WO2021253751A1 - 背接触太阳电池及生产方法、背接触电池组件 - Google Patents

背接触太阳电池及生产方法、背接触电池组件 Download PDF

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WO2021253751A1
WO2021253751A1 PCT/CN2020/135400 CN2020135400W WO2021253751A1 WO 2021253751 A1 WO2021253751 A1 WO 2021253751A1 CN 2020135400 W CN2020135400 W CN 2020135400W WO 2021253751 A1 WO2021253751 A1 WO 2021253751A1
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layer
carrier
silicon substrate
electrode
solar cell
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PCT/CN2020/135400
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English (en)
French (fr)
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吴兆
徐琛
李子峰
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隆基绿能科技股份有限公司
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Priority claimed from CN202021108338.6U external-priority patent/CN212676291U/zh
Priority claimed from CN202010544465.9A external-priority patent/CN111816726B/zh
Priority claimed from CN202021101871.XU external-priority patent/CN212676289U/zh
Priority claimed from CN202021106709.7U external-priority patent/CN212676290U/zh
Application filed by 隆基绿能科技股份有限公司 filed Critical 隆基绿能科技股份有限公司
Priority to EP20941464.8A priority Critical patent/EP4167300A1/en
Priority to US18/001,821 priority patent/US20230238463A1/en
Priority to AU2020453832A priority patent/AU2020453832B2/en
Publication of WO2021253751A1 publication Critical patent/WO2021253751A1/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0216Coatings
    • H01L31/02161Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02167Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0224Electrodes
    • H01L31/022408Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/022441Electrode arrangements specially adapted for back-contact solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/072Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/072Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
    • H01L31/074Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a heterojunction with an element of Group IV of the Periodic Table, e.g. ITO/Si, GaAs/Si or CdTe/Si solar cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention relates to the field of photovoltaic technology, in particular to a back contact solar cell and a production method, and a back contact battery assembly.
  • the back-contact solar cell can achieve high photoelectric conversion efficiency because it has no electrode shield to the smooth surface, so it is widely used.
  • back-contact solar cells usually need to fabricate areas of different conductivity types that are accurately aligned and electrically isolated from each other on the backlight surface of the silicon substrate.
  • the invention provides a back-contact solar cell, a production method, and a back-contact battery assembly, aiming to solve the problem of poor process stability.
  • a back-contact solar cell comprising: a silicon substrate, the backlight surface of the silicon substrate is divided into a first region and a second region; a metal chalcogenide layer deposited at least on the The first region of the silicon substrate; the region corresponding to the metal chalcogenide layer and the first region forms a first carrier collection terminal; a first electrode is correspondingly arranged on the first carrier collection terminal On; the second electrode is correspondingly arranged in the area corresponding to the second area.
  • the conduction band energy level of the metal chalcogenide layer near the interface of the first region is close to the conduction energy level of the first carrier in the first region, which can play a role in absorbing the first carrier and repelling the second carrier. Furthermore, the region corresponding to the first region of the metal chalcogenide layer forms a first carrier collection end, and the collection and transmission of the first carrier are realized through the first carrier collection end.
  • the structure and performance of the metal oxygen group compound layer are highly adjustable, the thermal stability is good, the process selection window is wide, and at the same time, it can achieve lower lateral conductivity and stronger longitudinal conductivity.
  • the silicon substrate in the second region is doped to form a second carrier collection terminal; the metal chalcogen compound layer is deposited on the entire backlight surface of the silicon substrate; the metal chalcogen compound The region of the layer corresponding to the second region forms a second carrier transport region; the second electrode is correspondingly disposed on the second carrier transport region.
  • the second carrier collection end is formed by doping through the second region of the backlight surface of the silicon substrate, which can absorb the second carriers and repel the first carriers, thereby serving as a second carrier selection Sexual effect, and then at the second carrier collection end, the second carrier density is higher, and the first carrier density is lower.
  • the continuous whole layer of metal oxychloride layer at the interface near the first region is close to the conduction level of the first carrier in the first region, which can absorb the first carrier to repel.
  • the role of the second carrier, and then the area corresponding to the metal chalcogenide layer and the first region forms the first carrier collection end, and the collection and transmission of the first carrier are realized through the first carrier collection end .
  • the carrier conduction level of the metal chalcogenide layer corresponds to the conduction level of the second carrier corresponding to the second region Therefore, the second carrier at the second carrier collection end can directly enter the area corresponding to the second area of the metal chalcogenide layer, and further, the area corresponding to the second area of the metal chalcogen compound layer serves as the second carrier.
  • the current carrier transmission area realizes the collection and transmission of the second carrier.
  • the region corresponding to the first region realizes the collection and transmission of the first carrier
  • the region corresponding to the second region realizes the collection and transmission of the second carrier.
  • the metal chalcogenide layer realizes the second carrier transport and the first carrier collection respectively.
  • the metal chalcogenide layer has a lower lateral transport capacity, and different types of carriers After being collected, they are all transmitted longitudinally into the corresponding electrodes, and will not be connected to each other due to lateral transmission and cause leakage or short circuit. Therefore, additional alignment and electrical isolation are not required, the process is simple, the recombination is reduced, and the photoelectric conversion efficiency is improved.
  • the second carrier collection terminal, the first carrier collection terminal and the metal oxychloride layer will not cause a reverse pn junction due to mutual contact.
  • the silicon substrate in the second region is doped to form a second carrier collection end; the metal chalcogenide layer is deposited only on the first region; the second electrode is correspondingly disposed on the The second carrier collection terminal;
  • the metal chalcogenide layer is deposited on the entire backlight surface of the silicon substrate; at least a portion of the metal chalcogenide layer corresponding to the second region has an opening for electrically dividing the metal chalcogenide layer Hole; a second carrier selection layer is formed on a portion corresponding to the second region of the metal chalcogenide layer, and the second carrier selection layer is filled in the opening; the second electrode is correspondingly arranged On the second carrier selection layer.
  • the second carrier collection end is formed by doping through the second region of the backlight surface of the silicon substrate, which can absorb the second carriers and repel the first carriers, thereby serving as a second carrier selection And the second carrier density is higher at the second carrier collection end, and the first carrier density is lower.
  • the metal chalcogenide layer is only deposited on the first area of the backlight surface of the silicon substrate as the first carrier collection terminal, and its carrier conduction energy level is close to the conduction energy level of the first carrier in the first area. It can absorb the first carrier and repel the second carrier, and realize the collection and transmission of the first carrier through the first carrier collection end.
  • the first electrode is correspondingly arranged on the first carrier collecting end
  • the second electrode is correspondingly arranged on the second carrier collecting end, that is, the second area of the backlight surface of the doped silicon substrate realizes the second
  • the metal chalcogenide layer deposited on the first area of the backlight surface of the silicon substrate realizes the collection and transmission of the first carriers, and different substances located at different positions realize the pairing.
  • the collection and transmission of different carriers does not require additional alignment and electrical isolation, the process is simple, the area of the non-collection area is reduced, and the photoelectric conversion efficiency is improved.
  • the carrier conduction energy level of the collection or conduction material of each carrier collection area is close to the transmission energy level of the corresponding carrier in the silicon material, and the transmission interface has no or low potential barrier, reducing the longitudinal contact resistance.
  • the continuous whole layer of the metal chalcogenide layer is close to the first carrier.
  • the carrier conduction level at the interface of the region is close to the conduction level of the first carrier in the first region, which can absorb the first carrier and repel the second carrier, and then the metal chalcogenide layer
  • the part corresponding to the first region forms a first carrier collection end, and the collection and transmission of the first carrier are realized through the first carrier collection end.
  • At least the part corresponding to the second region of the continuous whole metal chalcogenide layer has openings for electrically dividing the metal chalcogenide layer, the openings are filled with the second carrier selection layer, and the second electrode is arranged On the second carrier selection layer, it is equivalent to that the second carrier is exclusively transported through the second carrier selection layer, and the first carrier is mainly transported through the unopened part of the metal chalcogenide layer , Realizes the transmission of different substances to different carriers, does not require additional alignment and electrical isolation, the process is simple, the area of the non-collection area is reduced, and the photoelectric conversion efficiency is improved.
  • the first carrier and the second carrier are respectively transmitted through different substances, and the second carrier selection layer is more convenient for the second carrier transmission and can reduce the longitudinal contact resistance.
  • the second carrier collection terminal, the first carrier collection terminal and the metal oxychloride layer will not cause a reverse pn junction due to mutual contact.
  • the silicon substrate in the second region is doped to form a second carrier collection terminal; the metal chalcogen compound layer is deposited on the entire backlight surface of the silicon substrate; The compound layer has a blocking structure that electrically divides the metal chalcogenide layer into a second carrier transport region and the first carrier collection end; wherein, the second carrier transport region corresponds to the The second area; the second electrode is correspondingly arranged on the second carrier transport area.
  • the second carrier collection end is formed by doping through the second region of the backlight surface of the silicon substrate, which can absorb the second carriers and repel the first carriers, thereby serving as a second carrier selection Sexual effect, and then at the second carrier collection end, the second carrier density is higher, and the first carrier density is lower.
  • the blocking structure divides the metal chalcogenide layer electrically into the second carrier transport region and the first carrier collection end.
  • the first carrier collection end is at the interface close to the first region and the carrier conduction energy level and The conduction energy level of the first carrier in the first region is close, which can play a role in absorbing the first carrier and repelling the second carrier.
  • the carrier conduction energy level of the second carrier transport region corresponds to the conduction of the second carrier corresponding to the second region
  • the energy level is close, therefore, the second carrier at the second carrier collection end can directly enter the second carrier transmission area, thereby realizing the collection and transmission of the second carrier.
  • the second carrier transport area and the first carrier collection end are divided by the blocking structure, so that the lateral transport capacity of the entire metal chalcogenide layer is very low, so that the vertical conduction of the metal chalcogenide layer can be improved. Capability and avoid lateral leakage, which can reduce the longitudinal series resistance to a large extent.
  • the second carrier transport area and the first carrier collection end are divided by the blocking structure. After different types of carriers are collected, they will be transported longitudinally into the corresponding electrode, and will not be connected to each other due to lateral transport and cause leakage or Short circuit, so precise doping alignment is not required, the process is simple, the recombination is reduced, and the photoelectric conversion efficiency is improved. At the same time, the second carrier collection terminal, the first carrier collection terminal and the metal oxychloride layer will not cause a reverse pn junction due to mutual contact.
  • the back contact solar cell further includes: a second carrier selective collection layer; the second carrier selective collection layer is deposited on the second region of the silicon substrate; the metal oxygen The group compound layer is deposited on the first area and on the backlight surface of the second carrier selective collection layer; the part of the metal oxygen compound layer corresponding to the second carrier selective collection layer forms a second Two carrier transport regions; the second electrode is correspondingly arranged on the second carrier transport region.
  • the second carrier selective collection layer is deposited on the second area of the backlight surface of the silicon substrate without high temperature diffusion and low process temperature.
  • the carrier conduction level of the second carrier selection and collection layer is close to the second carrier conduction level of the silicon substrate, which can absorb the second carrier to repel the first carrier and play a role in the second carrier selection Sexual effect.
  • the metal chalcogenide layer at the interface of the region outside the second carrier selective collection layer is close to the conduction level of the first carrier in the first region on the backlight surface of the silicon substrate.
  • the metal chalcogenide layer region corresponding to the second carrier selective collection layer realizes the transport of the second carrier
  • the other metal chalcogenide layer region realizes the transmission of the first carrier. Collection and transport, that is, different regions of the metal chalcogenide layer realize the second carrier transport and the first carrier collection respectively.
  • the second carrier transport region and the first carrier are collected.
  • the second carrier selective collection layer adopts a deposition selective contact structure, and the metal chalcogenide layer also adopts a deposited selective contact structure, which has the advantage of low body region recombination and is not restricted by the Auger recombination limit. At the same time, the second carrier selective collection layer and the first carrier collection end will not cause a reverse pn junction due to mutual contact.
  • a method for producing a back-contact solar cell including:
  • the backlight surface of the silicon substrate is divided into a first area and a second area;
  • At least a metal chalcogenide layer is deposited on the first area of the silicon substrate; the area corresponding to the metal chalcogenide layer and the first area forms a first carrier collecting end;
  • a first electrode is correspondingly arranged on the first carrier collection end
  • a second electrode is correspondingly arranged in an area corresponding to the second area.
  • a back-contact solar cell assembly including any of the aforementioned back-contact solar cells.
  • FIGs 1-23 respectively show the structural schematic diagrams of the first to the twentieth types of back-contact solar cells in the embodiments of the present invention.
  • FIG. 1 shows a schematic structural diagram of the first type of back-contact solar cell in the embodiment of the present invention.
  • the back contact solar cell includes a silicon substrate 1, and the backlight surface of the silicon substrate 1 is divided into a first area and a second area 2.
  • the area of the backlight surface of the silicon substrate 1 except for the second area 2 is the first area.
  • the metal chalcogenide layer 4 is deposited at least on the first region of the silicon substrate 1. It should be noted that whether the metal chalcogenide layer 4 is deposited on the second region 2 of the silicon substrate 1 is not specifically limited. For example, in the back contact solar cell shown in FIG. 1, the second region 2 of the silicon substrate 1 is not deposited with the metal chalcogenide layer 4.
  • the region corresponding to the first region of the backlight surface of the metal oxychloride layer 4 of the silicon substrate 1 forms a first carrier collection end, and the first carrier collection end can realize the collection and transmission of the first carriers.
  • the first carrier is selected from one of many carriers or few carriers, and the second carrier is the other one of many carriers or few carriers. That is, when the first carrier is multiple carriers, the second carrier must be a minority carrier; when the second carrier is multiple carriers, the first carrier must be a minority carrier; In the present invention, whether the multiple sons and the minority sons are electrons or holes is mainly determined according to the doping type of the silicon substrate 1. If the doping type of the silicon substrate 1 is n-type, then in the back-contact solar cell of the present invention, the multiple sons refer to electrons, and the minority sons refer to holes. If the doping type of the silicon substrate 1 is p-type, then in the back-contact solar cell of the present invention, multiple sons refer to holes, and minority sons refer to electrons.
  • a first electrode 5 is correspondingly provided at the first carrier collecting end of the metal chalcogenide layer 4, and the first electrode 5 is used for conducting the first carrier.
  • the second electrode 6 is correspondingly arranged in the area corresponding to the second area 2, and the second electrode 6 is used for conducting the second carrier. It should be noted that an electrical insulation gap needs to be reserved between the first electrode 5 and the second electrode 6, and the electrical insulation gap is not less than the breakdown distance under normal operating voltage.
  • the first electrode 5 and the second electrode 6 can be fabricated by printing, deposition and other processes.
  • the second electrode 6 and the first electrode 5 may be metal electrodes.
  • the conduction band energy level of the metal chalcogenide layer 4 at the interface near the first region is close to the conduction energy level of the first carrier in the first region, which can absorb the first carrier and repel the second carrier.
  • the region corresponding to the first region of the metal chalcogenide layer 4 forms a first carrier collection end, and the collection and transmission of the first carrier are realized through the first carrier collection end.
  • the metal chalcogenide layer 4 has strong structural and performance tunability, good thermal stability, and a wide process selection window. At the same time, it can achieve lower lateral conductivity and stronger longitudinal conductivity.
  • FIG. 2 shows a schematic structural diagram of a second type of back-contact solar cell in an embodiment of the present invention.
  • the metal chalcogenide layer 4 is deposited on the backlight surface of the entire silicon substrate 1.
  • the structure and performance are highly adjustable, which can achieve lower lateral conductivity and Strong longitudinal conductivity, good thermal stability, wide process selection window.
  • the area corresponding to the second area of the back light surface of the metal chalcogenide layer 4 and the silicon substrate 1 forms a second carrier transport area, which can realize the transport of the second carrier .
  • a second electrode 6 is correspondingly provided in the second carrier transport region in the metal chalcogenide layer 4, and the second electrode 6 is used to conduct the second carrier.
  • the second region 2 is doped to form a second carrier collection end.
  • the second carrier collection terminal can realize the collection and transmission of the second carrier.
  • the second region 2 and the second region in the silicon substrate 1 have the same or different doping types; when the doping types are the same, the doped elements can be the same or different. There is no specific limitation.
  • the projected area of the second carrier collection end on the backlight surface of the silicon substrate 1 accounts for 5% to 45% of the total area of the backlight surface of the silicon substrate. With this area ratio, the second carrier The collection and transmission effect is good, and it will not affect the collection and transmission of the first carrier.
  • the top view of the second carrier collection end may be a dotted or linear pattern, such as a circle or an ellipse. Linear patterns such as rectangles or polygons.
  • the top view of the second carrier collecting end is a dotted or linear pattern, so that the doping process for the second region is simple.
  • the doping concentration of the second carrier collection end is greater than or equal to 10 15 cm -3 and greater than the doping concentration of the silicon substrate 1 in the first region, so that the second carrier collection and transmission effect is better .
  • the second carrier collection end is a doped structure, which can cause the n-type silicon substrate to bend downward in the energy band of the second region 2 to attract electrons to repel holes, and play a role of selective electron collection.
  • the area corresponding to the first area in the metal chalcogenide layer 4 forms a first carrier collecting end, and the first carrier collecting end is the hole collecting end.
  • the metal chalcogenide compound in the first region ie, the first carrier collection terminal
  • the conduction band energy level of the material is close to the valence band energy level of the n-type silicon substrate, and can have Negative interface charges or negative fixed defects can cause the energy band at the interface to bend upwards, forming an interface p-type layer, which acts to attract holes and repel electrons.
  • materials with stronger selectivity will cause stronger interface band bending, and at the same time, the conduction band bottom energy level of the first carrier collection end is lower, and holes can pass through the tunneling recombination mechanism Enter the hole selective material to realize the collection and transport of holes.
  • the bottom energy level of the conduction band in this region is lower, which is close to the bottom energy level of the second carrier collection end.
  • the electrons can directly enter the second carrier transport area corresponding to the second carrier collection end in the metal chalcogenide layer, so as to realize the transport of electrons.
  • conduction band energy level and valence band energy level in the present invention generally refer to the energy level of the material itself, that is, the energy level when the material exists alone, and does not refer to the actual energy level in the battery structure.
  • the metal chalcogenide layer 4 can simultaneously realize the collection of holes and the transmission of electrons.
  • the material can adjust the crystallinity, crystal phase and doping elements to make it have lower lateral conductivity.
  • the holes at the current collector end and the electrons in the second carrier transport region, different types of carriers are collected and transported longitudinally into the corresponding electrode, and will not communicate with each other due to lateral transport and cause leakage or short circuit, so different types of carriers
  • the current collector terminal does not need to be additionally electrically isolated, and no reverse pn junction will be generated due to mutual contact.
  • the second carrier collection end adopts a local doping selective contact structure
  • the metal chalcogenide layer 4 adopts a deposited selective contact structure.
  • the metal chalcogenide layer 4 has a minority carrier collection area.
  • the metal chalcogenide layer 4 has stronger selectivity, higher thermal stability, and material deposition Process equipment requirements are lower and safety is higher.
  • the metal oxygen group compound layer 4 can fully cover the back of the battery, which further simplifies the process flow.
  • the region corresponding to the first region in the metal chalcogenide layer 4 is used to form the first carrier collection end. Compared with amorphous silicon material, it has stronger selectivity and vertical transmission ability. Stronger transmission capacity; At the same time, at the second carrier collection end, in conjunction with the local doping structure, the second carrier is transported through the band edge of the oxygen compound material, and does not involve the cross-level tunneling mechanism. Two-carrier transmission is small, and lower contact resistance can be achieved.
  • the metal chalcogenide layer 4 may have a one-layer or multi-layer structure.
  • the thickness d1 of the metal chalcogenide layer 4 may be 1-600 nm, and more preferably, d1 is 2. -100nm, this thickness range is conducive to the transmission and collection of the second carrier and the first carrier.
  • the silicon substrate 1 is a p-type silicon substrate and the second carriers are holes, which can be understood with reference to the above.
  • the metal oxygen group is selected from: at least one of the first materials.
  • the first material is: an n-type metal oxide with a work function greater than or equal to 5 eV, or a p-type metal oxide with a work function less than or equal to 6 eV.
  • the second carrier transport region in the metal chalcogenide layer 4 of this material facilitates the transport of the second carrier, and the first carrier in the metal chalcogenide layer 4 of this material
  • the collection terminal facilitates the transmission and collection of the first carrier.
  • the metal chalcogenide layer is selected from: at least one of the above-mentioned first materials.
  • the aforementioned first material is selected from: molybdenum oxide, tungsten oxide, vanadium oxide, niobium oxide, nickel oxide, mercury-doped niobium oxide (such as Hg 2 Nb 2 O 7 ), mercury-doped tantalum oxide (such as Hg 2 Ta 2) O 7 ) at least one of.
  • the metal chalcogenide layer of the above material When the silicon substrate is an n-type silicon substrate and the second carriers are electrons, or, when the silicon substrate is a p-type silicon substrate and the second carriers are electrons, the metal chalcogenide layer of the above material
  • the first carrier collection end in 4 is conducive to the transmission and collection of the first carrier
  • the second carrier transmission region in the metal oxychloride layer 4 of the above-mentioned material is conducive to the transmission of the second carrier.
  • the metal chalcogenide The material of the layer is selected from at least one of the second materials; the second material is a metal chalcogenide compound with a work function greater than or equal to 3 eV.
  • the second carrier transport region in the metal chalcogenide layer 4 of this material is conducive to the transport of the second carrier, and the first carrier collection end in the metal chalcogenide layer 4 of the material is conducive to the first carrier. Transmission and collection of streamers.
  • the material of layer 4 is selected from: at least one of the above-mentioned second materials.
  • the above-mentioned second material is selected from: zinc oxide, tin oxide, titanium oxide, copper oxide, thallium oxide, cadmium sulfide, molybdenum sulfide, zinc sulfide, molybdenum selenide, copper selenide, niobium-doped copper oxide (such as CuNb 3 O 8 ), at least one of cadmium germanium oxide (such as Ce 0.8 Gd 0.2 O 2 ), iridium zinc oxide (such as ZnIr 2 O 4 ), and calcium cobalt oxide (such as Ca 3 Co 4 O 9 ).
  • the metal chalcogenide of the material When the silicon substrate is a p-type silicon substrate and the second carrier is a hole, or when the silicon substrate is an n-type silicon substrate and the second carrier is a hole, the metal chalcogenide of the material
  • the second carrier transport region in the layer 4 is conducive to the transport of the second carrier, and the first carrier collection end in the metal chalcogenide layer 4 of this material is conducive to the transport and collection of the first carrier.
  • the above-mentioned metal oxygen compound contains a doping element, and the doping element is selected from the group consisting of halogen elements, transition metal elements, alkali metal elements, rare earth elements, group III elements, group IV elements, and group V elements. At least one.
  • the second carrier transport region in the metal chalcogenide layer 4 of the above material is conducive to the transport of the second carrier, and the first carrier collection end in the metal chalcogenide layer 4 of the material is conducive to the first carrier. Transmission and collection of streamers.
  • the lateral conductivity of the metal chalcogenide layer 4 is less than or equal to 1.0 ⁇ 10 -3 S/cm, and the lateral resistance is greater than or equal to 1.0 ⁇ 10 3 ⁇ /cm, thereby having a good blocking effect on the lateral current.
  • the lateral conductivity can be reduced by adjusting the material structure, such as crystallinity, crystal phase, or doping.
  • the silicon substrate is a p-type silicon substrate and the second carrier is a majority carrier, or when the silicon substrate is an n-type silicon substrate and the second carrier is a minority carrier
  • the area corresponding to the metal chalcogenide layer 4 and the first area forms a first carrier collecting end for collecting and transporting the first carrier electrons
  • the area corresponding to the metal chalcogenide layer 4 and the second area forms a second carrier.
  • the carrier transport area is used to transport the second carrier holes.
  • the fixed positive charge density at the interface or inside of the metal oxygen compound layer 4 is greater than or equal to 10 11 cm -2 , and/or the acceptor defect density at the interface or inside of the metal oxygen compound layer 4 is greater than or equal to 10 11 cm ⁇ 2 , and/or, the limit charge density at the interface or inside of the metal oxygen group compound layer 4 is greater than or equal to 10 11 cm -2 .
  • the second carrier transport region in the metal chalcogenide layer 4 of this material is conducive to the transport of the second carrier, and the first carrier collection end in the metal chalcogenide layer 4 of the material is conducive to the first carrier. Transmission and collection of streamers.
  • the silicon substrate is an n-type silicon substrate and the second carrier is multiple carriers, or when the silicon substrate is a p-type silicon substrate and the second carrier is a minority carrier
  • the area corresponding to the metal chalcogenide layer 4 and the first area forms a first carrier collection end for collecting and transporting the first carrier holes, and the area corresponding to the metal chalcogenide layer 4 and the second area forms a first carrier collecting end.
  • the two-carrier transport area is used to transport the second carrier electrons.
  • the fixed negative charge density at the interface or inside of the metal chalcogenide layer 4 is greater than or equal to 10 12 cm -2 , and/or the donor defect density at the interface or inside of the metal chalcogen compound layer 4 is greater than or equal to 10 12 cm -2 , And/or, the limit charge density at the interface or inside of the metal oxychloride layer 4 is greater than or equal to 10 12 cm -2 .
  • the second carrier transport region in the metal chalcogenide layer 4 of this material is conducive to the transport of the second carrier, and the first carrier collection end in the metal chalcogenide layer 4 of the material is conducive to the first carrier. Transmission and collection of streamers.
  • the average light transmittance of the metal chalcogenide layer 4 in the visible light band is greater than or equal to 70%, and further, the metal chalcogenide layer 4 shields visible light less, which is beneficial to improve the photoelectric conversion efficiency.
  • the backlight surface of the silicon substrate 1 has a planar structure or a light-trapping structure
  • the light-facing surface of the metal chalcogenide layer 4 is adapted to the backlight surface of the silicon substrate 1.
  • the light-facing surface of the silicon substrate 1 has a planar structure or a light-trapping structure.
  • the optical path can be increased and the photoelectric conversion efficiency can be improved.
  • the light trapping structure can be suede, inverted pyramid, nano light trapping structure, etc.
  • the light-facing surface of the silicon substrate may also be provided with at least one of a passivation layer, a front field effect layer, a front anti-reflection film layer, a scattering structure layer, and a light-concentrating structure layer.
  • a passivation layer e.g., a front field effect layer
  • a front anti-reflection film layer e.g., a scattering structure layer
  • a light-concentrating structure layer e.g., the area outside the second electrode and the first electrode is provided with a back passivation film to achieve passivation, optical improvement, and the like.
  • FIG. 3 shows a schematic structural diagram of a third type of back-contact solar cell in an embodiment of the present invention.
  • 7 may be a front anti-reflection film layer
  • 8 may be a back passivation film.
  • FIG. 4 shows a schematic structural diagram of a fourth type of back-contact solar cell in an embodiment of the present invention.
  • a second carrier selection layer 22 is also deposited on the backlight surface of the second region 2, and the second carrier selection layer 22 can further enhance the transmission capability of the second region 2 for second carriers.
  • the projection of the second region 2 and the projection of the second carrier selective layer 22 at least partially overlap, thereby facilitating processing.
  • the projection of the second region 2 and the projection of the second carrier selection layer 22 have a high degree of overlap.
  • the second carrier selection layer 22 is located on the backlight surface or the light-facing surface of the metal chalcogenide layer 4.
  • the second carrier selection layer 22 is located on the light facing surface of the metal chalcogenide layer 4.
  • FIG. 5 shows a schematic structural diagram of a fifth type of back-contact solar cell in an embodiment of the present invention.
  • the second carrier selection layer 22 is located on the backlight surface of the metal chalcogenide layer 4.
  • the second carrier selection layer 22 has a one-layer or multi-layer structure, and the thickness d2 of the second carrier selection layer 22 is 1-500 nm, and more preferably, d2 It is 2-60nm. The thickness of the second carrier selection layer 22 facilitates the transport of second carriers.
  • the projection area of the second carrier selection layer 22 on the backlight surface of the silicon substrate 1 accounts for 5% to 45% of the total area of the backlight surface of the silicon substrate 1. Under this area ratio, the transmission effect for the second carrier is good, and at the same time, the collection and transmission of the first carrier are not affected. It should be noted that the area of the second carrier selection layer 22 and the above-mentioned second region 2 are equal or unequal, which is not specifically limited in the embodiment of the present invention.
  • the second carrier is selected from at least one of a crystalline silicon material with a work function greater than or equal to 3 eV, an amorphous silicon material with a function greater than or equal to 3 eV, or a second material.
  • the second material is a metal oxygen group compound with a work function greater than or equal to 3 eV.
  • the second carrier selection layer of the above-mentioned material has a good effect on the collection and transmission of the second carrier.
  • the second carrier may be selected from: at least one of the first materials; the first material is an n-type metal oxygen compound with a work function greater than or equal to 5 eV, or a p-type metal oxygen compound with a work function less than or equal to 6 eV.
  • the second carrier selection layer of the above-mentioned material has a good effect on the collection and transmission of the second carrier.
  • a tunnel isolation layer is provided between the backlight surface of the silicon substrate and the metal oxychloride layer.
  • the tunnel isolation layer may have a one-layer or multi-layer structure, and the thickness of the tunnel isolation layer is 0.1 nm-5 nm.
  • the tunnel isolation layer has a good surface passivation effect and can reduce the recombination of current at the interface.
  • FIG. 6 shows a schematic structural diagram of a sixth back contact solar cell in an embodiment of the present invention.
  • a tunnel isolation layer 3 is provided between the backlight surface of the silicon substrate 1 and the metal chalcogenide layer 4, and the thickness d3 of the tunnel isolation layer 3 is 0.1 nm-5 nm.
  • FIG. 7 shows a schematic structural diagram of a seventh type of back-contact solar cell in an embodiment of the present invention.
  • the tunnel isolation layer 3 is located between the backlight surface of the silicon substrate 1 and the light-facing surface of the metal chalcogenide layer 4 and the light-facing surface of the second carrier selection layer 22.
  • FIG. 8 shows a schematic structural diagram of an eighth back-contact solar cell in an embodiment of the present invention.
  • the tunnel isolation layer 3 is located between the backlight surface of the silicon substrate 1 and the light-facing surface of the metal chalcogenide layer 4 and the light-facing surface of the second carrier selection layer 22.
  • the material of the tunnel isolation layer is selected from at least one of silicon oxide, silicon nitride, silicon oxynitride, and silicon halide.
  • the above-mentioned materials have a better chemical passivation effect on the surface of the tunnel isolation layer.
  • the tunnel isolation layer can be formed separately, for example, using in-situ reaction processes such as wet thermal oxygen, dry thermal oxygen, chemical vapor deposition, physical vapor deposition, or other deposition processes. Or use a process integrated with the metal chalcogenide layer, such as the interfacial silicon oxide layer formed in the process of growing the metal chalcogen compound or in the post-annealing process, as the tunnel isolation layer.
  • the tunnel isolation layer is made of a material that does not contain silicon, it may include a chemical transition layer between it and a silicon material.
  • the material of the tunnel isolation layer can be a dielectric material, and the dielectric constant of the tunnel isolation layer is greater than 2.
  • the dielectric material can be polarized into an insulating material.
  • the material of the tunnel isolation layer can be a dielectric material, and the dielectric constant is greater than 2, which not only has a good surface chemical passivation effect, but also has a good field passivation effect. Can play a good blocking effect on lateral conduction.
  • the breakdown voltage of the tunnel isolation layer is greater than or equal to 3MV/cm, the surface passivation effect is good, and the lateral conduction is well blocked.
  • the material of the tunnel isolation layer is selected from silicon oxide (such as SiO x ), silicon nitride (such as SiN x ), silicon fluoride (such as SiF 4 ), silicon oxyfluoride (such as SiOF), silicon oxycarbide (Such as SiOC), aluminum oxide (such as Al 2 O 3 ), aluminum fluoride (such as AlF x ), and aluminum oxynitride (such as AlON).
  • silicon oxide such as SiO x
  • silicon nitride such as SiN x
  • silicon fluoride such as SiF 4
  • silicon oxyfluoride such as SiOF
  • silicon oxycarbide Silicon oxide
  • aluminum oxide such as Al 2 O 3
  • aluminum fluoride such as AlF x
  • aluminum oxynitride such as AlON
  • a second transparent conductive film and/or a second work function adjusting layer are arranged between the second carrier collecting end and the second electrode. That is, a second transparent conductive film, or a second work function adjustment layer, or both may be provided between the second carrier collection terminal and the second electrode.
  • the second transparent conductive film and/or the second work function adjusting layer are both located in the projection area of the second carrier collection end. It should be noted that, in the case of both, the second transparent conductive film may be located on the backlight surface or the light-facing surface of the second work function adjustment layer.
  • the projection of the second electrode may be located within the projection of the second transparent conductive film and/or the second work function adjustment layer.
  • a first transparent conductive film and/or a first work function adjusting layer are arranged between the first carrier collecting end and the first electrode. That is, a first transparent conductive film, or a first work function adjustment layer, or both may be provided between the first carrier collection terminal and the first electrode.
  • the first transparent conductive film and/or the first work function adjusting layer are both located in the projection area of the first carrier collection end. It should be noted that, in the case of both, the first transparent conductive film may be located on the backlight surface or the light-facing surface of the first work function adjustment layer.
  • the projection of the first electrode may be within the projection of the first transparent conductive film and/or the first work function adjustment layer.
  • the above-mentioned first transparent conductive film and the second transparent conductive film can play a role in assisting carrier transmission, and transmit light, which can further improve the photoelectric conversion efficiency.
  • the first work function adjustment layer and the second work function adjustment layer play a role in reducing contact resistance.
  • FIG. 9 shows a schematic structural diagram of a ninth type of back-contact solar cell in an embodiment of the present invention.
  • a second transparent conductive film 63 and a second work function adjusting layer 62 are provided between the second carrier collecting end and the second electrode 6.
  • the second transparent conductive film 63 is located on the light facing surface of the second work function adjustment layer 62.
  • a first transparent conductive film 52 and a first work function adjusting layer 53 are provided between the first carrier collecting end and the first electrode 5.
  • the first transparent conductive film 52 is located on the backlight surface of the first work function adjustment layer 53.
  • the thickness d4 of the second work function adjustment layer 62 and the thickness d5 of the first work function adjustment layer 53 are both 0.1-5 nm. This thickness range can reduce the contact resistance to a greater extent.
  • the second transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material.
  • the first transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material. That is, the first transparent conductive film and the second transparent conductive film can not only play the role of assisting carrier transport, but also transmit light, which can further improve the photoelectric conversion efficiency, and at the same time, can reduce the contact resistance or the longitudinal resistance.
  • the second electrode is provided on the back light surface of the second transparent conductive film in the form of a grid line, which makes full use of The back side transmits light, which can further improve the photoelectric conversion efficiency.
  • the first electrode is provided on the backlight surface of the first transparent conductive film in the form of a grid line to make full use of The back light is transparent, which can further improve the photoelectric conversion efficiency.
  • the materials of the first transparent conductive film and the second transparent conductive film are independently selected from at least one of zinc oxide, aluminum-doped zinc oxide, tin oxide, indium-doped tin oxide, and indium-gallium-doped tin oxide.
  • the first transparent conductive film and the second transparent conductive film of the above-mentioned materials have better carrier transport performance, which can further improve the photoelectric conversion efficiency.
  • the work functions of the first work function adjustment layer and the second work function adjustment layer are both 1eV-5.5eV, which can further reduce the contact resistance.
  • the material of the first work function adjustment layer, the material of the second work function adjustment layer, the first transparent conductive film, and/or the work function adjustment material in the second transparent conductive film may be independently selected from: alkali metals, At least one of a transition metal, an alkali metal halide, or a transition metal halide can further reduce the contact resistance.
  • the material of the first work function adjustment layer, the material of the second work function adjustment layer, the first transparent conductive film and/or the work function adjustment material in the second transparent conductive film may be independently selected from: Ca, Mg, Ba, LiF x, KFx, MgF x, BaCl x and so on. Among them, for the x in the chemical formula here, those skilled in the art can choose an appropriate value according to the actual situation.
  • the work function of the work function adjusting material in the first transparent conductive film and/or the second transparent conductive film is 1 eV-5.5 eV, which can further reduce the contact resistance.
  • the second region 2 is doped to form a second carrier collection end.
  • the second carrier collection terminal can realize the collection and transmission of the second carrier.
  • the second region 2 and the second region in the silicon substrate 1 have the same doping type, but the doped elements may be the same or different. The embodiment of the present invention does not specifically limit this.
  • the metal chalcogenide layer 4 as the first carrier collection terminal is only deposited on the first area of the backlight surface of the silicon substrate 1.
  • the first carrier collection terminal can realize the collection and transmission of the first carrier.
  • the second electrode 6 is correspondingly disposed on the second carrier collecting end, and the second electrode 6 is used for conducting the second carrier.
  • the first electrode 5 is correspondingly arranged on the first carrier collecting end, and the first electrode 5 is used for conducting the first carrier. It should be noted that an electrical insulation gap needs to be reserved between the second electrode 6 and the first electrode 5, and the electrical insulation gap is not less than the breakdown distance under normal operating voltage.
  • the second electrode 6 and the first electrode 5 can be fabricated by printing, deposition and other processes.
  • the first electrode 5 and the second electrode 6 may be metal electrodes.
  • the second region 2 of the backlight surface of the doped silicon substrate 1 realizes the collection and transmission of second carriers, and only the metal chalcogen compound deposited on the first region of the backlight surface of the silicon substrate 1
  • Layer 4 realizes the collection and transmission of the first carrier, and different substances located in different positions realize the collection and transmission of different carriers respectively, without additional alignment and electrical isolation, simple process, and low cost.
  • the area of the collection area improves the photoelectric conversion efficiency.
  • the second carrier collection terminal is directly connected to the second electrode 6, and the first carrier collection terminal is directly connected to the first electrode 5.
  • the carrier conduction energy levels of the two are close, and there is no contact barrier or only a small contact.
  • the potential barrier reduces the longitudinal contact resistance.
  • the second carrier collecting end, the first carrier collecting end and the metal oxychloride layer 4 will not cause a reverse pn junction due to mutual contact.
  • the structure and performance of the metal chalcogenide layer 4 are highly adjustable, which can achieve lower lateral conductivity and stronger longitudinal conductivity, and has better thermal stability and a wide process selection window.
  • FIG. 10 shows a schematic structural diagram of a tenth type of back-contact solar cell in an embodiment of the present invention.
  • the back contact solar cell may also include a silicon substrate 1, and the backlight surface of the silicon substrate 1 is divided into a first area and a second area 2.
  • the second region 2 of the silicon substrate 1 is doped to form a second carrier collection end.
  • the entire silicon substrate 1 is deposited with a metal chalcogenide layer 4 on the backlight surface.
  • the structure and performance are highly adjustable, which can achieve better performance. Low lateral conductivity and strong longitudinal conductivity, and good thermal stability, wide process selection window.
  • the portion of the metal chalcogenide layer 4 corresponding to the first region of the backlight surface of the silicon substrate 1 forms a first carrier collection end, which can realize the first carrier collection end. Collection and transmission.
  • the first electrode 5 is correspondingly arranged on the first carrier collecting end, and the longitudinal contact resistance is low.
  • the portion of the metal chalcogenide layer 4 corresponding to the second area of the backlight surface of the silicon substrate 1 has an opening for electrically dividing the metal chalcogenide layer 4, and the opening can completely cut off the metal.
  • the chalcogenide layer 4, or the metal chalcogenide layer 4 is partially cut off.
  • the opening is filled with a second carrier selection layer 22, and the second carrier selection layer 22 is used to transmit second carriers.
  • the second electrode 6 is correspondingly disposed on the second carrier selection layer 22. Furthermore, the second carrier is collected by the second electrode 6 via the second carrier selection layer 22.
  • the opening area is approximately equal to the second area, and may be larger or smaller than the second area.
  • the peripheral area of the second carrier selection layer 22 may be larger than the opening area. The openings can completely or partly break the metal chalcogenide layer 4.
  • the second electrode 6 and the first electrode 5 can also refer to the aforementioned related descriptions. In order to avoid repetition, the details will not be repeated here.
  • the second carrier is an electron.
  • the second carrier collection end is the electron gathering area.
  • the second carrier collection end is a doped structure, which can cause the n-type silicon substrate to bend downward in the energy band of the second region 2 to attract electrons to repel holes, and play a role of selective electron collection.
  • the metal chalcogenide layer 4 forms a first carrier collection end, and the first carrier collection end is a hole accumulation region.
  • the first carrier collection end appears as a hole-selective contact material, the conduction band energy level of the material is close to the valence band energy level of the n-type silicon substrate, and it can have negative interface charges or negative fixed defects, which can cause the interface at The energy band bends upwards to form an interface p-type layer, which acts to attract holes and repel electrons.
  • the portion of the metal chalcogenide layer 4 corresponding to the first region forms a first carrier collection end, and the first carrier collection end is a hole accumulation region.
  • the portion of the first carrier collection terminal corresponding to the first region in the metal chalcogenide layer is shown as a hole-selective contact material.
  • the conduction band energy level of the material is close to the valence band energy level of the n-type silicon substrate. Possessing interface negative charges or negative fixed defects can cause the energy band at the interface to bend upwards to form an interface p-type layer, which plays the role of attracting holes and repelling electrons.
  • the second carrier selection layer 22 due to the higher electron density in this part, the lower hole density, resulting in a lower energy level at the bottom of the conduction band of this part, and the conduction band of the second carrier collection end
  • the bottom energy level is close, so it is convenient for the transmission of electrons.
  • conduction band energy level and valence band energy level generally refer to the energy level of the material itself, that is, the energy level when the material exists alone, and do not refer to the actual energy level in the battery structure.
  • the second carrier collection end adopts a local doping selective contact structure
  • the metal chalcogenide layer 4 adopts a deposited selective contact structure.
  • the minority carrier has the advantages of low recombination in part of the body region, fewer diffusion steps, and relatively simple process.
  • the metal chalcogenide layer 4 has stronger selectivity and higher thermal stability. At the same time, the equipment requirements for the material deposition process are lower and the safety is higher.
  • the part of the metal chalcogenide layer 4 corresponding to the first region is used to form the first carrier collection end. Compared with the amorphous silicon material, it has stronger selectivity and vertical transmission ability. The transmission capacity is stronger.
  • At least the portion corresponding to the second region 2 of the continuous entire layer of the metal chalcogenide layer 4 has openings that electrically divide the metal chalcogenide layer 4, and the openings are filled with second carrier selection Layer 22, the second electrode 6 is arranged on the second carrier selection layer 22, which is equivalent to that the second carrier is exclusively transported through the second carrier selection layer 22, and the first carrier is mainly passed through the metal oxygen
  • the unperforated part of the group compound layer 4 transmits, which realizes the transmission of different substances to different carriers, without additional alignment and electrical isolation.
  • the process is simple, the area of the non-collection area is reduced, and the photoelectric conversion is improved. efficient.
  • the first carrier and the second carrier are respectively transmitted through different substances, and the second carrier selection layer 22 is more convenient for the second carrier transmission, and its carrier conduction level is similar to that of the second carrier.
  • Region 2 is closer, and the two contacts have no potential barrier or have a small potential barrier, which can reduce the longitudinal contact resistance.
  • the second carrier collecting end, the first carrier collecting end and the metal oxychloride layer 4 will not cause a reverse pn junction due to mutual contact.
  • the structure and performance of the metal chalcogenide layer 4 are highly adjustable, which can achieve lower lateral conductivity and stronger longitudinal conductivity, and has better thermal stability and a wide process selection window.
  • the projection of the second region 2 and the projection of the second carrier selection layer 22 at least partially overlap, thereby facilitating processing.
  • the second carrier selection layer 22 is located on the backlight surface or the light-facing surface of the metal chalcogenide layer 4.
  • the projection of the second region 2 and the projection of the second carrier selection layer 22 have a high degree of overlap.
  • the second carrier selection layer 22 is located on the back light surface of the metal chalcogenide layer 4.
  • the metal chalcogenide layer 4 may have a one-layer or multi-layer structure, as shown in FIG. 1, and the thickness d1 of the metal chalcogenide layer 4 is referred to the foregoing relevant description.
  • the projection area of the second carrier selection layer 22 on the backlight surface of the silicon substrate 1 accounts for 5% to 45% of the total area of the backlight surface of the silicon substrate 1. Under this area ratio, the transmission effect for the second carrier is good, and at the same time, the collection and transmission of the first carrier are not affected. It should be noted that the area of the second carrier selection layer 22 and the above-mentioned second region 2 are equal or different, which is not specifically limited.
  • FIG. 11 shows a schematic structural diagram of an eleventh type of back-contact solar cell in an embodiment of the present invention.
  • a tunnel isolation layer 3 is provided between the backlight surface of the silicon substrate 1 and the metal chalcogenide layer 4, and the thickness d2 of the tunnel isolation layer 3 is 0.1 nm-5 nm.
  • the opening can completely or partially disconnect the tunnel isolation layer 3 under the condition that the metal chalcogenide layer 4 is completely disconnected.
  • the materials of the tunnel isolation layer 3 refer to the aforementioned related descriptions.
  • a third transparent conductive film and/or a third work function are arranged between the second carrier selection layer and the second electrode Adjustment layer; that is, a third transparent conductive film, or a third work function adjustment layer, or both may be provided between the second carrier selection layer and the second electrode.
  • the third transparent conductive film and/or the third work function adjustment layer are both located in the projection portion of the second carrier selection layer. It should be noted that, in the case of both, the third transparent conductive film may be located on the backlight surface or the light-facing surface of the third work function adjustment layer.
  • the third transparent conductive film can all play the role of assisting carrier transmission, and transmit light, which can further improve the photoelectric conversion efficiency.
  • the third work function adjustment layer can all play a role in reducing contact resistance.
  • FIG. 12 shows a schematic structural diagram of a twelfth type of back-contact solar cell in an embodiment of the present invention.
  • FIG. 13 shows a schematic structural diagram of a thirteenth type of back-contact solar cell in an embodiment of the present invention.
  • the difference between FIG. 12 and FIG. 13 is that, in FIG. 13, a tunnel isolation layer 3 is provided between the backlight surface of the silicon substrate 1 and the metal oxychloride layer 4.
  • a first transparent conductive film 52 and a first work function adjusting layer 53 are provided between the first carrier collecting end and the first electrode 5.
  • the first transparent conductive film 52 is located on the light facing surface of the first work function adjusting layer 53.
  • a third transparent conductive film 65 and a third work function adjusting layer 64 are provided between the second carrier selection layer 22 and the second electrode 6.
  • the third transparent conductive film 65 is located on the backlight surface of the third work function adjustment layer 64.
  • the thickness d6 of the third work function adjustment layer 64 is 0.1-2 nm. This thickness range can reduce the contact resistance to a greater extent. This thickness range can reduce the contact resistance to a greater extent.
  • the third transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material.
  • the third transparent conductive film can not only play the role of assisting carrier transmission, but also transmit light, which can further improve the photoelectric conversion efficiency, and at the same time, can reduce the contact resistance or the longitudinal resistance.
  • the second electrode is provided on the backlight surface of the third transparent conductive film in the form of a grid line to make full use of The backlight surface transmits light, which can further improve the photoelectric conversion efficiency.
  • the material of the third transparent conductive film is selected from at least one of zinc oxide, aluminum-doped zinc oxide, tin oxide, indium-doped tin oxide, and indium-gallium-doped tin oxide.
  • the third transparent conductive film of the above-mentioned material has better carrier transport performance and can further improve the photoelectric conversion efficiency.
  • the work function of the third work function adjustment layer is 1eV-5.5eV, which can further reduce the contact resistance.
  • the material of the third work function adjustment layer and/or the work function adjustment material in the third transparent conductive film may be independently selected from: alkali metals, transition metals, alkali metal halides or transition metal halides At least one of them can further reduce the contact resistance.
  • the material of the third work function adjustment layer, and / or, a third transparent conductive thin film in regulating work function material may be independently selected from: Ca, Mg, Ba, LiF x, KFx, MgF x, BaCl x Wait. Among them, for x in the chemical formula, those skilled in the art can choose an appropriate value according to the actual situation.
  • the work function of the work function adjusting material in the third transparent conductive film is 1 eV-5.5 eV, which can further reduce the contact resistance.
  • the light-facing surface of the silicon substrate may also be provided with at least one of a passivation layer, a front field effect layer, a front anti-reflection film layer, a scattering structure layer, and a light-concentrating structure layer.
  • a passivation layer a front field effect layer
  • a front anti-reflection film layer a scattering structure layer
  • a light-concentrating structure layer a light-concentrating structure layer.
  • the second electrode is correspondingly disposed on the second carrier selection layer, in the backlight surface of the metal chalcogen compound layer and the backlight surface of the second carrier selection layer, the second electrode, the second electrode
  • the part other than the two electrodes is provided with an anti-reflection film on the backlight surface to achieve passivation and optical improvement.
  • 7 may be a front anti-reflection film layer
  • 8 may be a backlight surface anti-reflection film.
  • the second carrier selection layer has a one-layer or multi-layer structure
  • the thickness of the second carrier selection layer has nothing to do with the thickness of the metal chalcogenide layer
  • the thickness of the second carrier selection layer 22 may be slightly Higher than the height of the opening.
  • the thickness of the second carrier selection layer is 1-500 nm, and more preferably, the thickness of the second carrier selection layer is 2-60 nm.
  • the thickness of the second carrier selection layer 22 facilitates the transport of the first carriers.
  • the second carrier is selected from at least one of a crystalline silicon material with a work function greater than or equal to 3 eV, an amorphous silicon material with a function greater than or equal to 3 eV, or a second material.
  • the second material is a metal chalcogenide layer with a work function greater than or equal to 3 eV.
  • the second carrier selection layer of the above-mentioned material has a good effect on the collection and transmission of the second carrier.
  • the second carrier may be selected from: at least one of the first materials; the first material is an n-type metal oxychloride layer with a work function greater than or equal to 5 eV, or a p-type metal oxychloride layer with a work function less than or equal to 6 eV Floor.
  • the second carrier selection layer of the above-mentioned material has a good effect on the collection and transmission of the second carrier.
  • FIG. 14 shows a schematic structural diagram of a fourteenth type of back-contact solar cell in an embodiment of the present invention.
  • the second region 2 is doped to form a second carrier collection end.
  • the second carrier collection terminal can realize the collection and transmission of the second carrier.
  • the second region 2 and the second region in the silicon substrate 1 have the same doping type, but the doped elements may be the same or different.
  • the embodiment of the present invention does not specifically limit this.
  • the metal chalcogenide layer 4 is deposited on the backlight surface of the entire silicon substrate 1.
  • the structure and performance are highly adjustable, which can achieve lower The horizontal conductivity and the strong longitudinal conductivity, and the thermal stability is better, the process selection window is wide.
  • the metal chalcogenide layer 4 has a blocking structure 9 that electrically divides the metal chalcogenide layer 4 into a second carrier transport region and a first carrier collection end.
  • the number of blocking structures 9 is not specifically limited.
  • the first carrier collecting end is located in a part corresponding to the first area of the backlight surface of the silicon substrate 1, and the first carrier collecting end can realize the collection and transmission of the first carriers.
  • the second carrier transport area is located in a part corresponding to the second area of the backlight surface of the silicon substrate 1, and the second carrier transport area can realize the transport of the second carriers.
  • a first electrode 5 is correspondingly provided at the first carrier collection end, and the first electrode 5 is used to conduct the first carriers.
  • a second electrode 6 is correspondingly provided in the second carrier transport region, and the second electrode 6 is used for conducting the second carrier. It should be noted that an electrical insulation gap needs to be reserved between the first electrode 5 and the second electrode 6, and the electrical insulation gap gap is not less than the breakdown distance under normal operating voltage.
  • the first electrode 5 and the second electrode 6 can be fabricated by printing, deposition and other processes.
  • the second electrode 6 and the first electrode 5 may be metal electrodes.
  • the second carrier is an electron.
  • the second carrier collection end is the electron collection area.
  • the second carrier collection end is a doped structure, which can cause the n-type silicon substrate to bend downward in the energy band of the second region 2 to attract electrons to repel holes, and play a role of selective electron collection.
  • the first carrier collection end is the hole collection area.
  • the first carrier collection end appears as a hole-selective contact material, the conduction band energy level of the material is close to the valence band energy level of the n-type silicon substrate, and it can have negative interface charges or negative fixed defects, which can cause the interface at The energy band bends upwards to form an interface p-type layer, which acts to attract holes and repel electrons.
  • conduction band energy level and valence band energy level generally refer to the energy level of the material itself, that is, the energy level when the material exists alone, and do not refer to the actual energy level in the battery structure.
  • the silicon substrate 1 is an n-type silicon substrate
  • the first carrier is a hole
  • the second carrier is an electron.
  • the two parts electrically divided by the blocking structure 9 can respectively realize the collection of holes and the transmission of electrons.
  • the material can be adjusted to lower the crystallinity, crystal phase and doping elements. Due to the electrical division of the blocking structure 9 between the holes in the first carrier collection terminal and the electrons in the second carrier transport region, different types of carriers are collected and transported longitudinally into the corresponding electrode. There will be no leakage or short circuit due to mutual communication due to lateral transmission, so different types of carrier collection terminals do not need to be electrically isolated, and no reverse pn junction will be generated due to mutual contact.
  • the second carrier collection end adopts a local doping selective contact structure
  • the metal chalcogenide layer 4 adopts a deposited selective contact structure.
  • the metal chalcogenide layer 4 has a body region recombination structure.
  • the metal chalcogenide layer 4 has stronger selectivity and higher thermal stability.
  • the material deposition process equipment requirements Lower, higher security.
  • the metal oxygen group compound layer 4 can fully cover the back of the battery, which further simplifies the process flow.
  • the portion of the metal chalcogenide layer 4 corresponding to the first region is used to form the first carrier collection end.
  • the amorphous silicon material it has stronger selectivity and vertical transmission ability. Stronger carrier collection and vertical transmission capabilities, lower contact resistance can be achieved; at the same time, at the second carrier collection end, in conjunction with the local doped structure, the second carrier transmission is transmitted through the edge of the oxide material. , Does not involve a cross-level tunneling mechanism, the second carrier transport is less obstructed, and lower contact resistance can be achieved.
  • the blocking structure is a slot; and/or, the blocking structure is an insulator.
  • the blocking structure of the above form not only has a good blocking effect, but also has a simple implementation process.
  • the insulator can be provided by ion implantation.
  • the thickness of the blocking structure is greater than or equal to the thickness of the metal chalcogenide layer, so that the electrical blocking effect is good.
  • the thickness of the blocking structure 9 is equal to the thickness of the metal chalcogenide layer 4.
  • the blocking structure protrudes toward the backlight surface of the metal chalcogenide layer.
  • the thickness of the blocking structure 9 is greater than the thickness of the metal chalcogenide layer 4, and the blocking structure 9 protrudes toward the backlight surface of the metal chalcogenide layer 4.
  • FIG. 16 shows a schematic structural diagram of a sixteenth type of back-contact solar cell in an embodiment of the present invention.
  • 7 can be a front anti-reflection film layer
  • 8 can be a back anti-reflection film.
  • FIG. 17 shows a schematic structural diagram of a seventeenth type of back contact solar cell in an embodiment of the present invention.
  • a tunnel isolation layer 3 is provided between the backlight surface of the silicon substrate 1 and the metal oxychloride layer 4, and the thickness of the tunnel isolation layer 3 is 0.1 nm-5 nm.
  • the materials of the tunnel isolation layer 3 refer to the aforementioned related descriptions.
  • a fourth transparent conductive film and/or a fourth work function adjustment layer are arranged between the second carrier transport region and the second electrode. That is, a fourth transparent conductive film, or a fourth work function adjustment layer, or both may be provided between the second carrier transport region and the second electrode.
  • the fourth transparent conductive film and/or the fourth work function adjusting layer are both located in the projection area of the second carrier transport area. It should be noted that, in the case of both, the fourth transparent conductive film may be located on the backlight surface or the light-facing surface of the fourth work function adjustment layer.
  • the projection of the second electrode may be located within the projection of the fourth transparent conductive film and/or the fourth work function adjustment layer.
  • the fourth transparent conductive film can play a role in assisting carrier transmission, and is light-transmissive, which can further improve the photoelectric conversion efficiency.
  • the fourth work function adjustment layer plays a role in reducing contact resistance.
  • FIG. 18 shows a schematic structural diagram of an eighteenth type of back-contact solar cell in an embodiment of the present invention.
  • a fourth transparent conductive film 67 and a fourth work function adjusting layer 66 are provided between the second carrier transport region and the second electrode 6.
  • the fourth transparent conductive film 67 is located on the backlight surface of the fourth work function adjustment layer 66.
  • a first transparent conductive film 52 and a first work function adjusting layer 53 are provided between the first carrier collecting end and the first electrode 5.
  • the first transparent conductive film 52 is located on the backlight surface of the first work function adjustment layer 53.
  • the thickness d7 of the fourth transparent conductive film 67 is 0.1-2 nm, and the thickness range can reduce the contact resistance to a greater extent.
  • the fourth transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material.
  • the first transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material. That is, the first transparent conductive film and the fourth transparent conductive film can not only play the role of assisting carrier transport, but also transmit light, which can further improve the photoelectric conversion efficiency, and at the same time, can reduce the contact resistance or the longitudinal resistance.
  • the second electrode is provided on the back light surface of the fourth transparent conductive film in the form of a grid line, which makes full use of The back side transmits light, which can further improve the photoelectric conversion efficiency.
  • the first electrode is provided on the backlight surface of the first transparent conductive film in the form of a grid line to make full use of The back side transmits light, which can further improve the photoelectric conversion efficiency.
  • the material of the fourth transparent conductive film is selected from at least one of zinc oxide, aluminum-doped zinc oxide, tin oxide, indium-doped tin oxide, and indium-gallium-doped tin oxide.
  • the fourth transparent conductive film of the above-mentioned material has better carrier transport performance and can further improve the photoelectric conversion efficiency.
  • the work function of the fourth work function adjustment layer is 1eV-5.5eV, which can further reduce the contact resistance.
  • the material of the fourth work function adjustment layer and the work function adjustment material in the fourth transparent conductive film can be independently selected from: at least one of alkali metals, transition metals, alkali metal halides or transition metal halides , Can further reduce the contact resistance.
  • the fourth work function regulating material layer, the fourth transparent conductive thin film in regulating work function material may be independently selected from: Ca, Mg, Ba, LiF x, KFx, MgF x, BaCl x and the like. Among them, for x in the chemical formula, those skilled in the art can choose an appropriate value according to the actual situation.
  • the material of the fourth work function adjustment layer and/or the work function of the work function adjustment material in the fourth transparent conductive film is 1 eV-5.5 eV, which can further reduce the contact resistance.
  • FIG. 19 shows a schematic structural diagram of a nineteenth type of back-contact solar cell in an embodiment of the present invention.
  • a second carrier selective collection layer 23 is deposited on the second area of the backlight surface of the silicon substrate 1.
  • the second carrier selective collection layer 23 can realize the collection and transmission of the second carrier.
  • a metal chalcogenide layer 4 is deposited on the common backlight surface of the silicon substrate 1 and the second carrier selective collection layer 23.
  • the metal chalcogenide layer 4 is highly adjustable in structure and performance, can achieve lower lateral conductivity and stronger longitudinal conductivity, and has better thermal stability and a wide process selection window.
  • the portion of the metal chalcogenide layer 4 corresponding to the second carrier selective collection layer 23 forms a second carrier transport region, which can realize the transport of the second carrier.
  • the portion of the metal chalcogenide layer 4 corresponding to the first region of the silicon substrate 1 forms a first carrier collection end, which can realize the collection and transmission of the first carrier.
  • the projection area of the second carrier selective collection layer 23 on the backlight surface of the silicon substrate 1 occupies 5% to 45% of the total area of the backlight surface of the silicon substrate. Under this area ratio, the second carrier The collection and transmission of current carriers are effective without affecting the collection and transmission of the first carriers.
  • the top view of the second carrier selective collection layer 23 may be a dotted or linear pattern, such as a circle or an ellipse. Linear patterns such as rectangles or polygons.
  • the top view of the second carrier selective collection layer 23 is a dotted or linear pattern, and the deposition process for the second carrier selective collection layer 23 is simple.
  • a first electrode 5 is correspondingly provided on the backlight surface of the first carrier collection end in the metal chalcogenide layer 4, and the first electrode 5 is used for conducting the first carrier.
  • a second electrode 6 is correspondingly arranged on the second carrier transport region, and the second electrode 6 is used to conduct the first carriers. It should be noted that an electrical insulation gap needs to be reserved between the first electrode 5 and the second electrode 6, and the electrical insulation gap gap is not less than the breakdown distance under normal operating voltage.
  • the first electrode 5 and the second electrode 6 can be fabricated by printing, deposition and other processes.
  • the second electrode 6 and the first electrode 5 may be metal electrodes.
  • the silicon substrate 1 is an n-type silicon substrate
  • the second carrier is an electron
  • the first carrier is a hole.
  • the second carrier selective collection layer 23 is the electron collection terminal.
  • the second carrier selective collection layer is a deposition structure, and its conduction band energy level is close to that of the silicon material, which can cause the n-type silicon substrate to bend downward in the energy band of the second carrier selective collection layer 23. Attracting electrons and repelling holes, plays the role of selective electron collection.
  • the portion of the metal chalcogenide layer 4 corresponding to the first region of the silicon substrate 1 forms a first carrier collecting end, and the first carrier collecting end is the hole collecting end.
  • the first carrier collection end appears as a hole-selective contact material, the conduction band energy level of the material is close to the valence band energy level of the n-type silicon substrate, and it can have negative interface charges or negative fixed defects, which can cause the interface at The energy band bends upwards to form an interface p-type layer, which acts to attract holes and repel electrons.
  • conduction band energy level and valence band energy level in the present invention generally refer to the energy level of the material itself, that is, the energy level when the material exists alone, and does not refer to the actual energy level in the battery structure.
  • the conduction band bottom energy level of the second carrier selective collection layer 23 is located between the conduction band energy level of the silicon substrate 1 and the conduction band energy level of the metal chalcogenide layer 4 Therefore, the electrons in the silicon substrate 1 can directly enter the second carrier selective collection layer 23 and then enter the second carrier transport region corresponding to the second carrier selective collection layer 23 in the metal chalcogenide layer 4 , So as to realize the transmission of electrons.
  • the metal chalcogenide layer 4 can simultaneously realize the collection of holes and the transport of electrons. At the same time, in the metal chalcogenide layer 4, at the interface between the second carrier transport region and the first carrier collection end, There are high-resistance defects, and insulation can be achieved. After different types of carriers are collected, they are transmitted longitudinally into the corresponding electrodes without leakage or short circuit. Therefore, different types of carrier collection terminals do not require additional electrical isolation and will not Reverse pn junctions are created due to mutual contact.
  • the second carrier selective collection layer adopts a deposition selective contact structure
  • the metal chalcogenide layer 4 also adopts a deposited selective contact structure.
  • the second carrier selective collection layer and the metal oxygen group compound layer are formed by deposition methods without high temperature.
  • the metal chalcogenide layer 4 has stronger selectivity and higher thermal stability. At the same time, the material deposition process equipment requirements are lower and the safety is higher.
  • the metal oxygen group compound layer 4 can fully cover the back of the battery, which further simplifies the process flow.
  • the part of the metal chalcogenide layer 4 corresponding to the first region of the silicon substrate 1 is used to form the first carrier collection end, which has stronger selectivity and vertical transport ability than amorphous silicon materials. The collection and vertical transmission capabilities are stronger.
  • FIG. 20 shows a schematic structural diagram of a twentieth type of back-contact solar cell in an embodiment of the present invention.
  • a blocking structure 9 is provided between the second carrier transport region and the first carrier collection end.
  • the blocking structure 9 electrically divides the second carrier transport region and the first carrier collection end of the metal chalcogenide layer, thereby improving the conductivity of the metal chalcogenide in the undivided area, which can be very Reduce the longitudinal series resistance to a large extent.
  • the second carrier transport area and the first carrier collection terminal are electrically divided. After different types of carriers are collected, they will be transported longitudinally into the corresponding electrode, and will not be connected to each other due to lateral transport and cause leakage. Or short-circuit, so there is no need for additional alignment and electrical isolation, the process is simple, the recombination is reduced, and the photoelectric conversion efficiency is improved.
  • the blocking structure is a slot; and/or, the blocking structure is a high-resistance body, and the resistivity of the high-resistance body is more than 100 times the resistivity of the metal chalcogenide layer 4.
  • the insulation effect is good, and on the other hand, the realization process is simple.
  • the light-facing surface of the silicon substrate may also be provided with at least one of a passivation layer, a front field effect layer, a front anti-reflection film layer, a scattering structure layer, and a light-concentrating structure layer. And/or, in the backlight surface of both the metal chalcogenide layer and the second carrier transport region, the area outside the first electrode and the second electrode is provided with a back anti-reflection film to achieve passivation and optical improvement Wait.
  • FIG. 21 shows a schematic structural diagram of a twenty-first type of back-contact solar cell in an embodiment of the present invention.
  • 7 may be a front anti-reflection film layer
  • 8 may be a back anti-reflection film.
  • the thickness d8 of the second carrier selective collection layer 23 is 1-500 nm, and more preferably, d8 is 2-60 nm.
  • the second carrier selective collection layer 23 of this thickness facilitates the collection and transmission of second carriers.
  • the second carrier when the silicon substrate is an n-type silicon substrate and the second carrier is multiple carriers, or when the silicon substrate is a p-type silicon substrate and the second carrier is a minority carrier, the second carrier
  • the material of the collection layer is selected from at least one of a crystalline silicon material with a work function greater than or equal to 3 eV, an amorphous silicon material with a function greater than or equal to 3 eV, or a second material.
  • the second material is a metal oxygen group compound with a work function greater than or equal to 3 eV.
  • the second carrier selective collection layer of the above-mentioned material has a good effect on the collection and transmission of the second carrier.
  • the second carrier may be selected from: at least one of the first materials; the first material is an n-type metal oxygen compound with a work function greater than or equal to 5 eV, or a p-type metal oxygen compound with a work function less than or equal to 6 eV .
  • the second carrier selective collection layer of the above-mentioned material has a good effect on the collection and transmission of the second carrier.
  • a tunnel isolation layer is provided between the backlight surface of the silicon substrate and the common light-facing surface of the metal chalcogenide layer and the second carrier selective collection layer.
  • the tunnel isolation layer For the material, thickness, function, etc. of the tunnel isolation layer, reference may be made to the foregoing description.
  • FIG. 22 shows a schematic structural diagram of a twenty-second type of back contact solar cell in an embodiment of the present invention.
  • a tunnel isolation layer 3 is provided between the backlight surface of the silicon substrate 1 and the common light-facing surface of the metal chalcogenide layer 4 and the second carrier selective collection layer 23.
  • a fifth transparent conductive film and/or a fifth work function adjusting layer are arranged between the second electrode and the second carrier selective collection layer. That is, a fifth transparent conductive film, or a fifth work function adjusting layer, or both may be provided between the second electrode and the second carrier selective collection layer.
  • the fifth transparent conductive film and/or the fifth work function adjusting layer are both located in the projection area of the second carrier selective collection layer. It should be noted that, in the case of both, the fifth transparent conductive film may be located on the backlight surface or the light-facing surface of the fifth work function adjustment layer.
  • the projection of the second electrode may be within the projection of the fifth transparent conductive film and/or the fifth work function adjustment layer.
  • a first transparent conductive film and/or a first work function adjusting layer are arranged between the first carrier collecting end and the first electrode. That is, a first transparent conductive film, or a first work function adjustment layer, or both may be provided between the first carrier collection terminal and the first electrode.
  • the first transparent conductive film and/or the first work function adjusting layer are both located in the projection area of the first carrier collecting end and the first electrode. It should be noted that, in the case of both, the first transparent conductive film may be located on the backlight surface or the light-facing surface of the first work function adjustment layer.
  • the projection of the first electrode may be within the projection of the first transparent conductive film and/or the first work function adjustment layer.
  • the above-mentioned fifth transparent conductive film and the first transparent conductive film can play a role in assisting carrier transport, and transmit light, which can further improve the photoelectric conversion efficiency.
  • the first work function adjustment layer and the fifth work function adjustment layer play a role in reducing contact resistance.
  • FIG. 23 shows a schematic diagram of the structure of the twenty-third type of back-contact solar cells in the embodiment of the present invention.
  • a fifth transparent conductive film 69 and a fifth work function adjusting layer 68 are provided between the second carrier selective collection layer 23 and the second electrode 6.
  • the fifth transparent conductive film 69 is located on the light facing surface of the fifth work function adjusting layer 68.
  • a first transparent conductive film 52 and a first work function adjusting layer 53 are provided between the first carrier collecting end and the first electrode 5.
  • the first transparent conductive film 52 is located on the backlight surface of the first work function adjustment layer 53.
  • the thickness d9 of the fifth work function adjusting layer 68 is 0.1-2 nm. This thickness range can reduce the contact resistance to a greater extent.
  • the fifth transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material.
  • the first transparent conductive film is formed by combining or mixing a transparent conductive material and a work function adjusting material. That is, the fifth transparent conductive film and the first transparent conductive film can not only play the role of assisting carrier transmission, but also transmit light, which can further improve the photoelectric conversion efficiency, and at the same time, can reduce the contact resistance or the longitudinal resistance.
  • the second electrode is provided on the backlight surface of the fifth transparent conductive film in the form of a grid line. Using the back light to transmit light can further improve the photoelectric conversion efficiency.
  • the first electrode is provided on the backlight surface of the first transparent conductive film in the form of a grid line to make full use of The back side transmits light, which can further improve the photoelectric conversion efficiency.
  • the material of the fifth transparent conductive film is selected from at least one of zinc oxide, aluminum-doped zinc oxide, tin oxide, indium-doped tin oxide, and indium-gallium-doped tin oxide.
  • the fifth transparent conductive film of the above-mentioned material has better carrier transport performance and can further improve the photoelectric conversion efficiency.
  • the work function of the fifth work function adjustment layer is 1eV-5.5eV, which can further reduce the contact resistance.
  • the work function adjusting material in the fifth work function adjusting layer and the fifth transparent conductive film may be independently selected from at least one of alkali metals, transition metals, alkali metal halides, or transition metal halides, and Further reduce the contact resistance.
  • the fifth work function adjustment layer, a fifth transparent conductive film in regulating work function material may be independently selected from: Ca, Mg, Ba, LiF x, KFx, MgF x, BaCl x and the like. Among them, for x in the chemical formula, those skilled in the art can choose an appropriate value according to the actual situation.
  • the work function of the work function adjusting material in the fifth transparent conductive film is 1 eV-5.5 eV, which can further reduce the contact resistance.
  • the embodiment of the present invention also provides a method for producing a back contact solar cell.
  • the method includes the following steps:
  • Step S1 providing a silicon substrate; the backlight surface of the silicon substrate is divided into a first area and a second area.
  • Step S2 at least depositing a metal chalcogenide layer on the first area of the silicon substrate; the area corresponding to the metal chalcogenide layer and the first area forms a first carrier collecting end.
  • step S3 a first electrode is correspondingly arranged on the first carrier collection end; the area of the metal chalcogenide layer corresponding to the second area forms a second carrier transport area.
  • Step S4 correspondingly disposing a second electrode in an area corresponding to the second area.
  • the method may further include: doping the silicon substrate in the second region to form a second carrier collection end.
  • Step S2 may include: depositing a metal chalcogenide layer on the entire backlight surface of the silicon substrate; and a region of the metal chalcogenide layer corresponding to the second region forms a second carrier transport region.
  • Step S4 includes: correspondingly disposing the second electrode on the second carrier transport region.
  • the silicon substrate the second carrier collection terminal, the first carrier collection terminal, the second carrier transport region, the second electrode, and the first electrode in each step of the method, please refer to the aforementioned related records, and can To achieve the same or similar beneficial effects, in order to avoid repetition, details are not repeated here.
  • the embodiment of the present invention also provides a back contact battery assembly, including any of the aforementioned back contact solar cells.
  • the silicon substrate, the second carrier collection terminal, the first carrier collection terminal, the second carrier transport area, the second electrode, and the first electrode in the component can be specifically referred to the aforementioned related records, and can achieve the same or Similar beneficial effects are not repeated here in order to avoid repetition.

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Abstract

背接触太阳电池及生产方法、背接触电池组件,涉及光伏技术领域。背接触太阳电池包括硅基底(1),硅基底(1)的背光面分为第一区域和第二区域(2);第二区域(2)经掺杂形成第二载流子收集端;金属氧族化合物层(4),至少沉积于硅基底(1)的第一区域;金属氧族化合物层(4)与第一区域对应的区域形成第一载流子收集端;第一电极(5),对应设置在第一载流子收集端上;第二电极(6),对应设置在第二区域(2)对应的区域上。通过第一载流子收集端实现了第一载流子的收集和传输。金属氧族化合物层(4)结构与性能可调性强,热稳定性较好,工艺选择窗口宽,同时,可实现较低的横向传导能力和较强的纵向传导能力。

Description

背接触太阳电池及生产方法、背接触电池组件
本申请要求在2020年6月15日提交中国专利局、申请号为202010544465.9、发明名称为“背接触太阳电池及生产方法、背接触电池组件”、在2020年6月15日提交中国专利局、申请号为202021106709.7、发明名称为“IBC电池及IBC组件”、在2020年6月15日提交中国专利局、申请号为202021108338.6、发明名称为“全背电极太阳电池及全背电极电池组件”,以及在2020年6月15日提交中国专利局、申请号为202021101871.X、发明名称为“太阳电池及光伏组件”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本发明涉及光伏技术领域,特别是涉及一种背接触太阳电池及生产方法、背接触电池组件。
背景技术
背接触太阳电池由于向光面完全无电极遮挡,可以实现较高的光电转换效率,因此应用广泛。
目前,背接触太阳电池通常需要在硅基底的背光面制作对位准确、且相互电学隔离的不同导电类型区域。
但是,制作对位准确、且相互电学隔离的不同导电类型区域,导致工艺稳定性差。
发明内容
本发明提供一种背接触太阳电池及生产方法、背接触电池组件,旨在解决工艺稳定性差的问题。
根据本发明的第一方面,提供了一种背接触太阳电池,包括:硅基底,所述硅基底的背光面分为第一区域和第二区域;金属氧族化合物层,至少沉积于所述硅基底的所述第一区域;所述金属氧族化合物层与所述第一区域对应的区域形成第一载流子收集端;第一电极,对应设置在所述第一载流子收集端上;第二电极,对应设置在所述第二区域对应的区域内。
金属氧族化合物层在靠近第一区域的界面处导带能级与第一区域的第一载流子的传导能级接近,可以起到吸收第一载流子排斥第二载流子的作用,进而金属氧族化合物层与第一区域对应的区域形成了第一载流子收集端,通过第一载流子收集端实现了第一载流子的收集和传输。金属氧族化合物层结构与性能可调性强,热稳定性较好,工艺选择窗口宽,同时,可实现较低的横向传导能力和较强的纵向传导能力。
可选的,所述第二区域的硅基底经掺杂形成第二载流子收集端;所述金属氧族化合物层,沉积于整个所述硅基底的背光面上;所述金属氧族化合物层与所述第二区域对应的区域形成第二载流子传输区;所述第二电极,对应设置在所述第二载流子传输区上。
本发明实施方式中,第二载流子收集端是经硅基底的背光面的第二区域掺杂形成,可以吸收第二载流子排斥第一载流子,起到第二载流子选择性作用,进而在第二载流子收集端,第二载流子密度较高,第一载流子密度较低。而连续整层的金属氧族化合物层在靠近第一区域的界面处载流子传导能级与第一区域的第一载流子的传导能级接近,可以起到吸收第一载流子排斥第二载流子的作用,进而金属氧族化合物层与第一区域对应的区域形成了第一载流子收集端,通过第一载流子收集端实现了第一载流子的收集和传输。第二载流子收集端由于第二载流子密度高,第一载流子密度低,金属氧族化合物层载流子传导能级与第二区域对应的第二载流子的传导能级接近,因此,第二载流子收集端的第二载流子可以直接进入金属氧族化合物层与第二区域对应的区域,进而,金属氧族化合物层与第二区域对应的区域作为第二载流子传输区,实现了第二载流子的收集和传输。也就是说,金属氧族化合物层中,与第一区域对应的区域实现了对第一载流子的收集和传输,而与第二区域对应的区域实现了对第二载流子的收集和传输,即,金属氧族化合物层的不同区域分别实现了第二载流子传输和第一载流子的收集,同时,金属氧族化合物层具有较低的横向传输能力,不同类型载流子被收集后均纵向传输进入相应电极,不会因为横向传输而互相连通导致漏电或短路,因此不需要额外的对位和电学隔离,工艺简单,降低了复合,提升了光电转换效率。同时,第二载流子收集端、第一载流子收集端与金属氧族化合物层,不会因为相互接触而产生反向pn结。
可选的,所述第二区域的硅基底经掺杂形成第二载流子收集端;所述金属氧族化合 物层只沉积在所述第一区域上;所述第二电极对应设置在所述第二载流子收集端上;
或,
所述金属氧族化合物层,沉积于整个所述硅基底的背光面上;所述金属氧族化合物层中至少与所述第二区域对应的部分具有电学分割所述金属氧族化合物层的开孔;所述金属氧族化合物层第二区域对应的部分上形成有第二载流子选择层,所述第二载流子选择层填充在所述开孔中;所述第二电极对应设置在所述第二载流子选择层上。
本发明实施方式中,第二载流子收集端是经硅基底的背光面的第二区域掺杂形成,可以吸收第二载流子排斥第一载流子,起到第二载流子选择性作用,进而在第二载流子收集端第二载流子密度较高,第一载流子密度较低。金属氧族化合物层作为第一载流子收集端仅沉积在硅基底的背光面的第一区域上,其载流子传导能级与第一区域的第一载流子的传导能级接近,可以起到吸收第一载流子排斥第二载流子的作用,通过第一载流子收集端实现了第一载流子的收集和传输。第一电极对应设置在第一载流子收集端上,第二电极对应设置在第二载流子收集端上,即,掺杂后的硅基底的背光面的第二区域实现了对第二载流子的收集和传输,仅沉积在硅基底的背光面的第一区域的金属氧族化合物层实现了对第一载流子的收集和传输,位于不同位置的不同的物质分别实现了对不同载流子的收集和传输,不需要额外的对位和电学隔离,工艺简单,降低无收集区域面积,提升了光电转换效率。同时,各个载流子收集区域收集或传导材料的载流子传导能级与硅材料中对应载流子的传输能级接近,传输界面无势垒或低势垒,降低了纵向接触电阻。或者,在第二载流子收集端吸收第二载流子排斥第一载流子,起到第二载流子选择性作用的基础上,连续整层的金属氧族化合物层在靠近第一区域的界面处载流子传导能级与第一区域的第一载流子的传导能级接近,可以起到吸收第一载流子排斥第二载流子的作用,进而金属氧族化合物层与第一区域对应的部分形成了第一载流子收集端,通过第一载流子收集端实现了第一载流子的收集和传输。而连续整层的金属氧族化合物层中至少与第二区域对应的部分,具有电学分割上述金属氧族化合物层的开孔,开孔中填充有第二载流子选择层,第二电极设置在第二载流子选择层上,相当于,第二载流子通过第二载流子选择层专门进行传输,而第一载流子主要通过金属氧族化合物层中未开孔的部分传输,实现了不同的物质分别对不同载流子的传输,不需要额外的对位和电学隔离,工艺简单,降低无收集区域面积,提升了光电转换效率。同时,第一载流子和第二载流子分别通过不同物质实现传输,且,第二载流子选择层更便于第二载流子的传输,可以降低纵向接触电阻。同时,第二载流子收集端、第一载流子收集端与金属氧族化合物层,不会因为相互接触而产生反向pn结。
可选的,所述第二区域的硅基底经掺杂形成第二载流子收集端;所述金属氧族化合物层,沉积于整个所述硅基底的背光面上;在所述金属氧族化合物层中,具有将所述金属氧族化合物层电学分割为第二载流子传输区和所述第一载流子收集端的阻断结构;其中,所述第二载流子传输区对应所述第二区域;所述第二电极,对应设置在所述第二载流子传输区上。
本发明实施方式中,第二载流子收集端是经硅基底的背光面的第二区域掺杂形成,可以吸收第二载流子排斥第一载流子,起到第二载流子选择性作用,进而在第二载流子收集端,第二载流子密度较高,第一载流子密度较低。阻断结构将金属氧族化合物层电学分割为第二载流子传输区和第一载流子收集端,第一载流子收集端在靠近第一区域的界面处载流子传导能级与第一区域的第一载流子的传导能级接近,可以起到吸收第一载流子排斥第二载流子的作用。第二载流子收集端由于第二载流子密度高,第一载流子密度低,第二载流子传输区载流子传导能级与第二区域对应的第二载流子的传导能级接近,因此,第二载流子收集端的第二载流子可以直接进入第二载流子传输区,实现了第二载流子的收集和传输。同时,通过阻断结构对第二载流子传输区和第一载流子收集端进行分割,使得整个金属氧族化合物层的横向传输能力很低,从而可以提高金属氧族化合物层的纵向传导能力且避免横向漏电,进而可以从很大程度上减少纵向串联电阻。且通过阻断结构对第二载流子传输区和第一载流子收集端进行分割,不同类型载流子被收集后均纵向传输进入相应电极,不会因为横向传输而互相连通导致漏电或短路,因此不需要精准的掺杂对位,工艺简单,降低了复合,提升了光电转换效率。同时,第二载流子收集端、第一载流子收集端与金属氧族化合物层,不会因为相互接触而产生反向pn结。
可选的,所述背接触太阳电池还包括:第二载流子选择收集层;所述第二载流子选择收集层沉积于所述硅基底的所述第二区域上;所述金属氧族化合物层沉积于所述第一区域上以及所述第二载流子选择收集层的背光面上;所述金属氧族化合物层中对应所述第二载流子选择收集层的部分形成第二载流子传输区;所述第二电极,对应设置在所述第二载流子传输区上。
本发明实施方式中,第二载流子选择收集层沉积在硅基底的背光面的第二区域上,无需高温扩散,工艺温度低。第二载流子选择收集层载流子传导能级与硅基底的第二载流子传导能级接近,可以吸收第二载流子排斥第一载流子,起到第二载流子选择性作用。 金属氧族化合物层在第二载流子选择收集层之外的区域的界面处载流子传导能级与硅基底的背光面上第一区域的第一载流子的传导能级接近,可以起到吸收第一载流子排斥第二载流子的作用,进而金属氧族化合物层中第二载流子传输区之外的区域形成了第一载流子收集端,通过第一载流子收集端实现了第一载流子的收集和传输。也就是说,与第二载流子选择收集层对应的金属氧族化合物层区域实现了对第二载流子的传输,之外的金属氧族化合物层区域实现了对第一载流子的收集和传输,即,金属氧族化合物层的不同区域分别实现了第二载流子传输和第一载流子的收集,同时,金属氧族化合物层中,第二载流子传输区和第一载流子收集端的界面处,存在高阻缺陷,可以实现绝缘,不会产生漏电或短路,因此不需要额外的对位和电学隔离,工艺简单,降低了复合,提升了光电转换效率。第二载流子选择收集层采用沉积选择性接触结构,金属氧族化合物层也采用沉积的选择性接触结构,具有体区复合低的优点,不受俄歇复合极限的限制。同时,第二载流子选择收集层、第一载流子收集端,不会因为相互接触而产生反向pn结。
根据本发明的第二方面,提供了一种背接触太阳电池的生产方法,包括:
提供硅基底;所述硅基底的背光面分为第一区域和第二区域;
至少在所述硅基底的所述第一区域沉积得到金属氧族化合物层;所述金属氧族化合物层与所述第一区域对应的区域形成第一载流子收集端;
在所述第一载流子收集端上对应设置第一电极;
在所述第二区域对应的区域内对应设置第二电极。
根据本发明的第三方面,提供了一种背接触电池组件,包括:任一前述的背接触太阳电池。
上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段,而可依照说明书的内容予以实施,并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂,以下特举本发明的具体实施方式。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1-23分别示出了本发明实施方式中的第一种至第二十三种背接触太阳电池的结构示意图。
附图编号说明:
1-硅基底,2-第二区域,3-隧穿隔离层,4-金属氧族化合物层,22-第二载流子选择层,23-第二载流子选择收集层,5-第一电极,6-第二电极,52-第一透明导电薄膜,53-第一功函数调节层,63-第二透明导电薄膜,62-第二功函数调节层,64-第三功函数调节层,65-第三透明导电薄膜,66-第四功函数调节层,67-第四透明导电薄膜,68-第五功函数调节层,69-第五透明导电薄膜,7-正面减反射薄膜层,8-背面钝化膜或背光面减反射膜,9-阻断结构。
具体实施例
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
在本发明实施方式中,参照图1所示,图1示出了本发明实施方式中的第一种背接触太阳电池的结构示意图。该背接触太阳电池包括:硅基底1,硅基底1的背光面分为第一区域和第二区域2。其中图1中,硅基底1的背光面除了第二区域2之外的区域为第一区域。
金属氧族化合物层4至少沉积于硅基底1的第一区域,需要说明的是,硅基底1的第二区域2是否沉积金属氧族化合物层4不作具体限定。例如,图1所示的背接触太阳电池中,硅基底1的第二区域2没有沉积有金属氧族化合物层4。
金属氧族化合物层4与硅基底1的背光面的第一区域对应的区域形成第一载流子收集端,第一载流子收集端可以实现对第一载流子的收集和传输。
可以理解的是,在背接触太阳电池中,只存在两个载流子。故所述第一载流子选自多子或少子中的一个,第二载流子则为多子或少子中的另一个。也即当第一载流子为多子时,则第二载流子必为少子;当第二载流子为多子时,则第一载流子必为少子;需要说明的是,在本发明中,多子、少子具体是电子还是空穴,主要根据硅基底1的掺杂类 型决定。若硅基底1的掺杂类型为n型,则,在本发明的背接触太阳电池中多子即指电子,少子即指空穴。若硅基底1的掺杂类型为p型,则,本发明的背接触太阳电池中多子即指空穴,少子即指电子。
在金属氧族化合物层4中第一载流子收集端对应设置有第一电极5,第一电极5用于传导第一载流子。第二电极6对应设置在第二区域2对应的区域内,第二电极6用于传导第二载流子。需要说明的是,第一电极5和第二电极6之间需要保留电气绝缘间隙,电气绝缘间隙不小于正常工作电压下的击穿距离。第一电极5和第二电极6可采用印刷、沉积等工艺制作。第二电极6和第一电极5可以为金属电极。
金属氧族化合物层4在靠近第一区域的界面处导带能级与第一区域的第一载流子的传导能级接近,可以起到吸收第一载流子排斥第二载流子的作用,进而金属氧族化合物层4与第一区域对应的区域形成了第一载流子收集端,通过第一载流子收集端实现了第一载流子的收集和传输。金属氧族化合物层4结构与性能可调性强,热稳定性较好,工艺选择窗口宽,同时,可实现较低的横向传导能力和较强的纵向传导能力。
可选的,参照图2所示,图2示出了本发明实施方式中的第二种背接触太阳电池的结构示意图。整个硅基底1的背光面沉积有金属氧族化合物层4,相对于在整个硅基底1的背光面沉积其它材料层而言,结构与性能可调性强,可实现较低的横向传导能力和较强的纵向传导能力,且热稳定性较好,工艺选择窗口宽。
图2中,金属氧族化合物层4与硅基底1的背光面的第二区域对应的区域形成第二载流子传输区,第二载流子传输区可以实现对第二载流子的传输。在金属氧族化合物层4中第二载流子传输区对应设置有第二电极6,第二电极6用于传导第二载流子。
可选的,上述第二区域2经掺杂形成第二载流子收集端。第二载流子收集端可以实现对第二载流子的收集和传输。需要说明的是第二区域2和硅基底1中第二区域本身的掺杂类型相同或不同;在掺杂类型相同的情况下,掺杂的元素可以相同或不同,本发明实施方式,对此不作具体限定。
可选的,第二载流子收集端在硅基底1的背光面的投影的面积,占硅基底的背光面的总面积的5%至45%,该面积比例下,对第二载流子的收集和传输效果好,同时也不会影响第一载流子的收集和传输。
可选的,第二载流子收集端的俯视图可以为点状或线状图案,点状图案例如圆形或椭圆形。线状图案如矩形或多边形等。第二载流子收集端的俯视图为点状或线状图案,这样对于第二区域的掺杂实现工艺简单。
可选的,第二载流子收集端的掺杂浓度大于等于10 15cm -3,且大于第一区域的硅基底1的掺杂浓度,这样对第二载流子的收集和传输效果更好。
参照图2所示,以下以硅基底1为n型硅基底,第二载流子为电子,第一载流子为空穴为例进行说明。第二载流子收集端为掺杂结构,可以引起n型硅基底在该第二区域2能带向下弯曲,吸引电子排斥空穴,起到电子选择性收集的作用。金属氧族化合物层4中与第一区域对应的区域形成第一载流子收集端,第一载流子收集端即为空穴收集端。在第一区域的金属氧族化合物(即第一载流子收集端)表现为空穴选择性接触材料,该材料的导带能级与n型硅基底的价带能级接近,且可以具备界面负电荷或负固定缺陷,可以引起界面处能带向上弯曲,形成界面p型层,起到吸引空穴排斥电子的作用。在第一载流子收集端,具备较强选择性的材料会引起较强的界面能带弯曲,同时第一载流子收集端的导带底能级较低,空穴可通过隧穿复合机制进入空穴选择性材料,实现空穴的收集与传输。在第二载流子传输区,由于该区域电子密度较高,空穴密度较低,导致该区域导带底能级较低,与第二载流子收集端的导带底能级接近,因此,电子可以直接进入金属氧族化合物层中与第二载流子收集端对应的第二载流子传输区,从而实现电子的传输。
需要说明的是,本发明中的导带能级、价带能级一般指材料本身的能级,即该材料单独存在时的能级水平,并不是指在电池结构中的实际能级。
图2中,金属氧族化合物层4可同时实现空穴的收集与电子的传输,同时该材料可通过调节结晶性、晶相及掺杂元素使其具备较低的横向导电能力,第一载流子收集端的空穴与第二载流子传输区的电子,不同类型载流子被收集后均纵向传输进入相应电极,不会因为横向传输而互相连通导致漏电或短路,因而不同类型的载流子收集端不需要额外进行电学隔离,并且不会因为相互接触而产生反向pn结。
图2中,第二载流子收集端采用局域掺杂选择性接触结构,金属氧族化合物层4采用沉积的选择性接触结构,相比于传统的全扩散背接触结构,具有少子收集区域体区复合低的优点,同时扩散步骤少,工艺相对简单;相比于采用非晶硅作为背接触的结构,金属氧族化合物层4的选择性更强,热稳定性更高,同时材料沉积过程设备要求较低,安全性更高。金属氧族化合物层4可以全面覆盖电池背面,进一步简化工艺流程。
采用金属氧族化合物层4中与第一区域对应的区域形成第一载流子收集端,相比于非晶硅材料具备更强的选择性和纵向传输能力,第一载流子收集与纵向传输能力更强; 同时在第二载流子收集端,与局域掺杂结构相配合,第二载流子传输通过氧族化合物材料带边进行传输,不涉及跨能级隧穿机制,第二载流子传输阻碍小,可实现更低的接触电阻。
可选的,金属氧族化合物层4可以为一层或多层结构,参照图1、图2所示,金属氧族化合物层4的厚度d1可以为1-600nm,更优地,d1为2-100nm,该厚度范围利于第二载流子和第一载流子的传输和收集。
其它情况,例如硅基底1为p型硅基底,第二载流子为空穴,可以参照上面理解。
可选的,在硅基底为n型硅基底且第二载流子为多子的情况下,或,在硅基底为p型硅基底且第二载流子为少子的情况下,金属氧族化合物层4的材料选自:第一材料中的至少一种。该第一材料为:功函数大于等于5eV的n型金属氧化物、或功函数小于等于6eV的p型金属氧化物。针对上述两种情况,该材料的金属氧族化合物层4中的第二载流子传输区,利于第二载流子的传输,该材料的金属氧族化合物层4中的第一载流子收集端利于第一载流子的传输和收集。
具体的,在硅基底为n型硅基底且第二载流子为电子的情况下,或,在硅基底为p型硅基底且第二载流子为电子的情况下,金属氧族化合物层4的材料选自:上述第一材料中的至少一种。
可选的,上述第一材料选自:氧化钼、氧化钨、氧化钒、氧化铌、氧化镍、掺汞氧化铌(如Hg 2Nb 2O 7)、掺汞氧化钽(如Hg 2Ta 2O 7)中的至少一种。在硅基底为n型硅基底且第二载流子为电子的情况下,或,在硅基底为p型硅基底且第二载流子为电子的情况下,上述材料的金属氧族化合物层4中的第一载流子收集端利于第一载流子的传输和收集,上述材料的金属氧族化合物层4中的第二载流子传输区,利于第二载流子的传输。
可选的,在硅基底为p型硅基底且第二载流子为多子的情况下,或在硅基底为n型硅基底且第二载流子为少子的情况下,金属氧族化合物层的材料选自第二材料中的至少一种;第二材料为功函数大于或等于3eV的金属氧族化合物。该材料的金属氧族化合物层4中的第二载流子传输区,利于第二载流子的传输,该材料的金属氧族化合物层4中的第一载流子收集端利于第一载流子的传输和收集。
具体的,在硅基底为p型硅基底且第二载流子为空穴的情况下,或在硅基底为n型硅基底且第二载流子为空穴的情况下,金属氧族化合物层4的材料选自:上述第二材料中的至少一种。
可选的,上述第二材料选自:氧化锌、氧化锡、氧化钛、氧化铜、氧化铊、硫化镉、硫化钼、硫化锌、硒化钼、硒化铜、掺铌氧化铜(如CuNb 3O 8)、氧化镉锗(如Ce 0.8Gd 0.2O 2)、氧化铱锌(如ZnIr 2O 4)、氧化钴钙(如Ca 3Co 4O 9)中的至少一种。在硅基底为p型硅基底且第二载流子为空穴的情况下,或在硅基底为n型硅基底且第二载流子为空穴的情况下,该材料的金属氧族化合物层4中的第二载流子传输区,利于第二载流子的传输,该材料的金属氧族化合物层4中的第一载流子收集端利于第一载流子的传输和收集。
可选的,上述金属氧族化合物中含有掺杂元素,该掺杂元素选自:卤族元素、过渡金属元素、碱金属元素、稀土元素、III族元素、IV族元素、V族元素中的至少一种。上述材料的金属氧族化合物层4中的第二载流子传输区,利于第二载流子的传输,该材料的金属氧族化合物层4中的第一载流子收集端利于第一载流子的传输和收集。
可选的,金属氧族化合物层4的横向传导能力小于等于1.0×10 -3S/cm,横向电阻大于或等于1.0×10 3Ω/cm,进而对横向电流具有良好的阻隔作用。可以通过调节材料结构如结晶性、晶相或掺杂等工艺实现降低横向导电能力。
可选的,图2中,在硅基底为p型硅基底且第二载流子为多子的情况下,或在硅基底为n型硅基底且第二载流子为少子的情况下,金属氧族化合物层4与第一区域对应的区域形成第一载流子收集端,用于收集和传输第一载流子电子,金属氧族化合物层4与第二区域对应的区域形成第二载流子传输区,用于传输第二载流子空穴。金属氧族化合物层4的界面或内部的固定正电荷密度大于或等于10 11cm -2,和/或,金属氧族化合物层4的界面或内部的受主缺陷密度大于或等于10 11cm -2,和/或,金属氧族化合物层4的界面或内部的限位电荷密度大于或等于10 11cm -2。该材料的金属氧族化合物层4中的第二载流子传输区,利于第二载流子的传输,该材料的金属氧族化合物层4中的第一载流子收集端利于第一载流子的传输和收集。
可选的,图2中,在硅基底为n型硅基底且第二载流子为多子的情况下,或在硅基底为p型硅基底且第二载流子为少子的情况下,金属氧族化合物层4与第一区域对应的区域形成第一载流子收集端,用于收集和传输第一载流子空穴,金属氧族化合物层4与第二区域对应的区域形成第二载流子传输区,用于传输第二载流子电子。金属氧族化合物层4的界面或内部的固定负电荷密度大于或等于10 12cm -2,和/或,金属氧族化合物层4的界面或内部的施主缺陷密度大于或等于10 12cm -2,和/或,金属氧族化合物层4的界面或内部的限位电荷密度大于或等于10 12cm -2。该材料的金属氧族化合物层4中的第二载流子传输区,利于第二载流子的传输,该材料的金属氧族化合物层4中的第一载流子收集 端利于第一载流子的传输和收集。
可选的,金属氧族化合物层4在可见光波段的平均透光率大于或等于70%,进而,金属氧族化合物层4对可见光的遮挡少,利于提升光电转换效率。
可选的,硅基底1的背光面为平面结构或陷光结构,金属氧族化合物层4的向光面适配于硅基底1的背光面。和/或,硅基底1的向光面为平面结构或陷光结构。对于陷光结构而言,可以增加光程,提升光电转换效率。陷光结构可以为绒面、倒金字塔、纳米陷光结构等。
可选的,硅基底的向光面还可以设置有钝化层、正面场效应层、正面减反射薄膜层、散射结构层、聚光结构层中的至少一种。和/或,在金属氧族化合物层的背光面中,第二电极、第一电极之外的区域设置有背面钝化膜,以实现钝化、光学改进等。
例如,参照图3所示,图3示出了本发明实施方式中的第三种背接触太阳电池的结构示意图。图3中7可以为正面减反射薄膜层,8可以为背面钝化膜。
可选的,参照图4所示,图4示出了本发明实施方式中的第四种背接触太阳电池的结构示意图。在第二区域2的背光面还沉积有第二载流子选择层22,该第二载流子选择层22可以进一步增强第二区域2对第二载流子的传输能力。第二区域2的投影与第二载流子选择层22的投影至少部分重合,进而便于加工。例如,图4所示,第二区域2的投影与第二载流子选择层22的投影重合度较高。
第二载流子选择层22位于金属氧族化合物层4的背光面或向光面。例如,参照图4所示,第二载流子选择层22位于金属氧族化合物层4的向光面。再例如,参照图5所示,图5示出了本发明实施方式中的第五种背接触太阳电池的结构示意图。第二载流子选择层22位于金属氧族化合物层4的背光面。
可选的,参照图4或图5所示,第二载流子选择层22为一层或多层结构,第二载流子选择层22的厚度d2为1-500nm,更优地,d2为2-60nm。该厚度的第二载流子选择层22有利于对第二载流子的传输。
可选的,第二载流子选择层22在硅基底1的背光面的投影的面积,占硅基底1的背光面的总面积的5%至45%。该面积比例下,对第二载流子的传输效果好,同时也不会影响第一载流子的收集和传输。需要说明的是,第二载流子选择层22与上述第二区域2的面积相等或不等,本发明实施方式,对此不作具体限定。
可选的,硅基底为n型硅基底且第二载流子为多子的情况下,或在硅基底为p型硅基底且第二载流子为少子的情况下,第二载流子选择层的材料选自:功函数大于或等于3eV的晶硅材料、函数大于或等于3eV的非晶硅材料、或第二材料中的至少一种。该第二材料为功函数大于或等于3eV的金属氧族化合物。上述材料的第二载流子选择层对第二载流子的收集和传输效果好。
可选的,在硅基底为p型硅基底且第二载流子为多子的情况下,或在硅基底为n型硅基底且第二载流子为少子的情况下,第二载流子选择层的材料可以选自:第一材料中的至少一种;该第一材料为功函数大于等于5eV的n型金属氧族化合物、或功函数小于等于6eV的p型金属氧族化合物。上述材料的第二载流子选择层对第二载流子的收集和传输效果好。
关于该第二材料、第一材料的具体选择可以参照前述有关记载,且能达到相同或类似的有益效果,为了避免重复,此处不再赘述。
可选的,硅基底的背光面和金属氧族化合物层之间设置有隧穿隔离层。隧穿隔离层可以为一层或多层结构,隧穿隔离层的厚度为0.1nm-5nm。隧穿隔离层起到良好的表面钝化作用,可以减少电流在界面处的复合。
例如,参照图6所示,图6示出了本发明实施方式中的第六种背接触太阳电池的结构示意图。在上述图2的基础上,硅基底1的背光面和金属氧族化合物层4之间设置有隧穿隔离层3,隧穿隔离层3的厚度d3为0.1nm-5nm。参照图7所示,图7示出了本发明实施方式中的第七种背接触太阳电池的结构示意图。在上述图4的基础上,隧穿隔离层3位于硅基底1的背光面,以及金属氧族化合物层4的向光面、第二载流子选择层22的向光面之间。再例如,参照图8所示,图8示出了本发明实施方式中的第八种背接触太阳电池的结构示意图。隧穿隔离层3位于硅基底1的背光面,以及金属氧族化合物层4的向光面、第二载流子选择层22的向光面之间。
可选的,隧穿隔离层的材料选自:硅的氧化物、硅的氮化物、硅的氮氧化物、硅的卤化物中的至少一种。上述材料的隧穿隔离层表面化学钝化作用更好。隧穿隔离层可以单独形成,如,采用原位反应的工艺如湿法热氧、干法热氧工艺,可以采用化学气相沉积、物理气相沉积等沉积工艺单独形成。或用与金属氧族化合物层集成的工艺,如生长金属氧族化合物过程中或后退火过程中形成的界面氧化硅层,作为隧穿隔离层。需要说明的是,若隧穿隔离层为不含硅的材料时,可以包含其与硅材料的化学过渡层。
可选的,隧穿隔离层的材料可以选择电介质材料,隧穿隔离层的介电常数大于2。电介质材料是可以被极化为绝缘材料,隧穿隔离层的材料可以选择电介质材料,且介电常 数大于2,不仅起到良好的表面化学钝化作用,而且,具有良好的场钝化作用,可以对横向导电起到良好的阻断作用。
可选的,隧穿隔离层的击穿电压大于或等于3MV/cm,表面钝化作用好,且对横向导电起到良好的阻断作用。
可选的,隧穿隔离层的材料选自:氧化硅(如SiO x)、氮化硅(如SiN x)、氟化硅(如SiF 4)、氟氧化硅(如SiOF)、碳氧化硅(如SiOC)、氧化铝(如Al 2O 3)、氟化铝(如AlF x)、氮氧化铝(如AlON)中的至少一种。上述材料的隧穿隔离层表面钝化作用好,且对横向导电起到良好的阻断作用。需要说明的是化学式中的x,本领域技术人员可以根据实际情况选择合适的取值。
可选的,第二载流子收集端和第二电极之间设置有第二透明导电薄膜和/或第二功函数调节层。即,第二载流子收集端和第二电极之间可以设置有第二透明导电薄膜、或者第二功函数调节层,亦或者两者都有。第二透明导电薄膜和/或第二功函数调节层均位于第二载流子收集端的投影区域内。需要说明的是,在两者都有的情况下,第二透明导电薄膜可以位于第二功函数调节层的背光面或向光面。第二电极的投影可以位于第二透明导电薄膜和/或第二功函数调节层的投影之内。
和/或,第一载流子收集端和第一电极之间设置有第一透明导电薄膜和/或第一功函数调节层。即,第一载流子收集端和第一电极之间可以设置有第一透明导电薄膜、或者第一功函数调节层,亦或者两者都有。第一透明导电薄膜和/或第一功函数调节层均位于第一载流子收集端的投影区域内。需要说明的是,在两者都有的情况下,第一透明导电薄膜可以位于第一功函数调节层的背光面或向光面。第一电极的投影可以位于第一透明导电薄膜和/或第一功函数调节层的投影之内。
其中,上述第一透明导电薄膜、第二透明导电薄膜能够起到辅助载流子传输的作用,而且透光,可以进一步提高光电转换效率。第一功函数调节层、第二功函数调节层起到降低接触电阻的作用。
图9示出了本发明实施方式中的第九种背接触太阳电池的结构示意图。如,参照图5、图8或图9,第二载流子收集端和第二电极6之间设置有第二透明导电薄膜63和第二功函数调节层62。第二透明导电薄膜63位于第二功函数调节层62的向光面。第一载流子收集端和第一电极5之间设置有第一透明导电薄膜52和第一功函数调节层53。第一透明导电薄膜52位于第一功函数调节层53的背光面。
可选的,参照图9所示,第二功函数调节层62的厚度d4、第一功函数调节层53的厚度d5均为0.1-5nm。该厚度范围可以更大程度降低接触电阻。
可选的,第二透明导电薄膜由透明导电材料和功函数调节材料化合或混合形成。和/或,第一透明导电薄膜由透明导电材料和功函数调节材料化合或混合形成。即,第一透明导电薄膜、第二透明导电薄膜不仅可以起到辅助载流子传输的作用,而且透光,可以进一步提高光电转换效率,同时,可以降低接触电阻或纵向电阻。
可选的,在第二载流子收集端和第二电极之间设置有第二透明导电薄膜的情况下,第二电极以栅线的形式设置在第二透明导电薄膜的背光面,充分利用背面透光,可以进一步提高光电转换效率。
和/或,在第一载流子收集端和第一电极之间设置有第一透明导电薄膜的情况下,第一电极以栅线的形式设置在第一透明导电薄膜的背光面,充分利用背面透光,可以进一步提高光电转换效率。
可选的,第一透明导电薄膜与第二透明导电薄膜的材料均独立选自:氧化锌、掺铝氧化锌、氧化锡、掺铟氧化锡、掺铟镓氧化锡中的至少一种。上述材料的第一透明导电薄膜与第二透明导电薄膜载流子传输性能更优,可以进一步提高光电转换效率。
可选的,第一功函数调节层、第二功函数调节层的功函数均为1eV-5.5eV,可以更进一步降低接触电阻。
可选的,第一功函数调节层、第二功函数调节层的材料、第一透明导电薄膜,和/或,第二透明导电薄膜中的功函数调节材料均可以独立选自:碱金属、过渡金属、碱金属卤化物或过渡金属卤化物中的至少一种,可以更进一步降低接触电阻。
可选的,第一功函数调节层、第二功函数调节层的材料、第一透明导电薄膜和/或,第二透明导电薄膜中的功函数调节材料均可以独立选自:Ca、Mg、Ba、LiF x、KFx、MgF x、BaCl x等。其中,此处化学式中的x,本领域技术人员可以根据实际情况选择合适的取值。
可选的,第一透明导电薄膜和/或,第二透明导电薄膜中的功函数调节材料的功函数为1eV-5.5eV,可以更进一步降低接触电阻。
可选的,参照图1所示,第二区域2经掺杂形成第二载流子收集端。第二载流子收集端可以实现对第二载流子的收集和传输。需要说明的是第二区域2和硅基底1中第二区域本身的掺杂类型相同,但是掺杂的元素可以相同或不同,本发明实施方式,对此不作具体限定。
该第二载流子收集端的掺杂浓度等可以参照前述有关记载,为了避免重复,此处不 再赘述。
参照图1所示,金属氧族化合物层4作为第一载流子收集端仅沉积在硅基底1的背光面的第一区域上。第一载流子收集端可以实现对第一载流子的收集和传输。
参照图1所示,第二电极6对应设置在第二载流子收集端上,第二电极6用于传导第二载流子。第一电极5对应设置在第一载流子收集端上,第一电极5用于传导第一载流子。需要说明的是,第二电极6和第一电极5之间需要保留电气绝缘间隙,电气绝缘间隙不小于正常工作电压下的击穿距离。第二电极6和第一电极5可采用印刷、沉积等工艺制作。第一电极5和第二电极6可以为金属电极。
图1中,掺杂后的硅基底1的背光面的第二区域2实现了对第二载流子的收集和传输,仅沉积在硅基底1的背光面的第一区域的金属氧族化合物层4实现了对第一载流子的收集和传输,位于不同位置的不同的物质分别实现了对不同载流子的收集和传输,不需要额外的对位和电学隔离,工艺简单,降低无收集区域面积,提升了光电转换效率。同时,第二载流子收集端直接连接第二电极6,第一载流子收集端直接连接第一电极5,二者载流子传导能级接近,无接触势垒或只有很小的接触势垒,降低了纵向接触电阻。同时,第二载流子收集端、第一载流子收集端与金属氧族化合物层4,不会因为相互接触而产生反向pn结。并且,金属氧族化合物层4的结构与性能可调性强,可实现较低的横向传导能力和较强的纵向传导能力,且热稳定性较好,工艺选择窗口宽。
或者,参照图10所示,图10示出了本发明实施方式中的第十种背接触太阳电池的结构示意图。该背接触太阳电池同样可以包括:硅基底1,硅基底1的背光面分为第一区域和第二区域2。硅基底1的第二区域2经掺杂形成第二载流子收集端,此部分可以参照前述的有关记载,为了避免重复,此处不再赘述。参照图10所示,整个硅基底1的背光面沉积有金属氧族化合物层4,相对于在整个硅基底1的背光面沉积其余材料层而言,结构与性能可调性强,可实现较低的横向传导能力和较强的纵向传导能力,且热稳定性较好,工艺选择窗口宽。
参照图10所示,金属氧族化合物层4与硅基底1的背光面的第一区域对应的部分形成第一载流子收集端,第一载流子收集端可以实现对第一载流子的收集和传输。第一电极5对应设置在该第一载流子收集端上,纵向接触电阻低。
参照图10所示,金属氧族化合物层4中至少与硅基底1的背光面的第二区域对应的部分,具有电学分割该金属氧族化合物层4的开孔,该开孔可以完全切断金属氧族化合物层4,或部分切断金属氧族化合物层4。开孔中填充有第二载流子选择层22,该第二载流子选择层22用于传输第二载流子。第二电极6对应设置在第二载流子选择层上22。进而,第二载流子经由第二载流子选择层22由第二电极6收集。需要说明的是,开孔区域与第二区域大致相等,可以大于或小于第二区域。第二载流子选择层22的周边区域可以大于开孔区域。开孔可以完全或部分断开金属氧族化合物层4。
第二电极6,第一电极5同样可以参照前述有关记载,为了避免重复,此处不再赘述。
参照图1或图10所示,若,硅基底1为n型硅基底,若第一载流子为空穴,第二载流子为电子。第二载流子收集端即为电子聚集区。第二载流子收集端为掺杂结构,可以引起n型硅基底在该第二区域2能带向下弯曲,吸引电子排斥空穴,起到电子选择性收集的作用。参照图1所示,金属氧族化合物层4形成第一载流子收集端,第一载流子收集端即为空穴聚集区。第一载流子收集端表现为空穴选择性接触材料,该材料的导带能级与n型硅基底的价带能级接近,且可以具备界面负电荷或负固定缺陷,可以引起界面处能带向上弯曲,形成界面p型层,起到吸引空穴排斥电子的作用。或,参照图10所示,金属氧族化合物层4中与第一区域对应的部分形成第一载流子收集端,第一载流子收集端即为空穴聚集区。第一载流子收集端在金属氧族化合物层中第一区域对应的部分表现为空穴选择性接触材料,该材料的导带能级与n型硅基底的价带能级接近,且可以具备界面负电荷或负固定缺陷,可以引起界面处能带向上弯曲,形成界面p型层,起到吸引空穴排斥电子的作用。参照图10所示,第二载流子选择层22,由于该部分电子密度较高,空穴密度较低,导致该部分导带底能级较低,与第二载流子收集端的导带底能级接近,因此,便于电子的传输。
需要说明的是,上述导带能级、价带能级一般指材料本身的能级,即该材料单独存在时的能级水平,并不是指在电池结构中的实际能级。
图1或图10中,第二载流子收集端采用局域掺杂选择性接触结构,金属氧族化合物层4采用沉积的选择性接触结构,相比于传统的全扩散背接触结构,具有少子收集部分体区复合低的优点,同时扩散步骤少,工艺相对简单;相比于采用非晶硅作为背接触的结构,金属氧族化合物层4的选择性更强,热稳定性更高,同时材料沉积过程设备要求较低,安全性更高。
采用金属氧族化合物层4中与第一区域对应的部分形成第一载流子收集端,相比于非晶硅材料具备更强的选择性和纵向传输能力,第一载流子收集与纵向传输能力更强。
图10中,连续整层的金属氧族化合物层4中至少与第二区域2对应的部分,具有电 学分割上述金属氧族化合物层4的开孔,开孔中填充有第二载流子选择层22,第二电极6设置在第二载流子选择层22上,相当于,第二载流子通过第二载流子选择层22专门进行传输,而第一载流子主要通过金属氧族化合物层4中未开孔的部分传输,实现了不同的物质分别对不同载流子的传输,不需要额外的对位和电学隔离,工艺简单,降低了无收集区域面积,提升了光电转换效率。同时,第一载流子和第二载流子分别通过不同物质实现传输,且,第二载流子选择层22更便于第二载流子的传输,其载流子传导能级与第二区域2更为接近,二者接触无势垒或具有很小的势垒,可以降低纵向接触电阻。同时,第二载流子收集端、第一载流子收集端与金属氧族化合物层4,不会因为相互接触而产生反向pn结。并且,金属氧族化合物层4结构与性能可调性强,可实现较低的横向传导能力和较强的纵向传导能力,且热稳定性较好,工艺选择窗口宽。
可选的,第二区域2的投影与第二载流子选择层22的投影至少部分重合,进而便于加工。第二载流子选择层22位于金属氧族化合物层4的背光面或向光面。例如,图10所示,第二区域2的投影与第二载流子选择层22的投影重合度较高。图10中,可以认为第二载流子选择层22位于金属氧族化合物层4的背光面。
可选的,金属氧族化合物层4可以为一层或多层结构,参照图1所示,金属氧族化合物层4的厚度d1参照前述有关记载。
可选的,第二载流子选择层22在硅基底1的背光面的投影的面积,占硅基底1的背光面的总面积的5%至45%。该面积比例下,对第二载流子的传输效果好,同时也不会影响第一载流子的收集和传输。需要说明的是,第二载流子选择层22与上述第二区域2的面积相等或不等,对此不作具体限定。
参照图11所示,图11示出了本发明实施方式中的第十一种背接触太阳电池的结构示意图。在上述图10的基础上,硅基底1的背光面和金属氧族化合物层4之间设置有隧穿隔离层3,隧穿隔离层3的厚度d2为0.1nm-5nm。开孔在完全断开金属氧族化合物层4的条件下,可以完全或部分断开隧穿隔离层3。隧穿隔离层3的材料等参照前述有关记载。
可选的,在第二电极对应设置在第二载流子选择层上的情况下,第二载流子选择层和第二电极之间设置有第三透明导电薄膜和/或第三功函数调节层;即,第二载流子选择层和第二电极之间可以设置有第三透明导电薄膜、或者第三功函数调节层,亦或者两者都有。第三透明导电薄膜和/或第三功函数调节层均位于该第二载流子选择层的投影部分内。需要说明的是,在两者都有的情况下,第三透明导电薄膜可以位于第三功函数调节层的背光面或向光面。
第三透明导电薄膜均能够起到辅助载流子传输的作用,而且透光,可以进一步提高光电转换效率。第三功函数调节层均可以起到降低接触电阻的作用。
图12示出了本发明实施方式中的第十二种背接触太阳电池的结构示意图。再例如,参照图13所示,图13示出了本发明实施方式中的第十三种背接触太阳电池的结构示意图。图12和图13的区别在于,图13中,硅基底1的背光面和金属氧族化合物层4之间设置有隧穿隔离层3。参照图12或图13,第一载流子收集端和第一电极5之间设置有第一透明导电薄膜52和第一功函数调节层53。第一透明导电薄膜52位于第一功函数调节层53的向光面。参照图12或图13,第二载流子选择层22和第二电极6之间设置有第三透明导电薄膜65和第三功函数调节层64。第三透明导电薄膜65位于第三功函数调节层64的背光面。
可选的,参照图12所示,第三功函数调节层64的厚度d6为0.1-2nm。该厚度范围可以更大程度降低接触电阻。该厚度范围可以更大程度降低接触电阻。
可选的,第三透明导电薄膜由透明导电材料和功函数调节材料化合或混合形成。第三透明导电薄膜不仅可以起到辅助载流子传输的作用,而且透光,可以进一步提高光电转换效率,同时,可以降低接触电阻或纵向电阻。
可选的,在第二载流子选择层和第二电极之间设置有第三透明导电薄膜的情况下,第二电极以栅线的形式设置在第三透明导电薄膜的背光面,充分利用背光面透光,可以进一步提高光电转换效率。
可选的,第三透明导电薄膜的材料选自:氧化锌、掺铝氧化锌、氧化锡、掺铟氧化锡、掺铟镓氧化锡中的至少一种。上述材料的第三透明导电薄膜载流子传输性能更优,可以进一步提高光电转换效率。
可选的,第三功函数调节层的功函数均为1eV-5.5eV,可以更进一步降低接触电阻。
可选的,第三功函数调节层的材料和/或,第三透明导电薄膜中的功函数调节材料均可以独立选自:碱金属、过渡金属、碱金属卤化物或过渡金属卤化物中的至少一种,可以更进一步降低接触电阻。
可选的,第三功函数调节层的材料、和/或,第三透明导电薄膜中的功函数调节材料均可以独立选自:Ca、Mg、Ba、LiF x、KFx、MgF x、BaCl x等。其中,化学式中的x,本领域技术人员可以根据实际情况选择合适的取值。
可选的,第三透明导电薄膜中的功函数调节材料的功函数为1eV-5.5eV,可以更进一步降低接触电阻。
可选的,硅基底的向光面还可以设置有钝化层、正面场效应层、正面减反射薄膜层、散射结构层、聚光结构层中的至少一种。和/或,在第二电极对应设置在第二载流子收集端上的情况下,在金属氧族化合物层的背光面中,第二电极之外的部分,以及在第二区域中第二电极之外的部分,均设置有背光面减反射膜。和/或,在第二电极对应设置在第二载流子选择层上的情况下,在金属氧族化合物层的背光面以及第二载流子选择层的背光面中,第二电极、第二电极之外的部分设置有背光面减反射膜,以实现钝化、光学改进等。
例如,参照图10至图13所示,7可以为正面减反射薄膜层,8可以为背光面减反射膜。
可选的,第二载流子选择层为一层或多层结构,第二载流子选择层的厚度与金属氧族化合物层的厚度无关,第二载流子选择层22的厚度可以略高于开孔的高度。如,第二载流子选择层厚度为1-500nm,更优地,第二载流子选择层厚度为2-60nm。该厚度的第二载流子选择层22有利于对第一载流子的传输。
可选的,硅基底为n型硅基底且第二载流子为多子的情况下,或在硅基底为p型硅基底且第二载流子为少子的情况下,第二载流子选择层的材料选自:功函数大于或等于3eV的晶硅材料、函数大于或等于3eV的非晶硅材料、或第二材料中的至少一种。该第二材料为功函数大于或等于3eV的金属氧族化合物层。上述材料的第二载流子选择层对第二载流子的收集和传输效果好。
可选的,在硅基底为p型硅基底且第二载流子为多子的情况下,或在硅基底为n型硅基底且第二载流子为少子的情况下,第二载流子选择层的材料可以选自:第一材料中的至少一种;该第一材料为功函数大于等于5eV的n型金属氧族化合物层、或功函数小于等于6eV的p型金属氧族化合物层。上述材料的第二载流子选择层对第二载流子的收集和传输效果好。
关于该第二材料、第一材料的具体选择可以参照前述有关记载,且能达到相同或类似的有益效果,为了避免重复,此处不再赘述。
可选的,参照图14所示,图14示出了本发明实施方式中的第十四种背接触太阳电池的结构示意图。上述第二区域2经掺杂形成第二载流子收集端。第二载流子收集端可以实现对第二载流子的收集和传输。需要说明的是第二区域2和硅基底1中第二区域本身的掺杂类型相同,但是掺杂的元素可以相同或不同,本发明实施方式,对此不作具体限定。
图14中,整个硅基底1的背光面沉积有金属氧族化合物层4,相对于在整个硅基底1的背光面沉积其余材料层而言,结构与性能可调性强,可实现较低的横向传导能力和较强的纵向传导能力,且热稳定性较好,工艺选择窗口宽。
图14中,金属氧族化合物层4中具有将该金属氧族化合物层4电学分割为第二载流子传输区和第一载流子收集端的阻断结构9。关于阻断结构9的数量不作具体限定。第一载流子收集端位于与硅基底1的背光面的第一区域对应的部分,第一载流子收集端可以实现对第一载流子的收集和传输。第二载流子传输区位于与硅基底1的背光面的第二区域对应的部分,第二载流子传输区可以实现对第二载流子的传输。
第一载流子收集端对应设置有第一电极5,第一电极5用于传导第一载流子。第二载流子传输区对应设置有第二电极6,第二电极6用于传导第二载流子。需要说明的是,第一电极5和第二电极6之间需要保留电气绝缘间隙,电气绝缘间隙间隙不小于正常工作电压下的击穿距离。第一电极5和第二电极6可采用印刷、沉积等工艺制作。第二电极6和第一电极5可以为金属电极。
参照图14所示,若,硅基底1为n型硅基底,若第一载流子为空穴,第二载流子为电子。第二载流子收集端即为电子收集区。第二载流子收集端为掺杂结构,可以引起n型硅基底在该第二区域2能带向下弯曲,吸引电子排斥空穴,起到电子选择性收集的作用。第一载流子收集端即为空穴收集区。第一载流子收集端表现为空穴选择性接触材料,该材料的导带能级与n型硅基底的价带能级接近,且可以具备界面负电荷或负固定缺陷,可以引起界面处能带向上弯曲,形成界面p型层,起到吸引空穴排斥电子的作用。
需要说明的是,上述导带能级、价带能级一般指材料本身的能级,即该材料单独存在时的能级水平,并不是指在电池结构中的实际能级。
图14中,在第二载流子传输区由于该部分电子密度较高,空穴密度较低,导致该部分导带底能级较低,与第二载流子收集端的导带底能级接近,因此,电子可以直接进入金属氧族化合物层中与第二载流子收集端对应的第二载流子传输区,从而实现电子的传输。
图14中,若硅基底1为n型硅基底,若第一载流子为空穴,第二载流子为电子。金属氧族化合物层4中,由阻断结构9电学分割的两部分可分别实现空穴的收集与电子的 传输,同时该材料可通过调节结晶性、晶相及掺杂元素使其具备较低的横向导电能力,第一载流子收集端的空穴与第二载流子传输区的电子,由于阻断结构9的电学分割,使得不同类型载流子被收集后均纵向传输进入相应电极,不会因为横向传输而互相连通导致漏电或短路,因而不同类型的载流子收集端不需要额外进行电学隔离,并且不会因为相互接触而产生反向pn结。
图14中,第二载流子收集端采用局域掺杂选择性接触结构,金属氧族化合物层4采用沉积的选择性接触结构,相比于传统的全扩散背接触结构,具有体区复合低的优点,同时扩散步骤少,工艺相对简单;相比于采用非晶硅作为背接触的结构,金属氧族化合物层4的选择性更强,热稳定性更高,同时材料沉积过程设备要求较低,安全性更高。金属氧族化合物层4可以全面覆盖电池背面,进一步简化工艺流程。
图14中,采用金属氧族化合物层4中与第一区域对应的部分形成第一载流子收集端,相比于非晶硅材料具备更强的选择性和纵向传输能力,第一载流子收集与纵向传输能力更强,可实现更低的接触电阻;同时在第二载流子收集端,与局域掺杂结构相配合,第二载流子传输通过氧化物材料带边进行传输,不涉及跨能级隧穿机制,第二载流子传输阻碍小,可实现更低的接触电阻。
可选的,阻断结构为开槽;和/或,阻断结构为绝缘体。上述形式的阻断结构不仅阻断效果好,而且实现工艺简单。如,可以采用离子注入的方式设置绝缘体。
可选的,阻断结构的厚度大于或等于金属氧族化合物层的厚度,进而电学阻断效果好。例如,参照图14所示,则,阻断结构9的厚度等于金属氧族化合物层4的厚度。在阻断结构的厚度大于金属氧族化合物层的厚度的情况下,阻断结构朝向金属氧族化合物层的背光面凸出。
例如,参照图15所示,在上述图14的基础上,阻断结构9的厚度大于金属氧族化合物层4的厚度,且阻断结构9朝向金属氧族化合物层4的背光面凸出。
参照图16所示,图16示出了本发明实施方式中的第十六种背接触太阳电池的结构示意图。在上述图14的基础上,图16中7可以为正面减反射薄膜层,8可以为背面减反射膜。
参照图17所示,图17示出了本发明实施方式中的第十七种背接触太阳电池的结构示意图。在上述图16的基础上,硅基底1的背光面和金属氧族化合物层4之间设置有隧穿隔离层3,隧穿隔离层3的厚度为0.1nm-5nm。隧穿隔离层3的材料等参照前述有关记载。
可选的,第二载流子传输区和第二电极之间设置有第四透明导电薄膜和/或第四功函数调节层。即,第二载流子传输区和第二电极之间可以设置有第四透明导电薄膜、或者第四功函数调节层,亦或者两者都有。第四透明导电薄膜和/或第四功函数调节层均位于第二载流子传输区的投影区域内。需要说明的是,在两者都有的情况下,第四透明导电薄膜可以位于第四功函数调节层的背光面或向光面。第二电极的投影可以位于第四透明导电薄膜和/或第四功函数调节层的投影之内。
第四透明导电薄膜能够起到辅助载流子传输的作用,而且透光,可以进一步提高光电转换效率。第四功函数调节层起到降低接触电阻的作用。
图18示出了本发明实施方式中的第十八种背接触太阳电池的结构示意图。如,参照图18,第二载流子传输区和第二电极6之间设置有第四透明导电薄膜67和第四功函数调节层66。第四透明导电薄膜67位于第四功函数调节层66的背光面。第一载流子收集端和第一电极5之间设置有第一透明导电薄膜52和第一功函数调节层53。第一透明导电薄膜52位于第一功函数调节层53的背光面。
可选的,参照图18所示,第四透明导电薄膜67的厚度d7为0.1-2nm,该厚度范围可以更大程度降低接触电阻。
可选的,第四透明导电薄膜由透明导电材料和功函数调节材料化合或混合形成。和/或,第一透明导电薄膜由透明导电材料和功函数调节材料化合或混合形成。即,第一透明导电薄膜、第四透明导电薄膜不仅可以起到辅助载流子传输的作用,而且透光,可以进一步提高光电转换效率,同时,可以降低接触电阻或纵向电阻。
可选的,在第二载流子传输区和第二电极之间设置有第四透明导电薄膜的情况下,第二电极以栅线的形式设置在第四透明导电薄膜的背光面,充分利用背面透光,可以进一步提高光电转换效率。
和/或,在第一载流子收集端和第一电极之间设置有第一透明导电薄膜的情况下,第一电极以栅线的形式设置在第一透明导电薄膜的背光面,充分利用背面透光,可以进一步提高光电转换效率。
可选的,第四透明导电薄膜的材料选自:氧化锌、掺铝氧化锌、氧化锡、掺铟氧化锡、掺铟镓氧化锡中的至少一种。上述材料的第四透明导电薄膜载流子传输性能更优,可以进一步提高光电转换效率。
可选的,第四功函数调节层的功函数均为1eV-5.5eV,可以更进一步降低接触电阻。
可选的,第四功函数调节层的材料、第四透明导电薄膜中的功函数调节材料均可以独立选自:碱金属、过渡金属、碱金属卤化物或过渡金属卤化物中的至少一种,可以更进一步降低接触电阻。
可选的,第四功函数调节层的材料、第四透明导电薄膜中的功函数调节材料均可以独立选自:Ca、Mg、Ba、LiF x、KFx、MgF x、BaCl x等。其中,化学式中的x,本领域技术人员可以根据实际情况选择合适的取值。
可选的,第四功函数调节层的材料和/或,第四透明导电薄膜中的功函数调节材料的功函数为1eV-5.5eV,可以更进一步降低接触电阻。
可选的,参照图19所示,图19示出了本发明实施方式中的第十九种背接触太阳电池的结构示意图。硅基底1的背光面的第二区域上沉积有第二载流子选择收集层23。第二载流子选择收集层23可以实现对第二载流子的收集和传输。硅基底1和第二载流子选择收集层23两者共同的背光面上沉积有金属氧族化合物层4。金属氧族化合物层4结构与性能可调性强,可实现较低的横向传导能力和较强的纵向传导能力,且热稳定性较好,工艺选择窗口宽。
金属氧族化合物层4中对应第二载流子选择收集层23的部分形成第二载流子传输区,可以实现对第二载流子的传输。金属氧族化合物层4中对应硅基底1的第一区域的部分形成第一载流子收集端,可以实现对第一载流子的收集和传输。
可选的,第二载流子选择收集层23在硅基底1的背光面的投影的面积,占硅基底的背光面的总面积的5%至45%,该面积比例下,对第二载流子的收集和传输效果好,同时也不会影响第一载流子的收集和传输。
可选的,第二载流子选择收集层23的俯视图可以为点状或线状图案,点状图案例如圆形或椭圆形。线状图案如矩形或多边形等。第二载流子选择收集层23的俯视图为点状或线状图案,对于第二载流子选择收集层23的沉积实现工艺简单。
在金属氧族化合物层4中第一载流子收集端的背光面上对应设置有第一电极5,第一电极5用于传导第一载流子。在第二载流子传输区上对应设置有第二电极6,第二电极6用于传导第一载流子。需要说明的是,第一电极5和第二电极6之间需要保留电气绝缘间隙,电气绝缘间隙间隙不小于正常工作电压下的击穿距离。第一电极5和第二电极6可采用印刷、沉积等工艺制作。第二电极6和第一电极5可以为金属电极。
参照图19所示,若,硅基底1为n型硅基底,若第二载流子为电子,第一载流子为空穴。第二载流子选择收集层23即为电子收集端。第二载流子选择收集层为沉积结构,其导带能级与硅材料的导带能级接近,可以引起n型硅基底在该第二载流子选择收集层23能带向下弯曲,吸引电子排斥空穴,起到电子选择性收集的作用。金属氧族化合物层4中对应硅基底1的第一区域的部分形成第一载流子收集端,第一载流子收集端即为空穴收集端。第一载流子收集端表现为空穴选择性接触材料,该材料的导带能级与n型硅基底的价带能级接近,且可以具备界面负电荷或负固定缺陷,可以引起界面处能带向上弯曲,形成界面p型层,起到吸引空穴排斥电子的作用。
需要说明的是,本发明中的导带能级、价带能级一般指材料本身的能级,即该材料单独存在时的能级水平,并不是指在电池结构中的实际能级。
图19中,在第二载流子传输区,第二载流子选择收集层23的导带底能级位于硅基底1导带能级和金属氧族化合物层4的导带能级之间,因此,硅基底1中电子可以直接顺序进入第二载流子选择收集层23后再进入金属氧族化合物层4中与第二载流子选择收集层23对应的第二载流子传输区,从而实现电子的传输。
图19中,金属氧族化合物层4可同时实现空穴的收集与电子的传输,同时,金属氧族化合物层4中,第二载流子传输区和第一载流子收集端的界面处,存在高阻缺陷,可以实现绝缘,不同类型载流子被收集后均纵向传输进入相应电极,不会产生漏电或短路,因而不同类型的载流子收集端不需要额外进行电学隔离,并且不会因为相互接触而产生反向pn结。
图19中,第二载流子选择收集层采用沉积选择性接触结构,金属氧族化合物层4也采用沉积的选择性接触结构,相比于传统的全扩散结构,具有体区复合低的优点,不受俄歇复合极限的限制,同时扩散步骤少,工艺相对简单;而且在形成第二载流子选择收集层和金属氧族化合物层均采用沉积方式,无需高温。相比于采用非晶硅作为的结构,金属氧族化合物层4的选择性更强,热稳定性更高,同时材料沉积过程设备要求较低,安全性更高。金属氧族化合物层4可以全面覆盖电池背面,进一步简化工艺流程。
采用金属氧族化合物层4中对应硅基底1的第一区域的部分形成第一载流子收集端,相比于非晶硅材料具备更强的选择性和纵向传输能力,第一载流子收集与纵向传输能力更强。
可选的,参照图20所示,图20示出了本发明实施方式中的第二十种背接触太阳电池的结构示意图。金属氧族化合物层4中,第二载流子传输区和第一载流子收集端之间设置有阻断结构9。该阻断结构9将金属氧族化合物层中,第二载流子传输区和第一载流 子收集端进行电学分割,从而可以提高未分割区域内金属氧族化合物的电导率,可以从很大程度上减少纵向串联电阻。且通过阻断结构对第二载流子传输区和第一载流子收集端进行电学分割,不同类型载流子被收集后均纵向传输进入相应电极,不会因为横向传输而互相连通导致漏电或短路,因此不需要额外的对位和电学隔离,工艺简单,降低了复合,提升了光电转换效率。
可选的,阻断结构为开槽;和/或,阻断结构高阻体,高阻体的电阻率是金属氧族化合物层4的电阻率100倍以上。一方面绝缘效果好,另一方面实现工艺简单。
可选的,硅基底的向光面还可以设置有钝化层、正面场效应层、正面减反射薄膜层、散射结构层、聚光结构层中的至少一种。和/或,在金属氧族化合物层的以及第二载流子传输区两者背光面中,第一电极、第二电极之外的区域设置有背面减反射膜,以实现钝化、光学改进等。
参照图21所示,图21示出了本发明实施方式中的第二十一种背接触太阳电池的结构示意图。图21中7可以为正面减反射薄膜层,8可以为背面减反射膜。
可选的,参照图19所示,第二载流子选择收集层23的厚度d8为1-500nm,更优地,d8为2-60nm。该厚度的第二载流子选择收集层23有利于对第二载流子的收集和传输。
可选的,硅基底为n型硅基底且第二载流子为多子的情况下,或在硅基底为p型硅基底且第二载流子为少子的情况下,第二载流子选择收集层的材料选自:功函数大于或等于3eV的晶硅材料、函数大于或等于3eV的非晶硅材料、或第二材料中的至少一种。该第二材料为功函数大于或等于3eV的金属氧族化合物。上述材料的第二载流子选择收集层对第二载流子的收集和传输效果好。
可选的,在硅基底为p型硅基底且第二载流子为多子的情况下,或在硅基底为n型硅基底且第二载流子为少子的情况下,第二载流子选择收集层的材料可以选自:第一材料中的至少一种;该第一材料为功函数大于等于5eV的n型金属氧族化合物、或功函数小于等于6eV的p型金属氧族化合物。上述材料的第二载流子选择收集层对第二载流子的收集和传输效果好。
关于该第二材料、第一材料的具体选择可以参照前述有关记载,且能达到相同或类似的有益效果,为了避免重复,此处不再赘述。
可选的,硅基底的背光面和金属氧族化合物层与第二载流子选择收集层两者共同的向光面之间设置有隧穿隔离层。隧穿隔离层的材料、厚度、作用等,可以参照前述记载。
参照图22所示,图22示出了本发明实施方式中的第二十二种背接触太阳电池的结构示意图。硅基底1的背光面和金属氧族化合物层4与第二载流子选择收集层23两者共同的向光面之间设置有隧穿隔离层3。
可选的,第二电极和第二载流子选择收集层之间设置有第五透明导电薄膜和/或第五功函数调节层。即,第二电极和第二载流子选择收集层之间可以设置有第五透明导电薄膜、或者第五功函数调节层,亦或者两者都有。第五透明导电薄膜和/或第五功函数调节层均位于第二载流子选择收集层的投影区域内。需要说明的是,在两者都有的情况下,第五透明导电薄膜可以位于第五功函数调节层的背光面或向光面。第二电极的投影可以位于第五透明导电薄膜和/或第五功函数调节层的投影之内。
和/或,第一载流子收集端和第一电极之间设置有第一透明导电薄膜和/或第一功函数调节层。即,第一载流子收集端和第一电极之间可以设置有第一透明导电薄膜、或者第一功函数调节层,亦或者两者都有。第一透明导电薄膜和/或第一功函数调节层均位于第一载流子收集端和第一电极的投影区域内。需要说明的是,在两者都有的情况下,第一透明导电薄膜可以位于第一功函数调节层的背光面或向光面。第一电极的投影可以位于第一透明导电薄膜和/或第一功函数调节层的投影之内。
其中,上述第五透明导电薄膜、第一透明导电薄膜能够起到辅助载流子传输的作用,而且透光,可以进一步提高光电转换效率。第一功函数调节层、第五功函数调节层起到降低接触电阻的作用。
图23示出了本发明实施方式中的第二十三种背接触太阳电池的结构示意图。如,参照图23,第二载流子选择收集层23和第二电极6之间设置有第五透明导电薄膜69和第五功函数调节层68。第五透明导电薄膜69位于第五功函数调节层68的向光面。第一载流子收集端和第一电极5之间设置有第一透明导电薄膜52和第一功函数调节层53。第一透明导电薄膜52位于第一功函数调节层53的背光面。
可选的,参照图23所示,第五功函数调节层68的厚度d9的厚度为0.1-2nm。该厚度范围可以更大程度降低接触电阻。
可选的,第五透明导电薄膜由透明导电材料和功函数调节材料化合或混合形成。和/或,第一透明导电薄膜由透明导电材料和功函数调节材料化合或混合形成。即,第五透明导电薄膜、第一透明导电薄膜不仅可以起到辅助载流子传输的作用,而且透光,可以进一步提高光电转换效率,同时,可以降低接触电阻或纵向电阻。
可选的,在第二载流子选择收集层和第二电极之间设置有第五透明导电薄膜的情况下,第二电极以栅线的形式设置在第五透明导电薄膜的背光面,充分利用背面透光,可以进一步提高光电转换效率。
和/或,在第一电极和第一载流子收集端之间设置有第一透明导电薄膜的情况下,第一电极以栅线的形式设置在第一透明导电薄膜的背光面,充分利用背面透光,可以进一步提高光电转换效率。
可选的,第五透明导电薄膜的材料选自:氧化锌、掺铝氧化锌、氧化锡、掺铟氧化锡、掺铟镓氧化锡中的至少一种。上述材料的第五透明导电薄膜载流子传输性能更优,可以进一步提高光电转换效率。
可选的,第五功函数调节层的功函数均为1eV-5.5eV,可以更进一步降低接触电阻。
可选的,第五功函数调节层、第五透明导电薄膜中的功函数调节材料均可以独立选自:碱金属、过渡金属、碱金属卤化物或过渡金属卤化物中的至少一种,可以更进一步降低接触电阻。
可选的,第五功函数调节层、第五透明导电薄膜中的功函数调节材料均可以独立选自:Ca、Mg、Ba、LiF x、KFx、MgF x、BaCl x等。其中,化学式中的x,本领域技术人员可以根据实际情况选择合适的取值。
可选的,第五透明导电薄膜中的功函数调节材料的功函数为1eV-5.5eV,可以更进一步降低接触电阻。
本发明实施方式还提供了一种背接触太阳电池的生产方法,该方法包括如下步骤:
步骤S1,提供硅基底;所述硅基底的背光面分为第一区域和第二区域。
步骤S2,至少在所述硅基底的所述第一区域沉积得到金属氧族化合物层;所述金属氧族化合物层与所述第一区域对应的区域形成第一载流子收集端。
步骤S3,在所述第一载流子收集端上对应设置第一电极;所述金属氧族化合物层与所述第二区域对应的区域形成第二载流子传输区。
步骤S4,在所述第二区域对应的区域内对应设置第二电极。
可选的,在步骤S2之前,该方法还可以包括:对所述第二区域的硅基底进行掺杂,形成第二载流子收集端。步骤S2可以包括:在整个所述硅基底的背光面上沉积得到金属氧族化合物层;所述金属氧族化合物层与所述第二区域对应的区域形成第二载流子传输区。步骤S4,包括:在所述第二载流子传输区上对应设置所述第二电极。
该方法的各个步骤中的硅基底、第二载流子收集端、第一载流子收集端、第二载流子传输区、第二电极、第一电极具体可以参照前述有关记载,并能达到相同或相似的有益效果,为了避免重复,此处不再赘述。
本发明实施方式还提供了一种背接触电池组件,包括:任一前述背接触太阳电池。该组件中的硅基底、第二载流子收集端、第一载流子收集端、第二载流子传输区、第二电极、第一电极具体可以参照前述有关记载,并能达到相同或相似的有益效果,为了避免重复,此处不再赘述。
上面结合附图对本发明的实施方式进行了描述,但是本发明并不局限于上述的具体实施方式,上述的具体实施方式仅仅是示意性的,而不是限制性的,本领域的普通技术人员在本发明的启示下,在不脱离本发明宗旨和权利要求所保护的范围情况下,还可做出很多形式,这些均属于本发明的保护之内。
本文中所称的“一个实施例”、“实施例”或者“一个或者多个实施例”意味着,结合实施例描述的特定特征、结构或者特性包括在本发明的至少一个实施例中。此外,请注意,这里“在一个实施例中”的词语例子不一定全指同一个实施例。
在此处所提供的说明书中,说明了大量具体细节。然而,能够理解,本发明的实施例可以在没有这些具体细节的情况下被实践。在一些实例中,并未详细示出公知的方法、结构和技术,以便不模糊对本说明书的理解。
最后应说明的是:以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (53)

  1. 一种背接触太阳电池,其特征在于,包括:
    硅基底,所述硅基底的背光面分为第一区域和第二区域;
    金属氧族化合物层,至少沉积于所述硅基底的所述第一区域;所述金属氧族化合物层与所述第一区域对应的区域形成第一载流子收集端;
    第一电极,对应设置在所述第一载流子收集端上;
    第二电极,对应设置在所述第二区域对应的区域内。
  2. 根据权利要求1所述的背接触太阳电池,其特征在于,
    所述第二区域的硅基底经掺杂形成第二载流子收集端;
    所述金属氧族化合物层,沉积于整个所述硅基底的背光面上;所述金属氧族化合物层与所述第二区域对应的区域形成第二载流子传输区;
    所述第二电极,对应设置在所述第二载流子传输区上。
  3. 根据权利要求1所述的背接触太阳电池,其特征在于,
    所述第二区域的硅基底经掺杂形成第二载流子收集端;
    所述金属氧族化合物层只沉积在所述第一区域上;
    所述第二电极对应设置在所述第二载流子收集端上;
    或,
    所述金属氧族化合物层,沉积于整个所述硅基底的背光面上;所述金属氧族化合物层中至少与所述第二区域对应的部分具有电学分割所述金属氧族化合物层的开孔;所述金属氧族化合物层第二区域对应的部分上形成有第二载流子选择层,所述第二载流子选择层填充在所述开孔中;所述第二电极对应设置在所述第二载流子选择层上。
  4. 根据权利要求1所述的背接触太阳电池,其特征在于,
    所述第二区域的硅基底经掺杂形成第二载流子收集端;
    所述金属氧族化合物层,沉积于整个所述硅基底的背光面上;在所述金属氧族化合物层中,具有将所述金属氧族化合物层电学分割为第二载流子传输区和所述第一载流子收集端的阻断结构;其中,所述第二载流子传输区对应所述第二区域;
    所述第二电极,对应设置在所述第二载流子传输区上。
  5. 根据权利要求1所述的背接触太阳电池,其特征在于,还包括:第二载流子选择收集层;所述第二载流子选择收集层沉积于所述硅基底的所述第二区域上;
    所述金属氧族化合物层沉积于所述第一区域上以及所述第二载流子选择收集层的背光面上;所述金属氧族化合物层中对应所述第二载流子选择收集层的部分形成第二载流子传输区;
    所述第二电极,对应设置在所述第二载流子传输区上。
  6. 根据权利要求2-5中任一所述的背接触太阳电池,其特征在于,
    在所述硅基底为n型硅基底且第二载流子为多子的情况下,或在所述硅基底为p型硅基底且所述第二载流子为少子的情况下,所述金属氧族化合物层的材料选自第一材料中的至少一种;所述第一材料为功函数大于等于5eV的n型金属氧族化合物、或功函数小于等于6eV的p型金属氧族化合物;
    在所述硅基底为p型硅基底且所述第二载流子为多子的情况下,或在所述硅基底为n型硅基底且所述第二载流子为少子的情况下,所述金属氧族化合物层的材料选自第二材料中的至少一种;所述第二材料为功函数大于或等于3eV的金属氧族化合物。
  7. 根据权利要求2-4中任一所述的背接触太阳电池,其特征在于,所述第二载流子收集端的掺杂浓度大于等于10 15cm -3,且大于所述第一区域的硅基底的掺杂浓度;
    所述第二载流子收集端在所述硅基底的背光面的投影的面积,占所述硅基底的背光面的总面积的5%至45%。
  8. 根据权利要求2-5中任一所述的背接触太阳电池,其特征在于,所述第二区域的背光面沉积有第二载流子选择层;所述第二载流子选择层位于所述金属氧族化合物层的背光面或向光面。
  9. 根据权利要求8所述的背接触太阳电池,其特征在于,所述第二载流子选择层的厚度为1-500nm;
    所述第二载流子选择层在所述硅基底的背光面的投影的面积,占所述硅基底的背光面的总面积的5%至45%。
  10. 根据权利要求8所述的背接触太阳电池,其特征在于,
    在所述硅基底为n型硅基底且第二载流子为多子的情况下,或在所述硅基底为p型硅基底且所述第二载流子为少子的情况下,所述第二载流子选择层的材料选自功函数大于等于3eV的晶硅材料、功函数大于等于3eV的非晶硅材料、或第二材料中的至少一种;所述第二材料为功函数大于或等于3eV的金属氧族化合物;
    在所述硅基底为p型硅基底且所述第二载流子为多子的情况下,或在所述硅基底为n 型硅基底且所述第二载流子为少子的情况下,所述第二载流子选择层的材料选自:第一材料中的至少一种;所述第一材料为功函数大于等于5eV的n型金属氧族化合物、或功函数小于等于6eV的p型金属氧族化合物。
  11. 根据权利要求6或10所述的背接触太阳电池,其特征在于,
    所述金属氧族化合物中含有掺杂元素,掺杂元素选自卤族元素、过渡金属元素、碱金属元素、III族元素、IV族元素、V族元素中的至少一种。
  12. 根据权利要求6或10所述的背接触太阳电池,其特征在于,
    所述第二材料选自:氧化锌、氧化锡、氧化钛、氧化铜、氧化铊、硫化镉、硫化钼、硫化锌、硒化钼、硒化铜、掺铌氧化铜、氧化镉锗、氧化铱锌、氧化钴钙中的至少一种;
    所述第一材料选自:氧化钼、氧化钨、氧化钒、氧化铌、氧化镍、掺汞氧化铌、掺汞氧化钽中的至少一种。
  13. 根据权利要求2所述的背接触太阳电池,其特征在于,所述金属氧族化合物层的横向传导能力小于等于1.0×10 -3S/cm。
  14. 根据权利要求2所述的背接触太阳电池,其特征在于,在所述硅基底为p型硅基底且第二载流子为多子的情况下,或在所述硅基底为n型硅基底且所述第二载流子为少子的情况下,
    所述金属氧族化合物层的固定正电荷密度大于或等于10 11cm -2
    和/或,所述金属氧族化合物层的受主缺陷密度大于或等于10 11cm -2
    和/或,所述金属氧族化合物层的限位电荷密度大于或等于10 11cm -2
    在所述硅基底为n型硅基底且所述第二载流子为多子的情况下,或在所述硅基底为p型硅基底且所述第二载流子为少子的情况下,
    所述金属氧族化合物层的固定负电荷密度大于或等于10 12m -2
    和/或,所述金属氧族化合物层的施主缺陷密度大于或等于10 12cm -2
    和/或,所述金属氧族化合物层的限位电荷密度大于或等于10 12cm -2
  15. 根据权利要求2-5中任一所述的背接触太阳电池,其特征在于,所述金属氧族化合物层在可见光波段的平均透光率大于等于70%;
    所述金属氧族化合物层的厚度为1-600nm。
  16. 根据权利要求2-5中任一所述的背接触太阳电池,其特征在于,所述硅基底的背光面和所述金属氧族化合物层之间设置有隧穿隔离层;所述隧穿隔离层的厚度为0.1nm-5nm,所述隧穿隔离层为一层或多层结构。
  17. 根据权利要求16所述的背接触太阳电池,其特征在于,所述隧穿隔离层的材料选自:硅的氧化物、硅的氮化物、硅的氮氧化物、硅的卤化物中的至少一种。
  18. 根据权利要求16所述的背接触太阳电池,其特征在于,所述隧穿隔离层的材料为电介质材料,所述隧穿隔离层的材料的介电常数大于2;
    所述隧穿隔离层的击穿电压大于或等于3MV/cm。
  19. 根据权利要求16所述的背接触太阳电池,其特征在于,所述隧穿隔离层的材料选自:氧化硅、氮化硅、氟化硅、氟氧化硅、碳氧化硅、氧化铝、氟化铝、氮氧化铝中的至少一种。
  20. 根据权利要求2-4中任一所述的背接触太阳电池,其特征在于,所述第二载流子收集端和所述第二电极之间设置有第二透明导电薄膜和/或第二功函数调节层;所述第二透明导电薄膜和/或第二功函数调节层均位于所述第二载流子收集端的投影区域内;
    和/或,所述第一载流子收集端和所述第一电极之间设置有第一透明导电薄膜和/或第一功函数调节层;所述第一透明导电薄膜和/或第一功函数调节层均位于所述第一载流子收集端的投影区域内。
  21. 根据权利要求20所述的背接触太阳电池,其特征在于,所述第一功函数调节层、所述第二功函数调节层的厚度均为0.1-5nm;所述第一功函数调节层、所述第二功函数调节层的功函数均为1eV-5.5eV;
    所述第一透明导电薄膜由透明导电材料和功函数调节材料化合或混合形成;和/或,所述第二透明导电薄膜由透明导电材料和功函数调节材料化合或混合形成。
  22. 根据权利要求20所述的背接触太阳电池,其特征在于,在所述第二载流子收集端和所述第二电极之间设置有所述第二透明导电薄膜的情况下,所述第二电极以栅线的形式设置在所述第二透明导电薄膜的背光面;
    和/或,在所述第一载流子收集端和所述第一电极之间设置有所述第一透明导电薄膜的情况下,所述第一电极以栅线的形式设置在所述第一透明导电薄膜的背光面。
  23. 根据权利要求20所述的背接触太阳电池,其特征在于,所述第一透明导电薄膜与所述第二透明导电薄膜的材料均独立选自:氧化锌、掺铝氧化锌、氧化锡、掺铟氧化锡、掺铟镓氧化锡中的至少一种。
  24. 根据权利要求21所述的背接触太阳电池,其特征在于,所述功函数调节材料的功函数为1eV-5.5eV。
  25. 根据权利要求20所述的背接触太阳电池,其特征在于,所述第一功函数调节层、所述第二功函数调节层均独立选自:碱金属、过渡金属、碱金属卤化物或过渡金属卤化物中的至少一种。
  26. 根据权利要求20所述的背接触太阳电池,其特征在于,所述第一功函数调节层、所述第二功函数调节层均独立选自:钙、镁、钡、氟化锂、氟化钾、氟化镁、氯化钡中的至少一种。
  27. 根据权利要求2-5中任一所述的背接触太阳电池,其特征在于,所述硅基底的背光面为平面结构或陷光结构;
    和/或,所述硅基底的向光面为平面结构或陷光结构。
  28. 根据权利要求2-4中任一所述的背接触太阳电池,其特征在于,所第二载流子收集端的俯视图为点状或线状图案。
  29. 根据权利要求2或4所述的背接触太阳电池,其特征在于,所述硅基底的向光面设置有钝化层、正面场效应层、正面减反射薄膜层、散射结构层、聚光结构层中的至少一种;
    和/或,在所述金属氧族化合物层的背光面中,所述第二电极、所述第一电极之外的区域设置有背面钝化膜。
  30. 根据权利要求3所述的背接触太阳电池,其特征在于,所述第二区域的投影与所述第二载流子选择层的投影至少部分重合;
    所述第二载流子选择层位于所述金属氧族化合物层的背光面或向光面。
  31. 根据权利要求3或30所述的背接触太阳电池,其特征在于,
    所述第二载流子收集端在所述硅基底的背光面的投影的面积,占所述硅基底的背光面的总面积的5%至45%;
    所述第二载流子选择层在所述硅基底的背光面的投影的面积,占所述硅基底的背光面的总面积的5%至45%。
  32. 根据权利要求3或30所述的背接触太阳电池,其特征在于,在所述第二电极对应设置在所述第二载流子选择层上的情况下,所述第二载流子选择层和所述第二电极之间设置有第三透明导电薄膜和/或第三功函数调节层;所述第三透明导电薄膜和/或第三功函数调节层均位于所述第二载流子选择层的投影部分内。
  33. 根据权利要求32所述的背接触太阳电池,其特征在于,
    所述第三功函数调节层的厚度为0.1-2nm。
  34. 根据权利要求32所述的背接触太阳电池,其特征在于,
    在所述第二载流子选择层和所述第二电极之间设置有第三透明导电薄膜的情况下,所述第二电极以栅线的形式设置在所述第三透明导电薄膜的背光面。
  35. 根据权利要求3或30所述的背接触太阳电池,其特征在于,
    所述硅基底的向光面设置有钝化层、正面场效应层、正面减反射薄膜层、散射结构层、聚光结构层中的至少一种;
    和/或,在所述第二电极对应设置在所述第二载流子收集端上的情况下,在所述金属氧族化合物层的背光面中,所述第一电极之外的部分,以及在所述第二区域中所述第二电极之外的部分,均设置有背光面减反射膜;
    和/或,在所述第二电极对应设置在所述第二载流子选择层上的情况下,在所述金属氧族化合物层的背光面以及所述第二载流子选择层的背光面中,所述第一电极、所述第二电极之外的部分设置有背光面减反射膜。
  36. 根据权利要求4所述的背接触太阳电池,其特征在于,
    所述阻断结构为开槽;和/或,所述阻断结构为绝缘体。
  37. 根据权利要求4或36所述的背接触太阳电池,其特征在于,所述阻断结构的厚度大于或等于所述金属氧族化合物层的厚度;
    在所述阻断结构的厚度大于所述金属氧族化合物层的厚度的情况下,所述阻断结构朝向所述金属氧族化合物层的背光面凸出。
  38. 根据权利要求4或36所述的背接触太阳电池,其特征在于,
    所述第二载流子传输区和所述第二电极之间设置有第四透明导电薄膜和/或第四功函数调节层;所述第四透明导电薄膜和/或第四功函数调节层均位于所述第二载流子传输区的投影区域内;
    和/或,所述第一载流子收集端和所述第一电极之间设置有第一透明导电薄膜和/或第一功函数调节层;所述第一透明导电薄膜和/或第一功函数调节层均位于所述第一载流子收集端的投影区域内。
  39. 根据权利要求38所述的背接触太阳电池,其特征在于,
    所述第四透明导电薄膜的厚度为0.1-2nm。
  40. 根据权利要求38所述的背接触太阳电池,其特征在于,
    在所述第二载流子传输区和所述第二电极之间设置有第四透明导电薄膜的情况下, 所述第二电极以栅线的形式设置在所述第四透明导电薄膜的背光面;
    和/或,在所述第一载流子收集端和所述第一电极之间设置有第一透明导电薄膜的情况下,所述第一电极以栅线的形式设置在所述第一透明导电薄膜的背光面。
  41. 根据权利要求5所述的背接触太阳电池,其特征在于,所述金属氧族化合物层中,所述第二载流子传输区和所述第一载流子收集端之间设置有阻断结构。
  42. 根据权利要求41所述的背接触太阳电池,其特征在于,所述阻断结构为开槽;和/或,所述阻断结构为高阻体,所述高阻体的电阻率是所述金属氧族化合物层的电阻率100倍以上。
  43. 根据权利要求5或41所述的背接触太阳电池,其特征在于,所述第二载流子选择收集层的厚度为1-500nm。
  44. 根据权利要求5或41所述的背接触太阳电池,其特征在于,所述第二载流子选择收集层在所述硅基底的背光面的投影的面积,占所述硅基底的背光面的总面积的5%至45%。
  45. 根据权利要求5所述的背接触太阳电池,其特征在于,还包括隧穿隔离层;所述隧穿隔离层位于所述硅基底的背光面与所述金属氧族化合物层与所述第二载流子选择收集层两者共同的向光面之间;所述隧穿隔离层的厚度为0.1nm-5nm,所述隧穿隔离层为一层或多层结构。
  46. 根据权利要求5或41所述的背接触太阳电池,其特征在于,所述第二电极和所述第二载流子选择收集层之间设置有第五透明导电薄膜和/或第五功函数调节层;所述第五透明导电薄膜和/或第五功函数调节层均位于所述第二载流子选择收集层的投影区域内;
    和/或,所述第一电极和所述第一载流子收集端之间设置有第一透明导电薄膜和/或第一功函数调节层;所述第一透明导电薄膜和/或第一功函数调节层均位于所述第一载流子收集端的投影区域内。
  47. 根据权利要求46所述的背接触太阳电池,其特征在于,所述第五功函数调节层的厚度为0.1-2nm。
  48. 根据权利要求46所述的背接触太阳电池,其特征在于,在所述第二电极和所述第二载流子选择收集层之间设置有所述第五透明导电薄膜的情况下,所述第二电极以栅线的形式设置在所述第五透明导电薄膜的背光面;
    和/或,在所述第一电极和所述第一载流子收集端之间设置有所述第一透明导电薄膜的情况下,所述第一电极以栅线的形式设置在所述第一透明导电薄膜的背光面。
  49. 根据权利要求5或41所述的背接触太阳电池,其特征在于,所述第二载流子选择收集层的俯视图为点状或线状图案。
  50. 根据权利要求5所述的背接触太阳电池,其特征在于,所述硅基底的向光面设置有钝化层、正面场效应层、正面减反射薄膜层、散射结构层、聚光结构层中的至少一种;
    和/或,在所述金属氧族化合物层以及所述第二载流子传输区两者的背光面中,所述第一电极、所述第二电极之外的区域设置有背面减反射膜。
  51. 一种背接触太阳电池的生产方法,其特征在于,包括:
    提供硅基底;所述硅基底的背光面分为第一区域和第二区域;
    至少在所述硅基底的所述第一区域沉积得到金属氧族化合物层;所述金属氧族化合物层与所述第一区域对应的区域形成第一载流子收集端;
    在所述第一载流子收集端上对应设置第一电极;
    在所述第二区域对应的区域内对应设置第二电极。
  52. 根据权利要求51所述的背接触太阳电池的生产方法,其特征在于,所述至少在所述硅基底的所述第一区域沉积得到金属氧族化合物层之前,还包括:
    对所述第二区域的硅基底进行掺杂,形成第二载流子收集端;
    所述至少在所述硅基底的所述第一区域沉积得到金属氧族化合物层的步骤,包括:
    在整个所述硅基底的背光面上沉积得到金属氧族化合物层;所述金属氧族化合物层与所述第二区域对应的区域形成第二载流子传输区;
    所述在所述第二区域对应的区域内对应设置第二电极的步骤,包括:
    在所述第二载流子传输区上对应设置所述第二电极。
  53. 一种背接触电池组件,其特征在于,包括:权利要求1至权利要求50中任一所述的背接触太阳电池。
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