WO2021251386A1 - 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法 - Google Patents

回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法 Download PDF

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WO2021251386A1
WO2021251386A1 PCT/JP2021/021760 JP2021021760W WO2021251386A1 WO 2021251386 A1 WO2021251386 A1 WO 2021251386A1 JP 2021021760 W JP2021021760 W JP 2021021760W WO 2021251386 A1 WO2021251386 A1 WO 2021251386A1
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WIPO (PCT)
Prior art keywords
component
adhesive layer
circuit connection
adhesive film
meth
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/JP2021/021760
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English (en)
French (fr)
Japanese (ja)
Inventor
孝 中澤
裕行 酒井
将人 福井
和也 成冨
智陽 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Showa Denko Materials Co Ltd
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Publication date
Application filed by Showa Denko Materials Co Ltd filed Critical Showa Denko Materials Co Ltd
Priority to US17/926,362 priority Critical patent/US20230234333A1/en
Priority to KR1020227040629A priority patent/KR20230023621A/ko
Priority to EP21822911.0A priority patent/EP4140737A1/en
Priority to KR1020267005962A priority patent/KR20260032650A/ko
Priority to CN202510647677.2A priority patent/CN120349739A/zh
Priority to CN202180037776.9A priority patent/CN115667446A/zh
Priority to JP2022530581A priority patent/JPWO2021251386A1/ja
Publication of WO2021251386A1 publication Critical patent/WO2021251386A1/ja
Anticipated expiration legal-status Critical
Priority to JP2025273960A priority patent/JP2026034742A/ja
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
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    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
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    • C09J201/00—Adhesives based on unspecified macromolecular compounds
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    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/30—Particles characterised by physical dimension
    • B32B2264/303—Average diameter greater than 1µm
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    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
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    • B32B2457/08—PCBs, i.e. printed circuit boards
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    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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    • C09J2471/00—Presence of polyether
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
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    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

Definitions

  • the present disclosure relates to an adhesive film for circuit connection, a circuit connection structure, and a method for manufacturing the same.
  • liquid crystal display panels organic EL panels, etc. have been used as various display means for televisions, PC monitors, mobile phones, smart phones, and the like.
  • a so-called COG (chip on glass) mounting in which a driving IC is directly mounted on a glass substrate of a display panel is adopted from the viewpoint of fine pitch, light weight and thinness.
  • a semiconductor element such as a liquid crystal driving IC is connected on a transparent substrate (glass substrate or the like) having a plurality of transparent electrodes (ITO (indium tin oxide) or the like).
  • ITO indium tin oxide
  • an adhesive film for circuit connection having anisotropic conductivity in which conductive particles are dispersed in the adhesive is used.
  • the liquid crystal drive IC when a liquid crystal drive IC is mounted as a semiconductor element, the liquid crystal drive IC has a plurality of electrode terminals corresponding to transparent electrodes on the mounting surface thereof, and is an adhesive for circuit connection having anisotropic conductivity.
  • a polyimide substrate having a circuit electrode having a titanium layer on the outermost layer is mainly used.
  • the circuit electrode having the titanium layer on the outermost surface has an oxide film on the surface thereof, and the higher the resin fluidity of the adhesive film for circuit connection, the more the connection resistance between the circuits. Was found to be prone to low.
  • the high resin fluidity means that the conductive particles are likely to flow at the same time, and the flowing conductive particles are likely to cause short-circuit defects between adjacent circuits.
  • the resin exclusion property itself can be tolerated in principle by mounting at high pressure.
  • an adhesive layer such as a pressure-sensitive resin and a film such as PET (polyethylene terephthalate) and PEN (polyethylene naphthalate) are usually arranged on the lower surface of the polyimide substrate, and together with the polyimide substrate, Stress accumulates on the circuit electrode having the titanium layer on the outermost layer, cracks occur, and there is a possibility that the circuit may be broken. Therefore, when mounting a flexible display, it is desirable to mount it at a low voltage (for example, an area conversion pressure of 0.1 to 50 MPa at a bump electrode), and the adhesive film for circuit connection used for COP mounting is mounted under low pressure. It is required to suppress the fluidity of the conductive particles and the increase in the connection resistance in the above.
  • the present disclosure is a circuit connection adhesive capable of improving the capture rate of conductive particles between facing electrodes of a circuit connection structure and reducing the connection resistance even when mounted at a low voltage.
  • the main purpose is to provide the film.
  • the circuit connection adhesive film is provided on a first adhesive layer containing conductive particles, a cured product of a photocurable resin component, and a first thermosetting resin component, and a first adhesive layer. It is provided with a second adhesive layer containing a second thermosetting resin component.
  • the thickness of the first adhesive layer is 5 ⁇ m or less. According to such a circuit-connecting adhesive film, it is possible to suppress the decrease in the removability of the resin while suppressing the fluidity of the conductive particles at the time of circuit connection by curing the photocurable resin component. Further, when the thickness of the first adhesive layer is 5 ⁇ m or less, the fluidity of the conductive particles at the time of circuit connection can be further suppressed. Therefore, even when mounted at a low voltage, it is possible to improve the capture rate of conductive particles between the facing electrodes of the circuit connection structure and reduce the connection resistance.
  • Such a circuit connection adhesive film can be suitably used for COP mounting.
  • the first thermosetting resin component and the second thermosetting resin component may contain a cationically polymerizable compound and a thermally cationic polymerization initiator, and the photocurable resin component contains a radically polymerizable compound. You may. At this time, the first thermosetting resin component and the second thermosetting resin component have cation curability, and the photocurable resin component has radical curability. According to the studies by the present inventors, if the first thermosetting resin component, the second thermosetting resin component, and the photocurable resin component are such a combination, for example, all the curable resin components Tends to be better in terms of connection resistance than when it has cation curability. The inventors of the present disclosure infer that the reason for such an effect is as follows.
  • the cationically active species remains when forming a cured product of the photocurable resin component. It is considered that this is because the cationically active species promotes the curing reaction of the second thermosetting resin component in the second adhesive layer and reduces the resin's removability. .. Therefore, if the photocurable resin component has radical curability, cationic active species are not generated when the cured product of the photocurable resin component is formed, so that the second adhesive layer has a second layer. It is expected that the progress of the curing reaction of the thermosetting resin component can be suppressed, the deterioration of the resin's exclusion property can be suppressed, and the connection resistance can be reduced.
  • the cationically polymerizable compound may be at least one selected from the group consisting of an oxetane compound and an alicyclic epoxy compound.
  • the thermal cationic polymerization initiator may be a salt compound having an anion containing boron as a constituent element.
  • the circuit connection adhesive film further comprises a third adhesive layer containing a third thermosetting resin component provided on the opposite side of the first adhesive layer from the second adhesive layer. May be.
  • the third thermosetting resin component may contain a cationically polymerizable compound and a thermally cationic polymerization initiator.
  • Another aspect of this disclosure relates to a method of manufacturing a circuit connection structure.
  • the above-mentioned circuit connection adhesive film is interposed between the first circuit member having the first electrode and the second circuit member having the second electrode.
  • the circuit connection structure is arranged between a first circuit member having a first electrode, a second circuit member having a second electrode, and a first circuit member and a second circuit member.
  • a circuit connection portion for electrically connecting the first electrode and the second electrode to each other is provided.
  • the circuit connection portion includes a cured product of the above-mentioned circuit connection adhesive film.
  • a circuit connection adhesive capable of improving the capture rate of conductive particles between facing electrodes of a circuit connection structure and reducing the connection resistance even when mounted at a low voltage.
  • the film is disclosed.
  • Such a circuit connection adhesive film can be suitably used for COP mounting.
  • a circuit connection structure using such a circuit connection adhesive film and a method for manufacturing the same are disclosed.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of an adhesive film for circuit connection.
  • FIG. 2 is a schematic cross-sectional view showing an embodiment of a circuit connection structure.
  • FIG. 3 is a schematic cross-sectional view showing an embodiment of a method for manufacturing a circuit connection structure. 3 (a) and 3 (b) are schematic cross-sectional views showing each process.
  • the numerical range indicated by using "-" indicates a range including the numerical values before and after "-" as the minimum value and the maximum value, respectively.
  • the upper limit value or the lower limit value of the numerical range of one step may be replaced with the upper limit value or the lower limit value of the numerical range of another step.
  • the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.
  • the upper limit value and the lower limit value described individually can be arbitrarily combined.
  • the numerical values A and B at both ends are included in the numerical range as the lower limit value and the upper limit value, respectively.
  • the description of "10 or more” means “10” and “a numerical value exceeding 10", and the same applies when the numerical values are different.
  • the description “10 or less” means “10” and “a numerical value less than 10", and the same applies when the numerical values are different.
  • the term “(meth) acrylate” means at least one of acrylate and the corresponding methacrylate. The same applies to other similar expressions such as “(meth) acryloyl” and "(meth) acrylic acid”.
  • “A or B” may include either A or B, and may include both.
  • the materials exemplified below may be used alone or in combination of two or more.
  • the content of each component in the composition means the total amount of the plurality of substances present in the composition when a plurality of substances corresponding to each component are present in the composition, unless otherwise specified.
  • FIG. 1 is a schematic cross-sectional view showing an embodiment of an adhesive film for circuit connection.
  • the circuit connection adhesive film 10 (hereinafter, may be simply referred to as “adhesive film 10”) shown in FIG. 1 includes conductive particles 4, a cured product of a photocurable resin component, and (first).
  • the adhesive layer 2 of 2 is provided.
  • a first region which is a region formed from the first adhesive film (first adhesive layer 1), and a second region provided adjacent to the first region are provided.
  • the adhesive film 10 has a first region containing conductive particles 4, a cured product of a photocurable resin component, and an adhesive component 5 containing a (first) thermosetting resin component, and a first region. It can also be said that the region is provided with a second region containing a (second) thermosetting resin component, which is provided adjacent to the region.
  • the adhesive film 10 the conductive particles 4 are dispersed in the first adhesive layer 1. Therefore, the adhesive film 10 can be a circuit-connecting adhesive film (anisotropic adhesive film) having anisotropic conductivity.
  • the adhesive film 10 is interposed between the first circuit member having the first electrode and the second circuit member having the second electrode, and heats the first circuit member and the second circuit member. It may be crimped and used to electrically connect the first electrode and the second electrode to each other.
  • the conductive particles 4 (hereinafter, may be referred to as "(A) component”) and the photocurable resin component (hereinafter, may be referred to as “(B) component”) are cured. It contains a substance and a thermosetting resin component (hereinafter, may be referred to as "(C) component”).
  • a composition layer composed of a composition containing the component (A), the component (B), and the component (C) is irradiated with light energy, and the component (B) is subjected to light energy. It can be obtained by polymerizing the contained components and curing the component (B).
  • the first adhesive layer 1 contains the component (A), the cured product of the component (B), and the adhesive component 5 containing the component (C).
  • the cured product of the component (B) may be a cured product obtained by completely curing the component (B), or may be a cured product obtained by curing a part of the component (B).
  • the component (C) is a component that can flow when connected to a circuit, and is, for example, an uncured curable resin component.
  • Component (A) Conductive particles
  • the component (A) is not particularly limited as long as it is a particle having conductivity, and is a metal particle composed of a metal such as Au, Ag, Pd, Ni, Cu, or solder, or conductive carbon. It may be a conductive carbon particle composed of.
  • the component (A) may be a coated conductive particle containing a nucleus containing non-conductive glass, ceramic, plastic (polystyrene, etc.) and the like, and a coating layer containing the metal or conductive carbon and covering the nucleus. good.
  • the component (A) preferably comprises a core containing metal particles or plastic formed of a heat-meltable metal, and a coating layer containing metal or conductive carbon and coating the core.
  • Such coated conductive particles can easily deform the cured product of the thermosetting resin component by heating or pressurizing, when the electrodes are electrically connected to each other, the electrode and the component (A) are connected to each other.
  • the contact area can be increased and the conductivity between the electrodes can be further improved.
  • the component (A) may be an insulating coated conductive particle containing the above-mentioned metal particles, conductive carbon particles, or coated conductive particles and an insulating material such as a resin and having an insulating layer covering the surface of the particles. good.
  • the component (A) is an insulating coated conductive particle, even when the content of the component (A) is large, the insulating layer is provided on the surface of the particle, so that the component (A) is short-circuited due to contact with each other. The generation can be suppressed, and the insulation between adjacent electrode circuits can be improved.
  • one of the above-mentioned various conductive particles may be used alone or in combination of two or more.
  • the maximum particle size of the component (A) needs to be smaller than the minimum distance between the electrodes (the shortest distance between adjacent electrodes).
  • the maximum particle size of the component (A) may be 1.0 ⁇ m or more, 2.0 ⁇ m or more, or 2.5 ⁇ m or more from the viewpoint of excellent dispersibility and conductivity.
  • the maximum particle size of the component (A) may be 20 ⁇ m or less, 10 ⁇ m or less, or 5 ⁇ m or less from the viewpoint of excellent dispersibility and conductivity.
  • the particle size of any 300 conductive particles (pcs) is measured by observation using a scanning electron microscope (SEM), and the largest value obtained is the maximum particle size of the component (A).
  • SEM scanning electron microscope
  • the particle size of the component (A) is the diameter of a circle circumscribing the conductive particles in the SEM image.
  • the average particle size of the component (A) may be 1.0 ⁇ m or more, 2.0 ⁇ m or more, or 2.5 ⁇ m or more from the viewpoint of excellent dispersibility and conductivity.
  • the average particle size of the component (A) may be 20 ⁇ m or less, 10 ⁇ m or less, or 5 ⁇ m or less from the viewpoint of excellent dispersibility and conductivity.
  • the particle size of any 300 conductive particles (pcs) is measured by observation using a scanning electron microscope (SEM), and the average value of the obtained particle sizes is taken as the average particle size.
  • the component (A) is preferably uniformly dispersed.
  • the particle density of the component (A) in the adhesive film 10 is 100 pieces / mm 2 or more, 1000 pieces / mm 2 or more, 3000 pieces / mm 2 or more, or 5000 pieces / mm from the viewpoint of obtaining stable connection resistance. It may be 2 or more.
  • the particle density of the component (A) in the adhesive film 10 is 100,000 pieces / mm 2 or less, 70,000 pieces / mm 2 or less, 50,000 pieces / mm 2 or less, or 30,000 from the viewpoint of improving the insulating property between adjacent electrodes. Pieces / mm 2 or less may be used.
  • the content of the component (A) is 1% by mass or more, 5% by mass or more, or 10% by mass or more based on the total mass of the first adhesive layer from the viewpoint of further improving the conductivity. It may be there.
  • the content of the component (A) may be 60% by mass or less, 50% by mass or less, or 40% by mass or less based on the total mass of the first adhesive layer from the viewpoint of easily suppressing a short circuit.
  • the content of the component (A) is in the above range, the effect of the present disclosure tends to be remarkably exhibited.
  • the content of the component (A) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • Component (B) Photocurable resin component
  • the component (B) is not particularly limited as long as it is a resin component that is cured by light irradiation, but when the component (C) is a resin component having cation curability, (B)
  • the component may be a resin component having radical curability from the viewpoint of better connection resistance.
  • the component (B) contains, for example, a radically polymerizable compound (hereinafter, may be referred to as “(B1) component”) and a photoradical polymerization initiator (hereinafter, may be referred to as “(B2) component”). You may be.
  • the component (B) can be a component composed of the component (B1) and the component (B2).
  • Component (B1) Radical Polymerizable Compound
  • the component (B1) is a compound polymerized by radicals generated from the component (B2) by irradiation with light (for example, ultraviolet light).
  • the component (B1) may be either a monomer or a polymer (or oligomer) obtained by polymerizing one or more kinds of monomers.
  • the component (B1) one type may be used alone, or a plurality of them may be used in combination.
  • the component (B1) is a compound having a radically polymerizable group that reacts with a radical.
  • the radically polymerizable group include (meth) acryloyl group, vinyl group, allyl group, styryl group, alkenyl group, alkenylene group, maleimide group and the like.
  • the number of radically polymerizable groups (number of functional groups) of the component (B1) is 2 or more from the viewpoint that the desired melt viscosity can be easily obtained after polymerization, the effect of reducing the connection resistance is further improved, and the connection reliability is superior. It may be 10 or less from the viewpoint of suppressing curing shrinkage during polymerization. Further, in order to balance the crosslink density and the curing shrinkage, in addition to the compound having the number of radically polymerizable groups within the above range, a compound having the number of radically polymerizable groups outside the above range may be used. good.
  • the component (B1) may contain, for example, a polyfunctional (bifunctional or higher) (meth) acrylate from the viewpoint of suppressing the flow of conductive particles.
  • the polyfunctional (bifunctional or higher) (meth) acrylate may be a bifunctional (meth) acrylate, and the bifunctional (meth) acrylate may be a bifunctional aromatic (meth) acrylate.
  • polyfunctional (meth) acrylate examples include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, and polyethylene glycol di (meth) acrylate.
  • the content of the polyfunctional (bifunctional or higher) (meth) acrylate is, for example, 40 to 100, based on the total mass of the component (B1), from the viewpoint of achieving both the effect of reducing the connection resistance and the suppression of particle flow. It may be% by mass, 50 to 100% by mass, or 60 to 100% by mass.
  • the component (B1) may further contain a monofunctional (meth) acrylate in addition to the polyfunctional (bifunctional or higher) (meth) acrylate.
  • a monofunctional (meth) acrylate examples include (meth) acrylic acid; methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, and tert-butyl (meth) acrylate.
  • (Meta) acrylates having an alicyclic epoxy group such as, ( Examples thereof include (meth) acrylate having an oxetanyl group such as 3-ethyloxetane-3-yl) methyl (meth) acrylate.
  • the content of the monofunctional (meth) acrylate may be, for example, 0 to 60% by mass, 0 to 50% by mass, or 0 to 40% by mass based on the total mass of the component (B1).
  • the cured product of the component (B) may have, for example, a polymerizable group that reacts with a substance other than a radical.
  • the polymerizable group that reacts with a non-radical substance may be, for example, a cationically polymerizable group that reacts with a cation.
  • the cationically polymerizable group include an epoxy group such as a glycidyl group, an alicyclic epoxy group such as an epoxycyclohexylmethyl group, and an oxetanyl group such as an ethyloxetanylmethyl group.
  • the cured product of the component (B) having a polymerizable group that reacts by other than a radical is, for example, a (meth) acrylate having an epoxy group, a (meth) acrylate having an alicyclic epoxy group, or a (meth) acrylate having an oxetanyl group. It can be introduced by using a (meth) acrylate having a polymerizable group that reacts with a non-radical substance such as (B) as a component (B).
  • (B1) Mass ratio of (meth) acrylate having a polymerizable group that reacts with other than radicals to the total mass of the component (mass of (meth) acrylate having a polymerizable group that reacts with other than radicals (charged amount) / (B1)
  • the total mass (charged amount) of the components may be, for example, 0 to 0.7, 0 to 0.5, or 0 to 0.3 from the viewpoint of improving reliability.
  • the component (B1) may contain other radically polymerizable compounds in addition to polyfunctional (bifunctional or higher) and monofunctional (meth) acrylates.
  • examples of other radically polymerizable compounds include maleimide compounds, vinyl ether compounds, allyl compounds, styrene derivatives, acrylamide derivatives, nadiimide derivatives and the like.
  • the content of the other radically polymerizable compound may be, for example, 0 to 40% by mass based on the total mass of the component (B1).
  • Component (B2) Photoradical Polymerization Initiator
  • the component (B2) comprises light containing a wavelength in the range of 150 to 750 nm, preferably light containing a wavelength in the range of 254 to 405 nm, and more preferably a wavelength in the range of 365 nm. It is a photopolymerization initiator that generates radicals by irradiation with light (for example, ultraviolet light).
  • the component (B2) one type may be used alone, or a plurality of them may be used in combination.
  • the component (B2) is decomposed by light to generate free radicals. That is, the component (B2) is a compound that generates radicals by applying light energy from the outside.
  • the component (B2) includes an oxime ester structure, a bisimidazole structure, an acrydin structure, an ⁇ -aminoalkylphenone structure, an aminobenzophenone structure, an N-phenylglycine structure, an acylphosphine oxide structure, a benzyldimethylketal structure, and an ⁇ -hydroxyalkylphenone structure. It may be a compound having a structure such as. As the component (B2), one type may be used alone, or a plurality of them may be used in combination.
  • the component (B2) is selected from the group consisting of an oxime ester structure, an ⁇ -aminoalkylphenone structure, and an acylphosphine oxide structure from the viewpoint that the desired melt viscosity can be easily obtained and the effect of reducing the connection resistance is superior. It may be a compound having at least one structure.
  • the compound having an oxime ester structure examples include 1-phenyl-1,2-butandion-2- (o-methoxycarbonyl) oxime and 1-phenyl-1,2-propanedione-2- (o-methoxycarbonyl).
  • the compound having an ⁇ -aminoalkylphenone structure examples include 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one and 2-benzyl-2-dimethylamino-1. -Morphorinophenyl) -butanone-1 and the like can be mentioned.
  • the compound having an acylphosphine oxide structure include bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide and bis (2,4,6, -trimethylbenzoyl) -phenylphosphine.
  • examples thereof include oxides, 2,4,6-trimethylbenzoyl-diphenylphosphine oxides and the like.
  • the content of the component (B2) is, for example, 0.1 to 10 parts by mass, 0.3 to 7 parts by mass, or 0 with respect to 100 parts by mass of the component (B1) from the viewpoint of suppressing the flow of the conductive particles. It may be 5 to 5 parts by mass.
  • the content of the cured product of the component (B) is 1% by mass or more, 5% by mass or more, or 10% by mass or more based on the total mass of the first adhesive layer from the viewpoint of suppressing the flow of the conductive particles. May be.
  • the content of the cured product of the component (B) is 50% by mass or less, 40% by mass or less, or 30% by mass based on the total mass of the first adhesive layer from the viewpoint of developing low resistance in low-pressure mounting. It may be as follows. When the content of the cured product of the component (B) is in the above range, the effect of the present disclosure tends to be remarkably exhibited.
  • the content of the component (B) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • Component (C) Thermosetting resin component
  • the component (C) is not particularly limited as long as it is a resin component that cures by heat, but if the component (B) is a resin component having radical curability, the component (C) May be a resin component having cation curability from the viewpoint of being superior in terms of connection resistance.
  • the component (C) contains, for example, a cationically polymerizable compound (hereinafter, may be referred to as “(C1) component”) and a thermal cationic polymerization initiator (hereinafter, may be referred to as “(C2) component”). You may be.
  • the component (C) can be a component composed of the component (C1) and the component (C2).
  • the first thermosetting resin component, the second thermosetting resin component, and the third thermosetting resin component are the first adhesive layer, the second adhesive layer, and the third, respectively. It means a thermosetting resin component contained in an adhesive layer, and is a component contained in a first thermosetting resin component, a second thermosetting resin component, and a third thermosetting resin component (for example,). (C1) component, (C2) component, etc.) and the content may be the same as or different from each other.
  • Component (C1) Cationicly polymerizable compound
  • the component (C1) is a compound that crosslinks by reacting with the component (C2) by heat.
  • the component (C1) means a compound having no radically polymerizable group that reacts with a radical, and the component (C1) is not included in the component (B1).
  • the component (C1) may be at least one selected from the group consisting of, for example, an oxetane compound and an alicyclic epoxy compound from the viewpoint of further improving the effect of reducing the connection resistance and improving the connection reliability.
  • As the component (C1) one type may be used alone, or a plurality of types may be used in combination.
  • the component (C1) preferably contains at least one oxetane compound and at least one alicyclic epoxy compound from the viewpoint that the desired melt viscosity can be easily obtained.
  • the oxetane compound as the component (C1) can be used without particular limitation as long as it is a compound having an oxetane group and no radically polymerizable group.
  • examples of commercially available oxetane compounds include ETERNACOLL OXBP (trade name, 4,4'-bis [(3-ethyl-3-oxetanyl) methoxymethyl] biphenyl, manufactured by Ube Kosan Co., Ltd.), OXSQ, OXT-121, and the like. Examples thereof include OXT-221, OXT-101, and OXT-212 (trade name, manufactured by Toagosei Co., Ltd.). These may use one kind of compound alone or may use a plurality of compounds in combination.
  • the alicyclic epoxy compound as the component (C1) can be used without particular limitation as long as it is a compound having an alicyclic epoxy group (for example, an epoxycyclohexyl group) and no radical polymerizable group.
  • Examples of commercially available alicyclic epoxy compounds include EHPE3150, EHPE3150CE, seroxide 8010, seroxide 2021P, and seroxide 2081 (trade name, manufactured by Daicel Corporation). These may use one kind of compound alone or may use a plurality of compounds in combination.
  • Component (C2) Thermal Cationic Polymerization Initiator
  • the component (C2) is a thermal polymerization initiator that generates an acid or the like by heating to initiate polymerization.
  • the component (C2) may be a salt compound composed of a cation and an anion.
  • (C2) component for example, BF 4 -, BR 4 - (R represents a 2 or more fluorine atoms or more a phenyl group substituted by trifluoromethyl group.), PF 6 -, SbF 6 - , AsF 6 ⁇ and the like, sulfonium salt, phosphonium salt, ammonium salt, diazonium salt, iodonium salt, onium salt such as anilinium salt and the like.
  • One of these may be used alone, or a plurality of them may be used in combination.
  • C2 component from the viewpoint of storage stability, for example, anions containing boron as an element, i.e., BF 4 - or BR 4 - (R is a 2 or more fluorine atoms or more trifluoromethyl group It may be a salt compound having a substituted phenyl group.).
  • Anions containing boron as an element is, BR 4 - a may be, more specifically, may be a tetrakis (pentafluorophenyl) borate.
  • the onium salt as the component (C2) may be, for example, an anilinium salt because it has resistance to a substance that can inhibit curing against cationic curing.
  • anilinium salt compound examples include N, N-dialkylanilinium salts such as N, N-dimethylanilinium salt and N, N-diethylanilinium salt.
  • the component (C2) may be an anilinium salt having an anion containing boron as a constituent element.
  • anilinium salt compounds include CXC-1821 (trade name, manufactured by King Industries) and the like.
  • the content of the component (C2) is, for example, 0 with respect to 100 parts by mass of the component (C1) from the viewpoint of ensuring the formability and curability of the adhesive film for forming the first adhesive layer. It may be 1 to 20 parts by mass, 1 to 18 parts by mass, 3 to 15 parts by mass, or 5 to 12 parts by mass.
  • the content of the component (C) is 5% by mass or more based on the total mass of the first adhesive layer from the viewpoint of ensuring the curability of the adhesive film for forming the first adhesive layer. It may be 10% by mass or more, 15% by mass or more, or 20% by mass or more.
  • the content of the component (C) is 70% by mass or less based on the total mass of the first adhesive layer from the viewpoint of ensuring the formability of the adhesive film for forming the first adhesive layer. It may be 60% by mass or less, 50% by mass or less, or 40% by mass or less.
  • the first adhesive layer 1 may further contain other components in addition to the component (A), the cured product of the component (B), and the component (C).
  • other components include a thermoplastic resin (hereinafter, may be referred to as “(D) component”), a coupling agent (hereinafter, may be referred to as “(E) component”), and a filler (hereinafter, may be referred to as “component”).
  • component a thermoplastic resin
  • (E) component” a coupling agent
  • component hereinafter, may be referred to as “component”.
  • component a filler
  • the component (D) examples include phenoxy resin, polyester resin, polyamide resin, polyurethane resin, polyester urethane resin, acrylic rubber, epoxy resin (solid at 25 ° C.) and the like. One of these may be used alone, or a plurality of them may be used in combination.
  • the composition layer further, the first adhesive layer 1 from the composition. Can be easily formed.
  • the component (D) may be, for example, a phenoxy resin.
  • the content of the component (D) may be 1% by mass or more, 5% by mass or more, or 10% by mass or more, and is 70% by mass or less and 50% by mass, based on the total mass of the first adhesive layer. It may be less than or equal to 30% by mass or less.
  • the content of the component (D) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the component (E) examples include a silane coupling agent having an organic functional group such as a (meth) acryloyl group, a mercapto group, an amino group, an imidazole group and an epoxy group, a silane compound such as tetraalkoxysilane, and a tetraalkoxy titanate derivative. , Polydialkyl titanate derivatives and the like. One of these may be used alone, or a plurality of them may be used in combination.
  • the component (E) may be, for example, a silane coupling agent.
  • the content of the component (E) may be 0.1 to 10% by mass based on the total mass of the first adhesive layer.
  • the content of the component (E) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the component (F) include non-conductive fillers (for example, non-conductive particles).
  • the component (F) may be either an inorganic filler or an organic filler.
  • the inorganic filler include metal oxide fine particles such as silica fine particles, alumina fine particles, silica-alumina fine particles, titania fine particles, and zirconia fine particles; and inorganic fine particles such as metal nitride fine particles.
  • the organic filler include organic fine particles such as silicone fine particles, methacrylate / butadiene / styrene fine particles, acrylic / silicone fine particles, polyamide fine particles, and polyimide fine particles. One of these may be used alone, or a plurality of them may be used in combination.
  • the component (F) may be, for example, silica fine particles.
  • the content of the component (F) may be 0.1 to 10% by mass based on the total mass of the first adhesive layer.
  • the content of the component (F) in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the first adhesive layer 1 may further contain other additives such as a softening agent, an accelerator, a deterioration inhibitor, a coloring agent, a flame retardant, and a thixotropic agent.
  • the content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the first adhesive layer.
  • the content of other additives in the composition or the composition layer (based on the total mass of the composition or the composition layer) may be the same as the above range.
  • the thickness d1 of the first adhesive layer 1 is 5 ⁇ m or less, and may be, for example, 4.5 ⁇ m or less, 4.0 ⁇ m or less, 3.5 ⁇ m or less, 3.0 ⁇ m or less, or 2.5 ⁇ m or less. ..
  • the thickness d1 of the first adhesive layer 1 may be, for example, 0.1 ⁇ m or more or 0.7 ⁇ m or more.
  • the thickness d1 of the first adhesive layer 1 can be obtained, for example, by the method described in Examples. Further, as shown in FIG. 1, when a part of the conductive particles 4 is exposed from the surface of the first adhesive layer 1 (for example, protruding toward the second adhesive layer 2), the first The first adhesive layer 1 and the second adhesive layer 2 located at the separated portions of the adjacent conductive particles 4 and 4 from the surface 2a of the adhesive layer 1 opposite to the second adhesive layer 2 side. The distance to the boundary S with and (the distance indicated by d1 in FIG. 1) is the thickness of the first adhesive layer 1, and the exposed portion of the conductive particles 4 is included in the thickness of the first adhesive layer 1. I can't. The length of the exposed portion of the conductive particles 4 may be, for example, 0.1 ⁇ m or more, and may be 5 ⁇ m or less.
  • the second adhesive layer 2 contains the component (C).
  • the component (C1) and the component (C2) used in the component (C) in the second adhesive layer 2 are (C) in the first adhesive layer 1. Since it is the same as the component (C1) and the component (C2) used in the component (that is, the first thermosetting resin component), detailed description thereof will be omitted here.
  • the second thermosetting resin component may be the same as or different from the first thermosetting resin component.
  • the content of the component (C) is 5% by mass or more, 10% by mass or more, 15% by mass or more, or 20% by mass or more based on the total mass of the second adhesive layer from the viewpoint of maintaining reliability. May be.
  • the content of the component (C) is 70% by mass or less and 60% by mass or less based on the total mass of the second adhesive layer from the viewpoint of preventing the resin seepage problem in the reel, which is one aspect of the supply form. , 50% by mass or less, or 40% by mass or less.
  • the second adhesive layer 2 may further contain other components and other additives in the first adhesive layer 1. Preferred embodiments of the other components and other additives are the same as the preferred embodiments of the first adhesive layer 1.
  • the content of the component (D) may be 1% by mass or more, 5% by mass or more, or 10% by mass or more, and is 80% by mass or less and 60% by mass, based on the total mass of the second adhesive layer. It may be less than or equal to 40% by mass or less.
  • the content of the component (E) may be 0.1 to 10% by mass based on the total mass of the second adhesive layer.
  • the content of the component (F) may be 1% by mass or more, 10% by mass or more, or 30% by mass or more, and 90% by mass or less, 70% by mass, based on the total mass of the second adhesive layer. It may be less than or equal to 50% by mass or less.
  • the content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the second adhesive layer.
  • the thickness d2 of the second adhesive layer 2 may be appropriately set according to the height of the electrodes of the circuit member to be adhered.
  • the thickness d2 of the second adhesive layer 2 is 5 ⁇ m or more or 7 ⁇ m or more from the viewpoint that the space between the electrodes can be sufficiently filled to seal the electrodes and better connection reliability can be obtained. It may be 15 ⁇ m or less or 11 ⁇ m or less.
  • the thickness d2 of the second adhesive layer 2 can be obtained, for example, by the method described in Examples.
  • the first in the second adhesive layer 2 The distance from the surface 3a on the side opposite to the adhesive layer 1 side to the boundary S between the first adhesive layer 1 and the second adhesive layer 2 located at the separated portions of the adjacent conductive particles 4 and 4 ( The distance (d2) in FIG. 1 is the thickness of the second adhesive layer 2.
  • the thickness of the adhesive film 10 (the total thickness of all the layers constituting the adhesive film 10, in FIG. 1, the thickness d1 of the first adhesive layer 1 and the thickness of the second adhesive layer 2).
  • the total of d2) may be, for example, 5 ⁇ m or more or 8 ⁇ m or more, and may be 30 ⁇ m or less or 20 ⁇ m or less.
  • the adhesive film 10 is an anisotropically conductive adhesive film having an anisotropic conductivity.
  • the adhesive film 10 is interposed between the first circuit member having the first electrode and the second circuit member having the second electrode, and holds the first circuit member and the second circuit member. It is thermocompression bonded and used to electrically connect the first electrode and the second electrode to each other.
  • the adhesive film 10 it is possible to suppress the decrease in the removability of the resin while suppressing the fluidity of the conductive particles at the time of circuit connection by curing the photocurable resin component. Further, when the thickness of the first adhesive layer is 5 ⁇ m or less, the fluidity of the conductive particles at the time of circuit connection can be further suppressed. Therefore, even when mounted at a low voltage, it is possible to improve the capture rate of conductive particles between the facing electrodes of the circuit connection structure and reduce the connection resistance.
  • Such an adhesive film 10 can be suitably used for COP mounting.
  • the adhesive film may be composed of, for example, two layers of a first adhesive layer and a second adhesive layer, and the two layers of the first adhesive layer and the second adhesive layer may be formed. It may be composed of three or more layers including.
  • the adhesive film further comprises, for example, a third adhesive layer containing a (third) thermosetting resin component provided on the opposite side of the first adhesive layer from the second adhesive layer. You may be prepared.
  • a first region which is a region formed from the first adhesive film (first adhesive layer) and a third adhesive provided adjacent to the first region.
  • the adhesive film further comprises a third region containing a (third) thermosetting resin component, which is provided adjacent to the second region of the first region on the opposite side. You can also.
  • the third adhesive layer contains the component (C).
  • the component (C1) and the component (C2) used in the component (C) in the third adhesive layer (that is, the third thermosetting resin component) are the component (C) in the first adhesive layer 1. Since it is the same as the component (C1) and the component (C2) used in (that is, the first thermosetting resin component), detailed description thereof will be omitted here.
  • the third thermosetting resin component may be the same as or different from the first thermosetting resin component.
  • the third thermosetting resin component may be the same as or different from the second thermosetting resin component.
  • the content of the component (C) is 5% by mass or more, 10% by mass or more, and 15% by mass or more based on the total mass of the third adhesive layer from the viewpoint of imparting good transferability and peeling resistance. , Or 20% by mass or more.
  • the content of the component (C) is 70% by mass or less based on the total mass of the third adhesive layer from the viewpoint of imparting good half-cut property and blocking resistance (suppression of resin seepage of the reel). It may be 60% by mass or less, 50% by mass or less, or 40% by mass or less.
  • the third adhesive layer may further contain other components and other additives in the first adhesive layer 1. Preferred embodiments of the other components and other additives are the same as the preferred embodiments of the first adhesive layer 1.
  • the content of the component (D) may be 10% by mass or more, 20% by mass or more, or 30% by mass or more, and is 80% by mass or less and 70% by mass, based on the total mass of the third adhesive layer. It may be less than or equal to 60% by mass or less.
  • the content of the component (E) may be 0.1 to 10% by mass based on the total mass of the third adhesive layer.
  • the content of the component (F) may be 1% by mass or more, 3% by mass or more, or 5% by mass or more, and is 50% by mass or less and 40% by mass, based on the total mass of the third adhesive layer. It may be less than or equal to 30% by mass or less.
  • the content of the other additives may be, for example, 0.1 to 10% by mass based on the total mass of the third adhesive layer.
  • the thickness of the third adhesive layer may be appropriately set according to the height of the electrodes of the circuit member to be adhered.
  • the thickness of the third adhesive layer may be 0.2 ⁇ m or more from the viewpoint that the space between the electrodes can be sufficiently filled to seal the electrodes and better connection reliability can be obtained. , 3.0 ⁇ m or less.
  • the thickness of the third adhesive layer can be determined, for example, by the method described in Examples.
  • circuit connection adhesive film of the above embodiment is an anisotropic conductive adhesive film having anisotropic conductivity, but the circuit connection adhesive film is a conductive adhesive having no anisotropic conductivity. It may be a film.
  • the method for producing an adhesive film for circuit connection is, for example, a composition comprising a composition containing (A) component, (B) component, and (C) component (first thermosetting resin component).
  • the step of irradiating the material layer with light to form the first adhesive layer (first step) and the component (C) (second thermosetting resin component) on the first adhesive layer. ) May be provided with a step of laminating a second adhesive layer (second step).
  • the first step may be a step of forming a first adhesive layer having a thickness of 5 ⁇ m or less.
  • a third adhesive layer containing a component (C) (third thermosetting resin component) is placed on a layer of the first adhesive layer opposite to the second adhesive layer. May be further provided with a step of laminating (third step).
  • a composition containing (A) component, (B) component, and (C) component, and other components and other additives added as needed are organically prepared.
  • a varnish composition is prepared by dissolving or dispersing by stirring and mixing in a solvent, kneading and the like. Then, the varnish composition is applied onto the release-treated substrate using a knife coater, roll coater, applicator, comma coater, die coater, etc., and then the organic solvent is volatilized by heating to form the substrate. Form a composition layer composed of the composition. At this time, the thickness of the finally obtained first adhesive layer (first adhesive film) can be adjusted by adjusting the coating amount of the varnish composition. Subsequently, the composition layer made of the composition is irradiated with light to cure the component (B) in the composition layer, and a first adhesive layer is formed on the substrate. The first adhesive layer can be said to be the first adhesive film.
  • the organic solvent used in the preparation of the varnish composition is not particularly limited as long as it has the property of uniformly dissolving or dispersing each component.
  • examples of such an organic solvent include toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, propyl acetate, butyl acetate and the like. These organic solvents can be used alone or in combination of two or more.
  • Stirring and mixing or kneading in the preparation of the varnish composition can be carried out by using, for example, a stirrer, a raider, a three-roll, a ball mill, a bead mill, a homodisper or the like.
  • the base material is not particularly limited as long as it has heat resistance that can withstand the heating conditions when volatilizing the organic solvent.
  • a substrate examples include stretched polypropylene (OPP), polyethylene terephthalate (PET), polyethylene naphthalate, polyethylene isophthalate, polyvinylidene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, polyimide, cellulose, and the like.
  • a substrate (for example, a film) made of an ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, a synthetic rubber system, a liquid crystal polymer or the like can be used.
  • the heating conditions for volatilizing the organic solvent from the varnish composition applied to the base material can be appropriately set according to the organic solvent to be used and the like.
  • the heating conditions may be, for example, 40 to 120 ° C. for 0.1 to 10 minutes.
  • irradiation light for example, ultraviolet light
  • Light irradiation can be performed using, for example, a low-pressure mercury lamp, a medium-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a metal halide lamp, an LED light source, or the like.
  • the integrated light amount of light irradiation can be appropriately set, but may be, for example, 500 to 3000 mJ / cm 2 .
  • the second step is a step of laminating the second adhesive layer on the first adhesive layer.
  • the second step is the same as the first step except that, for example, the component (C) and other components and other additives added as needed are used and no light irradiation is performed.
  • a second adhesive layer is formed on the substrate to obtain a second adhesive film.
  • the second adhesive layer can be laminated on the first adhesive layer by adhering the first adhesive film and the second adhesive film.
  • a varnish composition obtained by using the component (C) and other components and other additives added as needed is applied onto the first adhesive layer.
  • the second adhesive layer can also be laminated on the first adhesive layer by volatilizing the organic solvent.
  • Examples of the method of adhering the first adhesive film and the second adhesive film include a method of heat pressing, roll laminating, vacuum laminating and the like. Laminating can be performed, for example, under temperature conditions of 0-80 ° C.
  • the third step is a step of laminating the third adhesive layer on the layer of the first adhesive layer opposite to the second adhesive layer.
  • a third adhesive layer is formed on the substrate to obtain a third adhesive film.
  • the varnish composition is applied onto the layer of the first adhesive layer opposite to the second adhesive layer, and an organic solvent is applied.
  • the second adhesive layer can be laminated on the first adhesive layer by volatilizing the above. The method of bonding and the conditions thereof are the same as in the second step.
  • Circuit connection structure and its manufacturing method> a circuit connection structure using the above-mentioned circuit connection adhesive film 10 as a circuit connection material and a method for manufacturing the same will be described.
  • FIG. 2 is a schematic cross-sectional view showing an embodiment of a circuit connection structure.
  • the circuit connection structure 20 includes a first circuit member 13 having a first electrode 12 formed on a main surface 11a of the first circuit board 11 and the first circuit board 11.
  • a second circuit member 16 having a second electrode 15 formed on the main surface 14a of the second circuit board 14 and the second circuit board 14, and the first circuit member 13 and the second circuit member. It is arranged between 16 and includes a circuit connection portion 17 that electrically connects the first electrode 12 and the second electrode 15 to each other.
  • the first circuit member 13 and the second circuit member 16 may be the same or different from each other.
  • the first circuit member 13 and the second circuit member 16 may be a glass substrate or a plastic substrate on which electrodes are formed, a printed wiring board, a ceramic wiring board, a flexible wiring board, an IC chip, or the like.
  • the first circuit board 11 and the second circuit board 14 may be formed of an inorganic substance such as semiconductor, glass, or ceramic, an organic substance such as polyimide or polycarbonate, or a composite such as glass / epoxy.
  • the first circuit member 13 is made of an organic substance such as polyimide, polycarbonate, polyethylene terephthalate, or cycloolefin polymer. It may be a plastic substrate, and the second circuit board 14 may be, for example, an IC chip.
  • the first electrode 12 and the second electrode 15 are gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, copper, aluminum, molybdenum, titanium and other metals, indium tin oxide (ITO), and the like.
  • the electrode may be an electrode containing an oxide such as indium tin oxide (IZO) or indium gallium zinc oxide (IGZO).
  • the first electrode 12 and the second electrode 15 may be electrodes formed by laminating two or more of these metals, oxides, and the like.
  • the electrode formed by stacking two or more types may have two or more layers, and may have three or more layers.
  • the first electrode 12 When the first circuit member 13 is a plastic substrate, the first electrode 12 may be an electrode having a titanium layer on the outermost surface.
  • the first electrode 12 and the second electrode 15 may be circuit electrodes or bump electrodes. At least one of the first electrode 12 and the second electrode 15 may be a bump electrode.
  • the first electrode 12 is a circuit electrode and the second electrode 15 is a bump electrode.
  • the circuit connection portion 17 contains a cured product of the above-mentioned adhesive film 10.
  • the circuit connection portion 17 may be made of a cured product of the adhesive film 10 described above.
  • the circuit connection portion 17 is located, for example, on the side of the first circuit member 13 in the direction in which the first circuit member 13 and the second circuit member 16 face each other (hereinafter referred to as “opposite direction”), and the above-mentioned first circuit member 17 is located.
  • the first cured product region 18 composed of the cured product of the component (B) and the cured product of the component (C) other than the conductive particles 4 in the adhesive layer of the above.
  • the first is interposed between the second cured product region 19 made of the cured product such as the component (C) in the second adhesive layer and at least the first electrode 12 and the second electrode 15. It has conductive particles 4 that electrically connect the electrode 12 and the second electrode 15 to each other.
  • the circuit connection portion 17 does not have to have two distinct regions between the first cured product region 18 and the second cured product region 19, and the first The cured product derived from the adhesive layer and the cured product derived from the second adhesive layer may be mixed to form one cured product region.
  • FIG. 3 is a schematic cross-sectional view showing an embodiment of a method for manufacturing a circuit connection structure.
  • 3 (a) and 3 (b) are schematic cross-sectional views showing each process.
  • a method of manufacturing the circuit connection structure 20 is to use a method of manufacturing the circuit connection structure 20 between the first circuit member 13 having the first electrode 12 and the second circuit member 16 having the second electrode 15.
  • the above-mentioned adhesive film 10 is interposed, and the first circuit member 13 and the second circuit member 16 are thermally crimped to electrically connect the first electrode 12 and the second electrode 15 to each other. ..
  • a first circuit including a first electrode 12 formed on a main surface 11a of a first circuit board 11 and a first circuit board 11.
  • a member 13 and a second circuit member 16 provided with a second electrode 15 formed on the main surface 14a of the second circuit board 14 and the second circuit board 14 are prepared.
  • the first circuit member 13 and the second circuit member 16 are arranged so that the first electrode 12 and the second electrode 15 face each other, and the first circuit member 13 and the second circuit member 12 are arranged.
  • the adhesive film 10 is placed between the 16 and 16.
  • the adhesive film 10 is laminated on the first circuit member 13 so that the first adhesive layer 1 side faces the main surface 11a of the first circuit board 11. do.
  • the adhesive film 10 is laminated so that the first electrode 12 on the first circuit board 11 and the second electrode 15 on the second circuit board 14 face each other.
  • the second circuit member 16 is arranged on the circuit member 13.
  • the first circuit member 13 and the second circuit member 16 are thermocompression bonded to each other.
  • the second adhesive layer 2 has a flowable uncured thermosetting component, the second electrodes 15 are connected to each other. It flows so as to fill the voids and is cured by the above heating. As a result, the first electrode 12 and the second electrode 15 are electrically connected to each other via the conductive particles 4, and the first circuit member 13 and the second circuit member 16 are adhered to each other.
  • the circuit connection structure 20 shown in 2 can be obtained.
  • the method for manufacturing the circuit connection structure 20 of the present embodiment it can be said that a part of the first adhesive layer 1 is cured by light irradiation, so that the conductive particles 4 are fixed in the first adhesive layer 1.
  • the facing first electrodes 12 and the second are used.
  • the connection resistance between the electrodes 15 is reduced.
  • the thickness of the first adhesive layer is 5 ⁇ m or less, the fluidity of the conductive particles at the time of circuit connection can be further suppressed.
  • the heating temperature for thermocompression bonding can be set as appropriate, but may be, for example, 50 to 190 ° C.
  • the pressurization is not particularly limited as long as it does not damage the adherend, but in the case of COP mounting, for example, the area conversion pressure at the bump electrode may be 0.1 to 50 MPa. Further, in the case of COG mounting, for example, the area conversion pressure at the bump electrode may be 10 to 100 MPa.
  • These heating and pressurizing times may be in the range of 0.5 to 120 seconds.
  • Conductive particles A-1 Conductive particles having an average particle size of 3.2 ⁇ m, in which the surface of a plastic core is Ni-plated and the outermost surface is substituted-plated with Pd, are used.
  • Component (B) Photocurable resin component
  • a photocurable resin component that is, component (B)
  • component (B) photoradical polymerization initiator
  • thermosetting polymerization initiator thermosetting component
  • Radical polymerizable compound Radical polymerizable compound B1-1 NK ester A-BPEF (ethoxylated fluorene type di (meth) acrylate (bifunctional), manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), non-volatile in organic solvent Radical polymerizable compound B1-2: Lipoxy VR-90 (bisphenol A type epoxy (meth) acrylate (bifunctional) (vinyl ester resin), manufactured by Showa Denko Co., Ltd.), non-volatile content Used at 100% by mass Radical polymerizable compound B1-3: Cyclomer M100 (methacrylate having an alicyclic epoxy group (monofunctional), manufactured by Daicel Co., Ltd.), used at 100% by mass of non-volatile content
  • Photo-radical polymerization initiator B2-1 IrgacureOXE-02 (compound having an oxime ester structure, manufactured by BASF), diluted with an organic solvent to a non-volatile content of 10% by mass, used.
  • (B2) Component Thermal radical polymerization initiator
  • Thermal radical polymerization initiator b2-1 Park mill D (dialkyl peroxide, manufactured by NOF CORPORATION), diluted to 20% by mass of non-volatile content with an organic solvent, is used.
  • Component (C) Thermosetting resin component
  • thermosetting component that is, component (C)
  • component (C) thermosetting component
  • photocationic polymerization initiator By combining (C1) a cationically polymerizable compound and (c2) a photocationic polymerization initiator, it can act as a photocurable component.
  • C1 Ingredients: Cationicly polymerizable compound C1-1: ETERNALCOLL OXBP (Oxetane compound, manufactured by Ube Kosan Co., Ltd.), used at 100% by mass of non-volatile content
  • Cationicly polymerizable compound C1-2 OXSQ (Oxetane compound, Toa Synthetic Co., Ltd.), used at 100% by mass of non-volatile content
  • Cationic polymerizable compound C1-3 EHPE3150 (alicyclic epoxy compound, manufactured by Daicel Co., Ltd.), diluted to 70% by mass of non-volatile content with an organic solvent
  • C2 Ingredient: Thermal Cationic Polymerization Initiator Thermal Cationic Polymerization Initiator Thermal Cationic Polymerization Initiator C2-1: CXC-1821 (N- (p-methoxybenzyl) -N, N-dimethylanilium tetrakis (pentafluorophenyl) borate, King Industries, Inc. Made), used with 100% by mass of non-volatile content
  • Photocationic polymerization initiator c2-1 CPI-310B (manufactured by Sun Abro Co., Ltd.), diluted with an organic solvent to a non-volatile content of 10% by mass, is used.
  • Thermoplastic resin Thermoplastic resin D-1 Phenototo FX-293 (Phenoxy resin, manufactured by Nittetsu Chemical & Materials Co., Ltd.), diluted with an organic solvent to a non-volatile content of 40% by mass
  • Thermoplastic Resin D-2 Phenototo YP-50S (Phenoxy resin, manufactured by Nittetsu Chemical & Materials Co., Ltd.), diluted with an organic solvent to a non-volatile content of 40% by mass
  • Thermoplastic resin D-4 jER1007 (epoxy resin, manufactured by Mitsubishi Chemical Co., Ltd.), non-volatile content with organic solvent Use diluted to 70% by mass
  • Thermoplastic resin D-5 Phenototo ZX
  • Coupling agent E-1 SH-6040 (3-glycidoxypropyltrimethoxysilane, manufactured by Toray Dow Corning Co., Ltd.), used with a non-volatile content of 100% by mass.
  • ⁇ Preparation of the first adhesive film (first adhesive layer)> A composition obtained by mixing the materials shown in Table 1 at the composition ratio shown in Table 1 (the numerical value in Table 1 means the amount of non-volatile content) is obtained, and then a magnetic field is applied onto a PET (polyethylene terephthalate) film which has been mold-released.
  • the composition layers 1a to 1i composed of the composition containing each component were obtained by applying the coating while applying the above-mentioned material and drying the organic solvent or the like at 70 ° C. for 5 minutes with hot air.
  • the composition layers 1a to 1i were coated so that the thickness after drying was finally the thickness shown in Tables 4 and 5.
  • the first adhesive films 1A to 1F were applied by irradiating the layers with light (UV irradiation: metal halide lamp, integrated light amount: 1900 to 2300 mJ / cm 2). Obtained. With respect to 1 g of the composition layer, the first adhesive film 1 G was obtained by irradiating the layer with light (UV irradiation: metal halide lamp, integrated light amount: 1000 to 1500 mJ / cm 2). On the other hand, the composition layers 1h and 1i were not treated and were used as they were as the first adhesive films 1H and 1I.
  • Second adhesive film (second adhesive layer)>
  • the materials shown in Table 2 are mixed at the composition ratio shown in Table 2 (the numerical values in Table 2 mean the non-volatile content), and then coated on a release-treated PET (polyethylene terephthalate) film to form an organic solvent. And the like were dried to obtain second adhesive films 2A to 2C containing each component.
  • the second adhesive film 2A is coated so that the thickness after drying is 9 ⁇ m
  • the second adhesive film 2B is coated so that the thickness after drying is 10 ⁇ m
  • the agent film 2C was coated so that the thickness after drying was 7 ⁇ m.
  • ⁇ Third adhesive film (third adhesive layer)> The materials shown in Table 3 are mixed at the composition ratio shown in Table 3 (the numerical values in Table 3 mean the non-volatile content), and then coated on a PET (polyethylene terephthalate) film that has been demolded and subjected to an organic solvent. And the like were dried to obtain a third adhesive film 3A.
  • the third adhesive film 3A was coated so that the thickness after drying was 1 ⁇ m.
  • Examples 1 to 8 and Comparative Examples 1 to 5 [Preparation of adhesive film] Using the first adhesive film, the second adhesive film, and the third adhesive film prepared above, the adhesive films having the configurations shown in Tables 4 and 5 were prepared.
  • the adhesive film of Example 1 the first adhesive film 1A is bonded to the second adhesive film 2A while applying a temperature of 50 to 60 ° C., and the first adhesive film 1A is released from the mold. The film was peeled off.
  • the third adhesive film 3A was bonded to the first adhesive film 1A exposed by peeling off the release film while applying a temperature of 50 to 60 ° C. to obtain the adhesive film of Example 1. rice field.
  • a Ti (50 nm) / Al (400 nm) wiring pattern is provided on the surface of a polyimide substrate (200H, manufactured by Toray DuPont Co., Ltd., outer shape: 38 mm ⁇ 28 mm, thickness: 0.05 mm). A width: 19 ⁇ m, a space between electrodes: 5 ⁇ m) was prepared.
  • an IC chip in which bump electrodes are arranged in two rows in a staggered pattern (outer shape: 0.9 mm ⁇ 20.3 mm, thickness: 0.3 mm, bump electrode size: 70 ⁇ m ⁇ 12 ⁇ m, bump electrode Spacing space: 12 ⁇ m, bump electrode thickness: 9 ⁇ m) was prepared.
  • Circuit connection structures were made using the adhesive films of Examples 1 to 8 and Comparative Examples 1 to 5.
  • the adhesive film was placed on the first circuit member so that the first adhesive layer or the third adhesive layer of the adhesive film was in contact with the first circuit member.
  • a thermocompression bonding device (BS-17U, manufactured by Ohashi Seisakusho Co., Ltd.) consisting of a stage consisting of a ceramic heater and a tool (8 mm x 50 mm), under the conditions of 70 ° C. and 0.98 MPa (10 kgf / cm 2).
  • the adhesive film was attached to the first circuit member by heating and pressurizing for 2 seconds, and the release film on the opposite side of the adhesive film from the first circuit member was peeled off.
  • the measured maximum reached temperature of the adhesive film is 170 ° C.
  • the area conversion pressure of the bump electrode is 30 MPa.
  • the capture rate of the conductive particles between the bump electrode and the circuit electrode was evaluated.
  • the capture rate of the conductive particles means the ratio of the density of the conductive particles on the bump electrode to the density of the conductive particles in the adhesive film, and was calculated from the following formula.
  • the average number of conductive particles on the bump electrode is measured by observing the mounted circuit member from the polyimide substrate using a differential interference microscope to measure the number of conductive particles captured per bump through the metal electrode. I asked.
  • Capture rate of conductive particles (%) (average number of conductive particles on bump electrode / (bump electrode area x density of conductive particles in adhesive film)) x 100
  • connection resistance was evaluated using the circuit connection structure obtained by using each of the adhesive films of Examples 1 to 8 and Comparative Examples 1 to 5.
  • the evaluation of the connection resistance was carried out by the four-terminal measurement method, and the evaluation was made using the average value of the connection resistance values measured at 14 points.
  • a multimeter (MLR21, manufactured by ETAC) was used for the measurement. If the connection resistance value is less than 0.6 ⁇ , it is judged as "S”, if the connection resistance value is less than 1.0 ⁇ , it is judged as "A”, and if the connection resistance value is 1.0 ⁇ or more, it is judged as "B". I evaluated it. The results are shown in Tables 4 and 5.
  • the adhesive films of Examples 1 to 8 were excellent in both the capture rate of conductive particles and the connection resistance when mounted at a low pressure.
  • the adhesive films of Comparative Examples 1 to 5 were not sufficient in at least one of the capture rate of the conductive particles and the connection resistance. From this, even when the adhesive film of the present disclosure is mounted at a low pressure, it is possible to improve the capture rate of conductive particles between the facing electrodes of the circuit connection structure and reduce the connection resistance. It was confirmed that.

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PCT/JP2021/021760 2020-06-11 2021-06-08 回路接続用接着剤フィルム、並びに回路接続構造体及びその製造方法 Ceased WO2021251386A1 (ja)

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Application Number Priority Date Filing Date Title
US17/926,362 US20230234333A1 (en) 2020-06-11 2021-06-08 Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor
KR1020227040629A KR20230023621A (ko) 2020-06-11 2021-06-08 회로 접속용 접착제 필름, 및 회로 접속 구조체 및 그 제조 방법
EP21822911.0A EP4140737A1 (en) 2020-06-11 2021-06-08 Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor
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CN202510647677.2A CN120349739A (zh) 2020-06-11 2021-06-08 电路连接用黏合剂薄膜、以及电路连接结构体及其制造方法
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