200834649 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種半導體製造技術的方法，且特別 是有關於一種半導體製造技術中，先進製程控制（Advanced Process Control，APC)系統中的預先檢查製程的方法。 【先前技術】 許多半導體製造廠或工廠都已開始採用先進製程控 制（Advanced Process Control，APC)系統來有效降低生產 成本。先進製程控制系統收集製程中各項資料及分析各種 參數對生產製程所造成的影響，以使整個製程更具穩定性 與正確性。 請參照第1圖所示，現有的先進製程控制系統400， 可配合一製造執行系統（Manufacturing Execution System，MES)410 以及一監控主機（Equipment Application Program， EAP)420以對機台430進行收集製程中各項資 料及分析各種參數。 先進製程控制系統400包含一圖形介面401、一資料 蒐集模組402、一資料庫403、一錯誤偵測系統404以及 一警報系統405。資料蒐集模組402接收監控主機420所 傳送出的製程中各項資料，並儲存於資料庫403以供後端 分析。圖形介面4〇1為一網頁（Web)介面，供使用者進行 系統的操作與設定。錯誤偵測系統404藉由分析各項資料 及各種參數的結果，當發現錯誤時，通知警報系統405發 6 200834649 出警報。 請參照第2圖所示，現有的先進製程控制系統4〇〇的 操作方法’主要為於準備工作完成後，開始查詢製程程式 識別碼（Process Program ID，PPID)列表、檢查晶圓片數、 更新參數等工作後，進行工作導入(j〇b-in)，開始對晶圓進 行製程處理’完成後，進行工作導出（job-out)。其中，工 作導入(j〇b_in)之前的參數檢查作業，大約需花2〇秒的時 間。 然而’現有的先進製程控制系統4〇〇在發現錯誤並通 知警報系統405發出警報時，晶圓已經進入機台的反應室 中進行或完成製程處理。因此，在收到警報訊息時，已經 來不及彳了止晶圓進行製程處理。亦即，這些經處理過的晶 圓必須面臨報廢的命運。因此，造成生產成本的增加。 【發明内容】 因此本發明的目的在提供一種先進製程進控制系統 的製程預檢查方法，用以於晶圓進行製程處理前，預先檢 查出異常，進而停止進行晶圓進行製程處理。 依據本發明之一種先進製程進控制系統的製程預檢 查方法，至少包含： 使用先進製程進控制系統的一監控主機於晶圓進行 製程工作導入前，蒐集第一晶圓加工資訊； 使用一預先檢查系統接收由監控主機所傳送的第一 晶圓加工資訊，並進行比較該第一晶圓加工資訊與先進製 200834649 以及 程進控制系統的一資料庫中的第二晶圓加工資訊 /於比較該第一晶圓加工資訊與第二晶圓加工資 後田α亥第日日圓加工資訊違反一預設規則時，停止對 圓進行製程工作導入 其中，該第-晶圓加工資訊與第二晶圓加工資訊分別 包含批號、晶圓編號、機台編號、機台 程式識別碼以及上述之任—組合。該㈣_包含 Γ200834649 IX. Description of the Invention: [Technical Field] The present invention relates to a method of semiconductor manufacturing technology, and more particularly to a pre-advanced in an Advanced Process Control (APC) system in a semiconductor manufacturing technology Check the method of the process. [Prior Art] Many semiconductor manufacturing plants or factories have begun to adopt advanced process control (APC) systems to effectively reduce production costs. Advanced process control systems collect data from the process and analyze the effects of various parameters on the manufacturing process to make the process more stable and correct. Referring to FIG. 1 , the existing advanced process control system 400 can be combined with a Manufacturing Execution System (MES) 410 and an Equipment Application Program (EAP) 420 to collect the process on the machine 430. Various data and analysis of various parameters. The advanced process control system 400 includes a graphical interface 401, a data collection module 402, a database 403, an error detection system 404, and an alarm system 405. The data collection module 402 receives the data in the process transmitted by the monitoring host 420 and stores the data in the database 403 for analysis by the back end. The graphical interface 4〇1 is a web interface for the user to operate and set up the system. The error detection system 404 notifies the alarm system 405 to issue an alarm when an error is found by analyzing the results of various data and various parameters. Please refer to Figure 2, the existing advanced process control system 4〇〇 operation method is mainly to start to query the process program ID (PPID) list, check the number of wafers, and after the preparation work is completed. After updating the parameters and other work, the work is imported (j〇b-in), and the wafer processing process is started. After the completion, the job-out is performed. Among them, the parameter check operation before the work import (j〇b_in) takes about 2 seconds. However, when the existing advanced process control system 4 detects an error and notifies the alarm system 405 to issue an alarm, the wafer has entered the reaction chamber of the machine to perform or complete the process. Therefore, when the alarm message is received, it is too late to stop the wafer for process processing. That is, these treated crystals must face the fate of retirement. Therefore, the production cost is increased. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a process pre-inspection method for an advanced process control system for pre-detecting anomalies prior to wafer processing, thereby stopping wafer processing. The process pre-inspection method of an advanced process advance control system according to the present invention comprises at least: collecting a first wafer processing information by using a monitoring host of an advanced process control system to perform processing on the wafer; and using a pre-check The system receives the first wafer processing information transmitted by the monitoring host, and compares the first wafer processing information with Advanced System 200834649 and the second wafer processing information in a database of the Chengjin control system. When the first wafer processing information and the second wafer processing information of the Houtian α海日日日加工 processing information violates a predetermined rule, the processing of the circle is stopped, and the first wafer processing information and the second wafer processing are performed. The information includes the batch number, wafer number, machine number, machine program identification code, and the above-mentioned combinations. The (four)_ contains Γ
處理檢查規則，用以檢查晶圓是否有遺漏處理（Miss㈣ 發生；-重複處理檢查規則，用讀查晶圓是㈣重複處 理(Double _)發生以及-即時機台控制檢查規則，用以檢 查機台是否可進行晶圓製程處理。 本發明所此達成的功效在於·· 於晶圓進行製程處理前，預先檢查出異常，進而停止 進行晶圓進行製程處理，以減少晶圓報廢，降低生產成 本同時本發明女裝於先進製程控制系統中，對於原有 之生產與製造流程’不會產生任何有影響。此外，本發明 具有高度的可擴充性，該預設規則可根據使用上的需求進 仃凋整貫其他不同的功能，使原有之先進製程控制系統具 有更多的功能增加。 【實施方式】 請參照第3圖所示，依據本發明一較佳實施例之一種 製程預檢查方法，係·於—先進製程控㈣統中。先進 製程控制系統係為現有技術手段且並非本案之技術特 8 200834649 徵，所以不再重複贅述。 該製程預檢查方法主要係利用一預先檢查系統100, 該預先檢查系統100可以安裝於先進製程控制系統，並於 先進製程控制系統中的其他元件相容使用。 請參照4圖所示，依據本發明較佳實施例之製程預檢 查方法’主要係利用先進製程控制系統在晶圓製程工作導 入前的參數檢查期間（在現有的先進製程控制系統中，該段 參數檢查期間約為20秒），以預先檢查系統100依據一預 設規則同步檢查晶圓製程的處理狀態，該預設規則包含一 遺漏處理（miss run)檢查規則、一重複處理（d〇uble run)檢查 規則、一即時機台控制（real time tool contro卜RTTC)檢查 規則等。對於此項技術領域中具有通常知識者應可認知， 前述檢查規則僅為例示說明，並非用以限定本發明。 依據本發明較佳實施例之製程預檢查方法係使用先 進製程進控制系統的一監控主機2〇〇於晶圓進行製程工作 ί 導入W’ t集第-晶圓加工資訊。使用該預先檢查系統1〇〇 接收由監—控主機200所傳送的第一晶圓加工資訊，並進行 比較該第一晶圓加工資訊與先進製程進控制系統的一資 :庫21:中的第二晶圓加工資訊。其中，該第一晶圓加工 貧訊與第二晶圓加卫資訊分別包含批號、晶圓編號、機台 編號、機台反應室編號、製程程式編號以及上述之任一組 合0在本實施例中，該第一曰 义 茨弟日日51加工貧訊係為晶圓為一目 ^的^^晶圓加工資訊係為該目前站點 刖的站；且存放於該資料庫的加工資訊。 9 200834649 於比較該第一晶圓加工資訊與第二晶圓加工資訊 後，當該第一晶圓加工資訊違反該預設規則時，停止對晶 圓進行製程工作導入。 请參照第5圖所示，該預設規則的遺漏處理檢查規 則，係用以檢查晶圓是否有遺漏處理（Missrun)發生。該遺 漏處理檢查規則包含決定是否檢查站點資料，若是，則取 得前一站點資料包含批號以及晶圓編號。檢查批號是否正 確，若是，則繼續進行下一步驟，若否，則發出警報（可經 由警報系統230)。檢查晶圓編號是否正確，若是，則繼續 進行下一步驟，若否，則發出警報（可經由警報系統23〇)。 最後，檢查晶圓編號是否已經處理，若是，則結束，若否， 則發出警報（可經由警報系統230)。 此外，遺漏處理檢查規則包含一解除警報步驟與一解 除/設定遺漏處理批號步驟，解除警報步驟係利用圖形介面 220於決定是否檢查站點資料步驟時設定不處理批號，在 此一狀況下，設定不處理批號即不發出警報。 解除/設定遺漏處理批號步驟，係於決定是否檢查站點 資料步驟或步驟檢查批號是否正確時，解除/設定進行遺漏 處理批號晶圓的補處理製程。亦即，當發現有遺漏處理批 號晶圓時，此一步驟即進行該些晶圓的補救製程處理。 請參照第6圖所示，該預設規則包含一重複處理檢查 規則，用以檢查晶圓是否有重複處理（D〇ublerun)發生。包 含檢查批號是否存在，若是，則繼續進行下一步驟，若否， 則結束。檢查晶圓處理紀錄是否存在，若否，則結束，若 200834649 是，則發出警報（可經由警報系統230)。相同的，重複處 理檢查規則可包含一解除警報步驟，係利用圖形介面220 於檢查晶圓處理紀錄是否存在步驟時設定不處理批號。 請參照第7圖所示，即時機台控制檢查規則，用以檢 查機台是否可進行晶圓製程處理。該即時機台控制檢查規 則包含檢查製程程式識別碼（Process Program ID，PPID)是 否存在，若是，則繼續進行下一步驟，若否，則將製程程 式編號加入一製程程式識別碼（PPID)表。確認製程程式識 別碼是否可執行，若是，則繼續進行下一步驟，若否，則 發出警報（可經由警報系統230)。確認機台、製程程式識 別碼以及製程參數是否存在，若是，則繼續進行下一步 驟，若否，則發出警報（可經由警報系統230)。確認反應 室各項參數規格設定（Chamber Setting)是否存在，若是， 則繼續進行下一步驟，若否，則發出警報（可經由警報系統 230)。確認反應室即時機台控制裝置設定（Chamber RTTC Setting)是否存在，若是，則結束，若否，則發出警報（可 經由警報系統230)。 在確認機台、製程程式識別碼以及製程參數是否存在 步驟中，包含提供一製程參數（Chamber Recipe)表以進行確 認機台、製程程式編號以及製程參數是否存在。 在確認反應室規格設定（Chamber Setting)是否存在步 驟中，包含提供一即時機台控制設定表，以進行確認反應 室即時機台控制裝置是否存在。 請參照8圖所示，依據本發明較佳另一實施例之製程 11 200834649 預檢查方法，主要係利用先進製程控制系統在晶圓製程工 作導入前的參數檢查期間（在現有的先進製程控制系統 中，該段參數檢查期間約為20秒），以預先檢查系統1〇〇 依據一預設規則同步檢查晶圓製程的處理狀態，該預設規 則包含一遺漏處理（miss run)檢查規則、一重複處理（double run)檢查規則、一即時機台控制（reai time to〇i contr〇卜 RTTC)檢查規則等。對於此項技術領域中具有通常知識者 應可認知，前述檢查規則僅為例示說明，並非用以限定本 發明。 在此一實施例中，遺漏處理（miss run)檢查規則、重複 處理（double nm)檢查規則以及即時機台控制（real衍㈣ tool C〇ntn>卜RTTC)檢查規則係為同步執行（如圖中並列所 示）。至於各檢查規則的詳細步驟，可與前一實施例相同， 因此不再加以贅述。 雖然本發明已以數較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作各種之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1圖係繪示現有的先進製程控制系統的示意方塊 12 200834649 圖 第2圖係繪示第1圖中現有的先進製程控制系統的流 程圖。 第3圖係繪示依照本發明一較佳實施例實施於現有的 先進製程控制系統的示意方塊圖。 第4圖係繪示繪示第3圖中系統的流程圖。 第5圖係繪示本發明較佳實施例實施之該預設規則包 含一遺漏處理（miss run)檢查規則的流程圖。 第6圖係繪示本發明較佳實施例實施之該預設規則包 含一重複處理（double run)檢查規則的流程圖。 第7圖係繪示本發明較佳實施例實施之該預設規則包 含一即時機台控制（real time tool contro卜RTTC)檢查規則 的流程圖。 第8圖係繪示依照本發明另一較佳實施例的流程圖。 402 :資料蒐集模組 403 :資料庫 404 :錯誤偵測系統 405 :警報系統 410 :製造執行系統 420 :監控主機 430 ·β機台 【主要元件符號說明】 100 :預先檢查系統 200 :監控主機 21〇 :資料庫 220 :圖形介面 230 :警報系統 400 :先進製程控制系統 401 :圖形介面 13Handling inspection rules to check if the wafer is missing (Miss occurs); - Repeat processing check rules, using wafer read (4) Repeat (Double _) and - Instant machine control check rules for checking machine Whether the wafer can be processed by the wafer process. The effect achieved by the present invention is that the abnormality is detected in advance before the wafer is processed, and the wafer processing is stopped to reduce wafer scrap and reduce production cost. At the same time, the present invention is in the advanced process control system, and does not have any influence on the original production and manufacturing process. In addition, the invention has a high degree of expandability, and the preset rule can be adapted according to the needs of use. The other advanced functions of the original advanced process control system have more functions. [Embodiment] Please refer to FIG. 3, a process pre-inspection method according to a preferred embodiment of the present invention. , Department · Advanced Technology Control (4), advanced process control system is a prior art means and not the technical speciality of this case 20083464 The process pre-inspection method mainly utilizes a pre-inspection system 100 that can be installed in an advanced process control system and is compatible with other components in the advanced process control system. Referring to FIG. 4, the process pre-inspection method according to the preferred embodiment of the present invention mainly utilizes an advanced process control system during parameter inspection before the wafer process work is introduced (in the existing advanced process control system, the segment The parameter inspection period is about 20 seconds. The pre-check system 100 synchronously checks the processing status of the wafer process according to a preset rule, and the preset rule includes a miss run check rule and a repeat process (d〇uble). Run) check rules, a real time tool contro (RTTC) check rule, etc. It should be understood by those of ordinary skill in the art that the foregoing check rules are merely illustrative and are not intended to limit the present invention. The process pre-inspection method according to the preferred embodiment of the present invention uses a monitoring of an advanced process control system. The machine 2 performs the process work on the wafer ί, and imports the W-t set first-wafer processing information. The pre-inspection system 1 is used to receive the first wafer processing information transmitted by the supervisory control host 200, and performs Comparing the first wafer processing information with the advanced process control system: the second wafer processing information in the library 21: wherein the first wafer processing information and the second wafer enhancement information respectively comprise Batch number, wafer number, machine number, machine reaction chamber number, process program number, and any combination of the above. In this embodiment, the first 曰 茨 弟 51 51 51 processing aids for the wafer is The ^^ wafer processing information is the station of the current site; and the processing information stored in the database. 9 200834649 After comparing the first wafer processing information and the second wafer processing information, When the first wafer processing information violates the preset rule, the process import of the wafer is stopped. Referring to Figure 5, the omission processing check rule of the preset rule is used to check whether the wafer has a missing process (Missrun). The omission processing check rule includes a decision whether to check the site material, and if so, the previous site data includes the lot number and the wafer number. Check that the lot number is correct, and if so, proceed to the next step, and if not, issue an alert (via alarm system 230). Check that the wafer number is correct. If yes, proceed to the next step. If not, issue an alarm (via alarm system 23). Finally, it is checked whether the wafer number has been processed, and if so, it ends, and if not, an alarm is issued (via the alarm system 230). In addition, the omission processing check rule includes a cancel alarm step and a release/set omission processing batch number step, and the disarming step is performed by using the graphic interface 220 to determine whether to check the site data step, and the batch number is not processed. In this case, the setting is set. No alert is issued without processing the batch number. The procedure for releasing/setting the missing processing batch number is to decide whether to check the site data step or step to check whether the batch number is correct, and to cancel/set the missing processing process for the batch wafer processing. That is, when it is found that there is a missing wafer for processing the batch, this step performs the remedial processing of the wafers. Referring to Figure 6, the preset rule includes a repetitive processing check rule to check whether the wafer has duplicate processing (D〇ublerun). Contains whether the inspection lot number exists, and if so, proceeds to the next step, and if not, ends. Check if the wafer processing record exists. If not, then it ends. If 200834649 is yes, an alarm is issued (via alarm system 230). Similarly, the repetitive processing check rule may include a de-alert step, which is set by the graphical interface 220 to check whether the wafer processing record has a step or not. Please refer to Figure 7, the instant machine control check rule to check whether the machine can be processed by the wafer. The real-time machine control check rule includes checking whether the process program ID (PPID) exists, and if so, proceeding to the next step, if not, adding the process program number to a process program identification code (PPID) table. . Confirm that the process identification code is executable, and if so, proceed to the next step, and if not, issue an alarm (via alarm system 230). Confirm that the machine, the process identification code, and the process parameters are present. If yes, proceed to the next step. If not, an alarm is issued (via the alarm system 230). Confirm that the Chamber Setting is present, and if so, proceed to the next step. If not, an alarm is issued (via the alarm system 230). Check if the Chamber RTTC Setting is present, and if so, the process ends. If not, an alarm is issued (via the alarm system 230). In the step of confirming the existence of the machine, the program identification code and the process parameters, a list of the Chamber Recipe is provided to confirm whether the machine, the program number and the process parameters exist. In the confirmation of the existence of the Chamber Setting, the provision of a real-time machine control setting table is included to confirm the presence of the immediate machine control device in the reaction chamber. Referring to FIG. 8, a process 11 according to another preferred embodiment of the present invention, the method of pre-inspection, mainly uses an advanced process control system during parameter inspection before the introduction of the wafer process work (in the existing advanced process control system) In the period of the parameter inspection period of about 20 seconds, the pre-check system 1 同步 synchronously checks the processing status of the wafer process according to a preset rule, the preset rule includes a miss run check rule, Double run check rules, a real machine control (reai time to 〇i contr RT RTTC) check rules, and so on. It should be understood by those of ordinary skill in the art that the foregoing inspection rules are merely illustrative and are not intended to limit the invention. In this embodiment, the miss run check rule, the double nm check rule, and the real machine control (real) (four) tool C〇ntn> RT RTTC check rule are performed synchronously (as shown in the figure). In the middle row). The detailed steps of the respective inspection rules can be the same as in the previous embodiment, and therefore will not be described again. Although the present invention has been described above in terms of several preferred embodiments, it is not intended to limit the present invention, and it is to be understood that those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; Illustrated block 12 200834649 Figure 2 is a flow chart showing the prior art advanced process control system of Figure 1. Figure 3 is a schematic block diagram of an advanced process control system implemented in accordance with a preferred embodiment of the present invention. Figure 4 is a flow chart showing the system of Figure 3. Figure 5 is a flow chart showing the default rule of the preferred embodiment of the present invention including a miss run check rule. Figure 6 is a flow chart showing the preset rule including a double run check rule implemented by the preferred embodiment of the present invention. Figure 7 is a flow chart showing the preset rule including a real time tool contro (RTTC) check rule implemented by the preferred embodiment of the present invention. Figure 8 is a flow chart showing another preferred embodiment of the present invention. 402: data collection module 403: database 404: error detection system 405: alarm system 410: manufacturing execution system 420: monitoring host 430, beta machine [main component symbol description] 100: pre-check system 200: monitoring host 21 〇: Library 220: Graphic Interface 230: Alarm System 400: Advanced Process Control System 401: Graphic Interface 13