WO2022022010A1 - 一种服务器、机柜式服务器以及刀片式服务器 - Google Patents

一种服务器、机柜式服务器以及刀片式服务器 Download PDF

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Publication number
WO2022022010A1
WO2022022010A1 PCT/CN2021/093974 CN2021093974W WO2022022010A1 WO 2022022010 A1 WO2022022010 A1 WO 2022022010A1 CN 2021093974 W CN2021093974 W CN 2021093974W WO 2022022010 A1 WO2022022010 A1 WO 2022022010A1
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WO
WIPO (PCT)
Prior art keywords
interface
server
backplane
parallel
pcb
Prior art date
Application number
PCT/CN2021/093974
Other languages
English (en)
French (fr)
Inventor
黄城
姚益民
樊义威
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP21849171.0A priority Critical patent/EP4188044A4/en
Publication of WO2022022010A1 publication Critical patent/WO2022022010A1/zh
Priority to US18/157,559 priority patent/US20230156972A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184—Mounting of motherboards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/187—Mounting of fixed and removable disk drives
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/2205—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/22—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing
    • G06F11/2273—Test methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1489—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source

Definitions

  • the present application relates to the technical field of servers, and in particular, to a server, a cabinet server and a blade server.
  • the power consumption of each component in the server (such as processor, memory, hard disk, etc.) will also increase significantly, and the increase in the power consumption of the components in the server will lead to the accumulation of components in the server. heat is also increasing. In order to ensure the normal operation of each component in the server, it is necessary to improve the heat dissipation capacity of the server and dissipate the heat accumulated on the components in the server in time.
  • the server is provided with an air outlet and an air inlet.
  • the cold air enters from the air inlet, passes through each component in the server, takes away the heat accumulated on each component in the server, and then flows out from the air outlet.
  • the hard disk backplane blocks the circulation of cold air, which reduces the cooling capacity of the entire server.
  • punching holes on the backplane of the hard disk can increase the flow of cold air, the backplane is designed with a more complex circuit, and the punched area is limited, which still cannot ensure that the server has a good heat dissipation capacity.
  • the present application provides a server, a cabinet-type server and a blade-type server, which are used to improve the heat dissipation capability of the server.
  • an embodiment of the present application provides a server, the server includes a backplane, and components in the server, such as a hard disk, a memory, and the like, can be installed on the backplane.
  • the back plate can be arranged between the air outlet and the air inlet of the server, and the back plate can be parallel to the wind direction flowing in from the air inlet or parallel to the wind direction flowing out of the air outlet.
  • the backplane is parallel to the wind direction, which can reduce the obstruction to the wind entering or exiting the server, increase the ventilation volume of the server, and improve the heat dissipation capacity of the server.
  • the backplane can accommodate hard disks in the server, and the hard disks in the server can be mounted on the backplane in a direction parallel to the backplane.
  • the hard disk is also parallel to the wind direction, which can further reduce the obstruction to the wind flowing into or out of the server, and ensure that the server has better heat dissipation capacity.
  • the backplane includes multi-layer PCBs, and the multi-layer PCBs are arranged in parallel, that is, each layer of PCB is parallel to the wind direction flowing into or out of the server, and each layer of PCB is provided with a hard disk slot, and each layer of PCB is provided with hard disk slots. Hard disks in the server can be placed in the hard disk slots.
  • the backplane adopts a layered structure, and on the premise of ensuring the ventilation volume in the server, it can also ensure that a sufficient number of hard disks can be installed on the backplane.
  • the multi-layer PCB can be arranged in many ways.
  • the multi-layer PCB can be located in the same plane, and the plane is parallel to the direction of the air flowing in from the air inlet, or parallel to the direction of the air flowing out of the air outlet. .
  • the multi-layer PCBs can be arranged in the same plane, so that a large amount of wind can circulate in the server and ensure the heat dissipation capability of the server.
  • the multi-layer PCBs can also be distributed in multiple planes, and the multiple planes are all parallel to the air flow direction of the air inlet, or are all parallel to the air flow direction of the air outlet.
  • the multilayer PCBs can be arranged in sequence along the direction perpendicular to the wind direction, that is, the projections of the multilayer PCBs on the plane perpendicular to the wind direction coincide; they can also be arranged in steps.
  • the arrangement of the multi-layer PCB is flexible and can be applied to different server architectures.
  • each layer of the multi-layer PCB is fixed on the server casing by a structural member.
  • the multi-layer PCB is fixed with the shell of the server to ensure the stability of the multi-layer PCB.
  • the server may further include a mainboard, the backplane includes a plurality of first interfaces, the mainboard includes a plurality of second interfaces, one first interface corresponds to one second interface, each first interface The interface is connected to the corresponding second interface through a data line, and the lengths of the data lines used to connect the adjacent first interface and the corresponding second interface are different.
  • the correspondence between the first interface and the second interface may be pre-configured.
  • the lengths of the data lines used to connect the adjacent first interfaces and the corresponding second interfaces are different, and the corresponding first interfaces and second interfaces can be distinguished by the lengths of the data lines, so as to ensure the first interface and the second interface. correctly connected.
  • the server may further include an expansion board, and the expansion board may be parallel to the direction of the wind flowing in from the air inlet, or parallel to the direction of the wind flowing out of the air outlet.
  • the connection can be made through the expansion board, that is, the first interface can be connected to the expansion board through the data line, and the expansion board is connected to the second interface.
  • the expansion board can realize the effect of interface expansion, so that each first interface on the backplane can be connected to the main board of the server.
  • the server may further include a management module, and the management module is connected to the second interface; the management module may detect whether the first interface and the second interface are correctly connected, and after detecting the connection between the first interface and the second interface In the event of a connection error, an alarm can be issued.
  • the correct connection between the first interface and the second interface means that the first interface is connected with the corresponding second interface; correspondingly, the incorrect connection between the first interface and the second interface means that the first interface is not connected with the corresponding second interface, For example, it is connected to another second interface, or the data line between the corresponding second interface is disconnected.
  • the management module can timely discover the wrong connection between the first interface and the second interface, and further determine that the first interface can be connected with the corresponding second interface.
  • the management module can obtain the signal on the data line between the first interface and the second interface when detecting whether the first interface and the second interface are correctly connected, and determine the relationship between the first interface and the second interface according to the signal on the data line. Whether the second interface is connected correctly. For example, the management module can compare the signal on the data line with the preset signal. If they are consistent, it indicates that the first interface and the second interface are correctly connected, otherwise the first interface and the second interface are incorrectly connected.
  • the management module can accurately determine whether the first interface and the second interface are correctly connected through the signal on the data line, and can also discover the connection between the first interface and the second interface in a timely manner through the signal on the data line. error, ensuring the timeliness of detection.
  • an embodiment of the present invention provides a rack-type server, where the rack-type server includes one or more servers provided by the first aspect and any design of the first aspect.
  • an embodiment of the present invention provides a blade server, where the blade server includes one or more of the first aspect and the server provided by any design of the first aspect.
  • 1A is a schematic diagram of the setting position of the hard disk backplane in the server
  • 1B is a schematic structural diagram of a hard disk backplane in a server
  • 2A is a schematic structural diagram of a server provided by the application.
  • 2B is a schematic structural diagram of a server provided by the application.
  • 3A to 3C are schematic structural diagrams of a multilayer PCB in a hard disk backplane provided by the present application;
  • 4A is a schematic diagram of a fixed connection between a one-layer PCB and a housing of a server provided by the application;
  • 4B is a schematic diagram of a fixed connection between a one-layer PCB and a component with a fixed function in a server provided by the application;
  • FIG. 5 is a schematic structural diagram of a layer of PCB in a hard disk backplane provided by the application;
  • FIG. 6 is a schematic diagram of the connection between a layer of PCB in a hard disk backplane and a mainboard of a server provided by the application;
  • FIGS. 7A-7B are schematic diagrams of the connection between a first interface in a one-layer PCB and a second interface in a mainboard of a server according to the present application;
  • 8A is a schematic diagram of a data line with different lengths between a first interface in a one-layer PCB and a second interface in the motherboard of a server provided by the application;
  • 8B is a schematic diagram of the setting position of a management module provided in the application in the server;
  • 9A to 9C are schematic diagrams of connection between a backplane and a mainboard of a server according to the present application.
  • Figure 1A is a schematic diagram of the location of the hard disk backplane in the server.
  • the hard disk backplane is located between the air outlet and the air inlet of the server.
  • the hard disk backplane is vertically installed in the server.
  • the hard disk backplane The wind direction of the air outlet of the server is vertical, and the setting of the hard disk backplane will hinder the circulation of the air in the server.
  • Ventilations holes can also be provided on the hard disk backplane.
  • the hard disk backplane is a printed circuit board (PCB)
  • PCB printed circuit board
  • more components need to be deployed on the PCB.
  • the location of the ventilation holes on the hard disk backplane is limited, and only fewer ventilation holes can be set on the hard disk backplane. Fewer ventilation holes cannot effectively improve the heat dissipation capacity of the server.
  • an embodiment of the present application provides a server.
  • the server 100 includes a backplane 110 , and the backplane 110 is used for
  • the components in the server 100 are installed, and the embodiment of the present application does not limit the type of the components.
  • the components may be hard disks, memory, and the like.
  • the back plate 110 is located between the air outlet and the air inlet, and the back plate 110 can be parallel to the wind direction flowing in from the air inlet or parallel to the wind direction flowing out of the air outlet.
  • the wind direction inflow from the air inlet and the wind direction outflow from the air outlet are taken as an example for description.
  • the back plate 110 and the wind direction inflow from the air inlet are not consistent with each other. Either the flat or the wind direction flowing out of the air outlet can be parallel.
  • the backplane 110 can be abstracted as a space plane (the space plane can be called the space plane corresponding to the backplane 110 ), and the air inlet flows into
  • the wind direction (or the wind direction flowing out of the air outlet) can be abstracted as a set of spatial straight lines (the set of spatial straight lines can be referred to as the spatial straight line corresponding to the wind direction flowing in from the air inlet or the spatial straight line corresponding to the wind direction flowing out of the air outlet).
  • the back plate 110 is parallel to the wind direction flowing into the air inlet means that the space plane corresponding to the back plate 110 is parallel to the space line corresponding to the wind direction flowing into the air inlet, and the back plate 110 is parallel to the wind direction flowing out of the air outlet means that the back plate 110 corresponds to The space plane is parallel to the space line corresponding to the wind direction flowing out of the air outlet.
  • the positions of the backplane 110 in the server 100 are different, and the structure of the server 100 is also different to some extent.
  • the directions of the two mutually perpendicular sides of the server 100 are defined as the width direction and the length direction, respectively.
  • the longitudinal direction is the direction of the side between the front side and the rear side of the server 100
  • the width direction is the direction of the side between the left and right sides of the server 100 .
  • the backplane 110 is disposed along the width direction of the server 100 , that is, both ends of the backplane 110 may be fixed on the left and right sides of the server 100 respectively.
  • the back plate 110 is parallel to the wind direction flowing into the air inlet.
  • the backplane 110 in the server 100 is disposed along the length direction of the server 100 , that is, both ends of the backplane 110 can be respectively fixed to the server Front and rear sides of the 100.
  • the back plate 110 is parallel to the wind direction flowing into the air inlet.
  • the backplane 110 is arranged in a direction parallel to the wind direction (such as the inflow direction of the air inlet, the wind direction of the air outlet), and the backplane 110 can greatly reduce the obstruction to the wind entering the server 100, so that the ventilation volume of the server 100 can be greatly reduced. This can effectively improve and further improve the heat dissipation capability of the server 100 .
  • the backplane 110 as a hard disk backplane, that is, for inserting the hard disks in the server 100 as an example, for the case where the backplane 110 is used for inserting other components in the server 100, it is different from the case where the backplane 110 is a hard disk backplane. The situation is similar, the difference lies in the installed components.
  • the backplane 110 please refer to the relevant description when the backplane 110 is a hard disk backplane 110 , which will not be repeated here.
  • the hard disk When the hard disk is installed on the backplane 110 , the hard disk can be installed on the backplane 110 along a direction parallel to the backplane 110 , so that the hard disk is also parallel to the direction of the air flowing into the air inlet.
  • the hard disks installed on the backplane 110 will not greatly hinder the wind entering the server 100 , which further ensures the ventilation of the server 100 .
  • the backplane 110 may include one or more layers of PCBs 111 , and one or more hard disk slots 112 may be disposed on one layer of the PCB 111 , and the hard disk slots 112 can be inserted into hard disks.
  • the installation direction of the hard disk please refer to the above description, which will not be repeated here.
  • the multi-layer PCB 111 is arranged in parallel, and there are many ways to arrange the multi-layer PCB 111 in parallel.
  • the multi-layer PCB 111 may be located in the same plane, or may be located in a plurality of different parallel planes respectively. , some of which are listed below:
  • the backplane 110 includes a multi-layer PCB 111 , and the multi-layer PCB 111 is located in the same plane, and the plane is parallel to the wind direction flowing into the air inlet.
  • the multilayer PCBs 111 in the backplane 110 are arranged side by side along a direction parallel to the wind direction flowing into the air inlet.
  • the multi-layer PCBs 111 may be spaced and arranged in a loose manner; or there may be no space, and the multi-layer PCBs 111 may be closely arranged.
  • the multi-layer PCB 111 is located in the same plane, and the wind entering the server 100 is greatly reduced by the backplane 110, which increases the air flow in the entire server 100 and improves the heat dissipation capacity of the server 100.
  • the backplane 110 includes a multi-layer PCB 111 , and the multi-layer PCB 111 is located in a plurality of different parallel planes, and the plurality of parallel planes and The direction of the wind flowing into the air inlet is parallel. That is, there are PCBs 111 located in different planes in the multilayer PCB 111 .
  • the number of the plurality of planes is not limited here, and the number of the plurality of parallel planes may be the same as the number of layers of the multilayer PCB 111 , that is, one layer of the PCB 111 is located in one plane.
  • the multilayer PCB 111 can be arranged in the following two ways:
  • Mode 1 The multilayer PCB 111 intersects with the same straight line, which is perpendicular to the straight line, and the straight line is perpendicular to the wind direction flowing into the air inlet. That is, the multilayer PCBs 111 are aligned in a direction perpendicular to the wind direction of the air inlet, and the projections of the multilayer PCBs 111 on a plane perpendicular to the wind direction of the air inlet are coincident. As shown in FIG. 3B , the middle backplane 110 is arranged in the first manner.
  • the multi-layer PCBs 111 are centrally arranged in the server 100, occupying less space, and since the multi-layer PCB 111 is parallel to the wind flowing into the air inlet, the obstruction to the wind can be reduced, and the heat dissipation of the server 100 can be ensured .
  • Mode 2 The multi-layer PCBs 111 are arranged in sequence along a direction parallel to the wind direction flowing into the air inlet, and the multi-layer PCBs 111 are arranged in a stepped shape.
  • the middle backplane 110 is arranged in the second manner. Similar to Mode 1, there may also be gaps between adjacent PCBs 111 in the multilayer PCB 111 in a direction perpendicular to the direction of the wind flowing into the air inlet, so as to improve the ventilation rate of the server 100 .
  • the multi-layer PCBs 111 are scattered in the server 100, which is suitable for the special scene of component deployment in the server 100, and since the multi-layer PCB 111 is parallel to the wind flowing into the air inlet, the server 100 can still be guaranteed to have Better cooling capacity.
  • the number of the multiple planes may also be different from the number of layers of the multilayer PCB 111 , for example, the number of the multiple planes may be smaller than the number of layers of the multilayer PCB 111 , that is, there are at least two layers of the PCB 111 located in the same multilayer PCB 111 . in plane.
  • the PCBs 111 located in the same plane can be arranged as shown in FIG. 3A
  • the PCBs 111 located in different planes can be arranged as shown in FIG. 3B or FIG. 3C .
  • the specific arrangement can refer to the foregoing content, which will not be repeated here.
  • the multi-layer PCB 111 can be fixed in the server 100 , and there are many ways to fix the multi-layer PCB 111 in the server 100 . Active component connections.
  • the shape of the structural member 210 shown in FIG. 4A is only an example, the embodiment of the present application does not limit the shape of the structural member, and any structural member capable of fixing the multilayer PCB 111 and the casing of the server 100 is applicable to the embodiment of the present application.
  • the component 300 may be a plate-shaped or rod-shaped fixed inside the server 100 components.
  • the shape of the component 300 here is only an example, the embodiment of the present application does not limit the shape and type of the component 300, and any component with a fixed function inside the server 100 is applicable to the embodiment of the present application.
  • the L-shaped structural member 220 is used to fix the PCB 111 and the assembly 300 .
  • the PCB 111 and the assembly 300 are respectively fixed to two vertical surfaces of the L-shaped structural member 220 .
  • the PCB 111 can be fixed on one surface of the L-shaped structural member 220 by nuts.
  • the assembly 300 can also be fixed on the other surface of the L-shaped structural member 220 by nuts.
  • the backplane 110 can be connected to the main board of the server 100.
  • a schematic diagram of the structure of a layer of PCB 111 in the backplane 110 a layer of PCB 111 can include at least two first interfaces 113, each first interface 113 is connected to the main board of the server 100 through a data line 130 .
  • the main board 120 of the server 100 is also provided with a second interface 121 corresponding to the first interface 113 of the PCB 111 .
  • Each first interface 113 can establish a connection with the second interface 121 on the mainboard 120 of the server 100 through a data line 130 .
  • a first interface 113 on this layer of PCB 111 corresponds to some or all of the hard disks inserted in the hard disk slots 112 on this layer of PCB 111 , that is, the first interface 113 on the layer of PCB 111 is connected to some or all of the hard disks. or all hard drives connected.
  • the first interface 113 on this layer of PCB 111 is connected to the second interface 121 of the main board 120 of the server 100 through a data cable 130 , and the main board 120 of the server 100 (such as the processor on the main board 120 ) can be connected to the first interface on the layer of PCB 111
  • the hard disk corresponding to 113 is connected, and the hard disk corresponding to the first interface 113 can be read and written.
  • the main board 120 of the server 100 may be provided with a processor, which is based on the second interface 121 and the first interface
  • the connection between 113 can connect the hard disk on this layer of PCB 111, and then realize the read and write operations on the hard disk, but the backplane 110 includes multiple layers of PCB 111, and the hard disk slot 112 of each layer of PCB 111 can be installed with one or more hard disks.
  • the processor performs read and write operations, it is necessary to distinguish the hard disks to determine which hard disk to read or write to.
  • the processor can distinguish different hard disks through different second interfaces 121 .
  • the main board 120 of the server 100 has a second interface 121A, a second interface 121B, and a second interface 121C
  • the PCB 111 of the layer has a first interface 113A (corresponding to the PCB 111 of this layer).
  • the correct connection relationship between the second interface 121 on the main board 120 of the server 100 and the first interface 113 on the PCB 111 is as follows: the first interface 113A is connected to the second interface 121A, the first interface 113B is connected to the second interface 121B, and the first interface 113A is connected to the second interface 121A.
  • An interface 113C is connected to the second interface 121C, where the correct connection relationship between the first interface 113 and the second interface 121 is the corresponding relationship between the first interface 113 and the second interface 121, and the corresponding relationship can be understood as a preset connection relationship, Only when the connection relationship is satisfied, the first interface and the second interface can be considered to be connected correctly, otherwise the connection is wrong; in this way, the processor is located after the second interface 121 on the main board 120 of the server 100 and the first interface 113 on the PCB 111 of this layer.
  • the hard disks connected through the second interface 121A are the hard disk 1 and the hard disk 2
  • the hard disks connected through the second interface 121B are determined as the hard disk 3 and the hard disk 4
  • the hard disks connected through the second interface 121C are determined as the hard disk 5 and the hard disk 6.
  • the hard disk installed on the backplane 110 can be replaced or a certain layer or multiple layers of PCB 111 can be replaced according to actual needs.
  • the connection will be of a pluggable design. That is to say, the data line 130 between the first interface 113 and the second interface 121 can be flexibly dialed out or inserted from the first interface 113 or the second interface 121 .
  • the connection between the first interface 113 and the second interface 121 adopts a pluggable design
  • the first interface An interface 113A is connected to the second interface 121B
  • the first interface 113B is connected to the second interface 121C
  • the first interface 113C is connected to the second interface 121A.
  • the processor cannot correctly distinguish the hard disk, which may cause confusion in the read and write operations on the hard disk.
  • Mode 1 Determine the first interface 113 and the second interface 121 to be connected by the length of the data cable 130 (ie, the corresponding relationship between the first interface 113 and the second interface 121 ).
  • the data lines 130 between the first interface 113 and the second interface 121 can be set to have different lengths, and the first interface 113 on the layer PCB 111 is connected to the corresponding second interface on the motherboard 120 of the server 100 through the data lines 130 of different lengths.
  • the interface 121 is connected.
  • the lengths of the data lines 130 used to connect the two adjacent first interfaces 113 on the PCB 111 to the corresponding second interfaces 121 on the main board 120 of the server 100 are different.
  • the lengths of the data lines 130 used to connect any two first interfaces 113 on the PCB 111 to the corresponding second interfaces 121 on the main board 120 of the server 100 are different.
  • the data line 130 between the first interface 113A and the second interface 121A is the data line 130A
  • the data line 130 between the first interface 113B and the second interface 121B is the data line 130B
  • the data line 130 between 113C and the second interface 121C is the data line 130C as an example
  • the first interface 113A, the first interface 113B, and the first interface 113C are three consecutive first interfaces 113 on the layer of PCB 111
  • the lengths of the data lines 130B and 130C may be different; the lengths of the data lines 130A and 130C may be the same, and the lengths of the data lines 130A and 130B may be different.
  • the length of the data cable 130 is used to determine the first interface 113 and the second interface 121 to be connected as an example.
  • the color of the data cable 130 and the size or shape of the first interface 113 and the second interface 121 can also be determined.
  • the orientation of the first interface 113 and the second interface 121 and other means that need to be connected to the first interface 113 and the second interface 121 can also be determined.
  • the second way is to set up a management module.
  • the management module determines whether the connection between the first interface 113 and the second interface 121 is correct according to the signal on the data line 130 between the first interface 113 and the second interface 121 .
  • the server 100 may further include a management module 140.
  • the management module 140 may be arranged on the mainboard 120 of the server 100, or may be arranged outside the mainboard 120 of the server 100.
  • the management module 140 may acquire and detect the first The signal on the data line 130 between the first interface 113 and the second interface 121 .
  • the way in which the management module 140 obtains the signal on the data line 130 between the first interface 113 and the second interface 121 is not limited here.
  • the management module 140 When the management module 140 is installed on the main board 120 of the server 100, the management module 140 can be connected to the second interface. 121, obtain the signal on the data line 130 between the first interface 113 and the second interface 121 from the second interface 121; when the management module 140 is set outside the mainboard 120 of the server 100, the management module 140 can communicate with the server 100.
  • the mainboard 120 is connected, and the signal on the data line 130 between the first interface 113 and the second interface 121 is obtained through the mainboard 120 of the server 100 .
  • the management module 140 can detect the signal on the data line 130 between the first interface 113 and the second interface 121 , and perform a comparison with the preset signal. By comparison, if they are consistent, it is determined that the connection between the first interface 113 and the second interface 121 is correct; otherwise, it is determined that the connection between the first interface 113 and the second interface 121 is incorrect.
  • the data line 130 between the first interface 113 and the second interface 121 may include multiple pins, each of which may be used to transmit signals, and the management module 140 may detect the connection between the first interface 113 and the second interface 121.
  • a signal is transmitted on one or more pins of the data line 130 between the two interfaces 121, and the signal transmitted on the one or more pins is compared with a preset signal.
  • the management module 140 When the management module 140 detects the signal on the data line 130 between the first interface 113 and the second interface 121, it can detect the signal value of the signal, such as detecting whether the signal is a high-level signal or a low-level signal; for example, the The first interface 113A on the layer PCB 111 can send a high-level signal, and the first interface 113B can send a low-level signal. If the signal obtained by the management module 140 through the second interface 121A is a high-level signal, and the signal obtained through the second interface 121B is a low-level signal, it is determined that the first interface 113A and the second interface 121A are correctly connected, and the first interface 113B It is correctly connected to the second interface 121B.
  • the signal obtained by the management module 140 through the second interface 121A is a low-level signal, and the signal obtained through the second interface 121B is a high-level signal, it is determined that the first interface 113A and the second interface 121A are connected incorrectly, and the first interface 113B The connection with the second interface 121B is incorrect.
  • the management module 140 When the management module 140 detects the signal on the data line 130 between the first interface 113 and the second interface 121, it can also detect the duty cycle of the signal, and the duty cycle can refer to a high-level signal or a low-level signal in one signal period.
  • the proportion of the level signal to determine whether the duty cycle of the signal is a preset value; for example, the first interface 113A on the PCB 111 on this layer can send a signal with a duty cycle of 85%, and the first interface 113B can send a duty cycle. than the 15% signal.
  • the first interface 113A and the second interface are determined. 121A is correctly connected, and the first interface 113B and the second interface 121B are correctly connected. If the signal obtained by the management module 140 through the second interface 121A is a signal with a duty cycle of 100%, and the signal obtained through the second interface 121B is a signal with a duty cycle of 100%, the first interface 113A and the second interface are determined. 121A is connected incorrectly, and the first interface 113B and the second interface 121B are connected incorrectly.
  • the embodiment of the present application does not limit the method of generating the signal sent from the first interface 113 on the layer of PCB 111.
  • a device that can generate a signal is provided on the layer of PCB, and the device is connected to the first interface 113 on the layer of PCB to generate a signal.
  • the generated signal is sent out through the first interface.
  • the layer of PCB 111 may be connected to a signal-generating device disposed outside the backplane 110 , and the device sends the generated signal through the first interface.
  • the management module 140 may be a central processing unit, an ASIC, a field-programmable gate array (FPGA) or a complex programmable logic device (complex programmable logic device). logic device, CPLD), and can also have some or all of the above modules.
  • the management module may be a newly added module in the server 100, or may be an existing management module 140 in the server 100, such as a baseboard management controller (BMC), that is, an existing management module 140 in the server 100
  • BMC baseboard management controller
  • the management module 140 adds the function of detecting the signal on the data line 130 between the first interface 113 and the second interface 121 .
  • the management module 140 may issue an alarm when it is determined that the connection between the first interface 113 and the second interface 121 is incorrect.
  • This embodiment of the present application does not limit the manner in which the management module 140 issues an alarm.
  • the warning light is used for alarming, and the alarming sound and warning light can also be used for alarming at the same time.
  • the embodiment of the present application does not limit the connection method between the first interface 113 and the second interface 121 , for example, the first interface 113 on the backplane 110 may directly connect to the second interface on the main board 120 of the server 100 through the data cable 130 121, and can also be connected to the second interface 121 on the main board 120 of the server 100 through an expansion board.
  • the two methods are described below:
  • Manner 1 The first interface 113 on the backplane 110 is directly connected to the second interface 121 on the main board 120 of the server 100 through the data cable 130 .
  • the layer of PCB 111 is directly connected to the main board 120 of the server 100 , that is, the plurality of first interfaces 113 on the layer of PCB 111 are respectively connected through data lines.
  • 130 is connected to a plurality of second ports 121 of the main board 120 of the server 100, and the first ports 113 and the second ports 121 are connected one by one.
  • Mode 2 The first interface 113 on the backplane 110 is connected to the second interface 121 on the main board 120 of the server 100 through an expansion board.
  • each first interface 113 on the backplane 110 can be connected to a second interface 121 on the mainboard 120 of the server 100.
  • Each first interface 113 on the board 110 can be connected to the main board 120 of the server 100, and an expansion board 150 can be added between the backplane 110 and the main board 120 of the server 100, and the expansion board 150 can be a serial SCSI expansion chip ( serial attached SCSI expander, SAS Expander), can also be a standard switch chip for fast peripheral component interconnection (peripheral component interconnect express switch, PCIe switch), the embodiment of the present application does not limit the type of the expansion board 150.
  • serial SCSI expansion chip serial attached SCSI expander, SAS Expander
  • PCIe switch peripheral component interconnect express switch
  • the first interface 113 on the layer of PCB 111 can be connected to the expansion board 150 first, and the expansion board 150 is connected to the second interface 121 of the main board 120 of the server 100 to realize interface expansion.
  • the expansion board 150 can be parallel to the direction of the wind flowing into the air inlet, so as to reduce the obstruction to the wind entering the server 100 .
  • the expansion board 150 may be parallel to the wind direction of the air inlet, and the expansion board 150 is parallel to the backplane 110 .
  • the data cables 130 that need to be connected to different first interfaces 113 can also be distinguished by the length of the data cables 130 , and the different first interfaces 113 can be distinguished by the shape of the first interface 113 .
  • the management module 140 can also determine whether the first interface 113 and the second interface 121 are correctly connected (in this case, it can be understood as detecting whether the first interface 113 and the expansion board 150 are correctly connected), specifically For the method, please refer to the foregoing content and will not be repeated here.
  • the expansion board 150 may be parallel to the wind direction of the air inlet, and the expansion board 150 is perpendicular to the backplane 110 .
  • the data cables 130 that need to be connected to different first interfaces 113 can also be distinguished by the length of the data cables 130 , and the different first interfaces 113 can be distinguished by the shape of the first interface 113 .
  • the management module 140 can also determine whether the first interface 113 and the second interface 121 are correctly connected (in this case, it can be understood as detecting whether the first interface 113 and the expansion board 150 are correctly connected), specifically For the method, please refer to the foregoing content and will not be repeated here.

Abstract

一种服务器、机柜式服务器以及刀片式服务器，本申请中，该服务器包括背板，该背板上可以安插该服务器中的硬盘。该背板设置在该服务器的出风口和入风口之间，该背板可以与入风口流入的风向平行，也可以与出风口流出的风向平行。背板与风向平行，能够减少对进入或流出服务器的风的阻碍，保证服务器中风的流通，增加服务器的通风量，提高服务器的散热能力。

Description

一种服务器、机柜式服务器以及刀片式服务器 技术领域
本申请涉及服务器技术领域，尤其涉及一种服务器、机柜式服务器以及刀片式服务器。
背景技术
随着服务器运算能力的提高，服务器中各个组件(如处理器、内存、硬盘等)的功耗也会随之明显增大，而服务器中组件的功耗的增大，导致服务器中组件上集聚的热量也越来越多。为了保证服务器中各个组件的正常工作，需要提升服务器的散热能力，及时将服务器中组件上集聚的热量散发出去。
目前，服务器中通常采用风冷散热，服务器中设置有出风口和入风口，冷风从入风口进入，经过服务器中各个组件，带走服务器中各个组件上集聚的热量，之后，从出风口流出。
但由于服务器中用于安插硬盘的背板的设置方向垂直与入风口的风向，硬盘背板阻挡了冷风的流通，降低了整个服务器的散热能力。虽然通过在硬盘背板上打孔的方式可以增大流通的冷风风量，但背板上设计有较为复杂的电路，打孔的区域有限，依然无法能够保证服务器具备较好的散热能力。
发明内容
本申请提供一种服务器、机柜式服务器以及刀片式服务器，用以提升服务器的散热能力。
第一方面，本申请实施例提供了一种服务器，该服务器包括背板，该背板上可以安插该服务器中的组件，如硬盘、内存等。该背板可以设置在该服务器的出风口和入风口之间，该背板可以与入风口流入的风向平行，也可以与出风口流出的风向平行。
通过上述服务器，背板与风向平行，能够减少对进入或流出服务器的风的阻碍，增加服务器的通风量，提高服务器的散热能力。
在一种可能的设计中，背板可以安插服务器中的硬盘，服务器中的硬盘可以沿着与背板平行的方向安插在背板上。
通过上述服务器，硬盘也与风向平行，能够进一步减少对流入或流出服务器的风的阻碍，保证该服务器具备较好的散热能力。
在一种可能的设计中，该背板包括多层PCB，该多层PCB平行设置，也即每层PCB均与流入或流出服务器的风向平行，每层PCB上设置有硬盘插槽，每个硬盘插槽上可以安插服务器中的硬盘。
通过上述服务器，背板采用分层的结构，在保证服务器中通风量的前提下，还能保证该背板上能够安插足够数量的硬盘。
在一种可能的设计中，该多层PCB的排布方式有许多种，例如，该多层PCB可以位于同一平面内，该平面与入风口流入的风向平行，或与出风口流出的风向平行。
通过上述服务器，该多层PCB可以排布在同一个平面内，使得服务器中可以流通大量的风，保证该服务器的散热能力。
在一种可能的设计中，该多层PCB也可以分布在位于多个平面内，该多个平面均与该入风口流入的风向平行，或均与该出风口流出的风向平行。例如该多层PCB可以沿着垂直于风 向的方向，依次排布，也即该多层PCB在垂直于风向的平面上的投影重合；也可以呈阶梯状排布。
通过上述服务器，该多层PCB的排布方式灵活，可以适用于不同服务器架构。
在一种可能的设计中，该多层PCB中相邻PCB之间在垂直于入风口流入的风向或出风口流出的风向上存在间隔。
通过上述服务器，相邻PCB之间存在间隔，进入服务器的风能够在通过该间隔进行流通，可以带走服务器组件上集聚的热量，达到较佳的散热效果。
在一种可能的设计中，该多层PCB中的每层PCB通过结构件固定在服务器的外壳上。
通过上述服务器，该多层PCB与服务器的外壳固定，保证该多层PCB的稳定性。
在一种可能的设计中，服务器还可以包括主板，该背板上包括多个第一接口，该主板上包括多个第二接口，一个第一接口与一个第二接口对应，每个第一接口通过一条数据线与对应的第二接口连接，相邻第一接口与对应的第二接口连接所采用的数据线的长度不同。第一接口与第二接口之间的对应关系可以是预先配置的。
通过上述服务器，相邻第一接口与对应的第二接口连接所采用的数据线的长度不同，能够通过数据线的长度区分对应的第一接口和第二接口，保证第一接口和第二接口之间可以正确连接。
在一种可能的设计中，服务器还可以包括扩展板，该扩展板可以与入风口流入的风向平行，也可以与出风口流出的风向平行。
第一接口通过数据线与第二接口连接时，可以通过该扩展板进行连接，也即该第一接口可以通过数据线连接扩展板，扩展板连接第二接口。
通过上述服务器，扩展板能够实现接口扩展的效果，使得该背板上的各个第一接口均能够连接到该服务器的主板上。
在一种可能的设计中，服务器还可以包括管理模块，该管理模块与第二接口连接；管理模块可以检测第一接口与第二接口是否正确连接，在检测到第一接口与第二接口的连接错误的情况下，可以发出告警。其中，第一接口与第二接口连接正确是指第一接口与对应的第二接口连接；相应的，第一接口与第二接口连接错误是指第一接口未与对应的第二接口连接，例如与另一个第二接口连接，或与对应的第二接口之间的数据线断路等。
通过上述服务器，管理模块能够及时发现第一接口与第二接口之间的错误连接，进一步确定第一接口可以与对应的第二接口连接。
在一种可能的设计中，管理模块在检测第一接口与第二接口是否正确连接可以获取第一接口与第二接口之间数据线上的信号，根据数据线上的信号确定第一接口与第二接口是否正确连接。例如，管理模块可以根据该数据线上的信号与预设的信号进行比较，若一致，则表明第一接口与第二接口连接正确，否则第一接口与第二接口连接错误。
通过上述服务器，管理模块通过数据线上的信号，能够准确的判断第一接口与第二接口是否正确连接，且通过数据线上的信号，也能够较为及时的发现第一接口与第二接口连接错误，保证了检测的时效性。
第二方面，本发明实施例提供了一种机柜式服务器，机柜式服务器包括一个或多个第一方面以及第一方面任意一种设计提供的服务器。
第三方面，本发明实施例提供了一种刀片式服务器，刀片式服务器包括一个或多个第一方面以及第一方面任意一种设计提供的服务器。
附图说明
图1A为服务器中硬盘背板的设置位置示意图；
图1B为服务器中硬盘背板的结构示意图；
图2A为本申请提供的一种服务器的结构示意图；
图2B为本申请提供的一种服务器的结构示意图；
图3A～图3C为本申请提供的一种硬盘背板中多层PCB的结构示意图；
图4A为本申请提供的一种一层PCB与服务器的外壳固定连接的示意图；
图4B为本申请提供的一种一层PCB与服务器中具备固定作用的组件固定连接的示意图；
图5为本申请提供的一种硬盘背板中一层PCB的结构示意图；
图6为本申请提供的一种硬盘背板中一层PCB与服务器的主板连接的示意图；
图7A～图7B为本申请提供的一种一层PCB中第一接口与服务器的主板中第二接口连接的示意图；
图8A为本申请提供的一种一层PCB中第一接口与服务器的主板中第二接口之间不同长度的数据线的示意图；
图8B为本申请提供的一种管理模块在服务器中的设置位置的示意图；
图9A～图9C为本申请提供的一种背板与服务器的主板连接的示意图。
具体实施方式
如图1A所示为，硬盘背板在服务器中的设置位置的示意图，硬盘背板位于服务器的出风口以及入风口之间，图1A中硬盘背板竖直的安插在服务器中，硬盘背板与服务器出风口的风向是垂直的，这种硬盘背板的设置方式会阻碍服务器中风的流通。
如图1B所示，硬盘背板上除了硬盘插槽之外，还可以设置通风孔，但由于硬盘背板是一块印制电路板(printed circuit board，PCB)，PCB上需要部署较多的元器件，使得硬盘背板上设置通风孔的位置受限，只能在硬盘背板上设置较少的通风孔，较少的通风孔并不能有效的提升服务器的散热能力。
为了能够提高服务器散热能力，本申请实施例提供了一种服务器，参见图2A，为本申请实施例提供的一种服务器的示意图，该服务器100中包括有背板110，该背板110用于安插服务器100中的组件，本申请实施例并不限定组件的类型，如该组件可以为硬盘、内存等。
该背板110位于出风口和入风口之间，该背板110可以与入风口流入的风向平行，也可以与出风口流出的风向平行。
在本申请实施例中以入风口流入的风向与出风口流出的风向一致为例进行说明，对于入风口流入的风向与出风口流出的风向不一致的情况，该背板110与入风口流入的风向平以及出风口流出的风向中任一风向平行即可。
关于背板110与入风口流入的风向、出风口流出的风向之间的关系，可以将背板110抽象为一个空间平面(该空间平面可以称为背板110对应的空间平面)，入风口流入的风向(或出风口流出的风向)可以为抽象为一组空间直线(该组空间直线可以称为入风口流入的风向对应的空间直线或出风口流出的风向对应的空间直线)。
该背板110与入风口流入的风向平行是指背板110对应的空间平面与入风口流入的风向对应的空间直线平行，该背板110与出风口流出的风向平行是指背板110对应的空间平面与出风口流出的风向对应的空间直线平行。
背板110在服务器100中设置的位置不同，服务器100的结构也存在一定的区别，这里 将服务器100两个互相垂直的边的方向分别定义为宽度方向和长度方向。长度方向为服务器100前侧与后侧之间边的方向，宽度方向为服务器100左右两侧之间边的方向。
在图2A所示的服务器100中，背板110沿着服务器100的宽度方向设置，也就是说，背板110的两端可以分别固定在服务器100的左右两侧。背板110与入风口流入的风向平行。
如图2B所示，为本申请实施例提供的另一种服务器100，该服务器100中背板110沿着服务器100的长度方向设置，也就是说，背板110的两端可以分别固定在服务器100的前后两侧。背板110与入风口流入的风向平行。
背板110采用与风向(如入风口流入的风向、风口流出的风向)平行的方向的设置方式，背板110能够较大程度的减少对进入服务器100的风的阻碍，使得服务器100的通风量能够有效提高，进而提高服务器100散热能力。
以该背板110为硬盘背板，也即用于安插服务器100中的硬盘为例，对于该背板110用于安插服务器100中的其他组件的情况，与该背板110为硬盘背板的情况类似，区别在于所安插的组件不同，背板110的结构以及设置方式可以参见该背板110为硬盘背板110时的相关说明，此处不再赘述。
硬盘安插在背板110上时，硬盘可以沿着平行于背板110的方向安插在该背板110上，这样硬盘也与入风口流入的风向平行。安插在背板110上的硬盘也不会对进入服务器100的风产生较大的阻碍，进一步保证服务器100的通风量。
下面对背板110的结构进行说明：
背板110可以包括一层或多层PCB111，一层PCB111上可以设置一个或多个硬盘插槽112，该硬盘插槽112能够插入硬盘。硬盘的安插方向可参见前述说明，此处不再赘述。
当背板110包括多层PCB111时，多层PCB111平行设置，多层PCB111平行设置的方式有多种，例如，该多层PCB111可以位于同一平面内，也可以分别位于多个不同的平行平面内，下面列举其中几种：
如图3A所示，为本申请实施例提供的一种服务器100的结构示意图，该背板110中包括多层PCB111，多层PCB111位于同一个平面内，该平面与入风口流入的风向平行。
从图3A中，可以看出背板110中的多层PCB111沿着与入风口流入的风向平行的方向、并排设置。
该多层PCB111之间可以存在间隔，采用较为稀松的方式排布；也可以不存在间隔，多层PCB111紧密排布。
这种方式中，多层PCB111位于同一个平面内，进入服务器100的风受到背板110的阻碍会大大减少，使得整个服务器100内流通的风量增大，提升服务器100的散热能力。
如图3B所示，为本申请实施例提供的一种服务器100的结构示意图，该背板110中包括多层PCB111，该多层PCB111位于多个不同的平行平面内，该多个平行平面与入风口流入的风向平行。也就是说，多层PCB111中存在位于不同平面内的PCB111。
这里并不限定该多个平面的数量，该多个平行平面的数量可以与多层PCB111的层数相同，也就是说，一层PCB111位于一个平面内。
该多层PCB111可以采用如下两种方式进行排布：
方式一：该多层PCB111与同一直线相交，均于该直线垂直，该直线与入风口流入的风向垂直。也就是说，该多层PCB111在垂直于入风口流入的风向的方向上是对齐的，该多层PCB111在垂直于入风口流入的风向的平面上的投影是重合的。如图3B所示中背板110即采用方式一进行排布。
为了进一步提升服务器100的散热能力，多层PCB111板中相邻PCB111之间在垂直于入风口流入的风向的方向上存在间隔，这样进入服务器100中的风可以从这些间隔中流通，使得服务器100的通风率得以提升。
这种方式中，多层PCB111集中的设置在服务器100中，占用的空间较少，且由于该多层PCB111板与入风口流入的风平行，能够减少对风的阻碍，保证了服务器100的散热。
方式二：该多层PCB111沿着与入风口流入的风向平行的方向依次排布，多层PCB111呈阶梯状排布。
如图3C所示中背板110采用方式二进行排布。与方式一类似，多层PCB111板中相邻PCB111之间在垂直于所述入风口流入的风向的方向上也可以存在间隔，以提升服务器100的通风率。
这种方式中，多层PCB111较为分散的设置在服务器100中，适用于服务器100中组件部署较为特殊的场景，且由于该多层PCB111板与入风口流入的风平行，仍能保证服务器100具备较佳的散热能力。
该多个平面的数量也可以与多层PCB111的层数不同，例如该多个平面的数量可以小于多层PCB111的层数，也就是说，该多层PCB111中至少存在两层PCB111位于同一个平面内。这种情况中，位于同一平面内的PCB111可以采用如图3A的方式进行排布，位于不同平面内的PCB111可以采用如图3B或图3C的方式进行排布。具体的排布方式可以参见前述内容，此处不再赘述。
多层PCB111可以固定在服务器100中，多层PCB111固定在服务器100中的方式有许多种，例如，多层PCB111可以与服务器100的外壳固定，多层PCB111还可以与该服务器100中的具体固定作用的组件连接。
这里仅以其中一层PCB111与服务器100的外壳之间的固定方式为例进行说明，如图4A所示，PCB111与服务器100的外壳之间通过L型的结构件210固定，PCB111与服务器100的外壳分别与该L型的结构件210两个垂直的面固定，PCB111可以通过螺母固定在该L型结构件210的一个面上。服务器100的外壳也可以通过螺母固定在该L型结构件210的另一个面上。
在图4A所示的结构件210的形状仅是举例，本申请实施例并不限定结构件的形状，凡是能够固定多层PCB111与服务器100的外壳的结构件均适用于本申请实施例。
这里仅以其中一层PCB111与服务器100中具有固定作用的组件300之间的固定方式为例进行说明，如图4B所示，该组件300可以是固定在服务器100内部的板状或杆状的组件。这里组件300的形状仅是举例，本申请实施例并不限定组件300的形状以及类型，凡是在服务器100内部、具有固定作用的组件均适用于本申请实施例。
PCB111与组件300之间通过L型的结构件220固定，PCB111与组件300分别与该L型的结构件220两个垂直的面固定，PCB111可以通过螺母固定在该L型结构件220的一个面上。组件300也可以通过螺母固定在该L型结构件220的另一个面上。
该背板110可以与服务器100的主板连接，如图5所示，该背板110中的一层PCB111的结构示意图，一层PCB111上可以包括至少两个第一接口113，每个第一接口113通过一个数据线130与服务器100的主板连接。
如图6所示，在服务器100的主板120上也设置有与PCB111的第一接口113对应的第二接口121。每个第一接口113通过一个数据线130可以与服务器100的主板120上的第二接口121建立连接。
在一层PCB111上，该层PCB111上的一个第一接口113与该层PCB111上硬盘插槽112上安插的部分或全部硬盘对应，也就是说，该第一接口113在该PCB111层上与部分或全部硬盘连接。通过一个数据线130连接该层PCB111上第一接口113与服务器100的主板120的第二接口121，服务器100的主板120(如主板120上的处理器)可以与该层PCB111上该第一接口113对应的硬盘建立连接，能够对该第一接口113对应的硬盘进行读写操作。
这里对服务器100的主板120上第二接口121与该层PCB111上第一接口113的对应关系进行说明，服务器100的主板120上可以设置处理器，该处理器基于第二接口121与第一接口113之间的连接，可以连接该层PCB111上的硬盘，进而实现对硬盘的读写操作，但背板110上包括多层PCB111，每层PCB111的硬盘插槽112能够安插一个或多个硬盘，处理器进行读写操作时，需要区分硬盘，以确定对哪一个硬盘进行读或写。处理器可以通过不同的第二接口121区分不同的硬盘。
举例来说，如图7A所示，服务器100的主板120上有第二接口121A、第二接口121B、以及第二接口121C，该层PCB111上有第一接口113A(对应该层PCB111板上安插的硬盘1以及硬盘2)、第一接口113B(对应该层PCB111板上安插的硬盘3以及硬盘4)、以及第一接口113C(对应该层PCB111板上安插的硬盘3以及硬盘4)。服务器100的主板120上的第二接口121与该层PCB111上的第一接口113的正确连接关系为：第一接口113A与第二接口121A连接，第一接口113B与第二接口121B连接，第一接口113C与第二接口121C连接，这里第一接口113与第二接口121的正确连接关系为第一接口113与第二接口121的对应关系，该对应关系可以理解为预先设置的连接关系，只有满足该连接关系，第一接口与第二接口才可以被认为连接正确，否则连接错误；这样处理器在服务器100的主板120上的第二接口121与该层PCB111上的第一接口113之后，确定通过第二接口121A连接的硬盘为硬盘1和硬盘2，确定通过第二接口121B连接的硬盘为硬盘3和硬盘4，确定通过第二接口121C连接的硬盘为硬盘5和硬盘6。
但在实际应用中，为了使得背板110的设置更加灵活，能够根据实际需要更换背板110上安插的硬盘或更换某一层或多层PCB111，第一接口113和第二接口121之间的连接会采用可插拔的设计。也就是说，第一接口113与第二接口121之间的数据线130可以灵活地从第一接口113或第二接口121中拨出或插入。
第一接口113和第二接口121之间的连接采用可插拔的设计的情况下，会存在第一接口113与第二接口121之间连接错误的情况，例如，如图7B所示，第一接口113A与第二接口121B连接，第一接口113B与第二接口121C连接，第一接口113C与第二接口121A连接。这种连接错误的情况，会使得处理器不能正确区分硬盘，可能使得对硬盘的读写操作产生混乱。
为了避免这种连接错误的情况，本申请实施例提供了几种方式，下面分别进行说明：
方式一、通过数据线130的长度确定需要连接的第一接口113和第二接口121(也即第一接口113与第二接口121的对应关系)。
可以将第一接口113与第二接口121之间的数据线130设置为不同的长度，该层PCB111上第一接口113通过不同长度的数据线130与服务器100的主板120上的对应的第二接口121连接。
例如，该层PCB111上相邻的两个第一接口113与服务器100的主板120上的对应的第二接口121连接所采用的数据线130的长度不同。又例如，该层PCB111上任意两个第一接口113与服务器100的主板120上的对应的第二接口121连接所采用的数据线130的长度不 同。
如图8A所示，以第一接口113A与第二接口121A之间的数据线130为数据线130A，第一接口113B与第二接口121B之间的数据线130为数据线130B，第一接口113C与第二接口121C之间的数据线130为数据线130C为例，第一接口113A、第一接口113B、第一接口113C为该层PCB111上连续的三个第一接口113，数据线130A、数据线130B以及数据线130C的长度可以各不相同；数据线130A可以与数据线130C的长度相同，数据线130A与数据线130B的长度不同。
这里，以数据线130的长度确定需要连接的第一接口113和第二接口121为例，在实际应用中还可以通过数据线130的颜色、第一接口113和第二接口121的尺寸或形状、以及第一接口113和第二接口121的朝向等方式需要连接的第一接口113和第二接口121。
方式二、设置管理模块，管理模块根据第一接口113与第二接口121之间数据线130上的信号确定第一接口113与第二接口121之间是否连接正确。
如图8B，该服务器100中还可以包括管理模块140，该管理模块140可以设置在该服务器100的主板120上，也可以设置服务器100的主板120之外，该管理模块140可以获取并检测第一接口113与第二接口121之间数据线130上的信号。
这里并不限定管理模块140获取第一接口113与第二接口121之间数据线130上信号的方式，当该管理模块140设置在服务器100的主板120上时，管理模块140可以连接第二接口121，从第二接口121获取第一接口113与第二接口121之间数据线130上的信号；当该管理模块140设置在服务器100的主板120之外时，管理模块140可以与服务器100的主板120连接，通过该服务器100的主板120获取第一接口113与第二接口121之间数据线130上的信号。
管理模块140在获取第一接口113与第二接口121之间数据线130上的信号后，可以检测第一接口113与第二接口121之间数据线130上的信号，与预设的信号进行比对，若一致，则确定第一接口113与第二接口121之间连接正确，否则确定第一接口113与第二接口121之间连接错误。
需要说明的是，第一接口113与第二接口121之间数据线130可以包括多个管脚(pin)，每个管脚可以用于传输信号，管理模块140可以检测第一接口113与第二接口121之间数据线130中的一个或多个管脚上传输信号，对该一个或多个管脚上传输的信号与预设的信号进行比对。
管理模块140检测第一接口113与第二接口121之间数据线130上的信号时，可以检测该信号的信号值，如检测该信号是否为高电平信号或低电平信号；例如，该层PCB111上第一接口113A可以发出高电平信号，第一接口113B可以发出低电平信号。若管理模块140通过第二接口121A获取的信号为高电平信号，通过第二接口121B获取的信号为低电平信号，则确定第一接口113A和第二接口121A正确连接，第一接口113B和第二接口121B正确连接。若管理模块140通过第二接口121A获取的信号为低电平信号，通过第二接口121B获取的信号为高电平信号，则确定第一接口113A和第二接口121A连接错误，第一接口113B和第二接口121B连接错误。
管理模块140检测第一接口113与第二接口121之间数据线130上的信号时，也可以检测该信号的占空比，该占空比可以指在一个信号周期内高电平信号或低电平信号所占的比重，确定该信号的占空比是否为预设值；例如，该层PCB111上第一接口113A可以发出占空比为85％的信号，第一接口113B可以发出占空比为15％的信号。若管理模块140通过第二接口 121A获取的信号为占空比为85％的信号，通过第二接口121B获取的信号为占空比为15％的信号，则确定第一接口113A和第二接口121A正确连接，第一接口113B和第二接口121B正确连接。若管理模块140通过第二接口121A获取的信号为占空比为100％的信号，通过第二接口121B获取的信号为占空比为100％的信号，则确定第一接口113A和第二接口121A连接错误，第一接口113B和第二接口121B连接错误。
本申请实施例并不限定该层PCB111上第一接口113上发出的信号的生成方式，例如该层PCB上设置有可以产生信号的器件，该器件连接该层PCB上的第一接口113，以通过第一接口将产生的信号发出，又例如，该层PCB111可以与设置在背板110之外的用于产生信号的器件连接，该器件通过第一接口将产生的信号发出。
本申请实施例并不限定该管理模块140的构成，例如该管理模块140可以为中央处理器、ASIC、现场可编程门阵列(field－programmable gate array，FPGA)或复杂可编程逻辑器件(complex programmable logic device，CPLD)，也可以有上述的部分或全部构成的模块。该管理模块可以是服务器100中新增的模块，也可以是服务器100中已有的管理模块140，如基板管理控制器(baseboard management controller，BMC)，也就是说，在服务器100中已有的管理模块140增加检测第一接口113与第二接口121之间数据线130上的信号的功能。
该管理模块140在确定第一接口113与第二接口121连接错误的情况下，可以发出告警，本申请实施例并不限定管理模块140发出告警的方式，例如可以采用警报声进行告警，也可以采用警示灯进行告警，也可以同时采用警报声和警示灯的方式进行告警。
本申请实施例并不限定第一接口113与第二接口121之间的连接方式，例如，背板110上的第一接口113可以直接通过数据线130与服务器100的主板120上的第二接口121连接，也可以通过扩展板与服务器100的主板120上的第二接口121连接。下面对这两种方式分别进行说明：
方式一：背板110上的第一接口113直接通过数据线130与服务器100的主板120上的第二接口121连接。
以背板110中的一层PCB111为例，如图9A所示，该层PCB111与服务器100的主板120采用直连的方式，也即该层PCB111上的多个第一接口113分别通过数据线130与服务器100的主板120的多个第二接口121连接，第一接口113和第二接口121之间是一一连接的。
方式二：背板110上的第一接口113通过扩展板与服务器100的主板120上的第二接口121连接。
通常服务器100的主板120上的第二接口121的数量有限，并不能保证背板110上的每个第一接口113都能与服务器100的主板120上的一个第二接口121连接，为了保证背板110上的每个第一接口113均能够与服务器100的主板120连接，可以在背板110和服务器100的主板120之间增设扩展板150，该扩展板150可以为串行SCSI扩展芯片(serial attached SCSI expander，SAS Expander)，也可以为快捷外围部件互连标准交换芯片(peripheral component interconnect express switch，PCIe switch)，本申请实施例并不限定扩展板150的类型。
该层PCB111上的第一接口113可以先与该扩展板150连接，扩展板150连接到服务器100的主板120的第二接口121上，以实现接口扩展。
该扩展板150可以与入风口流入的风向平行，以减少对进入服务器100中风的阻碍。
如图9B所示，为背板110与扩展板150的结构示意图，该扩展板150可以与入风口流入的风向平行，且扩展板150与背板110平行。
同样的，为了防止第一接口113与扩展板150连接错误，也可以通过数据线130的长度区分需要与不同第一接口113连接的数据线130，通过第一接口113的外形区分不同的第一接口113，还可以由管理模块140确定第一接口113与第二接口121是否正确连接(在这种情况下，可以理解为检测的是第一接口113与扩展板150的是否正确连接)，具体方式可以参见前述内容此处不再赘述。
如图9C所示，为背板110与扩展板150的结构示意图，该扩展板150可以与入风口流入的风向平行，且扩展板150与背板110垂直。
同样的，为了防止第一接口113与扩展板150连接错误，也可以通过数据线130的长度区分需要与不同第一接口113连接的数据线130，通过第一接口113的外形区分不同的第一接口113，还可以由管理模块140确定第一接口113与第二接口121是否正确连接(在这种情况下，可以理解为检测的是第一接口113与扩展板150的是否正确连接)，具体方式可以参见前述内容此处不再赘述。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的精神和范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (13)

  1. 一种服务器，其特征在于，所述服务器包括背板，所述背板用于安插所述服务器中的组件；
    所述背板位于所述服务器的出风口和入风口之间，所述背板与所述入风口流入的风向平行、或与所述出风口流出的风向平行。
  2. 如权利要求1所述的服务器，其特征在于，所述背板用于安插所述服务器中的硬盘，所述硬盘沿与所述背板平行的方向安插在所述背板上。
  3. 如权利要求1或2所述的服务器，其特征在于，所述背板包括多层印刷电路板PCB，多层PCB平行设置，每层PCB上设置有硬盘插槽。
  4. 如权利要求3所述的服务器，其特征在于，所述多层PCB位于同一平面内，所述平面与所述入风口流入的风向平行，或与所述出风口流出的风向平行。
  5. 如权利要求3所述的服务器，其特征在于，所述多层PCB分布在位于多个平面内，所述多个平面均与所述入风口流入的风向平行，或均与所述出风口流出的风向平行。
  6. 如权利要求5所述的服务器，其特征在于，所述多层PCB中相邻所述PCB之间在垂直于所述入风口流入的风向或所述出风口流出的风向上存在间隔。
  7. 如权利要求5所述的服务器，其特征在于，所述多层PCB中的每层PCB通过结构件固定在所述服务器的外壳上。
  8. 如权利要求1～7任一所述的服务器，其特征在于，所述服务器还包括主板，所述背板上包括多个第一接口，所述主板上包括多个第二接口，一个所述第一接口与一个所述第二接口对应，每个所述第一接口通过一条数据线与对应的所述第二接口连接，相邻所述第一接口与对应的所述第二接口连接所采用的数据线的长度不同。
  9. 如权利要求8所述的服务器，其特征在于，所述服务器还包括扩展板，所述扩展板与所述入风口流入的风向平行、或与所述出风口流出的风向平行；
    所述第一接口通过数据线与对应的所述第二接口连接，包括：
    所述第一接口通过所述数据线连接所述扩展板，所述扩展板连接所述第二接口。
  10. 如权利要求1～9任一所述的服务器，其特征在于，所述服务器还包括管理模块，所述管理模块与所述第二接口连接；
    所述管理模块用于检测所述第一接口与所述第二接口是否正确连接，在检测到所述第一接口与所述第二接口的连接错误的情况下，发出告警。
  11. 如权利要求10所述的服务器，其特征在于，所述管理模块在检测所述第一接口与所述第二接口是否正确连接时，具体用于：
    获取所述第一接口与所述第二接口之间数据线上的信号，根据所述数据线上的信号确定所述第一接口与所述第二接口是否正确连接。
  12. 一种机柜式服务器，其特征在于，所述机柜式服务器包括一个或多个如权利要1～11任一所述的服务器。
  13. 一种刀片式服务器，其特征在于，所述刀片式服务器包括一个或多个如权利要1～11任一所述的服务器。
PCT/CN2021/093974 2020-07-28 2021-05-15 一种服务器、机柜式服务器以及刀片式服务器 WO2022022010A1 (zh)

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