WO2021259120A1 - 镭射机台自动化运行方法及系统 - Google Patents

镭射机台自动化运行方法及系统 Download PDF

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Publication number
WO2021259120A1
WO2021259120A1 PCT/CN2021/100515 CN2021100515W WO2021259120A1 WO 2021259120 A1 WO2021259120 A1 WO 2021259120A1 CN 2021100515 W CN2021100515 W CN 2021100515W WO 2021259120 A1 WO2021259120 A1 WO 2021259120A1
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Prior art keywords
laser machine
wafer
information
laser
characteristic information
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PCT/CN2021/100515
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English (en)
French (fr)
Inventor
陆玉斌
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长鑫存储技术有限公司
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Priority to US17/486,645 priority Critical patent/US20220011757A1/en
Publication of WO2021259120A1 publication Critical patent/WO2021259120A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers

Definitions

  • This application relates to the field of semiconductor manufacturing, in particular to an automated operation method and system for laser machines.
  • the wafer In the semiconductor manufacturing process, it is usually necessary to use a laser machine to process the wafer, and the wafer enters the next process after the operation is completed.
  • the disadvantage is that the existing laser machines are offline, and the generation control system cannot know the laser status of the entire batch of wafers, which may cause the wafers to be repeatedly lasered, and the repeated lasers of the wafers may cause the yield of the wafers. loss.
  • the technical problem to be solved by this application is to provide a laser machine automatic operation method and system.
  • this application provides an automated operation method of a laser machine, which includes: (a) judging whether the wafer has completed the operation on the laser machine according to the characteristic information; if so, skip the laser machine and proceed to the next step. Process, if not, perform step (b); (b) process the wafer on the laser machine, the laser machine generates record information, the record information and the wafer on the laser machine The job information is related; (c) acquiring the record information, and generating characteristic information based on the record information, the characteristic information serving as a judgment basis for step (a).
  • the characteristic information is stored in a preset storage space, and the step of obtaining the characteristic information from the preset storage space is included before the step of determining whether the wafer has been operated on the laser machine.
  • the characteristic information is stored in a preset storage space to form a database.
  • step (a) further includes comparing the inherent information of the wafer with the characteristic information in the database, if the inherent information matches the characteristic information, and the characteristic information records that the wafer is completed All operations, the wafer is completed on the laser machine; if the inherent information matches the characteristic information, and the characteristic information records that the wafer has completed part of the operation, the wafer The operation is not completed on the laser machine; if the inherent information does not match the characteristic information, the wafer has not completed the operation on the laser machine.
  • the characteristic information includes at least inherent information of the wafer and operation information of the wafer on a laser machine.
  • the inherent information of the wafer includes the lot number of the wafer.
  • the history record of the wafer is obtained.
  • the database is backed up.
  • the operation information is that the wafer has been operated on a laser machine.
  • the operation information is that the wafer has completed the laser phase operation on the laser machine.
  • the present application also provides an automated operation system for a laser machine, which includes: a laser machine for performing laser processing on wafers and capable of generating recorded information.
  • the recorded information and the wafer on the laser machine Operational information related; control system, used to obtain the record information from the laser machine, and generate characteristic information based on the record information, and used to determine whether the wafer has been processed on the laser machine according to the characteristic information Work and generate control instructions.
  • control system includes: an automation system capable of communicating with the laser machine, used for obtaining the record information from the laser machine, and generating the characteristic information based on the record information, and also used for The control instructions of the manufacturing execution system are sent to the laser machine; the manufacturing execution system can communicate with the automation system for obtaining the characteristic information and for judging whether the wafer is on the laser machine according to the characteristic information Worked and able to generate control instructions.
  • the manufacturing execution system has a preset storage space for storing the database formed by the characteristic information.
  • the automatic operation system of the laser machine further includes a backup unit for backing up the database.
  • the laser machine automated operation system further includes a matching unit for matching the inherent information of the wafer with the characteristic information in the database, and the manufacturing execution system generates a control instruction according to the matching result.
  • the advantage of this application is that it can generate feature information based on the local records of the laser machine, and then use the feature chip to determine whether the wafer has completed the laser operation on the laser machine, thereby avoiding re-lasing the wafer that has completed the laser operation. Greatly improve the yield of wafers and reduce losses.
  • FIG. 1 is a flowchart of an embodiment of the automatic operation method of a laser machine according to the present application
  • Fig. 2 is a block diagram of an embodiment of the automatic operation system of the laser machine according to the present application.
  • Fig. 1 is a flowchart of an embodiment of the automatic operation method of a laser machine according to the present application. Please refer to Figure 1.
  • the automatic operation method of the laser machine in this application includes the following steps:
  • step S10 it is judged whether the wafer has completed the operation on the laser machine according to the characteristic information.
  • the characteristic information is related to the operation information of the wafer on the laser machine.
  • the characteristic information includes at least the inherent information of the wafer and the operation information of the wafer on the laser machine.
  • the inherent information of the wafer is information that distinguishes the batch of wafers from other batches of wafers, for example, the batch number of the wafer.
  • the operation information is used to record the laser operation of the wafer on the laser machine. For example, for a wafer that requires only one laser operation, the corresponding operation information should include the content of the wafer that has been operated on the laser machine; for the wafer that needs to complete multiple laser operations on the laser machine For the wafer, the corresponding operation information should include the content of the operation of the laser phase completed by the wafer on the laser machine.
  • the wafer can be associated with its operation information on the laser machine. During subsequent operations on the wafer, the inherent information of the wafer can be obtained, and the inherent information can be used as an index to determine the operation status of the wafer on the laser machine in the characteristic information.
  • step S11 is executed.
  • Step S11 is executed.
  • step S11 For another example, for a wafer that needs to complete multiple laser operations on a laser machine, it is judged according to the characteristic information whether the wafer has completed all the laser operations in the laser stage on the laser machine, and if so, skip Go through the laser machine to proceed to the next process; if the wafer has only completed part of the laser operation in the laser phase on the laser machine, then the judgment is no and step S11 is executed; if the wafer is not in the laser machine The laser operation has been performed on the laser machine, and it is judged as no, and step S11 is executed.
  • Step S11 the wafer is processed on a laser machine, and the laser machine generates record information, and the record information is related to the operation status of the wafer on the laser machine.
  • the laser machine will automatically generate record information, and the record information is the local information of the laser machine.
  • the recording information includes at least the inherent information of the wafer and the content of the operation information for performing the laser operation.
  • Step S12 Obtain the record information, and generate characteristic information according to the record information, and the characteristic information is used as a judgment basis for step S10.
  • the record information is the local information of the laser machine, it may not be recognized by other programs or software. Therefore, after obtaining the record information, the record information can be analyzed to generate Characteristic information recognized by other programs or software.
  • the characteristic information generated in this step is the characteristic information described in step S10.
  • feature information can be generated only if the wafer has been lasered on the laser machine. If the wafer has not been operated on the laser machine, it will not generate features. information.
  • the characteristic information is stored in the preset storage space 100.
  • the preset storage space 100 is a storage location provided by the control system.
  • the characteristic information is stored in the preset storage space 100.
  • the generated feature information A1 is stored in the preset storage space 100, and after performing step S12 on another batch of wafers, the generated feature information A1 is stored in the preset storage space 100, and so on.
  • characteristic information A1 to An are stored in the preset storage space 100, and each characteristic information corresponds to one or a batch of wafers.
  • step S10 the method further includes step S01 of obtaining the characteristic information from the preset storage space 100.
  • the obtained characteristic information can be used for the judgment in step S10.
  • the characteristic information forms a database, which can be retrieved in step S10.
  • the user can also trace the history of the wafer based on the database record to facilitate problem analysis.
  • the present application also provides a method for judging whether the wafer has completed the operation on the laser machine according to the characteristic information. There will be differences in the judgment parameters for wafers that require only one laser operation and wafers that require multiple laser operations on the laser machine.
  • the inherent information of the wafer is compared with the characteristic information in the database. If the inherent information matches the characteristic information, that is, the characteristic information contains the inherent information, it is determined that the wafer has completed the operation on the laser machine; if the inherent information does not match the characteristic information , That is, if the characteristic information does not include the inherent information, it is determined that the wafer has not been completed on the laser machine.
  • the inherent information of the wafer is compared with the characteristic information in the database. If the inherent information matches the characteristic information, that is, the characteristic information contains the inherent information, and the characteristic information records that the wafer has completed all operations, it is determined that the wafer is in the laser machine If the inherent information matches the characteristic information, that is, the characteristic information contains the inherent information, and the characteristic information records that the wafer has completed part of the operation, then it is determined that the wafer The operation is not completed on the laser machine; if the inherent information does not match the characteristic information, that is, the characteristic information does not include the inherent information, it is determined that the wafer has not completed the operation on the laser machine.
  • the automatic operation method of the laser machine of the present application further includes the step of backing up the database.
  • the database is regularly backed up, for example, on a weekly or daily or hourly basis. In the case of data loss, the backup data can be restored to the laser machine automation system, thereby avoiding misoperation and greatly improving the wafer yield.
  • the automatic operation method of the laser machine in this application can generate characteristic information based on the local records of the laser machine, and then use the characteristic chip to determine whether the wafer has completed the laser operation on the laser machine, thereby avoiding re-lasing the wafer that has already completed the laser operation Processing greatly improves the yield of wafers and reduces losses.
  • FIG. 2 is a block diagram of an embodiment of the automatic operation system of the laser machine according to the present application. Please refer to FIG. 2, the automatic operation system of the laser machine in this application includes the laser machine 200 and the control system 210.
  • the laser machine 200 is used to perform laser processing on wafers according to preset settings, and can generate record information.
  • the recorded information is the local information of the laser machine 200.
  • the record information is related to the operation status of the wafer on the laser machine. Further, in this embodiment, the recording information includes at least the inherent information of the wafer and the operation information of completing the laser operation of the wafer.
  • the control system 210 is used to obtain the record information from the laser machine 200, and generate characteristic information according to the record information. In addition, the control system 210 is also used for judging the operation status of the wafer on the laser machine 200 according to the characteristic information, and generating control instructions.
  • the control system 210 performs a check on the record information. Perform analysis to generate characteristic information that can be recognized by other programs or software.
  • control system 210 includes an automation system 211 and a manufacturing execution system 212.
  • the automation system 211 can communicate with the laser machine 200 for obtaining the record information from the laser machine 200.
  • the automation system 211 can communicate with the laser machine 200 through a communication protocol to transmit information.
  • the automation system 211 can also generate the characteristic information according to the record information.
  • the automation system 211 analyzes the recorded information and generates characteristic information in a preset format.
  • the feature information in the preset format has a certain regularity and can be recognized by various procedural grammars, that is, the feature information can be recognized by various programs and software, so that it can be used as the identity information of the wafer. used.
  • the automation system 211 generates characteristic information that can be recognized by the manufacturing execution system 211 according to the recorded information, so that the manufacturing execution system 211 can determine whether the wafer needs to be lasered according to the characteristic information .
  • the method for analyzing the record information is a conventional method in the art, and will not be repeated here.
  • the automation system 211 is also used to send control instructions of the manufacturing execution system 212 to the laser machine 200.
  • the automation system 211 is an EAP (Equipment Automation Programming) system.
  • the manufacturing execution system 212 can communicate with the automation system 211.
  • the manufacturing execution system 212 and the automation system 211 communicate through a communication protocol.
  • the manufacturing execution system 212 can obtain the characteristic information, and determine the operation status of the wafer on the laser machine according to the characteristic information.
  • the manufacturing execution system 212 can also generate a control instruction according to the judgment result.
  • the manufacturing execution system 212 judges whether the wafer is completed on the laser machine according to the characteristic information, and if the wafer is completed on the laser machine, the manufacturing execution system 212 will report to the The automation system 211 issues an instruction to skip the laser machine and proceed to the next process, and the automation system 211 sends the instruction to the machine of the next process; if the wafer is not completed on the laser machine, the The manufacturing execution system 212 issues a control instruction for starting the laser machine 200 to the automation system 211, and the automation system 211 sends the control instruction to the laser machine 200, and the laser machine 200 is started to perform laser operations on the wafers. .
  • the manufacturing execution system 212 has a preset storage space for storing the database formed by the characteristic information.
  • the preset storage space is a storage location provided by the manufacturing execution system 212.
  • the characteristic information is stored in a preset storage space to form a database.
  • the database can be retrieved by the manufacturing execution system 212.
  • the user can also trace the history of the wafer based on the database record to facilitate problem analysis.
  • the automatic operation system of the laser machine further includes a comparison unit 213.
  • the comparing unit 213 is used to compare the inherent information of the wafer with the characteristic information in the database. If the inherent information matches the characteristic information, that is, the characteristic information contains the inherent information, it is determined that the wafer has completed the operation on the laser machine; if the inherent information does not match the characteristic information , That is, if the characteristic information does not include the inherent information, it is determined that the wafer has not been completed on the laser machine.
  • the manufacturing execution system 212 generates a control instruction according to the comparison result. If it is determined that the wafer is completed on the laser machine, the manufacturing execution system 212 issues an instruction to the automation system 211 to skip the laser machine and proceed to the next process; if it is determined that the wafer is on the laser machine If the operation is not completed, the manufacturing execution system 212 issues a control instruction for starting the laser machine 200 to the automation system 211 to control the laser machine to perform laser operations on the wafer.
  • the automatic operation system of the laser machine further includes a backup unit 214 capable of backing up the database.
  • a backup unit 214 capable of backing up the database. In the event that the data stored in the preset storage space 100 is lost, the data can be restored from the backup unit 214 to the preset storage space 100, avoiding misoperation of the wafer, and greatly improving the yield rate of the wafer .

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Abstract

本申请提供一种镭射机台自动化运行方法及系统，所述方法包括：(a)根据特征信息判断晶圆是否在镭射机台上完成作业，若是，则跳过镭射机台进行下一工序，若否，则执行步骤(b)；(b)在镭射机台上对晶圆进行处理，所述镭射机台生成记录信息，所述记录信息与所述晶圆在镭射机台上的作业信息相关；(c)获取所述记录信息，并根据所述记录信息生成特征信息，所述特征信息作为步骤(a)的判断依据。本申请的优点在于，根据镭射机台的本地记录信息生成特征信息，进而利用特征芯片判断晶圆是否在镭射机台上完成镭射作业，进而避免对已经完成镭射作业的晶圆进行再次镭射处理，大大提高了晶圆的良率，降低了损失。

Description

镭射机台自动化运行方法及系统
相关申请引用说明
本申请要求于2020年06月22日递交的中国专利申请号202010572280.9，申请名为“镭射机台自动化运行方法及系统”的优先权，其全部内容以引用的形式附录于此。
技术领域
本申请涉及半导体制造领域，尤其涉及一种镭射机台自动化运行方法及系统。
背景技术
在半导体制造工艺中，通常需要采用镭射机台对晶圆进行处理，晶圆在作业完成后进入下一工序。其缺点在于，现有的镭射机台为离线作业，生成控制系统无法得知整批晶圆的镭射状况，可能会导致晶圆被重复镭射，晶圆的重复镭射可能会造成晶圆的良率损失。
因此，亟需一种镭射机台自动化运行方法及系统，以解决上述问题。
发明内容
本申请所要解决的技术问题是，提供一种镭射机台自动化运行方法及系统。
为了解决上述问题，本申请提供了一种镭射机台自动化运行方法，其包括：(a)根据特征信息判断晶圆是否在镭射机台上完成作业，若是，则跳过镭射机台进行下一工序，若否，则执行步骤(b)；(b)在镭射机台上对晶圆进行处理，所述镭射机台生成记录信息，所述记录信息与所述晶圆在镭射机台上的作业信息相关；(c)获取所述记录信息，并根据所述记录信息生成特征信息，所述特征信息作为步骤(a)的判断依据。
进一步，所述特征信息被存储在预设存储空间，在判断晶圆是否在镭射机台上进行过作业的步骤之前包括自预设存储空间获取所述特征信息的步骤。
进一步，所述特征信息被存储在预设存储空间，形成数据库。
进一步，步骤(a)进一步包括，将所述晶圆的固有信息与数据库中的特征信息进行对比，若所述固有信息与所述特征信息匹配，且所述特征信息记录所述晶圆完成了全部的作业，则所述晶圆在镭射机台上完成作业；若所述固有 信息与所述特征信息匹配，且所述特征信息记录所述晶圆完成了部分的作业，则所述晶圆在镭射机台上未完成作业；若所述固有信息与所述特征信息不匹配，则所述晶圆在镭射机台上未完成作业。
进一步，所述特征信息至少包括所述晶圆的固有信息及所述晶圆在镭射机台上的作业信息。
进一步，所述晶圆的固有信息包括所述晶圆的批次号。
进一步，根据特征信息，获取所述晶圆的历史记录。
进一步，对所述数据库进行备份。
进一步，所述作业信息为，所述晶圆在镭射机台上进行过作业。
进一步，所述作业信息为，所述晶圆在镭射机台上完成镭射阶段的作业。
本申请还提供一种镭射机台自动化运行系统，其包括：镭射机台，用于对晶圆进行镭射处理，并能够生成记录信息，所述记录信息与所述晶圆在镭射机台上的作业信息相关；控制系统，用于自所述镭射机台获取所述记录信息，并根据所述记录信息生成特征信息，且用于根据所述特征信息判断晶圆是否在镭射机台上进行过作业，并生成控制指令。
进一步，所述控制系统包括：自动化系统，能够与所述镭射机台通信，用于自所述镭射机台获取所述记录信息，并根据所述记录信息生成所述特征信息，还用于将制造执行系统的控制指令发送给所述镭射机台；制造执行系统，能够与所述自动化系统通信，用于获取所述特征信息，并用于根据所述特征信息判断晶圆是否在镭射机台上进行过作业，并能够生成控制指令。
进一步，所述制造执行系统具有一预设存储空间，用于存储所述特征信息形成的数据库。
进一步，所述镭射机台自动化运行系统还包括备份单元，用于对数据库进行备份。
进一步，所述镭射机台自动化运行系统还包括匹配单元，所述匹配单元用于将晶圆的固有信息与数据库中的特征信息进行匹配，所述制造执行系统根据所述匹配结果生成控制指令。
本申请的优点在于，能够根据镭射机台的本地记录生成特征信息，进而利 用特征芯片判断晶圆是否在镭射机台上完成镭射作业，进而避免对已经完成镭射作业的晶圆进行再次镭射处理，大大提高了晶圆的良率，降低了损失。
附图说明
为了更清楚地说明本申请实施例的技术方案，下面将对本申请实施例中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请镭射机台自动化运行方法的一实施例的流程图；
图2是本申请镭射机台自动化运行系统的一实施例的框图。
具体实施方式
为了使本申请的目的、技术手段及其效果更加清楚明确，以下将结合附图对本申请作进一步地阐述。应当理解，此处所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例，并不用于限定本申请。基于本申请中的实施例，本领域技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
图1是本申请镭射机台自动化运行方法的一实施例的流程图。请参阅图1，本申请镭射机台自动化运行方法包括如下步骤：
步骤S10，根据特征信息判断晶圆是否在镭射机台上完成作业。
其中，所述特征信息与晶圆在镭射机台上的作业信息相关。在本实施例中，所述特征信息至少包括所述晶圆的固有信息及所述晶圆在镭射机台上的作业信息。所述晶圆的固有信息为该批次晶圆区别于其他批次晶圆的信息，例如，晶圆的批次号。所述作业信息用于记录所述晶圆在所述镭射机台上进行过镭射作业的情况。例如，对于仅需要进行一次镭射作业的晶圆，其对应的所述作业信息应包括所述晶圆在镭射机台上进行过作业的内容；对于需要在镭射机台上完成多次镭射作业的晶圆，其对应的所述作业信息应包括所述晶圆在镭射机台上完成镭射阶段的作业的内容。
通过所述晶圆的固有信息可将所述晶圆与其在镭射机台上的作业信息关联。在后续对晶圆进行操作时，可获取所述晶圆的固有信息，并利用所述固有 信息作为索引，在所述特征信息内确定所述晶圆在镭射机台上的作业情况。
若所述晶圆在镭射机台上完成作业，则结束，跳过镭射机台进行下一工序；若所述晶圆未在镭射机台上完成作业，则执行步骤S11。
例如，对于仅需要进行一次镭射作业的晶圆，根据所述特征信息判断其是否在所述镭射机台上进行过镭射作业，若是，则跳过镭射机台进行下一工序，若否，则执行步骤S11。
再例如，对于需要在镭射机台上完成多次镭射作业的晶圆，根据所述特征信息判断所述晶圆是否在所述镭射机台上完成了镭射阶段的所有镭射作业，若是，则跳过镭射机台进行下一工序；若所述晶圆在所述镭射机台上仅完成了镭射阶段的部分镭射作业，则判断为否，执行步骤S11；若所述晶圆并未在所述镭射机台上进行过镭射作业，也判断为否，执行步骤S11。
步骤S11，在镭射机台上对晶圆进行处理，所述镭射机台生成记录信息，所述记录信息与所述晶圆在镭射机台上的作业情况相关。
在该步骤中，在所述镭射机台上根据预设程序对晶圆进行处理后，所述镭射机台会自动生成记录信息，所述记录信息为所述镭射机台的本地信息。在本实施例中，所述记录信息至少包含有所述晶圆的固有信息及进行镭射作业的作业信息的内容。
步骤S12，获取所述记录信息，并根据所述记录信息生成特征信息，所述特征信息作为步骤S10的判断依据。
由于所述记录信息为所述镭射机台的本地信息，其可能存在不能被其他程序或者软件等识别的情况，因此，在获取所述记录信息后，可对所述记录信息进行解析，生成能够被其他程序或者软件识别的特征信息。
在该步骤中生成的特征信息即为步骤S10所述的特征信息。在本申请中，只有所述晶圆在所述镭射机台上进行过镭射作业，才能生成特征信息，若所述晶圆没有在所述镭射机台上进行过作业，其并不会生成特征信息。
进一步，所述特征信息被存储在预设存储空间100中。在本实施例中，所述预设存储空间100为控制系统提供的一存储位置。对于每一个或者每一批晶圆，执行步骤S12后，特征信息被存储在预设存储空间100中。例如，在对某 一批次的晶圆执行步骤S12后，生成的特征信息A1被存储在预设存储空间100中，在对另一批次的晶圆执行步骤S12后，其生成的特征信息A1被存储在预设存储空间100中，依此类推。如图1所示，在所述预设存储空间100中存储有特征信息A1～An，每一特征信息对应一个或者一批次晶圆。
进一步，在步骤S10之前，还包括自预设存储空间100获取所述特征信息的步骤S01。该获得的特征信息可用于步骤S10的判断。
进一步，所述特征信息形成数据库，可供步骤S10调取。另外，若所述晶圆产生问题，用户还可根据所述数据库的记录追溯所述晶圆的历史记录，以便于进行问题分析。
进一步，本申请还提供一种根据所述特征信息判断晶圆是否在镭射机台上完成作业的方法。对于仅需要进行一次镭射作业的晶圆及需要在镭射机台上完成多次镭射作业的晶圆其判断参数会存在差别。
例如，对于仅需要进行一次镭射作业的晶圆，将所述晶圆的固有信息与数据库中的特征信息进行对比。若所述固有信息与所述特征信息匹配，即所述特征信息中包含所述固有信息，则判定所述晶圆在镭射机台上完成作业；若所述固有信息与所述特征信息不匹配，即所述特征信息中不包含所述固有信息，则判定所述晶圆在镭射机台上未完成作业。
再例如，对于需要在镭射机台上完成多次镭射作业的晶圆，将所述晶圆的固有信息与数据库中的特征信息进行对比。若所述固有信息与所述特征信息匹配，即所述特征信息中包含所述固有信息，且所述特征信息记录所述晶圆完成了全部的作业，则判定所述晶圆在镭射机台上完成作业；若所述固有信息与所述特征信息匹配，即所述特征信息中包含所述固有信息，且所述特征信息记录所述晶圆完成了部分的作业，则判定所述晶圆在镭射机台上未完成作业；若所述固有信息与所述特征信息不匹配，即所述特征信息中不包含所述固有信息，则判定所述晶圆在镭射机台上未完成作业。
进一步，在镭射机台自动化系统掉电或者重启的情况下，可能会发生数据库丢失的情况，则需要重新整理晶圆的特征信息，可能会发生误判断的情况，导致晶圆被再次执行镭射作业，因此，在本实施例中，本申请镭射机台自动化 运行方法还包括对所述数据库进行备份的步骤。对所述数据库进行定期备份，例如，以周或者天或者小时为单位定期备份。在数据丢失的情况下，可将备份的数据恢复至镭射机台自动化系统，从而避免误操作，大大提高了晶圆的良率。
本申请镭射机台自动化运行方法能够根据镭射机台的本地记录生成特征信息，进而利用特征芯片判断晶圆是否在镭射机台上完成镭射作业，进而避免对已经完成镭射作业的晶圆进行再次镭射处理，大大提高了晶圆的良率，降低了损失。
本申请还提供一种镭射机台自动化运行系统。图2是本申请镭射机台自动化运行系统的一实施例的框图。请参阅图2，本申请镭射机台自动化运行系统包括镭射机台200及控制系统210。
所述镭射机台200用于根据预设设置对晶圆进行镭射处理，并能够生成记录信息。所述记录信息为所述镭射机台200的本地信息。所述记录信息与所述晶圆在镭射机台上的作业情况相关。进一步，在本实施例中，所述记录信息至少包括所述晶圆的固有信息及所述晶圆完成镭射作业的作业信息。
所述控制系统210用于自所述镭射机台200获取所述记录信息，并根据所述记录信息生成特征信息。且所述控制系统210还用于根据所述特征信息判断晶圆在镭射机台200上的作业情况，并生成控制指令。
由于所述记录信息为所述镭射机台200的本地信息，其可能存在不能被其他程序或者软件等识别的情况，因此，在获取所述记录信息后，所述控制系统210对所述记录信息进行解析，生成能够被其他程序或者软件识别的特征信息。
进一步，所述控制系统210包括自动化系统211及制造执行系统212。
所述自动化系统211能够与所述镭射机台200通信，用于自所述镭射机台200获取所述记录信息。所述自动化系统211可通过通信协议与所述镭射机台200通信，进而传递信息。
所述自动化系统211还能够根据所述记录信息生成所述特征信息。例如，所述自动化系统211对所述记录信息进行解析，并生成具有预设格式的特征信息。所述预设格式的特征信息具有一定规律性，且能够被各种程序式语法识别，即所述特征信息能够被各种程序及软件识别，以使得其可作为所述晶圆的身份 信息而被使用。例如，所述自动化系统211根据所述记录信息生成能够被所述制造执行系统211识别的特征信息，以使得所述制造执行系统211能够根据所述特征信息判断所述晶圆是否需要进行镭射作业。其中，对所述记录信息进行解析的方法为本领域常规的方法，不再赘述。
所述自动化系统211还用于将制造执行系统212的控制指令发送给所述镭射机台200。在本实施例中，所述自动化系统211为EAP(Equipment Automation Programing)系统。
所述制造执行系统212能够与所述自动化系统211通信。例如，所述制造执行系统212与所述自动化系统211通过通信协议通信。
所述制造执行系统212能够获取所述特征信息，并根据所述特征信息判断晶圆在镭射机台上的作业情况。所述制造执行系统212还能够根据判断结果所述生成控制指令。
例如，所述制造执行系统212根据所述特征信息判断所述晶圆是否在镭射机台上完成作业，若所述晶圆在镭射机台上完成作业，则所述制造执行系统212向所述自动化系统211发布跳过镭射机台进行下一工序的指令，所述自动化系统211将该指令发送至下一工序的机台；若所述晶圆未在镭射机台上完成作业，则所述制造执行系统212向所述自动化系统211发布启动镭射机台200的控制指令，所述自动化系统211将该控制指令发送至镭射机台200，所述镭射机台200启动，对晶圆进行镭射作业。
进一步，所述制造执行系统212具有一预设存储空间，用于存储所述特征信息形成的数据库。在本实施例中，所述预设存储空间为所述制造执行系统212提供的一存储位置。对于每一个或者每一批晶圆，在制造执行系统212获取特征信息后，所述特征信息均被存储在预设存储空间中，形成数据库。所述数据库可供所述制造执行系统212调取。另外，若所述晶圆产生问题，用户还可根据所述数据库的记录追溯所述晶圆的历史记录，以便于进行问题分析。
进一步，在本实施例中，所述镭射机台自动化运行系统还包括比较单元213。所述比较单元213用于将晶圆的固有信息与数据库中的特征信息进行比较。若所述固有信息与所述特征信息匹配，即所述特征信息中包含所述固有信 息，则判定所述晶圆在镭射机台上完成作业；若所述固有信息与所述特征信息不匹配，即所述特征信息中不包含所述固有信息，则判定所述晶圆在镭射机台上未完成作业。
所述制造执行系统212根据所述比较结果生成控制指令。若判定所述晶圆在镭射机台上完成作业，则所述制造执行系统212向所述自动化系统211发布跳过镭射机台进行下一工序的指令；若判定所述晶圆在镭射机台上未完成作业，则所述制造执行系统212向所述自动化系统211发布启动镭射机台200的控制指令，以控制所述镭射机台对晶圆进行镭射作业。
进一步，所述镭射机台自动化运行系统还包括备份单元214，其能够备份所述数据库。在存储在预设存储空间100中的数据丢失的情况下，可将数据自所述备份单元214恢复至预设存储空间100中，避免对晶圆的误操作，大大提高了晶圆的良率。
以上所述仅是本申请的优选实施方式，应当指出，对于本技术领域的普通技术人员，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (15)

  1. 一种镭射机台自动化运行方法，其中，包括：
    (a)根据特征信息判断晶圆是否在镭射机台上完成作业，若是，则跳过镭射机台进行下一工序，若否，则执行步骤(b)；
    (b)在镭射机台上对晶圆进行处理，所述镭射机台生成记录信息，所述记录信息与所述晶圆在镭射机台上的作业信息相关；
    (c)获取所述记录信息，并根据所述记录信息生成特征信息，所述特征信息作为步骤(a)的判断依据。
  2. 根据权利要求1所述的镭射机台自动化运行方法，其中，所述特征信息被存储在预设存储空间，在判断晶圆是否在镭射机台上进行过作业的步骤之前包括自预设存储空间获取所述特征信息的步骤。
  3. 根据权利要求1所述的镭射机台自动化运行方法，其中，所述特征信息被存储在预设存储空间，形成数据库。
  4. 根据权利要求3所述的镭射机台自动化运行方法，其中，步骤(a)进一步包括，将所述晶圆的固有信息与数据库中的特征信息进行对比，若所述固有信息与所述特征信息匹配，且所述特征信息记录所述晶圆完成了全部的作业，则所述晶圆在镭射机台上完成作业；若所述固有信息与所述特征信息匹配，且所述特征信息记录所述晶圆完成了部分的作业，则所述晶圆在镭射机台上未完成作业；若所述固有信息与所述特征信息不匹配，则所述晶圆在镭射机台上未完成作业。
  5. 根据权利要求4所述的镭射机台自动化运行方法，其中，所述特征信息至少包括所述晶圆的固有信息及所述晶圆在镭射机台上的作业信息。
  6. 根据权利要求5所述的镭射机台自动化运行方法，其中，所述晶圆的固有信息包括所述晶圆的批次号。
  7. 根据权利要求3所述的镭射机台自动化运行方法，其中，根据特征信息，获取所述晶圆的历史记录。
  8. 根据权利要求3所述的镭射机台自动化运行方法，其中，对所述数据库进行备份。
  9. 根据权利要求1所述的镭射机台自动化运行方法，其中，所述作业信息为， 所述晶圆在镭射机台上进行过作业。
  10. 根据权利要求1所述的镭射机台自动化运行方法，其中，所述作业信息为，所述晶圆在镭射机台上完成镭射阶段的作业。
  11. 一种镭射机台自动化运行系统，其中，包括：
    镭射机台，用于对晶圆进行镭射处理，并能够生成记录信息，所述记录信息与所述晶圆在镭射机台上的作业信息相关；
    控制系统，用于自所述镭射机台获取所述记录信息，并根据所述记录信息生成特征信息，且用于根据所述特征信息判断晶圆是否在镭射机台上进行过作业，并生成控制指令。
  12. 根据权利要求11所述的镭射机台自动化运行系统，其中，所述控制系统包括：
    自动化系统，能够与所述镭射机台通信，用于自所述镭射机台获取所述记录信息，并根据所述记录信息生成所述特征信息，还用于将制造执行系统的控制指令发送给所述镭射机台；
    制造执行系统，能够与所述自动化系统通信，用于获取所述特征信息，并用于根据所述特征信息判断晶圆是否在镭射机台上进行过作业，并能够生成控制指令。
  13. 根据权利要求12所述的镭射机台自动化运行系统，其中，所述制造执行系统具有一预设存储空间，用于存储所述特征信息形成的数据库。
  14. 根据权利要求13所述的镭射机台自动化运行系统，其中，所述镭射机台自动化运行系统还包括备份单元，用于对数据库进行备份。
  15. 根据权利要求12所述的镭射机台自动化运行系统，其中，所述镭射机台自动化运行系统还包括匹配单元，所述匹配单元用于将晶圆的固有信息与数据库中的特征信息进行匹配，所述制造执行系统根据所述匹配结果生成控制指令。
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