CN115069653B - 一种槽式晶圆清洗设备及使用方法 - Google Patents
一种槽式晶圆清洗设备及使用方法 Download PDFInfo
- Publication number
- CN115069653B CN115069653B CN202211011186.1A CN202211011186A CN115069653B CN 115069653 B CN115069653 B CN 115069653B CN 202211011186 A CN202211011186 A CN 202211011186A CN 115069653 B CN115069653 B CN 115069653B
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- CN
- China
- Prior art keywords
- wafer
- basket
- area
- cleaning
- loading
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 177
- 238000000034 method Methods 0.000 title claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims abstract description 117
- 238000001035 drying Methods 0.000 claims abstract description 29
- 235000012431 wafers Nutrition 0.000 claims description 575
- 230000007306 turnover Effects 0.000 claims description 84
- 230000032258 transport Effects 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 7
- 230000008569 process Effects 0.000 abstract description 16
- 230000006872 improvement Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 230000003750 conditioning effect Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001502 supplementing effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/045—Cleaning involving contact with liquid using perforated containers, e.g. baskets, or racks immersed and agitated in a liquid bath
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/045—Cleaning involving contact with liquid using perforated containers, e.g. baskets, or racks immersed and agitated in a liquid bath
- B08B3/047—Containers specially adapted therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211011186.1A CN115069653B (zh) | 2022-08-23 | 2022-08-23 | 一种槽式晶圆清洗设备及使用方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202211011186.1A CN115069653B (zh) | 2022-08-23 | 2022-08-23 | 一种槽式晶圆清洗设备及使用方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN115069653A CN115069653A (zh) | 2022-09-20 |
CN115069653B true CN115069653B (zh) | 2023-01-17 |
Family
ID=83245255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202211011186.1A Active CN115069653B (zh) | 2022-08-23 | 2022-08-23 | 一种槽式晶圆清洗设备及使用方法 |
Country Status (1)
Country | Link |
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CN (1) | CN115069653B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117153734B (zh) * | 2023-09-22 | 2024-10-11 | 苏州智程半导体科技股份有限公司 | 一种半导体晶圆多槽清洗装置 |
CN117878042B (zh) * | 2024-03-11 | 2024-06-04 | 无锡琨圣智能装备股份有限公司 | 一种晶圆插片机构及方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110116728A (ko) * | 2010-04-20 | 2011-10-26 | 세메스 주식회사 | 웨이퍼 처리 방법 |
CN206059354U (zh) * | 2016-08-31 | 2017-03-29 | 张家港市超声电气有限公司 | 硅片花篮回转机构 |
CN107051966A (zh) * | 2017-03-08 | 2017-08-18 | 常州市科沛达超声工程设备有限公司 | 全自动硅片清洗线及其工作方法 |
CN109326547B (zh) * | 2018-11-16 | 2023-11-10 | 罗博特科智能科技股份有限公司 | 花篮内循环装置 |
CN212768148U (zh) * | 2020-02-27 | 2021-03-23 | 湖南红太阳光电科技有限公司 | 一种用于光伏车间自动传输的花篮缓存站 |
TW202218027A (zh) * | 2020-10-27 | 2022-05-01 | 瑞士商伊斯美加半導體控股公司 | 處理晶圓之總成及方法 |
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2022
- 2022-08-23 CN CN202211011186.1A patent/CN115069653B/zh active Active
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Publication number | Publication date |
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CN115069653A (zh) | 2022-09-20 |
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CP01 | Change in the name or title of a patent holder |
Address after: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Zhicheng semiconductor equipment technology (Kunshan) Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CP03 | Change of name, title or address |
Address after: 215000, No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |