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  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
  • C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
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  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/02—Pretreatment of the material to be coated
  • C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
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  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
  • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
  • C23C16/463—Cooling of the substrate
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  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
  • C23C16/482—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using incoherent light, UV to IR, e.g. lamps
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  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/56—After-treatment
• • C—CHEMISTRY; METALLURGY
  • C30—CRYSTAL GROWTH
  • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
  • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
  • C30B25/02—Epitaxial-layer growth
  • C30B25/10—Heating of the reaction chamber or the substrate
• • C—CHEMISTRY; METALLURGY
  • C30—CRYSTAL GROWTH
  • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
  • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
  • C30B25/02—Epitaxial-layer growth
  • C30B25/16—Controlling or regulating
  • C30B25/165—Controlling or regulating the flow of the reactive gases
• • C—CHEMISTRY; METALLURGY
  • C30—CRYSTAL GROWTH
  • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
  • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
  • C30B25/02—Epitaxial-layer growth
  • C30B25/18—Epitaxial-layer growth characterised by the substrate
• • C—CHEMISTRY; METALLURGY
  • C30—CRYSTAL GROWTH
  • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
  • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
  • C30B29/10—Inorganic compounds or compositions
  • C30B29/12—Halides
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
  • H01G9/0029—Processes of manufacture
  • H01G9/0036—Formation of the solid electrolyte layer
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
  • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
  • H01G9/20—Light-sensitive devices
  • H01G9/2004—Light-sensitive devices characterised by the electrolyte, e.g. comprising an organic electrolyte
  • H01G9/2009—Solid electrolytes
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
  • H10K30/30—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
  • H10K71/10—Deposition of organic active material
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
  • H10K71/10—Deposition of organic active material
  • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
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  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
  • H10K71/10—Deposition of organic active material
  • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
  • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
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  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
  • H10K85/50—Organic perovskites; Hybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3
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  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
  • H10K30/50—Photovoltaic [PV] devices
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  • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
  • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/542—Dye sensitized solar cells
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy
  • Y02E10/549—Organic PV cells
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
  • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
  • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

• the present disclosure relates to chemical vapor deposition techniques for creating Perovskite solar cells.
• Perovskite as a low-cost material is boosting the performance up to 25.2% for small area (0.09 cm 2 ) single-junction solar cells and the expected levelized cost of electricity (LCOE) is as low as 3.5 US cents/kWh (as comparison, LCOE for grid power is 7.04-11.90 US cents/kWh and for c-Si solar cell is 9.78-19.33 US cents/kWh) when assuming a 1 m 2 module with 20% efficiency and >15 years lifetime, and this exceeds the 2030 goals of US Department of Energy of 5 US cents/kWh for residential solar power.
• PSMs perovskite solar modules
• perovskite and other functional layers e.g., electron transport layer (ETL), hole transport layer (HTL), electrode and interface modification
• ETL electron transport layer
• HTL hole transport layer
• electrode and interface modification e.g., electrode and interface modification
• PSCs perovskite solar cells
• solution- and vapor-based processes including doctor blading, slot-die coating, spray coating, thermal evaporation and hybrid chemical vapor deposition (HCVD).
• HCVD is a promising method as compared to the solution-based ones because of its advantages such as uniform deposition across large area, low cost, solvent-free, and readiness for integration with other thin film solar technologies (e.g., thin film silicon solar cells) to form tandem solar cells.
• thin film solar technologies e.g., thin film silicon solar cells
• the decay rate between small area cells and large area modules upon upscaling is 1.3%/decade area increase, which is approaching other mature photovoltaic technologies.
• HCVD is a two-step deposition process. In the first step, inorganic precursor materials (e.g., PbF. PbCh, Csl, etc.) is deposited by thermal evaporation, spray coating or spin coating.
• organic precursor materials e.g., FAI, MAI, MABr, etc., where FA is formamidinium and MA is methylammonium
• a gas flow e.g., N2, Ar, or dry air
• HCVD techniques can be developed to fabricate perovskite film including atmospheric pressure HCVD, low-pressure HCVD, single-zone HCVD and double-zone HCVD.
• FIG. 1 depicts an example structure for a planar perovskite solar cell.
• FIG. 2 depicts an example device for generating a perovskite fdm.
• FIG. 3 depicts an example rapid hybrid chemical vapor deposition process.
• a method for fabricating perovskite film comprises depositing a first type of precursor materials on a substrate; placing the substrate in a receptacle of a heating device, the heating device comprising a heating component configured to provide heat to at least a portion of the receptacle; placing a second type of precursor materials in the receptacle of the heating device such that the second type of precursor materials is closer to a gas source of the heating device than the substrate; creating a gas flow through the receptacle of the heating device; using the heating component, causing heating of a portion of the receptacle comprising the substrate and the second type of precursor materials; wherein during a heating process, at least a portion of the second type of precursor materials is deposited on at least a portion of the first type of precursor materials on the substrate.
• the heating device comprises a cooling component that is and the method further comprises, after completing the heating process, using the cooling component, causing cooling of a portion of the receptacle comprising the substrate.
• the cooling component comprises one or more of fans, dry ice, or method that provides cooled dry air flow.
• the heating component comprises an infrared heating component.
• one or more of the heating component or the cooling component are mechanically movable with respect to the receptacle and are moved into position to cause performance of the heating or cooling respectively.
• the second type of precursor materials comprises formamidinium iodide, methylammonium iodide, methylammonium bromide or formamidinium bromide.
• the inorganic precursor materials comprise a layer comprising Csl and Pbh.
• the layer comprising Csl and Pbh is deposited through co-evaporation, spray-coating, doctor blading, or spin-coating.
• the heating device further comprises a vacuum pump and a vacuum gauge and wherein the method further comprises controlling a vacuum level of the receptacle during the heating process using the vacuum pump and the vacuum gauge.
• a heating device comprises a receptacle configured to hold an inorganic precursor material on a substrate and an organic compound; a heating component that is configured to heat at least a portion of the receptacle comprising the substrate and the organic compound to cause creation of a perovskite layer on the substrate; a vacuum gauge configured to measure a vacuum level of the receptacle; and a vacuum pump configured to create at least a partial vacuum in the receptacle.
• the heating component comprises an infrared heating component.
• the heating component is mechanically movable with respect to the receptacle.
• the heating device further comprises a cooling component that is configured to cause cooling of a portion of the receptacle comprising the substrate after creation of the perovskite layer on the substrate.
• the cooling component comprises one or more of fans, dry ice, or an implement that provides cooled dry air flow.
• the cooling component is mechanically movable with respect to the receptacle.
• an n-i-p planar perovskite solar cell (PSC) structure is configured with a perovskite layer sandwiched between an electron transport layer (ETL) and a hole transport layer (HTL).
• the PSC structure does not include mesoporous structures, thereby obviating the need for a high-temperature step to generate the PSC structure.
• FIG. 1 depicts an example structure for a planar perovskite solar cell.
• a planar perovskite solar cell 100 comprises a bottom layer 102 comprising indium-doped tin oxide (ITO) substrates, which corresponds to a transparent conductive oxide (TCO).
• ITO substrates may be initially washed sequentially with distilled water, acetone, and isopropanol and dried with N2 gas.
• a second layer 104 may comprise a tin dioxide (S11O2) nanocrystal layer.
• the Sn02 layer may be spin coated onto the ITO layer at a rate of 3000 rpm for 30 seconds, then dried, such as at a temperature of 150°C for thirty minutes.
• TCO and ETL are depicted in FIG. 1 as comprising ITO and SnCh layers, respectively, other embodiments may comprise any TCO and ETL that are suitable for the rapid hybrid chemical vapor deposition (RHCVD) process described herein.
• RHCVD rapid
• Perovskite layer 106 comprises a layer of inorganic precursor materials and organic precursor materials that are deposited onto the ETL using the systems and methods described herein.
• perovskite layer 106 comprises a combination of cesium iodide, formamidinium (FA), and lead iodide.
• Other embodiments may comprise different combinations of organic and inorganic precursor materials, such as lead chloride for the inorganic material or methylammonium for the organic materials.
• An example composition of the perovskite layer is Cso.iFAo.gPbH.
• Hole transport layer 108 comprises a hole transport material that sits atop the perovskite layer 106. Hole transport layer 108 may be spin coated on top of perovskite layer 106, such as at a rotation speed of 300 rpm for 30 seconds.
• hole transport layer 108 comprises a solution of spiro-MeOTAD, tributyl phosphate (TBP), and lithium bis(trisfluoromethanesulfonyl)imide (LiTFSI) in chlorobenzene.
• the solution may comprise 20 mg spiro-MeOTAD, 11.5pL TBP, and 7pL LiTFSI in 0.4mL chlorobenzene.
• Top layer 110 may comprise a back-contact electrode, such as a layer of gold with a thickness of 100-120nm.
• FIG. 2 depicts an example device for generating a perovskite solar module.
• device 200 comprises a rapid-thermal annealing (RTA) tube furnace.
• RTA rapid-thermal annealing
• Device 200 comprises a single-zone or multi-zone tube 202.
• the tube 202 may comprise any material that is capable of being heated to required temperatures and transferring heat to objects inside.
• An example tube 202 may be a quartz tube.
• Input 204 comprises an opening in which a gas can be pumped into the tube 202.
• Input 204 may also comprise a location in which a vacuum gauge (not shown) may be placed to measure pressure inside tube 202.
• Output 206 comprises an opening which may be attached to a vacuum pump (not shown) to reduce pressure within tube 202.
• Output 206 may additionally provide an opening through which a gas may flow out of tube 202.
• Heating system 208 comprises one or more heating apparatuses configured to provide heat to a section of tube 202.
• heating system 208 comprises an infrared heating system.
• Heating system 208 may be mechanically free-moving with respect to tube 202 and/or attached to one or more rails that allow heating system 208 to move freely along a horizontal axis of tube 202. Movement of the heating system may be controlled mechanically or may be automatically controlled by a computing device.
• Cooling system 210 comprises one or more cooling apparatuses configured to cool a section of tube 202.
• cooling apparatus 210 comprises one or more fans.
• Cooling system 210 may be mechanically free-moving with respect to tube 202 and/or attached to one or more rails that allow cooling system 210 to move freely along a horizontal axis of tube 202. Movement of cooling system 210 may be controlled mechanically or may be automatically controlled by a computing device.
• cooling system 210 and heating system 208 are attached, such that moving heating system 208 causes movement of cooling system 210.
• Substrate 212 comprises one or more solar module substrates onto which a perovskite fdm is to be deposited using the methods described herein.
• substrate 212 is placed on a platform within device 200.
• the platform is controllable, thereby allowing the substrate to be moved within the device 200 during execution of the methods as described further herein.
• the substrate 212 is precoated with inorganic precursor materials, such as a mixture of Csl and Pbh.
• Deposition materials 214 comprise organic precursor materials placed in device 200 for sublimation.
• the organic precursor materials may comprise a formamidinium iodide, a methylammonium iodide, a methylammonium bromide, or any other suitable organic precursor material.
• the organic precursor materials may be placed in an upstream position of the substrate 212 relative to a gas flow to be driven through the device 200.
• deposition materials 213 are placed on a platform within device 200. In an embodiment, the platform is controllable, thereby allowing deposition materials to be moved within the device 200 during execution of the methods as described further herein.
• FIG. 3 depicts an example rapid hybrid chemical vapor deposition process.
• the example of FIG. 3 comprises one implementation of the rapid hybrid chemical vapor deposition methods described herein.
• Alternative examples may include different materials, different types of heating or cooling systems, different types of movement systems, multi zone tubes, and/or other variations.
• a solar substrate module and deposition materials are placed in chamber.
• the chamber may comprise a chamber of any material suitable for the vacuum pressures and heating methods described herein. While the chamber is depicted as a cylindrical tube in FIG. 3, other shapes, such as a cuboid or hexagonal prism, may be used. Additionally, while the cylindrical tube is listed as being made from quartz, other materials may be used.
• the solar substrate module may comprise an indium-doped tin oxide coated with an SnC layer.
• the deposition materials may comprise an organic precursor material in powder form, such as O.lg of formamidinium iodide for a 5cm x 5cm substrate module.
• the deposition materials may be placed such that the deposition materials are upstream of the solar substrate module with respect to a gas flow. For example, if a gas is pulled through the device through use of a vacuum pump, the deposition materials may be placed closer to the source of the gas than the solar substrate module such that the gas flow would reach the deposition materials prior to reaching the solar substrate module.
• a flow of carrier gas is created through the chamber.
• the carrier gas may be any suitable gas for creating an air flow, such as N2, Ar, air, O2, or other gases.
• the flow may be created using any suitable means for providing a gas flow.
• a vacuum pump may be used to generate pressure within the chamber.
• a vacuum gauge is used to control the pressure level of the chamber. As an example, the vacuum level may be adjusted through use of the vacuum pump to remain at or near 10 Torrs.
• a heating system begins heating the solar substrate module and the deposition materials.
• a moveable infrared heating system may be moved into a position such that heat would be applied directly to both the solar substrate module and the deposition materials.
• a heating system already in position to heat the solar substrate module and the deposition materials may be activated to begin the heating process.
• the solar substrate module and deposition materials may be moved into a position to be heated by the heating system, such as through a moving platform within the chamber. While FIG. 3 depicts the heating system as an infrared heating system, other systems may be used to heat both the solar substrate module and the deposition materials.
• the heating system and cooling system are configured to move together.
• the heating system and cooling system may be attached to each other along a rail, such that the two systems may be moved along a horizontal axis of the chamber.
• the heating and cooling system are stationary and the solar substrate module and deposition materials are moved along the horizontal axis of the chamber.
• the heating of step 306 may be performed for anywhere between one and twenty minutes. Reduced temperatures may correspond to higher perovskite conversion times. As an example, a temperature of 170°C may be applied for two to three minutes while a temperature of 160°C is applied for five to six minutes.
• the heating system stops heating the solar substrate module and the deposition materials and a cooling system begins cooling the solar substrate module.
• the heating system may be turned off and the cooling system may be moved into a position to provide cooling to at least the solar substrate module.
• the solar substrate module may be moved to a position where the cooling system is capable of cooling the solar substrate module, such as through a moveable platform.
• the cooling system may comprise one or more fans or any other cooling system.
• a cooling system and heating system may be configured to both target a same portion of the chamber.
• the heating system may be activated, thereby applying heat to the solar substrate module and deposition materials.
• the heating system may be deactivated and the cooling system may be activated.
• the perovskite film may be washed and heated to remove any residual formamidinium iodide.
• a hole transport material may be spin-coated on top of the perovskite layer.
• a back contact electrode may be added onto the hole transport layer, such as a 120nm layer of gold.
• the systems and methods described herein improve the process of hybrid chemical vapor deposition to generate perovskite solar modules.
• the use of the rapid hybrid chemical vapor deposition process reduces deposition time for the perovskite layer from several hours to within ten minutes.
• the process may additionally be scaled to produce a greater number of perovskite solar modules at a time without significant efficiency reduction and minimal hysteresis.
• the use of an infrared heating system leads to better perovskite film quality compared to perovskite films post-annealed by conventional methods due to the dual function of IR heating in promoting perovskite formation as well as uniformly heating the converted perovskite films to enhance their crystallinity.
• the shorter processing time inside the CVD tube furnace shortens the exposure time of the glass/ITO/SnCh electron-transport layer substrates in vacuum, which helps maintain the high quality of SnC electron-transport layer with a low density of gap states.
• PSMs with a designated area of 22.4 cm 2 have been demonstrated with an efficiency of 12.3%. The performance of these PSMs maintains 90% of its initial value after operation at steady state power output under continuous light illumination for over 800 h.
• n-i-p planar PSC structure with a perovskite layer between the ETL and HTL eliminates a need for a high-temperature process due to the lack of mesoporous structures.
• the use of a small amount of Cs cation improves the stability of the perovskite film.

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• 2021
  • 2021-05-27 CN CN202180041385.4A patent/CN115768917A/zh active Pending
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