WO2024007154A1 - 内存扩展装置 - Google Patents

内存扩展装置 Download PDF

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Publication number
WO2024007154A1
WO2024007154A1 PCT/CN2022/103933 CN2022103933W WO2024007154A1 WO 2024007154 A1 WO2024007154 A1 WO 2024007154A1 CN 2022103933 W CN2022103933 W CN 2022103933W WO 2024007154 A1 WO2024007154 A1 WO 2024007154A1
Authority
WO
WIPO (PCT)
Prior art keywords
memory expansion
expansion device
heat dissipation
housing
card
Prior art date
Application number
PCT/CN2022/103933
Other languages
English (en)
French (fr)
Inventor
毛丹芸
杨佳俊
陈兴全
肖杰
Original Assignee
深圳市显盈科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市显盈科技股份有限公司 filed Critical 深圳市显盈科技股份有限公司
Priority to CN202280002122.7A priority Critical patent/CN115552354A/zh
Priority to PCT/CN2022/103933 priority patent/WO2024007154A1/zh
Publication of WO2024007154A1 publication Critical patent/WO2024007154A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means

Definitions

  • the present application relates to the field of computer technology, and specifically to a memory expansion device.
  • a computer commonly known as a computer, is an electronic computing machine used for high-speed calculations. It can perform numerical calculations, logical calculations, and has a storage and memory function.
  • the purpose of the embodiments of the present application is to include but not be limited to solving the technical problem in the prior art that when the memory expansion dock is in contact with the computer host, the memory expansion dock will cover some of the heat dissipation holes on the computer host, thereby affecting the heat dissipation of the computer host. .
  • a memory expansion device including:
  • the housing is provided with a contact surface, a heat dissipation surface and a heat conduction port.
  • An accommodation cavity is provided in the housing.
  • the heat conduction port penetrates the contact surface and the heat dissipation surface and is separated from the accommodation cavity. settings;
  • a memory expansion component is provided in the accommodation cavity.
  • the contact surface is arranged opposite to the heat dissipation surface, and the housing is also provided with a plurality of air inlet holes and a plurality of air outlet holes, and the air inlet holes and the air outlet holes are connected with the The accommodating cavity is connected and located on the side of the heat dissipation surface.
  • the circumferential area of the heat dissipation surface corresponding to the heat conduction port is recessed toward the contact surface to form a flow guide groove, and the heat dissipation surface corresponds to the circumference of the air inlet hole and the air outlet hole. The area is inclined towards the guide channel.
  • a plurality of anti-slip feet are further included, and a plurality of the anti-slip feet are arranged at intervals on the heat dissipation surface.
  • the contact surface includes a middle region, a transition region and an edge region.
  • the transition region surrounds the periphery of the middle region.
  • the edge region surrounds the periphery of the transition region.
  • the accommodation cavity and The middle area is arranged correspondingly, the heat conduction port is arranged correspondingly to the transition area, a wiring cavity is provided in the housing, the wiring cavity is arranged correspondingly to the edge area, and is connected with the accommodation cavity.
  • the middle area is recessed relative to the edge area to form a placement groove.
  • the transition area is arranged obliquely relative to the edge area, and the transition area is toward the center of the middle area.
  • the housing includes a face shell and a bottom shell.
  • the bottom shell is cooperatively connected with the face shell to surround the accommodation cavity and the wiring cavity.
  • the face shell faces away from the The side of the bottom shell is the contact surface, the side of the bottom shell away from the face shell is the heat dissipation surface, and the heat conduction port penetrates the face shell and the bottom shell.
  • one of the front case and the bottom case is provided with a slot
  • the other of the front case and the bottom case is provided with a buckle
  • the buckle is connected to the
  • the card slots are arranged corresponding to the transition area, and the buckles are engaged with the card slots.
  • the front shell is an aluminum shell
  • the bottom shell is a plastic shell
  • the memory expansion component is disposed close to the heat dissipation surface.
  • the memory expansion component includes a circuit board and an expansion card, and the expansion card is detachably disposed on the circuit board.
  • a card holder and an elastic limiting column are provided on the circuit board.
  • the card holder and the elastic limiting column are arranged relatively spaced apart.
  • the expansion card is arranged between the card holder and the elastic limiting column. between elastic limiting columns.
  • the elastic limiting post is silica gel particles.
  • the housing is provided with an installation opening connected to the accommodation cavity, and the installation opening is located on the side of the heat dissipation surface;
  • the memory expansion device further includes a device that is covered with the installation opening.
  • the cover plate; the expansion card is arranged corresponding to the installation port.
  • a plurality of heat dissipation fins are provided on a side of the cover facing away from the accommodation cavity.
  • an indicator light assembly is further included.
  • the indicator light assembly is disposed on the housing and is electrically connected to the circuit board for indicating the working status of the expansion card.
  • the indicator light assembly when the expansion card is not working, displays a first color light; when the expansion card is not assembled on the circuit board, the indicator light assembly displays a second color light. ; When the expansion card is connected normally and can work, the indicator light assembly displays a third color light, and the first color light, the second color light and the third color light are respectively different colors of light.
  • a data transmission line is further included.
  • One end of the data transmission line is electrically connected to the memory expansion component, and the other end extends out of the housing through the peripheral side wall of the housing.
  • the number of the data transmission lines is two, and the two data transmission lines are arranged in parallel.
  • the memory expansion device of the present application includes a housing and a memory expansion component.
  • the memory expansion component is used to store programs and various data to expand the memory of the computer host.
  • the heat on the computer host can be dissipated to the side of the heat dissipation surface through the heat conduction port, so that the heat on the computer host can be dissipated in time, which is conducive to ensuring the heat dissipation of the computer host, and the heat conduction port and the accommodation cavity are separated, effectively preventing the computer from collapsing
  • the dissipated heat enters the accommodation cavity through the heat conduction port and damages the memory expansion component.
  • Figure 1 is a schematic three-dimensional structural diagram of a memory expansion device provided by an embodiment of the present application.
  • Figure 2 is a schematic cross-sectional structural view of the memory expansion device shown in Figure 1;
  • Figure 3 is a schematic diagram 2 of the three-dimensional structure of the memory expansion device provided by the embodiment of the present application.
  • FIG. 4 is an exploded view of the memory expansion device shown in FIG. 3 .
  • the memory expansion device is used to expand the memory of a computer host to improve the running speed and fluency of the computer host.
  • the computer host is Mac Sdudio.
  • the memory expansion device of the present application is mainly adapted to Mac Sdudio, that is, the applied memory expansion device is used to expand the memory of Mac Sdudio.
  • the memory expansion device also It can be used as a special base for Mac Sdudio to support Mac Sdudio.
  • the memory expansion device includes a housing 10 and a memory expansion component 30 .
  • the housing 10 is provided with a contact surface 11, a heat dissipation surface 12 and a heat conduction port 14.
  • the housing 10 is provided with a receiving cavity 13.
  • the heat conduction port 14 penetrates the contact surface 11 and the heat dissipation surface 12 and is separated from the receiving cavity 13. It can be understood that the heat conduction port 14 is not connected with the accommodation cavity 13 .
  • the memory expansion component 30 is disposed in the accommodation cavity 13 and is used to store programs and various data.
  • the computer host When in use, the computer host is placed on the contact surface 11 of the casing 10. Some of the heat dissipation holes on the bottom of the computer host are connected with the heat conduction ports 14 on the casing 10, so that the computer host can dissipate heat through the heat conduction ports 14. It can be understood that Therefore, the heat emitted by the computer host through the heat dissipation holes corresponding to the heat conduction holes 14 can be dissipated to the side of the heat dissipation surface 12 of the casing 10 through the heat conduction holes 14. At the same time, the cold air flow on the side of the heat dissipation surface 12 can also pass through the heat conduction holes. The heat dissipation holes corresponding to the heat conduction ports 14 on the computer host flow into the computer host.
  • the memory expansion component 30 is electrically connected to the computer host to expand the memory of the computer host.
  • the memory expansion device includes a casing 10 and a memory expansion component 30.
  • the memory expansion component 30 is used to store programs and various data to expand the memory of the computer host.
  • the heat conduction ports 14 on the computer host are connected correspondingly, so that the heat on the computer host can be dissipated to the side of the heat dissipation surface 12 through the heat conduction port 14, so that the heat on the computer host can be dissipated in time, which is beneficial to ensuring the heat dissipation of the computer host and the heat conduction
  • the opening 14 is separated from the accommodation cavity 13 to effectively prevent the heat dissipated by the computer from entering the accommodation cavity 13 through the heat conduction opening
  • the contact surface 11 includes a middle region 110, a transition region 111 and an edge region 112.
  • the transition region 111 surrounds the periphery of the middle region 110
  • the edge region 112 surrounds the periphery of the transition region 111.
  • the accommodation cavity 13 and The middle area 110 is arranged correspondingly, and the heat conduction port 14 is arranged correspondingly in the transition area 111.
  • a wiring cavity 15 is provided in the housing 10.
  • the wiring cavity 15 is arranged correspondingly to the edge area 112, and is connected with the accommodation cavity 13, and the wiring cavity 15 Separated from the heat conduction port 14 , the wiring cavity 15 is used for wiring the memory expansion component 30 .
  • the wire hole is spaced apart from the heat conduction port 14, that is, the wire hole is not connected to the heat conduction port 14.
  • the wire hole connects the accommodation cavity 13 and the wiring cavity 15, thereby achieving The wiring cavity 15 is connected with the accommodation cavity 13 .
  • the middle area 110 is recessed relative to the edge area 112 to form a placement groove 113, so that the bottom part of the computer host can be placed exactly in the placement groove 113, thereby making the computer host more stable. on the contact surface 11.
  • the transition area 111 is inclined relative to the edge area 112, and the transition area 111 faces the center of the middle area 110, so that the transition area 111 matches the inclined part of the bottom of the computer host, and the inclined part of the bottom of the computer host is provided with heat dissipation holes, so that By matching the transition area 111 with the inclined portion of the bottom of the computer main body, the heat conduction port 14 can better correspond to the heat dissipation holes on the bottom of the computer main body.
  • the shapes of the middle area 110, the edge area 112 and the transition area 111 are set according to the bottom shape of the adapted computer host, and are not limited here.
  • the housing 10 is in a rectangular shape, that is, the edge area 112 is a rectangle, and the middle area 110 and the transition area 111 are both circular.
  • the housing 10 can also be other polygons, triangles or ellipses, that is, the edge area 112 can also be other polygons, triangles or ellipses, etc.
  • the middle area 110 and the transition area 111 can also be polygons, triangles, etc. Or oval, etc.
  • the number of heat conduction ports 14 is four, and the four heat conduction ports 14 are equally spaced along the circumferential direction of the transition region 111 .
  • the heat conduction port 14 is in an arc shape and extends along the circumferential direction of the contact surface 11 . Specifically, the heat conduction opening 14 extends along the circumferential direction of the transition area 111 .
  • the contact surface 11 and the heat dissipation surface 12 are arranged oppositely, that is, the contact surface 11 and the heat dissipation surface 12 are respectively two opposite sides of the housing 10 . It can be understood that the heat dissipation surface 12 is arranged away from the contact surface 11 .
  • the contact surface 11 is the top surface of the housing 10
  • the heat dissipation surface 12 is the bottom surface of the housing 10 .
  • the heat dissipation surface 12 may also be a peripheral side surface of the housing 10 , that is, the heat dissipation surface 12 and the contact surface 11 are arranged adjacent to each other.
  • the heat dissipation surface 12 and the heat dissipation surface 12 are located on the same side of the housing 10 , and the heat dissipation surface 12 is not in contact with the computer host. It can be understood that the heat dissipation surface 12 can be any surface of the housing 10 , as long as the heat in the heat conduction port 14 can be dissipated to the outside through the heat dissipation surface 12 .
  • the housing 10 is also provided with a plurality of air inlets 120 and a plurality of air outlets 121 .
  • the air inlets 120 and the air outlets 121 are both connected to the accommodation cavity 13 and are located on the heat dissipation surface 12
  • the air inlet hole 120 and the air outlet hole 121 are respectively provided on opposite sides of the housing 10 corresponding to the middle area 110 .
  • the outside air enters into the accommodation cavity 13 through the air inlet hole 120 and is then discharged through the air outlet hole 121 , so that the air inlet hole 120 and the air outlet hole 121 form air convection to take away the heat in the accommodation cavity 13 , thereby realizing the control of the inside of the accommodation cavity 13 .
  • the memory expansion component 30 dissipates heat, lowers the temperature of the memory expansion component 30 when used, and avoids high temperature damage. At the same time, the heat of the effective housing 10 is too high and the user is scalded.
  • the circumferential area of the heat dissipation surface 12 corresponding to the heat conduction port 14 is recessed toward the contact surface 11 to form a flow guide groove 122 , that is, the flow guide groove 122 is annular along the circumferential direction of the housing 10 . It can be understood that the flow guide groove 122 is connected with the heat conduction port 14 .
  • the circumferential area of the heat dissipation surface 12 corresponding to the air inlet hole 120 and the air outlet hole 121 is inclined toward the direction of the flow guide groove 122 . It can be understood that the guide groove 122 is connected with the air inlet hole 120 and the air outlet hole 121 .
  • the housing 10 is provided with an installation opening 123 , which is connected with the accommodation cavity 13 .
  • the installation opening 123 is located on the side of the heat dissipation surface 12 ; the expansion of the memory expansion component 30 is installed or removed through the installation opening 123 .
  • Card 32 is provided with an installation opening 123 , which is connected with the accommodation cavity 13 .
  • the installation opening 123 is located on the side of the heat dissipation surface 12 ; the expansion of the memory expansion component 30 is installed or removed through the installation opening 123 .
  • Card 32 is provided with an installation opening 123 , which is connected with the accommodation cavity 13 .
  • the housing 10 includes a face shell 16 and a bottom shell 17 .
  • the bottom shell 17 and the face shell 16 are cooperatively connected to form a receiving cavity 13 and a wiring cavity 15 .
  • the side of the surface shell 16 facing away from the bottom shell 17 is the contact surface 11
  • the side of the bottom shell 17 facing away from the face shell 16 is the heat dissipation surface 12
  • the heat conduction port 14 runs through the face shell 16 and the bottom shell 17, the air inlet, the air outlet and the installation
  • the ports 123 are all located on the bottom shell 17 .
  • One of the front case 16 and the bottom case 17 is provided with a latching slot 160
  • the other one of the front case 16 and the bottom case 17 is provided with a buckle 170 .
  • Both the buckle 170 and the latching groove 160 are arranged corresponding to the transition area 111 , the buckle 170 is engaged with the card slot 160 .
  • the front case 16 is provided with a buckle 160
  • the bottom case 17 is provided with a buckle 170.
  • the buckle 170 and the buckle 160 correspond to the transition area 111, and the buckle 170 cooperates with the buckle 160.
  • Card access
  • the front case 16 is provided with a buckle 170
  • the bottom case 17 is provided with a buckle 160 .
  • the buckle 170 and the buckle 160 correspond to the transition area 111 , and the buckle 170 cooperates with the buckle 160 .
  • the surface shell 16 is an aluminum shell. It can be understood that the surface shell 16 is made of aluminum alloy, which is beneficial to heat dissipation of the memory expansion component 30 and the computer host.
  • the bottom case 17 is a plastic case. It can be understood that the bottom case 17 is made of plastic material. Optionally, the plastic material of the bottom case 17 may be acrylonitrile-butadiene-styrene plastic (ABS for short).
  • the memory expansion device also includes a cover plate 20 that detachably covers the installation opening 123 . It can be understood that by opening the cover 20 , the user can install or remove the expansion card 32 through the installation opening 123 , which facilitates the user to replace the expansion card 32 .
  • a plurality of heat dissipation fins 21 are provided on the side of the cover 20 away from the accommodation cavity 13, and the plurality of heat dissipation fins 21 are spaced apart. By arranging a plurality of heat dissipation fins 21 on the cover 20 , heat dissipation of the memory expansion component 30 is facilitated.
  • cover plate 20 and the heat dissipation fins 21 are made of aluminum alloy.
  • the memory expansion device further includes a plurality of anti-slip feet 60 .
  • the plurality of anti-slip feet 60 are spaced on the heat dissipation surface 12 of the bottom case 17 .
  • the anti-slip feet 60 correspond to the edge area 112 .
  • the number of anti-slip feet 60 is four, and the four anti-slip feet 60 are respectively provided at the four corners of the bottom case 17 .
  • the memory expansion component 30 is disposed close to the heat dissipation surface 12 .
  • the memory expansion assembly 30 is disposed close to the bottom case 17 . It can be understood that when in use, the computer host will generate heat and transfer it to the contact surface 11, and the memory expansion component 30 will also generate heat. Therefore, by placing the memory expansion component 30 close to the heat dissipation surface 12, that is, the memory expansion component 30 will be far away from the contact surface. 11 is set to separate the memory expansion component 30 from the computer host, effectively preventing cross-transfer of heat between the memory expansion component 30 and the computer host.
  • the memory expansion assembly 30 includes a circuit board 31 and an expansion card 32 .
  • the circuit board 31 is disposed in the receiving cavity 13 and is disposed close to the heat dissipation surface 12 .
  • the expansion card 32 is detachably disposed on the circuit board 31 to realize electrical connection between the expansion card 32 and the circuit board 31.
  • the expansion card 32 is disposed corresponding to the installation port 123, so that the expansion card 32 can be disassembled and assembled by opening the cover 20.
  • the circuit board 31 is sandwiched between the front case 16 and the bottom case 17 .
  • the surface case 16, the circuit board 31, and the bottom case 17 are connected in sequence through screws.
  • the circuit board 31 is PCBA.
  • PCBA is the abbreviation of Printed Circuit Board Assembly in English. It is the entire process of the PCB blank board passing through SMT upper parts or DIP plug-ins.
  • the number of expansion cards 32 is two, and the two expansion cards 32 are arranged side by side and spaced apart.
  • the expansion card 32 may be a conventional M.2 PCIE card on the market.
  • the circuit board 31 is provided with a card holder 33 and an elastic limiting column 34 .
  • the card holder 33 and the elastic limiting column 34 are relatively spaced apart.
  • the expansion card 32 is clamped between the card holder 33 and the elastic limiting column 34 . between.
  • the card holder 33 is provided with a limiting slot, and one end of the expansion card 32 can be inserted into the limiting slot.
  • the elastic limiting post 34 is made of silica gel particles.
  • the silica gel particles are soft materials and have good elasticity.
  • the elastic limiting post 34 can deform to adjust the distance between the elastic limiting post 34 and the card base 33, so that the expansion can be
  • the card 32 is limited between the card base 33 and the elastic limiting column 34 .
  • the memory expansion device further includes an indicator light assembly 40 .
  • the indicator light assembly 40 is disposed on the housing 10 and is electrically connected to the circuit board 31 .
  • the indicator light assembly 40 is used to indicate the expansion card 32 working status.
  • the indicator light assembly 40 displays the first color light.
  • the indicator light assembly 40 displays the second color light.
  • the indicator light assembly 40 displays the third color light.
  • the first color light, the second color light and the third color light are respectively different colors of light.
  • the first color light is red light
  • the second color light is yellow light
  • the third color light is green light
  • the housing 10 is provided with a light-transmitting hole 18.
  • the light-transmitting hole 18 is provided on the side wall of the housing 10.
  • the light-transmitting hole 18 is connected to the wiring cavity 15.
  • the indicator light assembly 40 includes a flexible circuit board 41 (Flexible circuit board 41). Printed Circuit board (FPC for short) and foam 42.
  • FPC Printed Circuit board
  • One end of the flexible circuit board 41 is located in the receiving cavity 13 and is electrically connected to the circuit board 31.
  • the other end of the flexible circuit board 41 extends into the wiring cavity 15 through the wire hole. , and are arranged corresponding to the light-transmitting hole 18 , and an indicator light is provided on one end of the flexible circuit board 41 corresponding to the light-transmitting hole 18 .
  • the indicator light lights up red, it means that the expansion card 32 is not working. If the indicator light lights up yellow, it means that the expansion card 32 is not assembled. If the indicator light is green, it means that the expansion card 32 is connected normally and can work.
  • the first color light, the second color light, and the third color light can also be light of other different colors, and this application is not limited thereto.
  • Foam 42 is arranged in the wiring cavity 15. Foam 42 is arranged between the flexible circuit board 41 and the light-transmitting hole 18. The foam 42 is used to protect the flexible circuit board. 41, the foam 42 also has a semi-shielding effect, which prevents the indicator light from transmitting light from parts outside the light-transmitting hole 18 of the housing 10, which is beneficial to ensuring the consistency of the appearance brightness of the housing 10.
  • the memory expansion device also includes a data transmission line 50.
  • One end of the data transmission line 50 is electrically connected to the memory expansion component 30, and the other end of the data transmission line 50 passes through the shell.
  • the outer peripheral side wall of the body 10 extends out of the casing 10 and is used for electrical connection with the computer host. That is, the memory expansion component 30 is electrically connected with the computer host through the data transmission line 50 .
  • one end of the data transmission line 50 is located in the accommodation cavity 13 and is electrically connected to the circuit board 31 .
  • the other end of the data transmission line 50 sequentially passes through the wire hole, the wiring cavity 15 and the outer peripheral side wall of the housing 10 and extends to outside the housing 10.
  • the memory expansion device has its own data transmission line 50, so when the memory expansion device is used, one end of the data transmission line 50 is extended out of the housing 10 and plugged into the computer host, so that the memory expansion device is electrically connected to the computer host without additional wiring. , convenient for users to use.
  • the number of data transmission lines 50 is two. By setting two data transmission lines 50 , dual-line input is achieved and double-rate transmission is performed. The transmission efficiency is high, which is conducive to improving the user experience.
  • the data transmission line 50 is a Type-c wire.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请公开一种内存扩展装置，该内存扩展装置包括壳体（10）及内存扩展组件（30），壳体（10）上设有接触面（11）、散热面（12）及导热口（14），壳体（10）内设有容纳腔（13），导热口（14）贯穿接触面（11）及散热面（12），并与容纳腔（13）分隔设置；内存扩展组件（30）设置在容纳腔（13）内。当壳体的接触面与计算机主机的外表面接触时，计算机主机底部上的部分散热孔与壳体（10）上的导热口（14）对应连通，从而计算机主机上的热量能够通过导热口（14）散发至散热面（12）的所在侧，以使计算机主机上的热量能够及时散发，有利于保证计算机主机的散热性。

Description

内存扩展装置 技术领域
本申请涉及计算机技术领域，具体涉及一种内存扩展装置。
 背景技术
随着微电子技术和工业信息化的发展，计算机在各领域的应用越来越广泛。计算机俗称电脑，是一种用于高速计算的电子计算机器，可以进行数值计算，又可以进行逻辑计算，还具有存储记忆功能。
目前，同时随着计算机的迅速发展，现有计算机系统对存储容量的要求越来越高，在使用计算机过程中，会出现内存容量不足的现象，需要进行内存容量扩展来满足数据中心业务需求，从而内存扩展坞应运而生。
 技术问题
本申请实施例的目在于包括但不限于解决现有技术中存在的内存扩展坞与计算机主机接触时，内存扩展坞会遮住计算机主机上的部分散热孔，从而影响计算机主机散热性的技术问题。
 技术解决方案
本申请实施例采用的技术方案是：
提供了一种内存扩展装置，包括：
壳体，所述壳体上设有接触面、散热面及导热口，所述壳体内设有容纳腔，所述导热口贯穿所述接触面及所述散热面，并与所述容纳腔分隔设置；及
内存扩展组件，所述内存扩展组件设置在所述容纳腔内。
在一个实施例中，所述接触面与所述散热面相对设置，所述壳体上还设有多个进气孔及多个出气孔，所述进气孔及所述出气孔均与所述容纳腔连通，并位于所述散热面的所在侧。
在一个实施例中，所述散热面对应导热口的周向区域朝所述接触面方向凹陷，以形成导流槽，所述散热面对应所述进气孔及所述出气孔的周向区域朝所述导流槽方向倾斜。
在一个实施例中，还包括多个防滑垫脚，多个所述防滑垫脚间隔设置在所述散热面上。
在一个实施例中，所述接触面包括中间区域、过渡区域及边缘区域，所述过渡区域环绕于所述中间区域的外围，所述边缘区域环绕所述过渡区域的外围，所述容纳腔与所述中间区域对应设置，所述导热口与所述过渡区域对应设置，所述壳体内设有走线腔，所述走线腔与所述边缘区域对应设置，并与所述容纳腔连通。
在一个实施例中，所述中间区域相对所述边缘区域凹陷设置，以形成放置槽。
在一个实施例中，所述过渡区域相对所述边缘区域倾斜设置，且所述过渡区域朝向所述中间区域的中心。
在一个实施例中，所述壳体包括面壳及底壳，所述底壳与所述面壳配合连接，以围设成所述容纳腔及所述走线腔，所述面壳背离所述底壳的侧面为所述接触面，所述底壳背离所述面壳的侧面为所述散热面，所述导热口贯穿于所述面壳及所述底壳。
在一个实施例中，所述面壳和所述底壳中的其中一个上设有卡槽，所述面壳和所述底壳中的另一个上设置有卡扣，所述卡扣及所述卡槽均与过渡区域对应设置，所述卡扣与所述卡槽配合卡接。
在一个实施例中，所述面壳为铝壳，所述底壳为塑壳。
在一个实施例中，所述内存扩展组件靠近所述散热面设置。
在一个实施例中，所述内存扩展组件包括电路板及扩展卡，所述扩展卡可拆卸设置在所述电路板上。
在一个实施例中，所述电路板上设置有卡座及弹性限位柱，所述卡座与所述弹性限位柱相对间隔设置，所述扩展卡卡设于所述卡座与所述弹性限位柱之间。
在一个实施例中，所述弹性限位柱为硅胶粒。
在一个实施例中，所述壳体上设有与所述容纳腔连通的安装口，所述安装口位于所述散热面的所在侧；所述内存扩展装置还包括盖合于所述安装口的盖板；所述扩展卡与所述安装口对应设置。
在一个实施例中，所述盖板背离所述容纳腔的侧面上设置有多个散热鳍片。
在一个实施例中，还包括指示灯组件，所述指示灯组件设置在所述壳体上，并与所述电路板电连接，用于指示所述扩展卡的工作状态。
在一个实施例中，当所述扩展卡不工作时，所述指示灯组件显示第一颜色光；当所述电路板上未组装所述扩展卡时，所述指示灯组件显示第二颜色光；当所述扩展卡正常连接并可以工作时，所述指示灯组件显示第三颜色光，所述第一颜色光、所述第二颜色光及所述第三颜色光分别不同颜色的光。
在一个实施例中，还包括数据传输线，所述数据传输线的一端与所述内存扩展组件电连接，另一端穿过所述壳体的外周侧壁伸出至所述壳体外。
在一个实施例中，所述数据传输线的数量为两个，两个所述数据传输线并列设置。
 有益效果
本申请实施例提供的内存扩展装置的有益效果在于：本申请的内存扩展装置包括壳体及内存扩展组件，内存扩展组件用于存储程序和各种数据，以对计算机主机进行内存扩展。通过在壳体上开设贯穿于接触面及散热面的导热口，当壳体的接触面与计算机主机的外表面接触时，计算机主机底部上的部分散热孔与壳体上的导热口对应连通，从而计算机主机上的热量能够通过导热口散发至散热面的所在侧，以使计算机主机上的热量能够及时散发，有利于保证计算机主机的散热性，且导热口与容纳腔分隔设置，有效防止计算机散热出的热量经导热口进入至容纳腔内而损伤内存扩展组件。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例或示范性技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1为本申请实施例提供的内存扩展装置的立体结构示意图一；
图2为图1所示的内存扩展装置的剖视结构示意图；
图3为本申请实施例提供的内存扩展装置的立体结构示意图二；
图4为图3所示的内存扩展装置的分解图。
 本发明的实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明，并不用于限定本申请。
需说明的是，当部件被称为“固定于”或“设置于”另一个部件，它可以直接在另一个部件上或者间接在该另一个部件上。当一个部件被称为是“连接于”另一个部件，它可以是直接或者间接连接至该另一个部件上。术语“上”、“下”、“左”、“右”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制，对于本领域的普通技术人员而言，可以根据具体情况理解上述术语的具体含义。术语“第一”、“第二”仅用于便于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明技术特征的数量。“多个”的含义是两个或两个以上，除非另有明确具体的限定。
为了说明本申请所提供的技术方案，以下结合具体附图及实施例进行详细说明。
请一并参阅图1至图4，本申请的一些实施例提供了一种内存扩展装置，内存扩展装置用于对计算机主机进行内存扩展，以提高计算机主机的运行速度和流畅性。具体到本实施例中，计算机主机为Mac Sdudio，可以理解地，本申请的内存扩展装置主要与Mac Sdudio适配，即申请的内存扩展装置用于扩充Mac Sdudio的内存，另外，内存扩展装置还可以作为Mac Sdudio的专用底座，用于支撑Mac Sdudio。
具体地，请一并参阅图1及图2，内存扩展装置包括壳体10及内存扩展组件30。壳体10上设有接触面11、散热面12及导热口14，壳体10内设有容纳腔13，导热口14贯穿接触面11及散热面12，并与容纳腔13分隔设置。可以理解地，导热口14未与容纳腔13连通。内存扩展组件30设置在容纳腔13内，内存扩展组件30用于存储程序和各种数据。
使用时，将计算机主机放置在壳体10的接触面11上，计算机主机底部上的部分散热孔与壳体10上的导热口14对应连通，从而计算机主机能够通过导热口14进行散热，可以理解地，计算机主机经对应于导热口14的散热孔散发出的热量，能够经导热口14散发至壳体10的散热面12的所在侧，同时散热面12的所在侧的冷气流也可以经导热口14及计算机主机上对应于导热口14的散热孔流至计算机主机内。内存扩展组件30通过与计算机主机电连接，以对计算机主机进行内存扩展。
本申请提供的内存扩展装置，与现有技术相比，内存扩展装置包括壳体10及内存扩展组件30，内存扩展组件30用于存储程序和各种数据，以对计算机主机进行内存扩展。通过在壳体10上开设贯穿于接触面11及散热面12的导热口14，当壳体10的接触面11与计算机主机的外表面接触时，计算机主机底部上的部分散热孔与壳体10上的导热口14对应连通，从而计算机主机上的热量能够通过导热口14散发至散热面12的所在侧，以使计算机主机上的热量能够及时散发，有利于保证计算机主机的散热性，且导热口14与容纳腔13分隔设置，有效防止计算机散热出的热量经导热口14进入至容纳腔13内而损伤内存扩展组件30。
在本申请另一个实施例中，接触面11包括中间区域110、过渡区域111及边缘区域112，过渡区域111环绕于中间区域110的外围，边缘区域112环绕过渡区域111的外围，容纳腔13与中间区域110对应设置，导热口14于过渡区域111对应设置，壳体10内设有走线腔15，走线腔15与边缘区域112对应设置，并与容纳腔13连通，且走线腔15与导热口14分隔设置，走线腔15供内存扩展组件30进行走线。
壳体10内对应过渡区域111设有过线孔，过线孔与导热口14间隔设置，即过线孔未与导热口14连通，过线孔连通容纳腔13及走线腔15，从而实现走线腔15与容纳腔13连通。
请一并参阅图2及图3，中间区域110相对边缘区域112凹陷设置，以形成放置槽113，使计算机主机底部的部分能够恰好地放置在放置槽113内，从而使计算机主机较稳定地防止在接触面11上。过渡区域111相对边缘区域112倾斜设置，且过渡区域111朝向中间区域110的中心，以使过渡区域111与计算机主机底部的倾斜部分匹配贴合，计算机主机底部的该倾斜部分设有散热孔，从而通过过渡区域111与计算机主机底部的倾斜部分匹配贴合，使导热口14与计算机主机底部上的散热孔较好地对应。
需要说明的是，中间区域110、边缘区域112及过渡区域111的形状根据适配的计算机主机的底部形状进行设定，在此不作限制。可选的，在本实施例中，壳体10为矩形状，即边缘区域112为矩形，中间区域110及过渡区域111均为圆形。在其他实施例中，壳体10还可以为其他多边形、三角形或椭圆形等，即边缘区域112还可以为其他多边形、三角形或椭圆形等，中间区域110及过渡区域111还可以为多边形、三角形或椭圆形等。
在本申请另一个实施例中，导热口14的数量多个，多个导热口14沿过渡区域111的周向间隔分布。可选的，导热口14的数量为四个，四个导热口14沿过渡区域111的周向等距离间隔分布。
可选的，导热口14呈弧形状，并沿接触面11的周向延伸。具体地，导热口14沿过渡区域111的周向延伸。
在一些实施例中，接触面11与散热面12相对设置，即，接触面11与散热面12分别为壳体10的相对两侧面。可以理解地，散热面12背离接触面11设置。可选的，接触面11为壳体10的顶面，散热面12为壳体10的底面。在另一些实施例中，散热面12还可以为壳体10的周侧面，即散热面12与接触面11相邻设置。又或者，散热面12与散热面12位于壳体10的同一侧面，散热面12并不与计算机主机接触。可以理解地，散热面12可以为壳体10的任一面，只要保证导热口14内的热量能够经散热面12散发至外界即可。
在本申请另一个实施例中，壳体10上还设有多个进气孔120及多个出气孔121，进气孔120及出气孔121均与容纳腔13连通，并位于散热面12的所在侧，进气孔120及出气孔121分别设于壳体10对应中间区域110的相对两侧部。外界气体经进气孔120进入至容纳腔13，然后经出气孔121排出，从而进气孔120与出气孔121形成空气对流，以带走容纳腔13内的热量，从而实现对容纳腔13内的内存扩展组件30进行散热，降低内存扩展组件30使用时的温度，避免高温受损，同时有效壳体10热量过高而烫伤用户。
散热面12对应导热口14的周向区域朝接触面11方向凹陷，以形成导流槽122，即导流槽122沿壳体10的周向呈环状。可以理解地，导流槽122与导热口14连通。散热面12对应进气孔120及出气孔121的周向区域朝导流槽122方向倾斜。可以理解地，导流槽122与进气孔120及出气孔121连通。通过设置导流槽122，有利于增大壳体10底部的气流空间，使导热口14处的热量能够经导流槽122快速地进行散发，同时有利于提高进气孔120与出气孔121之间的对流效果。
在一些实施例中，壳体10上设有安装口123，安装口123与容纳腔13连通，安装口123位于散热面12的所在侧；通过安装口123进行安装或拆卸内存扩展组件30的扩展卡32。
在一些实施例中，请一并参阅图1及图4，壳体10包括面壳16及底壳17，底壳17与面壳16配合连接，以围设成容纳腔13及走线腔15，面壳16背离底壳17的侧面为接触面11，底壳17背离面壳16的侧面为散热面12，导热口14贯穿于面壳16及底壳17，进气口、出气口及安装口123均设于底壳17上。
面壳16和底壳17中的其中一个上设有卡槽160，面壳16和底壳17中的另一个上设置有卡扣170，卡扣170及卡槽160均与过渡区域111对应设置，卡扣170与卡槽160配合卡接。可以理解地，在一些实施例中，面壳16设有卡槽160，底壳17上设置有卡扣170，卡扣170及卡槽160对应于过渡区域111，卡扣170与卡槽160配合卡接。在其他实施例中，面壳16设置有卡扣170，底壳17上设有卡槽160，卡扣170及卡槽160对应于过渡区域111，卡扣170与卡槽160配合卡接。
面壳16为铝壳，可以理解地，面壳16由铝合金材质制成，有利于内存扩展组件30及计算机主机散热。底壳17为塑壳，可以理解地，底壳17由塑料材质制成。可选的，制成底壳17的塑料材质可以是丙烯腈-丁二烯-苯乙烯塑料（Acrylonitrile Butadiene Styrene plastic，简称ABS）。
内存扩展装置还包括盖板20，盖板20可拆卸地盖合于安装口123。可以理解地，通过打开盖板20，用户能够通过安装口123进行安装或拆卸扩展卡32，便于用户更换扩展卡32。
盖板20背离容纳腔13的侧面上设置有多个散热鳍片21，多个散热鳍片21间隔设置。通过在盖板20上设置多个散热鳍片21，有利于内存扩展组件30散热。
可选的，盖板20及散热鳍片21均由铝合金材质制成。
在本申请另一个实施例中，请参阅图2至图4，内存扩展装置还包括多个防滑垫脚60，多个防滑垫脚60间隔设置在底壳17的散热面12上。防滑垫脚60对应于边缘区域112。可选的，防滑垫脚60的数量为四个，四个防滑垫脚60分别设置在底壳17的四个边角处。通过设置防滑垫脚60，以增高壳体10底部的高度，使得内存扩展装置放置在桌面或者地面上时，使得导热口14的热量能够散发至外界，同时使进气孔120与出气孔121之间形成空气对流。
请一并参阅图2及图4，内存扩展组件30靠近散热面12设置。内存扩展组件30靠近底壳17设置。可以理解地，使用时，计算机主机会产生热量传递至接触面11上，而内存扩展组件30也会产生热量，从而通过将内存扩展组件30靠近散热面12设置，即内存扩展组件30远离接触面11设置，使内存扩展组件30靠与计算机主机间隔开，有效防止内存扩展组件30与计算机主机的热量交叉传递。
具体地，内存扩展组件30包括电路板31及扩展卡32，电路板31设置在容纳腔13内，并靠近散热面12设置。扩展卡32可拆卸设置在电路板31上，实现扩展卡32与电路板31电性连接，扩展卡32与安装口123对应设置，从而可通过打开盖板20，进行拆装扩展卡32。
电路板31夹设在面壳16与底壳17之间。可选的，面壳16、电路板31、底壳17通过螺丝依次相连。可选的，电路板31为PCBA，PCBA是英文Printed Circuit Board Assembly 的简称，是PCB空板经过SMT上件，或经过DIP插件的整个制程。
扩展卡32的数量为两个，两个扩展卡32并列间隔设置。扩展卡32可以是市场上常规M.2的PCIE卡。
在一些实施例中，电路板31上设置有卡座33及弹性限位柱34，卡座33与弹性限位柱34相对间隔设置，扩展卡32卡设于卡座33与弹性限位柱34之间。卡座33上设有限位槽，扩展卡32的一端能够插入至限位槽内。弹性限位柱34为硅胶粒，硅胶粒为软质料，具有较好的弹性，弹性限位柱34能够发生形变，以调节弹性限位柱34与卡座33之间的间距，从而能够将扩展卡32限位在卡座33与弹性限位柱34之间。
在一些实施例中，请参阅图4，内存扩展装置还包括指示灯组件40，指示灯组件40设置在壳体10上，并与电路板31电连接，指示灯组件40用于指示扩展卡32的工作状态。
需要说明的是，当扩展卡32不工作时，指示灯组件40显示第一颜色光。当电路板31上未组装扩展卡32时，指示灯组件40显示第二颜色光。当扩展卡32正常连接并可以工作时，指示灯组件40显示第三颜色光。第一颜色光、第二颜色光及第三颜色光分别不同颜色的光。
可选的，第一颜色光为红光，第二颜色光为黄光，第三颜色光为绿光。
具体地，壳体10上设有透光孔18，透光孔18设于壳体10的侧壁上，透光孔18与走线腔15连通，指示灯组件40包括柔性线路板 41（Flexible Printed Circuit board，简称FPC）及泡棉42，柔性线路板 41的一端设于容纳腔13内，并与电路板31电连接，柔性线路板 41的另一端经过线孔延伸至走线腔15内，并与透光孔18对应设置，柔性线路板 41与透光孔18对应的一端上设有指示灯。若指示灯亮红光，则表示扩展卡32不工作。若指示灯亮黄光，则表示未组装扩展卡32。若指示灯亮绿光，则表示扩展卡32正常连接并可以工作。当然，在其他实施例中，第一颜色光、第二颜色光及第三颜色光还可以为其他不同颜色的光，本申请对此不作限制。
泡棉42设置在走线腔15内，泡棉42设于柔性线路板 41与透光孔18之间，泡棉42用于保护柔性线路板 41上的指示灯，同时泡棉42还具有半遮光作用，避免指示灯从壳体10的透光孔18外的部位进行透光，有利于保证壳体10外观亮度的一致性。
在一些实施例中，请一并参阅图1、图3及图4，内存扩展装置还包括数据传输线50，数据传输线50的一端与内存扩展组件30电连接，数据传输线50的另一端穿过壳体10的外周侧壁伸出至壳体10外，并用于与计算机主机电连接，即内存扩展组件30通过数据传输线50与计算机主机电连接。具体地，数据传输线50的一端位于容纳腔13内，并与电路板31电连接，数据传输线50的另一端依次穿过过线孔、走线腔15及壳体10的外周侧壁伸出至壳体10外。通过内存扩展装置自带数据传输线50，从而在内存扩展装置使用时，将数据传输线50伸出至壳体10外的一端与计算机主机插接，使内存扩展装置与计算机主机电连接，无需额外接线，便于用户使用。
数据传输线50的数量为两个，通过设置两个数据传输线50，实现双线输入，进行双倍速率传输，传输效率高，有利于提高用户使用体验感。
可选的，数据传输线50为Type-c线材。
以上仅为本申请的可选实施例而已，并不用于限制本申请。对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的权利要求范围之内。

Claims (20)

  1. 一种内存扩展装置，其特征在于，包括：
    壳体，所述壳体上设有接触面、散热面及导热口，所述壳体内设有容纳腔，所述导热口贯穿所述接触面及所述散热面，并与所述容纳腔分隔设置；及
    内存扩展组件，所述内存扩展组件设置在所述容纳腔内。
  2. 根据权利要求1所述的内存扩展装置，其特征在于：所述接触面与所述散热面相对设置，所述壳体上还设有多个进气孔及多个出气孔，所述进气孔及所述出气孔均与所述容纳腔连通，并位于所述散热面的所在侧。
  3. 根据权利要求2所述的内存扩展装置，其特征在于：所述散热面对应导热口的周向区域朝所述接触面方向凹陷，以形成导流槽，所述散热面对应所述进气孔及所述出气孔的周向区域朝所述导流槽方向倾斜。
  4. 根据权利要求2所述的内存扩展装置，其特征在于：还包括多个防滑垫脚，多个所述防滑垫脚间隔设置在所述散热面上。
  5. 根据权利要求2所述的内存扩展装置，其特征在于：所述接触面包括中间区域、过渡区域及边缘区域，所述过渡区域环绕于所述中间区域的外围，所述边缘区域环绕所述过渡区域的外围，所述容纳腔与所述中间区域对应设置，所述导热口与所述过渡区域对应设置，所述壳体内设有走线腔，所述走线腔与所述边缘区域对应设置，并与所述容纳腔连通。
  6. 根据权利要求5所述的内存扩展装置，其特征在于：所述中间区域相对所述边缘区域凹陷设置，以形成放置槽。
  7. 根据权利要求5所述的内存扩展装置，其特征在于：所述过渡区域相对所述边缘区域倾斜设置，且所述过渡区域朝向所述中间区域的中心。
  8. 根据权利要求5所述的内存扩展装置，其特征在于：所述壳体包括面壳及底壳，所述底壳与所述面壳配合连接，以围设成所述容纳腔及所述走线腔，所述面壳背离所述底壳的侧面为所述接触面，所述底壳背离所述面壳的侧面为所述散热面，所述导热口贯穿于所述面壳及所述底壳。
  9. 根据权利要求8所述的内存扩展装置，其特征在于：所述面壳和所述底壳中的其中一个上设有卡槽，所述面壳和所述底壳中的另一个上设置有卡扣，所述卡扣及所述卡槽均与过渡区域对应设置，所述卡扣与所述卡槽配合卡接。
  10. 根据权利要求8所述的内存扩展装置，其特征在于：所述面壳为铝壳，所述底壳为塑壳。
  11. 根据权利要求1所述的内存扩展装置，其特征在于：所述内存扩展组件靠近所述散热面设置。
  12. 根据权利要求1所述的内存扩展装置，其特征在于：所述内存扩展组件包括电路板及扩展卡，所述扩展卡可拆卸设置在所述电路板上。
  13. 根据权利要求12所述的内存扩展装置，其特征在于：所述电路板上设置有卡座及弹性限位柱，所述卡座与所述弹性限位柱相对间隔设置，所述扩展卡卡设于所述卡座与所述弹性限位柱之间。
  14. 根据权利要求13所述的内存扩展装置，其特征在于：所述弹性限位柱为硅胶粒。
  15. 根据权利要求12所述的内存扩展装置，其特征在于：所述壳体上设有与所述容纳腔连通的安装口，所述安装口位于所述散热面的所在侧；所述内存扩展装置还包括盖合于所述安装口的盖板；所述扩展卡与所述安装口对应设置。
  16. 根据权利要求15所述的内存扩展装置，其特征在于：所述盖板背离所述容纳腔的侧面上设置有多个散热鳍片。
  17. 根据权利要求12所述的内存扩展装置，其特征在于：还包括指示灯组件，所述指示灯组件设置在所述壳体上，并与所述电路板电连接，用于指示所述扩展卡的工作状态。
  18. 根据权利要求17所述的内存扩展装置，其特征在于：当所述扩展卡不工作时，所述指示灯组件显示第一颜色光；当所述电路板上未组装所述扩展卡时，所述指示灯组件显示第二颜色光；当所述扩展卡正常连接并可以工作时，所述指示灯组件显示第三颜色光，所述第一颜色光、所述第二颜色光及所述第三颜色光分别不同颜色的光。
  19. 根据权利要求1所述的内存扩展装置，其特征在于：还包括数据传输线，所述数据传输线的一端与所述内存扩展组件电连接，另一端穿过所述壳体的外周侧壁伸出至所述壳体外。
  20. 根据权利要求19所述的内存扩展装置，其特征在于：所述数据传输线的数量为两个，两个所述数据传输线并列设置。
PCT/CN2022/103933 2022-07-05 2022-07-05 内存扩展装置 WO2024007154A1 (zh)

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