WO2021253751A1 - 背接触太阳电池及生产方法、背接触电池组件 - Google Patents
背接触太阳电池及生产方法、背接触电池组件 Download PDFInfo
- Publication number
- WO2021253751A1 WO2021253751A1 PCT/CN2020/135400 CN2020135400W WO2021253751A1 WO 2021253751 A1 WO2021253751 A1 WO 2021253751A1 CN 2020135400 W CN2020135400 W CN 2020135400W WO 2021253751 A1 WO2021253751 A1 WO 2021253751A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- carrier
- silicon substrate
- electrode
- solar cell
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 254
- 239000002184 metal Substances 0.000 claims abstract description 254
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 238
- 239000010703 silicon Substances 0.000 claims abstract description 238
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 235
- 239000000758 substrate Substances 0.000 claims abstract description 231
- 150000004770 chalcogenides Chemical class 0.000 claims abstract description 192
- 230000005540 biological transmission Effects 0.000 claims abstract description 78
- 238000000034 method Methods 0.000 claims abstract description 43
- 239000000463 material Substances 0.000 claims description 157
- 239000000969 carrier Substances 0.000 claims description 63
- 238000002955 isolation Methods 0.000 claims description 51
- 230000000903 blocking effect Effects 0.000 claims description 35
- -1 oxygen group compound Chemical class 0.000 claims description 29
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 24
- 238000002161 passivation Methods 0.000 claims description 17
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 16
- 229910001887 tin oxide Inorganic materials 0.000 claims description 16
- RCJVRSBWZCNNQT-UHFFFAOYSA-N dichloridooxygen Chemical compound ClOCl RCJVRSBWZCNNQT-UHFFFAOYSA-N 0.000 claims description 15
- 239000002210 silicon-based material Substances 0.000 claims description 15
- 150000002927 oxygen compounds Chemical class 0.000 claims description 13
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 12
- 150000001786 chalcogen compounds Chemical class 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 12
- 229910052723 transition metal Inorganic materials 0.000 claims description 12
- 239000011787 zinc oxide Substances 0.000 claims description 12
- 230000007547 defect Effects 0.000 claims description 11
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 150000003624 transition metals Chemical class 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- 229910052783 alkali metal Inorganic materials 0.000 claims description 7
- 239000011575 calcium Substances 0.000 claims description 6
- 230000015556 catabolic process Effects 0.000 claims description 6
- 230000005669 field effect Effects 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 229910001508 alkali metal halide Inorganic materials 0.000 claims description 5
- 150000008045 alkali metal halides Chemical class 0.000 claims description 5
- 150000001340 alkali metals Chemical class 0.000 claims description 5
- 229910052788 barium Inorganic materials 0.000 claims description 5
- 229910052791 calcium Inorganic materials 0.000 claims description 5
- 229910052749 magnesium Inorganic materials 0.000 claims description 5
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 4
- 239000005751 Copper oxide Substances 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 229910000431 copper oxide Inorganic materials 0.000 claims description 4
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims description 4
- 229910000484 niobium oxide Inorganic materials 0.000 claims description 4
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000005083 Zinc sulfide Substances 0.000 claims description 2
- SUZRSWUQPPOXTN-UHFFFAOYSA-N [Ge]=O.[Cd] Chemical compound [Ge]=O.[Cd] SUZRSWUQPPOXTN-UHFFFAOYSA-N 0.000 claims description 2
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 2
- OJCDKHXKHLJDOT-UHFFFAOYSA-N fluoro hypofluorite;silicon Chemical compound [Si].FOF OJCDKHXKHLJDOT-UHFFFAOYSA-N 0.000 claims description 2
- 229910021480 group 4 element Inorganic materials 0.000 claims description 2
- 229910021478 group 5 element Inorganic materials 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- MHWZQNGIEIYAQJ-UHFFFAOYSA-N molybdenum diselenide Chemical compound [Se]=[Mo]=[Se] MHWZQNGIEIYAQJ-UHFFFAOYSA-N 0.000 claims description 2
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 2
- 229910000476 molybdenum oxide Inorganic materials 0.000 claims description 2
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 2
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 claims description 2
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 claims description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 2
- WKMKTIVRRLOHAJ-UHFFFAOYSA-N oxygen(2-);thallium(1+) Chemical compound [O-2].[Tl+].[Tl+] WKMKTIVRRLOHAJ-UHFFFAOYSA-N 0.000 claims description 2
- IRPLSAGFWHCJIQ-UHFFFAOYSA-N selanylidenecopper Chemical compound [Se]=[Cu] IRPLSAGFWHCJIQ-UHFFFAOYSA-N 0.000 claims description 2
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 claims description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 claims description 2
- 229910003438 thallium oxide Inorganic materials 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 238000002834 transmittance Methods 0.000 claims description 2
- 229910001930 tungsten oxide Inorganic materials 0.000 claims description 2
- 229910001935 vanadium oxide Inorganic materials 0.000 claims description 2
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 2
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 claims 2
- 235000012149 noodles Nutrition 0.000 claims 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
- IOOOFYZYXDAZST-UHFFFAOYSA-N [Zn].[Ir] Chemical compound [Zn].[Ir] IOOOFYZYXDAZST-UHFFFAOYSA-N 0.000 claims 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims 1
- WDIHJSXYQDMJHN-UHFFFAOYSA-L barium chloride Chemical compound [Cl-].[Cl-].[Ba+2] WDIHJSXYQDMJHN-UHFFFAOYSA-L 0.000 claims 1
- 229910001626 barium chloride Inorganic materials 0.000 claims 1
- LMPZHWVTVJLPBZ-UHFFFAOYSA-N calcium cobalt(2+) oxygen(2-) Chemical compound [O--].[O--].[Ca++].[Co++] LMPZHWVTVJLPBZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 claims 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 claims 1
- 229910001507 metal halide Inorganic materials 0.000 claims 1
- 150000005309 metal halides Chemical class 0.000 claims 1
- 229910052700 potassium Inorganic materials 0.000 claims 1
- 239000011591 potassium Substances 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 37
- 238000013082 photovoltaic technology Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 126
- 238000006243 chemical reaction Methods 0.000 description 31
- 238000010586 diagram Methods 0.000 description 23
- 230000000694 effects Effects 0.000 description 17
- 230000006798 recombination Effects 0.000 description 13
- 238000005215 recombination Methods 0.000 description 13
- 239000000126 substance Substances 0.000 description 12
- 230000008021 deposition Effects 0.000 description 8
- 238000010292 electrical insulation Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 6
- 238000005137 deposition process Methods 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 210000000746 body region Anatomy 0.000 description 5
- 230000001846 repelling effect Effects 0.000 description 5
- 230000005570 vertical transmission Effects 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000005036 potential barrier Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000001568 sexual effect Effects 0.000 description 3
- 230000005641 tunneling Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000006388 chemical passivation reaction Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- IRPGOXJVTQTAAN-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropanal Chemical compound FC(F)(F)C(F)(F)C=O IRPGOXJVTQTAAN-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910017109 AlON Inorganic materials 0.000 description 1
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminum fluoride Inorganic materials F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 1
- 229910020177 SiOF Inorganic materials 0.000 description 1
- OXLRDKBGARCSLL-UHFFFAOYSA-N [Ca].[Co]=O Chemical compound [Ca].[Co]=O OXLRDKBGARCSLL-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- UPNFMHMMXOKBOJ-UHFFFAOYSA-N zinc iridium(3+) oxygen(2-) Chemical compound [Ir+3].[O-2].[Zn+2] UPNFMHMMXOKBOJ-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/074—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a heterojunction with an element of Group IV of the Periodic Table, e.g. ITO/Si, GaAs/Si or CdTe/Si solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention relates to the field of photovoltaic technology, in particular to a back contact solar cell and a production method, and a back contact battery assembly.
- the back-contact solar cell can achieve high photoelectric conversion efficiency because it has no electrode shield to the smooth surface, so it is widely used.
- back-contact solar cells usually need to fabricate areas of different conductivity types that are accurately aligned and electrically isolated from each other on the backlight surface of the silicon substrate.
- the invention provides a back-contact solar cell, a production method, and a back-contact battery assembly, aiming to solve the problem of poor process stability.
- a back-contact solar cell comprising: a silicon substrate, the backlight surface of the silicon substrate is divided into a first region and a second region; a metal chalcogenide layer deposited at least on the The first region of the silicon substrate; the region corresponding to the metal chalcogenide layer and the first region forms a first carrier collection terminal; a first electrode is correspondingly arranged on the first carrier collection terminal On; the second electrode is correspondingly arranged in the area corresponding to the second area.
- the conduction band energy level of the metal chalcogenide layer near the interface of the first region is close to the conduction energy level of the first carrier in the first region, which can play a role in absorbing the first carrier and repelling the second carrier. Furthermore, the region corresponding to the first region of the metal chalcogenide layer forms a first carrier collection end, and the collection and transmission of the first carrier are realized through the first carrier collection end.
- the structure and performance of the metal oxygen group compound layer are highly adjustable, the thermal stability is good, the process selection window is wide, and at the same time, it can achieve lower lateral conductivity and stronger longitudinal conductivity.
- the silicon substrate in the second region is doped to form a second carrier collection terminal; the metal chalcogen compound layer is deposited on the entire backlight surface of the silicon substrate; the metal chalcogen compound The region of the layer corresponding to the second region forms a second carrier transport region; the second electrode is correspondingly disposed on the second carrier transport region.
- the second carrier collection end is formed by doping through the second region of the backlight surface of the silicon substrate, which can absorb the second carriers and repel the first carriers, thereby serving as a second carrier selection Sexual effect, and then at the second carrier collection end, the second carrier density is higher, and the first carrier density is lower.
- the continuous whole layer of metal oxychloride layer at the interface near the first region is close to the conduction level of the first carrier in the first region, which can absorb the first carrier to repel.
- the role of the second carrier, and then the area corresponding to the metal chalcogenide layer and the first region forms the first carrier collection end, and the collection and transmission of the first carrier are realized through the first carrier collection end .
- the carrier conduction level of the metal chalcogenide layer corresponds to the conduction level of the second carrier corresponding to the second region Therefore, the second carrier at the second carrier collection end can directly enter the area corresponding to the second area of the metal chalcogenide layer, and further, the area corresponding to the second area of the metal chalcogen compound layer serves as the second carrier.
- the current carrier transmission area realizes the collection and transmission of the second carrier.
- the region corresponding to the first region realizes the collection and transmission of the first carrier
- the region corresponding to the second region realizes the collection and transmission of the second carrier.
- the metal chalcogenide layer realizes the second carrier transport and the first carrier collection respectively.
- the metal chalcogenide layer has a lower lateral transport capacity, and different types of carriers After being collected, they are all transmitted longitudinally into the corresponding electrodes, and will not be connected to each other due to lateral transmission and cause leakage or short circuit. Therefore, additional alignment and electrical isolation are not required, the process is simple, the recombination is reduced, and the photoelectric conversion efficiency is improved.
- the second carrier collection terminal, the first carrier collection terminal and the metal oxychloride layer will not cause a reverse pn junction due to mutual contact.
- the silicon substrate in the second region is doped to form a second carrier collection end; the metal chalcogenide layer is deposited only on the first region; the second electrode is correspondingly disposed on the The second carrier collection terminal;
- the metal chalcogenide layer is deposited on the entire backlight surface of the silicon substrate; at least a portion of the metal chalcogenide layer corresponding to the second region has an opening for electrically dividing the metal chalcogenide layer Hole; a second carrier selection layer is formed on a portion corresponding to the second region of the metal chalcogenide layer, and the second carrier selection layer is filled in the opening; the second electrode is correspondingly arranged On the second carrier selection layer.
- the second carrier collection end is formed by doping through the second region of the backlight surface of the silicon substrate, which can absorb the second carriers and repel the first carriers, thereby serving as a second carrier selection And the second carrier density is higher at the second carrier collection end, and the first carrier density is lower.
- the metal chalcogenide layer is only deposited on the first area of the backlight surface of the silicon substrate as the first carrier collection terminal, and its carrier conduction energy level is close to the conduction energy level of the first carrier in the first area. It can absorb the first carrier and repel the second carrier, and realize the collection and transmission of the first carrier through the first carrier collection end.
- the first electrode is correspondingly arranged on the first carrier collecting end
- the second electrode is correspondingly arranged on the second carrier collecting end, that is, the second area of the backlight surface of the doped silicon substrate realizes the second
- the metal chalcogenide layer deposited on the first area of the backlight surface of the silicon substrate realizes the collection and transmission of the first carriers, and different substances located at different positions realize the pairing.
- the collection and transmission of different carriers does not require additional alignment and electrical isolation, the process is simple, the area of the non-collection area is reduced, and the photoelectric conversion efficiency is improved.
- the carrier conduction energy level of the collection or conduction material of each carrier collection area is close to the transmission energy level of the corresponding carrier in the silicon material, and the transmission interface has no or low potential barrier, reducing the longitudinal contact resistance.
- the continuous whole layer of the metal chalcogenide layer is close to the first carrier.
- the carrier conduction level at the interface of the region is close to the conduction level of the first carrier in the first region, which can absorb the first carrier and repel the second carrier, and then the metal chalcogenide layer
- the part corresponding to the first region forms a first carrier collection end, and the collection and transmission of the first carrier are realized through the first carrier collection end.
- At least the part corresponding to the second region of the continuous whole metal chalcogenide layer has openings for electrically dividing the metal chalcogenide layer, the openings are filled with the second carrier selection layer, and the second electrode is arranged On the second carrier selection layer, it is equivalent to that the second carrier is exclusively transported through the second carrier selection layer, and the first carrier is mainly transported through the unopened part of the metal chalcogenide layer , Realizes the transmission of different substances to different carriers, does not require additional alignment and electrical isolation, the process is simple, the area of the non-collection area is reduced, and the photoelectric conversion efficiency is improved.
- the first carrier and the second carrier are respectively transmitted through different substances, and the second carrier selection layer is more convenient for the second carrier transmission and can reduce the longitudinal contact resistance.
- the second carrier collection terminal, the first carrier collection terminal and the metal oxychloride layer will not cause a reverse pn junction due to mutual contact.
- the silicon substrate in the second region is doped to form a second carrier collection terminal; the metal chalcogen compound layer is deposited on the entire backlight surface of the silicon substrate; The compound layer has a blocking structure that electrically divides the metal chalcogenide layer into a second carrier transport region and the first carrier collection end; wherein, the second carrier transport region corresponds to the The second area; the second electrode is correspondingly arranged on the second carrier transport area.
- the second carrier collection end is formed by doping through the second region of the backlight surface of the silicon substrate, which can absorb the second carriers and repel the first carriers, thereby serving as a second carrier selection Sexual effect, and then at the second carrier collection end, the second carrier density is higher, and the first carrier density is lower.
- the blocking structure divides the metal chalcogenide layer electrically into the second carrier transport region and the first carrier collection end.
- the first carrier collection end is at the interface close to the first region and the carrier conduction energy level and The conduction energy level of the first carrier in the first region is close, which can play a role in absorbing the first carrier and repelling the second carrier.
- the carrier conduction energy level of the second carrier transport region corresponds to the conduction of the second carrier corresponding to the second region
- the energy level is close, therefore, the second carrier at the second carrier collection end can directly enter the second carrier transmission area, thereby realizing the collection and transmission of the second carrier.
- the second carrier transport area and the first carrier collection end are divided by the blocking structure, so that the lateral transport capacity of the entire metal chalcogenide layer is very low, so that the vertical conduction of the metal chalcogenide layer can be improved. Capability and avoid lateral leakage, which can reduce the longitudinal series resistance to a large extent.
- the second carrier transport area and the first carrier collection end are divided by the blocking structure. After different types of carriers are collected, they will be transported longitudinally into the corresponding electrode, and will not be connected to each other due to lateral transport and cause leakage or Short circuit, so precise doping alignment is not required, the process is simple, the recombination is reduced, and the photoelectric conversion efficiency is improved. At the same time, the second carrier collection terminal, the first carrier collection terminal and the metal oxychloride layer will not cause a reverse pn junction due to mutual contact.
- the back contact solar cell further includes: a second carrier selective collection layer; the second carrier selective collection layer is deposited on the second region of the silicon substrate; the metal oxygen The group compound layer is deposited on the first area and on the backlight surface of the second carrier selective collection layer; the part of the metal oxygen compound layer corresponding to the second carrier selective collection layer forms a second Two carrier transport regions; the second electrode is correspondingly arranged on the second carrier transport region.
- the second carrier selective collection layer is deposited on the second area of the backlight surface of the silicon substrate without high temperature diffusion and low process temperature.
- the carrier conduction level of the second carrier selection and collection layer is close to the second carrier conduction level of the silicon substrate, which can absorb the second carrier to repel the first carrier and play a role in the second carrier selection Sexual effect.
- the metal chalcogenide layer at the interface of the region outside the second carrier selective collection layer is close to the conduction level of the first carrier in the first region on the backlight surface of the silicon substrate.
- the metal chalcogenide layer region corresponding to the second carrier selective collection layer realizes the transport of the second carrier
- the other metal chalcogenide layer region realizes the transmission of the first carrier. Collection and transport, that is, different regions of the metal chalcogenide layer realize the second carrier transport and the first carrier collection respectively.
- the second carrier transport region and the first carrier are collected.
- the second carrier selective collection layer adopts a deposition selective contact structure, and the metal chalcogenide layer also adopts a deposited selective contact structure, which has the advantage of low body region recombination and is not restricted by the Auger recombination limit. At the same time, the second carrier selective collection layer and the first carrier collection end will not cause a reverse pn junction due to mutual contact.
- a method for producing a back-contact solar cell including:
- the backlight surface of the silicon substrate is divided into a first area and a second area;
- At least a metal chalcogenide layer is deposited on the first area of the silicon substrate; the area corresponding to the metal chalcogenide layer and the first area forms a first carrier collecting end;
- a first electrode is correspondingly arranged on the first carrier collection end
- a second electrode is correspondingly arranged in an area corresponding to the second area.
- a back-contact solar cell assembly including any of the aforementioned back-contact solar cells.
- FIGs 1-23 respectively show the structural schematic diagrams of the first to the twentieth types of back-contact solar cells in the embodiments of the present invention.
- FIG. 1 shows a schematic structural diagram of the first type of back-contact solar cell in the embodiment of the present invention.
- the back contact solar cell includes a silicon substrate 1, and the backlight surface of the silicon substrate 1 is divided into a first area and a second area 2.
- the area of the backlight surface of the silicon substrate 1 except for the second area 2 is the first area.
- the metal chalcogenide layer 4 is deposited at least on the first region of the silicon substrate 1. It should be noted that whether the metal chalcogenide layer 4 is deposited on the second region 2 of the silicon substrate 1 is not specifically limited. For example, in the back contact solar cell shown in FIG. 1, the second region 2 of the silicon substrate 1 is not deposited with the metal chalcogenide layer 4.
- the region corresponding to the first region of the backlight surface of the metal oxychloride layer 4 of the silicon substrate 1 forms a first carrier collection end, and the first carrier collection end can realize the collection and transmission of the first carriers.
- the first carrier is selected from one of many carriers or few carriers, and the second carrier is the other one of many carriers or few carriers. That is, when the first carrier is multiple carriers, the second carrier must be a minority carrier; when the second carrier is multiple carriers, the first carrier must be a minority carrier; In the present invention, whether the multiple sons and the minority sons are electrons or holes is mainly determined according to the doping type of the silicon substrate 1. If the doping type of the silicon substrate 1 is n-type, then in the back-contact solar cell of the present invention, the multiple sons refer to electrons, and the minority sons refer to holes. If the doping type of the silicon substrate 1 is p-type, then in the back-contact solar cell of the present invention, multiple sons refer to holes, and minority sons refer to electrons.
- a first electrode 5 is correspondingly provided at the first carrier collecting end of the metal chalcogenide layer 4, and the first electrode 5 is used for conducting the first carrier.
- the second electrode 6 is correspondingly arranged in the area corresponding to the second area 2, and the second electrode 6 is used for conducting the second carrier. It should be noted that an electrical insulation gap needs to be reserved between the first electrode 5 and the second electrode 6, and the electrical insulation gap is not less than the breakdown distance under normal operating voltage.
- the first electrode 5 and the second electrode 6 can be fabricated by printing, deposition and other processes.
- the second electrode 6 and the first electrode 5 may be metal electrodes.
- the conduction band energy level of the metal chalcogenide layer 4 at the interface near the first region is close to the conduction energy level of the first carrier in the first region, which can absorb the first carrier and repel the second carrier.
- the region corresponding to the first region of the metal chalcogenide layer 4 forms a first carrier collection end, and the collection and transmission of the first carrier are realized through the first carrier collection end.
- the metal chalcogenide layer 4 has strong structural and performance tunability, good thermal stability, and a wide process selection window. At the same time, it can achieve lower lateral conductivity and stronger longitudinal conductivity.
- FIG. 2 shows a schematic structural diagram of a second type of back-contact solar cell in an embodiment of the present invention.
- the metal chalcogenide layer 4 is deposited on the backlight surface of the entire silicon substrate 1.
- the structure and performance are highly adjustable, which can achieve lower lateral conductivity and Strong longitudinal conductivity, good thermal stability, wide process selection window.
- the area corresponding to the second area of the back light surface of the metal chalcogenide layer 4 and the silicon substrate 1 forms a second carrier transport area, which can realize the transport of the second carrier .
- a second electrode 6 is correspondingly provided in the second carrier transport region in the metal chalcogenide layer 4, and the second electrode 6 is used to conduct the second carrier.
- the second region 2 is doped to form a second carrier collection end.
- the second carrier collection terminal can realize the collection and transmission of the second carrier.
- the second region 2 and the second region in the silicon substrate 1 have the same or different doping types; when the doping types are the same, the doped elements can be the same or different. There is no specific limitation.
- the projected area of the second carrier collection end on the backlight surface of the silicon substrate 1 accounts for 5% to 45% of the total area of the backlight surface of the silicon substrate. With this area ratio, the second carrier The collection and transmission effect is good, and it will not affect the collection and transmission of the first carrier.
- the top view of the second carrier collection end may be a dotted or linear pattern, such as a circle or an ellipse. Linear patterns such as rectangles or polygons.
- the top view of the second carrier collecting end is a dotted or linear pattern, so that the doping process for the second region is simple.
- the doping concentration of the second carrier collection end is greater than or equal to 10 15 cm -3 and greater than the doping concentration of the silicon substrate 1 in the first region, so that the second carrier collection and transmission effect is better .
- the second carrier collection end is a doped structure, which can cause the n-type silicon substrate to bend downward in the energy band of the second region 2 to attract electrons to repel holes, and play a role of selective electron collection.
- the area corresponding to the first area in the metal chalcogenide layer 4 forms a first carrier collecting end, and the first carrier collecting end is the hole collecting end.
- the metal chalcogenide compound in the first region ie, the first carrier collection terminal
- the conduction band energy level of the material is close to the valence band energy level of the n-type silicon substrate, and can have Negative interface charges or negative fixed defects can cause the energy band at the interface to bend upwards, forming an interface p-type layer, which acts to attract holes and repel electrons.
- materials with stronger selectivity will cause stronger interface band bending, and at the same time, the conduction band bottom energy level of the first carrier collection end is lower, and holes can pass through the tunneling recombination mechanism Enter the hole selective material to realize the collection and transport of holes.
- the bottom energy level of the conduction band in this region is lower, which is close to the bottom energy level of the second carrier collection end.
- the electrons can directly enter the second carrier transport area corresponding to the second carrier collection end in the metal chalcogenide layer, so as to realize the transport of electrons.
- conduction band energy level and valence band energy level in the present invention generally refer to the energy level of the material itself, that is, the energy level when the material exists alone, and does not refer to the actual energy level in the battery structure.
- the metal chalcogenide layer 4 can simultaneously realize the collection of holes and the transmission of electrons.
- the material can adjust the crystallinity, crystal phase and doping elements to make it have lower lateral conductivity.
- the holes at the current collector end and the electrons in the second carrier transport region, different types of carriers are collected and transported longitudinally into the corresponding electrode, and will not communicate with each other due to lateral transport and cause leakage or short circuit, so different types of carriers
- the current collector terminal does not need to be additionally electrically isolated, and no reverse pn junction will be generated due to mutual contact.
- the second carrier collection end adopts a local doping selective contact structure
- the metal chalcogenide layer 4 adopts a deposited selective contact structure.
- the metal chalcogenide layer 4 has a minority carrier collection area.
- the metal chalcogenide layer 4 has stronger selectivity, higher thermal stability, and material deposition Process equipment requirements are lower and safety is higher.
- the metal oxygen group compound layer 4 can fully cover the back of the battery, which further simplifies the process flow.
- the region corresponding to the first region in the metal chalcogenide layer 4 is used to form the first carrier collection end. Compared with amorphous silicon material, it has stronger selectivity and vertical transmission ability. Stronger transmission capacity; At the same time, at the second carrier collection end, in conjunction with the local doping structure, the second carrier is transported through the band edge of the oxygen compound material, and does not involve the cross-level tunneling mechanism. Two-carrier transmission is small, and lower contact resistance can be achieved.
- the metal chalcogenide layer 4 may have a one-layer or multi-layer structure.
- the thickness d1 of the metal chalcogenide layer 4 may be 1-600 nm, and more preferably, d1 is 2. -100nm, this thickness range is conducive to the transmission and collection of the second carrier and the first carrier.
- the silicon substrate 1 is a p-type silicon substrate and the second carriers are holes, which can be understood with reference to the above.
- the metal oxygen group is selected from: at least one of the first materials.
- the first material is: an n-type metal oxide with a work function greater than or equal to 5 eV, or a p-type metal oxide with a work function less than or equal to 6 eV.
- the second carrier transport region in the metal chalcogenide layer 4 of this material facilitates the transport of the second carrier, and the first carrier in the metal chalcogenide layer 4 of this material
- the collection terminal facilitates the transmission and collection of the first carrier.
- the metal chalcogenide layer is selected from: at least one of the above-mentioned first materials.
- the aforementioned first material is selected from: molybdenum oxide, tungsten oxide, vanadium oxide, niobium oxide, nickel oxide, mercury-doped niobium oxide (such as Hg 2 Nb 2 O 7 ), mercury-doped tantalum oxide (such as Hg 2 Ta 2) O 7 ) at least one of.
- the metal chalcogenide layer of the above material When the silicon substrate is an n-type silicon substrate and the second carriers are electrons, or, when the silicon substrate is a p-type silicon substrate and the second carriers are electrons, the metal chalcogenide layer of the above material
- the first carrier collection end in 4 is conducive to the transmission and collection of the first carrier
- the second carrier transmission region in the metal oxychloride layer 4 of the above-mentioned material is conducive to the transmission of the second carrier.
- the metal chalcogenide The material of the layer is selected from at least one of the second materials; the second material is a metal chalcogenide compound with a work function greater than or equal to 3 eV.
- the second carrier transport region in the metal chalcogenide layer 4 of this material is conducive to the transport of the second carrier, and the first carrier collection end in the metal chalcogenide layer 4 of the material is conducive to the first carrier. Transmission and collection of streamers.
- the material of layer 4 is selected from: at least one of the above-mentioned second materials.
- the above-mentioned second material is selected from: zinc oxide, tin oxide, titanium oxide, copper oxide, thallium oxide, cadmium sulfide, molybdenum sulfide, zinc sulfide, molybdenum selenide, copper selenide, niobium-doped copper oxide (such as CuNb 3 O 8 ), at least one of cadmium germanium oxide (such as Ce 0.8 Gd 0.2 O 2 ), iridium zinc oxide (such as ZnIr 2 O 4 ), and calcium cobalt oxide (such as Ca 3 Co 4 O 9 ).
- the metal chalcogenide of the material When the silicon substrate is a p-type silicon substrate and the second carrier is a hole, or when the silicon substrate is an n-type silicon substrate and the second carrier is a hole, the metal chalcogenide of the material
- the second carrier transport region in the layer 4 is conducive to the transport of the second carrier, and the first carrier collection end in the metal chalcogenide layer 4 of this material is conducive to the transport and collection of the first carrier.
- the above-mentioned metal oxygen compound contains a doping element, and the doping element is selected from the group consisting of halogen elements, transition metal elements, alkali metal elements, rare earth elements, group III elements, group IV elements, and group V elements. At least one.
- the second carrier transport region in the metal chalcogenide layer 4 of the above material is conducive to the transport of the second carrier, and the first carrier collection end in the metal chalcogenide layer 4 of the material is conducive to the first carrier. Transmission and collection of streamers.
- the lateral conductivity of the metal chalcogenide layer 4 is less than or equal to 1.0 ⁇ 10 -3 S/cm, and the lateral resistance is greater than or equal to 1.0 ⁇ 10 3 ⁇ /cm, thereby having a good blocking effect on the lateral current.
- the lateral conductivity can be reduced by adjusting the material structure, such as crystallinity, crystal phase, or doping.
- the silicon substrate is a p-type silicon substrate and the second carrier is a majority carrier, or when the silicon substrate is an n-type silicon substrate and the second carrier is a minority carrier
- the area corresponding to the metal chalcogenide layer 4 and the first area forms a first carrier collecting end for collecting and transporting the first carrier electrons
- the area corresponding to the metal chalcogenide layer 4 and the second area forms a second carrier.
- the carrier transport area is used to transport the second carrier holes.
- the fixed positive charge density at the interface or inside of the metal oxygen compound layer 4 is greater than or equal to 10 11 cm -2 , and/or the acceptor defect density at the interface or inside of the metal oxygen compound layer 4 is greater than or equal to 10 11 cm ⁇ 2 , and/or, the limit charge density at the interface or inside of the metal oxygen group compound layer 4 is greater than or equal to 10 11 cm -2 .
- the second carrier transport region in the metal chalcogenide layer 4 of this material is conducive to the transport of the second carrier, and the first carrier collection end in the metal chalcogenide layer 4 of the material is conducive to the first carrier. Transmission and collection of streamers.
- the silicon substrate is an n-type silicon substrate and the second carrier is multiple carriers, or when the silicon substrate is a p-type silicon substrate and the second carrier is a minority carrier
- the area corresponding to the metal chalcogenide layer 4 and the first area forms a first carrier collection end for collecting and transporting the first carrier holes, and the area corresponding to the metal chalcogenide layer 4 and the second area forms a first carrier collecting end.
- the two-carrier transport area is used to transport the second carrier electrons.
- the fixed negative charge density at the interface or inside of the metal chalcogenide layer 4 is greater than or equal to 10 12 cm -2 , and/or the donor defect density at the interface or inside of the metal chalcogen compound layer 4 is greater than or equal to 10 12 cm -2 , And/or, the limit charge density at the interface or inside of the metal oxychloride layer 4 is greater than or equal to 10 12 cm -2 .
- the second carrier transport region in the metal chalcogenide layer 4 of this material is conducive to the transport of the second carrier, and the first carrier collection end in the metal chalcogenide layer 4 of the material is conducive to the first carrier. Transmission and collection of streamers.
- the average light transmittance of the metal chalcogenide layer 4 in the visible light band is greater than or equal to 70%, and further, the metal chalcogenide layer 4 shields visible light less, which is beneficial to improve the photoelectric conversion efficiency.
- the backlight surface of the silicon substrate 1 has a planar structure or a light-trapping structure
- the light-facing surface of the metal chalcogenide layer 4 is adapted to the backlight surface of the silicon substrate 1.
- the light-facing surface of the silicon substrate 1 has a planar structure or a light-trapping structure.
- the optical path can be increased and the photoelectric conversion efficiency can be improved.
- the light trapping structure can be suede, inverted pyramid, nano light trapping structure, etc.
- the light-facing surface of the silicon substrate may also be provided with at least one of a passivation layer, a front field effect layer, a front anti-reflection film layer, a scattering structure layer, and a light-concentrating structure layer.
- a passivation layer e.g., a front field effect layer
- a front anti-reflection film layer e.g., a scattering structure layer
- a light-concentrating structure layer e.g., the area outside the second electrode and the first electrode is provided with a back passivation film to achieve passivation, optical improvement, and the like.
- FIG. 3 shows a schematic structural diagram of a third type of back-contact solar cell in an embodiment of the present invention.
- 7 may be a front anti-reflection film layer
- 8 may be a back passivation film.
- FIG. 4 shows a schematic structural diagram of a fourth type of back-contact solar cell in an embodiment of the present invention.
- a second carrier selection layer 22 is also deposited on the backlight surface of the second region 2, and the second carrier selection layer 22 can further enhance the transmission capability of the second region 2 for second carriers.
- the projection of the second region 2 and the projection of the second carrier selective layer 22 at least partially overlap, thereby facilitating processing.
- the projection of the second region 2 and the projection of the second carrier selection layer 22 have a high degree of overlap.
- the second carrier selection layer 22 is located on the backlight surface or the light-facing surface of the metal chalcogenide layer 4.
- the second carrier selection layer 22 is located on the light facing surface of the metal chalcogenide layer 4.
- FIG. 5 shows a schematic structural diagram of a fifth type of back-contact solar cell in an embodiment of the present invention.
- the second carrier selection layer 22 is located on the backlight surface of the metal chalcogenide layer 4.
- the second carrier selection layer 22 has a one-layer or multi-layer structure, and the thickness d2 of the second carrier selection layer 22 is 1-500 nm, and more preferably, d2 It is 2-60nm. The thickness of the second carrier selection layer 22 facilitates the transport of second carriers.
- the projection area of the second carrier selection layer 22 on the backlight surface of the silicon substrate 1 accounts for 5% to 45% of the total area of the backlight surface of the silicon substrate 1. Under this area ratio, the transmission effect for the second carrier is good, and at the same time, the collection and transmission of the first carrier are not affected. It should be noted that the area of the second carrier selection layer 22 and the above-mentioned second region 2 are equal or unequal, which is not specifically limited in the embodiment of the present invention.
- the second carrier is selected from at least one of a crystalline silicon material with a work function greater than or equal to 3 eV, an amorphous silicon material with a function greater than or equal to 3 eV, or a second material.
- the second material is a metal oxygen group compound with a work function greater than or equal to 3 eV.
- the second carrier selection layer of the above-mentioned material has a good effect on the collection and transmission of the second carrier.
- the second carrier may be selected from: at least one of the first materials; the first material is an n-type metal oxygen compound with a work function greater than or equal to 5 eV, or a p-type metal oxygen compound with a work function less than or equal to 6 eV.
- the second carrier selection layer of the above-mentioned material has a good effect on the collection and transmission of the second carrier.
- a tunnel isolation layer is provided between the backlight surface of the silicon substrate and the metal oxychloride layer.
- the tunnel isolation layer may have a one-layer or multi-layer structure, and the thickness of the tunnel isolation layer is 0.1 nm-5 nm.
- the tunnel isolation layer has a good surface passivation effect and can reduce the recombination of current at the interface.
- FIG. 6 shows a schematic structural diagram of a sixth back contact solar cell in an embodiment of the present invention.
- a tunnel isolation layer 3 is provided between the backlight surface of the silicon substrate 1 and the metal chalcogenide layer 4, and the thickness d3 of the tunnel isolation layer 3 is 0.1 nm-5 nm.
- FIG. 7 shows a schematic structural diagram of a seventh type of back-contact solar cell in an embodiment of the present invention.
- the tunnel isolation layer 3 is located between the backlight surface of the silicon substrate 1 and the light-facing surface of the metal chalcogenide layer 4 and the light-facing surface of the second carrier selection layer 22.
- FIG. 8 shows a schematic structural diagram of an eighth back-contact solar cell in an embodiment of the present invention.
- the tunnel isolation layer 3 is located between the backlight surface of the silicon substrate 1 and the light-facing surface of the metal chalcogenide layer 4 and the light-facing surface of the second carrier selection layer 22.
- the material of the tunnel isolation layer is selected from at least one of silicon oxide, silicon nitride, silicon oxynitride, and silicon halide.
- the above-mentioned materials have a better chemical passivation effect on the surface of the tunnel isolation layer.
- the tunnel isolation layer can be formed separately, for example, using in-situ reaction processes such as wet thermal oxygen, dry thermal oxygen, chemical vapor deposition, physical vapor deposition, or other deposition processes. Or use a process integrated with the metal chalcogenide layer, such as the interfacial silicon oxide layer formed in the process of growing the metal chalcogen compound or in the post-annealing process, as the tunnel isolation layer.
- the tunnel isolation layer is made of a material that does not contain silicon, it may include a chemical transition layer between it and a silicon material.
- the material of the tunnel isolation layer can be a dielectric material, and the dielectric constant of the tunnel isolation layer is greater than 2.
- the dielectric material can be polarized into an insulating material.
- the material of the tunnel isolation layer can be a dielectric material, and the dielectric constant is greater than 2, which not only has a good surface chemical passivation effect, but also has a good field passivation effect. Can play a good blocking effect on lateral conduction.
- the breakdown voltage of the tunnel isolation layer is greater than or equal to 3MV/cm, the surface passivation effect is good, and the lateral conduction is well blocked.
- the material of the tunnel isolation layer is selected from silicon oxide (such as SiO x ), silicon nitride (such as SiN x ), silicon fluoride (such as SiF 4 ), silicon oxyfluoride (such as SiOF), silicon oxycarbide (Such as SiOC), aluminum oxide (such as Al 2 O 3 ), aluminum fluoride (such as AlF x ), and aluminum oxynitride (such as AlON).
- silicon oxide such as SiO x
- silicon nitride such as SiN x
- silicon fluoride such as SiF 4
- silicon oxyfluoride such as SiOF
- silicon oxycarbide Silicon oxide
- aluminum oxide such as Al 2 O 3
- aluminum fluoride such as AlF x
- aluminum oxynitride such as AlON
- a second transparent conductive film and/or a second work function adjusting layer are arranged between the second carrier collecting end and the second electrode. That is, a second transparent conductive film, or a second work function adjustment layer, or both may be provided between the second carrier collection terminal and the second electrode.
- the second transparent conductive film and/or the second work function adjusting layer are both located in the projection area of the second carrier collection end. It should be noted that, in the case of both, the second transparent conductive film may be located on the backlight surface or the light-facing surface of the second work function adjustment layer.
- the projection of the second electrode may be located within the projection of the second transparent conductive film and/or the second work function adjustment layer.
- a first transparent conductive film and/or a first work function adjusting layer are arranged between the first carrier collecting end and the first electrode. That is, a first transparent conductive film, or a first work function adjustment layer, or both may be provided between the first carrier collection terminal and the first electrode.
- the first transparent conductive film and/or the first work function adjusting layer are both located in the projection area of the first carrier collection end. It should be noted that, in the case of both, the first transparent conductive film may be located on the backlight surface or the light-facing surface of the first work function adjustment layer.
- the projection of the first electrode may be within the projection of the first transparent conductive film and/or the first work function adjustment layer.
- the above-mentioned first transparent conductive film and the second transparent conductive film can play a role in assisting carrier transmission, and transmit light, which can further improve the photoelectric conversion efficiency.
- the first work function adjustment layer and the second work function adjustment layer play a role in reducing contact resistance.
- FIG. 9 shows a schematic structural diagram of a ninth type of back-contact solar cell in an embodiment of the present invention.
- a second transparent conductive film 63 and a second work function adjusting layer 62 are provided between the second carrier collecting end and the second electrode 6.
- the second transparent conductive film 63 is located on the light facing surface of the second work function adjustment layer 62.
- a first transparent conductive film 52 and a first work function adjusting layer 53 are provided between the first carrier collecting end and the first electrode 5.
- the first transparent conductive film 52 is located on the backlight surface of the first work function adjustment layer 53.
- the thickness d4 of the second work function adjustment layer 62 and the thickness d5 of the first work function adjustment layer 53 are both 0.1-5 nm. This thickness range can reduce the contact resistance to a greater extent.
- the second transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material.
- the first transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material. That is, the first transparent conductive film and the second transparent conductive film can not only play the role of assisting carrier transport, but also transmit light, which can further improve the photoelectric conversion efficiency, and at the same time, can reduce the contact resistance or the longitudinal resistance.
- the second electrode is provided on the back light surface of the second transparent conductive film in the form of a grid line, which makes full use of The back side transmits light, which can further improve the photoelectric conversion efficiency.
- the first electrode is provided on the backlight surface of the first transparent conductive film in the form of a grid line to make full use of The back light is transparent, which can further improve the photoelectric conversion efficiency.
- the materials of the first transparent conductive film and the second transparent conductive film are independently selected from at least one of zinc oxide, aluminum-doped zinc oxide, tin oxide, indium-doped tin oxide, and indium-gallium-doped tin oxide.
- the first transparent conductive film and the second transparent conductive film of the above-mentioned materials have better carrier transport performance, which can further improve the photoelectric conversion efficiency.
- the work functions of the first work function adjustment layer and the second work function adjustment layer are both 1eV-5.5eV, which can further reduce the contact resistance.
- the material of the first work function adjustment layer, the material of the second work function adjustment layer, the first transparent conductive film, and/or the work function adjustment material in the second transparent conductive film may be independently selected from: alkali metals, At least one of a transition metal, an alkali metal halide, or a transition metal halide can further reduce the contact resistance.
- the material of the first work function adjustment layer, the material of the second work function adjustment layer, the first transparent conductive film and/or the work function adjustment material in the second transparent conductive film may be independently selected from: Ca, Mg, Ba, LiF x, KFx, MgF x, BaCl x and so on. Among them, for the x in the chemical formula here, those skilled in the art can choose an appropriate value according to the actual situation.
- the work function of the work function adjusting material in the first transparent conductive film and/or the second transparent conductive film is 1 eV-5.5 eV, which can further reduce the contact resistance.
- the second region 2 is doped to form a second carrier collection end.
- the second carrier collection terminal can realize the collection and transmission of the second carrier.
- the second region 2 and the second region in the silicon substrate 1 have the same doping type, but the doped elements may be the same or different. The embodiment of the present invention does not specifically limit this.
- the metal chalcogenide layer 4 as the first carrier collection terminal is only deposited on the first area of the backlight surface of the silicon substrate 1.
- the first carrier collection terminal can realize the collection and transmission of the first carrier.
- the second electrode 6 is correspondingly disposed on the second carrier collecting end, and the second electrode 6 is used for conducting the second carrier.
- the first electrode 5 is correspondingly arranged on the first carrier collecting end, and the first electrode 5 is used for conducting the first carrier. It should be noted that an electrical insulation gap needs to be reserved between the second electrode 6 and the first electrode 5, and the electrical insulation gap is not less than the breakdown distance under normal operating voltage.
- the second electrode 6 and the first electrode 5 can be fabricated by printing, deposition and other processes.
- the first electrode 5 and the second electrode 6 may be metal electrodes.
- the second region 2 of the backlight surface of the doped silicon substrate 1 realizes the collection and transmission of second carriers, and only the metal chalcogen compound deposited on the first region of the backlight surface of the silicon substrate 1
- Layer 4 realizes the collection and transmission of the first carrier, and different substances located in different positions realize the collection and transmission of different carriers respectively, without additional alignment and electrical isolation, simple process, and low cost.
- the area of the collection area improves the photoelectric conversion efficiency.
- the second carrier collection terminal is directly connected to the second electrode 6, and the first carrier collection terminal is directly connected to the first electrode 5.
- the carrier conduction energy levels of the two are close, and there is no contact barrier or only a small contact.
- the potential barrier reduces the longitudinal contact resistance.
- the second carrier collecting end, the first carrier collecting end and the metal oxychloride layer 4 will not cause a reverse pn junction due to mutual contact.
- the structure and performance of the metal chalcogenide layer 4 are highly adjustable, which can achieve lower lateral conductivity and stronger longitudinal conductivity, and has better thermal stability and a wide process selection window.
- FIG. 10 shows a schematic structural diagram of a tenth type of back-contact solar cell in an embodiment of the present invention.
- the back contact solar cell may also include a silicon substrate 1, and the backlight surface of the silicon substrate 1 is divided into a first area and a second area 2.
- the second region 2 of the silicon substrate 1 is doped to form a second carrier collection end.
- the entire silicon substrate 1 is deposited with a metal chalcogenide layer 4 on the backlight surface.
- the structure and performance are highly adjustable, which can achieve better performance. Low lateral conductivity and strong longitudinal conductivity, and good thermal stability, wide process selection window.
- the portion of the metal chalcogenide layer 4 corresponding to the first region of the backlight surface of the silicon substrate 1 forms a first carrier collection end, which can realize the first carrier collection end. Collection and transmission.
- the first electrode 5 is correspondingly arranged on the first carrier collecting end, and the longitudinal contact resistance is low.
- the portion of the metal chalcogenide layer 4 corresponding to the second area of the backlight surface of the silicon substrate 1 has an opening for electrically dividing the metal chalcogenide layer 4, and the opening can completely cut off the metal.
- the chalcogenide layer 4, or the metal chalcogenide layer 4 is partially cut off.
- the opening is filled with a second carrier selection layer 22, and the second carrier selection layer 22 is used to transmit second carriers.
- the second electrode 6 is correspondingly disposed on the second carrier selection layer 22. Furthermore, the second carrier is collected by the second electrode 6 via the second carrier selection layer 22.
- the opening area is approximately equal to the second area, and may be larger or smaller than the second area.
- the peripheral area of the second carrier selection layer 22 may be larger than the opening area. The openings can completely or partly break the metal chalcogenide layer 4.
- the second electrode 6 and the first electrode 5 can also refer to the aforementioned related descriptions. In order to avoid repetition, the details will not be repeated here.
- the second carrier is an electron.
- the second carrier collection end is the electron gathering area.
- the second carrier collection end is a doped structure, which can cause the n-type silicon substrate to bend downward in the energy band of the second region 2 to attract electrons to repel holes, and play a role of selective electron collection.
- the metal chalcogenide layer 4 forms a first carrier collection end, and the first carrier collection end is a hole accumulation region.
- the first carrier collection end appears as a hole-selective contact material, the conduction band energy level of the material is close to the valence band energy level of the n-type silicon substrate, and it can have negative interface charges or negative fixed defects, which can cause the interface at The energy band bends upwards to form an interface p-type layer, which acts to attract holes and repel electrons.
- the portion of the metal chalcogenide layer 4 corresponding to the first region forms a first carrier collection end, and the first carrier collection end is a hole accumulation region.
- the portion of the first carrier collection terminal corresponding to the first region in the metal chalcogenide layer is shown as a hole-selective contact material.
- the conduction band energy level of the material is close to the valence band energy level of the n-type silicon substrate. Possessing interface negative charges or negative fixed defects can cause the energy band at the interface to bend upwards to form an interface p-type layer, which plays the role of attracting holes and repelling electrons.
- the second carrier selection layer 22 due to the higher electron density in this part, the lower hole density, resulting in a lower energy level at the bottom of the conduction band of this part, and the conduction band of the second carrier collection end
- the bottom energy level is close, so it is convenient for the transmission of electrons.
- conduction band energy level and valence band energy level generally refer to the energy level of the material itself, that is, the energy level when the material exists alone, and do not refer to the actual energy level in the battery structure.
- the second carrier collection end adopts a local doping selective contact structure
- the metal chalcogenide layer 4 adopts a deposited selective contact structure.
- the minority carrier has the advantages of low recombination in part of the body region, fewer diffusion steps, and relatively simple process.
- the metal chalcogenide layer 4 has stronger selectivity and higher thermal stability. At the same time, the equipment requirements for the material deposition process are lower and the safety is higher.
- the part of the metal chalcogenide layer 4 corresponding to the first region is used to form the first carrier collection end. Compared with the amorphous silicon material, it has stronger selectivity and vertical transmission ability. The transmission capacity is stronger.
- At least the portion corresponding to the second region 2 of the continuous entire layer of the metal chalcogenide layer 4 has openings that electrically divide the metal chalcogenide layer 4, and the openings are filled with second carrier selection Layer 22, the second electrode 6 is arranged on the second carrier selection layer 22, which is equivalent to that the second carrier is exclusively transported through the second carrier selection layer 22, and the first carrier is mainly passed through the metal oxygen
- the unperforated part of the group compound layer 4 transmits, which realizes the transmission of different substances to different carriers, without additional alignment and electrical isolation.
- the process is simple, the area of the non-collection area is reduced, and the photoelectric conversion is improved. efficient.
- the first carrier and the second carrier are respectively transmitted through different substances, and the second carrier selection layer 22 is more convenient for the second carrier transmission, and its carrier conduction level is similar to that of the second carrier.
- Region 2 is closer, and the two contacts have no potential barrier or have a small potential barrier, which can reduce the longitudinal contact resistance.
- the second carrier collecting end, the first carrier collecting end and the metal oxychloride layer 4 will not cause a reverse pn junction due to mutual contact.
- the structure and performance of the metal chalcogenide layer 4 are highly adjustable, which can achieve lower lateral conductivity and stronger longitudinal conductivity, and has better thermal stability and a wide process selection window.
- the projection of the second region 2 and the projection of the second carrier selection layer 22 at least partially overlap, thereby facilitating processing.
- the second carrier selection layer 22 is located on the backlight surface or the light-facing surface of the metal chalcogenide layer 4.
- the projection of the second region 2 and the projection of the second carrier selection layer 22 have a high degree of overlap.
- the second carrier selection layer 22 is located on the back light surface of the metal chalcogenide layer 4.
- the metal chalcogenide layer 4 may have a one-layer or multi-layer structure, as shown in FIG. 1, and the thickness d1 of the metal chalcogenide layer 4 is referred to the foregoing relevant description.
- the projection area of the second carrier selection layer 22 on the backlight surface of the silicon substrate 1 accounts for 5% to 45% of the total area of the backlight surface of the silicon substrate 1. Under this area ratio, the transmission effect for the second carrier is good, and at the same time, the collection and transmission of the first carrier are not affected. It should be noted that the area of the second carrier selection layer 22 and the above-mentioned second region 2 are equal or different, which is not specifically limited.
- FIG. 11 shows a schematic structural diagram of an eleventh type of back-contact solar cell in an embodiment of the present invention.
- a tunnel isolation layer 3 is provided between the backlight surface of the silicon substrate 1 and the metal chalcogenide layer 4, and the thickness d2 of the tunnel isolation layer 3 is 0.1 nm-5 nm.
- the opening can completely or partially disconnect the tunnel isolation layer 3 under the condition that the metal chalcogenide layer 4 is completely disconnected.
- the materials of the tunnel isolation layer 3 refer to the aforementioned related descriptions.
- a third transparent conductive film and/or a third work function are arranged between the second carrier selection layer and the second electrode Adjustment layer; that is, a third transparent conductive film, or a third work function adjustment layer, or both may be provided between the second carrier selection layer and the second electrode.
- the third transparent conductive film and/or the third work function adjustment layer are both located in the projection portion of the second carrier selection layer. It should be noted that, in the case of both, the third transparent conductive film may be located on the backlight surface or the light-facing surface of the third work function adjustment layer.
- the third transparent conductive film can all play the role of assisting carrier transmission, and transmit light, which can further improve the photoelectric conversion efficiency.
- the third work function adjustment layer can all play a role in reducing contact resistance.
- FIG. 12 shows a schematic structural diagram of a twelfth type of back-contact solar cell in an embodiment of the present invention.
- FIG. 13 shows a schematic structural diagram of a thirteenth type of back-contact solar cell in an embodiment of the present invention.
- the difference between FIG. 12 and FIG. 13 is that, in FIG. 13, a tunnel isolation layer 3 is provided between the backlight surface of the silicon substrate 1 and the metal oxychloride layer 4.
- a first transparent conductive film 52 and a first work function adjusting layer 53 are provided between the first carrier collecting end and the first electrode 5.
- the first transparent conductive film 52 is located on the light facing surface of the first work function adjusting layer 53.
- a third transparent conductive film 65 and a third work function adjusting layer 64 are provided between the second carrier selection layer 22 and the second electrode 6.
- the third transparent conductive film 65 is located on the backlight surface of the third work function adjustment layer 64.
- the thickness d6 of the third work function adjustment layer 64 is 0.1-2 nm. This thickness range can reduce the contact resistance to a greater extent. This thickness range can reduce the contact resistance to a greater extent.
- the third transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material.
- the third transparent conductive film can not only play the role of assisting carrier transmission, but also transmit light, which can further improve the photoelectric conversion efficiency, and at the same time, can reduce the contact resistance or the longitudinal resistance.
- the second electrode is provided on the backlight surface of the third transparent conductive film in the form of a grid line to make full use of The backlight surface transmits light, which can further improve the photoelectric conversion efficiency.
- the material of the third transparent conductive film is selected from at least one of zinc oxide, aluminum-doped zinc oxide, tin oxide, indium-doped tin oxide, and indium-gallium-doped tin oxide.
- the third transparent conductive film of the above-mentioned material has better carrier transport performance and can further improve the photoelectric conversion efficiency.
- the work function of the third work function adjustment layer is 1eV-5.5eV, which can further reduce the contact resistance.
- the material of the third work function adjustment layer and/or the work function adjustment material in the third transparent conductive film may be independently selected from: alkali metals, transition metals, alkali metal halides or transition metal halides At least one of them can further reduce the contact resistance.
- the material of the third work function adjustment layer, and / or, a third transparent conductive thin film in regulating work function material may be independently selected from: Ca, Mg, Ba, LiF x, KFx, MgF x, BaCl x Wait. Among them, for x in the chemical formula, those skilled in the art can choose an appropriate value according to the actual situation.
- the work function of the work function adjusting material in the third transparent conductive film is 1 eV-5.5 eV, which can further reduce the contact resistance.
- the light-facing surface of the silicon substrate may also be provided with at least one of a passivation layer, a front field effect layer, a front anti-reflection film layer, a scattering structure layer, and a light-concentrating structure layer.
- a passivation layer a front field effect layer
- a front anti-reflection film layer a scattering structure layer
- a light-concentrating structure layer a light-concentrating structure layer.
- the second electrode is correspondingly disposed on the second carrier selection layer, in the backlight surface of the metal chalcogen compound layer and the backlight surface of the second carrier selection layer, the second electrode, the second electrode
- the part other than the two electrodes is provided with an anti-reflection film on the backlight surface to achieve passivation and optical improvement.
- 7 may be a front anti-reflection film layer
- 8 may be a backlight surface anti-reflection film.
- the second carrier selection layer has a one-layer or multi-layer structure
- the thickness of the second carrier selection layer has nothing to do with the thickness of the metal chalcogenide layer
- the thickness of the second carrier selection layer 22 may be slightly Higher than the height of the opening.
- the thickness of the second carrier selection layer is 1-500 nm, and more preferably, the thickness of the second carrier selection layer is 2-60 nm.
- the thickness of the second carrier selection layer 22 facilitates the transport of the first carriers.
- the second carrier is selected from at least one of a crystalline silicon material with a work function greater than or equal to 3 eV, an amorphous silicon material with a function greater than or equal to 3 eV, or a second material.
- the second material is a metal chalcogenide layer with a work function greater than or equal to 3 eV.
- the second carrier selection layer of the above-mentioned material has a good effect on the collection and transmission of the second carrier.
- the second carrier may be selected from: at least one of the first materials; the first material is an n-type metal oxychloride layer with a work function greater than or equal to 5 eV, or a p-type metal oxychloride layer with a work function less than or equal to 6 eV Floor.
- the second carrier selection layer of the above-mentioned material has a good effect on the collection and transmission of the second carrier.
- FIG. 14 shows a schematic structural diagram of a fourteenth type of back-contact solar cell in an embodiment of the present invention.
- the second region 2 is doped to form a second carrier collection end.
- the second carrier collection terminal can realize the collection and transmission of the second carrier.
- the second region 2 and the second region in the silicon substrate 1 have the same doping type, but the doped elements may be the same or different.
- the embodiment of the present invention does not specifically limit this.
- the metal chalcogenide layer 4 is deposited on the backlight surface of the entire silicon substrate 1.
- the structure and performance are highly adjustable, which can achieve lower The horizontal conductivity and the strong longitudinal conductivity, and the thermal stability is better, the process selection window is wide.
- the metal chalcogenide layer 4 has a blocking structure 9 that electrically divides the metal chalcogenide layer 4 into a second carrier transport region and a first carrier collection end.
- the number of blocking structures 9 is not specifically limited.
- the first carrier collecting end is located in a part corresponding to the first area of the backlight surface of the silicon substrate 1, and the first carrier collecting end can realize the collection and transmission of the first carriers.
- the second carrier transport area is located in a part corresponding to the second area of the backlight surface of the silicon substrate 1, and the second carrier transport area can realize the transport of the second carriers.
- a first electrode 5 is correspondingly provided at the first carrier collection end, and the first electrode 5 is used to conduct the first carriers.
- a second electrode 6 is correspondingly provided in the second carrier transport region, and the second electrode 6 is used for conducting the second carrier. It should be noted that an electrical insulation gap needs to be reserved between the first electrode 5 and the second electrode 6, and the electrical insulation gap gap is not less than the breakdown distance under normal operating voltage.
- the first electrode 5 and the second electrode 6 can be fabricated by printing, deposition and other processes.
- the second electrode 6 and the first electrode 5 may be metal electrodes.
- the second carrier is an electron.
- the second carrier collection end is the electron collection area.
- the second carrier collection end is a doped structure, which can cause the n-type silicon substrate to bend downward in the energy band of the second region 2 to attract electrons to repel holes, and play a role of selective electron collection.
- the first carrier collection end is the hole collection area.
- the first carrier collection end appears as a hole-selective contact material, the conduction band energy level of the material is close to the valence band energy level of the n-type silicon substrate, and it can have negative interface charges or negative fixed defects, which can cause the interface at The energy band bends upwards to form an interface p-type layer, which acts to attract holes and repel electrons.
- conduction band energy level and valence band energy level generally refer to the energy level of the material itself, that is, the energy level when the material exists alone, and do not refer to the actual energy level in the battery structure.
- the silicon substrate 1 is an n-type silicon substrate
- the first carrier is a hole
- the second carrier is an electron.
- the two parts electrically divided by the blocking structure 9 can respectively realize the collection of holes and the transmission of electrons.
- the material can be adjusted to lower the crystallinity, crystal phase and doping elements. Due to the electrical division of the blocking structure 9 between the holes in the first carrier collection terminal and the electrons in the second carrier transport region, different types of carriers are collected and transported longitudinally into the corresponding electrode. There will be no leakage or short circuit due to mutual communication due to lateral transmission, so different types of carrier collection terminals do not need to be electrically isolated, and no reverse pn junction will be generated due to mutual contact.
- the second carrier collection end adopts a local doping selective contact structure
- the metal chalcogenide layer 4 adopts a deposited selective contact structure.
- the metal chalcogenide layer 4 has a body region recombination structure.
- the metal chalcogenide layer 4 has stronger selectivity and higher thermal stability.
- the material deposition process equipment requirements Lower, higher security.
- the metal oxygen group compound layer 4 can fully cover the back of the battery, which further simplifies the process flow.
- the portion of the metal chalcogenide layer 4 corresponding to the first region is used to form the first carrier collection end.
- the amorphous silicon material it has stronger selectivity and vertical transmission ability. Stronger carrier collection and vertical transmission capabilities, lower contact resistance can be achieved; at the same time, at the second carrier collection end, in conjunction with the local doped structure, the second carrier transmission is transmitted through the edge of the oxide material. , Does not involve a cross-level tunneling mechanism, the second carrier transport is less obstructed, and lower contact resistance can be achieved.
- the blocking structure is a slot; and/or, the blocking structure is an insulator.
- the blocking structure of the above form not only has a good blocking effect, but also has a simple implementation process.
- the insulator can be provided by ion implantation.
- the thickness of the blocking structure is greater than or equal to the thickness of the metal chalcogenide layer, so that the electrical blocking effect is good.
- the thickness of the blocking structure 9 is equal to the thickness of the metal chalcogenide layer 4.
- the blocking structure protrudes toward the backlight surface of the metal chalcogenide layer.
- the thickness of the blocking structure 9 is greater than the thickness of the metal chalcogenide layer 4, and the blocking structure 9 protrudes toward the backlight surface of the metal chalcogenide layer 4.
- FIG. 16 shows a schematic structural diagram of a sixteenth type of back-contact solar cell in an embodiment of the present invention.
- 7 can be a front anti-reflection film layer
- 8 can be a back anti-reflection film.
- FIG. 17 shows a schematic structural diagram of a seventeenth type of back contact solar cell in an embodiment of the present invention.
- a tunnel isolation layer 3 is provided between the backlight surface of the silicon substrate 1 and the metal oxychloride layer 4, and the thickness of the tunnel isolation layer 3 is 0.1 nm-5 nm.
- the materials of the tunnel isolation layer 3 refer to the aforementioned related descriptions.
- a fourth transparent conductive film and/or a fourth work function adjustment layer are arranged between the second carrier transport region and the second electrode. That is, a fourth transparent conductive film, or a fourth work function adjustment layer, or both may be provided between the second carrier transport region and the second electrode.
- the fourth transparent conductive film and/or the fourth work function adjusting layer are both located in the projection area of the second carrier transport area. It should be noted that, in the case of both, the fourth transparent conductive film may be located on the backlight surface or the light-facing surface of the fourth work function adjustment layer.
- the projection of the second electrode may be located within the projection of the fourth transparent conductive film and/or the fourth work function adjustment layer.
- the fourth transparent conductive film can play a role in assisting carrier transmission, and is light-transmissive, which can further improve the photoelectric conversion efficiency.
- the fourth work function adjustment layer plays a role in reducing contact resistance.
- FIG. 18 shows a schematic structural diagram of an eighteenth type of back-contact solar cell in an embodiment of the present invention.
- a fourth transparent conductive film 67 and a fourth work function adjusting layer 66 are provided between the second carrier transport region and the second electrode 6.
- the fourth transparent conductive film 67 is located on the backlight surface of the fourth work function adjustment layer 66.
- a first transparent conductive film 52 and a first work function adjusting layer 53 are provided between the first carrier collecting end and the first electrode 5.
- the first transparent conductive film 52 is located on the backlight surface of the first work function adjustment layer 53.
- the thickness d7 of the fourth transparent conductive film 67 is 0.1-2 nm, and the thickness range can reduce the contact resistance to a greater extent.
- the fourth transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material.
- the first transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material. That is, the first transparent conductive film and the fourth transparent conductive film can not only play the role of assisting carrier transport, but also transmit light, which can further improve the photoelectric conversion efficiency, and at the same time, can reduce the contact resistance or the longitudinal resistance.
- the second electrode is provided on the back light surface of the fourth transparent conductive film in the form of a grid line, which makes full use of The back side transmits light, which can further improve the photoelectric conversion efficiency.
- the first electrode is provided on the backlight surface of the first transparent conductive film in the form of a grid line to make full use of The back side transmits light, which can further improve the photoelectric conversion efficiency.
- the material of the fourth transparent conductive film is selected from at least one of zinc oxide, aluminum-doped zinc oxide, tin oxide, indium-doped tin oxide, and indium-gallium-doped tin oxide.
- the fourth transparent conductive film of the above-mentioned material has better carrier transport performance and can further improve the photoelectric conversion efficiency.
- the work function of the fourth work function adjustment layer is 1eV-5.5eV, which can further reduce the contact resistance.
- the material of the fourth work function adjustment layer and the work function adjustment material in the fourth transparent conductive film can be independently selected from: at least one of alkali metals, transition metals, alkali metal halides or transition metal halides , Can further reduce the contact resistance.
- the fourth work function regulating material layer, the fourth transparent conductive thin film in regulating work function material may be independently selected from: Ca, Mg, Ba, LiF x, KFx, MgF x, BaCl x and the like. Among them, for x in the chemical formula, those skilled in the art can choose an appropriate value according to the actual situation.
- the material of the fourth work function adjustment layer and/or the work function of the work function adjustment material in the fourth transparent conductive film is 1 eV-5.5 eV, which can further reduce the contact resistance.
- FIG. 19 shows a schematic structural diagram of a nineteenth type of back-contact solar cell in an embodiment of the present invention.
- a second carrier selective collection layer 23 is deposited on the second area of the backlight surface of the silicon substrate 1.
- the second carrier selective collection layer 23 can realize the collection and transmission of the second carrier.
- a metal chalcogenide layer 4 is deposited on the common backlight surface of the silicon substrate 1 and the second carrier selective collection layer 23.
- the metal chalcogenide layer 4 is highly adjustable in structure and performance, can achieve lower lateral conductivity and stronger longitudinal conductivity, and has better thermal stability and a wide process selection window.
- the portion of the metal chalcogenide layer 4 corresponding to the second carrier selective collection layer 23 forms a second carrier transport region, which can realize the transport of the second carrier.
- the portion of the metal chalcogenide layer 4 corresponding to the first region of the silicon substrate 1 forms a first carrier collection end, which can realize the collection and transmission of the first carrier.
- the projection area of the second carrier selective collection layer 23 on the backlight surface of the silicon substrate 1 occupies 5% to 45% of the total area of the backlight surface of the silicon substrate. Under this area ratio, the second carrier The collection and transmission of current carriers are effective without affecting the collection and transmission of the first carriers.
- the top view of the second carrier selective collection layer 23 may be a dotted or linear pattern, such as a circle or an ellipse. Linear patterns such as rectangles or polygons.
- the top view of the second carrier selective collection layer 23 is a dotted or linear pattern, and the deposition process for the second carrier selective collection layer 23 is simple.
- a first electrode 5 is correspondingly provided on the backlight surface of the first carrier collection end in the metal chalcogenide layer 4, and the first electrode 5 is used for conducting the first carrier.
- a second electrode 6 is correspondingly arranged on the second carrier transport region, and the second electrode 6 is used to conduct the first carriers. It should be noted that an electrical insulation gap needs to be reserved between the first electrode 5 and the second electrode 6, and the electrical insulation gap gap is not less than the breakdown distance under normal operating voltage.
- the first electrode 5 and the second electrode 6 can be fabricated by printing, deposition and other processes.
- the second electrode 6 and the first electrode 5 may be metal electrodes.
- the silicon substrate 1 is an n-type silicon substrate
- the second carrier is an electron
- the first carrier is a hole.
- the second carrier selective collection layer 23 is the electron collection terminal.
- the second carrier selective collection layer is a deposition structure, and its conduction band energy level is close to that of the silicon material, which can cause the n-type silicon substrate to bend downward in the energy band of the second carrier selective collection layer 23. Attracting electrons and repelling holes, plays the role of selective electron collection.
- the portion of the metal chalcogenide layer 4 corresponding to the first region of the silicon substrate 1 forms a first carrier collecting end, and the first carrier collecting end is the hole collecting end.
- the first carrier collection end appears as a hole-selective contact material, the conduction band energy level of the material is close to the valence band energy level of the n-type silicon substrate, and it can have negative interface charges or negative fixed defects, which can cause the interface at The energy band bends upwards to form an interface p-type layer, which acts to attract holes and repel electrons.
- conduction band energy level and valence band energy level in the present invention generally refer to the energy level of the material itself, that is, the energy level when the material exists alone, and does not refer to the actual energy level in the battery structure.
- the conduction band bottom energy level of the second carrier selective collection layer 23 is located between the conduction band energy level of the silicon substrate 1 and the conduction band energy level of the metal chalcogenide layer 4 Therefore, the electrons in the silicon substrate 1 can directly enter the second carrier selective collection layer 23 and then enter the second carrier transport region corresponding to the second carrier selective collection layer 23 in the metal chalcogenide layer 4 , So as to realize the transmission of electrons.
- the metal chalcogenide layer 4 can simultaneously realize the collection of holes and the transport of electrons. At the same time, in the metal chalcogenide layer 4, at the interface between the second carrier transport region and the first carrier collection end, There are high-resistance defects, and insulation can be achieved. After different types of carriers are collected, they are transmitted longitudinally into the corresponding electrodes without leakage or short circuit. Therefore, different types of carrier collection terminals do not require additional electrical isolation and will not Reverse pn junctions are created due to mutual contact.
- the second carrier selective collection layer adopts a deposition selective contact structure
- the metal chalcogenide layer 4 also adopts a deposited selective contact structure.
- the second carrier selective collection layer and the metal oxygen group compound layer are formed by deposition methods without high temperature.
- the metal chalcogenide layer 4 has stronger selectivity and higher thermal stability. At the same time, the material deposition process equipment requirements are lower and the safety is higher.
- the metal oxygen group compound layer 4 can fully cover the back of the battery, which further simplifies the process flow.
- the part of the metal chalcogenide layer 4 corresponding to the first region of the silicon substrate 1 is used to form the first carrier collection end, which has stronger selectivity and vertical transport ability than amorphous silicon materials. The collection and vertical transmission capabilities are stronger.
- FIG. 20 shows a schematic structural diagram of a twentieth type of back-contact solar cell in an embodiment of the present invention.
- a blocking structure 9 is provided between the second carrier transport region and the first carrier collection end.
- the blocking structure 9 electrically divides the second carrier transport region and the first carrier collection end of the metal chalcogenide layer, thereby improving the conductivity of the metal chalcogenide in the undivided area, which can be very Reduce the longitudinal series resistance to a large extent.
- the second carrier transport area and the first carrier collection terminal are electrically divided. After different types of carriers are collected, they will be transported longitudinally into the corresponding electrode, and will not be connected to each other due to lateral transport and cause leakage. Or short-circuit, so there is no need for additional alignment and electrical isolation, the process is simple, the recombination is reduced, and the photoelectric conversion efficiency is improved.
- the blocking structure is a slot; and/or, the blocking structure is a high-resistance body, and the resistivity of the high-resistance body is more than 100 times the resistivity of the metal chalcogenide layer 4.
- the insulation effect is good, and on the other hand, the realization process is simple.
- the light-facing surface of the silicon substrate may also be provided with at least one of a passivation layer, a front field effect layer, a front anti-reflection film layer, a scattering structure layer, and a light-concentrating structure layer. And/or, in the backlight surface of both the metal chalcogenide layer and the second carrier transport region, the area outside the first electrode and the second electrode is provided with a back anti-reflection film to achieve passivation and optical improvement Wait.
- FIG. 21 shows a schematic structural diagram of a twenty-first type of back-contact solar cell in an embodiment of the present invention.
- 7 may be a front anti-reflection film layer
- 8 may be a back anti-reflection film.
- the thickness d8 of the second carrier selective collection layer 23 is 1-500 nm, and more preferably, d8 is 2-60 nm.
- the second carrier selective collection layer 23 of this thickness facilitates the collection and transmission of second carriers.
- the second carrier when the silicon substrate is an n-type silicon substrate and the second carrier is multiple carriers, or when the silicon substrate is a p-type silicon substrate and the second carrier is a minority carrier, the second carrier
- the material of the collection layer is selected from at least one of a crystalline silicon material with a work function greater than or equal to 3 eV, an amorphous silicon material with a function greater than or equal to 3 eV, or a second material.
- the second material is a metal oxygen group compound with a work function greater than or equal to 3 eV.
- the second carrier selective collection layer of the above-mentioned material has a good effect on the collection and transmission of the second carrier.
- the second carrier may be selected from: at least one of the first materials; the first material is an n-type metal oxygen compound with a work function greater than or equal to 5 eV, or a p-type metal oxygen compound with a work function less than or equal to 6 eV .
- the second carrier selective collection layer of the above-mentioned material has a good effect on the collection and transmission of the second carrier.
- a tunnel isolation layer is provided between the backlight surface of the silicon substrate and the common light-facing surface of the metal chalcogenide layer and the second carrier selective collection layer.
- the tunnel isolation layer For the material, thickness, function, etc. of the tunnel isolation layer, reference may be made to the foregoing description.
- FIG. 22 shows a schematic structural diagram of a twenty-second type of back contact solar cell in an embodiment of the present invention.
- a tunnel isolation layer 3 is provided between the backlight surface of the silicon substrate 1 and the common light-facing surface of the metal chalcogenide layer 4 and the second carrier selective collection layer 23.
- a fifth transparent conductive film and/or a fifth work function adjusting layer are arranged between the second electrode and the second carrier selective collection layer. That is, a fifth transparent conductive film, or a fifth work function adjusting layer, or both may be provided between the second electrode and the second carrier selective collection layer.
- the fifth transparent conductive film and/or the fifth work function adjusting layer are both located in the projection area of the second carrier selective collection layer. It should be noted that, in the case of both, the fifth transparent conductive film may be located on the backlight surface or the light-facing surface of the fifth work function adjustment layer.
- the projection of the second electrode may be within the projection of the fifth transparent conductive film and/or the fifth work function adjustment layer.
- a first transparent conductive film and/or a first work function adjusting layer are arranged between the first carrier collecting end and the first electrode. That is, a first transparent conductive film, or a first work function adjustment layer, or both may be provided between the first carrier collection terminal and the first electrode.
- the first transparent conductive film and/or the first work function adjusting layer are both located in the projection area of the first carrier collecting end and the first electrode. It should be noted that, in the case of both, the first transparent conductive film may be located on the backlight surface or the light-facing surface of the first work function adjustment layer.
- the projection of the first electrode may be within the projection of the first transparent conductive film and/or the first work function adjustment layer.
- the above-mentioned fifth transparent conductive film and the first transparent conductive film can play a role in assisting carrier transport, and transmit light, which can further improve the photoelectric conversion efficiency.
- the first work function adjustment layer and the fifth work function adjustment layer play a role in reducing contact resistance.
- FIG. 23 shows a schematic diagram of the structure of the twenty-third type of back-contact solar cells in the embodiment of the present invention.
- a fifth transparent conductive film 69 and a fifth work function adjusting layer 68 are provided between the second carrier selective collection layer 23 and the second electrode 6.
- the fifth transparent conductive film 69 is located on the light facing surface of the fifth work function adjusting layer 68.
- a first transparent conductive film 52 and a first work function adjusting layer 53 are provided between the first carrier collecting end and the first electrode 5.
- the first transparent conductive film 52 is located on the backlight surface of the first work function adjustment layer 53.
- the thickness d9 of the fifth work function adjusting layer 68 is 0.1-2 nm. This thickness range can reduce the contact resistance to a greater extent.
- the fifth transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material.
- the first transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material. That is, the fifth transparent conductive film and the first transparent conductive film can not only play the role of assisting carrier transmission, but also transmit light, which can further improve the photoelectric conversion efficiency, and at the same time, can reduce the contact resistance or the longitudinal resistance.
- the second electrode is provided on the backlight surface of the fifth transparent conductive film in the form of a grid line. Using the back light to transmit light can further improve the photoelectric conversion efficiency.
- the first electrode is provided on the backlight surface of the first transparent conductive film in the form of a grid line to make full use of The back side transmits light, which can further improve the photoelectric conversion efficiency.
- the material of the fifth transparent conductive film is selected from at least one of zinc oxide, aluminum-doped zinc oxide, tin oxide, indium-doped tin oxide, and indium-gallium-doped tin oxide.
- the fifth transparent conductive film of the above-mentioned material has better carrier transport performance and can further improve the photoelectric conversion efficiency.
- the work function of the fifth work function adjustment layer is 1eV-5.5eV, which can further reduce the contact resistance.
- the work function adjusting material in the fifth work function adjusting layer and the fifth transparent conductive film may be independently selected from at least one of alkali metals, transition metals, alkali metal halides, or transition metal halides, and Further reduce the contact resistance.
- the fifth work function adjustment layer, a fifth transparent conductive film in regulating work function material may be independently selected from: Ca, Mg, Ba, LiF x, KFx, MgF x, BaCl x and the like. Among them, for x in the chemical formula, those skilled in the art can choose an appropriate value according to the actual situation.
- the work function of the work function adjusting material in the fifth transparent conductive film is 1 eV-5.5 eV, which can further reduce the contact resistance.
- the embodiment of the present invention also provides a method for producing a back contact solar cell.
- the method includes the following steps:
- Step S1 providing a silicon substrate; the backlight surface of the silicon substrate is divided into a first area and a second area.
- Step S2 at least depositing a metal chalcogenide layer on the first area of the silicon substrate; the area corresponding to the metal chalcogenide layer and the first area forms a first carrier collecting end.
- step S3 a first electrode is correspondingly arranged on the first carrier collection end; the area of the metal chalcogenide layer corresponding to the second area forms a second carrier transport area.
- Step S4 correspondingly disposing a second electrode in an area corresponding to the second area.
- the method may further include: doping the silicon substrate in the second region to form a second carrier collection end.
- Step S2 may include: depositing a metal chalcogenide layer on the entire backlight surface of the silicon substrate; and a region of the metal chalcogenide layer corresponding to the second region forms a second carrier transport region.
- Step S4 includes: correspondingly disposing the second electrode on the second carrier transport region.
- the silicon substrate the second carrier collection terminal, the first carrier collection terminal, the second carrier transport region, the second electrode, and the first electrode in each step of the method, please refer to the aforementioned related records, and can To achieve the same or similar beneficial effects, in order to avoid repetition, details are not repeated here.
- the embodiment of the present invention also provides a back contact battery assembly, including any of the aforementioned back contact solar cells.
- the silicon substrate, the second carrier collection terminal, the first carrier collection terminal, the second carrier transport area, the second electrode, and the first electrode in the component can be specifically referred to the aforementioned related records, and can achieve the same or Similar beneficial effects are not repeated here in order to avoid repetition.
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims (53)
- 一种背接触太阳电池,其特征在于,包括:硅基底,所述硅基底的背光面分为第一区域和第二区域;金属氧族化合物层,至少沉积于所述硅基底的所述第一区域;所述金属氧族化合物层与所述第一区域对应的区域形成第一载流子收集端;第一电极,对应设置在所述第一载流子收集端上;第二电极,对应设置在所述第二区域对应的区域内。
- 根据权利要求1所述的背接触太阳电池,其特征在于,所述第二区域的硅基底经掺杂形成第二载流子收集端;所述金属氧族化合物层,沉积于整个所述硅基底的背光面上;所述金属氧族化合物层与所述第二区域对应的区域形成第二载流子传输区;所述第二电极,对应设置在所述第二载流子传输区上。
- 根据权利要求1所述的背接触太阳电池,其特征在于,所述第二区域的硅基底经掺杂形成第二载流子收集端;所述金属氧族化合物层只沉积在所述第一区域上;所述第二电极对应设置在所述第二载流子收集端上;或,所述金属氧族化合物层,沉积于整个所述硅基底的背光面上;所述金属氧族化合物层中至少与所述第二区域对应的部分具有电学分割所述金属氧族化合物层的开孔;所述金属氧族化合物层第二区域对应的部分上形成有第二载流子选择层,所述第二载流子选择层填充在所述开孔中;所述第二电极对应设置在所述第二载流子选择层上。
- 根据权利要求1所述的背接触太阳电池,其特征在于,所述第二区域的硅基底经掺杂形成第二载流子收集端;所述金属氧族化合物层,沉积于整个所述硅基底的背光面上;在所述金属氧族化合物层中,具有将所述金属氧族化合物层电学分割为第二载流子传输区和所述第一载流子收集端的阻断结构;其中,所述第二载流子传输区对应所述第二区域;所述第二电极,对应设置在所述第二载流子传输区上。
- 根据权利要求1所述的背接触太阳电池,其特征在于,还包括:第二载流子选择收集层;所述第二载流子选择收集层沉积于所述硅基底的所述第二区域上;所述金属氧族化合物层沉积于所述第一区域上以及所述第二载流子选择收集层的背光面上;所述金属氧族化合物层中对应所述第二载流子选择收集层的部分形成第二载流子传输区;所述第二电极,对应设置在所述第二载流子传输区上。
- 根据权利要求2-5中任一所述的背接触太阳电池,其特征在于,在所述硅基底为n型硅基底且第二载流子为多子的情况下,或在所述硅基底为p型硅基底且所述第二载流子为少子的情况下,所述金属氧族化合物层的材料选自第一材料中的至少一种;所述第一材料为功函数大于等于5eV的n型金属氧族化合物、或功函数小于等于6eV的p型金属氧族化合物;在所述硅基底为p型硅基底且所述第二载流子为多子的情况下,或在所述硅基底为n型硅基底且所述第二载流子为少子的情况下,所述金属氧族化合物层的材料选自第二材料中的至少一种;所述第二材料为功函数大于或等于3eV的金属氧族化合物。
- 根据权利要求2-4中任一所述的背接触太阳电池,其特征在于,所述第二载流子收集端的掺杂浓度大于等于10 15cm -3,且大于所述第一区域的硅基底的掺杂浓度;所述第二载流子收集端在所述硅基底的背光面的投影的面积,占所述硅基底的背光面的总面积的5%至45%。
- 根据权利要求2-5中任一所述的背接触太阳电池,其特征在于,所述第二区域的背光面沉积有第二载流子选择层;所述第二载流子选择层位于所述金属氧族化合物层的背光面或向光面。
- 根据权利要求8所述的背接触太阳电池,其特征在于,所述第二载流子选择层的厚度为1-500nm;所述第二载流子选择层在所述硅基底的背光面的投影的面积,占所述硅基底的背光面的总面积的5%至45%。
- 根据权利要求8所述的背接触太阳电池,其特征在于,在所述硅基底为n型硅基底且第二载流子为多子的情况下,或在所述硅基底为p型硅基底且所述第二载流子为少子的情况下,所述第二载流子选择层的材料选自功函数大于等于3eV的晶硅材料、功函数大于等于3eV的非晶硅材料、或第二材料中的至少一种;所述第二材料为功函数大于或等于3eV的金属氧族化合物;在所述硅基底为p型硅基底且所述第二载流子为多子的情况下,或在所述硅基底为n 型硅基底且所述第二载流子为少子的情况下,所述第二载流子选择层的材料选自:第一材料中的至少一种;所述第一材料为功函数大于等于5eV的n型金属氧族化合物、或功函数小于等于6eV的p型金属氧族化合物。
- 根据权利要求6或10所述的背接触太阳电池,其特征在于,所述金属氧族化合物中含有掺杂元素,掺杂元素选自卤族元素、过渡金属元素、碱金属元素、III族元素、IV族元素、V族元素中的至少一种。
- 根据权利要求6或10所述的背接触太阳电池,其特征在于,所述第二材料选自:氧化锌、氧化锡、氧化钛、氧化铜、氧化铊、硫化镉、硫化钼、硫化锌、硒化钼、硒化铜、掺铌氧化铜、氧化镉锗、氧化铱锌、氧化钴钙中的至少一种;所述第一材料选自:氧化钼、氧化钨、氧化钒、氧化铌、氧化镍、掺汞氧化铌、掺汞氧化钽中的至少一种。
- 根据权利要求2所述的背接触太阳电池,其特征在于,所述金属氧族化合物层的横向传导能力小于等于1.0×10 -3S/cm。
- 根据权利要求2所述的背接触太阳电池,其特征在于,在所述硅基底为p型硅基底且第二载流子为多子的情况下,或在所述硅基底为n型硅基底且所述第二载流子为少子的情况下,所述金属氧族化合物层的固定正电荷密度大于或等于10 11cm -2;和/或,所述金属氧族化合物层的受主缺陷密度大于或等于10 11cm -2;和/或,所述金属氧族化合物层的限位电荷密度大于或等于10 11cm -2;在所述硅基底为n型硅基底且所述第二载流子为多子的情况下,或在所述硅基底为p型硅基底且所述第二载流子为少子的情况下,所述金属氧族化合物层的固定负电荷密度大于或等于10 12m -2;和/或,所述金属氧族化合物层的施主缺陷密度大于或等于10 12cm -2;和/或,所述金属氧族化合物层的限位电荷密度大于或等于10 12cm -2。
- 根据权利要求2-5中任一所述的背接触太阳电池,其特征在于,所述金属氧族化合物层在可见光波段的平均透光率大于等于70%;所述金属氧族化合物层的厚度为1-600nm。
- 根据权利要求2-5中任一所述的背接触太阳电池,其特征在于,所述硅基底的背光面和所述金属氧族化合物层之间设置有隧穿隔离层;所述隧穿隔离层的厚度为0.1nm-5nm,所述隧穿隔离层为一层或多层结构。
- 根据权利要求16所述的背接触太阳电池,其特征在于,所述隧穿隔离层的材料选自:硅的氧化物、硅的氮化物、硅的氮氧化物、硅的卤化物中的至少一种。
- 根据权利要求16所述的背接触太阳电池,其特征在于,所述隧穿隔离层的材料为电介质材料,所述隧穿隔离层的材料的介电常数大于2;所述隧穿隔离层的击穿电压大于或等于3MV/cm。
- 根据权利要求16所述的背接触太阳电池,其特征在于,所述隧穿隔离层的材料选自:氧化硅、氮化硅、氟化硅、氟氧化硅、碳氧化硅、氧化铝、氟化铝、氮氧化铝中的至少一种。
- 根据权利要求2-4中任一所述的背接触太阳电池,其特征在于,所述第二载流子收集端和所述第二电极之间设置有第二透明导电薄膜和/或第二功函数调节层;所述第二透明导电薄膜和/或第二功函数调节层均位于所述第二载流子收集端的投影区域内;和/或,所述第一载流子收集端和所述第一电极之间设置有第一透明导电薄膜和/或第一功函数调节层;所述第一透明导电薄膜和/或第一功函数调节层均位于所述第一载流子收集端的投影区域内。
- 根据权利要求20所述的背接触太阳电池,其特征在于,所述第一功函数调节层、所述第二功函数调节层的厚度均为0.1-5nm;所述第一功函数调节层、所述第二功函数调节层的功函数均为1eV-5.5eV;所述第一透明导电薄膜由透明导电材料和功函数调节材料化合或混合形成;和/或,所述第二透明导电薄膜由透明导电材料和功函数调节材料化合或混合形成。
- 根据权利要求20所述的背接触太阳电池,其特征在于,在所述第二载流子收集端和所述第二电极之间设置有所述第二透明导电薄膜的情况下,所述第二电极以栅线的形式设置在所述第二透明导电薄膜的背光面;和/或,在所述第一载流子收集端和所述第一电极之间设置有所述第一透明导电薄膜的情况下,所述第一电极以栅线的形式设置在所述第一透明导电薄膜的背光面。
- 根据权利要求20所述的背接触太阳电池,其特征在于,所述第一透明导电薄膜与所述第二透明导电薄膜的材料均独立选自:氧化锌、掺铝氧化锌、氧化锡、掺铟氧化锡、掺铟镓氧化锡中的至少一种。
- 根据权利要求21所述的背接触太阳电池,其特征在于,所述功函数调节材料的功函数为1eV-5.5eV。
- 根据权利要求20所述的背接触太阳电池,其特征在于,所述第一功函数调节层、所述第二功函数调节层均独立选自:碱金属、过渡金属、碱金属卤化物或过渡金属卤化物中的至少一种。
- 根据权利要求20所述的背接触太阳电池,其特征在于,所述第一功函数调节层、所述第二功函数调节层均独立选自:钙、镁、钡、氟化锂、氟化钾、氟化镁、氯化钡中的至少一种。
- 根据权利要求2-5中任一所述的背接触太阳电池,其特征在于,所述硅基底的背光面为平面结构或陷光结构;和/或,所述硅基底的向光面为平面结构或陷光结构。
- 根据权利要求2-4中任一所述的背接触太阳电池,其特征在于,所第二载流子收集端的俯视图为点状或线状图案。
- 根据权利要求2或4所述的背接触太阳电池,其特征在于,所述硅基底的向光面设置有钝化层、正面场效应层、正面减反射薄膜层、散射结构层、聚光结构层中的至少一种;和/或,在所述金属氧族化合物层的背光面中,所述第二电极、所述第一电极之外的区域设置有背面钝化膜。
- 根据权利要求3所述的背接触太阳电池,其特征在于,所述第二区域的投影与所述第二载流子选择层的投影至少部分重合;所述第二载流子选择层位于所述金属氧族化合物层的背光面或向光面。
- 根据权利要求3或30所述的背接触太阳电池,其特征在于,所述第二载流子收集端在所述硅基底的背光面的投影的面积,占所述硅基底的背光面的总面积的5%至45%;所述第二载流子选择层在所述硅基底的背光面的投影的面积,占所述硅基底的背光面的总面积的5%至45%。
- 根据权利要求3或30所述的背接触太阳电池,其特征在于,在所述第二电极对应设置在所述第二载流子选择层上的情况下,所述第二载流子选择层和所述第二电极之间设置有第三透明导电薄膜和/或第三功函数调节层;所述第三透明导电薄膜和/或第三功函数调节层均位于所述第二载流子选择层的投影部分内。
- 根据权利要求32所述的背接触太阳电池,其特征在于,所述第三功函数调节层的厚度为0.1-2nm。
- 根据权利要求32所述的背接触太阳电池,其特征在于,在所述第二载流子选择层和所述第二电极之间设置有第三透明导电薄膜的情况下,所述第二电极以栅线的形式设置在所述第三透明导电薄膜的背光面。
- 根据权利要求3或30所述的背接触太阳电池,其特征在于,所述硅基底的向光面设置有钝化层、正面场效应层、正面减反射薄膜层、散射结构层、聚光结构层中的至少一种;和/或,在所述第二电极对应设置在所述第二载流子收集端上的情况下,在所述金属氧族化合物层的背光面中,所述第一电极之外的部分,以及在所述第二区域中所述第二电极之外的部分,均设置有背光面减反射膜;和/或,在所述第二电极对应设置在所述第二载流子选择层上的情况下,在所述金属氧族化合物层的背光面以及所述第二载流子选择层的背光面中,所述第一电极、所述第二电极之外的部分设置有背光面减反射膜。
- 根据权利要求4所述的背接触太阳电池,其特征在于,所述阻断结构为开槽;和/或,所述阻断结构为绝缘体。
- 根据权利要求4或36所述的背接触太阳电池,其特征在于,所述阻断结构的厚度大于或等于所述金属氧族化合物层的厚度;在所述阻断结构的厚度大于所述金属氧族化合物层的厚度的情况下,所述阻断结构朝向所述金属氧族化合物层的背光面凸出。
- 根据权利要求4或36所述的背接触太阳电池,其特征在于,所述第二载流子传输区和所述第二电极之间设置有第四透明导电薄膜和/或第四功函数调节层;所述第四透明导电薄膜和/或第四功函数调节层均位于所述第二载流子传输区的投影区域内;和/或,所述第一载流子收集端和所述第一电极之间设置有第一透明导电薄膜和/或第一功函数调节层;所述第一透明导电薄膜和/或第一功函数调节层均位于所述第一载流子收集端的投影区域内。
- 根据权利要求38所述的背接触太阳电池,其特征在于,所述第四透明导电薄膜的厚度为0.1-2nm。
- 根据权利要求38所述的背接触太阳电池,其特征在于,在所述第二载流子传输区和所述第二电极之间设置有第四透明导电薄膜的情况下, 所述第二电极以栅线的形式设置在所述第四透明导电薄膜的背光面;和/或,在所述第一载流子收集端和所述第一电极之间设置有第一透明导电薄膜的情况下,所述第一电极以栅线的形式设置在所述第一透明导电薄膜的背光面。
- 根据权利要求5所述的背接触太阳电池,其特征在于,所述金属氧族化合物层中,所述第二载流子传输区和所述第一载流子收集端之间设置有阻断结构。
- 根据权利要求41所述的背接触太阳电池,其特征在于,所述阻断结构为开槽;和/或,所述阻断结构为高阻体,所述高阻体的电阻率是所述金属氧族化合物层的电阻率100倍以上。
- 根据权利要求5或41所述的背接触太阳电池,其特征在于,所述第二载流子选择收集层的厚度为1-500nm。
- 根据权利要求5或41所述的背接触太阳电池,其特征在于,所述第二载流子选择收集层在所述硅基底的背光面的投影的面积,占所述硅基底的背光面的总面积的5%至45%。
- 根据权利要求5所述的背接触太阳电池,其特征在于,还包括隧穿隔离层;所述隧穿隔离层位于所述硅基底的背光面与所述金属氧族化合物层与所述第二载流子选择收集层两者共同的向光面之间;所述隧穿隔离层的厚度为0.1nm-5nm,所述隧穿隔离层为一层或多层结构。
- 根据权利要求5或41所述的背接触太阳电池,其特征在于,所述第二电极和所述第二载流子选择收集层之间设置有第五透明导电薄膜和/或第五功函数调节层;所述第五透明导电薄膜和/或第五功函数调节层均位于所述第二载流子选择收集层的投影区域内;和/或,所述第一电极和所述第一载流子收集端之间设置有第一透明导电薄膜和/或第一功函数调节层;所述第一透明导电薄膜和/或第一功函数调节层均位于所述第一载流子收集端的投影区域内。
- 根据权利要求46所述的背接触太阳电池,其特征在于,所述第五功函数调节层的厚度为0.1-2nm。
- 根据权利要求46所述的背接触太阳电池,其特征在于,在所述第二电极和所述第二载流子选择收集层之间设置有所述第五透明导电薄膜的情况下,所述第二电极以栅线的形式设置在所述第五透明导电薄膜的背光面;和/或,在所述第一电极和所述第一载流子收集端之间设置有所述第一透明导电薄膜的情况下,所述第一电极以栅线的形式设置在所述第一透明导电薄膜的背光面。
- 根据权利要求5或41所述的背接触太阳电池,其特征在于,所述第二载流子选择收集层的俯视图为点状或线状图案。
- 根据权利要求5所述的背接触太阳电池,其特征在于,所述硅基底的向光面设置有钝化层、正面场效应层、正面减反射薄膜层、散射结构层、聚光结构层中的至少一种;和/或,在所述金属氧族化合物层以及所述第二载流子传输区两者的背光面中,所述第一电极、所述第二电极之外的区域设置有背面减反射膜。
- 一种背接触太阳电池的生产方法,其特征在于,包括:提供硅基底;所述硅基底的背光面分为第一区域和第二区域;至少在所述硅基底的所述第一区域沉积得到金属氧族化合物层;所述金属氧族化合物层与所述第一区域对应的区域形成第一载流子收集端;在所述第一载流子收集端上对应设置第一电极;在所述第二区域对应的区域内对应设置第二电极。
- 根据权利要求51所述的背接触太阳电池的生产方法,其特征在于,所述至少在所述硅基底的所述第一区域沉积得到金属氧族化合物层之前,还包括:对所述第二区域的硅基底进行掺杂,形成第二载流子收集端;所述至少在所述硅基底的所述第一区域沉积得到金属氧族化合物层的步骤,包括:在整个所述硅基底的背光面上沉积得到金属氧族化合物层;所述金属氧族化合物层与所述第二区域对应的区域形成第二载流子传输区;所述在所述第二区域对应的区域内对应设置第二电极的步骤,包括:在所述第二载流子传输区上对应设置所述第二电极。
- 一种背接触电池组件,其特征在于,包括:权利要求1至权利要求50中任一所述的背接触太阳电池。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20941464.8A EP4167300A4 (en) | 2020-06-15 | 2020-12-10 | BACK CONTACT SOLAR CELL AND MANUFACTURING METHODS AND BACK CONTACT BATTERY ARRANGEMENT |
US18/001,821 US20230238463A1 (en) | 2020-06-15 | 2020-12-10 | Back contact solar cell and production method, and back contact battery assembly |
AU2020453832A AU2020453832B2 (en) | 2020-06-15 | 2020-12-10 | Back contact solar cell and production method, and back contact battery assembly |
AU2024213186A AU2024213186A1 (en) | 2020-06-15 | 2024-08-22 | Back contact solar cell and production method, and back contact battery assembly |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021101871.X | 2020-06-15 | ||
CN202010544465.9 | 2020-06-15 | ||
CN202021108338.6 | 2020-06-15 | ||
CN202021101871.XU CN212676289U (zh) | 2020-06-15 | 2020-06-15 | 太阳电池及光伏组件 |
CN202021108338.6U CN212676291U (zh) | 2020-06-15 | 2020-06-15 | 全背电极太阳电池及全背电极电池组件 |
CN202021106709.7 | 2020-06-15 | ||
CN202010544465.9A CN111816726B (zh) | 2020-06-15 | 2020-06-15 | 背接触太阳电池及生产方法、背接触电池组件 |
CN202021106709.7U CN212676290U (zh) | 2020-06-15 | 2020-06-15 | Ibc电池及ibc组件 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2021253751A1 true WO2021253751A1 (zh) | 2021-12-23 |
Family
ID=79269128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2020/135400 WO2021253751A1 (zh) | 2020-06-15 | 2020-12-10 | 背接触太阳电池及生产方法、背接触电池组件 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230238463A1 (zh) |
EP (1) | EP4167300A4 (zh) |
AU (2) | AU2020453832B2 (zh) |
WO (1) | WO2021253751A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114883425A (zh) * | 2022-05-25 | 2022-08-09 | 中国科学院电工研究所 | 一种晶硅异质结太阳电池的迎光面结构 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160276515A1 (en) * | 2015-03-17 | 2016-09-22 | Lg Electronics Inc. | Solar cell |
CN106449781A (zh) * | 2016-10-26 | 2017-02-22 | 中国科学院宁波材料技术与工程研究所 | 钝化接触太阳能电池 |
CN106575676A (zh) * | 2014-07-17 | 2017-04-19 | 光城公司 | 具有叉指背接触的太阳能电池 |
CN108074989A (zh) * | 2016-11-14 | 2018-05-25 | Lg电子株式会社 | 太阳能电池及其制造方法 |
CN111816726A (zh) * | 2020-06-15 | 2020-10-23 | 隆基绿能科技股份有限公司 | 背接触太阳电池及生产方法、背接触电池组件 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009024807B3 (de) * | 2009-06-02 | 2010-10-07 | Helmholtz-Zentrum Berlin Für Materialien Und Energie Gmbh | Solarzelle mit benachbarten elektrisch isolierenden Passivierbereichen mit hoher Oberflächenladung gegensätzlicher Polarität und Herstellungsverfahren |
KR102018381B1 (ko) * | 2017-01-26 | 2019-09-04 | 엘지전자 주식회사 | 태양 전지 및 이의 제조 방법 |
JP7361023B2 (ja) * | 2018-05-08 | 2023-10-13 | 株式会社カネカ | 太陽電池の製造方法及びそれに用いるホルダ |
CN108735828A (zh) * | 2018-07-02 | 2018-11-02 | 黄河水电光伏产业技术有限公司 | 一种异质结背接触太阳能电池及其制备方法 |
-
2020
- 2020-12-10 EP EP20941464.8A patent/EP4167300A4/en active Pending
- 2020-12-10 AU AU2020453832A patent/AU2020453832B2/en active Active
- 2020-12-10 WO PCT/CN2020/135400 patent/WO2021253751A1/zh unknown
- 2020-12-10 US US18/001,821 patent/US20230238463A1/en active Pending
-
2024
- 2024-08-22 AU AU2024213186A patent/AU2024213186A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106575676A (zh) * | 2014-07-17 | 2017-04-19 | 光城公司 | 具有叉指背接触的太阳能电池 |
US20160276515A1 (en) * | 2015-03-17 | 2016-09-22 | Lg Electronics Inc. | Solar cell |
CN106449781A (zh) * | 2016-10-26 | 2017-02-22 | 中国科学院宁波材料技术与工程研究所 | 钝化接触太阳能电池 |
CN108074989A (zh) * | 2016-11-14 | 2018-05-25 | Lg电子株式会社 | 太阳能电池及其制造方法 |
CN111816726A (zh) * | 2020-06-15 | 2020-10-23 | 隆基绿能科技股份有限公司 | 背接触太阳电池及生产方法、背接触电池组件 |
Non-Patent Citations (1)
Title |
---|
See also references of EP4167300A4 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114883425A (zh) * | 2022-05-25 | 2022-08-09 | 中国科学院电工研究所 | 一种晶硅异质结太阳电池的迎光面结构 |
CN114883425B (zh) * | 2022-05-25 | 2023-11-21 | 中国科学院电工研究所 | 一种晶硅异质结太阳电池的迎光面结构 |
Also Published As
Publication number | Publication date |
---|---|
US20230238463A1 (en) | 2023-07-27 |
EP4167300A1 (en) | 2023-04-19 |
AU2020453832A1 (en) | 2023-02-09 |
EP4167300A4 (en) | 2024-07-24 |
AU2024213186A1 (en) | 2024-09-12 |
AU2020453832B2 (en) | 2024-05-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111816726B (zh) | 背接触太阳电池及生产方法、背接触电池组件 | |
TWI631721B (zh) | 高效率堆疊太陽電池 | |
EP3261133B1 (en) | Solar cell | |
AU2020429125B2 (en) | Tandem photovoltaic device and production method | |
WO2022134991A1 (zh) | 太阳能电池及生产方法、光伏组件 | |
CN212676291U (zh) | 全背电极太阳电池及全背电极电池组件 | |
KR20200075640A (ko) | 텐덤 태양전지 | |
TW201725746A (zh) | 串接式太陽電池及其製造方法以及太陽面板 | |
AU2024213186A1 (en) | Back contact solar cell and production method, and back contact battery assembly | |
CN115274868B (zh) | 太阳能电池及光伏组件 | |
CN106653946A (zh) | 一种碲化镉薄膜太阳能电池吸收层的沉积方法 | |
WO2021196606A1 (zh) | 叠层光伏器件及生产方法 | |
CN115172602B (zh) | 一种掺杂金属氧化物复合层结构 | |
CN114744052B (zh) | 太阳能电池及光伏组件 | |
KR20240045490A (ko) | 양면 수광형 실리콘 / 페로브스카이트 텐덤 태양전지 | |
CN112086534B (zh) | 一种叠层电池及其制作方法 | |
CN116722060A (zh) | 太阳能电池及光伏组件 | |
CN212676289U (zh) | 太阳电池及光伏组件 | |
CN212676290U (zh) | Ibc电池及ibc组件 | |
JPH10294478A (ja) | 光電変換素子 | |
KR20160111622A (ko) | 태양 전지 | |
CN118524723B (zh) | 叠层太阳能电池及其制备方法 | |
WO2023024620A1 (zh) | 一种叠层光伏器件 | |
CN113990959B (zh) | 中间串联层及生产方法、叠层光伏器件及制备方法 | |
KR102667799B1 (ko) | 태양 전지 및 이의 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 20941464 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 2020941464 Country of ref document: EP Effective date: 20230116 |
|
ENP | Entry into the national phase |
Ref document number: 2020453832 Country of ref document: AU Date of ref document: 20201210 Kind code of ref document: A |