WO2022083639A1 - 电子设备 - Google Patents

电子设备 Download PDF

Info

Publication number
WO2022083639A1
WO2022083639A1 PCT/CN2021/124980 CN2021124980W WO2022083639A1 WO 2022083639 A1 WO2022083639 A1 WO 2022083639A1 CN 2021124980 W CN2021124980 W CN 2021124980W WO 2022083639 A1 WO2022083639 A1 WO 2022083639A1
Authority
WO
WIPO (PCT)
Prior art keywords
sound
structural member
circuit board
middle frame
electronic device
Prior art date
Application number
PCT/CN2021/124980
Other languages
English (en)
French (fr)
Inventor
郑宁杰
Original Assignee
维沃移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Priority to EP21882054.6A priority Critical patent/EP4236272A4/en
Publication of WO2022083639A1 publication Critical patent/WO2022083639A1/zh
Priority to US18/192,208 priority patent/US20230239386A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/023—Screens for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2884—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure
    • H04R1/2888—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2892—Mountings or supports for transducers
    • H04R1/2896—Mountings or supports for transducers for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present application belongs to the field of communication technologies, and specifically relates to an electronic device.
  • smartphones on the market are increasingly focusing on the functions of entertainment experience.
  • the demand for stereo sound of mobile phones is getting higher and higher.
  • scenes such as videos, movies, and games mobile phones need to have stereo functions to improve the audio experience.
  • the speaker module In the process of realizing stereo sound, if a speaker module is used, the speaker module will occupy a large space, which will affect the layout of other components of the mobile phone, and even affect the capacity of the battery.
  • the cavity inside the phone is used as the sound cavity of the speaker, and the speaker will cause violent vibrations of parts such as the battery cover when it is working, thus affecting the experience of using the phone.
  • the purpose of the embodiments of the present application is to provide an electronic device that can solve the problems of the prior art speakers occupying too much space, poor sound-producing performance, and causing vibrations of components such as battery covers.
  • An embodiment of the present application provides an electronic device, including: a display module, a middle frame, a sound-emitting device, a first structural member, a first circuit board, and a back shell, the middle frame is provided with an accommodating groove, and the display module The group is arranged in the accommodating slot, the side of the middle frame facing away from the display module is provided with an installation slot, the sound-emitting device is at least partially arranged in the installation slot, the first structural member and the The back case is disposed on the side of the middle frame away from the display module, the first structural member is located between the back case and the middle frame, and the first structural member is connected to the back case There is a first gap between, where:
  • the first structural member and the middle frame form a first sound cavity of the sound-emitting device, and the first circuit board is located in the first sound cavity; or,
  • the first circuit board is located between the first structural member and the middle frame, a fixing groove is formed on the first circuit board, and the sound-emitting device is partially arranged in the fixing groove, and the first circuit board is provided with a fixing groove.
  • the structural member is enclosed with the first circuit board to form a first sound cavity of the sound producing device.
  • the second gap forms a sound guide channel, and the sound guide channel communicates with the installation groove.
  • it also includes a first sealing member, in the case that the first structural member and the middle frame are enclosed to form a first sound cavity of the sound-emitting device, the first structural member and the middle frame They are sealed and connected by the first sealing member.
  • the first structural member and the first circuit board are enclosed to form the first sound cavity of the sound-emitting device, the first structural member and the The first circuit boards are sealed and connected through the first sealing member.
  • the first structural member is provided with a mounting hole
  • the middle frame is provided with a connecting portion
  • the connecting portion is correspondingly distributed with the mounting hole
  • the first connecting piece is connected to the connecting portion through the mounting hole
  • the second sealing piece is disposed on the side of the mounting hole away from the connecting portion, and the second sealing piece seals Cover the mounting holes.
  • it further includes a third sealing member, in the case that the first structural member and the first circuit board are enclosed to form a first sound cavity of the sound-emitting device, the first circuit board and the The middle frames are sealed and connected through the third sealing member.
  • a leakage hole is further opened on the first structural member, the leakage hole communicates with the first sound cavity, and a damping net is arranged in the leakage hole.
  • the edge of the first structural member is formed with a bone position, and when the first structural member and the middle frame are enclosed to form the first sound cavity of the sound-emitting device, the first sealing The component is arranged on the contact surface between the bone position and the middle frame. Under the circumstance that the first structural component and the first circuit board are enclosed to form the first sound cavity of the sound-emitting device, the The first sealing member is arranged on the contact surface between the bone site and the first circuit board.
  • a camera the camera is arranged in the first sound cavity, the first structural member is also provided with a camera through hole, and the camera protrudes from the surface of the first structural member through the camera through hole, so The contact surface between the camera head and the first structural member is further provided with a third sealing member.
  • a flexible circuit board when the first structural member and the middle frame are enclosed to form a first sound cavity of the sound-emitting device, a part of the flexible circuit board passes through the first sealing member and the middle frame. The frames enter into the first sound cavity and are electrically connected to the first circuit board.
  • a flexible circuit board when the first structural member and the first circuit board are enclosed to form a first sound cavity of the sound-emitting device, a gap is formed on the first structural member, and the first circuit The board exposes the first structural member through the notch, and the flexible circuit board is connected to the portion of the first circuit board exposed through the notch.
  • the first sealing member and the third sealing member are foam
  • the second sealing member is a polyester film (Polyester Film, PET).
  • the first sound cavity is formed by components such as the middle frame and the first structural member of the electronic device, which reduces the space occupied by the speaker and expands the volume of the sound cavity, which can effectively improve the performance of the speaker and enhance the The sound quality suppresses the bad phenomenon that the speaker causes the battery cover to vibrate.
  • FIG. 1 is a schematic diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 2 is an exploded view of an electronic device provided by an embodiment of the present application.
  • FIG 3 is one of the cross-sectional views of the sound-emitting device provided by the embodiment of the present application.
  • FIG. 4 is one of the exploded views of the structural assembly provided by the embodiment of the application.
  • FIG. 5 is a cross-sectional view of the connection position of the first structural member and the middle frame provided by the embodiment of the present application;
  • FIG. 6 is a cross-sectional view of a camera provided in an embodiment of the present application.
  • FIG. 7 is one of the schematic diagrams of the connection between the first circuit board and the flexible circuit board according to an embodiment of the present application.
  • FIG. 8 is the second cross-sectional view of the sound-emitting device provided by the embodiment of the present application.
  • FIG. 9 is the second exploded view of the structural assembly provided by the embodiment of the application.
  • FIG. 10 is a schematic diagram of a notch position of a first structural member provided by an embodiment of the present application.
  • FIG. 11 is the second schematic diagram of the connection between the first circuit board and the flexible circuit board provided by the embodiment of the application.
  • FIG. 12 is a schematic diagram of a front side of a middle frame provided by an embodiment of the present application.
  • FIG. 13 is a schematic diagram of the back side of the middle frame provided by the embodiment of the present application.
  • first, second and the like in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the present application can be practiced in sequences other than those illustrated or described herein, and distinguish between “first”, “second”, etc.
  • the objects are usually of one type, and the number of objects is not limited.
  • the first object may be one or more than one.
  • “and/or” in the description and claims indicates at least one of the connected objects, and the character “/" generally indicates that the associated objects are in an "or” relationship.
  • the top of the electronic device is generally provided with a speaker module, but the inventors of the present application found that since there are many components on the top of the electronic device, including the main board, the camera assembly, etc.
  • the volume of the speaker module is large and the space occupied is too large, which will affect the arrangement of camera components, etc., and even reduce the volume of the battery that can be assembled due to the excessive occupation of the internal space of the electronic device.
  • the corresponding battery capacity is also reduced; if the speaker unit is used on the top of the electronic device, in order to ensure a certain sound effect, the internal cavity of the electronic device needs to be used as the sound cavity of the speaker unit, which will cause the speaker unit to cause The violent vibration of the battery cover will affect the experience of the mobile phone.
  • FIG. 1 is a schematic diagram of an electronic device according to an embodiment of the present application.
  • an embodiment of the present application provides an electronic device.
  • a sound-emitting device 105 is placed on the top of the electronic device 100 , and the sound-emitting device 105 realizes sound transmission through the second gap 102 of the electronic device 100 .
  • the electronic device 100 may specifically be a mobile phone, a tablet computer, or the like.
  • the electronic device may include: a display module, a middle frame, a sound-emitting device, a first structural member, a first circuit board, and a back shell, the middle frame is provided with an accommodating slot, and the display module is provided with In the accommodating groove, a side of the middle frame facing away from the display module is provided with an installation groove, and the sound-emitting device is at least partially arranged in the installation groove, and the first structural member and the back The shell is disposed on the side of the middle frame away from the display module, the first structural member is located between the back casing and the middle frame, and between the first structural member and the back casing has a first gap where:
  • the first structural member and the middle frame form a first sound cavity of the sound-emitting device, and the first circuit board is located in the first sound cavity;
  • the first circuit board is located between the first structural member and the middle frame, a fixing groove is formed on the first circuit board, and the sound-emitting device is partially provided In the fixing groove, the first structural member and the first circuit board are enclosed to form a first sound cavity of the sound-emitting device.
  • FIG. 2 is an exploded view of an electronic device provided by an embodiment of the present application
  • FIG. 3 is one of cross-sectional views of a sound-emitting device provided by an embodiment of the present application. As shown in FIG. 2 and FIG.
  • the electronic device 100 in the embodiment of the present application may include a display module 103 , a middle frame 104 , a sounding device 105 , a first structural member 1061 , a first circuit board 111 and a back shell 118, wherein, the front side of the middle frame 104 is provided with an accommodating groove, the display module 103 is arranged in the accommodating groove opened on the front side of the middle frame 104, and a side surface of the middle frame 104 away from the display module 103 is provided with a mounting groove 1041, The sounding device 105 is arranged on the back of the middle frame 104, and part of the sounding device 105 is embedded in the installation groove 1041 to prevent the sounding device 105 from sliding; One side of the display module 103, and the first structural member 1061 and the middle frame 104 enclose the first sound cavity 108 of the sound-emitting device 105, and the first circuit board 111 is located in the first sound cavity 108; A structural member 1061 is located between the back shell
  • the sound-emitting device 105 may be a speaker
  • the display module 103 may include a screen
  • the first structural member 1061 is an internal structural member of the electronic device, specifically a cover plate or a circuit board and other devices.
  • the second gap 102 between the display module 103 and the middle frame 104, and the second gap 102 is formed as a sound guide channel, and the sound guide channel is communicated with the installation groove 1041, so as to emit sound
  • the device 105 can transmit the sound to the outside of the electronic device 100 through the sound guiding channel, so as to realize the external sound reproduction.
  • the embodiment of the present application does not need to design a separate speaker module, but adopts a single sound-emitting device 105, which does not occupy the device stacking space at the top of the middle frame 104;
  • the original components of 100 constitute the first sound cavity 108 with a larger volume, which makes the performance of the sound-emitting device 105 more excellent, the stereo effect is better, and there is no problem that the performance of the speakers at the top and the bottom differs greatly; in addition, due to the first sound
  • the cavity 108 is not in contact with the back shell 118 fixed on the back of the middle frame 104 , so sound waves are hardly transmitted to the back shell 118 when the speaker is working, and the back shell 118 will not vibrate violently and affect the user experience.
  • the electronic device includes a structural component 106 .
  • the structural component 106 also includes a first sealing component 1062 .
  • the first sealing member 1062 is disposed on the contact surface of the first structural member 1061 and the middle frame 104, so that the first structural member 1061 A sealed first sound cavity 108 is formed between it and the middle frame 104 .
  • the first sealing member 1062 may have the same shape as the outer circumference of the first structural member 1061, such as a rectangle, and the material of the first sealing member 1062 may be foam, and of course, may also be a sealing material such as elastic rubber.
  • FIG. 5 is a cross-sectional view of the connection position of the first structural member and the middle frame provided by the embodiment of the present application.
  • the structural component 106 of the electronic device 100 may further include a first connecting member 1063 and a second sealing member 1064 , and the first structural member 1061 is further provided with a There are a plurality of mounting holes 1065, and the back of the middle frame 104 is provided with a connecting portion 1042 correspondingly. The connection between them is fixed.
  • each mounting hole 1065 away from the connecting portion 1042 is also attached there is a second sealing member 1064, and the second sealing member 1064 covers the mounting hole 1065, and the second sealing member 1064 realizes the sealing of the joint, so as to achieve a better sound quality effect and reduce the impact on the first sound cavity 108. vibration interference from external devices.
  • the second sealing member 1064 is a PET film; in an optional embodiment, the first connecting member 1063 can be a screw, the mounting hole 1065 is correspondingly formed as a screw hole, and the connecting portion 1042 is formed as a screw post, namely A cylinder with screw holes; in another optional embodiment, the first connector 1063 can be a snap, and the connecting portion 1042 is formed as a snap, and the snap is passed through the mounting hole 1065 to fit with the snap Realize a fixed connection.
  • the first structural member 1061 is further provided with a leakage hole 1066 , and a damping net 1067 is attached to the leakage hole 1066 or at least one of the two ends of the leakage hole 1066 , and the leakage hole 1066 And the damping net 1067 is used to adjust the air pressure balance of the first sound chamber 108 to avoid the problem of noise caused by excessive air pressure.
  • a bone position 10611 is formed on the edge of the first structural member 1061 .
  • a cover space is formed on the back, and the first sound cavity 108 is further sealed; and the first sealing member 1062 is arranged on the contact surface between the bone position 10611 of the first structural member 1061 and the middle frame 104, and is facing the first structural member 1061.
  • the first sealing member 1062 can have a good sealing effect.
  • FIG. 6 is a cross-sectional view of a camera according to an embodiment of the present application.
  • the electronic device 100 further includes a camera 109 , and the camera 109 is disposed in the covering space formed by the first structural member 1061 and the middle frame 104 , that is, in the first sound cavity 108 , and,
  • the first structural member 1061 also has a camera through hole 10612, and the collecting end of the camera 109 protrudes from the surface of the first structural member 1061 through the camera through hole 10612 to collect optical signals.
  • a camera seal 110 is also provided on the contact surface between the camera 109 and the first structural member 1061.
  • the camera seal 110 can be annular, and the camera through hole 10612 is located in the camera In the enclosed area of the sealing member 110, when the first structural member 1061 exerts a pressing force on the camera head 109, the camera head sealing member 110 can have a good sealing effect.
  • the camera sealing member 110 may be foam, or may be a sealing material such as elastic rubber.
  • FIG. 7 is one schematic diagram of the connection between the first circuit board and the flexible circuit board according to an embodiment of the present application.
  • the electronic device 100 further includes a flexible circuit board 112 , and the first circuit board 111 is disposed in the enclosed space between the first structural member 1061 and the middle frame 104 , that is, the first sound cavity 108 Inside.
  • the flexible circuit board 112 needs to be connected with the first circuit board 111 .
  • the first structural member 1061 Since the first circuit board 111 is covered by the first structural member 1061 , in order to solve the sealing problem during the connection between the flexible circuit board 112 and the first circuit board 111 The problem is that the part of the flexible circuit board 112 located outside the first structural member 1061 is close to the back of the middle frame 104 , and the other part of the flexible circuit board 112 enters the first sealing member 1062 and the middle frame 104 Inside a sound cavity 108, it climbs up to the first circuit board 111 to connect with the first circuit board 111. Since the thickness of the flexible circuit board 112 is thin, when the first structural member 1061 applies a pressing force, the first A seal 1062 can still have a good sealing effect, thereby solving the leakage problem.
  • the first structural member 1061 may be other circuit boards other than the first circuit board 111 , a shelf board, or a shielding cover structure of the first circuit board 111 , or the like.
  • FIG. 8 is the second cross-sectional view of the sound-emitting device provided by the embodiment of the present application.
  • the first circuit board 111 is located between the first structural member 1061 and the middle frame 104 , and the first circuit board 111 is opened There is a fixing groove, and part of the sound-emitting device 105 is disposed in the fixing groove to reduce the assembly thickness of the electronic device 100 , and the first structural member 1061 and the first circuit board 111 are enclosed to form the first sound cavity 108 of the sound-emitting device.
  • first structural member 1061 and the first circuit board 111 are enclosed to form the first sound cavity 108 of the sound-emitting device 105, in order to ensure the sealing of the first sound cavity 108, the first structural member 1061 and the first circuit board 111
  • a first sealing member 1062 is used for sealing connection between them.
  • the edge of the first structural member is formed with a bone position, and the first sealing member 1062 is arranged on the contact surface between the bone position and the first circuit board 111; and
  • the first circuit board 111 and the middle frame 104 are hermetically connected by a third sealing member 1068 .
  • the adopted third sealing member 1068 may be foam, and of course may also be a device composed of sealing materials such as elastic rubber.
  • FIG. 9 is the second exploded view of the structural component provided by the embodiment of the application
  • FIG. 10 is a schematic diagram of the position of the notch of the first structural component provided by the embodiment of the application
  • FIG. 11 is the implementation of the application
  • FIGS. 9 to 11 in the embodiment of the present application, optionally, in the case where the first structural member 1061 and the first circuit board 111 are enclosed to form the first sound cavity 108 of the sound-emitting device 105 , the first structure There is also a gap 10613 on the component 1061.
  • the part of the first circuit board 111 in the gap 10613 will not be covered by the first structural component 1061, that is, the first circuit board 111 is partially exposed through the gap 10613.
  • the flexible circuit board 112 can be directly connected to the first circuit board 111 at the notch 10613, so as to achieve the effect of simplifying the assembly process.
  • FIG. 12 is a schematic diagram of a front side of a middle frame provided by an embodiment of the present application
  • FIG. 13 is a schematic diagram of a back side of the middle frame provided by an embodiment of the present application.
  • the back of the middle frame 104 is divided into three areas, namely the top area 113 , the middle area 114 and the bottom area 115 , wherein the speaker module 117 is placed in the bottom area 115 of the electronic device 100 , The speaker module 117 realizes sound transmission through the speaker sound hole 101 at the bottom of the electronic device 100.
  • the speaker module occupies a large space, but because it is arranged at the bottom of the electronic device 100, it has little influence; while the sound-emitting device 105 and the first The structural members 1061 are all disposed on the top area 113 of the middle frame 104. Since a speaker unit is used in the embodiment of the present application instead of a speaker module, the space occupied by the sound-emitting device 105 in the top area 113 is small, so the middle area The space of 114 can be appropriately increased, and the middle area 114 is used to place the battery 116, so the capacity of the battery 116 can also be improved to a certain extent, thereby improving the endurance of the electronic device; The speaker modules 117 of the zone 115 work together to produce a stereo effect.
  • the first sound cavity and the sealed second sound cavity are formed by components such as the middle frame and the cover plate assembly of the electronic device, which reduces the space occupied by the speaker and enlarges the volume of the sound cavity. Effectively improve the performance of the speaker, improve the sound quality, and suppress the bad phenomenon that the speaker causes the battery cover to vibrate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Telephone Set Structure (AREA)

Abstract

本申请公开了一种电子设备，属于通信技术领域。所述电子设备包括：显示模组、中框、发声器件、第一结构件、第一电路板和背壳，中框开设有容置槽，显示模组设置于容置槽内，中框背离显示模组的一侧开设有安装槽，发声器件至少部分设置于安装槽内，第一结构件和背壳设置于中框背显示模组的一侧，第一结构件与背壳之间具有第一间隙第一结构件与中框围合形成发声器件的第一音腔，或者，第一结构件与第一电路板围合形成发声器件的第一音腔。

Description

电子设备
相关申请的交叉引用
本申请主张在2020年10月23日在中国提交的中国专利申请No.202011146114.9的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于通信技术领域，具体涉及一种电子设备。
背景技术
目前，市场上的智能手机越来越注重娱乐体验的功能。其中手机立体声的需求越来越高，在视频、电影、游戏等场景中，手机需要具有立体声功能，以提升音频体验效果。
在实现立体声的过程中，若采用扬声器模组，则扬声器模组将会占用较大的空间，从而影响到手机其他器件的布局，甚至影响到电池的容量，而若直接装入扬声器，利用整机内的腔体作为扬声器的音腔，则扬声器工作时会引起电池盖等部件的剧烈震动，从而影响手机的使用体验。
发明内容
本申请实施例的目的是提供一种电子设备，能够解决现有技术扬声器占用过大的空间、发声性能不佳以及引起电池盖等部件产生震动的问题。
为了解决上述技术问题，本申请是这样实现的：
本申请实施例提供了一种电子设备，包括：显示模组、中框、发声器件、第一结构件、第一电路板和背壳，所述中框开设有容置槽，所述显示模组设置于所述容置槽内，所述中框背离所述显示模组的一侧开设有安装槽，所述发声器件至少部分设置于所述安装槽内，所述第一结构件和所述背壳设置于所述中框背离所述显示模组的一侧，所述第一结构件位于所述背壳和所述中框之间，且所述第一结构件与所述背壳之间具有第一间隙，其中：
所述第一结构件与所述中框围合形成所述发声器件的第一音腔，所述第 一电路板位于所述第一音腔内；或者，
所述第一电路板位于所述第一结构件和所述中框之间，所述第一电路板上开设有固定槽，所述发声器件部分设置于所述固定槽内，所述第一结构件与所述第一电路板围合形成所述发声器件的第一音腔。
可选的，所述显示模组与所述中框之间具有第二间隙，所述第二间隙形成导音通道，所述导音通道与所述安装槽相连通。
可选的，还包括第一密封件，在所述第一结构件与所述中框围合形成所述发声器件的第一音腔的情况下，所述第一结构件与所述中框之间通过所述第一密封件密封连接，在所述第一结构件与所述第一电路板围合形成所述发声器件的第一音腔的情况下，所述第一结构件与所述第一电路板之间通过所述第一密封件密封连接。
可选的，还包括第一连接件和第二密封件，所述第一结构件上开设有安装孔，所述中框上设置有连接部，所述连接部与所述安装孔对应分布，且所述第一连接件穿过所述安装孔与所述连接部相连接，所述第二密封件设置于所述安装孔背离所述连接部的一侧，且所述第二密封件封盖所述安装孔。
可选的，还包括第三密封件，在所述第一结构件与所述第一电路板围合形成所述发声器件的第一音腔的情况下，所述第一电路板与所述中框之间通过所述第三密封件密封连接。
可选的，所述第一结构件上还开设有泄漏孔，所述泄漏孔与所述第一音腔连通，所述泄漏孔内设有阻尼网。
可选的，所述第一结构件的边缘形成有骨位，在所述第一结构件与所述中框围合形成所述发声器件的第一音腔的情况下，所述第一密封件设置于所述骨位和所述中框之间的接触面上，在所述第一结构件与所述第一电路板围合形成所述发声器件的第一音腔的情况下，所述第一密封件设置于所述骨位和所述第一电路板之间的接触面上。
可选的，还包括：
摄像头，所述摄像头设置于所述第一音腔内，所述第一结构件上还开设有摄像头通孔，所述摄像头通过所述摄像头通孔伸出所述第一结构件的表面，所述摄像头和所述第一结构件之间的接触面还设置有第三密封件。
可选的，还包括：
柔性电路板，在所述第一结构件与所述中框围合形成所述发声器件的第一音腔的情况下，所述柔性电路板的部分经由所述第一密封件和所述中框之间进入所述第一音腔内与所述第一电路板电连接。
可选的，还包括：
柔性电路板，在所述第一结构件与所述第一电路板围合形成所述发声器件的第一音腔的情况下，所述第一结构件上开设有缺口，所述第一电路板通过所述缺口部分显露出所述第一结构件，所述柔性电路板与所述第一电路板露出于所述缺口的部分连接。
可选的，所述第一密封件和所述第三密封件为泡棉，所述第二密封件为聚酯薄膜(Polyester Film，PET)。
在本申请实施例中，利用电子设备的中框、第一结构件等部件形成第一音腔，减小了扬声器所占用的空间的同时扩大了音腔的体积，可以有效提高扬声器性能、提升音质，抑制了扬声器引起电池盖振动的不良现象。
附图说明
图1为本申请实施例提供的电子设备的示意图；
图2为本申请实施例提供的电子设备的爆炸图；
图3为本申请实施例提供的发声器件的截面图之一；
图4为本申请实施例提供的结构组件的爆炸图之一；
图5为本申请实施例提供的第一结构件和中框的连接位置的截面图；
图6为本申请实施例提供的摄像头处的截面图；
图7为本申请实施例提供的第一电路板与柔性电路板的连接示意图之一；
图8为本申请实施例提供的发声器件的截面图之二；
图9为本申请实施例提供的结构组件的爆炸图之二；
图10为本申请实施例提供的第一结构件的缺口位置的示意图；
图11为本申请实施例提供的第一电路板与柔性电路板的连接示意图之二；
图12为本申请实施例提供的中框的正面的示意图；
图13为本申请实施例提供的中框的背面的示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的电子设备进行详细地说明。
现有技术中，电子设备的顶部一般会设置有扬声器模组，但是本申请发明人发现，由于电子设备顶部的部件众多，包括主板、摄像头组件等均设置在该部位，因此若采用扬声器模组的形式，则由于扬声器模组的体积较大，占用的空间过大，从而会影响摄像头组件等的排布，甚至由于过多占用电子设备的内部空间而致使所能装配的电池的体积减小，相对应的电池容量也减少；若电子设备顶部采用扬声器单元，则为了保证一定的音效，需要利用电子设备的内部腔体作为扬声器单元的音腔，由此，将导致扬声器单元在工作时引发电池盖的剧烈震动，影响手机的体验效果。
由此，请参考图1，为本申请实施例提供的电子设备的示意图。如图1所示，本申请实施例提供一种电子设备，该电子设备100的顶部则放置有发声器件105，发声器件105通过电子设备100的第二间隙102实现声音外传。本申请实施例中，通过利用电子设备100的内部器件形成一定体积的腔体，在实现立体声效果的同时，不会占用过多的空间，也不会引起电池盖的震动。 其中，电子设备100具体可以为手机、平板电脑等。
本申请实施例中，电子设备可以包括：显示模组、中框、发声器件、第一结构件、第一电路板和背壳，所述中框开设有容置槽，所述显示模组设置于所述容置槽内，所述中框背离所述显示模组的一侧开设有安装槽，所述发声器件至少部分设置于所述安装槽内，所述第一结构件和所述背壳设置于所述中框背离所述显示模组的一侧，所述第一结构件位于所述背壳和所述中框之间，且所述第一结构件与所述背壳之间具有第一间隙，其中：
在一种可选的实施方式中，所述第一结构件与所述中框围合形成所述发声器件的第一音腔，所述第一电路板位于所述第一音腔内；
在另一种可选的实施方式中，所述第一电路板位于所述第一结构件和所述中框之间，所述第一电路板上开设有固定槽，所述发声器件部分设置于所述固定槽内，所述第一结构件与所述第一电路板围合形成所述发声器件的第一音腔。
下面结合附图介绍上述两种实施方式。
请参考图2至图3，图2为本申请实施例提供的电子设备的爆炸图，图3为本申请实施例提供的发声器件的截面图之一。如图2和图3所示，具体的，本申请实施例中的电子设备100可以包括显示模组103、中框104、发声器件105、第一结构件1061、第一电路板111和背壳118，其中，中框104的正面开设有容置槽，显示模组103设置于中框104正面开设的容置槽内，中框104背离显示模组103的一侧面上开设有安装槽1041，发声器件105设置于中框104的背面，且发声器件105的部分嵌设于安装槽1041中，用于防止发声器件105发生滑动；第一结构件1061和背壳118即设置于中框104背离显示模组103的一侧，并且，第一结构件1061和中框104围合形成发声器件105的第一音腔108，而第一电路板111即位于第一音腔108内；此外，第一结构件1061位于背壳118和中框104之间，并且第一结构件1061与背壳118之间具有第一间隙，通过该第一间隙，第一结构件1061与背壳118之间实现隔离。
本申请实施例中，发声器件105可以为扬声器，显示模组103可以包括屏幕，而第一结构件1061为电子设备的内部结构件，具体可以为盖板或者电路板等其他器件。
可选的，本申请实施例中，显示模组103与中框104之间具有第二间隙102，第二间隙102形成为导音通道，所述导音通道与安装槽1041相连通，从而发声器件105可以通过该导音通道将声音传到至电子设备100外部，实现声音外放。
由此，本申请实施例不需要设计单独的扬声器模组，而是采用单个发声器件105，不会占用中框104顶部的器件堆叠空间；并且通过合理利用电子设备100的内部空间，采用电子设备100原有的部件构成体积更大的第一音腔108，使得发声器件105的性能更加优异，立体声效果更好，不会出现顶部和底部的扬声器性能差异大的问题；此外，由于第一音腔108不与固定在中框104背面的背壳118接触，因此扬声器工作时声波几乎不会传递到背壳118，也就不会造成背壳118剧烈震动而影响用户使用体验的问题。
请参考图4，为本申请实施例提供的结构组件的爆炸图之一。如图2和图4所示，本申请实施例中，所述电子设备包括结构组件106，结构组件106除包括第一结构件1061外，还包括第一密封件1062，在第一结构件1061与中框104围合形成发声器件105的第一音腔108的情况下，第一密封件1062则设置在第一结构件1061与中框104的接触面上，由此，第一结构件1061和中框104之间构成密封的第一音腔108。
可选的，第一密封件1062可以呈与第一结构件1061的外周相同的形状，例如矩形，第一密封件1062的材质可以为泡棉，当然还可以是弹性橡胶等密封材料。
请参考图5，为本申请实施例提供的第一结构件和中框的连接位置的截面图。如图4、图5和图13所示，本申请实施例中，电子设备100的结构组件106还可以包括第一连接件1063和第二密封件1064，在第一结构件1061上还开设有多个安装孔1065，而中框104的背面上则对应设置有连接部1042，第一连接件1063即通过安装孔1065紧固在连接部1042上，从而实现第一结构件1061与中框104之间的连接固定。由于第一连接件1063与连接部1042之间可能存在间隙，因此，为了避免第一音腔108与外界连通，可选的，在每一安装孔1065的背离连接部1042的一侧还贴设有第二密封件1064，且第二密封件1064封盖住安装孔1065，通过第二密封件1064实现对,连接处的密 封，从而达到更好的音质效果，并降低对第一音腔108外的器件的振动干扰。可选的，第二密封件1064为PET薄膜；在一种可选实施方式中，第一连接件1063可以为螺丝，安装孔1065对应形成为螺丝孔，而连接部1042形成为螺丝柱，即开设有螺丝孔的柱体；在另一可选实施方式中，第一连接件1063可以为卡扣件，而连接部1042形成为扣位，通过卡扣件穿过安装孔1065与扣位配合实现固定连接。
请继续参考图4，本申请实施例中，第一结构件1061上还开设有泄漏孔1066，泄漏孔1066内或者泄漏孔1066的两端中的至少一端贴设有阻尼网1067，泄漏孔1066和阻尼网1067用于调节第一音腔108的气压平衡，避免出现气压过大而引发的杂音问题。
请继续参考图4，本申请实施例中，第一结构件1061的边缘形成有骨位10611，骨位10611使第一结构件1061呈盒装，从而第一结构件1061能够与中框104的背面形成盖合空间，进一步密封得到第一音腔108；而第一密封件1062则设置在第一结构件1061的骨位10611与中框104之间的接触面上，在向第一结构件1061施加压合力的情况下，第一密封件1062可起到良好的密封效果。
请参考图6，为本申请实施例提供的摄像头处的截面图。如图6所示，本申请实施例中，电子设备100还包括摄像头109，摄像头109设置于第一结构件1061与中框104形成的盖合空间内，即第一音腔108内，并且，第一结构件1061上还开设有摄像头通孔10612，摄像头109的采集端则通过摄像头通孔10612伸出第一结构件1061的表面，以采集光信号。为了确保第一音腔108的密封效果，在摄像头109与第一结构件1061之间的接触面上还设置有摄像头密封件110，摄像头密封件110可以为环状，摄像头通孔10612则位于摄像头密封件110的围合区域内，在第一结构件1061施加压合力在摄像头109上的情况下，摄像头密封件110可以起到良好的密封效果。可选的，摄像头密封件110可以为泡棉，还可以是弹性橡胶等密封材料。
请参考图7，为本申请实施例提供的第一电路板与柔性电路板的连接示意图之一。如图7所示，本申请实施例中，电子设备100还包括柔性电路板112，第一电路板111设置于第一结构件1061与中框104的围合空间内，即 第一音腔108内。通常，柔性电路板112需要与第一电路板111连接，由于第一电路板111被第一结构件1061盖合，因此，为了解决柔性电路板112与第一电路板111之间连接时的密封问题，柔性电路板112的位于第一结构件1061的外部的部分紧贴着中框104的背面，而柔性电路板112的另一部分则经由第一密封件1062与中框104之间进入到第一音腔108内，然后爬升至第一电路板111处与第一电路板111实现连接，由于柔性电路板112的厚度较薄，因此，在第一结构件1061施加压合力的情况下，第一密封件1062依旧能够起到较好的密封效果，从而解决泄漏问题。可选的，第一结构件1061可以是除第一电路板111以外的其他电路板，也可以是架板，还或者是第一电路板111的屏蔽盖结构等。
请参考图8，为本申请实施例提供的发声器件的截面图之二。如图8所示，本申请的另一实施方式中，与图3中的结构不同的是，第一电路板111位于第一结构件1061和中框104之间，第一电路板111上开设有固定槽，发声器件105部分设置于固定槽内，以此降低电子设备100的组装厚度，并且第一结构件1061与第一电路板111围合形成所述发声器件的第一音腔108。
在第一结构件1061与第一电路板111围合形成发声器件105的第一音腔108的情况下，为确保第一音腔108的密封性，第一结构件1061与第一电路板111之间通过第一密封件1062密封连接，具体的，第一结构件的边缘形成有骨位，第一密封件1062设置于所述骨位和第一电路板111之间的接触面上；而第一电路板111与中框104之间通过第三密封件1068密封连接。可选的，采用的第三密封件1068可以为泡棉，当然还可以是弹性橡胶等密封材料所组成的器件。
请参考图9至图11，图9为本申请实施例提供的结构组件的爆炸图之二，图10为本申请实施例提供的第一结构件的缺口位置的示意图，图11为本申请实施例提供的第一电路板与柔性电路板的连接示意图之二。如图9至图11所示，本申请实施例中，可选的，在第一结构件1061与第一电路板111围合形成发声器件105的第一音腔108的情况下，第一结构件1061上还开设有一缺口10613，由于缺口10613的存在，第一电路板111在该缺口10613的部分将不被第一结构件1061所盖合，即第一电路板111通过缺口10613而部分显 露出第一结构件1061，则此时柔性电路板112可以直接在该缺口10613处于第一电路板111连接，从而可以达到简化组装工艺的效果。
至于本实施方式中的其他部件及连接方式，可以参考前一实施方式中的描述，在此不再赘述。
请参考图12至图13，图12为本申请实施例提供的中框的正面的示意图，图13为本申请实施例提供的中框的背面的示意图。如图12至图13所示，中框104的背面分为三个区域，即顶部区域113、中部区域114和底部区域115，其中，在电子设备100的底部区域115放置有扬声器模组117，扬声器模组117通过电子设备100的底部扬声器出声孔101实现声音外传，扬声器模组占用的空间较大，但由于设置在电子设备100的底部，因此影响不大；而发声器件105和第一结构件1061均设在中框104的顶部区域113，由于本申请实施例中采用的是扬声器单体，而非扬声器模组，因此发声器件105占用的顶部区域113的空间较小，因此中部区域114的空间可以得到适当增加，而该中部区域114用于放置电池116，因此电池116的容量也可得到一定的提升，从而提高电子设备的续航能力；此外，顶部区域113的发声器件105与底部区域115的扬声器模组117共同作用，以产生立体声效果。
在本申请实施例中，通过电子设备的中框、盖板组件等部件形成第一音腔和密封的第二音腔，减小了扬声器所占用的空间的同时扩大了音腔的体积，可以有效提高扬声器性能、提升音质，抑制了扬声器引起电池盖振动的不良现象。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。此外，需要指出的是，本申请实施方式中的方法和装置的范围不限按示出或讨论的顺序来执行功能，还可包括根据所涉及的功能按基本同时的方式或按相反的顺序来执行功能，例如，可以按不同于所描述的次序来执行所描述的方法，并且还可以添加、省 去、或组合各种步骤。另外，参照某些示例所描述的特征可在其他示例中被组合。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (11)

  1. 一种电子设备，包括：显示模组、中框、发声器件、第一结构件、第一电路板和背壳，所述中框开设有容置槽，所述显示模组设置于所述容置槽内，所述中框背离所述显示模组的一侧开设有安装槽，所述发声器件至少部分设置于所述安装槽内，所述第一结构件和所述背壳设置于所述中框背离所述显示模组的一侧，所述第一结构件位于所述背壳和所述中框之间，且所述第一结构件与所述背壳之间具有第一间隙，其中：
    所述第一结构件与所述中框围合形成所述发声器件的第一音腔，所述第一电路板位于所述第一音腔内；或者，
    所述第一电路板位于所述第一结构件和所述中框之间，所述第一电路板上开设有固定槽，所述发声器件部分设置于所述固定槽内，所述第一结构件与所述第一电路板围合形成所述发声器件的第一音腔。
  2. 根据权利要求1所述的电子设备，其中，所述显示模组与所述中框之间具有第二间隙，所述第二间隙形成导音通道，所述导音通道与所述安装槽相连通。
  3. 根据权利要求1所述的电子设备，其中，还包括第一密封件，在所述第一结构件与所述中框围合形成所述发声器件的第一音腔的情况下，所述第一结构件与所述中框之间通过所述第一密封件密封连接，在所述第一结构件与所述第一电路板围合形成所述发声器件的第一音腔的情况下，所述第一结构件与所述第一电路板之间通过所述第一密封件密封连接。
  4. 根据权利要求3所述的电子设备，其中，还包括第一连接件和第二密封件，所述第一结构件上开设有安装孔，所述中框上设置有连接部，所述连接部与所述安装孔对应分布，且所述第一连接件穿过所述安装孔与所述连接部相连接，所述第二密封件设置于所述安装孔背离所述连接部的一侧，且所述第二密封件封盖所述安装孔。
  5. 根据权利要求3所述的电子设备，其中，还包括第三密封件，在所述第一结构件与所述第一电路板围合形成所述发声器件的第一音腔的情况下，所述第一电路板与所述中框之间通过所述第三密封件密封连接。
  6. 根据权利要求1所述的电子设备，其中，所述第一结构件上还开设有泄漏孔，所述泄漏孔与所述第一音腔连通，所述泄漏孔内设有阻尼网。
  7. 根据权利要求3所述的电子设备，其中，所述第一结构件的边缘形成有骨位，在所述第一结构件与所述中框围合形成所述发声器件的第一音腔的情况下，所述第一密封件设置于所述骨位和所述中框之间的接触面上，在所述第一结构件与所述第一电路板围合形成所述发声器件的第一音腔的情况下，所述第一密封件设置于所述骨位和所述第一电路板之间的接触面上。
  8. 根据权利要求1所述的电子设备，其中，还包括：
    摄像头，所述摄像头设置于所述第一音腔内，所述第一结构件上还开设有摄像头通孔，所述摄像头通过所述摄像头通孔伸出所述第一结构件的表面，所述摄像头和所述第一结构件之间的接触面还设置有第三密封件。
  9. 根据权利要求3所述的电子设备，其中，还包括：
    柔性电路板，在所述第一结构件与所述中框围合形成所述发声器件的第一音腔的情况下，所述柔性电路板的部分经由所述第一密封件和所述中框之间进入所述第一音腔内与所述第一电路板电连接。
  10. 根据权利要求3所述的电子设备，其中，还包括：
    柔性电路板，在所述第一结构件与所述第一电路板围合形成所述发声器件的第一音腔的情况下，所述第一结构件上开设有缺口，所述第一电路板通过所述缺口部分显露出所述第一结构件，所述柔性电路板与所述第一电路板露出于所述缺口的部分连接。
  11. 根据权利要求5所述的电子设备，其中，所述第一密封件和所述第三密封件为泡棉。
PCT/CN2021/124980 2020-10-23 2021-10-20 电子设备 WO2022083639A1 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP21882054.6A EP4236272A4 (en) 2020-10-23 2021-10-20 ELECTRONIC DEVICE
US18/192,208 US20230239386A1 (en) 2020-10-23 2023-03-29 Electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202011146114.9A CN112261186B (zh) 2020-10-23 2020-10-23 电子设备
CN202011146114.9 2020-10-23

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US18/192,208 Continuation US20230239386A1 (en) 2020-10-23 2023-03-29 Electronic device

Publications (1)

Publication Number Publication Date
WO2022083639A1 true WO2022083639A1 (zh) 2022-04-28

Family

ID=74263569

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/124980 WO2022083639A1 (zh) 2020-10-23 2021-10-20 电子设备

Country Status (4)

Country Link
US (1) US20230239386A1 (zh)
EP (1) EP4236272A4 (zh)
CN (1) CN112261186B (zh)
WO (1) WO2022083639A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116055602A (zh) * 2022-06-24 2023-05-02 荣耀终端有限公司 一种音频设备及终端设备

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112261186B (zh) * 2020-10-23 2022-08-05 维沃移动通信有限公司 电子设备
CN112995843B (zh) * 2021-02-09 2023-07-25 维沃移动通信有限公司 电子设备
CN113115168B (zh) * 2021-03-23 2022-10-04 北京小米移动软件有限公司 音频模组和电子设备
CN113099006A (zh) * 2021-04-09 2021-07-09 维沃移动通信有限公司 电子设备
CN113471592B (zh) * 2021-05-27 2022-07-08 北京荣耀终端有限公司 一种电子设备及电池盖
CN113382099A (zh) * 2021-06-09 2021-09-10 维沃移动通信有限公司 电子设备
CN113411426B (zh) * 2021-06-25 2023-09-01 维沃移动通信有限公司 电子设备
CN113490086A (zh) * 2021-07-07 2021-10-08 维沃移动通信有限公司 电子设备
CN115225746B (zh) * 2022-09-21 2023-02-17 荣耀终端有限公司 电子设备
CN116684507B (zh) * 2022-09-29 2024-03-15 荣耀终端有限公司 电子设备
CN117041398A (zh) * 2023-08-17 2023-11-10 荣耀终端有限公司 一种电子设备
CN117492351B (zh) * 2023-12-29 2024-05-14 荣耀终端有限公司 穿戴设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111262980A (zh) * 2020-01-17 2020-06-09 青岛海信移动通信技术股份有限公司 移动终端
CN211720586U (zh) * 2020-04-21 2020-10-20 上海创功通讯技术有限公司 喇叭模组和移动终端
CN112261186A (zh) * 2020-10-23 2021-01-22 维沃移动通信有限公司 电子设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101600142B (zh) * 2008-06-06 2013-02-20 深圳富泰宏精密工业有限公司 电子装置的音箱结构
CN103957486B (zh) * 2014-04-29 2018-01-02 歌尔股份有限公司 应用在终端内部的扬声器模组
KR20170076567A (ko) * 2015-12-24 2017-07-04 주식회사 모다이노칩 이동 단말기
CN206472427U (zh) * 2016-09-28 2017-09-05 华为技术有限公司 电子设备散热结构及电子设备
CN106954104A (zh) * 2017-02-16 2017-07-14 上海与德通讯技术有限公司 喇叭固定结构及移动终端
CN206948606U (zh) * 2017-08-10 2018-01-30 广东欧珀移动通信有限公司 电子设备
CN108494906A (zh) * 2018-02-28 2018-09-04 广东欧珀移动通信有限公司 电子组件和电子设备
CN207947905U (zh) * 2018-03-23 2018-10-09 珠海市魅族科技有限公司 扬声器组件和移动终端
CN109218940B (zh) * 2018-08-29 2021-01-15 维沃移动通信有限公司 一种终端
CN109547602A (zh) * 2018-12-29 2019-03-29 重庆蓝岸通讯技术有限公司 一种手机听筒音腔结构
CN110049415B (zh) * 2019-03-19 2021-06-01 华为技术有限公司 振动发声装置和电子设备
CN110475002B (zh) * 2019-08-13 2021-03-19 Oppo广东移动通信有限公司 电子设备
CN210724969U (zh) * 2019-09-18 2020-06-09 华为技术有限公司 移动终端

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111262980A (zh) * 2020-01-17 2020-06-09 青岛海信移动通信技术股份有限公司 移动终端
CN211720586U (zh) * 2020-04-21 2020-10-20 上海创功通讯技术有限公司 喇叭模组和移动终端
CN112261186A (zh) * 2020-10-23 2021-01-22 维沃移动通信有限公司 电子设备

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4236272A4 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116055602A (zh) * 2022-06-24 2023-05-02 荣耀终端有限公司 一种音频设备及终端设备

Also Published As

Publication number Publication date
CN112261186B (zh) 2022-08-05
EP4236272A4 (en) 2024-03-20
CN112261186A (zh) 2021-01-22
US20230239386A1 (en) 2023-07-27
EP4236272A1 (en) 2023-08-30

Similar Documents

Publication Publication Date Title
WO2022083639A1 (zh) 电子设备
WO2022083643A1 (zh) 电子设备
KR20050014748A (ko) 음향재생장치 및 휴대가능한 단말장치
CN115334185A (zh) 电子设备、信号处理的方法和装置
US7088838B2 (en) Speakerphone accessory assembly
US20170366889A1 (en) Microphone housing with screen for wind noise reduction
CN217010912U (zh) 电子设备
US9769559B2 (en) Sound transducer acoustic back cavity system
WO2009144857A1 (ja) 電子機器
CN112272250A (zh) 扬声器模组及电子设备
WO2010053496A1 (en) Electronic devices including substrate mounted acoustic actuators and related methods and mobile radiotelephones
US8301188B2 (en) Electronic devices including substrate mounted acoustic actuators and related methods and mobile radiotelephones
CN215184722U (zh) 插座及电子设备
JP7318095B1 (ja) スピーカ装置及び電子機器
CN217085504U (zh) 一种带麦克风功能的投影仪
CN216437414U (zh) 电子设备
CN212278462U (zh) 音频模组和终端
CN114866912A (zh) 发声器件、发声模组及终端设备
JP5057345B2 (ja) 電子機器におけるマイクロホン装置、携帯電話機、および導音部材
WO2020063415A1 (zh) 发声组件及电子设备
CN113163041A (zh) 电子设备
CN219420810U (zh) 电子设备和壳体
CN212572847U (zh) 听筒装置和终端设备
WO2024037039A1 (zh) 一种发声装置及电子设备
CN116546400A (zh) 电子设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21882054

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

ENP Entry into the national phase

Ref document number: 2021882054

Country of ref document: EP

Effective date: 20230523