WO2022016339A1 - 一种车辆以及车辆的控制系统 - Google Patents

一种车辆以及车辆的控制系统 Download PDF

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Publication number
WO2022016339A1
WO2022016339A1 PCT/CN2020/103119 CN2020103119W WO2022016339A1 WO 2022016339 A1 WO2022016339 A1 WO 2022016339A1 CN 2020103119 W CN2020103119 W CN 2020103119W WO 2022016339 A1 WO2022016339 A1 WO 2022016339A1
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WO
WIPO (PCT)
Prior art keywords
control system
air
vehicle
domain controller
cooling
Prior art date
Application number
PCT/CN2020/103119
Other languages
English (en)
French (fr)
Inventor
贾鑫宇
欧阳磊
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2020/103119 priority Critical patent/WO2022016339A1/zh
Priority to CN202080030163.8A priority patent/CN113728734A/zh
Publication of WO2022016339A1 publication Critical patent/WO2022016339A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/10—Internal combustion engine [ICE] based vehicles
    • Y02T10/40—Engine management systems

Definitions

  • the present invention generally relates to the field of automatic driving, and more particularly, to a vehicle and a control system for the vehicle.
  • Self-driving cars can perceive the surrounding environment in a large range or even 360 degrees through multi-sensors (such as cameras, lidars, millimeter-wave radars, etc.), conduct autonomous control and navigation, and lead passengers to their destinations. Since the perception of the surrounding environment by autonomous vehicles relies on more complex algorithms, traditional automotive processors are unable to run such algorithms. Therefore, after in-vehicle sensors such as lidar, cameras, and millimeter-wave radars collect environmental information data around the vehicle, A dedicated domain controller needs to be entered for unified fusion and processing. Limited by the existing hardware level, the chip on the domain controller has high power consumption and generates a lot of heat.
  • the existing method usually needs to arrange the heat dissipation system of the domain controller in the front and rear of the vehicle to achieve better cooling effect, but this will increase the modification of the vehicle. requirements, and the modification will affect the space and appearance of the vehicle itself.
  • control system for a vehicle, the control system comprising:
  • a domain controller installed in the main body of the vehicle, for receiving parameters of the surrounding environment detected by a plurality of sensors of the vehicle and calculating the parameters, so as to realize the control of the vehicle;
  • the domain controller includes a housing and an air-cooling structure, the air-cooling structure is disposed on a first side surface of the housing, and is configured to introduce the cooling air from the first side surface to be opposite to the first side surface the second side to allow the heat generated by the domain controller to dissipate.
  • the domain controller includes:
  • a plurality of processors disposed around the communication structure and in communication connection with the communication structure, are used for receiving parameters of the surrounding environment detected by the sensor and calculating the parameters.
  • a heat dissipation structure is provided on top of the processor and/or the communication structure.
  • the heat dissipation structure includes a plurality of vertically spaced plate-shaped heat dissipation fins disposed on the top of the processor and/or the communication structure.
  • the domain controller further includes:
  • the base plate is disposed on the bottom plate of the casing, wherein the base plate includes a first surface and a second surface arranged opposite to each other, and the processor and the communication structure are mounted and fixed on the first surface of the base plate.
  • a hollow first protrusion is arranged on the second surface of the base plate, a support structure is arranged on the bottom plate of the casing, and after the base plate is fixed on the bottom plate of the casing, the The first protrusion is in contact with the support structure.
  • the first protrusion is a nut, and/or the support structure is a raised columnar structure.
  • a heat dissipation boss is further disposed on the bottom plate of the casing, wherein the heat dissipation boss is disposed below the processor and/or the communication structure.
  • an elastic heat-conducting element is disposed between the heat-dissipating boss and the substrate, and the elastic heat-conducting element fills the gap between the heat-dissipating boss and the substrate.
  • the elastic thermally conductive element includes thermally conductive grease.
  • the material of the casing is a metal material.
  • a first number of functional devices of the domain controller are arranged on the first side, and a second number of functional devices of the domain controller are arranged on the second side, and the first number is greater than the second number.
  • the functional device of the domain controller disposed on the first side has a first height
  • the functional device of the domain controller disposed on the second side has a second height
  • the first The height is greater than the second height
  • the first side surface of the casing is disposed at the front end of the vehicle or the rear end opposite to the front end.
  • the air-cooling structure includes a first air guide cover, and the first air guide cover is disposed outside the casing and configured to guide the cooling air into the casing.
  • the air cooling structure includes a second air guide cover, and the second air guide cover is disposed inside the housing and configured to comb the airflow of the cooling air flowing through the domain controller.
  • the second air deflector includes a first air deflector and a second air deflector arranged in sequence from the first side to the second side, wherein the first air deflector is horizontally arranged, and the The second deflector is inclined downward.
  • the included angle between the second air guide plate and the horizontal plane ranges from 18 degrees to 43 degrees.
  • the second air deflector further includes a third air deflector
  • the third air deflector includes a horizontally arranged first portion and a vertically arranged second portion, wherein the second portion is arranged on the both sides of the first part.
  • the first air guide plate, the second air guide plate and the third air guide plate are integrally arranged or connected to each other.
  • the housing further includes a third side surface and a fourth side surface arranged opposite to each other, and one end of the first air guide plate, the second air guide plate and the third air guide plate is fixed to the third air guide plate.
  • Heat dissipation on the side, and/or the other ends of the first, second and third air guides are fixed on the fourth side or on the top of the processor on the fourth side structurally.
  • the first air guide cover is a cavity structure with an opening, and an air inlet corresponding to the opening is provided on the first side surface, so as to guide the cooling air into the housing.
  • an air outlet is provided on the second side surface.
  • the air-cooling structure further includes a cooling air conveying device, which is arranged inside the casing and at the air inlet.
  • the cooling air conveying device includes a plurality of fans.
  • the first air guide plate in the second air guide hood of the air cooling structure is fixed on the cooling air conveying device.
  • control system further includes a solid-state disk enclosure disposed in the housing.
  • the solid-state drive case is disposed inside the second side surface and on the top of the casing.
  • control system further includes an installation bracket on which the solid-state hard disk box is erected.
  • control system further includes a display unit configured to display the working status of the domain controller.
  • the display unit includes a display panel disposed on the top of the casing and a light guide structure disposed between the display panel and the substrate.
  • the light guide structure is a transparent light guide columnar structure.
  • the cooling air is the cooling air generated by the vehicle refrigeration equipment.
  • the upper surface of the control system is substantially flush with the ground of the trunk of the vehicle.
  • Another aspect of the present invention provides a vehicle having the aforementioned control system installed in a main body of the vehicle.
  • the vehicle control system of the present invention applies the air-cooling structure scheme, introduces cooling air, and obtains the best cooling effect through simulation and optimization of the air-guiding structure, ensuring that the domain controller works within a suitable temperature range.
  • the installation of the air-cooled structure is portable and easy to maintain; the structure is simple, the weight and external dimensions are relatively small; the reliability is high, and the manufacturing cost is low; Small, suitable for modification of different models.
  • the heat can be effectively dissipated and the cost can be further reduced.
  • FIG. 1 shows a schematic diagram of the overall structure of the domain controller in an embodiment of the present invention
  • FIG. 2 shows a schematic structural diagram of the internal structure of the domain controller in an embodiment of the present invention
  • FIG. 3 shows a schematic diagram of an installation manner of the processor in the domain controller according to an embodiment of the present invention
  • FIG. 4 shows a schematic structural diagram of the bottom plate of the housing in the domain controller according to an embodiment of the present invention
  • FIG. 5 shows a schematic structural diagram of a first air guide hood in the air cooling structure in an embodiment of the present invention
  • FIG. 6 shows a schematic structural diagram of a second air guide hood in the air cooling structure in an embodiment of the present invention
  • FIG. 7 shows a schematic structural diagram of the internal structure of the control system in an embodiment of the present invention.
  • the chips mounted on domain controllers in autonomous vehicles have high power consumption and generate a lot of heat. If the heat cannot be dissipated in time, the processing speed of the domain controller will be affected, and in severe cases, it may cause downtime, affecting the driving experience and personal safety of the occupants.
  • the current self-driving domain controllers usually use water-cooled heat dissipation technology.
  • the vehicle In addition to the structure of water-cooled heat dissipation itself, the vehicle must also be equipped with accessories such as water pumps, water tanks, and pipes.
  • the automatic driving modification of ordinary vehicles will involve changes in the components of the whole vehicle, with a long preparation period and a large amount of changes.
  • the domain controller with water cooling and heat dissipation is large in size and takes up more space in the car; it is heavy, which is not conducive to the lightweight of the car; in order to avoid waterway blockage or backflow, there are higher requirements for the layout of the pipeline; The most serious thing is that the water cooling solution faces the problem of poor reliability. Once the water pipe joint or the cold plate itself leaks, the circuit board will be directly short-circuited and scrapped, resulting in irreparable losses.
  • the present invention provides a control system for a vehicle, the control system includes:
  • a domain controller installed in the main body of the vehicle, for receiving parameters of the surrounding environment detected by a plurality of sensors of the vehicle and calculating the parameters, so as to realize the control of the vehicle;
  • the domain controller includes a housing and an air-cooling structure, the air-cooling structure is disposed on a first side surface of the housing, and is configured to introduce the cooling air from the first side surface to be opposite to the first side surface the second side to allow the heat generated by the domain controller to dissipate.
  • the vehicle control system of the present invention applies the air-cooling structure scheme, introduces cooling air, and obtains the best cooling effect through simulation and optimization of the air-guiding structure, ensuring that the domain controller works within a suitable temperature range.
  • the air-cooled structure is portable in installation and easy to maintain; simple in structure, relatively small in weight and external dimensions; high in reliability and low in manufacturing cost, which can greatly shorten the remodeling time of vehicles, and is less dependent on vehicle layout, and is suitable for Modifications for different models.
  • the heat can be effectively dissipated and the cost can be further reduced.
  • the control system of the vehicle is used to receive the parameters of the surrounding environment detected by the multiple sensors of the vehicle and perform fusion calculation on the parameters, automatically complete a series of planning, and issue control commands to the vehicle executive agencies to realize the control of the vehicle. control of the vehicle.
  • control system can be applied to vehicles, especially unmanned vehicles, and can be further applied to mobile devices such as drones, airplanes, and ships.
  • the domain controller is arranged in the main body of the vehicle, for example, embedded in the body of the vehicle, and on the premise of ensuring that the domain controller can work normally, the domain controller can be hidden to the maximum extent, avoiding the need for Destruction of the shape and aesthetics of a vehicle (eg, a vehicle), reducing modifications to the vehicle.
  • a vehicle eg, a vehicle
  • the domain controller is arranged in the space below the trunk at the rear of the vehicle, which facilitates the passage of cooling air generated by the vehicle into the domain controller on the one hand, and reduces the impact on the Changes to the vehicle.
  • control system is substantially flush with the ground of the trunk of the vehicle, so as to avoid affecting the normal use of the trunk.
  • the domain controller includes: a casing 10 , an air cooling structure, a communication structure 13 and a plurality of processors 12 .
  • the housing 10 is used to form an accommodating space for accommodating various functional devices of the domain controller, and at the same time protecting the functional devices in the domain controller.
  • the housing 10 is also used to support and fix the air-cooling structure, for example, the air-conducting plate of the air-cooling structure can be fixedly arranged on the side wall of the housing and the like.
  • part of the display device may also be provided on the casing 10 .
  • the casing 10 needs to be made of materials with certain hardness, strength, light weight, and rapid heat dissipation.
  • the casing 10 can be made of a metal material.
  • the casing 10 can be made of an aluminum alloy.
  • the aluminum alloy is not only light in weight, but also can quickly dissipate heat. It should be noted that other materials can also be selected for the shell, which can be selected according to actual needs.
  • the shape of the housing 10 can be designed according to the shape and installation position of the vehicle, and is not limited to a certain one.
  • the shape of the housing is a square box, such as a Box in the shape of a cuboid.
  • the casing 10 is formed by assembling 6 aluminum alloy plates, and the 6 aluminum alloy plates can be disassembled for easy maintenance.
  • the housing includes four side surfaces, a top plate 105 and a bottom plate 106.
  • the four side surfaces include a first side surface 101 and a second side surface 102 arranged opposite to each other. , and the third side surface 103 and the fourth side surface 104 arranged oppositely.
  • the air cooling structure is arranged on the first side surface 101 of the casing, and is configured to guide the cooling air from the first side surface 101 to the second side surface 102 opposite to the first side surface, so that all The heat generated by the domain controller is dissipated.
  • the domain controller includes a communication structure 13 and a plurality of processors 12, wherein the communication structure 13 and a plurality of processors 12 are arranged in the casing.
  • the processor 12 is configured to receive parameters of the surrounding environment detected by multiple sensors of the vehicle and perform a fusion calculation on the parameters, wherein the type and number of the processors 12 can be selected according to actual needs. This is not further limited.
  • the communication structure 13 may be a switch, which is connected to the processor 12 for communication.
  • the communication structure 13 is a processor communication switch chip.
  • the processor 12 is disposed around the communication structure 13 , for example, the processor 12 is disposed around the communication structure 13 , and the processor 12 is disposed in the communication structure 13
  • the connection circuit between the processor 12 and the communication structure 13 can be shortened, the area of the substrate of the domain controller can be reduced, and the space of the domain controller can be reduced, and on the other hand, the processor can be guaranteed.
  • the processor 12 can also be disposed more concentratedly on the first side 101, that is, more concentratedly disposed upstream of the cooling air, It is more favorable for the cooling air to cool the processors 12 concentrated in the upstream, and it is also more favorable for the overall heat dissipation of the domain controller, thereby improving the heat dissipation efficiency.
  • the domain controller includes seven processors 12 and one communication structure 13 , wherein four processors 12 are disposed on the first side 101 , namely Upstream of the cooling air, for example, the first side is spaced and arranged side by side, the three processors 12 are arranged closer to the second side 102, for example, the second side is spaced side by side, and the four processors 12 and the said four processors 12 are arranged side by side.
  • the communication structure 13 is provided between the three processors.
  • fewer or lower-height hardware devices are arranged at the downstream air vents of the domain controller to reduce heat dissipation wind resistance.
  • a first number of functional devices of the domain controller are arranged on the first side, and a first number of functional devices of the domain controller are arranged on the second side.
  • a second number of functional devices of the domain controller is set, the first number being greater than the second number.
  • the functional device of the domain controller disposed on the first side has a first height
  • the functional device of the domain controller disposed on the second side has a second height
  • the first height is greater than the second height
  • the functional device includes the processor 12 and the communication structure 13, but is not limited to the above two devices.
  • the domain controller may further include other functional devices, for example, may include MOS transistors, functional inductors, clock chips, camera boards, network cards, GPUs, etc., which will not be listed one by one here.
  • the present invention is further provided with a heat dissipation structure 14 on the functional devices, for example, at least in the processor 12 and/or the communication device.
  • the top of the structure 13 is provided with a heat dissipation structure 14 .
  • the heat dissipation structure 14 is a plurality of plate-shaped heat dissipation fins disposed on the top of the processor 12 and/or the communication structure 13 , wherein the plate-shaped heat dissipation fins are mutually They are arranged at intervals and placed vertically on the top of the processor 12 and/or the communication structure 13 , and the distance between the plate-shaped heat dissipation fins can be set as required.
  • the heat dissipation structure 14 includes a plurality of plate-shaped heat dissipation fins arranged in parallel, or adjacent plate-shaped heat dissipation fins may be in contact with each other.
  • the domain controller further includes: a substrate 11 , which is disposed on the bottom plate 106 of the casing and is used to carry the above-mentioned functional devices.
  • the substrate 11 includes a first surface and a second surface disposed opposite to each other, and the processor 12 and the communication structure 13 are mounted and fixed on the first surface of the substrate 11 .
  • the substrate 11 may include various types of substrates such as a PCB substrate (Printed Circuit Board), a ceramic substrate, a pre-mold (Pre-mold) substrate, and the ceramic substrate may be aluminum nitride or aluminum oxide. substrate.
  • PCB substrate printed Circuit Board
  • Pre-mold substrate pre-mold substrate
  • the ceramic substrate may be aluminum nitride or aluminum oxide. substrate.
  • the PCB is made of different components and a variety of complex process technologies, and the structure of the PCB circuit board includes single-layer, double-layer, and multi-layer structures, and the production methods of different hierarchical structures are different. .
  • the printed circuit board is mainly composed of pads, vias, mounting holes, wires, components, connectors, padding, electrical boundaries, and the like.
  • Single-layer board that is, a circuit board with copper on one side and no copper on the other side. Usually components are placed on the side without copper, and the copper side is mainly used for wiring and soldering.
  • Double-layer board that is, a circuit board with copper on both sides, usually called one side is the top layer (Top Layer), and the other side is the bottom layer (Bottom Layer).
  • Top Layer a circuit board with copper on both sides
  • Bottom Layer the bottom layer
  • the top layer is used as the component placement surface
  • the bottom layer is used as the component welding surface.
  • Multilayer board that is, a circuit board containing multiple working layers. In addition to the top layer and the bottom layer, it also contains several intermediate layers. Usually, the intermediate layer can be used as a wire layer, a signal layer, a power layer, and a ground layer. The layers are insulated from each other, and the connection between layers is usually achieved through vias.
  • the printed circuit board includes many types of working layers, such as a signal layer, a protective layer, a silk screen layer, an inner layer, etc., which will not be repeated here.
  • the substrate may also be selected a ceramic substrate, a ceramic substrate at elevated temperatures means a copper foil bonded directly to an alumina (Al 2 O 3) or aluminum nitride (AlN) ceramic substrate surface (one surface or double-sided) on a special craft board.
  • a ceramic substrate at elevated temperatures means a copper foil bonded directly to an alumina (Al 2 O 3) or aluminum nitride (AlN) ceramic substrate surface (one surface or double-sided) on a special craft board.
  • AlN aluminum nitride
  • the substrate 11 may be a pre-molded (pre-mold) substrate, wherein the pre-molded substrate has injection-molded wires and pins, the injection-molded wires are embedded in the main structure of the substrate, and the leads The feet are located on the surface of the main structure of the substrate, such as the inner surface and/or the outer surface, etc., so as to realize the electrical connection between the substrate and the functional device respectively.
  • pre-molded substrate has injection-molded wires and pins
  • the injection-molded wires are embedded in the main structure of the substrate
  • the leads The feet are located on the surface of the main structure of the substrate, such as the inner surface and/or the outer surface, etc., so as to realize the electrical connection between the substrate and the functional device respectively.
  • a substrate with better heat dissipation effect can be selected.
  • a heat sink may be further arranged between the substrate and the functional device.
  • the material of the heat sink includes metal or metallized material.
  • a hollow first protrusion 15 is provided on the second surface of the base plate 11, and a support structure 16 is provided on the bottom plate of the housing.
  • first protrusion 15 and the support structure 16 are in contact with each other but are not integrally connected with each other, so that they can be quickly disassembled for maintenance in case of failure.
  • the first protrusion 15 is a nut, for example, an M3 nut is welded on the lower surface of the PCB, and the support structure 16 is configured as a raised columnar structure, for example, the support structure is configured as a protrusion tower.
  • a heat dissipation boss 18 is also provided on the bottom plate 106 of the casing to dissipate the heat generated by the substrate in time, wherein the heat dissipation boss 18 is disposed on the processor and/or the below the communication structure.
  • chips with heat dissipation requirements on the lower surface of the substrate PCB are designed with heat dissipation bosses 18 at corresponding positions of the bottom plate, and the heights thereof are relatively low to prevent components from being bumped when the PCB is assembled.
  • an elastic heat-conducting element is arranged between the heat-dissipating boss 18 and the substrate 11 , and the elastic heat-conducting element fills the heat-dissipating boss and the substrate. The gap between them eliminates the air spacer and further improves the heat dissipation efficiency.
  • the elastic heat-conducting element includes thermally conductive grease, but is not limited to thermally-conductive grease, and any material with elasticity and good thermal conductivity can be used.
  • the air cooling structure is disposed on the first side surface 101 of the casing, wherein the first side surface 101 of the casing is disposed at the front end of the vehicle or the rear end opposite to the front end.
  • the direction of the cooling wind is blowing from the rear of the vehicle to the head of the vehicle;
  • the cooling wind is The direction is blowing from the head of the vehicle to the rear of the vehicle, which can be selected according to the position of the cooling air.
  • the cooling air may be the cooling air delivered from the outside, or may be the cooling air generated by the vehicle itself.
  • the cooling air may be the cooling air generated by the vehicle itself, wherein the first side surface 101 is disposed at an end close to the cooling air outlet.
  • the first side surface 101 is arranged at the front end of the vehicle.
  • the first side surface 101 is arranged at the rear of the vehicle , so as to facilitate the introduction of the cooling air generated by the vehicle into the air-cooling structure.
  • the air conditioner of the vehicle is arranged at the rear of the vehicle, so the first side surface of the casing is arranged at the rear of the vehicle, close to the trunk.
  • the air-cooling structure includes a first air guide hood 19 , as shown in FIG. 5 , the first air guide hood 19 is disposed outside the casing 10 for introducing the cooling air into the casing 10 Inside.
  • the first air guide cover is a cavity structure with an opening 191 , and the first side surface 101 is provided with an air inlet 24 corresponding to the opening, as shown in FIG. 7 , to introduce the cooling air into the housing.
  • one end of the first air guide cover 19 may be fixed on one side of the vehicle body, and the bottom of the first wind guide cover is fixed on the horizontal surface of the vehicle body on which the domain controller is carried.
  • the first air guide hood 19 can be configured to have the opening corresponding to the air inlet and the inlet for introducing cooling air into the first air guide hood, and the opening and the inlet are completely closed. structure.
  • the bottom of the first air guide hood 19 may be fixed on the horizontal surface of the vehicle body on which the domain controller is carried, so as to close the bottom of the first air guide hood and form a closed cavity.
  • the first air guide hood 19 is arranged near the air conditioning port on the right side of the trunk of the vehicle, and the cold air of the vehicle air conditioner is introduced through the first air guide hood 19 .
  • the air-cooling structure further includes a second air guide hood 20 , the second air guide hood 20 is disposed inside the housing 10 , and the second air guide hood 20 is used to guide the cooling air. Flow direction, combing the cooling air flow across the surface of the domain controller.
  • an air outlet 26 is provided on the second side surface
  • the first air guide cover 19 introduces cooling air into the casing 10 of the domain controller
  • the second air guide The cover 20 combs the air flow of the cooling air flowing through the surface of the domain controller, and then leads out the casing through the air outlet 26 on the second side surface 102 , and simultaneously takes away the heat dissipated by the domain controller.
  • the air cooling structure further includes a cooling air conveying device 25, which is arranged inside the casing and at the air inlet, so as to introduce the first air guide hood 19 into the air inlet.
  • the cooling air is introduced into the casing and accelerated.
  • the cooling air conveying device includes a plurality of fans. For example, four fans are provided on the first side surface inside the housing.
  • four 6025-type axial flow fans are selected. Simulate the actual use conditions of the fan in the vehicle, and test the noise generated in the middle of the front row at different speeds. It is found that when the speed is between 4500 and 5000 (duty ratio of 60% to 65%), the subjective sense of hearing is good. The noise meter test The value is 43dB, and the air-cooled solution will not bring about large noise pollution.
  • the second air deflector 20 includes a first air deflector 201 , a second air deflector 202 and a first air deflector 201 , a second air deflector 202 , and a Three deflectors 203, namely, a first deflector 201, a second deflector 202 and a third deflector 203 are arranged in sequence along the flow direction of the cooling air.
  • the first air guide plate 201 is arranged horizontally, and is used for fixing the second air guide cover 20 , for example, the second air guide cover 20 is arranged on the cooling air conveying device 25 .
  • the second air guide plate 202 is inclined downward.
  • the angle between the second air guide plate 202 and the horizontal plane ranges from 18 degrees to 43 degrees.
  • the included angle is 27 degrees.
  • the maximum temperature of the control system is 51.6°C, and when the angle between the second deflector 202 and the horizontal plane is 27 degrees
  • the maximum temperature of the control system is 50.0°C
  • the angle between the second deflector 202 and the horizontal plane is 43°
  • the maximum temperature of the control system is 52.1°C. Therefore, the second guide plate 202 has a maximum temperature of 52.1°C.
  • the included angle between the flow plate 202 and the horizontal plane ranges from 18 degrees to 43 degrees, the temperature requirements of the control system are all met.
  • the third baffle 203 can be arranged horizontally or obliquely, and can be selected according to the height of each functional device on the second side surface.
  • the third deflector 203 includes a first portion 2031 arranged horizontally and a second portion 2032 arranged vertically, wherein the second portion 2032 is arranged on both sides of the first portion 2031, that is, the second portion 2032 is arranged on both sides of the first portion 2031.
  • the second portion 2032 is disposed close to the third side surface 103 and the fourth side surface 104 .
  • first air guide plate 201 , the second air guide plate 202 and the third air guide plate 203 are integrally provided, or the first air guide plate 201 , the second air guide plate 202 and the third air guide plate 201
  • the plates 203 are provided separately and then connected to each other as a whole.
  • one end of the first air guide plate 201, the second air guide plate 202 and the third air guide plate 203 is fixed on the third side surface, and/or the first air guide plate 201, the third air guide plate 203
  • the other ends of the second air guide plate 202 and the third air guide plate 203 are fixed on the fourth side surface or on the heat dissipation structure on the top of the processor on the fourth side surface.
  • the first deflector 201 is disposed on the fan, one end of the first deflector 201 is fixed on the third side or the fourth side, and the other end is fixed on the side of the fan.
  • one end is fixed on the third side or the fourth side, and the other end is fixed on the processor on the heat dissipation structure at the top.
  • control system further includes a solid-state disk box 22 disposed in the casing, so as to extract a large amount of data stored by the domain controller for offline analysis.
  • the solid state drive case 22 is fixed at the downwind of the casing 10 , that is, the solid state drive case 22 is disposed inside the second side surface, inside the casing 10 and located in the casing top of 10.
  • control system further includes an installation bracket 23, the installation bracket has a receiving groove, and the solid-state disk box 22 is inserted into the groove horizontally.
  • control system further includes a display unit 21 to facilitate the identification of the working state of the domain controller.
  • the display unit 21 includes a display panel 210 disposed on the top of the casing and a light guide structure 211 disposed between the display panel and the substrate, and the light guide structure 211 is a transparent light guide columnar structure.
  • connector plugs are also provided outside the first side surface for realizing electrical connection of various functional devices, wherein all the connector plugs are distributed along the direction from the third side surface to the fourth side surface. Determine the position of the connector on the board according to the circuit schematic diagram, the actual wiring requirements on the car, the size of the wire end of the connector, and the hardware.
  • the vehicle control system of the embodiment of the present invention may be applied to a vehicle, and the vehicle control system may be installed on a platform body of the vehicle.
  • the present invention also provides a vehicle equipped with the aforementioned control system.
  • the vehicle described in the present invention may further include sensors, and the sensors mainly used include scanning laser radar, visible light camera, millimeter-wave radar, ultrasonic sensor, wheel odometer, IMU and GPS, etc., to realize 360-degree perception of the surrounding environment without dead angle, With less redundancy, it provides reliable and stable environmental perception data; it can easily and quickly perform sensor calibration, and can meet the needs of real-time calibration result verification.
  • different sensors form a set of independent sensor modules to cover a specific detection area and range. Combining the information of all sensors, the data of the surrounding environment can be obtained in real time, and the drivable road surface, as well as other pedestrians and vehicles can be detected, and then the control system can guide the vehicle (such as a vehicle) to drive automatically.
  • the thermal simulation software Flotherm is used to carry out a simulation simulation, and the simulation results show that the temperature of the domain controller is reduced to the minimum, and the best cooling is achieved.
  • each device has no overtemperature under the ambient temperature of 50°C, and has a large margin, indicating that the domain controller can meet the normal working conditions.
  • the domain controller When the domain controller is fully loaded, the temperature of several positions in Table 1 is measured with thermocouple sensors. During the simulation, the devices with the worst temperature resistance have no over-temperature conditions during the actual measurement, which proves the air cooling scheme. Effectively, it can replace the complicated water cooling scheme to make the domain controller work within the ideal temperature range.
  • the present invention also compares the air-cooled structure and the water-cooled structure, and the results are shown in Table 3.
  • the air-cooled structure of the present invention has a good heat dissipation effect, its size is smaller, the weight is lighter, the cost is lower, the modification of the vehicle is smaller, the reliability is better, the maintenance is better, and the satisfaction of Domain controllers have temperature requirements.
  • the vehicle control system of the present invention applies the air-cooling structure scheme, introduces cooling air, and obtains the best cooling effect through simulation and optimization of the air-guiding structure, ensuring that the domain controller works within a suitable temperature range.
  • the air-cooled structure is portable in installation and easy to maintain; simple in structure, relatively small in weight and external dimensions; high in reliability and low in manufacturing cost, which can greatly shorten the remodeling time of vehicles, and is less dependent on vehicle layout, and is suitable for Modifications for different models.
  • the heat can be effectively dissipated and the cost can be further reduced.
  • the disclosed apparatus and method may be implemented in other manners.
  • the device embodiments described above are only illustrative.
  • the division of the units is only a logical function division. In actual implementation, there may be other division methods.
  • multiple units or components may be combined or May be integrated into another device, or some features may be omitted, or not implemented.
  • Various component embodiments of the present invention may be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof.
  • a microprocessor or a digital signal processor (DSP) may be used in practice to implement some or all of the functions of some modules according to the embodiments of the present invention.
  • DSP digital signal processor
  • the present invention may also be implemented as apparatus programs (eg, computer programs and computer program products) for performing part or all of the methods described herein.
  • Such a program implementing the present invention may be stored on a computer-readable medium, or may be in the form of one or more signals. Such signals may be downloaded from Internet sites, or provided on carrier signals, or in any other form.

Abstract

一种车辆的控制系统及车辆，车辆的控制系统包括：域控制器，安装于车辆的主体内，用于接收车辆的多个传感器检测的周围环境的参数并对参数进行计算，以实现车辆的控制；域控制器包括壳体（10）和风冷结构，风冷结构设置于壳体的第一侧面（101），配置为将冷却风从第一侧面（101）导入与第一侧面（101）相对的第二侧面（102），以使域控制器产生的热量散出。该车辆的控制系统应用风冷结构的方案，保证域控制器工作在合适的温度范围内。

Description

一种车辆以及车辆的控制系统
说明书
技术领域
本发明总地涉及自动驾驶领域，更具体地涉及一种车辆以及车辆的控制系统。
背景技术
自动驾驶汽车可通过多传感器(例如相机、激光雷达、毫米波雷达等)实现大范围甚至360度地感知周围环境，进行自主控制与导航，从而带领乘客到达目的地。由于自动驾驶汽车对周围环境的感知依赖于更为复杂的算法，传统的汽车处理器已无法运行这类算法，从而激光雷达、相机、毫米波雷达等车载传感器采集车辆周围的环境信息数据后，需要输入专用的域控制器做统一的融合和处理。受限于现有的硬件水平，域控制器搭载的芯片功耗较高，发热量非常大。如果不能及时将热量散出，会影响域控制器的处理速度，严重时可能造成宕机，影响乘员的驾驶感受及人身安全。而若为了达到更好的对域控制器的散热，现有的方法通常需要将域控制器的散热系统布置到整车前后以实现更好的冷却效果，但这样会对车辆的改装提出更高的要求，并且在改装后会对车辆本身的空间及外观造成影响。
因此，如何快速而有效地将域控制器的热量散出并且减小对车辆的改装成为目前亟待解决的问题。
发明内容
为了解决上述问题中的至少一个而提出了本发明。具体地，本发明一方面提供了一种车辆的控制系统，所述控制系统包括：
域控制器，安装于所述车辆的主体内，用于接收所述车辆的多个传感器检测的周围环境的参数并对所述参数进行计算，以实现所述车辆的控制；
所述域控制器包括壳体和风冷结构，所述风冷结构设置于所述壳体的第一侧面，配置为将所述冷却风从所述第一侧面导入与所述第一侧面相对的第二侧面，以使所述域控制器产生的热量散出。
可选地，所述域控制器包括：
通讯结构，设置于所述壳体内；
若干处理器，设置于所述通讯结构的周围并且与所述通讯结构通讯连接，用于接收所述传感器检测的周围环境的参数并对所述参数进行计算。
可选地，在所述处理器和/或所述通讯结构的顶部设置有散热结构。
可选地，所述散热结构包括设置于所述处理器和/或所述通讯结构的顶部的多个相互间隔的且竖直放置的板状散热鳍片。
可选地，所述域控制器还包括：
基板，设置于所述壳体的底板上，其中，所述基板包括相对设置的第一表面和第二表面，所述处理器和所述通讯结构装载固定于所述基板的第一表面上。
可选地，在所述基板的第二表面上设置有中空的第一凸起，在所述壳体的底板上设置有支撑结构，所述基板固定于所述壳体的底板上后，所述第一凸起和所述支撑结构相接触。
可选地，所述第一凸起为螺母，和/或所述支撑结构为凸起的柱状结构。
可选地，在所述壳体的底板上还设置有散热凸台，其中所述散热凸台设置于所述处理器和/或所述通讯结构的下方。
可选地，所述散热凸台和所述基板之间设置有弹性导热元件，所述弹性导热元件填充所述散热凸台和所述基板之间的缝隙。
可选地，所述弹性导热元件包括导热凝脂。
可选地，所述壳体的材质为金属材料。
可选地，在所述第一侧面设置第一数目的所述域控制器的功能器件，在所述第二侧面设置第二数目的所述域控制器的功能器件，所述第一数目大于所述第二数目。
可选地，在所述第一侧面设置的所述域控制器的功能器件具有第一高度，在所述第二侧面设置的所述域控制器的功能器件具有第二高度，所述第一高度大于所述第二高度。
可选地，所述壳体的第一侧面设置于所述车辆的前端或与所述前端相对设置的尾端。
可选地，所述风冷结构包括第一导风罩，所述第一导风罩设置于所述 壳体的外部，配置为将所述冷却风导入所述壳体内。
可选地，所述风冷结构包括第二导风罩，所述第二导风罩设置于所述壳体的内部，配置为梳理所述冷却风流经所述域控制器的气流。
可选地，所述第二导风罩包括从所述第一侧面至第二侧面依次设置的第一导流板和第二导流板，其中所述第一导流板水平设置，所述第二导流板向下倾斜设置。
可选地，所述第二导流板与水平面之间的夹角范围为18度-43度。
可选地，所述第二导风罩还包括第三导流板，所述第三导流板包括水平设置的第一部分和竖直设置的第二部分，其中，所述第二部分设置于所述第一部分的两侧。
可选地，第一导流板、第二导流板和所述第三导流板一体设置或互相连接。
可选地，所述壳体还包括相对设置的第三侧面和第四侧面，所述第一导流板、第二导流板和所述第三导流板的一端固定于所述第三侧面上，和/或所述第一导流板、第二导流板和所述第三导流板的另一端固定于所述第四侧面上或固定于第四侧面的处理器顶部的散热结构上。
可选地，所述第一导风罩为具有开口的腔体结构，所述第一侧面上设置有与所述开口相对应的进风口，以将所述冷却风导入所述壳体。
可选地，在所述第二侧面上设置有出风口。
可选地，所述风冷结构还包括冷却风输送设备，设置于所述壳体内部并且设置于所述进风口处。
可选地，所述冷却风输送设备包括多个风机。
可选地，所述风冷结构的第二导风罩中的第一导流板固定于所述冷却风输送设备上。
可选地，所述控制系统还包括设置于所述壳体内的固态硬盘盒。
可选地，所述固态硬盘盒设置于所述第二侧面内侧，并且位于所述壳体的顶部。
可选地，所述控制系统还包括安装支架，所述固态硬盘盒架设于所述安装支架上。
可选地，所述控制系统还包括显示单元，配置为显示所述域控制器的 工作状态。
可选地，所述显示单元包括设置于所述壳体顶部的显示面板以及设置于所述显示面板和基板之间的导光结构。
可选地，所述导光结构为透明的导光柱状结构。
可选地，所述冷却风为所述车辆制冷设备产生的制冷风。
可选地，所述控制系统的上表面与所述车辆后备箱的地面基本平齐。
本发明的另一方面提供了一种车辆，所述车辆的主体内安装有前文所述的控制系统。
本发明的车辆的控制系统，应用风冷结构的方案，引入冷却风，通过仿真优化导风结构获得了最佳的冷却效果，保证域控制器工作在合适的温度范围内。所述风冷结构的安装便携，易于维护；结构简单，重量和外形尺寸相对较小；可靠性高，制造成本低，可大大缩短车辆的改装时间并减少改装影响，且对车辆布置的依赖较小，适用于不同车型的改装。通过本发明所述改进不仅可以有效地将热量散出同时进一步降低了成本。
附图说明
为了更清楚地说明本发明实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1示出了本发明一个实施例中的所述域控制器的整体结构的示意图；
图2示出了本发明一个实施例中的所述域控制器的内部构成的结构示意图；
图3示出了本发明一个实施例中的所述域控制器中所述处理器的安装方式示意图；
图4示出了本发明一个实施例中的所述域控制器中壳体的底板的结构示意图；
图5示出了本发明一个实施例中的所述风冷结构中第一导风罩的结构示意图；
图6示出了本发明一个实施例中的所述风冷结构中第二导风罩的结构示意图；
图7示出了本发明一个实施例中的所述控制系统的内部构成的结构示意图。
附图标识
10、壳体
101、第一侧面
102、第二侧面
103、第三侧面
104、第四侧面
105、顶板
106、底板
11、基板
12、处理器
13、通讯结构
14、散热结构
15、第一凸起
16、支撑结构
17、螺栓
18、散热凸台
19、第一导风罩
191、开口
20、第二导风罩
201、第一导流板
202、第二导流板
203、第三导流板
2031、第一部分
2032、第二部分
21、显示单元
210、显示面板
211、导光结构
22、固态硬盘盒
23、安装支架
24、进风口
25、冷却风输送设备
26、出风口
具体实施方式
为了使得本发明的目的、技术方案和优点更为明显，下面将参照附图详细描述根据本发明的示例实施例。显然，所描述的实施例仅仅是本发明的一部分实施例，而不是本发明的全部实施例，应理解，本发明不受这里描述的示例实施例的限制。基于本发明中描述的本发明实施例，本领域技术人员在没有付出创造性劳动的情况下所得到的所有其它实施例都应落入本发明的保护范围之内。
在下文的描述中，给出了大量具体的细节以便提供对本发明更为彻底的理解。然而，对于本领域技术人员而言显而易见的是，本发明可以无需一个或多个这些细节而得以实施。在其他的例子中，为了避免与本发明发生混淆，对于本领域公知的一些技术特征未进行描述。
应当理解的是，本发明能够以不同形式实施，而不应当解释为局限于这里提出的实施例。相反地，提供这些实施例将使公开彻底和完全，并且将本发明的范围完全地传递给本领域技术人员。
在此使用的术语的目的仅在于描述具体实施例并且不作为本发明的限制。在此使用时，单数形式的“一”、“一个”和“所述/该”也意图包括复数形式，除非上下文清楚指出另外的方式。还应明白术语“组成”和/或“包括”，当在该说明书中使用时，确定所述特征、整数、步骤、操作、元件和/或部件的存在，但不排除一个或更多其它的特征、整数、步骤、操作、元件、部件和/或组的存在或添加。在此使用时，术语“和/或”包括相关所列项目的任何及所有组合。
为了彻底理解本发明，将在下列的描述中提出详细的结构，以便阐释本发明提出的技术方案。本发明的可选实施例详细描述如下，然而除了这些详细描述外，本发明还可以具有其他实施方式。
目前自动驾驶汽车中域控制器搭载的芯片功耗较高，发热量非常大。如果不能及时将热量散出，会影响域控制器的处理速度，严重时可能造成 宕机，影响乘员的驾驶感受及人身安全。
为了解决该问题，目前自动驾驶的域控制器通常使用水冷散热技术，除水冷散热本身的结构外，车辆上还必须配备水泵、水箱、管路等附件。如对普通车辆进行自动驾驶改装，将涉及到整车部件的变动，准备周期长，改动量较大。
另外，水冷散热的域控制器的尺寸较大，占用较多的车内空间；重量大，非常不利于汽车的轻量化；为避免水路堵塞或回流，对管路的布置有较高的要求；最严重的是，水冷方案面临可靠性差的问题，一旦水管接头或者冷板自身出现泄漏，会直接使电路板短路报废，造成不可挽回的损失。
为了解决上述问题，本发明提供了一种车辆的控制系统，所述控制系统包括：
域控制器，安装于所述车辆的主体内，用于接收所述车辆的多个传感器检测的周围环境的参数并对所述参数进行计算，以实现所述车辆的控制；
所述域控制器包括壳体和风冷结构，所述风冷结构设置于所述壳体的第一侧面，配置为将所述冷却风从所述第一侧面导入与所述第一侧面相对的第二侧面，以使所述域控制器产生的热量散出。
本发明的车辆的控制系统，应用风冷结构的方案，引入冷却风，通过仿真优化导风结构获得了最佳的冷却效果，保证域控制器工作在合适的温度范围内。所述风冷结构的安装便携，易于维护；结构简单，重量和外形尺寸相对较小；可靠性高，制造成本低，可大大缩短车辆的改制时间，且对车辆布置的依赖较小，适用于不同车型的改装。通过本发明所述改进不仅可以有效地将热量散出同时进一步降低了成本。
下面结合附图1-图7，对本申请的车辆的控制系统进行详细说明。在不冲突的情况下，下述的实施例及实施方式中的特征可以相互组合。
所述车辆的控制系统，用于接收所述车辆的多个传感器检测的周围环境的参数并对所述参数做融合计算，自动完成一系列规划，并向车辆执行机构发出控制命令，以实现对车辆的控制。
其中，所述控制系统可以应用于车辆，特别是无人驾驶汽车，除此之外还可以进一步应用于无人机、飞机、船等移动设备。
下文为了便于对本发明的车辆的控制系统进行解释和说明，主要以控制系统应用于车辆的情况为例。
作为示例，所述域控制器设置于车辆的主体中，例如，内嵌在例如车辆的车身中，在保证所述域控制器能正常工作的前提下，能够最大限度隐藏域控制器，避免了对车辆(例如车辆)的外形和美观的破坏，降低对车辆的改动。
在本发明的一具体实施例中，所述域控制器设置于车辆尾部的后备箱下方的空间内，一方面便于将车辆产生的冷却风通入所述域控制器中，一方面减小对车辆的改动。
进一步，所述控制系统的上表面与所述车辆后备箱的地面基本平齐，以避免对所述后备箱的正常使用造成影响。
下面对所述域控制器的构成进行详细的说明，如图1和图2所示，其中所述域控制器包括：壳体10、风冷结构、通讯结构13以及若干处理器12。
其中，所述壳体10用于形成容纳空间，以容纳所述域控制器的各个功能器件，同时对其内部的功能器件起到保护作用。此外，所述壳体10还用于对所述风冷结构起到支撑和固定作用，例如所述风冷结构的导风板可以固定设置于所述壳体的侧壁上等。此外，所述壳体10上还可以设置部分显示装置。
为了满足上述功能，所述壳体10需要选用具有一定硬度、强度、轻质以及能够快速散热的材料。
在本发明中，所述壳体10可以选用金属材料，在一具体实施例中，所述壳体10可以选用铝合金，铝合金不仅质量较轻，还能快速散热。需要说明的是，壳体还可以选用其他材料，可以根据实际需要进行选择。
其中，所述壳体10的形状可以根据车辆的形状以及安装位置进行设计，并不局限于某一种，在本发明的一实施例中，所述壳体的形状呈方形盒，例如正方体或长方体形状的盒。
其中，所述壳体10由6块铝合金板拼合而成，所述6块铝合金板之间可以拆卸，以便于检修。
在本发明的一实施例中，所述壳体包括四个侧面、一个顶板105和一个底板106，如图1所示，所述四个侧面包括相对设置的第一侧面101和第二侧面102，以及相对设置的第三侧面103和第四侧面104。
其中，所述风冷结构设置于所述壳体的第一侧面101，配置为将所述 冷却风从所述第一侧面101导入与所述第一侧面相对的第二侧面102，以使所述域控制器产生的热量散出。
其中，所述域控制器包括通讯结构13和若干处理器12，其中，所述通讯结构13和若干处理器12设置于所述壳体内。
其中，所述处理器12用于接收所述车辆的多个传感器检测的周围环境的参数并对所述参数做融合计算，其中所述处理器12的种类和数目可以根据实际需要进行选择，在此不做进一步的限定。
其中，所述通讯结构13可以选用交换机(switch)，其与所述处理器12通讯连接，在本发明的一实施例中，所述通讯结构13为处理器通讯交换芯片。
其中，如图2所示，在本发明中将所述处理器12设置于所述通讯结构13的周围，例如环绕所述通讯结构13设置，将所述处理器12设置于所述通讯结构13的周围一方面可以缩短处理器12和所述通讯结构13之间的连接电路，减小所述域控制器的基板的面积，减小域控制器的空间，另一方面可以保证所述处理器12和所述通讯结构13之间通讯信号的完整和传输。
此外，除了将所述处理器12设置于所述通讯结构13的周围之外，还可以将所述处理器12更集中地设置于第一侧面101，即更加集中的设置于冷却风的上游，更有利于冷却风对集中于上游的处理器12进行冷却，也更有利于域控制器整体的散热，提高散热效率。
在本发明的一实施例中，如图2所示，例如所述域控制器包括七个处理器12和一个通讯结构13，其中，四个处理器12设置于所述第一侧面101，即冷却风的上游，例如在第一侧面间隔并排设置，三个处理器12设置于更靠近第二侧面102的位置，例如在第二侧面间隔并排设置，在所述四个处理器12和所述三个处理器之间设置所述通讯结构13。
在本发明中在所述域控制器的下游风口布置较少或高度较低的硬件设备，减小散热风阻。
具体地，冷却风的方向为从所述第一侧面101向所述第二侧面102时，在所述第一侧面设置第一数目的所述域控制器的功能器件，在所述第二侧面设置第二数目的所述域控制器的功能器件，所述第一数目大于所述第二 数目。
同时，在所述第一侧面设置的所述域控制器的功能器件具有第一高度，在所述第二侧面设置的所述域控制器的功能器件具有第二高度，所述第一高度大于所述第二高度。
其中，所述功能器件包括所述处理器12和所述通讯结构13，但并不局限于上述两种器件。所述域控制器还可以进一步包含其他功能器件，例如可以包括MOS晶体管，功能电感，时钟芯片，相机板卡，网卡GPU等等，在此不再一一列举。
可选地，为了更快更有效的将上述功能器件产生的热量及时散出，本发明在所述功能器件上还设置有散热结构14，例如至少在所述处理器12和/或所述通讯结构13的顶部设置有散热结构14。
其中，如图2所示，所述散热结构14为设置于所述处理器12和/或所述通讯结构13的顶部的多个板状散热鳍片，其中，所述板状散热鳍片相互间隔设置，并且竖直放置于所述处理器12和/或所述通讯结构13的顶部，所述板状散热鳍片之间的间距可以根据需要进行设置。
其中，所述散热结构14包括多个平行设置的板状散热鳍片，或者相邻的所述板状散热鳍片之间可以相互接触。
进一步，所述域控制器还包括：基板11，设置于所述壳体的底板106上，用于承载上述各功能器件。其中，所述基板11包括相对设置的第一表面和第二表面，所述处理器12和所述通讯结构13装载固定于所述基板11的第一表面上。
其中，所述基板11可以包括PCB基板(Printed Circuit Board，印制电路板)、陶瓷基板、预注塑(Pre-mold)基板等等各种类型的基板，陶瓷基板可以是氮化铝或氧化铝基板。
其中，所述PCB由不同的元器件和多种复杂的工艺技术处理等制作而成，其中PCB线路板的结构有单层、双层、多层结构，不同的层次结构其制作方式是不同的。
可选地，印刷电路板主要由焊盘、过孔、安装孔、导线、元器件、接插件、填充、电气边界等组成。
进一步，印刷电路板常见的板层结构包括单层板(Single Layer PCB)、 双层板(Double Layer PCB)和多层板(Multi Layer PCB)三种，其具体结构如下所述：
(1)单层板：即只有一面敷铜而另一面没有敷铜的电路板。通常元器件放置在没有敷铜的一面，敷铜的一面主要用于布线和焊接。
(2)双层板：即两个面都敷铜的电路板，通常称一面为顶层(Top Layer)，另一面为底层(Bottom Layer)。一般将顶层作为放置元器件面，底层作为元器件焊接面。
(3)多层板：即包含多个工作层面的电路板，除了顶层和底层外还包含若干个中间层，通常中间层可作为导线层、信号层、电源层、接地层等。层与层之间相互绝缘，层与层的连接通常通过过孔来实现。
其中，印刷电路板包括许多类型的工作层面，如信号层、防护层、丝印层、内部层等，在此不再赘述。
此外，在本申请中所述基板还可以选用陶瓷基板，陶瓷基板是指铜箔在高温下直接键合到氧化铝(Al 2O 3)或氮化铝(AlN)陶瓷基片表面(单面或双面)上的特殊工艺板。所制成的超薄复合基板具有优良电绝缘性能，高导热特性，优异的软钎焊性和高的附着强度，并可像PCB板一样能刻蚀出各种图形，具有很大的载流能力。
进一步，所述基板11可以为预注塑(Pre-mold)基板，其中，所述预注塑基板中具有注塑导线和引脚，所述注塑导线嵌于所述基板的主体结构之内，所述引脚位于所述基板的主体结构的表面，例如内表面和/或外表面等，以实现所述基板分别与所述功能器件的电连接。
在本发明中可以选择散热效果更好的基板。为了进一步提高散热效果，在所述基板和所述功能器件之间还可以进一步设置热沉。所述热沉的材料包括金属或金属化材料。
可选地，如图3和图4所示，在所述基板11的第二表面上设置有中空的第一凸起15，在所述壳体的底板上设置有支撑结构16，在将所述基板固定于所述壳体的底板106上后，所述基板11固定于所述壳体的底板上后，所述第一凸起15和所述支撑结构16相接触，以对所述基板11进行支撑，防止所述基板11发生弯曲变形。
进一步，所述第一凸起15和所述支撑结构16相接触但是并不相互连 接为一体，以在发生故障时可以快速拆卸进行检修。
在本发明的一实施例中，其中所述第一凸起15为螺母，例如PCB下表面焊接有M3螺母，所述支撑结构16设置为凸起的柱状结构，例如所述支撑结构设置为凸台。
进一步，在所述壳体的底板106上还设置有散热凸台18，用于将所述基板产生的热量及时散出，其中所述散热凸台18设置于所述处理器和/或所述通讯结构的下方。例如，在所述基板PCB的下表面有散热需求的芯片在底板的对应位置均设计有散热凸台18，其高度较低，防止装配PCB时磕碰元器件。
为了进一步提高散热效果，防止所述间隙形成空气隔层，在所述散热凸台18和所述基板11之间设置有弹性导热元件，所述弹性导热元件填充所述散热凸台和所述基板之间的缝隙，消除所述空气隔层，进一步提高散热效率。
其中，所述弹性导热元件包括导热凝脂，但是并不局限于导热凝脂，具有弹性且导热性能良好的材料均可。
在本发明中，所述风冷结构设置于所述壳体的第一侧面101，其中所述壳体的第一侧面101设置于所述车辆的前端或与所述前端相对设置的尾端。当第一侧面101设置于所述车辆的前端，此时冷却风的方向为从车辆的尾部吹向车辆的头部；当第一侧面101设置于所述车辆的尾端，此时冷却风的方向为从车辆的头部吹向车辆的尾部，可以根据冷却风的位置进行选择。
在本发明中所述冷却风可以为外部输送的制冷风，还可以为车辆自身产生的制冷风。
在本发明的一实施例中，所述冷却风可以采用车辆自身产生的制冷风，其中，所述第一侧面101设置于靠近所述制冷风出口的一端。例如，所述制冷风产生于靠近车辆前端位置，则所述第一侧面101设置于车辆的前端，若所述制冷风产生于靠近车辆尾端位置，则所述第一侧面设置于车辆的尾部，以更加便于将所述车辆产生的制冷风导入所述风冷结构中。
在本发明的一实施例中，车辆的空调设置于汽车尾部，因此所述壳体的第一侧面设置于车辆的尾部，靠近后备箱的位置。
所述风冷结构包括第一导风罩19，如图5所示，所述第一导风罩19设置于所述壳体10的外部，用于将所述冷却风导入所述壳体10内。
其中，如图5所示，所述第一导风罩为具有开口191的腔体结构，所述第一侧面101上设置有与所述开口相对应的进风口24，如图7所示，以将所述冷却风导入所述壳体。
其中，所述第一导风罩19的一端可以固定在车辆本体的一侧，所述第一导风罩的底部固定于所述车辆本体承载所述域控制器的水平面上。
所述第一导风罩19可以设置为具有与所述进风口对应的所述开口和将冷却风导入所述第一导风罩的入口，除了所述开口和所述入口之外完全封闭的结构。
进一步，所述第一导风罩19的底部可以通过固定于车辆本体承载所述域控制器的水平面上，以封闭所述第一导风罩的底部，形成封闭的腔体。
在本发明的一实施例中，所述第一导风罩19布置在车辆后备箱的右侧空调口附近，并在通过所述第一导风罩19导入车辆空调冷气。
进一步，所述风冷结构还包括第二导风罩20，所述第二导风罩20设置于所述壳体10的内部，所述第二导风罩20用于引导所述冷却风的流向，梳理所述冷却风流经所述域控制器表面的气流。
进一步，如图7所示，在所述第二侧面上设置有出风口26，所述第一导风罩19将冷却风引入所述域控制器的壳体10内，所述第二导风罩20梳理所述冷却风流经所述域控制器表面的气流，然后经所述第二侧面102上的所述出风口26引出所述壳体，同时将域控制器散发的热量带走。
进一步，为了加快风速流动，提高散热效果，所述风冷结构还包括冷却风输送设备25，设置于所述壳体内部并且设置于所述进风口处，以将第一导风罩19引入的冷却风导入所述壳体内并进行加速。
其中，所述冷却风输送设备包括多个风机。例如在所述壳体内部的所述第一侧面上设置4台风机。
在本发明的一实施例中，选用4个6025型轴流风机。在车辆模拟风机的实际使用条件，测试不同转速下在前排中间位置产生的噪音情况，发现转速在4500～5000时(占空比60％～65％)，主观听感较好，噪音计测试值为43dB，风冷方案不会带来较大的噪音污染。
其中，如图6和图7所示，所述第二导风罩20包括从所述第一侧面101至第二侧面102依次设置的第一导流板201、第二导流板202和第三导流板203，即沿冷却风的流向依次设置第一导流板201、第二导流板202和第三导流板203。
其中，所述第一导流板201水平设置，其用于固定所述第二导风罩20，例如将所述第二导风罩20设置于冷却风输送设备25上。
其中，所述第二导流板202向下倾斜设置，在本发明的一实施例中，所述第二导流板202与水平面之间的夹角范围为18度-43度，例如在一实施例中，所述夹角为27度，通过不断调整风机相对于散热结构的高度以及第二导流板202的倾斜角度，使芯片散热结构表面在增加少量风阻的前提下温度降至最低，达到最佳的冷却效果，以使各个器件在50℃的环境温度下均没有超温，并有较大的余量，所述域控制器可以满足正常的工况使用。
当所述第二导流板202与水平面之间的夹角为18度时，所述控制系统的最高温度为51.6℃，当所述第二导流板202与水平面之间的夹角为27度时，所述控制系统的最高温度为50.0℃，当所述第二导流板202与水平面之间的夹角为43度时，所述控制系统的最高温度为52.1℃，因此第二导流板202与水平面之间的夹角范围为18度-43度时，均满足所述控制系统的温度需求。
其中，所述第三导流板203可以水平或倾斜设置，可以根据所述第二侧面各个功能器件的高度进行选择。
进一步，所述第三导流板203包括水平设置的第一部分2031和竖直设置的第二部分2032，其中，所述第二部分2032设置于所述第一部分2031的两侧，即所述第二部分2032靠近于所述第三侧面103和第四侧面104设置。
其中，所述第一导流板201、第二导流板202和所述第三导流板203一体设置，或第一导流板201、第二导流板202和所述第三导流板203单独设置然后互相连接为一体。
其中，所述第一导流板201、第二导流板202和所述第三导流板203的一端固定于所述第三侧面上，和/或所述第一导流板201、第二导流板202和所述第三导流板203的另一端固定于所述第四侧面上或固定于第四侧面 的处理器顶部的散热结构上。
在本发明的一实施例中，所述第一导流板201设置所述风机上，所述第一导流板201的一端固定于第三侧面或第四侧面上，另一端固定于所述风机一侧。
在本发明的一实施例中，所述第二导流板202和第三导流板203相互连接之后，一端固定于所述第三侧面或第四侧面上，另一端固定于所述处理器顶部的散热结构上。
可选地，如图7所示，所述控制系统还包括设置于所述壳体内的固态硬盘盒22，以便于将所述域控制器存储的大量的数据取出，进而用于离线分析。
其中，所述固态硬盘盒22固定于所述壳体10的下风口处，即所述固态硬盘盒22设置于所述第二侧面内侧，并且位于所述壳体10内部并且位于所述壳体10的顶部。
其中，所述控制系统还包括安装支架23，所述安装支架具有容纳凹槽，所述固态硬盘盒22水平地插入所述凹槽中。
进一步，所述控制系统还包括显示单元21，方便识别域控制器的工作状态。
可选地，所述显示单元21包括设置于所述壳体顶部的显示面板210以及设置于所述显示面板和基板之间的导光结构211，所述导光结构211为透明的导光柱状结构。
进一步，在所述第一侧面的外面还设置有连接器插头，用于实现各个功能器件的电连接，其中，所述所有连接器插头沿第三侧面至第四侧面方向上分布。根据电路原理图、车上实际的走线要求、连接器的线端尺寸，与硬件，确定板上连接器的位置。
具体地，本发明实施方式的车辆的控制系统可应用于车辆，所述车辆的控制系统可安装在车辆的平台本体。
本发明还提供了一种车辆，所述车辆安装有前文所述的控制系统。本发明中所述车辆还可以进一步包括传感器，主要使用的传感器包括扫描式激光雷达、可见光相机、毫米波雷达、超声波传感器、车轮里程计、IMU和GPS等，实现360度无死角感知周围环境，以较少的冗余，提供可靠和稳定的环境感知数据；可以方便、快速的进行传感器标定，以及可满足实 时标定结果验证的需求。另外，不同的传感器组成一套独立的传感器模块，从而覆盖特定的检测区域和范围。综合所有传感器的信息，可以实时得到周围环境的数据，检测出可行驶路面，以及其他的行人和车辆，再交由所述控制系统引导车辆(例如车辆)自动驾驶。
在本发明中通过对上述域控制器和所述风冷结构的改进，采用热仿真软件Flotherm，进行了模拟仿真，仿真结果表明，所述域控制器的温度降至最低，达到最佳的冷却效果，各个器件在50℃的环境温度下均没有超温，并有较大的余量，表明域控制器可以满足正常的工况使用。
针对上述改进，对改进后控制系统的温度进行了测量，结果如表1。
表1温度测试
Figure PCTCN2020103119-appb-000001
在域控制器整机满负载的工况下，用热电偶传感器测量表1中几个位置的温度，仿真时耐温最差的几个器件在实测时均无超温情况，证明风冷方案有效，可以代替复杂的水冷方案，使域控制器工作在理想的温度范围内。
此外，还对改进后控制系统进行了噪声测试，结果如表2。
表2噪声测试
Figure PCTCN2020103119-appb-000002
Figure PCTCN2020103119-appb-000003
将风机转速调至60％，在第一侧面和第二侧面分别实测噪音分贝值，结果都是在人耳可接受范围内。实测时，主观听感也较好，证明风冷方案不会带来较大的噪音污染。
此外，本发明还对比了风冷结构和水冷结构，结果如表3。
表3风冷和水冷对比
Figure PCTCN2020103119-appb-000004
通过表3可以看出，本发明所述风冷结构具有良好的散热效果，其尺 寸更小，重量更轻，成本更低，对车改装变动更小，可靠行更好，更好维护，满足域控制器对温度需求。
本发明的车辆的控制系统，应用风冷结构的方案，引入冷却风，通过仿真优化导风结构获得了最佳的冷却效果，保证域控制器工作在合适的温度范围内。所述风冷结构的安装便携，易于维护；结构简单，重量和外形尺寸相对较小；可靠性高，制造成本低，可大大缩短车辆的改制时间，且对车辆布置的依赖较小，适用于不同车型的改装。通过本发明所述改进不仅可以有效地将热量散出同时进一步降低了成本。
尽管这里已经参考附图描述了示例实施例，应理解上述示例实施例仅仅是示例性的，并且不意图将本发明的范围限制于此。本领域普通技术人员可以在其中进行各种改变和修改，而不偏离本发明的范围和精神。所有这些改变和修改意在被包括在所附权利要求所要求的本发明的范围之内。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本发明的范围。
在本申请所提供的几个实施例中，应该理解到，所揭露的设备和方法，可以通过其它的方式实现。例如，以上所描述的设备实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个设备，或一些特征可以忽略，或不执行。
在此处所提供的说明书中，说明了大量具体细节。然而，能够理解，本发明的实施例可以在没有这些具体细节的情况下实践。在一些实例中，并未详细示出公知的方法、结构和技术，以便不模糊对本说明书的理解。
类似地，应当理解，为了精简本发明并帮助理解各个发明方面中的一个或多个，在对本发明的示例性实施例的描述中，本发明的各个特征有时被一起分组到单个实施例、图、或者对其的描述中。然而，并不应将该本发明的方法解释成反映如下意图：即所要求保护的本发明要求比在每个权 利要求中所明确记载的特征更多的特征。更确切地说，如相应的权利要求书所反映的那样，其发明点在于可以用少于某个公开的单个实施例的所有特征的特征来解决相应的技术问题。因此，遵循具体实施方式的权利要求书由此明确地并入该具体实施方式，其中每个权利要求本身都作为本发明的单独实施例。
本领域的技术人员可以理解，除了特征之间相互排斥之外，可以采用任何组合对本说明书(包括伴随的权利要求、摘要和附图)中公开的所有特征以及如此公开的任何方法或者设备的所有过程或单元进行组合。除非另外明确陈述，本说明书(包括伴随的权利要求、摘要和附图)中公开的每个特征可以由提供相同、等同或相似目的替代特征来代替。
此外，本领域的技术人员能够理解，尽管在此所述的一些实施例包括其它实施例中所包括的某些特征而不是其它特征，但是不同实施例的特征的组合意味着处于本发明的范围之内并且形成不同的实施例。例如，在权利要求书中，所要求保护的实施例的任意之一都可以以任意的组合方式来使用。
本发明的各个部件实施例可以以硬件实现，或者以在一个或者多个处理器上运行的软件模块实现，或者以它们的组合实现。本领域的技术人员应当理解，可以在实践中使用微处理器或者数字信号处理器(DSP)来实现根据本发明实施例的一些模块的一些或者全部功能。本发明还可以实现为用于执行这里所描述的方法的一部分或者全部的装置程序(例如，计算机程序和计算机程序产品)。这样的实现本发明的程序可以存储在计算机可读介质上，或者可以具有一个或者多个信号的形式。这样的信号可以从因特网网站上下载得到，或者在载体信号上提供，或者以任何其他形式提供。
应该注意的是上述实施例对本发明进行说明而不是对本发明进行限制，并且本领域技术人员在不脱离所附权利要求的范围的情况下可设计出替换实施例。在权利要求中，不应将位于括号之间的任何参考符号构造成对权利要求的限制。本发明可以借助于包括有若干不同元件的硬件以及借助于适当编程的计算机来实现。在列举了若干装置的单元权利要求中，这些装置中的若干个可以是通过同一个硬件项来具体体现。单词第一、第二、以及第三等的使用不表示任何顺序。可将这些单词解释为名称。

Claims (35)

  1. 一种车辆的控制系统，其特征在于，所述控制系统包括：
    域控制器，安装于所述车辆的主体内，用于接收所述车辆的多个传感器检测的周围环境的参数并对所述参数进行计算，以实现所述车辆的控制；
    所述域控制器包括壳体和风冷结构，所述风冷结构设置于所述壳体的第一侧面，配置为将所述冷却风从所述第一侧面导入与所述第一侧面相对的第二侧面，以使所述域控制器产生的热量散出。
  2. 根据权利要求1所述的控制系统，其特征在于，所述域控制器包括：
    通讯结构，设置于所述壳体内；
    若干处理器，设置于所述通讯结构的周围并且与所述通讯结构通讯连接，用于接收所述传感器检测的周围环境的参数并对所述参数进行计算。
  3. 根据权利要求2所述的控制系统，其特征在于，在所述处理器和/或所述通讯结构的顶部设置有散热结构。
  4. 根据权利要求3所述的控制系统，其特征在于，所述散热结构包括设置于所述处理器和/或所述通讯结构的顶部的多个相互间隔的且竖直放置的板状散热鳍片。
  5. 根据权利要求2所述的控制系统，其特征在于，所述域控制器还包括：
    基板，设置于所述壳体的底板上，其中，所述基板包括相对设置的第一表面和第二表面，所述处理器和所述通讯结构装载固定于所述基板的第一表面上。
  6. 根据权利要求5所述的控制系统，其特征在于，在所述基板的第二表面上设置有中空的第一凸起，在所述壳体的底板上设置有支撑结构，所述基板固定于所述壳体的底板上后，所述第一凸起和所述支撑结构相接触。
  7. 根据权利要求6所述的控制系统，其特征在于，所述第一凸起为螺母，和/或所述支撑结构为凸起的柱状结构。
  8. 根据权利要求5所述的控制系统，其特征在于，在所述壳体的底板上还设置有散热凸台，其中所述散热凸台设置于所述处理器和/或所述通 讯结构的下方。
  9. 根据权利要求8所述的控制系统，其特征在于，所述散热凸台和所述基板之间设置有弹性导热元件，所述弹性导热元件填充所述散热凸台和所述基板之间的缝隙。
  10. 根据权利要求9所述的控制系统，其特征在于，所述弹性导热元件包括导热凝脂。
  11. 根据权利要求2所述的控制系统，其特征在于，所述壳体的材质为金属材料。
  12. 根据权利要求1至11中任一项所述的控制系统，其特征在于，在所述第一侧面设置第一数目的所述域控制器的功能器件，在所述第二侧面设置第二数目的所述域控制器的功能器件，所述第一数目大于所述第二数目。
  13. 根据权利要求前述任一项所述的控制系统，其特征在于，在所述第一侧面设置的所述域控制器的功能器件具有第一高度，在所述第二侧面设置的所述域控制器的功能器件具有第二高度，所述第一高度大于所述第二高度。
  14. 根据权利要求前述任一项所述的控制系统，其特征在于，所述壳体的第一侧面设置于所述车辆的前端或与所述车辆的前端相对设置的尾端。
  15. 根据权利要求前述任一项所述的控制系统，其特征在于，所述风冷结构包括第一导风罩，所述第一导风罩设置于所述壳体的外部，配置为将所述冷却风导入所述壳体内。
  16. 根据权利要求前述任一项所述的控制系统，其特征在于，所述风冷结构包括第二导风罩，所述第二导风罩设置于所述壳体的内部，配置为梳理所述冷却风流经所述域控制器的气流。
  17. 根据权利要求16所述的控制系统，其特征在于，所述第二导风罩包括从所述第一侧面至第二侧面依次设置的第一导流板和第二导流板，其中所述第一导流板水平设置，所述第二导流板向下倾斜设置。
  18. 根据权利要求17所述的控制系统，其特征在于，所述第二导流板与水平面之间的夹角范围为18度-43度。
  19. 根据权利要求17所述的控制系统，其特征在于，所述第二导风 罩还包括第三导流板，所述第三导流板包括水平设置的第一部分和竖直设置的第二部分，其中，所述第二部分设置于所述第一部分的两侧。
  20. 根据权利要求19所述的控制系统，其特征在于，第一导流板、第二导流板和所述第三导流板一体设置或互相连接。
  21. 根据权利要求19所述的控制系统，其特征在于，所述壳体还包括相对设置的第三侧面和第四侧面，所述第一导流板、第二导流板和所述第三导流板的一端固定于所述第三侧面上，和/或所述第一导流板、第二导流板和所述第三导流板的另一端固定于所述第四侧面上或固定于第四侧面的处理器顶部的散热结构上。
  22. 根据权利要求15所述的控制系统，其特征在于，所述第一导风罩为具有开口的腔体结构，所述第一侧面上设置有与所述开口相对应的进风口，以将所述冷却风导入所述壳体。
  23. 根据权利要求22所述的控制系统，其特征在于，在所述第二侧面上设置有出风口。
  24. 根据权利要求22所述的控制系统，其特征在于，所述风冷结构还包括冷却风输送设备，设置于所述壳体内部并且设置于所述进风口处。
  25. 根据权利要求24所述的控制系统，其特征在于，所述冷却风输送设备包括多个风机。
  26. 根据权利要求24所述的控制系统，其特征在于，所述风冷结构的第二导风罩中的第一导流板固定于所述冷却风输送设备上。
  27. 根据权利要求11所述的控制系统，其特征在于，所述控制系统还包括设置于所述壳体内的固态硬盘盒。
  28. 根据权利要求27所述的控制系统，其特征在于，所述固态硬盘盒设置于所述第二侧面内侧，并且位于所述壳体的顶部。
  29. 根据权利要求27所述的控制系统，其特征在于，所述控制系统还包括安装支架，所述固态硬盘盒架设于所述安装支架上。
  30. 根据权利要求11所述的控制系统，其特征在于，所述控制系统还包括显示单元，配置为显示所述域控制器的工作状态。
  31. 根据权利要求30所述的控制系统，其特征在于，所述显示单元包括设置于所述壳体顶部的显示面板以及设置于所述显示面板和基板之间 的导光结构。
  32. 根据权利要求31所述的控制系统，其特征在于，所述导光结构为透明的导光柱状结构。
  33. 根据权利要求前述任一项所述的控制系统，其特征在于，所述冷却风为所述车辆制冷设备产生的制冷风。
  34. 根据权利要求1所述的控制系统，其特征在于，所述控制系统的上表面与所述车辆后备箱的地面基本平齐。
  35. 一种车辆，其特征在于，所述车辆的主体内安装有权利要求1至34之一所述的控制系统。
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CN111385985A (zh) * 2020-04-26 2020-07-07 李富龙 电动车集成控制器

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