WO2022006987A1 - 射频模组及具有其的电子设备 - Google Patents
射频模组及具有其的电子设备 Download PDFInfo
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- WO2022006987A1 WO2022006987A1 PCT/CN2020/102729 CN2020102729W WO2022006987A1 WO 2022006987 A1 WO2022006987 A1 WO 2022006987A1 CN 2020102729 W CN2020102729 W CN 2020102729W WO 2022006987 A1 WO2022006987 A1 WO 2022006987A1
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- WIPO (PCT)
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- circuit board
- antenna structure
- radio frequency
- frequency module
- low temperature
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
Definitions
- the present application relates to the field of electro-acoustic conversion, and in particular, to a sound-generating device and an electronic device having the same.
- 5G With the commercialization of 5G, it means not only the maturity of technology and the popularization of networks, but also terminals and applications.
- antenna radio frequency and other transceiver signals are also required to realize 5G data transmission, and the radio frequency module comes into being.
- major module manufacturers are also actively preparing 5G RF modules.
- the RF modules on the market usually all use high-frequency circuit boards to be stacked at one time.
- the RF front-end 10' and the antenna structure 30' are processed by high-frequency circuit boards.
- the high-frequency circuit boards have excellent performance, However, the stacking process is difficult and the cost is high.
- the connecting wire 20' connecting the main board and the high-frequency circuit board needs to be electrically connected to the high-frequency circuit board through a separate connector male end 51' and a connector female end 52', which is complicated in structure and high in cost.
- the purpose of the present application is to provide a radio frequency module and an electronic device having the same, which are used to solve the problems of complex structure and high processing cost of the radio frequency module in the prior art.
- the radio frequency module of the present application is applied to electronic equipment, and is electrically connected to the main board of the electronic equipment, and the radio frequency module includes a first circuit board stacked by a multi-layer substrate, A second circuit board stacked by a multi-layer substrate and an antenna structure stacked by a multi-layer substrate, the first circuit board and the antenna structure are laminated and laminated, the first circuit board includes a radio frequency front-end circuit that is electrically connected to the antenna structure, and the second circuit The board is used to electrically connect the first circuit board and the main board.
- One of the first circuit board and the antenna structure is made of the same material as the second circuit board, and the first circuit board and the antenna structure are made of the same material as the second circuit board.
- One is integrally formed with the second circuit board.
- one of the first circuit board and the antenna structure that is integrally formed with the second circuit board shares at least one layer of substrate with the second circuit board.
- the first circuit board is made of low temperature co-fired ceramic
- the second circuit board and the antenna structure are made of liquid crystal polymer
- the first circuit board and the second circuit board are made of liquid crystal polymer
- the antenna structure is made of Made of low temperature co-fired ceramics.
- the first circuit board is made of low temperature co-fired ceramics
- the second circuit board and the antenna structure are made of PTFE, or the first circuit board and the second circuit board are made of PTFE, the antenna
- the structure is made using low temperature co-fired ceramics.
- the first circuit board is made of low temperature co-fired ceramics
- the second circuit board and the antenna structure are made of polyimide resin
- the first circuit board and the second circuit board are made of polyimide resin
- the antenna structure is made of low temperature co-fired ceramics.
- the first circuit board is bonded or welded to the antenna structure.
- the second circuit board is a flexible circuit board.
- a connector is provided on the second circuit board, and the connector is used to connect the second circuit board and the main board.
- the antenna structure includes a radiation surface, and the radiation surface is disposed on a side of the antenna structure away from the first circuit board.
- the present application also provides an electronic device including a radio frequency module, where the radio frequency module is a radio frequency module including all or part of the above technical structures.
- the beneficial effect of the present application is that the antenna structure and the circuit board where the RF front-end circuit are located are separately arranged and processed separately, so that each part can be selected according to functional requirements, which is beneficial to reduce the processing cost of the RF module.
- One of the first circuit board and the antenna structure is made of the same material as the second circuit board, and the one of the first circuit board and the antenna structure that has the same material as the second circuit board is integrally formed with the second circuit board, instead of a separate
- the provided connector for connecting the first circuit board and the second circuit board simplifies the structure of the radio frequency module and reduces the processing cost of the radio frequency module.
- FIG. 1 is a schematic structural diagram of Embodiment 1 of the sound-emitting device of the present application
- FIG. 2 is a schematic structural diagram of the sound-emitting device of FIG. 1 from another perspective;
- FIG. 3 is a schematic structural diagram of the sound-emitting device of FIG. 1 from another perspective;
- FIG. 4 is a schematic diagram of a partially enlarged structure at the position A of the sound-emitting device of FIG. 3;
- Embodiment 2 is a schematic structural diagram of Embodiment 2 of the sound-emitting device of the application.
- FIG. 6 is a schematic structural diagram of the sound-emitting device of FIG. 5 from another perspective;
- FIG. 7 is a schematic structural diagram of the sound-emitting device of FIG. 5 from another viewing angle
- FIG. 8 is a partial enlarged structural schematic diagram of the sound-emitting device at B of FIG. 7;
- FIG. 9 is a schematic structural diagram of an embodiment of a sound-emitting device in the prior art.
- the radio frequency module of this embodiment is applied to electronic equipment, and is electrically connected to the main board (not shown in the figure) of the electronic equipment.
- the radio frequency module of this embodiment includes a first The circuit board 10, the second circuit board 20 stacked by the multi-layer substrate, and the antenna structure 30 stacked by the multi-layer substrate, the first circuit board 10 and the antenna structure 30 are laminated and laminated along the X direction in the figure, the first circuit board 10 It includes a radio frequency front-end circuit electrically connected to the antenna structure 30 .
- the second circuit board 20 is used to electrically connect the first circuit board 10 and the main board.
- the antenna structure 30 and the second circuit board 20 are made of the same material and integrally formed.
- the antenna structure 30 and the first circuit board 10 where the RF front-end circuit is located are separately arranged and processed separately, so that each part can be selected according to functional requirements, which is beneficial to reduce the processing cost of the RF module.
- the antenna structure 30 and the second circuit board 20 are made of the same material and integrally formed, which replaces the separately provided connector for connecting the antenna structure 30 and the second circuit board 20, simplifies the structure of the radio frequency module, and reduces the The processing cost of the RF module.
- the antenna structure 30 of this embodiment includes a radiation surface 31 , and the radiation surface 31 is disposed on a side of the antenna structure 30 away from the first circuit board 10 .
- the antenna structure 30 of this embodiment and the second circuit board 20 share at least one layer of substrate 21 .
- the first circuit board 10 of this embodiment uses low temperature co-fired ceramics (Low Temperature Co-fired ceramics).
- Co-fired Ceramic referred to as LTCC
- the first circuit board 10 and the antenna structure 30 can be connected and fixed by surface mount technology (Surface Mount Technology, referred to as SMT).
- SMT Surface Mount Technology
- the second circuit board 20 and the antenna structure 30 are made of liquid crystal polymer (Liquid Crystal Polymer, referred to as LCP) is integrally formed.
- the high-frequency circuit board and the antenna structure may also be fixed by adhesive bonding.
- the second circuit board and the antenna structure can also be made of PTFE or polyimide resin,
- the second circuit board 20 in this embodiment is a flexible circuit board, and the flexible circuit board can be bent and deformed to a certain extent so as to be easily connected to the main board.
- the second circuit board 20 in this embodiment is provided with a connector 40 , and the connector 40 is used to connect the radio frequency module to the main board, so as to realize the electrical connection between the radio frequency module and the main board. .
- the sound-emitting device of the second embodiment changes the connection mode between the antenna structure 30 , the second circuit board 20 and the first circuit board 10 on the basis of the first embodiment. Specifically, as shown in FIGS. 5 to 8 , this embodiment The first circuit board 10 and the second circuit board 20 in the example are made of the same material and integrally formed.
- the antenna structure 30 of this embodiment is made of low temperature co-fired ceramic (LTCC), the first circuit board 10 and the antenna structure 30 can be connected and fixed by surface mount technology (SMT), the second circuit board 20 and the first
- the circuit board 10 is integrally formed using liquid crystal polymer (LCP).
- the first circuit board and the second circuit board are made of polytetrafluoroethylene or polyimide resin.
- the high-frequency circuit board and the antenna structure may also be fixed by adhesive bonding.
- the first circuit board 10 of the present embodiment is stacked on the antenna structure 30 along the X direction in the figure.
- the present application also provides an electronic device.
- the electronic device (not shown in the figure) according to this embodiment includes a sound-generating device.
- the sound-generating device is a sound-generating device including all or part of the above technical structures.
- the electronic device of this embodiment has the advantages of simple structure and low processing cost.
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Computer Networks & Wireless Communication (AREA)
- Support Of Aerials (AREA)
- Telephone Set Structure (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
本申请提供了一种射频模组及具有其的电子设备，其中射频模组应用于电子设备，且与电子设备的主板电连接，射频模组包括由多层基板堆叠的第一电路板、由多层基板堆叠的第二电路板和由多层基板堆叠的天线结构，第一电路板与天线结构叠层贴合，第一电路板包括与天线结构电连接的射频前端电路，第二电路板用于电连接第一电路板和主板，第一电路板和天线结构中的一个与第二电路板使用相同的材质制成，第一电路板和天线结构中与第二电路板材质相同的一个与第二电路板一体成型。本申请的技术方案可以有效地解决现有技术中射频模组结构复杂、加工成本较高的问题。
Description
本申请涉及电声转换领域，尤其涉及一种发声器件及具有其的电子设备。
随着5G的商用，不仅意味着技术的成熟和网络的普及，更加意味着终端和应用。在5G移动设备中，除了需要芯片还需要天线射频等收发信号实现5G数据传输，射频模组应运而声。随着5G芯片的陆续发布，各大模组厂商也积极的准备5G射频模组。
目前市面上的射频模组通常全部采用高频电路板一次性整体堆叠，如图9所示，射频前端10’和天线结构30’均使用高频电路板加工，虽然高频电路板性能优良，但其堆叠加工难度大，成本较高。并且连接主板和高频电路板的连接线20’需要通过单独的连接器公端51’和连接器母端52’实现与高频电路板的电连接，结构复杂、成本较高。
本申请的目的在于提供一种射频模组及具有其的电子设备，用于解决现有技术中射频模组结构复杂、加工成本较高的问题。
本申请的技术方案如下：为达到上述目的，一方面，本申请的射频模组应用于电子设备，且与电子设备的主板电连接，射频模组包括由多层基板堆叠的第一电路板、由多层基板堆叠的第二电路板和由多层基板堆叠的天线结构，第一电路板与天线结构叠层贴合，第一电路板包括与天线结构电连接的射频前端电路，第二电路板用于电连接第一电路板和主板，第一电路板和天线结构中的一个与第二电路板使用相同的材质制成，第一电路板和天线结构中与第二电路板材质相同的一个与第二电路板一体成型。
优选地，第一电路板和天线结构中与第二电路板一体成型的一个，至少与第二电路板共用一层基板。
优选地，第一电路板使用低温共烧陶瓷制成，第二电路板和天线结构使用液晶聚合物制成，或者，第一电路板和第二电路板使用液晶聚合物制成，天线结构使用低温共烧陶瓷制成。
优选地，第一电路板使用低温共烧陶瓷制成，第二电路板和天线结构使用聚四氟乙烯制成，或者，第一电路板和第二电路板使用聚四氟乙烯制成，天线结构使用低温共烧陶瓷制成。
优选地，第一电路板使用低温共烧陶瓷制成，第二电路板和天线结构使用聚酰亚胺树脂制成，或者，第一电路板和第二电路板使用聚酰亚胺树脂制成，天线结构使用低温共烧陶瓷制成。
优选地，第一电路板与天线结构粘接或焊接固定。
优选地，第二电路板为柔性电路板。
优选地，第二电路板上设置有连接器，连接器用于连接第二电路板和主板。
优选地，天线结构包括辐射面，辐射面设于天线结构背离第一电路板的一侧。
另一方面，本申请还提供了一种电子设备，包括射频模组，射频模组为包含上述全部或部分技术结构的射频模组。
本申请的有益效果在于：天线结构与射频前端电路所在的电路板分体设置、分别加工，使各部分可以根据功能需要进行选材，有利于降低射频模组的加工成本。第一电路板和天线结构中的一个与第二电路板使用相同的材质制成，第一电路板和天线结构中与第二电路板材质相同的那个与第二电路板一体成型，取代了单独设置的用于连接第一电路板和第二电路板的连接器，简化了射频模组的结构，降低了射频模组的加工成本。
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请的发声器件的实施例一的结构示意图；
图2为图1的发声器件另一视角下的结构示意图；
图3为图1的发声器件另一视角下的结构示意图；
图4为图3的发声器件的A处的局部放大结构示意图；
图5为本申请的发声器件的实施例二的结构示意图；
图6为图5的发声器件另一视角下的结构示意图；
图7为图5的发声器件另一视角下的结构示意图；
图8为图7的发声器件的B处的局部放大结构示意图；以及
图9为现有技术中的发声器件的实施例的结构示意图。
上述附图中包含下列附图标记：
10、第一电路板；20、第二电路板；21、基板；30、天线结构；31、辐射面；40、连接器；10’、射频前端；20’、连接线；30’、天线结构； 51’、连接器公端；52’、连接器母端。
为了便于理解本申请，下面将参照相关附图对本申请进行更全面的描述。附图中给出了本申请的较佳的实施例。但是，本申请可以通过许多其他不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本申请的公开内容的理解更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。本文中在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。本文所使用的术语“及／或”包括一个或多个相关的所列项目的任意的和所有的组合。
实施例一
本实施例的射频模组应用于电子设备，且与电子设备的主板（图中未示出）电连接，如图1所示，本实施例的射频模组包括由多层基板堆叠的第一电路板10、由多层基板堆叠的第二电路板20和由多层基板堆叠的天线结构30，第一电路板10与天线结构30沿图中X方向叠层贴合，第一电路板10包括与天线结构30电连接的射频前端电路，第二电路板20用于电连接第一电路板10和主板，天线结构30与第二电路板20使用相同的材质制成并一体成型。
应用本实施例的技术方案，天线结构30与射频前端电路所在的第一电路板10分体设置、分别加工，使各部分可以根据功能需要进行选材，有利于降低射频模组的加工成本。天线结构30与第二电路板20使用相同的材质制成并一体成型，取代了单独设置的用于连接天线结构30和第二电路板20的连接器，简化了射频模组的结构，降低了射频模组的加工成本。
如图1所示，本实施例的天线结构30包括辐射面31，辐射面31设于天线结构30背离第一电路板10的一侧。
如图4所示，本实施例的天线结构30与第二电路板20至少共用一层基板21。
优选地，本实施例的第一电路板10使用低温共烧陶瓷（Low Temperature
Co-fired Ceramic，简称LTCC）制成，第一电路板10与天线结构30可通过表面贴装技术（Surface Mount Technology，简称SMT）连接固定。第二电路板20和天线结构30使用液晶聚合物（Liquid Crystal
Polymer，简称 LCP）一体成型制成。
需要说明的是，在图中未示出的其他实施例中，高频电路板与天线结构也可通过胶粘接固定。
在图中未示出的其他实施例中，第二电路板和天线结构也可以使用聚四氟乙烯或聚酰亚胺树脂制成，
如图1和图2所示，本实施例的第二电路板20为柔性电路板，柔性电路板能够在一定程度上进行弯曲变形，便于与主板相连。
如图2和图3所示，本实施例的第二电路板20上设置有连接器40，连接器40用于将射频模组连接在主板上，实现射频模组与主板之间的电连接。
实施例二
实施例二的发声器件在实施例一的基础上改变了天线结构30、第二电路板20以及第一电路板10之间的连接方式，具体地，如图5至图8所示，本实施例的第一电路板10与第二电路板20使用相同的材质制成并一体成型。
具体地，本实施例的天线结构30使用低温共烧陶瓷（LTCC）制成，第一电路板10与天线结构30可通过表面贴装技术（SMT）连接固定，第二电路板20和第一电路板10使用液晶聚合物（LCP）一体成型制成。
在图中未示出的其他实施例中，第一电路板和第二电路板使用聚四氟乙烯或聚酰亚胺树脂制成。
需要说明的是，在图中未示出的其他实施例中，高频电路板与天线结构也可通过胶粘接固定。
参考图5至图8，本实施例的第一电路板10沿图中X方向叠层设置在天线结构30上。
本申请还提供了一种电子设备，根据本实施例的电子设备（图中未示出）包括发声器件，具体地，发声器件为包含上述全部或部分技术结构的发声器件。本实施例的电子设备具备结构简单、加工成本低的优点。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述的仅是本申请的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本申请创造构思的前提下，还可以做出改进，但这些均属于本申请的保护范围。
Claims (10)
- 一种射频模组，应用于电子设备，且与所述电子设备的主板电连接，其特征在于，所述射频模组包括由多层基板堆叠的第一电路板、由多层基板堆叠的第二电路板和由多层基板堆叠的天线结构，所述第一电路板与所述天线结构叠层贴合，所述第一电路板包括与所述天线结构电连接的射频前端电路，所述第二电路板用于电连接所述第一电路板和所述主板，所述第一电路板和所述天线结构中的一个与所述第二电路板使用相同的材质制成，所述第一电路板和所述天线结构中与所述第二电路板材质相同的一个与所述第二电路板一体成型。
- 根据权利要求1所述的射频模组，其特征在于，所述第一电路板和所述天线结构中与所述第二电路板一体成型的一个，至少与所述第二电路板共用一层基板。
- 根据权利要求2所述的射频模组，其特征在于，所述第一电路板使用低温共烧陶瓷制成，所述第二电路板和所述天线结构使用液晶聚合物制成，或者，所述第一电路板和所述第二电路板使用液晶聚合物制成，所述天线结构使用低温共烧陶瓷制成。
- 根据权利要求2所述的射频模组，其特征在于，所述第一电路板使用低温共烧陶瓷制成，所述第二电路板和所述天线结构使用聚四氟乙烯制成，或者，所述第一电路板和所述第二电路板使用聚四氟乙烯制成，所述天线结构使用低温共烧陶瓷制成。
- 根据权利要求2所述的射频模组，其特征在于，所述第一电路板使用低温共烧陶瓷制成，所述第二电路板和所述天线结构使用聚酰亚胺树脂制成，或者，所述第一电路板和所述第二电路板使用聚酰亚胺树脂制成，所述天线结构使用低温共烧陶瓷制成。
- 根据权利要求1所述的射频模组，其特征在于，所述第一电路板与所述天线结构粘接或焊接固定。
- 根据权利要求1所述的射频模组，其特征在于，所述第二电路板为柔性电路板。
- 根据权利要求1所述的射频模组，其特征在于，所述第二电路板上设置有连接器，所述连接器用于连接所述第二电路板和主板。
- 根据权利要求1所述的射频模组，其特征在于，所述天线结构包括辐射面，所述辐射面设于所述天线结构背离所述第一电路板的一侧。
- 一种电子设备，包括射频模组，其特征在于，所述射频模组为权利要求1至9中任意一项所述的射频模组。
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| CN114867197A (zh) * | 2022-04-25 | 2022-08-05 | 中国电子科技集团公司第二十九研究所 | 射频基板互联结构及射频电子设备 |
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| CN102158244A (zh) * | 2011-01-23 | 2011-08-17 | 电子科技大学 | 一种集成封装的射频前端系统 |
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