WO2022033361A1 - 一种电子设备和扩展组件 - Google Patents

一种电子设备和扩展组件 Download PDF

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Publication number
WO2022033361A1
WO2022033361A1 PCT/CN2021/110380 CN2021110380W WO2022033361A1 WO 2022033361 A1 WO2022033361 A1 WO 2022033361A1 CN 2021110380 W CN2021110380 W CN 2021110380W WO 2022033361 A1 WO2022033361 A1 WO 2022033361A1
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WO
WIPO (PCT)
Prior art keywords
shell
casing
air duct
assembly
electronic device
Prior art date
Application number
PCT/CN2021/110380
Other languages
English (en)
French (fr)
Inventor
万军平
杜阳
熊健
吕丹华
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP21855414.5A priority Critical patent/EP4192210A4/en
Publication of WO2022033361A1 publication Critical patent/WO2022033361A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/08—Waterproof bodies or housings
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B13/00—Burglar, theft or intruder alarms
    • G08B13/18—Actuation by interference with heat, light, or radiation of shorter wavelength; Actuation by intruding sources of heat, light, or radiation of shorter wavelength
    • G08B13/189—Actuation by interference with heat, light, or radiation of shorter wavelength; Actuation by intruding sources of heat, light, or radiation of shorter wavelength using passive radiation detection systems
    • G08B13/194—Actuation by interference with heat, light, or radiation of shorter wavelength; Actuation by intruding sources of heat, light, or radiation of shorter wavelength using passive radiation detection systems using image scanning and comparing systems
    • G08B13/196—Actuation by interference with heat, light, or radiation of shorter wavelength; Actuation by intruding sources of heat, light, or radiation of shorter wavelength using passive radiation detection systems using image scanning and comparing systems using television cameras
    • G08B13/19617—Surveillance camera constructional details
    • G08B13/19619—Details of casing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements

Definitions

  • the present application relates to the technical field of electronic devices, and in particular, to an electronic device and an extension assembly.
  • Cameras are widely used in people's daily life. For example, cameras can be used in environments such as roads, parks, and indoors to realize functions such as image acquisition. With the development of science and technology and the continuous improvement of people's needs, users hope that the camera can have more abundant functions. For example, some users hope that the camera can have wireless communication functions; some users hope that the camera can have functions such as face recognition and license plate recognition.
  • the required functional circuits (such as communication circuits, processors, etc.) can be added to the camera.
  • the required functional circuits can be added to the camera.
  • the required functional circuit needs to be installed in the camera before leaving the factory, and the required functional circuit cannot be performed after leaving the factory or at the application site. retrofit, thus resulting in incompetence or excess redundancy of the camera.
  • the present application provides an electronic device and an expansion component that can facilitate flexible expansion.
  • the application provides an electronic device, including a main device assembly and an extension assembly;
  • the main device assembly includes a main circuit;
  • the extension assembly includes one or more functional circuits and a housing; at least one of the one or more functional circuits is connected to the main circuit Electrical connection;
  • the shell includes an inner shell and an outer shell; the inner circumference of the inner shell forms a cooling air duct;
  • the outer shell is arranged on the outer circumference of the inner shell, and the inner shell and the outer shell enclose a accommodating space;
  • the functional circuit is arranged in the accommodating space and is connected with the inner shell thermal contact to dissipate heat from the functional circuit through airflow in the cooling air duct.
  • the extension assembly is a hollow chimney-like structure as a whole, and when the outside air flows through the heat dissipation air duct of the inner shell, the heat of the inner shell will be taken away.
  • the functional circuit specifically, the heat-generating components such as the processor in the functional circuit
  • thermal contact refers to the contact that can transfer heat, such as direct contact or contact through thermal conductive glue, thermal pad, etc.
  • the heat generated by the functional circuit can be effectively conducted to the inner casing, so that the heat dissipation of the functional circuit can be facilitated.
  • the required functional circuits can be installed in the expansion components before leaving the factory, or the required functional circuits can be installed in the expansion components at the engineering site, so that it has greater flexibility and will not Causes undesirable problems such as functional insufficiency or functional redundancy.
  • the functional component when installed, it is not necessary to disassemble and assemble the main equipment component, so that the air tightness of the main equipment component itself will not be affected.
  • the expansion module is installed on the main equipment component (such as a camera), the expansion component will not affect the heat dissipation performance of the main equipment component itself.
  • the extension assembly is independent of the structure of the main equipment assembly, when the main equipment assembly has different functional requirements, it is only necessary to install corresponding functional circuits in the extension assembly.
  • the extension assembly and the main device assembly adopt a split-cavity structure, so that the extension assembly can be installed at a position away from the main device assembly, thereby reducing the influence of the extension assembly on the heat dissipation of the main device assembly.
  • the types and numbers of functional circuits that can be included in the expansion component can be diverse.
  • the functional circuit may be: radar, WiFi module, 4G communication module, 5G communication module, Bluetooth module and other communication circuits. It can also be: graphics processor, Ai processing chip, memory and other devices.
  • the required functional circuits can be installed in the expansion components before leaving the factory, or the required functional circuits can be installed in the expansion components at the engineering site, so that it has greater flexibility and will not Causes undesirable problems such as functional insufficiency or functional redundancy.
  • the functional components when installed, it is not necessary to disassemble and assemble the main equipment components (such as cameras), so that the air tightness of the main equipment components themselves will not be affected.
  • the housing may be an integral structural member, or may be formed by splicing multiple components.
  • the housing may include an inner shell and an outer shell.
  • the inner shell can be configured as a tubular structure
  • the outer shell can also be configured as a tubular structure, which can be a circular tubular structure, or any other regular or irregular tubular structure.
  • the outer shell is sleeved on the outer circumference of the inner shell, and a gap is maintained between the outer shell and the inner shell for forming the accommodating space.
  • the casing further includes an upper cover and a bottom casing. Wherein, the upper cover and the bottom case are both configured as annular plate-like structures.
  • the inner edge of the bottom case is hermetically connected with the first end of the inner case, and the outer edge of the bottom case is hermetically connected with the first end of the outer case.
  • the inner edge of the upper cover is tightly connected with the second end of the inner shell, and the outer edge of the upper cover is tightly connected with the second end of the outer shell.
  • the cross section of the heat dissipation channel can be a circle, ellipse, square or other polygonal structures, or it is understood that the cross section of the inner contour of the inner shell can be a circle, ellipse, square or other polygonal structures structure; in addition, the shape of the inner contour and the outer contour of the inner shell can be the same or different.
  • the cross-sections of the inner contour and the outer contour of the inner shell may both be circular, or the section of the inner contour of the inner shell may be circular, and the section of the outer contour of the inner shell may be square.
  • the cross-section of the inner contour of the casing can be a circle, an ellipse, a square or other polygonal structures; in addition, the shapes of the inner contour and the outer contour of the casing can be the same or different.
  • the cross-sections of the inner contour and the outer contour of the housing may both be circular, or the cross-section of the inner contour of the housing may be circular, and the cross-section of the outer contour of the housing may be square.
  • a sealing ring or a sealant may be applied to the part where the upper cover is connected with the inner shell and the outer shell.
  • a sealing ring or a sealant may also be applied to the part where the bottom case is connected with the inner case and the outer case.
  • the connection modes between the upper cover, the inner shell, and the outer shell can also be various.
  • the connection modes between the bottom shell, the inner shell and the outer shell can also be various.
  • the inner shell and the upper cover may be connected by means of screw connection. Specifically, an inner thread can be provided on the inner edge of the upper cover, and an outer thread can be arranged at the second end of the inner shell. fixed connection between.
  • a sealing ring or a sealant may also be applied to the screwed portion.
  • the inner shell, the outer shell, the upper cover and the bottom shell may be mutually independent structural members, or may be partially integrated structural members.
  • the inner case and the bottom case may be a unitary structure; the outer case and the upper cover may be a unitary structure.
  • the functional circuit in the expansion assembly may need to be electrically connected to the main circuit in the main device assembly through a cable to meet the power supply requirements of the expansion assembly itself or the signal transmission requirements between the expansion assembly and the main device assembly. Therefore, in the housing A wiring hole that communicates with the accommodating space can be provided on the top. In a specific implementation, the wiring hole may be provided on the bottom case, or may be provided on the inner case or the outer case.
  • the inner shell may be made of metal materials with good thermal conductivity such as aluminum and aluminum alloys.
  • the heating element (such as the processor, etc.) of the functional circuit can be in thermal contact with the outer wall of the inner casing, so that the heat generated by the heating element can be efficiently transferred to the inner casing.
  • the housing may also be made of a metal material with good thermal conductivity, such as aluminum or aluminum alloy.
  • the heating element of the functional circuit can also be in thermal contact with the inner wall of the casing, so that the heat generated by the heating element can be efficiently transferred to the casing.
  • the casing can be made of polycarbonate, ABS plastic (including acrylonitrile). , butadiene, styrene copolymer) and other non-electromagnetic shielding materials to ensure the normal operation of functional circuits.
  • the extension component may be applied in a harsh environment such as outdoor.
  • the extension component may further include a shielding cover component.
  • the shielding cover assembly can be installed on the outside of the casing to prevent the casing from being exposed to the sun and causing the overheating and other undesirable conditions.
  • the shield assembly may include a shield.
  • the shielding cover can be covered on the top and the outer circumference of the casing; and the top of the shielding cover is provided with ventilation holes.
  • the shielding cover can be placed on the top of the casing, and at the same time, the air flowing through the cooling air duct can also be discharged through the ventilation holes of the shielding cover; therefore, the shielding cover will not affect the cooling air duct of the inner shell. It will not affect the heat dissipation performance of the expansion components.
  • the shroud assembly may also include a shroud.
  • the shutter can be arranged on the top of the shielding cover to shield the ventilation holes.
  • a certain ventilation gap is maintained between the shutter and the shielding cover, and the air flowing through the heat dissipation air duct can be discharged through the ventilation gap.
  • the cooling air duct can maintain a vertical or inclined posture, so that the hot air in the cooling air duct can be Smooth upward discharge.
  • a heat dissipation fan may also be provided in the expansion assembly.
  • the cooling fan can be fixedly installed in the cooling air duct or other positions, so as to increase the flow speed of the air flowing through the cooling air duct, thereby improving the cooling capacity of the expansion components.
  • the extension component and the main equipment component are adapted to be installed, the extension component may be directly and fixedly connected to the main equipment component, or the extension component and the main equipment component may also be connected through an indirect structural member.
  • a first installation gap may be set between the expansion assembly and the main device assembly, and the first installation gap may be communicated with the cooling air duct.
  • the airflow in the first installation gap can be promoted to circulate, so that the heat of the main equipment components can be quickly taken away.
  • the main device housing of the main device assembly may include a base, the base is located on one side of the first installation gap, and the main circuit in the main device assembly may be installed in the base and in thermal contact with the base.
  • the heat-generating components in the main circuit can conduct thermal contact with the base through thermally conductive adhesives, thermal pads, etc., and the heat generated by the heat-generating components can be quickly transferred to the base, and passed through the first installation gap.
  • the base is rapidly dissipated, so that the heat dissipation effect of the main circuit can be effectively improved.
  • the expansion components and the main equipment components are connected through an indirect structure.
  • the expansion components and the main equipment components can be connected by brackets.
  • a second installation gap can be set between the bracket and the main equipment component, and a connecting air duct can be set in the bracket; wherein, one end of the connecting air duct can be docked with the cooling air duct, and the other end can be connected to the cooling air duct. It can be connected with the second installation gap, so that the second installation gap and the cooling air duct are effectively communicated.
  • the main device housing of the main device assembly may include a base, the base is located on one side of the second installation gap, and the main circuit in the main device assembly may be installed in the base and in thermal contact with the base.
  • the heat-generating components in the main circuit can conduct thermal contact with the base through thermally conductive adhesives, thermal pads, etc., and the heat generated by the heat-generating components can be quickly transferred to the base and passed through the second installation gap.
  • the base is rapidly dissipated, so that the heat dissipation effect of the main circuit can be effectively improved.
  • the shielding cover can also be covered at least part of the periphery of the main equipment assembly, so that a certain shielding effect can be achieved for the main equipment assembly.
  • a certain gap can be maintained between the shield and the main device components, so that the outside air can enter the installation gap (the first installation gap or the second installation gap) through the gap. ); further, when the air flows through the installation gap, it will enter the cooling air duct, and then be discharged from the top of the cooling air duct.
  • the main device component may be a camera, an outdoor base station (eg, a base station for sending and receiving wireless signals), etc.
  • the type of the main device component is not limited in this application.
  • FIG. 1 is a schematic cross-sectional structure diagram of an expansion assembly provided by an embodiment of the present application
  • FIG. 2 is an exploded view of another expansion component provided by an embodiment of the present application.
  • FIG. 3 is a schematic cross-sectional structure diagram of another expansion assembly provided by an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional structure diagram of another expansion assembly provided by an embodiment of the present application.
  • FIG. 5 is a schematic cross-sectional structure diagram of another expansion assembly provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a camera according to an embodiment of the present application.
  • FIG. 7 is a schematic cross-sectional structure diagram of a camera according to an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of another camera provided by an embodiment of the present application.
  • FIG. 9 is an exploded view of a camera according to an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of another camera provided by an embodiment of the present application.
  • the extension components provided in this application can be applied to main equipment components such as cameras and outdoor base stations to expand and improve the functionality of the corresponding main equipment components.
  • the camera generally includes a lens assembly to realize the function of collecting image information.
  • some manufacturers usually add an extra processor inside the camera in order to enable the camera to have certain information processing capabilities (such as face recognition, license plate recognition, etc.), but the processor will generate a large amount of heat during normal operation; due to The lens assembly is a heat-sensitive device with a low temperature specification. When the heat generated by the processor is large, it will affect the normal operation of the lens assembly. Therefore, the power and efficiency of the processor are greatly restricted, and it also affects the camera. Its own heat dissipation capacity has a greater test.
  • the installation of the processor can only be carried out before the camera leaves the factory. Therefore, the installation of the processor cannot be reasonably adjusted on the engineering site.
  • some manufacturers usually add a wireless communication circuit to the camera in order to enable the camera to have a wireless communication function.
  • the camera in practical applications, in order to meet the heat dissipation requirements of the camera itself, the camera usually adopts a metal casing such as aluminum alloy. Therefore, in order to prevent the signal of the wireless communication circuit from being shielded by the metal casing, the wireless communication circuit can only be installed on the casing of the camera. It cannot be installed inside the camera.
  • the wireless communication circuit When the wireless communication circuit is mounted on the casing, it occupies part of the area of the casing, thereby reducing the heat dissipation of the camera.
  • the wireless communication circuit needs to be connected to the camera body through a cable, and the position where the cable is connected to the camera body needs to be sealed to ensure the airtightness of the lens assembly.
  • the lens assembly needs to be tested for air tightness. Therefore, the installation of the wireless communication circuit can only be carried out before leaving the factory, but not at the engineering site (or after the camera leaves the factory). , so there is a big limitation.
  • the embodiments of the present application provide an expansion assembly that can be flexibly installed without affecting the heat dissipation performance of the electronic device, and an electronic device equipped with the expansion assembly.
  • references in this specification to "one embodiment” or “some embodiments” and the like mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application.
  • appearances of the phrases “in one embodiment,” “in some embodiments,” “in other embodiments,” “in other embodiments,” etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless specifically emphasized otherwise.
  • the terms “including”, “including”, “having” and their variants mean “including but not limited to” unless specifically emphasized otherwise.
  • an extension component 10 is provided in this embodiment of the present application, which is used to expand or improve the functionality of the main device component.
  • the expansion assembly 10 includes a housing 11 and a functional circuit 12 installed in the housing 11 .
  • One or more functional circuits 12 may be provided, and at least one functional circuit 12 is used for electrical connection with the main circuit in the main device assembly.
  • the casing 11 includes an inner casing 111 and an outer casing 112, and the inner circumference of the inner casing 111 forms a cooling air duct 1111; the outer casing 112 is arranged on the outer circumference of the inner casing 111, and the inner casing 111 and the outer casing 112 enclose an accommodation space 113; the functional circuit 12 is provided In the accommodating space 113 and in thermal contact with the inner case 111 , the functional circuit 12 is dissipated by the airflow in the heat dissipating air duct 1111 .
  • the outer periphery of the housing 112 since the outer periphery of the housing 112 is not blocked, it also has a larger heat dissipation area, so that the expansion assembly 10 itself has a strong heat dissipation capability.
  • the extension assembly 10 When the extension assembly 10 is installed on the main equipment assembly (eg, a camera), the extension assembly 10 will not affect the heat dissipation performance of the main equipment assembly itself. In addition, since the extension assembly 10 is independent of the structure of the main equipment assembly, when the main equipment assembly has different functional requirements, only the corresponding functional circuit 12 needs to be installed in the extension assembly 10 .
  • the types and numbers of functional circuits 12 that can be included in the expansion assembly 10 can be various.
  • the functional circuit 12 may be a communication circuit such as a radar, a WiFi module, a 4G communication module, a 5G communication module, and a Bluetooth module. It can also be: graphics processor, Ai processing chip, memory and other devices.
  • the required functional circuit 12 can be installed in the extension assembly 10 before leaving the factory, or the required functional circuit 12 can be installed in the extension assembly 10 at the engineering site, so as to have greater flexibility It will not cause undesirable problems such as functional insufficiency or functional redundancy.
  • the functional circuit 12 when installed, it is not necessary to disassemble or assemble the main equipment assembly (eg, camera), so that the air tightness of the main equipment assembly itself will not be affected.
  • the inner circumference of the inner shell 111 refers to the structural feature opposite to the outer circumference of the inner shell 111, or the inner circumference refers to the structural feature of the formed inner contour; for example, when the inner shell 111 is a cylindrical structure, The inner circumference of the inner shell 111 refers to the inner wall of the cylindrical structure, and the outer circumference of the inner shell 111 refers to the outer wall of the cylindrical structure.
  • the structure of the heat dissipation air duct 1111 can be various.
  • the cooling air duct 1111 may be a circular, square, rectangular or other polygonal structure in cross section.
  • the heat dissipation air duct 1111 may also have a linear, curvilinear, broken-line or other structure in the longitudinal direction, which is not specifically limited in the present application.
  • the inner shell 111 may be made of a metal material with good thermal conductivity, such as aluminum or aluminum alloy.
  • the functional circuit 12 located in the accommodating space 113 can be in thermal contact with the outer wall of the inner casing 111 , so that the heat generated by the functional circuit 12 can be efficiently transferred to the inner casing 111 .
  • the multiple functional circuits 12 can be circumferentially arranged around the inner casing 111 , and the heating elements in each functional circuit 12 can be in thermal contact with the outer wall of the inner casing 111 .
  • the heat-generating components in the functional circuit 12 can be in thermal contact with the inner case 111 by means of thermal pads, thermal adhesives, or the like.
  • the inner wall of the inner shell 111 may also be provided with structures such as heat dissipation fins, heat sinks, and heat conduction pipes, so as to improve the heat dissipation performance of the inner shell 111 .
  • the housing 112 can also be made of aluminum, aluminum alloy, etc. with good thermal conductivity made of metal material.
  • the functional circuit 12 located in the accommodating space 113 can be in thermal contact with the inner wall of the casing 112 , so that the heat generated by the functional circuit 12 can be efficiently transferred to the casing 112 .
  • the casing 112 can be made of polycarbonate, ABS plastic (including acrylonitrile) , butadiene, styrene copolymer) and other non-electromagnetic shielding materials to ensure the normal operation of the functional circuit 12.
  • the accommodating space 113 may also be a closed space. That is, the inner shell 111 and the outer shell 112 can be tightly connected.
  • the specific structural shapes of the inner shell 111 and the outer shell 112 can be various, and there can be various ways to achieve a hermetic connection between the corresponding inner shell 111 and the outer shell 112 .
  • the outer shell 112 and the inner shell 111 are both tubular structures, and the outer shell 112 is sleeved on the outer circumference of the inner shell 111 .
  • the shell 11 further includes a bottom shell 114 and an upper cover 115, the first end of the inner shell 111 (the lower end in the figure) and the first end of the outer shell 112 (the lower end in the figure) The lower end of the inner shell 111 (the upper end in the figure) and the second end (the upper end in the figure) of the outer shell 112 are airtightly connected through the upper cover 115 .
  • the bottom case 114 and the upper cover 115 are both annular plate-shaped structures.
  • the inner edge of the bottom case 114 is hermetically connected to the bottom edge of the inner case 111
  • the outer edge of the bottom case 114 is hermetically connected to the bottom edge of the outer case 112 .
  • the bottom case 114 and the inner case 111 can be hermetically connected by welding, gluing, setting a sealing ring, etc.
  • welding, gluing, setting can also be used between the shell 114 and the outer shell 112 Sealing ring, etc. for airtight connection.
  • the inner edge of the upper cover 115 is hermetically connected with the top edge of the inner shell 111
  • the outer edge of the upper cover 115 is hermetically connected with the top edge of the outer shell 112 .
  • the upper cover 115 and the inner shell 111 may be hermetically connected by welding, gluing, or setting a sealing ring; Sealing ring, etc. for airtight connection.
  • the cross-section of the heat dissipation channel 1111 can be a circle, an ellipse, a square or other polygonal structures, or it can be understood that the cross-section of the inner contour of the inner shell 111 can be a circle, an ellipse, a square or other A polygonal structure; in addition, the shape of the inner contour and the outer contour of the inner shell 111 may be the same or different.
  • the cross-sections of the inner contour and the outer contour of the inner shell 111 may both be circular, or the section of the inner contour of the inner shell 111 may be circular, and the section of the outer contour of the inner shell 111 may be square.
  • the cross section of the inner contour of the housing 112 may be a circle, an ellipse, a square or other polygonal structures; in addition, the shapes of the inner contour and the outer contour of the housing 112 may be the same or different.
  • the cross-sections of the inner contour and the outer contour of the housing 112 may both be circular, or the cross-section of the inner contour of the housing 112 may be circular, and the cross-section of the outer contour of the housing 112 may be square.
  • the inner shell 111 , the outer shell 112 , the bottom shell 114 and the upper cover 115 may be mutually independent structural components, or may be partially integrated structures.
  • the inner shell 111 and the bottom shell 114 are integral structural members (or it can be understood that the inner shell 111 and the bottom shell 114 are provided with an integrated structure to achieve airtightness therebetween. connection);
  • the housing 112 and the upper cover 115 are integral structural members (or it can be understood that the housing 112 and the upper cover 115 are provided with an integral structure to achieve a hermetic connection therebetween).
  • the inner shell 111 and the bottom shell 114 can be made into an integrated structure by means of die-casting, CNC machining and other processes.
  • the casing 112 and the upper cover 115 can also be made into an integrated structure by means of die casting, CNC machining and other processes.
  • the outer casing 112 and the bottom casing 114 are connected by means of screw connection.
  • the bottom edge of the casing 112 is provided with a through hole (not shown in the figure), and the bottom casing 114 is provided with a threaded hole (not shown in the figure), when the casing 11 is assembled, the through hole of the casing 112 can be The holes are aligned with the threaded holes of the bottom shell 114 , and then bolts are inserted through the through holes of the outer shell 112 and then screwed with the threaded holes of the bottom shell 114 , so as to realize the fixed connection between the outer shell 112 and the bottom shell 114 .
  • a sealing ring 1112 or sealant may be applied between the upper end of the inner shell 111 and the upper cover 115 .
  • the outer edge of the bottom shell 114 and the bottom edge of the outer shell 112 may be hermetically connected by providing a sealing ring or applying a sealant.
  • the part where the bottom case 114 and the outer case 112 are combined can be re-applied with sealant for bonding. Therefore, it has greater flexibility and convenience in disassembly and assembly, and at the same time, the airtightness of the accommodating space 113 can be effectively ensured.
  • an external thread structure may also be provided on the upper end of the inner casing 111 (for example, the sealing ring 1112 can be regarded as the external thread structure), and an internal thread structure is provided in the through hole 1151 of the upper cover 115 .
  • the external thread of the inner casing 111 can be screwed into the through hole 1151 , so as to realize the threaded connection between the inner casing 111 and the upper cover 115 .
  • composition structure of the casing 11 and the connection form between the composition structures may also be in other manners, which are not specifically limited in this application.
  • the extension assembly 10 may be electrically connected to the main device assembly through a cable, so as to meet the power supply requirement of the extension assembly 10 itself or the signal transmission requirement between the extension assembly 10 and the main device assembly.
  • the bottom case 114 is provided with a wiring hole 1141 that communicates with the accommodating space 113 .
  • a structure such as a sealant may be filled in the wiring hole 1141.
  • a sealing ring such as a rubber ring with greater elasticity can also be provided at the wiring hole 1141.
  • the sealing ring can be sealed with the cable and the hole wall of the wiring hole 1141. fit, so as to ensure the airtightness between the wiring hole 1141 and the cable.
  • the cable itself may also be provided with a corresponding sealing structure for airtight connection with the wiring hole 1141 .
  • the outer periphery of the cable can be provided with an external thread structure
  • the inner wall of the wiring hole 1141 can be provided with an internal thread structure
  • the cable can be tightly connected with the wiring hole 1141 to achieve a certain airtight connection.
  • sealant may also be filled in the gap between the cable and the wiring hole 1141 to improve the waterproof performance.
  • structures such as interfaces, connectors, etc. can also be installed in the wiring holes 1141, and the functional circuit 12 can be electrically connected to the main device components through the interfaces or connectors.
  • the number of the wiring holes 1141 may also be two or more.
  • the arrangement position of the wiring hole 1141 is not limited to being arranged on the bottom case 114 .
  • the wiring hole 1141 may also be provided on the housing 112 .
  • the extension assembly 10 may be used in relatively harsh environments such as outdoors.
  • the extension assembly 10 may further include a shielding cover assembly 13 .
  • the shielding cover assembly 13 can be installed outside the casing 112 to prevent the casing 112 from being exposed to sunlight and causing problems such as excessive temperature.
  • the shielding cover assembly 13 includes a shielding cover 131 and a shielding plate 132 .
  • the shielding cover 131 can be disposed on the top and the outer periphery of the housing 11 ; and the top of the shielding cover 131 is provided with a ventilation hole 1311 .
  • the shielding cover 131 can be covered on the top of the casing 11, and at the same time, the air flowing through the cooling air duct 1111 can also be discharged through the ventilation holes 1311 of the shielding cover 131; therefore, the shielding cover 131 will not affect the inner shell 131.
  • the heat dissipation air duct 1111 of 111 acts as a hindrance, and thus will not affect the heat dissipation performance of the expansion assembly 10 .
  • impurities such as leaves from falling into the cooling air duct 1111 and causing blockage.
  • the shutter 132 may be disposed on the top of the shielding cover 131 , and the shape outline of the shutter 132 is larger than that of the ventilation hole 1311 , so as to shield the ventilation hole 1311 .
  • a certain ventilation gap 133 is maintained between the shutter 132 and the shielding cover 131 , and the airflow entering from the bottom of the cooling air duct 1111 can be discharged upward through the ventilation gap 133 .
  • the cooling airflow enters the cooling air duct 1111 from the bottom of the cooling air duct 1111 and flows to the top, and then is discharged through the ventilation holes 1311 of the shielding cover 131 and the ventilation gap 133 between the shielding cover 131 and the shutter 132 .
  • the ventilation gap 133 between the shielding cover 131 and the shutter 132 can be set to a relatively complex shape structure to prevent rainwater from entering the cooling air duct 1111 through the ventilation gap 133 .
  • the ventilation gap 133 may be provided with a plurality of corners, or the ventilation gap 133 may be provided with a relatively zigzag structure.
  • the shielding cover 131 and the shielding plate 132 may be independent structures or may be integral structures.
  • the shielding cover 131 and the shielding plate 132 can be separately manufactured by a process such as injection molding, and then fixedly connected by means of bonding, screw connection, or the like.
  • the shielding cover 131 and the shielding plate 132 may also be formed into an integral structure by a process such as injection molding.
  • the shielding cover 131 and the shielding plate 132 can be made of non-electromagnetic shielding materials such as polycarbonate, ABS plastic (including copolymers of acrylonitrile, butadiene, and styrene), so as to not cause any damage to the functional circuit.
  • the electromagnetic shielding effect can also play a good role in protecting and shielding the casing 11 .
  • only the shielding cover 131 may be provided and the shielding plate 132 may be omitted.
  • only the shutter 132 may be provided and the shield 131 may be omitted.
  • the above-mentioned shield assembly 13 may also be omitted.
  • the heat dissipation air duct 1111 can maintain a vertical or inclined posture, so that the heat dissipation air duct 1111 The hot air inside can be discharged upwards smoothly.
  • a cooling fan 14 may also be provided in the expansion assembly 10 .
  • the cooling fan 14 can be fixedly installed in the cooling air duct 1111 or at other positions to increase the flow speed of the air flowing through the cooling air duct 1111 , thereby improving the heat dissipation capability of the expansion assembly 10 .
  • the cooling fan 14 may be of a type with strong performance such as waterproof, dustproof, and shockproof, so as to improve the reliability and stability of the cooling fan 14 .
  • the expansion component 10 can be adapted with various types of main device components to expand or improve the functionality of the corresponding main device components.
  • the main device component may be an outdoor base station (such as a base station for sending and receiving wireless signals), a camera, and the like.
  • the extension assembly 10 is matched and installed with the main equipment assembly, it is not necessary to disassemble and assemble the main equipment assembly, so that the airtightness and reliability of the main equipment assembly will not be affected.
  • the main equipment component has different functional requirements, it is only necessary to install corresponding functional circuits in the expansion component 10, so as to have strong flexibility. It can effectively prevent the occurrence of undesirable situations such as functional insufficiency or functional redundancy.
  • the expansion assembly 10 provided by the embodiment of the present application not only does not reduce the heat dissipation performance of the main device assembly itself, but in some cases, the expansion assembly 10 can also increase the heat dissipation performance of the main device assembly.
  • a first installation gap that communicates with the heat dissipation air duct 1111 can be set between the main device shell and the shell 11 of the expansion assembly 10.
  • the flow rate of the air flow in the first installation gap can be increased, thereby improving the heat dissipation performance of the main device components.
  • a second installation gap that communicates with the cooling air duct 1111 may be set between the main device housing and the bracket.
  • the flow rate of the airflow in the first installation gap is increased, thereby improving the heat dissipation performance of the main equipment components.
  • the main device component is a camera component for specific description.
  • a camera 20 provided by the present application includes a camera assembly 21 and a bracket 22 , and the camera assembly 21 can be fixed at an installation position (eg, a wall, a road monitoring pole) through the bracket 22 .
  • the camera assembly 21 can be fixedly installed on the lower side of the bracket 22 in the form of hoisting, and there is a certain second installation gap 23a between the camera assembly 21 and the bracket 22 (that is, there is a second installation gap 23a between the main equipment shell and the bracket 22 ). Two installation gaps 23a).
  • the expansion assembly 10 can be fixed on the upper side of the bracket 22 .
  • the bracket 22 has a connecting air duct 221 penetrating the upper and lower ends.
  • the upper end of the connecting air duct 221 can be butted with the lower end of the cooling air duct 1111 , and the lower end of the connecting air duct 221 is communicated with the second installation gap 23a.
  • the connecting air duct 221 on the bracket 22 can be connected to the second installation gap 23 a and the cooling air duct 1111 of the expansion assembly 10 .
  • the cooling airflow will first enter the connecting air duct 221 from the second installation gap 23 a , and after passing through the connecting air duct 221 , the cooling airflow will flow into the cooling air duct 1111 , and then be discharged from the upper end of the cooling air duct 1111 .
  • the flow rate of the airflow flowing through the camera assembly 21 can be increased, so that the heat dissipation effect of the camera assembly can be effectively improved.
  • the camera assembly 21 can facilitate the chimney effect of the cooling air duct 1111 to increase the flow rate of the upper air flowing through the camera assembly 21 , so that the heat generated by the camera assembly 21 can be quickly taken away.
  • the flow rate of the air flowing through the camera assembly 21 can also be effectively increased, and the heat generated by the camera assembly 21 can also be quickly taken away. That is, the expansion assembly 10 not only does not reduce the heat dissipation performance of the camera assembly 21 , but can also significantly improve the heat dissipation performance of the camera assembly 21 .
  • the installation manner and relative position between the camera assembly 21 and the extension assembly 10 can also be set flexibly.
  • FIG. 8 shows a schematic diagram of a simplified structure of the camera 20, the extension assembly 10 can be directly installed on the upper side of the camera assembly 21, and a certain first installation gap 23b ( That is, a first installation gap 23b) is provided between the main device casing and the casing 11 of the expansion assembly 10.
  • the cooling air flow can directly enter the cooling air duct 1111 through the first installation gap 23b, and then be discharged from the top of the cooling air duct 1111.
  • the lower end of the shielding cover 131 can extend to the periphery of the camera 20 (eg, the base 211 ), and a certain distance between the shielding cover 131 and the camera 20 can be maintained. Clearance.
  • the outside air can enter the first installation gap 23b through the gap and flow upward through the heat dissipation air duct 1111 .
  • the airflow is discharged from the top of the heat dissipation air duct 1111 and then flows to the shutter 132 , and is discharged to the outside through the gap between the shutter 132 and the shield 131 .
  • the heat generating components located in the camera assembly 21 may be installed at a position close to the first installation gap 23b.
  • the housing of the camera assembly 21 includes a base 211 and a dome cover 212 .
  • the base 211 and the dome cover 212 can enclose a closed space for installing the lens 24 , so as to form a good protection effect for the lens 24 .
  • the heat-generating components in the main circuit 213 may be in thermal contact with the base 211 through a thermal pad or a thermal-conductive glue, so as to improve the heat dissipation of the heat-generating components.
  • a metal bottom plate 2111 can be set in the base 211 , the base 211 (or the camera assembly 21 ) can be fixedly connected to the bracket 22 through the metal bottom plate 2111 , and the metal bottom plate 2111 and the bracket 22 can be connected Keep a certain installation clearance.
  • the main circuit 213 may be attached to one side of the metal base plate 2111 .
  • the base 211 may also be provided with structures such as interfaces or connectors, and the main circuit 213 can be electrically connected to the functional circuit 12 in the expansion assembly 10 through the interfaces or connectors.
  • both the camera assembly 21 and the extension assembly 10 can be fixed at the installation position through the bracket 22; alternatively, the camera assembly 21 can be fixed in the installation position through the bracket 22, and the extension assembly 10 can be directly fixed on the camera assembly 21; or, the extension assembly 10 It can be fixed at the installation position through the bracket 22 , and the camera assembly 21 can be directly fixed on the extension assembly 10 . As shown in FIG.
  • the shielding cover 131 may be provided with a gap (not shown in the figure) for the beam of the bracket 22 to pass through, so that the shielding cover 131 can A smooth cover is provided on the periphery of the camera assembly 21 .

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Abstract

本申请提供了一种电子设备和扩展组件，涉及电子设备技术领域，以解决在对主设备组件的功能性进行扩展时难度大、灵活性小等问题；本申请提供的电子设备包括主设备组件和扩展组件；扩展组件包括功能电路和壳体，功能电路与主设备组件的主体电路电连接；壳体包括内壳和外壳；内壳的内周形成散热风道；外壳设置在内壳的外周，且内壳和外壳围成容纳空间；功能电路设置在容纳空间内并与内壳热接触；在本申请提供的电子设备中，扩展组件整体呈中空的烟囱状结构，当外界气流流经内壳的散热风道时，会带走内壳的热量。另外，由于扩展组件是独立于主设备组件的构造，因此，当主设备组件存在不同的功能需求时，只需要在扩展组件中加装相应的功能电路即可。

Description

一种电子设备和扩展组件
相关申请的交叉引用
本申请要求在2020年08月13日提交中国专利局、申请号为202010814994.6、申请名称为“一种电子设备和扩展组件”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种电子设备和扩展组件。
背景技术
摄像机广泛应用在人们的日常生活中，例如，摄像机可以应用在道路、园区、室内等环境中以实现图像采集等功能。随着科技的发展和人们需求的不断提升，用户希望摄像机能够具备更加丰富的功能。例如，一些用户希望摄像机能够具备无线通信功能；一些用户希望摄像机能够具备人脸识别、车牌识别等功能。为了满足不同客户的不同需求，可以在摄像机中增加所需的功能电路(如通信电路、处理器等)。但是，在实际应用时，为了满足摄像机中镜头组件的气密性需求，需要在出厂前将所需的功能电路加装在摄像机中，而无法在出厂后或应用现场对所需的功能电路进行加装，因此会导致摄像机功能不全或功能冗余过剩等情况。
发明内容
本申请提供了一种能够便于灵活扩展的电子设备和扩展组件。
本申请提供了一种电子设备，包括主设备组件和扩展组件；主设备组件包括主体电路；扩展组件包括一个或多个功能电路以及壳体；一个或多个功能电路中的至少一个与主体电路电连接；壳体包括内壳和外壳；内壳的内周形成散热风道；外壳设置在内壳的外周，且内壳和外壳围成容纳空间；功能电路设置在容纳空间内并且与内壳热接触，从而通过散热风道中的气流来对功能电路进行散热。在本申请提供的电子设备中，扩展组件整体呈中空的烟囱状结构，当外界气流流经内壳的散热风道时，会带走内壳的热量。另外，由于功能电路(具体可以是功能电路中的处理器等发热元器件)与内壳热接触(热接触指的是能传递热量的接触，例如直接接触或通过导热胶、导热垫等进行接触)，功能电路所产生的热量能够有效的传导至内壳，从而能便于对功能电路进行散热。在实际应用时，可以在出厂前将所需的功能电路加装在扩展组件中，也可以在工程现场将所需的功能电路加装在扩展组件中，从而具有较大的灵活性，不会造成功能不全或功能冗余等不良问题。另外，功能组件在加装时，不需要对主设备组件进行拆装，从而不会影响到主设备组件本身的气密性等。当扩展模块加装在主设备组件(如摄像机)上时，扩展组件不会影响到主设备组件本身所具备的散热性能。另外，由于扩展组件是独立于主设备组件的构造，因此，当主设备组件存在不同的功能需求时，只需要在扩展组件中加装相应的功能电路即可。即，扩展组件和主设备组件采用分腔架构形式，使得扩展组件能够安装在远离主设备组件的位置，从 而能够降低扩展组件对主设备组件散热性的影响。在具体实施时，扩展组件中所能包含的功能电路的种类和数量可以是多样的。例如，功能电路可以是：雷达、WiFi模块、4G通信模块、5G通信模块、蓝牙模块等通信电路。也可以是：图形处理器、Ai处理芯片、存储器等器件。在实际应用时，可以在出厂前将所需的功能电路加装在扩展组件中，也可以在工程现场将所需的功能电路加装在扩展组件中，从而具有较大的灵活性，不会造成功能不全或功能冗余等不良问题。另外，功能组件在加装时，不需要对主设备组件(如摄像机)进行拆装，从而不会影响到主设备组件本身的气密性等。
另外，在具体实施时，壳体可以是一体的结构件，也可以是由多个部件拼接而成的。
例如，壳体可以包括内壳和外壳。内壳可以构造为管状结构，外壳也构造为管状结构，可以是圆管结构，或者其他任何规则或者非规则的管状结构。外壳套设在内壳的外周，且外壳和内壳之间保持有用于构成该容纳空间的间隙。另外，为了实现内壳和外壳之间的密闭连接，壳体还包括上盖和底壳。其中，上盖和底壳均构造为环形的板状结构。具体来说，底壳的内边缘与内壳的第一端密闭连接，底壳的外边缘与外壳的第一端密闭连接。上盖的内边缘与内壳的第二端密闭连接，上盖的外边缘与外壳的第二端密闭连接。在具体配置时，散热通道的截面可以是圆形、椭圆形、方形或其他多边形的结构，或者可以理解的是，内壳的内轮廓的截面可以是圆形、椭圆形、方形或其他多边形的结构；另外，内壳的内轮廓与外轮廓的形状可以相同也可以不同。例如，内壳的内轮廓和外轮廓的截面可以均为圆形，或者，内壳的内轮廓的截面为圆形，内壳的外轮廓的截面为方形。相应的，外壳的内轮廓的截面可以是圆形、椭圆形、方形或其他多边形的结构；另外，外壳的内轮廓与外轮廓的形状可以相同也可以不同。例如，外壳的内轮廓和外轮廓的截面可以均为圆形，或者，外壳的内轮廓的截面为圆形，外壳的外轮廓的截面为方形。
在具体实施时，为了保证容纳空间的密闭性，上盖与内壳和外壳相连接的部分可以设置密封圈或涂抹密封胶等。相应的，底壳与内壳和外壳相连接的部分也可以设置密封圈或涂抹密封胶等。另外，在具体实施时，上盖与内壳、外壳之间的连接方式也可以是多样的。底壳与内壳、外壳之间的连接方式也可以是多样的。例如，内壳和上盖之间可以采用螺纹连接的方式进行连接。具体来说，可以在上盖的内边缘设置内螺纹、在内壳的第二端可以外螺纹，当内壳的外螺纹与上盖的内螺纹螺接后便可实现内壳和上盖之间的固定连接。另外，为了保证螺接部分的密闭性，也可以在螺接部分设置密封圈或者涂抹密封胶等。
另外，在具体实施时，内壳、外壳、上盖和底壳可以是相互独立的结构件，也可以是部分一体的结构件。例如，内壳和底壳可以是一体结构；外壳和上盖可以是一体结构。
另外，扩展组件中的功能电路可能需要通过线缆与主设备组件中的主体电路进行电连接，以满足扩展组件自身的供电需求或与主设备组件之间的信号传输需求，因此，在壳体上可以设置与容纳空间连通的走线孔。在具体实施时，走线孔可以设置在底壳上，也可以设置在内壳或外壳上。
为了提升扩展组件的散热性能，内壳可以由铝、铝合金等导热性良好的金属材料制成。另外，功能电路的发热元器件(如处理器等)可以与内壳的外壁热接触，以使发热元器件所产生的热量能够高效的传递给内壳。
或者，在另一些实施方式中，外壳也可以由铝、铝合金等导热性良好的金属材料制成。另外，功能电路的发热元器件也可以与外壳的内壁热接触，以使发热元器件所产生的热量能够高效的传递给外壳。
另外，在实际应用时，当功能电路包括雷达、WiFi模块、4G通信模块等无线通信电路时，为了防止壳体对该功能电路产生屏蔽作用，外壳可以由聚碳酸酯、ABS塑料(包括丙烯腈、丁二烯、苯乙烯的共聚物)等非电磁屏蔽材料制成，以保证功能电路的正常工作。
另外，扩展组件可能会应用在室外等较为恶劣的环境中，为了提升其使用效果，扩展组件还可以包括遮蔽罩组件。遮蔽罩组件可以罩设在壳体的外部，以防止壳体受阳光暴晒而产生温度过高等不良情况。
在具体实施时，遮蔽罩组件可以包括遮蔽罩。遮蔽罩可以罩设在壳体的顶部和外周；且遮蔽罩的顶部设有通风孔。在具体实施时，遮蔽罩可以盖设在壳体的顶部，同时，流经散热风道的气流也可以通过遮蔽罩的通风孔排出；因此，遮蔽罩不会对内壳的散热风道起到阻碍的作用，进而不会影响到扩展组件的散热性能。
另外，为了防止树叶等杂质掉落在散热风道内造成堵塞。遮蔽罩组件还可以包括遮板。遮板可以设置在遮蔽罩的顶部，以对通风孔起到遮挡的作用。另外，为了防止遮板对散热风道形成阻碍，遮板与遮蔽罩之间保持有一定的通风间隙，流经散热风道的气流能够通过该通风间隙向排出。
在实际应用时，为了利用热气流上升的原理来提升扩展组件的散热性，当扩展组件固定在安装位置后，散热风道可以保持竖直或倾斜的姿态，以使散热风道内的热气流能够顺利的向上排出。
另外，为了提升扩展组件的散热性能和安装姿态的灵活性，在另一些实施方式中，扩展组件中还可以设置散热风扇。例如，可以将散热风扇固定安装在散热风道内或者其他位置，以提升流经散热风道的气流的流动速度，进而提升扩展组件的散热能力。
另一方面，当扩展组件与主设备组件进行适配性安装时，扩展组件可以与主设备组件直接固定连接，或者，扩展组件与主设备组件之间也可以通过间接的结构件进行连接。
例如，当扩展组件与主设备组件直接固定连接时，扩展组件的壳体与主设备组件的主设备外壳之间可以通过螺钉、卡勾等结构进行连接。另外，为了提升主设备组件的散热性，扩展组件和主设备组件之间还可以设置第一安装间隙，第一安装间隙可以与散热风道连通。当散热风道内有气流流通时，可以促使第一安装间隙的内的气流进行流通，从而可以快速带走主设备组件的热量。在具体实施时，主设备组件的主设备外壳中可以包括底座，底座位于第一安装间隙的一侧，主设备组件中的主体电路可以安装在底座中并与底座热接触。具体来说，主体电路中的发热元器件可以通过导热胶、导热垫等与底座进行导热接触，发热元器件所产生的热量能够快速的传递至底座中，并通过流经第一安装间隙的气流对底座进行快速散热，从而能够有效提升主体电路的散热效果。
另外，当扩展组件与主设备组件之间通过间接的结构进行连接。例如，扩展组件与主设备组件之间可以通过支架进行连接。另外，为了提升主设备组件的散热性，支架和主设备组件之间还可以设置第二安装间隙，支架中可以设置连接风道；其中，连接风道的一端可以与散热风道对接，另一端可以与第二安装间隙连接，以使第二安装间隙和散热风道进行有效连通。当散热风道内有气流流通时，可以促使第二安装间隙的内的气流进行流通，从而可以快速带走主设备组件的热量。在具体实施时，主设备组件的主设备外壳中可以包括底座，底座位于第二安装间隙的一侧，主设备组件中的主体电路可以安装在底座中并与底座热接触。具体来说，主体电路中的发热元器件可以通过导热胶、导热垫等与底座进行导热接触，发热元器件所产生的热量能够快速的传递至底座中，并通过流经第二安装间隙 的气流对底座进行快速散热，从而能够有效提升主体电路的散热效果。
当上述的扩展组件中包括遮蔽罩时，遮蔽罩还可以罩设在主设备组件的至少部分外围，从而可以为主设备组件起到一定的遮挡效果。另外，为了保证主设备组件以及扩展组件的散热性能，遮蔽罩和主设备组件之间可以保持一定的间隙，以使外界气流能够通过该间隙进入该安装间隙(第一安装间隙或第二安装间隙)内；进一步的，当气流流经安装间隙后会进入散热风道内，然后从散热风道的顶部排出。
在具体应用时，主设备组件可以是摄像机、室外基站(如用于收发无线信号的基站)等，本申请对主设备组件的类型不作限定。
附图说明
图1为本申请实施例提供的一种扩展组件的剖面结构示意图；
图2为本申请实施例提供的另一种扩展组件的爆炸图；
图3为本申请实施例提供的另一种扩展组件的剖面结构示意图；
图4为本申请实施例提供的另一种扩展组件的剖面结构示意图；
图5为本申请实施例提供的另一种扩展组件的剖面结构示意图；
图6为本申请实施例提供的一种摄像机的结构示意图；
图7为本申请实施例提供的一种摄像机的剖面结构示意图；
图8为本申请实施例提供的另一种摄像机的结构示意图；
图9为本申请实施例提供的一种摄像机的爆炸图；
图10为本申请实施例提供的另一种摄像机的结构示意图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
为了方便理解本申请实施例提供的扩展组件，下面首先介绍一下其应用场景。
本申请提供的扩展组件可以应用在摄像机、室外基站等主设备组件中，以扩展、提升对应主设备组件的功能性。以摄像机为例，摄像机一般包括镜头组件，以实现图像信息的采集功能。目前，一些厂商为了使得摄像机能够具备一定的信息处理能力(如人脸识别、车牌识别等)，通常会在摄像机内部增加额外的处理器，但是处理器在正常工作时会产生较大热量；由于镜头组件为热敏感器件，温度规格较低，当处理器所产生的热量较大时，会影响到镜头组件的正常工作，因此对处理器的功率和效能有着较大的限制，同时也对摄像机本身的散热能力有着较大的考验。另外，为了保证镜头组件的气密性，处理器的加装工作只能在摄像机出厂前进行，因此，不能在工程现场对处理器的加装工作进行合理调整。另外，一些厂商为了使得摄像机能够具备无线通信功能，通常会在摄像机上增加无线通信电路。然而在实际应用时，为了满足摄像机本身的散热需求，摄像机通常采用铝合金等金属外壳，因此，为了防止无线通信电路的信号被金属外壳屏蔽，无线通信电路只能安装在摄像机的外壳上，而不能安装在摄像机内部。当无线通信电路安装在外壳上时，会占用外壳的部分面积，从而会降低摄像机的散热性。另外，在实际应用时，无线通信电路需要通过线缆与摄像机本体进行连接，线缆与摄像机本体连接的位置需要做密封处理，以保证镜 头组件的气密性。另一方面，当密封工作完成以后，还需要对镜头组件进行气密性测试，因此，无线通信电路的加装工作只能在出厂前进行，而不能在工程现场(或者在摄像机出厂后)进行，从而存在较大的局限性。
在实际应用时，由于摄像机存在多种不同的应用场景，且不同用户对摄像机的功能需求也有所不同，因此，摄像机所增加的功能电路的种类和数量也有着很大的不同。但是受限于镜头组件(或摄像机本身)的气密性要求，摄像机中所加装的功能电路只能在出厂前进行配置，在实际应用时，会导致功能不全或功能冗余等不良情况。另外，由于加装的一些功能电路没有散热结构，因此需要依靠摄像机的壳体进行散热，从而会影响到摄像机本身的散热性能。可以理解的是，上述仅以摄像机为例进行了简单说明，然而在实际应用时，室外基站(如用于收发无线信号的基站)等主设备组件在加装功能电路时，也面临与上述摄像机相同或类似的技术问题。
为此，本申请实施例提供了一种能够实现灵活加装、且不会影响电子设备散热性能的扩展组件和配备该扩展组件的电子设备。
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图和具体实施例对本申请作进一步地详细描述。
以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。还应当理解，在本申请以下各实施例中，“至少一个”、“一个或多个”是指一个、两个或两个以上。术语“和/或”，用于描述关联对象的关联关系，表示可以存在三种关系；例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B的情况，其中A、B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
如图1所示，在本申请实施例提供了一种扩展组件10，用于扩展或提升主设备组件的功能性。扩展组件10包括壳体11和安装在壳体11内的功能电路12。功能电路12可以设置一个或者多个，且至少一个功能电路12用于与主设备组件中的主体电路进行电连接。壳体11包括内壳111和外壳112，内壳111的内周形成散热风道1111；外壳112设置在内壳111的外周，且内壳111和外壳112围成容纳空间113；功能电路12设置在容纳空间113内并且与内壳111热接触，从而通过散热风道1111中的气流来对功能电路12进行散热。另外，由于外壳112的外周不受遮挡，也具有较大的散热面积，从而使得扩展组件10本身具备较强的散热能力。当扩展组件10加装在主设备组件(如摄像机)上时，扩展组件10不会影响到主设备组件本身所具备的散热性能。另外，由于扩展组件10是独立于主设备组件的构造，因此，当主设备组件存在不同的功能需求时，只需要在扩展组件10中加装相应的功能电路12即可。在具体实施时，扩展组件10中所能包含的功能电路12的种类和数量可以是多样的。例如，功能电路12可以是：雷达、WiFi模块、4G通信模块、5G 通信模块、蓝牙模块等通信电路。也可以是：图形处理器、Ai处理芯片、存储器等器件。在实际应用时，可以在出厂前将所需的功能电路12加装在扩展组件10中，也可以在工程现场将所需的功能电路12加装在扩展组件10中，从而具有较大的灵活性，不会造成功能不全或功能冗余等不良问题。另外，功能电路12在加装时，不需要对主设备组件(如摄像机)进行拆装，从而不会影响到主设备组件本身的气密性等。
其中，内壳111的内周指的是与内壳111的外周相反的结构特征，或者内周指的是所形成的内轮廓的结构特征；例如，当内壳111为圆筒状结构时，内壳111的内周指的是圆筒状结构的内壁，内壳111的外周指的是圆筒状结构的外壁。
在具体实施时，散热风道1111的结构可以是多样的。例如，散热风道1111可以是截面为圆形、方形、矩形或其他的多边形结构。另外，散热风道1111在长度方向也可以是直线型、曲线型、折线形等结构，本申请对此不作具体限定。
在具体实施时，为了提升扩展组件10的散热性能，内壳111可以由铝、铝合金等导热性良好的金属材料制成。另外，位于容纳空间113内的功能电路12可以与内壳111的外壁热接触，以使功能电路12所产生的热量能够高效的传递给内壳111。当该容纳空间113内的功能电路12为多个时，多个功能电路12可以围绕内壳111周向设置，且每个功能电路12中的发热元器件均可以与内壳111的外壁热接触，从而使得多个功能电路12均能够通过内壳111进行散热。具体来说，功能电路12中的发热元器件可以通过导热垫、导热胶等方式与内壳111进行热接触。另外，内壳111的内壁也可以设置散热鳍片、散热器、导热管等结构，以提升内壳111的散热性。或者，在另一些实施方式中，当功能电路12不包含无线通信电路(即无线通信电路需要通过无线信号与外界进行传输才能正常工作)时，外壳112也可以由铝、铝合金等导热性良好的金属材料制成。另外，位于容纳空间113内的功能电路12可以与外壳112的内壁热接触，以使功能电路12所产生的热量能够高效的传递给外壳112。
在另一些实施方式中，当功能电路12包括雷达、WiFi模块、4G通信模块时，为了防止壳体11对该功能电路12产生屏蔽作用，外壳112可以由聚碳酸酯、ABS塑料(包括丙烯腈、丁二烯、苯乙烯的共聚物)等非电磁屏蔽材料制成，以保证功能电路12的正常工作。
另外，在一些实施方式中，一些功能电路12可能需要较高的密闭性，以防止水汽、灰尘等杂质影响其正常工作，因此，在具体实施时，该容纳空间113也可以是密闭的空间，即内壳111和外壳112之间可以进行密闭连接。
在具体实施时，内壳111和外壳112的具体结构形状可以是多样的，相应的内壳111和外壳112之间实现密闭连接的方式可以有多种。
例如，如图2和图3所示，在本申请提供的一个实施例中，外壳112和内壳111均为管状结构，外壳112套设在内壳111的外周。为了实现外壳112和内壳111之间的密闭连接，壳体11还包括底壳114和上盖115，内壳111的第一端(图中的下端)和外壳112的第一端(图中的下端)通过底壳114密闭连接；内壳111的第二端(图中的上端)和外壳112的第二端(图中的上端)通过上盖115密闭连接。具体来说，在本申请提供的实施例中，底壳114和上盖115均为环形板状结构。其中，底壳114的内边缘与内壳111的底部边缘进行密闭连接，底壳114的外边缘与外壳112的底部边缘进行密闭连接。在具体实施时，底壳114和内壳111之间可以通过焊接、胶接、设置密封圈等方式进行密闭连接；相 应的，壳体114和外壳112之间也可以采用焊接、胶接、设置密封圈等方式进行密闭连接。另外，上盖115的内边缘与内壳111的顶部边缘进行密闭连接，上盖115的外边缘与外壳112的顶部边缘进行密闭连接。在具体实施时，上盖115和内壳111之间可以通过焊接、胶接、设置密封圈等方式进行密闭连接；相应的，壳体114和外壳112之间也可以采用焊接、胶接、设置密封圈等方式进行密闭连接。
在具体配置时，散热通道1111的截面可以是圆形、椭圆形、方形或其他多边形的结构，或者可以理解的是，内壳111的内轮廓的截面可以是圆形、椭圆形、方形或其他多边形的结构；另外，内壳111的内轮廓与外轮廓的形状可以相同也可以不同。例如，内壳111的内轮廓和外轮廓的截面可以均为圆形，或者，内壳111的内轮廓的截面为圆形，内壳111的外轮廓的截面为方形。相应的，外壳112的内轮廓的截面可以是圆形、椭圆形、方形或其他多边形的结构；另外，外壳112的内轮廓与外轮廓的形状可以相同也可以不同。例如，外壳112的内轮廓和外轮廓的截面可以均为圆形，或者，外壳112的内轮廓的截面为圆形，外壳112的外轮廓的截面为方形。
另外，在具体实施时，内壳111、外壳112、底壳114和上盖115可以是相互独立的结构件，也可以是部分一体的结构。例如，在本申请提供的一个实施例中，内壳111和底壳114是一体的结构件(或者可以理解的是，内壳111和底壳114通过一体结构的设置实现两者之间的密闭连接)；外壳112和上盖115是一体的结构件(或者可以理解的是，外壳112和上盖115通过一体结构的设置实现两者之间的密闭连接)。其中，内壳111和底壳114可以采用压铸成型、CNC加工等工艺制作为一体结构。相应的，外壳112和上盖115也可以采用压铸成型、CNC加工等工艺制作为一体结构。另外，在具体实施时，为了实现壳体11的可拆卸连接，外壳112和底壳114之间采用螺纹连接的方式进行连接。具体来说，外壳112的底部边缘设有通孔(图中未示出)，底壳114设有螺纹孔(图中未示出)，将壳体11进行装配时，可将外壳112的通孔与底壳114的螺纹孔对中，然后将螺栓由外壳112的通孔穿入后与底壳114的螺纹孔进行螺接，从而实现外壳112和底壳114之间的固定连接。另外，为了保证容纳空间113的密闭性，内壳111的上端与上盖115之间可以设置密封圈1112或涂抹密封胶。另外，底壳114的外边缘与外壳112的底部边缘可以通过设置密封圈或涂抹密封胶的形式进行密闭连接。当容纳空间113内需要增加、替换或拆除功能电路12时，将底壳114和外壳112之间的密封胶进行拆除，然后拆除螺栓后即可实现壳体11的拆卸工作。另外，当功能电路12的加装、替换或拆除等工作完成后，再将底壳114和外壳112相结合的部分重新涂覆密封胶进行胶接即可。从而具有较大的拆装灵活性和便利性，同时也能够有效保证容纳空间113的密闭性。
另外，在一些实施方式中，也可以在内壳111的上端设置外螺纹结构(例如，密封圈1112可以看作该外螺纹结构)，在上盖115的通孔1151内设置内螺纹结构。在对壳体11进行装配时，可将内壳111的外螺纹旋入通孔1151内，从而实现内壳111和上盖115之间的螺纹连接。
可以理解的是，在另外的实施方式中，壳体11的组成结构，以及组成结构之间的连接形式也可以是其他的方式，本申请对此不作具体限定。
另外，如图3所示，在具体实施时，扩展组件10可能通过线缆与主设备组件进行电连接，从而满足扩展组件10自身的供电需求或与主设备组件之间的信号传输需求。在本申请提供的一个实施例中，底壳114上设有与容纳空间113连通的走线孔1141。在具体实 施时，为了提升线缆和走线孔1141之间的密闭性，可以在走线孔1141中填充密封胶等结构。或者也可以在走线孔1141处设置弹性较大的密封圈(如橡胶圈)，当线缆穿设在走线孔1141内后，密封圈可以与线缆和走线孔1141的孔壁密闭贴合，从而保证走线孔1141和线缆之间的密闭性。另外，在一些实施方式中，线缆本身也可以设置相应的密封结构与走线孔1141进行密闭连接。例如，线缆的外周可以设置外螺纹结构，走线孔1141的内壁可以设置内螺纹结构，线缆可以与走线孔1141旋紧后便可实现一定的密闭连接。在具体实施时，也可以在线缆和走线孔1141之间的间隙内填充密封胶以提升防水性能。另外，在具体配置时，走线孔1141处还可以安装接口、连接器等结构，功能电路12可以通过该接口或连接器与主设备组件进行电连接。
可以理解的是，在另外的实施方式中，走线孔1141的数量也可以是两个或者两个以上。另外，走线孔1141的设置位置也并不仅限于设置在底壳114上。例如，走线孔1141也可以设置在外壳112上。
如图4所示，在实际应用时，扩展组件10可能会应用在室外等较为恶劣的环境中，为了提升其使用效果，扩展组件10还可以包括遮蔽罩组件13。遮蔽罩组件13可以罩设在外壳112的外部，以防止外壳112受阳光暴晒而产生温度过高等不良情况。在本申请提供的一个实施例中，遮蔽罩组件13包括遮蔽罩131和遮板132。为了能够清楚示出遮蔽罩组件13的主要结构，请结合参考图5。遮蔽罩131可以罩设在壳体11的顶部和外周；且遮蔽罩131的顶部设有通风孔1311。在具体实施时，遮蔽罩131可以盖设在壳体11的顶部，同时，流经散热风道1111的气流也可以通过遮蔽罩131的通风孔1311排出；因此，遮蔽罩131不会对内壳111的散热风道1111起到阻碍的作用，进而不会影响到扩展组件10的散热性能。另外，为了防止树叶等杂质掉落在散热风道1111内造成堵塞。遮板132可以设置在遮蔽罩131的顶部，且遮板132的形状轮廓大于通风孔1311的形状轮廓，以对通风孔1311起到遮挡的作用。另外，为了防止遮板132对散热风道1111形成阻碍，遮板132与遮蔽罩131之间保持有一定的通风间隙133，由散热风道1111的底部进入的气流能够通过该通风间隙133向上排出。具体来说，冷却气流由散热风道1111的底部进入该散热风道1111内后流向顶部，然后经遮蔽罩131的通风孔1311、遮蔽罩131和遮板132之间的通风间隙133后排出。在具体实施时，遮蔽罩131和遮板132之间的通风间隙133可以设置成较为复杂的形状结构，以防止雨水通过该通风间隙133进入散热风道1111内。例如，该通风间隙133中可以设置多个拐角，或者通风间隙133可以设置成形状较为曲折的结构。可以理解的是，遮蔽罩131和遮板132可以是相互独立的结构，也可以是一体的结构。例如，遮蔽罩131和遮板132可以采用注塑成型等工艺进行分别制作，然后采用粘接、螺钉连接等方式进行固定连接。或者，遮蔽罩131和遮板132也可以采用注塑成型等工艺进行成型为一体结构。在具体实施时，遮蔽罩131和遮板132可以采用聚碳酸酯、ABS塑料(包括丙烯腈、丁二烯、苯乙烯的共聚物)等非电磁屏蔽材料制成，从而不会对功能电路产生电磁屏蔽作用，同时，还能够对壳体11起到良好的保护和遮蔽作用。
另外，在一些实施方式中，也可以仅设置遮蔽罩131而省略设置遮板132。或者，在另一些实施方式中，也可以仅设置遮板132而省略遮蔽罩131。或者，在一些室内环境中，也可以省略上述遮蔽罩组件13。
在实际应用时，为了利用热气流上升的原理来提升扩展组件10的散热性，当扩展组件10固定在安装位置后，散热风道1111可以保持竖直或倾斜的姿态，以使散热风道1111 内的热气流能够顺利的向上排出。
另外，如图5所示，为了提升扩展组件10的散热性能和安装姿态的灵活性。在另一些实施方式中，扩展组件10中还可以设置散热风扇14。例如，可以将散热风扇14固定安装在散热风道1111内或者其他位置，以提升流经散热风道1111的气流的流动速度，进而提升扩展组件10的散热能力。在具体实施时，散热风扇14可以选择防水、防尘、防震等性能较强的类型，以提升散热风扇14的可靠性和稳定性。
在具体实施时，扩展组件10可以与多种类型的主设备组件进行适配，以扩展或提升对应主设备组件的功能性。在具体实施时，主设备组件可以是室外基站(如用于收发无线信号的基站)摄像机等。另外，扩展组件10在与主设备组件进行匹配安装时，不需要对主设备组件进行拆装，从而不会影响到主设备组件的密闭性和可靠性。另外，当主设备组件存在不同的功能需求时，只需要在扩展组件10中加装相应的功能电路即可，从而具备较强的灵活性。能有效防止功能不全或功能冗余等不良情况的发生。
另外，本申请实施例提供的扩展组件10不仅不会降低主设备组件本身的散热性能，在一些情况下，扩展组件10还可以增加主设备组件的散热性能。例如，当扩展组件10固定安装在主设备组件的外壳上时，可以在主设备外壳和扩展组件10的壳体11之间设置与散热风道1111连通的第一安装间隙，当散热风道1111内存在冷却气流时，能够提升第一安装间隙内气流的流速，从而提升主设备组件的散热性能。或者，当扩展组件10通过支架与主设备组件固定连接时，可以在主设备外壳和支架之间设置与散热风道1111连通的第二安装间隙，当散热风道1111内存在冷却气流时，能够提升第一安装间隙内气流的流速，从而提升主设备组件的散热性能。下面将主设备组件为摄像组件为例进行具体说明。
例如，如图6所示，在本申请提供的一种摄像机20中，包括摄像组件21和支架22，摄像组件21可以通过支架22固定在安装位置(如墙壁、道路监控杆)。具体来说，摄像组件21可以通过吊装的形式固定安装在支架22的下侧，且摄像组件21和支架22之间具有一定的第二安装间隙23a(即主设备外壳和支架22之间具有第二安装间隙23a)。扩展组件10可以固定在支架22的上侧。如图7所示，支架22具有贯通上、下两端的连接风道221。该连接风道221的上端可以与散热风道1111的下端对接，该连接风道221的下端与该第二安装间隙23a连通。概括来说，位于支架22上的连接风道221可以接通该第二安装间隙23a和扩展组件10的散热风道1111。冷却气流首先会从该第二安装间隙23a进入连接风道221，经连接风道221后冷却气流流入散热风道1111，然后从散热风道1111的上端排出。通过这种结构设置，能够增加流经摄像组件21的气流的流速，从而能够有效提升摄像组件的散热效果。具体来说，摄像组件21可以利于散热风道1111的烟囱效应来增加流经摄像组件21的上侧气流的流速，从而可以快速带走摄像组件21所产生的热量。另外，当散热风道1111内安装有散热风扇时，也会有效增加流经摄像组件21的气流的流速，同样能够快速带走摄像组件21所产生的热量。即，扩展组件10不仅不会降低摄像组件21的散热性能，还能够明显提升摄像组件21的散热性能。
在具体实施时，摄像组件21和扩展组件10之间的安装方式和相对位置也可以灵活设置。
例如，图8示出了摄像机20的简化结构的示意图，扩展组件10可以直接安装在摄像组件21的上侧，且扩展组件10和摄像组件21之间也可以设置一定的第一安装间隙23b(即主设备外壳和扩展组件10的壳体11之间设有第一安装间隙23b)。具体来说，冷却气 流可以由该第一安装间隙23b直接进入散热风道1111内，然后由散热风道1111的顶部排出。
请继续参阅图8，当扩展组件10中安装有遮蔽罩组件13时，遮蔽罩131的下端可以延伸至摄像机20(如底座211)的外围，且遮蔽罩131和摄像机20之间可以保持有一定的间隙。外界气流可以由该间隙进入该第一安装间隙23b内并向上流经散热风道1111。气流由散热风道1111的顶部排出后流向遮板132，并通过遮板132和遮蔽罩131之间的间隙向外界排出。
在具体实施时，为了有效提升摄像组件21的散热性，位于摄像组件21内的发热元器件可以安装在靠近该第一安装间隙23b的位置设置。例如，在本申请提供的实施例中，摄像组件21的外壳包括底座211和球罩212。底座211和球罩212可以围成用于安装镜头24的密闭空间，以对镜头24形成良好的保护作用。另外，主体电路213中的发热元器件可以通过导热垫或导热胶与底座211进行热接触，以提升发热元器件的散热性。
如图9所示，在具体实施时，底座211中可以设置金属底板2111，底座211(或摄像组件21)可以通过该金属底板2111与支架22固定连接，且金属底板2111和支架22之间可以保持有一定的安装间隙。在实际应用时，为了提升主体电路213的散热性，主体电路213可以贴合在金属底板2111的一侧。另外，在具体配置时，底座211上还可以设置接口或连接器等结构，主体电路213可以通过该接口或连接器与扩展组件10中的功能电路12进行电连接。
可以理解的是，在具体实施时，支架22的形状构造可以是多样的。另外，摄像组件21和扩展组件10可以均通过支架22固定在安装位置；或者，摄像组件21可以通过支架22固定在安装位置，扩展组件10可以直接固定在摄像组件21上；或者，扩展组件10可以通过支架22固定在安装位置，摄像组件21可以直接固定在扩展组件10上。如图10所示，在具体实施时，为了避免遮蔽罩131与支架22形成干涉，遮蔽罩131可以设置供支架22的横梁穿设的缺口(图中未示出)，以使遮蔽罩131能够顺利的盖设在摄像组件21的外围。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (33)

  1. 一种电子设备，其特征在于，包括主设备组件和扩展组件；
    所述主设备组件包括主体电路；
    所述扩展组件包括一个或多个功能电路以及壳体；所述一个或多个功能电路中的至少一个与所述主体电路电连接；所述壳体包括内壳和外壳；
    所述内壳的内周形成散热风道；
    所述外壳设置在所述内壳的外周，且所述内壳和所述外壳围成容纳空间；
    所述功能电路设置在所述容纳空间内并且与所述内壳热接触，从而通过所述散热风道中的气流来对所述功能电路进行散热。
  2. 根据权利要求1所述的电子设备，其特征在于，所述主设备组件与所述扩展组件通过可拆卸方式连接。
  3. 根据权利要求2所述的电子设备，其特征在于，所述主设备组件包括主设备外壳，所述主体电路设置在所述主设备外壳内；
    所述主设备外壳与所述壳体可拆卸式连接。
  4. 根据权利要求3所述的电子设备，其特征在于，所述主设备外壳和所述壳体之间具有第一安装间隙，所述第一安装间隙与所述散热风道的一端连通。
  5. 根据权利要求2所述的电子设备，其特征在于，所述主设备组件包括主设备外壳；
    所述壳体通过支架与所述主设备外壳可拆卸式连接；
    所述主设备外壳和所述支架之间具有第二安装间隙；
    所述支架包括连接风道，所述连接风道的一端与所述散热风道的一端对接，所述连接风道的另一端与所述第二安装间隙连通。
  6. 根据权利要求4所述的电子设备，其特征在于，所述主设备外壳包括底座，所述底座位于所述第一安装间隙的一侧；
    所述主体电路包括发热元器件，所述发热元器件与所述底座热接触，从而通过所述第一安装间隙中的气流对所述发热元器件进行散热。
  7. 根据权利要求5所述的电子设备，其特征在于，所述主设备外壳包括底座，所述底座位于所述第二安装间隙的一侧；
    所述主体电路包括发热元器件，所述发热元器件与所述底座热接触，从而通过所述第二安装间隙中气流对所述发热元器件进行散热。
  8. 根据权利要求1至7中任意一项所述的电子设备，其特征在于，所述功能电路包括发热元器件，所述发热元器件与所述内壳热接触。
  9. 根据权利要求1至8中任意一项所述的电子设备，其特征在于，所述扩展组件的壳体还包括底壳和上盖；
    所述外壳套设在所述内壳的外周；
    所述内壳的第一端和所述外壳的第一端通过所述底壳密闭连接；
    所述内壳的第二端和所述外壳的第二端通过所述上盖密闭连接；
    其中，所述底壳具有供所述散热风道的一端与外界连通的第一通孔，所述上盖具有供所述散热风道的另一端与外界连接的第二通孔。
  10. 根据权利要求9所述的电子设备，其特征在于，所述第二通孔的内边缘设有内螺纹， 所述内壳的第二端设有外螺纹，所述内壳的第二端和所述上盖通过所述内螺纹和所述外螺纹螺接。
  11. 根据权利要求9或10所述的电子设备，其特征在于，所述上盖和所述外壳构造为一体结构。
  12. 根据权利要求9至11中任意一项所述的电子设备，其特征在于，所述底壳和所述内壳构造为一体结构。
  13. 根据权利要求9至12中任意一项所述的电子设备，其特征在于，所述底壳具有走线孔，所述走线孔与所述容纳空间连通。
  14. 根据权利要求1至13中任意一项所述的电子设备，其特征在于，所述内壳由金属材料制成。
  15. 根据权利要求1至14中任意一项所述的电子设备，其特征在于，所述功能电路包括无线通信电路；
    所述外壳由非电磁屏蔽材料制成。
  16. 根据权利要求1至15中任意一项所述的电子设备，其特征在于，还包括遮蔽罩；
    所述遮蔽罩罩设在所述壳体的顶部和外周，且所述遮蔽罩的顶部具有与所述散热风道连通的通风孔。
  17. 根据权利要求16所述的电子设备，其特征在于，当所述功能电路包括无线通信电路时，所述遮蔽罩由非电磁屏蔽材料制成。
  18. 根据权利要求16或17所述的电子设备，其特征在于，所述遮蔽罩还罩设在所述外壳的外周，且所述遮蔽罩与所述外壳之间具有间隙。
  19. 根据权利要求16至18中任意一项所述的电子设备，其特征在于，还包括遮板；
    所述遮板盖设所述遮蔽罩顶部的通风孔，且所述遮板和所述遮蔽罩之间设有通风间隙。
  20. 根据权利要求1至19中任意一项所述的电子设备，其特征在于，所述扩展组件还包括散热风扇；
    所述散热风扇设置在所述散热风道内。
  21. 一种扩展组件，其特征在于，所述扩展组件用于与主设备组件可拆卸连接；
    所述扩展组件包括一个或多个功能电路以及壳体；所述一个或多个功能电路中的至少一个与所述主设备组件中的主体电路电连接；所述壳体包括内壳和外壳；
    所述内壳的内周形成散热风道；
    所述外壳设置在所述内壳的外周，且所述内壳和所述外壳围成容纳空间；
    所述功能电路设置在所述容纳空间内并且与所述内壳热接触，从而通过所述散热风道中的气流对所述功能电路进行散热。
  22. 根据权利要求21所述的扩展组件，其特征在于，所述功能电路包括发热元器件；
    所述发热元件器与所述内壳热接触。
  23. 根据权利要求21或22所述的扩展组件，其特征在于，所述扩展组件的壳体还包括底壳和上盖；
    所述外壳套设在所述内壳的外周；
    所述内壳的第一端和所述外壳的第一端通过所述底壳密闭连接；
    所述内壳的第二端和所述外壳的第二端通过所述上盖密闭连接；
    其中，所述底壳具有供所述散热风道的一端与外界连通的第一通孔，所述上盖具有供 所述散热风道的另一端与外界连接的第二通孔。
  24. 根据权利要求23所述的扩展组件，其特征在于，所述第二通孔的内边缘设有内螺纹，所述内壳的第二端设有外螺纹，所述内壳的第二端和所述上盖通过所述内螺纹和所述外螺纹螺接。
  25. 根据权利要求23或24所述的扩展组件，其特征在于，所述上盖和所述外壳构造为一体结构。
  26. 根据权利要求23至25中任意一项所述的扩展组件，其特征在于，所述底壳和所述内壳构造为一体结构。
  27. 根据权利要求23至26中任意一项所述的扩展组件，其特征在于，所述底壳具有走线孔，所述走线孔与所述容纳空间连通。
  28. 根据权利要求21至27中任意一项所述的扩展组件，其特征在于，所述内壳由金属材料制成。
  29. 根据权利要求21至28中任意一项所述的扩展组件，其特征在于，所述功能电路包括无线通信电路；
    所述外壳由非电磁屏蔽材料制成。
  30. 根据权利要求21至29中任意一项所述的扩展组件，其特征在于，还包括遮蔽罩；
    所述遮蔽罩罩设在所述壳体的顶部和外周，且所述遮蔽罩的顶部具有与所述散热风道连通的通风孔。
  31. 根据权利要求30所述的扩展组件，其特征在于，当所述功能电路包括无线通信电路时，所述遮蔽罩由非电磁屏蔽材料制成。
  32. 根据权利要求30或31所述的扩展组件，其特征在于，还包括遮板；
    所述遮板盖设所述遮蔽罩顶部的通风孔，且所述遮板和所述遮蔽罩之间设有通风间隙。
  33. 根据权利要求21至32中任意一项所述的扩展组件，其特征在于，所述扩展组件还包括散热风扇；
    所述散热风扇设置在所述散热风道内。
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