WO2022054479A1 - Feuille thermo-conductrice, et procédé de fabrication de celle-ci - Google Patents

Feuille thermo-conductrice, et procédé de fabrication de celle-ci Download PDF

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WO2022054479A1
WO2022054479A1 PCT/JP2021/029338 JP2021029338W WO2022054479A1 WO 2022054479 A1 WO2022054479 A1 WO 2022054479A1 JP 2021029338 W JP2021029338 W JP 2021029338W WO 2022054479 A1 WO2022054479 A1 WO 2022054479A1
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conductive sheet
heat conductive
anisotropic filler
filler
heat
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Japanese (ja)
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慶輔 荒巻
勇磨 佐藤
佑介 久保
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デクセリアルズ株式会社
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • This technology relates to a heat conductive sheet and a method for manufacturing a heat conductive sheet.
  • This application claims priority on the basis of Japanese Patent Application No. 2020-152686 filed on September 11, 2020 in Japan, and this application is referred to in this application. It will be used.
  • heat conductive sheet for example, a silicone resin containing (dispersed) a filler such as an inorganic filler is widely used.
  • a heat radiating member such as this heat conductive sheet is required to further improve the heat conductivity.
  • the inorganic filler examples include alumina, aluminum nitride, aluminum hydroxide and the like.
  • the matrix may be filled with scaly particles such as boron nitride and graphite, carbon fibers and the like. This is due to the anisotropy of the thermal conductivity of the scaly particles and the like.
  • carbon fiber is known to have a thermal conductivity of about 600 to 1200 W / m ⁇ K in the fiber direction.
  • boron nitride in the case of boron nitride, it may have a thermal conductivity of about 110 W / m ⁇ K in the plane direction and a thermal conductivity of about 2 W / m ⁇ K in the direction perpendicular to the plane direction.
  • the fiber direction of the carbon fibers and the plane direction of the scaly particles are made the same as the thickness direction of the sheet, which is the heat transfer direction, that is, the carbon fibers and the scaly particles are oriented in the thickness direction of the sheet. It can be expected that the thermal conductivity will be dramatically improved.
  • Patent Document 1 describes a heat conductive sheet in which carbon fibers are oriented in the thickness direction.
  • the heat conductive sheet in which the carbon fibers are oriented in the thickness direction is conductive, its use is limited in applications where insulation is required.
  • a thermally conductive filler having a high specific dielectric constant for example, conductive filler, alumina, aluminum nitride, etc. is usually used, so that the thermally conductive sheet is heated to a high temperature. If you try to make it conductive, the relative dielectric constant will also increase.
  • Patent Document 2 describes a heat conductive sheet in which a matrix resin is highly filled with aluminum nitride.
  • a matrix resin is highly filled with aluminum nitride.
  • a thermally conductive filler such as aluminum nitride or alumina as in the technique described in Patent Document 2
  • the relative permittivity increases as well as the thermal conductivity, and the specific gravity also increases. It ends up.
  • This technique has been proposed in view of such conventional circumstances, and provides a method for manufacturing a heat conductive sheet and a heat conductive sheet having a low relative permittivity, a high thermal conductivity, and a low specific gravity. ..
  • the thermally conductive sheet according to the present technology contains a polymer matrix, an anisotropic filler, and a non-isotropic filler, and the anisotropic filler is oriented in the thickness direction of the thermally conductive sheet.
  • the specific gravity of the heat conductive sheet is less than 2.7
  • the thermal conductivity of the heat conductive sheet is 7.0 W / m ⁇ K or more
  • the specific dielectric constant of the heat conductive sheet is 7.0 or less. Is.
  • the method for producing a heat conductive sheet according to the present technology is a step A of preparing a resin composition for forming a heat conductive sheet containing a polymer matrix, an anisotropic filler, and a non-isotropic filler. It also has a step B of forming a molded body block from a resin composition for forming a heat conductive sheet, and a step C of slicing the molded body block into a sheet to obtain a heat conductive sheet.
  • the anisotropic filler is oriented in the thickness direction of the heat conductive sheet, the specific gravity of the heat conductive sheet is less than 2.7, and the heat conductivity of the heat conductive sheet is 7.0 W / m. It is K or more, and the specific dielectric constant of the heat conductive sheet is 7.0 or less.
  • thermoly conductive sheet having a low relative permittivity, a high thermal conductivity, and a small specific gravity.
  • FIG. 1 is a cross-sectional view showing an example of a heat conductive sheet.
  • FIG. 2 is a perspective view schematically showing scaly boron nitride having a hexagonal crystal shape, which is an example of an anisotropic filler.
  • FIG. 3 is a cross-sectional view showing an example of a semiconductor device to which a heat conductive sheet is applied.
  • the average particle size (D50) of the anisotropic filler or the non-isometric filler is the case where the entire particle size distribution of the anisotropic filler or the non-isometric filler is 100%.
  • the cumulative curve of the particle size value is obtained from the small particle size side of the particle size distribution, it means the particle size when the cumulative value becomes 50%.
  • the particle size distribution (particle size distribution) in the present specification is obtained by the volume standard.
  • a method for measuring the particle size distribution for example, a method using a laser diffraction type particle size distribution measuring machine can be mentioned.
  • FIG. 1 is a cross-sectional view showing an example of a heat conductive sheet 1 according to the present technology.
  • the heat conductive sheet 1 contains a polymer matrix 2, an anisotropic filler 3, and a non-anisotropic filler 4.
  • the anisotropic filler 3 and the non-anisotropic filler 4 are dispersed in the polymer matrix 2, and the anisotropic filler 3 is in the thickness direction B of the thermally conductive sheet 1. It is oriented.
  • the thermal conductive sheet 1 has a low relative permittivity, a high thermal conductivity, and a small specific gravity.
  • the fact that the anisotropic filler 3 is oriented in the thickness direction B of the heat conductive sheet 1 means that the thickness of the heat conductive sheet 1 among all the anisotropic fillers 3 in the heat conductive sheet 1 It means that the ratio of the anisotropic filler 3 whose major axis is oriented in the direction B is 50% or more.
  • the heat conductive sheet 1 has a relative permittivity of 7.0 or less.
  • the relative permittivity of the heat conductive sheet 1 is preferably as low as possible from the viewpoint of enhancing the insulating property.
  • the relative permittivity in the thickness direction B may be 7.0 or less, 6.5 or less, or 6. It may be 0 or less, 5.5 or less, 5.4 or less, or 5.2 or less.
  • the relative permittivity of the heat conductive sheet 1 can be measured by the method described in Examples described later.
  • the thermal conductivity sheet 1 has a thermal conductivity of 7.0 W / m ⁇ K or more.
  • the thermal conductivity in the thickness direction B is 7.0 W / m ⁇ K or more and 7.1 W / m ⁇ K or more. It may be 8.0 W / m ⁇ K or more, 8.9 W / m ⁇ K or more, 10.0 W / m ⁇ K or more, and 11. It may be 0 W / m ⁇ K or more.
  • the thermal conductivity of the thermal conductivity sheet 1 can be measured by the method described in Examples described later.
  • the heat conductive sheet 1 has a specific gravity of less than 2.7.
  • the specific gravity of the heat conductive sheet 1 is preferably as small as possible from the viewpoint of weight reduction of electronic components, and may be 2.6 or less, 2.5 or less, or 2.4 or less. It may be 2.3 or less.
  • the specific gravity of the heat conductive sheet 1 can be measured by the method described in Examples described later.
  • the thermal conductivity sheet 1 has a low relative permittivity, a high thermal conductivity, and a low specific gravity, new applications can be expected in the field of shields and antennas, for example.
  • the thermally conductive sheet 1 is suitable for equipment that requires high frequency characteristics such as high-speed wireless communication equipment and applications that require insulation.
  • the thickness of the heat conductive sheet 1 is not particularly limited and can be appropriately selected according to the purpose.
  • the thickness of the heat conductive sheet can be 0.05 mm or more, or 0.1 mm or more.
  • the upper limit of the thickness of the heat conductive sheet can be 5 mm or less, may be 4 mm or less, or may be 3 mm or less.
  • the thickness of the heat conductive sheet 1 is preferably 0.1 to 4 mm.
  • the thickness of the heat conductive sheet 1 can be obtained from, for example, the thickness B of the heat conductive sheet 1 measured at any five points and the arithmetic mean value thereof.
  • the polymer matrix 2 is a binder resin for holding the anisotropic filler 3 and the non-anisotropic filler 4 in the heat conductive sheet 1.
  • the polymer matrix 2 is selected according to the characteristics such as mechanical strength, heat resistance, and electrical properties required for the thermally conductive sheet 1.
  • the polymer matrix 2 can be selected from a thermoplastic resin, a thermoplastic elastomer, and a thermosetting resin.
  • thermoplastic resin examples include ethylene- ⁇ -olefin copolymers such as polyethylene, polypropylene, and ethylene-propylene copolymers, polymethylpentene, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, and ethylene-vinyl acetate copolymers.
  • Fluoropolymers such as polyvinyl alcohol, polyvinyl acetal, polyvinylidene fluoride and polytetrafluoroethylene, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polystyrene, polyacrylonitrile, styrene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene
  • Polymethacryl such as polymer (ABS) resin, polyphenylene-ether copolymer (PPE) resin, modified PPE resin, aliphatic polyamides, aromatic polyamides, polyimide, polyamideimide, polymethacrylic acid, polymethacrylic acid methyl ester, etc.
  • Examples thereof include acid esters, polyacrylic acids, polycarbonates, polyphenylene sulfides, polysulfones, polyether sulfones, polyether nitriles, polyether ketones, polyketones, liquid crystal polymers, silicone resins, ionomers and the like.
  • thermoplastic elastomer examples include a styrene-butadiene block copolymer or a hydrogenated product thereof, a styrene-isoprene block copolymer or a hydrogenated product thereof, a styrene-based thermoplastic elastomer, an olefin-based thermoplastic elastomer, and a vinyl chloride-based thermoplastic elastomer.
  • thermosetting resin examples include crosslinked rubber, epoxy resin, phenol resin, polyimide resin, unsaturated polyester resin, diallyl phthalate resin and the like.
  • crosslinked rubber examples include natural rubber, acrylic rubber, butadiene rubber, isoprene rubber, styrene-butadiene copolymer rubber, nitrile rubber, hydrogenated nitrile rubber, chloroprene rubber, ethylene-propylene copolymer rubber, and chlorinated polyethylene rubber. Examples thereof include chlorosulfonated polyethylene rubber, butyl rubber, halogenated butyl rubber, fluororubber, urethane rubber, and silicone rubber.
  • a silicone resin is preferable in consideration of the adhesion between the heat generating surface and the heat sink surface of the electronic component.
  • the silicone resin is, for example, a two-component addition reaction type silicone resin containing a silicone having an alkenyl group as a main component, a main agent containing a curing catalyst, and a curing agent having a hydrosilyl group (Si—H group).
  • a silicone having an alkenyl group for example, a polyorganosiloxane having a vinyl group can be used.
  • the curing catalyst is a catalyst for accelerating the addition reaction between the alkenyl group in the silicone having an alkenyl group and the hydrosilyl group in the curing agent having a hydrosilyl group.
  • the curing catalyst include well-known catalysts as catalysts used in the hydrosilylation reaction, and for example, platinum group curing catalysts such as platinum group metal alone such as platinum, rhodium and palladium, platinum chloride and the like can be used.
  • platinum group curing catalysts such as platinum group metal alone such as platinum, rhodium and palladium, platinum chloride and the like can be used.
  • the curing agent having a hydrosilyl group for example, a polyorganosiloxane having a hydrosilyl group can be used.
  • the polymer matrix 2 may be used alone or in combination of two or more.
  • the content of the polymer matrix 2 in the heat conductive sheet 1 is not particularly limited and can be appropriately selected depending on the purpose.
  • the content of the polymer matrix 2 in the heat conductive sheet 1 can be more than 25% by volume, may be 30% by volume or more, may be 32% by volume or more, and may be 36% by volume. It may be% or more.
  • the upper limit of the content of the polymer matrix 2 in the heat conductive sheet 1 can be 70% by volume or less, 60% by volume or less, or 50% by volume or less. , 40% by volume or less.
  • the content of the polymer matrix 2 in the heat conductive sheet 1 is preferably 25 to 60% by volume, preferably 26 to 40% by volume, from the viewpoint of the specific dielectric constant, the heat conductivity, and the specific gravity of the heat conductive sheet 1. % Is more preferred, and 32 to 36% by volume is even more preferred.
  • the anisotropic filler 3 is a thermally conductive filler having anisotropy in shape.
  • the anisotropic filler 3 include a thermally conductive filler having a major axis, a minor axis, and a thickness, for example, a scaly thermally conductive filler.
  • the scaly heat conductive filler is a heat conductive filler having a major axis, a minor axis, and a thickness, has a high aspect ratio (major axis / thickness), and is isotropic in the plane direction including the major axis. It has a high thermal conductivity.
  • the minor axis of the scaly heat conductive filler is a direction intersecting the long axis of the scaly heat conductive filler on the surface including the long axis of the scaly heat conductive filler, and the scaly heat.
  • the thickness means a value obtained by measuring and averaging the thicknesses of the surfaces including the major axis of the scaly heat conductive filler at 10 points.
  • the aspect ratio of the anisotropic filler 3 is not particularly limited and can be appropriately selected depending on the intended purpose. For example, the aspect ratio of the anisotropic filler 3 can be in the range of 10 to 100.
  • the major axis, minor axis and thickness of the anisotropic filler 3 can be measured by, for example, a microscope, a scanning electron microscope (SEM), a particle size distribution meter, or the like.
  • the material of the anisotropic filler 3 is not particularly limited, and examples thereof include boron nitride (BN), mica, alumina, aluminum nitride, silicon carbide, silica, zinc oxide, molybdenum disulfide, and the like. Boron nitride is preferable from the viewpoint of thermal conductivity and specific gravity. Further, from the viewpoint of insulating property, it is preferable that the anisotropic filler 3 does not substantially contain carbon fiber, which is a conductive material.
  • the anisotropic filler 3 may be used alone or in combination of two or more.
  • FIG. 2 is a perspective view schematically showing a scaly boron nitride 3A having a hexagonal crystal shape, which is an example of the anisotropic filler 3.
  • a represents the major axis of the scaly boron nitride 3A
  • b represents the thickness of the scaly boron nitride 3A
  • c represents the minor axis of the scaly boron nitride 3A.
  • the anisotropic filler 3 it is preferable to use scaly boron nitride 3A having a hexagonal crystal shape as shown in FIG. 2 from the viewpoint of relative permittivity, thermal conductivity, and specific gravity.
  • a scaly heat conductive filler for example, scaly boron nitride 3A
  • a spherical heat conductive filler for example, spherical boron nitride
  • a thermally conductive sheet 1 having both excellent thermal properties (high thermal conductivity), dielectric properties (low dielectric constant), and weight reduction (low specific gravity) can be obtained at low cost.
  • the average particle size (D50) of the anisotropic filler 3 is not particularly limited and can be appropriately selected depending on the intended purpose.
  • the lower limit of the average particle size of the anisotropic filler 3 can be 10 ⁇ m or more, may be 20 ⁇ m or more, may be 30 ⁇ m or more, or may be 35 ⁇ m or more.
  • the upper limit of the average particle size of the anisotropic filler 3 can be 150 ⁇ m or less, 100 ⁇ m or less, 90 ⁇ m or less, 80 ⁇ m or less, or 70 ⁇ m. It may be less than or equal to, 50 ⁇ m or less, and 45 ⁇ m or less.
  • the average particle size of the anisotropic filler 3 is preferably 20 to 100 ⁇ m.
  • the aspect ratio of the first heat conductive filler 3 is not particularly limited and can be appropriately selected depending on the intended purpose.
  • the aspect ratio of the scaly heat conductive filler can be in the range of 10 to 100.
  • the average value of the ratio (major axis / minor axis) between the major axis and the minor axis of the first thermally conductive filler 3 can be, for example, in the range of 0.5 to 10, and can be in the range of 1 to 5. It can also be in the range of 1 to 3.
  • the content of the anisotropic filler 3 in the heat conductive sheet 1 is not particularly limited and can be appropriately selected depending on the intended purpose.
  • the content of the anisotropic filler 3 in the heat conductive sheet 1 can be 15% by volume or more, 20% by volume or more, or 23% by volume or more. It may be 27% by volume or more.
  • the upper limit of the content of the anisotropic filler 3 in the heat conductive sheet 1 can be, for example, 45% by volume or less, 40% by volume or less, or 35% by volume or less. It may be present, and may be 30% by volume or less.
  • the content of the anisotropic filler 3 in the heat conductive sheet 1 is preferably 20 to 35% by volume, preferably 20 to 35% by volume. It can be 30% by volume or 23 to 27% by volume.
  • the non-anisotropic filler 4 is a thermally conductive filler other than the anisotropic filler 3 described above, and is a thermally conductive filler having no anisotropy in shape.
  • the non-anisotropic filler 4 contains a thermally conductive filler such as spherical, powdery, and granular.
  • the material of the non-anisotropic filler 4 is preferably one that can secure the insulating property of the heat conductive sheet 1, for example, a ceramic filler, and specific examples thereof are aluminum oxide (alumina, sapphire), aluminum nitride, and water. Examples thereof include aluminum oxide, zinc oxide, boron nitride, zirconia, and silicon carbide.
  • the non-anisotropic filler 4 may be used alone or in combination of two or more.
  • non-anisotropic filler 4 it is preferable to use aluminum nitride and spherical alumina in combination from the viewpoint of thermal conductivity and specific gravity of the thermally conductive sheet 1, and aluminum nitride particles, alumina particles, and zinc oxide are preferably used in combination. It is also preferable to use the particles and the aluminum hydroxide particles in combination.
  • the average particle size (D50) of the aluminum nitride particles is preferably less than 30 ⁇ m, preferably 0.1 to 10 ⁇ m, or 0.5 to 5 ⁇ m from the viewpoint of the specific gravity of the thermally conductive sheet 1. Is preferable, and it may be 1 to 3 ⁇ m or 1 to 2 ⁇ m. Further, the average particle size (D50) of the alumina particles is preferably 0.1 to 10 ⁇ m, may be 0.1 to 8 ⁇ m, and may be 0.1 to 0.1 to 0, from the viewpoint of the specific gravity of the heat conductive sheet 1. It may be 7 ⁇ m or 0.1 to 2 ⁇ m.
  • the average particle size (D50) of the zinc oxide particles is preferably 1 to 5 ⁇ m, preferably 0.5 to 3 ⁇ m, or 0.5 to 2 ⁇ m from the viewpoint of the specific gravity of the heat conductive sheet 1. You may.
  • the average particle size (D50) of the aluminum hydroxide particles is preferably 1 to 10 ⁇ m from the viewpoint of the specific gravity of the heat conductive sheet 1, and may be 2 to 9 ⁇ m or 6 to 8 ⁇ m. ..
  • the content of the non-anisotropic filler 4 in the heat conductive sheet 1 is not particularly limited and can be appropriately selected depending on the intended purpose.
  • the content of the non-isotropic filler 4 in the heat conductive sheet 1 can be 10% by volume or more, may be 15% by volume or more, may be 20% by volume or more, and 25. It may be 50% by volume or more, 30% by volume or more, or 35% by volume or more.
  • the upper limit of the content of the non-anisotropic filler 4 in the heat conductive sheet 1 can be 50% by volume or less, 45% by volume or less, and 40% by volume or less. You may.
  • the content of the alumina particles in the heat conductive sheet 1 is preferably 10 to 25% by volume, and the aluminum nitride particles have a content of 10 to 25% by volume. The content is preferably 10 to 25% by volume. Further, when aluminum nitride particles, alumina particles, zinc oxide particles, and aluminum hydroxide particles are used in combination as the non-anisotropic filler 4, the content of the alumina particles in the heat conductive sheet 1 is 10 to 10 or more.
  • the content is preferably 25% by volume
  • the content of the aluminum nitride particles is preferably 10 to 25% by volume
  • the content of the zinc oxide particles is preferably 0.1 to 3% by volume
  • aluminum hydroxide is preferably 0.1 to 3% by volume.
  • the heat conductive sheet 1 may further contain components other than the above-mentioned components as long as the effects of the present technology are not impaired.
  • other components include coupling agents, dispersants, curing accelerators, retarders, tackifiers, plasticizers, flame retardants, antioxidants, stabilizers, colorants and the like.
  • the heat conductive sheet 1 is a coupling agent from the viewpoint of further improving the dispersibility of the anisotropic filler 3 and the non-anisotropic filler 4 and further improving the flexibility of the heat conductive sheet 1. 3 and / or the non-anisotropic filler 4 treated with the coupling agent may be used.
  • the heat conductive sheet 1 in which the anisotropic filler 3 and the non-anisotropic filler 4 are dispersed in the polymer matrix 2 has a specific gravity of less than 2.7 and a thermal conductivity. It is 7.0 W / m ⁇ K or more and the relative permittivity is 7.0 or less. That is, the thermal conductivity sheet 1 has a low relative permittivity, a high thermal conductivity, and a small specific gravity.
  • the method for manufacturing a heat conductive sheet according to the present technology includes the following steps A, B, and C.
  • step A the anisotropic filler 3 and the non-anisotropic filler 4 are dispersed in the polymer matrix 2 to prepare a composition for forming a thermally conductive sheet.
  • a composition for forming a thermally conductive sheet in addition to the anisotropic filler 3, the non-anisotropic filler 4, and the polymer matrix 2, various additives and volatile solvents are known as needed. It can be prepared by uniformly mixing according to the above method.
  • a molded body block is formed from the prepared resin composition for forming a heat conductive sheet.
  • the method for forming the molded body block include an extrusion molding method and a mold molding method.
  • the extrusion molding method and the mold molding method are not particularly limited, and the viscosity of the resin composition for forming the heat conductive sheet and the heat conductive sheet are required from among various known extrusion molding methods and mold molding methods. It can be appropriately adopted depending on the characteristics to be applied.
  • the extrusion molding method when the resin composition for forming a heat conductive sheet is extruded from a die, or in the mold molding method, when the resin composition for forming a heat conductive sheet is press-fitted into a mold, a polymer is used.
  • the matrix 2 flows, and the anisotropic filler 3 is oriented along the flow direction.
  • the size and shape of the molded body block can be determined according to the required size of the heat conductive sheet 1. For example, a rectangular parallelepiped having a vertical size of 0.5 to 15 cm and a horizontal size of 0.5 to 15 cm can be mentioned. The length of the rectangular parallelepiped may be determined as needed.
  • step C the molded block is sliced into a sheet to obtain a heat conductive sheet 1.
  • the anisotropic filler 3 is substantially oriented in the thickness direction B.
  • the anisotropic filler 3 is exposed on the surface (sliced surface) of the sheet obtained by slicing. Since the surface of the thermally conductive sheet 1 obtained by slicing is smoothed, the adhesion to other members can be improved, and the thermal conductivity and the specific non-dielectric constant can be improved. can.
  • the method for slicing the molded body block is not particularly limited, and can be appropriately selected from known slicing devices depending on the size and mechanical strength of the molded body block.
  • the slice direction of the molded body block may be 60 to 120 degrees with respect to the extrusion direction because the anisotropic filler 3 may be oriented in the extrusion direction.
  • the direction is more preferably 70 to 100 degrees, and the direction is more preferably 90 degrees (vertical).
  • the polymer matrix 2, the anisotropic filler 3, and the non-isotropic filler 4 are contained.
  • the anisotropic filler 3 is oriented in the thickness direction B of the heat conductive sheet 1, the specific gravity is less than 2.7, and the thermal conductivity is 7.0 W / m.
  • -A thermally conductive sheet 1 having K or more and a specific dielectric constant of 7.0 or less can be obtained.
  • the method for manufacturing the thermally conductive sheet 1 according to the present technology is not limited to the above-mentioned example.
  • a step of pressing the surface sliced in step C may be further included.
  • the step of pressing the heat conductive sheet 1 By further including the step of pressing the heat conductive sheet 1, the surface of the sheet obtained in step C can be further smoothed, and the adhesion to other members can be further improved.
  • a pressing method a pair of pressing devices including a flat plate and a pressing head having a flat surface can be used. Alternatively, it may be pressed with a pinch roll.
  • the pressure at the time of pressing can be, for example, 0.1 to 100 MPa, or 0.1 to 1 MPa.
  • the pressing is performed at the glass transition temperature (Tg) or higher of the polymer matrix 2.
  • Tg glass transition temperature
  • the press temperature can be 0 to 180 ° C., may be in the temperature range of room temperature (for example, 25 ° C.) to 100 ° C., or may be 30 to 100 ° C.
  • the heat conductive sheet 1 is, for example, arranged between a heating element and a heat radiating element, so that heat generated by the heating element is dissipated to the heat radiating element, and electrons having a structure arranged between them are arranged. It can be a device (thermal device).
  • the electronic device has at least a heating element, a heat radiating element, and a heat conductive sheet 1, and may further have other members, if necessary.
  • the heating element is not particularly limited, and for example, a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), a DRAM (Dynamic Random Access Memory), an integrated circuit element such as a flash memory, a transistor, a resistor, or an electric circuit. Examples include electronic components that generate heat in. Further, the heating element also includes a component that receives an optical signal such as an optical transceiver in a communication device.
  • the radiator is not particularly limited, and examples thereof include those used in combination with integrated circuit elements, transistors, optical transceiver housings, etc. such as heat sinks and heat spreaders.
  • the radiator may be any one that conducts heat generated from a heat source and dissipates it to the outside. Examples include heat pipes, metal covers, and housings.
  • FIG. 3 is a cross-sectional view showing an example of a semiconductor device 50 to which the heat conductive sheet 1 according to the present technology is applied.
  • the heat conductive sheet 1 is mounted on a semiconductor device 50 built in various electronic devices and is sandwiched between a heating element and a heat radiating element.
  • the semiconductor device 50 shown in FIG. 3 includes an electronic component 51, a heat spreader 52, and a heat conductive sheet 1, and the heat conductive sheet 1 is sandwiched between the heat spreader 52 and the electronic component 51.
  • the heat conductive sheet 1 is sandwiched between the heat spreader 52 and the heat sink 53 to form a heat radiating member that dissipates heat from the electronic component 51 together with the heat spreader 52.
  • the mounting location of the heat conductive sheet 1 is not limited to between the heat spreader 52 and the electronic component 51 and between the heat spreader 52 and the heat sink 53, and can be appropriately selected depending on the configuration of the electronic device or the semiconductor device.
  • Example 1 In Example 1, 32% by volume of silicone resin, 27% by volume of scaly boron nitride (D50 is 40 ⁇ m) having a hexagonal crystal shape, 19% by volume of aluminum nitride (1.5 ⁇ m of D50), and alumina.
  • a resin composition for forming a heat conductive sheet was prepared by uniformly mixing 20% by volume of particles (D50 is 1 ⁇ m) and 1% by volume of a coupling agent. By the extrusion molding method, the resin composition for forming a heat conductive sheet is poured into a mold (opening: 50 mm ⁇ 50 mm) having a rectangular parallelepiped internal space, and heated in an oven at 60 ° C.
  • a molded product For 4 hours to form a molded product. Formed a block. A peeled polyethylene terephthalate film was attached to the inner surface of the mold so that the peeled surface was on the inside. By slicing the molded body block into a sheet shape with a slicer in a direction orthogonal to the length direction of the obtained molded body block, a 2 mm-thick, anisotropic filler, scaly boron nitride, conducts heat. A heat conductive sheet oriented in the thickness direction of the sex sheet was obtained.
  • Example 2 After obtaining the same heat conductive sheet as in Example 1, the sliced surface was sandwiched between peeled polyethylene terephthalate films and pressed by a press machine. The pressing conditions were a pressure of 0.5 MPa and 80 ° C. for 3 minutes.
  • Example 3 In Example 3, 36% by volume of silicone resin, 23% by volume of scaly boron nitride (D50 is 40 ⁇ m) and 20% by volume of aluminum nitride (D50 is 1.5 ⁇ m) having a hexagonal crystal shape, and alumina. The same method as in Example 1 except that a resin composition for forming a heat conductive sheet was prepared by uniformly mixing 20% by volume of particles (D50 is 1 ⁇ m) and 1% by volume of a coupling agent. Then, a thermally conductive sheet in which scaly boron nitride, which is an anisotropic filler, was oriented in the thickness direction of the sheet was obtained.
  • Example 4 In Example 4, 36% by volume of silicone resin, 23% by volume of scaly boron nitride (D50 is 40 ⁇ m) and 20% by volume of aluminum nitride (D50 is 1.5 ⁇ m) having a hexagonal crystal shape, and alumina. By uniformly mixing 18% by volume of particles (1 ⁇ m of D50), 1% by volume of zinc oxide (1 ⁇ m of D50), 1% by volume of aluminum hydroxide (1 ⁇ m of D50), and 1% by volume of a coupling agent.
  • the scaly boron nitride which is an anisotropic filler, is oriented in the thickness direction of the sheet, except that the resin composition for forming the heat conductive sheet is prepared. I got a sheet.
  • Comparative Example 1 In Comparative Example 1, 25% by volume of a silicone resin, 29% by volume of aluminum nitride (1.5 ⁇ m for D50), 45% by volume of alumina particles (1 ⁇ m for D50), and 1% by volume of a coupling agent are uniformly mixed. As a result, a resin composition for forming a heat conductive sheet was prepared. The prepared resin composition for forming a heat conductive sheet was applied on a peeled polyethylene terephthalate film and heated in an oven at 60 ° C. for 4 hours to form a heat conductive sheet having a thickness of 2 mm. ..
  • Comparative Example 2 In Comparative Example 2, 19% by volume of the silicone resin, 16% by volume of aluminum nitride (1.5 ⁇ m for D50), 35% by volume of aluminum nitride (80 ⁇ m for D50), and 29% by volume of aluminum nitride (30 ⁇ m for D50).
  • a resin composition for forming a heat conductive sheet was prepared by uniformly mixing 1% by volume of the coupling agent. The prepared resin composition for forming a heat conductive sheet was applied on a peeled polyethylene terephthalate film and heated in an oven at 80 ° C. for 4 hours to form a heat conductive sheet having a thickness of 2 mm. ..
  • the thermally conductive sheet obtained in Examples 1 to 4 contains a polymer matrix, an anisotropic filler, and a non-anisotropic filler, and the anisotropic filler is the thermally conductive sheet. It was found that the anisotropy was oriented in the thickness direction, the specific gravity was less than 2.7, the thermal conductivity was 7.0 W / m ⁇ K or more, and the specific dielectric constant was 7.0 or less.
  • the thermal conductivity sheet obtained in Comparative Example 1 does not satisfy the specific gravity of less than 2.7, the thermal conductivity of 7.0 W / m ⁇ K or more, and the relative permittivity of 7.0 or less. It turned out. Further, it was found that the heat conductive sheet obtained in Comparative Example 2 did not satisfy the specific gravity of less than 2.7 and the relative permittivity of 7.0 or less. Since the heat conductive sheets obtained in Comparative Examples 1 and 2 did not contain the anisotropic filler, it is considered that the cause is that the anisotropic filler is not oriented in the thickness direction of the heat conductive sheet.

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  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
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Abstract

L'invention fournit une feuille thermo-conductrice qui présente une constante diélectrique relative basse, une conductivité thermique élevée et un faible poids spécifique. La feuille thermo-conductrice (1) de l'invention comprend une matrice polymère (2), un matériau de charge anisotrope (3) et un agent de charge non anisotrope (4). Le matériau de charge anisotrope (3) est orienté dans une direction épaisseur (B) de la feuille thermo-conductrice (1). Le poids spécifique de la feuille thermo-conductrice (1) est inférieur à ２,７, sa conductivité thermique est supérieure ou égale à ７,０Ｗ／ｍ・Ｋ, et sa constante diélectrique relative est inférieure ou égale à ７,０.
PCT/JP2021/029338 2020-09-11 2021-08-06 Feuille thermo-conductrice, et procédé de fabrication de celle-ci WO2022054479A1 (fr)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011012193A (ja) * 2009-07-03 2011-01-20 Denki Kagaku Kogyo Kk 樹脂組成物及びその用途
JP2012119674A (ja) * 2010-11-11 2012-06-21 Kitagawa Ind Co Ltd 熱伝導シート
JP2014040341A (ja) * 2012-08-22 2014-03-06 Denki Kagaku Kogyo Kk 窒化ホウ素粉末及びその用途
JP2018073912A (ja) * 2016-10-26 2018-05-10 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法及び半導体装置
WO2019031458A1 (fr) * 2017-08-10 2019-02-14 デンカ株式会社 Élément de dissipation de chaleur thermoconducteur à faible constante diélectrique
JP2020004955A (ja) * 2018-05-02 2020-01-09 デクセリアルズ株式会社 熱伝導体、及びこれを用いた電子機器
JP2020013872A (ja) * 2018-07-18 2020-01-23 デクセリアルズ株式会社 熱伝導性シートの製造方法
WO2020105601A1 (fr) * 2018-11-20 2020-05-28 積水ポリマテック株式会社 Feuille thermoconductrice et procédé de fabrication d'une telle feuille thermoconductrice

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011012193A (ja) * 2009-07-03 2011-01-20 Denki Kagaku Kogyo Kk 樹脂組成物及びその用途
JP2012119674A (ja) * 2010-11-11 2012-06-21 Kitagawa Ind Co Ltd 熱伝導シート
JP2014040341A (ja) * 2012-08-22 2014-03-06 Denki Kagaku Kogyo Kk 窒化ホウ素粉末及びその用途
JP2018073912A (ja) * 2016-10-26 2018-05-10 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法及び半導体装置
WO2019031458A1 (fr) * 2017-08-10 2019-02-14 デンカ株式会社 Élément de dissipation de chaleur thermoconducteur à faible constante diélectrique
JP2020004955A (ja) * 2018-05-02 2020-01-09 デクセリアルズ株式会社 熱伝導体、及びこれを用いた電子機器
JP2020013872A (ja) * 2018-07-18 2020-01-23 デクセリアルズ株式会社 熱伝導性シートの製造方法
WO2020105601A1 (fr) * 2018-11-20 2020-05-28 積水ポリマテック株式会社 Feuille thermoconductrice et procédé de fabrication d'une telle feuille thermoconductrice

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