1 according to an embodiment of the present invention
  • Figure 3 provides a perspective view of the first and second wafer holders and the carrier used in the assembly of Figures 1 and 2;
  • Figure 4 illustrates the step of the carrier moving a wafer holder from the picking station to the intermediate rest station of the assembly
  • Figures 5 and 6 illustrates the operation of the actuator and the cam of the assembly as the carrier moves a wafer holder into the intermediate rest station;
  • Figure 7a illustrates a step in which the first wafer holder in the intermediate rest station is lifted by the first pair of claiming members so that the first wafer holder is removed from the carrier;
  • Figure 7a also illustrates that the second wafer holder in the loading station has been moved to an elevated position by the second pair of clamping member so as to provide space to allow the carrier to be moved under the second wafer holder;
  • Figure 7b illustrate the carrier moving under the second wafer holder.
  • Figure 8 illustrates a step in which the second wafer holder in the loading station is moved downwards, away from the elevated position shown in Figure 7, onto the carrier; and the operation of the actuator on the carrier is also illustrated after the second wafer holder has been placed on the carrier;
  • Figure 9 illustrates a step in which the second wafer holder which was already loaded with a wafer having semiconductor components to be picked (see figure 7) is moved from the loading station to the picking station;
  • Figure 10 illustrates steps in which the first wafer holder is moved by the transfer arm, from the intermediate rest station to the loading station;
  • Figure 11 illustrates a step wherein the first wafer holder is transferred from the transfer arm to the first pair of clamping members located at the loading station;
  • Figure 12 illustrates a step wherein empty wafer (i.e. the wafer from which all of the semiconductor components have been picked) on first wafer holder is removed from the first wafer holder and placed into a magazine;
  • Figure 13 illustrates a step wherein a wafer having semiconductor components to be picked, is loaded from a magazine onto the first wafer holder;
  • Figure 14 illustrates a step wherein the first wafer holder is configured to clamp the wafer and stretch the wafer foil; and the first wafer holder is lifted by the first pair of claiming members so as to provide space to allow the carrier to be moved under the first wafer holder.
  • Figures 1 and 2 is a perspective view of exemplary embodiment of a wafer handling assembly 1 according to an exemplary embodiment of the present invention, which can be used to perform a method according to the accord to an exemplary embodiment of the present invention.
  • the assembly 1 comprises, a first wafer holder 2a and second wafer holder 2b, each of which can hold a respective wafer 3 which comprises semiconductor components 3a.
  • the assembly 1 further comprises a carrier 5 which is selectively operable to carry one of said wafer holders 2a, 2b to move said wafer holder to predefined, different locations within the assembly 1.
  • the assembly comprises a picking station 7, a loading station 8, and an intermediate rest station 9.
  • the picking station 7 comprises means to pick semiconductor components from a wafer on the wafer holder 2a, 2b which has been brought to the picking station by the carrier 5.
  • the loading station 8 comprises means to load a wafer having semiconductor components onto a wafer holder 2a, 2b which is located at the loading station 8.
  • the intermediate rest station 9 comprises an area in which a wafer holder 2a, 2b can be parked.
  • the components 3a could be picked using any suitable means, in this example the components are picked using a component handling head on a picking tool; the component handling head on the picking tool is them moved to bring the picked component to a position below a respective component handling head on a rotatable turret; the component handling head on the rotatable turret then picks the component from the component handling head on the picking tool.
  • the transfer arm 13 is configured such that it can be selectively moved to first and second positions, wherein in said first position the transfer arm 13 can mechanically cooperate with a wafer holder 2a, b held by the first pair of clamping members 11a,b, to hold said wafer holder, and in said second position the second pair of clamping members 12a,b located at the loading station 8 can clamp the wafer holder 2a, b held by the transfer arm 13.
  • the assembly further comprises a controller 20 which is configured to operate said carrier 5 and the transfer means 10, so that, the carrier 5 moves the second wafer holder 2b from the loading station 8 to the picking station 7, wherein at the picking station 7 semiconductor components 3a on a wafer 3 held on the second wafer holder 2b can be picked from the wafer; and so that the transfer means 10 moves the first wafer holder 2a from the intermediate rest station 9 to the loading station 8, after the carrier 5 has moved the second wafer holder 2b from the loading station 8, so that a wafer 3 comprising semiconductor components 3a which are to be picked, is loaded onto the first wafer holder 2a while the semiconductor components 3a on a wafer 3 held on the second wafer holder 2b are picked at the picking station 7.
  • a controller 20 which is configured to operate said carrier 5 and the transfer means 10, so that, the carrier 5 moves the second wafer holder 2b from the loading station 8 to the picking station 7, wherein at the picking station 7 semiconductor components 3a on a wafer 3 held on the second wafer
  • the controller 20 is further configured to operate said carrier 5 and the transfer means 10, so that, the carrier 5 moves the second wafer holder 2b from the picking station 7 to the intermediate rest station 9, after all the semiconductor components 3a on the wafer 3 on the second wafer holder 2b have been picked; so that the second wafer holder 2b (which now holds an empty wafer 3 (i.e. the wafer 3 which has no more semiconductor components 3a)) is located at the intermediate rest station 9 at same time the first wafer holder 2a is located at the loading station 8.
  • Figure 3 provides a perspective view of the first and second wafer holders 2a, b (in Figure 3 the first wafer holder 2a is located at the intermediate station 9 and the second wafer holder 2b is located that the loading station 8) and a perspective view of the carrier 5.
  • Each of the first and second wafer holder 2a, b comprise, a base platform member 31, which comprises a projecting portion 33 on which a wafer foil 3 having semiconductor components 3a attached thereto, can be supported; and a top member 34, wherein the top member has an aperture 32 defined therein which can receive the projection portion 33 of the base platform member 31.
  • the base platform member 31 further comprises a first rim 35, and the top member 34 comprises a second rim 36, and wherein base platform member 31 and the top member 34 can be selectively arrange to clamp a wafer ring to which the wafer foil 3 is attached); and wherein when base platform member 31 and the top member 34 are be selectively arrange to clamp the wafer ring the projecting portion 33 of the base platform member 31 projects into the aperture 32 defined in the top member 34 so that a wafer foil which is attached to the wafer ring is stretched.
  • Each of the first and second wafer holders 2a, b comprise a rotatable stage 39 wherein the base platform member 31 is attached to the stage 39; wherein said stage 39 comprises a rim member 38.
  • Figure 3 also shows that the carrier 5 comprises an actuator 37; the actuator 37 can mechanically cooperate with the rim member 38 of a respective wafer holder 2a, b when the wafer holder 2a, b is supported on the carrier 5; and the actuator can be selectively operated to rotate the stage 39 of that wafer holder 2a, b.
  • the actuator 37 comprises a wheel member 40 which comprises a groove 41 and wherein the groove 41 has dimensions such that when the wafer holder 2a, b is supported on the carrier 5 the rim member 38 of the stage 39 abuts a surface which defines the groove 41; when the actuator 37 is actuated the wheel member 40 rotates and the rotation of the wheel member 40 applies a force to the rim member 38 of the stage 39 of the wafer holder 2a, b to effect rotation of the stage 39.
  • the actuator 37 further comprises a biasing means 43 (which in this example comprises a spring 43) which biases the wheel member 40 towards abutting rim member 38 of the stage 39 when the wafer holder 2a, b is supported on the carrier 5.
  • the actuator 37 further comprise a leaver member 43b which is configured such when a force is applied to the leaver member 43b the wheel member 40 is moved against the biasing means 43 in a direction away from the rim member 38.
  • the assembly 1 further comprise a first cam member 48a and second cam member 48b.
  • the first cam member 48a is located so that when the carrier 5 moves into the intermediate rest station 9 the movement of the carrier 5 into the intermediate rest station 9 causes the first cam member 48a to apply a force to the leaver member 43b belonging to the actuator 37 of the carrier 5, so that the wheel member 40 is moved against the biasing means 43 in a direction away from the rim member 38 of the wafer holder 2a, b which is supported on the carrier 5, before the first pair of clamping members 11a,b located at the intermediate rest station 9 move the wafer holder 2a, b off of the carrier 5.
  • the assembly further comprises a second cam member 48b.
  • the assembly 1 can be used to perform a method of wafer handling according to a further aspect of the present invention. It should be understood that the method of the present invention is not limited to requiring the use of the assembly 1, rather, any suitable assembly can be used to perform said method of the present invention. An exemplary embodiment of the method will be described which uses the assembly 1 described above. In the following a specific embodiment of the method will be described, however it should be understood that only those method steps recited in the independent method claim of this application are essential to the invention, all other method steps described are optional steps.
  • the preferred embodiment of the method of the present invention comprises the steps of, moving the first wafer holder 2a from the picking station 7 to the intermediate rest station 9 after the semiconductor components 3a on the wafer 3 on the first wafer holder 2a have been picked at the picking station (as illustrated in Figure 4); transferring the first wafer holder 2a from the carrier 5 to the transfer means 10 at the intermediate rest station 9;
  • Figures 5 and 6 illustrates the operation of the actuator 37 of the carrier 5 and the first cam 48a as the carrier 5 moves the first wafer holder 2a into the intermediate rest station; so at this stage of the method the first wafer holder 2a is located at the intermediate rest station 9 at same time as the second wafer holder 2b is located at the loading station 8.
  • the first pair of clamping members 11 a,b located at the intermediate rest station 9 move the first wafer holder 2a is transferred from the first pair of clamping members 11a, b to the transfer arm 13; so that the transfer arm 13 now holds the first wafer holder 2a.
  • Figure 7b after the first pair of clamping members 11a,b move the first wafer holder 2a off of the carrier 5 the carrier then moves from the intermediate rest station 9 to a position under the second wafer holder 2b at the loading station 8.
  • Figure 8 also illustrates the operation of the actuator 37 on the carrier 5 and the second cam 48b as the carrier 5 moves into the loading station and the second wafer holder is placed onto the carrier 5.
  • the movement of the carrier 5 into the loading station 8 causes the second cam member 48b to apply a force to the leaver member 43b belonging to the actuator 37 of the carrier 5, so that the wheel member 40 is moved against the biasing means 43, so that the wheel member 40 is moved out of the way of the rim member 38 of the stage 39 of the second wafer holder 2b which is being delivered onto the carrier 5 at the loading station 8; subsequently, when the carrier 5 is moved out of the loading station 8 the force which the second cam member 48b applied to the leaver member 43b is removed and the biasing means 43 moves the wheel member 40 to abut rim member 38 of the stage 39 of the second wafer holder 2b.
  • the method further comprises the steps of, using the carrier to move the second wafer holder 2b from the loading station 8 to the picking station 7 after a wafer 3 comprising semiconductor components 3a to be picked has been loaded onto the second wafer holder 2b (as illustrated in Figure 9); using the transfer means 10 to move the first wafer holder 2a from the intermediate rest station 9 to the loading station 8, after the carrier 5 moves the second wafer holder 2b from the loading station (as illustrated in Figure 10 and 11); picking the semiconductor components 3a from the wafer 3 held on the second wafer holder 2b at the picking station; loading a wafer 3 comprising semiconductor components 3a which are to be picked onto the first wafer holder 2a at the loading station 8 (as illustrated in Figures 12-14), while semiconductor components 3a on a wafer 3 held on the second wafer holder 2b are picked from the wafer at the picking station 7.
  • the preferred method further comprises the steps of, moving the second wafer holder 2b from the picking station 7 to the intermediate rest station 9 after the semiconductor component 3a on the wafer 3 on the second wafer holder 2b have been picked; so that at this stage of the method the second wafer holder 2b is located at the intermediate rest station 9 at same time as the first wafer holder 2a is located at the loading station 8; transferring the second wafer holder 2b from the carrier 5 to the transfer means 10 at the intermediate rest station 9; moving the carrier 5 from the intermediate rest station 9 to the loading station 8, and transferring the first wafer holder 2a onto the carrier 5 at the loading station 8 (after a wafer 3 having semiconductor components 3a which are to be picked has been loaded onto the first wafer holder 2a); using the carrier 5 to move the first wafer holder 2a (which now holds a wafer 3 having semiconductor components 3a which are to be picked at the picking station 7) from the loading station 8 to the picking station 7; using the transfer means 10 to move the second wafer holder
  • the above mentioned steps are repeated a plurality of times.
  • the wafer 3 comprises a wafer foil which is attached to a wafer ring; the semiconductor components 3 are located on the wafer foil.
  • the step of loading a wafer 3 comprising semiconductor components 3a which are to be picked onto the first wafer holder 2a at the loading station 8, preferably comprises transferring a wafer 3 which comprises a wafer ring which comprises a wafer foil attached thereto and comprises semiconductor components attached to the wafer foil, onto the base platform member 31 of the first wafer holder 2a; and moving a top member 34 of first wafer holder 2a so that the wafer ring is clamped between the base platform member 31 and the top member 34 of the first wafer holder 2a; and moving a projecting portion 33 of the base platform member 31 into an aperture 32 defined in the top member 34 so that the wafer foil is stretched.
  • the step of loading a wafer 3 comprising semiconductor components 3a which are to be picked onto the second wafer holder 2b at the loading station 8 comprises transferring a wafer 3 which comprises a wafer ring which comprises a wafer foil attached thereto and which comprises semiconductor components attached to the wafer foil, onto a base platform member 32 of the second wafer holder 2b; and moving a top member 34 of second wafer holder 2b so that the wafer ring is clamped between the base platform member 31 and the top member 34 of the second wafer holder 2b; and moving a projecting portion 33 of the base platform member 31 into an aperture 32 defined in the top member 34 so that the wafer foil is stretched.
  • Figures 12-14 The steps of loading a wafer 3 comprising semiconductor components 3a which are to be picked onto the first wafer holder 2a at the loading station 8 are illustrated in Figures 12-14; more precisely, Figure 12 illustrates the unloading of the empty wafer (i.e. a wafer from which all of the semiconductor components have already been picked at the picking station 7) and Figures 13 the loading of a new wafer comprising semiconductor components 3a which are to be picked onto the first wafer holder 2a and Figure 14 illustrates the closing of the first wafer holder so that the wafer is securely held on the first wafer holder and the wafer foil of the wafer is stretched.
  • Figure 12 illustrates the unloading of the empty wafer (i.e. a wafer from which all of the semiconductor components have already been picked at the picking station 7)
  • Figures 13 the loading of a new wafer comprising semiconductor components 3a which are to be picked onto the first wafer holder 2a
  • Figure 14 illustrates the closing of the first wafer holder so that the wa
  • Figures 12-14 illustrate the steps of loading a wafer 3 comprising semiconductor components 3a which are to be picked onto the first wafer holder 2a at the loading station 8 the same steps are performed when loading a wafer 3 comprising semiconductor components 3a which are to be picked onto the second wafer holder 2b at the loading station 8.
  • the top member 34 of the first wafer holder 2a is moved away from the based platform member 31 so that the wafer ring 60 of the empty wafer 3 on the first wafer holder 2a is unclamped; once unclamped the empty wafer 3 is moved from the first wafer holder 2a into a magazine 61a.
  • a new wafer 3 comprising semiconductor components 3a which are to be picked, is then moved from the magazine 61a into the first wafer holder 2a; specifically the new wafer 3 is moved onto the based platform member 31 of the first wafer holder 2a so that the new wafer 3 is positioned between the top member 34 and the based platform member 31 of the first wafer holder 2a.
  • the top member 34 of the first wafer holder 2a is moved towards the based platform member 31 so that the wafer ring 60 of the new wafer 3 is clamped between the first rim 35 of the base platform member 31 and the second rim 36 of the top member 34; this clamping ensures that the new wafer 3 is held securely on the first wafer holder 2a.
  • the projecting portion 33 of the base platform member 31 projects into the aperture 32 defined in the top member 34 so that a wafer foil 60b of the new wafer 3 which is attached to the wafer ring 60 of the new wafer, is stretched.
  • the step of transferring the second wafer holder 2b from the carrier 5 to the transfer means 10 at the intermediate rest station 9 comprises, clamping the second wafer holder 2b using a first pair of clamping members 11a,b located at the intermediate rest station 9; moving the second wafer holder 2b using the first pair of clamping members 11 a,b towards a transfer arm 13 so that the transfer arm 13 mechanically cooperates with the second wafer holder 2b; and then moving the first pair of clamping members 11 a,b away from the second wafer holder 2b so that the second wafer holder 2b is held exclusively by the transfer arm 13.
  • the step of transferring the first wafer holder 2a from the carrier 5 to the transfer means 10 at the intermediate rest station 9 comprises, clamping the first wafer holder 2a using a first pair of clamping members 11a,b located at the intermediate rest station 9; moving the first wafer holder 2a using the first pair of clamping members 11 a,b towards a transfer arm 13 so that the transfer arm 13 mechanically cooperates with the first wafer holder 2a; and then moving the first pair of clamping members 11a,b away from the first wafer holder 2a so that the first wafer holder 2a is held exclusively by the transfer arm 13.
  • the second pair of clamping member 12a,b move to clamp the first wafer holder 2a which is held by the transfer arm 13, once the second pair of clamping members 12a, b have clamped the first wafer holder 2a the first wafer holder 2a is then released from the transfer arm 13 so that the first wafer holder 2a is held exclusively by the second pair of clamping members 12a,b.
  • the transfer arm 13 then moves along the track 13b, from the loading station 8 back to the intermediate rest station 9.
  • the second pair of clamping members 12a, b move the first wafer holder 2a downwards, away from the transfer arm 13, so that the first wafer holder 2a does not obstruct the movement of the transfer arm 13 from the loading station 8 back to the intermediate rest station 9.
  • the step of using the transfer means 10 to move the second wafer holder 2b from the intermediate rest station 9 to the loading station 8 comprises moving the transfer arm 13, so that the transfer arm 13moves the second wafer holder 2b from the intermediate rest station 9 to the loading station 8. It should be understood that the same steps as described above are performed when moving the second wafer holder 2b from the intermediate rest station 9 to the loading station 8.
  • the method preferably comprises the step of clamping the first wafer holder 2a using a second pair of clamping members 12a,b located at the loading station 8 after the transfer means 10 moves the first wafer holder 2a from the intermediate rest station 9 to the loading station 8; and moving the first wafer holder 2a, using the second pair of clamping members 12a, b away from the transfer arm 13 so that the first wafer holder 2a is held exclusively by the second pair of clamping members 12a,b.
  • the carrier 5 receives the loaded wafer holder 2a, b from the clamping members 12a,b before transporting the loaded wafer holder 2a, b to the picking station 7.
  • the step of loading a wafer comprising semiconductor components which are to be picked onto the second wafer holder 2b at the loading station 8 is done as the second wafer holder 2b is held exclusively by the second pair of clamping members 12a,b.
  • the step of loading a wafer comprising semiconductor components which are to be picked onto the first wafer holder 2a at the loading station 8 is done as the first wafer holder 2a is held exclusively by the second pair of clamping members 12a, b.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Selon la présente invention, il est proposé un ensemble qui comprend, au moins un premier et un second support de tranche, chacun d'entre eux pouvant contenir une tranche qui comprend des composants semi-conducteurs ; un support qui est sélectivement actionnable pour porter l'un desdits supports de tranche pour déplacer ledit support de tranche ; une station de prélèvement dans laquelle la station de prélèvement comprend des moyens pour prélever des composants semi-conducteurs à partir d'une tranche sur le support de tranche ; une station de chargement, la station de chargement comprenant des moyens pour charger une tranche ayant des composants semi-conducteurs sur un support de tranche ; une station de repos intermédiaire qui comprend une zone dans laquelle un support de tranche peut être stationné ; un moyen de transfert qui peut fonctionner de manière sélective pour déplacer un support de tranche de la station de repos intermédiaire à la station de chargement ; un dispositif de commande qui est conçu pour faire fonctionner ledit support et le moyen de transfert, de sorte que, le support déplace le second support de tranche de la station de chargement à la station de prélèvement, au niveau de la station de prélèvement, des composants semi-conducteurs sur une tranche maintenue sur le second support de tranche peuvent être prélevés à partir de la tranche ; le moyen de transfert déplace le premier support de tranche de la station de repos intermédiaire vers la station de chargement, après que le support déplace le second support de tranche à partir de la station de chargement, de telle sorte qu'une tranche comprenant des composants semi-conducteurs qui doivent être prélevés, est chargée sur le premier support de tranche tandis que les composants semi-conducteurs sur une tranche maintenue sur le second support de tranche sont prélevés à partir de la tranche. L'invention concerne en outre un procédé correspondant de manipulation de tranches semi-conductrices.
PCT/IB2021/058715 2020-10-27 2021-09-24 Ensemble et procédé de manipulation de tranches WO2022090823A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202180073432.3A CN116547793A (zh) 2020-10-27 2021-09-24 用于处理晶片的组件和方法
KR1020237014217A KR20230093267A (ko) 2020-10-27 2021-09-24 웨이퍼의 어셈블리 및 취급 방법

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Application Number Priority Date Filing Date Title
CH13762020 2020-10-27
CH01376/20 2020-10-27

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WO2022090823A1 true WO2022090823A1 (fr) 2022-05-05

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PCT/IB2021/058715 WO2022090823A1 (fr) 2020-10-27 2021-09-24 Ensemble et procédé de manipulation de tranches

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KR (1) KR20230093267A (fr)
CN (1) CN116547793A (fr)
TW (1) TW202218027A (fr)
WO (1) WO2022090823A1 (fr)

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