WO2022007245A1 - 射频模组 - Google Patents

射频模组 Download PDF

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Publication number
WO2022007245A1
WO2022007245A1 PCT/CN2020/123394 CN2020123394W WO2022007245A1 WO 2022007245 A1 WO2022007245 A1 WO 2022007245A1 CN 2020123394 W CN2020123394 W CN 2020123394W WO 2022007245 A1 WO2022007245 A1 WO 2022007245A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
radio frequency
module
frequency circuit
antenna unit
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PCT/CN2020/123394
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English (en)
French (fr)
Inventor
王建安
陈勇利
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技(新加坡)有限公司
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Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(新加坡)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2022007245A1 publication Critical patent/WO2022007245A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits

Definitions

  • the utility model relates to the technical field of radio frequency terminals, in particular to a radio frequency module used in 5G products.
  • 5G mobile devices are undoubtedly the most common and portable 5G terminal devices.
  • 5G mobile devices include chips, antennas and radio frequency devices that process signals sent and received to realize 5G data transmission. Therefore, radio frequency modules have become an important module of 5G mobile devices.
  • the radio frequency module of the related art includes a high-frequency circuit board and an antenna unit that is stacked and fixed on the high-frequency circuit board.
  • the RF module adopts the high-frequency circuit board and is processed together with the antenna unit.
  • the material and processing costs are high; in addition, the number of stacks of the high-frequency circuit boards More, generally more than 10 layers, the processing is more difficult; and the dielectric constant (English Dielectric Constant, DK) value of the high-frequency circuit board is low, which is used in the processing of the antenna unit, which directly causes the
  • the volume of the antenna unit is relatively large, which is not conducive to miniaturization applications.
  • the radio frequency module described in the related art also needs to be connected to the radio frequency front-end module and the peripheral circuit module through a connector, and the assembly is relatively complicated.
  • the purpose of the utility model is to provide a radio frequency module with small size, easy processing and assembly.
  • the present invention provides a radio frequency module, which includes a high frequency circuit board, an antenna unit stacked and fixed on one side of the high frequency circuit board, and a connection for connecting with an external motherboard Module; one of the antenna unit and the high-frequency circuit board is made of low temperature co-fired ceramic technology.
  • the antenna unit is made of low temperature co-fired ceramic technology.
  • the high-frequency circuit board is made of one of polytetrafluoroethylene, liquid crystal polymer material and improved polyimide.
  • connection module and the high-frequency circuit board are integrally formed.
  • the high frequency circuit board is made of low temperature co-fired ceramic technology.
  • the antenna unit is made of one of polytetrafluoroethylene, liquid crystal polymer material and improved polyimide.
  • connection module and the high-frequency circuit board are integrally formed.
  • connection module includes a flexible circuit board and two connectors that are detachably connected to the flexible circuit board, wherein one of the connectors is connected to the high-frequency circuit board, and the other is used for Connect an external motherboard.
  • connection module includes a flexible circuit board and two connectors that are detachably connected to the flexible circuit board, wherein one of the connectors is connected to the high-frequency circuit board, and the other is used for Connect an external motherboard.
  • the antenna unit and the high-frequency circuit board are formed and fixed by surface mounting technology or gluing.
  • one of the antenna unit and the high-frequency circuit board of the radio frequency module of the present invention is made of low-temperature co-fired ceramic technology, and then the high-frequency circuit board and the antenna unit are assembled.
  • the high-frequency circuit board and the antenna unit are processed and reassembled separately, so that the products are effectively stacked and distributed to different products, which greatly reduces the processing difficulty.
  • the antenna unit or the high-frequency circuit board made of low-temperature co-fired ceramic technology can reduce the size of the antenna, thereby reducing the volume of the radio frequency module and saving the radio frequency module The space occupied in the whole machine is conducive to assembly and application.
  • FIG. 1 is a three-dimensional schematic diagram of a radio frequency module of the present invention
  • FIG. 2 is an exploded view of a part of the three-dimensional structure of the radio frequency module of the present invention
  • FIG. 3 is a schematic diagram of a three-dimensional assembly structure of a radio frequency module and a mainboard of the present invention
  • FIG. 4 is a schematic three-dimensional structural diagram of another embodiment of the radio frequency module of the present invention.
  • FIG. 5 is a schematic diagram of the three-dimensional assembly structure of the radio frequency module and the main board in FIG. 4;
  • FIG. 6 is a schematic three-dimensional structure diagram of another embodiment of the radio frequency module of the present invention.
  • FIG. 7 is an exploded view of a part of the three-dimensional structure of the radio frequency module of FIG. 6;
  • FIG. 8 is a schematic diagram of a three-dimensional assembly structure of the radio frequency module and the main board in FIG. 6 .
  • the present invention provides a radio frequency module 100 .
  • the RF module 100 can be connected to an external mainboard 200 .
  • the radio frequency module 100 is used for realizing 5G data transmission by sending and receiving signals.
  • the radio frequency module 100 and the main board 200 are installed in a device with 5G function.
  • the radio frequency module 100 includes a high frequency circuit board 1 for circuit wiring connection, an antenna unit 2 stacked and fixed on one side of the high frequency circuit board 1 , and a connection module 5 .
  • the connection module 5 is used for connecting with the external motherboard 200 .
  • One of the antenna unit 2 and the high frequency circuit board 1 is made of low temperature co-fired ceramic technology.
  • the high-frequency circuit board 1 and the antenna unit 2 are separately fabricated from two different materials and then stacked. In this structure, the high-frequency circuit board 1 and the antenna unit 2 are processed and reassembled separately, so that the radio frequency module 100 is effectively stacked and distributed to different components, which greatly reduces the difficulty of processing.
  • the low temperature co-fired ceramic technology (English Low Temperature The high-frequency circuit board 1 or the antenna unit 2 made of Co-fired Ceramic (LTCC for short) can reduce the size of the antenna, thereby reducing the volume of the RF module 100 and saving the RF module in the whole machine
  • the occupied space is small, that is, the radio frequency module 100 is small in size, which is beneficial to assembly and application.
  • the antenna unit 2 and the high-frequency circuit board 1 are fixed by surface mounting technology (Surface Mounted Technology in English, SMT for short) or gluing.
  • the radio frequency module 100 further includes a radio frequency front-end module 3 and a peripheral circuit module 4 that are electrically connected to the antenna unit 2 .
  • the RF front-end module 3, the peripheral circuit module 4 and the high-frequency circuit board 5 are integrally processed and formed. That is to say, the radio frequency module 100 is assembled with the antenna unit 2 after the radio frequency front end module 3, the peripheral circuit module 4 and the high frequency circuit board 1 are processed together; or the radio frequency front end
  • the module 3 and the peripheral circuit module 4 are integrally processed using high-frequency circuit processing technology, that is, the radio frequency module 100 is processed by high-frequency circuit processing technology for the radio frequency front-end module 3 and the peripheral circuit module 4 Then, it is assembled with the high-frequency circuit board 1 and the antenna unit 2 respectively.
  • the RF front-end module 3, the peripheral circuit module 4 and the high-frequency circuit board 1 can also be processed together, which can save connectors that are electrically connected to each other, thereby reducing assembly and improving the RF model. Group 100 machining and reliability.
  • the high-frequency circuit board 1 is made of polytetrafluoroethylene (Polytetrafluoroethylene). fluoroethylene, referred to as PTFE) or/and liquid crystal polymer (English Liquid Crystal Polymer, referred to as LCP) material.
  • PTFE polytetrafluoroethylene
  • LCP liquid crystal polymer
  • the antenna unit 2 is made of low temperature co-fired ceramic technology.
  • the antenna unit 2 is stacked and fixed on one side of the high-frequency circuit board 1 .
  • the RF front-end module 3 , the peripheral circuit module 4 and the connection module 5 are mounted and fixed on the other side of the high-frequency circuit board 1 .
  • the RF front-end module 3 , the peripheral circuit module 4 and the high-frequency circuit board 1 are processed together into an integral processing and molding structure, which is beneficial to the assembly of the RF module 100 .
  • connection module 5 is used for connecting with the mainboard 200 .
  • the connection module 5 includes a flexible circuit board 51 and two connectors 52 detachably connected to the flexible circuit board 51 , wherein one of the connectors is connected to the high-frequency circuit board 1 , and the other is connected to the high-frequency circuit board 1 .
  • the connector is used to connect the external motherboard 200 . This structure is beneficial to reduce the processing cost of the radio frequency module 100 .
  • the flexible circuit board 51 is made of polytetrafluoroethylene PTFE, liquid crystal polymer LCP, modified polyimide (English Modified Polyimide, referred to as MPI) and polyimide (English Polyimide, referred to as PI) in a material.
  • the second embodiment provides a radio frequency module 100a.
  • the radio frequency module 100a is basically the same as the radio frequency module 100 .
  • the difference from the radio frequency module 100 of the first embodiment is that the connection module 5 a and the high frequency circuit board 1 a are integrally formed.
  • the high-frequency circuit board 1 a is a high-frequency flexible circuit board.
  • the high-frequency circuit board 1 a may also be an ordinary high-frequency circuit board.
  • the high-frequency circuit board 1 a is made of one of polytetrafluoroethylene PTFE, liquid crystal polymer LCP and improved polyimide MPI.
  • the antenna unit 2a is stacked and fixed on one side of the high-frequency circuit board 1a, and the RF front-end module 3a, the peripheral circuit module 4a, and the connection module 5a are installed and fixed on the other side of the high-frequency circuit board 1 a. That is to say, the RF front-end module 3 a, the peripheral circuit module 4 a and the connection module 5 a are mounted and fixed on the high-frequency flexible circuit board.
  • the connection module 5 a includes a connector 51 a that is detachably connected to the high-frequency circuit board 1 a, and the connector 51 a is used to connect to the external motherboard 200 .
  • the connection module 5 a has one less connector than the connection module 5 , which facilitates the assembly of the radio frequency module 100 a, reduces assembly, and improves reliability. sex.
  • Embodiment 3 provides a radio frequency module 100b.
  • the radio frequency module 100 b is basically the same as the radio frequency module 100 .
  • the difference from the radio frequency module 100 of the first embodiment is that the high frequency circuit board 1 b is made of low temperature co-fired ceramic technology; and the antenna unit 2 b is made of polytetrafluoroethylene PTFE, liquid crystal polymer LCP and improved It is made of a kind of material in type polyimide MPI.
  • the antenna unit 2 b is stacked and fixed on one side of the high-frequency circuit board 1 b.
  • the RF front-end module 3b, the peripheral circuit module 4b and the connection module 5b are fixed on the other side of the high-frequency circuit board 1b.
  • the radio frequency front-end module 3 b, the peripheral circuit module 4 b and the high frequency circuit board 1 b are processed together into an integral processing and molding structure, which is beneficial to the assembly of the radio frequency module 100 b.
  • connection module 5b includes a flexible circuit board 51b and two connectors 52b detachably connected to the flexible circuit board 51b, wherein one of the connectors 52b is connected to the high The frequency circuit board 1 b, and the other connector 52 b is used to connect the external motherboard 200 .
  • This structure is beneficial to reduce the processing cost of the radio frequency module 100b.
  • the radio frequency module of the present invention has a small volume and is easy to process and assemble.
  • one of the antenna unit and the high-frequency circuit board of the radio frequency module of the present invention is made of low-temperature co-fired ceramic technology, and then the high-frequency circuit board and the antenna unit are assembled.
  • the high-frequency circuit board and the antenna unit are processed and reassembled separately, so that the products are effectively stacked and distributed to different products, which greatly reduces the processing difficulty.
  • the antenna unit or the high-frequency circuit board made of low-temperature co-fired ceramic technology can reduce the size of the antenna, thereby reducing the volume of the radio frequency module and saving the radio frequency module The space occupied in the whole machine is conducive to assembly and application.

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Abstract

本申请提供了一种射频模组，该射频模组包括高频电路板、叠设固定于所述高频电路板一侧的天线单元以及用于与外部主板连接的连接模块；所述天线单元和所述高频电路板其中之一为低温共烧陶瓷技术制成。与相关技术相比，本申请的射频模组的体积小、易于加工和组装。

Description

射频模组 技术领域
本实用新型涉及射频终端技术领域，尤其涉及一种运用于5G产品的射频模组。
 背景技术
随着5G时代的到来，5G的终端和设备应用的数量不断上升。而在5G产品之中，5G移动设备无疑是最常见、最便携的5G终端设备。目前，5G移动设备包括芯片以及处理收发信号实现5G数据传输的天线和射频器件，因此，射频模组成为5G移动设备的重要模块。
相关技术的所述射频模组包高频电路板和叠设固定于所述高频电路板的天线单元。
 技术问题
然而，相关技术中所述射频模组采用所述高频电路板并与所述天线单元共同加工，虽然性能较优，但是材料及加工成本很高；另外，所述高频电路板的层叠数量较多，一般在10层以上，加工难度较大；还有所述高频电路板的介电常数（英文Dielectric Constant，简称DK）值较低，应用于加工所述天线单元，直接造成所述天线单元的体积较大，不利于小型化应用。在应用上，相关技术中所述射频模组还需要通过连接器与射频前端模块和外围电路模块连接，装配较为复杂。
因此，实有必要提供一种新的射频模组解决上述技术问题。
 技术解决方案
本实用新型的目的在于提供一种体积小、易于加工和组装的射频模组。
为了达到上述目的，本实用新型提供了一种射频模组，该射频模组包括高频电路板、叠设固定于所述高频电路板一侧的天线单元以及用于与外部主板连接的连接模块；所述天线单元和所述高频电路板其中之一为低温共烧陶瓷技术制成。
优选的，所述天线单元为低温共烧陶瓷技术制成。
优选的，所述高频电路板为聚四氟乙烯、液晶聚合物材料及改进型聚酰亚胺中的一种材料制成。
优选的，所述连接模块与所述高频电路板一体成型。
优选的，所述高频电路板为低温共烧陶瓷技术制成。
优选的，所述天线单元为聚四氟乙烯、液晶聚合物材料及改进型聚酰亚胺中的一种材料制成。
优选的，所述连接模块与所述高频电路板一体成型。
优选的，所述连接模块包括柔性电路板和与所述柔性电路板形成可拆卸连接的两个连接器，其中一个所述连接器连接于所述高频电路板，另一个所述连接器用于连接外部主板。
优选的，所述连接模块包括柔性电路板和与所述柔性电路板形成可拆卸连接的两个连接器，其中一个所述连接器连接于所述高频电路板，另一个所述连接器用于连接外部主板。
优选的，所述天线单元与所述高频电路板通过表面组装技术或者胶合形成固定。
 有益效果
与相关技术相比，本实用新型的射频模组的天线单元和高频电路板其中之一采用低温共烧陶瓷技术制成，再将所述高频电路板和所述天线单元组装，该结构将所述高频电路板和所述天线单元分开加工再组装，使得有效的将产品层叠分摊到不同产品，大大的降低了加工难度。另外，由于陶瓷介电常数值较高，采用低温共烧陶瓷技术制成的所述天线单元或所述高频电路板，可减小天线尺寸，从而可减少射频模组体积，节约射频模组在整机内的占用空间，有利于组装和应用。
 附图说明
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本实用新型射频模组的立体结构示意图；
图2为本实用新型射频模组的部分立体结构分解图；
图3为本实用新型射频模组与主板的立体装配结构示意图；
图4为本实用新型射频模组另一种实施例的立体结构示意图；
图5为图4中的射频模组与主板的立体装配结构示意图；
图6为本实用新型射频模组其他一种实施例的立体结构示意图；
图7为图6的射频模组的部分立体结构分解图；
图8为图6中的射频模组与主板的立体装配结构示意图。
 本发明的实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本实用新型的一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本实用新型保护的范围。
请同时参阅图1-8，本实用新型提供了一种射频模组100。所述射频模组100可与外部的主板200连接。所述射频模组100用于实现收发信号实现5G数据传输。所述射频模组100和所述主板200安装于具有5G功能的设备。
所述射频模组100包括用于电路走线连接的高频电路板1、叠设固定于所述高频电路板1一侧的天线单元2以及连接模块5。所述连接模块5用于与外部主板200连接。
所述天线单元2和所述高频电路板1其中之一为低温共烧陶瓷技术制成。所述高频电路板1与所述天线单元2采用两种不同的材料分开制作之后在层叠设置。该结构将所述高频电路板1和所述天线单元2分开加工再组装，使得有效的将所述射频模组100层叠分摊到不同部件，大大的降低了加工难度。另外，由于陶瓷介电常数值较高，采用低温共烧陶瓷技术（英文Low Temperature Co-fired Ceramic ，简称LTCC）制成的所述高频电路板1或者所述天线单元2，可减小天线尺寸，从而可减少所述射频模组100体积，节约射频模组在整机内的占用空间，即所述射频模组100体积小，有利于组装和应用。
所述天线单元2与所述高频电路板1通过表面组装技术（英文Surface Mounted Technology，简称为SMT）或者胶合形成固定。
所述射频模组100还包括与所述天线单元2电连接的射频前端模块3和外围电路模块4。其中，所述射频前端模块3、所述外围电路模块4以及所述高频电路板5为一体加工成型结构。也就是说，所述射频模组100为所述射频前端模块3、所述外围电路模块4以及所述高频电路板1共同加工后与所述天线单元2组装制成；或者所述射频前端模块3和所述外围电路模块4采用高频电路加工技术一体加工成型，也就是说，所述射频模组100为所述射频前端模块3和所述外围电路模块4采用高频电路加工技术加工后分别与所述高频电路板1和所述天线单元2组装制成。另外，还可以将所述射频前端模块3、所述外围电路模块4以及所述高频电路板1一起加工，可以节省相互电连接的连接器，从而减少装配，也有利于提高所述射频模组100的加工和可靠性。
以下分别通过三个实施例对本实用新型进行分别说明：
（实施例一）
请同时参阅图1-3，本实施例提供了一种射频模组100。本实施方式中，所述高频电路板1为聚四氟乙烯（Poly tetra fluoroethylene，简称为PTFE）或/和液晶聚合物（英文Liquid Crystal Polymer，简称为LCP）材料制成。
所述天线单元2为低温共烧陶瓷技术制成。所述天线单元2叠设固定于所述高频电路板1一侧。
所述射频前端模块3、所述外围电路模块4以及所述连接模块5安装固定于所述高频电路板1的另一侧。所述射频前端模块3、所述外围电路模块4以及所述高频电路板1一起加工为一体加工成型结构，有利于射频模组100组装。
所述连接模块5用于与所述主板200连接。具体的，所述连接模块5包括柔性电路板51和与所述柔性电路板51形成可拆卸连接的两个连接器52，其中一个所述连接器连接于所述高频电路板1，另一个所述连接器用于连接外部所述主板200。该结构有利于降低射频模组100的加工成本。
本实施方式中，所述柔性电路板51为聚四氟乙烯PTFE、液晶聚合物LCP、改进型聚酰亚胺（英文Modified Polyimide，简称为MPI）及聚酰亚胺（英文Polyimide，简称为PI）中的一种材料制成。
(实施例二)
请同时参阅图4-5，实施例二提供了一种射频模组100a。
射频模组100a与射频模组100基本相同。与实施例一的射频模组100不同的是：所述连接模块5 a与所述高频电路板1 a一体成型。
本实施方式中，所述高频电路板1 a为高频柔性电路板。当然，所述高频电路板1 a为普通的高频电路板也是可以的。
其中，所述高频电路板1 a为聚四氟乙烯PTFE、液晶聚合物LCP及改进型聚酰亚胺MPI中的一种材料制成。
本实施方式中，所述天线单元2 a叠设固定于所述高频电路板1 a一侧，所述射频前端模块3 a、所述外围电路模块4 a以及所述连接模块5 a安装固定于所述高频电路板1 a的另一侧。也就是说，所述射频前端模块3 a、所述外围电路模块4 a以及所述连接模块5 a安装固定于高频柔性电路板。
所述连接模块5 a包括与所述高频电路板1 a形成可拆卸连接的连接器51 a，所述连接器51 a用于连接外部的所述主板200连接。与实施例一的射频模组100相比，本实施方式中，所述连接模块5 a相对于所述连接模块5少一个连接器，有利于射频模组100a组装，减少装配，同时也提高可靠性。
(实施例三)
请同时参阅图6-8，实施例三提供了一种射频模组100b。
射频模组100 b与射频模组100基本相同。与实施例一的射频模组100不同的是：所述高频电路板1 b为低温共烧陶瓷技术制成；而所述天线单元2 b为聚四氟乙烯PTFE、液晶聚合物LCP及改进型聚酰亚胺MPI中的一种材料制成。
具体的，所述天线单元2 b叠设固定于所述高频电路板1 b一侧。
所述射频前端模块3 b、所述外围电路模块4 b以及所述连接模块5 b固定于所述高频电路板1 b的另一侧。所述射频前端模块3 b、所述外围电路模块4 b以及所述高频电路板1 b一起加工为一体加工成型结构，有利于射频模组100 b组装。
本实施方式中，所述连接模块5b包括柔性电路板51 b和与所述柔性电路板51 b形成可拆卸连接的两个连接器52 b，其中一个所述连接器52 b连接于所述高频电路板1 b，另一个所述连接器52 b用于连接外部所述主板200。该结构有利于降低射频模组100b的加工成本。
综合上述实施例一、实施例二及实施例三，本实用新型的射频模组射频模组的体积小、易于加工和组装。
与相关技术相比，本实用新型的射频模组的天线单元和高频电路板其中之一采用低温共烧陶瓷技术制成，再将所述高频电路板和所述天线单元组装，该结构将所述高频电路板和所述天线单元分开加工再组装，使得有效的将产品层叠分摊到不同产品，大大的降低了加工难度。另外，由于陶瓷介电常数值较高，采用低温共烧陶瓷技术制成的所述天线单元或所述高频电路板，可减小天线尺寸，从而可减少射频模组体积，节约射频模组在整机内的占用空间，有利于组装和应用。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (10)

  1. 一种射频模组，其特征在于，该射频模组包括高频电路板、叠设固定于所述高频电路板一侧的天线单元以及用于与外部主板连接的连接模块；所述天线单元和所述高频电路板其中之一为低温共烧陶瓷技术制成。
  2. 根据权利要求1所述的射频模组，其特征在于，所述天线单元为低温共烧陶瓷技术制成。
  3. 根据权利要求2所述的射频模组，其特征在于，所述高频电路板为聚四氟乙烯、液晶聚合物材料及改进型聚酰亚胺中的一种材料制成。
  4. 根据权利要求2或3所述的射频模组，其特征在于，所述连接模块与所述高频电路板一体成型。
  5. 根据权利要求2或3所述的射频模组，其特征在于，所述连接模块包括柔性电路板和与所述柔性电路板形成可拆卸连接的两个连接器，其中一个所述连接器连接于所述高频电路板，另一个所述连接器用于连接外部主板。
  6. 根据权利要求1所述的射频模组，其特征在于，所述高频电路板为低温共烧陶瓷技术制成。
  7. 根据权利要求6所述的射频模组，其特征在于，所述天线单元为聚四氟乙烯、液晶聚合物材料及改进型聚酰亚胺中的一种材料制成。
  8. 根据权利要求6或7所述的射频模组，其特征在于，所述连接模块与所述高频电路板一体成型。
  9. 根据权利要求6或7所述的射频模组，其特征在于，所述连接模块包括柔性电路板和与所述柔性电路板形成可拆卸连接的两个连接器，其中一个所述连接器连接于所述高频电路板，另一个所述连接器用于连接外部主板。
  10. 根据权利要求1所述的射频模组，其特征在于，所述天线单元与所述高频电路板通过表面组装技术或者胶合形成固定。
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CN1578172A (zh) * 2003-07-30 2005-02-09 奇美通讯股份有限公司 以多层陶瓷形成的射频收发模块
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CN201966901U (zh) * 2011-03-08 2011-09-07 世盟科信（北京）国际科技发展有限公司 一种射频收发装置
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CN1578172A (zh) * 2003-07-30 2005-02-09 奇美通讯股份有限公司 以多层陶瓷形成的射频收发模块
KR20080056043A (ko) * 2006-12-15 2008-06-20 한국과학기술원 엘티씨씨 모듈의 패키지 구조
CN201966901U (zh) * 2011-03-08 2011-09-07 世盟科信（北京）国际科技发展有限公司 一种射频收发装置
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