WO2022004235A1 - Composition de résine thermoplastique, élément associé ainsi que procédé de fabrication de celui-ci, et procédé de développement de conductivité pour composition de résine thermoplastique - Google Patents

Composition de résine thermoplastique, élément associé ainsi que procédé de fabrication de celui-ci, et procédé de développement de conductivité pour composition de résine thermoplastique Download PDF

Info

Publication number
WO2022004235A1
WO2022004235A1 PCT/JP2021/020683 JP2021020683W WO2022004235A1 WO 2022004235 A1 WO2022004235 A1 WO 2022004235A1 JP 2021020683 W JP2021020683 W JP 2021020683W WO 2022004235 A1 WO2022004235 A1 WO 2022004235A1
Authority
WO
WIPO (PCT)
Prior art keywords
thermoplastic resin
resin composition
mass
resin
parts
Prior art date
Application number
PCT/JP2021/020683
Other languages
English (en)
Japanese (ja)
Inventor
裕基 神田
智宏 門間
Original Assignee
ポリプラスチックス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ポリプラスチックス株式会社 filed Critical ポリプラスチックス株式会社
Priority to JP2022533758A priority Critical patent/JP7510504B2/ja
Priority to CN202180046675.8A priority patent/CN115885017B/zh
Publication of WO2022004235A1 publication Critical patent/WO2022004235A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L59/00—Compositions of polyacetals; Compositions of derivatives of polyacetals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables

Definitions

  • the present invention relates to a thermoplastic resin composition, a member formed by molding the thermoplastic resin composition, a method for producing the same, and a method for developing conductivity of the thermoplastic resin composition.
  • Polyacetal resin (hereinafter, also referred to as "POM resin”) is widely used as an engineering plastic because of its excellent various physical and mechanical properties, chemical resistance, and slidability.
  • the POM resin is inferior in conductivity because it is an electric insulator like most other resins. Therefore, it is known to add a conductive filler such as carbon black or carbon fiber in order to impart conductivity to the POM resin (see Patent Documents 1 and 2).
  • a conductive filler such as carbon black or carbon fiber in order to impart conductivity to the POM resin.
  • Patent Documents 1 and 2 As described above, it is possible to impart conductivity by adding a conductive filler to the POM resin, and the addition of the conductive filler is effective not only for the purpose of making the conductive member but also for antistatic.
  • the present inventor has confirmed that the impact resistance and tensile fracture strain are inferior when carbon black or carbon fiber is added as a conductive filler in the POM resin composition. That is, although it is possible to impart conductivity by adding carbon black or carbon fiber, there is a problem that impact resistance and breaking elongation are greatly reduced. Such a problem may also occur in a thermoplastic resin composition containing a thermoplastic resin other than the POM resin.
  • the present invention has been made in view of the above-mentioned conventional problems, and the problems thereof are a thermoplastic resin composition and a member to which conductivity is imparted without significantly reducing impact resistance and tensile fracture strain, and a member thereof. It is an object of the present invention to provide a manufacturing method and a method for developing conductivity of a thermoplastic resin composition.
  • thermoplastic resin composition obtained by melt-kneading at least 0.3 to 2.5 parts by mass of carbon nanostructures with respect to 100 parts by mass of the thermoplastic resin.
  • thermoplastic resin composition obtained by melt-kneading at least 0.3 to 2.5 parts by mass of carbon nanostructures with respect to 100 parts by mass of the thermoplastic resin, and the thermoplastic resin composition.
  • a method for manufacturing a conductive member which comprises a step of forming an object into a predetermined shape.
  • thermoplastic resin composition A method for developing conductivity of a thermoplastic resin composition, wherein at least 0.3 to 2.5 parts by mass of carbon nanostructure is added to 100 parts by mass of the thermoplastic resin and melt-kneaded.
  • thermoplastic resin composition to which conductivity is imparted a member and a method for producing the same, and a method for developing conductivity of the thermoplastic resin composition are provided without significantly reducing impact resistance and tensile fracture strain. Can be provided.
  • thermoplastic resin composition In the thermoplastic resin composition of the present embodiment, at least 0.3 to 2.5 parts by mass of carbon nanostructure (hereinafter, also referred to as “CNS”) is melt-kneaded with 100 parts by mass of the thermoplastic resin. It is characterized by being obtained.
  • carbon nanostructure hereinafter, also referred to as “CNS”.
  • thermoplastic resin composition of the present embodiment by adding a predetermined amount of CNS to the thermoplastic resin and melt-kneading it, conductivity is imparted without significantly reducing impact resistance and tensile fracture strain. To.
  • each component of the thermoplastic resin composition of the present embodiment will be described.
  • the thermoplastic resin includes a crystalline thermoplastic resin, for example, a polyacetal resin (hereinafter, also referred to as “POM resin”), a polyarylene sulfide resin (hereinafter, also referred to as “PAS resin”), and polybutylene.
  • POM resin polyacetal resin
  • PAS resin polyarylene sulfide resin
  • PBT resin terephthalate resin
  • the thermoplastic resin is preferably one selected from the group consisting of polyacetal resin, polyarylene sulfide resin, polybutylene terephthalate resin, polyethylene terephthalate resin, and polyamide resin.
  • the thermoplastic resin will be described with reference to POM resin, PAS resin, and PBT resin, but the present embodiment is not limited thereto.
  • the polyacetal resin is a polymer compound having an oxymethylene group (-CH 2 O-) as a main constituent unit, and includes polyoxymethylene homopolymers and oximethylene copolymers, and any of these may be used.
  • the oxymethylene copolymer has an oxymethylene group as the main repeating unit, and also contains other structural units such as ethylene oxide, 1,3-dioxolane, and 1,4-butanediol formal in a small amount.
  • the polyacetal resin may be one in which the molecule is not only linear but also has a branched or crosslinked structure, or may be a known modified polyoxymethylene into which another organic group is introduced. Further, the polyacetal resin is not particularly limited in terms of the degree of polymerization, and has melt molding processability (for example, a melt flow value (MFR) of 1.0 g / 10 minutes or more under a load of 190 ° C. and 2160 g / 100 g / It may be 10 minutes or less). The polyacetal resin is produced by a known production method.
  • MFR melt flow value
  • the PBT resin is a dicarboxylic acid component containing at least terephthalic acid or an ester-forming derivative thereof (such as an alkyl ester of C1-6 or an acid halide) and an alkylene glycol (1,4-butanediol) having at least 4 carbon atoms. It is a resin obtained by polycondensing with a glycol component containing the ester-forming derivative (acetylated acid or the like).
  • the PBT resin is not limited to homopolybutylene terephthalate, and may be a copolymer containing 60 mol% or more (particularly 75 mol% or more and 95 mol% or less) of butylene terephthalate units.
  • the amount of terminal carboxyl groups in the PBT resin is not particularly limited as long as it does not inhibit the effect of the thermoplastic resin of the present embodiment.
  • the amount of the terminal carboxyl group of the PBT resin is preferably 30 meq / kg or less, more preferably 25 meq / kg or less.
  • the intrinsic viscosity of the PBT resin is preferably 0.65 to 1.20 dL / g.
  • the obtained resin composition is particularly excellent in mechanical properties and fluidity.
  • the intrinsic viscosity is less than 0.65 dL / g, excellent mechanical properties cannot be obtained, and if it exceeds 1.20 dL / g, excellent fluidity may not be obtained.
  • the PBT resin having the above-mentioned intrinsic viscosity can be blended with PBT resins having different intrinsic viscosities to adjust the intrinsic viscosity.
  • a PBT resin having an intrinsic viscosity of 0.8 dL / g can be prepared by blending a PBT resin having an intrinsic viscosity of 0.9 dL / g and a PBT resin having an intrinsic viscosity of 0.7 dL / g.
  • the intrinsic viscosity of the PBT resin is, for example, a value measured in o-chlorophenol under the condition of a temperature of 35 ° C.
  • examples of the dicarboxylic acid component (comonomer component) other than terephthalic acid and its ester-forming derivative include isophthalic acid, phthalic acid, 2,6-naphthalenedicarboxylic acid, 4,4'-dicarboxydiphenyl ether and the like.
  • C4-16 alcandicarboxylic acid such as succinic acid, adipic acid, azelaic acid, sebacic acid;
  • C5-10 cycloalkandicarboxylic acid such as cyclohexanedicarboxylic acid;
  • Examples thereof include ester-forming derivatives (C1-6 alkyl ester derivatives, acid halides, etc.).
  • These dicarboxylic acid components can be used alone or in combination of two or more.
  • C8-12 aromatic dicarboxylic acids such as isophthalic acid and C6-12 arcandicarboxylic acids such as adipic acid, azelaic acid, and sebacic acid are more preferable.
  • examples of the glycol component (comonomer component) other than 1,4-butanediol include ethylene glycol, propylene glycol, trimethylene glycol, 1,3-butylene glycol, hexamethylene glycol, neopentyl glycol, and 1, C2-10 alkylene glycols such as 3-octanediol; polyoxyalkylene glycols such as diethylene glycol, triethylene glycol and dipropylene glycol; alicyclic diols such as cyclohexanedimethanol and hydride bisphenol A; bisphenol A, 4,4 Aromatic diols such as'-dihydroxybiphenyl; alkylene oxide adducts of C2-4 of bisphenol A such as ethylene oxide 2 mol adducts of bisphenol A, propylene oxide 3 mol adducts of bisphenol A; or esters of these glycols. Examples thereof include formable derivatives (acetylated products, etc.
  • C2-6 alkylene glycols such as ethylene glycol and trimethylene glycol
  • polyoxyalkylene glycols such as diethylene glycol
  • alicyclic diols such as cyclohexanedimethanol are more preferable.
  • Examples of the comonomer component that can be used in addition to the dicarboxylic acid component and the glycol component include 4-hydroxybenzoic acid, 3-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 4-carboxy-4'-hydroxybiphenyl and the like.
  • Examples thereof include sex derivatives (C1-6 alkyl ester derivatives, acid halides, acetylates, etc.).
  • PAS resin Polyarylene sulfide resin
  • the PAS resin is characterized by being excellent in mechanical properties, electrical properties, heat resistance and other physical and chemical properties, and having good processability.
  • the PAS resin is a polymer compound mainly composed of-(Ar-S)-(where Ar is an arylene group) as a repeating unit, and is a PAS resin having a molecular structure generally known in the present embodiment. Can be used.
  • arylene group examples include a p-phenylene group, an m-phenylene group, an o-phenylene group, a substituted phenylene group, a p, p'-diphenylene sulphon group, a p, p'-biphenylene group, p, p'-.
  • Examples thereof include a diphenylene ether group, a p, p'-diphenylene carbonyl group and a naphthalene group.
  • the PAS resin may be a homopolymer composed of only the above-mentioned repeating units, or a copolymer containing the following different kinds of repeating units may be preferable from the viewpoint of processability and the like.
  • a polyphenylene sulfide resin (hereinafter, also referred to as “PPS resin”) using a p-phenylene group as an arylene group and having a p-phenylene sulfide group as a repeating unit is preferably used.
  • PPS resin polyphenylene sulfide resin
  • the copolymer among the above-mentioned allylene sulfide groups consisting of allylene groups, two or more different combinations can be used, and among them, the combination containing the p-phenylene sulfide group and the m-phenylene sulfide group is particularly preferably used. Be done.
  • those containing 70 mol% or more, preferably 80 mol% or more of the p-phenylene sulfide group are suitable from the viewpoint of physical properties such as heat resistance, moldability and mechanical properties.
  • a high molecular weight polymer having a substantially linear structure obtained by polycondensation from a monomer mainly composed of a bifunctional halogen aromatic compound can be particularly preferably used.
  • the PAS resin used in this embodiment may be a mixture of two or more different molecular weight PAS resins.
  • a small amount of a monomer such as a polyhalo aromatic compound having three or more halogen substituents is used to partially form a branched structure or a crosslinked structure during polycondensation.
  • a monomer such as a polyhalo aromatic compound having three or more halogen substituents
  • examples thereof include a polymer obtained by heating a low molecular weight linear structure polymer at a high temperature in the presence of oxygen and the like to increase the melt viscosity by oxidative crosslinking or thermal crosslinking to improve molding processability.
  • the melt viscosity (310 ° C., shear rate 1200 sec -1 ) of the PAS resin as the substrate resin used in the present embodiment is preferably 5 to 500 Pa ⁇ s, including the case of the above mixed system.
  • CNS Carbon Nanostructure
  • FIG. 1 schematically shows the CNS used in the present embodiment
  • (A) is a state before melt-kneading with a thermoplastic resin
  • (B) is a state immediately after the start of melt-kneading
  • (C) is a state immediately after melt-kneading. Indicates the later state.
  • the CNS 10 before melt-kneading forms a structure in which a large number of branched carbon nanotubes 12 are entangled and bonded.
  • the CNS 10 is poured into the thermoplastic resin 20 and melt-kneaded, the CNS 10 is divided into a large number as shown in FIG.
  • each of the carbon nanotubes 12 is in contact with each other via the contact point 14. That is, in the state of FIG. 1C, in the thermoplastic resin, a large number of carbon nanotubes 12 are in contact with each other over a wide range to form a conductive path, so that conductivity is exhibited. Further, since the carbon nanotubes 12 are randomly entangled to form a three-dimensional network structure, it is considered that the impact resistance and the decrease in tensile fracture strain can be suppressed.
  • the CNS used in this embodiment may be a commercially available product.
  • ATHLOS 200, ATHLOS 100, etc. manufactured by CABOT can be used.
  • CNS is contained in an amount of 0.3 to 2.5 parts by mass with respect to 100 parts by mass of the thermoplastic resin. If the content of the CNS is less than 0.3 parts by mass, the conductivity is inferior, and if it exceeds 2.5 parts by mass, the impact resistance and the tensile fracture strain are lowered.
  • the content of the CNS is preferably 0.5 to 2.0 parts by mass, more preferably 0.6 to 1.8 parts by mass, and even more preferably 0.8 to 1.5 parts by mass.
  • thermoplastic resin composition of the present embodiment examples include one or more of hindered phenol compounds, nitrogen-containing compounds, hydroxides of alkaline or alkaline earth metals, inorganic salts, carboxylates and the like. can. Further, as long as the above-mentioned effects are not impaired, general additives to thermoplastic resins such as colorants such as dyes and pigments, lubricants, nucleating agents, mold release agents, antistatic agents and surfactants are required. One or two or more kinds of agents, organic polymer materials, inorganic or organic fibrous, powdery, plate-like fillers and the like can be added.
  • the method for producing a molded product using the thermoplastic resin composition of the present embodiment is not particularly limited, and a known method can be adopted.
  • the thermoplastic resin composition of the present embodiment is put into an extruder, melt-kneaded and pelletized, and the pellets are put into an injection molding machine equipped with a predetermined mold and injection-molded. Can be done.
  • thermoplastic resin composition of the present embodiment may be a conductive member described later, or may be a molded product having an antistatic function.
  • the member of the present embodiment is formed by molding the above-mentioned thermoplastic resin composition of the present embodiment. Therefore, the member of the present embodiment has conductivity, and has sufficient impact resistance and tensile fracture strain, like the thermoplastic resin composition of the present embodiment.
  • the member of the present embodiment for example, it can be suitably used for an automobile part such as a fuel piping part and an electric / electronic part such as a printer part.
  • the member of the present embodiment can be manufactured by the method of manufacturing the conductive member of the present embodiment described below.
  • thermoplastic resin composition obtained by melt-kneading at least 0.3 to 2.5 parts by mass of a carbon nanostructure with 100 parts by mass of a thermoplastic resin is prepared. It is characterized by including a step of forming the thermoplastic resin composition into a predetermined shape (hereinafter referred to as “step B”). Each process will be described below.
  • thermoplastic resin composition obtained by melt-kneading at least 0.3 to 2.5 parts by mass of carbon nanostructures with respect to 100 parts by mass of the thermoplastic resin is prepared.
  • Preferred components in the thermoplastic resin composition, preferred contents thereof, and other components are as described above.
  • the thermoplastic resin composition is obtained by melt-kneading each of the above components and, if necessary, other components according to a conventional method. For example, it can be obtained by putting the thermoplastic resin composition of the present embodiment into an extruder, melt-kneading it, and pelletizing it.
  • CNS may be set as a masterbatch in advance, and this masterbatch may be used when CNS is added.
  • the masterbatch is a thermoplastic resin composition containing a high concentration of CNS, which is prepared in advance.
  • CNS thermoplastic resin composition
  • step B the thermoplastic resin composition is molded into a predetermined shape.
  • the pellets obtained as described above are put into an injection molding machine equipped with a predetermined mold for injection molding.
  • the above-mentioned manufacturing method of the present embodiment can manufacture a conductive member having conductivity and sufficient impact resistance and tensile fracture strain.
  • the method for expressing conductivity of the thermoplastic resin composition of the present embodiment is a method for exhibiting conductivity with respect to the thermoplastic resin composition, and the carbon nanostructure is 0.3 with respect to 100 parts by mass of the thermoplastic resin. It is characterized by adding up to 2.5 parts by mass and melt-kneading.
  • the conductive member obtained by molding the thermoplastic resin composition of the present embodiment has conductivity, and has sufficient impact resistance and tensile fracture strain. That is, by using the thermoplastic resin composition of the present embodiment, the conductivity of the thermoplastic resin composition can be exhibited, and sufficient impact resistance and tensile fracture strain can also be exhibited.
  • the preferable content of CNS with respect to the thermoplastic resin and other components are as described in the above-mentioned thermoplastic resin composition of the present embodiment.
  • Examples 1 to 8 Comparative Examples 1 to 7
  • the raw material components shown in Tables 1 and 2 were dry-blended, then put into a twin-screw extruder having a cylinder temperature of 200 ° C., melt-kneaded, and pelletized.
  • Tables 1 and 2 the numerical values of each component indicate parts by mass. The details of each raw material component used are shown below.
  • Thermoplastic resin-Polyacetal resin (POM resin) Polyacetal resin
  • Polyacetal copolymer obtained by copolymerizing 96.7% by mass of trioxane and 3.3% by mass of 1,3-dioxolane melt flow rate (measured at 190 ° C.
  • Carbon nanostructure ATHLOS 200 manufactured by CABOT (3) Glass fiber Owens Corning Japan GK, chopped strand Fiber diameter: 10.5 ⁇ m, length 3 mm (4) Carbon fiber manufactured by Toho Tenax Co., Ltd., HT C443 6 mm (5) Carbon Black Lion Corporation, Ketjen Black EC300J (6) Stabilizer (hindered phenol-based oxidation stabilizer) Irganox1010 manufactured by BASF Japan Ltd.
  • the ISO TYPE1A test piece is molded by injection molding with an injection molding machine (EC40, manufactured by Toshiba Machine Co., Ltd.) (the cylinder temperature of the molding machine is POM resin: 200 ° C, PBT resin: 260 ° C, PPS resin: 320. ° C., mold temperature was POM resin: 80 ° C., PBT resin: 80 ° C., PPS resin: 150 ° C.), and was used for the following evaluation. The measurement was carried out at room temperature for surface resistivity and volume resistivity, at 23 ° C. and 50 RH% for tensile fracture strain and impact resistance. (1) Surface resistivity / volume resistivity Fig. 2 shows the appearance of the multipurpose test piece obtained as described above. FIG.
  • FIG. 2 (A) shows the front surface
  • FIG. 2 (B) shows the back surface
  • a conductive paint Dotite D500, manufactured by Fujikura Kasei Co., Ltd.
  • a conductive paint Dotite D500, manufactured by Fujikura Kasei Co., Ltd.
  • a conductive paint Dotite D500, manufactured by Fujikura Kasei Co., Ltd.
  • a low resistivity measuring device DIGITAL MULTIMETER R6450, manufactured by Advantest
  • the resistance between AB in FIG. 2 (A) was measured, and this was used as the surface resistivity.
  • the resistance between CD and CD in FIG. 2 was measured and used as the volume resistivity.
  • the measurement results are shown in Tables 1 and 2.
  • the upper limit of measurement of surface resistivity is 5.0 ⁇ 10 9 ⁇ / ⁇
  • the upper limit of measurement of volume resistivity is 1.8 ⁇ 10 11 ⁇ ⁇ cm.
  • the surface resistivity in Comparative Examples 1 and 2 containing no or less CNS is also 5.0 ⁇ 10 9 ⁇ / ⁇ , but the volume resistivity is higher than that in Examples 1 and 2, and therefore, in Examples 1 and 2.
  • the surface resistivity is considered to be lower than that of Comparative Examples 1 and 2.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

L'invention concerne une composition de résine thermoplastique qui est obtenue par fusion et malaxage d'au moins ０,３ à ２,５ parties en masse de nano-structures de carbone pour 100 parties en masse d'une résine thermoplastique, et concerne également un élément constitué par moulage de cette composition de résine thermoplastique. En outre, l'invention concerne un procédé de fabrication d'un élément conducteurs qui inclut : une étape au cours de laquelle est préparée une composition de résine obtenue par fusion et malaxage d'au moins ０,３ à ２,５ parties en masse de nano-structures de carbone pour 100 parties en masse d'une résine thermoplastique ; et une étape au cours de laquelle cette composition de résine est moulée selon une forme prédéfinie. Enfin, l'invention concerne un procédé de développement de conductivité pour composition de résine thermoplastique, c'est-à-dire un procédé destiné à développer la conductivité dans une composition de résine thermoplastique, selon lequel au moins ０,３ à ２,５ parties en masse de nano-structures de carbone sont additionnées à 100 parties en masse d'une résine thermoplastique, puis une fusion et un malaxage sont effectués.
PCT/JP2021/020683 2020-06-30 2021-05-31 Composition de résine thermoplastique, élément associé ainsi que procédé de fabrication de celui-ci, et procédé de développement de conductivité pour composition de résine thermoplastique WO2022004235A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022533758A JP7510504B2 (ja) 2020-06-30 2021-05-31 熱可塑性樹脂組成物、部材及びその製造方法、並びに熱可塑性樹脂組成物の導電性発現方法
CN202180046675.8A CN115885017B (zh) 2020-06-30 2021-05-31 热塑性树脂组合物、部件及其制造方法以及热塑性树脂组合物的导电性表达方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020112469 2020-06-30
JP2020-112469 2020-06-30

Publications (1)

Publication Number Publication Date
WO2022004235A1 true WO2022004235A1 (fr) 2022-01-06

Family

ID=79315966

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/020683 WO2022004235A1 (fr) 2020-06-30 2021-05-31 Composition de résine thermoplastique, élément associé ainsi que procédé de fabrication de celui-ci, et procédé de développement de conductivité pour composition de résine thermoplastique

Country Status (3)

Country Link
JP (1) JP7510504B2 (fr)
CN (1) CN115885017B (fr)
WO (1) WO2022004235A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022075107A1 (fr) * 2020-10-09 2022-04-14
JPWO2022137998A1 (fr) * 2020-12-23 2022-06-30
WO2024053535A1 (fr) * 2022-09-08 2024-03-14 Dic株式会社 Composition de résine conductrice, mélange maître, corps moulé, et leurs procédés de production
WO2024083686A1 (fr) * 2022-10-17 2024-04-25 Dsm Ip Assets B.V. Composition polymère électriquement conductrice, procédé de préparation et de moulage, et articles fabriqués à partir de celle-ci

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08508534A (ja) * 1993-03-31 1996-09-10 ハイピリオン カタリシス インターナショナル インコーポレイテッド 強化導電性ポリマー
JP2007112885A (ja) * 2005-10-19 2007-05-10 Bussan Nanotech Research Institute Inc 熱可塑性エラストマー組成物
JP2007119647A (ja) * 2005-10-28 2007-05-17 Bussan Nanotech Research Institute Inc 複合材料
JP2011132370A (ja) * 2009-12-24 2011-07-07 Polyplastics Co ポリアセタール樹脂組成物の製造方法
JP2012140482A (ja) * 2010-12-28 2012-07-26 Hodogaya Chem Co Ltd ポリアセタール樹脂／カーボンナノチューブ導電性樹脂複合材料
JP2013221231A (ja) * 2012-04-18 2013-10-28 Tec One Company 分岐型炭素繊維、分岐型炭素繊維製造方法、前記分岐型炭素繊維を有する材
JP2016504470A (ja) * 2013-12-06 2016-02-12 エルジー・ケム・リミテッド 機械的物性が改善された複合材及びこれを含有する成形品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100706651B1 (ko) * 2006-12-22 2007-04-13 제일모직주식회사 전기 전도성 열가소성 수지 조성물 및 플라스틱 성형품
JP5616943B2 (ja) * 2012-02-21 2014-10-29 大日精化工業株式会社 導電性樹脂組成物の製造方法及び導電性樹脂組成物
JP7232176B2 (ja) * 2017-02-28 2023-03-02 三井化学株式会社 導電性樹脂組成物、その製造方法およびそれから得られる成形体
WO2019181828A1 (fr) * 2018-03-20 2019-09-26 大日精化工業株式会社 Composition de résine électro-conductrice et procédé de production associé

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08508534A (ja) * 1993-03-31 1996-09-10 ハイピリオン カタリシス インターナショナル インコーポレイテッド 強化導電性ポリマー
JP2007112885A (ja) * 2005-10-19 2007-05-10 Bussan Nanotech Research Institute Inc 熱可塑性エラストマー組成物
JP2007119647A (ja) * 2005-10-28 2007-05-17 Bussan Nanotech Research Institute Inc 複合材料
JP2011132370A (ja) * 2009-12-24 2011-07-07 Polyplastics Co ポリアセタール樹脂組成物の製造方法
JP2012140482A (ja) * 2010-12-28 2012-07-26 Hodogaya Chem Co Ltd ポリアセタール樹脂／カーボンナノチューブ導電性樹脂複合材料
JP2013221231A (ja) * 2012-04-18 2013-10-28 Tec One Company 分岐型炭素繊維、分岐型炭素繊維製造方法、前記分岐型炭素繊維を有する材
JP2016504470A (ja) * 2013-12-06 2016-02-12 エルジー・ケム・リミテッド 機械的物性が改善された複合材及びこれを含有する成形品

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022075107A1 (fr) * 2020-10-09 2022-04-14
JP7217384B2 (ja) 2020-10-09 2023-02-02 ポリプラスチックス株式会社 ポリアセタール樹脂組成物及び自動車部品
JPWO2022137998A1 (fr) * 2020-12-23 2022-06-30
WO2022137998A1 (fr) * 2020-12-23 2022-06-30 ポリプラスチックス株式会社 Composition de résine de polyacétal et article en contact avec un combustible
JP7217385B2 (ja) 2020-12-23 2023-02-02 ポリプラスチックス株式会社 ポリアセタール樹脂組成物及び燃料接触体
WO2024053535A1 (fr) * 2022-09-08 2024-03-14 Dic株式会社 Composition de résine conductrice, mélange maître, corps moulé, et leurs procédés de production
JP7568165B2 (ja) 2022-09-08 2024-10-16 Dic株式会社 導電性樹脂組成物、マスターバッチ、成形体及びそれらの製造方法
WO2024083686A1 (fr) * 2022-10-17 2024-04-25 Dsm Ip Assets B.V. Composition polymère électriquement conductrice, procédé de préparation et de moulage, et articles fabriqués à partir de celle-ci

Also Published As

Publication number Publication date
JPWO2022004235A1 (fr) 2022-01-06
CN115885017A (zh) 2023-03-31
CN115885017B (zh) 2024-08-23
JP7510504B2 (ja) 2024-07-03

Similar Documents

Publication Publication Date Title
WO2022004235A1 (fr) Composition de résine thermoplastique, élément associé ainsi que procédé de fabrication de celui-ci, et procédé de développement de conductivité pour composition de résine thermoplastique
WO2022004236A1 (fr) Composition de résine thermoplastique, élément associé ainsi que procédé de fabrication de celui-ci, et procédé de développement de conductivité pour composition de résine thermoplastique
WO2022009616A1 (fr) Composition de résine thermoplastique, élément, et procédé de fabrication et procédé d'amélioration de résistance mécanique pour élément formé à partir d'une composition de résine thermoplastique
KR102046880B1 (ko) 대전방지용 탄소 복합재, 성형품 및 그 제조방법
EP2177567B1 (fr) Composition de résine de type téréphtalate de polybutylène et article moulé mince la contenant
CN109689782B (zh) 聚对苯二甲酸丁二醇酯树脂组合物以及成型品
EP3323854B1 (fr) Composition de résine de poly6téréphtalate de butylène
KR102252550B1 (ko) 열가소성 수지 조성물 및 이로부터 제조된 성형품
JP6294829B2 (ja) 耐コロナ性部材、耐コロナ性樹脂組成物及び樹脂成形品の耐コロナ性発現方法
KR950009758B1 (ko) 폴리황화아릴렌 수지조성물 및 그 제조방법
US5310823A (en) Polyacetal resin composition
JP2015129073A (ja) 表面処理ガラス繊維およびそれを用いたガラス繊維強化熱可塑性樹脂組成物
CN115612261A (zh) 一种可激光焊接的耐水解阻燃聚酯复合材料及其制备方法
JP7446090B2 (ja) ポリブチレンテレフタレート樹脂組成物の耐トラッキング性向上方法
KR101950118B1 (ko) 폴리아미드 수지 조성물 및 이를 포함하는 성형품
JP2006298993A (ja) ポリブチレンテレフタレート樹脂組成物
JP7455652B2 (ja) 樹脂組成物の製造方法
JP7448740B2 (ja) 樹脂組成物および成形品
JPH0548789B2 (fr)
JP7261841B2 (ja) 二色成形品の強度低下抑制方法、二色成形用樹脂組成物、並びに二色成形品及びその製造方法
JP2023093180A (ja) ポリブチレンテレフタレート樹脂組成物及び成形品
JPS62106954A (ja) ポリエステル樹脂組成物
WO2023105955A1 (fr) Composition de résine de polyalkylène téréphtalate, procédé de production de composition de résine de polyalkylène téréphtalate et article moulé
WO2018159487A1 (fr) Composition de résine poly(téréphtalate de butylène) pour corps moulé servant à souder un élastomère de polyester, et corps moulé composite
JPH01282245A (ja) 導電性樹脂組成物

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21833117

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2022533758

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21833117

Country of ref document: EP

Kind code of ref document: A1